Multi-light source therapy device

Abstract

To efficiently and quickly resolve various skin issues.SOLUTION: A multi-light source treatment instrument according to one embodiment comprises: a case; a main control panel attached to the inside of the case; a light source electrically connected to the main control panel; a power supply component; a fan; and a semiconductor refrigeration member. The semiconductor refrigeration member comprises a semiconductor particle layer in the middle, and a hot surface and a cold surface at two ends. A light outlet is formed in a front end face of the multi-light source treatment instrument. The light source includes an IPL light source, and further includes a tungsten light source and / or a carbon light source. The light outlet is formed by a transparent substrate mounted at a front end of the case. The cold surface of the semiconductor refrigeration member is in heat transfer connection with the transparent substrate so as to cool the transparent substrate, or the transparent substrate is directly used as the cold surface of the semiconductor refrigeration member. The light generated from the light source transmits through the light outlet and acts on the skin for beauty or treatment.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present application relates to the technical field of beauty and skin care devices, and in particular to a multi-light source treatment device. [Background technology]

[0002] Many of the conventional beauty devices available on the market use a single IPL (Intense Pulsed Light) light source for beauty and skin beauty such as hair removal, whitening, and skin rejuvenation. The higher the energy of the IPL light source, the more remarkable the therapeutic effect, but the degree of burn and pain caused by it varies. In addition, the higher the energy, the slower the flashing speed and the shorter the life cycle of the tube. In addition, the IPL light source is a strong pulsed light, with a short emission time and high peak energy, so the continuity of the spectrum is poor. In contrast, when precision band treatment (e.g., DPL: Dye Pulsed Light) is required for different skin colors and treatment needs (e.g., different needs such as removing spots, whitening, skin rejuvenation, and removing wrinkles), the utilization rate of the tube light source is greatly reduced. In addition, there is little near-infrared spectrum above 1200 nm in the light generated by the IPL light source, and the near-infrared band cannot be selected for beauty. The light generated by the IPL light source has a narrow optical band and low optical power, and is unable to solve various skin problems efficiently and quickly. Some conventional beauty devices use a single LED light source for skin beautification. However, the LED light source has low optical power and is unable to solve various skin problems efficiently and quickly. Summary of the Invention

[0003] The problem to be solved by the present application is to provide a multi-light source treatment device that solves the above-mentioned problems caused by the use of a single IPL light source or a single LED light source in conventional beauty devices.

[0004] In order to solve the above problems, the present application employs the following technical solutions.

[0005] A multi-light source treatment device comprising a case, a main control board mounted in the case, and a light source, a power supply component, a fan, and a semiconductor cooling member electrically connected to the main control board, the semiconductor cooling member including a middle semiconductor particle layer and hot and cold surfaces at both ends, the front end surface of which is formed with a light outlet, the light source includes an IPL light source, and further includes a tungsten light source and / or a carbon light source, the light outlet is formed by a transparent substrate mounted in the front end of the case, the cold surface of the semiconductor cooling member is thermally connected to the transparent substrate to cool it, or the transparent substrate is directly the cold surface of the semiconductor cooling member, and the light generated from the light source passes through the light outlet and acts on the skin to perform cosmetic or therapeutic treatment.

[0006] In some embodiments, the semiconductor cooling member is annular and attached to the back surface of the transparent substrate and configured to cool the periphery of the light exit port, the annular central region of the semiconductor cooling member being a through hole for passing light generated from the light source, and the front surface of the transparent substrate being in contact with the skin; or one or more semiconductor cooling members are attached to one or more sides of the periphery of the transparent substrate to cool the sides of the light exit port. Both ends of the couple particle layer are a cold end and a hot end. When the transparent substrate is used as the cold surface of the semiconductor cooling member, the transparent substrate is provided with one or more cold end circuits, and the one or more cold end circuits are welded and electrically connected to the cold ends of the one or more semiconductor particle layers. The hot ends of each set of semiconductor particle layers are hot surfaces, and the hot surfaces are provided with hot end circuits welded and electrically connected to the hot ends of the semiconductor particle layers. When the cold end circuits are electrically connected to the cold ends of the couple particle layers and the hot end circuits are electrically connected to the hot ends of the couple particle layers, an internal circuit of the semiconductor cooling member is formed, and the internal circuit is electrically connected to a control unit via positive and negative poles. When the circuit is conductive, a temperature difference is formed between the cold surface and the hot surface of the transparent substrate.

[0007] In some embodiments, the semiconductor cooling member has a built-in temperature sensor, which is located in the middle semiconductor particle layer and is in close contact with the hot or cold surface to directly detect the temperature of the cold or hot surface, and the positive and negative electrodes of the temperature sensor and the positive and negative electrodes of the semiconductor particle layer extend outside the semiconductor cooling member to be electrically connected to a control unit, and the control unit is provided on the main control board or an independent control board to control the temperature of the cold or hot surface to be constant within a predetermined temperature range.

[0008] In some embodiments, the hot surface of the semiconductor cooling member is one or more of a combination of a heat tube, a vapor chamber, a superheat transfer tube, a superheat transfer plate, or a heat transfer substrate made of a single heat transfer material; the hot surface of the semiconductor cooling member is connected to a heat dissipation component in a rapid heat transfer manner, the heat dissipation component includes one or more of a combination of a heat tube, a vapor chamber, a superheat transfer tube, a superheat transfer plate, a heat transfer structure of a single heat transfer material, or a heat dissipation fin; the light source is mounted within a light reflecting member, and a heat dissipation member is provided on the light reflecting member, and the heat dissipation member is one or more of a combination selected from a heat dissipation fin, a heat tube, a vapor chamber, a superheat transfer tube, a superheat transfer plate, or a heat transfer element made of a single heat transfer material.

[0009] In some embodiments, the case of the multi-light source treatment device is provided with several air inlets and air outlets, the fan includes a case and a rotating blade inside the case, the case is provided with several air inlets and air outlets, the air inlets and air outlets of the fan are provided on the case of the upper surface, lower surface or side elevational surface of the fan in the axial direction of the fan, and the air passage of the fan is formed by the air flow communication between the air inlets of the fan, the inside of the fan case, and the air outlet of the fan, and the heat dissipation The parts are located in a heat dissipation air passage formed by air flow communication between the air inlet of the case of the multi-light source treatment device, the air passage of the fan, and the air outlet of the case of the multi-light source treatment device, and are adapted to cool and dissipate heat from the heat dissipation parts by air, and the light source, light reflecting member, or heat dissipation member is located in a heat dissipation air passage formed by air flow communication between the air inlet of the case of the multi-light source treatment device, the air passage of the fan, and the air outlet of the case of the multi-light source treatment device, and are adapted to cool and dissipate heat from the light source, light reflecting member, or heat dissipation member by air.

[0010] In some embodiments, a filter is mounted between the light source and the light outlet, and the light generated from the light source is projected to the light outlet after being filtered by the filter, the filter including a transparent base sheet and a coating layer on the transparent base sheet, the filter being formed by single-section band coating to pass a single section band, or the filter being obtained by multi-section band coating to pass multiple bands simultaneously, or the filter being obtained by segment coating on the same transparent base sheet to pass different bands for each of multiple segments.

[0011] In some embodiments, the multi-light source therapy device is provided with a plurality of filters or a filter having a plurality of sections, the plurality of filters or the plurality of sections passing different bands of light, the plurality of filters are switchable between a light source and a light outlet, or the plurality of sections of the filter are switchable between a light source and a light outlet, and the switching between the plurality of filters or the plurality of sections is realized by manual or motorized means.

[0012] In some embodiments, the case of the cosmetic device is provided with an insertion / removal opening located between the light source and the light exit port, and a filter is inserted or removed through the insertion / removal opening, allowing switching between multiple filters.

[0013] In some embodiments, a motor, a screw and a nut connecting member are mounted within the case of the cosmetic device, the output shaft of the motor is axially coupled to the screw and rotates synchronously, the screw and the nut connecting member are screwed together, the nut connecting member is connected to a filter, and the multiple filters are connected to each other, and the nut connecting member is moved back and forth in a straight line as the screw rotates, thereby moving and switching the multiple filters or multiple sections of a multi-section filter, so that different filters or different sections of the filter can be switched between the light source and the light outlet.

[0014] In some embodiments, the multi-light source treatment device includes an RF (Radio Frequency) component or an EMS (Electrical Muscle Stimulation) component, and the RF component or EMS component includes one or more pairs of RF electrodes or EMS electrodes, which are attached to the transparent substrate, or attached to the front end surface of the case of the multi-light source treatment device, or connected to the front end of the multi-light source treatment device via an RF accessory head or an EMS accessory head, and the RF electrodes or EMS electrodes are electrically connected to a main control board or an independent control board, and the main control board or the independent control board controls the RF electrodes or EMS electrodes to generate an RF current or EMS current acting on the skin.

[0015] In some embodiments, the power supply components include a battery and / or a power interface, the power interface is electrically connected to a main control board, and the case has a through hole for mounting the power interface for connecting an external power source.

[0016] Preferably, the tungsten light source or carbon light source includes a transparent lampshade and a luminous material mounted in the transparent lampshade, the inside of the transparent lampshade is evacuated or filled with an inert gas or a halogen gas, the luminous material of the tungsten light source is a tungsten filament, the luminous material of the carbon light source is a carbon filament, and the tungsten light source or carbon light source generates a full spectrum light.

[0017] The beneficial effects of the present application are as follows:

[0018] The light source of the treatment device according to the present application includes an IPL light source, a tungsten lamp light source, and / or a carbon light source, and the combination of multiple light sources can obtain mutual complementation of the spectrum, and the spectral band values ​​in the same section can be increased, so that more skin problems can be solved. The treatment device according to the present application uses the stable bands of the tungsten light source and / or the carbon light source to preheat the skin, thereby increasing the basal temperature of the skin, reducing the effects of the loss of IPL light energy, and achieving more effective treatment or cosmetic purposes. [Brief description of the drawings]

[0019] [Figure 1] 1A to 1C are examples of perspective views of a multiple light source treatment device according to a first embodiment of the present application from different angles. [Diagram 2] 1A to 1C are examples of perspective views of a multiple light source treatment device according to a first embodiment of the present application from different angles. [Diagram 3] 1 is an example of an exploded view of a multiple light source treatment device according to a first embodiment of the present application. [Figure 4] 1 is an example of a cross-sectional view of a multi-light source treatment device according to a first embodiment of the present application. [Diagram 5] FIG. 2 is a perspective view of a transparent substrate cooling member according to an embodiment of the present application. [Figure 6] FIG. 11 is an example of a cross-sectional view of a multi-light source treatment device according to a second embodiment of the present application. [Figure 7]FIG. 13 is an example of an exploded view of a multiple light source treatment device according to a third embodiment of the present application. [Figure 8] FIG. 13 is an example of a cross-sectional view of a multi-light source treatment device according to a third embodiment of the present application. [Figure 9] 1 is a perspective view of an example of a transparent substrate cooling member formed by integrating a transparent substrate and a semiconductor cooling member; [Figure 10] FIG. 13 is an example of a cross-sectional view of a multi-light source treatment device according to a fourth embodiment of the present application. [Figure 11] FIG. 13 is an example of an exploded view of a multiple light source treatment device according to a fifth embodiment of the present application. [Figure 12] FIG. 13 is an example of a schematic cross-sectional view of a multiple light source treatment device according to a fifth embodiment of the present application. [Figure 13] FIG. 13 is an example of a cross-sectional schematic diagram of the alternative embodiment of FIG. 12. [Figure 14] 1 is an example of a schematic diagram of the structure of an RF / EMS attachment head. [Figure 15] FIG. 2 is a schematic diagram of a heat dissipation system according to an embodiment of the present application. [Figure 16-18] 5A to 5C are schematic diagrams illustrating different embodiments of cooperation between a semiconductor cooling member, a heat sink, and a fan according to the present application. [Figure 19] 1 is a schematic diagram of a semiconductor cooling member according to an embodiment of the present application; [Figure 20] 1 is a schematic diagram of a combination of a transparent substrate and a one-sided semiconductor cooling member according to an embodiment of the present application. [Figure 21] 1 is a schematic diagram of a combination of a transparent substrate and a double-sided semiconductor cooling member according to an embodiment of the present application. [Figure 22] 1 is a schematic diagram of a transparent substrate semiconductor cooling member according to an embodiment of the present application; [Diagram 23] FIG. 2 is a schematic diagram of a transparent substrate semiconductor cooling member according to another embodiment of the present application. [Figure 24] 1 is a schematic diagram of a semiconductor cooling member according to another embodiment of the present application; [Diagram 25] FIG. 24 is a schematic diagram of a combination of a transparent substrate and the semiconductor cooling member of FIG. 23 in an embodiment of the present application. [Figure 26]1 is a schematic diagram of a transparent substrate semiconductor cooling member according to some embodiments of the present application; [Figure 27] 1 is a schematic diagram of a transparent substrate semiconductor cooling member according to some embodiments of the present application; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0020] Hereinafter, exemplary embodiments of the present application will be described in more detail with reference to the accompanying drawings. Although exemplary embodiments of the present application are illustrated in the accompanying drawings, it should be understood that the present application can be realized in various forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to make the present application more thoroughly understandable and to fully convey the scope of the present application to those skilled in the art.

[0021] It is to be understood that the terms used herein are for the purpose of describing particular exemplary embodiments only and are not intended to be limiting. As used herein, the singular forms "a", "one" and "said" can also include the plural, unless the context clearly indicates otherwise. The terms "comprise", "include", "contain" and "have" are inclusive and thus indicate the presence of a stated feature, step, operation, element and / or component, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components and / or combinations thereof. The method steps, procedures and operations described herein should not be construed as necessarily requiring performance in the particular order described or illustrated, unless the order of performance is specifically stated. It is further understood that additional or alternative steps can be employed.

[0022] In this specification, terms such as first, second, etc. may be used to describe a plurality of elements, components, regions, layers, and / or areas, but these elements, components, regions, layers, and / or sections should not be limited by such terms. These terms may be used merely to distinguish one element, component, region, layer, or section from another region, layer, or section. Terms such as "first", "second", and other numerical terms, as used herein, do not imply a sequence or order unless otherwise indicated by the context. Thus, an element, component, region, layer, or section described below may also be referred to as a second element, component, region, layer, or section without departing from the teachings of the exemplary embodiments.

[0023] For ease of explanation, spatial relative terms may be used herein to describe the relative relationship of one element or feature to another element or feature as shown in the figures. These relative terms may be, for example, "inside," "outside," "inner," "outside," "lower," "lower," "up," "upper," "front end," "rear," and the like. Such spatial relative terms are intended to encompass various orientations of the device during use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures were inverted, an element described as being "under" or "under" another element or feature would correspondingly be positioned "above" or "above" the other element or feature. Thus, the exemplary term "under..." can encompass both an above and below orientation. The device may be otherwise oriented (rotated 90 degrees or at other orientations), and the spatial relative terms used herein would be interpreted accordingly.

[0024] The endpoints and any values ​​set forth herein are not limited to the precise ranges or values, and these ranges or values ​​should be understood to include values ​​close to such ranges or values. In the case of numerical ranges, the endpoints of each range, between each range endpoint and the individual point values, and between the individual point values, can be combined with each other to obtain one or more new numerical ranges, and these numerical ranges should be considered to be specifically disclosed herein.

[0025] 1 to 15, the multi-light source treatment device 1000 according to the present application includes a case, a main control board 40 mounted in the case, a light source 2 electrically connected to the main control board 40, a power supply component, a fan 60, and a semiconductor cooling member 80, the semiconductor cooling member 80 includes a middle semiconductor particle layer 82, and hot surfaces 83 and cold surfaces 81 at both ends, a light outlet is formed on the front end surface of the treatment device, the light source 2 includes an IPL light source 20' and further includes a tungsten light source and / or a carbon light source 20, the light outlet is formed by a transparent substrate 12 mounted in the front end of the case, the cold surface 81 of the semiconductor cooling member is thermally connected to the transparent substrate 12 to cool the transparent substrate, or the transparent substrate 12 is directly the cold surface 81 of the semiconductor cooling member, and the light generated by the light source 2 passes through the light outlet and acts on the skin to perform beauty or treatment.

[0026] The light source 2 of the multi-light source treatment device 1000 according to the present application includes multiple types of light sources, one of which is an IPL light source, and further includes a tungsten light source and / or a carbon light source, but of course it can also be used in combination with other light sources such as an LED light source, and the light source is selected and combined according to the target skin problem. The multiple light sources can be mounted side by side in the light reflecting member 21, and may be arranged in parallel, and the light generated from the light source 2 is projected to the light exit port after being reflected by the light reflecting member 21. As can be understood, for the multiple types of light sources according to the present application, one or multiple tubes or light bulbs may be designed for the same type of light source. In the following embodiment, an example in which each type of light source is one light source lamp (tube / light bulb) will be described, but multiple light source lamps that are the same type of light source may be directly arranged in parallel or in series as necessary.

[0027] Among them, the tungsten light source or carbon fiber light source uses a tungsten filament or carbon fiber as the lamp filament, that is, the luminous material, and the lamp filament is mounted in a transparent lampshade, and the lamp filament emits light when electricity is applied. In order to prevent the lamp filament from oxidizing at high temperatures, the inside of the lampshade is kept in a vacuum or filled with low-pressure inert gas or halogen gas. When the transparent lampshade of the tungsten light source or carbon fiber light source is filled with halogen gas such as iodine or bromine, a halogen lamp is obtained (also called a tungsten halogen lamp). The tungsten light source or carbon fiber light source belongs to the incandescent lamp light source, and is realized using the structure of an incandescent lamp.

[0028] If a tungsten filament and / or carbon fiber is used as the luminous material of the lamp filament, it is possible to extend the life of the light source by filling a certain percentage of inert gas or halogen gas into the transparent lampshade, and it is possible to change the spectral distribution of the tungsten filament and / or carbon fiber light source by adjusting the air pressure and gas ratio inside the lamp, or by adjusting the current pulse or power supply voltage, etc.

[0029] A tungsten light source or a carbon fiber light source has full spectrum characteristics and always bright characteristics. The light source generates full spectrum light including visible light and invisible light, and after filtering, light of a predetermined band for skin beauty or treatment is obtained. For example, light of the visible light band of 500 to 600 nm can lighten melanin in the epidermis, and near-infrared light of the band of 900 to 2500 nm can directly reach the dermis layer and basal layer, promoting collagen regeneration and repairing the basal layer.

[0030] In some embodiments, one light reflecting member 21 may be provided corresponding to each light source, and multiple light sources correspond to multiple light reflecting members 21, and the multiple light reflecting members 21 are connected to each other. In other embodiments, multiple light sources share one light reflecting member 21. The multiple light reflecting members 21 or the single light reflecting member 21 includes an arc-shaped surface provided to surround the corresponding light source.

[0031] The following embodiment will be described taking two light sources 2 as an example, one of which is an IPL light source 20 ′ and the other is a tungsten light source 20 .

[0032] As shown in Figs. 1 to 4, the handheld type multi-light source treatment device 1000 according to the first embodiment of the present application has an elongated shape as a whole, and can be operated by handholding the device. The multi-light source treatment device 1000 includes a case, a cavity is formed inside the case, and a light exit window is formed at the front end of the case. The case includes a main housing 10, a front housing 11 connected to the front end of the main housing, and a rear housing 15 connected to the rear end of the main housing. The light exit window is formed in the front housing 11, and the light exit window is covered by a transparent substrate 12 to form a light exit port of the front end surface of the multi-light source treatment device, and the rear end of the main housing is covered by the rear housing 15. Components such as a light source unit, a power supply component, a main control board 40, a fan 60, a semiconductor cooling member 80, and a heat dissipation component 70 are mounted in the main housing. Among them, the transparent substrate 12 is provided independently, and the transparent substrate 12 is cooled by the semiconductor cooling member 80, or the transparent substrate 12 serves as a transparent substrate cold surface of the semiconductor cooling member. The light source unit includes a light source 2.

[0033] A base holder 13 is attached to the cavity inside the main housing 10, and the base holder 13 is for mounting the light source unit. The front end of the base holder is provided with a light exit passage 160 that communicates with the light exit port on the front end face of the multi-light source treatment device. The light exit passage is formed by a mirror cover 161 attached to the front end of the base holder 13. The mirror cover is a cylindrical body with both front and rear ends open, and its inner wall is made of a light reflecting material to guide the light generated from the light source 2 to the light exit port. A partition plate 14 is further attached inside the main housing 10, and the partition plate 14 fits the inner wall of the main housing to form a relatively sealed space with the inner wall of the main housing, thereby mounting and protecting the main control board 40. The base holder 13 and the partition plate 14 may be the same component, or may be two components provided independently. At any appropriate position in the case (main housing 10 and / or front housing 11 and / or rear housing 15), several ventilation holes 101 may be provided as air intakes and air outlets for the multi-light source therapy device, communicating with the air passage in the case to form an air passage for heat dissipation. The main housing is provided with key holes to which the key group 42 is attached. The rear housing 15 is provided with a through hole to which the power interface 41 is attached.

[0034] The light source section includes a light source 2 and a light reflecting member 21 to which the light source is attached. The light source 2 includes a tungsten light source 20 and an IPL light source 20' arranged side by side within the light reflecting member 21. The light generated from the two light sources 2 is projected to the light exit port after being reflected by the light reflecting member 21.

[0035] In some embodiments, the filter 50 may be a coating layer formed on the surface of a transparent base sheet by a coating process, and the filter can be fabricated using an optical coating process. Exemplary coating processes include, for example, vapor deposition, ion beam sputtering (IBS), plasma sputtering, atomic layer deposition (ALD), and the like. In a vapor deposition process, a source material in a vacuum chamber is evaporated by heating or bombardment with an electron beam during vapor deposition. The vapor condenses to form a uniform coating layer on the surface of the transparent base sheet. In an ion beam sputtering (IBS) process, an ion beam can be accelerated by a high energy electric field, which gives the ions a large kinetic energy, and when colliding with the source material, the ion beam "sputters" the target atoms, and the sputtered target ions (atoms are transformed into ions by the ionization zone) also have kinetic energy and will form a dense film when they contact the surface of the transparent base sheet. The plasma sputtering process is a general term for a series of techniques, such as plasma sputtering and magnetron sputtering, in which ions in the plasma are accelerated and injected into the source material, collide with loose energy source ions, and then sputtered onto the transparent base sheet to form a uniform filtering film. In the atomic layer deposition process, the source material used in atomic layer deposition (ALD) exists in gas form as it is, and in a high-temperature vacuum chamber, the gas phase precursor can be transferred through non-overlapping pulses and deposited on the surface of the transparent base sheet to form a filtering film. The transparent substrate of the filter 50 plays the role of support and light transmission, and the filtering film is formed by the coating layer, and the filtering performance of passing a predetermined band can be obtained by coating with multiple layers, multiple materials, and multiple processes.

[0036] In some embodiments, a coating layer is formed on a transparent base sheet by the above coating process, among which, single-section band coating is used to form a single single-band filter that passes a single section band, for example, a single-section filter that passes the bands of 500-1800 nm, 900-1800 nm, and 500-600 nm; or multi-section band coating is used to obtain a multi-band filter that passes multiple bands simultaneously, for example, double-section band coating is used to obtain a double-band filter that passes both the bands of 500-600 nm and 900-1800 nm; or section coating is used on a transparent base sheet to obtain a multi-section filter that passes different bands for each of multiple sections, for example, section coating is used to obtain a filter with section A of 500-600 nm and section B of 900-1800 nm.

[0037] The filter 50 can be any conventional filter. By switching between different filters 50, different bands of treatment for different skin problems can be achieved.

[0038] The main control board 40 is electrically connected to the key group 42, electrically connected to the multiple light sources 2, and connected to power supply components. A current interface 41 is connected to the main control board. The main control board 40 is provided with corresponding circuits and function modules according to functional needs, and these circuits or function modules can use conventional technology or purchase corresponding electronic elements from the market. For example, the main control board 40 is provided with a power supply module, multiple control modules, an RF / EMS driving module, a temperature control module, etc.

[0039] The power supply components include a battery 30 and / or an electrical interface 41. The battery 30 may be a rechargeable battery that is charged via the electrical interface 41, or may be a replaceable disposable battery. Alternatively, the battery 30 may be omitted and may be directly connected to an external power source via the electrical interface 41 for power supply.

[0040] The key group 42 includes, as necessary, a power on / off key, a light source control key, a setting key, an RF / EMS switch, and the like, but is not limited to these.

[0041] In this embodiment, a light exit port is formed by a transparent substrate 12 mounted in a light exit window at the front end of the multi-light source treatment device, and the transparent substrate 12 is cooled by a semiconductor cooling member 80. The transparent substrate 12 and the semiconductor cooling member 80 are compatible in shape, and the semiconductor cooling member 80 cools the periphery of the transparent substrate 12, i.e., cools the periphery of the light exit port. The transparent substrate 12 is a substrate whose entire surface is transparent and can be brought into contact with the skin.

[0042] The semiconductor cooling member 80 is also called a thermoelectric cooler (TEC) or heat pump or Peltier cooler, and includes a semiconductor particle layer 82 in the middle, and a hot surface 83 and a cold surface 81 at both ends. It further includes a pair of positive and negative electrodes that electrically connect the circuit of the semiconductor cooling member to a control module provided on the main control board 40 or an independently provided control board, and the independent control board can be electrically connected to the main control board 40. The two ends of the couple particle layer are a cold end and a hot end, a cold end circuit is provided on the cold surface 81, and a hot end circuit is provided on the hot surface 83. When the cold end circuit is electrically connected to the cold end of the semiconductor particle layer and the hot end circuit is electrically connected to the hot end of the semiconductor particle layer, an internal circuit of the semiconductor cooling member is formed, and a temperature difference is formed between the cold surface 81 and the hot surface 83 after electricity is applied.

[0043] In some embodiments, when the transparent substrate 12 is used as the cold surface 81 of the semiconductor cooling member, the transparent substrate is provided with one or more cold end circuits, and the one or more cold end circuits are welded and electrically connected to the cold ends of one or more semiconductor particle layers 82, and the hot ends of each set of semiconductor particle layers 82 are one hot surface 83, and the hot surface 83 is provided with a hot end circuit that is welded and electrically connected to the hot ends of the semiconductor particle layers 82. When the cold end circuit is electrically connected to the cold ends of the couple particle layers and the hot end circuit is electrically connected to the hot ends of the couple particle layers, an internal circuit of the semiconductor cooling member 80 is formed, and a temperature difference is formed between the transparent substrate cold surface 12 / 81 and the hot surface 83 after electricity is applied, and the transparent substrate cold surface 12 / 81 has a low temperature and is used for cooling, and the hot surface 83 has a high temperature and needs to be dissipated.

[0044] For example, the semiconductor cooling member 80 is generally annular, the hot surface 83 and the cold surface 81 are matched annular substrates, and the semiconductor particle layer 82 is arranged in a matched annular shape. The annular central through hole is for passing the light generated from the light source 2. The hot surface 83 / cold surface 82 are substrates or other types of heat transfer structures made of heat conductive materials, and may be made of a single heat transfer material such as aluminum / copper / graphene, or may be heat transfer structures using phase change (evaporation and condensation) such as a heat pipe / vapor chamber (VC) / ALVC (aluminum superheat transfer tube or aluminum superheat transfer plate) for rapid heat transfer or cooling. The annular semiconductor cooling member 80 is provided on the rear surface (back side) of the transparent substrate 12, and the annular cold surface 82 is in close contact with the edge of the transparent substrate 12 to cool the periphery of the transparent substrate 12, so that the entire surface of the transparent substrate 12 is cooled. The transparent substrate 12 is secured to the front housing 11 , and the semiconductor cooling member 80 is also mounted within the front housing 11 .

[0045] In another alternative embodiment, referring to Fig. 5, the cold surface 81 of the semiconductor cooling member 80 is a transparent substrate over the entire surface, in which case the transparent substrate cold surface 81 and the transparent substrate 12 are used in combination, eliminating the need to provide a separate transparent substrate 12. The transparent substrate cold surface 12 / 81 covers the light exit window of the front housing to form a light exit port, and the semiconductor cooling member 80 is fastened and attached by the front housing 11. The transparent substrate cold surface is capable of contacting the skin. The semiconductor particle layer 82 and the hot surface 83 may be annularly provided and welded to an annular band at the edge of the transparent substrate cold surface 81.

[0046] A heat dissipation component 70 for dissipating heat from the semiconductor cooling member 80 is further mounted in the main housing 10. The heat dissipation component 70 includes one or a combination of a heat tube, a vapor chamber, a superheat transfer tube, a superheat transfer plate, a heat transfer member made of a single heat transfer material, or a heat dissipation fin. Exemplarily, the heat dissipation component 70 includes a heat dissipation fin 71 and a heat transfer member 72, and the heat transfer member 72 is connected at one end to the heat dissipation fin 71 in a rapid heat transfer manner and at the other end to the hot surface 83 of the semiconductor cooling member 80 in a rapid heat transfer manner in order to rapidly transfer heat from the hot surface to the heat dissipation fin 71 for heat dissipation. The shapes of both ends of the heat transfer member are designed according to the principle that heat is rapidly transferred, and exemplarily, the front end is annular and is in close contact with the annular hot surface 83 to transfer heat with the maximum contact area, and the rear end is a straight rod that is inserted into a set of parallel heat dissipation fins 71 and contacts the heat dissipation fins 71 to transfer heat. In other embodiments, the front end may be bent to make the entire heat transfer member L-shaped or other shapes. The heat transfer member 72 is a heat transfer structure and may be made of a single heat transfer material such as aluminum / copper / graphene, or may be a component that utilizes phase change (evaporation and condensation), such as a superheat transfer tube or superheat transfer plate, such as a heat tube / vapor chamber VC / ALVC (aluminum superheat transfer tube or aluminum superheat transfer plate). In order to facilitate air cooling and heat dissipation, one or more sets of heat dissipation fins 71 are preferably located behind the ventilation holes in the main housing.

[0047] The fan 60 may be attached to one side of the heat dissipation fins 71. The fan 60 includes a case and a rotating blade therein, and the fan case is provided with several ventilation holes, which may be provided on both the top and bottom surfaces (in the axial direction) or on the side elevation of the fan as air inlets / air outlets for the fan.

[0048] The multi-light source treatment device 1000 according to the present embodiment further includes RF components or EMS components (RF / EMS components) including several pairs of RF / EMS electrodes 90. For example, the RF / EMS electrodes are a pair of columnar electrodes, and through-holes are provided in the periphery of the transparent substrate 12 and / or the semiconductor cooling member 80, and the RF / EMS electrodes 90 are attached at one end in the through-hole, and the front end is exposed outside the transparent substrate 12 / 81 to contact the skin, and the rear end is formed with positive and negative electrodes electrically connected to the main control board 40 or an independently provided RF / EMS control board. The main control board 40 or the RF / EMS control board is provided with functional modules such as a control module, a power module, and an RF / EMS driving module. When the RF / EMS control board is provided independently, the RF / EMS control board is electrically connected to the main control board 40, and the power module of the RF / EMS control board is divided and supplied by the power module in the main control board 40. In another embodiment, the RF / EMS control board may be integrated into the main control board 40, and accordingly, functional modules such as the control module, the power module, and the RF / EMS driving module are integrated into the main control board 40. The RF / EMS electrodes 90 may be stripe-shaped, columnar, arc-shaped, annular, or any other suitable shape, and the RF / EMS electrodes 90 may be provided overlapping the light exit port or around the light exit port, and one or more pairs are provided. The rear ends of each pair of RF / EMS electrodes are formed with RF / EMS positive and negative electrodes electrically connected to the RF / EMS control board or the main control board. The RF / EMS control board or the main control board 40 controls the power module to supply a voltage required for the corresponding position to the RF / EMS driving module, and the RF / EMS driving module converts the DC power supply voltage into a high-voltage sine wave through a step-up transformer and provides it to the output control module, and the output control module outputs an RF / EMS current to the user's skin through the RF / EMS electrodes 90 to perform RF / EMS treatment or RF / EMS beauty treatment on the skin. The RF / EMS electrodes and the RF / EMS main board / main control board or the functional modules integrated therein can be realized using conventional technology models.

[0049] In this embodiment, multiple pairs of RF / EMS electrodes 90 are mounted in through holes provided in the transparent substrate 12 and the semiconductor cooling member 80, electrode points are formed on the outer surface of the transparent substrate 12, and the positive and negative poles are electrically connected to the main control board 40. The transparent substrate 12 and the semiconductor cooling member 80 are mounted in close contact with each other, and both are mounted in the front housing 11, the annular front end of the heat transfer member 72 of the heat dissipation component 70 is abutted against the annular hot surface of the semiconductor cooling member 80, the heat dissipation fins 71 are mounted behind the ventilation holes 101 of the main housing 10, the ventilation holes 101 are a pair of thin through holes that communicate with the heat dissipation fins 71 through airflow, and the fan 60 may be provided above and below the heat dissipation fins 71, and the air passages of both communicate with each other through airflow. The light source unit is attached to the base holder 13 and is located inside the front end of the main housing 10. The two light sources 2 include a tungsten light source 20 and an IPL light source 20'. The two light sources 2 are attached inside the light reflecting member 21. A heat dissipation air passage for dissipating heat from the light source may be formed inside the light reflecting member, or a heat dissipation member for dissipating heat from the light reflecting member may be provided outside the light reflecting member. The outlet of the light reflecting member 21 is covered by a filter 50, and its front end becomes a light exit passage 160. A battery 30 is attached inside the rear end of the main housing. When the power is turned on by the key group 42, the two light sources 2 are turned on, and the light generated from the two light sources 2 is filtered by the filter 50 to obtain a predetermined band, and then projected to the light exit port through the light exit passage 160, acting on the skin to perform photon beauty treatment. When the RF / EMS function is turned on by the key group 42, an RF / EMS current is generated from the RF / EMS electrode 90 and acts on the skin to perform RF / EMS physical therapy. The RF / EMS function and the photon cosmetic function may be turned on simultaneously or alternatively, and for multiple light sources, one or more of the light sources may be selectively turned on. The hot surface of the semiconductor cooling member 80 is dissipated by the heat dissipation component 70, the transparent substrate 12 is cooled by the cold surface of the semiconductor cooling member 80, and the transparent substrate 12 comes into contact with the skin, or the transparent substrate cold surface of the semiconductor cooling member 80 comes into contact with the skin. The fan 60 draws in cold air from the ventilation holes provided in the case of the multi-light source treatment device, cooling and dissipating heat from the heat dissipation fins 71 and the light source unit.

[0050] 6, the multi-light source treatment device 1000 according to the second embodiment of the present application is different from the first embodiment in that it is not provided with RF / EMS components, that is, it is not provided with an RF / EMS electrode 90 and an RF / EMS control board (or the main control board 40 is not provided with a functional module corresponding to the RF / EMS components). For the structure and arrangement of the multi-light source treatment device 1000 according to the second embodiment similar to those of the above-mentioned embodiment, please refer directly to the above-mentioned embodiment and will not be repeated here.

[0051] 7 to 9, the main difference between the multi-light source treatment device 1000 according to the third embodiment of the present application and the first embodiment is that in the third embodiment, the transparent substrate 12 is cooled by one or more semiconductor cooling members 80 provided on the side of the transparent substrate 12. The light exit window at the front end of the body of the multi-light source treatment device is covered by the transparent substrate 12 to form a light exit port. In the first embodiment, the semiconductor cooling member 80 is annular and attached to the back surface of the transparent substrate 12 to cool the area around the light exit port, whereas in the third embodiment, the shape of one or more semiconductor cooling members 80 is adapted to the shape of the side surface of the transparent substrate, and the cold surface 82 of the semiconductor cooling member 80 is in close contact with the side surface of the transparent substrate 12 to rapidly cool the transparent substrate 12.

[0052] As a non-limiting example, the transparent substrate 12 may be a rectangular parallelepiped, the semiconductor cooling member 80 may be a rectangular parallelepiped, and may include a rectangular cold surface 81 / a rectangular hot surface 83, with an intermediate semiconductor particle layer arranged between the entire cold surface / the entire hot surface. One semiconductor cooling member 80 is attached to the bottom side surface of the transparent substrate 12, but one or more of the four peripheral surfaces, ie, top, bottom, left, and right surfaces, may each be provided with one semiconductor cooling member 80 to cool the corresponding side surface. The heat dissipation component 70 is for dissipating heat from the semiconductor cooling member 80. The transparent substrate 12 is larger than in the first embodiment, and the front end of the base holder does not need to be provided with the mirror cover 161 and the light exit passage 160 therein. The transparent substrate 12 is fixed by the light exit window of the front housing 11 and the front end of the base holder, and its rear end is abutted against the filter 50, and both cover the outlets of the light reflecting member, covering the two light sources 2 within the light reflecting member 21.

[0053] The front housing 11 is provided with through holes for attaching RF / EMS electrodes 90, and several pairs of RF / EMS electrodes 90 are columnar (not limited to being columnar) and are inserted into the through holes on the front housing 11, with their front ends forming electrode points on the end face of the front housing 11 that act on the surface of the skin to perform RF / EMS physical therapy, and their rear ends are the positive and negative poles of the RF / EMS electrodes and are electrically connected to the main control board 40 or the RF / EMS control board.

[0054] A heat dissipation part 70 for dissipating heat from the semiconductor cooling member 80 is further mounted in the main housing 10. The heat dissipation part 70 includes one or a combination of a heat tube, a vapor chamber, a superheat transfer tube, a superheat transfer plate, a heat transfer member made of a single heat transfer material, or a heat dissipation fin. Exemplarily, a heat dissipation part 70 for dissipating heat is provided corresponding to each hot surface, and the heat dissipation part may be provided completely independently or may be shared. For example, each hot surface is connected to one heat transfer member 72, and each heat transfer member 72 is connected to one set of heat dissipation fins 71, respectively, or each heat transfer member is connected to the same set of heat dissipation fins 71, and the heat dissipation fins dissipate heat through air cooling, and the air cooling heat dissipation is the same as in the above embodiment. As in the above embodiment, a base holder 13, a light source unit, a power supply part, a main control board 40, and a fan 60 are mounted in the case (main housing 10) of the multi-light source treatment device 1000 according to the third embodiment. The partition plate 14 forms a relatively sealed space between the main housing and the inner wall for mounting the main control board 40. The case of the multi-light source treatment device is provided with several ventilation holes 101 serving as an air intake and an air outlet. The case of the multi-light source treatment device 1000 is provided with key holes to which the key group 42 is attached. The case of the multi-light source treatment device 1000 (for example, the rear housing 15) is provided with a through hole to which the power interface 41 is attached. The base holder 13 is for mounting the light source unit. The two light sources 2 include an IPL light source 20' and a tungsten light source (or a carbon light source) 20, and are mounted in the light reflecting member 21, and the outlet of the light reflecting member is covered by a filter 50. The main control board 40 is electrically connected to the key group 42, electrically connected to the two light sources 2, and connected to a power supply component. The main control board 40 is provided with corresponding circuits and function modules according to functional needs, and for example, the main control board 40 is provided with a power supply module, multiple control modules, an RF / EMS driving module, a temperature control module, etc. The power supply components include a battery 30 and / or a current-carrying interface 41. The fan 60 may be mounted on one side of the heat dissipation fin 71.The fan 60 includes a case and a rotating blade therein, and the case of the fan is provided with several ventilation holes serving as the fan's air intake / air outlet. The multi-light source treatment device 1000 according to this embodiment further includes RF / EMS components including several pairs of RF / EMS electrodes 90, which are electrically connected to the main control board 40 or an independently provided RF / EMS control board. The RF / EMS control board or the main control board 40 includes functional modules such as a control module, a power supply module, and an RF / EMS driving module.

[0055] In use, when the power is turned on by the key group 42, the two light sources 2 are turned on, and the light generated from the two light sources 2 is filtered by the filter 50 to obtain a predetermined band, and then passes through the transparent substrate 12 to act on the skin for photon cosmetic treatment. When the RF / EMS function is turned on by the key group 42, an RF / EMS current is generated from the electrode point formed on the front end surface of the multi-light source treatment device by the RF / EMS electrode 90, and acts on the skin to perform RF / EMS physical therapy. The RF / EMS function and the photon cosmetic treatment function may be turned on simultaneously or alternatively. The semiconductor cooling member 80 dissipates heat by the heat dissipation component 70, and the transparent substrate 12 is cooled by the cold surface of the semiconductor cooling member 80, and the transparent substrate 12 comes into contact with the skin to form an ice compress or pre-cooling. Cool air is drawn in through the ventilation holes on the case of the multi-light source treatment device and enters the inside, cooling the heat dissipation fins 71 and the light source unit, and the fan 60 strengthens the air flow and promotes the heat dissipation speed.

[0056] 10, the multi-light source treatment device 1000 according to the fourth embodiment is based on the third embodiment, and is not provided with RF / EMS components, i.e., the RF / EMS electrode 90 and the RF / EMS control board (or the main control board 40 is not provided with a functional module corresponding to the RF / EMS components), and the front housing 11 is not provided with a through hole for mounting the RF / EMS electrode 90. When the power is turned on by the key group 42, the two light sources 2 are turned on, and the light generated from the two light sources 2 is filtered by the filter 50 to obtain a predetermined band, and then projected to the light exit port through the light exit path 160, and acts on the skin to perform photon beauty treatment. The other structure is the same as that of the third embodiment, and will not be repeated here.

[0057] 11 and 12, the multi-light-source treatment device 1000 according to the fifth embodiment of the present application is different from the first embodiment in that a switchable filter 50 is arranged and the filter 50 can be replaced by inserting and removing it on the side of the case (main housing 10) of the multi-light-source treatment device. Specifically, the case (main housing 10) of the multi-light-source treatment device is provided with a filter insertion / removal opening 16 corresponding to the filter 50. The filter 50 is fixed by a holder 51, and the shapes of the filter 50 and the holder 51 fit the insertion / removal opening 16. The filter 50 is inserted and removed from the insertion / removal opening 16, and one end of the holder 51 is inserted into the insertion / removal opening 16 and protrudes outward in order to facilitate operation. The filter 50 is inserted into the case of the multi-light-source treatment device from the insertion / removal opening 16 and is located at the exit of the light reflecting member 21, and the two light sources 2 are covered within the light reflecting member. The multiple light source treatment device 1000 may be provided with multiple filters 50 having different bands in order to enable selection and switching of filters of corresponding bands for different skin problems. For example, the multiple filters 50 include an NIR filter that can transmit near-infrared light but cannot transmit invisible light. The multiple filters 50 may include a precision optical filter that can pass a single section band such as 500-600 nm or 500-650 nm, or a multi-band filter in which two or more bands such as 500-600 and 900-1900 nm appear simultaneously in the same coating area may be used, thereby obtaining two or more bands as light waves acting on the skin.

[0058] As in the first embodiment, the multi-light source therapy device 1000 according to the fifth embodiment includes a case, in which a cavity is formed, and in which a cap holder 13, a light source unit, a power supply component, a main control board 40, a fan 60, a semiconductor cooling member 80, and a heat dissipation component 70 are mounted. The transparent substrate 12 is cooled by the semiconductor cooling member 80, or the transparent substrate 12 is used as the transparent substrate cold surface 81 of the semiconductor cooling member. The multi-light source therapy device 1000 according to this embodiment further includes an RF / EMS component. The structure and operation principle of the multi-light source therapy device 1000 according to the fifth embodiment, which are similar to those of the first embodiment or the above-mentioned other embodiments, can be directly used and will not be repeated here.

[0059] Referring to Fig. 13, the multi-light source treatment device 100 uses an electric method to realize the switching of the filter 50. For example, the base holder is equipped with a motor 52 and a screw part, and the screw part includes a screw 53 and a nut connection member 54. The output shaft of the motor is axially coupled with the screw 53 to rotate synchronously. The screw 53 is inserted into the screw hole of the nut connection member 54 and screwed together, and one end of the nut connection member 54 is connected to the filter holder 51. The multiple filters 50 may be connected to each other and soft-connected. In the direction shown in Fig. 13, filter A and filter B are connected vertically (or are the A and B sections of a multi-section filter), and any one of the filters 50 is clamped and fixed by the filter holder 51. The forward and reverse rotation of the motor 52 drives the screw 53 to rotate forward and reverse, so that the nut connection member 54 moves linearly back and forth along the screw 53 (moves up and down along the direction shown in the figure), and the filter holder 51 and the multiple filters 50 move linearly back and forth (up and down) by the nut connection member 54, so that different filters (up and down) or different sections can be switched into the light exit passage or the outlet of the light reflecting member. The light waves emitted from the two light sources 2 are projected to the light exit port after filtering by the filters 50, and act on the skin outside the transparent substrate. The motor 52 is electrically connected to the main control board 40.

[0060] In another embodiment, the motor screw part may be replaced with an electromagnet, and the extension and contraction of the output shaft of the electromagnet moves the filter holder 51 and the multiple filters 50 up and down. The electromagnet is electrically connected to the main control board 40.

[0061] In any of the multi-light source treatment devices 1000 according to the first to fourth embodiments, it is possible to switch between different filters 50 at the exit of the light output path or the light reflecting member by using the form of the corresponding embodiment in Fig. 11 to Fig. 13, thereby realizing switching between filters 50 of different bands. For example, the main housing 10 is provided with an insertion / removal opening 16, and the filter 50 is inserted from the insertion / removal opening 16 into the exit position of the light output path or the light reflecting member, and the filter is removed from the insertion / removal opening 16 and another filter is inserted, or an electric screwdriver is attached to the mouthpiece holder, and the multiple different filters 50 attached to the filter holder 51 are moved into the light output path or the exit of the light reflecting member by the electric screwdriver.

[0062] In the above-mentioned embodiments of the multi-light source therapy device 1000, the light source is a tungsten light source or a carbon light source, and infrared heating is possible. The transparent substrate may be sapphire, quartz, K9, glass, transparent plastic or other suitable light-transmitting material, and is preferably transparent crystal.

[0063] The treatment device 1000 according to each of the above embodiments uses multiple light sources 2, among which the tungsten light source and / or carbon light source 20 enables infrared heating, has good spectral continuity, a wide spectrum (ranging from 300 to 2500 nm), and has a large near-infrared spectrum. The IPL light source 20' among the multiple light sources 2 is a strong pulsed light, has a short emission time, high peak light energy, and a fast photochemical reaction caused by the skin receiving the light energy, and can instantly increase the temperature of the skin, but has poor spectral continuity and a small near-infrared spectrum. The advantages of combining two types of light sources are as follows: 1) Mutual complementation of spectra: The number of spectral band values ​​in the same interval increases, and the spectral values ​​of the two are mutually complemented. 2) Complementary advantages: In the same band section, the stable band of the tungsten light source and / or carbon light source 20 is used to preheat the skin, thereby increasing the basic temperature of the skin and reducing the loss of light energy from the IPL, while the IPL allows the instantaneous light energy of strong pulsed light to be applied to the heated skin. According to this form, while achieving the same therapeutic effect, the energy of the IPL light source can be reduced and the light emission speed of the IPL light source can be improved, reducing the impact caused by the high-energy IPL light source, and achieving faster, gentler, safer and more effective therapeutic objectives.

[0064] 3) Enhanced scope of treatment for cosmetic and other skin diseases: The 900-2500 nm band of the near-infrared spectrum of the tungsten light source and / or carbon light source resonates with the water molecules inside the skin (the interaction between the near-infrared band and water molecules has already been confirmed by major medical journals / papers / magazines / clinical reports), heating and cooling the underlying skin at the same time, working together with the temperature control means to make the outer skin cool and the inner skin hot, and further adding the instantaneous photochemical thermal energy shock of the IPL light source, achieving a more comfortable experience and better treatment effect.

[0065] As can be understood, in use, the treatment device 1000 according to the present application may select multiple light sources and turn them on simultaneously, or may selectively use any one of the light sources.

[0066] Referring to FIG. 14, the RF / EMS electrode 90 of the multiple light source treatment device 1000 according to each embodiment may be mounted on the front end of the multiple light source treatment device 1000 in the form of an accessory head, and the RF / EMS electrode accessory head includes a case 91, which is provided with a through hole or a mounting groove, and several RF / EMS electrodes 90 are mounted in the through hole or the mounting groove, and the front end of the RF / EMS electrode 90 is exposed to the front end surface of the accessory head case to contact the skin, and the rear end of the RF / EMS electrode 90 is electrically connected to the RF / EMS circuit board or the main control board 40 inside the multiple light source treatment device 1000 through an interface or an electric wire. The accessory head is connected to the front end of the multiple light source treatment device 1000 in a plug-in connection or snap-fit ​​manner. The front end surface of the case of the accessory head may be made of a transparent material or an opaque material. In the case of a transparent material, when the accessory head is connected to the multiple light source treatment device 1000, photon cosmetology and RF / EMS treatment can be simultaneously realized, and in the case of an opaque material, only RF / EMS treatment can be turned on. Multiple accessory heads may be arranged for interchangeable use with the multi-light source treatment device 1000.

[0067] Referring to the schematic diagram of Fig. 15, one embodiment of the heat dissipation system of the treatment device according to the present application is shown. The heat dissipation system is composed of a fan 60 and a heat dissipation air passage, and the fan 60 is for simultaneously dissipating heat from the heat dissipation parts 70 of the semiconductor cooling member 80 and the light source part. The arrows in the figure indicate the air flow direction of the heat dissipation air passage. The arrows at the light exit port on the front end face of the multi-light source treatment device indicate the light irradiation direction.

[0068] In this embodiment, the fan 60 can simultaneously allow airflow to flow in and out from both the upper and lower sides (in the axial direction), one airflow flows through the light source unit, and the other airflow flows through the heat dissipation component 70 (heat dissipation fins 71). The ventilation port 101 provided at the front end of the case of the multi-light source treatment device serves as an air intake port for the light source unit, and is in airflow communication with the air passage of the light source unit, the fan 60, and another ventilation port 101 provided in the case of the multi-light source treatment device, for example, a ventilation port (used as an air outlet) at the rear end of the case, to form a first heat dissipation air passage for dissipating heat from the light source unit. The first air passage for heat dissipation can be in airflow communication with the space inside the light reflecting member 21, and ventilation openings may be formed at both ends of the light reflecting member as an air inlet and an air outlet, or the first air passage for heat dissipation may be in airflow communication with the space on the surface of the outer wall of the light reflecting member 21 to dissipate heat from the light reflecting member, or the outer wall (or back surface) of the light reflecting member may further be provided with a light source heat dissipation member (the heat dissipation member may include one or a combination of a heat tube, a vapor chamber, a superheat transfer tube, a superheat transfer plate, a heat transfer member made of a single heat transfer material, or a heat dissipation fin), in which case heat transfer between the light reflecting member is rapid, and the first air passage for heat dissipation is in airflow communication with the heat dissipation member of the light source unit to air-cool and dissipate heat from the fan heat dissipation member. Ventilation openings are formed on the upper and lower sides of the fan in the axial direction, and a ventilation opening is provided in the side elevation case of the fan (outside the rotating blades). Of these, the ventilation opening on the upper side of the fan serves as an air intake and is in airflow communication with the air passage of the light source unit, and the ventilation opening on the side elevation case serves as an air outlet and is in airflow communication with the air outlet at the rear end of the case of the skin care device. The heat dissipation principle of the first heat dissipation air passage is that when the fan 60 is turned on, the surrounding air is accelerated and enters the body of the multi-light source treatment device through the ventilation opening 101 at the front end of the case, and a guide passage is formed in the nozzle holder, and this guide passage guides air into the light source section (for example, the inside of the light reflecting member or the space on the surface of the outer wall of the light reflecting member, or the air passage of the heat dissipation member on the back of the light reflecting member) where it absorbs the heat of the light source section and turns into hot air, and the hot air enters the space inside the fan case through the ventilation opening 61 on the upper surface of the fan 60, and then flows from the ventilation opening 62 on the case on the side elevation to the ventilation opening (air outlet) provided at the rear end of the case of the multi-light source treatment device, and is discharged to the outside of the body of the multi-light source treatment device, thereby achieving wind-cooled heat dissipation of the light source section.

[0069] A second heat dissipation air passage for dissipating heat from the heat dissipation component 70 of the semiconductor cooling member 80 is formed by airflow communication between the ventilation opening 101 (designated as an air inlet) at a position corresponding to the heat dissipation fin 71 of the heat dissipation component 70 in the case of the multi-light source treatment device, the air passage of the heat dissipation fin 71, the ventilation opening on the underside of the fan, the ventilation opening on the case on the side elevation of the fan, and the ventilation opening (designated as an air outlet) at the rear end of the case of the multi-light source treatment device. The heat dissipation principle of the second heat dissipation air passage is that when the fan 60 is turned on, the surrounding air is accelerated and enters the air passage of the heat dissipation fins 71 inside the body (case of the multi-light source treatment device) from the ventilation opening 101 of the case, where it absorbs heat from the heat dissipation fins and turns into hot air, and the hot air enters the space inside the fan case from the ventilation opening on the underside of the fan 60, then flows from the ventilation opening of the case on the side elevation to the ventilation opening (air outlet) provided at the rear end of the case of the multi-light source treatment device, and is discharged to the outside of the body of the multi-light source treatment device, thereby achieving wind-cooled heat dissipation from the heat dissipation component 70 of the semiconductor cooling member.

[0070] In another embodiment, the air outlet of the case of the multi-light source treatment device is provided on the side of the main housing 10, and the ventilation hole (air outlet) 62 on the case on the side elevation of the fan is in airflow communication with the air outlet of the case of the multi-light source treatment device via a guide passage provided in the nozzle holder to exhaust hot air.

[0071] In another embodiment, the fan 60 sucks in or exhausts airflow on one side (lower side). The heat dissipation principle is that the airflow enters from the ventilation port (taken as the intake port) 101 on the case of the multi-light source treatment device by the intake or exhaust action of the fan, passes through the heat dissipation part 70 (heat dissipation fin 71) of the semiconductor cooling member, and then flows into the inside of the fan from the ventilation port 61 provided on the lower side of the fan, then flows into the light source part from the ventilation port (taken as the wind outlet) 62 provided on the side elevation of the fan to dissipate heat from the light source part, and then flows out of the case of the multi-light source treatment device from the wind outlet (the ventilation port 101 provided at the position corresponding to the light source part at the front end of the case is taken as the wind outlet) provided on the case of the multi-light source treatment device, forming an air passage for cooling and dissipating heat from the semiconductor cooling member 80 and the light source part, and the heat dissipation fin 71 and the light source part are successively dissipated.

[0072] In each of the embodiments of the heat dissipation system of the multi-light source treatment device described above, air flows from the ventilation opening (said to be an air intake opening) 101 on the case of the multi-light source treatment device into the heat dissipation component 70 / light source unit of the semiconductor cooling member and the fan 60, and then flows out through the ventilation opening (said to be an air outlet) 101 on the case of the multi-light source treatment device, thereby forming an air passage for heat dissipation, and the heat dissipation component 70 and the light source unit of the semiconductor cooling member are air-cooled and dissipated, and the positional order in which the air flows into the heat dissipation component 70 / light source unit of the semiconductor cooling member and the fan 60 includes, but is not limited to, the positional order in the method of each of the embodiments described above.

[0073] 16 to 18, there are shown a number of embodiments of the heat dissipation part 70 and the fan 60 of the semiconductor cooling member 80 of the multi-light source medical treatment device 1000 according to the above-mentioned embodiments. As shown in FIG. 16, the heat dissipation part 70 includes a heat dissipation fin 71 and a heat transfer member 72, and the heat transfer member 72 has one end (condensation end) connected to the heat dissipation fin 71 in a rapid heat transfer manner and the other end (evaporation end) connected to the hot surface 83 of the semiconductor cooling member 80 in a rapid heat transfer manner, or the hot surface 83 is directly formed by the surface of the heat transfer member (evaporation end) 72, that is, the hot end circuit is provided to be welded and electrically connected to the semiconductor particle layer 82 in order to rapidly transfer the heat of the hot surface to the heat dissipation fin 71 for heat dissipation. The fan 60 may be attached to one side of the heat dissipation fin 71. The heat transfer member 72 may be a heat transfer structure made of a single heat transfer material such as aluminum / copper / graphene, or may be a component that utilizes phase change (evaporation and condensation), such as a superheat transfer tube or superheat transfer plate, such as a heat tube / vapor chamber VC / ALVC (aluminum superheat transfer tube or aluminum superheat transfer plate).

[0074] 17 is provided with only a heat transfer member 72, and does not have a heat dissipation fin 71. One end (evaporation end) of the heat transfer member guide piece 72 is connected to the hot surface 83 of the semiconductor cooling member 80 in a rapid heat transfer manner, or the hot surface 83 is directly formed by the surface of the heat transfer member (evaporation end), that is, the hot end circuit is welded to the semiconductor particle layer 82 and electrically connected. The heat transfer member 72 (condensation end) is connected to or integral with the case of the fan 60, or the heat transfer member 72 (condensation end) is located at the ventilation port of the fan 60.

[0075] As shown in Fig. 18, the heat dissipation component 70 includes a heat dissipation fin 71 and a heat transfer member 72. One end (evaporation end) of the heat transfer member 72 is connected to the hot surface 83 of the semiconductor cooling member 80 in a rapid heat transfer manner, or the hot surface 83 is directly formed by the surface of the heat transfer member (evaporation end), that is, the hot end circuit is welded and electrically connected to the semiconductor particle layer 82, so as to rapidly transfer the heat of the hot surface to the heat dissipation fin 71 for heat dissipation. The other end (condensation end) of the heat transfer member 72 is connected to the heat dissipation fin 71 in a rapid heat transfer manner, and the heat dissipation fin 71 is provided with a hole or groove 710, which is located at the ventilation port of the fan 60 to communicate with the airflow.

[0076] The semiconductor cooling member 80 in each of the above embodiments of the present application may be a built-in or external temperature sensor, and the temperature sensor is connected to the main control board 4 or an independent control circuit board to control the temperature of the cold surface or hot surface. The semiconductor particle layer 82 is formed by alternate p-type and n-type semiconductor particles arranged parallel to each other and electrically connected in series, and the hot surface 83 and the cold surface 81 formed at both ends of the p-type and n-type semiconductor particles are substrates of heat transfer material, which may be a single heat transfer material such as ceramic / aluminum / copper / transparent substrate, or may be a heat transfer structure member such as a heat tube, a vapor chamber, a superheat transfer tube such as ALVC or a superheat transfer plate. The temperature sensor may be an NTC sensor.

[0077] 19 to 27, as some examples, a built-in temperature sensor is used in the semiconductor cooling member 80. The temperature sensor is located in the intermediate semiconductor particle layer 82 and is in close contact with the hot surface 83 / cold surface 81 of the semiconductor cooling member 80 to directly detect the temperature of the cold surface 81 / hot surface 83 of the cooling member.

[0078] In the embodiment shown in Fig. 19, the semiconductor cooling member 80 has a cold surface 81 that provides full cooling, a hot surface 83 that provides full heating, the semiconductor particle is laid or nearly laid on the inner surface of the cold surface 81 and the hot surface 83, the cold surface 81 and the hot surface 83 are conformal, and the semiconductor particle layer 82 and the temperature sensor 85 are located between the cold surface and the hot surface. The temperature sensor 85 is in close contact with the hot surface 83 or the cold surface 81. The positive and negative electrodes 86 of the temperature sensor 85 and the positive and negative electrodes 84 of the semiconductor particle layer 82 extend out of the semiconductor cooling member 80 to be electrically connected to a control unit (provided on the main control board 40 or an independent control circuit board). In Fig. 20, one side of the transparent substrate 12 in each of the above-mentioned embodiments is coupled to the semiconductor cooling member 80, and the entire surface of the cold surface 81 is in close contact with the side surface of the transparent substrate 12 to cool the transparent substrate, which is applicable to the multi-light source treatment device 1000 according to the third embodiment of the present application shown in Figs. 7 to 9. In Fig. 21, each side of the transparent substrate 12 is coupled to a half of the conductive cooling member 80, and the transparent substrate is cooled on both sides. The hot surface 83 of the semiconductor cooling member 80 is connected to the heat dissipation component 70, and heat is dissipated by the heat dissipation component 70.

[0079] In the embodiment shown in Fig. 22, the transparent substrate 12 and the cold surface 81 of the semiconductor cooling member are combined into one, that is, a transparent substrate is used as the cold surface of the semiconductor cooling member 80, and the transparent substrate cold surface is attached to the light exit window at the front end of the case of the multi-light source treatment device to form a light exit port, and the light generated from the multiple light sources 2 acts on the surface of the skin through the transparent substrate cold surface, and the transparent substrate cold surface 12 / 81 can directly contact the skin. In Fig. 22, there is one semiconductor cooling member, and in Fig. 23, there are two semiconductor cooling members, and the transparent substrate is connected to a pair of semiconductor particle layers 82 and hot surfaces 83 on both sides as a common cold surface, and the hot surface 83 is a heat-conducting material substrate. The corresponding surface of the transparent substrate is provided with a cold end circuit (e.g., a conductor) that is welded and electrically connected to the corresponding semiconductor particle layer 82.

[0080] The semiconductor cooling member 80 in the embodiment shown in FIG. 24 includes a semiconductor particle layer 82 in the middle, and hot and cold surfaces 83 and 81 at both ends, and a temperature sensor 85 is built into the semiconductor cooling member 80. In this embodiment, the semiconductor particle layer 82 inside the semiconductor cooling member 80 is arranged as an annular band, and an empty area is formed in the central internal area without p-type and n-type semiconductors. The cold surface 81 / hot surface 83 includes an annular area corresponding to the semiconductor particle layer 82. The central area of ​​the cold surface 81 / hot surface 83 is a through hole, which forms an annular light output area together with the empty area of ​​the semiconductor particle layer 82, and the light generated from the multiple light sources 2 is projected onto the transparent substrate 12 through the light output area. The semiconductor particle layer 82 and the temperature sensor 85 are located between the cold surface and the hot surface. In the examples shown in FIG. 19 and FIG. 24, the temperature sensor 85 is in close contact with the hot surface 83, but it may be in close contact with the cold surface 81. The positive and negative electrodes 86 of the temperature sensor 85 and the positive and negative electrodes 84 of the semiconductor particle layer 82 extend out of the semiconductor cooling member 80 so as to be electrically connected to a control unit (provided on the main control board 40 or an independent control circuit board). In another embodiment, one of the cold surface 81 / hot surface 83 has a through hole formed therein correspondingly, and the other substrate is a transparent substrate (e.g., a transparent substrate), or both the cold surface substrate and the hot surface substrate are transparent substrates (e.g., a transparent substrate). The semiconductor cooling member 80 has a light output region formed therein. The temperature sensor 85 is in close contact with the hot surface 83 or the cold surface 81. The positive and negative electrodes 86 of the temperature sensor 85 and the positive and negative electrodes 84 of the semiconductor particle layer 82 extend out of the semiconductor cooling member 80.

[0081] The working principle of the semiconductor cooling member 80 is that the temperature sensor 85 detects the temperature data of the cold surface 81 or the hot surface 83 and transmits the temperature data to the control unit, and the control unit controls the output of a control signal for the semiconductor cooling member through the analysis of the temperature data and the requirements of a predetermined temperature range, thereby controlling the power supply operation of the semiconductor cooling member 80. Taking advantage of the characteristics of the semiconductor cooling member that it cools when powered in the forward direction and heats when powered in the reverse direction, the semiconductor cooling member 80 is powered in the forward direction or the reverse direction by driving an H-bridge to adjust the working state of the semiconductor cooling member 80, so that the temperature is precisely constant within the desired temperature range. An independent control circuit board may be provided to control the operation of the semiconductor cooling member 80. The number of temperature sensors 85 may be one or more depending on the area and shape of the semiconductor cooling member.

[0082] If the temperature sensor module is external, it can be attached to a conductive member to detect the temperature. For example, the temperature sensor module is attached to the transparent substrate 12, detects temperature information, transmits it to the control unit, and compares it with a predetermined temperature, after which the power supply to the positive and negative poles of the semiconductor cooling member is controlled.

[0083] Figure 25 shows a combination of a transparent substrate 12 and a semiconductor cooling member 80 having a light-emitting region formed inside the annular shape shown in Figure 24. The semiconductor cooling member is in close contact with the back surface of the transparent substrate 12 and cools the entire annular periphery of the transparent substrate, thereby cooling the entire surface of the transparent substrate 12.

[0084] In the embodiment shown in Fig. 26, the transparent substrate 12 and the semiconductor cooling member 80 are integrated into one, that is, a transparent substrate is used as the cold surface of the semiconductor cooling member 80, and the light emitted from the multiple light sources 2 acts on the surface of the skin through the transparent substrate cold surface, and the transparent substrate cold surface 12 / 81 can directly contact the skin. The corresponding surface of the transparent substrate is provided with a cold end circuit (e.g., a conductor) that is welded and electrically connected to the corresponding semiconductor particle layer 82. The semiconductor particle layer 82 and the hot surface 83 are annular, and the hot surface 83 is a heat-conducting material substrate.

[0085] In the embodiment shown in FIG. 27, the transparent substrate 12 and the semiconductor cooling member 80 are integrated into one, that is, a transparent substrate is used for the cold surface of the semiconductor cooling member 80, and the light emitted from the multiple light sources 2 acts on the surface of the skin through the transparent substrate cold surface, and the transparent substrate cold surface 12 / 81 can directly contact the skin. The corresponding surface of the transparent substrate is provided with a cold end circuit (e.g., a conductor) that is welded and electrically connected to the corresponding semiconductor particle layer 82. The semiconductor particle layer 82 and the hot surface 83 are annular, and the surface of a heat dissipation member such as a heat tube, VC, copper block, or ALVC superheat transfer tube or superheat transfer plate can be used as the hot surface 83, and a hot end circuit (conductor) that is welded and electrically connected to the semiconductor particle layer 82 can be formed on the surface.

[0086] The semiconductor cooling member 80 in Figures 24 to 27 is applicable to the multi-light source treatment device 1000 of each embodiment shown in Figures 1 to 6 and Figures 10 to 13, and is used to cool the transparent substrate 12 or is integrated with the transparent substrate 12.

[0087] The treatment device 1000 according to each of the above-described embodiments of the present application has one or more of the following functions in cooperation with each other. 1. Advantages of multiple light sources: Intense pulsed light: The light emission time is short, the peak light energy is high, and the photochemical reaction that occurs in the skin exposed to the light energy is fast, so the skin temperature can be increased instantly. However, the spectral continuity is poor and the near-infrared spectrum is small. Tungsten filament or carbon light source: Its spectrum has good continuity, a wide spectrum (ranging from 300 to 2500 nm), and a large near-infrared spectrum. The advantages of combining two types of light sources are as follows: 1) Mutual complementation of spectra: The number of spectral band values ​​in the same interval increases, and the spectral values ​​of the two are mutually complemented. 2) Complementary advantages: In the same band section, the stable bands of a tungsten light source and / or a carbon light source are used to preheat the skin, thereby increasing the basic temperature of the skin and reducing the loss of light energy from the IPL, while the IPL allows the instantaneous light energy of a strong pulsed light to be applied to the heated skin. This form allows the energy of the IPL light source to be reduced and the light emission speed of the IPL light source to be improved while achieving the same therapeutic effect, thereby reducing the impact caused by the high-energy IPL light source, and achieving faster, gentler, safer and more effective therapeutic objectives. 3) Enhanced scope of treatment for cosmetic and other skin diseases: The 900-2500 nm band of the near-infrared spectrum of the tungsten light source and / or carbon light source resonates with the water molecules inside the skin (the interaction between the near-infrared band and water molecules has already been confirmed by major medical journals / papers / magazines / clinical reports), heating and cooling the underlying skin at the same time, working together with the temperature control means to make the outer skin cool and the inner skin hot, and further adding the instantaneous photochemical thermal energy shock of the IPL light source, achieving a more comfortable experience and better treatment effect. 2. Constant temperature: By controlling the temperature of the semiconductor cooling element 80, during treatment, the treatment surface can be precisely controlled to a specific temperature range through the temperature control technology built into the cooling element according to different bands of treatment power. 3. RF / EMS components: According to photoelectric comprehensive treatment and beauty, RF can accelerate the instantaneous temperature of the dermis layer, and support the combined treatment of the near-infrared band light waves of the tungsten light source and / or carbon light source, effectively improving its efficacy; EMS biocurrent can support the treatment of the dermis layer and muscle fascia layer by the near-infrared rays of the tungsten light source and / or carbon light source.

[0088] 4. Filter 50: Filters can be switched manually or electrically to achieve precise treatment for different skin problems.

[0089] Although the embodiments of the present application have been shown and described, it is understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present application. The scope of protection of the present application is defined by the appended claims and their equivalents. [Explanation of symbols]

[0090] 2 light source 4 Main Control Board 10 Main housing 11 Front housing 12 Transparent substrate 13 Cap holder 14 Partition 15 Rear housing 16 Insertion / removal port 20,20' light source 21 Light reflecting material 30 batteries 40 Main Control Board 41 Power Interface 50 Filters 51 Holder 52 Motor 53 Screw 54 Nut connection member 60 Fans 61,62 Ventilation hole 70 Heat dissipation parts 71 Heat dissipation fin 72 Heat transfer materials 80 Semiconductor cooling materials 81 Cold Surface 82 Semiconductor particle layer 83 Hot Surface 84,86 Positive and negative poles 85 Temperature Sensor 90 electrodes 91 cases 101 Ventilation hole 160 Idemitsu Passage 161 Mirror Cover 1000 Multi-light therapy device

Claims

1. A multi-light source therapy device including a case, a main control board mounted in the case, two light sources electrically connected to the main control board and arranged vertically with a gap therebetween, the two light sources being an IPL light source and a tungsten light source or a carbon light source, a light reflecting member including a first arc-shaped surface surrounding the upper light source of the two light sources and a second arc-shaped surface surrounding the lower light source, a power supply component, a fan mounted on the rear side of the light reflecting member in the case, and a semiconductor cooling member, the semiconductor cooling member including an intermediate semiconductor particle layer and hot and cold surfaces at both ends, and a light exit port is formed on the front end surface of the multi-light source therapy device, The light exit is formed by a transparent substrate mounted in the front end of the case, and the cold surface of the semiconductor cooling member is thermally connected to the transparent substrate for cooling the transparent substrate, or the transparent substrate is directly the cold surface of the semiconductor cooling member; The light generated from the light source passes through a light exit port and acts on the skin to perform cosmetic or therapeutic treatment; a first ventilation port is formed in a lower surface of the case near the light source, the fan includes a case and a rotating blade, and a second ventilation port and a third ventilation port are formed on an upper side and a rear side of the case of the fan, Air enters the case of the multiple light source treatment device from the first ventilation opening, absorbs the heat of the light reflecting member, and turns into hot air. This hot air enters the space in the fan case from the second ventilation opening, and is discharged from the third ventilation opening. In this way, a heat dissipation air passage is formed. A multi-light source treatment device characterized by:

2. The semiconductor cooling member is annular and attached to the back surface of the transparent substrate, and is formed to cool the periphery of the light exit port, and the annular central region of the semiconductor cooling member is a through hole for passing the light generated from the light source, and the front surface of the transparent substrate is in contact with the skin, or one or more semiconductor cooling members are attached to one or more side surfaces of the periphery of the transparent substrate to cool the side surface of the light exit port; The two ends of the semiconductor particle layer are a cold end and a hot end, and when the transparent substrate is used as the cold surface of the semiconductor cooling member, the transparent substrate is provided with one or more cold end circuits, and the one or more cold end circuits are welded and electrically connected to the cold ends of the one or more semiconductor particle layers, and the hot ends of each set of semiconductor particle layers are hot surfaces, and the hot surfaces are provided with hot end circuits welded and electrically connected to the hot ends of the semiconductor particle layers, and when the cold end circuit is electrically connected to the cold ends of the semiconductor particle layers and the hot end circuit is electrically connected to the hot ends of the semiconductor particle layers, an internal circuit of the semiconductor cooling member is formed, and the internal circuit is electrically connected to a control unit via positive and negative poles, and when the circuit is conductive, a temperature difference is formed between the cold surface and the hot surface of the transparent substrate.

3. The multi-light source treatment device of claim 2, characterized in that the semiconductor cooling member has a built-in temperature sensor, which is located in the middle semiconductor particle layer and is in close contact with the hot surface or cold surface to directly detect the temperature of the cold surface or hot surface, and the positive and negative electrodes of the temperature sensor and the positive and negative electrodes of the semiconductor particle layer extend outside the semiconductor cooling member to be electrically connected to a control unit, and the control unit is provided on the main control board or an independent control board to control the temperature of the cold surface or hot surface to be constant within a predetermined temperature range.

4. The hot surface of the semiconductor cooling member is one or a combination of a heat pipe, a vapor chamber, or a heat transfer substrate made of a single heat transfer material; The hot surface of the semiconductor cooling member is connected to a heat dissipation component, The heat dissipation part includes one or more combinations of a heat pipe, a vapor chamber, a heat transfer structure of a single heat transfer material, or a heat dissipation fin; The multi-light source treatment device according to claim 1, characterized in that the light reflecting member is provided with a heat dissipation member, and the heat dissipation member is one or a combination of a heat dissipation fin, a heat tube, a vapor chamber, or a heat transfer element made of a single heat transfer material.

5. A filter is installed between the light source and the light exit port, and the light generated from the light source is projected to the light exit port after being filtered by the filter; The multi-light source treatment device according to claim 1 , wherein the filter includes a transparent base sheet and a coating layer on the transparent base sheet.

6. The multi-light source treatment device according to claim 5, characterized in that the multi-light source treatment device is provided with a plurality of filters or a filter having a plurality of sections, and the plurality of filters or the plurality of sections transmit light of different bands.

7. The multi-light source treatment device of claim 6, characterized in that the case of the treatment device has an insertion / removal port located between the light source and the light emission port, and a filter is inserted or removed through the insertion / removal port, thereby enabling switching between multiple filters.

8. The multi-light source treatment device according to claim 6, characterized in that a motor, a screw and a nut connecting member are mounted inside the case of the treatment device, the output shaft of the motor is axially connected to the screw to rotate synchronously, the screw and the nut connecting member are screwed together, and the nut connecting member is connected to a filter.

9. The multi-light source treatment device includes an RF component or an EMS component, and the RF component or EMS component includes one or more pairs of RF electrodes or EMS electrodes, and the one or more pairs of RF electrodes or EMS electrodes are attached to the transparent substrate, or attached to the front end surface of the case of the multi-light source treatment device, or connected to the front end of the multi-light source treatment device via an RF accessory head or an EMS accessory head, and the RF electrodes or EMS electrodes are electrically connected to a main control board or an independent control board, and the main control board or the independent control board controls the RF electrodes or EMS electrodes to generate an RF current or EMS current that acts on the skin. The multi-light source treatment device according to any one of claims 1 to 8.

10. The power supply component includes a battery and / or an electrical interface; The multi-light source treatment device according to any one of claims 1 to 8, characterized in that the power interface is electrically connected to a main control board, and the case is provided with a through hole.

11. The tungsten or carbon light source includes a transparent lampshade and a luminescent material mounted in the transparent lampshade, and the transparent lampshade is evacuated or filled with an inert gas or a halogen gas; The luminous material of the tungsten light source is a tungsten filament, and the luminous material of the carbon light source is a carbon filament; 9. The multi-light source treatment device according to claim 1, wherein the tungsten light source or the carbon light source generates full spectrum light.

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