Thermal interface material

Abstract

A thermal interface material is disclosed. The material includes a sheet extending between first and second major surfaces, the sheet including a low-temperature material and a filler material embedded in a substrate, and the substrate may include anisotropically oriented thermally conductive elements. In some embodiments, the thermally conductive elements are preferentially oriented along a primary direction from the first major surface to the second major surface to promote thermal conduction through the sheet along the primary direction. In some embodiments, the substrate is substantially free of silicone, and in some embodiments, * , the thermal conductivity of the sheet along the primary direction is at least 20 W / mK, 30 W / mK, 40 W / mK, 50 W / mK, 60 W / mK, 70 W / mK, 80 W / mK, 90 W / mK, 100 W / mK, or greater.

Description

[Technical field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application claims the benefit of and priority to U.S. Provisional Patent Application No. 62 / 880,370, entitled "THERMAL INTERFACE MATERIALS," filed July 30, 2019, the contents of each of which are incorporated herein in their entirety.

[0002] The invention disclosed herein relates to thermal interface materials, and more particularly to composite materials for providing efficient transfer of heat from electronic components. [Background technology]

[0003] As electronics continue to shrink in size while increasing in capabilities, a critical practical problem is that of heat generation: without effective heat dissipation, the performance of high density circuits can be substantially compromised. One important toolset in heat dissipation includes a variety of thermal interface materials.

[0004] The term "thermal interface material" (also referred to herein as "TIM") generally describes any material that is inserted between two parts to enhance the thermal bond between the two parts. Many designs involve the use of a thermal interface material that is inserted between a heat-generating device (e.g., a heat source such as a processor) and a heat-dissipating device (e.g., a heat sink).

[0005] There are several types of thermal interface materials in common use, including thermal greases, thermal adhesives, thermally conductive pads, thermal tape, and phase change materials.

[0006] Thermal grease provides a thin bond line and therefore little thermal resistance. Thermal grease has no effective mechanical strength and therefore requires an external mechanical fastening mechanism. Because thermal grease does not harden, its use is limited to where the material can be contained or thin applications where the viscosity of the grease allows the material to stay in place during use.

[0007] Thermal adhesives or thermal tacks provide some mechanical strength to the bond after curing. Thermal tacks allow for a thicker bond line than thermal grease as the thermal grease cures.

[0008] Thermally conductive pads are generally mostly made of silicone or silicone-like materials. Thermally conductive pads have the advantage of being easy to apply and allowing for thicker bond lines. Typically, thermally conductive pads require a higher force to press the heat sink on the heat source so that the thermal pad conforms to the surface of the particular device. This can be problematic or even prohibitive for highly sensitive devices where any deformation will result in signal interference.

[0009] Thermal tape may also be used. Generally, thermal tapes adhere to surfaces, do not require curing time, and are easy to apply. Thermal tapes are similar to thermal pads with adhesive properties.

[0010] A phase change material (PCM) may be used. Generally, phase change materials are naturally adhesive materials and may be used instead of thermal grease. The application is similar to the solid pads. After reaching its melting point, typically around 55-60°C, the phase change material changes to at least partially liquid state and fills all the gaps between the heat source and the heat sink.

[0011] These and other embodiments of the thermal interface material use a variety of compositions. Some embodiments of the compositions include a dispersion of dimensional materials. For example, some compositions may include thermally conductive fibers. In some embodiments, carbon nanotubes may be included. While such embodiments may show some promise, performance demands require further improvement.

[0012] That is, unfortunately, advances in circuit design are outpacing improvements in heat dissipation technology. Although thermal interface materials of the types described above serve today's electronic devices, advances in system design are increasingly being limited by heat generation.

[0013] What is needed are improved techniques for heat dissipation in electronic systems. Summary of the Invention

[0014] In one aspect, a thermal interface material is disclosed that includes a sheet extending between a first major surface and a second major surface, the sheet including a substrate and a filler embedded in the substrate. The filler includes anisotropically oriented thermally conductive elements. In some embodiments, the thermally conductive elements are preferentially oriented along a primary direction from the first major surface to the second major surface to selectively promote thermal conduction through the sheet along the primary direction. In some embodiments, the substrate is substantially free of silicone. In some embodiments, the thermal conductivity of the sheet along the primary direction is at least 15 W / mK, 20 W / mK, 30 W / mK, 40 W / mK, 50 W / mK, 60 W / mK, 70 W / mK, 80 W / mK, 90 W / mK, 100 W / mK, or greater.

[0015] In another aspect, a method of making a thermal interface material is disclosed that includes the steps of: forming a stack comprising a plurality of layers, in some embodiments, each layer comprising a substrate and a filler comprising anisotropically oriented thermally conductive elements, in some embodiments, each layer extends from a lower surface to a top surface along a vertical direction, and the layers are stacked in the vertical direction, in some embodiments, the thermally conductive elements in each layer are anisotropically oriented to preferentially promote heat flow in a direction transverse to the vertical direction.

[0016] In a further step, a force is applied to the stack to compress the stack along a vertical direction, which in some embodiments causes the layers of the stack to bond together to form a monolithic device.

[0017] In a further step, the stack is sliced ​​along a plane extending vertically and transverse to the top and bottom surfaces of the layers to form a sheet. In some embodiments, the sheet extends between the first and second major surfaces and includes a portion of the substrate and filler cut from the stack. The filler includes anisotropically oriented thermally conductive elements that are preferentially oriented along a primary direction from the first to the second major surface to promote thermal conduction through the sheet along the primary direction.

[0018] Various embodiments may include any of the features and elements described herein, either alone or in any suitable combination. [Brief description of the drawings]

[0019] The features and advantages of the present invention will become apparent from the following description taken in conjunction with the accompanying drawings.

[0020] [Figure 1] FIG. 1 is a schematic diagram depicting an embodiment of the use of a heat generating component, a heat sink, and a thermal interface material. [Diagram 2] FIG. 2 is a schematic diagram of a thermal interface material pad. [Diagram 3] FIG. 3 is an illustration of a surface treatment of the thermal interface material pad of FIG. 2. [Figure 4] 4 is a plot of thermal impedance versus pressure for six samples of thermal interface material pads. The top three traces show the results for samples without a surface treatment. The bottom three traces show the results for samples with a surface treatment of the type illustrated in FIG. [Diagram 5] FIG. 13 is a schematic diagram of an alternative embodiment thermal interface material pad. [Figure 6A] 3 is an illustration of an initial step in a method for fabricating a thermal interface pad of the type shown in FIG. 2. [Figure 6B] FIG. 3 is an illustration of a final step in the process of fabricating a thermal interface pad of the type shown in FIG. 2. [Figure 7A] 6 is an illustration of an initial step in a method for fabricating a thermal interface pad of the type shown in FIG. 5. [Figure 7B] FIG. 6 is an illustration of a final step in the fabrication method of a thermal interface pad of the type shown in FIG. 5. [Figure 8] FIG. 1 is a schematic diagram depicting another example embodiment of a thermal interface material including a dispersion of a dimensional material. [Figure 9] FIG. 1 is a schematic diagram depicting another example embodiment of a thermal interface material including a dispersion of dimensionally oriented material. [Figure 10] 10 is a representation of a block of stacked thermal interface material layers, each layer composed of a dimensionally oriented dispersion of material such as that shown in FIG. [Figure 11] 11 is a depiction of a thermal interface material pad containing dimensionally oriented material that may be cut from a block such as that shown in FIG. 10. [Figure 12] 1 is a graph depicting the thermal performance of the orienting pad disclosed herein compared to competitive products. [Figure 13] 1 is a graph illustrating comparative performance of embodiments of thermal interface materials. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0021] Disclosed herein are embodiments of thermal interface materials, along with methods for fabricating and using the thermal interface materials. Generally, thermal interface materials exhibit a high degree of thermal conductivity and further provide anisotropic heat dissipation.

[0022] Before introducing thermal interface materials (TIMs), some terminology is provided to establish a context for the teachings herein.

[0023] In general, the term "self-healing" refers to materials that have a built-in ability to automatically repair their own damage without external diagnosis of the problem or human intervention. Typically, conventional materials deteriorate over time due to fatigue, environmental conditions, or damage incurred during operation. Cracks and other types of damage at the microscopic level have been shown to change the thermal, electrical, and acoustic properties of conventional materials, and the propagation of cracks can lead to the eventual failure of conventional materials. Generally, cracks are difficult to detect early, and manual intervention is required for routine inspection and repair. In contrast, self-healing materials combat degradation through the initiation of repair mechanisms in response to micro-damage.

[0024] In general, "thermal conductivity" (often written as k, λ, or κ) refers to a material's ability to conduct heat. Thermal conductivity is primarily evaluated in terms of Fourier's law for heat conduction. In general, thermal conductivity is a tensor property, which describes the anisotropy of the property.

[0025] In materials with low thermal conductivity, heat transfer occurs at a slower rate than in materials with high thermal conductivity. Accordingly, materials with high thermal conductivity are used in heat sink applications and materials with low thermal conductivity are used as thermal insulators. The thermal conductivity of a material can depend on temperature. The inverse of thermal conductivity is called the "thermal resistivity."

[0026] Thermal conductivity can be expressed as provided in equation (1).

number

number

number

[0027] Generally, as discussed herein, the term "thermal impedance" refers to the sum of the thermal resistance of a material and all contact resistances. If the thermal impedance of a material is low, the material is a better heat conductor in that application. Thus, factors such as surface roughness, surface flatness, clamp pressure, presence of adhesive, unevenness, and material thickness are factors that affect the thermal impedance of a material. Generally, thermal impedance is a useful metric for evaluating thermal performance because thermal impedance takes into account more variables that are application specific.

[0028] As used herein, an "isotropically oriented" set of elements should be understood to be randomly or substantially randomly arranged such that the elements are not preferentially or substantially preferentially aligned along a particular direction in space.

[0029] As used herein, an "anisotropically oriented" set of elements should be understood to be arranged such that the elements are substantially preferentially aligned along a particular direction in space.

[0030] Referring now to FIG. 1, an embodiment of a thermal management system for an electronic device is shown. In the illustrated thermal management system 1, a heat source 5 generates heat. Non-limiting examples of the heat source 5 include at least one of a processor, a memory, a power supply, a power converter, a light emitting diode, and a laser diode. Generally, the heat source 5 is attached to a support 4. A non-limiting example of the support 4 is a printed circuit board (PCB). In this illustration, the heat source 5 is surface mounted on the support 4. A first deposit of a thermal interface material (TIM) 10 is directly above and in thermal communication with the heat source 5. A heat spreader 7 is disposed over and in thermal communication with the first deposit. Over and in thermal communication with the heat spreader 7 is a second deposit of a thermal interface material (TIM) 10. A heat sink 2 is disposed over and in thermal communication with the second deposit.

[0031] When energized, heat source 5 generates heat. The heat is conducted away from heat source 5 by a deposit of thermal interface material (TIM) 10 with heat spreader 7 and heat sink 2. Generally, the deposit of thermal interface material (TIM) 10 enhances thermal conduction between heat source 5 and heat sink 2 by eliminating gaps and voids between the components.

[0032] Generally, the heat sink 2 is a traditional cooling solution that maximizes surface area (using fins or pins) and airflow (using a fan) to dissipate heat from the heat source 5 into the surrounding air. The heat sink 2 may also be built with a cooling fan as a simple, lightweight, and completely self-contained cooling solution. Depending on the available airflow, the heat sink 2 can often outperform a similarly sized heat spreader 7.

[0033] Generally, the heat spreader 7 has a large flat surface on top. In some embodiments, the heat spreader 7 does not have a fan and fins. The heat spreader 7 may be pressed directly against another large flat surface (e.g., the frame of a vehicle or the inside wall of an enclosed container), allowing heat to be transferred from the heat spreader 7 to a larger metal (thermally conductive) surface. In a typical design, the heat spreader 7 does not cool the heat source 5 (e.g., a CPU) by itself. Rather, the heat spreader 7 is designed to transfer heat from the heat source 5 to another object where it can safely dissipate outside. Generally, the heat spreader 7 is ideal for electronic systems that are intended to operate under extreme shock and vibration, or systems that need to be completely sealed in a container to be protected from the environment. As can be seen, the performance of the heat sink 2 and heat spreader 7, and therefore the heat source 2 (such as a processor), can be substantially affected by the performance of the thermal interface material (TIM) 10.

[0034] It may be readily apparent that the thermal management system 1 of FIG. 1 having a thermal interface material (TIM) 10 available as a pad may speed assembly and provide consistent quality. That is, dispensing a thermal interface material (TIM) 10 in the form of a grease or paste, for example, requires volume control as well as consistent spreading. In contrast, by designing a thermal interface material (TIM) 10 in its implementation as a pad with suitable physical properties, superior quality control may be achieved.

[0035] 2, there is shown an exemplary thermal interface material (TIM) 101. The TIM 101 is formed as a pad or sheet 102 extending between a first major surface 103 (as shown, the bottom surface) and a second major surface 104 (as shown, the top surface). Although a flat sheet is shown, it will be apparent to one of ordinary skill in the art that other shapes may be used, such as curved sheets, or sheets cut to custom shapes and dimensions, as desired for a given application.

[0036] The sheet 102 is formed from a substrate 105 having a thermally conductive filler 106 embedded therein.

[0037] The substrate 105 may be a material selected to have desired mechanical and thermal properties. A number of exemplary suitable materials are described below. For purposes of the illustrated exemplary embodiment, the substrate is considered to be an acrylic rubber or acrylic resin material. In some embodiments, the substrate 105 may be a mixture of components such as a resin combined with a plasticizer material.

[0038] Advantageously, in some embodiments, the substrate may be free or substantially free of silicone or other siloxane-based polymers, which are known to exhibit degradation, outgassing, and other undesirable properties at high temperatures.

[0039] As shown, the filler 106 may include anisotropically oriented thermally conductive elements 107. The thermally conductive elements 107 may be preferentially oriented along a primary direction from the first major surface 103 to the second major surface 104 (vertical, as shown) to promote thermal conduction through the sheet along the primary direction.

[0040] In some embodiments, the inclusion of filler provides excellent thermal conductivity through the sheet 102 along a primary direction. For example, in some embodiments, the thermal conductivity of the sheet along a primary direction is at least 10 W / mK, 15 W / mK, 20 W / mK, 30 W / mK, 40 W / mK, 50 W / mK, 60 W / mK, 70 W / mK, 80 W / mK, 90 W / mK, 100 W / mK, or greater. In some embodiments, thermal conductivity may be measured using ASTM standard D5470, as known in the art.

[0041] In some embodiments, the TIM 101 exhibits excellent thermal impedance as a function of applied pressure. For example, in some embodiments, this property may be measured using techniques described in ASTM standard D5470, known in the art, and has a thermal impedance of 0.1°C·inch at 10 psi pressure. 2 / W, less than 0.09°C·inch 2 / W, less than 0.08°C·inch 2 / W, less than 0.07°C·inch 2 / W, less than 0.05°C·inch 2 / W or less (e.g., for sheets having thicknesses ranging from 0.5 mm to 5.0 mm). For example, in some embodiments, this property may be measured using techniques described in ASTM standard D5470, known in the art, and is less than 0.06°C·in at 30 psi pressure. 2 / W, less than 0.05°C·inch 2 / W, less than 0.04°C·inch 2 / W, less than 0.03°C·inch 2 / W, less than 0.02°C·inch 2 / W, less than 0.01°C·inch 2 / W or even smaller (e.g., for sheets having thicknesses in the range of 0.5 mm to 5.0 mm).

[0042] In some embodiments, the sheet 102 can be free-standing, for example, formed from a flexible polymeric resin substrate 105. In some embodiments, the sheet can have a thickness in the range of 0.1 mm to 10 mm, or any subrange thereof, such as in the range of 0.5 mm to 5.0 mm. In some embodiments, the TIM 101 can exhibit a Shore hardness in the range of 40 to 90, or 50 to 80, or any subrange thereof, such as 60 to 70, as determined by the procedures set forth in ASTM D2240 (Shore 00).

[0043] In some embodiments, TIM101 may have a density in the range of 0.5 g / mL to 5.0 g / mL, or any subrange thereof, such as 1.0 g / mL to 2.0 g / mL, In some embodiments, TIM101 may have a density of about 1.7 g / mL.

[0044] In some embodiments, the TIM 101 exhibits a desirably high deflection as a function of applied pressure. In some such embodiments, this property allows for good thermal contact between the TIM 101 and other heat sources and heat sinks in applications where pressure is applied. Some deflections as a function of compression can be measured using ASTM D5470 and ASTM C165 standard techniques known in the art. In some embodiments, the TIM 102 exhibits at least 10%, 20%, 30%, 40%, 50%, 60% or more deflection at 30 psi compression pressure and at least 30%, 40%, 50%, 60%, 70%, 80% or more deflection at 50 psi pressure.

[0045] In some embodiments, the TIM 101 can operate at temperatures ranging from −40° C. to 150° C. without significant degradation. For example, in some embodiments, the TIM 101 exhibits less than 0.2% total mass loss at temperatures of 150° C., 160° C., 170° C., 180° C., or higher under thermogravimetric analysis using techniques described in the ASTM E595 standard known in the art.

[0046] In some embodiments, the filler may include ceramic flakes, such as boron nitride flakes, hi some embodiments, the filler may include boron nitride nanoflakes or nanoscrolls.

[0047] In some embodiments, the filler may include carbon, such as graphite or graphene flakes. In some embodiments, the filler may include carbon nanotubes, bundles of carbon nanotubes, and aggregates of aligned carbon nanotubes. Other suitable examples of fillers are provided in the examples below.

[0048] In some embodiments, the anisotropically oriented thermally conductive elements include flake-like elements having major surfaces, and at least 65%, 75%, 85%, 95%, 99%, or more of the flake-like elements are arranged such that their major surfaces lie substantially in a plane extending transversely along a primary direction across the first and second surfaces of the sheet. For example, as shown in FIG. 2, the majority of the conductive elements are oriented such that the major surfaces of the flakes are oriented transversely relative to the top and bottom surfaces.

[0049] In some embodiments, the anisotropically oriented thermally conductive elements include elongated elements (e.g., carbon nanotubes) having a major dimension and one or more minor dimensions, and at least 65%, 75%, 85%, 95%, 99%, or more of the elongated elements are arranged such that the major dimension extends across the first and second surfaces of the sheet along a primary direction.

[0050] In various embodiments, the amount of filler used can be selected to provide the desired properties. In general, a higher amount of filler tends to provide a higher thermal conductivity (provided that sufficient care is taken to ensure that the filler does not result in unwanted surface roughness, as described in more detail below). In some embodiments, the filler is at least 20%, 30%, 40%, 50%, 60%, 70%, 80%, 90%, 95% or more by weight of the sheet.

[0051] 3, in some embodiments, the presence of filler elements 107 embedded in substrate 105 may result in unwanted roughness of one or both of major surfaces 103, 104 (104 is shown). In some such embodiments, surface 104 may be treated to provide a smoother surface better suited for good thermal contact with objects such as heat sources and heat sinks, thereby reducing thermal impedance.

[0052] For example, in some embodiments, a solvent 110 may be applied (e.g., sprayed through a nozzle) onto the surface 104 to partially dissolve the substrate. In embodiments in which the substrate 105 is an acrylic resin, isopropyl alcohol (IPA) is a suitable solvent choice. Pressure may then be applied to the surface (e.g., using a mechanical roller or similar technique) to smooth the substrate 105 and reorient the filler elements 107 near the surface 104 to provide a smoother interface.

[0053] In some embodiments, following this surface treatment, the sheet 102 may include a region 112 proximate the first major surface 103 (not shown) and / or the second major surface 104 (shown) of the sheet in which the filler elements 107 have been reoriented. In this case, this region 112 may contain a subset of the thermally conductive elements 107 of the filler 106 that are less anisotropically oriented than the thermally conductive elements located more distally relative to the surface of the interior portion of the sheet. For example, with the substrate 105 at least partially melted, the filler 106 in the region 112 may be released to return to a greater isotropic orientation.

[0054] Instead, in this case, region 112 may contain a subset of the thermally conductive elements 107 of filler material 106 that are anisotropically oriented along a different direction than the thermally conductive elements 107 located more distal to the surface in the interior portion of sheet 102. For example, pressure applied by the rolling elements may cause elements 107 near surface 104 to be oriented flat along the surface rather than extending across the surface.

[0055] In some embodiments, instead of or in addition to the solvent 110 , heat may be applied to the surfaces 103 , 104 to soften or melt the substrate in the region 112 .

[0056] In some embodiments, in addition to or in lieu of the surface treatments described above, a thin layer of an adhesive material (not shown) may be applied (e.g., using a spray nozzle) to the surfaces 103, 04. The adhesive layer may fill surface roughness and promote adhesion of the TIM 101 to a heat source or heat sink. In some embodiments, the adhesive material may include a space-filling material (e.g., a material suitable for use as a substrate, such as an acrylic rubber). For example, in some embodiments, the space-filling material may be dissolved in a solvent and sprayed onto the surface 104 to fill gaps, cracks, depressions, etc., such as within the surface 104. In some examples, the solvent may then dry, leaving behind the space-filling material, thereby creating a smoother surface 103, 104 on the sheet 102.

[0057] FIG. 4 illustrates the benefit of the solvent-based surface treatment described above. Six samples of TIM101 were made, each 1.0 mm thick. The samples were tested for thermal impedance at various pressures using the techniques described in ASTM standard D5470, known in the art. Three of the samples underwent surface treatment to improve surface finish, while three did not. As shown in FIG. 4, the thermal impedance of the treated sample (lower trace) was less than that of the untreated sample (upper trace), especially at low pressures. This clearly indicates that the surface treatment promotes better thermal contact between the TIM101 used in the evaluation and the heat source and heat sink.

[0058] 5, in some embodiments, the TIM 101 includes thermally conductive elements 120 that extend through the sheet 102 from the first major surface 103 to the second major surface 104 along a primary direction (vertical as shown). These thermally conductive elements may facilitate heat flow between the surfaces 103, 104. In some embodiments, these elements 120 may be made of carbon. For example, graphite or graphene formed as sheets, strips, pillars, or other suitable shapes may be used.

[0059] In some embodiments, portions of the thermal conduction elements may be exposed at the first and second major surfaces 103, 104 of the sheet 102. In some such cases, it may be desirable to treat the surfaces to protect these areas, for example, by using a solvent-based surface treatment as described above or by applying a thin protective adhesive layer to the surfaces 103, 104.

[0060] 6A and 6B, an exemplary method for fabricating the TIM 101 is shown.

[0061] Referring to FIG. 6A, a stack 500 including multiple layers 501 is formed.

[0062] Each layer 501 extends along a direction (vertical, as shown) from a lower surface 502 to an upper surface 503, and the layers are stacked on top of each other in that direction, as shown.

[0063] Each layer 501 includes a substrate 105 and a filler 106 of the type described above with reference to Figure 2. The filler 106 in each layer is composed of anisotropically oriented heat conducting elements 107. However, unlike in the sheets 102 used in the final TIM 101, the elements 107 are oriented to promote a heat flow direction across, rather than along, the vertical direction from the lower surface 502 to the upper surface 503. Thus, these layers 501 of the stack are not suitable for use as a TIM 101 without further processing.

[0064] 6B, thus in some embodiments, a force (optionally together with heat) may be applied in a vertical direction to compress the stack 500 to join the layers 501 together to form a monolithic element. The stack 501 may be ultrasonically or laser cut (indicated in FIG. 6B with thick dark arrows) using, for example, a fine blade or along a vertically extending plane to form a sheet 102 of a desired thickness. This sheet 102 is removed from the stack to form the TIM 101. Notably, the TIM 101 includes a sheet 102 having a filler 106 made up of anisotropically oriented thermally conductive elements 107 oriented in the correct direction. That is, sheet 102 extends between first major surface 103 and second major surface 104, and filler 106 includes anisotropically oriented thermally conductive elements 107 that are preferentially oriented along a primary direction from first major surface 103 to second major surface 104 to promote thermal conduction through sheet 102 along the primary direction.

[0065] Additional slices may be taken to produce additional TIM101 pads. In other words, the stacking and slicing process described above takes multiple layers in which the filler has anisotropic orientation in a direction not suitable for use as TIM101, and produces several TIM101 pads with filler having the desired orientation.

[0066] As described in detail below, the layer 501 can be produced using a simple process that is suitable for mass production techniques. For example, in some embodiments, each laminate 501 can be formed by providing a mixture of a substrate and a filler material that includes thermally conductive elements. Generally, the mixture can be made without any step to orient the filler material, resulting in an isotropic distribution of the thermally conductive elements in the substrate. The resulting mixture can then be physically manipulated to anisotropically orient the thermally conductive elements within the layer. For example, the mixture can be extruded to form layer 501, compressed to form layer 501, folded repeatedly on itself to form layer 501, or a combination thereof, as described in detail in additional examples below.

[0067] As discussed above, this physical manipulation results in a layer having anisotropically oriented thermally conductive elements 107 oriented in an undesirable direction for use in a TIM 101. However, this can be corrected by performing the lamination, compression, and slicing steps described above with reference to Figures 6A and 6B.

[0068] In some embodiments, the substrate 105 is a self-healing material, thereby facilitating the fusing of the layers 501 into a monolithic element during the compression step provided above. Self-healing materials are also advantageous in that they are resistant to damage (e.g., cracks) that may occur during the slicing step described above with reference to FIG.

[0069] In various embodiments, the method may further include applying a surface treatment to one or more of the major surfaces 103, 104 of the TIM 101, as described above with reference to FIG.

[0070] 7A and 7B, the process described above can be easily modified to produce alternative versions of the TIM 101 shown in FIG. 5. In some embodiments, a conductive element, such as a carbon element 510, is sandwiched between at least some of the layers 501 of the stack 500 prior to compressing and slicing the stack.

[0071] The carbon elements may include graphite or graphene and may be formed as sheets (e.g., extending continuously across the surface of layer 501) or strips (e.g., covering only a portion of layer 501) or any other suitable shape. In some embodiments, the carbon elements 501 may be formed of graphite or graphene.

[0072] As shown in FIG. 7B, when the stack 500 is sliced ​​to form a sheet 102 of TIM 101, portions of the carbon elements 520 form thermally conductive elements 120 extending through the sheet 102 from the first major surface 103 to the second major surface 104, as described above with reference to FIG. 5.

[0073] As will be apparent to one of skill in the art, the above process can be readily adapted to provide TIM101 of any of the types described herein.

[0074] 6A-7A show a particular number of layers 501 and conductive elements 510, any suitable number may be used. For example, some embodiments use 2, 3, 4, 5, 10, 15, 20, or more layers 501, e.g., in the range of 2 to 100 layers or any subrange thereof.

[0075] Additional Examples

[0076] An exemplary TIM pad fabrication process is described with respect to Figures 8-11. As would be apparent to one of ordinary skill in the art, the exemplary materials and techniques described herein may be readily adapted for use in the previous examples.

[0077] The process for fabricating a pad 10 of thermal interface material (TIM) begins as shown in FIG.

[0078] FIG. 8 illustrates a volume of a suitable thermally conductive composition 21. The thermally conductive composition 21 may include fillers, such as metal powders and mixtures thereof (e.g., aluminum powder, silver powder, copper powder), graphite flakes, ceramic powders (e.g., alumina, boron nitride, etc.). The composition 21 may also include a free-standing substrate including materials such as rubbers (e.g., acrylic rubbers), oils, polymers, thermoplastics, and thermosets. In general, the thermally conductive composition 21 may be fabricated from materials that exhibit suitable properties. The properties may include, for example, flexibility and good thermal conductivity. A variety of other materials may be used.

[0079] In some embodiments, a thermoplastic resin that is substantially solid at room temperature is used. Some examples of suitable thermoplastic resins include acrylic resins, epoxy resins, silicone resins, fluororesins, etc. These may be used alone or in combination with other materials (as far as practicable).

[0080] Thermoplastic resins may be used in combination with the solid. Examples of thermoplastic polymers / resins that may be used include acrylic resins such as poly(2-ethylhexyl acrylate), 2-ethylhexyl acrylate-acrylic acid copolymer, polymethacrylic acid or its ester, polyacrylic acid or its ester, silicone resins, fluororesins, polyethylene, polypropylene, ethylene-propylene copolymer, polymethylpentene, polyvinyl chloride, polyvinyl acetate, ethylene-vinyl acetate copolymer, polyvinyl alcohol, polyacetal, polyethylene terephthalate, polyethylene, polystyrene, polyacrylonitrile, - Examples include styrene-acrylonitrile copolymers, acrylyl-butadiene-styrene (ABS resin)-copolymers, styrene-butadiene block copolymers or hydrogenated products thereof, styrene-isoprene block copolymers or hydrogenated products thereof, polyphenylene ethers, modified polyphenylene ethers, aliphatic and aromatic polyamides, polyamides, polycarbonates, polyphenylene sulfides, polysulfones, polyether sulfones, polyether nitriles, polyether ketones, polyketones, polyurethanes, liquid crystal polymers, ionomers, etc. These may be used alone or (where practicable) in combination with other materials.

[0081] In some embodiments, thermoplastic fluorocarbon resins are used, which may provide certain other advantages, such as improved heat, oil, and chemical resistance.

[0082] Solid fluorothermoplastics that may be useful include, for example, vinylidene fluoride, tetrafluoroethylene-propylene, tetrafluoroethylene-[papuruorobiniruete-ru[papuruorobinirueteru] systems, and the like, and the resulting elastomeric fluorine-containing polymerizable monomers. More specifically, these include poly-tetrafluoroethylene, tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer, tetrafluoroethylene hexafluoropropylene copolymer, tetrafluoroethylene-ethylene copolymer, polyvinylidene fluoride, polychlorotrifluoroethylene, ethylene [kurorohuruoroechiren[kurorohuruoroechiren] copolymer, tetrafluoroethylene [pahuruorojiokisoru[pahuruorojiokisoru] copolymer, polyvinyl fluoride, tetrafluoroethylene-propylene copolymer, tetrafluoroethylene-hexafluoropropylene copolymer [biniridenhuruoraido[biniridenhuruoraido]acrylic modified polytetrafluoroethylene, polytetrafluoroethylene modified ester, epoxy modified silane modified polytetrafluoroethylene and polytetrafluorofluoroethylene.

[0083] Additional materials that may be used as thermosets include, for example, natural rubber, acrylate rubber, butadiene rubber, isoprene rubber, nitrile rubber, hydrogenated nitrile rubber, chloroprene rubber, ethylene-propylene rubber, chlorinated polyethylene, chlorosulfonated polyethylene, butyl rubber, halogenated butyl rubber, polyisobutylene rubber, polyacrylic rubber, epoxy resins, polyimide resins, bismaleimide resins, benzocyclobutene resins, phenolic resins, unsaturated polyesters, diallyl phthalate resins, polyimide resins, polyurethanes, thermoset polyphenylene ethers, thermoset polyphenylene ethers, and the like.

[0084] In some embodiments, the thermally conductive composition 21 comprises poly(vinyl acetate) (PVA) or poly(ethenyl ethanoate) (PVAc). Generally, PVA has the formula (C4H6O2): n PVA is an aliphatic rubber synthetic polymer having the general formula -[RCOOCHCH2]- and is a type of thermoplastic material in the polyvinyl ester family. In some embodiments, the thermally conductive composition 21 is non-silicone based. An additional example is soybean oil based.

[0085] Any of the foregoing materials may be used alone or in combination (to the extent practicable) with these or other materials.

[0086] A dispersion of thermal filler material is disposed within the thermally conductive composition 21. The thermal filler material may be provided as nano- and / or micro-materials.

[0087] Generally, the thermal filler will have some shape or form and therefore at least one dimensional aspect (e.g., a thin flake with a major surface and one minor dimension, or an elongated element with one major dimension and two lateral minor dimensions). The thermal filler may be selected for dispersion and exhibit good to excellent thermal conductivity. Some examples of nanomaterials include, but are not limited to, forms of carbon nanotubes (including single-walled carbon nanotubes (SWCNT) and multi-walled carbon nanotubes (MWCNT)), as well as nanohorns, nano-onions, carbon black, fullerenes, graphene, graphene oxide, and various processed forms of the aforementioned. In some embodiments, the nanomaterials further include at least one form of metal nanoparticles, metal oxide nanoparticles, and / or thermally conductive polymers. The thermal filler may be provided as a micro-material and may include, but is not limited to, at least one form of graphite, boron nitride, boron nitride flakes, boron nitride nanoscrolls, aluminum nitride, aluminum nitride whiskers, carbon nanotubes, metal particles, metal oxide particles, and / or thermally conductive polymers.

[0088] As used herein, the term "micromaterial" refers to a dimensional thermal filler material (e.g., microscale particles or flakes) exhibiting one or more dimensions in the range of about 0.1 microns to about 200 microns. In general, the term "nanomaterial" refers to a dimensional thermal filler material (e.g., nanotubes, nanorods, nanoparticles, nanoshells, nanohorns, and nanoscopic flakes such as graphene flakes) exhibiting one or more dimensions in the range of about a few nanometers to about 100 nanometers (0.1 microns).

[0089] Given that thermal fillers are small in nature, in some embodiments, it is not possible to control their orientation when mixing them into the thermally conductive composition 21. Thus, dispersion of the thermal filler results in randomly oriented dimensional material 22 disposed within the volume of the thermally conductive composition 21.

[0090] Because the thermal filler is randomly oriented within the thermally conductive composition 21, the beneficial properties of directional thermal conductivity are not present. More specifically, without the directional orientation, as shown in Figure 8 by the directional arrows, heat would conduct out in random directions due to the isotropic thermal conductivity preferences of the thermal filler. However, the potential of the thermal filler can be exploited when rearranging the dimensional thermal filler into anisotropic orientations to form an oriented material 100, as shown in Figure 9.

[0091] As shown in FIG. 9, the thermal filler dispersed in the thermally conductive composition 21 may be arranged as directionally oriented dimensional material 32 in an oriented material layer 100 suitable for use as layer 501 in the stacking and slicing process described above with reference to, for example, FIGS. 6A-7B.

[0092] Exemplary techniques for providing the oriented dimensional material 32 include hydraulic pressing or hydraulic extrusion. In some embodiments, hydraulic pressing begins with a volume of thermally conductive composition 21 having a dispersion of randomly oriented dimensional material 22. The volume of material is pressed or extruded into a substantially planar form. In some embodiments, the substantially planar form is then folded back onto itself, effectively reforming the volume into, for example, a ball or cube. The volume of material is then pressed back into a substantially planar form. Generally, through repeated pressing and folding, the randomly oriented fillers are urged into a planar orientation, for example, as shown above in layer 501 with reference to FIG. 6A or FIG. 6B.

[0093] To aid in moving the filler into the desired orientation, the mixture of thermally conductive composition 21 and the dispersion of randomly oriented dimensional material 22 may be heated, for example, during a pressing or extrusion process as described above. Generally, heating the mixture of thermally conductive composition 21 with the dispersion of randomly oriented dimensional material 22 reduces the viscosity of the thermally conductive composition 21, thereby aiding in moving the randomly oriented dimensional material 22 into the desired orientation.

[0094] When the dimensional material 32 is provided in a directional arrangement, as shown in Figure 9 by the directional arrows, heat generally conducts outward in the XY plane due to the anisotropic thermal conductivity preferences of the nanomaterials. This property is exploited to provide the thermal pads disclosed herein. In some embodiments,

[0095] As shown in Figure 10, the oriented material 100 may be segmented and placed into a stack 40. Once in the stack 40, the oriented thermal interface material (TIM) 100 may be further segmented. For example, the stack 40 may be cut along an imaginary plane, labeled as the A-plane, which lies in the XZ plane. The result is depicted in Figure 11.

[0096] As shown in FIG. 11, the oriented pad 50 includes a portion of the stack 40 shown in FIG. 4. In general, the oriented pad 50 is machined to dimensions suitable for use in the thermal management system 1 illustrated in FIG. 1. The resulting vectors transfer heat from the heat source 5 substantially through the XY plane. It is envisioned that some of the thermal filler transfers heat substantially in the X direction, while a substantially equal portion of the nanomaterial transfers heat substantially in the Y direction. In other words, the anisotropic thermal conductivity of the thermal filler allows a significant portion of the heat to transfer through the XY plane, but transfer of heat in the Z direction is limited (for the same reasons). Thus, recirculation of heat within the oriented pad 50 is limited.

[0097] The thermal conductivity performance of the oriented pad 50 was evaluated in a series of tests using a standardized test stand. The tests included a comparison with competitive products. When placed on the test stand, each product was subjected to some compression. The compression exhibited is described in Table 1 below. In the data tables below, "NaL Pad" refers to the oriented pad 50. The test data for the thermal conductivity evaluation is presented in FIG. 12. [Table 1]

[0098] As shown in Figure 12, the resulting oriented pad 50 outperforms all competing pad products tested. The data indicates that the thermal conductivity performance of the oriented pad 50 is substantially equivalent to the thermal performance of the potting material (i.e., the coating of the heat source 5 with the potting material).

[0099] FIG. 13 shows a comparison illustrating the effect realized from the orientation of the dimensional thermal material. In the thermal management system 1 used to generate the data shown, the heat spreader 7 was omitted. Three samples of thermal interface material 10 were tested. The first sample included a standard (STD) with thermal fill material oriented substantially perpendicularly. The temperature difference between the heat source 5 and the heat sink 2 quickly reached equilibrium and was maintained at about 5° C. The second sample of thermal interface material 10 (45 degrees) was processed using the slicing technique described herein, with the slices being at an angle of about 45 degrees. The third sample of thermal interface material 10 contained thermal fill material oriented substantially perpendicular (90 degrees) to the desired direction of heat flux.

[0100] A smaller temperature difference between the heat source 5 and the heat sink 2 indicates a lower thermal resistivity. Thus, since the first sample has the smallest temperature difference, it is clear that orienting the particles to conduct heat through the XY plane (as defined in FIG. 11) improves the thermal conductivity of the thermal interface material 10.

[0101] After introducing aspects of the thermal interface materials, some further aspects and examples are provided.

[0102] The thermal interface material may be formed as a soft material. Generally, the thermal interface material is self-healing during processing (slicing and stacking procedure).

[0103] Generally, thermal interface materials are useful in applications requiring gap filling, i.e., they provide excellent conformance to irregular surfaces.

[0104] In some embodiments, the thermal interface material comprises a flexible polymer sheet material having thickness options of about 0.25 mm to about 5 mm and thermal conductivities of up to about 60 W / mK or greater. Current high performance TIM sheets tend to be around 5 W / mK. The resulting four-fold performance improvement makes this a useful technology for applications using high power. Virtually any powered system may utilize the high performance TIM.

[0105] Applications of thermal interface materials include, but are not limited to, power supplies, automotive electronics, motor controls, power semiconductors, heat sink interfaces, processing systems, and other electronic devices such as computers, amplifiers, video processing equipment, control systems, and many others.

[0106] In some embodiments, the resulting product exhibits a thermal conductivity that is at least 60 W / mK. The product may be provided in a sheet, in some embodiments, a sheet having a size of about a standard printer paper size. The product may have a thickness of about 0.25 mm to 5 mm, the thickness may be lesser or greater. The product may be useful at temperatures ranging from -60°C to 250°C (or any subrange thereof, e.g., -40°C to 150°C), lesser or greater temperature ranges. Generally, the product is non-outgassing and does not exhibit creep upon thermal cycling. Generally, the product is flexible and conforms to surrounding components. Generally, the product is reworkable and may be used in existing / common manufacturing processes.

[0107] Various other components may be included or required to provide aspects of the teachings herein For example, additional materials, combinations of materials, and / or omissions of materials may be used to provide additional embodiments that are within the scope of the teachings herein.

[0108] Various modifications of the teachings herein may be implemented. In general, the modifications may be designed according to the needs of a user, designer, manufacturer, or other similarly interested party. The modifications may be intended to meet particular standards of performance that are deemed important by that party.

[0109] No appended claim or claim element may be construed as invoking 35 U.S.C. §112(f) unless the words "means for" or "step for" are expressly used in a particular claim.

[0110] When introducing an element of the invention or an embodiment thereof, the articles "a," "an," and "the" are intended to mean that there are one or more of the element. Similarly, the adjective "another," when used to introduce an element, is intended to mean one or more of the element. The terms "including" and "having" are intended to be inclusive such that there may be additional elements other than the listed elements. As used herein, the term "exemplary" does not imply an example at its best. Rather, "exemplary" refers to an embodiment that is one of many possible embodiments.

[0111] Although the present invention has been described with reference to exemplary embodiments, those skilled in the art will recognize that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In addition, those skilled in the art will recognize many modifications to adapt a particular equipment, situation, or material to the teachings of the invention without departing from the essential scope of the invention. Therefore, it is not intended that the invention be limited to the particular embodiment disclosed as the best mode contemplated for carrying out this invention, but the invention is intended to include all embodiments falling within the scope of the appended claims. The initial disclosure of this specification includes at least the following aspects. [1] A thermal interface material comprising: A sheet extending between a first major surface and a second major surface, the sheet comprising: A substrate; a filler material embedded in the substrate, the filler material comprising anisotropically oriented thermally conductive elements; Equipped with the thermally conductive elements are preferentially oriented along a primary direction from the first major surface to the second major surface to promote thermal conduction through the sheet along the primary direction; the substrate is substantially free of silicone; A thermal interface material, wherein the thermal conductivity of the sheet along the primary direction is at least 20 W / mK. [2] The sheet comprises a slice separated from a stack of multiple layers of substrate compressed together; a filler material embedded in each of said layers, said filler material in each layer comprising anisotropically oriented thermally conductive elements; the orientation of the slice during separation from the stack is such that the heat conducting elements are preferentially oriented along a primary direction from the first major surface to the second major surface to promote heat conduction through the sheet along the primary direction. 1. The thermal interface material according to claim 1. [3] The thermal interface material of [1] or [2], wherein the substrate comprises a free-standing flexible layer. [4] The thermal interface material according to any one of [1] to [3], wherein the substrate comprises a thermoplastic material. [5] The thermal interface material according to any one of [1] to [4], wherein the thermal conductivity of the sheet along the primary direction is at least 30 W / mK. [6] The thermal interface material according to any one of [1] to [4], wherein the thermal conductivity of the sheet along the primary direction is at least 50 W / mK. [7] The thermal interface material according to any one of [1] to [4], wherein the thermal conductivity of the sheet along the primary direction is at least 60 W / mK. [8] The thermal interface material according to any one of [1] to [7], wherein the sheet is characterized by a Shore hardness in the range of 40 to 90. [9] The thermal interface material according to any one of [1] to [7], wherein the sheet is characterized by a Shore hardness in the range of 50 to 80.

[10] The thermal interface material according to any one of [1] to [7], wherein the sheet is characterized by a Shore hardness in the range of 60 to 70.

[11] The thermal interface material according to any one of [1] to

[10] , wherein the filler comprises ceramic flakes.

[12] The thermal interface material according to any one of [1] to

[11] , wherein the filler comprises flakes of boron nitride.

[13] The thermal interface material according to any one of [1] to

[12] , wherein the filler comprises graphite flakes.

[14] The thermal interface material according to any one of [1] to

[13] , wherein the filler comprises graphene flakes.

[15] The thermal interface material according to any one of [1] to

[14] , wherein the filler comprises at least one selected from the list consisting of carbon nanotubes, bundles of carbon nanotubes, and aggregates of aligned carbon nanotubes.

[16] The thermal interface material according to any one of [1] to

[15] , wherein the sheet comprises a region proximal to the first major surface or the second major surface of the sheet, the region containing a subset of the thermal conduction elements of the filler that are less anisotropically oriented than the thermal conduction elements located more distally to the surface.

[17] The thermal interface material according to any one of [1] to

[16] , wherein the sheet comprises a first region proximal to the first major surface of the sheet and a second region proximal to the second major surface of the sheet, each of the first and second regions containing a respective subset of the thermal conduction elements of the filler that are less anisotropically oriented than the thermal conduction elements located more distal to the surface.

[18] The thermal interface material of any one of [1] to

[17] , wherein at least one of the first major surface and the second major surface of the sheet has a surface region that has been treated with a solvent to promote surface smoothness.

[19] The thermal interface material of any one of [1] to

[18] , further comprising a carbon element extending through the sheet from the first major surface to the second major surface along the primary direction and configured to facilitate heat flow from the first surface to the second surface.

[20] The thermal interface material of

[19] , wherein the carbon element comprises a graphite sheet.

[21] The thermal interface material of

[19] , wherein the carbon element comprises a graphite strip.

[22] The thermal interface material according to any one of [1] to

[21] , wherein the anisotropically oriented thermally conductive elements comprise flake-like elements having major surfaces, at least 65% of the flake-like elements being arranged such that the major surfaces lie substantially in a plane extending along the primary direction across the first and second surfaces of the sheet.

[23] The anisotropically oriented heat conducting element comprises a flake-like element having a major surface; The thermal interface material according to any one of [1] to

[21] , wherein at least 75% of the flake-like elements are arranged such that the major surfaces of the flake-like elements lie substantially in a plane extending along the primary direction across the first and second surfaces of the sheet.

[24] The thermal interface material of any one of [1] to

[21] , wherein the anisotropically oriented thermally conductive elements comprise flake-like elements having major surfaces, at least 85% of the flake-like elements being arranged such that the major surfaces of the flake-like elements lie substantially in a plane extending along the primary direction across the first and second major surfaces of the sheet.

[25] The thermal interface material according to any one of [1] to

[21] , wherein the anisotropically oriented thermally conductive elements comprise flake-like elements having major surfaces, at least 95% of the flake-like elements being arranged such that the major surfaces lie substantially in a plane extending along the primary direction across the first and second major surfaces of the sheet.

[26] The thermal interface material according to any one of [1] to

[25] , wherein the filler is at least 50% by weight of the sheet.

[27] The thermal interface material according to any one of [1] to

[25] , wherein the filler is at least 70% by weight of the sheet.

[28] The thermal interface material according to any one of [1] to

[25] , wherein the filler is at least 80% by weight of the sheet.

[29] The thermal interface material according to any one of [1] to

[25] , wherein the filler is at least 90% by weight of the sheet.

[30] The thermal interface material according to any one of [1] to

[25] , wherein the filler is at least 95% by weight of the sheet.

[31] A method for producing a thermal interface material, comprising the steps of: Forming a stack comprising a plurality of layers, Each layer comprises a substrate and a filler material comprising anisotropically oriented thermally conductive elements; forming a laminate, each layer extending from a lower surface to a top surface along a vertical direction, the layers being stacked in the vertical direction; applying a force to the stack to compress the stack along the vertical direction; and slicing the stack along a plane extending in the vertical direction and transverse to the top and bottom surfaces of the layers to form a sheet; Including, the heat conducting elements are oriented to preferentially promote heat flow in a direction transverse to the perpendicular direction; the sheet comprises a portion extending between a first major surface and a second major surface, the portion of the substrate and the portion of the filler comprising anisotropically oriented thermally conductive elements that are preferentially oriented along a primary direction from the first major surface to the second major surface to promote thermal conduction through the sheet along the primary direction.

[32] Prior to completing the step of forming the stack, Providing a mixture of a substrate and a filler material comprising a thermally conductive element; physically manipulating the mixture to anisotropically orient the heat conducting elements within the layer; forming each layer by a method including The method according to

[31] , further comprising:

[33] The method of

[32] , wherein physically manipulating the mixture to anisotropically orient the heat conductive elements within the layer includes at least one of extruding the mixture for the layer, compressing the mixture to form the layer, and repeatedly folding the mixture to form the layer.

[34] The method according to any one of

[31] to

[33] , wherein the substrate is a self-repairing material.

[35] prior to the step of slicing the stack, sandwiching carbon elements between at least some of the layers of the stack. The method according to any one of

[31] to

[34] , further comprising:

[36] The method according to

[35] , wherein the carbon element comprises at least one from the list consisting of graphite sheets, graphite strips, graphene sheets, and graphene strips.

[37] The method according to any one of

[31] to

[36] , further comprising applying a solvent to at least one of the first major surface and the second major surface of the sheet to enhance the smoothness of the surface.

[38] The method of

[37] , further comprising applying pressure to at least a portion of the surface.

[39] The method of any of

[31] to

[38] , further comprising forming a region of the sheet proximal to the first or second major surface of the sheet, the region containing a subset of the thermal conduction elements of the filler that are less anisotropically oriented than the thermal conduction elements located more distal to the surface.

[40] The method according to any one of claims 31 to 39, further comprising providing a layer of adhesive on at least one of the first major surface and the second major surface of the sheet.

[41] The method according to any one of

[31] to

[40] , wherein the thermal interface material comprises the thermal interface material according to any one of [1] to

[30] .

Claims

1. 1. A thermal interface material comprising: A sheet extending between a first major surface and a second major surface, the sheet comprising: A substrate; a filler material embedded in the substrate, the filler material comprising anisotropically oriented thermally conductive elements; Equipped with the thermally conductive elements are preferentially oriented along a primary direction from the first major surface to the second major surface to promote thermal conduction through the sheet along the primary direction; the substrate is substantially free of silicone; a thermal interface material, the thermal conductivity of the sheet along the primary direction being at least 20 W / mK; the sheet comprising a region proximate the first or second major surface of the sheet, the region containing a subset of the thermally conductive elements of the filler that are less anisotropically oriented than the thermally conductive elements located more distally to the surface; the thermal interface material further comprising a carbon element extending through the sheet from the first major surface to the second major surface along the primary direction and configured to facilitate heat flow from the first surface to the second surface. Thermal interface materials.

2. the sheet comprises a slice separated from a stack of multiple layers of substrate compressed together; a filler material embedded in each of said layers, said filler material in each layer comprising anisotropically oriented thermally conductive elements; the orientation of the slice during separation from the stack is such that the heat conducting elements are preferentially oriented along a primary direction from the first major surface to the second major surface to promote heat conduction through the sheet along the primary direction.

10. The thermal interface material of claim 1.

3. The thermal interface material of claim 1 or 2, wherein the substrate comprises a free-standing flexible layer.

4. The thermal interface material of any one of claims 1 to 3, wherein the substrate comprises a thermoplastic material.

5. The thermal interface material of any one of claims 1 to 4, wherein the thermal conductivity of the sheet along the primary direction is at least 30 W / mK.

6. The thermal interface material of any one of claims 1 to 4, wherein the thermal conductivity of the sheet along the primary direction is at least 50 W / mK.

7. The thermal interface material of any one of claims 1 to 4, wherein the thermal conductivity of the sheet along the primary direction is at least 60 W / mK.

8. The thermal interface material of any one of claims 1 to 7, wherein the sheet is characterized by a Shore hardness in the range of 40 to 90.

9. The thermal interface material of any one of claims 1 to 7, wherein the sheet is characterized by a Shore hardness in the range of 50-80.

10. The thermal interface material of any one of claims 1 to 7, wherein the sheet is characterized by a Shore hardness in the range of 60-70.

11. The thermal interface material of any one of claims 1 to 10, wherein the filler comprises ceramic flakes.

12. The thermal interface material of any one of claims 1 to 11, wherein the filler comprises boron nitride flakes.

13. The thermal interface material of any one of the preceding claims, wherein the filler comprises graphite flakes.

14. 14. The thermal interface material of any one of the preceding claims, wherein the filler comprises graphene flakes.

15. 15. The thermal interface material of any one of claims 1 to 14, wherein the filler comprises at least one selected from the list consisting of carbon nanotubes, bundles of carbon nanotubes, and aggregates of aligned carbon nanotubes.

16. 16. The thermal interface material of claim 1, wherein the sheet comprises a first region proximate to the first major surface of the sheet and a second region proximate to the second major surface of the sheet, each of the first and second regions containing a respective subset of the thermal conduction elements of the filler that are less anisotropically oriented than the thermal conduction elements located more distal to the surface.

17. The thermal interface material of any preceding claim, wherein the carbon element comprises a graphite sheet.

18. The thermal interface material of any preceding claim, wherein the carbon element comprises a graphite strip.

19. The thermal interface material of any one of claims 1 to 18, wherein the filler is at least 50% by weight of the sheet.

20. The thermal interface material of any one of claims 1 to 18, wherein the filler is at least 70% by weight of the sheet.

21. The thermal interface material of any one of claims 1 to 18, wherein the filler is at least 80% by weight of the sheet.

22. The thermal interface material of any one of claims 1 to 18, wherein the filler is at least 90% by weight of the sheet.

23. The thermal interface material of any one of claims 1 to 18, wherein the filler is at least 95% by weight of the sheet.

24. 1. A method of making a thermal interface material, comprising: Forming a stack comprising a plurality of layers, Each layer comprises a substrate and a filler material comprising anisotropically oriented thermally conductive elements; forming a laminate, each layer extending from a lower surface to a top surface along a vertical direction, the layers being stacked in the vertical direction; applying a force to the stack to compress the stack along the vertical direction; and slicing the stack along a plane extending in the vertical direction and transverse to the top and bottom surfaces of the layers to form a sheet; Including, the heat conducting elements are oriented to preferentially promote heat flow in a direction transverse to the perpendicular direction; 11. A method of forming a laminate comprising: a sheet extending between a first major surface and a second major surface and comprising a portion of the substrate and the filler of the stack, the filler of the sheet comprising anisotropically oriented thermally conductive elements that are preferentially oriented along a primary direction from the first major surface to the second major surface to promote thermal conduction through the sheet along the primary direction, the method comprising: sandwiching carbon elements between at least some of the layers of the stack prior to the step of slicing the stack. Further comprising: The carbon element comprises at least one from the list consisting of graphite sheets, graphite strips, graphene sheets, and graphene strips. method.

25. Prior to completion of the step of forming the stack, Providing a mixture of a substrate and a filler material comprising a thermally conductive element; physically manipulating the mixture to anisotropically orient the heat conducting elements within the layer; forming each layer by a method including 25. The method of claim 24, further comprising:

26. 26. The method of claim 25, wherein physically manipulating the mixture to anisotropically orient the thermally conductive elements within the layer comprises at least one of extruding the mixture for the layer, compressing the mixture to form the layer, and repeatedly folding the mixture to form the layer.

27. The method of any one of claims 24 to 26, wherein the substrate is a self-repairing material.

28. 28. The method of any one of claims 24 to 27, further comprising applying a solvent to at least one of the first and second major surfaces of the sheet to enhance surface smoothness.

29. 30. The method of claim 28, further comprising applying pressure to at least a portion of the surface.

30. 30. The method of any one of claims 24 to 29, further comprising forming a region of the sheet proximate to the first or second major surface of the sheet, the region containing a subset of the thermal conduction elements of the filler that are less anisotropically oriented than the thermal conduction elements located more distal to the surface.

31. 31. The method of any one of claims 24 to 30, further comprising a layer of adhesive to at least one of the first and second major surfaces of the sheet.

32. The method of any one of claims 24 to 31, wherein the thermal interface material comprises the thermal interface material of any one of claims 1 to 23.

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