Multi-function sintering equipment, or diffusion soldering equipment and pressing tools
The apparatus addresses the challenge of uniform pressure application and frequent tool changes in diffusion soldering/sintering by using a pivotable cover and locking mechanism, ensuring uniform force distribution and reducing downtime through easy access and adjustable atmospheric conditions.
Patent Information
- Application Number
- JP2024522381
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2021-10-14
- Filing Date
- 2022-10-07
- Publication Date
- 2025-01-20
- Estimated Expiration
- 2042-10-07
AI Technical Summary
Existing diffusion soldering or sintering equipment faces challenges in uniformly applying pressing forces, particularly when connecting electronic components of varying heights, leading to local peak pressures and requiring frequent access to the process chamber for tool changes and maintenance, resulting in significant downtime.
A diffusion soldering or sintering apparatus with a process chamber featuring a pivotable cover and locking mechanism that allows easy access, combined with a pressing yoke and elastic foils to ensure uniform force distribution and minimize tool changes, and a pressure chamber with a controllable atmosphere for precise pressure application.
Facilitates uniform pressure application, reduces downtime by simplifying access to the process chamber, and enables multifunctional use under adjustable atmospheric conditions, enhancing production efficiency and component connectivity.
Smart Images

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Abstract
Description
[Technical field]
[0001] The present invention relates to a multifunctional diffusion soldering or sintering apparatus for connecting components of at least one electronic assembly by diffusion soldering or pressure sintering, the diffusion soldering or sintering apparatus comprising an evacuable process chamber in which the assembly is held and in which an upper tool and a lower tool are arranged which are relatively displaceable at a distance from each other to apply a pressing force. [Background technology]
[0002] General diffusion soldering or sintering machines are used to mechanically, electrically and thermally connect components of electronic assemblies to one another. For example, general diffusion soldering or sintering machines can be used to connect electronic-electrical semiconductor components, such as high-performance switching elements or semiconductor assemblies, to basic bodies, such as PCBs, heat sinks, to one another by diffusion soldering or pressure sintering. In diffusion soldering, the atoms of the solid base material are mixed with the atoms of the liquid solder by means of a pressing force. This results in an alloy zone forming a material-to-material connection between the base material and the solder. In pressure sintering, two or more components, in particular an electronic component and a substrate, can be connected to one another by an electrically and / or thermally conductive joining material, which is sintered. Corresponding devices and methods are known, for example, from WO 2014 / 135151 A2.
[0003] Typical diffusion soldering or sintering machines are frequently used in automated soldering or sintering systems, especially in automated multi-chamber sintering systems. A soldering machine of similar design with a process chamber divided into several zones is described in EP 2 026 927 B1.
[0004] The sintering of the electronic assembly itself is achieved by regulating the temperature of the assembly to be sintered and / or its components and by the action of the pressing force exerted by the upper and lower tools. Thus, in the variants of pressure sintering (low pressure sintering), for example with silver as the joining material, the temperatures required for connection and diffusion regularly vary between about 130 ° C and 250 ° C - 300 ° C. The sintering operation requires about 5 - 10 minutes at pressures up to 30 MPa. The use of new types of sintering pastes allows for shorter sintering times.
[0005] During pressure sintering, in order to obtain a layer of porosity as small as possible from the sintered material inserted between the components, the joining layer is compressed by pressure before and during the diffusion process in order to ensure a mechanically stable, particularly shear-resistant connection and the necessary electrical and thermal conductivity. Towards the end of sintering, the pressure and temperature are reduced.
[0006] A sintering apparatus having one or more sintering chambers and an associated method are described in DE 10 2014 114 093 B4.
[0007] DE 10 2017 216 545 A1 shows an apparatus for producing low-temperature pressure sintered connections of at least one electronic assembly.
[0008] DE 10 2019 134 410 A1 describes a method and a system for connecting electronic assemblies and / or a method for manufacturing workpieces.
[0009] US 2007 / 0296035 A1 shows a device for connecting semiconductor structures.
[0010] US 2013 / 0133828 A1 describes an apparatus for connecting a substrate to be processed and a support substrate. [Prior art documents] [Patent documents]
[0011] [Patent Document 1] WO 2014 / 135151 A2 [Patent Document 2] EP 2 026 927 B1 [Patent Document 3] DE 10 2014 114 093 B4 [Patent Document 4] DE 10 2017 216 545 A1 [Patent Document 5] DE 10 2019 134 410 A1 [Patent Document 6] US 2007 / 0296035 A1 [Patent Document 7] US 2013 / 0133828 A1 Summary of the Invention [Problem to be solved by the invention]
[0012] One challenge is to ensure that the pressure forces required for diffusion soldering or sintering are applied to the assembly in as uniform a manner as possible, so that the components of the assembly are not subjected to local or temporary pressure peaks, particularly when connecting assemblies in which several electronic components of different heights are located on one substrate or support.
[0013] A typical diffusion soldering or sintering machine will often employ upper and / or lower tools that match the dimensions of the electronic assembly or components thereof being manufactured. For example, appropriate plungers of different lengths are fixed to a pressing tool.
[0014] As a rule, not only one type of assembly is produced on a diffusion soldering or sintering machine, but also different assembly types. A change of assembly type often requires a change of the associated upper and / or lower tool as well. This requires regular access to the process chamber in order to carry out the necessary resetting operations. Regular access to the process chamber is also required for other maintenance and / or cleaning operations or in case of breakdowns. However, this kind of access often involves more work steps, where elements of the diffusion soldering or sintering machine are removed and later put back in their original positions. This can lead to not inconsiderable downtimes of the diffusion soldering or sintering machine and significant disruptions to the production sequence.
[0015] It is therefore an object of the present invention to develop a diffusion soldering or sintering apparatus with simplified access to the process chamber. [Means for solving the problem]
[0016] This object is achieved by a diffusion soldering or sintering device having the features of claim 1. Advantageous embodiments of the sintering device are set out in the dependent claims.
[0017] The present invention provides a diffusion soldering or sintering apparatus for connecting components of at least one electronic assembly by diffusion soldering or pressure sintering, comprising an evacuable process chamber in which an assembly is held and in which upper and lower tools are disposed relatively displaceable at a distance from each other to apply a pressing force, the process chamber having a base body having an access opening on its upper side and a cover adjustable between a closed position and an open position for closing the access opening with the cover, the upper tool being supported by the cover in the closed position of the cover at least while the pressing force is applied.
[0018] The diffusion soldering or sintering machine can be operated in particular in adjustable atmospheric conditions, in particular in vacuum. As a result, it can also be used multifunctionally for drying purposes under vacuum or atmospheric pressure. Preferably, soldering or sintering pastes can be dried with it, and multiple functions such as drying, soldering or sintering can be used multifunctionally under adjustable atmospheric conditions. Purging with cleaning fluids for corrosion prevention, for example nitrogen (N2) and / or formic acid (HCOOH), is also possible.
[0019] By arranging the access openings on the upper side or on the base body of the process chamber, when the cover is open, access to the interior of the process chamber, in particular to the upper and / or lower tools, is facilitated. The forces occurring during the actuation of the pressing force or the corresponding reaction force are transferred to the cover in the closed state, so that the cover performs the function of a pressing yoke.
[0020] The access opening is preferably hermetically sealed in the closed position of the cover, for example by a circumferential seal provided on the cover or on the base body.
[0021] This results in a diffusion soldering or sintering apparatus which can be used for drying purposes under adjustable atmospheric conditions, in particular in a vacuum, and which can be used multifunctionally for soldering and sintering purposes, in particular for small series or development purposes.
[0022] Preferably, the upper tool is fixed to the cover so that it is particularly easy to replace the upper tool when the cover is open.
[0023] According to a preferred embodiment, the cover is pivotally connected to the base body about a tilt axis, and preferably an actuating arm, which is configured to pivot the cover, is fixed to the cover. The joint connection of the cover to the base body ensures guidance of the cover when opening and closing. The actuating arm, in particular functioning as a lever arm, simplifies the opening and closing operations. The actuating arm can be permanently fixed to the cover so that the latter can be used directly without resetting efforts. Preferably, the actuating arm is detachably fixed to the cover and can be removed from the cover when not in use and can be stored space-savingly, for example in a storage area provided inside the diffusion soldering or sintering device. The actuating arm can be supported by pneumatic, hydraulic or spring forces when opening and closing the cover. Alternatively or additionally, the opening and closing of the cover can be assisted or performed by a motor drive, for example by an electric motor or a hydraulic or pneumatic drive. It is also possible here to omit the actuating arm.
[0024] According to a further preferred embodiment, the process chamber comprises a locking device movable between a locked position and an unlocked position, which is configured to fix the cover in a closed position on the base body in the locked position. In the closed position, a pressing force or a corresponding reaction force is transmitted from the cover to the base body by the locking device, whereby the cover is held in the closed position against the pressing force or the reaction force. In particular, in the locked position, the joint, with which the cover is pivotably connected to the base body about a tilting axis, is unloaded by the locking device, so that the pressing force or the corresponding reaction force is transmitted only via the locking device between the cover and the base body. This allows the use of a joint of relatively simple design, which only has to withstand the weight force of the cover without being additionally loaded by the pressing force.
[0025] According to a further preferred embodiment, the locking device has several pivotable locking arms which are positively connected to both the cover and the base body in the locked position, so that during the soldering or sintering operation the forces are substantially transmitted via the locking arms and an inadvertent opening of the cover is prevented by the positive connection.
[0026] According to a further preferred embodiment, each of the locking arms has at its first end a locking part which is fixed to the cover so as to be pivotable about a respective pivot axis and at its second end a locking part which, in the locked position, is locked by means of a respective locking bolt associated with the locking arm and fixed to the base body. The engagement between the locking part and the locking bolt in the locked position can be released by pivoting the locking arm about the respective pivot axis in order to move the locking device from the locked position to the unlocked position. The locking arms in this embodiment are swingably suspended from the cover by the force of gravity, which simplifies the movement of the locking arms to the locked position and can in particular be combined with the closing movement of the cover, which can be assisted, for example, by a suitably shaped insert chamfer at the second end of the locking arm.
[0027] Preferably, the access opening, the cover in the closed position, and the pivot axis of the locking arm extend in respective horizontal planes.
[0028] According to a further preferred embodiment, the locking arms are arranged on two side surfaces of the cover facing each other. This allows for an even transmission of forces between the cover and the base body, and significantly reduces the forces that cause deformation or bending of the cover. Preferably, the cover has a cubic shape with an upper side and a lower side parallel to the upper side, the lower side having a sealing surface that interacts with the base body, two first side surfaces extending parallel to each other and perpendicular to the upper and lower sides, and two second side surfaces extending parallel to each other and perpendicular to the upper and lower sides and perpendicular to the first side surfaces. Preferably, the aforementioned tilt axis of the cover extends parallel to the first side surface and the locking arms are arranged on the second side surface. This makes it possible to prevent the locking arms from blocking access to the process chamber when the cover is open.
[0029] The sealing surface can be formed by a sealing ring, optionally with a circular, square, rectangular or elliptical cross section, which creates a gap between the cover and the base body such that under atmospheric conditions, locking of the cover is not possible. When a negative pressure, preferably a vacuum, is created, the sealing ring is compressed between the cover and the base body by the negative pressure, allowing the cover to be locked to the base body by activating a locking mechanism.
[0030] The cover is locked and unlocked as follows: When locking, the cover is first pressed against the seal by the actuating arm until the locking arm automatically engages the locking bolt. The position of the locking arm can be fixed in place by the blocking lever.
[0031] During unlocking, it is advantageous to first apply a negative pressure or vacuum to the process chamber, since the seal exerts a reaction force on the cover, which presses the locking arm against the locking bolt in the locked position. As atmospheric pressure acts on the cover, the load of the locking arm against the locking bolt is relieved, and the cover is pressed further against the seal by atmospheric pressure, so that the locking arm can be moved effortlessly to the unlocked position by the unlocking lever. When the vacuum is subsequently released, the inflated seal gradually and automatically pivots the cover towards the open position. The cover can then be pivoted relatively easily to the open position by the actuating arm.
[0032] According to a further preferred embodiment, the locking device has exactly three locking arms, the first and second locking arms being arranged on one side surface and the third locking arm being arranged on the other side surface, the aforementioned side surface being preferably the second side surface described above.
[0033] According to a further preferred embodiment, the pivot axis of the locking arm and the locking bolt associated with the locking arm are arranged as follows: the two effective directions of the locking force transmitted by the application of a pressing force between the cover and the base body via the respective locked locking arm run parallel to the effective direction of the pressing force for at least the first and second locking arms and preferably obliquely to the effective direction of the pressing force for the third locking arm. Thus, the locking force transmitted via the first and second locking arms acts perpendicular to the main extension direction of the cover. However, preferably, due to the oblique course of the locking force transmitted via the third locking arm to the effective direction of the pressing force, this locking force has, in addition to the usual component running parallel to the effective direction of the pressing force, a transverse component running perpendicular to the effective direction of the pressing force and parallel to the main extent plane of the cover. The cover is pretensioned inside its main extent plane by this transverse component. Preferably, the angle formed between the effective direction of the pressing force and the locking force transmitted via the third locking arm is a few degrees, the lateral component being small compared to the pressing force.
[0034] According to a further preferred embodiment, the first and second locking arms are connected via a connecting rod so as to be synchronously movable between the locked and unlocked positions, where the locking arms form an imaginary connecting line of their pivot axes and the connecting rod forms a kind of parallelogram with variable angles, simplifying the locking and unlocking operations.
[0035] According to a further preferred embodiment, the mass distribution of the third locking arm, the position of the pivot axis of the third locking arm and the position of the locking bolt relative to the third locking arm are selected such that, when the cover is closed, in the absence of additional forces, the third locking arm is held in its locked position only or at least substantially by the effect of gravity. The said mass distribution can for example be asymmetric with respect to an imaginary plane of symmetry arising between the pivot axis and the axis of symmetry of the locking bolt which is parallel to the pivot axis when the locking arm is locked.
[0036] According to a further preferred embodiment, at least one blocking lever, preferably designed as a toggle lever and interacting with the respective associated locking arm, is provided, which is movable between a blocking position, in which the blocking lever blocks the locking arm in its locked position against movement, and a releasing position, in which the blocking lever releases the locking arm against movement. Alternatively or additionally, at least one releasing lever, preferably designed as a toggle lever and interacting with the respective associated locking arm, is provided, which releasing lever is configured to move the locking arm from its locked position to its unlocked position. The blocking lever ensures that the locking arm is fully in the locked position, thus preventing inadvertent unlocking due to a pressing force or a moving force acting on the locking arm. The locking arm is released from the locked position by the releasing lever, thereby allowing a subsequent opening of the cover. The at least one blocking lever and / or the at least one releasing lever are preferably arranged on the base body.
[0037] To ensure that the locking device is always in the locked position while the pressing force is acting, a suitable position sensor can be provided on the blocking lever, connected to a control device of the diffusion soldering or sintering device and preventing the drive provided for applying the pressing force from operating if the blocking lever / s are not in the blocking position. Alternatively or additionally, a position sensor can also be provided on the locking arm and / or on the locking bolt and configured to detect whether the locking arm is in the locked position.
[0038] The invention relates in a further aspect to a diffusion soldering or sintering device for connecting components of at least one electronic assembly by diffusion soldering or pressure sintering, in particular a diffusion soldering or sintering device according to one of the above-mentioned embodiments preferred or according to the invention, in which the diffusion soldering or sintering device comprises an upper tool and a lower tool, between which the assembly is held and which are relatively displaceable at a distance from each other to apply a pressing force, and an elastic foil, preferably a graphite foil, is arranged between the pressing yoke and the upper tool and / or in the lower tool. The pressing yoke is a part provided for absorbing the pressing force. Preferably, the pressing yoke can be formed by the cover of the previously described embodiment or it can be formed as a separate part, which can be arranged, for example, between the cover and the upper tool. The lower tool can be designed in several parts, in particular two parts, and the elastic foil is arranged between the two parts. The elastic foil can also be arranged under the lower tool towards the pressing device. The elastic foil is used to compensate for non-parallelism between the upper tool and the pressing yoke and to ensure homogenization of the forces acting on the components. In particular, the gradient curve of the pressing force across the surface of the pressed area is reduced.
[0039] According to a further advantageous embodiment of the above-mentioned diffusion soldering or sintering device, the lower tool has a fluid-filled pressure pad on the side facing the assembly. The pressure pad can also be made of silicone. The pressure pad, in addition to the elastic foil, provides a further homogenization of the pressing force and in particular compensates for any height tolerances of the components to be connected.
[0040] The invention in a further aspect relates to a pressing tool for an upper or lower tool of a diffusion soldering or sintering device according to one of the aforementioned embodiments preferred or according to the invention, which comprises a rigid base plate, a membrane part connected to the base plate and formed by a flexible, preferably dished, silicone membrane or by a metal membrane, preferably made of a steel alloy, and a pressure chamber with a pressure pad, which is preferably filled with a fluid and arranged in a closed receiving area limited by the base plate and the membrane part in the direction of the pressing surface. The pressure chamber can for example be filled with a fluid or have a support structure or have a pressure pad arranged in it. The pressure pad in principle has a flexible envelope, for example silicone, which defines a volume for the fluid. The pressure pad can also be entirely made of silicone or other heat-resistant pressure-equalizing material. The envelope is usually subject to heavy wear by conforming to the contours of the components and by contamination caused by the components and the joining material. To protect the pressure pad, in conventional diffusion soldering or sintering systems, a foil, especially of PTFE (polytetrafluoroethylene), is often used, which is placed between the component to be connected and the pressure pad and is removed after the completion of the soldering or sintering operation. However, this involves additional method steps which, on the one hand, extend the process time and, on the other hand, are new sources of defects. In the embodiment of the upper and lower tool according to the invention, a metal film assumes the function of such a protective foil on the one hand and the function of a retaining device for the pressure pad on the other hand. The pressure pad is protected from damage and contamination and the flexibility of the metal film ensures a sufficient fit of the upper and / or lower tool to the component to be connected.
[0041] Also, by providing a closed receiving area for the pressure pad, the requirements for the compressive strength of the pressure pad are reduced, since the pressure built up in the pressure pad during the pressing action is completely absorbed via the base plate and membrane parts, preventing excessive stretching of the envelope of the pressure pad.
[0042] According to a preferred embodiment, the membrane part has a full circumferential rim which is clamped between a base plate and a clamping ring which is preferably connected to the base plate by means of bolts, a secure connection of the membrane part to the base plate being achieved by the clamping ring and which also allows replacement of the pressure pad or the membrane part in case of a defect.
[0043] The membrane parts can have a uniform thickness, but also have regions of varying thickness. In particular, thickened and thinned membrane parts can be provided in order to adapt the flexibility of the membrane parts to the part regions depending on the arrangement and / or surface structure of the parts to be pressed. In this way, the membrane parts can have a rigid structure adapted to the arrangement of the parts, in particular the arrangement of the parts arranged on the product carrier, by means of the variation in thickness, i.e. the thickened and thinned regions of the membrane surface.
[0044] In an advantageous development, a sub-region of the pressure chamber of the pressing tool, in particular at least one sub-region of the pressure pad held in the pressure chamber, can be designed to be controllably fluid-fillable, in particular gas-fillable. Preferably, the fluid filling is controllable by at least one filling valve. By filling the sub-region of the pressure chamber, in particular the sub-region with fluid, in particular with gas, an additional or alternative pressing force can be generated by the fluid filled in the pressing chamber to the pressing force mechanically applied by the press. Thus, for example, the pressure chamber can be expanded through the membrane part by introducing the atmospheric gas of the process chamber, if necessary a purge gas such as nitrogen, into the sub-region of the pressure chamber. This allows for a relatively low but often sufficient pressure to be generated on the component, for example for bonding methods, low-pressure sintering with silver or copper, diffusion soldering, for example up to 0.4 MPa, thermocompression, for example up to 0.1 MPa, etc., without the use of a hydraulic press with which the pressing plunger is mechanically actuated. Thus, by simply setting the process atmosphere in the process chamber and / or pressure chamber, precise pressing forces can be applied to the component by relative movement of the lower tool and the upper tool that could not be applied by a mechanical press.
[0045] In this embodiment, a pressing tool can be provided cheaply and easily with little effort for additional or alternative pressure application, since the gas pressure and process atmosphere or vacuum in the process chamber typically required for the process can be used to apply the required and controlled sintering or diffusion soldering or joining pressure to the semiconductor element to compensate for the height differences of the parts on the component.
[0046] For this purpose, a vacuum pressure sensor and a simple software domain conversion are sufficient, so that no additional force or pressure measuring systems are required and the required and set sintering pressure or diffusion soldering pressure or joining pressure can be obtained.
[0047] The vacuum chamber in the vacuum applies pressure to the component via the pressing tool, so that any unexpected increase in chamber pressure can be detected immediately and oxygen can be continuously monitored during the process to ensure that hot components, especially copper surfaces, do not oxidize. Pressure monitoring of the component can be performed, for example, by means of a load cell integrated in the pressing drive. For example, a stuck plunger can be detected.
[0048] As an advantageous development of the pressing tool, a multi-plunger unit with several pressing plungers guided in a guide frame can be arranged under the membrane part. This allows pressure to be applied selectively to individual parts of the component and in particular height differences can be compensated for. Pressing energy can also be reduced, as pressure is only applied to the required parts. Sub-areas of the component can be protected against overload.
[0049] The diffusion soldering or sintering device preferably comprises a cooling and / or heating device advantageously arranged at least in the lower tool of the pressing tool. The cooling and / or heating device may comprise an induction heater and / or a convection heater, but also a radiant heater or a contact heater. Furthermore, a fluid cooling, in particular by water, air or oil, may be provided.
[0050] Further advantages will become apparent from the following description of the drawings, which show examples of the invention. The drawings, description and claims include many feature combinations. Those skilled in the art can consider the features individually and combine them into further useful combinations. [Brief description of the drawings]
[0051] [Figure 1] FIG. 1 is a schematic perspective view of a diffusion soldering or sintering apparatus according to an embodiment; [Diagram 2] 1A-1D are schematic perspective views of a diffusion soldering or sintering device according to an embodiment in different working positions; [Figure 3a] FIG. 3 is a side view of the diffusion soldering or sintering apparatus of FIGS. 1 and 2 in a closed position. [Figure 3b] FIG. 3 is a side view of the diffusion soldering or sintering apparatus of FIGS. 1 and 2 in an open position. [Figure 4] FIG. 4 is a perspective view, partially in section, of the diffusion soldering apparatus or sintering apparatus of FIGS. 1 to 3. [Diagram 5] FIG. 5 is a perspective view of the diffusion soldering or sintering apparatus of FIGS. 1 to 4. [Figure 6a] 6 is a schematic side view of a locking device of the diffusion soldering apparatus or sintering apparatus of FIGS. 1 to 5. FIG. [Figure 6b] FIG. 6 is a detailed view of a locking device of the diffusion soldering apparatus or sintering apparatus of FIGS. 1 to 5. [Figure 7a] FIG. 7 is a schematic diagram showing a locking position of the cover of the diffusion soldering or sintering apparatus of FIGS. 1 to 6. [Figure 7b] FIG. 7 is a schematic diagram showing an open position of the cover of the diffusion soldering or sintering apparatus of FIGS. 1 to 6. [Figure 8] FIG. 2 is an exploded perspective view of a pressing tool of a diffusion soldering or sintering apparatus according to an embodiment. [Figure 9a] FIG. 9 is a cross-sectional view of the pressing tool of FIG. 8. [Figure 9b] FIG. 9 is a cross-sectional view of the pressing tool of FIG. 8. [Figure 10] FIG. 13 is a schematic side view of a diffusion soldering or sintering apparatus according to a further embodiment. [Figure 11a] FIG. 13 is a schematic side view of a diffusion soldering or sintering apparatus according to a further embodiment. [Figure 11b] FIG. 13 is a schematic side view of a diffusion soldering or sintering apparatus according to a further embodiment. [Figure 11c] FIG. 13 is a schematic side view of a diffusion soldering or sintering apparatus according to a further embodiment. [Figure 11d] FIG. 13 is a schematic side view of a diffusion soldering or sintering apparatus according to a further embodiment. [Figure 12a]4A-4D show further pressing tools in several method steps of such a diffusion soldering or sintering apparatus according to an embodiment. [Figure 12b] 4A-4D show further pressing tools in several method steps of such a diffusion soldering or sintering apparatus according to an embodiment. [Figure 12c] 4A-4D show further pressing tools in several method steps of such a diffusion soldering or sintering apparatus according to an embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0052] In the following, the same reference numbers are used for the same or similar elements.
[0053] 1 and 2 show a diffusion soldering or sintering device 10 according to an embodiment, which comprises a housing 12 enclosing an evacuable process chamber 20 and various auxiliary units and auxiliary devices of the diffusion soldering or sintering device 10, which are not mentioned in detail. The housing 12 has a pivotable lid 14, which in its open position allows further access to the interior of the housing 12, in particular to the process chamber 20. The process chamber 20 can be purged with cleaning liquids, for example nitrogen (N2) or formic acid. Pressure conditions can be set in the process chamber 20, ranging from positive pressure, atmospheric pressure to negative pressure and vacuum. In particular, the soldering or sintering method in a vacuum or in an oxygen-free atmosphere prevents undesirable corrosion effects.
[0054] As shown in particular in Figures 3a, 3b and additionally in Figure 4, the process chamber 20 comprises a base body 22 having an access opening 23 on its upper side, which is sealable by a cover 24 which is pivotable between a closed position (Figures 1, 3a) and an open position (Figures 2, 3b). The cover 24 has a generally three-dimensional shape, with upper and lower sides running parallel to the main extension direction of the cover 24 extending in a horizontal plane and with longitudinal and lateral sides of the cover 24 extending in a vertical plane in the closed position of the cover 24. The cover 24 is connected to the base body 22 by means of a joint 36 arranged on the rear longitudinal side.
[0055] The access opening 23 is bordered by a sealing surface which interacts with a circumferential sealing ring 28 on the underside of the cover 24. The sealing ring 28 is lightly pressed against the sealing surface of the base body 22 by the weight of the cover 24, so that the access opening 23 is already hermetically closed at the beginning of the evacuation operation and no vacuum leakage occurs. The cover 24 is pressed harder against the base body 22 by a negative pressure of, for example, less than 800 hPa, which may cause the sealing ring 28 to deform slightly. In the absence of a negative pressure, the sealing ring 28, which is preferably designed as an O-ring, is stable and can be spaced apart between the cover 24 and the base body 22 such that the cover 24 cannot be locked. The joint 36 can have a certain amount of play so that the pressing against the cover 24 and the deformation of the sealing ring 28 by the joint 36 are not hindered. A negative pressure of less than 800 hPa can already bring the cover 24 into close contact with the base body 22.
[0056] To actuate the cover 24, an actuation arm 26 is provided which functions as a lever arm and is preferably removably connected to the cover 24 so that it can be removed and stored within the housing 12 when not in use (see Figures 1 and 2).
[0057] As can be seen in particular in Figures 3a, 3b and 5, the process chamber 20 can have a further access opening allowing additional access to the interior of the process chamber 20. This further access opening can be sealed by a further cover, such as for example a lid 14, in particular an airtight cover or airlock, for example a sliding partition, which can be opened and closed using actuating and locking means not mentioned in detail, or which can be fixed to the base body 22 (see Figures 3a, 3b).
[0058] An upper tool 30 (FIGS. 2 and 4) protruding into the inside of the process chamber 20 is fixed to the cover 24. Furthermore, the diffusion soldering or sintering apparatus 10 has a lower tool 32 arranged opposite to the upper tool 30, and the electronic assembly components to be connected are disposed between the upper tool 30 and the lower tool 32 to perform the diffusion soldering or sintering operation. The components to be connected can be disposed in the process chamber 20, for example, with the aid of a workpiece carrier 38 (FIG. 4).
[0059] To apply the pressing force, a lower tool 32 is mounted so as to be vertically movable, is positioned below the process chamber 20 and is connected to a pressing drive 34 which is connected to the base body 22 .
[0060] During the pressing operation, the lower tool 32 is brought closer to the upper tool 30 by the drive means 34, as a result of which the pressing force acting on the upper tool 30 and thus on the cover 24 becomes very high, and when a certain pressing force is exceeded, the opening of the cover 24 cannot be prevented by the negative pressure present in the process chamber 20 alone.
[0061] The diffusion soldering or sintering apparatus 10 thus comprises a locking device 40, which is described in detail in Figures 5, 6a and 6b, which in its locked position fixes the cover 24 in its closed position on the base body 22 and comprises a plurality of pivotable locking arms 42.1-42.3 provided on two transverse faces of the cover 24. Each locking arm 42.1-42.3 has at its first end a respective locking portion 46.1-46.3 which is pivotally fixed to the cover 24 about a respective pivot axis 44.1-44.3 and at its second end opposite the first end is locked in the locked position by means of a locking bolt 50.1-50.3 associated with the respective locking arm 42.1-42.3 and fixed to the base body 22. The relationship of the pivot axes 44.1-44.3, the locking parts 46.1-46.3 and the locking bolts 50.1-50.3 to the locking arms 42.1-42.3 is indicated by the last digit after the dot in the reference numerals. According to the embodiment shown, the pivot axes 44.1-44.3 can extend in a common plane which extends parallel to the main extent plane of the cover 24.
[0062] The lock arms 42.1 to 42.3 are attached to the cover 42.1, 42.2, 42.3, as shown in a perspective view in FIG. 5 and in a plan view in FIG. 6a. 24 A first locking arm 42.1 and a second locking arm 42. 2 and a third locking arm 42.3 disposed on the lateral side opposite to the lateral side. 2 The respective pivot axes 44.1, 44.2 and the axes of symmetry of the associated locking bolts 50.1, 50.2 form the corners of an imaginary rectangle, as can be easily seen, especially in FIG. 6a. The first and second locking arms 42.1, 42. 2 are connected by a joint-fixed connecting rod 64 (figures 3a, 3b, 4) so that the locking arms 42.1, 42.2 can pivot synchronously between the locked and unlocked positions, the locking arms 42.1, 42.2 here moving like a parallelogram.
[0063] The pivot axis 44.3 of the third locking arm 42.3 is in the same plane as the pivot axes 44.1, 44.2 and is equidistant to the first and second pivot axes 44.1, 44.2 (see FIG. 6b). The axis of symmetry of the third locking bolt 50.3 is in the same plane as the axes of symmetry of the first and second locking bolts 50.1, 50.2, but the distance A of the axis of symmetry of the third locking bolt 50.3 to the axis of symmetry of the second locking bolt 50.2 is smaller than the distance to the axis of symmetry of the first locking bolt 50.1.
[0064] The precise positioning of the three locking arms 42.1-42.3 on the cover and the symmetrical arrangement of their pivot axes 44.1-44.3 ensures the most even locking possible of the cover 24 while virtually preventing any twisting or distortion of the cover 24. In this way it is also ensured that there are no deformations or distortions that could adversely affect the evenness of the components to be connected onto the upper tool 30.
[0065] As can be easily discerned in particular in Fig. 6b, the pivot axis 44.3 of the third locking arm 42.3 and the axis of symmetry of the locking bolt 50.3 in the lateral view are however slightly offset from each other. The effective direction of the locking force transmitted by the application of a pressing force between the cover 24 and the base body 22 via the respective locked locking arm 42.1-42.3 runs parallel to the effective direction of the pressing force generated by the movement of the lower tool 32 for the first and second locking arms 42.1, 42.2, whereas this locking force runs obliquely to the effective direction of the pressing force for the third locking arm 42.3. The locking force transmitted via the third locking arm 42.3 therefore has, in addition to a normal component parallel to the effective direction of the pressing force, a transverse component perpendicular to the effective direction of the pressing force and thus parallel to the plane of the main extent of the cover. As a result, the cover 24 is slightly supported inside its main range plane and in particular its play at the jointed mounting of the locking arms 42.1-42.3 on the cover 24 in the locked position can be reduced, so that the cover 24 is in an exactly defined position during the pressing action.
[0066] However, the lateral component of the pressing or locking force exerted through the third locking arm 42.3 does not cause twisting of the cover 24 about an axis extending in its main direction of extension, so that the planarity of the cover 24 is not disturbed.
[0067] As can be easily discerned in Figures 5 and 6a, the third locking arm 42.3 has a concave shape, whereby an asymmetric distribution of mass is achieved such that the third locking arm 42.3 is moved to its locked position under the effect of gravity and is held in this locked position when the cover 24 is closed and in the absence of additional forces, thereby facilitating the closing and locking of the cover 24 on the base body 22.
[0068] In order to ensure that the locking arms 42.1-42.3 are completely in their locked position, remain in this locked position even when the pressing force is initiated and cannot be inadvertently released, the respective blocking levers 60.1, 60.3 can be provided on the side of the base body 22, used as toggle levers and designed with an actuating element with a signal colour so that the user can reliably see whether the locking arms 42.1-42.3 are actually in their locked position and blocked in this position by the respective blocking levers 60.1, 60.3. The blocking lever 60.1 interacts with the locking arm 42.1 and indirectly also with the locking arm 42.2 via the connecting rod 64, while the blocking lever 60.3 arranged on the opposite side of the base body 22 interacts with the locking arm 42.3.
[0069] When the blocking lever 60.1 is in its release position (see FIG. 3b), the locking arms 42.1-42.3 can be pivoted from the locked position to the unlocked position by means of a release lever 62, which is likewise designed as a toggle lever. A release lever of this type can also be omitted for the third locking arm 42.3. To that end, the locking part 46.3 can be moved with the aid of gravity, for example by means of a drawing chamfer 48, from the locked position to the unlocked position and thus disengaged from the third locking bolt 50.3.
[0070] To ensure an additional monitoring of the locking position of the locking arms 42.1-42.3, one or more of the locking arms 42.1-42.3 can be provided with a lock sensor, which can be designed for example as an optical, magnetic, electrostatic or mechanical sensor, detecting whether the respective locking arm 42.1-42.3 is engaged with the associated locking bolt 50.1-50.3. In the present embodiment, such a lock sensor 66 is provided on the second locking arm 42.2 (Figures 3a, 3b, 4).
[0071] As shown in FIG. 7, the opening and closing of the cover 24 can be assisted by a negative pressure, for example below 800 hPa, and a sealing ring 76. It is thus possible, as shown in FIG. 7b, to first keep the cover 24 spaced away in the direction of the base body 22 by the sealing ring 76, so that the locking arms 42.1-42.3 are not initially allowed to be in the locked position. Upon evacuation of the vacuum chamber 20, the atmospheric pressure, indicated by the arrow on the cover 24, presses the sealing ring 76 in the direction of the process chamber 20, so that the locking arms 42.1-42.3 can move automatically under the influence of gravity into the locked position (see FIG. 7a). One or more locking sensors 66 monitor the assumption of the correct locking position. The position of the locking arms 42.1-42.3 can be locked by means of blocking levers 60.1-60.3, the sealing rings 76 pressing the cover against the locking device 40 so that opening of the cover in the absence of pressure is not possible. To enable the locked position, at least one locking portion 46.1-46.3 of at least one locking arm 42.1-42.3 is provided with play 51 for receiving a locking bolt 50.1-50.3.
[0072] According to a further aspect of the invention, figures 8 and 9a or 9b show a pressing tool 70 for a diffusion soldering or sintering apparatus, in particular for the embodiment of the diffusion soldering or sintering apparatus 10 described above. The pressing tool 70 can be designed as either an upper or lower tool and is composed of a base plate 72 and a cylindrical wall 74 extending away from the base plate 72. The rectangular shape of the base plate 72 and the cylindrical shape of the wall 74 in the embodiment are purely exemplary and each can have a variety of shapes.
[0073] The hollow space defined by the base plate 72 and the wall 74 is closed by the membrane part 80. The membrane part 80 can be flat or dished, for example by deep drawing from a metal film or foil, a preferred material for the membrane part 80 being a steel alloy, for example a chromium-nickel-steel alloy. On the side facing away from the base plate 72, the membrane part 80 borders the hollow space, in which for example a pressure pad 90 can be received as a pressure chamber. Alternatively, a support structure can be received in the hollow space, for example a mechanically soft metal, a fluid chamber or a silicone pad. The membrane part 80 can have a full peripheral rim extending laterally in the same way as the wall 74 and is clamped, for example, between the base plate 72 and a clamping ring 84. The clamping ring 84 can be bolted to the base plate 72, in particular to the open part of the wall 74, and can fix the preferably dished rim of the membrane part 80. Alternatively, the membrane part 80 can be fixed directly to the wall 74. A seal ring 76 capable of interacting with an inner circumferential surface of wall portion 74 is mountable within a circumferential groove disposed in clamp ring 84 .
[0074] The hollow space formed between the base plate 72 and the membrane portion 80 defines a receiving space closed on all sides for a pressure pad or pressure chamber 90, see Fig. 9a, 9b. This receiving space can form a pressure chamber 90 filled with a fluid, for example silicone or oil, see Fig. 9a, into which the pressure pad 90 can be inserted, see Fig. 9b, which can be for example an oil-filled pad or a silicone pad, etc. The pressure pad 90 can have for example a threaded insert and can be bolted to the base plate 72.
[0075] The thickness of the membrane portion 80 is selected so that the membrane portion 80 in the area of the pressing surface 92 interacting with the electronic assembly components to be connected is elastic enough to deform by an appropriate dimension and provide a pressure compensation between adjacent components via the pressure pad 90. The membrane portion 80 can have a uniform thickness, but also have areas of varying thickness. Thus, the membrane portion 80 can be thicker or thinner in some areas and thus have a structure corresponding to different pressure area zones depending on the arrangement structure of the components 130 to be pressed. The pressing tool 70 can have an overall height of about 40 mm, the size ratios shown in Figures 8 and 9 are not necessarily to scale. In particular, the thickness of the membrane portion 80 can also be smaller than shown.
[0076] The sealing ring 76 can have a multi-layer structure, and the illustrations of the sealing ring 76 in Figures 8, 9a and 9b are simplified. It is also generally conceivable to design the clamping ring 84 in several parts rather than an inserted sealing ring groove.
[0077] With reference to Figures 10 to 12, further diffusion soldering or sintering apparatuses 110, 210, 310 are described, in which any of the features described may be realised in combination with the features of the diffusion soldering or sintering apparatus 10 previously described according to Figures 1 to 7 and used in other generally similar sintering apparatuses.
[0078] The diffusion soldering or sintering device 110, shown diagrammatically and without scale in Fig. 10, comprises a pressing yoke 112 of an upper tool and a pressing plunger 114 of a lower tool, arranged below the pressing yoke, which are movable relative to each other by drive means in order to apply a pressing force to an electronic assembly component 130, which is connected and arranged between the pressing yoke 112 and the pressing plunger 114. The drive can act on both the pressing yoke 112 and the pressing plunger 114 and can be designed, for example, as a hydraulic press. Under the pressing yoke 112, an upper hard tool 120 is arranged, between the pressing yoke 112 and the upper hard tool 120, a graphite foil 140 is arranged, which can achieve a degree of compensation of the pressure or gradient between the pressing yoke 112 and the upper hard tool 120. The graphite foil 140, like an elastic foil, can be adapted in type and thickness to achieve planar alignment between the upper hard tool 120 and the lower tool 122 when a pressing force is applied between them. As a result, the graphite foil 140 can achieve accurate parallel alignment between the upper tool and the lower tool.
[0079] Above the pressing plunger 114, a heating plate 124 is arranged, which in addition to one or more heating devices can also have one or more cooling devices. A lower tool 122, which has a receptacle for an elastic pressure pad 90 on its upper surface, is arranged above the heating plate 124. Alternatively or additionally, the upper tool 120 can be provided with a pressure pad designed as a soft tool, so that the upper hard tool 120 and / or the lower tool 122 can be replaced by a pressing tool 70, as shown in Fig. 8, Fig. 9a or Fig. 9b.
[0080] The component 130 to be connected is placed on the pressure pad 90. To protect the pressure pad 90, the upper hard tool 120 and the lower tool 122 from damage and / or dirt, the separating foils 132.1, 132.2, correspondingly formed of cut metal foil or PTFE film (polytetrafluoroethylene film) and having a thickness of, for example, about 250 μm, are placed above and below the component 130, respectively. To prevent inadvertent slippage of the separating foils 132.1, 132.2, the upper hard tool 120 can be provided with a pressure ring 126 pretensioned by a compression spring 128, which comes into contact with the full rim of the lower tool 122 when the pressure yoke 112 and the pressure plunger 114 are brought together, thereby clamping the separating foils 132.1, 132.2. Alternatively, the separating foil 132 can be omitted, especially when using a metal foil 80 according to the design of Figs. 8, 9a, 9b.
[0081] Further exemplary diffusion soldering or sintering devices 210 are shown in Figs. 11a-11d, the design of which in principle corresponds to the design of the diffusion soldering or sintering device 110 of Fig. 10, but is simplified and not shown to scale. Therefore, in the following only the main differences will be described. In the view of Fig. 11a, the pressure yoke and the pressure plunger are not shown. An upper rigid tool 120 of two-piece design consisting of a first upper rigid tool 120.1 and a second upper rigid tool 120.2 is placed on the pressure yoke. No elastic compensation foil, e.g. graphite foil, is provided. The lower tool 122, like the diffusion soldering or sintering device 110, has an embedded pressure pad 90 in which the component 130 to be connected is housed. Above the component 130 there is a separating foil 132.1, not shown to scale, and below the component 130 there is a further separating foil 132.2, which corresponds to the design of the diffusion soldering or sintering device 110. The thickness of the separating foils 132.1, 132.2 is, for example, 250 μm. A pressure ring for fixing the separating foils 132.1, 132.2 is not shown, but can be provided in a similar manner to the diffusion soldering or sintering device 110. Alternatively, the pressure pad 90 can be separated from the component 130 by a metal foil 80 corresponding to figures 8, 9a, 9b.
[0082] FIG. 11b shows a diffusion soldering or sintering apparatus 310, which is a modification of the diffusion soldering or sintering apparatus 110, 210 of FIG. 10 or FIG. 11a. The pressure yoke and the pressure plunger are not shown. The design of the upper rigid tool is two-part, similar to the diffusion soldering or sintering apparatus 210 of FIG. 11a, and consists of a first upper rigid tool 120.1 and a second upper rigid tool 120.2 arranged below it. Unlike the diffusion soldering or sintering apparatus 210 of FIG. 11a, an elastic foil 140 is arranged between the first upper rigid tool 120.1 and the second upper rigid tool 120.2 to achieve parallelism between the upper and lower tools. A further difference is that only a single separate foil 132 is provided, which is arranged between the component 130 and the lower tool 122 and whose thickness can be, for example, 500 μm.
[0083] The embodiment of the diffusion soldering or sintering device 410 of Fig. 11c substantially corresponds to the design of Fig. 11a, with the difference that an elastic foil 140 is arranged between the first upper rigid tool 120.1 and the second upper rigid tool 120.2 in order to achieve parallelism between the upper and lower tools. To that extent, the embodiment 410 corresponds to a combination of the embodiments 210 and 310.
[0084] Figure 11d shows a further embodiment of a diffusion soldering or sintering apparatus 510. It substantially corresponds to the embodiment of figure 11c, with the difference that the pressure pad 90 is not arranged in the lower tool 122, but in the upper tool below the second tool 120.2.
[0085] 12a-12c show an embodiment of a diffusion soldering or sintering device 610 in combination with a pressing tool 70, for example as shown in Fig. 8 and Fig. 9a-b. The folding process chamber 20 has a base body 22 and a cover 24. By means of the previously described pivot axis 44 (axis 44.1 and 44.3 are shown), the cover 24 is fixed on the base body 22 and can be pivoted, i.e. folded open, to allow access to the interior of the process chamber 20 and to the lower and upper tools. Inside the base body 22, a pressing drive 34 is arranged, which via a pressing plunger 114 can exert a feed movement on a component 130 held on a workpiece carrier (not shown) relative to the pressing tool 70 arranged on the upper tool. A number of components 142, for example power semiconductor components such as IGBTs, are arranged on the component 130. The parts 142 of the component 130 can have different heights and should be connected, for example with cooling structures and connection lines, in a diffusion soldering, bonding or sintering process on the component 130. The component 130 can be covered here with a process coating, not shown, for example a foil, for contamination prevention and protection. Fluid ducts 156 for temperature regulation, i.e. for the passage of a heating or cooling fluid, such as oil or air, are integrated into the cover 24.
[0086] A heating plate 124, which may have the same fluid ducts for heating or cooling, is arranged in the pressing tool 70. The heating plate 124 is the lower limit of the pressure chamber 90, in which a pressure pad may be arranged. The pressure chamber 90 has a chamber area 144 which is controllably filled with a fluid. The fluid may be a gas or a liquid. In this embodiment, the chamber area 144 is provided to be filled with the ambient gas of the process chamber 20, for example a cleaning gas such as nitrogen or air. To that end, two filling valves 146 are provided in the cover 24, which allow the chamber area 144 of the pressure chamber 90 to be fluid-tightly closed or opened with respect to the process chamber 20 via a valve actuator 148.
[0087] The pressure chamber 90 is further constrained in the direction of the lower tool by a metal membrane which becomes the membrane portion 80. The metal membrane can be, for example, a steel sheet, such as a dished steel plate. The metal membrane can bulge downwards in the direction of the process chamber 20 due to fluid filling of the chamber area 144.
[0088] A multi-plunger unit 150 is arranged below the membrane portion 80. The multi-plunger unit 150 has a guide plate 154 for receiving and guiding a number of pressing plungers 152. The pressing plungers 152 are used to selectively introduce a pressing force into predefined areas of the component 130 and can be adapted in shape and size to various geometric dimensions of the part 142 to which the pressing force is to be introduced. During pressure application, i.e., activation of the pressing drive 34, the pressing plungers 152 are moved inside the guide frame 154 towards the component 130 in order to selectively apply a pressing force.
[0089] 12a-12c, the pressing force should be generated by the membrane portion 80 expanding due to the pressure difference between the process chamber 20 and the chamber region 144 of the fluid-fillable pressure chamber 90, regardless of the pressing force generated by the pressing drive 34. The magnitude of the compressive force is determined from the pressure difference between the chamber region 144 and the process chamber 20, which displaces the membrane portion 80 towards the lower tool and exerts pressure on the component 130.
[0090] In a first process step, shown in Figure 12a, the fill valve 146 is in an up position and the chamber region 144 is in fluid communication with the process chamber 20. In a second process step, a vacuum is created in the process chamber 20, which also creates a vacuum in the chamber region 144. The first and second process steps are shown in Figure 12a.
[0091] In a subsequent third process step, the process chamber 20 is injected with a cleaning gas, such as nitrogen, which permeates the chamber region 144 of the fluid chamber 90. In a fourth process step, the fill valve 146 is fluid-tight isolated from the process chamber 20 by the valve actuator 148. The pressure drive 34 can then be actuated in a fifth process step until the workpiece carrier (not shown) and the positioned process cover (not shown) together with the component 130 are in abutting contact with the multi-plunger unit 154. The third to fifth process steps are shown in FIG. 12b.
[0092] In the next sixth process step shown in Fig. 12c, the process chamber 20 is evacuated. The membrane portion 80 now bulges downwards due to the pressure difference between the chamber area 144 of the pressure chamber 90 and the process chamber 20, moving the pressing plunger 152 in the guide frame 154 towards the component 130, so that a compressive force is selectively applied to the individual parts 142. This allows the height differences of the parts 142 to be compensated for and the pressing force to be fine-tuned according to the pressure difference.
[0093] This pressure application resulting from the pressure difference between the process chamber 20 and the pressure chamber 90 can be applied alternatively or additionally to the pressing force exerted by the pressing drive 34. The pressure generated thereby is lower and can be applied more finely than the mechanical compression force exerted by the pressing drive 34. Bonding, diffusion soldering or low-pressure sintering methods can be effectively supported thereby.
[0094] It is clear that different features of the diffusion soldering or sintering apparatus 110, 210, 310, 410, 510, 610 can be combined with one another to obtain further variants. For example, it is possible to replace the first upper rigid tool 120.1 by a pressing yoke 112. Furthermore, it is also possible to eliminate the upper separating foil 132.1 in the diffusion soldering or sintering apparatus 110 (FIG. 10) as in the diffusion soldering or sintering apparatus 310. According to a further modification, the combination of the lower tool 122 and the pressure pad 90 can also be replaced by a pressing tool 70 (FIGS. 8 and 9). In a further modification, the pressing tool 70 can alternatively or additionally replace the upper rigid tool 120 or 120.2 or the combination of both upper rigid tools 120.1, 120.2. In a further modification, the pressing yoke 112 can be formed by a pivotable cover 24 (FIGS. 1 to 7). Further embodiments include, for example, pressure pads integrated into the upper and lower tools. It is also possible that the elastic foil 140 is provided on the lower tool, the upper tool, or the lower and upper tools. [Explanation of symbols]
[0095] 10, 110, 210, 310, 410, 510, 610 Diffusion soldering or sintering equipment 12. Housing 14 Lid 20 Process Chamber 22 Base body 23 Access opening 24 Cover 26 Actuating Arm 28 Seal ring 30 Upper Tools 32 Lower Tool 34 Press Drive 36 Joint 38 Work Carrier 40 Locking device 42.1~42.3 Lock arm 44.1~44.3 Swivel axis 46.1~46.3 Lock section 48 Drawing chamfer 50.1~50.3 Rock bolt 51 Bolt's Play 60.1, 60.3 Blocking lever 62 Release lever 64 Coupling rod 66 Lock Sensor 70 Pressing Tool 72 Base Plate 74 Wall 76 Seal Ring 80 Membrane part 84 Clamp ring 90 Pressure Chambers / Pressure Pads 92 Pressing surface 112 Pressing Yoke 114 Pressing plunger 120, 120.1, 120.2 Upper Hard Tool 122 Lower Tool 124 Heating Plate 126 Pressure Ring 128 Compression Spring 130 Components 132, 132.1, 132.2 Separate foil 140 Elastic foil / graphite foil 142 Part on component 144 Fillable chamber area of fluid chamber 146 Filling valve 148 Valve Actuator 150 Multi-plunger unit 152 Pressurized plunger 154 Guide Frame 156 Temperature control fluid duct.
Claims
1. A sintering or diffusion soldering apparatus (10, 110, 210, 310, 410, 510) comprising an evacuable process chamber (20) in which an upper tool (30) and a lower tool (32) are arranged, the upper tool (30) being relatively displaceable away from each other for clamping and applying a pressing force to at least one electronic assembly component to be connected by pressure sintering or diffusion soldering, the process chamber (20) having a base body (22) having an access opening (23) on its upper side, and a cover (24) adjustable between a closed position for closing the access opening (23) and an open position, the upper tool (30) being supported by the cover (24) in the closed position thereof at least while the pressing force is applied, the process chamber (20) has a locking device (40) movable between a locked position and an unlocked position, the locking device (40) is configured to secure the cover (24) in its closed position on the base body (22) in the locked position, the locking device (40) having a plurality of pivotable locking arms (42.1-42.3) positively coupled to both the cover (24) and the base body (22) in the locked position; each of said locking arms (42.1 to 42.3) is fixed at its first end to said cover (24) so as to be pivotable about a respective pivot axis (44.1 to 44.3), is attached to said cover (24) so as to swing under the force of gravity, and at each of its second ends has a locking portion (46.1 to 46.3) on which a chamfer (48) is formed, whereby in said locked position said locking portions (46.1 to 46.3) are locked by a locking bolt (50.1 to 50.3) assigned to each of said locking arms (42.1 to 42.3) and fixed to said base body (22).
2. 2. The sintering or diffusion soldering apparatus (10, 110, 210, 310, 410, 510) according to claim 1, characterized in that the cover (24) is joined to the base body (22) so as to be pivotable about an inclined axis.
3. The sintering or diffusion soldering apparatus (10, 110, 210, 310, 410, 510) according to claim 1, characterized in that the access opening (23), the cover (24) in its locked position and the pivot axes (44.1 to 44.3) of the locking arms (42.1 to 42.3) extend in respective horizontal planes.
4. 2. A sintering or diffusion soldering apparatus (10, 110, 210, 310, 410, 510) according to claim 1, characterized in that the locking arms (42.1 to 42.3) are arranged opposite each other on two side surfaces of the cover (24).
5. A sintering or diffusion soldering apparatus (10, 110, 210, 310, 410, 510) according to claim 4, characterized in that the locking device (40) has exactly three locking arms (42.1 to 42.3), the first and second locking arms (42.1, 42.2) being arranged on one side surface and the third locking arm (42.3) being arranged on the other side surface.
6. 6. The sintering or diffusion soldering device (10, 110, 210, 310, 410, 510) according to claim 5, characterized in that the pivot axes (44.1-44.3) of the locking arms (42.1-42.3) and the locking bolts (50.1-50.3) associated with these locking arms (42.1-42.3) are arranged in such a way that an effective direction of a locking force transmitted by the action of the pressing force between the cover (24) and the base body (22) via the respective locking arms (42.1-42.3) is transmitted between the cover (24) and the base body (22) via the respective locking arms (42.1-42.3) and extends parallel to the effective direction of the pressing force for at least the first and second locking arms (42.1, 42.2).
7. The sintering or diffusion soldering apparatus (10, 110, 210, 310, 410, 510) according to claim 5, characterized in that the first and second locking arms (42.1-42.3) are connected via a connecting rod (64) such that the first and second locking arms (42.1, 42.2) are synchronously movable between the locked position and the unlocked position.
8. 6. A sintering or diffusion soldering apparatus (10, 110, 210, 310, 410, 510) according to claim 5, characterized in that the mass distribution of the third locking arm (42.3) is asymmetric with respect to an imaginary plane of symmetry spanning between the pivot axis and an axis of symmetry of the locking bolt (50.3) which extends parallel to the pivot axis when the locking arm (42.3) is locked, so that when the cover (24) is closed, the third locking arm (42.3) is held in its locked position solely by the effect of gravity, without any additional forces.
9. at least one blocking lever (60.1, 60.3) is provided which interacts with each associated locking arm (42.1 to 42.3), said blocking lever (60.1, 60.3) being movable between a blocking position in which said locking arm (42.1 to 42.3) is blocked from movement in its locked position and a release position in which said blocking lever (60.1, 60.3) releases said locking arm (42.1 to 42.3) from movement; and / or A sintering or diffusion soldering apparatus (10, 110, 210, 310, 410, 510) according to claim 1, characterized in that at least one release lever (62), preferably designed as a toggle lever and interacting with each associated locking arm (42.1-42.3), is provided, said release lever being configured to move said locking arms (42.1-42.3) from their locked position to their unlocked position.
10. 2. The sintering or diffusion soldering apparatus (10, 110, 210, 310, 410, 510) according to claim 1, comprising a pressing yoke (112), on which the upper tool (30, 120, 120.1, 120.2) is arranged, and an elastic foil (140) is arranged between the pressing yoke (112) and the upper tool (30, 120, 120.1, 120.2) and / or within the lower tool (32, 122).
11. 11. The sintering or diffusion soldering apparatus (10, 110, 210, 310, 410, 510) according to claim 10, characterized in that the lower tool (32, 122) has a fluid-filled pressure pad (90) on the side facing the assembly.
12. 2. The sintering or diffusion soldering apparatus (10, 110, 210, 310, 410, 510) according to claim 1, further comprising a pressing tool (70) for the upper tool (30, 120, 120.1, 120.2) or the lower tool (32, 122), the pressing tool having a rigid base plate (72) and a membrane part (80) formed by a flexible membrane connected to the base plate (72) in the direction of a pressing surface (92), and including a pressure chamber.
13. The sintering or diffusion soldering apparatus (10, 110, 210, 310, 410, 510) of claim 12, characterized in that the membrane portion (80) is clamped between the base plate (72) and a clamping ring (84) and has a full peripheral rim portion connected to the base plate (72).
14. 13. Sintering or diffusion soldering apparatus (10, 110, 210, 310, 410, 510) according to claim 12, characterized in that at least one sub-region of the pressure chamber is controllably fillable with a fluid.
15. 13. A sintering or diffusion soldering apparatus (10, 110, 210, 310, 410, 510) according to claim 12, characterized in that a multi-plunger unit (150) with a plurality of press plungers (152) guided in a guide frame (154) is arranged under the membrane part (80).
Citation Information
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