Rubber resin material and metal substrate

Abstract

To provide a rubber resin material and a metal substrate.SOLUTION: A rubber resin material contains a resin composition, and an inorganic filler dispersed in the resin composition. The resin composition contains 10-50 wt.% of liquid rubber, 20-60 wt.% of a polyphenylene ether resin, and 5-60 wt.% of a cyanate resin. The polyphenylene ether resin contains polyphenylene ether having a bismaleimide group at a molecular terminal, polyphenylene ether having a methacrylate group at a molecular terminal, and polyphenylene ether having a styrene group at a molecular terminal or a combination thereof. The cyanate resin contains a bisphenol M type cyanate resin.SELECTED DRAWING: None

Description

[Technical field]

[0001] The present invention relates to a rubber resin material and a metal substrate, and more particularly to a low dielectric rubber resin material and a metal substrate. [Background technology]

[0002] 5th generation mobile communication system (5 th With the development of 5G (Fast Generation Wireless System), high frequency transmission has become the current mainstream of development in order to meet the 5G wireless communication standard. In the current high frequency transmission technology, reducing the signal loss in the transmission path is an important goal.

[0003] In order to reduce dielectric loss, antennas and radio frequency front-end (RFFE) circuits are integrated into the transceiver module using antenna-in-package (AIP) technology, which reduces the distance between the antenna and the amplifier or other circuit systems, thereby reducing dielectric loss and the product volume.

[0004] In antenna mounting technology, the development of rubber resin materials suitable for high-frequency transmission is progressing. To be applied to high-frequency transmission, resin materials usually have low relative dielectric constant (Dk) and low dielectric dissipation factor (Df). In this specification, the relative dielectric constant and dielectric dissipation factor of a resin material are collectively referred to as the dielectric properties.

[0005] Currently available rubber resin materials add a certain ratio of liquid rubber to reduce the dielectric properties of the resin material, but the amount of liquid rubber added should not be too high, as too much liquid rubber will lower the glass transition temperature (Tg) of the resin material and reduce the peel strength between the resin material and the metal layer.

[0006] Therefore, it is an important task for this project to overcome the above-mentioned shortcomings by simultaneously achieving the flame retardancy, peel strength, and dielectric properties of the rubber resin material through improvement of the components. Summary of the Invention [Problem to be solved by the invention]

[0007] The technical problem to be solved by the present invention is to provide a rubber-resin material and a metal substrate in response to the shortcomings of the prior art. [Means for solving the problem]

[0008] In order to solve the above technical problems, one technical means adopted by the present invention is to provide a rubber resin material. The rubber resin material includes a resin composition and an inorganic filler dispersed in the resin composition. The resin composition includes 10% by weight to 50% by weight of liquid rubber, 20% by weight to 60% by weight of polyphenylene ether resin, and 5% by weight to 60% by weight of cyanate resin. The polyphenylene ether resin includes polyphenylene ether having a bismaleimide group at the molecular end, polyphenylene ether having a methacrylate group at the molecular end, polyphenylene ether having a styrene group at the molecular end, or a combination thereof. The cyanate resin includes a bisphenol M type cyanate resin.

[0009] In one embodiment of the present invention, the resin composition does not include a bismaleimide resin.

[0010] In one embodiment of the present invention, the weight average molecular weight of the cyanate resin is 100 g / mol to 3000 g / mol.

[0011] In one embodiment of the present invention, the number average molecular weight of the polyphenylene ether resin is 1500 g / mol to 5000 g / mol.

[0012] In one embodiment of the invention, the polyphenylene ether resin has a hydroxyl number of less than 0.5 mg KOH / g.

[0013] In one embodiment of the present invention, the molecular weight of the liquid rubber is from 3500 g / mol to 4200 g / mol.

[0014] In one embodiment of the present invention, monomers for synthesizing the liquid rubber include butadiene monomers, and the liquid rubber includes 60% by weight to 80% by weight of vinyl groups, with the total weight of the liquid rubber being 100% by weight.

[0015] In one embodiment of the invention, the liquid rubber is a polybutadiene homopolymer.

[0016] In one embodiment of the present invention, the viscosity of the liquid rubber at 25° C. is 35,000 cps to 43,000 cps.

[0017] In one embodiment of the present invention, the amount of the inorganic filler added is 50 parts by weight to 180 parts by weight based on 100 parts by weight of the resin composition.

[0018] In one embodiment of the present invention, the inorganic filler contains at least one of a methacrylate group and a vinyl group by being subjected to a surface treatment.

[0019] In one embodiment of the present invention, the rubber resin material contains 0.5 to 5 parts by weight of a peroxide based on 100 parts by weight of a resin composition.

[0020] Another technical means adopted by the present invention to solve the above technical problems is to provide a metal substrate. The metal substrate includes a base layer made of a rubber resin material and a metal layer provided on the base layer. The rubber resin material includes a resin composition and an inorganic filler dispersed in the resin composition. The resin composition includes 10% to 50% by weight of liquid rubber, 20% to 60% by weight of polyphenylene ether resin, and 5% to 60% by weight of cyanate resin. The polyphenylene ether resin includes polyphenylene ether having a bismaleimide group at the molecular end, polyphenylene ether having a methacrylate group at the molecular end, polyphenylene ether having a styrene group at the molecular end, or a combination thereof. The cyanate resin includes a bisphenol M type cyanate resin.

[0021] In one embodiment of the present invention, the dielectric tangent of the rubber resin material at 10 GHz is less than 0.0035.

[0022] In one embodiment of the present invention, the rubber resin material has a relative dielectric constant of 3.0 to 3.5 at 10 GHz.

[0023] In one embodiment of the present invention, the peel strength of the metal substrate is 4.0 lb / in to 7.5 lb / in.

[0024] In one embodiment of the present invention, the peel strength of the metal substrate is 4.0 lb / in to 7.5 lb / in.

[0025] In one embodiment of the present invention, the thermal expansion coefficient of the metal substrate is 20 ppm / °C·K to 40 ppm / °C·K. Effect of the Invention

[0026] As an advantageous effect of the present invention, the rubber resin material and metal substrate according to the present invention improve the heat resistance and dielectric properties of the rubber resin material and reduce the thermal expansion coefficient of the rubber resin material due to the technical features that "the resin composition contains liquid rubber, polyphenylene ether resin, and cyanate" and "the cyanate resin contains bisphenol M-type cyanate resin". DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0027] In order to better understand the features and technical contents of the present invention, please refer to the following detailed description of the present invention, which is not intended to limit the scope of the present invention.

[0028] Hereinafter, the embodiment of the "rubber resin material and metal substrate" according to the present invention will be described by way of a specific embodiment, and a person skilled in the art can understand the advantages and effects of the present invention based on the contents disclosed in this specification. The present invention can be implemented or applied by other different specific embodiments, and various modifications and changes can be made to each detail in this specification based on different perspectives and applications without departing from the concept of the present invention. The technical contents according to the present invention will be described in more detail based on the following embodiments, but the disclosure does not limit the scope of protection of the present invention. In addition, the term "or" used in this specification may include any one or more combinations of the related items listed according to the actual situation.

[0029] [Rubber resin materials] In the present invention, the use of a specific polyphenylene ether resin can solve the problems of poor heat resistance and peel strength caused by the inclusion of a large amount of liquid rubber in the conventional method. In addition, even after the addition of the polyphenylene ether resin, the problem of poor dielectric properties (high relative dielectric constant and high dielectric tangent) of the rubber resin material does not occur. In addition, in the present invention, the addition of a specific cyanate resin can reduce the coefficient of thermal expansion (CTE) of the rubber resin material. Thus, the rubber resin material according to the present invention has good heat resistance, peel strength, and dielectric properties, as well as a low coefficient of thermal expansion.

[0030] Specifically, the rubber resin material according to the present invention includes a resin composition and an inorganic filler that is uniformly dispersed in the resin composition. The properties of the resin composition and the inorganic filler are described in detail below.

[0031] [Resin composition] The resin composition according to the present invention contains 10% by weight to 50% by weight of liquid rubber, 20% by weight to 60% by weight of polyphenylene ether resin, and 5% by weight to 60% by weight of cyanate resin.

[0032] The rubber resin material according to the present invention, which is a resin composition having the above-mentioned specific components and contents, is used to manufacture a metal substrate having good heat resistance and dielectric properties and a low thermal expansion coefficient, and the metal substrate is applied in the field of high frequency transmission. The resin material according to the present invention also has good adhesion to a metal layer. Measurement of the properties of the rubber resin material and the metal substrate according to the present invention will be described later.

[0033] The rubber resin material of the present invention includes a liquid rubber, which has a feature of high solubility, thereby improving the compatibility between the components, and also has a reactive functional group, thereby improving the degree of crosslinking after the resin material is cured.

[0034] The molecular weight of the liquid rubber according to the present invention is 2000 g / mol to 6000 g / mol, which improves the fluidity of the resin composition and further improves the filling property of the rubber resin material. Preferably, the molecular weight of the liquid rubber is 3500 g / mol to 4200 g / mol. For example, the molecular weight of the liquid rubber may be 3600 g / mol, 3700 g / mol, 3800 g / mol, 3900 g / mol, 4000 g / mol, or 4100 g / mol. The viscosity of the liquid rubber at 25°C is 35000 cps to 43000 cps.

[0035] The content of the liquid rubber in the resin composition is preferably 15% by weight to 45% by weight. For example, the content of the liquid rubber in the resin composition may be 20% by weight, 25% by weight, 30% by weight, 35% by weight, or 40% by weight.

[0036] In one embodiment, the liquid rubber comprises a liquid diene-based rubber. Preferably, the liquid diene-based rubber has a high proportion of side chains containing vinyl groups, particularly a liquid diene-based rubber containing a high proportion of 1,2-vinyl side chains.

[0037] When the liquid rubber has an unsaturated side chain (or vinyl group) containing at least one vinyl group, the crosslink density and heat resistance of the crosslinked resin composition are improved. Specifically, the material for synthesizing the liquid rubber includes a butadiene monomer. The liquid rubber may be synthesized only with a butadiene monomer, or may be synthesized with a butadiene monomer and other monomers. In simple terms, the liquid rubber may be a butadiene homopolymer or a butadiene copolymer, and is preferably a butadiene homopolymer.

[0038] When the material for synthesizing the liquid rubber contains a butadiene monomer, the liquid rubber contains 60% by weight to 80% by weight of vinyl groups, with the total weight of the liquid rubber being 100% by weight.

[0039] In one preferred embodiment, the liquid rubber is a polybutadiene homopolymer, i.e. the monomers for synthesizing the liquid rubber include only butadiene, without any other monomers (e.g. styrene monomers).

[0040] Preferably, the content of polyphenylene ether in the resin composition may be 25% by weight to 55% by weight, for example, the content of polyphenylene ether resin in the resin composition is 30% by weight, 35% by weight, 40% by weight, 45% by weight, or 50% by weight.

[0041] The polyphenylene ether resin can improve the dielectric properties and the glass transition temperature of the rubber resin material, and can also reduce the thermal expansion coefficient of the rubber resin material.

[0042] In one embodiment, the number average molecular weight of the polyphenylene ether resin is 1500 g / mol to 5000 g / mol, preferably 1500 g / mol to 4500 g / mol, and more preferably 1500 g / mol to 3500 g / mol.

[0043] In one embodiment, the polyphenylene ether resin includes a first polyphenylene ether having a bismaleimide group at a molecular terminal, a second polyphenylene ether having a methacrylate group at a molecular terminal, a third polyphenylene ether having a styrene group at a molecular terminal, or a combination thereof.

[0044] In one preferred embodiment, the average number of the first polyphenylene ether is 1 to 2, and the hydroxyl value of the first polyphenylene ether is less than 0.5 mgKOH / g. The bismaleimide group in the first polyphenylene ether provides an unsaturated bond, which favors the progress of the crosslinking reaction and improves the peel strength of the rubber resin material. Thus, the addition of the first polyphenylene ether improves the dielectric properties, glass transition temperature, peel strength, and thermal expansion coefficient of the rubber resin material.

[0045] Furthermore, by adding the first polyphenylene ether, the amount of liquid rubber added can be reduced. For example, when the resin composition contains 20% by weight to 40% by weight of the first polyphenylene ether, the amount of liquid rubber added can be reduced to 10% by weight to 30% by weight, which makes it possible to avoid a decrease in the glass transition temperature of the rubber resin material or a decrease in the peel strength between the rubber resin material and the metal layer.

[0046] It should be noted that the first polyphenylene ether of the present invention is used as a substitute for bismaleimide resin in conventional rubber resin materials. That is, the rubber resin material of the present invention does not need to contain bismaleimide resin. In this way, the rubber resin material of the present invention contains fewer types of components, the compatibility of the entire rubber resin material is relatively improved, and the amount of liquid rubber added can be appropriately reduced.

[0047] The second polyphenylene ether and the third polyphenylene ether of the present invention can improve the dielectric properties of a rubber resin material, in particular, can reduce the dielectric tangent of the rubber resin material. Therefore, by mixing the first polyphenylene ether, the second polyphenylene ether and the third polyphenylene ether, it is possible to control the properties of the rubber resin material.

[0048] The cyanate resin of the present invention has a cyanate group at the molecular end, and the addition of the cyanate resin can improve the degree of crosslinking between the liquid rubber and the polyphenylene ether resin. In addition, the addition of the cyanate resin can reduce the thermal expansion coefficient of the rubber-resin material and improve the thermal stability of the metal substrate.

[0049] The content of the cyanate resin in the resin composition is preferably 10% by weight to 55% by weight. For example, the content of the cyanate resin in the resin composition may be 15% by weight, 20% by weight, 25% by weight, 30% by weight, 35% by weight, 40% by weight, 45% by weight, or 50% by weight.

[0050] In the present invention, the cyanate resin includes a cyanate resin whose main chain structure is formed with bisphenol M, that is, the cyanate resin includes a bisphenol M type cyanate resin.

[0051] The cyanate resin has a cyanate group at the molecular end of the main chain structure, and the average number of cyanate groups in the cyanate resin is 1 to 2. In one embodiment, the weight average molecular weight of the cyanate resin is 100 g / mol to 70,000 g / mol, preferably 100 g / mol to 5,000 g / mol, more preferably 100 g / mol to 3,000 g / mol, and even more preferably 100 g / mol to 1,000 g / mol. The viscosity of the cyanate resin at 25°C is 425 mPa·s to 475 mPa·s. When the weight average molecular weight and viscosity of the cyanate resin are within the above ranges, the crosslinkability of the resin composition is effectively improved, and the viscosity and processability of the resin composition are not adversely affected, which is advantageous for the subsequent application of the thermosetting resin material.

[0052] In one exemplary embodiment, the cyanate resin may further include one or more cyanate compounds, the cyanate compounds having two or more cyanate groups.

[0053] [Inorganic filler] The addition of inorganic fillers can reduce the viscosity of the rubber resin material and the relative dielectric constant of the rubber resin material. Some types of inorganic fillers can improve the thermal conductivity of the rubber resin material, but the above description is a general description and the present invention is not limited thereto.

[0054] In the present invention, the inorganic filler may be silicon dioxide, strontium titanate, calcium titanate, titanium dioxide, aluminum oxide, or a combination thereof, but the present invention is not limited thereto.In one preferred embodiment, the inorganic filler simultaneously comprises silicon dioxide, aluminum oxide, and titanium dioxide, and the titanium dioxide may be replaced with strontium titanate, calcium titanate, or a combination thereof.The silicon dioxide may be fused silica or crystalline silica.Preferably, the silicon dioxide is fused silica.

[0055] In one preferred embodiment, the inorganic filler is surface-treated to include at least one of a methacrylate group and a vinyl group on the surface of the inorganic filler, which allows the inorganic filler to react with the liquid rubber, so that the rubber-resin composition has good compatibility and does not adversely affect the heat resistance of the metal substrate.

[0056] It is worth noting that the inorganic filler may be a mixture of a single component or a plurality of components. In addition, all inorganic fillers may be surface-treated to contain at least one of a methacrylate group and a vinyl group, or some inorganic fillers may be surface-treated to contain at least one of a methacrylate group and a vinyl group. For example, when the inorganic filler includes silicon dioxide and aluminum oxide, in one embodiment, the silicon dioxide is surface-treated to contain at least one of a methacrylate group and a vinyl group, but the aluminum oxide is not surface-treated. However, the above example is merely one embodiment, and the present invention is not limited thereto.

[0057] The inorganic filler has a spherical appearance. The average particle diameter of the inorganic filler (D 50 ) is 0.3 μm to 3 μm, and the maximum particle diameter of the inorganic filler (D 99) is less than 10 μm, which is advantageous for uniformly dispersing the inorganic filler in the rubber resin composition. In one embodiment, the purity of the inorganic filler is 99.8% or more.

[0058] The amount of inorganic filler added can be adjusted according to the product specifications. In one embodiment, the amount of inorganic filler added is 50 parts by weight to 180 parts by weight, preferably 60 parts by weight to 160 parts by weight, and more preferably 70 parts by weight to 150 parts by weight, relative to 100 parts by weight of the resin composition. However, the above example is merely one embodiment, and the present invention is not limited thereto.

[0059] [Siloxane coupling agents] The rubber resin material may further include a siloxane coupling agent. The addition of the siloxane coupling agent can improve the reactivity and compatibility between the fiber cloth, the resin composition and the inorganic filler, and can improve the peel strength and heat resistance of the metal substrate.

[0060] In one preferred embodiment, the siloxane coupling agent contains at least one of a methacrylate group and a vinyl group, and the molecular weight of the siloxane coupling agent is 100 g / mol to 500 g / mol, preferably 110 g / mol to 250 g / mol, and more preferably 120 g / mol to 200 g / mol.

[0061] The content of the siloxane coupling agent is 0.1 to 5 parts by weight, and preferably 0.5 to 3 parts by weight, based on 100 parts by weight of the total weight of the resin composition.

[0062] [Peroxide] The rubber resin material may further contain a peroxide. The peroxide is used as a radical initiator, and is preferably an olefin crosslinking initiator. The content of the peroxide is 0.5 to 5 parts by weight, based on 100 parts by weight of the total weight of the resin composition. Examples of peroxides include tert-butylcumyl peroxide, dicumyl peroxide (DCP), benzoyl peroxide (BPO), 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexane, 2,5-dimethyl-2,5-di(tert-butylperoxy)hexyne, 1,1-bis(tert-butyldioxy)-3,3,5-trimethylcyclohexane, di(tert-butylperoxyisopropyl)benzene, and combinations thereof.

[0063] [catalyst] The rubber resin material may further contain a catalyst. The catalyst plays a role of accelerating the hardening of the rubber resin material to form a high-frequency substrate. The content of the catalyst is 0.25 to 1.5 parts by weight, where the total weight of the resin composition is 100 parts by weight.

[0064] For example, the catalyst may be an imidazole-based compound, such as triphenylimidazole, 2-ethyl-4-methylimidazole (2E4MZ), 1-benzyl-2-phenylimidazole (1B2PZ), 1-cyanoethyl-2-phenylimidazole (2PZ-CN), and 2,3-dihydro-1H-pyrrole[1,2-a]benzimidazole (TBZ), but the present invention is not limited thereto.

[0065] [Flame retardant] The rubber resin material may further include a flame retardant. The addition of the flame retardant can improve the flame retardancy of the high frequency substrate. For example, the flame retardant may be a phosphorus-based flame retardant or a bromine-based flame retardant. Preferably, the flame retardant is a halogen-free flame retardant, i.e., does not contain bromine.

[0066] The brominated flame retardant may be ethylene bis(tetrabromophthalimide), tetradecabromodiphenoxy benzene, decabromo diphenoxy oxide, or a combination thereof, but the present invention is not limited thereto.

[0067] The phosphorus-based flame retardant may be a sulphosuccinic acid ester, a phosphazene, an ammonium polyphosphate, a melamine polyphosphate, or a melamine cyanurate. Examples of the phosphorus-based flame retardant include triphenyl phosphate (TPP), tetraphenyl resorcinol bis(diphenylphosphate), RDP, bisphenol A bis(diphenyl phosphate), BPAPP, bisphenol A bis(dimethyl)phosphate (BBC), resorcinol diphosphate, and resorcinol bis(2,6-dimethylphenyl phosphate), but the present invention is not limited thereto.

[0068] The amount of the flame retardant added can be adjusted according to the product specifications. In one embodiment, the amount of the flame retardant added is 0.1 to 5 parts by weight based on 100 parts by weight of the rubber resin composition.

[0069] [Measurement of characteristics] In order to prove that the rubber resin material according to the present invention can be applied to high frequency transmission, in the present invention, 10% by weight to 50% by weight of liquid rubber, 20% by weight to 60% by weight of polyphenylene ether resin, and 5% by weight to 60% by weight of cyanate resin are mixed to form a resin composition, and an inorganic filler is blended into the resin composition to produce the rubber resin materials according to Examples 1 to 3 and Comparative Examples 1 to 6. The component ratios of the rubber resin materials according to Examples 1 to 3 and Comparative Examples 1 to 6 are as shown in Table 1. The glass transition temperatures, relative dielectric constants, and dielectric loss tangents of the rubber resin materials according to Examples 1 to 3 and Comparative Examples 1 to 6 are as shown in Table 2.

[0070] Next, the glass fiber cloth was immersed in the rubber resin material according to Examples 1 to 3 and Comparative Examples 1 to 6, and the steps of impregnation, drying and molding were carried out to obtain prepregs. The prepregs were then processed, and a metal layer was provided on the prepregs to produce the metal substrates according to Examples 1 to 3 and Comparative Examples 1 to 6. The peel strength and heat resistance of the metal substrates in Examples 1 to 3 and Comparative Examples 1 to 6 are as shown in Table 2.

[0071] In Table 1, 4,4'-[1,3-phenylenebis(1-methylethylidene)]bisphenylcyanate was used as the bisphenol M type cyanate resin, and di(t-butylperoxyisopropyl)benzene was used as the peroxide, but the present invention is not limited thereto.

[0072] The methods for evaluating the rubber resin material / metal substrate in Table 2 are as follows. (1) Glass transition temperature: The glass transition temperature of a rubber-resin material is measured using a thermogravimetric analyzer (TGA). (2) Dielectric constant (10 GHz): Using a dielectric analyzer (product number: HP Agilent E5071C), the dielectric constant of the resin material at a frequency of 10 GHz is measured. (3) Dielectric loss tangent (10 GHz): Using a dielectric analyzer (product number: HP Agilent E5071C), the dielectric loss tangent of the resin material is measured at a frequency of 10 GHz. (4) Peel strength: The peel strength of the metal substrate is measured based on the test method IPC-TM-650-2.4.8. (5) Heat resistance: A metal board is heated in a pressure cooker at 120°C and 2 atm for 120 minutes, then immersed in a soldering furnace at 288°C, and the time it takes for the board to popcorn is recorded. If it takes more than 10 minutes to popcorn, it is shown as "OK." If it takes less than 10 minutes to popcorn, it is shown as "NG." (6) Thermal expansion coefficient: The metal substrate was cut into a sample of 4.5 mm × 30 mm × 0.1 mm, and the sample was placed in a thermomechanical analyzer (manufactured by TA Instruments). The sample was heated from 40°C to 340°C at a heating rate of 10°C / min to measure the linear thermal expansion coefficient in the planar direction in the temperature range of 50°C to 120°C.

[0073] [Table 1]

[0074] [Table 2]

[0075] According to the results in Table 1, the rubber resin materials according to Examples 1 to 3 have high glass transition temperatures and excellent dielectric properties, which can improve the heat resistance of the metal substrate. In addition, the metal substrates according to Examples 1 to 3 have good peel strength and low thermal expansion coefficient.

[0076] Comparing the rubber resin materials of Examples 1 to 3, when polyphenylene ether having a bismaleimide group at the molecular end was added, the glass transition temperature of the rubber resin material was significantly improved, and the heat resistance of the metal substrate was improved, and the metal substrate was given good peel strength and low thermal expansion coefficient. Specifically, the glass transition temperature of the rubber resin material was improved to 250°C to 270°C, the peel strength of the metal substrate was 5.5 lb / in to 7.5 lb / in, and the thermal expansion coefficient of the metal substrate was 20 ppm / °C·K to 30 ppm / °C·K.

[0077] On the other hand, when polyphenylene ether having a methacrylate group at the molecular end or polyphenylene ether having a styrene group at the molecular end is added, the dielectric tangent of the rubber resin material can be reduced. Specifically, the dielectric tangent of the rubber resin material is less than 0.0030.

[0078] In this way, different properties are imparted to the rubber resin material by adding polyphenylene ethers having different terminal functional groups to the rubber resin material depending on the requirements for different properties.

[0079] [Advantageous Effects of the Embodiments] As an advantageous effect of the present invention, the rubber resin material and metal substrate according to the present invention have the technical features that "the resin composition contains liquid rubber, polyphenylene ether resin, and cyanate" and "the cyanate resin contains bisphenol M-type cyanate resin", thereby improving the heat resistance and dielectric properties of the rubber resin material, improving the heat resistance and peel strength of the metal substrate, and reducing the thermal expansion coefficient of the metal substrate.

[0080] To explain further, the rubber resin material and metal substrate according to the present invention impart different properties to the rubber resin material due to the technical feature that "the polyphenylene ether resin includes polyphenylene ether having bismaleimide groups at its molecular terminals, polyphenylene ether having methacrylate groups at its molecular terminals, polyphenylene ether having styrene groups at its molecular terminals, or a combination thereof."

[0081] To explain further, the rubber resin material and metal substrate according to the present invention can improve the fluidity of the resin composition due to the technical feature that "the molecular weight of the liquid rubber is 3500 g / mol to 4200 g / mol."

[0082] To explain further, the rubber resin material and metal substrate according to the present invention have a technical feature that "the hydroxyl value of the polyphenylene ether is less than 0.5 mgKOH / g", which results in good adhesion between the rubber resin material and the metal layer.

[0083] The above disclosure is merely a preferred embodiment of the present invention, and the scope of the claims of the present invention is not limited thereto. Therefore, all equivalent technical modifications made by utilizing the specification and drawings of the present invention are included in the scope of the claims of the present invention.

Claims

1. A rubber resin material comprising a resin composition and an inorganic filler dispersed in the resin composition, the resin composition comprising: 10% to 50% by weight of a liquid rubber which is a polybutadiene homopolymer; 20% to 60% by weight of a polyphenylene ether resin; and 5% to 60% by weight of a cyanate resin; The polyphenylene ether resin contains polyphenylene ether having a bismaleimide group at a molecular end, The cyanate resin comprises a bisphenol M type cyanate resin; The rubber resin material is characterized in that the resin composition does not contain a bismaleimide resin.

2. The rubber resin material according to claim 1, wherein the cyanate resin has a weight average molecular weight of 100 g / mol to 3000 g / mol.

3. The rubber resin material according to claim 1, wherein the polyphenylene ether resin has a number average molecular weight of 1500 g / mol to 5000 g / mol.

4. The rubber resin material according to claim 1 , wherein the polyphenylene ether resin has a hydroxyl value of less than 0.5 mg KOH / g.

5. The rubber resin material according to claim 1, wherein the number average molecular weight of the liquid rubber is 3500 g / mol to 4200 g / mol.

6. The rubber resin material according to claim 1, wherein the viscosity of the liquid rubber at 25° C. is 35,000 cps to 43,000 cps.

7. 2. The rubber resin material according to claim 1, wherein the amount of the inorganic filler added is 50 parts by weight to 180 parts by weight based on 100 parts by weight of the resin composition.

8. The rubber resin material according to claim 1 , wherein the inorganic filler is subjected to a surface treatment to contain at least one of a methacrylate group and a vinyl group.

9. The rubber resin material according to claim 1, wherein the rubber resin material contains 0.5 to 5 parts by weight of a peroxide based on 100 parts by weight of the resin composition.

10. A metal substrate comprising a base layer made of a rubber resin material and a metal layer disposed on the base layer, The rubber resin material includes a resin composition and an inorganic filler dispersed in the resin composition, and the resin composition is 10% to 50% by weight of a liquid rubber which is a polybutadiene homopolymer; 20% to 60% by weight of a polyphenylene ether resin; and 5% to 60% by weight of a cyanate resin; The polyphenylene ether resin contains polyphenylene ether having a bismaleimide group at a molecular end, The cyanate resin comprises a bisphenol M type cyanate resin; A metal substrate, wherein the resin composition does not contain a bismaleimide resin.

11. The metal substrate according to claim 10 , wherein the dielectric tangent of the rubber resin material at 10 GHz is less than 0.0035.

12. The metal substrate according to claim 10, wherein the rubber resin material has a relative dielectric constant of 3.0 to 3.5 at 10 GHz.

13. A metal substrate as described in claim 10, wherein the glass transition temperature of the rubber resin material is 250°C to 270°C.

14. The metal substrate of claim 10, wherein the peel strength is from 4.0 lb / in to 7.5 lb / in.

15. The metal substrate according to claim 10, having a thermal expansion coefficient of 20 ppm / ° C.·K to 40 ppm / ° C.·K.

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