Lead frame, semiconductor device, and method of manufacturing lead frame

Abstract

To suppress detachment of a die pad from a resin.SOLUTION: A lead frame has a first frame member having a die pad, a second frame member which is laminated on the first frame member and has a lead, and a resin which is made to fill a space around the die pad and the lead, wherein the die pad is composed of a projection part and an embedded part, the projection part projects from the resin, the embedded part is embedded in the resin and has a mounting surface of a semiconductor element and a side face continuous to the mounting surface, and the side face is covered with a resin and has a constriction recessed in a direction parallel to the mounting surface.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a lead frame, a semiconductor device, and a method for manufacturing a lead frame. [Background technology]

[0002] In recent years, semiconductor devices have been known in which a semiconductor element, such as an integrated circuit (IC) chip, is mounted on a metal lead frame. That is, the semiconductor element is mounted on a planar die pad provided in the center of the lead frame, and the semiconductor element is connected to a plurality of leads provided around the die pad by wire bonding, for example. The semiconductor element mounted on the lead frame is then sealed with a resin, such as an epoxy resin, to form a semiconductor device.

[0003] Some of these lead frames have a two-layer structure in which two frame members are laminated. That is, a lead frame having a two-layer structure is constructed by laminating a frame member having a die pad on a frame member having leads. The space around the die pad and the leads is filled with, for example, resin. In this way, the two frame members are reinforced by the resin, and the strength of the entire lead frame can be improved. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2017-130493 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, in a lead frame having a two-layer structure, there is a problem that the die pad may come off from the resin. That is, a portion equivalent to half of the thickness of the entire die pad is embedded in the resin, and a portion equivalent to the remaining half protrudes from the resin, so that the die pad comes into contact with the sealing resin only at the side of the portion embedded in the resin. However, the area of ​​the surface area of ​​the die pad that is occupied by the side of the portion embedded in the resin is small, and the adhesion between the die pad and the resin is not very high. For this reason, for example, when deformation such as warping occurs in the lead frame, the stress due to the deformation is applied to the boundary between the die pad and the resin, and the die pad may easily come off from the resin.

[0006] The disclosed technology has been made in consideration of the above, and aims to provide a lead frame, a semiconductor device, and a method for manufacturing a lead frame that can suppress detachment of a die pad from a resin. [Means for solving the problem]

[0007] In one aspect, the lead frame disclosed in the present application comprises a first frame member having a die pad, a second frame member laminated to the first frame member and having leads, and resin filling the space around the die pad and the leads, the die pad consisting of a protruding portion and an embedded portion, the protruding portion protruding from the resin and the embedded portion embedded in the resin, and having a mounting surface for a semiconductor element and a side surface continuous with the mounting surface, the side surface being covered by the resin and having a constriction concave in a direction parallel to the mounting surface. Effect of the Invention

[0008] According to one aspect of the lead frame disclosed in the present application, it is possible to suppress detachment of the die pad from the resin. [Brief description of the drawings]

[0009] [Figure 1]FIG. 1 is a diagram showing an example of the configuration of a lead frame according to the first embodiment. [Diagram 2] FIG. 2 is a flowchart showing an example of a method for manufacturing a lead frame according to the first embodiment. [Diagram 3] FIG. 3 is a diagram showing a specific example of the first frame member molding step. [Figure 4] FIG. 4 is a diagram showing a specific example of the second frame member molding step. [Diagram 5] FIG. 5 is a diagram showing a specific example of a frame member laminating step. [Figure 6] FIG. 6 is a diagram showing a specific example of a resin sealing step. [Figure 7] FIG. 7 is a diagram showing a specific example of an etching resist forming step. [Figure 8] FIG. 8 is a diagram showing a specific example of the etching process. [Figure 9] FIG. 9 is a diagram showing a specific example of an etching resist stripping step. [Figure 10] FIG. 10 is a diagram showing a specific example of an electrolytic plating process. [Figure 11] FIG. 11 is a diagram for explaining mounting of a semiconductor element. [Figure 12] FIG. 12 is a diagram illustrating wire bonding. [Figure 13] FIG. 13 is a diagram illustrating the mold. [Figure 14] FIG. 14 is a diagram illustrating an example of a configuration of a semiconductor device. [Figure 15] FIG. 15 is a cross-sectional view showing an example of the configuration of the lead frame according to the second embodiment. [Figure 16] FIG. 16 is a diagram showing a specific example of an etching resist forming step. [Figure 17] FIG. 17 is a diagram showing a specific example of the etching process. [Figure 18] FIG. 18 is a diagram illustrating wire bonding. [Figure 19]FIG. 19 is a diagram showing an example of a first frame member and a second frame member on which an etching resist is formed. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, embodiments of the lead frame, semiconductor device, and method for manufacturing the lead frame disclosed in the present application will be described in detail with reference to the drawings. Note that the disclosed technology is not limited to these embodiments.

[0011] (First embodiment) [Lead frame configuration] FIG. 1 is a diagram showing an example of the configuration of a lead frame 100 according to the first embodiment. In FIG. 1, a cross section of the lead frame 100 is shown typically. The lead frame 100 shown in FIG. 1 is manufactured as an assembly in which units surrounded by dashed lines are repeatedly arranged, for example, in the left-right and depth directions of FIG. 1. The units surrounded by dashed lines are units that are separated into individual semiconductor devices after semiconductor elements are mounted on the lead frame 100 and sealed with resin. In the following, the embodiment will be described using the units surrounded by dashed lines as an example of the lead frame 100. The number of units surrounded by dashed lines is not particularly limited.

[0012] In the following explanation, the surface of lead frame 100 on which the semiconductor element is mounted is assumed to be the upper surface (top surface); however, lead frame 100 may be manufactured and used, for example, upside down, or may be manufactured and used in any position.

[0013] The lead frame 100 has a two-layer structure in which a first frame member 110 and a second frame member 120 are laminated. Each element of the first frame member 110 and each element of the second frame member 120 are sealed with resin 130.

[0014] The first frame member 110 is a metal plate-like member on which a semiconductor element is mounted, and is a member that forms an external connection terminal that electrically connects the lead frame 100 to an external component. The material of the first frame member 110 may be, for example, copper or a copper alloy, or an iron-nickel alloy such as alloy 42. The thickness of the first frame member 110 may be, for example, about 0.1 to 0.3 mm.

[0015] The first frame member 110 has a die pad 111 and a plurality of terminals 112 .

[0016] The die pad 111 is a plate-like region formed in the center of the first frame member 110. The upper surface of the die pad 111 is a mounting surface on which a semiconductor element is mounted. Therefore, the upper surface of the die pad 111 is not covered with the resin 130. The die pad 111 has an embedded portion 111a whose side surface continuous with the upper surface (i.e., the mounting surface) is covered with the resin 130, and a protruding portion 111b protruding from the lower surface of the resin 130. The embedded portion 111a and the protruding portion 111b each have a thickness of about half the thickness of the entire die pad 111. A constriction 111c recessed in a direction parallel to the upper surface (i.e., the mounting surface) of the embedded portion 111a is formed on the side surface of the embedded portion 111a.

[0017] The terminals 112 are disposed around the die pad 111 and are used as external connection terminals that electrically connect the lead frame 100 to external components. The upper surface of the terminals 112 and the upper surface of the die pad 111 are located in the same plane, and the lower surface of the terminals 112 and the lower surface of the die pad 111 are located in the same plane. In other words, the thicknesses of the terminals 112 and the die pad 111 are equal. The terminals 112 have an embedded portion 112a located inside the resin 130 and a protruding portion 112b that protrudes from the lower surface of the resin 130. The embedded portion 112a and the protruding portion 112b each have a thickness of about half the thickness of the entire terminal 112. The side surface of the embedded portion 112a is covered with the resin 130. A constriction 112c that is recessed in a direction parallel to the upper surface of the embedded portion 112a is formed on the side surface of the embedded portion 112a.

[0018] The second frame member 120 is a metal plate-like member that grounds the semiconductor element mounted on the upper surface of the die pad 111, and is a member that forms a wiring pattern that connects the semiconductor element to the terminals 112 that are external connection terminals. The material of the second frame member 120 may be, for example, copper or a copper alloy, or an iron-nickel alloy such as alloy 42. The thickness of the second frame member 120 may be, for example, about 0.1 to 0.3 mm.

[0019] The second frame member 120 has a ground pad 121 , a plurality of leads 122 , and a plurality of wirings 123 .

[0020] The grounding pad 121 is a pad that electrically connects a semiconductor element to the die pad 111 and grounds the semiconductor element when the semiconductor element is mounted on the upper surface of the die pad 111. The grounding pad 121 is arranged along the periphery of the upper surface of the die pad 111, and has an opening 121a in the center that exposes the upper surface of the die pad 111. The lower end of the grounding pad 121 is located inside the resin 130, and the upper end of the grounding pad 121 protrudes from the upper surface of the resin 130. When a semiconductor element is mounted on the upper surface of the die pad 111, the semiconductor element is connected to the grounding pad 121 by wire bonding.

[0021] The leads 122 are terminals that electrically connect the semiconductor element to the terminals 112, which are external connection terminals, via the wiring 123 when a semiconductor element is mounted on the upper surface of the die pad 111. The leads 122 are arranged around the grounding pad 121. The lower ends of the leads 122 are located inside the resin 130, and the upper ends of the leads 122 protrude from the upper surface of the resin 130. The upper end face of the leads 122 is located in the same plane as the upper end face of the grounding pad 121, and the lower end face of the leads 122 is located in the same plane as the lower end face of the grounding pad 121. In other words, the thicknesses of the leads 122 and the grounding pad 121 are equal. When a semiconductor element is mounted on the upper surface of the die pad 111, the semiconductor element is connected to the leads 122 by wire bonding.

[0022] The wiring 123 is located inside the resin 130 with its upper surface exposed from the upper surface of the resin 130. The wiring 123 extends in a predetermined pattern inside the resin 130 and is appropriately connected to the lead 122 at its tip. The multiple wirings 123 correspond one-to-one to the multiple terminals 112 of the first frame member 110 and pass through positions overlapping the multiple terminals 112 in a planar view. An interlayer connection portion 123a is formed at a position of the wiring 123 overlapping the terminal 112 in a planar view. The interlayer connection portion 123a has a disk shape with a larger diameter than the width of other parts of the wiring 123, and electrically connects the wiring 123 to the terminal 112. That is, an opening 124 is formed in the center of the interlayer connection portion 123a, which penetrates to the upper surface of the terminal 112 (embedded portion 112a). Then, the upper surface of interlayer connection portion 123a, the inner wall surface of opening portion 124, and the upper surface of terminal 112 exposed from opening portion 124 are covered with plating layer 142 described below, whereby wiring 123 and terminal 112 are electrically connected via interlayer connection portion 123a and plating layer 142. As a result, wiring 123 and lead 122 form a wiring pattern that connects a semiconductor element mounted on the upper surface of die pad 111 to terminal 112, which is an external connection terminal.

[0023] The elements of the first frame member 110 and the elements of the second frame member 120 are sealed with resin 130. That is, the spaces around the die pad 111, the terminals 112, the grounding pad 121, the leads 122, and the wiring 123 are filled with resin 130. The material of the resin 130 may be, for example, an insulating resin such as a polyimide resin or an epoxy resin, or a resin material obtained by mixing a filler such as silica or alumina into such a resin.

[0024] A plating layer is formed on the surfaces of the first frame member 110 and the second frame member 120 that are exposed and not covered by the resin 130. For example, a plating layer 141 is formed on the lower surface of the protruding portion 111b of the die pad 111, the side surface of the protruding portion 111b, and the lower surface of the protruding portion 112b of the terminal 112 and the side surface of the protruding portion 112b. A plating layer 142 is formed on the upper end side surface of the grounding pad 121, the upper end surface of the grounding pad 121, the inner wall surface of the opening 121a, the upper surface of the die pad 111 exposed from the opening 121a, the upper end surface of the lead 122, the upper end side surface of the lead 122, and the upper surface of the wiring 123. The plating layer 142 formed on the upper surface of the wiring 123 covers the upper surface of the interlayer connection portion 123a, the inner wall surface of the opening 124, and the upper surface of the terminal 112 exposed from the opening 124.

[0025] Incidentally, in the lead frame 100 having a two-layer structure consisting of the first frame member 110 and the second frame member 120, there is a possibility that the die pad 111 will come off from the resin 130. That is, in the lead frame 100 having a two-layer structure, the embedded portion 111a corresponding to half of the entire thickness of the die pad 111 is embedded in the resin 130, and the protruding portion 111b corresponding to the remaining half protrudes from the resin 130. Therefore, the die pad 111 is in contact with the resin 130 only at the side surface of the embedded portion 111a, and the contact area with the resin 130 is not so large. As a result, there is a possibility that the die pad 111 will come off from the resin 130.

[0026] 1, in the lead frame 100 according to this embodiment, a constriction 111c is formed on the side surface of the embedded portion 111a of the die pad 111. A bottom 111cc of the constriction 111c is located inside the embedded portion 111a with respect to the periphery of the upper surface (i.e., the mounting surface) of the embedded portion 111a. The bottom 111cc of the constriction 111c refers to the portion where the depth of the constriction 111c is greatest.

[0027] By forming the constricted portion 111c on the side surface of the embedded portion 111a, the resin 130 is filled into the constricted portion 111c, and therefore, the adhesiveness between the die pad 111 and the resin 130 can be improved by an anchor effect. As a result, detachment of the die pad 111 from the resin 130 can be suppressed.

[0028] In addition, by positioning the bottom 111cc of the constriction 111c inside the embedded portion 111a relative to the periphery of the upper surface of the embedded portion 111a, the adhesion between the die pad 111 and the resin 130 can be further improved, thereby further reducing the possibility of the die pad 111 becoming detached.

[0029] In the lead frame 100 having a two-layer structure, the terminals 112 are in contact with the resin 130 only on the side surfaces of the embedded portions 112a, similar to the die pad 111, and the contact area with the resin 130 is not so large. In contrast, in the lead frame 100, as shown in FIG. 1, constrictions 112c are also formed on the side surfaces of the embedded portions 112a of the terminals 112. This makes it possible to improve the adhesion between the terminals 112 and the resin 130. As a result, it is possible to suppress detachment of the terminals 112 from the resin 130.

[0030] [Lead frame manufacturing method] Next, a method for manufacturing the lead frame 100 configured as above will be described by way of a specific example with reference to Fig. 2. Fig. 2 is a flow chart showing an example of the method for manufacturing the lead frame 100 according to the first embodiment.

[0031] First, the first frame member 110 and the second frame member 120 that form the framework of the lead frame 100 are formed (steps S101 and S102). The first frame member 110 and the second frame member 120 are each formed by etching a metal plate.

[0032] Specifically, as shown in Fig. 3, the first metal plate 310 is dissolved by half-etching from the upper surface of the first metal plate 310 so as to leave the pedestal 311 and the multiple protrusions 312 arranged around the pedestal 311. Fig. 3 is a diagram showing a specific example of the first frame member molding step. A first recess 310a is formed around the remaining pedestal 311 and the multiple protrusions 312. In other words, the first frame member 110 in which the pedestal 311 and the multiple protrusions 312 are partitioned by the first recess 310a is molded from the first metal plate 310.

[0033] An anisotropic etching solution is used for etching the first metal plate 310. That is, when the first frame member 110 is formed, the first metal plate 310 is anisotropically etched using an anisotropic etching solution, so that the dissolution of the pedestal 311 proceeds not only in the thickness direction of the first metal plate 310 but also in the surface direction. As a result, the first frame member 110 is formed with a pedestal 311 having a constriction 111c on the side surface that is recessed in a direction parallel to the upper surface. At this time, the pedestal 311 is formed so that the bottom 111cc of the constriction 111c is located more inwardly of the pedestal 311 than the periphery of the upper surface of the pedestal 311. In addition, as with the pedestal 311, the first metal plate 310 is anisotropically etched, so that the dissolution of the protrusion 312 proceeds not only in the thickness direction of the first metal plate 310 but also in the surface direction. As a result, the first frame member 110 is formed with a protrusion 312 having a constriction 112c on the side surface that is recessed in a direction parallel to the upper surface. At this time, the protrusion 312 is formed so that the bottom of the constriction 112c is located further inward of the protrusion 312 than the periphery of the upper surface of the protrusion 312.

[0034] 4, the second metal plate 320 is dissolved by half-etching from the lower surface of the second metal plate 320 so as to leave the base 321 and the multiple protrusions 322 and 323 arranged around the base 321. FIG. 4 is a diagram showing a specific example of the second frame member molding step. A second recess 320a is formed around the remaining base 321, the multiple protrusions 322, and the multiple protrusions 323. That is, the second frame member 120 in which the base 321, the multiple protrusions 322, and the multiple protrusions 323 are partitioned by the second recess 320a is formed from the second metal plate 320.

[0035] The protrusions 323 extend in a predetermined pattern along the surface direction of the second metal plate 320, and are appropriately connected to the protrusions 322 at their tips. An interlayer connection portion 123a is formed at a predetermined position in the extension direction of the protrusions 323. By half-etching the second metal plate 320, recesses that do not communicate with each other are formed on both end faces of the interlayer connection portion 123a. In addition, by half-etching from both sides of the second metal plate 320, an opening 121a is formed in the center of the base 321.

[0036] When the first frame member 110 and the second frame member 120 are formed by etching the metal plate, the second frame member 120 is laminated on the first frame member 110 (step S103). Specifically, the second frame member 120 is laminated on the first frame member 110 so that the base 321 is disposed along the periphery of the upper surface of the base 311 and the interlayer connection portion 123a of the protrusion 323 is in contact with the upper surface of the protrusion 312. As a result, an intermediate structure having a two-layer structure consisting of the first frame member 110 and the second frame member 120 is formed, for example, as shown in FIG. 5. At this time, a space is formed around the base 311, the protrusion 312, the base 321, the protrusion 322, and the protrusion 323 of the intermediate structure by the first recess 310a and the second recess 320a. In addition, the upper surface of the base 311 is exposed at the opening 121a of the base 321. FIG. 5 is a diagram showing a specific example of the frame member lamination process.

[0037] The intermediate structure is resin-sealed by, for example, transfer molding (step S104). That is, the intermediate structure is placed in a cavity of a mold, and uncured resin 130 is injected into the cavity of the mold, and then the resin 130 is heated and cured. As a resin-sealing method, in addition to the transfer molding method, for example, a compression molding method or an injection molding method may be used. By resin-sealing the intermediate structure, the resin 130 is filled into the spaces around the base 311, the protrusion 312, the base 321, the protrusion 322, and the protrusion 323, as shown in FIG. 6, for example. At this time, since a constriction 111c is formed on the side surface of the base 311, the resin 130 is filled up to the constriction 111c, and the adhesion between the base 311 and the resin 130 is improved. Furthermore, since the constrictions 112c are formed on the side surfaces of the projections 312, the resin 130 fills up to the constrictions 112c, improving the adhesion between the projections 312 and the resin 130. Fig. 6 is a diagram showing a specific example of the resin sealing step.

[0038] When the intermediate structure is resin-sealed, an etching resist is formed on each of the surfaces of the first frame member 110 and the second frame member 120 (step S105). Specifically, for example, as shown in FIG. 7, an etching resist 410 is formed on the lower surface side of the first frame member 110, and an etching resist 420 is formed on the upper surface side of the second frame member 120. FIG. 7 is a diagram showing a specific example of an etching resist forming step. The etching resists 410 and 420 are formed at positions that will remain as the die pad 111, the terminal 112, the grounding pad 121, and the lead 122. For example, the etching resist 410 is formed at the positions of the pedestal 311 and the protrusion 312 that will remain as the die pad 111 and the terminal 112, respectively. Also, for example, the etching resist 420 is formed at the positions of the pedestal 321 and the protrusion 322 that will remain as the grounding pad 121 and the lead 122, respectively. Furthermore, for example, the etching resist 420 is also formed on the inner wall surface of the opening 121a and the upper surface of the pedestal 311 exposed in the opening 121a. Note that, in predetermined portions of the etching resists 410 and 420 that do not overlap with the pedestal 311, the protrusion 312, the pedestal 321, and the protrusion 322, voids are formed in the etching resist.

[0039] The first frame member 110 and the second frame member 120 on which such etching resist is formed are immersed in an etching solution and etched (step S106). Specifically, by immersing the first frame member 110 and the second frame member 120 in an etching solution such as sulfuric acid-hydrogen peroxide or persulfate, predetermined portions not covered with the etching resist are dissolved and formed into the shape of the lead frame 100.

[0040] That is, for example, as shown in Fig. 8, a predetermined portion of the first frame member 110 that does not overlap with the pedestal 311 and the protrusion 312 is etched to form the die pad 111 and the terminal 112. Also, for example, the pedestal 321, the upper surface of the pedestal 311, and a predetermined portion of the second frame member 120 that does not overlap with the protrusion 322 are etched to form the grounding pad 121, the lead 122, and the wiring 123. Also, recesses formed on both end faces of the interlayer connection portion 123a of the wiring 123 are connected by etching from the upper surface side of the interlayer connection portion 123a, thereby forming an opening 124. Fig. 8 is a diagram showing a specific example of the etching process.

[0041] In this manner, the die pad 111 and the terminal 112 are formed in the first frame member 110 by etching, and at the same time, the ground pad 121, the lead 122, and the wiring 123 are formed in the second frame member 120. The die pad 111 is an embedded portion 111a whose side surface is covered with the resin 130, and has the embedded portion 111a having a constriction 111c on the side surface and a protruding portion 111b protruding from the resin 130. The terminal 112 is an embedded portion 112a located inside the resin 130, and has the embedded portion 112a having a constriction 112c on the side surface and the protruding portion 112b protruding from the lower surface of the resin 130. In the second frame member 120, an opening 124 is formed in the interlayer connection portion 123a by performing etching that communicates the recesses formed on both end surfaces of the interlayer connection portion 123a of the wiring 123.

[0042] When the etching is completed, the etching resists 410, 420 are stripped using, for example, an amine-based or non-amine-based stripping liquid (step S107), and a two-layered lead frame 100 consisting of a first frame member 110 and a second frame member 120 is obtained. That is, as shown in Fig. 9, for example, a two-layered lead frame 100 is obtained in which a first frame member 110 having a die pad 111 and a terminal 112 is laminated with a second frame member 120 having a ground pad 121, a lead 122, and a wiring 123. Fig. 9 is a diagram showing a specific example of the etching resist stripping step.

[0043] The molded lead frame 100 is subjected to electrolytic plating (step S108), completing the lead frame 100. Specifically, power is supplied to the lead frame 100 from the first frame member 110 side or the second frame member 120 side, so that a plating layer is formed on the metal portions of the first frame member 110 and the second frame member 120 that are not covered by the resin 130 and are exposed.

[0044] 10, for example, a plating layer 141 is formed on the lower surface of the protruding portion 111b of the die pad 111, the side surface of the protruding portion 111b, the lower surface of the protruding portion 112b of the terminal 112, and the side surface of the protruding portion 112b. A plating layer 142 is formed on the upper end side surface of the grounding pad 121, the upper end surface of the grounding pad 121, the inner wall surface of the opening 121a, the upper surface of the die pad 111 exposed from the opening 121a, the upper end surface of the lead 122, the upper end side surface of the lead 122, and the upper surface of the wiring 123. The plating layer 142 covers the upper surface of the interlayer connection portion 123a, the inner wall surface of the opening 124, and the upper surface of the terminal 112 exposed from the opening 124, and also covers the inner wall surface of the opening 121a and the upper surface of the embedded portion 111a exposed from the opening 121a. This allows the interlayer connection portion 123a to be joined to the terminal 112 and the ground pad 121 to be joined to the die pad 111 by the plating layer 142. As a result, the bonding strength between the interlayer connection portion 123a and the terminal 112 and the bonding strength between the ground pad 121 and the die pad 111 are improved, which further reduces the possibility that the die pad 111 and the terminal 112 will become detached from the resin 130. Figure 10 is a diagram showing a specific example of an electrolytic plating process.

[0045] Metals used for the plating layers 141 and 142 include, for example, Ni (nickel) / Ag (silver), Ni / Pd (palladium) / Au (gold), Sn (tin), Ag, etc. Here, Ni / Ag is a plating layer formed by laminating a Ni layer and an Ag layer in this order from the bottom side, and Ni / Pd / Au is a plating layer formed by laminating a Ni layer, a Pd layer, and an Au layer in this order from the bottom side. As a method for forming the plating layers 141 and 142, in addition to electrolytic plating, for example, a PPF (Pre Plated leadFrame) method or the like may be used.

[0046] The completed lead frame 100 has a constriction 111c on the side surface of the embedded portion 111a of the die pad 111. By forming the constriction 111c on the side surface of the embedded portion 111a, the resin 130 is filled into the constriction 111c, and the adhesion between the die pad 111 and the resin 130 can be improved by an anchor effect. As a result, detachment of the die pad 111 from the resin 130 can be suppressed.

[0047] [Process for manufacturing semiconductor device] Next, a process for manufacturing a semiconductor device by mounting a semiconductor element on the lead frame 100 will be described.

[0048] The semiconductor element is mounted on the die pad 111 of the lead frame 100. Specifically, the semiconductor element 510 is bonded by a bonding material such as solder or die attach paste to the upper surface of the die pad 111 exposed from the opening 121a of the ground pad 121, as shown in Fig. 11 for example. Fig. 11 is a diagram for explaining the mounting of the semiconductor element.

[0049] When the semiconductor element 510 is bonded to the upper surface of the die pad 111, the semiconductor element 510 and the ground pad 121 are connected by wire bonding, and the semiconductor element 510 and the lead 122 are connected by wire bonding, as shown in FIG. 12. That is, the ground electrode of the semiconductor element 510 is electrically connected to the plating layer 142 on the ground pad 121 by the wire 520, and the signal electrode of the semiconductor element 510 is electrically connected to the plating layer 142 on the lead 122 by the wire 530. At this time, since the semiconductor element 510 is mounted on the upper surface of the die pad 111 exposed from the opening 121a of the ground pad 121, the height of the upper surface of the semiconductor element 510 is almost equal to the height of the plating layer 142 on the ground pad 121 and the lead 122. As a result, the semiconductor device can be made thinner, and the length of the wires 520 and 530 can be shortened. FIG. 12 is a diagram for explaining wire bonding.

[0050] Then, molding is performed to seal the semiconductor element 510 mounted on the lead frame 100 with sealing resin. Specifically, the lead frame 100 on which the semiconductor element 510 is mounted is accommodated in a metal mold, and fluidized sealing resin is injected into the metal mold. The sealing resin is then heated to a predetermined temperature and hardened, so that, for example, as shown in Fig. 13, sealing resin 540 fills the space around the semiconductor element 510, sealing the semiconductor element 510 mounted on the lead frame 100. Fig. 13 is a diagram for explaining molding.

[0051] When the semiconductor element 510 mounted on the lead frame 100 is sealed with the sealing resin 540, the sealing resin 540 and the lead frame 100 are cut, for example, at the dashed line portion shown in Fig. 13. This separates the lead frame 100 into individual pieces, and a semiconductor device having the die pad 111, terminals 112, ground pads 121, leads 122, wiring 123, the semiconductor element 510, and the sealing resin 540 is completed, for example, as shown in Fig. 14. Fig. 14 is a diagram showing an example of the configuration of a semiconductor device.

[0052] As described above, the lead frame (e.g., lead frame 100) according to this embodiment has a first frame member (e.g., first frame member 110), a second frame member (e.g., second frame member 120), and a resin (e.g., resin 130). The first frame member has a die pad (e.g., die pad 111) having a mounting surface for a semiconductor element (e.g., semiconductor element 510). The second frame member has leads (e.g., leads 122). The resin is filled in the space around the die pad and the leads. The die pad has an embedded portion (e.g., embedded portion 111a) and a protruding portion (e.g., protruding portion 111b). The embedded portion is an embedded portion whose side surface continuing from the mounting surface is covered with resin, and has a constriction (e.g., constriction 111c) on the side surface that is recessed in a direction parallel to the mounting surface. The protruding portion protrudes from the resin. As a result, according to the lead frame according to this embodiment, detachment of the die pad from the resin can be suppressed.

[0053] In addition, the bottom of the constriction according to this embodiment (for example, bottom 111cc) is located inside the embedded portion from the periphery of the mounting surface, which makes it possible to further reduce the possibility of the die pad coming off with the lead frame according to this embodiment.

[0054] Second embodiment The second embodiment relates to a variation of the die pad 111 in the first embodiment.

[0055] Fig. 15 is a cross-sectional view showing an example of the configuration of a lead frame 100 according to the second embodiment. In Fig. 15, the same parts as in Fig. 1 are denoted by the same reference numerals. The die pad 111 shown in Fig. 15 has an extending portion 111d in addition to an embedded portion 111a and a protruding portion 111b.

[0056] The extension portion 111d is formed by extending the outer periphery of the protrusion 111b toward the terminal 112 along the surface (lower surface) of the resin 130. Specifically, the extension portion 111d extends to a position on the surface of the resin 130 corresponding to the lead 122.

[0057] The extension portion 111d reduces the possibility that the die pad 111 will be detached from the resin 130. That is, the formation of the extension portion 111d increases the contact area between the die pad 111 and the resin 130, improving the bonding strength between the die pad 111 and the resin 130. In addition, the extension portion 111d extends to a position on the surface of the resin 130 corresponding to the lead 122, improving the connection reliability between the lead 122 and the wire during wire bonding between the lead 122 and the semiconductor element mounted on the upper surface of the die pad 111.

[0058] Next, a method for manufacturing the lead frame 100 configured as above will be described with specific examples. Note that in the following, the description of the same steps as in the first embodiment will be simplified.

[0059] First, similarly to the first embodiment, the steps from the molding step (steps S101, S102) of the first frame member 110 and the second frame member 120 in FIG. 2 to the resin sealing step (step S104) are performed.

[0060] Then, when the intermediate structure is resin-sealed, an etching resist is formed on each of the surfaces of the first frame member 110 and the second frame member 120 (step S105). Specifically, for example, as shown in FIG. 16, an etching resist 410A is formed on the lower surface side of the first frame member 110, and an etching resist 420 is formed on the upper surface side of the second frame member 120. FIG. 16 is a diagram showing a specific example of an etching resist forming step. The etching resists 410A and 420 are formed at positions that will remain as the die pad 111, the terminal 112, the grounding pad 121, and the lead 122. For example, the etching resist 410A is formed at the positions of the pedestal 311 and the protrusion 312 that will remain as the die pad 111 and the terminal 112, respectively. The etching resist 410A is formed by extending to a position outside the outer periphery of the pedestal 311 that will remain as the extension portion 111d of the die pad 111. The etching resist 420 is formed in the same manner as the etching resist 420 in the first embodiment.

[0061] The first frame member 110 and the second frame member 120 on which such etching resist is formed are immersed in an etching solution and etched (step S106). Specifically, by immersing the first frame member 110 and the second frame member 120 in an etching solution such as sulfuric acid-hydrogen peroxide or persulfate, predetermined portions not covered with the etching resist are dissolved and formed into the shape of the lead frame 100.

[0062] That is, for example, as shown in Fig. 17, the base 311 of the first frame member 110, a region extending to a position outside the outer periphery of the base 311, and a predetermined portion not overlapping with the protrusion 312 are etched to form the die pad 111 and the terminal 112. Also, for example, the base 321 of the second frame member 120, the upper surface of the base 311, and a predetermined portion not overlapping with the protrusion 322 are etched to form the grounding pad 121, the lead 122, and the wiring 123. Also, the recesses formed on both end faces of the interlayer connection portion 123a of the wiring 123 are connected by etching from the upper surface side of the interlayer connection portion 123a, thereby forming an opening 124. Fig. 17 is a diagram showing a specific example of the etching process.

[0063] In the region extending to a position outside the outer periphery of the base 311, the metal portion of the first frame member 110 remains, forming the extension portion 111d. At this time, the extension portion 111d is formed so as to extend to a position on the surface of the resin 130 corresponding to the lead 122. The extension portion 111d improves the transmission efficiency of heat, ultrasonic waves, and load transmitted to the lead 122 for joining the wire when the semiconductor element mounted on the upper surface of the die pad 111 and the lead 122 are connected by wire bonding. That is, by forming the extension portion 111d, heat from a heater that heats the lead 122 from below the lead 122 is efficiently transmitted to the lead 122 via the extension portion 111d. In addition, by forming the extension portion 111d, the lead 122 is supported from below by the extension portion 111d, and ultrasonic waves and load from a wire bonder that presses the wire against the lead 122 from above the lead 122 are efficiently transmitted to the wire. Wire bonding between the semiconductor element and the leads 122 will be described later.

[0064] When the etching is completed, similarly to the first embodiment, each step from the etching resist stripping step (step S107) to the electrolytic plating step (step S108) in FIG. 2 is performed, and the lead frame 100 is completed.

[0065] Here, wire bonding will be described with reference to FIG. 18. FIG. 18 is a diagram for explaining wire bonding. When a semiconductor element 510 is bonded to the upper surface of a die pad 111 in a process of manufacturing a semiconductor device, the semiconductor element 510 and the grounding pad 121 are connected by wire bonding, and the semiconductor element 510 and the lead 122 are connected by wire bonding, as shown in FIG. 18, for example. That is, the grounding electrode of the semiconductor element 510 is electrically connected to the plating layer 142 on the grounding pad 121 by the wire 520. Also, the signal electrode of the semiconductor element 510 is electrically connected to the plating layer 142 on the lead 122 by the wire 530. At this time, since the extension portion 111d is located at a position corresponding to the lead 122 on the surface of the resin 130, heat from the heater 610 that heats the lead 122 to bond the wire 530 is efficiently transferred to the lead 122. Furthermore, since the lead 122 is supported from below by the extending portion 111d, ultrasonic waves and a load from the wire bonder 620 that presses the wire 530 against the lead 122 are efficiently transmitted to the wire 530. As a result, the wire 530 can be reliably bonded to the plating layer 142 on the lead 122, thereby improving the connection reliability between the lead 122 and the wire 530.

[0066] As described above, the die pad of the lead frame according to this embodiment has an extension portion (e.g., extension portion 111d) that is formed on the outer periphery of the protruding portion (e.g., protruding portion 111b) and extends outward from the protruding portion along the surface of the resin (e.g., resin 130). As a result, according to the lead frame 100 according to this embodiment, the bonding strength between the die pad and the sealing resin can be improved.

[0067] Moreover, the extension portion according to this embodiment extends to a position on the surface of the resin corresponding to the lead (e.g., lead 122). As a result, according to the lead frame 100 according to this embodiment, when the semiconductor element and the lead are connected by wire bonding, the connection reliability between the lead and the wire can be improved.

[0068] (others) In the above embodiment, an example was shown in which the first frame member 110 and the second frame member 120 on which the etching resist is formed are immersed in an etching solution to dissolve the etching target portion that is not covered by the etching resist (etching step, see FIG. 8 and FIG. 17). At this time, if the thickness of the etching target portion of the first frame member 110 is smaller than the thickness of the etching target portion of the second frame member 120, the etching target portion of the first frame member 110 is excessively dissolved and the side surface of the embedded portion 111a is eroded. As a result, the shape of the constriction 111c on the side surface of the embedded portion 111a may be damaged. Therefore, from the viewpoint of maintaining the shape of the constriction 111c, it is preferable to make the thickness of the etching target portion A of the first frame member 110 and the thickness of the etching target portion B of the second frame member 120 approximately the same as each other, as shown in FIG. 19. FIG. 19 is a diagram showing an example of the first frame member 110 and the second frame member 120 on which the etching resist is formed. [Explanation of symbols]

[0069] 100 Leadframe 110 First frame member 111 Die pad 111a Embedded part 111b Protrusion 111c Confinement 111cc bottom 111d Extension part 120 Second frame member 122 Leads 130 Resin 510 Semiconductor Devices 540 Sealing resin

Claims

1. a first frame member having a die pad; a second frame member laminated to the first frame member and having a lead; a resin that fills a space around the die pad and the leads; the die pad comprises a protruding portion and a buried portion, the protruding portion protrudes from the resin, the embedded portion is embedded in the resin and has a mounting surface for a semiconductor element and a side surface continuous with the mounting surface, the side surface is covered with the resin and has a constriction that is recessed in a direction parallel to the mounting surface, The bottom of the constriction is Located inside the embedded portion from the periphery of the mounting surface A lead frame comprising:

2. The die pad is 2. The lead frame according to claim 1, further comprising an extension portion formed on the outer periphery of the protruding portion and extending outward from the protruding portion along the surface of the resin.

3. The extension portion is 3. The lead frame according to claim 2, wherein the resin surface extends to a position corresponding to the lead.

4. A lead frame; A semiconductor element mounted on the lead frame; and a sealing resin that seals the semiconductor element. The lead frame is a first frame member having a die pad; a second frame member laminated to the first frame member and having a lead; a resin that fills a space around the die pad and the leads; the die pad comprises a protruding portion and a buried portion, the protruding portion protrudes from the resin, the embedded portion is embedded in the resin and has a mounting surface for the semiconductor element and a side surface continuous with the mounting surface, the side surface is covered with the resin and has a constriction that is recessed in a direction parallel to the mounting surface, The bottom of the constriction is Located inside the embedded portion from the periphery of the mounting surface A semiconductor device comprising:

5. a step of forming a first frame member from a first metal plate, the first frame member having a base having a mounting surface for a semiconductor element defined by a first recess; forming a second frame member from a second metal plate, the second frame member having a plurality of first projections defined by second recesses; laminating the second frame member to the first frame member; filling a space formed by the first recess and the second recess around the base and the plurality of first projections with a sealing resin; and forming a die pad on the first frame member and a lead on the second frame member by etching at least predetermined portions of the first frame member and the second frame member that do not overlap with the base and the first projections, The step of forming the first frame member includes: the first metal plate is subjected to anisotropic etching to form the base in the first frame member, the base having a constriction on a side surface continuous with the mounting surface and recessed in a direction parallel to the mounting surface; The etching step includes: A method for manufacturing a lead frame, characterized in that the die pad is formed having an embedded portion whose side is covered by the sealing resin, the embedded portion having the constriction on the side, and a protruding portion that protrudes from the sealing resin.

6. The etching step includes: The method for manufacturing a lead frame according to claim 5, further comprising forming the die pad having the embedded portion, the protruding portion, and an extension portion extending from the outer periphery of the protruding portion along the surface of the sealing resin outwardly of the protruding portion.

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