IMPRINT DEVICE, IMPRINT METHOD, ARTICLE MANUFACTURING METHOD, DETERMINATION METHOD, AND PROGRAM

Abstract

To provide an imprint technique advantageous in achieving both of improvement of uniformity of a residual layer thickness and reduction of extrusion of an imprint material.SOLUTION: An imprint apparatus that forms a pattern of an imprint material on a substrate using a mold, includes: a supplier configured to supply the imprint material as a plurality of droplets onto the substrate; and a controller configured to control the supplier on the basis of information indicating a target arrangement of the imprint material to be supplied as the plurality of droplets onto a predetermined region of the substrate. The plurality of droplets in the target arrangement includes: a first droplet group including a plurality of first droplet arrays, each of the plurality of first droplet arrays consisting of droplets arrayed at a first pitch in a first direction along a side of the predetermined region, the plurality of first droplet arrays being arranged at a second pitch in a second direction different from the first direction; a second droplet group including a plurality of second droplet arrays, each of the plurality of second droplet arrays consisting of droplets arrayed at the first pitch in the first direction, the plurality of second droplet arrays being arranged at the second pitch in the second direction; and a third droplet array consisting of droplets arrayed at the first pitch in the first direction.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to an imprint apparatus, an imprint method, an article manufacturing method, a determination method, and a program. [Background technology]

[0002] One known lithography technique for manufacturing semiconductor devices and the like is the imprinting technique, which uses a mold to form a pattern of an imprinting material on a substrate. In the imprinting technique, the imprinting material is supplied as multiple droplets onto a shot area of ​​the substrate, the mold is brought into contact with the imprinting material on the substrate, the imprinting material is cured in this state, and the mold is peeled off from the cured imprinting material. By this type of process (imprinting process), a pattern made of the cured imprinting material can be formed on the shot area of ​​the substrate.

[0003] In imprint technology, it is desirable that the residual film thickness of the imprint material pattern formed on a substrate using a mold is uniform. The residual film thickness refers to the thickness of the imprint material between the substrate and the concave portions of the concave-convex pattern formed of the imprint material. Patent Document 1 describes a method for determining the arrangement of the imprint material (droplets) at the boundaries between a plurality of portions with different pattern configurations in an imprint process using a mold having the plurality of portions so that the residual film thickness is uniform. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 6700844 Summary of the Invention [Problem to be solved by the invention]

[0005] In imprint technology, in addition to improving the uniformity of the residual film thickness, it is desirable to reduce the overflow (seepage) of the imprint material from the shot area. One method for reducing such overflow of the imprint material is to reduce the number of droplets of the imprint material disposed on the outer periphery of the shot area. However, this method may result in the residual film thickness in the outer periphery being thinner than other parts, which may be disadvantageous in terms of the uniformity of the residual film thickness.

[0006] Therefore, an object of the present invention is to provide an imprinting technique that is advantageous for achieving both improved uniformity in the residual film thickness and reduced overflow of the imprinting material. [Means for solving the problem]

[0007] In order to achieve the above object, an imprint apparatus according to one aspect of the present invention comprises: basis Imprint material on the plate and a contacting step of contacting the imprint material supplied onto the substrate in the supplying step with a mold. An imprint apparatus for forming a pattern, comprising: a supply unit that supplies the imprint material onto the substrate as droplets; and a control unit that controls the supply unit based on information indicating a target arrangement of the imprint material to be supplied as a plurality of droplets onto a predetermined region of the substrate, wherein the plurality of droplets in the target arrangement include a first droplet group including a first droplet row in which droplets are arranged at a first pitch in a first direction along a side of the predetermined region, the first droplet group including a plurality of first droplet rows in which droplets are arranged at a second pitch in a second direction different from the first direction, and a second droplet row in which droplets are arranged at the first pitch in the first direction, the second droplet group including a plurality of first droplet rows in which droplets are arranged at the first pitch in the first direction, the second droplet group including a plurality of second ... a second droplet group including a plurality of droplets arranged at the second pitch, and a third droplet row in which droplets are arranged at the first pitch in the first direction, the second droplet group being shifted from the first droplet group by a first distance in the first direction that is smaller than the first pitch and a second distance in the second direction that is half the second pitch, the third droplet row being shifted by the first distance in the first direction from a specific droplet row that is the first droplet row of the first droplet group that is closest to the side, and the distance between the specific droplet row and the third droplet row in the second direction is smaller than the second distance. and when, in the contacting step, a priority is given to reducing the arrival time of the imprint material at the side over reducing the overflow of the imprint material from the predetermined region, the control unit arranges the third droplet string at a position closer to the side in the second direction than the specific droplet string, and when, in the contacting step, a priority is given to reducing the overflow over the arrival time, the control unit arranges the third droplet string at a position farther from the side in the second direction than the specific droplet string. , characterized in that

[0008] Further objects and other aspects of the present invention will become apparent from the following description of preferred embodiments with reference to the accompanying drawings. Effect of the Invention

[0009] According to the present invention, for example, it is possible to provide an imprinting technique that is advantageous for achieving both improved uniformity in the residual film thickness and reduced overflow of the imprinting material. [Brief description of the drawings]

[0010] [Figure 1] 1 is a schematic diagram illustrating an example of the configuration of an imprint apparatus; [Diagram 2] FIG. 1 is a diagram showing an example of the arrangement of an imprint material (plural droplets) in the first embodiment; [Diagram 3] FIG. 1 is a diagram showing an example of the arrangement of an imprint material (plural droplets) in the first embodiment; [Figure 4] 1 is a flow chart illustrating a method for determining a target placement of imprint material (multiple droplets). [Diagram 5] FIG. 13 is a diagram showing an example of arrangement of an imprint material (plural droplets) in the second embodiment; [Figure 6] FIG. 1 is a diagram for explaining a method for manufacturing an article. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, the embodiments will be described in detail with reference to the attached drawings. Note that the following embodiments do not limit the invention according to the claims. Although the embodiments describe a number of features, not all of these features are essential to the invention, and the features may be combined in any manner. Furthermore, in the attached drawings, the same reference numbers are used for the same or similar configurations, and duplicated descriptions are omitted.

[0012] First Embodiment An imprinting apparatus 10 according to a first embodiment of the present invention will be described. The imprinting apparatus 10 is an apparatus that brings an imprinting material supplied onto a substrate into contact with a mold and applies energy for hardening to the imprinting material, thereby forming a pattern of a cured material to which a concave-convex pattern of the mold has been transferred. For example, the imprinting apparatus 10 supplies liquid imprinting material onto a substrate as a plurality of droplets, and hardens the imprinting material in a state in which a mold (mold) on which a concave-convex pattern has been formed is brought into contact with the imprinting material on the substrate. Then, the distance between the mold and the substrate is widened, and the mold is peeled off (released) from the hardened imprinting material, thereby transferring the pattern of the mold to the imprinting material on the substrate. This series of processes is called an "imprinting process" and is performed for each of a plurality of shot areas on the substrate.

[0013] The imprint material uses a curable composition (sometimes called an uncured resin) that is cured by applying energy for curing. The energy for curing may be electromagnetic waves, heat, or the like. The electromagnetic waves may be, for example, infrared rays, visible light, ultraviolet rays, or other light having a wavelength selected from the range of 10 nm to 1 mm.

[0014] The curable composition is a composition that is cured by irradiation with light or by heating. Among them, the photocurable composition that is cured by light contains at least a polymerizable compound and a photopolymerization initiator, and may contain a non-polymerizable compound or a solvent as necessary. The non-polymerizable compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal mold release agent, a surfactant, an antioxidant, a polymer component, and the like.

[0015] The imprint material is applied to the substrate in the form of a film by a spin coater or a slit coater. Alternatively, the imprint material may be applied to the substrate in the form of droplets, or in the form of islands or a film formed by connecting a plurality of droplets, by a liquid ejection head. The viscosity of the imprint material (at 25°C) is, for example, 1 mPa·s or more and 100 mPa·s or less.

[0016] FIG. 1 is a schematic diagram showing an example of the configuration of an imprinting apparatus 10 of this embodiment. The imprinting apparatus 10 of this embodiment may include, for example, an imprinting head 12 that holds a mold 11, a curing unit 13, a stage 15 that holds a substrate 14, a supply unit 17, and a control unit 18. The control unit 18 is configured by, for example, a computer having a CPU and a memory, and controls each unit of the imprinting apparatus 10 to execute the imprinting process. Note that the imprinting apparatus 10 of this embodiment employs a photocuring method in which the imprinting material is cured by irradiating the imprinting material with light. In the following, directions perpendicular to each other in a plane parallel to the surface of the substrate 14 are defined as the X-axis direction and the Y-axis direction, and a direction perpendicular to the X-axis direction and the Y-axis direction is defined as the Z-axis direction. In the following description, when the term "X-axis direction" is used, it may be defined as including the +X direction and the -X direction. The same applies to the "Y-axis direction" and the "Z-axis direction".

[0017] The mold 11 is usually made of a material that can transmit ultraviolet light, such as quartz, and a pattern of projections and recesses to be transferred to the imprint material R on the substrate is formed in a portion of the region 11a (mesa region) protruding toward the substrate on the surface on the substrate side. Hereinafter, the portion of the region 11a (mesa region) may be referred to as a pattern region 11a. In addition, glass, ceramics, metal, semiconductor, resin, etc. are used as the substrate 14, and a member made of a material different from the substrate may be formed on the surface as necessary. Specific examples of the substrate 14 include silicon wafers, compound semiconductor wafers, and quartz glass. In addition, before applying the imprint material, an adhesion layer may be provided as necessary to improve adhesion between the imprint material and the substrate.

[0018] The imprint head 12 holds (fixes) the mold 11 by vacuum suction force or electrostatic force. The imprint head 12 includes a drive mechanism that drives (moves) the mold 11 in the Z-axis direction. The imprint head 12 has a function of imprinting (bringing the mold 11 into contact with) the uncured imprint material 16 supplied on the substrate, and a function of separating the mold 11 from the cured imprint material 16 on the substrate.

[0019] The stage 15 includes a substrate chuck that holds the substrate 14, and a drive mechanism for aligning the mold 11 and the substrate 14. The drive mechanism is composed of, for example, a coarse movement drive system and a fine movement drive system, and drives (moves) the substrate 14 in the X-axis direction and the Y-axis direction. The drive mechanism may also have a function for driving the substrate 14 not only in the X-axis direction and the Y-axis direction, but also in the Z-axis direction and the θ direction (rotation direction around the Z axis) and a tilt function for correcting the inclination of the substrate 14.

[0020] The curing unit 13 (irradiation unit) irradiates light (e.g., ultraviolet light) to the imprint material 16 on the substrate through the mold 11 while the mold 11 and the imprint material 16 on the substrate are in contact with each other, thereby curing the imprint material 16. In the case of this embodiment, the curing unit 13 includes, for example, a halogen lamp or an LED, and irradiates ultraviolet light to the imprint material 16 on the substrate through the mold 11, thereby curing the imprint material 16.

[0021] The supply unit 17 (discharge unit, dispenser) supplies the imprint material 16 (e.g., uncured resin) as a plurality of droplets onto the substrate 14. The supply unit 17 includes a plurality of discharge holes (nozzles) that discharge droplets of the imprint material 16 onto the substrate 14, and discharges droplets of the imprint material 16 from each discharge hole while the substrate 14 and the supply unit 17 are moving relative to each other. This allows the imprint material 16 to be supplied onto the substrate as a plurality of droplets.

[0022] For example, when a plurality of ejection holes are arranged along the Y-axis direction, the step of supplying droplets of the imprint material 16 from each ejection hole onto the substrate is performed while the substrate is moved in a direction (for example, the X-axis direction) different from the arrangement direction of the plurality of ejection holes. At this time, the ejection of droplets from each ejection hole (i.e., the ejection timing) is controlled by the control unit 18 based on information (hereinafter, sometimes referred to as the arrangement information) indicating the target arrangement of the plurality of droplets of the imprint material 16 on the substrate (on the shot region). That is, the interval in the Y-axis direction of the plurality of droplets of the imprint material 16 supplied onto the substrate is determined by the interval of the plurality of ejection holes provided in the supply unit 17, and the interval in the X-axis direction can be determined by the ejection timing of the droplets from each ejection hole. Here, the arrangement information is generated in advance by the control unit 18 and / or an external computer based on, for example, design information of the concave-convex pattern formed in the pattern region 11a of the mold 11. The amount of each droplet of the imprint material 16 ejected from each ejection hole of the supply unit 17 is subpicoliters to several picoliters. One drop of imprint material 16 is dispensed onto the substrate by one dispensing action from each nozzle.

[0023] In the imprinting apparatus 10, it is required to improve the uniformity of the residual film thickness and reduce overflow (seepage) of the imprinting material 16 at the same time. The residual film thickness is the thickness of the imprinting material 16 between the concaves of the concave-convex pattern of the imprinting material 16 formed on the substrate 14 by the imprinting process and the substrate 14. If the residual film thickness of the concave-convex pattern of the imprinting material 16 formed on the substrate is non-uniform, for example, it may be difficult to accurately control the subsequent etching process performed using the concave-convex pattern of the imprinting material 16 as a mask. In addition, overflow of the imprinting material 16 refers to the overflow of the imprinting material 16 supplied onto a predetermined region of the substrate 14 (on a shot region in this embodiment) from the predetermined region during a contact process (imprinting process) between the imprinting material 16 and the mold 11. If overflow of the imprinting material 16 occurs, for example, it may be difficult to accurately perform imprinting on an adjacent shot region due to the influence of the overflow.

[0024] In a conventional method in which multiple droplets of the imprint material 16 are arranged in a staggered pattern so that the residual film thickness within the shot region is uniform, overflow of the imprint material 16 occurs. Furthermore, in a conventional method in which the number of droplets of the imprint material 16 arranged on the outer periphery of the shot region (predetermined region) is reduced in order to reduce overflow of the imprint material 16, the residual film thickness on the outer periphery becomes thinner than other parts, and the residual film thickness may become non-uniform. Therefore, in this embodiment, an arrangement of the imprint material 16 (multiple droplets) that can achieve both improved uniformity of the residual film thickness and reduced overflow of the imprint material 16 will be described.

[0025] FIG. 2 shows an example of the arrangement of the imprint material 16 (plurality of droplets 1) according to the present embodiment. The example of the arrangement shown in FIG. 2 may be understood as an example of a target arrangement of the plurality of droplets 1 of the imprint material 16 to be supplied to the shot region 2 (predetermined region). In the example of the arrangement of the imprint material 16 according to the present embodiment, the plurality of droplets 1 of the imprint material 16 are arranged in a staggered pattern inside the shot region 2, and the arrangement of the droplets in the outer periphery of the shot region 2 is changed (corrected, modified). FIG. 2(a) shows an example of the arrangement of the plurality of droplets 1 in the entire shot region 2, and FIG. 2(b) shows an example of the arrangement of the droplets 1 in the outer periphery of the shot region 2 (an enlarged view of a partial region α in FIG. 2(a)). Note that FIG. 2(a) does not show the change in the arrangement of the droplets 1 in the outer periphery of the shot region 2.

[0026] The multiple droplets 1 in the arrangement example of this embodiment include a first droplet group including a plurality of first droplets 1a and a second droplet group including a plurality of second droplets 1b, and the multiple first droplets 1a and the multiple second droplets 1b are arranged in a staggered pattern.

[0027] The first droplet group is arranged at a first pitch P in a first direction (Y-axis direction) along a side 2a (outer periphery) of the shot area 2 (predetermined area). Y The first droplet row in which the first droplets 1a are arranged is arranged at a second pitch P in a second direction (X-axis direction) different from the first direction. XIn FIG. 2(b), only the first droplet trains A1 to A2 are shown among the multiple first droplet trains, but the first droplet trains having the same configuration as the first droplet trains A1 to A2 are arranged at the second pitch P X It may be understood that the first droplet rows are repeatedly arranged in the +X direction. Furthermore, among the multiple first droplet rows, the first droplet row A1 (hereinafter, may be referred to as a specific droplet row) that is closest to the side 2a of the shot area 2 is arranged so as to be spaced a predetermined distance from the side 2a. The predetermined distance is the second pitch P X The pitch can be set within a range of 1 / 2 to 1 time, but is preferably set to 3 / 4 times the second pitch PX.

[0028] On the other hand, the second droplet group has a first pitch P Y The second droplet row in which the second droplets 1b are arranged is arranged at a second pitch P X In FIG. 2(b), only the second droplet trains B1 to B2 are shown among the multiple second droplet trains, but a second droplet train having the same configuration as the second droplet trains B1 to B2 is arranged at a second pitch P X It may be understood that the second droplet groups (second droplet array B1-B2) are repeatedly arranged in the +X direction. Also, the second droplet groups (second droplet array B1-B2) are arranged offset from the first droplet groups (first droplet array A1-A2) by a first distance in the first direction (Y axis direction (-Y direction)) and a second distance in the second direction (X axis direction (+X direction)). The first distance is a first pitch P Y Although any smaller distance is acceptable, in this embodiment, the first pitch P Y Half the distance (P Y The second distance is the second pitch P X Half the distance (P X / 2). By configuring the first droplet group and the second droplet group in this manner, a plurality of first droplets 1a and a plurality of second droplets 1b can be arranged in a staggered pattern.

[0029] In addition, the droplets 1 in the arrangement example of this embodiment are arranged at a first pitch P in the first direction (Y-axis direction) as shown in FIG. YThe third droplet array C further includes a third droplet array C in which third droplets 1c are arranged at the same positions as the second droplet array B1-B2 (second droplets 1b) in the first direction (Y-axis direction), and may be understood as a part of the second droplet group described above. In other words, the third droplet array C may be understood as the second droplet array that should be arranged on the outer periphery of the shot area 2 in order to set the remaining film thickness on the outer periphery of the shot area 2 to the target thickness, shifted toward the inside of the shot area 2 (+X direction).

[0030] The third droplet array C is arranged to be shifted (offset) by a first distance in the first direction (Y-axis direction) with respect to the first droplet array A1 (specific droplet array) that is closest to the side 2a of the shot area 2 among the first droplet groups (plurality of first droplet arrays). In this embodiment, the first distance is a first pitch P Y Half the distance (P Y The third droplet column C has a second distance (P X That is, the third droplet train C is arranged so that the distance between the first droplet train A1 and the first droplet train A2 is smaller than the distance between the first droplet train A1 and the second droplet train A2 in the second direction (X-axis direction). X +X direction side from position / 2 and +P X The third droplet train C can be arranged inside a range β on the −X direction side from the position of 1 / 2. X The electrodes may be spaced apart by a distance equal to ¼ of the distance between the electrodes.

[0031] Here, in FIG. 2(b), the third droplet array C is disposed at the same position as the first droplet array A1 (specific droplet array) in the second direction (X-axis direction), but as shown in FIG. 3(a), it may be disposed at a position closer to side 2a than the first droplet array A1 in the second direction (X-axis direction). As described above, the third droplet array C is obtained by shifting the second droplet array to be disposed on the outer periphery of the shot area 2 toward the inside of the shot area 2 (+X direction) so that the amount of imprint material (amount of droplets) required to make the remaining film thickness on the outer periphery of the shot area 2 the target thickness is ensured. In order to reduce the overflow of the imprint material from the shot area 2 (side 2a), the position of the first droplet array A1 in the second direction (X-axis direction) is used as a reference, and the amount of imprint material (amount of droplets) required to make the remaining film thickness on the outer periphery of the shot area 2 the target thickness is ensured. X It is advisable to place the third droplet row C on the +X side of the position / 2.

[0032] 3(b), the third droplet array C may be disposed at a position farther from side 2a in the second direction (X-axis direction) than the first droplet array A1. In this case, the overflow of the imprint material from the shot area 2 (side 2a) can be further reduced, but the time it takes for the imprint material to reach side 2a increases, which may reduce productivity (throughput). Therefore, in consideration of compatibility with productivity, it is preferable to use the position of the first droplet array A1 in the second direction (X-axis direction) as a reference and place +P X It is advisable to place the third droplet row C on the -X direction side of the position / 2.

[0033] Next, a method for determining a target arrangement of multiple droplets 1 of imprint material 16 to be supplied to a shot area 2 (predetermined area) in imprint processing will be described. Fig. 4 is a flowchart showing a method for determining a target arrangement of imprint material 16 (multiple droplets 1). Below, an example will be described in which the flowchart (determination method) in Fig. 4 is performed by the control unit 18 of the imprint apparatus 10, but it may also be performed by an external computer outside the imprint apparatus 10.

[0034] In step S11, the control unit 18 acquires various conditions (imprint conditions) for the imprint process. Examples of the imprint conditions include the configuration of the concave-convex pattern formed in the pattern region 11a of the mold 11, the depth of the concaves in the concave-convex pattern, and the remaining film thickness of the pattern of the imprint material 16 to be formed on the shot region 2 of the substrate 14. Next, in step S12, the control unit 18 determines a tentative arrangement of the multiple droplets 1 to be arranged on the shot region 2 based on the imprint conditions acquired in step S11. For example, the control unit 18 assumes (sets) that the multiple droplets 1 are arranged in a houndstooth pattern on the shot region 2, and determines the first pitch P Y and the second pitch P X The tentative arrangement can be determined by determining based on the imprint conditions.

[0035] In step S13, the control unit 18 determines the droplet row closest to the side 2a of the shot area 2 in the temporary arrangement determined in step S12 as the third droplet row C. Next, in step S14, the control unit 18 changes the position of the third droplet row C within the range β described above. For example, the control unit 18 can determine the position of the third droplet row C depending on whether a priority is given to reducing overflow of the imprint material or to productivity. As an example, when productivity has a higher priority than reducing overflow of the imprint material, the control unit 18 can arrange the third droplet row C outside the shot area 2 relative to the first droplet row A1 (specific droplet row) depending on the priority (the higher the priority), as shown in FIG. 3(a). On the other hand, when reducing overflow of the imprint material is given a higher priority than productivity, the control unit 18 may position the third droplet array C further inside the shot area 2 than the first droplet array A1 (specific droplet array) according to the priority (the higher the priority), as shown in Figure 3(b).

[0036] In step S15, the control unit 18 determines, as a target arrangement, the arrangement of the plurality of droplets 1 obtained by changing the position of the third droplet train C in step S14. As a result, as described above, an arrangement including the first droplet group having a plurality of first droplet trains (a plurality of first droplets 1a), the second droplet group having a plurality of second droplet trains (a plurality of second droplets 1b), and the third droplet train C (a plurality of third droplets 1c) can be determined as the target arrangement.

[0037] As described above, according to this embodiment, it is possible to obtain a target arrangement of the imprint material 16 (plurality of droplets) that enables both improved uniformity in the residual film thickness and reduced overflow of the imprint material 16 to be achieved. In the imprint processing of the shot area 2, the imprint apparatus 10 supplies the imprint material 16 onto the shot area 2 according to the target arrangement, thereby enabling both improved uniformity in the residual film thickness and reduced overflow of the imprint material 16 to be achieved. In other words, it is possible to form a pattern of the imprint material on the substrate 14 (on the shot area 2) with high accuracy.

[0038] <Second embodiment> A second embodiment of the present invention will be described. In the above first embodiment, the shot area 2 of the substrate 14 is the predetermined area to which the imprint material 16 is to be supplied as a plurality of droplets 1, but the present invention is not limited to this, and a partial area included in the shot area 2 may be the predetermined area. This embodiment basically follows on from the first embodiment, and is the same as that described in the first embodiment, except for the configuration and processing described below.

[0039] FIG. 5(a) shows the layout of a plurality of shot regions 2 on the substrate 14, and FIG. 5(b) shows the target arrangement of the imprint material 16 supplied as a plurality of droplets 1 on each shot region. The pattern region 11a of the mold 11 has, for example, lines and spaces, holes, pillars, and other patterns with depths formed therein, and the pattern configuration (tendency) may differ for each partial region in the pattern region 11a. In this case, the target arrangement of the imprint material 16 may be changed for each partial region. In the example shown in FIG. 5(b), the pattern configurations of the partial region 8 and other regions are different from each other, and accordingly, the target arrangements of the imprint material 16 are also different from each other. In this case, at the boundary portion including the boundary between the partial region 8 and other regions (i.e., the side of the partial region 8), the uniformity of the remaining film thickness is likely to decrease and / or the imprint material is likely to overflow. Therefore, for the target arrangement of the imprint material in the partial region 8, it is advisable to change (correct, modify) the position of the third droplet array C as described in the first embodiment. In this embodiment, the sides of the partial region 8 (the boundaries with other regions) can correspond to the sides of the shot region 2 in the first embodiment.

[0040] In this manner, in this embodiment, the method described in the first embodiment is applied not only to the outer periphery of the shot region 2, but also to the boundary portion of the partial region 8 inside the shot region 2. This makes it possible to simultaneously improve the uniformity of the residual film thickness and reduce overflow of the imprint material, even at the boundary portion (side) of the partial region 8. Therefore, it becomes possible to form the pattern of the imprint material with high precision over the entire shot region 2.

[0041] <Embodiments of the method for manufacturing an article> The method for manufacturing an article according to an embodiment of the present invention is suitable for manufacturing an article such as a microdevice such as a semiconductor device or an element having a fine structure. The method for manufacturing an article according to this embodiment includes a step of forming a pattern on an imprint material supplied (applied) to a substrate using the above-mentioned imprinting apparatus (imprinting method), and a step of processing the substrate on which the pattern has been formed in this step. Furthermore, this manufacturing method includes other well-known steps (oxidation, film formation, deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The method for manufacturing an article according to this embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article compared to conventional methods.

[0042] The pattern of the cured product formed using the imprinting apparatus is used permanently on at least a part of various articles, or temporarily when manufacturing various articles. The articles include electric circuit elements, optical elements, MEMS, recording elements, sensors, molds, etc. Examples of electric circuit elements include volatile or non-volatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensors, and FPGAs. Examples of molds include molds for imprinting.

[0043] The pattern of the cured product is used as it is as at least a part of a component of the article, or is used temporarily as a resist mask, which is removed after etching or ion implantation in a substrate processing step.

[0044] Next, a specific method for manufacturing the article will be described. As shown in Fig. 6(a), a substrate 1z such as a silicon wafer is prepared on the surface of which a workpiece 2z such as an insulator is formed, and then an imprint material 3z is applied to the surface of the workpiece 2z by an inkjet method or the like. Here, a state in which multiple droplets of the imprint material 3z are applied onto the substrate is shown.

[0045] As shown in Fig. 6(b), the imprinting mold 4z is placed so that the side on which the concave-convex pattern is formed faces the imprinting material 3z on the substrate. As shown in Fig. 6(c), the substrate 1z to which the imprinting material 3z has been applied is brought into contact with the mold 4z, and pressure is applied. The imprinting material 3z fills the gap between the mold 4z and the workpiece 2z. When light is irradiated through the mold 4z in this state as energy for curing, the imprinting material 3z is cured.

[0046] 6(d), after the imprint material 3z is cured, the mold 4z and the substrate 1z are separated, and a pattern of the cured product of the imprint material 3z is formed on the substrate 1z. In this cured product pattern, the recesses of the mold correspond to the protrusions of the cured product, and the protrusions of the mold correspond to the recesses of the cured product, i.e., the recessed and protruding pattern of the mold 4z is transferred to the imprint material 3z.

[0047] As shown in Fig. 6(e), when etching is performed using the pattern of the cured material as an etching-resistant mask, the portion of the surface of the workpiece 2z where there is no cured material or where only a thin layer remains is removed, forming a groove 5z. As shown in Fig. 6(f), when the pattern of the cured material is removed, an article having grooves 5z formed on the surface of the workpiece 2z can be obtained. Here, the pattern of the cured material is removed, but it may be used as an interlayer insulating film included in a semiconductor element or the like, that is, a component of an article, without being removed after processing.

[0048] <Other Examples> The present invention can also be realized by a process in which a program for implementing one or more of the functions of the above-described embodiments is supplied to a system or device via a network or a storage medium, and one or more processors in a computer of the system or device read and execute the program. The present invention can also be realized by a circuit (e.g., ASIC) that implements one or more of the functions.

[0049] The invention is not limited to the above-described embodiments, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0050] 10: imprint device, 11: mold, 12: imprint head, 13: curing unit, 14: substrate, 15: stage, 16: imprint material, 17: supply unit, 18: control unit

Claims

1. An imprinting apparatus that forms a pattern in the imprinting material on the substrate through a supplying step of supplying an imprinting material onto a substrate, and a contacting step of bringing the imprinting material supplied onto the substrate in the supplying step into contact with a mold, comprising: a supply unit that supplies the imprint material onto the substrate as droplets; a control unit that controls the supply unit based on information indicating a target arrangement of the imprint material to be supplied as a plurality of droplets onto a predetermined area of ​​the substrate; Equipped with The plurality of droplets in the target arrangement include: a first droplet group including a plurality of first droplet rows, each of which has droplets arranged at a first pitch in a first direction along a side of the predetermined region, and a second pitch in a second direction different from the first direction; a second droplet group including a plurality of second droplet rows, each of which has droplets arranged at the first pitch in the first direction, at the second pitch in the second direction; a third droplet row in which droplets are arranged at the first pitch in the first direction, the second droplet group is offset from the first droplet group by a first distance in the first direction that is less than the first pitch and a second distance in the second direction that is half the second pitch; the third droplet row is arranged to be shifted by the first distance in the first direction with respect to a specific droplet row, which is the first droplet row of the first droplet group that is closest to the side, and a distance between the specific droplet row and the third droplet row in the second direction is smaller than the second distance; The control unit is in the contact step, when reducing the time it takes for the imprint material to reach the side is given priority over reducing the overflow of the imprint material from the predetermined region, the third droplet array is disposed at a position closer to the side in the second direction than the specific droplet array; In the contacting step, when reducing the overflow is prioritized over reducing the arrival time, the third droplet string is disposed at a position farther from the side in the second direction than the specific droplet string.

1. An imprint apparatus comprising:

2. The control unit: the third droplet train is disposed outside the predetermined region in the second direction relative to the specific droplet train, when the priority of reducing the arrival time is higher than the priority of reducing the protrusion; the third droplet train is disposed closer to the inside of the predetermined region than the specific droplet train in the second direction as the priority of reducing the protrusion is higher than the priority of reducing the arrival time. The imprint apparatus according to claim 1 .

3. the specific droplet row is arranged so as to be spaced a predetermined distance from the side in the second direction; 3. The imprint apparatus according to claim 1, wherein the predetermined distance is within a range of 1 / 2 to 1 time the second pitch.

4. 4. The imprint apparatus according to claim 1, wherein the specific droplet row is arranged so as to be spaced from the side by a distance of 3 / 4 of the second pitch.

5. 5. The imprint apparatus according to claim 3, wherein the third droplet row is arranged so as to be spaced apart from the side by a distance of at least 1 / 4 of the second pitch.

6. 6. The imprint apparatus according to claim 1, wherein the first distance is half the first pitch.

7. The imprint apparatus according to claim 1 , wherein the second direction is perpendicular to the first direction.

8. A forming step of forming a pattern on a substrate by using the imprint apparatus according to any one of claims 1 to 7; A processing step of processing the substrate on which the pattern is formed in the forming step, A method for manufacturing an article, comprising manufacturing an article from the substrate processed in the processing step.

9. 1. A method of imprinting using a mold to form a pattern of an imprint material on a substrate, comprising: a supplying step of supplying the imprint material onto the substrate based on information indicating a target arrangement of the imprint material to be supplied as a plurality of droplets onto a predetermined area of ​​the substrate; a contacting step of contacting the imprint material supplied onto the substrate in the supplying step with the mold; Including, The plurality of droplets in the target arrangement include: a first droplet group including a plurality of first droplet rows, each of which has droplets arranged at a first pitch in a first direction along a side of the predetermined region, and a second pitch in a second direction different from the first direction; a second droplet group including a plurality of second droplet rows, each of which has droplets arranged at the first pitch in the first direction, at the second pitch in the second direction; a third droplet row in which droplets are arranged at the first pitch in the first direction, the second droplet group is offset from the first droplet group by a first distance in the first direction that is less than the first pitch and a second distance in the second direction that is half the second pitch; the third droplet row is arranged to be shifted by the first distance in the first direction with respect to a specific droplet row, which is the first droplet row of the first droplet group that is closest to the side, and a distance between the specific droplet row and the third droplet row in the second direction is smaller than the second distance; in the contact step, when reducing the arrival time of the imprint material at the side is given priority over reducing the overflow of the imprint material from the predetermined region, the third droplet string is disposed at a position closer to the side in the second direction than the specific droplet string, In the contacting step, when reducing the overflow is prioritized over reducing the arrival time, the third droplet train is disposed at a position farther from the side in the second direction than the specific droplet train.

1. An imprint method comprising:

10. A method for determining a target arrangement of imprint material to be supplied as a plurality of droplets onto a predetermined area of ​​a substrate in order to form a pattern in the imprint material on the substrate by going through a supplying step of supplying the imprint material onto a substrate and a contacting step of bringing the imprint material supplied onto the substrate in the supplying step into contact with a mold, comprising: determining the target arrangement such that the plurality of droplets include a first droplet group including a plurality of first droplet trains, each of which has droplets arranged at a first pitch in a first direction along a side of the predetermined region, and at a second pitch in a second direction different from the first direction; a second droplet group including a plurality of second droplet trains, each of which has droplets arranged at the first pitch in the first direction, and at the second pitch in the second direction; and a third droplet train, each of which has droplets arranged at the first pitch in the first direction; the second droplet group is offset from the first droplet group by a first distance in the first direction that is less than the first pitch and a second distance in the second direction that is half the second pitch; the third droplet row is arranged to be shifted by the first distance in the first direction with respect to a specific droplet row, which is the first droplet row of the first droplet group that is closest to the side, and a distance between the specific droplet row and the third droplet row in the second direction is smaller than the second distance; in the contact step, when reducing the time it takes for the imprint material to reach the side is given priority over reducing the overflow of the imprint material from the predetermined region, the third droplet array is disposed at a position closer to the side in the second direction than the specific droplet array; In the contacting step, when reducing the overflow is prioritized over reducing the arrival time, the third droplet string is disposed at a position farther from the side in the second direction than the specific droplet string. A method for determining whether or not a

11. A program causing a computer to execute the determination method according to claim 10.

Images