Optical device, subassembly of optical device, and method for manufacturing optical device

Abstract

To provide, for example, an improved new configuration optical device, a subassembly of the optical device, and a manufacturing method of the optical device.SOLUTION: An optical device includes, for example, a case, a wiring board passing through the case and having an insulating portion and a conductor, and at least one component housed in the case and flip-chip mounted on the wiring board among a first component that performs at least one of light output, light reception, and light characteristic change, and a second component that electrically controls the first component. The wiring board may be a rigid board or a flexible board. Further, the case has a first wall through which the wiring board penetrates and a second wall that intersects with the first wall, and the optical device may include a heat transfer member that is interposed between the component and the second wall, and thermally connects the component and the second wall.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to an optical device, a subassembly of an optical device, and a method for manufacturing an optical device. [Background technology]

[0002] Conventionally, optical devices equipped with a feedthrough that penetrates a case have been known (for example, Patent Document 1). The feedthrough is an assembly of terminals that has an insulator and a plurality of terminals that penetrate the insulator, and that ensures electrical continuity between the inside and outside of the case. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2020-178117 A Summary of the Invention [Problem to be solved by the invention]

[0004] It would be beneficial to have new and improved optical arrangements for this type of optical device, for example, that would reduce the number of parts and allow the optical device to be made more compact.

[0005] SUMMARY OF THE PRESENT EMBODIMENTS It is therefore an object of the present invention to provide an optical device, a subassembly of an optical device, and a method for manufacturing an optical device, each having an improved and novel configuration. [Means for solving the problem]

[0006] The optical device of the present invention includes, for example, a case, a wiring board that penetrates the case and has an insulating portion and a conductor, and at least one of a first component that is housed within the case and flip-chip mounted to the wiring board, the first component performing at least one of outputting light, receiving light, and changing the characteristics of light, and a second component that electrically controls the first component.

[0007] The optical device may include a rigid substrate as the wiring substrate.

[0008] The optical device may include a flexible substrate as the wiring substrate.

[0009] In the optical device, the case has a first wall through which the wiring board passes and a second wall intersecting the first wall, and the optical device may include a heat transfer member interposed between the component and the second wall and thermally connecting the component and the second wall.

[0010] The optical device may include a flexible heat transfer member as the heat transfer member.

[0011] In the optical device, the wiring board may pass through an opening provided in the case, and the optical device may include a bonding material that bonds an edge of the opening and the wiring board.

[0012] In the optical device, the wiring board may pass through an opening provided in the case, and the case may have a protrusion that protrudes from an edge of the opening and engages with the wiring board.

[0013] In the optical device, the wiring board may pass through an opening provided in the case and be press-fitted into the opening.

[0014] In the optical device, the wiring board may pass through an opening provided in the case, and a gap between the wiring board and an edge of the opening may be hermetically sealed.

[0015] A subassembly of an optical device of the present invention has, for example, a wiring board and components mounted on the wiring board, including at least one of a first component that performs at least one of outputting light, receiving light, and changing the characteristics of light, and a second component that electrically controls the first component, and is configured to be attachable to a case of an optical device with the wiring board passing through an opening provided in a wall of the case and the components positioned on the opposite side of the wall from the outer surface of the case.

[0016] A subassembly of an optical device of the present invention has, for example, a first portion which is part of a case that houses an optical component and includes a first wall, a wiring board which penetrates the first wall and is fixed to the first wall, and at least one of a first component which performs at least one of outputting, receiving, and changing the characteristics of light, and a second component which electrically controls the first component, which is mounted on the wiring board and positioned on the opposite side of the first wall from the outer surface of the case relative to the first wall, and is configured to be attachable to a second portion different from the first portion of the case.

[0017] A manufacturing method for an optical device of the present invention includes, for example, a step of creating a subassembly on a wiring board having at least one of a first component that performs at least one of outputting, receiving, and changing the characteristics of light, and a second component that electrically controls the first component, and a step of fixing the subassembly to the case in a state in which the wiring board passes through an opening provided in a wall of a case for the optical device and the component is positioned on the opposite side of the wall from the outer surface of the case. Effect of the Invention

[0018] The present invention provides, for example, optical devices with novel and improved configurations, subassemblies of optical devices, and methods of manufacturing optical devices. [Brief description of the drawings]

[0019] [Figure 1]FIG. 1 is an illustrative schematic plan view showing the internal configuration of the optical device according to the first embodiment. [Diagram 2] FIG. 2 is an exemplary schematic cross-sectional view of a portion of the optical device according to the first embodiment. [Diagram 3] FIG. 3 is an illustrative schematic cross-sectional view of a portion of the optical device according to the second embodiment. [Figure 4] FIG. 4 is an exemplary schematic cross-sectional view of a portion of the optical device according to the third embodiment. [Diagram 5] FIG. 5 is an illustrative schematic cross-sectional view of a portion of the optical device according to the fourth embodiment. [Figure 6] FIG. 6 is an exemplary schematic side view (partial cross-sectional view) of a portion of the optical device according to the fifth embodiment. [Figure 7] FIG. 7 is an exemplary schematic side view (partial cross-sectional view) of a portion of the optical device according to the sixth embodiment. [Figure 8] FIG. 8 is an illustrative schematic cross-sectional view of a portion of the optical device according to the seventh embodiment. [Figure 9] FIG. 9 is an exemplary schematic exploded cross-sectional view of a portion of the optical device according to the eighth embodiment, illustrating the assembly of a subassembly into a case. [Figure 10] FIG. 10 is an exemplary schematic exploded cross-sectional view of a portion of the optical device according to the ninth embodiment, illustrating the assembly of a subassembly into a case. [Figure 11] FIG. 11 is an illustrative schematic cross-sectional view of a portion of the optical device according to the ninth embodiment. [Figure 12] FIG. 12 is an illustrative schematic exploded perspective view of the optical device according to the tenth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0020] Exemplary embodiments of the present invention are disclosed below. The configurations of the embodiments shown below, and the actions and results (effects) brought about by the configurations are merely examples. The present invention can be realized by configurations other than those disclosed in the following embodiments. Furthermore, according to the present invention, it is possible to obtain at least one of the various effects (including derivative effects) obtained by the configurations.

[0021] The following embodiments have similar configurations. Therefore, according to the configurations of the respective embodiments, similar actions and effects based on the similar configurations can be obtained. In the following, the similar configurations are given the same reference numerals, and duplicated descriptions may be omitted.

[0022] In this specification, ordinal numbers are given for the sake of convenience to distinguish members, parts, directions, etc., and do not indicate priority or order.

[0023] In each drawing, the X direction is represented by an arrow X, the Y direction is represented by an arrow Y, and the Z direction is represented by an arrow Z. The X direction, Y direction, and Z direction intersect with each other and are perpendicular to each other.

[0024] [First embodiment] Fig. 1 is a plan view showing the internal configuration of the optical device 10. Fig. 1 is a view of the optical device 10 viewed in the opposite direction to the Z direction with a flat cover (not shown) located at the end of a case 11 of the optical device 10 in the Z direction removed.

[0025] As shown in FIG. 1, the optical device 10 includes a case 11, a plurality of components 12, a plurality of external connection pins 13, a feedthrough 14, and a wiring board 15.

[0026] The case 11 has a bottom wall 11a, a peripheral wall 11b, ports 11c and 11d, and a lid (not shown). The bottom wall 11a has a generally rectangular, plate-like shape. The bottom wall 11a intersects with the Z direction and extends in the X direction and the Y direction. The peripheral wall 11b extends in the Z direction from the edge of the bottom wall 11a with a generally constant thickness. The peripheral wall 11b may also be referred to as a side wall.

[0027] The lid of the case 11 has a generally rectangular and plate-like shape, similar to the bottom wall 11a. The periphery of the lid overlaps with the Z-direction edge of the peripheral wall 11b in the Z direction. The periphery of the lid and the Z-direction edge of the peripheral wall 11b are joined together to form an accommodation chamber S in the case 11 for accommodating the components 12, the flexible board 15, and the like. The accommodation chamber S may be hermetically sealed. The accommodation chamber S may be filled with an inert gas.

[0028] The bottom wall 11a may be made of a material with high thermal conductivity, such as copper tungsten (CuW), copper molybdenum (CuMo), aluminum oxide (Al2O3), etc. The peripheral wall 11b and the lid may be made of a material with a low thermal expansion coefficient, such as an Fe-Ni-Co alloy, aluminum oxide (Al2O3), etc.

[0029] The ports 11c and 11d have a cylindrical shape and protrude laterally from a part of the peripheral wall 11b, in the Y direction in the example of FIG. 1. One of the ports 11c and 11d is an input port and the other is an output port. An input optical fiber penetrates the input port, and an output optical fiber penetrates the output port. The spaces between the ports 11c and 11d and the peripheral wall 11b, and between the ports 11c and 11d and the optical fibers are hermetically sealed.

[0030] The component 12 is accommodated in the accommodation chamber S, i.e., in the case 11. At least one component 12 is flip-chip mounted on the wiring board 15. The other components 12 may be mounted on the bottom wall 11a or on a cooling mechanism (not shown) provided on the bottom wall 11a. In this case, the other components 12 are electrically connected to the conductor wiring of the wiring board 15 or the external connection pins 13 via another conductor (not shown), such as a bump, a conductor of a flexible printed wiring board, or a bonding wire.

[0031] Each of the components 12 is energized from outside the case 11, that is, receives power from outside the case 11. Each of the components 12 is a first component that outputs light, receives light (detects light), and changes characteristics such as light intensity, wavelength, modulation frequency, polarization state, and interference state, or a second component that electrically controls the operation of at least one of the first components. That is, the components 12 are optical components or electrical components that operate electrically. The components 12 as the first components are, for example, a chip-on-submount (light-emitting unit), a wavelength locker that is a wavelength detector, a photodiode that is a light receiver, a photodiode array, a modulator, a modulator driver, a coherent mixer, a transimpedance amplifier, a heater (heating mechanism), a TEC (thermoelectric cooler, cooling mechanism), and the like. The components 12 as the second components are, for example, a controller. The controller is a computer, and is an integrated circuit that controls the operation of other electric and electronic components. The housing chamber S also houses optical components (not shown) that do not operate electrically, such as lenses, mirrors, beam combiners, beam splitters, and optical isolators.

[0032] The external connection pins 13 are attached to the feedthroughs 14. The external connection pins 13 all extend in the X direction and are arranged in the Y direction with gaps between them. In this embodiment, one array in which the external connection pins 13 are arranged in the Y direction is provided along a portion (side wall) located at an end of the peripheral wall 11b in the X direction and extending in the Y direction, and another array in which the external connection pins 13 are arranged in the Y direction is provided along a portion (side wall) located at an end of the peripheral wall 11b in the opposite direction to the X direction and extending in the Y direction. The external connection pins 13 can be made of a metal material with high conductivity, such as a copper-based metal or an aluminum-based metal. The copper-based metal is copper or a copper alloy, and the aluminum-based metal is aluminum or an aluminum alloy. The external connection pins 13 are mechanically and electrically connected to conductors of external wiring (not shown).

[0033] The feedthrough 14 has a conductor and an insulating portion, and penetrates the peripheral wall 11b of the case 11. The conductor of the feedthrough 14 may be made of a highly conductive metal material such as a copper-based metal. The conductors of the feedthrough 14, together with the external connection pins 13 to which they are electrically connected, form external connection conductors. The insulating portion of the feedthrough 14 may be made of an insulator such as ceramic. The boundary between the feedthrough 14 and the case 11 is hermetically sealed.

[0034] Wiring board 15 penetrates peripheral wall 11b and extends between the inside and outside of case 11. Wiring board 15 has a rectangular, plate-like shape, intersects with the Z direction, and extends in the X and Y directions. In this embodiment, wiring board 15 penetrates in the Y direction through a portion of peripheral wall 11b of case 11 that is located at the end in the Y direction. Peripheral wall 11b is an example of a first wall.

[0035] The wiring board 15 is a printed wiring board having an insulating layer and a plurality of conductor wirings. The insulating layer is made of an insulator such as ceramic, glass, synthetic resin material, or a mixture of these materials. The conductor wiring is made of a metal material with high conductivity such as a copper-based metal. In this embodiment, the wiring board 15 is a rigid board. However, the present invention is not limited to this, and the wiring board 15 may be a flexible board or a rigid-flexible board.

[0036] 2 is a cross-sectional view of the optical device 10 taken along a line intersecting the X direction, and includes a side view of some components. As shown in FIG.

[0037] The wiring board 15 penetrates an opening 11b1 provided in the peripheral wall 11b of the case 11. The opening 11b1 is a through hole penetrating the peripheral wall 11b in the Y direction and has a slit-like shape extending in the X direction. A bonding material 16 is interposed between the opening 11b1 and the wiring board 15. The bonding material 16 bonds between the edge of the opening 11b1 and the wiring board 15. The gap between the edge of the opening 11b1 and the wiring board 15 is hermetically sealed by the bonding material 16.

[0038] The wiring board 15 has an insulating layer 15a and conductor wiring 15b. In this embodiment, the conductor wiring 15b is exposed at least on a surface of the insulating layer 15a located at an end opposite to the Z direction. The insulating layer 15a is an example of an insulating portion, and the conductor wiring 15b is an example of a conductor.

[0039] The wiring board 15 is a rigid board. The wiring board 15 may be, for example, a single-sided board, a double-sided board, a multi-layer board, a build-up board, or the like.

[0040] The component 12 is located between the wiring board 15 and the bottom wall 11a, and is flip-chip mounted on the wiring board 15. That is, an electrode 12c provided on a surface 12a of the component 12 facing the wiring board 15 is mechanically and electrically connected to a pad of the conductor wiring 15b via a bonding material 17. The bonding material 17 is a conductor such as a bump or a ball, for example a solder ball.

[0041] The wiring board 15 is spaced apart from the bottom wall 11a of the case 11 in the Z direction. Heat transfer members 18 and 19 are interposed between the component 12 mounted on the wiring board 15 and the bottom wall 11a. The component 12 and the bottom wall 11a are thermally connected via these heat transfer members 18 and 19. This allows heat generated by the operation of the component 12 to be released to the outside of the optical device 10 via the heat transfer members 18 and 19 and the bottom wall 11a. The bottom wall 11a intersects with the peripheral wall 11b and is an example of a second wall.

[0042] The heat transfer member 18 is a block made of a metal material such as a copper-based material having high thermal conductivity, and may also be called a heat dissipation block. The heat transfer member 18 is joined to the bottom wall 11a in a substantially intimate contact state by welding, adhesive, or the like. The heat transfer member 18 is thermally connected to the bottom wall 11a.

[0043] The heat transfer member 19 is interposed between the surface 12b of the component 12 opposite to the surface 12a and the surface 18a of the heat transfer member 18 opposite to the bottom wall 11a. The heat transfer member 19 is, for example, an adhesive with high thermal conductivity. In this case, the heat transfer member 19 is interposed between the component 12 and the heat transfer member 18 in a fluid state before being solidified, so that the variation in the gap between the component 12 and the heat transfer member 18 can be absorbed. The heat transfer member 19 may also be a thermally conductive sheet. The thermally conductive sheet has thermal conductivity, flexibility, and malleability, and is deformable. In this case, the variation in the gap between the component 12 and the heat transfer member 18 can be absorbed by the deformation of the heat transfer member 19.

[0044] The heat transfer member 18 is also in close contact with the peripheral wall 11b. That is, in this embodiment, the component 12 is also thermally connected to the peripheral wall 11b via the heat transfer members 18 and 19. This makes it easier for heat generated by the operation of the component 12 to escape to the outside of the optical device 10 than when the component 12 is thermally connected only to the bottom wall 11a.

[0045] Conductive wiring 15b of wiring board 15 is electrically connected to conductive wiring 20b of external board 20 outside case 11 via bonding material 21. External board 20 is a wiring board having insulating layer 20a and conductive wiring 20b, and is a rigid board or a flexible board. External board 20 may be, for example, a transceiver board for transmitting a relatively high-frequency electric signal such as an RF signal. In this case, the relatively high-frequency electric signal is transmitted through conductive wiring 20b, bonding material 21, and conductive wiring 15b of wiring board 15.

[0046] In addition, for example, DC power or a relatively low-frequency electrical signal is transmitted between the external connection pin 13 and another component 12 (not shown in FIG. 2) via the conductor in the feedthrough 14 and another conductor.

[0047] As described above, in this embodiment, the wiring board 15 on which the components 12 are flip-chip mounted penetrates the peripheral wall 11b of the case 11. It can be said that the wiring board 15 is an integration of a feedthrough or an interface board and a wiring board arranged inside the case 11 (inside the housing chamber S). This integration has the advantage that, for example, the number of components in the optical device 10 can be reduced and the optical device 10 can be made more compact. Note that the one wiring board 15 and the two feedthroughs 14 shown in FIG. 1 may be integrated and replaced by one wiring board.

[0048] In this embodiment, the wiring board 15 is a rigid board. This configuration has the advantage that the wiring board 15 can be handled more easily when assembling the optical device 10, for example.

[0049] [Second embodiment] 3 is a cross-sectional view of the optical device 10A of the second embodiment taken along a cross section intersecting with the X direction, including a side view of some components. As shown in FIG. 3, the optical device 10A includes a support member 22 that supports the wiring board 15A. The support member 22 penetrates an opening 11b1 provided in the peripheral wall 11b. That is, the support member 22 has a portion that is accommodated in the case 11 and a portion that is exposed to the outside of the case 11. The support member 22 is joined to the bottom wall 11a by welding, adhesion, or the like in a substantially tight contact state. A bonding material 16 is interposed between the wiring board 15A and the support member 22.

[0050] In the present embodiment, the wiring board 15A is a flexible board. This configuration has the advantages of increasing the degree of freedom in the layout of the wiring board 15A in the accommodation chamber S and absorbing dimensional variations of the components by bending (bending) the wiring board 15A.

[0051] [Third embodiment] FIG. 4 is a cross-sectional view of the optical device 10B of the third embodiment taken along a cross section intersecting with the X direction, including a side view of some components. As shown in FIG. 4, in the optical device 10B, the heat transfer member 18B supports the wiring board 15A and penetrates an opening 11b1 provided in the peripheral wall 11b. The heat transfer member 18B has a portion accommodated in the case 11 and a heat dissipation portion 18b exposed to the outside of the case 11. The heat dissipation portion 18b has, for example, a plurality of fins, a plurality of pins, a concave-convex structure, or the like. With this configuration, the heat dissipation from the heat transfer member 18B can be improved by the heat dissipation portion 18b having a larger surface area, so that the heat generated by the operation of the component 12 can be more easily released to the outside of the optical device 10B.

[0052] Heat transfer member 18B is also thermally connected to a side surface of component 12 located at an end portion opposite to the Y direction via heat transfer member 19. With this configuration, for example, heat transfer member 18B is thermally connected to a plurality of surfaces of component 12, and therefore the amount of heat transferred from component 12 to heat transfer member 18B can be increased accordingly, so that heat generated by the operation of component 12 can be more easily released to the outside of optical device 10B.

[0053] [Fourth embodiment] FIG. 5 is a cross-sectional view of the optical device 10C of the fourth embodiment in a cross section intersecting with the X direction, and includes a side view of some components. As shown in FIG. 5, in the optical device 10C, the opening 11b1 is provided at the boundary between the end of the peripheral wall 11b in the Z direction and the top wall 11e as the lid of the case 11. In this case, the opening 11b1 can be formed between a notch provided at the end of the peripheral wall 11b in the Z direction and the top wall 11e. In this way, the opening 11b1 can be provided at the boundary between two members constituting the case 11. According to such a configuration, for example, since the notch can be formed in the formation of the end of the peripheral wall 11b, the advantage is obtained that the labor and cost of manufacturing the case 11 and the optical device 10C can be reduced compared to the case where the opening 11b1 is provided separately in the peripheral wall 11b.

[0054] Furthermore, the wiring board 15A may have a through conductor 15c that is electrically connected to the conductor wiring 15b and penetrates the wiring board 15A in the thickness direction. The through conductor 15c is an example of a conductor portion and may also be referred to as a conductor wiring. The wiring board 15A may have the through conductor 15c located in the accommodation chamber S. With a configuration having the through conductor 15c, for example, the conductor wiring 15b can be connected to other conductors or components 12 on the side opposite to the side on which the components 12 of the wiring board 15A are mounted, so that the components 12 and conductors can be laid out more efficiently in the accommodation chamber S.

[0055] [Fifth embodiment] FIG. 6 is a side view of the optical device 10D of the fifth embodiment as viewed in the Y direction, including a side view of the wiring board 15D. As shown in FIG. 6, in this embodiment, a claw-shaped protrusion 11f protruding toward the inside of the opening 11b1 is provided on the edge of the opening 11b1. The wiring board 15D is positioned in the Y direction by engaging with the protrusion 11f. The protrusion 11f may be engaged with the wiring board 15D in a state in which it bites into the inside of the wiring board 15D, or may be engaged in a state in which it abuts against a recess or a step (not shown) provided on the surface of the wiring board 15D. With this configuration, for example, the wiring board 15D can be more easily positioned and fixed to the case 11.

[0056] In this embodiment, a gap g is provided between the edge of the opening 11b1 and the wiring board 15D. If the accommodation chamber S does not need to be hermetically sealed, the gap g may be left as it is. As in the above embodiment, the gap g may be filled with a bonding material 16 (see FIGS. 1 to 5) or the like.

[0057] Furthermore, an external conductor 15b2 of the conductor wiring 15b surrounding the periphery of the insulating layer 15a is provided on the surface of the wiring board 15D at least in the portion penetrating the opening 11b1. The external conductor 15b2 may be a ground conductor electrically connected to a ground terminal (not shown) of the optical device 10D. Furthermore, an internal conductor 15b1 of the conductor wiring 15b is provided inside the insulating layer 15a. The internal conductor 15b1 is surrounded by the insulating layer 15a.

[0058] This configuration has the advantage that, for example, the insulating layer 15a can easily ensure the insulation of the internal conductor 15b1, and the external conductor 15b2 can enhance the noise resistance of the internal conductor 15b1. In addition, when both the external conductor 15b2 and the peripheral wall 11b are made of metal materials, a bonding material having a high affinity with both the external conductor 15b2 and the peripheral wall 11b, such as solder, can be used as the bonding material 16 that fills the gap g. In this case, for example, the bonding material 16 can be used to more easily or reliably fill the gap g.

[0059] [Sixth embodiment] 7 is a side view of the optical device 10E of the sixth embodiment as viewed in the Y direction, including a side view of the wiring board 15D. As shown in FIG. 7, in this embodiment, the wiring board 15D is press-fitted into the opening 11b1. This configuration provides the advantages of reducing the number of parts of the optical device 10E and reducing the manufacturing effort and cost, for example, by eliminating the need for the bonding material 16 and the protrusions 11f.

[0060] [Seventh embodiment] FIG. 8 is a side view of the optical device 10F of the seventh embodiment as viewed in the Y direction, including a side view of the wiring board 15F. As shown in FIG. 8, in this embodiment, the wiring board 15F has two wiring boards 15-1 and 15-2 joined to each other. Both wiring boards 15-1 and 15-2 have external conductors 15b2 on both sides in the thickness direction (Z direction) of the insulating layer 15a at least in the portion located in the opening 11b1. The wiring boards 15-1 and 15-2 are integrated by mechanically and electrically connecting the external conductors 15b2 adjacent to each other in the Z direction with a conductive bonding material 24. The bonding material 24 is made of a material that has a high affinity for the external conductors 15b2, such as solder. In addition, the edge of the opening 11b1 and the wiring board 15F are bonded via a bonding material 16. In this case, the bonding material 16 and the bonding material 24 may be made of the same material. The step of bonding wiring boards 15-1 and 15-2 may be performed in opening 11b1. This configuration has the advantage that, for example, airtight sealing between the edge of opening 11b1 and wiring board 15F can be more easily or more reliably performed via bonding materials 16 and 24.

[0061] [Eighth embodiment] 9 is an exploded cross-sectional view of the optical device 10G(10) of the eighth embodiment as viewed in the Y direction, including a side view of the wiring board 15, and shows the state before the subassembly 100G and the case 11 are assembled. The optical device 10G of this embodiment has the same components as the optical device 10 of the first embodiment.

[0062] In this embodiment, first, subassembly 100G is created by mounting component 12 on wiring board 15. At this time, component 12 is mounted, for example, by flip-chip mounting on wiring board 15. Subassembly 100G is configured to be attachable to peripheral wall 11b of case 11.

[0063] Next, as shown in FIG. 9, in the state of the subassembly 100G, the wiring board 15 is inserted into the opening 11b1 of the peripheral wall 11b of the case 11, and when a predetermined positional relationship is reached, the subassembly 100G is fixed to the case 11 by the bonding material 16, the heat transfer member 19, or the like. In the predetermined positional relationship, the component 12 is positioned on the opposite side of the peripheral wall 11b from the outer surface 11b2 of the case 11. As a result, the subassembly 100G is integrated with a part of the case 11, and then the part of the case 11 and the other part are assembled. According to this configuration, for example, the component 12 can be mounted on the wiring board 15 outside the case 11, so that the component 12 can be mounted more easily, more quickly, or more reliably than when the component 12 is mounted on the wiring board 15 inside the case 11. The peripheral wall 11b is an example of a wall of the case 11.

[0064] The subassembly 100G being configured to be attachable to the peripheral wall 11b of the case 11 means that with the wiring board 15 penetrating the opening 11b1 provided in the peripheral wall 11b, the wiring board 15, the component 12, and the case 11 (peripheral wall 11b) are configured to have a predetermined positional relationship in the optical device 10 (10G).

[0065] [Ninth embodiment] Fig. 10 is an exploded cross-sectional view of the optical device 10H of the ninth embodiment as seen in the Y direction, including a side view of the wiring board 15, and shows the state before the subassembly 100H and the case 11 are assembled. Fig. 11 is a cross-sectional view of the optical device 10H as seen in the Y direction, and shows the state after the subassembly 100H and the case 11 are assembled.

[0066] In this embodiment, the component 12 is mounted on the wiring board 15 first. At this time, the component 12 is mounted on the wiring board 15 by, for example, flip-chip mounting. Furthermore, when the wiring board 15 penetrates the opening 11b1 provided in the first portion 11b-1, which is a part of the peripheral wall 11b, and a predetermined positional relationship is established, the wiring board 15 and the first portion 11b-1 are integrated by the bonding material 16 or the like, thereby creating the subassembly 100H shown in FIG. 10. That is, the subassembly 100H of this embodiment includes a part of the wall of the case 11 in addition to the wiring board 15 and the component 12. In the predetermined positional relationship, the component 12 is positioned on the opposite side of the first portion 11b-1 to the outer surface 11b2 of the case 11. The first portion 11b-1 is an example of a first wall.

[0067] Next, as shown in FIGS. 10 and 11, in the state of the subassembly 100H, the first portion 11b-1 of the peripheral wall 11b and the second portion 11b-2 of the peripheral wall 11b are joined by welding or the like at the welded portion 11g, and the subassembly 100H and the portion of the case 11 other than the first portion 11b-1 are integrated. The first portion 11b-1 and the second portion 11b-2 are configured to be attachable to each other. In this embodiment, as an example, a fitting structure is provided by projections and recesses or the like at the boundary portion between the first portion 11b-1 and the second portion 11b-2. As a result, in the process of integrating the subassembly 100H and the portion of the case 11 other than the first portion 11b-1, a predetermined positional relationship between the first portion 11b-1 and the second portion 11b-2 can be obtained more easily, more quickly, or more reliably. This embodiment also has the advantage that the component 12 can be mounted on the wiring board 15 more easily, more quickly, or more reliably, as in the eighth embodiment. Note that the mountable configuration may be any configuration in which the first portion 11b-1 and the second portion 11b-2 are integrally connected to form the case 11, and a fitting structure is not essential.

[0068] [Tenth embodiment] FIG. 12 is an exploded perspective view of an optical device 10I according to a tenth embodiment. As shown in FIG. 12, in this embodiment, the subassembly 100I has a side wall that is a part of the peripheral wall 11b, and a wiring board 15I on which a component 12 (not shown in FIG. 12) is flip-chip mounted. The case 11 has a first divided body 11-1 having a bottom wall 11a and a peripheral wall 11b that is not included in the subassembly 100I, and a second divided body 11-2 including a top wall 11e as a lid. The peripheral wall 11b of the subassembly 100I is configured to be attachable to the bottom wall 11a, the peripheral wall 11b, and the top wall 11e included in the first divided body 11-1 or the second divided body 11-2. Here, the attachable configuration may be configured such that the walls are integrally connected to each other to form the case 11, and does not necessarily require a fitting structure or the like.

[0069] The optical device 10I is obtained by joining the subassembly 100I, the first divided body 11-1, and the second divided body 11-2. In this embodiment, a part of the peripheral wall 11b included in the subassembly 100I is an example of the first wall and the first portion, and the bottom wall 11a, the peripheral wall 11b, and the top wall 11e included in the first divided body 11-1 or the second divided body 11-2 are an example of the second portion.

[0070] In this embodiment, when assembling the subassembly 100I, the first divided body 11-1, and the second divided body 11-2, the edge 11h of the bottom wall 11a of the case 11, the edge 11h of the peripheral wall 11b, and the edge 11h of the top wall 11e of the case 11 are butted against each other, and thus the optical device 10I can be constructed by linearly welding the edges 11h of the bottom wall 11a, the peripheral wall 11b, and the top wall 11e of the case 11. Various welding methods such as roller seam welding and laser welding can be used for linear welding. With this configuration, for example, the component 12 can be mounted more easily or more reliably on the wiring board 15I, and the optical device 10I can be more easily produced.

[0071] Although the embodiment of the present invention has been illustrated above, the above embodiment is merely an example and is not intended to limit the scope of the invention. The above embodiment can be implemented in various other forms, and various omissions, substitutions, combinations, and modifications can be made without departing from the gist of the invention. In addition, the specifications of each configuration, shape, and the like (structure, type, direction, model, size, length, width, thickness, height, number, arrangement, position, material, etc.) can be appropriately changed and implemented.

[0072] For example, the first section may include multiple walls of the case and the second section may include multiple walls of the case. [Explanation of symbols]

[0073] 10,10A~10I…Optical device 11. Case 11-1...first split body 11-2…Second split field 11a...Bottom wall (second wall) 11b...Peripheral wall (first wall, wall) 11b1…Aperture 11b2…External surface 11b-1...First part (first wall, wall) 11b-2…Second part 11c…Port 11d…Port 11e...Top wall (lid) 11f…Protrusion 11g…Welded part 11h…Edge 12...Parts (first part, second part) 12a, 12b...surface 12c...electrode 13...External connection pin (external connection conductor) 14…Feedthrough 15, 15A, 15D, 15F, 15I...Wiring board 15-1, 15-2...Wiring board 15a…insulating layer 15b...Conductor wiring 15b1…Inner conductor 15b2...Outer conductor 15c...Through conductor 16...Joining material 17...Joining material 18, 18B…Heat transfer material 18a...side 18b...Heat radiation part 19...Heat transfer material 20…External board 20a…insulating layer 20b...Conductor wiring 21...Joining material 22...Support member 24...Joining material 100G~100I…Subassembly g…Gap S…Containment room X…direction Y...Direction Z…direction

Claims

1. Case and a wiring board which is a flexible board that penetrates the case and has an insulating portion and a conductor; at least one of a first component that is housed in the case and flip-chip mounted on the wiring board and performs at least one of outputting light, receiving light, and changing light characteristics, and a second component that electrically controls the first component; a support member that penetrates the case and supports the wiring board at a position where the support member penetrates the case; An optical device comprising:

2. A case having a first wall and a second wall intersecting the first wall; a wiring board that is a flexible board that penetrates the first wall and has an insulating portion and a conductor; at least one of a first component that is housed in the case and flip-chip mounted on the wiring board and performs at least one of outputting light, receiving light, and changing light characteristics, and a second component that electrically controls the first component; a first heat transfer member that penetrates the first wall, supports the wiring board at a position where the first wall penetrates, and is interposed between the component and the second wall and is thermally connected to the component and the second wall; An optical device comprising:

3. The optical device according to claim 2 , further comprising a second heat transfer member that is flexible, interposed between the component and the first heat transfer member, and thermally connected to the component and the first heat transfer member.

4. The wiring board passes through an opening provided in the case, 4. The optical device according to claim 1, further comprising a bonding material for bonding an edge of the opening to the wiring board.

5. The wiring board passes through an opening provided in the case, 5. The optical device according to claim 1, wherein the case has a protrusion that protrudes from an edge of the opening and engages with the wiring board.

6. 5. The optical device according to claim 1, wherein the wiring board passes through an opening provided in the case and is press-fitted into the opening.

7. The wiring board passes through an opening provided in the case, 7. The optical device according to claim 1, wherein a gap between the wiring board and an edge of the opening is hermetically sealed.

8. A subassembly including an optical device according to any one of claims 1 to 7, The wiring board; The part; having A subassembly of an optical device configured to be mountable to the case with the wiring board passing through an opening provided in a wall of the case and the component positioned on the opposite side of the wall from the outer surface of the case.

9. A subassembly including an optical device according to any one of claims 1 to 7, a first section that is a part of the case and includes a first wall; The wiring board; The part; having A subassembly of an optical device configured to be mountable to a second portion of the case that is different from the first portion.

10. A method for manufacturing an optical device according to any one of claims 1 to 7, comprising the steps of: creating a subassembly by mounting the components on the wiring board; a step of fixing the subassembly and the case in a state in which the wiring board passes through an opening provided in a wall of the case and the component is positioned on an opposite side of the wall from an outer surface of the case; A method for manufacturing an optical device comprising the steps of:

Images