Electronic components and manufacturing method thereof

Abstract

To provide a highly versatile electronic component that can prevent the disconnection of a conductor, and a manufacturing method thereof.SOLUTION: An electronic component includes a linear conductor and a first member in which the conductor is provided, and further includes a second member which is provided with a thick line part thicker than other portions in portions of the conductor that are subjected to bending or pressing work to form a three-dimensional pattern on the electronic component, the second member being stacked on the first member. The electronic component is a stacked body on which a three-dimensional pattern is formed by pressing work in a state where the first member and the second member are stacked.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present disclosure relates to electronic components and methods for manufacturing the same. [Background technology]

[0002] For example, Patent Document 1 discloses a heater unit (an example of an electronic component) that includes a linear heater element (an example of a conductor) and a substrate on which the heater element is provided. In this heater unit, a hole is provided in the portion of the substrate on which the heater element is provided so that the substrate and the heater element are not integrated. With this structure, if a tensile force or bending force is generated in the substrate when the heater unit is installed in a vehicle seat, the stress on the heater element is alleviated, and the heater element is prevented from breaking. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2018-73764 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, for some electronic components, drilling holes in the substrate is not preferable due to the structure, and therefore the structure of Patent Document 1 has a limited range of application and lacks versatility.

[0005] An object of one aspect of the present disclosure is to provide an electronic component that prevents conductor breakage and is highly versatile, and a method for manufacturing the electronic component. [Means for solving the problem]

[0006] An electronic component according to an embodiment of the present disclosure includes a linear conductor and a first member on which the conductor is provided, the first member including a first insulating layer and a first insulating layer formed on the first insulating layer. ChipThe area where the processing is to be performed has a thicker line than the other areas. Cage , The electronic component further includes a second member laminated on the first member, and the electronic component is a laminate having a three-dimensional pattern formed by press working performed on the first member and the second member in a laminated state. .

[0007] A method for manufacturing an electronic component according to an embodiment of the present disclosure includes a method for manufacturing an electronic component having a linear conductor and a first member on which the conductor is provided, the method comprising the steps of: Chip In the area where the processing is to be performed, a thicker line is formed than in other areas. A second member is laminated on the first member provided with the conductor; The above The second member is laminated. With respect to the first member , so that a three-dimensional pattern is formed. It is processed with a leather-like finish. Effect of the Invention

[0008] According to the present disclosure, it is possible to prevent breakage of the conductor and achieve high versatility. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is an exploded perspective view showing an example of a configuration of an electronic component according to an embodiment of the present disclosure. [Diagram 2] FIG. 1 is a perspective view showing an example of a three-dimensional pattern according to an embodiment of the present disclosure; [Diagram 3] FIG. 13 is a front view showing an example of a positional relationship between a three-dimensional pattern and a thick line portion according to an embodiment of the present disclosure; [Figure 4] FIG. 13 is an exploded perspective view showing an example of a configuration of an electronic component according to a third modification of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In addition, common components in the various drawings are denoted by the same reference numerals, and descriptions thereof will be omitted as appropriate.

[0011] First, the configuration of an electronic component 10 according to the present embodiment will be described with reference to Fig. 1. Fig. 1 is an exploded perspective view showing an example of the configuration of electronic component 10 according to the present embodiment.

[0012] As shown in FIG. 1, the electronic component 10 has a surface layer member 1, a first adhesive member 2, an insulating sheet 3, a heating wire 4, and a second adhesive member 5.

[0013] The surface layer member 1 corresponds to an example of the second member. The insulating sheet 3 corresponds to an example of the first member. The heating wire 4 corresponds to an example of a linear conductor (also called an electric conductor).

[0014] The surface layer member 1 is joined to the insulating sheet 3 via a first adhesive member 2. A heating wire 4 is provided on one surface of the insulating sheet 3 (the surface opposite to the surface joined to the first adhesive member 2). In FIG. 1, the insulating sheet 3 and the heating wire 4 are shown separately to make it easier to understand the shape of the heating wire 4, but in reality, the heating wire 4 is formed on the insulating sheet 3. A second adhesive member 5 is joined to one surface of the insulating sheet 3 (the surface on which the heating wire 4 is formed).

[0015] The surface layer member 1 is a member made of, for example, polyethylene terephthalate (PET).

[0016] The first adhesive member 2 is a member in which an acrylic adhesive is applied to both sides of a base material made of, for example, polyethylene (PE), polypropylene (PP), or nonwoven fabric. That is, the first adhesive member 2 functions as a double-sided tape.

[0017] The insulating sheet 3 is a member made of, for example, polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), or polycarbonate (PC).

[0018] Moreover, a metal layer (not shown) made of, for example, copper, stainless steel (SUS), or aluminum is provided on one surface of the insulating sheet 3 (the surface opposite to the surface to be bonded to the first adhesive member 2). This metal layer is etched to form the heating wire 4 in a predetermined pattern. The heating wire 4 generates heat when electricity is applied thereto, and functions as a heater.

[0019] The heating wire 4 also has a plurality of thick wire portions 6 that are partially formed thicker. In this embodiment, the thick wire portions 6 are formed in an almond shape (approximately elliptical) as an example. The thick wire portions 6 are formed in portions of the heating wire 4 that are to be press-processed (e.g., embossed) to form a three-dimensional pattern (described in detail below) on the electronic component 10. In other words, the thick wire portions 6 are formed in correspondence with the positions of the three-dimensional pattern to be formed on the electronic component 10 (described in detail below).

[0020] In the present embodiment, the case where the heating wire 4 is used has been described as an example, but the present invention is not limited to this. For example, a PTC (positive temperature coefficient heater) heater may be used instead of the heating wire 4.

[0021] The second adhesive member 5 is a member in which an acrylic adhesive is applied to one surface (the surface to be joined with the insulating sheet 3) of a base material made of, for example, polyethylene (PE) or nonwoven fabric, and a PET sheet is provided on the other surface (the surface opposite to the surface to be joined with the insulating sheet 3) of the base material. That is, the second adhesive member 5 functions as a single-sided tape.

[0022] In the present embodiment, the shape of each member constituting electronic component 10 is circular, but this is not limiting. Furthermore, the materials of each member constituting electronic component 10 are not limited to the above examples.

[0023] The electronic component 10 is formed as a laminate by stacking the above-mentioned surface layer member 1, first adhesive member 2, insulating sheet 3, heating wire 4, and second adhesive member 5. Then, by embossing the electronic component 10 (also called embossing or convex processing), for example, a three-dimensional pattern 7 as shown in FIG.

[0024] Fig. 2 is a perspective view showing an example of a three-dimensional pattern 7 formed on an electronic component 10. Note that in Fig. 2, illustration of components of the electronic component 10 other than the surface layer member 1 is omitted.

[0025] As shown in Fig. 2, a three-dimensional pattern 7 representing the alphabet "C" is formed by embossing on the surface of the surface layer member 1. Note that the three-dimensional pattern 7 shown in Fig. 2 is only an example, and is not limiting.

[0026] In the present embodiment, the embossing process is taken as an example of the press process for forming the three-dimensional pattern 7, but the present invention is not limited to this. For example, the three-dimensional pattern 7 may be formed by debossing (recess processing).

[0027] The above-mentioned three-dimensional pattern 7 is formed corresponding to the position of the thick line portion 6 included in the heating wire 4. In other words, each thick line portion 6 is formed corresponding to the position of the three-dimensional pattern 7.

[0028] Fig. 3 is a front view showing a schematic example of the positional relationship between the three-dimensional pattern 7 and the thick line portion 6. As shown in Fig. 3, the three-dimensional pattern 7 is formed so as to overlap the thick line portion 6. In other words, the portion of the heating wire 4 that overlaps with the outer edge portion of the three-dimensional pattern 7 is formed to be thicker than the other portions (almond-shaped in the example of Fig. 3). Note that, as shown in Fig. 3, it is preferable that the thick line portion 6 is formed so that the outer edge portion of the three-dimensional pattern 7 overlaps with its central portion.

[0029] The electronic component 10 on which the three-dimensional pattern 7 is formed is used, for example, as an emblem (also called an ornament) to be mounted on a vehicle. In this case, the electronic component 10 is disposed, for example, in front of a detection device 20 mounted on the vehicle (see FIG. 1). At this time, the electronic component 10 is disposed so that the three-dimensional pattern 7 faces the forward direction of the vehicle (so that the surface layer member 1 is positioned at the forefront).

[0030] 1 is a device that detects the surroundings of a vehicle. As the detection device 20, for example, a millimeter wave radar or a laser radar can be used, but is not limited to these.

[0031] As described above, when the electronic component 10 is disposed in front of the detection device 20, each member constituting the electronic component 10 only needs to be made of a material that transmits light or electromagnetic waves, etc., emitted from the detection device 20.

[0032] In the present embodiment, the case where the first adhesive member 2 is used to join the surface layer member 1 and the insulating sheet 3 has been described as an example, but the present invention is not limited thereto. For example, a fastener (e.g., a screw, a bolt, a nut, etc.) may be used instead of the first adhesive member 2. Or, for example, the surface layer member 1 may have a structure into which the insulating sheet 3 is fitted. Similarly, a PET sheet may be joined to the insulating sheet 3 using the fastener instead of the second adhesive member 5. Or, for example, the insulating sheet 3 may have a structure into which the PET sheet is fitted.

[0033] The configuration of electronic component 10 according to the present embodiment has been described above.

[0034] Next, a method for manufacturing the electronic component 10 will be described below.

[0035] First, the metal layer of the insulating sheet 3 is etched to form the heating wire 4. At this time, the portion of the heating wire 4 to be pressed (e.g., embossed) is made thicker than the other portions. As a result, the heating wire 4 has a plurality of thick wire portions 6 as shown in Figs. 1 and 3.

[0036] Next, as shown in FIG. 1, the surface layer member 1, the first adhesive member 2, the insulating sheet 3, and the second adhesive member 5 are arranged and laminated.

[0037] Next, the formed laminate (electronic component 10) is subjected to a press working so as to form the three-dimensional pattern 7. As a result, the three-dimensional pattern 7 shown in FIG.

[0038] The method for manufacturing the electronic component 10 has been described above.

[0039] As described above, in electronic component 10 of the present embodiment, thick wire portion 6 that is thicker than the other portions is formed in the portion of heating wire 4 that is subjected to press processing. This reduces the stress on heating wire 4 during press processing, and prevents breakage of heating wire 4. In addition, since there is no need to drill holes in insulating sheet 3, this embodiment can be applied to a wide variety of electronic components. Therefore, this embodiment can prevent breakage of the conductor and achieve high versatility.

[0040] Moreover, the electronic component 10 of the present embodiment can be heated by the heat generated by the heating wire 4. This makes it possible to remove moisture attached to the electronic component 10 or prevent moisture from adhering to the electronic component 10. This makes it possible to further improve the transparency of light, electromagnetic waves, or the like sent out from the detection device 20.

[0041] The present disclosure is not limited to the above-described embodiment, and various modifications are possible without departing from the spirit of the present disclosure. Modifications will be described below.

[0042] [Variation 1] The pattern of the heating wire 4 is not limited to the embodiment shown in Fig. 3. Furthermore, the position, number, thickness (size), and shape of the thick line portion 6 are not limited to the embodiment shown in Fig. 3. For example, the shape of the thick line portion 6 may be an ellipse, a circle, a rectangle, a square, or the like.

[0043] [Variation 2] In the embodiment, the electronic component 10 is used as an emblem for a vehicle, but the electronic component 10 is not limited to this.

[0044] For example, the electronic component 10 may be attached to a window glass of a vehicle and used as a sticker-type planar heating element for heating the window glass, thereby realizing defrosting or defogging of the window glass.

[0045] [Variation 3] In the embodiment, the electronic component 10 is a laminate, but is not limited to this. Also, in the embodiment, the electronic component 10 is a pressed electronic component, but is not limited to this.

[0046] Hereinafter, the electronic component 30 of this modified example will be described with reference to Fig. 4. Fig. 4 is a perspective view showing an example of the configuration of the electronic component 30 of this modified example.

[0047] 4, electronic component 30 has a flexible substrate 8 (corresponding to an example of a first member), an IC chip 9, and a copper foil wire 11 (corresponding to an example of a conductor). IC chip 9 and copper foil wire 11 are provided on flexible substrate 8. Copper foil wire 11 is electrically connected to IC chip 9.

[0048] The copper foil wire 11 has a thick line portion 13 that is partially formed thicker. The thick line portion 13 is provided at a position of a bent portion 12 of the flexible substrate 8. The bent portion 12 is a portion where the flexible substrate 8 on which the copper foil wire 11 is provided is subjected to a bending process.

[0049] In this way, by forming the copper foil wire 11 located at the bent portion 12 thicker than other portions before bending, it is possible to reduce the stress on the copper foil wire 11 during bending and prevent breakage of the copper foil wire 11. In addition, since there is no need to drill holes in the flexible substrate 8, it can be applied to a wide variety of electronic components. Thus, like the embodiment, this modified example can prevent breakage of the conductor and achieve high versatility.

[0050] In this modification, the copper foil wire 11 is given as an example of the conductor, but the conductor is not limited thereto. For example, the conductor may be a lead wire.

[0051] The above-described modified examples may be implemented in any combination. [Industrial Applicability]

[0052] The electronic component and the manufacturing method thereof disclosed herein are useful for an electronic component in which a linear conductor is provided on a member and subjected to bending or pressing, and for a manufacturing method thereof. [Explanation of symbols]

[0053] 1 Surface materials 2 First adhesive member 3. Insulation sheet 4 heating wire 5 Second adhesive member 6, 13 Bold line section 7. Three-dimensional patterns 8 Flexible Boards 9. IC Chip 10, 30 Electronic Components 11 Copper foil wire 12 Bending section 20. Detection Devices

Claims

1. An electronic component having a linear conductor and a first member on which the conductor is provided, The conductor has a thick wire portion that is thicker than other portions in a portion that is subjected to press working, The laminate further includes a second member laminated on the first member, The electronic component includes: A laminate in which a three-dimensional pattern is formed by press working performed in a state in which the first member and the second member are laminated. Electronic components.

2. The curved portion is formed so as to overlap an outer edge portion of the three-dimensional pattern. The electronic component according to claim 1 .

3. The curved portion is formed so that an outer edge portion of the three-dimensional pattern overlaps with a top portion of the curved portion. The electronic component according to claim 2 .

4. The conductor is a heating wire that generates heat when electricity is passed through it. The electronic component according to claim 1 .

5. The pressing is embossing. The electronic component according to claim 1 .

6. The electronic component includes: An emblem to be installed on a vehicle. The electronic component according to claim 1 .

7. The electronic component includes: Located in front of a detection device that detects the situation around the vehicle, The electronic component according to claim 1 .

8. A method for manufacturing an electronic component having a linear conductor and a first member on which the conductor is provided, comprising the steps of: A thick wire portion is formed in a portion of the conductor to be pressed, the thick wire portion being thicker than other portions of the conductor. A second member is laminated on the first member provided with the conductor; The first member on which the second member is laminated is subjected to a press working so as to form a three-dimensional pattern; A method for manufacturing electronic components.

9. The curved portion is formed so as to overlap an outer edge portion of the three-dimensional pattern. The method for manufacturing an electronic component according to claim 8 .

10. The curved portion is formed so that an outer edge portion of the three-dimensional pattern overlaps with a top portion of the curved portion. The method for manufacturing an electronic component according to claim 9 .

11. The conductor is a heating wire that generates heat when electricity is passed through it. The method for manufacturing an electronic component according to any one of claims 8 to 10.

12. The pressing is embossing. The method for manufacturing an electronic component according to any one of claims 8 to 11.

13. The electronic component includes: An emblem to be installed on a vehicle. The method for manufacturing an electronic component according to any one of claims 8 to 12.

14. The electronic component includes: Located in front of a detection device that detects the situation around the vehicle, The method for manufacturing an electronic component according to any one of claims 8 to 13.

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