Method for manufacturing a wired circuit board and wired circuit board sheet

Abstract

To provide a wiring circuit board capable of accurately measuring alignment errors of masks and a manufacturing method thereof.SOLUTION: A method of manufacturing a wiring circuit board includes the following steps: forming a conductor pattern 5, where photo resist 49 is exposed plural times in a state where a forth mask 39 including a forth shielding mark 43 and a fifth mask 40 including a sixth shielding mark 46 are disposed in a longitudinal direction in this order, the photo resist 49 is developed to form plating resist 51, and plating is performed using the plating resist 51; exposing the plating resist 51, where on the photo resist 49, a portion that was a facing portion 55 on the fourth mask 39 at the time of the first exposure and a portion that mounted the fifth mask 40 at the time of the second exposure are overlapped. By the first time exposure of the photo resist 49 through the forth shielding mark 43 and the plating using the plating resist 51, a first conductive mark 25 is formed. By the second time exposure of the photo resist 49 through the fifth mask 40 and the plating using the plating resist 51, a third conductor mark 27 is formed.SELECTED DRAWING: Figure 10

Description

[Technical field]

[0001] The present invention relates to a method for producing a wired circuit board, and a wired circuit board sheet. [Background technology]

[0002] 2. Description of the Related Art Conventionally, there has been known a method for manufacturing a flexible substrate, in which a wiring pattern is formed on an insulating layer by a pattern forming method such as an additive method or a subtractive method.

[0003] For example, as a method for forming a wiring pattern using a subtractive method, a method has been proposed in which an exposure mask having openings of equal length and width at both ends is placed on a photosensitive resist layer placed on the surface of a metal layer so that the opening ends overlap sequentially in the longitudinal direction, and the resist layer is repeatedly exposed to light (see, for example, Patent Document 1 below).

[0004] In Patent Document 1, a linear resist pattern of uniform width in the longitudinal direction is formed by development after exposure, and then the metal layer exposed from the resist pattern is etched to form a linear wiring pattern of uniform width in the longitudinal direction. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2005-286207 A Summary of the Invention [Problem to be solved by the invention]

[0006] However, when the exposure mask is moved in the longitudinal direction, the opening edge of the exposure mask may be shifted in the width direction. In this case, there is a demand to measure the amount of shift and adjust the position of the mask based on the amount of shift.

[0007] According to the method described in Patent Document 1, although the shape of the finally formed wiring pattern caused by the above-mentioned deviation can be observed, there is a problem that the above-mentioned deviation of the mask cannot be measured. In detail, the part of the resist layer facing the exposure mask includes a part exposed once and a part exposed twice, and these parts cannot be distinguished by observing the shape of the wiring pattern. Therefore, the deviation amount of the exposure mask cannot be measured with high accuracy. Therefore, the position of the exposure mask cannot be adjusted.

[0008] Furthermore, there is a demand for accurate measurement of the misalignment of the wiring pattern caused by the above-mentioned misalignment of the mask.

[0009] The present invention provides a wired circuit board and a manufacturing method thereof that can measure the amount of misalignment of a mask with high accuracy, correct the mask placement, and further measure the misalignment of a wiring pattern. [Means for solving the problem]

[0010] The present invention (1) includes a step of forming a long insulating layer, and a step of forming a conductor layer that is long along the insulating layer and adjacent to the insulating layer in a thickness direction perpendicular to the longitudinal direction, the conductor layer having an intermediate portion located between one end and the other end in the longitudinal direction, the step of forming the conductor layer includes arranging a long photoresist along the insulating layer on one side of the thickness direction of the insulating layer, exposing the photoresist multiple times while arranging masks in sequence in the longitudinal direction, developing the exposed photoresist to form a resist corresponding to the conductor layer, and plating or etching is performed using the resist, the mask has at least a pattern corresponding to the intermediate portion of the conductor layer, and the step of exposing the photoresist includes: the nth exposure includes a portion facing one longitudinal end of the mask during the n+1th exposure, the other longitudinal end of the mask during the n+1th exposure includes the pattern and a first mark, and the n+1th exposure includes the pattern and a second mark; and in the step of forming the conductor layer, one conductor mark portion is formed by exposing the photoresist for the nth time via the first mark, forming a resist by developing the photoresist after exposure, and plating or etching using the resist, and another conductor mark portion adjacent to the one conductor mark portion when projected in the longitudinal direction is formed by exposing the photoresist for the n+1th time via the second mark, forming a resist by developing the photoresist after exposure, and plating or etching using the resist.

[0011] In this method, the distance between one conductor mark portion and another conductor mark portion is measured, and this distance is evaluated based on the distance between the first mark and the second mark on a projection surface projected longitudinally on the mask, thereby measuring the amount of deviation between one longitudinal end of the nth mask and the other longitudinal end of the (n+1)th mask.

[0012] This allows adjustment of the mask placement when the same process is subsequently performed.

[0013] Furthermore, since the above-mentioned mask misalignment amount can be measured, the misalignment amount between one longitudinal end of the intermediate portion corresponding to the n-th mask pattern and the other longitudinal end of the intermediate portion corresponding to the n+1-th mask pattern can be measured with high accuracy, and therefore the quality of the conductor layer can be determined with high accuracy.

[0014] The present invention (2) includes the method for manufacturing a wired circuit board described in (1), wherein one of the one conductor mark portion and the other conductor mark portion includes one portion and the other portion arranged opposite each other with a gap in a direction perpendicular to the longitudinal direction and the thickness direction, and the other includes a middle portion arranged between the one portion and the other portion and spaced apart from them.

[0015] In this method, by measuring the distance between the middle portion and one portion, and the distance between the middle portion and the other portion, the amount of deviation between one longitudinal end of the nth mask and the other longitudinal end of the (n+1)th mask can be measured with greater accuracy.

[0016] Therefore, the mask placement can be adjusted with high precision when the same process is subsequently performed.

[0017] Furthermore, the amount of deviation between one longitudinal end of the intermediate portion corresponding to the n-th mask pattern and the other longitudinal end of the intermediate portion corresponding to the n+1-th mask pattern can be measured with even greater accuracy, so that the quality of the conductor layer can be determined with even greater accuracy.

[0018] The present invention (3) includes the method for manufacturing a wired circuit board described in (1) or (2), in which the measurement mark portion including the one conductor mark portion and the other conductor mark portion is arranged at intervals from each other in a longitudinal direction and an orthogonal direction perpendicular to the thickness direction.

[0019] In this method, since a plurality of measurement mark portions are arranged at intervals from each other in the orthogonal direction, even if the (n+1)th mask rotates with respect to the nth mask, the amount of rotation can be measured.

[0020] The present invention (4) comprises a step of forming a long insulating layer, and a step of forming a conductor layer that is long along the insulating layer and adjacent to the insulating layer in a thickness direction perpendicular to the longitudinal direction, the insulating layer having an intermediate portion located between one end and the other end in the longitudinal direction, the step of forming the insulating layer includes arranging a long photosensitive resin insulating layer, exposing the photosensitive resin insulating layer a plurality of times while arranging masks in sequence in the longitudinal direction, and developing the photosensitive resin insulating layer after exposure, the mask having at least a pattern corresponding to the intermediate portion of the insulating layer, and the step of exposing the photosensitive resin insulating layer includes exposing a portion of the photosensitive resin insulating layer that faces the other longitudinal end of the mask during the nth exposure (n is a natural number) and a portion of the nth exposure (n is a natural number) to light. the n+1th exposure overlaps a portion of the mask that faces one longitudinal end of the mask during the n+1th exposure, the other longitudinal end of the mask during the n+1th exposure includes the pattern and a third mark, and the one longitudinal end of the mask during the n+1th exposure includes the pattern and a fourth mark; and in the step of forming the insulating layer, one insulating mark portion is formed by exposing the photosensitive resin insulating layer during the nth exposure via the third mark and developing the photosensitive resin insulating layer after exposure, and another insulating mark portion adjacent to the one insulating mark portion is formed by exposing the photosensitive resin insulating layer during the n+1th exposure via the second mark and developing the photosensitive resin insulating layer after exposure, when projected in the longitudinal direction.

[0021] In this method, the distance between the first insulation mark and the second insulation mark is measured, and this distance is evaluated based on the distance between the third mark and the fourth mark on a projection surface projected longitudinally on the mask, thereby measuring the amount of deviation between one longitudinal end of the nth mask and the other longitudinal end of the (n+1)th mask.

[0022] Therefore, the mask placement can be adjusted with high precision when the same process is subsequently performed.

[0023] Furthermore, the amount of deviation between one longitudinal end of the intermediate portion corresponding to the n-th mask pattern and the other longitudinal end of the intermediate portion corresponding to the n+1-th mask pattern can be measured with high accuracy, so that the quality of the insulating layer can be determined with high accuracy.

[0024] The present invention (5) includes a wired circuit board sheet comprising: a long support sheet; a base insulating layer extending in the longitudinal direction of the support sheet and disposed on one surface in the thickness direction of the support sheet; and a conductor layer extending in the longitudinal direction and disposed on one surface in the thickness direction of the base insulating layer, the wired circuit board sheet having a plurality of areas partitioned in sequence in the longitudinal direction, the conductor layer having an intermediate portion located between one end portion and the other end portion in the longitudinal direction, disposed at a boundary portion between adjacent areas in the longitudinal direction, configured to measure the amount of deviation of the intermediate portion at the boundary portion in the thickness direction and in an orthogonal direction perpendicular to the longitudinal direction, and comprising a first measurement mark portion independent of the conductor layer.

[0025] Since the wired circuit board includes the first measurement mark portion, the amount of deviation in the middle portion of the conductor layer can be measured and the quality of the conductor layer can be determined. Therefore, the conductor layer of the wired circuit board has excellent reliability.

[0026] The present invention (6) includes the wired circuit board sheet according to (5), wherein the base insulating layer has a second intermediate portion located between one end portion and the other end portion in the longitudinal direction, and is configured to measure the amount of deviation of the second intermediate portion in the boundary portion in the perpendicular direction, and is provided with a second measurement mark portion independent of the base insulating layer.

[0027] Since the wired circuit board includes the second measurement mark portion, the amount of deviation in the middle portion of the insulating layer can be measured and the quality of the insulating layer can be determined. Therefore, the insulating layer of the wired circuit board has excellent reliability.

[0028] The present invention (7) provides the wired circuit board sheet according to (6), in which the first measurement mark portion and the second measurement mark portion overlap each other.

[0029] In this wired circuit board, the configuration of the measurement mark portion is compact. Also, by detecting one of the first and second measurement mark portions, the other can be easily detected. Effect of the Invention

[0030] The method for producing a wired circuit board of the present invention can measure the amount of misalignment of a mask with high accuracy, correct the mask position, and further measure the misalignment of a wiring pattern.

[0031] In the wired circuit board sheet of the present invention, the amount of deviation in the central portion of the conductor layer can be measured. [Brief description of the drawings]

[0032] [Figure 1] FIG. 1 is a plan view of the wired circuit board sheet of the present invention. [Diagram 2] FIG. 2 is a side cross-sectional view taken along the line XX of the wired circuit board sheet shown in FIG. [Diagram 3] 3 is a front cross-sectional view taken along line YY of the wired circuit board sheet shown in FIG. [Figure 4] FIG. 4 is an enlarged plan view of a measurement mark portion provided on the wired circuit board sheet shown in FIG. [Diagram 5] 5A to 5C are process diagrams of a method for producing the wired circuit board sheet shown in FIG. 1, where FIG. 5A shows a process for forming a base insulating layer, FIG. 5B shows a process for forming a conductor pattern, and FIG. 5C shows a process for forming a cover insulating layer. [Figure 6] 6A and 6B are process diagrams of a method for producing the wired circuit board sheet shown in FIG. 2, with FIG. 6A showing a process for forming a base insulating layer and FIG. 6B showing a process for forming a conductor pattern. [Figure 7]7A to 7B are process diagrams of a method for manufacturing the wired circuit board sheet shown in FIG. 3, where FIG. 7A shows a process for forming a base insulating layer and an insulation measurement mark portion, and FIG. 7B shows a process for forming a conductor pattern and a conductor measurement mark portion. [Figure 8] Figures 8A to 8C are process diagrams explaining the process of exposing a photosensitive base precursor layer while moving the masks, where Figure 8A shows the process of placing a first mask, Figure 8B shows the process of placing a second mask, and Figure 8C shows the process of placing a third mask. [Figure 9] Figures 9A to 9C explain the process of exposing the photosensitive base precursor layer through a mask, and are cross-sectional views of the process along line ZZ of Figures 8A to 8C, where Figure 9A shows the process of exposing the photosensitive base precursor layer through a first mask, Figure 9B shows the process of exposing the photosensitive base precursor layer through a second mask, and Figure 9C shows the process of developing the photosensitive base precursor layer to form an insulating measurement mark portion. [Figure 10] 10A to 10C are process diagrams explaining the process of exposing the photoresist while moving the masks, where FIG. 10A shows the process of placing a fourth mask, FIG. 10B shows the process of placing a fifth mask, and FIG. 10C shows the process of placing a sixth mask. [Figure 11] Figures 11A to 11D are process cross-sectional views along line ZZ of Figures 10A to 10C, explaining the process of exposing the photoresist through a mask, where Figure 11A shows the process of exposing the photoresist through a fourth mask, Figure 11B shows the process of exposing the photoresist through a fifth mask, Figure 11C shows the process of developing the photoresist to form a plating resist, and Figure 11D shows the process of forming a conductor measurement mark portion by plating using the plating resist. [Figure 12] 12A shows a state in which the first light-transmitting patterns of the first mask and the second mask are misaligned, and FIG. 12B is a plan view of an insulation measurement mark portion and a base insulating layer corresponding to FIG. 12A. [Figure 13] 13A shows a state in which the fourth light-shielding patterns of the fourth mask and the fifth mask are misaligned, and FIG. 13B is a plan view of the conductor measurement mark portion and the conductor pattern corresponding to FIG. 13A. [Figure 14] Figures 14A to 14D are modified examples of the manufacturing process shown in Figures 11A to 11D, and show an aspect of forming a conductor pattern and a conductor measurement mark portion by etching, where Figure 14A shows a process of exposing a photoresist through a fourth mask, Figure 14B shows a process of exposing a photoresist through a fifth mask, Figure 14C shows a process of developing the photoresist to form an etching resist, and Figure 14D shows a process of forming a conductor measurement mark portion and a conductor pattern by etching using the etching resist. [Figure 15] 15A to 15C show a modified example in which the same mask is moved, where FIG. 15A shows the step of placing a fifth mask, FIG. 15B shows the step of moving the fifth mask, and FIG. 15C shows an embodiment in which three measurement mark portions are formed at each of both widthwise end portions of the wiring circuit board sheet. [Figure 16] FIG. 16 is a plan view of a wired circuit board assembly sheet which is a modified example of the wired circuit board sheet including a plurality of wired circuit boards. [Figure 17] Figures 17A to 17C show a modified example in which the light-shielding mark is spaced apart from the longitudinal edge of the mask, with Figure 17A showing the step of placing a fourth mask, Figure 17B showing the step of placing a fifth mask, and Figure 17C showing the step of producing a wired circuit board sheet. [Figure 18] 18A to 18C show a modified example in which the conductor measurement mark portion has only a first conductor mark, where FIG. 18A shows the process of placing a fourth mask, FIG. 18B shows the process of placing a fifth mask, and FIG. 18C shows the process of manufacturing a wired circuit board sheet. [Figure 19] 19A to 19C show a modified example in which there are two third conductive marks 27, with FIG. 19A showing the step of placing a fourth mask, FIG. 19B showing the step of placing a fifth mask, and FIG. 18C showing the step of manufacturing a wired circuit board sheet. [Figure 20] 20A to 20C show a modified example in which the conductor measurement mark portion has a double rectangular frame shape, where FIG. 20A shows the process of placing a fourth mask, FIG. 20B shows the process of placing a fifth mask, and FIG. 20C shows the process of manufacturing a wired circuit board sheet. [Figure 21] 21A to 21C show a modified example in which the conductor measurement mark portion has a double ring shape, with FIG. 21A showing the process of placing a fourth mask, FIG. 21B showing the process of placing a fifth mask, and FIG. 21C showing the process of manufacturing a wired circuit board sheet. [Figure 22] 21A to 21C show a modified example in which the conductor measurement mark portion has two U-shaped portions, FIG. 22A shows the process of placing a fourth mask, FIG. 22B shows the process of placing a fifth mask, and FIG. 22C shows the process of manufacturing a wired circuit board sheet. [Figure 23] 23A to 23D show a modified example in which the same mask is moved from one side in the longitudinal direction to the other side, where FIG. 23A shows a step of placing a mask at one end of the photoresist in the longitudinal direction, FIG. 23A shows a step of moving the same mask, FIG. 23C shows a step of moving the same mask, and FIG. 23D is a plan view of a wiring circuit board sheet having a linear conductor pattern. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0033] (One embodiment) One embodiment of the method for producing a wired circuit board sheet and a wired circuit board of the present invention will be described with reference to Figs. 1 to 13B.

[0034] In Fig. 1, the cover insulating layer 10 (described later) is omitted in order to clearly show the shapes of the conductor pattern 5 and the base insulating layer 9 (described later). In Figs. 13A and 13B, the base insulating layer 9 is omitted in order to clearly show the respective arrangements of the conductor pattern 5 and the conductor measurement mark portion 18 (described later).

[0035] 1 to 3, the wired circuit board sheet 1 is a generally rectangular sheet having a predetermined thickness and extending in the longitudinal direction (direction perpendicular to the thickness direction) in a plan view. The wired circuit board sheet 1 includes one support sheet 2, one wired circuit board 3, and a plurality of measurement mark portions 4.

[0036] The support sheet 2 has the same shape in plan view as the wiring circuit board sheet 1. The support sheet 2 is not particularly limited as long as it is a sheet that can support (secure) the wiring circuit board 3 from the other side in the thickness direction, and examples thereof include sheets having toughness, flexibility, rigidity, etc. Examples of the support sheet 2 include metal sheets such as stainless steel sheets, resin sheets such as polyimide sheets, and paper. The support sheet 2 is a single layer or multiple layers (laminate). The thickness of the support sheet 2 is not particularly limited, and is, for example, 5 μm or more, preferably 10 μm or more, and, for example, 500 μm or less, preferably 200 μm or less.

[0037] The wired circuit board 3 is disposed on the inside of the peripheral edge in the planar direction (direction perpendicular to the thickness direction) on one thickness-wise surface of the support sheet 2. The wired circuit board 3 has a generally rectangular plate shape extending along the longitudinal direction.

[0038] The wired circuit board 3 includes a conductor pattern 5. The conductor pattern 5 is arranged in the longitudinal direction of the wired circuit board 3. The conductor pattern 5 extends in the longitudinal direction. The conductor pattern 5 includes one conductor end portion 6, the other conductor end portion 7, and a conductor intermediate portion 8 as an example of an intermediate portion.

[0039] The conductor one end 6 is located at one end in the longitudinal direction of the conductor pattern 5. The conductor one end 6 includes, for example, a one-side terminal. A plurality of the one-side terminals are arranged adjacent to each other at intervals in the longitudinal direction and width direction (an example of an orthogonal direction orthogonal to the longitudinal direction and thickness direction) on the wired circuit board 3. Each of the plurality of one-side terminals has, for example, a substantially rectangular land shape.

[0040] The other end 7 of the conductor is located at the other end in the width direction of the conductor pattern 5. The other end 7 of the conductor includes, for example, a other-side terminal. The other-side terminals are arranged adjacent to each other at intervals in the longitudinal and width directions on the wired circuit board 3. Each of the multiple other-side terminals has, for example, a substantially rectangular land shape.

[0041] The conductor intermediate portion 8 is located at the longitudinal center of the conductor pattern 5. The conductor intermediate portion 8 is located between the conductor one end portion 6 and the conductor other end portion 7. The conductor intermediate portion 8 extends in the longitudinal direction. The conductor intermediate portion 8 includes a wiring that is narrower than the one side terminal and the other side terminal. The wiring is continuous with the one side terminal and the other side terminal. As a result, the wiring connects the one side terminal and the other side terminal in the longitudinal direction. The wiring is arranged adjacent to each other at intervals in the width direction on the wired circuit board 3. The multiple wirings are parallel to each other. Each of the multiple wirings has a substantially linear shape in a plan view along the longitudinal direction.

[0042] The longitudinal length of the conductor pattern 5 is, for example, 300 mm or more, preferably 600 mm or more, more preferably 1,000 mm or more, and for example, 10,000 mm or less. The longitudinal length of the conductor pattern 5 is the distance between one end edge of the conductor one end 6 and the other end edge of the conductor other end 7. If the longitudinal length of the conductor pattern 5 is equal to or greater than the above-mentioned lower limit, the wired circuit board 3 is suitable as a long wired circuit board for transmitting electric signals and power supply current over a long distance.

[0043] The width of the wiring in the conductor pattern 5 is, for example, 100 μm or less, preferably 90 μm or less, more preferably 80 μm or less, and for example, 5 μm or more. The interval between adjacent wirings is, for example, 100 μm or less, preferably 90 μm or less, more preferably 80 μm or less, and for example, 5 μm or more. If the width and / or interval is equal to or less than the above-mentioned upper limit, it is suitable as a narrow-width wiring circuit board 3.

[0044] An example of the material of the conductive pattern 5 is a conductor such as copper. The thickness of the conductive pattern 5 is, for example, not less than 5 μm and not more than 100 μm.

[0045] The wired circuit board 3 further includes a base insulating layer 9 as an example of an insulating layer adjacent to the conductor pattern 5 on the other and one sides in the thickness direction, respectively, and an insulating cover layer 10. Specifically, the wired circuit board 3 includes the base insulating layer 9, the above-mentioned conductor pattern 5 arranged on one thickness direction surface of the base insulating layer 9, and a cover insulating layer 10 arranged on one thickness direction surface of the base insulating layer 9 so as to expose one side terminal and the other side terminal of the conductor pattern 5 and to cover one thickness direction surface and both side surfaces in the planar direction of the wiring of the conductor pattern 5.

[0046] The base insulating layer 9 is disposed on one surface in the thickness direction of the support sheet 2. The base insulating layer 9 has the same outer shape as the wired circuit board 3.

[0047] The insulating base layer 9 integrally includes a base one end 11 as an example of one end, a base other end 12 as an example of the other end, and a base intermediate portion 13 as an example of a second intermediate portion. The base one end 11 encompasses the conductor one end 6 in a plan view. The base other end 12 encompasses the conductor other end 7 in a plan view. The base intermediate portion 13 encompasses the conductor intermediate portion 8 in a plan view. An example of the material for the insulating base layer 9 is an insulating resin such as polyimide. The insulating base layer 9 has a thickness of, for example, 3 μm or more and 50 μm or less.

[0048] As shown in Fig. 2 and Fig. 5C, the cover insulating layer 10 includes one cover end portion 14, the other cover end portion 15, and a cover intermediate portion 16. The one cover end portion 14 is included in the one base end portion 11 in a plan view. The other cover end portion 15 is included in the other base end portion 12 in a plan view. The cover intermediate portion 16 is included in the base intermediate portion 13 in a plan view. Examples of materials for the cover insulating layer 10 include resins having insulating properties, such as polyimide. The thickness of the cover insulating layer 10 is, for example, 3 µm or more and 50 µm or less.

[0049] As shown in FIGS. 1 and 3, the measurement mark portions 4 are disposed on one surface of the support sheet 2 in the thickness direction, at both ends in the width direction.

[0050] A plurality of (two) measurement mark portions 4 are arranged at one end in the width direction of the support sheet 2 at an interval in the longitudinal direction.

[0051] A plurality of (two) measurement mark portions 4 are arranged at the other end in the width direction of the support sheet 2 at an interval in the longitudinal direction.

[0052] In the wired circuit board sheet 1, two measurement mark portions 4 arranged opposite each other in the width direction define a boundary 20 between adjacent sheet areas 19 in the longitudinal direction. The boundary 20 is a line segment passing through one measurement mark portion 4 and the other measurement mark portion 4, and extends along the width direction. Note that although the boundary 20 is shown by a virtual line in Fig. 1 and Figs. 5A to 5C, in the actual wired circuit board sheet 1, the outline of the boundary 20 may not be clearly visible.

[0053] The surrounding area including the boundary 20 is defined as a boundary portion 21. The measurement mark portion 4 is located in the boundary portion 21.

[0054] Each (one) seat area 19 is partitioned by a plurality (two) of boundaries 20 spaced apart in the longitudinal direction. The plurality (three) seat areas 19 are partitioned in sequence in the longitudinal direction. In this wired circuit board sheet 1, one wired circuit board 3 is disposed across the plurality (three) of continuous seat areas 19.

[0055] 1 and 5C, for example, the three seat areas 19 are designated as a first seat area 19A, a second seat area 19B, and a third seat area 19C in order from one side to the other side in the longitudinal direction. In this case, the conductor one end 6, the base one end 11, and the cover one end 14 are arranged in the first seat area 19A. The conductor other end 7, the base other end 12, and the cover other end 15 are arranged in the third seat area 19C. Meanwhile, the conductor middle portion 8, the base middle portion 13, and the cover middle portion 16 are arranged across the first seat area 19A to the third seat area 19C (all of the multiple seat areas 19).

[0056] As shown in FIG. 4, the measurement mark portion 4 includes an insulation measurement mark portion 17 as an example of a second measurement mark portion, and a conductor measurement mark portion 18 as an example of a first measurement mark portion.

[0057] The insulation measurement mark portions 17 are arranged at intervals on the outer sides in the width direction of the base insulating layer 9. The insulation measurement mark portions 17 are independent of the base insulating layer 9.

[0058] The insulation measurement mark portion 17 includes a first insulation mark 22 as an example of one portion, a third insulation mark 24 as an example of a middle portion, and a second insulation mark 23 as an example of the other portion, which are arranged in this order from one side to the other side in the width direction. The first insulation mark 22, the third insulation mark 24, and the second insulation mark 23 are spaced apart from each other in the width direction. The first insulation mark 22, the third insulation mark 24, and the second insulation mark 23 overlap each other when projected in the width direction.

[0059] As a result, the first insulation mark 22 and the second insulation mark 23 are arranged opposite each other at a distance in the width direction. Also, the third insulation mark 24 is arranged between the first insulation mark 22 and the second insulation mark 23, with a distance therebetween.

[0060] The first insulation mark 22, the third insulation mark 24, and the second insulation mark 23 each have a generally linear shape along the longitudinal direction of the base insulating layer 9 in a plan view.

[0061] The first insulation mark 22 and the second insulation mark 23 are an example of one insulation mark portion, and the third insulation mark 24 is an example of another insulation mark portion.

[0062] The conductor measurement mark portions 18 are arranged at intervals on the outer sides in the width direction of the conductor pattern 5. The conductor measurement mark portions 18 are electrically independent from the conductor pattern 5.

[0063] The conductor measurement mark portion 18 includes a first conductor mark 25 as an example of one portion, a third conductor mark 27 as an example of a middle portion, and a second conductor mark 26 as an example of the other portion, which are arranged in this order from the other side in the width direction to the one side. The first conductor mark 25, the third conductor mark 27, and the second conductor mark 26 are included in the first insulation mark 22, the third insulation mark 24, and the second insulation mark 23, respectively, in a plan view. The first conductor mark 25 and the second conductor mark 26 are arranged opposite each other with a gap in the width direction. The third conductor mark 27 is arranged between the first conductor mark 25 and the second conductor mark 26, and there is a gap between them.

[0064] Specifically, first conductive mark 25 has a generally linear shape in a plan view that is smaller than first insulating mark 22 and extends along the longitudinal direction of conductive pattern 5. First conductive mark 25 has a shorter longitudinal length than first insulating mark 22. When projected in the width direction, first conductive mark 25 does not overlap both longitudinal end portions of first insulating mark 22.

[0065] The third conductive mark 27 is parallel to the first conductive mark 25 and has a generally linear shape in a plan view that is smaller than the third insulating mark 24. The third conductive mark 27 has a shorter longitudinal length than the third insulating mark 24. When projected in the width direction, the third conductive mark 27 does not overlap both longitudinal end portions of the third insulating mark 24.

[0066] The second conductive mark 26 is parallel to the first conductive mark 25 and has a generally linear shape in a plan view that is smaller than the second insulating mark 23. The second conductive mark 26 has a shorter longitudinal length than the second insulating mark 23. When projected in the width direction, the second conductive mark 26 does not overlap both longitudinal ends of the second insulating mark 23.

[0067] The first conductive mark 25 and the second conductive mark 26 are an example of a one conductive mark portion. The third conductive mark 27 is an example of an other conductive mark portion.

[0068] Next, a method for producing this wired circuit board sheet 1 will be described.

[0069] As shown in Figures 2 to 3 and 6A to 7B, this method includes a first step of preparing a support sheet 2, a second step of forming a base insulating layer 9 and an insulation measurement mark portion 17 (see Figures 6A and 7A), a third step of measuring the amount of misalignment of masks 29, 30, and 31 (see Figures 4 and 12B), a fourth step of forming a conductor pattern 5 and a conductor measurement mark portion 18 (see Figures 6B and 7B), a fifth step of measuring the amount of misalignment of masks 39, 40, and 41 (see Figures 4 and 13B), and a sixth step of forming a cover insulating layer 10 (see Figures 2 to 3). In this embodiment, the first step to the sixth step are performed in order. [1st step] In the first step, a long support sheet 2 is prepared. [Second process] As shown in FIGS. 6A and 7A, in the second step, the base insulating layer 9 and the insulation measurement mark portion 17 are subsequently formed by photolithography.

[0070] 9A, in the photolithography, a photosensitive base precursor layer 28 as an example of a photosensitive resin insulating layer is disposed over the entire surface of one thickness direction surface of the support sheet 2. Specifically, a photosensitive resin varnish is applied to one thickness direction surface of the support sheet 2, and then dried to form a long photosensitive base precursor layer 28.

[0071] Subsequently, as shown in FIGS. 8A to 9C, the photosensitive base precursor layer 28 is exposed multiple times (three times) while three masks 29, 30, and 31 are arranged in sequence in the longitudinal direction, and the exposed photosensitive base precursor layer 28 is developed.

[0072] 8A to 8C, the three masks 29, 30, and 31 are a first mask 29, a second mask 30, and a third mask 31. Each of the first mask 29, the second mask 30, and the third mask 31 has a generally rectangular outer shape in a plan view.

[0073] As shown in FIGS. 8A and 9A, the first mask 29 includes a first light-transmitting pattern 32, a first light-transmitting mark 33, and a second light-transmitting mark .

[0074] 5A. The other longitudinal edge of the first light-transmitting pattern 32 is included in the other longitudinal edge of the first mask 29. The first light-transmitting pattern 32 extends from the other longitudinal edge of the first mask 29 to one side midway in the longitudinal direction.

[0075] As shown in Fig. 8A, the first light-transmitting mark 33 corresponds to the first insulation mark 22 shown in Fig. 5A. The second light-transmitting mark 34 corresponds to the second insulation mark 23 shown in Fig. 5A.

[0076] The first light-transmitting mark 33 and the second light-transmitting mark 34 are disposed at the other end of the first mask 29 in the longitudinal direction. The other end edges of the first light-transmitting mark 33 and the second light-transmitting mark 34 are included in the other end edge of the first mask 29 in the longitudinal direction. The first light-transmitting mark 33 and the second light-transmitting mark 34 each extend from the other end edge of the first mask 29 in the longitudinal direction toward one side to a midway point in the longitudinal direction. The shapes of the first light-transmitting mark 33 and the second light-transmitting mark 34 are the same as the shapes of the first insulating mark 22 and the second insulating mark 23 shown in FIG. 5A. The first light-transmitting mark 33 and the second light-transmitting mark 34 are both disposed at both ends of the first mask 29 in the width direction.

[0077] As shown in FIGS. 8B and 9B, the second mask 30 includes a second light-transmitting pattern 35, a third light-transmitting mark 36, a first light-transmitting mark 33, and a second light-transmitting mark 34.

[0078] The second light-transmitting pattern 35 corresponds to the base intermediate portion 13 shown in Fig. 5A. The second light-transmitting pattern 35 extends from one edge to the other edge in the longitudinal direction of the second mask 30.

[0079] The third light-transmitting mark 36 shown in FIG. 8B corresponds to the third insulating mark 24 shown in FIG. 5A. The third light-transmitting mark 36 is disposed at one longitudinal end of the second mask 30. One longitudinal end edge of the third light-transmitting mark 36 is included in one longitudinal end edge of the second mask 30. The third light-transmitting mark 36 extends from one longitudinal end edge of the second mask 30 to the middle of the longitudinal direction toward the other side. The shape of the third light-transmitting mark 36 is the same as the shape of the third insulating mark 24. The third light-transmitting mark 36 is disposed at both ends in the width direction of the second mask 30.

[0080] The first light-transmitting mark 33 and the second light-transmitting mark 34 (see FIG. 8A) in the second mask 30 shown in FIG. 8B have the same configuration (shape, arrangement, etc.) as the first light-transmitting mark 33 and the second light-transmitting mark 34 in the first mask 29.

[0081] Furthermore, the third light-transmitting mark 36 is offset from the first light-transmitting mark 33 and the second light-transmitting mark 34 when projected in the longitudinal direction on the second mask 30. Specifically, the third light-transmitting mark 36 is located between the first light-transmitting mark 33 and the second light-transmitting mark 34 when projected in the longitudinal direction.

[0082] When projected in the longitudinal direction, the width direction distance L1 between the first light-transmitting mark 33 and the third light-transmitting mark 36 and the width direction length L2 between the third light-transmitting mark 36 and the second light-transmitting mark 34 are lengths that serve as references for measuring the amount of misalignment described below. In other words, the width direction lengths L1 and L2 are not dependent on the amount of misalignment described below, that is, they are amounts that are inherent to the second mask 30.

[0083] As shown in FIG. 8C, the third mask 31 includes a third light-transmitting pattern 37 and a third light-transmitting mark .

[0084] The third light-transmitting pattern 37 corresponds to the base one end portion 11 and the base intermediate portion 13 shown in Fig. 5A. The third light-transmitting pattern 37 extends from one longitudinal edge of the third mask 31 to the middle of the longitudinal direction toward the other longitudinal edge.

[0085] The third light-transmitting marks 36 in the third mask 31 have the same configuration (shape, arrangement, etc.) as the third light-transmitting marks 36 in the second mask 30.

[0086] In the three masks 29, 30, and 31 described above, each light-transmitting pattern and light-transmitting mark is a light-transmitting portion that transmits light in the next exposure, and the portions other than the light-transmitting portions are light-shielding portions that block light.

[0087] 8A and 9A, in this photolithography, first, a first mask 29 is placed on one side in the thickness direction of one end portion in the longitudinal direction of the photosensitive base precursor layer 28. Next, the photosensitive base precursor layer 28 is exposed through the first mask 29 (first exposure). Then, a latent image 38 corresponding to the first light-transmitting pattern 32, the first light-transmitting mark 33, and the second light-transmitting mark 34 is formed in the photosensitive base precursor layer 28. The latent image 38 is formed by irradiating the photosensitive base precursor layer 28 with light that has passed through the light-transmitting pattern and the light-transmitting mark.

[0088] Next, as shown in FIG. 8B and FIG. 9B, in this photolithography, instead of the first mask 29, a second mask 30 is placed on one side in the thickness direction of the photosensitive base precursor layer 28. The second mask 30 is placed on the other side in the longitudinal direction with respect to the placement position of the first mask 29, and is placed on the photosensitive base precursor layer 28 so that one end in the longitudinal direction of the second mask 30 overlaps in the thickness direction with an opposing portion 55 in the photosensitive base precursor layer 28 that faces the other end in the longitudinal direction of the first mask 29. Next, the photosensitive base precursor layer 28 is exposed through the second mask 30 (second exposure). Then, a latent image 38 corresponding to the second light-transmitting pattern 35, the third light-transmitting mark 36, the first light-transmitting mark 33, and the second light-transmitting mark 34 is formed in the photosensitive base precursor layer 28.

[0089] In the latent image , an opposing portion 55 corresponding to the first light-transmitting pattern 32 overlaps with a portion opposing the second light-transmitting pattern .

[0090] On the other hand, a latent image 38 (see FIG. 9A) corresponding to the first light-transmitting mark 33 and the second light-transmitting mark 34 during the first exposure and a latent image 38 (see FIG. 9B) corresponding to the third light-transmitting mark 36 during the second exposure do not overlap (are offset), and specifically, are spaced apart from each other in the width direction.

[0091] As a result, at the boundary portion 21 between the first sheet area 19A and the second sheet area 19B, the latent image 38 formed by the current exposure using the third light-transmitting mark 36 is added to the latent image 38 formed by the previous exposure using the first light-transmitting mark 33 and the second light-transmitting mark 34.

[0092] Thereafter, as shown in FIG. 8C, in this method, instead of the second mask 30, a third mask 31 is placed on one side in the thickness direction of the photosensitive base precursor layer 28. The third mask 31 is placed on the other side in the longitudinal direction with respect to the placement position of the second mask 30, and is placed on the photosensitive base precursor layer 28 so that one end of the third mask 31 in the longitudinal direction overlaps in the thickness direction with an opposing portion 55 in the photosensitive base precursor layer 28 that faces the other end of the second mask 30 in the longitudinal direction. Next, the photosensitive base precursor layer 28 is exposed through the third mask 31. Then, a latent image 38 corresponding to the third light-transmitting pattern 37 and the third light-transmitting mark 36 is formed on the photosensitive base precursor layer 28.

[0093] As shown in FIG. 8C, in the latent image 38, the facing portion 55 corresponding to the second light transmitting pattern 35 overlaps with the portion facing the third light transmitting pattern 37.

[0094] On the other hand, the latent image 38 (see FIG. 8B) corresponding to the first light-transmitting mark 33 and the second light-transmitting mark 34 during the second exposure and the latent image 38 (see FIG. 9C) corresponding to the third light-transmitting mark 36 during the third exposure do not overlap (are offset), specifically, they are spaced apart from each other in the width direction. As a result, in the boundary portion 21 between the second sheet area 19B and the third sheet area 19C, the latent image 38 formed by the current exposure using the third light-transmitting mark 36 is added to the latent image 38 formed by the previous exposure using the first light-transmitting mark 33 and the second light-transmitting mark 34.

[0095] Thereafter, the photosensitive base precursor layer 28 with the above-mentioned latent image 38 formed thereon is developed and, if necessary, heated.

[0096] As a result, as shown in FIG. 5A, the base insulating layer 9 and the insulation measurement mark portion 17 are formed simultaneously.

[0097] [3rd step] Thereafter, the amounts of misalignment of masks 29, 30, and 31 shown in FIGS. 8A to 8C are measured.

[0098] Fig. 12A shows a state in which the first light-transmitting pattern 32 of the first mask 29 and the first light-transmitting pattern 32 of the second mask 30 are misaligned at the boundary portion 21 between the first sheet area 19A and the second sheet area 19B. Fig. 12B also shows the base insulating layer 9 and the insulation measurement mark portion 17 formed by the above-mentioned first mask 29 and second mask 30.

[0099] In the third step, as shown in FIG. 12B, first, the insulation measurement mark portion 17 in the boundary portion 21 between the first sheet area 19A and the second sheet area 19B is detected.

[0100] Next, the widthwise distance L11 between the first insulation mark 22 and the third insulation mark 24 in the insulation measurement mark portion 17 is measured. Then, this distance L11 is compared with the widthwise distance L1 (see FIG. 8B) (known) between the first light-transmitting mark 33 and the third light-transmitting mark 36, and the difference is obtained as a widthwise deviation between the other longitudinal end of the first light-transmitting pattern 32 of the first mask 29 and one longitudinal end of the first light-transmitting pattern 32 of the second mask 30, as shown in FIG. 12A. This deviation corresponds to a deviation between the widthwise edge of the base intermediate portion 13 of the first sheet area 19A and the widthwise edge of the base intermediate portion 13 of the second sheet area 19B in the facing portion 55 of the photosensitive base precursor layer 28, as shown in FIG. 12B.

[0101] Additionally, the widthwise distance L12 between the third insulating mark 24 and the second insulating mark 23 is measured. Then, this distance L12 is compared with the widthwise length L2 (see FIG. 8B) (known) between the third light-transmitting mark 36 and the second light-transmitting mark 34, and the difference therebetween is obtained as a widthwise deviation between the other longitudinal end of the first light-transmitting pattern 32 of the first mask 29 and one longitudinal end of the first light-transmitting pattern 32 of the second mask 30, as shown in FIG. 12A. This deviation corresponds to a deviation between the widthwise edge of the base intermediate portion 13 of the first sheet area 19A and the widthwise edge of the base intermediate portion 13 of the second sheet area 19B, as shown in FIG. 12B.

[0102] The above-mentioned measurements are performed on the insulation measurement mark portions 17 at both widthwise ends, and also on the insulation measurement mark portions 17 at the boundary portion 21 between the second sheet area 19B and the third sheet area 19C.

[0103] Thereafter, based on the misalignment of the masks 29, 30, 31, the widthwise positions of the masks 29, 30, 31 relative to the photosensitive base precursor layer 28 on which the insulating base layer 9 is to be formed next are adjusted.

[0104] If the deviation of the base intermediate portion 13 is within the tolerance range, the next step 4 and subsequent steps are carried out. On the other hand, if the deviation of the width direction edge of the base intermediate portion 13 is outside the tolerance range, that is, if it is a defective part, the next step 4 and subsequent steps are not carried out and the part is removed from the manufacturing target (manufacturing line). This allows the material of the conductor pattern 5 in the fifth step and the material of the cover insulating layer 10 in the sixth step to be used for manufacturing good conductor patterns 5 and cover insulating layers 10, respectively. [4th step] In the fourth step, as shown in FIG. 5B and FIG. 7B, the conductor pattern 5 and the conductor measurement mark portion 18 are formed.

[0105] In the fourth step, first, as shown in FIG. 11A, a seed film 50 is formed on the surfaces (including one surface in the thickness direction) of the support sheet 2, the base insulating layer 9, and the insulation measurement mark portion 17.

[0106] Subsequently, as shown in FIGS. 11A to 11C, a plating resist 51 is formed by photolithography.

[0107] 11A, first, a photoresist 49 is placed on the surface of a seed film 50. Specifically, a photosensitive dry film resist is laminated on the surface of the seed film 50 to form the photoresist 49 on the entire surface of the seed film 50.

[0108] Thereafter, as shown in FIGS. 10A to 11B, the photoresist 49 is exposed multiple times while three masks 39, 40, and 41 are arranged in sequence in the longitudinal direction.

[0109] 10A to 10C, the three masks 39, 40, 41 are a fourth mask 39, a fifth mask 40, and a sixth mask 41. Each of the fourth mask 39, the fifth mask 40, and the sixth mask 41 has a generally rectangular outer shape in a plan view.

[0110] As shown in FIG. 10A, the fourth mask 39 includes a fourth light-shielding pattern 42, a fourth light-shielding mark 43, and a fifth light-shielding mark 44.

[0111] 5B. The other longitudinal edge of fourth light-shielding pattern 42 is included in the other longitudinal edge of fourth mask 39. Fourth light-shielding pattern 42 extends from the other longitudinal edge of fourth mask 39 halfway in the longitudinal direction toward one side.

[0112] The fourth light shielding mark 43 shown in Fig. 10A corresponds to the first conductive mark 25 shown in Fig. 5B. The fifth light shielding mark 44 corresponds to the second conductive mark 26 shown in Fig. 5B.

[0113] The fourth light shielding mark 43 and the fifth light shielding mark 44 are disposed at the other end in the longitudinal direction of the fourth mask 39. The other end edges in the longitudinal direction of each of the fourth light shielding mark 43 and the fifth light shielding mark 44 are included in the other end edge in the longitudinal direction of the fourth mask 39. Each of the fourth light shielding mark 43 and the fifth light shielding mark 44 extends from the other end edge in the longitudinal direction of the fourth mask 39 toward one side to a midway point in the longitudinal direction. The shapes of the fourth light shielding mark 43 and the fifth light shielding mark 44 are the same as the shapes of the first conductor mark 25 and the second conductor mark 26 shown in FIG. 5B. In addition, both the fourth light shielding mark 43 and the fifth light shielding mark 44 are disposed at both ends in the width direction of the fourth mask 39.

[0114] 10B, the fifth mask 40 includes a fifth light-shielding pattern 45, a fifth light-shielding mark 46, a fourth light-shielding mark 43, and a fifth light-shielding mark 44. In addition, the fifth mask 40 includes a protective portion 52.

[0115] The fifth light-shielding pattern 45 corresponds to the conductor intermediate portion 8 shown in Fig. 5B. The fifth light-shielding pattern 45 extends from one longitudinal edge of the second mask 30 to the other longitudinal edge.

[0116] The sixth light shielding mark 46 shown in FIG. 10B corresponds to the third conductive mark 27 shown in FIG. 5B. The sixth light shielding mark 46 is disposed at one longitudinal end of the fifth mask 40. One longitudinal end edge of the sixth light shielding mark 46 is included in one longitudinal end edge of the fifth mask 40. The sixth light shielding mark 46 extends from one longitudinal end edge of the fifth mask 40 to halfway in the longitudinal direction toward the other side. The shape of the sixth light shielding mark 46 is the same as the shape of the third conductive mark 27.

[0117] The fourth light shielding mark 43 and the fifth light shielding mark 44 in the fifth mask 40 have the same configuration (shape, arrangement, etc.) as the fourth light shielding mark 43 and the fifth light shielding mark 44 in the fourth mask 39.

[0118] Furthermore, the sixth light shielding mark 46 is offset from the fourth light shielding mark 43 and the fifth light shielding mark 44 when projected in the longitudinal direction on the fifth mask 40. Specifically, the sixth light shielding mark 46 is located between the fourth light shielding mark 43 and the fifth light shielding mark 44 when projected in the longitudinal direction.

[0119] When projected in the longitudinal direction, the width direction distance L3 between the fourth light shielding mark 43 and the sixth light shielding mark 46 and the width direction length L4 between the sixth light shielding mark 46 and the fifth light shielding mark 44 are lengths that serve as references for measuring the amount of misalignment described below. In other words, the width direction lengths L3 and L4 are not dependent on the amount of misalignment described below, that is, they are amounts specific to the fifth mask 40.

[0120] The protective portions 52 are disposed on both sides in the width direction of the sixth light-shielding mark 46 at one longitudinal end of the fifth mask 40. Specifically, the two protective portions 52 are light-shielding portions including a pattern obtained by sliding (translating) the fourth light-shielding mark 43 and the fifth light-shielding mark 44 to one longitudinal side.

[0121] 10C, the sixth mask 41 includes a sixth light-shielding pattern 47 and a fifth light-shielding mark 46. Further, the sixth mask 41 includes a protective portion 52.

[0122] 5B. The sixth light-shielding pattern 47 extends from one longitudinal end edge of the sixth mask 41 to the middle of the longitudinal direction toward the other side. The sixth light-shielding mark 46 in the sixth mask 41 has the same configuration (shape, arrangement, etc.) as the sixth light-shielding mark 46 in the fifth mask 40.

[0123] The configuration of the protective portion 52 is similar to the configuration of the protective portion 52 of the fifth mask 40 .

[0124] In the three masks 39, 40, and 41 described above, the light-shielding patterns, light-shielding marks, and protective portions are light-shielding portions that block light in the next exposure, and the portions other than the light-shielding portions are light-transmitting portions that transmit light.

[0125] 10A and 11A, in this photolithography, first, a fourth mask 39 is placed on one side in the thickness direction of one end portion of a longitudinal direction of the photoresist 49. Next, the photoresist 49 is exposed through the fourth mask 39 (first exposure). Then, as shown in FIG. 11A, a latent image 48 corresponding to the fourth light-shielding pattern 42, the fourth light-shielding mark 43, and the fifth light-shielding mark 44 is formed in the photoresist 49. The latent image 48 is a reverse pattern of a portion of the photoresist 49 irradiated with light that has passed through a light-transmitting portion other than the light-shielding pattern and the light-shielding mark, and a pattern in which light is blocked by the light-shielding pattern and the light-shielding mark is formed in the photoresist 49.

[0126] As shown in FIG. 10B and FIG. 11C, in this photolithography, a fifth mask 40 is placed on one side of the photoresist 49 in the thickness direction instead of the fourth mask 39. The fifth mask 40 is placed on the other side in the longitudinal direction with respect to the placement position of the fourth mask 39, and is placed with respect to the photoresist 49 so that one end of the fourth mask 39 in the longitudinal direction overlaps in the thickness direction with an opposing portion 55 of the photoresist 49 that faces the other end of the fourth mask 39 in the longitudinal direction. Next, the photoresist 49 is exposed through the fifth mask 40 (second exposure). Then, a latent image 48 corresponding to the fifth light-shielding pattern 45, the fourth light-shielding mark 43, the fifth light-shielding mark 44, and the sixth light-shielding mark 46 is formed.

[0127] In the latent image 48 , a facing portion 55 corresponding to the fourth light-shielding pattern 42 overlaps with a portion facing the fifth light-shielding pattern 45 .

[0128] On the other hand, the latent image 48 (see FIG. 11A) corresponding to the fourth light-shielding mark 43 and the fifth light-shielding mark 44 during the first exposure and the latent image 48 (see FIG. 11B) corresponding to the sixth light-shielding mark 46 during the second exposure do not overlap (are offset), specifically, they are spaced apart from each other in the width direction. As a result, in the boundary portion 21 between the first sheet area 19A and the second sheet area 19B, the latent image 48 formed by the current exposure using the sixth light-shielding mark 46 is added to the latent image 48 formed by the previous exposure using the fourth light-shielding mark 43 and the fifth light-shielding mark 44. A latent image 48 corresponding to the fourth light-shielding mark 43 , the fifth light-shielding mark 44 and the sixth light-shielding mark 46 is formed in the photoresist 49 .

[0129] The protective portion 52 of the fifth mask 40 encompasses the latent image 48 formed in the photoresist 49 by the fourth light-shielding mark 43 and the fifth light-shielding mark 44 of the fourth mask 39 during the first exposure. Therefore, even during the second exposure through the fifth mask 40, the latent image 48 is not irradiated with light, that is, the latent image 48 corresponding to the fourth light-shielding mark 43 and the fifth light-shielding mark 44 during the first exposure is protected.

[0130] As shown in FIG. 10C, in this photolithography, a sixth mask 41 is then placed on one side in the thickness direction of the photoresist 49 instead of the fifth mask 40. The sixth mask 41 is placed on the other side in the longitudinal direction with respect to the placement of the fifth mask 40, and is placed with respect to the photoresist 49 so that one end in the longitudinal direction of the sixth mask 41 overlaps in the thickness direction with an opposing portion 55 of the photoresist 49 that faces the other end in the longitudinal direction of the fifth mask 40. Next, the photoresist 49 is exposed through the sixth mask 41. Then, a latent image 48 corresponding to the sixth light-shielding pattern 47 and the sixth light-shielding mark 46 is formed.

[0131] In the latent image 48 , a facing portion 55 corresponding to the fifth light-shielding pattern 45 overlaps with a portion facing the sixth light-shielding pattern 47 .

[0132] On the other hand, the latent image 48 corresponding to the fourth light-shielding mark 43 and the fifth light-shielding mark 44 during the second exposure and the latent image 48 (not shown) corresponding to the sixth light-shielding mark 46 during the third exposure do not overlap (are offset), specifically, they are spaced apart from each other in the width direction. As a result, in the boundary portion 21 between the second sheet area 19B and the third sheet area 19C, the latent image 48 formed by the current exposure using the sixth light-shielding mark 46 is added to the latent image 48 formed by the previous exposure using the fourth light-shielding mark 43 and the fifth light-shielding mark 44.

[0133] The protective portion 52 of the sixth mask 41 encompasses the latent image 48 formed in the photoresist 49 by the fourth light-shielding mark 43 and the fifth light-shielding mark 44 of the fifth mask 40 during the second exposure. Therefore, even during the third exposure through the sixth mask 41, light is not irradiated onto the latent image 48, that is, the latent image 48 corresponding to the fourth light-shielding mark 43 and the fifth light-shielding mark 44 during the second exposure is protected.

[0134] Thereafter, the photoresist 49 on which the latent image 48 is formed is developed, and if necessary, heated.

[0135] As a result, as shown in FIG. 11C, a plating resist 51 is formed in a reverse pattern of the conductive pattern 5, the first conductive mark 25, the second conductive mark 26, and the third conductive mark 27 (see FIG. 11D).

[0136] As shown in FIG. 11D, thereafter, the plating resist 51 is used to perform plating by supplying electricity to the seed film 50, thereby forming the conductive pattern 5, the first conductive mark 25, the second conductive mark 26, and the third conductive mark 27.

[0137] Subsequently, as shown in FIG. 3, the plating resist 51 and the seed film 50 located on the other side in the thickness direction are removed.

[0138] In this way, the conductor pattern 5 and the conductor measurement mark portion 18 are formed at the same time.

[0139] [5th ​​step] Thereafter, the amounts of misalignment of masks 39, 40, and 31 shown in FIGS. 10A to 10C are measured.

[0140] 13A shows a state in which the fourth light-shielding pattern 42 of the fourth mask 39 and the fourth light-shielding pattern 42 of the fifth mask 40 are misaligned at the boundary portion 21 between the first sheet area 19A and the second sheet area 19B. Also, FIG. 13B shows the conductor pattern 5 and the conductor measurement mark portion 18 formed by the above-mentioned fourth mask 39 and fifth mask 40.

[0141] In the fifth step, as shown in Fig. 13B, first, the conductor measurement mark portion 18 in the boundary portion 21 between the first sheet area 19A and the second sheet area 19B is detected. Specifically, as shown in Fig. 4, since the conductor measurement mark portion 18 is located within the insulation measurement mark portion 17, the conductor measurement mark portion 18 can be easily detected by detecting the insulation measurement mark portion 17.

[0142] Next, the widthwise distance L13 between the first conductor mark 25 and the third conductor mark 27 in the conductor measurement mark portion 18 is measured. Then, this L13 is compared with the widthwise distance L3 (see FIG. 10B) between the fourth light-shielding mark 43 and the sixth light-shielding mark 46, and the difference is obtained as a widthwise deviation between the other longitudinal end of the fourth light-shielding pattern 42 of the fourth mask 39 and one longitudinal end of the fourth light-shielding pattern 42 of the fifth mask 40, as shown in FIG. 13A. This deviation corresponds to a deviation between the widthwise edge of the conductor intermediate portion 8 of the first sheet area 19A and the widthwise edge of the conductor intermediate portion 8 of the second sheet area 19B in the facing portion 55 of the photoresist 49, as shown in FIG. 13B.

[0143] Additionally, the widthwise distance L14 between the third conductive mark 27 and the second conductive mark 26 is measured. Then, this distance L14 is compared with the widthwise length L4 (see FIG. 10B) between the sixth light-shielding mark 46 and the fifth light-shielding mark 44, and the difference therebetween is obtained as a widthwise deviation between the other longitudinal end of the fourth light-shielding pattern 42 of the fourth mask 39 and one longitudinal end of the fourth light-shielding pattern 42 of the fifth mask 40, as shown in FIG. 13A. This deviation corresponds to a deviation between the widthwise edge of the conductor intermediate portion 8 of the first sheet area 19A and the widthwise edge of the conductor intermediate portion 8 of the second sheet area 19B, as shown in FIG. 13B.

[0144] The above-mentioned measurements are performed on the conductor measurement mark portions 18 at both widthwise ends, and also on the conductor measurement mark portions 18 at the boundary portion 21 between the second sheet area 19B and the third sheet area 19C.

[0145] Thereafter, based on the misalignment of the masks 39, 40, 41, the widthwise positions of the masks 39, 40, 41 relative to the photoresist 49 on which the conductive pattern 5 is to be formed next are adjusted.

[0146] If the deviation of the conductor intermediate portion 8 is within the tolerance range, the next 6th step is carried out. On the other hand, if the deviation of the conductor intermediate portion 8 is outside the tolerance range, that is, if it is a defective part, the next 6th step is not carried out and the part is removed from the manufacturing object (manufacturing line). This allows the material of the cover insulating layer 10 in the 6th step to be used for manufacturing a good cover insulating layer 10. [6th step] As shown in FIG. 2 and FIG. 5C, the cover insulating layer 10 is formed on one surface in the thickness direction of the base insulating layer 9 so as to cover the wiring of the conductor pattern 5.

[0147] In this way, a wired circuit board sheet 1 including the support sheet 2, the wired circuit board 3, and a plurality of measurement mark portions 4 is obtained.

[0148] (Effects of one embodiment) In this method, as shown in FIG. 4, the distance L13 between the first conductive mark 25 and the third conductive mark 27 is measured, and this distance L13 is compared with the distance L1 (FIG. 8B) between the fourth light-shielding mark 43 and the sixth light-shielding mark 46 on the projection surface projected in the longitudinal direction, and the difference is found, thereby making it possible to measure the amount of deviation between the other longitudinal end of the fourth mask 39 and one longitudinal end of the fifth mask 40.

[0149] Therefore, the arrangement of the masks 39, 40, and 41 can be adjusted when the same fourth step is subsequently performed.

[0150] Furthermore, it is possible to accurately measure the amount of misalignment between the other longitudinal end of the conductor intermediate portion 8 corresponding to the fourth light-shielding pattern 42 of the fourth mask 39 and one longitudinal end of the conductor intermediate portion 8 corresponding to the fourth light-shielding pattern 42 of the fifth mask 40. The amount of misalignment between the other longitudinal end of the conductor intermediate portion 8 corresponding to the fourth light-shielding pattern 42 of the fifth mask 40 and one longitudinal end of the conductor intermediate portion 8 corresponding to the fourth light-shielding pattern 42 of the sixth mask 41 can also be accurately measured in the same manner as above.

[0151] In addition, in this method, by measuring both the distance L13 between the first conductor mark 25 and the third conductor mark 27 and the width direction distance L12 between the third insulating mark 24 and the second insulating mark 23, the amount of deviation between the other longitudinal end of the fourth mask 39 and one longitudinal end of the fifth mask 40 can be measured with high accuracy. Therefore, the amount of deviation between the other longitudinal end of the conductor intermediate portion 8 corresponding to the fourth light-shielding pattern 42 of the fourth mask 39 and one longitudinal end of the conductor intermediate portion 8 corresponding to the fourth light-shielding pattern 42 of the fifth mask 40 can be measured with even higher accuracy. The amount of deviation between the other longitudinal end of the conductor intermediate portion 8 corresponding to the fourth light-shielding pattern 42 of the fifth mask 40 and one longitudinal end of the conductor intermediate portion 8 corresponding to the fourth light-shielding pattern 42 of the sixth mask 41 can also be measured with even higher accuracy in the same manner as above. Therefore, the quality of the conductor pattern 5 can be determined with high accuracy.

[0152] Furthermore, in this method, since multiple (two) conductor measurement mark portions 18 are arranged at intervals from each other in the width direction in one boundary portion 21, for example, by comparing the distance L13 of the conductor measurement mark portion 18 on one side in the width direction with the distance L13 of the conductor measurement mark portion 18 on the other side in the width direction, it is possible to measure the rotation and the amount of rotation of the fifth mask 40 relative to the position to which the fourth mask 39 is translated (slid) parallel to the other longitudinal side.

[0153] In addition, in this method, the distance L11 between the first insulating mark 22 and the third insulating mark 24 is measured, and this distance L11 is compared with the distance L1 between the first light-transmitting mark 33 and the third light-transmitting mark 36 on the projection surface projected in the longitudinal direction, and the difference is found, thereby making it possible to measure the amount of deviation between the other longitudinal end of the first mask 29 and one longitudinal end of the second mask 30.

[0154] Therefore, the arrangement of the masks 29, 30, and 31 can be adjusted when the same second step is performed.

[0155] Furthermore, it is possible to accurately measure the amount of misalignment between the other longitudinal end of the base intermediate portion 13 corresponding to the first light-transmitting pattern 32 of the first mask 29 and one longitudinal end of the base intermediate portion 13 corresponding to the first light-transmitting pattern 32 of the second mask 30. It is possible to accurately measure the amount of misalignment between the other longitudinal end of the base intermediate portion 13 corresponding to the first light-transmitting pattern 32 of the second mask 30 and one longitudinal end of the base intermediate portion 13 corresponding to the first light-transmitting pattern 32 of the third mask 31.

[0156] This wired circuit board 3 includes conductor measurement mark portions 18, which allows the amount of deviation of conductor intermediate portions 8 of conductor pattern 5 to be measured, thereby enabling accurate judgment of the quality of conductor pattern 5. In this wired circuit board sheet 1, conductor pattern 5 has excellent reliability.

[0157] In addition, since the wired circuit board 3 includes the insulation measurement mark portion 17, the amount of deviation of the base intermediate portion 13 of the base insulating layer 9 can be measured, and the quality of the base insulating layer 9 can be determined with high accuracy. In the wired circuit board sheet 1, the base insulating layer 9 has excellent reliability.

[0158] Furthermore, in this wired circuit board 3, the conductor measurement mark portion 18 and the insulation measurement mark portion 17 overlap each other, so that the configuration of the measurement mark portion 4 becomes compact. Also, by detecting one of the insulation measurement mark portion 17 and the conductor measurement mark portion 18, the other can be easily detected.

[0159] (Modification) Next, modified examples of one embodiment will be described. In each of the following modified examples, the same reference numerals are used for the same members and steps as those of the above-described one embodiment, and detailed descriptions thereof will be omitted. In addition, one embodiment and each modified example can be appropriately combined. Furthermore, each modified example can achieve the same effects as the one embodiment, unless otherwise specified.

[0160] In addition, in Figs. 17A to 22C, the insulation measurement mark portion 17 and the base insulating layer 9 are omitted in order to clearly show the arrangement and shape of the conductor measurement mark portion 18.

[0161] In one embodiment, step 3 is performed before step 4, but can be performed after step 4. For example, step 3 is performed after step 4 and simultaneously with step 5.

[0162] Alternatively, steps 3 and 5 can be carried out after step 6, for example, simultaneously.

[0163] In one embodiment, the first conductive mark 25 and the second conductive mark 26 are formed, and then the third conductive mark 27 is formed, but they may be formed in the reverse order.

[0164] In this modified example, although not shown, the measurement mark portion 4 includes a cover insulation measurement mark which is in the same layer as the cover insulation layer 10.

[0165] In addition, the insulation measurement mark portion 17 and the conductor measurement mark portion 18 may be offset from each other in a plan view. Preferably, the insulation measurement mark portion 17 and the conductor measurement mark portion 18 overlap each other. This configuration makes the measurement mark portion 4 compact. In addition, by detecting one of the insulation measurement mark portion 17 and the conductor measurement mark portion 18, the other can be easily detected.

[0166] In the modified example, the measurement mark portion 4 includes only one of the insulation measurement mark portion 17 and the conductor measurement mark portion 18 .

[0167] In one embodiment, the conductor pattern 5 and the conductor measurement mark portion 18 are formed by plating. On the other hand, in a modified example, the conductor pattern 5 and the conductor measurement mark portion 18 are formed by etching, as shown in Fig. 14A to Fig. 14D. In this modified example, for example, an etching resist 61 is formed from a photoresist 49, and the conductor sheet 60 is etched using the etching resist 61.

[0168] 14A, a conductive sheet 60 is attached via an adhesive (not shown) to the surfaces of the support sheet 2, the base insulating layer 9, and the insulation measurement mark portion 17. Then, a photoresist 49 is laminated on one surface of the conductive sheet 60 in the thickness direction.

[0169] While masks 39, 40, and 41 are arranged in order, photoresist 49 is exposed multiple times. In masks 39, 40, and 41, light-shielding patterns 42, 45, and 47 and light-shielding marks 43, 44, and 47 shown in FIGS. 10A to 11B are replaced with light-transmitting patterns 62, 65, and 67 and light-transmitting marks 63, 64, and 67, respectively, and no protective portion is provided.

[0170] The light-transmitting patterns 62, 65, 67 and the light-transmitting marks 63, 64, 66 have the same shapes and arrangements as the light-shielding patterns 42, 45, 47 and the light-shielding marks 43, 44, 46 of the embodiment, respectively. The fourth mask 39 includes a fourth light-transmitting pattern 62, a fourth light-transmitting mark 63, and a fifth light-transmitting mark 64. The fifth mask 40 includes a fifth light-shielding pattern 65 and a sixth light-transmitting mark 66. The sixth mask 41 includes a sixth light-shielding pattern 67 and a sixth light-transmitting mark 66.

[0171] In the first exposure using the fourth mask 39, a latent image 48 is formed in the photoresist 49 by irradiation with light that has passed through the fourth light-transmitting pattern 62, the fourth light-transmitting mark 63, and the fifth light-transmitting mark 64.

[0172] In the second exposure using the fifth mask 40, a latent image 48 is newly formed on the photoresist 49 by irradiation with light that has passed through the sixth light-transmitting pattern 65.

[0173] As shown in FIG. 14C, the photoresist 49 is developed to form an etching resist 61.

[0174] Thereafter, as shown in FIG. 14D, the conductive sheet 60 exposed from the etching resist 61 is etched to form the conductor measurement mark portion 18 and the conductive pattern 5.

[0175] Thereafter, as shown in FIG. 7B, the etching resist 61 is removed.

[0176] 15A to 15C, photoresist 49 is exposed multiple times while the same masks are sequentially arranged in the longitudinal direction. That is, photoresist 49 is exposed multiple times while the same masks used only for forming conductor intermediate portion 8, other than the masks used for forming conductor one end portion 6 and conductor other end portion 7 of conductor pattern 5, are sequentially arranged in the longitudinal direction.

[0177] Specifically, after the second exposure (see FIG. 15A), the fifth mask 40 used in the second exposure is slid (moved) to the other side in the longitudinal direction as shown in FIG. 15B. At this time, the sliding fifth mask 40 is made to overlap the above-mentioned facing portion 55 of the photoresist 49.

[0178] In this modification, the photoresist 49 is exposed four times through a mask to form three measurement mark portions 4 at each of both widthwise ends of the wired circuit board sheet 1.

[0179] Although not shown, the photoresist 49 is exposed twice through the fifth mask 40 to form one measurement mark portion 4 at each of both widthwise ends of the wired circuit board sheet 1. The number of exposures may be five or more.

[0180] That is, the number of exposures is n+1 (n is a natural number), and the number of measurement mark portions 4 on each of both widthwise ends of the wired circuit board sheet 1 is n (n is a natural number).

[0181] Although not shown, the measurement mark portion 4 can be formed only on one end portion of the support sheet 2 in the width direction.

[0182] Preferably, the measurement mark portions 4 are formed at both widthwise ends of the support sheet 2. This makes it possible to measure the rotation of the mask and the amount of rotation.

[0183] 16, instead of the wired circuit board sheet 1, a wired circuit board assembly sheet 90 may be used in which a plurality of wired circuit boards 3 are supported by one support sheet 2. The plurality of wired circuit boards 3 are adjacently arranged at intervals in the width direction.

[0184] The position of the measurement mark portion 4 is not limited to the end portion in the width direction of the support sheet 2, and may be, for example, the center portion in the width direction (not shown). The position of the measurement mark portion 4 may be, for example, between adjacent wired circuit boards 3 in the width direction (not shown).

[0185] As shown in FIGS. 17A to 17C, the fourth light shielding mark 43, the fifth light shielding mark 44, and the sixth light shielding mark 46 are spaced apart from both longitudinal end edges of the masks 39, 40, and 41.

[0186] Specifically, the fourth light-shielding mark 43 and the fifth light-shielding mark 44 are spaced apart from the other longitudinal end edges of the fourth mask 39 and the fifth mask 40, respectively.

[0187] The sixth light-shielding mark 46 is spaced apart from one longitudinal end edge of each of the fifth mask 40 and the sixth mask 41 .

[0188] As shown in FIG. 18C, the conductor measurement mark portion 18 (an example of a first measurement mark portion) may include only the first conductor mark 25 (an example of one part) without including the second conductor mark 26 (an example of the other part, see FIG. 4).

[0189] Each of the fourth mask 39 and the fifth mask 40 does not include a fifth light-shielding mark 44 (see FIGS. 10A and 10B), but includes a fourth light-shielding mark 43.

[0190] 19A and 19B, there may be two sixth light shielding marks 46. The two sixth light shielding marks 46 are disposed adjacent to each other with an interval in between in the width direction.

[0191] As shown in FIG. 19C, the conductor measurement mark portion 18 includes two third conductor marks 27 corresponding to two sixth light-shielding marks 46.

[0192] 20C, the conductor measurement mark portion 18 has a double rectangular frame shape in a plan view. The conductor measurement mark portion 18 includes a first portion 71 and a second portion 72.

[0193] The first portion 71 has a rectangular frame shape in a plan view. The first portion 71 includes a first conductive mark 25 and a second conductive mark 26, and two first connecting pieces 73 connecting both ends of the marks in the longitudinal direction.

[0194] The second part 72 is disposed inside the first part 71 so as to be surrounded by the first part 71. The second part 72 has a rectangular frame shape in a plan view. The second part 72 includes two third conductive marks 27 and two second connecting pieces 74 connecting both longitudinal end edges thereof.

[0195] As shown in Figures 20A and 20B, the fourth mask 39 and the fifth mask 40 have, at the other longitudinal end, one light shielding mark 81 that corresponds to the first portion 71 and includes the fourth light shielding mark 43 and the fifth light shielding mark 44 (see Figures 10A and 10B).

[0196] The fifth mask 40 has another light-shielding mark 82 at one longitudinal end portion, which corresponds to the second portion 72 and includes two sixth light-shielding marks 46 .

[0197] 21C, the conductor measurement mark portion 18 has a double annular shape in a plan view. The conductor measurement mark portion 18 includes a first portion 71 and a second portion 72.

[0198] The first portion 71 has a circular ring shape in a plan view. The first portion 71 integrally includes a first conductive mark 25 having a semicircular arc shape in a plan view, and a second conductive mark 26 having a semicircular arc shape in a plan view.

[0199] The second portion 72 includes one third conductive mark 27 having a semicircular arc shape in a plan view, and the other third conductive mark 27 having a semicircular arc shape in a plan view.

[0200] As shown in FIG. 22C, the conductor measurement mark portion 18 includes a first U-shaped portion (first C-shaped portion) 75 and a second U-shaped portion (second C-shaped portion) 76, which are shifted from each other in the width direction.

[0201] The first U-shaped portion 75 has a shape that opens toward the other side in the longitudinal direction. The first U-shaped portion 75 integrally includes two first opposed pieces 77 as an example of a first conductive mark, and a first connecting piece 78. The two first opposed pieces 77 are spaced apart from each other in the width direction and each extends in the longitudinal direction. The first connecting piece 78 connects one longitudinal end edge of the two first opposed pieces 77.

[0202] The second U-shaped portion 76 has a shape that opens toward one side in the longitudinal direction. The second U-shaped portion 76 integrally includes two second opposed pieces 79 as an example of a second conductive mark, and a second connecting piece 80. The two second opposed pieces 79 are spaced apart from each other in the width direction and each extends in the longitudinal direction. The second connecting piece 80 connects the other longitudinal end edges of the two second opposed pieces 79.

[0203] As shown in FIGS. 22A and 22B, the fourth mask 39 and the fifth mask 40 have, at the other longitudinal end, one light shielding mark 81 that corresponds to the first U-shaped portion 75 and includes a fourth light shielding mark 43 and a fifth light shielding mark 44.

[0204] The fifth mask 40 has other light shielding marks 82 including two sixth light shielding marks 46, which correspond to the second U-shaped portion 76 at one end in the longitudinal direction.

[0205] In Figures 15A to 15C, the mask forming one end portion 6 of the conductor and the mask forming the other end portion 7 of the conductor are different from the mask forming the intermediate portion 8 of the conductor, but for example, as shown in Figures 23A to 23C, these may all be the same mask.

[0206] The mask 53 used in the exposure in the fourth step includes a fourth light-shielding pattern 42. The fourth light-shielding pattern 42 extends from one longitudinal edge to the other longitudinal edge of the mask 53. The width of the fourth light-shielding pattern 42 is constant along the longitudinal direction. The fourth light-shielding pattern 42 has a generally linear shape in a plan view.

[0207] As shown in FIG. 23A, a mask 53 is placed on one side in the thickness direction of one end portion in the longitudinal direction of photoresist 49, and then photoresist 49 is exposed through mask 53 (first exposure).

[0208] As shown in FIG. 23B, next, the mask 53 used in the first exposure is slid (moved) to the other side in the longitudinal direction, and then the photoresist 49 is exposed through the mask 53 (second exposure).

[0209] As shown in FIG. 23C, thereafter, the mask 53 used in the second exposure is further slid (moved) to the other side in the longitudinal direction, and then the photoresist 49 is exposed through the mask 53 (third exposure).

[0210] That is, in this fourth step, the same mask 53 is used for all exposures.

[0211] As a result, a plurality of linear conductor patterns 5 extending along the longitudinal direction are formed, as shown in FIG. 23D.

[0212] One longitudinal end of the conductor pattern 5 is a one-side terminal having the same width as the conductor intermediate portion 8. First mark portions 118 arranged on both sides of the one-side terminal in the width direction include third conductor marks 27, but do not include first conductor marks 25 and second conductor marks 26. Therefore, first mark portions 118 are not used to measure the displacement of mask 53 when mask 53 slides.

[0213] The other longitudinal end of the conductor pattern 5 is the other-side terminal having the same width as the conductor intermediate portion 8. Second mark portions 119 arranged on both sides of the other-side terminal in the width direction include a first conductor mark 25 and a second conductor mark 26, but do not include a third conductor mark 27. Therefore, second mark portions 119 are not used to measure the displacement of mask 53 when mask 53 slides. [Explanation of symbols]

[0214] 1 Wiring circuit board sheet 2 Support Sheet 3 Wiring circuit board 4 Measurement mark section 5 Conductor Pattern 6 Conductor one end 7 Other end of conductor 8 Conductor middle section 9 Base insulation layer 10 Cover insulation layer 11 Base one end 12 Other end of base 13 Base Middle Part 17 Insulation measurement mark 18 Conductor measurement mark section 19 Seat Area 21 Boundary part 22 First Insulation Mark 23 Second Insulation Mark 24 Third Insulation Mark 25 First Conductor Mark 26 Second Conductor Mark 27 Third Conductor Mark 28 Photosensitive base precursor layer 29 First Mask 30 2nd Mask 31 3rd Mask 32 First transparent pattern 33 First transparent mark 34 Second transparent mark 35 Second transparent pattern 36 Third transparent mark 37 Third transparent pattern 39 4th Mask 40 5th Mask 41 6th Mask 42 4th light blocking pattern 43 4th light-blocking mark 44 5th Shading Mark 45 5th shading pattern 46 6th Shading Mark 47 6th shading pattern 49 Photoresist 53 Mask 55 Opposite part 62 4th transparent pattern 63 4th Translucent Mark 64 5th Translucent Mark 65 6th transparent pattern 66 5th shading pattern 77 First opposing piece 79 Second opposing piece 90 Wiring circuit board assembly sheet

Claims

1. forming a long insulating layer; forming a conductor layer that is elongated along the insulating layer and adjacent to the insulating layer in a thickness direction perpendicular to the longitudinal direction; the conductor layer has an intermediate portion located between one end portion and the other end portion in the longitudinal direction, The step of forming the conductor layer includes: a long photoresist is arranged along the insulating layer on one side of the insulating layer in the thickness direction, the photoresist is exposed to light a plurality of times while masks are arranged in sequence in the longitudinal direction, the exposed photoresist is developed to form a resist corresponding to the conductor layer, and plating or etching is performed using the resist; the mask has a pattern corresponding to at least the intermediate portion of the conductor layer; In the step of exposing the photoresist, a portion of the photoresist facing the other end of the mask in the longitudinal direction during an n-th exposure (n is a natural number) is overlapped with a portion of the photoresist facing one end of the mask in the longitudinal direction during an n+1-th exposure, the other end portion in the longitudinal direction of the n-th mask includes the pattern and a first mark, the one longitudinal end portion of the (n+1)th mask includes the pattern and a second mark, In the step of forming the conductor layer, forming a conductive mark portion by exposing the photoresist through the first mark for an nth time, developing the photoresist after exposure to form a resist, and plating or etching using the resist; forming another conductor mark portion adjacent to the one conductor mark portion when projected in the longitudinal direction by exposing the photoresist for the (n+1)th time via the second mark, forming a resist by developing the photoresist after exposure, and plating or etching using the resist; At least a portion of each of the one conductor mark portion and the other conductor mark portion is disposed at an interval from each other in the longitudinal direction and an orthogonal direction perpendicular to the thickness direction. A method for producing a wired circuit board.

2. one of the first conductor mark portion and the second conductor mark portion includes one portion and another portion that are arranged opposite to each other with a gap therebetween in an orthogonal direction that is orthogonal to the longitudinal direction and the thickness direction, 2. The method for producing a wired circuit board according to claim 1, wherein the other part includes a middle part disposed between said one part and said other part and spaced apart from them.

3. 3. The method for manufacturing a wired circuit board according to claim 1, wherein the measurement mark portion including the one conductor mark portion and the other conductor mark portion is arranged at intervals from each other in an orthogonal direction perpendicular to the longitudinal direction and the thickness direction.

4. forming a long insulating layer; forming a conductor layer that is elongated along the insulating layer and adjacent to the insulating layer in a thickness direction perpendicular to the longitudinal direction; the insulating layer has an intermediate portion located between one end portion and the other end portion in the longitudinal direction, The step of forming the insulating layer includes arranging a long photosensitive resin insulating layer, exposing the photosensitive resin insulating layer a plurality of times while arranging masks in sequence in the longitudinal direction, and developing the photosensitive resin insulating layer after exposure; the mask has a pattern corresponding to at least the middle portion of the insulating layer; In the step of exposing the photosensitive resin insulating layer, a portion of the photosensitive resin insulating layer facing the other end of the mask in the longitudinal direction during an n-th exposure (n is a natural number) is overlapped with a portion of the photosensitive resin insulating layer facing one end of the mask in the longitudinal direction during an n+1-th exposure, the other end portion in the longitudinal direction of the nth mask includes the pattern and a third mark, the one longitudinal end portion of the (n+1)th mask includes the pattern and a fourth mark, In the step of forming the insulating layer, forming an insulating mark portion by exposing the photosensitive resin insulating layer for an nth time via the third mark and developing the photosensitive resin insulating layer after exposure; forming another insulation mark portion adjacent to the one insulation mark portion when projected in the longitudinal direction by exposing the photosensitive resin insulating layer to light via the fourth mark for the (n+1)th time and developing the photosensitive resin insulating layer after exposure; At least a portion of each of the one insulation mark portion and the other insulation mark portion is disposed at an interval from each other in a direction perpendicular to the longitudinal direction and the thickness direction. A method for producing a wired circuit board.

5. A long support sheet, an insulating base layer extending in a longitudinal direction of the support sheet and disposed on one surface of the support sheet in a thickness direction; a conductor layer extending in the longitudinal direction and disposed on one surface in the thickness direction of the insulating base layer, A plurality of areas are partitioned in sequence in the longitudinal direction, the conductor layer has an intermediate portion located between one end portion and the other end portion in the longitudinal direction, a first measurement mark portion that is disposed at a boundary portion between adjacent areas in the longitudinal direction and is configured to measure a deviation amount of the intermediate portion at the boundary portion in the thickness direction and an orthogonal direction perpendicular to the longitudinal direction, and is independent of the conductor layer; the first measurement mark portion includes a plurality of conductor marks; A wired circuit board sheet, characterized in that at least a portion of each of the plurality of conductor marks are arranged at intervals from each other in the orthogonal direction.

6. the base insulating layer has a second intermediate portion located between one end portion and the other end portion in the longitudinal direction, 6. The wired circuit board sheet according to claim 5, further comprising a second measurement mark portion configured to measure the amount of deviation of the second intermediate portion in the boundary portion in the orthogonal direction and independent of the base insulating layer.

7. 7. The wired circuit board sheet according to claim 6, wherein the first measurement mark portion and the second measurement mark portion overlap each other.

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