Image inspection device, image inspection method, and image inspection program for electronic components

Abstract

Provided is an image inspection device, an image inspection method, and an image inspection program for electronic components that can prevent products that are intended to be non-defective from being determined to be defective. [Solution] An image inspection device 100 for an electronic component 1 comprises a position detection means 10 that detects a product position PP based on a product image P, an image correction means 20 that generates a corrected product image Pc by correcting the product image P based on the product position PP, a first inspection means 30 that performs a first inspection T1 having a first inspection logic L1 based on the corrected product image Pc and outputs a first inspection result T1R, a repair inspection means 40 that performs a repair inspection Tk having a repair inspection logic Lk different from the first inspection logic L1 when the first inspection result T1R satisfies a specific condition in the first inspection logic L1 and outputs a repair inspection result TkR, and an overall judgment means 50 that makes an overall judgment on the electronic component 1 based on the first inspection result T1R and the repair inspection result TkR.

Description

[Technical field]

[0001] The present invention relates to an image inspection device, an image inspection method, and an image inspection program for electronic components. [Background technology]

[0002] Conventionally, there has been a device that performs visual inspection in which inspection A, which involves photographing the product and detecting the product position, is followed in parallel by inspections B and C, which are specialized for detecting various visual defects, and only if the product being inspected is judged to be non-defective is it judged to be a pass product (for example, Patent Document 1 and Patent Document 2).

[0003] In conventional visual inspection, each inspection has its own unique image inspection standard, and the inspection standard is set so that products with a specific type of visual defect are always judged as failing (NG). Furthermore, conventional image inspection standards could only set simple inspection standards that would produce one inspection result for one inspection. However, there are defective products that are not very different from good products in the image. Even such defective products need to be rejected in visual inspection. However, each inspection has overly strict inspection standards, and some products that should be good products are mistakenly judged as defective products. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 6999150 [Patent Document 2] Patent No. 7298825 Summary of the Invention [Problem to be solved by the invention]

[0005] An object of the present invention is to provide an image inspection device, an image inspection method, and an image inspection program for electronic components that can prevent products that are intended to be non-defective from being determined to be defective. [Means for solving the problem]

[0006] (1) An image inspection apparatus for electronic components according to one embodiment of the present invention includes a position detection means for detecting a product position based on a product image of an electronic component, an image correction means for generating a corrected product image by correcting the product image based on the product position, a first inspection means for performing a first inspection having a first inspection logic based on the corrected product image and outputting a first inspection result, a rescue inspection means for performing a rescue inspection having a rescue inspection logic different from the first inspection logic when the first inspection result satisfies a specific condition in the first inspection logic and outputting a rescue inspection result, and an overall judgment means for making an overall judgment on the electronic component based on the first inspection result and the rescue inspection result. (2) In the above (1), the specific condition may be a case where the first inspection result is a fail when the first inspection logic is a pass / fail judgment. (3) In the above (1) or (2), the comprehensive judgment means may make an overall judgment that the product is a good product when the first inspection result is pass or when the relief inspection result is pass, and may make an overall judgment that the product is defective when the first inspection result is fail and the relief inspection result is fail. (4) In the above (1) or (2), a second inspection means may be provided for executing a second inspection having a second inspection logic different from the first inspection logic and outputting a second inspection result, and the overall judgment means may make the overall judgment based on the first inspection result, the relief inspection result, and the second inspection result. (5) In the above (4), the overall judgment means may make an overall judgment that the product is good when the first inspection result is pass or when the relief inspection result is pass and the second inspection result is pass, and may make an overall judgment that the product is defective when the first inspection result is fail and the relief inspection result is fail, or when the second inspection result is fail. (6) In the above (1) or (2), the first inspection may be an inspection to detect defects in the electronic components. (7) In the above item (5), the second inspection may be an inspection for measuring a dimension of the electronic component. (8) An image inspection method for electronic components according to one embodiment of the present invention includes a position detection step of detecting a product position based on a product image of an electronic component, an image correction step of generating a corrected product image by correcting the product image based on the product position, a first inspection step of performing a first inspection having a first inspection logic based on the corrected product image and outputting a first inspection result, a rescue inspection step of performing a rescue inspection having a rescue inspection logic different from the first inspection logic if the first inspection result satisfies a specific condition in the first inspection logic and outputting a rescue inspection result, and an overall judgment step of making an overall judgment on the electronic component based on the first inspection result and the rescue inspection result. (9) An image inspection program for electronic components according to one embodiment of the present invention causes a computer to execute a position detection function for detecting a product position based on a product image of an electronic component, an image correction function for generating a corrected product image by correcting the product image based on the product position, a first inspection function for performing a first inspection having a first inspection logic based on the corrected product image and outputting a first inspection result, a rescue inspection function for performing a rescue inspection having a rescue inspection logic different from the first inspection logic when the first inspection result satisfies a specific condition in the first inspection logic and outputting a rescue inspection result, and an overall judgment function for making an overall judgment on the electronic component based on the first inspection result and the rescue inspection result. Effect of the Invention

[0007] According to the present invention, it is possible to provide an image inspection device, an image inspection method, and an image inspection program for electronic components that can prevent products that are intended to be non-defective from being determined to be defective. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is an explanatory diagram illustrating an overview of an image inspection device for electronic components. [Diagram 2] FIG. 2 is a diagram showing a flow of an image inspection method using an image inspection device for electronic components. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] (Embodiment) Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. Fig. 1 is an explanatory diagram for explaining an overview of an image inspection device 100 for an electronic component 1. Fig. 2 is a diagram showing a flow of an image inspection method using the image inspection device 100 for an electronic component 1. Note that, hereinafter, parts having common functions may be given the same reference numerals or symbols.

[0010] The image inspection device 100 for the electronic component 1 according to the embodiment is used to inspect the appearance of the electronic component 1.

[0011] The electronic component 1 is a product that is the subject of inspection to determine whether it is a good product (OK) or a bad product (NG). The electronic component 1 is a component or element for constituting an electronic device. The electronic component 1 is, for example, a resistor, a capacitor, an inductor, a transistor, a diode, an integrated circuit, etc. The electronic component 1 is used to control current or voltage in an electronic circuit, and to process and transfer information. The electronic component 1 is used in, for example, electronic devices such as mobile phones, computers, automobiles, and home appliances. The electronic component 1 has a three-dimensional shape such as a hexahedron.

[0012] The image inspection device 100 includes an imaging means C and a control means S. The image inspection device 100 performs an appearance inspection by, for example, imaging an electronic component 1, which is a workpiece that is placed on the top surface of a rotating, disc-shaped, transparent glass conveying table and is then sucked and conveyed, from six sides (front, back, top, bottom, left side, and right side) using the imaging means C, such as a camera, and determining pass / fail of the captured product images P using the control means S.

[0013] The imaging means C appropriately includes a front camera for imaging the front side of the electronic component 1, a rear camera for imaging the rear side of the electronic component 1, a plane camera for imaging the plane of the electronic component 1, a bottom camera for imaging the bottom side of the electronic component 1, a right side camera for imaging the right side of the electronic component 1 (the inner surface facing the rotation center of the conveying table), and a left side camera for imaging the left side of the electronic component 1 (the outer surface facing away from the rotation center of the conveying table). The imaging means C generates a product image P by imaging the electronic component 1. The product image P is sent to the control means S.

[0014] The control means S is a computer system including a CPU, memories (storage media) such as a RAM, a ROM, and an auxiliary storage device, an external connection interface with an input / output device, a network interface, and a bus. The memory stores an image inspection program for causing the control means S (computer system) to execute the image inspection method according to this embodiment.

[0015] The CPU is an arithmetic circuit that controls the control means S. The CPU reads out a program stored in the ROM or auxiliary storage device to the RAM. The CPU executes various processes in the program read out to the RAM. The ROM stores system programs and the like used to control the control means S. The auxiliary storage device stores application programs and the like that execute various processes. The auxiliary storage device is, for example, an HDD, an SSD, and the like. The external connection interface is an interface for connecting various devices to the control means S. The external connection interface connects, for example, an imaging means C, a display, a keyboard, and the like to the control means S. The network interface functions to communicate via a network based on the control of the CPU. The bus connects the above-mentioned functional units that constitute the control means S so that they can communicate with each other.

[0016] The image inspection device 100 captures an image of the electronic component 1 by an imaging means C, and based on the captured product image P, a control means S judges whether the electronic component 1 is a pass / fail product (whether the electronic component 1 is a non-defective product or a defective product).

[0017] In detail, as shown in FIG. 2, the image inspection device 100 of the electronic component 1 according to the embodiment (specifically, a control means S of the image inspection device 100) includes a position detection means 10 that detects a product position PP based on a product image P captured of the electronic component 1, an image correction means 20 that generates a corrected product image Pc by correcting the product image P based on the product position PP, a first inspection means 30 that executes a first inspection T1 having a first inspection logic L1 based on the corrected product image Pc and outputs a first inspection result T1R, a repair inspection means 40 that executes a repair inspection Tk having a repair inspection logic Lk different from the first inspection logic L1 when the first inspection result T1R satisfies a specific condition in the first inspection logic L1 and outputs a repair inspection result TkR, and an overall judgment means 50 that makes an overall judgment on the electronic component 1 based on the first inspection result T1R and the repair inspection result TkR. As a result, even if an electronic component 1 that should be judged as good (OK) is judged as a failure by the first inspection means 30 (hereinafter, this phenomenon may be referred to as overkill), if it is judged as good by the relief inspection means 40, it will be judged as good by the overall judgment means 50. Therefore, the image inspection device 100 for electronic components 1 can prevent a product that should be good from being judged as defective.

[0018] The image inspection device 100 may include an inspection logic correction means. The inspection logic correction means is provided between the position detection means 10 or the image correction means 20 and the first inspection means 30 in the information transmission path. Based on the product image P or the corrected product image Pc, the parameters of the first inspection logic L1, the second inspection logic L2, the third inspection logic L3 or the relief inspection logic Lk are corrected. The inspection logic (parameters) may be generated by, for example, an artificial intelligence that learns based on the relationship between the information of the product image P or the corrected product image Pc and the inspection result. This allows the inspection logic to be changed according to the information of the product image P or the corrected product image Pc, so that the inspection result (pass / fail judgment) in each inspection means can be corrected.

[0019] The image inspection apparatus 100 may optionally include a preliminary inspection means for carrying out a preliminary inspection before the first inspection T1 by the first inspection means 30.

[0020] The position detection means 10 detects the product position PP. The position detection means 10 detects the product position PP, which is defined, for example, by two-dimensional coordinates set on the top surface of the conveying table with the rotation axis of the conveying table as the reference, and the distance and direction (angle) with the rotation axis of the conveying table as the reference. The position detection means 10 may detect the product position PP, for example, as two-dimensional coordinates with one corner of a rectangular area that can be imaged by the imaging means C as the reference. Information on the product position PP detected by the position detection means 10 is used for correcting the product image P by the image correction means 20.

[0021] The image correcting means 20 generates a corrected product image Pc by correcting the product image P based on the product position PP. For example, when the front surface of the electronic component 1 is not perpendicular to the direction of the front camera, the image correcting means 20 corrects the product image P based on the product position PP to generate a corrected product image Pc equivalent to an image of the front surface of the electronic component 1 when the front surface of the electronic component 1 is perpendicular to the direction of the front camera. The corrected product image Pc generated by the image correcting means 20 is used in the first inspection T1 performed by the first inspection means 30.

[0022] The first inspection means 30 executes a first inspection T1 having a first inspection logic L1 based on the corrected product image Pc and outputs a first inspection result T1R. The corrected product image Pc is provided from the image correction means 20. The first inspection logic L1 is a logic for making a pass / fail judgment in the first inspection T1. The first inspection logic L1 is a logic for making a fail judgment when a predefined defect is found in the corrected product image Pc, and for making a pass judgment when no defect is found. The first inspection logic L1 may be, for example, a function for making a pass / fail judgment based on a threshold value set for a parameter for evaluating a defect. The function may be a model (algorithm) generated by artificial intelligence that has been trained using samples of pass or fail product images as teacher data.

[0023] In this way, the first inspection T1 is an inspection to detect defects in the electronic component 1. Here, the term "defect" refers to a concept that includes what is called a defect in a general appearance inspection, including dimensional defects (including dimensions outside the tolerance range or set standard), foreign matter contamination, defects including chips where a corner or other part is missing, and damage where the component is completely broken in appearance. In this way, the first inspection T1 is an inspection to detect defects in the electronic component 1, and therefore an electronic component 1 that would otherwise be defective can be reliably determined to be defective.

[0024] The first inspection T1 is preferably an inspection for detecting dirt or foreign matter on the element body among defects of the electronic component 1. The first inspection T1 is more preferably an inspection for detecting dirt on the element body among defects of the electronic component 1. The element body refers to the remaining part when the electronic component 1 is divided into an electrode part and the remaining part. It has been found that the inspection for dirt or foreign matter on the element body is more likely to cause overkill, in which an electronic component 1 that is originally a good product is judged as a failure, compared to other inspections such as dimensional inspection in defect inspection. Therefore, by setting an inspection for detecting dirt or foreign matter on the element body that is more likely to cause overkill as the first inspection T1, electronic components 1 in which dirt or foreign matter on the element body is detected are initially judged as a failure on the safe side in the first inspection T1, and a pass / fail judgment regarding dirt or foreign matter on the element body can be made precisely in the rescue inspection Tk that follows in series after the first inspection T1.

[0025] When the first test result T1R satisfies a specific condition in the first test logic L1, the repair test means 40 executes a repair test Tk having a repair test logic Lk different from the first test logic L1, and outputs a repair test result TkR.

[0026] Specifically, the specific condition is when the first inspection result T1R is a fail when the first inspection logic L1 is a pass / fail judgment. This allows the repair inspection means 40 to repair an electronic component 1 that would otherwise be a non-defective product by determining that it is a pass in the repair inspection Tk, even if the first inspection result T1R is a fail.

[0027] The relief inspection logic Lk is a logic for making a pass / fail judgment in the relief inspection Tk. Unlike the first inspection logic L1, the relief inspection logic Lk is set to be specialized for the inspection of the corrected product image Pc in which the first inspection result T1R falls under a specific condition (judged as fail) in the first inspection logic L1. The relief inspection logic Lk is a logic for failing the corrected product image Pc in which the first inspection result T1R falls under a specific condition (judged as fail) in the first inspection logic L1 when a predefined defect different from the defect defined in the first inspection logic L1 is found, and passing the corrected product image Pc in which no defect is found. The type of defect defined in the first inspection logic L1 and the type of defect defined in the relief inspection logic Lk may be the same, and the pass / fail judgment criterion of the first inspection logic L1 and the pass / fail judgment criterion of the relief inspection logic Lk may be different. In this way, since the image inspection device 100 is provided with the relief inspection means 40, when the electronic component 1 to be inspected is originally a non-defective product, even if it is judged as failing in the first inspection T1, it can be judged as passing in the relief inspection Tk.

[0028] The overall judgment means 50 performs an overall judgment on the electronic component 1 based on the first inspection result T1R and the repair inspection result TkR. Specifically, the overall judgment means 50 makes an overall judgment as a non-defective product when the first inspection result T1R is pass or the repair inspection result TkR is pass, and makes an overall judgment as a defective product when the first inspection result T1R is fail and the repair inspection result TkR is fail. In other words, the overall judgment means 50 makes an overall judgment as pass when the first inspection result T1R is pass, makes an overall judgment as pass when the first inspection result T1R is fail and the repair inspection result TkR is pass, and makes an overall judgment as fail when the first inspection result T1R is fail and the repair inspection result TkR is fail. As a result, even if the first inspection result T1R is fail, the overall judgment is not immediately made as fail, and even if the first inspection result T1R is fail, the overall judgment is made as pass when the repair inspection result TkR is pass. Therefore, the image inspection device 100 can prevent a product that is intended to be a non-defective product from being determined to be a defective product.

[0029] The image inspection device 100 may include a second inspection means 60 that executes a second inspection T2 having a second inspection logic L2 different from the first inspection logic L1 and outputs a second inspection result T2R. This allows the second inspection T2 to be executed in parallel on the electronic component 1 from a different viewpoint than the first inspection T1, so that even if an electronic component 1 that should be a defective product passes the first inspection T1, it can be determined to be a defective product overall if it fails the first inspection T2. ​​This makes it possible to prevent a product that should be a defective product from being determined to be a non-defective product, thereby improving the inspection accuracy of the image inspection device 100.

[0030] The overall judgment means 50 performs an overall judgment based on the first inspection result T1R, the relief inspection result TkR, and the second inspection result T2R. As a result, even if an electronic component 1 that is originally defective passes the first inspection T1, it can be judged as defective if it fails the first inspection T2. ​​Therefore, it is possible to prevent a product that should be a good product from being judged as a defective product, and it is also possible to prevent a product that should be a defective product from being judged as a good product, thereby improving the inspection accuracy by the image inspection device 100.

[0031] Specifically, the second inspection T2 is preferably an inspection for measuring the dimensions of the electronic component 1. It has been found that an inspection for measuring dimensions is less likely to cause overkill, in which an electronic component 1 that is actually a good product is judged to be a failure, compared to other inspections such as inspections for dirt or foreign matter on the element body in defect inspections. Therefore, it is preferable to carry out the second inspection T2 for measuring the dimensions of the electronic component 1, which is an inspection less likely to cause overkill, in parallel with the first inspection T1 prior to the repair inspection Tk, independently of the first inspection T1.

[0032] The image inspection device 100 may include a second repair inspection means, similar to the repair inspection means 40, for executing a second repair inspection Tk2 having a second repair inspection logic Lk2 different from the second inspection logic L2 when the second inspection result T2R satisfies a specific condition in the second inspection logic L2, and outputting a second repair inspection result TkR2. That is, the second inspection T2 may be refrained from being performed, similar to the repair inspection Tk for the first inspection T1. This can further prevent a product that should be a good product from being determined to be defective.

[0033] The image inspection device 100 may include a third inspection means 70 that performs a third inspection T3 having a third inspection logic L3 different from the first inspection logic L1 of the first inspection T1 and the second inspection logic L2 of the second inspection T2. ​​The third inspection means 70 is provided in parallel and independent of the first inspection means 30 and the second inspection means 60. This allows the electronic component 1 to be inspected from more viewpoints, thereby improving the inspection accuracy for defective products.

[0034] The technical scope of the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention.

[0035] In addition, the components in the above-described embodiment may be replaced with known components as appropriate without departing from the spirit of the present invention. Furthermore, the above-described modified examples may be combined as appropriate without departing from the spirit of the present invention.

[0036] As described above, the image inspection device 100 for an electronic component 1 according to the embodiment includes a position detection means 10 for detecting a product position PP based on a product image P obtained by capturing an image of the electronic component 1, an image correction means 20 for generating a corrected product image Pc by correcting the product image P based on the product position PP, a first inspection means 30 for executing a first inspection T1 having a first inspection logic L1 based on the corrected product image Pc and outputting a first inspection result T1R, a repair inspection means 40 for executing a repair inspection Tk having a repair inspection logic Lk different from the first inspection logic L1 when the first inspection result T1R satisfies a specific condition in the first inspection logic L1 and outputting a repair inspection result TkR, and an overall judgment means 50 for making an overall judgment on the electronic component 1 based on the first inspection result T1R and the repair inspection result TkR. As a result, even if an electronic component 1 that should be judged as good (OK) is judged as a failure by the first inspection means 30 (hereinafter, this phenomenon may be referred to as overkill), if it is judged as good by the rescue inspection means 40, it will be judged as good by the overall judgment means 50. Therefore, the image inspection device 100 for electronic components 1 can prevent a product that should be good from being judged as defective.

[0037] The image inspection method according to the embodiment includes a product position detection step of detecting a product position PP based on a product image P obtained by capturing an electronic component 1, an image correction step of generating a corrected product image Pc by correcting the product image P based on the product position PP, a first inspection step of executing a first inspection T1 having a first inspection logic L1 based on the corrected product image Pc to output a first inspection result T1R, a repair inspection step of executing a repair inspection Tk having a repair inspection logic Lk different from the first inspection logic L1 when the first inspection result T1R satisfies a specific condition in the first inspection logic L1 to output a repair inspection result TkR, and a comprehensive judgment step of making a comprehensive judgment on the electronic component 1 based on the first inspection result T1R and the repair inspection result TkR. As a result, even if an electronic component 1 that should have been judged as a non-defective product (OK) is judged as a failure by the first inspection means 30 (hereinafter, this event may be referred to as overkill), if it is judged as a non-defective product in the repair inspection step, it is comprehensively judged as a non-defective product in the comprehensive judgment step. Therefore, according to the image inspection method for the electronic component 1, it is possible to prevent a product that is intended to be a non-defective product from being determined to be a defective product.

[0038] The image inspection program according to the embodiment is for making a computer execute the image inspection method described above. That is, the image inspection program according to the embodiment is for making a computer execute a product position detection function for detecting a product position PP based on a product image P obtained by capturing an electronic component 1, an image correction function for generating a corrected product image Pc by correcting the product image P based on the product position PP, a first inspection function for executing a first inspection T1 having a first inspection logic L1 based on the corrected product image Pc and outputting a first inspection result T1R, a relief inspection function for executing a relief inspection Tk having a relief inspection logic Lk different from the first inspection logic L1 when the first inspection result T1R satisfies a specific condition in the first inspection logic L1 and outputting a relief inspection result TkR, and a comprehensive judgment function for making a comprehensive judgment on the electronic component 1 based on the first inspection result T1R and the relief inspection result TkR. As a result, even if an electronic component 1 that should be judged as a non-defective product (OK) is judged as a failure by the first inspection means 30 (hereinafter, this event may be referred to as overkill), if it is judged as a non-defective product in the relief inspection step, it is comprehensively judged as a non-defective product in the comprehensive judgment step. Therefore, according to the image inspection method for the electronic component 1, it is possible to prevent a product that is intended to be a non-defective product from being determined to be a defective product. [Explanation of symbols]

[0039] 100 Image inspection device 1. Electronic Components 10 Position detection means 20 Image correction means 30 First inspection means 40 Remedial Inspection Measures 50 Comprehensive assessment method 60 Second Inspection Method 70 Third inspection method C. Imaging means S Control Means L1 First inspection logic L2 Second inspection logic L3 Third inspection logic P Product image T1 First Inspection T1R 1st test result T2 Second Inspection T2R 2nd test results T3 Third Inspection Tk Rescue Check TkR Rescue Test Results

Claims

1. a position detection means for detecting a product position based on a product image obtained by capturing an image of an electronic component; an image correction means for generating a corrected product image by correcting the product image based on the product position; a first inspection means for executing a first inspection having a first inspection logic based on the corrected product image and outputting a first inspection result; a repair inspection means for executing a repair inspection having a repair inspection logic different from the first inspection logic when the first inspection logic is a pass / fail judgment and the first inspection result is a fail, and outputting a repair inspection result; a comprehensive evaluation means for performing a comprehensive evaluation on the electronic device based on the first inspection result and the repair inspection result; Equipped with the first inspection logic is a function for determining pass or fail based on a threshold value set for a parameter for evaluating a defect; The repair inspection logic is generated by artificial intelligence that learns based on the relationship between the information of the product image or the corrected product image and the inspection result. Image inspection equipment for electronic components.

2. The first inspection is an inspection for detecting defects in the electronic component, such as dirt or foreign matter on the body.

2. The image inspection apparatus for electronic parts according to claim 1.

3. The comprehensive judgment means comprehensively judges the product as a non-defective product when the first inspection result is a pass or the repair inspection result is a pass, and comprehensively judges the product as a defective product when the first inspection result is a fail and the repair inspection result is a fail.

3. The image inspection apparatus for electronic parts according to claim 1 or 2.

4. a second inspection means for executing a second inspection having a second inspection logic different from the first inspection logic and outputting a second inspection result; The comprehensive judgment means makes the comprehensive judgment based on the first inspection result, the relief inspection result, and the second inspection result.

3. The image inspection apparatus for electronic parts according to claim 1 or 2.

5. The comprehensive judgment means comprehensively judges the product as a non-defective product when the first inspection result is a pass or when the remedy inspection result is a pass and the second inspection result is a pass, and comprehensively judges the product as a defective product when the first inspection result is a fail and the remedy inspection result is a fail, or when the second inspection result is a fail.

5. The image inspection apparatus for electronic parts according to claim 4.

6. The first inspection is an inspection for detecting defects in the electronic components.

3. The image inspection apparatus for electronic parts according to claim 1 or 2.

7. The second inspection is an inspection for measuring the dimensions of the electronic component.

6. The image inspection apparatus for electronic parts according to claim 5.

8. a position detection step of detecting a product position based on a product image obtained by capturing an image of an electronic component; an image correction step of generating a corrected product image by correcting the product image based on the product position; a first inspection step of performing a first inspection having a first inspection logic based on the corrected product image and outputting a first inspection result; a repair inspection step of executing a repair inspection having a repair inspection logic different from the first inspection logic when the first inspection logic is a pass / fail judgment and the first inspection result is a fail, and outputting a repair inspection result; a comprehensive evaluation step of performing a comprehensive evaluation on the electronic device based on the first inspection result and the repair inspection result; Equipped with the first inspection logic is a function for determining pass or fail based on a threshold value set for a parameter for evaluating a defect; The repair inspection logic is generated by artificial intelligence that learns based on the relationship between the information of the product image or the corrected product image and the inspection result. An image inspection method for electronic components.

9. a position detection function for detecting a product position based on a product image obtained by capturing an image of an electronic component; an image correction function for generating a corrected product image by correcting the product image based on the product position; a first inspection function for performing a first inspection having a first inspection logic based on the corrected product image and outputting a first inspection result; a repair inspection function that, when the first inspection logic is a pass / fail judgment, executes a repair inspection having a repair inspection logic different from the first inspection logic when the first inspection result is a fail, and outputs a repair inspection result; a comprehensive judgment function for making a comprehensive judgment on the electronic device based on the first inspection result and the relief inspection result; Run the command, the first inspection logic is a function for determining pass or fail based on a threshold value set for a parameter for evaluating a defect; The repair inspection logic is generated by artificial intelligence that learns based on the relationship between the information of the product image or the corrected product image and the inspection result. Image inspection program for electronic components.

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