Electronic components and manufacturing method thereof

Abstract

To provide a highly versatile electronic component that can prevent the disconnection of a conductor, and a manufacturing method thereof.SOLUTION: An electronic component includes a linear conductor and a first member in which the conductor is provided. In the electronic component, sinuous parts are provided in portions of the conductor that are subjected to bending or pressing work, the sinuous parts being not adjacent to each other in a drawing direction of the conductor.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present disclosure relates to electronic components and methods for manufacturing the same. [Background technology]

[0002] For example, Patent Document 1 discloses a heater unit (an example of an electronic component) that includes a linear heater element (an example of a conductor) and a substrate on which the heater element is provided. In this heater unit, a hole is provided in the portion of the substrate on which the heater element is provided so that the substrate and the heater element are not integrated. With this structure, if a tensile force or bending force is generated in the substrate when the heater unit is installed in a vehicle seat, the stress on the heater element is alleviated, and the heater element is prevented from breaking. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2018-73764 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, for some electronic components, drilling holes in the substrate is not preferable due to the structure, and therefore the structure of Patent Document 1 has a limited range of application and lacks versatility.

[0005] An object of one aspect of the present disclosure is to provide an electronic component that prevents conductor breakage and is highly versatile, and a method for manufacturing the electronic component. [Means for solving the problem]

[0006] An electronic component according to an embodiment of the present disclosure includes a linear conductor and a first member on which the conductor is provided, the first member including a first insulating layer and a first insulating layer formed on the first insulating layer. ChipThe portion to be processed is provided with curved portions that are not adjacent to each other in the extending direction of the conductor. Cage , The electronic component further includes a second member laminated on the first member, and the electronic component is a laminate having a three-dimensional pattern formed by press working performed on the first member and the second member in a laminated state. .

[0007] A method for manufacturing an electronic component according to an embodiment of the present disclosure includes a method for manufacturing an electronic component having a linear conductor and a first member on which the conductor is provided, the method comprising the steps of: Chip forming curved portions that are not adjacent to each other in the extending direction of the conductor in the portion to be processed; A second member is laminated on the first member provided with the conductor; The above The second member is laminated. With respect to the first member , so that a three-dimensional pattern is formed. It is processed with a leather-like finish. Effect of the Invention

[0008] According to the present disclosure, it is possible to prevent breakage of the conductor and achieve high versatility. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is an exploded perspective view showing an example of a configuration of an electronic component according to an embodiment of the present disclosure. [Diagram 2] FIG. 1 is a perspective view showing an example of a three-dimensional pattern according to an embodiment of the present disclosure; [Diagram 3] FIG. 13 is a front view showing an example of a positional relationship between a three-dimensional pattern and a curved portion according to an embodiment of the present disclosure; [Figure 4] FIG. 13 is an exploded perspective view showing an example of a configuration of an electronic component according to a third modification of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In addition, common components in the various drawings are denoted by the same reference numerals, and descriptions thereof will be omitted as appropriate.

[0011] First, the configuration of an electronic component 10 according to the present embodiment will be described with reference to Fig. 1. Fig. 1 is an exploded perspective view showing an example of the configuration of electronic component 10 according to the present embodiment.

[0012] As shown in FIG. 1, the electronic component 10 has a surface layer member 1, a first adhesive member 2, an insulating sheet 3, a heating wire 4, and a second adhesive member 5.

[0013] The surface layer member 1 corresponds to an example of the second member. The insulating sheet 3 corresponds to an example of the first member. The heating wire 4 corresponds to an example of a linear conductor (also called an electric conductor).

[0014] The surface layer member 1 is joined to the insulating sheet 3 via a first adhesive member 2. A heating wire 4 is provided on one surface of the insulating sheet 3 (the surface opposite to the surface joined to the first adhesive member 2). In FIG. 1, the insulating sheet 3 and the heating wire 4 are shown separately to make it easier to understand the shape of the heating wire 4, but in reality, the heating wire 4 is formed on the insulating sheet 3. A second adhesive member 5 is joined to one surface of the insulating sheet 3 (the surface on which the heating wire 4 is formed).

[0015] The surface layer member 1 is a member made of, for example, polyethylene terephthalate (PET).

[0016] The first adhesive member 2 is a member in which an acrylic adhesive is applied to both sides of a base material made of, for example, polyethylene (PE), polypropylene (PP), or nonwoven fabric. That is, the first adhesive member 2 functions as a double-sided tape.

[0017] The insulating sheet 3 is a member made of, for example, polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), or polycarbonate (PC).

[0018] Moreover, a metal layer (not shown) made of, for example, copper, stainless steel (SUS), or aluminum is provided on one surface of the insulating sheet 3 (the surface opposite to the surface to be bonded to the first adhesive member 2). This metal layer is etched to form the heating wire 4 in a predetermined pattern. The heating wire 4 generates heat when electricity is applied thereto, and functions as a heater.

[0019] The heating wire 4 also has a plurality of curved portions 6 formed in a curved shape. The curved portions 6 are formed in the heating wire 4 at portions that are to be press-processed (e.g., embossed) to form a three-dimensional pattern (described in detail below) on the electronic component 10. In other words, the curved portions 6 are formed in correspondence with the positions of the three-dimensional pattern to be formed on the electronic component 10 (described in detail below). The curved shape may also be referred to as an arc shape.

[0020] In the present embodiment, the case where the heating wire 4 is used has been described as an example, but the present invention is not limited to this. For example, a PTC (positive temperature coefficient heater) heater may be used instead of the heating wire 4.

[0021] The second adhesive member 5 is a member in which an acrylic adhesive is applied to one surface (the surface to be joined with the insulating sheet 3) of a base material made of, for example, polyethylene (PE) or nonwoven fabric, and a PET sheet is provided on the other surface (the surface opposite to the surface to be joined with the insulating sheet 3) of the base material. That is, the second adhesive member 5 functions as a single-sided tape.

[0022] In the present embodiment, the shape of each member constituting electronic component 10 is circular, but this is not limiting. Furthermore, the materials of each member constituting electronic component 10 are not limited to the above examples.

[0023] The electronic component 10 is formed as a laminate by stacking the above-mentioned surface layer member 1, first adhesive member 2, insulating sheet 3, heating wire 4, and second adhesive member 5. Then, by embossing the electronic component 10 (also called embossing or convex processing), for example, a three-dimensional pattern 7 as shown in FIG.

[0024] Fig. 2 is a perspective view showing an example of a three-dimensional pattern 7 formed on an electronic component 10. Note that in Fig. 2, illustration of components of the electronic component 10 other than the surface layer member 1 is omitted.

[0025] As shown in Fig. 2, a three-dimensional pattern 7 representing the alphabet "C" is formed by embossing on the surface of the surface layer member 1. Note that the three-dimensional pattern 7 shown in Fig. 2 is only an example, and is not limiting.

[0026] In the present embodiment, the embossing process is taken as an example of the press process for forming the three-dimensional pattern 7, but the present invention is not limited to this example. For example, the three-dimensional pattern 7 may be formed by debossing (recess processing).

[0027] The above-mentioned three-dimensional pattern 7 is formed corresponding to the positions of the curved portions 6 included in the heating wire 4. In other words, each curved portion 6 is formed corresponding to the position of the three-dimensional pattern 7.

[0028] Fig. 3 is a front view showing a schematic example of the positional relationship between the three-dimensional pattern 7 and the curved portion 6. As shown in Fig. 3, the curved portion 6 is formed so as to overlap the outer edge of the three-dimensional pattern 7. In other words, the portion of the heating wire 4 that overlaps with the outer edge of the three-dimensional pattern 7 is formed in a curved shape. Note that, as shown in Fig. 3, it is preferable that the curved portion 6 is formed so that the outer edge of the three-dimensional pattern 7 overlaps with its top portion.

[0029] Furthermore, the curved portions 6 are not provided consecutively (adjacent to each other) in the extension direction of the heating wire 4. That is, as shown in Fig. 3, a straight portion extending horizontally (left and right direction in the figure) is included between two curved portions 6. Therefore, the curved portions 6 provided along the extension direction of the heating wire 4 do not form a zigzag (bellows) shape.

[0030] The electronic component 10 on which the three-dimensional pattern 7 is formed is used, for example, as an emblem (also called an ornament) to be mounted on a vehicle. In this case, the electronic component 10 is disposed, for example, in front of a detection device 20 mounted on the vehicle (see FIG. 1). At this time, the electronic component 10 is disposed so that the three-dimensional pattern 7 faces the forward direction of the vehicle (so that the surface layer member 1 is positioned at the forefront).

[0031] 1 is a device that detects the surroundings of a vehicle. As the detection device 20, for example, a millimeter wave radar or a laser radar can be used, but is not limited to these.

[0032] As described above, when the electronic component 10 is disposed in front of the detection device 20, each member constituting the electronic component 10 only needs to be made of a material that transmits light or electromagnetic waves, etc., emitted from the detection device 20.

[0033] In the present embodiment, the case where the first adhesive member 2 is used to join the surface layer member 1 and the insulating sheet 3 has been described as an example, but the present invention is not limited thereto. For example, a fastener (e.g., a screw, a bolt, a nut, etc.) may be used instead of the first adhesive member 2. Or, for example, the surface layer member 1 may have a structure into which the insulating sheet 3 is fitted. Similarly, a PET sheet may be joined to the insulating sheet 3 using the fastener instead of the second adhesive member 5. Or, for example, the insulating sheet 3 may have a structure into which the PET sheet is fitted.

[0034] The configuration of electronic component 10 according to the present embodiment has been described above.

[0035] Next, a method for manufacturing the electronic component 10 will be described below.

[0036] First, the metal layer of the insulating sheet 3 is etched to form the heating wire 4. At this time, the portion of the heating wire 4 to be pressed (e.g., embossed) is formed into a curved shape. As a result, the heating wire 4 has a plurality of curved portions 6 as shown in Figs. 1 and 3.

[0037] Next, as shown in FIG. 1, the surface layer member 1, the first adhesive member 2, the insulating sheet 3, and the second adhesive member 5 are arranged and laminated.

[0038] Next, the formed laminate (electronic component 10) is subjected to a press working so as to form the three-dimensional pattern 7. As a result, the three-dimensional pattern 7 shown in FIG.

[0039] The method for manufacturing the electronic component 10 has been described above.

[0040] As described above, in the electronic component 10 of this embodiment, curved portions 6 that are not adjacent to each other in the extension direction of the heating wire 4 are formed in the portion of the heating wire 4 that is subjected to press processing. This makes it possible to reduce the stress on the heating wire 4 during press processing and prevent breakage of the heating wire 4. In addition, since there is no need to drill holes in the insulating sheet 3, this embodiment can be applied to a wide variety of electronic components. Therefore, this embodiment can prevent breakage of the conductor and achieve high versatility.

[0041] Moreover, the electronic component 10 of the present embodiment can be heated by the heat generated by the heating wire 4. This makes it possible to remove moisture attached to the electronic component 10 or prevent moisture from adhering to the electronic component 10. This makes it possible to further improve the transparency of light, electromagnetic waves, or the like sent out from the detection device 20.

[0042] The present disclosure is not limited to the above-described embodiment, and various modifications are possible without departing from the spirit of the present disclosure. Modifications will be described below.

[0043] [Variation 1] The pattern of the heating wire 4 is not limited to the embodiment shown in Fig. 3. Furthermore, the positions, number, size and curvature of the curved portions 6 are not limited to the embodiment shown in Fig. 3.

[0044] [Variation 2] In the embodiment, the electronic component 10 is used as an emblem for a vehicle, but the electronic component 10 is not limited to this.

[0045] For example, the electronic component 10 may be attached to a window glass of a vehicle and used as a sticker-type planar heating element for heating the window glass, thereby realizing defrosting or defogging of the window glass.

[0046] [Variation 3] In the embodiment, the electronic component 10 is a laminate, but is not limited to this. Also, in the embodiment, the electronic component 10 is a pressed electronic component, but is not limited to this.

[0047] Hereinafter, the electronic component 30 of this modified example will be described with reference to Fig. 4. Fig. 4 is a perspective view showing an example of the configuration of the electronic component 30 of this modified example.

[0048] 4, electronic component 30 has a flexible substrate 8 (corresponding to an example of a first member), an IC chip 9, and a copper foil wire 11 (corresponding to an example of a conductor). IC chip 9 and copper foil wire 11 are provided on flexible substrate 8. Copper foil wire 11 is electrically connected to IC chip 9.

[0049] The copper foil wire 11 has a curved portion 13 formed in a curved shape. The curved portion 13 is provided at the position of a bent portion 12 of the flexible substrate 8. The bent portion 12 is a portion where the flexible substrate 8 on which the copper foil wire 11 is provided is bent.

[0050] In this way, by forming the copper foil wire 11 located at the bent portion 12 into a curved shape before bending, the stress on the copper foil wire 11 during bending can be relaxed, and breakage of the copper foil wire 11 can be prevented. In addition, since there is no need to drill holes in the flexible substrate 8, the present modification can be applied to a wide variety of electronic components. Thus, like the embodiment, this modification can prevent breakage of the conductor and achieve high versatility.

[0051] In this modification, the copper foil wire 11 is given as an example of the conductor, but the conductor is not limited thereto. For example, the conductor may be a lead wire.

[0052] The above-described modified examples may be implemented in any combination. [Industrial Applicability]

[0053] The electronic component and the manufacturing method thereof disclosed herein are useful for an electronic component in which a linear conductor is provided on a member and subjected to bending or pressing, and for a manufacturing method thereof. [Explanation of symbols]

[0054] 1 Surface materials 2 First adhesive member 3. Insulation sheet 4 heating wire 5 Second adhesive member 6, 13 Curved section 7. Three-dimensional patterns 8 Flexible Boards 9. IC Chip 10, 30 Electronic Components 11 Copper foil wire 12 Bending section 20. Detection Devices

Claims

1. An electronic component having a linear conductor and a first member on which the conductor is provided, a portion of the conductor that is subjected to press working is provided with curved portions that are not adjacent to each other in an extension direction of the conductor; The laminate further includes a second member laminated on the first member, The electronic component includes: A laminate in which a three-dimensional pattern is formed by press working performed in a state in which the first member and the second member are laminated. Electronic components.

2. The curved portion is formed so as to overlap an outer edge portion of the three-dimensional pattern. The electronic component according to claim 1 .

3. The curved portion is formed so that an outer edge portion of the three-dimensional pattern overlaps with a top portion of the curved portion. The electronic component according to claim 2 .

4. The conductor is a heating wire that generates heat when electricity is passed through it. The electronic component according to claim 1 .

5. The pressing is embossing. The electronic component according to claim 1 .

6. The electronic component includes: An emblem to be installed on a vehicle. The electronic component according to claim 1 .

7. The electronic component includes: Located in front of a detection device that detects the situation around the vehicle, The electronic component according to claim 1 .

8. A method for manufacturing an electronic component having a linear conductor and a first member on which the conductor is provided, comprising the steps of: forming curved portions that are not adjacent to each other in an extending direction of the conductor in a portion of the conductor that is to be subjected to press working; A second member is laminated on the first member provided with the conductor; The first member on which the second member is laminated is subjected to a press working so as to form a three-dimensional pattern; A method for manufacturing electronic components.

9. The curved portion is formed so as to overlap an outer edge portion of the three-dimensional pattern. The method for manufacturing an electronic component according to claim 8 .

10. The curved portion is formed so that an outer edge portion of the three-dimensional pattern overlaps with a top portion of the curved portion. The method for manufacturing an electronic component according to claim 9 .

11. The conductor is a heating wire that generates heat when electricity is passed through it. The method for manufacturing an electronic component according to any one of claims 8 to 10.

12. The pressing is embossing. The method for manufacturing an electronic component according to any one of claims 8 to 11.

13. The electronic component includes: An emblem to be installed on a vehicle. The method for manufacturing an electronic component according to any one of claims 8 to 12.

14. The electronic component includes: Located in front of a detection device that detects the situation around the vehicle, The method for manufacturing an electronic component according to any one of claims 8 to 13.

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