Laser processing method, programming tool and laser processing machine

Abstract

A laser processing method for forming a through hole in a workpiece using a laser processing machine that scans a laser beam emitted from a laser oscillator with a galvanometer mirror and focuses the laser beam on a workpiece placed on a table to perform a hole drilling process, the method including a first processed hole forming step and a second processed hole forming step. In the first processed hole forming step, a processed hole forming process is performed on a first processed surface of the workpiece, in which a scanning area that can be scanned by the galvanometer mirror moves by moving the table every time a hole drilling process in one scanning area is completed, so that a circular path that causes a scanning area to rotate along a direction parallel to the outer periphery of the processed surface of the workpiece moves from the outer periphery side to the inside of the workpiece. In the second processed hole forming step, a processed hole forming process is performed on the second processed surface. The first processed hole forming step and the second processed hole forming step are performed multiple times so that the positions of the through holes connected to the processed holes formed by a pair of the first processed hole forming step and the second processed hole forming step are different.

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