Imprinting apparatus and method for manufacturing article

Abstract

To provide an imprint apparatus advantageous in implementing accurate overlay between a mold and a substrate in a short period of time.SOLUTION: The imprint apparatus includes: an obtaining unit configured to obtain difference data indicating a shape difference between a pattern region of a mold 11 and a shot region on a substrate 13; a mold deformation unit 16 configured to deform the pattern region of the mold by applying a force to the mold; a substrate deformation unit 17 configured to deform the shot region by applying heat to the substrate; and a control unit 18 configured to control the mold deformation unit and the substrate deformation unit by making the mold deformation unit perform shape control on the pattern region and making the substrate deformation unit perform shape control on the shot region so as to make the shape difference fall within an allowable range. The control unit feedback-controls the mold deformation unit based on difference data obtained by the obtaining unit, target data indicating a relative target deformation amount between the pattern region of the mold and the shot region on the substrate, and time series data indicating a relative deformation amount between the pattern region of the mold and the shot region on the substrate which changes at each time while the substrate deformation unit performs shape control on the shot region.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present invention relates to an imprint apparatus and a method for manufacturing an article. [Background technology]

[0002] An imprinting apparatus forms a pattern on a substrate by hardening the imprinting material while a mold on which a pattern is formed is in contact with the imprinting material on a substrate, and then separating the mold from the hardened imprinting material. An imprinting apparatus generally has a position correction unit that corrects the positional deviation between the mold and the substrate, and a shape correction unit that corrects the shape difference between the mold (pattern) and the substrate (shot area). The position correction unit includes, for example, a movement mechanism that moves (drives) the mold and the substrate relatively. In addition, the shape correction unit includes, for example, a force deformation mechanism that pushes and pulls the mold or substrate from the periphery to deform them, or a thermal deformation mechanism that applies heat to the mold or substrate to thermally deform them.

[0003] In order to increase the productivity of the imprint apparatus, the correction of the positional misalignment between the mold and the substrate and the correction of the shape difference between the mold and the substrate are performed during the same time period from when the mold is brought into contact with the imprint material on the substrate until the mold is separated from the hardened imprint material on the substrate. In this case, the correction of the shape difference between the mold and the substrate may affect the positional misalignment between the mold and the substrate. Therefore, a technology has been proposed in which the effect of the correction of the shape difference between the mold and the substrate on the positional misalignment between the mold and the substrate is treated as time-series data, and a target position set in a moving mechanism that moves the mold and the substrate relatively is corrected (see Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2019-12821 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, since the correction of the shape difference between the mold and the substrate affects not only the positional deviation between the mold and the substrate but also the magnification deviation, the conventional technology may lead to an increase in the time required for correction of the magnification deviation and a decrease in the overlay accuracy. In addition, since hysteresis occurs in the force deformation mechanism due to the pushing and pulling direction, the force deformation mechanism may correct the mold or substrate in an unintended direction due to the influence of the thermal deformation mechanism, which may lead to a decrease in the overlay accuracy.

[0006] The present invention has been made in consideration of the problems with the conventional technology, and has an exemplified object to provide an imprint apparatus that is advantageous in realizing overlay of a mold and a substrate with high precision and in a short time. [Means for solving the problem]

[0007] In order to achieve the above object, an imprinting apparatus as one aspect of the present invention is an imprinting apparatus that forms a pattern of an imprint material on a substrate using a mold, the imprinting apparatus having: an acquisition unit that acquires difference data indicating a shape difference between a pattern region of the mold and a shot region on the substrate; a mold deformation unit that applies force to the mold to deform the pattern region of the mold; a substrate deformation unit that applies heat to the substrate to deform the shot region on the substrate; and a control unit that controls the mold deformation unit and the substrate deformation unit so that the shape difference falls within an allowable range by shape control of the pattern region by the mold deformation unit and shape control of the shot region by the substrate deformation unit, the control unit controlling the mold deformation unit and the substrate deformation unit so that the shape difference falls within an allowable range, based on the difference data acquired by the acquisition unit, target data indicating a relative target amount of deformation between the pattern region of the mold and the shot region on the substrate, and time series data indicating the relative amount of deformation between the pattern region of the mold and the shot region on the substrate that changes at each time while shape control of the shot region is being performed by the substrate deformation unit, The shape difference is within the allowable range. The mold deformation unit is feedback-controlled, and the deformation amount indicated by the time series data is While the shape of the shot area is being controlled by the substrate deformation unit, While the shape of the pattern area is being controlled by the mold deformation unit Leave, The direction of the force applied to the mold from the mold deformation portion is irreversibly changed to one direction. It is set asIt is characterized by:

[0008] Further objects or other aspects of the present invention will become apparent from the following description of the embodiments with reference to the accompanying drawings. Effect of the Invention

[0009] According to the present invention, for example, it is possible to provide an imprint apparatus that is advantageous in realizing overlapping between a mold and a substrate with high accuracy and in a short time. [Brief description of the drawings]

[0010] [Figure 1] 1 is a schematic diagram showing a configuration of an imprint apparatus according to one aspect of the present invention. [Diagram 2] 11A and 11B are diagrams for explaining shape control of a mold by a mold deformation section. [Diagram 3] 11A to 11C are diagrams for explaining substrate shape control by a substrate deformation unit. [Figure 4] 1A and 1B are diagrams for explaining problems with shape correction in the prior art. [Diagram 5] 1A and 1B are diagrams for explaining problems with shape correction in the prior art. [Figure 6] FIG. 4 is a diagram for explaining shape correction in the first embodiment. [Figure 7] FIG. 4 is a diagram for explaining shape correction in the first embodiment. [Figure 8] FIG. 13 is a diagram for explaining hysteresis. [Figure 9] FIG. 1 is a diagram for explaining problems in mold shape control caused by hysteresis. [Figure 10] FIG. 11 is a diagram for explaining shape control of a mold in the second embodiment. [Figure 11] 1A and 1B are diagrams for explaining problems with shape correction in the prior art. [Figure 12] 13A to 13C are diagrams for explaining shape correction in the third embodiment. [Figure 13] 1A to 1C are diagrams for explaining a method for manufacturing an article. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, the embodiments will be described in detail with reference to the attached drawings. Note that the following embodiments do not limit the invention according to the claims. Although the embodiments describe a number of features, not all of these features are essential to the invention, and the features may be combined in any manner. Furthermore, in the attached drawings, the same reference numbers are used for the same or similar configurations, and duplicated descriptions are omitted.

[0012] First Embodiment FIG. 1 is a schematic diagram showing the configuration of an imprinting apparatus 1 according to one aspect of the present invention. The imprinting apparatus 1 is employed in a lithography process, which is a manufacturing process for devices such as semiconductor elements, liquid crystal display elements, and magnetic storage media as articles. The imprinting apparatus 1 is a lithography apparatus that forms a pattern on a substrate, specifically, forms a pattern of an imprinting material on the substrate using a mold. The imprinting apparatus 1 brings uncured imprinting material supplied on the substrate into contact with a mold, and applies energy for curing to the imprinting material, thereby forming a pattern of a cured material to which the pattern of the mold has been transferred.

[0013] The imprint material is a material (curable composition) that is cured by applying energy for curing. The energy for curing may be electromagnetic waves, heat, or the like. The electromagnetic waves include, for example, light having a wavelength selected from the range of 10 nm to 1 mm, specifically infrared rays, visible rays, ultraviolet rays, and the like.

[0014] The curable composition is a composition that is cured by irradiation with light or by heating. The photocurable composition that is cured by irradiation with light contains at least a polymerizable compound and a photopolymerization initiator, and may further contain a non-polymerizable compound or a solvent, as necessary. The non-polymerizable compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal mold release agent, a surfactant, an antioxidant, a polymer component, and the like.

[0015] The imprint material may be applied in the form of a film on the substrate by a spin coater or a slit coater. The imprint material may also be applied in the form of droplets, or in the form of islands or a film formed by connecting a plurality of droplets, by a liquid jet head. The viscosity of the imprint material (at 25° C.) is, for example, 1 mPa·s or more and 100 mPa·s or less.

[0016] The substrate may be made of glass, ceramics, metal, semiconductor, resin, etc., and may have a member made of a material different from that of the substrate formed on its surface as required. Specifically, the substrate may be made of a silicon wafer, a compound semiconductor wafer, quartz glass, etc.

[0017] The imprint apparatus 1 has a mold holding section 12 that holds and moves a mold 11, a substrate holding section 14 that holds and moves a substrate 13, a measurement section 15, a mold deformation section 16, a substrate deformation section 17, and a control section 18. The imprint apparatus 1 uses, for example, an ultraviolet-curable imprint material that is cured by irradiation with ultraviolet rays as the imprint material (i.e., a photocuring method is adopted as the curing method for the imprint material).

[0018] In this specification and the accompanying drawings, directions are shown in an XYZ coordinate system with the direction parallel to the surface of the substrate 13 as the XY plane. The directions parallel to the X-axis, Y-axis, and Z-axis in the XYZ coordinate system are the X direction, the Y direction, and the Z direction, respectively, and the rotation around the X-axis, the Y axis, and the Z axis are θX, θY, and θZ, respectively. Control or movement about the X-axis, Y-axis, and Z-axis means control or movement about the direction parallel to the X-axis, the direction parallel to the Y axis, and the direction parallel to the Z axis, respectively. Furthermore, control or movement about the θX-axis, θY-axis, and θZ-axis means control or movement about the rotation around the axis parallel to the X-axis, the rotation around the axis parallel to the Y axis, and the rotation around the axis parallel to the Z axis, respectively.

[0019] The mold 11 has a rectangular outer shape, and has a pattern surface 11a on which a pattern to be transferred to the substrate 13 is formed. As shown in FIG. 1, the pattern surface 11a (pattern area) of the mold 11 used in the imprinting apparatus may have a convex shape (sometimes called a mesa portion or mesa area) relative to the substrate 13. In addition, a mold side mark 20 (alignment mark) is formed on the pattern surface 11a of the mold 11. The substrate 13 is a substrate to which the pattern of the mold 11 is transferred. A substrate side mark 21 (alignment mark) is formed in each of a plurality of shot areas of the substrate 13.

[0020] The mold holding unit 12 is a holding mechanism that holds the mold 11. The mold holding unit 12 includes, for example, a mold chuck that vacuum- or electrostatically adsorbs the mold 11, a head that supports the mold chuck, and a mold moving system that moves the head. The mold moving system moves the head (mold 11) at least in the Z direction. In addition, the mold moving system may have a function of moving the head not only in the Z direction, but also in the X direction, Y direction, and θZ direction.

[0021] The substrate holding unit 14 is a holding mechanism that holds the substrate 13. The substrate holding unit 14 includes, for example, a substrate chuck that vacuum- or electrostatically adsorbs the substrate 13, a substrate stage that supports the substrate chuck, and a substrate movement system that moves the substrate stage. The substrate movement system moves the substrate stage (substrate 13) at least in the X and Y directions. The substrate movement system may also have a function of moving the substrate stage not only in the X and Y directions, but also in the Z and θZ directions.

[0022] The measurement unit 15 includes a scope that optically detects the mold-side marks 20 provided on the mold 11 and the substrate-side marks 21 provided in each of the multiple shot areas of the substrate 13. The measurement unit 15 measures the relative positions (positional deviation) between the mold 11 and the substrate 13 based on the detection results of the scope, and acquires position data. The measurement unit 15 also functions as an acquisition unit that acquires difference data indicating a shape difference between the pattern of the mold 11 and the shot areas on the substrate from multiple position data acquired by detecting the multiple mold-side marks 20 and the multiple substrate-side marks 21. The shape difference between the pattern of the mold 11 and the shot areas on the substrate includes deformation deviations such as magnification deviation, trapezoidal deviation, and twist between the mold 11 and the shot areas on the substrate.

[0023] The mold deformation unit 16 has a function of applying a force to the mold 11 to deform the mold 11. In this embodiment, the mold deformation unit 16 corrects the shape of the pattern of the mold 11 in order to reduce the difference in shape between the pattern of the mold 11 and the shot area of ​​the substrate 13 for each shot area of ​​the substrate 13. The mold deformation unit 16 corrects the shape of the pattern of the mold 11 by applying a force to the mold 11 in a direction parallel to the pattern surface 11a to deform the mold 11 (pattern surface 11a).

[0024] The substrate deformation unit 17 has a function of applying heat to the substrate 13 to deform the substrate 13. In this embodiment, in order to reduce the difference in shape between the pattern of the mold 11 and the shot area of ​​the substrate 13, the substrate deformation unit 17 irradiates a predetermined position on the substrate with light 30 of a constant intensity to locally thermally expand the substrate 13 and correct the shape of the shot area of ​​the substrate 13. The substrate deformation unit 17 includes an element capable of controlling the irradiation position of the light 30 with high precision, such as a DMD (Digital Micromirror Device). The substrate deformation unit 17 generates a heat portion on the substrate and corrects the shape of the shot area of ​​the substrate 13.

[0025] The control unit 18 is composed of an information processing device (computer) including a CPU, a memory, etc., and generally controls each unit of the imprint apparatus 1 to operate the imprint apparatus 1 according to a program stored in the storage unit. In this embodiment, the control unit 18 controls the imprint process and processes related thereto. For example, when performing the imprint process, the control unit 18 controls the amount of deformation of the mold 11 by the mold deformation unit 16 and the amount of deformation of the substrate 13 by the substrate deformation unit 17 based on the measurement result of the measurement unit 15. In this manner, the control unit 18 controls the mold deformation unit 16 and the substrate deformation unit 17 so that the shape difference between the pattern of the mold 11 and the shot area on the substrate falls within an allowable range by the shape control of the mold 11 by the mold deformation unit 16 and the shape control of the substrate 13 by the substrate deformation unit 17. In addition, the control unit 18 controls at least one of the mold holding unit 12 and the substrate holding unit 14 so that the positional deviation between the pattern of the mold 11 and the shot area on the substrate falls within an allowable range based on the measurement result of the measurement unit 15.

[0026] The shape control of the mold 11 by the mold deformation unit 16 will be described with reference to FIG. 2. In FIG. 2, the vertical axis indicates the amount (deformation deviation amount) of the shape difference (magnification deviation, trapezoidal deviation, twist, etc.) between the pattern of the mold 11 and the shot area on the substrate, and the horizontal axis indicates time. In the shape control of the mold 11 by the mold deformation unit 16, the control unit 18 feedback controls the mold deformation unit 16 while controlling at least one of the mold holding unit 12 and the substrate holding unit 14 to align the mold 11 and the substrate 13. Specifically, the control unit 18 determines the output of the mold deformation unit 16 (the deformation amount of the mold 11) so that the deformation deviation amount acquired by the measurement unit 15 matches the target deformation amount. Then, the control unit 18 controls the mold deformation unit 16 according to the determined output, thereby pursuing (correcting) the shape of the mold 11. Since the shape of the shot area on the substrate is considered to be different for each shot area, the shape control of the mold 11 by the mold deformation unit 16 needs to be performed for each shot area.

[0027] With reference to FIG. 3, the shape control of the substrate 13 by the substrate deformation unit 17 will be described. As described above, the substrate deformation unit 17 generates a heat distribution in the shot area on the substrate to cause thermal expansion, thereby deforming the shot area, and corrects minute shapes (high-order components) that cannot be corrected by the mold deformation unit 16. In FIG. 3, the shape of the mold 11 is shown by a dotted line, and the shape of the shot area of ​​the substrate 13 is shown by a solid line. In the shape control of the substrate 13 by the substrate deformation unit 17, the complex shape difference between the mold 11 (pattern surface 11a) and the substrate 13 can be corrected (eliminated) by heating a point portion of the substrate 13. However, it can be seen that, before the substrate 13 is heated, the magnification components of the pattern of the mold 11 and the shot area on the substrate matched, whereas after the substrate 13 is heated, the shot area is larger than the mold 11.

[0028] Here, with reference to Figs. 4 and 5, problems with shape correction by shape control of mold 11 by mold deforming section 16 and shape control of substrate 13 by substrate deforming section 17 in the prior art will be described.

[0029] Fig. 4 is a block diagram showing a schematic operation of shape correction in the conventional technology. Referring to Fig. 4, first, the measurement unit 15 acquires a deformation deviation amount (E) corresponding to the amount of shape difference, which is the difference between the shape (M) of the pattern of the mold 11 and the shape (W) of the shot area of ​​the substrate 13, as difference data. Next, the control unit 18 controls the mold deformation unit 16 to correct the shape of the pattern of the mold 11 based on the deformation deviation amount (E) acquired by the measurement unit 15 and a target deformation amount (target data) indicating the deviation amount from the relative target shape of the pattern area and the shot area of ​​the mold 11. The control unit 18 also controls the substrate deformation unit 17 to correct the shape of the shot area of ​​the substrate 13.

[0030] FIG. 5 is a diagram showing an example of the change over time in the deformation deviation amount (E) due to the shape correction operation in the conventional technology, the shape of the pattern of the mold 11, and the shape of the shot area of ​​the substrate 13. Referring to FIG. 5, in order to make the deformation deviation amount (E) coincide with the target deformation amount, the mold deformation unit 16 starts the shape control of the mold 11 from time t1, and deforms the shape (M) of the pattern area of ​​the mold 11. In the period Pa, the deformation deviation amount (E) coincides with the target deformation amount, so the mold deformation unit 16 maintains the shape of the pattern area of ​​the mold 11 at that time. Then, when the substrate deformation unit 17 starts the shape control of the substrate 13 from time t2, the shape (W) of the shot area of ​​the substrate 13 is deformed, so that in the period Pb, a deviation occurs between the deformation deviation amount (E) and the target deformation amount. Therefore, by starting the shape control of the mold 11 by the mold deformation unit 16 again from time t3, the deformation deviation amount (E) is finally driven to the target deformation amount, and in the period Pc, the deformation deviation amount (E) coincides with the target deformation amount. As described above, in the conventional technology, the deformation deviation amount (E) is affected by the shape control of the substrate 13 by the substrate deformation unit 17, and the shape control of the mold 11 by the mold deformation unit 16 needs to be performed again, resulting in the problem that it takes time to complete the shape correction.

[0031] Therefore, in this embodiment, the mold deformation unit 16 is feedback-controlled based on the deformation deviation amount (E), the target deformation amount, and the relative deformation amount between the pattern area of ​​the mold 11 and the shot area on the substrate that changes at each time while the shape control of the substrate 13 is being performed by the substrate deformation unit 17. Hereinafter, shape correction by the shape control of the mold 11 by the mold deformation unit 16 and the shape control of the substrate 13 by the substrate deformation unit 17 in this embodiment will be described with reference to Figs. 6 and 7.

[0032] FIG. 6 is a block diagram showing a schematic diagram of the shape correction operation in this embodiment. The function f(t) indicates the deformation deviation amount that changes over time according to the shape control of the substrate 13 by the substrate deformation unit 17. In other words, the function f(t) is a function of time, and is time-series data indicating the relative deformation amount between the pattern area of ​​the mold 11 and the shot area on the substrate, which changes at each time while the substrate deformation unit 17 is performing the shape control of the substrate 13, for example, changing nonlinearly. In this embodiment, the control unit 18 includes an input unit that gives (adds) the function f(t), which is time-series data, to the target deformation amount, which is the target data. In this way, by giving the function f(t) to the target deformation amount, the shape correction of the mold 11 by the mold deformation unit 16 is minimized. However, the control unit 18 may include an input unit that gives (adds) the function f(t), which is time-series data, to the deformation deviation amount, which is the difference data, instead of the input unit that gives the function f(t) to the target deformation amount. In this case, the same effect can be obtained.

[0033] FIG. 7 is a diagram showing an example of the change over time of the deformation deviation amount (E) due to the shape correction operation in this embodiment, the shape of the pattern area of ​​the mold 11, and the shape of the shot area of ​​the substrate 13. Referring to FIG. 7, in order to make the deformation deviation amount (E) coincide with the target deformation amount, the mold deformation unit 16 starts the shape control of the mold 11 from time t1, and deforms the shape (M) of the pattern area of ​​the mold 11. In the period Pa, since the deformation deviation amount (E) coincides with the target deformation amount, the mold deformation unit 16 maintains the shape of the pattern area of ​​the mold 11 at that time. Then, from time t2, the substrate deformation unit 17 starts the shape control of the substrate 13, and gives the function f(t) to the target deformation amount. As a result, as shown in FIG. 7, the target deformation amount changes according to the deformation of the substrate 13, so that the influence of the shape control of the substrate 13 by the substrate deformation unit 17 can be canceled. Therefore, unlike the conventional technology, there is no deviation between the deformation deviation amount (E) and the target deformation amount in the period Pb, and the target deformation amount can be driven in to the period Pb. In this manner, this embodiment is advantageous in realizing the overlapping of the mold 11 and the substrate 13 with high accuracy and in a short time.

[0034] The function f(t) is obtained by measuring (actually measuring) the deformation deviation amount between the pattern area of ​​the mold 11 and the shot area of ​​the substrate 13 by the measurement unit 15 while controlling the shape of the substrate 13 by the substrate deformation unit 17 in a state where the shape of the mold 11 is not controlled by the mold deformation unit 16. The function f(t) can also be obtained by simulating the effect of the shape control of the substrate 13 by the substrate deformation unit 17. The function f(t) may be an approximation curve expressed by a polynomial with time t as a variable, or a result obtained by actual measurement or simulation may be used as it is. Here, the function f(t) is expressed as a value that changes over time, but since it is a component that changes according to the shape control of the substrate 13 by the substrate deformation unit 17, the light amount (heat amount) of the light irradiated to the substrate 13 by the substrate deformation unit 17 or its integrated amount may be used as a variable.

[0035] <Second embodiment> In controlling the shape of mold 11 by mold deformation section 16, if the direction of the force applied to mold 11 changes, hysteresis occurs, and the correlation between the output of mold deformation section 16 and the deformation amount of mold 11 (correction amount for deformation deviation) may be lost. With reference to FIG. 8, the hysteresis occurring in the relative relationship between the output of mold deformation section 16 (force applied to mold 11 from mold deformation section 16) and the deformation amount of mold 11 will be described. In FIG. 8, the vertical axis indicates the deformation amount of mold 11, and the horizontal axis indicates the output of mold deformation section 16. When correcting the shape of mold 11, if the direction of the force applied to mold 11 from mold deformation section 16 is one direction (constant), the output of mold deformation section 16 and the deformation amount of mold 11 are proportional, as shown by OPa in FIG. 8. However, if the shape of mold 11 is over-corrected and it becomes necessary to reverse the direction of the force applied to mold 11 by mold deformation section 16, the correlation between the output of mold deformation section 16 and the amount of deformation of mold 11 will be disrupted, as shown by OPb in Figure 8.

[0036] FIG. 9 is a diagram showing an example of the change over time in the deformation deviation amount (shape of the mold 11) and the output of the mold deformation unit 16 when the shape of the mold 11 is overcorrected in the shape control of the mold 11 by the mold deformation unit 16. Referring to FIG. 9, the shape control of the mold 11 by the mold deformation unit 16 is started from time t1, and the shape of the pattern area of ​​the mold 11 is gradually deformed, but in the period Pa, the shape of the pattern of the mold 11 is overcorrected (the deformation deviation amount exceeds the target deformation amount). Therefore, since the direction of the force applied to the mold 11 by the mold deformation unit 16 must be reversed, hysteresis occurs, and the output of the mold deformation unit 16 is not reflected in the deformation of the mold 11. After that, the deformation amount can be driven to the target deformation amount in the period Pb, but there is a problem that it takes time for the shape control of the mold 11 by the mold deformation unit 16 to be completed due to hysteresis.

[0037] Therefore, in this embodiment, as in the first embodiment, the target deformation amount is changed according to time as a function f(t) to reduce (prevent) delays in shape control of the mold 11 by the mold deformation section 16 caused by hysteresis.

[0038] FIG. 10 is a diagram showing an example of the deformation deviation amount due to the shape control operation of the mold 11 in this embodiment and the change over time in the output of the mold deformation unit 16. Referring to FIG. 10, the shape control of the mold 11 by the mold deformation unit 16 starts from time t1, and the shape of the pattern area of ​​the mold 11 is gradually deformed. In this embodiment, the target deformation amount at the start is set large. Therefore, in the period Pa, the deformation deviation amount exceeds the target deformation amount, but by applying the function f(t) to the target deformation amount from time t2, it is possible to drive it to the target deformation amount in the period Pb without generating hysteresis. In this way, this embodiment is advantageous in realizing the overlapping of the mold 11 and the substrate 13 with high accuracy and in a short time.

[0039] The function f(t) is obtained from actual measurement or simulation, as in the first embodiment. Specifically, the magnitude and timing of the difference between the deformation deviation amount and the target deformation amount are obtained, and a function f(t) is obtained that sets an initial value of the target deformation amount and changes it in a stepwise manner so that the final target deformation amount is not exceeded even if the initial target deformation amount is exceeded, as shown in Fig. 10. In addition, when the time for which the mold deformation unit 16 performs shape control of the mold 11 is determined, a function f(t) may be given that continuously changes the target deformation amount from the initial deformation deviation amount to the final target deformation amount in proportion to time.

[0040] <Third embodiment> The deformation deviation amount is affected by the shape correction of the substrate 13 by the substrate deformation unit 17, and hysteresis may occur. FIG. 11 is a diagram showing an example of the deformation deviation amount (E) due to the shape correction operation in the conventional technology, the output of the mold deformation unit 16, and the change over time in the shape of the pattern area of ​​the mold 11 and the shape of the shot area of ​​the substrate 13. Referring to FIG. 11, in order to make the deformation deviation amount (E) coincide with the target deformation amount, the mold deformation unit 16 starts shape control of the mold 11 from time t1, and deforms the shape (M) of the pattern area of ​​the mold 11. During the period Pa, since the deformation deviation amount (E) coincides with the target deformation amount, the mold deformation unit 16 maintains the shape of the pattern area of ​​the mold 11 at that time. Then, when the substrate deformation unit 17 starts shape control of the substrate 13 from time t2, the shape (W) of the shot area of ​​the substrate 13 is deformed. As a result, during period Pb, there is a deviation between the deformation deviation amount (E) and the target deformation amount, but because this direction is opposite to the initial driving direction, hysteresis occurs when shape control of mold 11 by mold deformation unit 16 is started again. Therefore, during period Pb, the output of mold deformation unit 16 is not reflected in the deformation of mold 11. After that, the deformation can be driven to the target deformation amount during period Pc, but there is a problem in that it takes time to complete shape correction due to hysteresis.

[0041] Therefore, in this embodiment, similarly to the first embodiment, the change in the deformation deviation amount between the mold 11 and the substrate 13 predicted from the heat amount of the light irradiated to the substrate 13 by the substrate deformation unit 17 is given as the function f(t). This suppresses the occurrence of a deviation between the target deformation amount and the deformation deviation amount caused by the shape control of the substrate 13 by the substrate deformation unit 17, and suppresses the occurrence of hysteresis.

[0042] FIG. 12 is a diagram showing an example of the change over time in the deformation deviation amount (E) due to the shape correction operation in this embodiment, the output of the mold deformation unit 16, the shape of the pattern area of ​​the mold 11, and the shape of the shot area of ​​the substrate 13. Referring to FIG. 12, the mold deformation unit 16 starts the shape control of the mold 11 from time t1, and deforms the shape (M) of the pattern area of ​​the mold 11. In the period Pa, the deformation deviation amount (E) and the target deformation amount match, so the mold deformation unit 16 maintains the shape of the pattern area of ​​the mold 11 at that time. Then, the substrate deformation unit 17 starts the shape control of the substrate 13 from time t2, and applies the function f(t) to the target deformation amount. As a result, as shown in FIG. 12, the target deformation amount changes according to the deformation of the substrate 13, and the influence of the shape control of the substrate 13 by the substrate deformation unit 17 can be canceled. Therefore, it is no longer necessary to change the direction of the force applied from the mold deformation unit 16 to the mold 11 in the opposite direction, so that no hysteresis occurs and the target deformation amount can be reached in the period Pb. In this manner, this embodiment is advantageous in realizing the overlapping of the mold 11 and the substrate 13 with high accuracy and in a short time.

[0043] As in the first embodiment, the function f(t) is obtained by actually measuring or simulating the effect of the shape correction of the substrate 13 by the substrate deforming unit 17. Furthermore, as a variable of the function f(t), not only the time t but also the amount of light (amount of heat) of the light irradiated to the substrate 13 by the substrate deforming unit 17 or its integrated amount may be given. Furthermore, as in the second embodiment, in order to suppress the occurrence of hysteresis, a component that changes stepwise or continuously from a small amount with respect to the final target deformation amount may be added to the function f(t).

[0044] <Fourth embodiment> The pattern of the cured material formed by using the imprint apparatus 1 is used permanently on at least a part of various articles, or temporarily when manufacturing various articles. The articles include electric circuit elements, optical elements, MEMS, recording elements, sensors, and molds. Examples of the electric circuit elements include volatile or non-volatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensors, and FPGA. Examples of the molds include molds for imprinting.

[0045] The pattern of the cured product may be used as it is as at least a part of the component of the above-mentioned article, or may be used temporarily as a resist mask, which is removed after etching or ion implantation is performed in a substrate processing step.

[0046] Next, a specific method for manufacturing the article will be described. As shown in Fig. 13(a), a substrate such as a silicon wafer with a workpiece such as an insulator formed on its surface is prepared, and then an imprint material is applied to the surface of the workpiece by an inkjet method or the like. Here, the state in which the imprint material in the form of multiple droplets is applied to the substrate is shown.

[0047] As shown in Fig. 13(b), the imprinting mold is placed so that the side on which the concave-convex pattern is formed faces the imprinting material on the substrate. As shown in Fig. 13(c), the substrate on which the imprinting material has been applied is brought into contact with the mold, and pressure is applied. The imprinting material fills the gap between the mold and the workpiece. When light is irradiated through the mold in this state as hardening energy, the imprinting material hardens.

[0048] As shown in Fig. 13(d), after the imprint material is cured, the mold and the substrate are separated, and a pattern of the cured product of the imprint material is formed on the substrate. In this cured product pattern, the recesses of the mold correspond to the protrusions of the cured product, and the protrusions of the mold correspond to the recesses of the cured product, i.e., the recessed and protruding patterns of the mold are transferred to the imprint material.

[0049] As shown in Fig. 13(e), when etching is performed using the pattern of the cured material as an etching-resistant mask, the portions of the surface of the workpiece where there is no cured material or where only a thin portion remains are removed to form grooves. As shown in Fig. 13(f), when the pattern of the cured material is removed, an article having grooves formed on the surface of the workpiece can be obtained. Here, the pattern of the cured material is removed, but it may also be used as an interlayer insulating film included in a semiconductor element, i.e., a component of an article, without being removed after processing.

[0050] The invention is not limited to the above-described embodiments, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0051] 1: Imprint device 11: Mold 13: Substrate 15: Measurement section 16: Mold deformation section 17: Substrate deformation section 18: Control section

Claims

1. An imprinting apparatus for forming a pattern of an imprint material on a substrate using a mold, comprising: an acquisition unit that acquires difference data indicating a shape difference between a pattern area of ​​the mold and a shot area on the substrate; a mold deformation unit that applies a force to the mold to deform a pattern area of ​​the mold; a substrate deformation unit that applies heat to the substrate to deform a shot area on the substrate; a control unit that controls the mold deformation unit and the substrate deformation unit so that the shape difference falls within an allowable range by controlling the shape of the pattern region by the mold deformation unit and the shape of the shot region by the substrate deformation unit, the control unit feedback-controls the mold deformation unit so that the shape difference falls within an allowable range, based on the difference data acquired by the acquisition unit, target data indicating a relative target deformation amount between the pattern area of ​​the mold and the shot area on the substrate, and time-series data indicating a relative deformation amount between the pattern area of ​​the mold and the shot area on the substrate that changes at each time while the substrate deformation unit is controlling the shape of the shot area, An imprint apparatus characterized in that the deformation amount indicated by the time series data is set so that the direction of the force applied to the mold from the mold deformation unit is irreversibly in one direction while the substrate deformation unit is controlling the shape of the shot area and while the mold deformation unit is controlling the shape of the pattern area.

2. The imprint apparatus according to claim 1, wherein the time series data indicates a relative deformation amount between a pattern area of ​​the mold, which changes nonlinearly at each time while the substrate deformation unit is controlling the shape of the shot area, and the shot area on the substrate.

3. An imprinting apparatus for forming a pattern of an imprint material on a substrate using a mold, comprising: a scope for optically detecting difference data indicating a shape difference between a pattern area of ​​the mold and a shot area on the substrate; a force deformation mechanism for applying a force to the mold to deform a pattern area of ​​the mold; an optical system that includes a device for controlling a light irradiation position and applies heat to the substrate to deform a shot area on the substrate; a control unit that controls the force deformation mechanism and the optical system so that the shape difference falls within an allowable range by controlling the shape of the pattern region by the force deformation mechanism and the shape of the shot region by the optical system, The control unit is receiving time series data including a plurality of measured values ​​indicating a relative deformation amount between a pattern area of ​​the mold and a shot area on the substrate, the relative deformation amount changing a plurality of times during a period corresponding to a time during which the optical system is performing shape control of the shot area; a feedback control is performed so that the force deformation mechanism deforms the pattern area of ​​the mold a plurality of times based on difference data acquired by the scope, target data indicating a relative target deformation amount between the pattern area of ​​the mold and the shot area on the substrate, and the time-series data, so that the shape difference falls within an allowable range; An imprint apparatus characterized in that the deformation amount indicated by the time series data is set so that the direction of the force applied to the mold from the force deformation mechanism is irreversibly set to one direction while the optical system is controlling the shape of the shot area and while the force deformation mechanism is controlling the shape of the pattern area.

4. 4. The imprint apparatus according to claim 1, wherein the control unit includes an input unit that adds the time series data to the target data.

5. 4. The imprint apparatus according to claim 1, wherein the control unit includes an input unit that adds the time series data to the difference data.

6. The acquisition unit is a measurement unit that measures a relative position between the mold and the substrate to obtain position data; The imprint apparatus according to claim 1 , wherein the difference data is obtained from a plurality of position data obtained by the measurement unit.

7. A mold holding unit that holds and moves the mold; a substrate holder that holds and moves the substrate, The imprint apparatus according to claim 6, characterized in that the control unit controls at least one of the mold holding unit and the substrate holding unit based on the position data acquired by the measurement unit so that a positional misalignment between a pattern area of ​​the mold and a shot area on the substrate falls within an acceptable range.

8. The imprint apparatus according to claim 7 , wherein the control unit performs feedback control of the mold deformation unit while controlling at least one of the mold holding unit and the substrate holding unit.

9. forming a pattern on a substrate using the imprint apparatus according to claim 1; processing the substrate on which the pattern has been formed in the process; producing an article from the processed substrate; A method for producing an article, comprising the steps of:

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