Display device, electronic device, and method for manufacturing the same

Abstract

[Problem] To improve transmittance without loss of display quality. [Solution] This display device is provided with a substrate, and a first display region and a second display region that are disposed on the substrate, and each have a plurality of pixels. In the first display region, the substrate has a first transmittance, and in the second display region, the substrate has a second transmittance higher than the first transmittance.

Description

[Technical field]

[0001] The present disclosure relates to a display device, an electronic device, and a method for manufacturing a display device. [Background technology]

[0002] In recent electronic devices such as smartphones, mobile phones, and PCs (Personal Computers), various sensors such as cameras are mounted on the frame (bezel) of the display panel. On the other hand, there is a demand to make the external size of electronic devices as compact as possible without affecting the screen size, and the bezel width tends to become narrower. Against this background, a technology has been proposed in which a camera module is placed directly below the display panel and the camera module captures the subject light that passes through the display panel. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] U.S. Patent Publication 2018 / 0069060 Summary of the Invention [Problem to be solved by the invention]

[0004] Display panels require a sealant to prevent the intrusion of moisture from the outside, and polyimide is generally used for this sealant. Polyimide also has excellent heat resistance and can withstand the heat treatment process used in forming TFTs.

[0005] However, polyimide has a low visible light transmittance, so as described above, when an image is taken with a camera module through the display panel, the image quality deteriorates.

[0006] Development is also underway to make polyimide transparent, but making polyimide transparent generally results in poor heat resistance, which may degrade the electrical characteristics of the TFTs formed in the display panel.

[0007] In view of this, the present disclosure provides a display device, an electronic device, and a method for manufacturing a display device that can improve transmittance without impairing display quality. [Means for solving the problem]

[0008] In order to solve the above problems, according to the present disclosure, there is provided a substrate, a first display area and a second display area, each of which has a plurality of pixels, disposed on the substrate; In the first display region, the substrate has a first transmittance; A display device is provided, wherein in the second display region, the substrate has a second transmittance higher than the first transmittance.

[0009] The second display area may be an area facing a sensing device disposed on a surface of the substrate opposite to the display surface.

[0010] The liquid crystal display may further include a first film that is disposed on a surface side opposite to the display surface in the first display region and has the first transmittance.

[0011] The liquid crystal display may further include a second film that is disposed on a surface side opposite to the display surface in the second display area and has the second transmittance.

[0012] The second film may be disposed on a surface side opposite to the display surface in at least a portion of the second display region including a boundary portion between adjacent pixels in the second display region.

[0013] The area of ​​the second film may be 30% or more of the area of ​​the light emitting region in the second display region.

[0014] The second film may have a function of cutting infrared light.

[0015] the second film is disposed in an opening formed by removing a portion of the first film, The transmittance of the boundary portion between the first film and the second film may vary continuously or stepwise from the first film to the second film.

[0016] the first film contains polyimide; The second film may contain a material having a higher transmittance than the polyimide of the first film.

[0017] The second film may have at least one of a recess and a protrusion.

[0018] The optical element may include an optical lens formed using the second film.

[0019] The second film may be used to form a moth-eye structure layer.

[0020] the first film is provided in at least a portion of the second display region excluding a boundary portion between adjacent pixels; An opening may be provided in the first film at a boundary between adjacent pixels in the second display region.

[0021] The first transmittance has a transmittance of 0 to 50% for visible light having a wavelength of 400 nm, The second transmittance may be 51 to 100% of the transmittance for the visible light.

[0022] According to the present disclosure, a display device and a sensing device disposed on the opposite side of the display surface of the display device, The display device includes: A substrate; a first display area and a second display area, each of which has a plurality of pixels, disposed on the substrate; In the first display region, the substrate has a first transmittance; In the second display region, the substrate has a second transmittance higher than the first transmittance. , an electronic device is provided.

[0023] The sensing device may include an imaging sensor.

[0024] The sensing device may include a biological information detection sensor.

[0025] The second display area is provided at a plurality of locations on the display surface, A plurality of the sensing devices may be arranged in association with a plurality of the second display regions.

[0026] The second transmittances of at least two of the second display regions at a plurality of locations may be different from each other.

[0027] According to the present disclosure, a method for manufacturing a semiconductor device comprising the steps of: forming a first film having a first transmittance on a first support substrate; forming a light emitting layer on the first film; forming a protective film on the light-emitting layer; forming a second support substrate on the protective film; removing the first support substrate; and forming an opening in the first film in accordance with a location where a sensing device is to be disposed.

[0028] A second film having a second transmittance higher than the first transmittance may be formed in the opening.

[0029] According to the present disclosure, a method for manufacturing a semiconductor device includes forming a first film having a first transmittance on a supporting substrate; forming an opening in the first film in accordance with a location of a sensing device; filling the opening with an insulating material; forming a first protective film on the first film; forming a light emitting layer on the first protective film; forming a second protective film on the light-emitting layer; removing the insulating member to form the opening in the first film.

[0030] The method may further include the step of forming a second film having a higher transmittance than the first film in the opening formed by removing the insulating member. [Brief description of the drawings]

[0031] [Figure 1] FIG. 1 is a schematic external view of an electronic device equipped with a display device according to a first embodiment. [Figure 2A] FIG. 4 is a schematic cross-sectional view showing a part of the second display region. [Figure 2B] FIG. 4 is a schematic cross-sectional view showing a part of the first display region. [Figure 2C] FIG. 1 is a schematic cross-sectional view of a display device having a first display region and a second display region. [Figure 2D] FIG. 4 is a schematic cross-sectional view of a display device in which a first film and a second film are disposed in a second display area. [Figure 3A] 3A to 3C are cross-sectional views showing a manufacturing process of the display device according to the first embodiment. [Figure 3B] 3B is a cross-sectional view showing the process subsequent to FIG. 3A. [Figure 3C] 3B , a cross-sectional view showing the process following FIG. 3B . [Figure 3D] 3C , a cross-sectional view showing the process following FIG. 3C . [Figure 3E] Cross-sectional view of the process following FIG. 3D. [Figure 3F] Cross-sectional view of the process following FIG. 3E. [Figure 4A] 13A and 13B are diagrams showing an example in which the density of areas with low transmittance increases stepwise from the center to the periphery of a transparent member. [Figure 4B] 11A and 11B are diagrams showing an example in which the transmittance changes continuously from the center to the periphery of a transparent member. [Figure 5A] 10A to 10C are cross-sectional views showing a step of forming a lens in the transmissive member. [Figure 5B] 5B is a cross-sectional view showing the process following FIG. 5A. [Figure 5C] 5B , a cross-sectional view showing the process following FIG. 5B . [Figure 5D] 5C , a cross-sectional view showing the process. [Figure 5E] Cross-sectional view showing the process following FIG. 5D. [Figure 5F]Cross-sectional view of the process following FIG. 5E. [Figure 6A] 1A to 1C are diagrams for explaining an example of a procedure of an imprint process. [Figure 6B] 6B is a cross-sectional view showing the process following FIG. 6A. [Figure 7A] 7A to 7C are cross-sectional views showing a manufacturing process of the display device according to the second embodiment. [Figure 7B] 7B is a cross-sectional view showing the process following FIG. 7A. [Figure 7C] 7B , a cross-sectional view showing the process following FIG. 7B . [Figure 7D] Cross-sectional view showing the process following FIG. 7C. [Figure 7E] Cross-sectional view showing the process following FIG. 7D. [Figure 7F] Cross-sectional view of the process following FIG. 7E. [Figure 8A] 10A to 10C are cross-sectional views showing a manufacturing process of the display device according to the third embodiment. [Figure 8B] 8B is a cross-sectional view showing the process following FIG. 8A. [Figure 8C] 8C is a cross-sectional view showing the process following FIG. 8B. [Figure 8D] Cross-sectional view showing the process following FIG. 8C. [Figure 8E] Cross-sectional view showing the process following FIG. 8D. [Figure 8F] Cross-sectional view of the process following FIG. 8E. [Figure 9A] 10A to 10C are cross-sectional views showing a manufacturing process of the display device according to the fourth embodiment. [Figure 9B] 9B is a cross-sectional view showing the process following FIG. 9A. [Figure 9C] 9B , a cross-sectional view showing the process. [Figure 9D] 9C , a cross-sectional view showing the process following FIG. 9C . [Figure 9E] Cross-sectional view showing the process following FIG. 9D. [Figure 9F] Cross-sectional view of the process following FIG. 9E. [Figure 9G] Cross-sectional view showing the process following FIG. 9F . [Figure 10A] 9B and 9C. FIG. [Figure 10B] 10B is a cross-sectional view showing the process following FIG. 10A. [Figure 10C] 10B , a cross-sectional view showing the process following FIG. 10B . [Figure 11A] 13A to 13C are cross-sectional views showing a manufacturing process of the display device according to the fifth embodiment. [Figure 11B] 11B is a cross-sectional view showing the process following FIG. 11A. [Figure 11C] 11B , a cross-sectional view showing the process. [Figure 11D] Cross-sectional view of the process following FIG. 11C . [Figure 11E] Cross-sectional view of the process following FIG. 11D. [Figure 11F] Cross-sectional view of the process following FIG. 11E. [Figure 11G] Cross-sectional view of the process continuing from FIG. 11F . [Figure 11H] Cross-sectional view of the process continuing from FIG. 11G. [Figure 11I] Cross-sectional view showing the process following FIG. 11H. [Figure 11J] Cross-sectional view of the process continuing from FIG. 11I. [Figure 12] FIG. 13 is a plan view of an electronic device according to a sixth embodiment. [Figure 13] 13 is a diagram showing a cross-sectional structure of an imaging section of a camera module mounted on an electronic device according to a seventh embodiment. [Figure 14] 1 is a plan view showing a case where the electronic device according to the first to seventh embodiments is applied to a capsule endoscope. [Figure 15] 1 is a rear view of an electronic device according to any one of the first to seventh embodiments applied to a digital single-lens reflex camera. [Figure 16A] 1 is a plan view showing an example in which the electronic device 2 according to the first to seventh embodiments is applied to an HMD. [Figure 16B] A diagram showing the current HMD. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0032] Hereinafter, an embodiment of a display device will be described with reference to the drawings. The following description will focus on the main components of the display device, but the display device 1 may include components and functions that are not shown or described. The following description does not exclude components and functions that are not shown or described.

[0033] (First embodiment) FIG. 1 is a schematic external view of an electronic device 2 equipped with a display device 1 according to a first embodiment. The electronic device 2 in FIG. 1 is any electronic device 2 having both a display function and an image capturing function, such as a smartphone, a mobile phone, a tablet, or a PC. The electronic device 2 in FIG. 1 includes a camera module (image capturing unit) 3 arranged on the opposite side of the display surface 1a of the display device 1. In FIG. 1, the location of the camera module 3 is indicated by a dashed line. Thus, the electronic device 2 in FIG. 1A is provided with the camera module 3 on the back side of the display surface 1a of the display device 1. Therefore, the camera module 3 captures images through the display device 1. In this specification, the display surface 1a side of the display device 1 is referred to as the front side, and the side on which the camera module 3 is arranged is referred to as the back side.

[0034] In this embodiment, the transmittance of a part of the display area overlapping with the location of the camera module 3 on the rear side of the display device 1 is increased.

[0035] The display device 1 according to this embodiment includes a first display region D1 and a second display region D2 disposed on a substrate. In the first display region D1, the substrate has a first transmittance. In the second display region D2, the substrate has a second transmittance higher than the first transmittance. The second display region D2 can be a region facing a sensing device such as a camera module 3 disposed on the surface of the substrate opposite to the display surface.

[0036] FIG. 2A is a schematic cross-sectional view showing a part of the second display region D2, FIG. 2B is a schematic cross-sectional view showing a part of the first display region D1, and FIG. 2C is a schematic cross-sectional view of a display device 1 having the first display region D1 and the second display region D2. In FIG. 2A and FIG. 2B, an area of ​​three adjacent pixels is shown. Each pixel has an upper electrode 4, a light-emitting layer 5, and a lower electrode 6. In reality, the layer structure is complicated, but is shown in a simplified form in FIG. 2A and FIG. 2B. The upper surface of FIG. 2A and FIG. 2B is the display surface 1a, and a camera module 3 is disposed on the lower surface side.

[0037] As shown in FIG. 2B, a base film 7 is disposed under the lower electrode 6 in the first display region D1. The base film 7 is made of opaque polyimide with low transmittance. If the transmittance of the base film 7 is low, the light from the display surface 1a side is blocked by the base film 7, and the amount of light incident on the camera module 3 is reduced. Therefore, in this embodiment, as shown in FIG. 2A, the base film 7 is not disposed under the lower electrode 6 in the second display region D2. In FIG. 2A and FIG. 2B, the base film 7 is called the first film 7b, and an example is shown in which a second film 7c having a higher transmittance than the base film 7 (first film 7b) is disposed under the lower electrode 6 in the second display region D2. As shown in FIG. 2C, the second display region D2 is an area facing the camera module 3 disposed on the surface 1b side opposite to the display surface 1a on the substrate of the display device 1.

[0038] Fig. 2B shows an example in which the second film 7c is disposed under the lower electrode 6 over the entire second display region D2, but as shown in Fig. 2D, the first film 7b may be disposed under the lower electrode 6 in the second display region D2, and an opening 7a may be partially provided in the first film 7b, and the second film 7c may be disposed in the opening 7a. The second film 7c in Fig. 2D is disposed on the surface 1b side opposite to the display surface 1a in at least a part of the second display region D2 including the boundary portion between adjacent pixels in the second display region D2.

[0039] The openings 7a are provided at least in the boundary portions of the pixels. In order for sufficient light to be incident on the camera module 3, the area of ​​the openings 7a or the second film 7c is preferably 30% or more of the area of ​​the light-emitting region in the second display region D2.

[0040] As described later, the second film 7c may have a function of cutting infrared light. In addition, the transmittance of the boundary between the first film 7b and the second film 7c may vary continuously or stepwise from the first film 7b to the second film 7c.

[0041] The first transmittance has a transmittance of, for example, 0 to 50% for visible light having a wavelength of 400 nm, and the second transmittance has a transmittance of, for example, 51 to 100% for visible light.

[0042] On the other hand, in the first display region D1, as shown in FIG. 2B, the base film 7 is disposed even in the boundary portion of the pixels, and no opening is provided.

[0043] This makes it possible to increase the transmittance on the camera module 3 side of the second display area D2, which overlaps with the location of the camera module 3, and thereby increase the amount of light entering the camera module 3, thereby improving the image quality of the captured image.

[0044] The display device 1 according to this embodiment is characterized in that the transmittance of the second display region D2 on the side of the camera module 3 is increased. The configuration and manufacturing process of the display device 1 according to this embodiment will be described below. The display device 1 according to this embodiment can be applied to a display device 1 including an organic EL element that emits light by itself, but can also be applied to a liquid crystal display device 1.

[0045] A typical camera module 3 mainly captures visible light, so those with low transmittance to visible light are often called opaque. However, if the camera module 3 arranged on the back side of the display device 1 captures infrared light, for example, those with low transmittance to infrared light are considered opaque.

[0046] In this way, the criteria for transparency or opacity and the transmittance value are determined by a balance with the wavelength of light for which the camera module 3 arranged on the back side of the display device 1 has detection sensitivity. In the following, mainly on the premise that the camera module 3 that detects or captures visible light is arranged on the back side of the display device 1, those with high visible light transmittance will be called transparent and those with low visible light transmittance will be called opaque.

[0047] 3A to 3F are cross-sectional views showing a manufacturing process of the display device 1 according to the first embodiment. FIG. 3A to 3F show a cross-sectional structure of a part of the second display region D2 in FIG. 2. FIG. 3A to 3F show a layer structure related to a characteristic part of the display device 1 according to the present embodiment, and the actual display device 1 may have layers not shown. For example, most of the recent display devices 1 adopt a touch panel system, and a touch sensor layer is provided in the layer structure of the display device 1, but is omitted in FIG. 3A to 3F. In addition, in FIG. 3A to 3F, the light-emitting layer 5 that causes the organic EL element to emit light is illustrated as an EL layer 15, but in reality, the light-emitting layer 5 may be composed of multiple layers. In addition, multiple TFTs that control the emission of the organic EL element are illustrated as a TFT layer 14, but in reality, the TFT layer 14 may be composed of multiple layers.

[0048] First, as shown in FIG. 3A, a base film 12, a first protective film 13, a TFT layer 14, an EL layer 15, a second protective film 16, and a transparent film 17 are formed in this order on a glass substrate 11. The base film 12 functions as a sealant and is usually made of opaque polyimide with excellent heat resistance. The first protective film 13 is made of a highly transparent insulating film such as SiN or SiO2. The TFT layer 14 is formed by injecting impurity ions into the drain region, the source region, etc., and thermally diffusing them. The EL layer 15 is actually made of multiple layers such as an electron injection layer, an electron import layer, a light-emitting layer 5, a hole transport layer, a charge generation layer, and an electron import layer. The second protective film 16 is made of a highly transparent insulating film such as SiN or SiO2. The process of FIG. 3A is the same as the process of a normal organic EL display device 1.

[0049] Of the layers shown in FIG. 3A, the opaque layer is base film 12, and the other layers (except for the sacrificial layer) are made of a material having a higher transmittance than base film 12.

[0050] 3B, a glass substrate 19 is formed on the transparent film 17 via a sacrificial layer 18. The sacrificial layer 18 is provided for the purpose of absorbing laser light to facilitate peeling of the glass substrate 19 when the glass substrate 19 is peeled off by laser lift-off in a later process.

[0051] 3C, the glass substrate 11 on the base film 12 is removed to expose the base film 12. The glass substrate 11 may be removed by BGR or CMP (Chemical Mechanical Polishing), or the glass substrate 11 may be peeled off by laser lift-off.

[0052] 3D, the base film 12 is turned over, a resist 10 is applied onto the exposed base film 12, and the resist 10 is patterned by lithography. More specifically, an opening 12a is provided in the resist 10 in a location that overlaps with the location of the camera module 3. Then, using the resist 10 as a mask, a part of the base film 12 located at the opening 12a of the resist 10 is etched.

[0053] Next, as shown in Fig. 3E, the resist 10 is peeled off to expose the base film 12. A part of the base film 12 (a region overlapping with the arrangement location of the camera module 3) is removed by the above-mentioned etching to form an opening 12a. A transparent member 20 is formed in this opening 12a. The transparent member 20 may be, for example, transparent polyimide. The transparent member 20 corresponds to the second film 7c in Fig. 2, and the base film 12 corresponds to the first film 7b.

[0054] As described above, transparent polyimide is often inferior in heat resistance to existing opaque polyimide. However, in this embodiment, transparent polyimide is formed only in the portion overlapping with the camera module 3. Since the base film 12 itself has heat resistance, the diffusion process can be performed by applying high heat, and therefore there is no risk of the electrical characteristics of the TFT formed in the TFT layer 14 being deteriorated.

[0055] After the step of FIG. 3E, the glass substrate 19 is peeled off by laser lift-off as shown in FIG. 3F. The laser light irradiated to the glass substrate 19 is absorbed by the sacrificial layer 18, and the glass substrate 19 formed on the sacrificial layer 18 can be easily peeled off. This makes it possible to obtain a display device 1 having a flexible substrate shape with excellent flexibility. The display device 1 can also be used in a curved shape, increasing its utility value.

[0056] After the step of FIG. 3F, the camera module 3 can be attached to face the transparent member 20 formed on a part of the base film 12. As described later, various sensor modules other than the camera module 3 may be attached to the back side of the display device 1 according to this embodiment. For example, various biometric information detection sensors such as a fingerprint sensor may be disposed to face the transparent member 20 of the base film 12. Hereinafter, a structure that performs any type of sensing, including the camera module 3, is collectively referred to as a sensing device.

[0057] In the display device 1 manufactured by the manufacturing process of FIGS. 3A to 3F, the transmittance (second transmittance) of the transparent member 20 formed on a part of the base film 12 on the sensing device side is higher than the transmittance (first transmittance) of the base film 12 on the sensing device side. The transparent member 20 formed on a part of the base film 12 can be formed in a boundary portion of pixels of the display device 1. In this specification, the display area not facing the sensing device is called the first display area D1, and the display area facing the sensing device is called the second display area D2. The transmittance of the surface side opposite the display surface 1a in the first display area D1 is the first transmittance, and the transmittance of the surface side opposite the display surface 1a (sensing device side) in the second display area D2 is the second transmittance higher than the first transmittance.

[0058] The transparent member 20 may have a function of cutting infrared light in addition to having a higher transmittance than the base film 12. If the transparent member 20 has a function of cutting infrared light, there is no need to provide an infrared light cutting film or the like on the sensing device side, and the configuration of the sensing device can be simplified.

[0059] When the transmittance of the base film 12 and the transparent member 20 is significantly different, the boundary between the base film 12 and the transparent member 20 may be visually recognized through the display surface 1a. Therefore, as shown in FIG. 4A or FIG. 4B, the transmittance of the boundary between the base film 12 and the transparent member 20 may be changed continuously or stepwise from the base film 12 to the transparent member 20. In FIG. 4A and FIG. 4B, the areas with low transmittance are shown in black. FIG. 4A shows an example in which the density of areas with low transmittance increases stepwise from the center to the periphery of the transparent member 20. FIG. 4B shows an example in which the transmittance changes continuously from the center to the periphery of the transparent member 20.

[0060] For example, a lens for a camera module 3 can be formed on the transparent member 20 manufactured by the steps of FIG. 3A to FIG. 3E. FIG. 5A to FIG. 5F are cross-sectional views showing the steps of forming a lens on the transparent member 20. FIG. 5A shows a cross-sectional structure similar to FIG. 3E. Next, as shown in FIG. 5B, a part of the transparent member 20 formed on a part of the base film 12 is removed to form a recess 20a. This recess 20a can be formed by, for example, etching or imprinting. FIG. 6A and FIG. 6B are diagrams for explaining an example of the procedure of the imprinting step. First, as shown in FIG. 6A, the imprint master 21 is pressed against the surface of the transparent member 20 and heat is applied or light is irradiated to transfer the outer shape of the master 21 to the transparent member 20. Next, the master 21 is released from the mold and heat treatment or light irradiation is performed. This allows the surface shape of the transparent member 20 to be shaped to match the outer shape of the lens.

[0061] In this manner, at least one of recesses and protrusions can be formed on the surface of the transmitting member 20 by performing the imprint process.

[0062] After the process of FIG. 5B is completed, a transparent resin layer 22 is then formed on the base film 12, including the inside of the recess 20a described above, in a process similar to the manufacturing process of the on-chip lens of a CMOS image sensor, as shown in FIG. 5C.

[0063] Next, as shown in Fig. 5D, a resist 23 is applied onto the transparent resin layer 22 and patterned, leaving the resist 23 only directly above the transparent member 20. Next, as shown in Fig. 5E, the transparent resin layer 22 is partially removed by etching using the resist 23 as a mask, and then the resist 23 is removed. As a result, a lens 24 is formed from the transparent resin layer 22 in a part of the transparent member 20. This lens 24 is, for example, a convex lens. A lens having a desired outer shape can be formed by performing surface processing of the transparent member 20 in Fig. 5B and patterning of the resist 23 in Fig. 5D according to the outer shape of the lens 24.

[0064] Next, as shown in Fig. 5F, similarly to Fig. 3F, the glass substrate 19 is peeled off, for example, by laser lift-off, to obtain a display device 1 with a lens in the form of a flexible substrate. This lens can be used to focus light on a sensing device such as a camera module 3.

[0065] 5A to 5F, an example in which a convex lens is formed by processing the surface of the transparent member 20 has been described, but the transparent member 20 can be processed into various shapes by using, for example, an imprinting process. For example, it is also possible to form a moth-eye structure layer having fine irregularities by processing the transparent member 20. Since the moth-eye structure layer has a function of suppressing reflection, for example, by disposing the moth-eye structure layer between the light-emitting layer 5 and the lens of the camera module 3, the amount of light incident on the lens can be increased, and the image quality can be improved.

[0066] In this manner, in the first embodiment, an opening 12a is provided in a part of the base film 12 formed of opaque polyimide in accordance with the location of a sensing device such as a camera module 3, and a transparent member 20 is formed in this opening 12a, so that sufficient light can be guided through the transparent member 20 to the sensing device, thereby improving the detection sensitivity of the sensing device.

[0067] Second embodiment In the first embodiment, the transparent member 20 is formed in the opening 12a formed in a part of the base film 12, but the opening 12a may be left as it is. With the opening 12a left as it is, that is, without disposing the transparent member 20 inside the opening 12a, the transmittance of the opening 12a on the sensing device side is higher than the transmittance of the base film 12 on the sensing device side. Therefore, by disposing a sensing device opposite the opening 12a, the amount of light incident on the sensing device can be increased.

[0068] 7A to 7F are cross-sectional views showing the manufacturing process of the display device 1 according to the second embodiment. FIGS. 7A to 7D are the same as FIGS. 3A to 3D. In FIG. 3E, an opening 12a is formed in the exposed base film 12 in accordance with the arrangement location of the sensing device, and a transparent member 20 is formed in this opening 12a, but in FIG. 7E, the opening 12a is left formed, and the transparent member 20 is not formed in the opening 12a. Next, as shown in FIG. 7F, the glass substrate 19 is peeled off by laser lift-off, thereby obtaining a display device 1 having excellent flexibility in the form of a flexible substrate.

[0069] 7F, a sensing device such as a camera module 3 may be disposed facing the opening 12a formed in a part of the base film 12, or the surface of the base film 12 may be covered with a transparent protective film while leaving the opening 12a in order to protect the base film 12. In this case, the opening 12a becomes a gap sealed by the base film 12 and the protective film, and high transparency is maintained.

[0070] In this way, in the second embodiment, the opening 12a is formed in a part of the base film 12 in accordance with the arrangement location of the sensing device, so that sufficient light can be incident on the sensing device through the opening 12a. Since the process of forming other members in the opening 12a can be omitted, the manufacturing process can be simplified compared to the first embodiment.

[0071] (Third embodiment) In the third embodiment, after the heat application step is completed when manufacturing the display device 1, the base film 12 made of polyimide is removed.

[0072] The reason for using opaque polyimide as the base film 12 of the display device 1 is that it has excellent heat resistance. In the display device 1, it is necessary to form the TFT layer 14 using polysilicon or the like, but the formation of the TFT layer 14 requires a diffusion process of impurity ions. Since the diffusion process involves a heat treatment, if transparent polyimide is used as the base film 12, for example, the electrical characteristics of the TFT may deteriorate because excessive heat cannot be applied.

[0073] Therefore, in this embodiment, the base film 12 is formed using opaque polyimide until the process of applying heat to the display device 1 is completed, and the base film 12 is peeled off after the process of applying heat is completed.

[0074] 8A to 8F are cross-sectional views showing the manufacturing process of the display device 1 according to the third embodiment. FIGS. 8A to 8C are the same as FIGS. 3A to 3C. As shown in FIG. 8D, at the stage where the glass substrate 11 is removed (peeled) to expose the base film 12, the formation of the TFT layer 14 and the EL layer 15 has already been completed, and there is no subsequent step of applying high heat. Therefore, as shown in FIG. 8E, the base film 12 is removed by etching or the like. At this time, a protective film made of SiN or the like is used as an etching stopper layer. Next, as shown in FIG. 8F, the glass substrate 19 is peeled off by laser lift-off.

[0075] If the protection and sealing functions of the display device 1 become insufficient due to the removal of the base film 12, a transparent resin layer 22 or the like may be disposed on the protective film.

[0076] In this way, in the third embodiment, the base film 12 made of opaque polyimide is formed until the heat application process for manufacturing the display device 1 is completed, and the base film 12 is removed after the heat application process is completed. This makes it possible to increase the transmittance of the entire second display region D2, and allows sufficient light to enter the sensing device.

[0077] (Fourth embodiment) In the fourth embodiment, the process order for forming the opening 12a in a part of the base film 12 is different from that in the first to third embodiments.

[0078] 9A to 9G are cross-sectional views showing the manufacturing process of the display device 1 according to the fourth embodiment. First, as shown in Fig. 9A, a base film 12 made of opaque polyimide is formed on a glass substrate 11, and an opening 12a is formed in the base film 12 in accordance with the location of the sensing device. Here, for example, a resist is applied onto the base film 12 and patterned, and the opening 12a is formed by etching.

[0079] 9B, the upper surface of the base film 12, including the inside of the opening 12a, is covered with a highly permeable insulating film 25 such as SiO2 or SiN. Next, as shown in FIG. 9C, the insulating film 25 formed on the upper surface of the base film 12 is removed by, for example, CMP to expose the base film 12 and the insulating film 25 inside the opening 12a.

[0080] Next, as shown in FIG. 9D, a first protective film 13, a TFT layer 14, an EL layer 15, a second protective film 16, and a transparent film 17 are formed in this order on the base film 12.

[0081] Next, as shown in FIG. 9E, the glass substrate 11 is removed (peeled off) by etching, laser lift-off, or the like, to expose the base film 12.

[0082] 9F, the insulating film 25 formed inside the opening 12a of the base film 12 is removed by, for example, etching. At this time, the second protective film 16 below the base film 12 functions as an etching stopper layer.

[0083] 9G, the entire upper surface of the base film 12, including the inside of the opening 12a, is covered with a transparent member 20. In this way, a display device 1 having a flexible substrate shape is obtained.

[0084] 9A to 9G, an opening 12a is formed in a base film 12 at an early stage of the manufacturing process of the display device 1, and with a highly heat-resistant insulating film 25 formed in this opening 12a, each layer of the display device 1 is formed in sequence, and finally, the insulating film 25 in the opening 12a is replaced with the original transparent member 20.

[0085] In the step of FIG. 9C described above, the insulating film 25 is removed by CMP or the like to expose the base film 12 and the insulating film 25 in the opening 12a, but a stopper layer may be provided on the upper surface of the base film 12 in advance.

[0086] Figures 10A to 10C are cross-sectional views of a process performed instead of Figures 9B and 9C. First, as shown in Figure 9A, an opening 12a is formed in a part of the base film 12, and then, as shown in Figure 10A, the upper surface of the base film 12, including the inner wall portion of the opening 12a, is covered with a stopper layer 26. The stopper layer 26 is formed by, for example, ALD (Atomic Layer Deposition) or CVD (Chemical Vapor Deposition).

[0087] 10B, an insulating film 25 is formed on the stopper layer 26. Next, the insulating film 25 on the stopper layer 26 is removed by etching to expose the stopper layer 26 and the insulating layer 25 in the opening 12a.

[0088] As described above, in the fourth embodiment, the opening 12a is formed in the base film 12 in the early stage of the manufacturing process of the display device 1, and therefore, it is not necessary to dispose an etching stopper layer 26 or the like under the base film 12, and the opening 12a can be easily formed. In addition, a temporary insulating film 25 with high heat resistance is formed in the opening 12a, and the insulating film 25 is replaced with the transmissive member 20 in the final stage, so that high heat can be applied during the manufacturing of the display device 1, and a display device 1 with excellent electrical properties can be manufactured.

[0089] Fifth embodiment In the display device 1 according to the above-described first to fourth embodiments, various sensing devices can be arranged facing the opening 12a formed in a part of the base film 12. In the following, an example of the arrangement of a fingerprint sensor that does not require a lens will be described as an example of a sensing device that detects biometric information.

[0090] 11A to 11J are cross-sectional views showing manufacturing processes for the display device 1 according to the fifth embodiment. FIGS. 11A to 11E are similar to FIGS. 7A to 7E. However, in this embodiment, it is assumed that a fingerprint sensor 31 will be disposed, and therefore the opening size of the opening 12a formed in a part of the base film 12 is set to a size that matches the outer shape of the fingerprint sensor 31. More specifically, the opening size of the opening 12a needs to be larger than the outer size of the fingerprint sensor 31.

[0091] 11F, a fingerprint sensor 31 is formed in an opening 12a formed in a part of the base film 12. The fingerprint sensor 31 does not require a lens on the outside, but an inner lens 31a is provided inside the fingerprint sensor 31.

[0092] As described above, the size of the opening 12a formed in a part of the base film 12 is larger than the outer size of the fingerprint sensor 31, so when the fingerprint sensor 31 is disposed inside the opening 12a, a gap is formed between the inner wall surface of the opening 12a and the outer wall surface of the fingerprint sensor 31. Therefore, as shown in Fig. 11G, an adhesive layer or insulating film 32 is formed on the entire upper surface of the base film 12, including this gap. In this case, the insulating film 32 is, for example, SiO2 or SiN.

[0093] 11H, the adhesive layer or insulating film 32 is removed by CMP, etching, or the like to expose the base film 12. As a result, the adhesive layer or insulating film 32 fills the gap between the inner wall surface of the opening 12a and the outer wall surface of the fingerprint sensor 31.

[0094] 11I, the adhesive layer or insulating film 32 formed on the pad portion 33 of the fingerprint sensor 31 is removed by lithography and etching to expose the pad portion 33. Next, as shown in FIG. 11J, a bonding wire 34 is connected to the pad portion 33 of the fingerprint sensor 31 to perform wiring connection.

[0095] In this manner, in the fifth embodiment, the sensing device can be disposed directly in the opening 12a formed in a part of the base film 12.

[0096] Sixth embodiment In the sixth embodiment, a plurality of sensing devices are arranged on the side of the display device 1 opposite to the display surface 1a.

[0097] Fig. 12 is a plan view of an electronic device 2 according to a sixth embodiment. In the electronic device 2 of Fig. 12, three sensing devices 30 are arranged on the opposite side of the display surface 1a of the display device 1. The number of sensing devices 30 is not limited to three. Furthermore, the object detected by the sensing devices 30 may be any object. For example, all three sensing devices 30 may be camera modules, each having a different focal length. Alternatively, a camera module may be combined with two bioinformation sensing devices.

[0098] In the base film 12 of the display device 1, openings 12a are formed corresponding to the respective sensing devices 30. A transparent member 20 may be disposed in the openings 12a, or the openings 12a may remain open. Since the optimal amount of incident light may differ depending on the type of sensing device 30, when the transparent member 20 is disposed in the openings 12a, it is desirable to set the transmittance of the transparent member 20 to a value corresponding to each sensing device 30.

[0099] In this way, in the sixth embodiment, multiple types of sensing devices 30 are arranged on the back side of the display device 1, and the transmittance of the transparent member 20 arranged at the location overlapping each sensing device 30 is individually optimized, thereby improving the detection sensitivity of all sensing devices 30.

[0100] Seventh embodiment The electronic device 2 according to the seventh embodiment differs from the first to sixth embodiments in the optical system of the camera module 3.

[0101] Fig. 13 is a diagram showing a cross-sectional structure of an imaging unit of a camera module 3 mounted on an electronic device 2 according to a seventh embodiment. The imaging unit in Fig. 13 has a microlens array 64, rather than a single lens or a lens group in which single lenses are arranged in the optical axis direction.

[0102] 13 has a photoelectric conversion unit 4a arranged along the bottom surface of a housing 63, a microlens array 64 arranged above the photoelectric conversion unit 4a, a plurality of light blocking bodies 66 arranged between adjacent microlenses 65, and a light guide plate 67 arranged above the microlens array 64. The imaging unit in FIG. 13 is applicable to any of the first to eighth embodiments described above.

[0103] Eighth embodiment There are various possible specific candidates for the electronic device 2 having the configurations described in the first to seventh embodiments. For example, Fig. 14 is a plan view of the electronic device 2 of the first to seventh embodiments applied to a capsule endoscope 50. The capsule endoscope 50 in Fig. 14 includes, in a housing 51 having, for example, hemispherical end faces and a cylindrical center, a camera (ultra-miniature camera) 52 for capturing images inside a body cavity, a memory 53 for recording image data captured by the camera 52, and a wireless transmitter 55 for transmitting the recorded image data to the outside via an antenna 54 after the capsule endoscope 50 is discharged from the subject's body.

[0104] Also provided within housing 51 are a CPU (Central Processing Unit) 56 and a coil (magnetic force-current conversion coil) 57. CPU 56 controls the shooting by camera 52 and the data storage operation in memory 53, and also controls the data transmission from memory 53 to a data receiving device (not shown) outside housing 51 by wireless transmitter 55. Coil 57 supplies power to camera 52, memory 53, wireless transmitter 55, antenna 54, and light source 52b described below.

[0105] Furthermore, the housing 51 is provided with a magnetic (reed) switch 58 for detecting when the capsule endoscope 50 is set in the data receiving device. When the reed switch 58 detects that the capsule endoscope 50 is set in the data receiving device and data transmission becomes possible, the CPU 56 supplies power from the coil 57 to the wireless transmitter 55.

[0106] The camera 52 has, for example, an imaging element 52a including an objective optical system for capturing an image inside the body cavity, and a plurality of light sources 52b for illuminating the inside of the body cavity. Specifically, the camera 52 is configured with, for example, a CMOS (Complementary Metal Oxide Semiconductor) sensor equipped with an LED (Light Emitting Diode) or a CCD (Charge Coupled Device) as the light source 52b.

[0107] The display device 1 in the electronic device 2 of the first to seventh embodiments is a concept including a light emitting body such as the light source 52b in Fig. 14. The capsule endoscope 50 in Fig. 14 has, for example, two light sources 52b, but these light sources 52b can be configured with a display panel having a plurality of light source units or an LED module having a plurality of LEDs. In this case, by arranging the imaging unit of the camera 52 below the display panel or the LED module, restrictions on the layout arrangement of the camera 52 are reduced, and a smaller capsule endoscope 50 can be realized.

[0108] 15 is a rear view of the electronic device 2 according to the first to seventh embodiments applied to a digital single-lens reflex camera 60. The digital single-lens reflex camera 60 or a compact camera is provided with a display device 1 for displaying a preview screen on the rear surface opposite the lens. A camera module 3 may be disposed on the opposite side of the display surface of the display device 1 so that an image of the photographer's face can be displayed on the display surface 1a of the display device 1. In the electronic device 2 according to the first to seventh embodiments, the camera module 3 can be disposed in an area overlapping with the display device 1, so that it is not necessary to provide the camera module 3 in the frame portion of the display device 1, and the size of the display device 1 can be made as large as possible.

[0109] Fig. 16A is a plan view showing an example in which the electronic device 2 according to the first to seventh embodiments is applied to a head mounted display (hereinafter, HMD) 61. The HMD 61 in Fig. 16A is used for VR (Virtual Reality), AR (Augmented Reality), MR (Mixed Reality), SR (Substituional Reality), or the like. Current HMDs, as shown in Fig. 16B, are equipped with a camera 62 on the outer surface, and while a person wearing the HMD can view images of the surroundings, there is a problem in that people around cannot see the eyes or facial expressions of the person wearing the HMD.

[0110] 16A, the display surface of the display device 1 is provided on the outer surface of the HMD 61, and the camera module 3 is provided on the opposite side to the display surface of the display device 1. This allows the facial expression of the wearer captured by the camera module 3 to be displayed on the display surface of the display device 1, allowing people around the wearer to grasp the facial expression and eye movements of the wearer in real time.

[0111] 16A, since the camera module 3 is provided on the back side of the display device 1, there are no restrictions on the installation location of the camera module 3, which increases the freedom of design of the HMD 61. In addition, since the camera can be placed in an optimal position, it is possible to prevent problems such as the wearer's line of sight not being aligned with the display surface.

[0112] In this way, in the eighth embodiment, the electronic device 2 according to the first to seventh embodiments can be used for various purposes, thereby increasing the utility value.

[0113] The present technology can be configured as follows. (1) a substrate; a first display area and a second display area, each of which has a plurality of pixels, disposed on the substrate; In the first display region, the substrate has a first transmittance; In the second display region, the substrate has a second transmittance higher than the first transmittance. (2) The display device according to (1), wherein the second display area is an area facing a sensing device arranged on the side opposite the display surface of the substrate. (3) The display device according to (2), further comprising: a first film arranged on a surface side opposite the display surface in the first display region and having the first transmittance. (4) The display device according to (3), further comprising a second film arranged on a surface side opposite the display surface in the second display region and having the second transmittance. (5) The display device described in (4), wherein the second film is arranged on the side opposite the display surface in at least a portion of the second display region including a boundary portion between adjacent pixels in the second display region. (6) The display device according to (4) or (5), wherein the area of ​​the second film is 30% or more of the area of ​​the light-emitting region in the second display region. (7) The display device according to any one of (4) to (6), wherein the second film has a function of cutting infrared light. (8) the second film is disposed in an opening formed by removing a part of the first film, The display device according to any one of (4) to (7), wherein the transmittance of the boundary portion between the first film and the second film varies continuously or stepwise from the first film to the second film. (9) The first film contains polyimide, The display device according to any one of (4) to (8), wherein the second film contains a material having a higher transmittance than the polyimide of the first film. (10) The display device according to any one of (4) to (9), wherein the second film has at least one of a concave portion and a convex portion. (11) The display device according to (10), further comprising an optical lens formed using the second film. (12) The display device according to (10), further comprising a moth-eye structure layer formed using the second film. (13) The first film is provided in at least a part of the second display region excluding a boundary portion of adjacent pixels, The display device according to any one of (3) to (12), wherein an opening is provided in the first film at a boundary portion between adjacent pixels in the second display region. (14) The first transmittance has a transmittance of 0 to 50% for visible light having a wavelength of 400 nm, The display device according to any one of (1) to (13), wherein the second transmittance is 51 to 100% for the visible light. (15) a display device; a sensing device disposed on the opposite side of the display surface of the display device, The display device includes: A substrate; a first display area and a second display area, each of which has a plurality of pixels, disposed on the substrate; In the first display region, the substrate has a first transmittance; In the second display region, the substrate has a second transmittance higher than the first transmittance. (16) The electronic device according to (15), wherein the sensing device has an imaging sensor. (17) The electronic device according to (15), wherein the sensing device has a biological information detection sensor. (18) The second display area is provided at a plurality of locations on the display surface, The electronic device according to any one of (15) to (17), wherein a plurality of the sensing devices are arranged in association with a plurality of the second display areas. (19) The electronic device according to (18), wherein the second transmittances of at least two of the second display regions in multiple locations are different from each other. (20) forming a first film having a first transmittance on a first support substrate; forming a light emitting layer on the first film; forming a protective film on the light-emitting layer; forming a second support substrate on the protective film; removing the first support substrate; and forming an opening in the first film in accordance with a location where a sensing device is to be disposed. (21) The method for manufacturing a display device according to (20), further comprising forming a second film having a second transmittance higher than the first transmittance in the opening. (22) forming a first film having a first transmittance on a supporting substrate; forming an opening in the first film in accordance with a location of a sensing device; filling the opening with an insulating material; forming a first protective film on the first film; forming a light emitting layer on the first protective film; forming a second protective film on the light-emitting layer; removing the insulating member to form the opening in the first film. (23) The method for manufacturing a display device according to (22), further comprising the step of forming a second film having a higher transmittance than the first film in the opening formed by removing the insulating member.

[0114] The aspects of the present disclosure are not limited to the above-mentioned individual embodiments, but include various modifications that may be conceived by a person skilled in the art, and the effects of the present disclosure are not limited to the above-mentioned contents. In other words, various additions, modifications, and partial deletions are possible within the scope of the conceptual idea and intent of the present disclosure derived from the contents defined in the claims and their equivalents. [Explanation of symbols]

[0115] 1 display device, 1a display surface, 2 electronic device, 3 camera module, 4 upper electrode, 5 light-emitting layer, 6 lower electrode, 7 base film, 7a opening, 7b first film, 7c second film, 10 resist, 11 glass substrate, 12 base film, 13 first protective film, 14 TFT layer, 15 EL layer, 16 second protective film, 17 transparent film, 18 sacrificial layer, 19 glass substrate, 20 transparent member, 20a recess, 21 master, 22 transparent resin layer, 23 resist, 24 lens, 25 insulating film, 26 stopper layer, 31 fingerprint sensor, 31a inner lens, 32 adhesive layer or insulating film, 33 pad portion, 34 bonding wire, 50 capsule endoscope, 51 housing, 52 camera, 53 memory, 54 antenna, 55 wireless transmitter, 60 digital single-lens camera, 61 Head mounted display, 64 Microlens array, 65 Microlens, 66 Shading body

Claims

1. A substrate; a first display area and a second display area, each of which has a plurality of pixels, disposed on the substrate; In the first display region, the substrate has a first transmittance; In the second display region, the substrate has a second transmittance higher than the first transmittance; the second display area is an area facing a sensing device disposed on a surface side of the substrate opposite to the display surface, a first film that is disposed on a surface side opposite to the display surface in the first display area and has the first transmittance; the first film is provided in at least a portion of the second display region excluding a boundary portion between adjacent pixels; an opening in the first film is provided at a boundary portion between adjacent pixels in the second display region; Display device.

2. a second film disposed on a surface side opposite to the display surface in the second display area and having the second transmittance; The display device according to claim 1 .

3. the second film is disposed on a surface side opposite to the display surface in at least a portion of the second display region including a boundary portion between adjacent pixels in the second display region; The display device according to claim 2 .

4. the second film is disposed on a surface side opposite to the display surface in at least a portion of the second display region including a boundary portion between adjacent pixels in the second display region; The display device according to claim 2 or 3.

5. The second film has a function of cutting infrared light. The display device according to claim 2 .

6. the second film is disposed in an opening formed by removing a part of the first film, and a transmittance of a boundary portion between the first film and the second film varies continuously or stepwise from the first film to the second film. The display device according to claim 2 .

7. the first film contains polyimide; the second film contains a material having a higher transmittance than the polyimide of the first film; The display device according to claim 2 .

8. The second film has at least one of a recess and a protrusion. The display device according to claim 2 .

9. An optical lens formed using the second film, The display device according to claim 8.

10. A moth-eye structure layer formed using the second film, The display device according to claim 8.

11. The first transmittance has a transmittance of 0 to 50% for visible light having a wavelength of 400 nm, The second transmittance has a transmittance of 51 to 100% for the visible light. The display device according to claim 1 .

12. A display device; a sensing device disposed on the opposite side of the display surface of the display device, The display device includes: A substrate; a first display area and a second display area, each of which has a plurality of pixels, disposed on the substrate; In the first display region, the substrate has a first transmittance; In the second display region, the substrate has a second transmittance higher than the first transmittance; the second display area is an area facing the sensing device, a first film that is disposed on a surface side opposite to the display surface in the first display area and has the first transmittance; the first film is provided in at least a portion of the second display region excluding a boundary portion between adjacent pixels; an opening in the first film is provided at a boundary portion between adjacent pixels in the second display region; electronic equipment.

13. The sensing device includes an imaging sensor.

13. The electronic device according to claim 12.

14. The sensing device has a biological information detection sensor.

13. The electronic device according to claim 12.

15. the second display area is provided in a plurality of locations on the display surface, and a plurality of the sensing devices are arranged in association with the second display area in a plurality of locations.

15. The electronic device according to claim 12.

16. The second transmittances of at least two of the second display regions at the plurality of locations are different from each other.

16. The electronic device according to claim 15.

17. forming a first film having a first transmittance on a first support substrate; forming a light emitting layer on the first film; forming a protective film on the light-emitting layer; forming a second support substrate on the protective film; removing the first support substrate; forming an opening in the first film in accordance with a location where a sensing device is to be disposed; forming the first film on at least a portion of the area facing the sensing device, excluding a boundary portion between adjacent pixels; forming an opening in the first film at a boundary portion of adjacent pixels in a region facing the sensing device; A method for manufacturing a display device.

18. forming a second film having a second transmittance higher than the first transmittance at the opening; The method for manufacturing the display device according to claim 17 .

Images