Surface material

Abstract

The present invention provides a laminate molding system and a laminate molding method using the laminate molding system that are improved over conventional systems in at least one of the uniformity of surface pressure distribution when pressurizing a press device, the smoothness of laminate molded products, and the releasability upon completion of laminate molding. [Solution] In a lamination molding system 1 equipped with a vacuum lamination device 2 and a press device 3 arranged in a process downstream of the vacuum lamination device 2, the press device 3 is equipped with pressure blocks 317, 318 attached to at least one of the upper platen 312 or the lower platen 314, buffer materials 321, 324 attached to the surfaces of the pressure blocks 317, 318, and metal plates 322, 325 attached to the surfaces of the buffer materials 321, 324, and at least one coating layer 323, 326 of titanium or a titanium alloy, nickel or a nickel alloy, metal nitride, or DLC is formed on the surface of the metal plates 322, 325.

Description

[Technical field]

[0001] The present invention relates to a lamination molding system including a vacuum lamination device, a press device arranged downstream of the vacuum lamination device, and a conveying device that conveys intermediate laminate material laminated by the vacuum lamination device to the press device, and a lamination molding method using the lamination molding system. [Background technology]

[0002] A laminate molding system including a vacuum lamination device, a press device disposed downstream of the vacuum lamination device, and a conveying device for conveying the intermediate laminated material laminated by the vacuum lamination device to the press device is known from Patent Document 1. Patent Document 1 discloses a flattening press machine, which is a press device, disposed downstream of the vacuum lamination device. In the flattening press, a cushioning material made of rubber or the like having a thickness of about 1.5 mm is attached to the surface of a polishing plate, which is a pressurizing block, and an elastically deformable mirror plate made of stainless steel or the like having a thickness of about 2 mm is attached to the surface of the cushioning material. It is described that the mirror plate constituting the molding surface at the time of molding initially elastically deforms in accordance with the unevenness of the surface of the product, and then gradually returns to the original flat surface due to the elastic deformation of the cushioning material and the elastic deformation of the mirror plate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2002-120100 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the press device of the conventional laminate molding system, there were cases where the results were not fully satisfactory in at least one of the uniformity of the surface pressure distribution during pressurization, the smoothness of the laminate molded product, and the releasability upon completion of the laminate molding. Therefore, the present invention aims to provide a laminate molding system and a laminate molding method using a laminate molding system that are improved from the conventional ones in at least one of the uniformity of the surface pressure distribution during pressurization of the press device, the smoothness of the laminate molded product, and the releasability upon completion of the laminate molding.

[0005] Other objects and novel features will become apparent from the description of this specification and the accompanying drawings. [Means for solving the problem]

[0006] The laminated molding system described in claim 1 of the present invention is a laminated molding system comprising a vacuum lamination device, a press device arranged in a downstream process of the vacuum lamination device, and a transport device that transports intermediate laminated material laminated by the vacuum lamination device to the press device, wherein the press device is provided with a pressure block attached to at least one of an upper platen or a lower platen, a buffer material attached to a surface of the pressure block, and a metal plate attached to a surface of the buffer material, and at least one coating layer of titanium or a titanium alloy, nickel or a nickel alloy, a metal nitride, or DLC is formed on the surface of the metal plate. Effect of the Invention

[0007] The laminate molding system of the present invention is a laminate molding system comprising a vacuum laminate apparatus, a press apparatus arranged in a downstream process of the vacuum laminate apparatus, and a transport device which transports intermediate laminate material laminated by the vacuum laminate apparatus to the press apparatus, wherein the press apparatus comprises a pressure block attached to at least one of the upper and lower plates, a cushioning material attached to the surface of the pressure block, and a metal plate attached to the surface of the cushioning material, and the surface of the metal plate is formed with at least one coating layer of titanium or a titanium alloy, nickel or a nickel alloy, metal nitride, or DLC, so that good results can be obtained in at least one of the uniformity of the surface pressure distribution during pressurization, the smoothness of the laminate molded product, and the releasability upon completion of the laminate molding. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a schematic explanatory diagram of a lamination molding system according to a first embodiment. [Diagram 2] 1 is an enlarged view of a main part of a laminate molding system according to a first embodiment. [Diagram 3] FIG. 11 is a schematic explanatory diagram of a lamination molding system according to a second embodiment. [Figure 4] FIG. 11 is a schematic explanatory diagram of a lamination molding system according to a third embodiment. [Diagram 5] FIG. 1 is a schematic explanatory diagram illustrating pressure molding performed using a press device of a conventional laminate molding system. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] A laminate molding system 1 according to a first embodiment of the present invention will be described with reference to Fig. 1, which shows cross sections of a vacuum lamination device 2 and a press device 3. In the laminate molding system 1, a press device 3 is disposed after a vacuum lamination device 2, and an intermediate laminate material A4 made of a substrate A1 and a lamination film A2, which are laminated materials having uneven portions and which are transported from the vacuum lamination device 2 by carrier films F1, F2 sent by a transport device, is pressure-molded by the press device 3.

[0010] The carrier film unwinding device 4 of the transport device 10, which also serves as a transfer device and tension device for the substrate A1 and laminated film A2, is equipped with a lower unwinding roll 411 and a driven roll 412. The lower carrier film F1 unwound from the unwinding roll 411 is changed to a horizontal state at the driven roll 412. A loading stage section 413 is provided at the portion where the lower carrier film F1 is in the horizontal state, on which the substrate A1 and laminated film A2, which are the materials to be molded and sent in a superimposed state from the previous process, are loaded. The carrier film unwinding device of the transport device 10 4 The lamination machine 410 includes an upper unwinding roll 414 and a driven roll 415, and the upper carrier film F2 unwound from the unwinding roll 414 is superimposed on the laminated product A3 consisting of the substrate A1 and the laminated film A2 at the driven roll 415. The substrate A1 and the laminated film A2 are transferred between the carrier films F1 and F2, and laminated molding is performed via the carrier films F1 and F2 in the vacuum lamination device 2 or the press device 3. This has the advantage of preventing the laminated film A2 from melting and adhering to the device parts, and of providing a certain cushioning effect when the intermediate laminate material A4 is pressed in the press device 3 in particular. Depending on the type of laminated product A5, the carrier films F1 and F2 are peeled off from the laminated product A5 after the temperature of the laminated product A5 taken out of the press device 3 has dropped, so peeling or demolding can be performed in good condition.

[0011] The vacuum lamination device 2, which is disposed in a process subsequent to the carrier film unwinding device 4 of the conveying device 10, pressurizes the laminated molded product A3 consisting of the substrate A1 and the laminated film A2 by a pressurizing body such as a diaphragm 211 in a vacuum state (reduced pressure state) chamber C, and laminates and molds an intermediate laminated material A4, which is a primary molded product. In the vacuum lamination device 2, the lower plate 213 is provided so as to be liftable and lowerable by a lifting mechanism 214 with respect to the upper plate 212 which is fixedly provided, and when the lower plate 213 rises and abuts against the upper plate 212, a chamber C can be formed inside. The chamber C is connected to a vacuum pump (not shown) and can be depressurized. A hot plate 215 is attached to the lower surface at the center of the upper plate 212, and an elastic body 216 such as a heat-resistant rubber film (not shown) is attached to the surface of the hot plate 215. Meanwhile, a hot plate 217 is also attached to the upper surface at the center of the lower plate 213. A diaphragm 211 made of a heat-resistant rubber film, which is a pressure body, is attached to the periphery of the hot plate 217 of the lower plate 213 so as to cover the upper surface of the hot plate 217. Then, pressurized air is sent to the rear side of the diaphragm 211 by a compressor (not shown), so that the diaphragm 211 expands in the chamber C and pressurizes the substrate A1 and the laminated film A2 between the hot plate 217. The diaphragm 211 of the vacuum lamination device 2 may be attached to the upper plate. The pressure body of the vacuum lamination device may be one that pressurizes the substrate A1 and the laminated film A2 between roll bodies with an elastic body attached to their surfaces or between the roll body and a pressure plate. The vacuum lamination device may also be a press device in which elastic sheets such as rubber are attached to the surfaces of the upper and lower hot plates, and the elastic sheets serve as the pressure surfaces.

[0012] The press device 3 arranged in series after the vacuum lamination device 2 pressurizes the intermediate laminate A4, which is made of the substrate A1 and the laminate film A2, which are laminated materials with uneven parts and are pressurized and molded by the vacuum lamination device 2, and has unevenness remaining on the side of the laminate film A2, to pressurize and mold it into a flatter laminated product A5. The press device 3 is equipped with a substantially rectangular base plate 311 provided below, and tie bars 313 erected between the four corners of an upper plate 312, which is a substantially rectangular fixed plate located above the base plate 311. The press device 3 is equipped with a lower plate 314, which is a substantially rectangular movable plate, that can be raised and lowered between the base plate 311 and the upper plate 312. The base plate 311 is equipped with a pressurizing cylinder 315, which is a pressurizing means and operates hydraulically, and a ram 316 of the pressurizing cylinder 315 is fixed to the back surface of the lower plate 314. The pressurizing means of the press apparatus 3 of the first embodiment may be of another type, such as one in which a ball screw is rotated by an electric motor to directly move the lower platen, or one in which a toggle device is used to move the lower platen by an electric motor. Furthermore, the press apparatus 3 may be one in which an upper platen descends relative to a lower platen. Furthermore, although the press apparatus 3 of the first embodiment does not include a chamber that can be placed in a vacuum state, it may be one that includes a chamber that can be placed in a vacuum state and pressurization is performed within the vacuum chamber.

[0013] Pressure blocks 317 and 318 are attached to the opposing surfaces of the upper platen 312 and the lower platen 314 of the press device 3. Next, the pressure block 318 on the lower platen 314 side will be described in detail with reference to FIG. 2. In FIG. 2, the cushioning material 321 made of a resin film, the stainless steel metal plate 322 which is a thin metal plate, and the titanium nitride coating layer 323 are depicted in a deformed manner so that their thicknesses (vertical direction in FIG. 2) in the length direction (horizontal direction in FIG. 2) are thicker than in reality. A heat insulating material 319 is disposed between the lower platen 314 and the pressure block 318 of the press device 3, and a plurality of cartridge heaters 320 as heating means are disposed in parallel inside the pressure block 318. The pressure block 318 which is also a hot plate may be equipped with a polishing plate or a plate-shaped heater as in Patent Document 1, and is not limited to the one shown in FIG. 2.

[0014] A buffer material 321 made of engineering plastic such as polyimide film or a thermosetting resin film is laid on the smooth surface 318a of the pressure block 318. The resin film used in the present invention is preferably an engineering plastic film or a thermosetting resin film, which is an industrial functional film. Specifically, a film made of engineering plastic (including super engineering plastic) such as polyimide, or a thermosetting resin film such as fluororesin is preferable. These resin films are particularly preferable to have a Rockwell R scale hardness (ISO 2039-2) of 15 to 140 and a heat resistance temperature of 150°C or higher. The thickness of the resin film as the buffer material 321 is preferably 0.005 mm to 3.00 mm, more preferably 0.05 mm to 1.00 mm. The material of the buffer material may be elastomer, fiber, paper, or a composite of these, in addition to resin.

[0015] A metal plate 322 such as stainless steel is overlaid on the surface of the buffer material 321. In the first embodiment, the surface 318a of the pressurizing block 318, the buffer material 321, and the stainless steel metal plate 322 have the same shape in plan view. The length of one side of the metal plate 322 etc. in plan view is, for example, 250 mm to 1,000 mm, but is not limited to this. The shape of the metal plate 322 etc. may be rectangular or square, and may have chamfered corners or uneven parts for mounting. In the case of stainless steel, the material of the metal plate 322 is particularly preferably high-hardness martensitic stainless steel (SUS440C etc.). Alternatively, high-hardness stainless steel may be stainless steel with a hardness HRC of 54 or more or an elastic modulus (×10 3 kg / mm 2 It is particularly preferable that the thickness of the metal plate 322 is 0.05 mm to 5.0 mm, and more preferably 0.3 mm to 3.0 mm. Alternatively, the metal constituting the metal plate 322 may be stainless steel, nickel, iron, copper, zinc, aluminum, or an alloy of these metals. The thickness of the metal plate 322 is 0.05 mm to 5.0 mm, and more preferably 0.3 mm to 3.0 mm.

[0016] In the present invention, at least one coating layer 323 made of titanium or a titanium alloy, nickel or a nickel alloy, a metal nitride, or DLC is formed on the surface 322a of the metal plate 322 such as stainless steel. More specifically, in this embodiment, titanium nitride (Ti N The titanium nitride coating layer 323 is formed by ion plating, which is a type of PVD method, and the thickness of the titanium nitride coating layer 323 is 0.1 μm to 100 μm. The thickness of the coating layer of a metal nitride such as titanium nitride is more preferably 0.3 μm to 2.0 μm. The ion plating Te The pressing surface 323a of the surface of the coating layer 323 of a metal nitride such as titanium nitride formed by the grinding method is polished with a polishing buff or the like as necessary, and is finished to the surface roughness described below.

[0017] The roughness of the pressurized surface 323a of the titanium nitride coating layer 323 formed on the surface 322a of the metal plate 322 is not limited to this, but the arithmetic mean roughness Ra (JIS B0601:2013) is preferably 0.07 μm or less, and more preferably Ra0.04 μm or less. The surface roughness of the titanium nitride coating is preferably 0.06 μm or less in maximum height roughness Rz (JIS B0601:2013), and more preferably Rz0.35 μm or less. For both the arithmetic mean roughness Ra and maximum height roughness Rz, it is more desirable for the lower limit values ​​to be small, but the surface treatment method is selected taking into account costs as well.

[0018] The type of the metal nitride coating layer may be a coating layer obtained by nitriding titanium or a titanium alloy such as TiC, TiCN, or TiAIN in addition to TiN. coatingThe coating layer may be a nitrided coating layer of CrN, molybdenum nitride, tungsten nitride, etc. Furthermore, a suitable material for the coating layer is DLC, which is a diamond carbide coating layer. The thickness of these coating layers is also preferably 0.3 μm to 100 μm, and the surface roughness is preferably Ra 0.1 μm or less. The coating layer may be formed by ion plating or PVD. R The most suitable coating method is selected depending on the type of coating layer, such as vacuum deposition, sputtering, or CVD.

[0019] The coating layer may be a coating layer made of titanium or a titanium alloy, or nickel or a nickel alloy. These metals are formed on the surface of the stainless steel metal plate 322, 325 by plating, spraying, or other methods. The coating layer may be a mixture of coating layers of titanium or a titanium alloy, nickel or a nickel alloy, metal nitride, or DLC, or the coating layer may be formed on the metal plate 322, 325 as a plurality of coating layers. For example, the surface of an intermediate layer such as a titanium nitride layer may be coated with DLC, or the surface of an intermediate layer such as a titanium alloy or nickel alloy may be coated with a coating layer of a metal nitride such as titanium nitride, and the combination may be appropriately selected.

[0020] The buffer material 321 and the stainless steel metal plate 322 are provided with holes for bolts (not shown) at multiple locations (4 locations, 6 locations, 8 locations, etc.) around the periphery other than the pressing surface. Then, bolts (not shown) are inserted through the holes from the front side of the metal plate 322 into the bolt holes of the pressing block 318, and the buffer material 321 and the stainless steel metal plate 322 are fixed to the pressing block 318. Note that an adjustment part consisting of a hole or a long hole larger than the cross-sectional area of ​​the bolt may be provided at the portion where the bolt is inserted to allow thermal expansion of the stainless steel metal plate 322, etc. Also, the method of attaching the buffer material 321 and the stainless steel metal plate 322 to the pressing block 318 may be by adhesion using a holder or adhesive other than a bolt. With the above structure, the pressing block 318 of the press device 3 is provided with the metal plate 322 via the buffer material 321, which is a buffer material.

[0021] In the press device 3 of the first embodiment, the upper platen 312 also includes a pressure block 317, a cushioning material 324, and a metal plate 325, which have the same side size and area as the lower platen 314. The surface of the metal plate 325 is provided with a stainless steel metal plate 325 coated with a titanium nitride coating layer 326. However, the metal plates 322, 325 of the pressure block 317 on the upper platen 312 side and the pressure block 318 on the lower platen 314 side have different plate thicknesses and surface areas. covered The type of film layer and the surface roughness may be different.

[0022] A carrier film unwinding device 5 of the conveying device 10, which also functions as a transport device and tension device for the laminated molded product A5, is provided in the process downstream of the press device 3. The carrier film unwinding device 5 includes a lower winding roll 511 and a driven roll 512, and the lower carrier film F1 is wound by the winding roll 511. The carrier film unwinding device 5 also includes an upper winding roll 513 and a driven roll 514, and the upper carrier film F2 is peeled off from the laminated molded product A5 at the driven roll 514, and the upper carrier film F2 is wound by the upper winding roll 513. A take-out stage 515 for the laminated molded product A5 is provided at the portion where only the lower carrier film F1 is sent in a horizontal state. As a transport device for the carrier films F1 and F2, a transfer device that grips both sides of the carrier films F1 and F2 and pulls them toward the downstream process may be provided. Furthermore, the conveying device 10 that conveys the laminated molded product A3 of the laminate molding system 1 to the vacuum lamination device 2 and conveys the intermediate laminated material A4 laminated by the vacuum lamination device 2 to the press device 3 is not limited to the above, and may also be a multi-axis robot or the like.

[0023] Next, a lamination molding method of the substrate A1 and the laminate film A2, which are the lamination materials, using the lamination molding system 1 including the press device 3 of the first embodiment will be described. In the lamination molding system 1 during continuous molding, pressure molding is performed in a batch processing manner at the same time by sequence control in the diaphragm type vacuum lamination device 2 and the press device 3, which is a flattening press device. However, here, the molding sequence of the substrate A1 and the laminate film A2, which are the lamination materials for one batch, will be described. The upper and lower carrier films F1 and F2, which are provided so as to be unwound from the carrier film unwinding device 4 of the conveying device 10 and wound up on the carrier film unwinding device 5, are often made of polyethylene terephthalate (PET) and have a thickness of 0.01 mm to 0.50 mm, although they are not limited to this. The types of the carrier films F1 and F2 may also be made of polyethylene, polypropylene, polyimide, etc.

[0024] The substrate A1 placed on the placement stage 413 of the conveying device 10 is a build-up circuit substrate having an uneven portion A1a consisting of a protruding portion A1b of the copper foil portion bonded to the substrate surface and a recessed portion A1c of the portion without the copper foil. The thickness of the copper foil (height relative to the substrate portion) is not limited to this, but may be any of several. μ m to tens μ The thickness of the laminated molded product A3 is about 1 / 4 mm, and in most cases is 0.1 mm or less. The laminated film A2 is laminated on the top and bottom of the substrate A1, respectively, to form a laminated molded product A3 for build-up molding. Although one laminated molded product A3 is shown in Fig. 1, a plurality of laminated molded products A3 may be laminated and molded at the same time.

[0025] The laminated film A2 in the first embodiment is an insulating film, and is used after the PET films laminated on both sides are peeled off from the original storage state. The resin material of the laminated film A2 is a thermosetting resin such as epoxy or a thermosetting resin that is the main component. In addition to the thermosetting resin, various materials and additives are contained for the purpose of adjusting roughness, imparting flame retardancy, imparting low expansion, imparting fluidity, imparting film-forming properties, lowering dielectric tangent (insulating properties), lowering moisture content, etc. In particular, in recent years, there has been an increase in the type of film in which the content of inorganic materials is increased for the purpose of adjusting roughness, imparting low expansion, lowering dielectric tangent, lowering moisture content, etc. The type of inorganic material is not limited to this, but SiO 2 etc.

[0026] In the first embodiment, the inorganic material SiO 2 The laminated film A2 having a content (volume %) of 20% or more is preferably used. 2The laminate film A2 with a content (volume %) of 20% or more is defined as a laminate film with a high content of inorganic materials. In the example of "Ajinomoto Build-up Film (ABF)" (registered trademark), an interlayer insulating film of Ajinomoto Fine-Techno Co., Ltd., although not limited thereto, examples of laminate films with a high content of inorganic materials include GX13 (Young's modulus (GPa) 4.0), GX92 (Young's modulus (GPa) 5.0), GX-T31 (Young's modulus (GPa) 7.5), NextGX (Young's modulus (GPa) 7.5), GZ41 (Young's modulus (GPa) 9.0), and films with a Young's modulus (GPa) of 9.0 or more are examples of laminate films with a high content of inorganic materials to be used.

[0027] Other companies' products also contain laminated films with a high content of inorganic materials of the same material. Coarse The inorganic material is 20% by volume or more, or 40% by volume or more, for the purpose of improving adhesion with laminated materials by polymerization, preventing peeling from the substrate by reducing the thermal expansion coefficient, improving insulation (reducing dielectric loss), and reducing the moisture content. volume The above are included. In particular, for substrates for 5G, which is a fifth generation communication system, a laminate film A2 (interlayer insulating film) with an inorganic material content of 25% by volume or more is particularly preferably used since even greater precision is required. The thickness of the laminate film A2 is not limited to this, but interlayer insulating films manufactured by Ajinomoto Fine-Techno Co., Ltd. and the like are commercially available with a thickness of 0.01 mm to 0.1 mm and are widely used. The laminate film A2 may also be one with a copper foil layer laminated thereon, and these are also used in the press device 3 of the laminate molding system 1 of the present invention.

[0028] The laminated product A3 placed on the placement stage 413 is sent together with the upper and lower carrier films F1 and F2 as the winding rolls 511 and 513 are rotated and driven, and is sent into the chamber C of the vacuum lamination device 2 in an open state and positioned therein. Next, the chamber C of the vacuum lamination device 2 is closed, and the chamber C is evacuated by a vacuum pump (not shown). Pressurized air is then sent in to expand the diaphragm 211 into the chamber C, and the laminated product A3 consisting of the substrate A1 and the laminated film A2 is pressurized between the elastic body 216 of the hot plate 215 on the upper platen 212 side. The pressure applied by the diaphragm 211 at this time is, for example, 1.0 MPa or less, and the substrate A1 and the laminated film A2 are bonded together in such a manner that the laminated film A2 is embedded in the recess A1c of the substrate A1, and the intermediate laminated material A4, which is a primary molded product, is laminated. However, the surface of the laminated film A2 of the intermediate laminated material A4 laminated by the vacuum lamination device still has unevenness following the shape of the uneven portion A1a of the substrate A1. Furthermore, in this case, if the laminate film A2 used has a high inorganic material content, the fluidity of the molten resin is low, so that unevenness is more likely to remain.

[0029] In the vacuum lamination device 2, the intermediate laminate A4, which is made of the substrate A1 with the uneven portion A1a and the laminate film A2, is laminated and molded. The chamber C is opened. Then, the carrier film unwinding device 5 of the conveying device 10 feeds the next carrier films F1 and F2, and the intermediate laminate A4 is conveyed between the upper plate 312 and the lower plate 314 of the press device 3, and is stopped at a predetermined pressurizing position. Next, the pressurizing cylinder 315 of the press device 3 is operated, and the lower plate 314 and the pressurizing block 318 are raised. As described above, the pressurizing block 318 is attached with the stainless steel metal plate 322, which is elastically deformable via the buffer material 321 with a buffer effect and has a coating layer 323 made of titanium nitride formed on its surface. After the pressing surface 323a on the surface of the titanium nitride coating layer 323 of the stainless steel metal plate 322 abuts against the lower carrier film F1, the intermediate laminate A4 is further pushed up via the lower carrier film F1. The intermediate laminate A4 is then abutted against the pressure surface 326a on the surface of the titanium nitride coating layer 326 on the surface of the stainless steel metal plate 325 of the upper platen 312 via the upper carrier film F2, and the intermediate laminate A4 is then pressed between the upper and lower pressure surfaces 323a and 326a via the carrier films F1, F2.

[0030] The temperature of the pressurizing blocks 317, 318 (hot plates) of the press device 3 at this time is not limited to this because it varies depending on the materials of the substrate A1 and the laminated film A2, but is controlled to 30°C to 200°C, more preferably 80°C to 140°C. If the temperature is too high, the viscosity of the resin material constituting the laminated film when melted will be low and the fluidity will be too high, causing the resin material constituting the laminated film to flow out from the end of the intermediate laminate material A4, and the desired plate thickness and insulating layer thickness of the laminated molded product will not be obtained. Furthermore, if the temperature of the pressurizing blocks 317, 318 at the time of pressing is too high, problems such as deterioration of the resin material and a longer molding cycle time including cooling in the post-process will occur. On the other hand, if the temperature of the pressurizing blocks 317, 318 at the time of pressing is too low, the viscosity of the resin material will be too high to obtain the desired fluidity, causing problems such as insufficient embedding of the laminated film A2 into the substrate A1 and insufficient flatness of the surface of the laminated molded product A5.

[0031] The pressure (surface pressure) applied to the intermediate laminate A4 also varies depending on the materials of the substrate A1 and the laminate film A2, and is not limited thereto, but is controlled to 0.1 MPa to 3.0 MPa, more preferably 0.5 MPa to 2.5 MPa. If the pressure is too strong, the molten resin material constituting the laminate film A2 will flow out from the end of the intermediate laminate A4, and good pressure molding will not be possible, as with the temperature conditions. If the pressure is too low, the laminate film A2 will not be embedded sufficiently into the substrate A1, or the surface of the laminate molded product A5 will not be sufficiently flat.

[0032] In the first embodiment, the stainless steel metal plates 322, 325, which are metal plates having coating layers 323, 326 such as titanium nitride formed on the surface, are used, and the intermediate laminate A4 is pressed through the carrier films F1, F2, thereby improving the smoothness of the intermediate laminate A4. The stainless steel metal plates 322, 325 having coating layers 323, 326 of titanium nitride formed thereon and the buffer materials 321, 324 made of resin films of polyimide or fluororesin are used, thereby improving the uniformity of the surface pressure distribution when the intermediate laminate A4 is pressed. In addition, the combination of the coating layers 323, 326 and the buffer materials 321, 324 made of resin films can prevent the resin material of the molten laminate film A2 from flowing out to the outside due to stress concentration at the time of pressing near the ends A4c, A4d of the intermediate laminate A4 when pressing the intermediate laminate A4 between the pressurizing blocks 102, 103 of the press device 101 as shown in FIG. 5.

[0033] After a predetermined pressurizing time has elapsed in the press device 3, the pressurizing cylinder 315 of the press device 3 is operated, and the lower platen 314 and the pressurizing block 318 are lowered. This causes a separation between the pressurizing surface 323a of the titanium nitride coating layer 323 formed on the surface 322a of the metal plate 322 attached to the pressurizing block 318 on the lower platen 314 side and the lower carrier film F1. Also, a separation between the pressurizing surface 326a of the titanium nitride coating layer 326 formed on the surface of the metal plate 325 attached to the upper platen 312 side and the upper carrier film F2 is caused. However, in the present invention, since the titanium nitride coating layers 323, 326 are formed on the surfaces of the metal plates 322, 325, separation from the carrier films F1, F2 can be performed more easily than before. This minimizes the phenomenon in which at least one of the carrier films F1, F2 is released while still attached to the metal plate, causing the laminated molded product A5 press-molded between the carrier films F1, F2 to be unintentionally released from the carrier films F1, F2 within the press device 3.

[0034] The laminated product A5, which has been laminated in the press device 3, is sent to the removal stage 515 for the laminated product A5 by the operation of the carrier film unwinding device 5 of the conveying device 10 in the next molding cycle. By this time, the upper carrier film F2 is satisfactorily released from the laminated product A5 at the driven roll 514. The laminated product A5 is then removed from the removal stage 515 by a robot or the like. When the laminated product A5 is a substrate for a build-up board, the smoothness of the surface is particularly important, and the present invention is therefore effective. In the case of a substrate for a build-up board, the surface of the laminated product A5 may be very finely roughened with chemicals or the like in order to attach copper foil or the like in the next process, but the surface smoothness of the present invention requires a smoothness with a larger unit than that, so in any case, it is important to ensure the smoothness of the laminated product A5 for a build-up board in the press device 3.

[0035] Next, the laminate molding system 6 of the second embodiment shown in FIG. 3 will be described with reference to the differences from the laminate molding system 1 of the first embodiment. The press device 8 of the laminate molding system 6 of the second embodiment does not use a diaphragm, and the pressurizing mechanism such as the pressurizing cylinder 821 has almost the same structure as the press device 3 of the first embodiment. In the press device 8, the pressurizing blocks 813 and 814 attached to the upper plate 811 and the lower plate 812 respectively include buffer materials 815 and 816 made of resin film such as polyimide as a buffer material, and stainless steel metal plates 817 and 818 as thin metal plates, and the surfaces of the stainless steel metal plates 817 and 818 are formed with coating layers 819 and 820 made of titanium nitride, which are the same as those of the first embodiment. The surfaces of the coating layers 819 and 820 are pressure surfaces 819a and 820a. Also, the lower plate 812 is raised by the pressure cylinder 821 to perform pressure molding between the pressure surfaces 819a and 820a.

[0036] The difference between the press device 3 of the first laminate molding system 1 and the press device 8 of the laminate molding system 6 of the second embodiment is that in the press device 8, side walls 822, 823 that are chamber forming members are formed on at least one of the upper platen 811 and the lower platen 812, and a chamber C is formed when the relative distance between the upper platen 811 and the lower platen 812 decreases as the lower platen 812 etc. rises. The press device 8 is equipped with a vacuum pump (not shown) for creating a vacuum in the chamber C. Therefore, the press device 8 is a vacuum laminate device.

[0037] In addition, the press device 3 used for secondary molding, which is the same as in the first embodiment, is provided in the process following the press device 8. The press device 8 is provided with buffer materials 815, 816 made of a resin film such as polyimide, which is a buffer material, and stainless steel metal plates 817, 818 which are thin metal plates. The stainless steel metal plates 817, 818 of the press device 8, the stainless steel metal plates 817, 818 of the press device 3, and the stainless steel metal plates 322, 325 of the press device 3 may be made of the same material or different materials. Furthermore, the coating layers such as titanium nitride of the metal plates 817, 818 and the coating layers 323, 326 such as titanium nitride of the metal plates 322, 325 may be made of the same material or different materials, and the surface roughness (arithmetic mean roughness Ra or maximum height roughness Rz ) The surface roughness of the coating layers 323, 326 of titanium nitride or the like of the metal plates 322, 325 of the press device 3 in the subsequent process may be smaller.

[0038] Next, a lamination molding system 7 of a third embodiment shown in Fig. 4 will be described with reference to the symbols, focusing on the differences from the lamination molding system 1 of the first embodiment. The lamination molding system 7 of the third embodiment is provided with another similar press device 9 in a process downstream of the press device 3 of the lamination molding system 1 of the first embodiment. That is, the press devices 3 and 9 of the lamination molding system 7 are provided in series in a process downstream of the vacuum lamination device 2. Then, the intermediate laminate material A4 consisting of the substrate A1 with the uneven portion and the laminate film A2 transported from the vacuum lamination device 2 by the carrier films F1 and F2 is pressure-molded in sequence by the two press devices 3 and 9.

[0039] Press device 9 has almost the same structure as press device 3, and pressure blocks 913, 914 attached to upper platen 911 and lower platen 912, respectively, are equipped with cushioning materials 915, 916 made of a resin film such as polyimide and stainless steel metal plates 917, 918, and coating layers 919, 920 made of titanium nitride or the like are formed on the surface of the stainless steel metal plate 918, which surfaces form pressure surfaces 919a, 920a.

[0040] The resin film cushioning material 915, 916 of the press device 9 and the stainless steel metal plate to The cushioning materials 321, 324 made of resin film of the press device 3 and the stainless steel metal plates 322, 325 may be the same thickness or one of them may be thicker. 0 and , coating layers 323, 326 such as titanium nitride formed on the metal plates 322, 325 teeth They may have the same thickness, or one of them may be thicker.

[0041] In the lamination molding method using the lamination molding system 6 of the third embodiment, intermediate laminate materials A4a and A4b that have been laminated are sent in this order to the vacuum lamination device 2, the press device 3, and the press device 9. In the case of two lamination devices as in the first embodiment, the press device 3 often requires a longer pressurization time than the vacuum lamination device 2, and the overall molding time is often determined by the press device 3. However, in the lamination molding system 7 of the third embodiment, the molding time can be distributed by two pressurization moldings using the press device 3 and the press device 9, and in most cases moldings using the other press devices 3 and 9 can also be performed in the molding time required for the vacuum lamination device 2.

[0042] In addition, since two press moldings using the press device 3 and the press device 9 are possible, even if the laminate film A2 contains a large amount of inorganic material and has poor fluidity when melted, it can be laminated well. The temperature and pressure (surface pressure) of the press block of the press device 3 and the press device 9 may be the same or different. Although not limited to this, as an example, the temperature of the press block of the press device 3 may be higher than that of the press device 9 to improve the fluidity of the resin material in the molten state of the laminate film A2, and the pressure of the press device 9 may be higher than that of the press device 3 to increase the smoothness of the surface of the laminated molded product A5. In the third embodiment, a further device such as a cooling press device may be provided in the process subsequent to the press device 9.

[0043] As a modification of the third embodiment, a press device whose pressing surface is made of an elastic plate such as rubber may be used instead of the press device 3 installed next to the vacuum lamination device 2. In that case, the press device of the present invention is used only for the third lamination molding.

[0044] It is also envisaged that the press devices 3, 8, and 9 of the present invention may be shipped without the cushioning resin film or metal plate attached, and that a metal having a coating layer of titanium nitride or the like formed thereon according to the present invention may be attached later, and these configurations are also encompassed by the present invention.

[0045] Although not listed one by one, the present invention is not limited to the above-mentioned first to third embodiments, and it goes without saying that the present invention is applicable to those modified by those skilled in the art based on the spirit of the present invention and those combining the descriptions of the first to third embodiments. The laminated molded products laminated by the laminated molding systems 1, 6, and 7 are particularly suitable for laminated molded products for which surface smoothness is important, and may be, without limitation, build-up boards, other circuit boards, semiconductor wafers, and the like. [Explanation of symbols]

[0046] 1,6,7 Lamination molding system 2 Vacuum lamination equipment 3,8,9 Press equipment 212,312,811,911 Upper board 213,314,812,912 Lower board 317,318,813,814,913,914 Pressurized block 321,324,815,816,915,916 Cushioning material 322,325,817,818,917,918 Metal Plate 323,326,819,820,919,920 Coating layer 323a, 326a, 821a, 822a, 919a, 920a Pressurized surface

Claims

1. A surface member provided on a surface facing the laminated molded product of a pressure block used in a laminate molding system that conveys a laminated molded product having a laminate film laminated on a substrate together with a carrier film arranged on the laminated film side and pressure molds the laminated molded product through the carrier film, A metal plate; A coating layer is coated on the surface of the metal plate, The metal plate is removably fixed to the pressure block, The coating layer is formed such that, during pressure molding, a first release force for releasing the laminated molded product from the carrier film is stronger than a second release force for releasing the carrier film from the coating layer.

2. The surface member of claim 1 , wherein the surface member has at least one through hole.

3. 3. The surface member of claim 2, wherein the through holes are circular.

4. 3. The surface member according to claim 2, wherein the cross-sectional area in the inner diameter direction of the through hole is larger than the cross-sectional area in the inner diameter direction of a bolt fastening hole provided in the pressurizing block and used to fasten the surface member to the pressurizing block.

5. the metal plate is provided on a surface of a cushioning material provided between the pressure block and the surface member, the cushioning material facing the laminated molded product, The surface member according to claim 1 , wherein the metal plate has at least one of a protrusion and a recess on a surface that contacts the buffer material.

Images