SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Abstract

To provide a substrate processing apparatus and a substrate processing method, capable of reducing a standby state of a transportation of a substrate.SOLUTION: In an interface part for connecting a pre-processing part for performing a pre-step of an exposure processing to a substrate and a post-processing part for performing a post-step thereto with two exposure devices, a plurality of conveyance robots and a plurality of modules are arranged. In the interface part, a first transport path for transporting the substrate to one exposure device and a second transport path for transporting the substrate to the other exposure device are existed. A processing time of the substrate in a first temperature adjustment device contained in the first transport path that is relatively short is extended by a predetermined delay time. Thus a time required for transporting the substrate along the first transport path and a time required for transporting the substrate along the second transport path can be nearly uniformed, and a standby state of the transport of the substrate in the first transport path can be reduced.SELECTED DRAWING: Figure 12

Description

[Technical field]

[0001] The present invention relates to a substrate processing apparatus and a substrate processing method for sequentially performing pre-processing of an exposure process and post-processing of an exposure process on a plurality of substrates included in a lot. Substrates to be processed include, for example, glass substrates for liquid crystal display devices, glass substrates for organic electroluminescence displays, glass substrates for PDPs, glass substrates for photomasks, etc. [Background technology]

[0002] Conventionally, substrate processing apparatuses have been known which treat substrates transported from an apparatus (also called an indexer apparatus) having a loading table for loading a cassette containing multiple substrates and a transport apparatus, and sequentially perform processes such as forming a photoresist coating film, vacuum drying, heat drying, transporting the substrate into an exposure apparatus, transporting the substrate from the exposure apparatus, developing the photoresist film after exposure, rinsing, and drying, and then transporting the substrate to the indexer apparatus (e.g., Patent Documents 1 and 2, etc.).

[0003] In the substrate processing apparatus disclosed in Patent Documents 1 and 2, two exposure apparatuses are connected to the substrate processing apparatus in order to avoid rate limitations in the exposure apparatus, which has a relatively long processing time. If two exposure apparatuses are provided, even if one exposure apparatus is in processing, the other exposure apparatus can perform exposure processing of the substrate, which prevents unexposed substrates from accumulating in the substrate processing apparatus. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2006-24643 A [Patent Document 2] JP 2006-24642 ​​A Summary of the Invention [Problem to be solved by the invention]

[0005] Incidentally, when connecting two exposure apparatuses, depending on the convenience of the user's operation of the substrate processing apparatus, there may be cases where two exposure apparatuses (equipped with the same mask) performing the same process are connected, and cases where two exposure apparatuses (equipped with different masks) performing different processes are connected. When connecting two exposure apparatuses performing different processes, the substrate is often transported to both of the exposure apparatuses in turn and exposure processing is performed twice using different masks. On the other hand, when connecting two exposure apparatuses performing the same process, the substrate is transported to only one of the exposure apparatuses and exposure processing is performed once.

[0006] When two exposure tools performing the same process are connected and a substrate is transported to only one of the exposure tools, the transport path of the substrate differs depending on the exposure tool used. In other words, there are two types of transport paths in the interface section that transports substrates to and from the exposure tools. Typically, multiple substrates in a lot are transported alternately along one of the two types of transport paths. Normally, substrates are not allowed to overtake one another in the interface section, and multiple substrates must be transported out of the interface section in the same order as they were input into the interface section.

[0007] However, the above two types of transport paths often have different lengths depending on the layout of the interface section. The time required to transport a substrate along a long transport path is necessarily longer than the time required to transport a substrate along a short transport path. In this case, if the substrate is not allowed to pass, the substrate transported along the short transport path needs to wait. If the substrate waits after the exposure process, the time from the exposure process to the development process may become uneven for each substrate, which may cause variations in the processing results. In addition, if the transport robot waits while holding the substrate transported along the short transport path, the transport robot will not be able to transport the substrate transported along the long transport path, and transport will stagnate at the interface section.

[0008] The present invention has been made in view of the above-mentioned problems, and has an object to provide a substrate processing apparatus and a substrate processing method that can reduce the number of times that substrate transport is put into a standby state. [Means for solving the problem]

[0009] In order to solve the above problems, a first aspect of the present invention provides a substrate processing apparatus that sequentially performs pre-processing of an exposure process on a plurality of substrates included in a lot, and performs post-processing of the exposure process, the apparatus comprising: a pre-processing section that performs the pre-processing; a post-processing section that performs the post-processing; an interface section that connects the pre-processing section and the post-processing section to a first exposure apparatus and a second exposure apparatus, and includes a plurality of transport robots and a plurality of modules that transport substrates; and a control section that controls the plurality of transport robots and the plurality of modules, wherein a second transport path from the pre-processing section to the post-processing section via the second exposure apparatus is longer than a first transport path from the pre-processing section to the post-processing section via the first exposure apparatus, the plurality of substrates included in the lot are transported alternately along the first transport path or the second transport path, and the control section extends the processing time of the substrate in a specific module included in the first transport path by a predetermined delay time.

[0010] In addition, in a second aspect, in the substrate processing apparatus of the first aspect, the delay time is set so that the elapsed time required for the substrate to be transported along the first transport path is equal to the elapsed time required for the substrate to be transported along the second transport path.

[0011] In addition, a third aspect is the substrate processing apparatus according to the first or second aspect, wherein the specific module is a temperature control module that controls a temperature of the substrate.

[0012] Further, a fourth aspect is a substrate processing apparatus according to any one of the first to third aspects, wherein the plurality of modules includes an input buffer arranged upstream of the first exposure device and the second exposure device, the plurality of modules includes a first output buffer arranged downstream of the first exposure device on the first transport path and dedicated to the first exposure device, and the plurality of modules includes a second output buffer arranged downstream of the second exposure device on the second transport path and dedicated to the second exposure device, and the control unit controls the plurality of transport robots so that at least the number of substrates present downstream of the input buffer on the first transport path is equal to or less than the number that can be accommodated by the first output buffer.

[0013] In a fifth aspect, in a substrate processing apparatus according to any one of the first to third aspects, the plurality of modules includes an input buffer arranged upstream of the first exposure device and the second exposure device, and the plurality of modules includes an output buffer arranged downstream of the first exposure device and the second exposure device and common to the first exposure device and the second exposure device, and the control unit controls the plurality of transport robots so that the number of substrates present downstream of the input buffer on the first transport path is at least equal to or less than the number of substrates that can be accommodated in the output buffer minus 1.

[0014] In a sixth aspect, in the substrate processing apparatus according to any one of the first to fifth aspects, the control unit controls the multiple transport robots to transport the leading substrate of the lot along the second transport path.

[0015] Further, a seventh aspect is a substrate processing method for sequentially performing a pre-processing step of an exposure process on a plurality of substrates included in a lot, and performing a post-processing step of the exposure process, the method comprising a transport step of transporting the substrates that have been subjected to the pre-processing step to the first exposure apparatus and / or the second exposure apparatus, and transporting the substrates that have been subjected to the exposure process to the post-processing step, at an interface unit that connects a pre-processing unit that performs the pre-processing step and a post-processing unit that performs the post-processing step with a first exposure apparatus and a second exposure apparatus, the interface unit comprising a plurality of transport robots and a plurality of modules that transport substrates, a second transport path from the pre-processing unit to the post-processing unit via the second exposure apparatus being longer than a first transport path from the pre-processing unit to the post-processing unit via the first exposure apparatus, the plurality of substrates included in the lot being transported alternately along the first transport path or the second transport path, and the processing time of the substrate in a specific module included in the first transport path is extended by a predetermined delay time.

[0016] In an eighth aspect, in the substrate processing method according to the seventh aspect, the delay time is set so that the elapsed time required for the substrate to be transported along the first transport path is equal to the elapsed time required for the substrate to be transported along the second transport path.

[0017] A ninth aspect is the substrate processing method according to the eighth aspect, wherein the specific module is a temperature control module that controls a temperature of the substrate.

[0018] Further, a tenth aspect is a substrate processing method according to any one of the seventh to ninth aspects, wherein the plurality of modules includes an input buffer arranged upstream of the first exposure device and the second exposure device, the plurality of modules includes a first output buffer arranged downstream of the first exposure device on the first transport path and dedicated to the first exposure device, and the plurality of modules includes a second output buffer arranged downstream of the second exposure device on the second transport path and dedicated to the second exposure device, and at least the number of substrates present downstream of the input buffer on the first transport path is set to less than or equal to the number that can be accommodated by the first output buffer.

[0019] In addition, an eleventh aspect is a substrate processing method according to any one of the seventh to ninth aspects, wherein the multiple modules include an input buffer arranged upstream of the first exposure device and the second exposure device, and the multiple modules include an output buffer arranged downstream of the first exposure device and the second exposure device and common to the first exposure device and the second exposure device, and the number of substrates present downstream of the input buffer on at least the first transport path is set to less than or equal to the number of substrates that can be accommodated by the output buffer minus 1.

[0020] A twelfth aspect is the substrate processing method according to any one of the seventh to eleventh aspects, wherein a leading substrate of the lot is transported along the second transport path.

[0021] However, "first" and "second" are merely used for the purpose of distinction, and the first transport path means a transport path that is relatively shorter than the second transport path. Effect of the Invention

[0022] According to the substrate processing apparatus of the first to sixth aspects, the processing time of a substrate in a specific module included in the relatively short first transport path is extended by a predetermined delay time, so that the time required for the substrate to be transported along the first transport path and the time required for the substrate to be transported along the second transport path can be made almost uniform, thereby reducing the waiting state of substrate transport along the first transport path.

[0023] In particular, in the substrate processing apparatus of the fourth aspect, the number of substrates present downstream of the inlet buffer on the first transport path is equal to or less than the number that can be accommodated in the first outlet buffer, thereby preventing exposed substrates from overflowing from the first outlet buffer on the first transport path and reducing the number of substrates that have been exposed and are waiting to be transported.

[0024] In particular, in the substrate processing apparatus of the fifth aspect, the number of substrates present downstream of the inlet buffer on the first transport path is equal to or less than the number of substrates that can be accommodated in the outlet buffer minus one, thereby preventing substrates that have completed exposure processing from overflowing from the common outlet buffer and reducing the number of substrates that have to wait for transport.

[0025] In particular, according to the substrate processing apparatus of the sixth aspect, the first substrate of the lot is transported along the relatively long second transport path, thereby suppressing variation in the elapsed time from exposure processing to development processing for multiple substrates included in the lot.

[0026] According to the substrate processing methods of the seventh to twelfth aspects, the processing time of a substrate in a specific module included in the relatively short first transport path is extended by a predetermined delay time, so that the time required for the substrate to be transported along the first transport path and the time required for the substrate to be transported along the second transport path can be made almost uniform, thereby reducing the number of times the substrate transport on the first transport path has to wait.

[0027] In particular, according to the substrate processing method of the tenth aspect, the number of substrates present downstream of the inlet buffer on the first transport path is set to less than the number that can be accommodated by the first outlet buffer, thereby preventing exposed substrates from overflowing from the first outlet buffer on the first transport path and reducing the number of substrates that have been subjected to waiting periods for transport.

[0028] In particular, according to the substrate processing method of the 11th aspect, the number of substrates present downstream of the inlet buffer on the first transport path is set to or less than the number that the outlet buffer can accommodate minus 1, thereby preventing substrates that have completed exposure processing from overflowing from the common outlet buffer and reducing the number of substrates that have to wait for transport.

[0029] In particular, according to the substrate processing method of the twelfth aspect, the first substrate of the lot is transported along the relatively long second transport path, thereby suppressing variation in the elapsed time from exposure processing to development processing for multiple substrates included in the lot. [Brief description of the drawings]

[0030] [Figure 1] 1 is a schematic diagram showing an example of an overall configuration of a substrate processing apparatus according to the present invention; [Diagram 2] FIG. 2 is a block diagram showing a configuration of a control unit. [Diagram 3] FIG. 2 illustrates an example of a configuration of an interface unit. [Figure 4] FIG. 2 is a diagram showing an example of a stacked arrangement of modules. [Diagram 5] 4 is a diagram showing a transport path for transporting a substrate to both a first exposure apparatus and a second exposure apparatus in the interface section of FIG. 3. [Figure 6] 4 is a diagram showing a transport path for transporting the substrate only to the first exposure device in the interface section of FIG. 3. [Figure 7] 4 is a diagram showing a transport path for transporting the substrate only to the second exposure device in the interface section of FIG. 3. [Figure 8]FIG. 13 is a diagram illustrating another example of the configuration of the interface unit. [Figure 9] 9 is a diagram showing a transport path for transporting a substrate to both the first exposure apparatus and the second exposure apparatus in the interface section of FIG. 8. [Figure 10] 9 is a diagram showing a transport path for transporting the substrate only to the first exposure device in the interface section of FIG. 8. FIG. [Figure 11] 9 is a diagram showing a transport path for transporting the substrate only to the second exposure device in the interface section of FIG. 8. FIG. [Figure 12] FIG. 13 is a diagram illustrating an extension of a processing time of a module included in a short transport path. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0031] Hereinafter, the embodiments of the present invention will be described in detail with reference to the drawings. In the following, expressions indicating relative or absolute positional relationships (e.g., "in one direction," "along one direction," "parallel," "orthogonal," "center," "concentric," "coaxial," etc.) not only strictly indicate the positional relationship, but also indicate a state in which the relative angle or distance is displaced within a range in which a tolerance or similar function is obtained, unless otherwise specified. Furthermore, expressions indicating an equal state (e.g., "same," "equal," "homogeneous," etc.) not only indicate a state in which the relative position is strictly equal quantitatively, but also indicate a state in which there is a difference in which a tolerance or similar function is obtained, unless otherwise specified. Furthermore, expressions indicating a shape (e.g., "circular," "square," "cylindrical," etc.) not only indicate a geometrically strict shape, but also indicate a shape within a range in which a similar effect is obtained, and may have, for example, unevenness or chamfering. Furthermore, each expression such as "comprises," "includes," "has," "includes," and "has" for a component is not an exclusive expression that excludes the presence of other components. In addition, the expression "at least one of A, B, and C" includes "A only," "B only," "C only," "any two of A, B, and C," and "all of A, B, and C."

[0032] First Embodiment <1-1. Overall configuration of substrate processing apparatus> FIG. 1 is a schematic diagram showing an example of the overall configuration of a substrate processing apparatus 1 according to the present invention. The substrate processing apparatus 1 is an apparatus that performs a pre-processing of an exposure process on a substrate G and a post-processing of the exposure process. The pre-processing of the exposure process includes, for example, cleaning, application of a processing liquid, drying of the processing liquid, and formation of a coating film by heating. On the other hand, the post-processing of the exposure process includes development, drying by heating after development, and cooling. The substrate G to be processed is, for example, a flat glass substrate. The substrate G has a first surface (also called an upper surface) as a first main surface, and a second surface (also called a lower surface) as a second main surface opposite to the first surface. In FIG. 1 and the following figures, the dimensions and numbers of each part are exaggerated or simplified as necessary for easy understanding.

[0033] An indexer apparatus 2 is connected to one end of the substrate processing apparatus 1, and a first exposure apparatus 3a and a second exposure apparatus 3b are connected to the other end. That is, in this embodiment, two exposure apparatuses 3a and 3b are connected to one line of the substrate processing apparatus 1. When there is no particular need to distinguish between the first exposure apparatus 3a and the second exposure apparatus 3b, they are collectively referred to simply as the exposure apparatus 3.

[0034] The substrate processing apparatus 1 includes a pre-processing section 11 which performs processing before the exposure processing, a post-processing section 12 which performs processing after the exposure processing, and an interface section 20. In the transport path of the substrate G in the entire substrate processing apparatus 1, the pre-processing section 11 forms an outgoing path section from the indexer apparatus 2 to the interface section 20. On the other hand, the post-processing section 12 forms a return path section from the interface section 20 to the indexer apparatus 2. Note that a first interface section 20a and a second interface section 20b, which will be described later, are collectively referred to simply as the interface section 20.

[0035] The indexer device 2 has a mounting table on which a cassette containing a plurality of substrates G is mounted, and a transfer mechanism for transferring the substrates G. As the transfer mechanism, for example, a transfer robot for transferring the substrates G between the cassette on the mounting table and the pre-processing section 11 and the post-processing section 12 is applied. The transfer mechanism takes out the unprocessed substrates G from the cassette on the mounting table and passes it to the pre-processing section 11. The transfer mechanism also receives the processed substrates G from the post-processing section 12 and stores them in the cassette.

[0036] The pre-treatment section 11 has a cleaning section 111, a coating section 112, a reduced pressure drying section 113, and a pre-baking section 114 as a plurality of treatment sections. The treatment sections of the pre-treatment section 11 are arranged in the order of the treatment sections described above. The substrate G is transported by a transport robot, a conveyor, or the like to each treatment section in the order of the treatment sections described above as the treatment progresses, as indicated by the arrows drawn with two-dot chain lines in FIG. 1 .

[0037] The cleaning section 111 performs a cleaning process on the substrate G carried in from the indexer device 2. The cleaning process includes, for example, a process of removing fine particles, organic contamination, metal contamination, oil and grease, natural oxide films, and the like. In the cleaning section 111, for example, removal of organic matter adhering to the surface of the substrate G by irradiation with ultraviolet light, cleaning of the surface of the substrate G by supplying a cleaning liquid such as deionized water and using a cleaning member such as a brush, and drying of the substrate G by a blower or the like are performed. Drying of the substrate G by a blower or the like includes, for example, removal of the cleaning liquid from the substrate G by an air knife, and the like.

[0038] The coating unit 112 coats the substrate G cleaned by the cleaning unit 111 with the treatment liquid. For example, a slit coater is used for the coating unit 112. The slit coater can coat the substrate G with the treatment liquid by moving a slit nozzle, which discharges the treatment liquid from a discharge port, relative to the substrate G. Here, in the coating unit 112, in an area (also called a coating area) where the treatment liquid is applied onto the substrate G, the substrate G is transported horizontally with a floating transport mechanism in a posture (also called a horizontal posture) in which the upper and lower surfaces are aligned in the horizontal direction. The floating transport mechanism supports or holds both end portions of the substrate G in the width direction perpendicular to the transport direction (also called the substrate transport direction) from below, and blows compressed air from below toward the substrate G to move the substrate G in the horizontal direction while holding the substrate G with the upper and lower surfaces aligned in the horizontal direction. In the coating section 112, for example, the substrate G is transported by a conveyor in each of a portion located on the upstream side of the coating area (also referred to as an entrance side portion) and a portion located on the downstream side of the coating area (also referred to as an exit side portion). The conveyor moves the substrate G in a horizontal position in the horizontal direction by rotating a plurality of rollers arranged along the substrate transport direction of the substrate G by a drive mechanism (not shown). Coating devices using other coating methods may be applied to the coating section 112.

[0039] The processing liquid applied by the application unit 112 is, for example, a liquid for application (also called application liquid), such as a resist liquid or a liquid containing a polyimide precursor and a solvent (also called PI liquid). For example, polyamic acid is applied as the polyimide precursor. For example, NMP (N-Methyl-2-Pyrrolidone) is applied as the solvent.

[0040] The reduced pressure drying section 113 performs a process (also referred to as a reduced pressure drying process) of drying the processing liquid applied onto the substrate G by reducing the pressure. Here, the solvent of the processing liquid applied onto the surface of the substrate G is vaporized (evaporated) by reducing the pressure, thereby drying the substrate G.

[0041] The pre-baking section 114 heats the substrate G dried in the reduced pressure drying section 113, and solidifies the components contained in the treatment liquid on the surface of the substrate G. As a result, a film related to the treatment liquid is formed on the substrate G. For example, when the treatment liquid is a resist, a heat treatment is applied to the coating film of the resist to form a resist film. For example, when the treatment liquid is a polyimide precursor, a heat treatment is applied to the coating film of the polyimide precursor to form a polyimide film by imidizing the polyimide precursor. The pre-baking section 114 may be a sheet-type heat processing section that heats a single substrate G, or a batch-type heat processing section that heats multiple substrates G collectively. Here, the processing time of the reduced pressure drying process in the reduced pressure drying section 113 and the processing time of the heat processing in the pre-baking section 114 are significantly different, and it is assumed that the pre-baking section 114 has a sheet-type heat processing section. In this case, the pre-baking section 114 may have, for example, multiple sheet-type heat processing sections that perform heat processing in parallel. The multiple heat processing sections are arranged, for example, stacked vertically.

[0042] The interface unit 20 connects the pre-processing unit 11 and the post-processing unit 12 to the first exposure apparatus 3a and the second exposure apparatus 3b. The interface unit 20 transports the substrate G received from the pre-processing unit 11 to the first exposure apparatus 3a and / or the second exposure apparatus 3b. The interface unit 20 also transports the exposed substrate G received from the first exposure apparatus 3a and / or the second exposure apparatus 3b to the post-processing unit 12. The interface unit 20 includes a plurality of transport robots and a plurality of modules that transport the substrate G, and the detailed configuration of the interface unit 20 will be described later.

[0043] The first exposure device 3a and the second exposure device 3b perform an exposure process on the film related to the processing liquid formed on the substrate G in the pretreatment section 11. Specifically, the exposure device 3 irradiates light of a specific wavelength, such as far ultraviolet light, through a mask on which a circuit pattern is drawn, and transfers the pattern to the film related to the processing liquid. The exposure device 3 may include, for example, a peripheral exposure section and a titler. The peripheral exposure section is a section that performs an exposure process to remove the peripheral portion of the film related to the processing liquid on the substrate G. The titler section is, for example, a section that writes predetermined information on the substrate G. The peripheral exposure section and the titler section may have a turn mechanism that changes the orientation of the substrate G.

[0044] The post-treatment section 12 has a plurality of treatment sections, which are a developing section 121, a post-bake section 122, and a cooling section 123. The treatment sections in the post-treatment section 12 are arranged in the order of the treatment sections described above. The substrate G is transported by a transport robot or the like to each treatment section in the order of the treatment sections described above as the treatment progresses, as indicated by the arrows drawn by two-dot chain lines in FIG.

[0045] The developing unit 121 performs a developing process on the film associated with the processing liquid formed in the pretreatment unit 11. The developing process includes, for example, a process of developing the film associated with the processing liquid, a process of washing away the developing liquid, and a process of drying the substrate G. In the developing unit 121, for example, a process of immersing the film associated with the processing liquid on the substrate G on which a pattern has been exposed by the exposure device 3 in the developing liquid, a process of washing away the developing liquid on the substrate G with a cleaning liquid such as deionized water, and a process of drying the substrate G with a blower or the like are performed. Drying the substrate G with a blower or the like includes, for example, removing the cleaning liquid from the substrate G with an air knife.

[0046] The post-bake unit 122 heats the substrate G and evaporates the cleaning liquid that has adhered to the substrate G in the developing unit 121, thereby drying the substrate G.

[0047] The cooling section 123 cools the substrate G heated in the post-bake section 122. The cooling section 123 may be configured to air-cool the substrate G while transporting it by a conveyor, or may be configured to cool the substrate G by placing it on a shelf-like portion and blowing a gas such as air onto the substrate G. The substrate G cooled in the cooling section 123 is transported from the post-processing section 12 to the outside of the substrate processing apparatus 1 by the indexer apparatus 2.

[0048] The operation of each part of the substrate processing apparatus 1 is controlled by a control unit 90. Fig. 2 is a block diagram showing the configuration of the control unit 90. The hardware configuration of the control unit 90 is similar to that of a general computer. That is, the control unit 90 includes a CPU which is a circuit that performs various arithmetic processing, a ROM which is a read-only memory that stores basic programs, a RAM which is a readable and writable memory that stores various information, and a storage unit 94 (e.g., a magnetic disk or SSD) that stores control software, data, and the like. The CPU of the control unit 90 executes a predetermined processing program, whereby processing in the substrate processing apparatus 1 proceeds.

[0049] A processing recipe 95 that defines procedures and conditions for processing the substrate G is stored in the memory unit 94 of the control unit 90. The processing recipe 95 is acquired by the substrate processing apparatus 1, for example, by an operator of the apparatus inputting the processing recipe 95 via an input unit 92 (described later) and storing the processing recipe in the memory unit 94. Alternatively, the processing recipe 95 may be transferred by communication from a host computer that manages a plurality of substrate processing apparatuses 1 to the substrate processing apparatus 1 and stored in the memory unit 94.

[0050] The control unit 90 is electrically connected to elements such as a transfer robot provided in the interface unit 20, which will be described later. The control unit 90 controls the transfer robot and the like in accordance with the contents of a processing recipe 95, for example.

[0051] A display unit 93 and an input unit 92 are also connected to the control unit 90. The display unit 93 and the input unit 92 function as a user interface of the substrate processing apparatus 1. The control unit 90 displays various information on the display unit 93. An operator of the substrate processing apparatus 1 can input various commands and parameters from the input unit 92 while checking the information displayed on the display unit 93. For example, a keyboard or a mouse can be used as the input unit 92. For example, a liquid crystal display can be used as the display unit 93. In this embodiment, a liquid crystal touch panel provided on the outer wall of the substrate processing apparatus 1 is used as the display unit 93 and the input unit 92 to provide both functions.

[0052] <1-2. Configuration of the first interface unit> Fig. 3 is a diagram showing the configuration of the first interface unit 20a. The interface unit 20a includes a transport mechanism and a plurality of modules for transporting the substrate G. The interface unit 20a in Fig. 3 includes five transport robots (a first transport robot 31, a second transport robot 32, a third transport robot 33, a fourth transport robot 34, and a fifth transport robot 35) as the transport mechanism.

[0053] Each of the first transport robot 31, the second transport robot 32, the third transport robot 33, the fourth transport robot 34, and the fifth transport robot 35 can move a hand that holds the substrate G forward and backward, and can also perform a turning motion and a lifting motion. This allows each of the first transport robot 31, the second transport robot 32, the third transport robot 33, the fourth transport robot 34, and the fifth transport robot 35 to deliver the substrate G to and from the surrounding modules.

[0054] The first transport robot 31, the third transport robot 33, and the fourth transport robot 34 are single-handed robots having one hand to transport the substrate G. On the other hand, the second transport robot 32, which transports the substrate G to and from the first exposure apparatus 3a, and the fifth transport robot 35, which transports the substrate G to and from the second exposure apparatus 3b, are double-handed robots having two hands. This allows the second transport robot 32 and the fifth transport robot 35 to exchange the unexposed substrate G for the exposed substrate G for the first exposure apparatus 3a and the second exposure apparatus 3b, respectively.

[0055] The interface section 20a also has, as modules, a cooling plate 51, an edge exposure machine 52, a buffer 53, a first temperature regulator 55, a second temperature regulator 56, a first path 37, a second path 38, a third path 39, a first outpath 58, and a second outpath 59. The modules are elements provided in the interface section 20a that do not have the function of transporting the substrate G, and are also the smallest control units in the transport control within the interface section 20a. Strictly speaking, the control of the cooling plate 51 and the edge exposure machine 52 does not belong to the interface section 20a (the control of the cooling plate 51 belongs to the pre-bake section 114).

[0056] The cooling plate 51 is a plate equipped with a cooling mechanism such as a cooling water circulation mechanism or a Peltier element. The heated substrate G is placed on the cooling plate 51 to cool the substrate G. The edge exposure machine 52 exposes the peripheral portion of the substrate G on which a resist film or the like is formed by irradiating the peripheral portion with light.

[0057] The buffer 53 has multiple (e.g., 16) stacked shelves, each capable of storing one substrate G. Thus, the buffer 53 can store one or more substrates G. The buffer 53 functions as an inlet buffer provided upstream of the first exposure device 3a and the second exposure device 3b on the transport path of the substrate G.

[0058] The first temperature regulator 55 supplies gas whose temperature has been adjusted to a predetermined temperature to the substrate G to regulate the temperature of the substrate G. The second temperature regulator 56 has a similar configuration to the first temperature regulator 55. The first temperature regulator 55 and the second temperature regulator 56 regulate the temperature of the substrate G to, for example, 23° C., which is the standard temperature in a clean room.

[0059] Each of the first path 37, the second path 38, and the third path 39 is configured by stacking, for example, two stages of mounting tables on which one substrate G can be placed. Each of the first out-path 58 and the second out-path 59 is configured by stacking, for example, five stages of mounting tables on which one substrate G can be placed. Each of the first path 37, the second path 38, the third path 39, the first out-path 58, and the second out-path 59 is an element for transferring the substrate G between two transport robots. Each of the first out-path 58 and the second out-path 59 also functions as an output buffer provided downstream of the first exposure apparatus 3a and the second exposure apparatus 3b on the transport path of the substrate G.

[0060] Of the multiple modules provided in the interface section 20a, the first temperature regulator 55, the first path 37, and the first outpath 58 are stacked in three stages along the vertical direction. Fig. 4 is a diagram showing an example of a stacked arrangement of modules. In the stacked structure of Fig. 4, the first temperature regulator 55 is arranged in the upper stage, the first path 37 is arranged in the middle stage, and the first outpath 58 is arranged in the lower stage.

[0061] The upper first temperature regulator 55 includes a blower unit 61, a mounting table 62, and a drive mechanism 63. A plurality of support pins 65 are provided on the upper surface of the mounting table 62. One substrate G can be mounted on the mounting table 62. The drive mechanism 63 moves the mounting table 62 up and down along the vertical direction and rotates the mounting table 62 around an axis along the vertical direction. That is, the first temperature regulator 55 regulates the temperature of the substrate G and also functions as a turntable that rotates the substrate G in a horizontal plane. The blower unit 61 blows gas, the temperature of which is regulated to, for example, 23° C., toward the substrate G that is mounted on the mounting table 62 and raised to a predetermined temperature-regulated position by the drive mechanism 63. The first temperature regulator 55 is provided with an opening 64 through which the first transport robot 31 can insert and remove its hand. The first temperature regulator 55 is also provided with an opening on the front side along the direction perpendicular to the paper surface of FIG. 4, through which the second transport robot 32 can insert and remove its hand.

[0062] The middle first path 37 has two stacked mounting tables, each capable of supporting one substrate G. The lower first out-path 58 has five stacked mounting tables, each capable of supporting one substrate G. The first path 37 and the first out-path 58 are also provided with openings (not shown) through which the adjacent transport robot can insert and remove its hand.

[0063] Returning to FIG. 3, the second outpath 59 and the second path 38 are stacked in two tiers along the vertical direction. The second outpath 59 is arranged in the upper tier, and the second path 38 is arranged in the lower tier. The second temperature regulator 56 and the third path 39 are also stacked in two tiers along the vertical direction. The second temperature regulator 56 is arranged in the upper tier, and the third path 39 is arranged in the lower tier. The second temperature regulator 56 has a configuration similar to the above-mentioned first temperature regulator 55, and not only regulates the temperature of the substrate G, but also functions as a turntable that rotates the substrate G in a horizontal plane.

[0064] 3, a stacked structure including a cooling plate 51, a buffer 53, a first temperature regulator 55, a first path 37, and a first outpath 58 is arranged around the first transport robot 31. The first transport robot 31 transfers the substrate G to and from the cooling plate 51, the buffer 53, the first temperature regulator 55, and the first path 37. The first transport robot 31 can transfer the substrate G to and from any of a plurality of shelves formed in the buffer 53. The first transport robot 31 is mainly responsible for transporting substrates on the inlet side of the interface section 20a.

[0065] A stacked structure including a first temperature regulator 55, a first path 37, and a first outpath 58 is arranged around the second transport robot 32. The second transport robot 32 delivers the substrate G to and from the first temperature regulator 55, the first path 37, the first outpath 58, and the first exposure apparatus 3a. The second transport robot 32 is mainly responsible for delivering the substrate G to and from the first exposure apparatus 3a.

[0066] Around the third transport robot 33, there are arranged a first temperature regulator 55, a stacked structure of the first path 37 and the first out-path 58, a stacked structure of the second out-path 59 and the second path 38, and an edge exposure machine 52. The third transport robot 33 delivers and receives substrates G to and from the first path 37, the first out-path 58, the second out-path 59, the second path 38, and the edge exposure machine 52. The third transport robot 33 is mainly responsible for transporting substrates on the exit side of the interface section 20a.

[0067] Around the fourth transport robot 34, a stacked structure of the second outpath 59 and the second path 38 and a stacked structure of the second temperature regulator 56 and the third path 39 are arranged. The fourth transport robot 34 delivers the substrate G to and from the second outpath 59, the second path 38, the second temperature regulator 56, and the third path 39. The fourth transport robot 34 is responsible for relaying substrate transport in the interface section 20a.

[0068] A stacked structure including a second temperature regulator 56 and a third path 39 is arranged around the fifth transfer robot 35. The fifth transfer robot 35 transfers the substrate G to and from the second temperature regulator 56, the third path 39, and the second exposure device 3b. The fifth transfer robot 35 is mainly responsible for transferring the substrate G to and from the second exposure device 3b.

[0069] <1-3. Circuit board processing procedure> Next, a description will be given of a processing procedure for the substrate G in the substrate processing apparatus 1. First, a brief description will be given of the overall processing flow for the substrate G in the substrate processing apparatus 1.

[0070] The indexer apparatus 2 takes out an unprocessed substrate G stored in a cassette and places it in the cleaning section 111 of the pre-treatment section 11. The cleaning section 111 cleans the surface of the substrate G, for example, by supplying a cleaning liquid, and dries the cleaning liquid after cleaning. The substrate G cleaned in the cleaning section 111 is transported to the coating section 112. In this embodiment, the coating section 112 coats a resist liquid on the clean surface of the substrate G after cleaning.

[0071] The substrate G coated with the resist liquid is transported from the coating section 112 to the reduced pressure drying section 113. The reduced pressure drying section 113 dries the resist liquid coated on the substrate G under a reduced pressure atmosphere. Thereafter, the substrate G is further transported from the reduced pressure drying section 113 to a pre-bake section 114. The pre-bake section 114 heats the substrate G to bake the resist film on the surface of the substrate G.

[0072] The substrate G on which the resist film has been formed in the pre-treatment section 11 is transported to the first exposure apparatus 3a and / or the second exposure apparatus 3b in the interface section 20 for exposure processing. After the exposure processing, the substrate G is transported to the post-treatment section 12 in the interface section 20. The transportation of the substrate G in the interface section 20 will be described in further detail.

[0073] The developing section 121 of the post-treatment section 12 supplies a developing solution to the substrate G after the exposure treatment to perform a developing treatment of the resist film. The developing section 121 also washes away the developing solution from the substrate G and performs a process of drying the substrate G.

[0074] After the development process, the substrate G is transported from the development section 121 to the post-bake section 122. The post-bake section 122 heats the substrate G to evaporate and remove the developing solution and cleaning solution remaining on the substrate G. Thereafter, the substrate G is transported from the post-bake section 122 to the cooling section 123. The cooling section 123 cools the substrate G, whose temperature has been increased by being heated in the post-bake section 122. The substrate G cooled in the cooling section 123 is returned to the indexer apparatus 2, and is stored in a cassette by the indexer apparatus 2.

[0075] <1-4. Substrate transportation in the first interface section> Continuing with the description of the transportation of the substrate G in the interface unit 20a of Fig. 3. As modes of transportation of the substrate G in the first interface unit 20a, a double exposure processing mode in which each of the multiple substrates G is transported sequentially to both the first exposure apparatus 3a and the second exposure apparatus 3b to perform two overlapping exposure processes, and a single exposure processing mode in which the multiple substrates G are transported to either the first exposure apparatus 3a or the second exposure apparatus 3b to perform one exposure process are provided.

[0076] The control unit 90 selects either the double exposure processing mode or the single exposure processing mode. Specifically, the operator of the apparatus may specify the double exposure processing mode or the single exposure processing mode from the input unit 92, so that the control unit 90 selects the mode. Alternatively, the control unit 90 may select the mode according to the description of the processing recipe 95 (FIG. 2). Furthermore, the control unit 90 may select the mode according to an instruction from a host computer or the like. The double exposure processing mode is adopted, for example, when the first exposure apparatus 3a and the second exposure apparatus 3b perform multiple exposure processing on the same substrate G using different types of masks. On the other hand, the single exposure processing mode is adopted, for example, when the first exposure apparatus 3a and the second exposure apparatus 3b perform exposure processing at high throughput using the same type of mask. In the single exposure processing mode, multiple substrates G may be transported alternately to the first exposure apparatus 3a and the second exposure apparatus 3b.

[0077] First, the transportation of the substrate G when the double exposure processing mode is selected by the control unit 90 will be described. Fig. 5 is a diagram showing a transport path for transporting the substrate G to both the first exposure apparatus 3a and the second exposure apparatus 3b in the interface unit 20a of Fig. 3. The transport of the substrate G described below is realized by the control unit 90 controlling multiple transport robots in the interface unit 20a.

[0078] The substrate G, which has been heated in the pre-bake section 114 of the pre-treatment section 11 and has been raised in temperature, is first carried into the cooling plate 51 and cooled. The first transport robot 31 takes out the cooled substrate G from the cooling plate 51 and carries it into the buffer 53. The first transport robot 31 then takes out the substrate G from the buffer 53 and carries it into the first temperature regulator 55. It is not essential to carry the substrate into the buffer 53, and if the first temperature regulator 55 is available, the first transport robot 31 may carry the substrate G taken out of the cooling plate 51 directly into the first temperature regulator 55.

[0079] In the double exposure processing mode, the buffer 53 absorbs fluctuations in the processing time of the first exposure apparatus 3a and the second exposure apparatus 3b. The processing time of the first exposure apparatus 3a and the second exposure apparatus 3b is not necessarily constant. For example, the first exposure apparatus 3a and the second exposure apparatus 3b may perform self-maintenance irregularly, and at such times, the processing time may be long. In addition, the first exposure apparatus 3a and the second exposure apparatus 3b require a long time for alignment, especially for the first substrate G of a lot, which also lengthens the processing time. When the processing time of the first exposure apparatus 3a or the second exposure apparatus 3b becomes long, the substrate G on which the resist film is formed in the pretreatment section 11 is temporarily stored in the buffer 53, thereby preventing the processing in the pretreatment section 11 from stagnating. The buffer 53 has a number of shelves that can store all the substrates G that have been coated in the pretreatment section 11 even if the first exposure apparatus 3a or the second exposure apparatus 3b is stopped for a long time.

[0080] The first temperature regulator 55 accurately regulates the temperature of the substrate G to a predetermined temperature (e.g., 23° C.) immediately before the exposure process. The first temperature regulator 55 may rotate the orientation of the substrate G in a horizontal plane as necessary while regulating the temperature of the substrate G. The temperature-regulated substrate G is taken out of the first temperature regulator 55 by the second transport robot 32 and carried into the first exposure apparatus 3a. At this time, the second transport robot 32 takes out the preceding exposed substrate G from the first exposure apparatus 3a and carries in an unexposed substrate G into the first exposure apparatus 3a to perform substrate exchange.

[0081] The first exposure apparatus 3a performs an exposure process on the substrate G to transfer a pattern to the resist film. After the exposure process, the substrate G is carried out of the first exposure apparatus 3a by the second transport robot 32 and carried into the first path 37. Then, the third transport robot 33 carries the substrate G out of the first path 37 and carries it into the second path 38. Then, the fourth transport robot 34 carries the substrate G out of the second path 38 and carries it into the second temperature regulator 56.

[0082] The second temperature regulator 56 accurately regulates the temperature of the substrate G to a predetermined temperature immediately before the second exposure process. The second temperature regulator 56 may rotate the orientation of the substrate G in a horizontal plane as necessary while regulating the temperature of the substrate G. The temperature-regulated substrate G is taken out of the second temperature regulator 56 by the fifth transport robot 35 and carried into the second exposure apparatus 3b. At this time, the fifth transport robot 35 takes out the preceding exposed substrate G from the second exposure apparatus 3b and carries in an unexposed substrate G into the second exposure apparatus 3b to perform substrate exchange.

[0083] The second exposure apparatus 3b performs exposure processing on the substrate G using a mask different from that of the first exposure apparatus 3a to transfer a pattern to the resist film. That is, in the double exposure processing mode, different patterns are transferred to the substrate G in an overlapping manner. The substrate G after the exposure processing is carried out from the second exposure apparatus 3b by the fifth transport robot 35 and carried into the third path 39. Then, the fourth transport robot 34 carries out the substrate G from the third path 39 and carries it into the second outpath 59. Then, the third transport robot 33 carries out the substrate G from the second outpath 59 and carries it into the edge exposure machine 52. The second outpath 59 also functions as a buffer when the substrate G exposed by the second exposure apparatus 3b is carried out from the interface unit 20a. The edge exposure machine 52 performs exposure processing on the peripheral portion of the substrate G. Thereafter, the substrate G is carried out to the development unit 121 of the post-processing unit 12.

[0084] As described above, when the double exposure processing mode is selected, all of the substrates G are transported according to the same transport path and procedure. In the double exposure processing mode, each of the substrates G on which the resist film is formed is transported sequentially to both the first exposure apparatus 3a and the second exposure apparatus 3b and subjected to two exposure processes.

[0085] Next, the transportation of the substrate G when the single exposure processing mode is selected by the control unit 90 will be described. In the single exposure processing mode in which a plurality of substrates G are transported to only one of the first exposure apparatus 3a or the second exposure apparatus 3b, the route for transporting the substrate G to the first exposure apparatus 3a and the route for transporting the substrate G to the second exposure apparatus 3b are different. Therefore, first, the route for transporting the substrate G to the first exposure apparatus 3a will be described. FIG. 6 is a diagram showing a transport route for transporting the substrate G to only the first exposure apparatus 3a in the interface unit 20a of FIG. 3. As in the double exposure processing mode, the transport of the substrate G in the single exposure processing mode is also realized by the control unit 90 controlling the transport mechanism of the interface unit 20a.

[0086] The substrate G, which has been heated in the pre-bake section 114 of the pre-treatment section 11 and has been raised in temperature, is first carried into the cooling plate 51 and cooled. The first transport robot 31 takes out the cooled substrate G from the cooling plate 51 and carries it into the buffer 53. The first transport robot 31 then takes out the substrate G from the buffer 53 and carries it into the first temperature regulator 55. As described above, if the first temperature regulator 55 is available, the first transport robot 31 may carry the substrate G taken out of the cooling plate 51 directly into the first temperature regulator 55.

[0087] Even in the single exposure processing mode, the buffer 53 absorbs fluctuations in the processing time of the first exposure apparatus 3a and the second exposure apparatus 3b. That is, when the processing time of the first exposure apparatus 3a and the second exposure apparatus 3b becomes long, the buffer 53 temporarily stores the substrate G on which the resist film is formed in order to prevent the processing in the pre-processing unit 11 from stagnating.

[0088] The first temperature regulator 55 accurately regulates the temperature of the substrate G to a predetermined temperature immediately before the exposure process. The temperature-regulated substrate G is taken out of the first temperature regulator 55 by the second transport robot 32 and carried into the first exposure apparatus 3a.

[0089] The first exposure apparatus 3a performs an exposure process on the substrate G to transfer a pattern to the resist film. After the exposure process, the substrate G is taken out of the first exposure apparatus 3a by the second transport robot 32 and carried into the first outpath 58. Then, the third transport robot 33 takes the substrate G out of the first outpath 58 and carries it into the edge exposure machine 52. The first outpath 58 also functions as a buffer when the substrate G that has been exposed by the first exposure apparatus 3a is taken out of the interface unit 20a. The edge exposure machine 52 performs an exposure process on the peripheral portion of the substrate G. Thereafter, the substrate G is carried out to the development unit 121 of the post-processing unit 12.

[0090] Next, a description will be given of a route along which the substrate G is transported to the second exposure apparatus 3b. Fig. 7 is a diagram showing a transport route along which the substrate G is transported only to the second exposure apparatus 3b in the interface section 20a of Fig. 3.

[0091] The substrate G, which has been heated in the pre-bake section 114 of the pre-treatment section 11 and has an increased temperature, is first carried into the cooling plate 51 and cooled. The first transport robot 31 takes out the cooled substrate G from the cooling plate 51 and carries it into the buffer 53. Then, the first transport robot 31 carries the substrate G out of the buffer 53 and carries the substrate G into the first path 37.

[0092] Next, the third transport robot 33 carries the substrate G out of the first path 37 and into the second path 38. Then, the fourth transport robot 34 carries the substrate G out of the second path 38 and into the second temperature regulator 56.

[0093] The second temperature regulator 56 accurately regulates the temperature of the substrate G to a predetermined temperature immediately before the exposure process. The temperature-regulated substrate G is carried out of the second temperature regulator 56 by the fifth transfer robot 35 and carried into the second exposure device 3b.

[0094] The second exposure apparatus 3b performs an exposure process on the substrate G to transfer a pattern to the resist film. The substrate G after the exposure process is taken out of the second exposure apparatus 3b by the fifth transport robot 35 and transported into the third path 39. Then, the fourth transport robot 34 takes out the substrate G from the third path 39 and transports it into the second outpath 59. Then, the third transport robot 33 takes out the substrate G from the second outpath 59 and transports it into the edge exposure machine 52. The second outpath 59 also functions as a buffer when the substrate G exposed by the second exposure apparatus 3b is taken out of the interface unit 20a. The edge exposure machine 52 performs an exposure process on the peripheral portion of the substrate G. Thereafter, the substrate G is transported to the development unit 121 of the post-processing unit 12.

[0095] As described above, when the single exposure processing mode is selected, the transport path (FIG. 6) for transporting the substrate G to the first exposure apparatus 3a is different from the transport path (FIG. 7) for transporting the substrate G to the second exposure apparatus 3b. In the single exposure processing mode, each of the multiple substrates G on which a resist film is formed is transported to either the first exposure apparatus 3a or the second exposure apparatus 3b for one exposure process. If the same mask is used in the first exposure apparatus 3a and the second exposure apparatus 3b and the multiple substrates G are transported alternately to the first exposure apparatus 3a and the second exposure apparatus 3b, the throughput can be increased.

[0096] <1-5. Configuring the second interface> Fig. 8 is a diagram showing the configuration of the second interface unit 20b. In this figure, the same elements as those in Fig. 3 are given the same reference numerals. The second interface unit 20b includes a transport mechanism and a plurality of modules for transporting the substrate G. The interface unit 20b in Fig. 8 includes five transport robots (a first transport robot 31, a second transport robot 32, a third transport robot 33, a fourth transport robot 34, and a fifth transport robot 35) as a transport mechanism.

[0097] Each of the first transport robot 31, the second transport robot 32, the third transport robot 33, the fourth transport robot 34, and the fifth transport robot 35 is the same as the transport robot of the first embodiment. Therefore, each of the first transport robot 31, the second transport robot 32, the third transport robot 33, the fourth transport robot 34, and the fifth transport robot 35 can transfer the substrate G to and from the surrounding modules. In addition, the first transport robot 31, the third transport robot 33, and the fourth transport robot 34 are single-hand type robots having one hand. On the other hand, the second transport robot 32 that carries the substrate G into and out of the first exposure apparatus 3a and the fifth transport robot 35 that carries the substrate G into and out of the second exposure apparatus 3b are double-hand type robots having two hands.

[0098] The interface unit 20b has, as modules, a cooling plate 51, an edge exposure machine 52, a buffer 53, a first temperature regulator 55, a second temperature regulator 56, a first path 37, a second path 38, and an outpath 57. Among these, the same reference numerals as in FIG. 3 are the same elements as in the first interface unit 20a. The outpath 57, like the first outpath 58 (or the second outpath 59) in FIG. 3, is configured by stacking, for example, five stages of mounting tables on which one substrate G can be placed, and is an element for transferring the substrate G between two transport robots. The outpath 57 also functions as an exit buffer provided downstream of the first exposure device 3a and the second exposure device 3b in the transport path of the substrate G. As with the first interface unit 20a, strictly speaking, the control of the cooling plate 51 and the edge exposure machine 52 does not belong to the interface unit 20b.

[0099] Of the multiple modules provided in the interface section 20b, the first temperature regulator 55 and the first path 37 are stacked in two stages along the vertical direction. The first temperature regulator 55 is arranged in the upper stage, and the first path 37 is arranged in the lower stage. The second temperature regulator 56 and the second path 38 are also stacked in two stages along the vertical direction. The second temperature regulator 56 is arranged in the upper stage, and the second path 38 is arranged in the lower stage.

[0100] In this way, the second interface section 20b also includes elements (transport robots and modules) that are generally similar to those of the first interface section 20a. However, as shown in Fig. 8, the layout of each element in the second interface section 20b is different from that of the first interface section 20a. While the first exposure apparatus 3a and the second exposure apparatus 3b are arranged side-by-side in Fig. 3, the first exposure apparatus 3a and the second exposure apparatus 3b are spaced apart in Fig. 8. Accordingly, the layout of each element in the second interface section 20b is also different from that in Fig. 3.

[0101] When a plurality of substrate processing apparatuses 1 are arranged side by side in a factory, it is preferable to alternately provide the first interface unit 20a shown in FIG. 3 and the second interface unit 20b shown in FIG. 8. In this case, the first exposure apparatus 3a in the layout of FIG. 8 is disposed between the pre-processing unit 11 of a certain substrate processing apparatus 1 and the post-processing unit 12 of the substrate processing apparatus 1 disposed adjacent thereto. In addition, by disposing both interface units so that the free space PA (FIG. 3) at the corner of the first interface unit 20a and the free space PB (FIG. 8) at the corner of the second interface unit 20b mesh with each other, the space in the factory can be effectively utilized without waste. That is, by disposing both interface units so that the fifth transport robot 35 of the first interface unit 20a is located in the space PB and the second transport robot 32 of the second interface unit 20b is located in the space PA, the space utilization efficiency can be improved.

[0102] 8, in the second interface section 20b, a stacked structure of a cooling plate 51, a buffer 53, a first temperature regulator 55 and a first path 37, and a stacked structure of a second temperature regulator 56 and a second path 38 are arranged around the first transport robot 31. The first transport robot 31 delivers the substrate G to and from the cooling plate 51, the buffer 53, the first temperature regulator 55 and the second temperature regulator 56.

[0103] A stacked structure including a first temperature regulator 55 and a first path 37 is arranged around the second transport robot 32. The second transport robot 32 delivers the substrate G to and from the first temperature regulator 55, the first path 37, and the first exposure device 3a.

[0104] A buffer 53, an outpath 57, and an edge exposure machine 52 are arranged around the third transport robot 33. The third transport robot 33 delivers the substrate G to and from the outpath 57 and the edge exposure machine 52.

[0105] A stacked structure of a first temperature regulator 55 and a first path 37 and a stacked structure of a second temperature regulator 56 and a second path 38 are arranged around the fourth transport robot 34. The fourth transport robot 34 delivers the substrate G to and from the first path 37, the second temperature regulator 56, and the second path 38.

[0106] A stacked structure of the second temperature regulator 56 and the second path 38, a buffer 53, and an outpath 57 are arranged around the fifth transport robot 35. The fifth transport robot 35 delivers the substrate G to and from the second temperature regulator 56, the second path 38, the outpath 57, and the second exposure device 3b.

[0107] <1-6. Substrate transportation in the second interface section> Continuing with the description of the transport of the substrate G in the interface section 20b in Fig. 8. As transport modes of the substrate G in the second interface section 20b, a double exposure processing mode in which each of the multiple substrates G is transported sequentially to both the first exposure apparatus 3a and the second exposure apparatus 3b and subjected to two exposure processes, and a single exposure processing mode in which the multiple substrates G are transported to either the first exposure apparatus 3a or the second exposure apparatus 3b and subjected to one exposure process are prepared. Then, similarly to the above, the control section 90 selects either the double exposure processing mode or the single exposure processing mode.

[0108] Fig. 9 is a diagram showing a transport path for transporting the substrate G to both the first exposure apparatus 3a and the second exposure apparatus 3b in the interface section 20b in Fig. 8 (i.e., a transport path when the double exposure processing mode is selected). The transport of the substrate G described below is also realized by the control section 90 controlling the multiple transport robots in the interface section 20b.

[0109] The substrate G, which has been heated and heated in the pre-bake section 114 of the pre-treatment section 11, is first carried into the cooling plate 51 and cooled. The first transport robot 31 takes out the cooled substrate G from the cooling plate 51 and carries it into the buffer 53. Then, the first transport robot 31 takes out the substrate G from the buffer 53 and carries it into the first temperature regulator 55. As described above, in the double exposure processing mode, the buffer 53 plays a role in absorbing fluctuations in the processing time of the first exposure device 3a and the second exposure device 3b. Also, as described above, if the first temperature regulator 55 is available, the first transport robot 31 may directly carry the substrate G taken out of the cooling plate 51 into the first temperature regulator 55.

[0110] The first temperature regulator 55 accurately regulates the temperature of the substrate G to a predetermined temperature immediately before the exposure process. The first temperature regulator 55 may rotate the orientation of the substrate G in a horizontal plane as necessary while regulating the temperature of the substrate G. The temperature-regulated substrate G is taken out of the first temperature regulator 55 by the second transport robot 32 and carried into the first exposure apparatus 3a. At this time, the second transport robot 32 takes out the preceding exposed substrate G from the first exposure apparatus 3a and carries in an unexposed substrate G into the first exposure apparatus 3a to perform substrate exchange.

[0111] The first exposure apparatus 3a performs an exposure process on the substrate G to transfer a pattern to the resist film. After the exposure process, the substrate G is carried out of the first exposure apparatus 3a by the second transport robot 32 and carried into the first path 37. Then, the fourth transport robot 34 carries the substrate G out of the first path 37 and carries it into the second temperature regulator 56.

[0112] The second temperature regulator 56 accurately regulates the temperature of the substrate G to a predetermined temperature immediately before the second exposure process. The second temperature regulator 56 may rotate the orientation of the substrate G in a horizontal plane as necessary while regulating the temperature of the substrate G. The temperature-regulated substrate G is taken out of the second temperature regulator 56 by the fifth transport robot 35 and carried into the second exposure apparatus 3b. At this time, the fifth transport robot 35 takes out the preceding exposed substrate G from the second exposure apparatus 3b and carries in an unexposed substrate G into the second exposure apparatus 3b to perform substrate exchange.

[0113] The second exposure apparatus 3b performs an exposure process on the substrate G using a mask different from that of the first exposure apparatus 3a, and transfers a pattern to the resist film. After the exposure process, the substrate G is carried out of the second exposure apparatus 3b by the fifth transport robot 35 and carried into the outpath 57. Then, the third transport robot 33 carries out the substrate G from the outpath 57 and carries it into the edge exposure machine 52. The edge exposure machine 52 performs an exposure process on the peripheral portion of the substrate G. Thereafter, the substrate G is carried out to the developing unit 121 of the post-processing unit 12.

[0114] As described above, when the double exposure processing mode is selected, all the substrates G are transported according to the same transport path and procedure in the second interface section 20b as well. In the double exposure processing mode, each of the substrates G on which a resist film is formed is transported sequentially to both the first exposure apparatus 3a and the second exposure apparatus 3b and subjected to two exposure processes.

[0115] Next, the transportation of the substrate G when the single exposure processing mode is selected by the control unit 90 will be described. In the single exposure processing mode in which the multiple substrates G are transported to only one of the first exposure apparatus 3a or the second exposure apparatus 3b in the second interface unit 20b, the route for transporting the substrate G to the first exposure apparatus 3a and the route for transporting the substrate G to the second exposure apparatus 3b are different. Therefore, the route for transporting the substrate G to the first exposure apparatus 3a will be described first. FIG. 10 is a diagram showing the transport route for transporting the substrate G to only the first exposure apparatus 3a in the interface unit 20b in FIG. 8. As in the double exposure processing mode, the transport of the substrate G in the single exposure processing mode is also realized by the control unit 90 controlling the transport mechanism of the interface unit 20b.

[0116] The substrate G, which has been heated in the pre-bake section 114 of the pre-treatment section 11 and has been raised in temperature, is first carried into the cooling plate 51 and cooled. The first transport robot 31 takes out the cooled substrate G from the cooling plate 51 and carries it into the buffer 53. The first transport robot 31 then takes out the substrate G from the buffer 53 and carries it into the first temperature regulator 55. As described above, if the first temperature regulator 55 is available, the first transport robot 31 may carry the substrate G taken out of the cooling plate 51 directly into the first temperature regulator 55.

[0117] Even in the single exposure processing mode, the buffer 53 absorbs fluctuations in the processing time of the first exposure apparatus 3a and the second exposure apparatus 3b. That is, when the processing time of the first exposure apparatus 3a and the second exposure apparatus 3b becomes long, the buffer 53 temporarily stores the substrate G on which the resist film is formed in order to prevent the processing in the pre-processing unit 11 from stagnating.

[0118] The first temperature regulator 55 accurately regulates the temperature of the substrate G to a predetermined temperature immediately before the exposure process. The temperature-regulated substrate G is taken out of the first temperature regulator 55 by the second transport robot 32 and carried into the first exposure apparatus 3a.

[0119] The first exposure device 3a performs an exposure process on the substrate G to transfer a pattern to the resist film. The substrate G after the exposure process is taken out of the first exposure device 3a by the second transport robot 32 and carried into the first path 57. Then, the fourth transport robot 34 takes out the substrate G from the first path 37 and carries it into the second path 38. Then, the fifth transport robot 34 takes out the substrate G from the second path 38 and carries it into the outpath 57. Then, the third transport robot 33 takes out the substrate G from the outpath 57 and carries it into the edge exposure machine 52. The edge exposure machine 52 performs an exposure process on the peripheral portion of the substrate G. Then, the substrate G is carried out to the development unit 121 of the post-processing unit 12.

[0120] Next, a description will be given of a route along which the substrate G is transported to the second exposure apparatus 3b. Fig. 11 is a diagram showing a transport route along which the substrate G is transported only to the second exposure apparatus 3b in the interface section 20b of Fig. 8.

[0121] The substrate G, which has been heated in the pre-bake section 114 of the pre-treatment section 11 and has been raised in temperature, is first carried into the cooling plate 51 and cooled. The first transport robot 31 takes out the cooled substrate G from the cooling plate 51 and carries it into the buffer 53. The first transport robot 31 then takes out the substrate G from the buffer 53 and carries it into the second temperature regulator 56. As in the above, if the second temperature regulator 56 is empty, the first transport robot 31 may carry the substrate G taken out of the cooling plate 51 directly into the second temperature regulator 56.

[0122] The second temperature regulator 56 accurately regulates the temperature of the substrate G to a predetermined temperature immediately before the exposure process. The temperature-regulated substrate G is carried out of the second temperature regulator 56 by the fifth transfer robot 35 and carried into the second exposure device 3b.

[0123] The second exposure apparatus 3b performs an exposure process on the substrate G to transfer a pattern to the resist film. After the exposure process, the substrate G is carried out of the second exposure apparatus 3b by the fifth transport robot 35 and carried into the outpath 57. Then, the third transport robot 33 carries the substrate G out of the outpath 57 and carries it into the edge exposure machine 52. The edge exposure machine 52 performs an exposure process on the peripheral portion of the substrate G. Thereafter, the substrate G is carried out to the developing unit 121 of the post-processing unit 12.

[0124] As described above, in the second interface section 20b as well, when the single exposure processing mode is selected, the transport path (FIG. 10) for transporting the substrate G to the first exposure apparatus 3a is different from the transport path (FIG. 11) for transporting the substrate G to the second exposure apparatus 3b. In the single exposure processing mode, each of the multiple substrates G on which a resist film is formed is transported to either the first exposure apparatus 3a or the second exposure apparatus 3b and subjected to a single exposure process.

[0125] <1-7.Transport control> In the first interface section 20a, the second transport path (transport path shown in FIG. 7) that transports the substrate G from the pre-processing section 11 to the post-processing section 12 via the second exposure device 3b is longer than the first transport path (transport path shown in FIG. 6) that transports the substrate G from the pre-processing section 11 to the post-processing section 12 via the first exposure device 3a. That is, the first transport path via the first exposure device 3a is the short transport path, and the second transport path via the second exposure device 3b is the long transport path. Therefore, in the first interface section 20a, the time required to transport the substrate G along the second transport path is longer than the time required to transport the substrate G along the first transport path.

[0126] On the other hand, in the second interface section 20b, the second transport path (transport path shown in FIG. 11) that transports the substrate G from the pre-processing section 11 to the post-processing section 12 via the second exposure apparatus 3b is shorter than the first transport path (transport path shown in FIG. 10) that transports the substrate G from the pre-processing section 11 to the post-processing section 12 via the first exposure apparatus 3a. That is, the first transport path via the first exposure apparatus 3a is the long transport path, and the second transport path via the second exposure apparatus 3b is the short transport path. Therefore, in the second interface section 20b, the time required to transport the substrate G along the second transport path is shorter than the time required to transport the substrate G along the first transport path.

[0127] In the first embodiment, a plurality of substrates G included in a lot are alternately transported along the first transport path or the second transport path. A plurality of substrates G are sequentially input from the pretreatment section 11 to the interface section 20 at a constant interval. However, since the time required to transport the substrate G along the first transport path is different from the time required to transport the substrate G along the second transport path, the plurality of substrates G that are input into the interface section 20 at a constant interval are not output from the interface section 20 at the same interval as the input interval. If there is no significant variation in the processing time in the first exposure device 3a or the second exposure device 3b, the substrate G that is normally transported along the short transport path can be output from the interface section 20 in a shorter time than the substrate G that is transported along the long transport path. However, the substrate G is prohibited from overtaking the other substrates in the interface section 20. In other words, the substrate G that is input into the interface section 20 later and transported along the short transport path is not allowed to be output from the interface section 20 before the preceding substrate G that is transported along the long transport path. As a result, in the short transport path (the first transport path in the first interface section 20a, the second transport path in the second interface section 20b), the transport of the substrate G may be put into a waiting state in order to wait for the preceding substrate G being transported along the long transport path.

[0128] If the substrate G transported along the short transport path is in a transport standby state after the exposure process, the time from the exposure process to the development process may become uneven for each substrate, which may cause variations in the processing results. In addition, for example, in the first interface section 20a, if the third transport robot 33 is in a standby state while holding the substrate G transported along the first transport path, which is the short transport path, the third transport robot 33 will also be unable to transport the substrate G transported along the second transport path. In other words, the transport of the substrate G in the interface section 20 will come to a standstill.

[0129] For this reason, in the first embodiment, the control unit 90 extends the processing time of the substrate G in any of the modules included in the short transport path by a predetermined delay time. For example, in the case of the first interface unit 20a, the processing time of the substrate G in the first temperature regulator 55 included in the first transport path, which is the short transport path, is extended. FIG. 12 is a time chart that shows a schematic diagram of the processing time extension of the modules included in the short transport path. In the first interface unit 20a, the control unit 90 controls the processing time of the substrate G in the first temperature regulator 55, which is a module included in the first transport path, to be extended by a predetermined delay time (hatched portion in FIG. 12). Note that the processing in the first temperature regulator 55 is to supply a temperature-regulated gas to the substrate G to regulate the temperature of the substrate G, so that even if the processing time is extended, there is no risk of adversely affecting the processing result (rather, the effect of more uniform temperature regulation of the entire substrate G can be expected).

[0130] By extending the processing time of the substrate G in the first temperature regulator 55 by a predetermined delay time, the timing of inputting the substrate G transported along the first transport path into the first exposure device 3a is delayed, and further the timing of the substrate G reaching the first outpath 58 is delayed. This makes it possible to substantially uniform the timing from when the substrate G transported along the first transport path, which is the short transport path, is carried into the first interface unit 20a until it is carried out, and the timing from when the substrate G transported along the second transport path, which is the long transport path, is carried into the interface unit 20a until it is carried out. As a result, it is possible to reduce the waiting state in which the substrate G is transported along the first transport path, which is the short transport path, waits for the preceding substrate G transported along the second transport path, which is the long transport path.

[0131] In other words, it is preferable to set the above-mentioned predetermined delay time so that the elapsed time required for the substrate G to be transported along the first transport path, which is the short transport path, is equal to the elapsed time required for the substrate G to be transported along the second transport path, which is the long transport path. Note that, since the processing times of the first exposure device 3a and the second exposure device 3b frequently change, the time required for the substrate G to be transported along the short transport path is not limited to being completely equal to the time required for the substrate G to be transported along the long transport path.

[0132] In the first embodiment, the processing time of the substrate G in the first temperature regulator 55 included in the first transport path, which is the short transport path in the first interface unit 20a, is extended by a predetermined delay time. Therefore, while delaying the timing of introducing the substrate G into the first exposure device 3a, the time required for the substrate G to be transported along the first transport path and the time required for the substrate G to be transported along the second transport path can be made substantially uniform, and the transport of the substrate G in the first transport path can be reduced to a standby state. Then, by delaying the introduction timing of the substrate G into the first exposure device 3a while making substantially uniform the time required for the substrate G to be transported along the first transport path and the time required for the substrate G to be transported along the second transport path, the elapsed time from the exposure process to the development process for a plurality of substrates G can also be made substantially uniform. Note that, for the second interface unit 20b, the processing time of the substrate G in the second temperature regulator 56 included in the second transport path, which is the short transport path, may be extended by a predetermined delay time in the same manner as above. This can obtain the same effect as above.

[0133] <Second embodiment> Next, a second embodiment of the present invention will be described. The configurations of the substrate processing apparatus 1 and the interface unit 20 of the second embodiment are the same as those of the first embodiment. The procedure for processing one substrate G in the substrate processing apparatus 1 and the interface unit 20 of the second embodiment is also the same as that of the first embodiment. In the second embodiment, multiple substrates G included in a lot are alternately transported along the first transport path or the second transport path. The definitions of the first transport path and the second transport path are the same as those of the first embodiment.

[0134] In both the first interface section 20a and the second interface section 20b, the buffer 53 functions as an inlet buffer provided upstream of the first exposure apparatus 3a and the second exposure apparatus 3b along the transport path of the substrate G. Meanwhile, in the first interface section 20a, the first outpath 58 is provided downstream of the first exposure apparatus 3a along the first transport path, and functions as a first outlet buffer dedicated to the first exposure apparatus 3a. Also, the second outpath 59 is provided downstream of the second exposure apparatus 3b along the second transport path, and functions as a second outlet buffer dedicated to the second exposure apparatus 3b. Furthermore, in the second interface section 20b, the outpath 57 is provided downstream of the first exposure apparatus 3a and the second exposure apparatus 3b along both the first transport path and the second transport path, and functions as an outlet buffer common to the first exposure apparatus 3a and the second exposure apparatus 3b.

[0135] In the first interface section 20a, when multiple substrates G are alternately input into the first transport path or the second transport path, even if the second exposure device 3b on the long transport path side starts a long-term alignment process or the like and standby occurs in the second transport path, the transport of the substrate G along the first transport path continues. However, as described above, the substrate G is prohibited from overtaking in the first interface section 20a. In that case, the exposed substrate G overflows from the first outpath 58 of the first transport path, and there is no waiting place for the substrate G that has been exposed in the first exposure device 3a. If the second transport robot 32 waits while holding the exposed substrate G overflowing from the first outpath 58, the transport of the substrate G along the first transport path also goes into a standby state.

[0136] For this reason, in the second embodiment, the control unit 90 controls the first transport robot 31 so that the number of substrates G present downstream of the buffer 53, which is an inlet buffer, on the first transport path is equal to or less than the number that can be accommodated in the first outpath 58, which is a first outlet buffer. Specifically, if the first outpath 58 has mounting tables stacked in, for example, five stages, the number of substrates that can be accommodated in the first outpath 58 is five. In this case, the control unit 90 controls the first transport robot 31 to restrict the discharge of substrates G from the buffer 53 so that the number of substrates G present between the buffer 53 and the first outpath 58 on the first transport path is equal to or less than five.

[0137] In this way, even if a standby occurs in the second transport path, the exposed substrates G are prevented from overflowing from the first out-path 58 in the first transport path, and the standby state of the transport of the substrates G can be reduced. In addition to the above, the control unit 90 may control the first transport robot 31 to regulate the dispensing of the substrates G from the buffer 53 so that the number of substrates G present in the second transport path between the buffer 53 and the second out-path 59 is equal to or less than the number that the second out-path 59 can accommodate. However, in the second transport path, which is longer than the first transport path, the transport stop due to the exposed substrates G overflowing from the output buffer is relatively unlikely to occur. For this reason, the control unit 90 may control the first transport robot 31 to regulate the dispensing of the substrates G from the buffer 53 so that the number of substrates G present in at least the first transport path between the buffer 53 and the first out-path 58 is equal to or less than the number that the first out-path 58 can accommodate.

[0138] On the other hand, in the second interface unit 20b, when multiple substrates G are alternately input into the first transport path or the second transport path, even if the first exposure device 3a on the long transport path side starts a long-term alignment process or the like and causes a standby on the first transport path, the transport of the substrate G along the second transport path continues. Then, the substrate G that has been exposed by the second exposure device 3b overflows from the outpath 57, which is an output buffer common to the first transport path and the second transport path, and there is no place to store the substrate G that has been exposed by the first exposure device 3a. If the fifth transport robot 35 waits while holding the substrate G that has been exposed by the first exposure device 3a that has no place to store it, the fifth transport robot 35 cannot even dispense the substrate G that has been exposed by the second exposure device 3b. That is, the transport of the substrate G is in a standby state on both the first transport path and the second transport path.

[0139] For this reason, in the second embodiment, the control unit 90 controls the first transport robot 31 so that the number of substrates G present downstream of the buffer 53, which is an inlet buffer, on the second transport path, which is a short transport path, is equal to or less than the number that can be accommodated in the outpath 57, which is an outlet buffer, minus 1. Specifically, if the outpath 57 has mounting tables stacked in, for example, five stages, the number that can be accommodated in the outpath 57 is five, and the number obtained by subtracting 1 from this is four. Therefore, the control unit 90 controls the first transport robot 31 to restrict the dispensing of substrates G from the buffer 53 so that the number of substrates G present between the buffer 53 and the outpath 57 on the second transport path is four or less.

[0140] In this way, even if a wait occurs on the first transport path, the Outpath 57 is prevented from being overflown with substrates G that have been exposed in the second exposure apparatus 3b, and the number of substrates G that are waiting to be transported can be reduced. In the first interface unit 20a, the number of substrates G discharged from the buffer 53 is set to be equal to or less than the number that the first Outpath 58 can accommodate, whereas in the second interface unit 20b, the number is set to be equal to or less than the number that the Outpath 57 can accommodate minus one, for the following reason. While the first Outpath 58 is an output buffer dedicated to the first exposure apparatus 3a, the Outpath 57 is an output buffer common to both the first exposure apparatus 3a and the second exposure apparatus 3b, and therefore it is necessary to always leave one substrate G free to accommodate a substrate G that has been exposed in the first exposure apparatus 3a. In addition to the above, the control unit 90 may control the first transport robot 31 to restrict the dispensing of substrates G from the buffer 53 so that the number of substrates G present on the first transport path between the buffer 53 and the outpath 57 is equal to or less than the number of substrates G that can be accommodated in the outpath 57 minus 1. That is, the control unit 90 may control the first transport robot 31 to restrict the dispensing of substrates G from the buffer 53 so that at least the number of substrates G present on the second transport path between the buffer 53 and the outpath 57 is equal to or less than the number of substrates G that can be accommodated in the outpath 57 minus 1.

[0141] <Third embodiment> Next, a third embodiment of the present invention will be described. The configurations of the substrate processing apparatus 1 and the interface unit 20 of the third embodiment are the same as those of the first embodiment. The procedure for processing one substrate G in the substrate processing apparatus 1 and the interface unit 20 of the third embodiment is also the same as that of the first embodiment. In the third embodiment, multiple substrates G included in a lot are alternately transported along the first transport path or the second transport path. The definitions of the first transport path and the second transport path are the same as those of the first embodiment.

[0142] In both the first interface section 20a and the second interface section 20b, there is a difference in the path length between the first transport path and the second transport path. If the first substrate G in a lot is simply alternately assigned to the first transport path, the second substrate G to the second transport path, and the third substrate G to the first transport path, the first interface section 20a will transport the leading substrate G along the first transport path, which is a short transport path, and the second substrate G along the second transport path, which is a long transport path. In this case, only the leading substrate G will be delivered to the post-processing section 12 too early, and the difference in the elapsed time from the exposure process to the development process between the following substrates G will be large.

[0143] For this reason, in the third embodiment, the control unit 90 controls the first transport robot 31 to the fifth transport robot 35 so as to transport the leading substrate G of the lot along the long transport path. Specifically, in the first interface unit 20a, the control unit 90 controls so as to transport the leading substrate G of the lot along the second transport path, which is the long transport path. That is, in the first interface unit 20a, the leading substrate G of the lot is transported along the second transport path, and the second substrate G is transported along the first transport path. Also, in the second interface unit 20b, the control unit 90 controls so as to transport the leading substrate G of the lot along the first transport path, which is the long transport path. That is, in the second interface unit 20b, the leading substrate G of the lot is transported along the first transport path, and the second substrate G is transported along the second transport path.

[0144] In this manner, the second substrate G in the lot is released to the post-processing unit 12 in a relatively short time after the first substrate G in the lot is released to the post-processing unit 12, thereby suppressing variation in the elapsed time from exposure processing to development processing for multiple substrates G in a lot.

[0145] <Modification> Although the embodiment of the present invention has been described above, various modifications can be made to the present invention without departing from the spirit of the present invention. For example, in the first embodiment, the processing time of the substrate G in the first temperature regulator 55 (or the second temperature regulator 56) included in the short transport path is extended by a predetermined delay time, but this is not limited to this, and the processing time of the substrate G in other modules included in the short transport path may be extended by a predetermined delay time. This makes it possible to make the time required for the substrate G to be transported along the short transport path and the time required for the substrate G to be transported along the long transport path almost uniform, thereby reducing the waiting state of the transport of the substrate G on the short transport path.

[0146] Furthermore, the layout of the transport mechanism and modules in the interface section is not limited to the examples shown in Figs. 3 and 8. The interface section may be provided with a plurality of transport robots and a plurality of modules. The plurality of modules preferably includes an inlet buffer upstream of the first exposure apparatus 3a or the second exposure apparatus 3b and an outlet buffer downstream of the first exposure apparatus 3a or the second exposure apparatus 3b. To save space, it is preferable that some of the modules are stacked. The layout of the interface section may be changed as appropriate depending on the installation positions of the first exposure apparatus 3a and the second exposure apparatus 3b.

[0147] Furthermore, the configurations of the pre-treatment unit 11 and the post-treatment unit 12 are not limited to the example in FIG. 1. For example, an inspection unit or the like may be disposed between the cooling unit 123 and the indexer device 2. The inspection unit is a unit that inspects the substrate G using an optical member such as a camera. Furthermore, for example, a dehydration bake unit may be disposed between the cleaning unit 111 and the coating unit 112. The dehydration bake unit is a unit that heats the substrate G after cleaning to remove moisture. Alternatively, the post-baking unit 122 and the cooling unit 123 may be omitted.

[0148] Furthermore, as the substrate G to be processed, substrates other than glass substrates, such as semiconductor wafers, substrates for color filters, substrates for recording disks, substrates for solar cells, or other substrates for precision electronic devices may be adopted.

[0149] Furthermore, in each of the above embodiments, the substrate processing apparatus 1 may include the indexer apparatus 2, and may include the first exposure apparatus 3a and the second exposure apparatus 3b. [Explanation of symbols]

[0150] 1. Substrate Processing Equipment 2. Indexer device 3a First exposure device 3b Second exposure device 11 Pretreatment section 12 Post-processing section 20a, 20b Interface section 31 First Transport Robot 32 Second Transport Robot 33 Third Transport Robot 34 4th Transport Robot 35 5th Transport Robot 37 1st pass 38 2nd pass 39 3rd Pass 51 Cooling Plate 52 Edge exposure machine 53 Buffer 55 1st temperature controller 56 Second temperature controller 57 Outpass 57 58 1st outpass 59 2nd outpass 90 Control section 111 Cleaning section 112 Application section 113 Reduced pressure drying section 114 Pre-bake section 121 Development section 122 Post-bake section 123 Cooling section G board

Claims

1. A substrate processing apparatus which sequentially performs a pre-processing of an exposure process and a post-processing of an exposure process on a plurality of substrates included in a lot, A pre-processing unit that executes the pre-processing; A post-processing unit that executes the post-processing; an interface unit that connects the pre-processing unit and the post-processing unit with a first exposure apparatus and a second exposure apparatus, and that includes a plurality of transport robots and a plurality of modules that transport substrates; A control unit that controls the plurality of transfer robots and the plurality of modules; Equipped with a second transport path from the pre-treatment unit to the post-treatment unit via the second exposure device is longer than a first transport path from the pre-treatment unit to the post-treatment unit via the first exposure device, the plurality of substrates included in the lot are alternately transported along the first transport path or the second transport path; The control unit extends a processing time of the substrate in a specific module included in the first transport path by a predetermined delay time.

2. 2. The substrate processing apparatus according to claim 1, The substrate processing apparatus, wherein the delay time is set so that the elapsed time required for the substrate to be transported along the first transport path is equal to the elapsed time required for the substrate to be transported along the second transport path.

3. 3. The substrate processing apparatus according to claim 2, The specific module is a temperature control module for controlling the temperature of a substrate in the substrate processing apparatus.

4. 2. The substrate processing apparatus according to claim 1, the plurality of modules includes an inlet buffer provided upstream of the first exposure apparatus and the second exposure apparatus; the plurality of modules are provided on the first transport path downstream of the first exposure device, and include a first output buffer dedicated to the first exposure device; the plurality of modules are provided on the second transport path downstream of the second exposure device, and include a second output buffer dedicated to the second exposure device; The control unit controls the multiple transport robots so that the number of substrates present at least downstream of the inlet buffer on the first transport path is equal to or less than the capacity of the first outlet buffer.

5. 2. The substrate processing apparatus according to claim 1, the plurality of modules includes an inlet buffer provided upstream of the first exposure apparatus and the second exposure apparatus; the plurality of modules are provided downstream of the first exposure apparatus and the second exposure apparatus and include an output buffer common to the first exposure apparatus and the second exposure apparatus; The control unit controls the multiple transport robots so that the number of substrates present downstream of the input buffer on the first transport path is equal to or less than the number of substrates that can be accommodated in the output buffer minus one.

6. 2. The substrate processing apparatus according to claim 1, The control unit controls the plurality of transport robots to transport the leading substrate of the lot along the second transport path.

7. A substrate processing method for sequentially performing a pre-processing step of an exposure process and a post-processing step of the exposure process on a plurality of substrates included in a lot, comprising the steps of: a transport step of transporting the substrate that has been subjected to the pre-processing to the first exposure apparatus and / or the second exposure apparatus, and transporting the substrate that has been subjected to the exposure processing to the post-processing, in an interface unit that connects a pre-processing unit that performs the processing of the pre-processing and a post-processing unit that performs the processing of the post-processing to a first exposure apparatus and a second exposure apparatus, the interface unit includes a plurality of transfer robots and a plurality of modules for transferring substrates; a second transport path from the pre-treatment unit to the post-treatment unit via the second exposure device is longer than a first transport path from the pre-treatment unit to the post-treatment unit via the first exposure device, the plurality of substrates included in the lot are alternately transported along the first transport path or the second transport path; A substrate processing method comprising: extending a substrate processing time in a specific module included in the first transport path by a predetermined delay time.

8. 8. The substrate processing method according to claim 7, A substrate processing method, wherein the delay time is set so that an elapsed time required for the substrate to be transported along the first transport path is equal to an elapsed time required for the substrate to be transported along the second transport path.

9. 9. The substrate processing method according to claim 8, The specific module is a temperature control module that controls a temperature of the substrate.

10. 8. The substrate processing method according to claim 7, the plurality of modules includes an inlet buffer provided upstream of the first exposure apparatus and the second exposure apparatus; the plurality of modules are provided on the first transport path downstream of the first exposure device, and include a first output buffer dedicated to the first exposure device; the plurality of modules are provided on the second transport path downstream of the second exposure device, and include a second output buffer dedicated to the second exposure device; A substrate processing method comprising: making the number of substrates present at least downstream of the inlet buffer on the first transport path equal to or less than the maximum capacity of the first outlet buffer.

11. 8. The substrate processing method according to claim 7, the plurality of modules includes an inlet buffer provided upstream of the first exposure apparatus and the second exposure apparatus; the plurality of modules are provided downstream of the first exposure apparatus and the second exposure apparatus and include an output buffer common to the first exposure apparatus and the second exposure apparatus; A substrate processing method comprising: setting the number of substrates present at least downstream of the inlet buffer on the first transport path to a number equal to or less than the capacity of the outlet buffer minus one.

12. 8. The substrate processing method according to claim 7, The substrate processing method further comprises transporting the leading substrate of the lot along the second transport path.

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