Method for manufacturing a circuit board assembly, a circuit board assembly manufactured by the method, and an electric vehicle including the circuit board assembly

Abstract

The present invention provides a method for manufacturing a circuit board assembly, a circuit board assembly manufactured thereby, and an electric vehicle equipped with the same. The present invention discloses a method for manufacturing a circuit board assembly, including the steps of mounting a plurality of components on a circuit board, preparing a mold having recesses corresponding to the shapes of the plurality of components and protrusions corresponding to the surface of the circuit board, placing the mold above the circuit board and providing a protective material to be placed on the circuit board, using the mold to place the protective material on the circuit board and the components, and curing the protective material to form a protective layer.

Description

[Technical field]

[0001] The present invention relates to a method for manufacturing a circuit board assembly, and more particularly to a method for manufacturing a circuit board assembly capable of protecting components mounted on a circuit board, and a circuit board assembly manufactured thereby. [Background technology]

[0002] Chargeable and dischargeable secondary batteries, i.e., batteries, are used as energy sources for mobile devices such as smartphones, etc. Batteries are also used as energy sources for electric vehicles and hybrid electric vehicles, which have been presented as a solution to address air pollution caused by gasoline and diesel vehicles that use fossil fuels.

[0003] Meanwhile, batteries are also used as an energy source for e-mobility, which has been attracting attention in recent years as the need for healthy lifestyles increases. E-mobility is a general term for environmentally friendly, electrically driven personal means of transportation for one or two people, and includes a wide variety of light electric vehicles, including upright transportation such as electric kick scooters, electric bicycles, electric motorcycles, and ultra-compact electric vehicles (three-wheeled vehicles).

[0004] As a result, not only electric vehicles (EVs) and light electric vehicles (LEVs), but also the types of applications that use batteries are becoming increasingly diverse due to the benefits of batteries, and batteries are expected to be applied to more fields and products than ever before.

[0005] Electric vehicles (hereinafter collectively referred to as electric vehicles), including light electric vehicles that use batteries as power sources, must be equipped with a battery management system (BMS) to control the operation of the battery. In addition, a controller must be installed to control the electric vehicle, such as driving and controlling the motor. Components such as a controller for driving the motor and a BMS for managing the battery are mounted on a circuit board. In this case, the controller and the BMS may be mounted on different boards. In other words, components for driving and controlling the electric vehicle and components for managing the battery may be mounted on different boards. As such a circuit board, a printed circuit board (PCB) on which a predetermined circuit pattern is printed can be used.

[0006] A circuit board uses conductive materials such as copper to electrically connect the components mounted on it to form a circuit, but because the spacing between these circuit patterns is generally narrow, even slight moisture or heat can cause electricity to flow between the components, damaging the circuit board. Components mounted on the circuit board can also be damaged by moisture or heat, or can be detached from the circuit board when subjected to external shock.

[0007] Therefore, it is essential to protect the circuit board and components from heat, moisture or external shocks to allow the components mounted on the circuit board to function normally. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] Korean Patent No. 10-1641435 Summary of the Invention [Problem to be solved by the invention]

[0009] The present invention provides a method for manufacturing a circuit board assembly that can protect the circuit board and the components mounted thereon.

[0010] The present invention provides a method for manufacturing a circuit board assembly, which can protect the circuit board and the components by forming a protective layer after mounting components on the circuit board.

[0011] The present invention provides a method for manufacturing a circuit board assembly capable of protecting a circuit board and components, a circuit board assembly manufactured by the method, and an electric vehicle equipped with the circuit board assembly. [Means for solving the problem]

[0012] A method for manufacturing a circuit board assembly according to one aspect (first embodiment) of the present invention includes the steps of: preparing a mold having recesses corresponding to the shapes of a plurality of components and a protrusion corresponding to the surface of a circuit board; mounting a plurality of components on the circuit board; providing the mold above the circuit board and providing a protective material to be placed on the circuit board; using the mold to place the protective material on the circuit board and the components; and hardening the protective material to form a protective layer.

[0013] The step of providing a protective material to be placed on the circuit board includes a step of placing the protective material between the circuit board and the mold, and the step of using the mold to place the protective material on the circuit board and the components includes a step of pressing the mold to bring the protective material into contact with the circuit board and the components.

[0014] The protective material has a width greater than the width of the circuit board, or a thickness greater than the gap between the recess and the component.

[0015] A predetermined vibration is applied to the protective material through the mold.

[0016] The recess is formed to be deeper than the height of the component and wider than the width of the component.

[0017] The distance between the recess and the component corresponds to the thickness of the protective layer.

[0018] The protective material may include a hot melt resin, a light curable resin, a heat curable resin, a wet resin, or a combination thereof.

[0019] The protective layer is formed to the same thickness on the top of the circuit board and on the side and top surfaces of the components.

[0020] The protective layer is formed to have a different thickness in at least one region.

[0021] The protective layer is formed to a thickness of 5 μm to 1 mm.

[0022] A method for manufacturing a circuit board assembly according to another aspect (second embodiment) of the present invention includes the steps of preparing a mold having recesses corresponding to the shapes of a plurality of components and a protrusion corresponding to the surface of the circuit board, mounting a plurality of components on the circuit board, providing the mold above the circuit board and providing a protective material to be placed on the circuit board, using the mold to place the protective material on the circuit board and the components, and hardening the protective material to form a protective layer.

[0023] The step of providing a protective material to be placed on the circuit board includes a step of connecting a container in which molten protective material is stored to the mold, and the step of using the mold to place the protective material on the circuit board and the components includes a step of injecting molten protective material through the mold to bring the circuit board and the components into contact with the molten protective material.

[0024] The mold is controlled to a predetermined temperature range that is higher than room temperature and lower than the melting temperature of the molten protective material.

[0025] Of the multiple tubes formed to penetrate the concave and convex portions of the mold, molten protective material is injected through the tube formed to penetrate the convex portion, and air is exhausted through the tube formed to penetrate the concave portion.

[0026] Air is exhausted through a filter provided at the opening of a tube formed to pass through the recess, thereby suppressing or preventing the outflow of the molten protective material.

[0027] The recess is formed to be deeper than the height of the component and wider than the width of the component.

[0028] The distance between the recess and the component corresponds to the thickness of the protective layer.

[0029] The protective material may include a hot melt resin, a light curable resin, a heat curable resin, a wet resin, or a combination thereof.

[0030] The protective layer is formed to the same thickness on the top of the circuit board and on the side and top surfaces of the components.

[0031] The protective layer is formed to have a different thickness in at least one region.

[0032] The protective layer is formed to a thickness of 5 μm to 1 mm.

[0033] A circuit board assembly according to yet another aspect of the present invention is manufactured according to one or another aspect of the present invention.

[0034] An electric vehicle according to yet another embodiment of the present invention includes a battery that is rechargeable and dischargeable and provides electric energy, a BMS that manages the battery, a controller that controls the status of the electric vehicle, and a motor that drives the electric vehicle, wherein the BMS is a first component of a first circuit board assembly manufactured by the method for manufacturing a circuit board assembly according to one or another embodiment of the present invention, and the controller is a second component of a second circuit board assembly manufactured by the method for manufacturing a circuit board assembly according to one or another embodiment of the present invention. Effect of the Invention

[0035] The circuit board assembly manufactured according to the present invention has a circuit board on which a plurality of components are mounted, and a protective layer can be formed on the upper portion of the circuit board and on the side and upper surfaces of the plurality of components. The protective layer can be formed using a mold having a concave-convex structure corresponding to the shapes of the circuit board and the plurality of components mounted thereon. As a protective layer is formed on the circuit board on which components are mounted according to the present invention, the circuit board and the components can be protected from heat, moisture, or external impact. Therefore, the circuit board assembly can function normally without malfunctioning due to heat, moisture, or external impact. [Brief description of the drawings]

[0036] [Figure 1] 1 is a process flow diagram illustrating a method for manufacturing a circuit board assembly according to one embodiment (first embodiment) of the present invention. [Diagram 2] 1A to 1C are schematic cross-sectional views of steps of a method for manufacturing a circuit board assembly according to an embodiment of the present invention. [Diagram 3] 1A to 1C are schematic cross-sectional views of steps of a method for manufacturing a circuit board assembly according to an embodiment of the present invention. [Figure 4] 1A to 1C are schematic cross-sectional views of steps of a method for manufacturing a circuit board assembly according to an embodiment of the present invention. [Diagram 5]1A to 1C are schematic cross-sectional views of steps of a method for manufacturing a circuit board assembly according to an embodiment of the present invention. [Figure 6] 1A to 1C are schematic cross-sectional views of steps of a method for manufacturing a circuit board assembly according to an embodiment of the present invention. [Figure 7] 5 is a process flow diagram illustrating a method for manufacturing a circuit board assembly according to another embodiment (second embodiment) of the present invention. [Figure 8] 5A to 5C are schematic cross-sectional views illustrating steps of a method for manufacturing a circuit board assembly according to another embodiment of the present invention. [Figure 9] 5A to 5C are schematic cross-sectional views illustrating steps of a method for manufacturing a circuit board assembly according to another embodiment of the present invention. [Figure 10] 1 is a block diagram of an electric vehicle equipped with a circuit board assembly manufactured by a method for manufacturing a circuit board assembly according to an embodiment of the present invention; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0037] Hereinafter, the embodiments of the present invention will be described in more detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, and may be embodied in various different forms. The embodiments of the present invention are provided merely to complete the disclosure of the present invention and to fully inform those skilled in the art of the scope of the invention. In order to explain the embodiments of the present invention, the drawings may be exaggerated, and parts that are not related to the description may be omitted from the drawings, and the same reference numerals in the drawings refer to the same elements.

[0038] 1. Method for manufacturing a circuit board assembly according to an embodiment of the present invention A manufacturing method for a circuit board assembly according to an embodiment of the present invention includes the steps of preparing a mold having recesses corresponding to the shapes of a plurality of components and a protrusion corresponding to the surface of the circuit board, mounting a plurality of components on the circuit board, providing the mold above the circuit board and providing a protective material to be placed on the circuit board, using the mold to place the protective material on the circuit board and the components, and hardening the protective material to form a protective layer.

[0039] Here, in one embodiment of the present invention (first embodiment), the step of providing a protective material to be placed on the circuit board may include a step of placing the protective material between the circuit board and the mold.

[0040] In addition, in one embodiment of the present invention, the step of using a mold to position the protective material on the circuit board and components may include a step of pressing the mold to contact the protective material with the circuit board and components.

[0041] That is, in one embodiment of the present invention, the protective layer may be formed by a pressing process using a mold having a concave-convex structure corresponding to the shapes of the circuit board and the multiple components mounted thereon.

[0042] On the other hand, in another embodiment (second embodiment) of the present invention, the step of providing a protective material to be placed on the circuit board may include a step of connecting a container in which molten protective material is stored to the mold.

[0043] In another embodiment of the present invention, the step of positioning the protective material over the circuit board and components using a mold may include injecting molten protective material through the mold to contact the circuit board and components with the molten protective material.

[0044] That is, in another embodiment of the present invention, the protective layer may be formed by an insert injection molding process using a mold having a concave-convex structure corresponding to the shapes of the circuit board and the multiple components mounted thereon.

[0045] Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

[0046] 2. Manufacturing method of a circuit board assembly according to one embodiment of the present invention (first embodiment) FIG. 1 is a process flow diagram illustrating a method for manufacturing a circuit board assembly according to one embodiment of the present invention, and FIGS. 2 to 6 are schematic cross-sectional views of each process of the method for manufacturing a circuit board assembly according to one embodiment of the present invention.

[0047] 1, a method for manufacturing a circuit board according to an embodiment of the present invention may include a step of providing a mold and a circuit board (S110), a step of mounting predetermined components on the circuit board (S120), a step of placing a mold on the circuit board on which the components are mounted and positioning a protective material between the mold and the circuit board (S130), a step of pressing the mold to contact the protective material with the circuit board and the components (S140), and a step of hardening the protective material to form a protective layer (S150). The method for manufacturing a circuit board according to an embodiment of the present invention will be described in more detail for each step with reference to FIGS. 2 to 6 as follows.

[0048] S110: The process of providing a mold and a circuit board is as follows.

[0049] Providing a mold and a circuit board comprises providing a mold and providing a printed circuit board.

[0050] 1 and 4, a mold 130 having recesses corresponding to the shapes of the multiple components 120 and a protrusion corresponding to the surface of the circuit board 110 is prepared.

[0051] The mold 130 may be provided with a predetermined thickness, and recesses may be formed in the shape of the components 120 in the portions corresponding to the components 120, and protrusions may be formed corresponding to the remaining surface of the upper portion of the circuit board 110. That is, the mold 130 may have an uneven structure that matches the components 120 mounted on the circuit board 110 and the upper surface of the circuit board 110. In this case, the recesses corresponding to the components 120 of the mold 130 may be formed larger than the components 130. That is, the recesses may be formed to be deeper than the height of the components 120 and wider than the width of the components 120. The width of the recesses may be wider than the width of the components 120 by about 10 μm to 2 mm, and the depth of the recesses may be deeper than the height of the components 120 by about 5 μm to 1 mm. Therefore, the side surface of the components 120 and the inner surface of the recesses may have a gap of about 5 μm to 1 mm, and the upper surface of the components 120 and the bottom surface of the recesses may also have a gap of about 5 μm to 1 mm. In this case, the distance between the side surface of the component 120 and the inner surface of the recess may be equal to or different from the distance between the upper surface of the component 120 and the bottom surface of the recess. If different, the distance between the side surface of the component and the inner surface of the recess may be larger than the distance between the upper surface of the component 120 and the bottom surface of the recess. Of course, the distance between the side surface of the component 120 and the inner surface of the recess may be smaller than the distance between the upper surface of the component 120 and the bottom surface of the recess.

[0052] 1 and 2, a printed circuit board (PCB) having a circuit pattern formed on an insulating layer is provided. In a printed circuit board, a copper-clad thin plate is generally attached to a surface of a phenolic resin insulating layer or an epoxy resin insulating layer, and then the copper-clad thin plate is etched according to a predetermined pattern to form a desired circuit pattern, and such a printed circuit board can be used as the circuit board 110. Meanwhile, as the printed circuit board, a single-sided board, a double-sided board, a multi-layer board, etc. can be used depending on the number of circuit layers and insulating layers, and the more layers there are, the better the mounting ability of electronic components is, and the more highly precise the printed circuit board is used, so the number of layers can be selected depending on the number of components to be mounted on the printed circuit board and the degree of integration.

[0053] On the other hand, a plurality of circuit boards 110 may be used in an electric vehicle. That is, a first circuit board on which a plurality of components having a controller for driving a motor and controlling the electric vehicle are mounted, and a second circuit board on which a plurality of components having a BMS for managing a battery are mounted can be used in an electric vehicle. In this case, the first circuit board and the second circuit board may be different in size from each other, and the shape of the circuit pattern, the interval between the circuit patterns, and the like may be different from each other. For example, the first circuit board may be larger in size than the second circuit board. The first and second circuit boards may be manufactured in various ratios depending on the type of electric vehicle or light electric vehicle to which they are applied, the number and density of components mounted on the board, and the like. The first circuit board and the second circuit board may have a horizontal ratio of 2:1 to 10:1 and a vertical ratio of 2:1 to 15:1, but may have a horizontal ratio of 2:1 and a vertical ratio of 5:1, for example. That is, the width of the first circuit board is 2 to 5 times longer than the width of the second circuit board, and the length of the first circuit board is 2 to 10 times longer than the length of the second circuit board. The first circuit board and the second circuit board may have an area ratio of 4:1 to 50:1, but may have an area ratio of 10:1, for example. That is, the area of ​​the first circuit board is 4 to 50 times larger than the area of ​​the second circuit board.

[0054] S120: Referring to FIG. 1 and FIG. 3, at least one component 120 for driving and controlling the electric vehicle is mounted on the circuit board 110. At this time, the component 120 mounted on the circuit board 110 may be in various forms such as a chip or a discrete component. For example, a controller and passive elements such as a capacitor, an inductor, and a resistor may be mounted on the first circuit board. By mounting the controller and the passive elements on the first circuit board in this way, a main board can be manufactured. Then, at least one component for managing a battery may be mounted on the second circuit board. For example, a battery management system (BMS) and passive elements such as a capacitor, an inductor, and a resistor may be mounted on the second circuit board. By mounting the BMS and the passive elements on the second circuit board in this way, a sub-board can be manufactured.

[0055] FIG. 3 shows a cross-sectional view of a circuit board 110 on which a plurality of components 120 are mounted. The circuit board 110 may be a first circuit board on which a controller is mounted, or a second circuit board on which a BMS is mounted. In the embodiment of the present invention, the second circuit board on which a BMS is mounted is taken as an example. As shown in FIG. 3, the circuit board 110 may have the same thickness, and the plurality of components 120 mounted on the circuit board 110 may have different heights and / or widths. For example, the height of the first component 121 may be higher than the heights of the second and third components 122 and 123, and the height of the second component 122 may be higher than the height of the third component 123. The width of the first component 121 may be wider than the widths of the second and third components 122 and 123, and the width of the second component 122 may be wider than the width of the third component 123. At least one of the intervals between the plurality of components may be different. For example, the distance between the first component 121 and the second component 122 may be greater than the distance between the first component 121 and the third component 123. Meanwhile, the multiple components may have a circular or rectangular shape when viewed from above. That is, among the multiple components, there may be a component having a cylindrical shape and another component having a hexagonal prism shape. These shapes of the multiple components are merely examples for understanding the invention, and various shapes can be adopted.

[0056] 1 and 4, the circuit board 110 on which a plurality of components 120 are mounted is placed and fixed on a predetermined mounting table (not shown). A mold 130 having a concave-convex structure formed following the shape of the components 120 mounted on the circuit board 110 may be provided above the work table. A protective material 140a is placed between the mold 130 and the circuit board 110.

[0057] The protective material 140a may be provided in a gel state between the mold 130 and the circuit board 110. Needless to say, the protective material 140a may be provided in a film state having a predetermined thickness depending on the properties. In this case, hot melt resin can be used as the protective material 140a. However, in addition to hot melt resin, photocurable resin, thermosetting resin, wet resin, or a combination of these can also be used as the protective material 140a.

[0058] The horizontal width of protective material 140a may be greater than the width of circuit board 110. Also, the vertical thickness of protective material 140a may be greater than the distance between the recess and the component. Therefore, when protective material 140a is pressed onto circuit board 110, protective material 140a can cover the entire upper surface of circuit board 110 thoroughly.

[0059] S140: Referring to FIG. 1 and FIG. 5, the mold 130 is moved downward and the circuit board 110 is pressed with the protective material 140a sandwiched therebetween, so that the protective material 140a comes into contact with the circuit board 110 and the component 120. At this time, heat may be applied to the protective material 140a so that the protective material 140a can flow through the mold 130. For example, heat may be applied to a range in which the protective material 140a has fluidity and does not cause thermal damage to the circuit board 110, for example, heat may be applied to 140°C. By pressing the mold 130 while applying heat to cause the protective material 140a to flow, the protective material 140a is positioned between the mold 130 and the circuit board 110 and between the mold 130 and the component 120.

[0060] In addition, a predetermined vibration can be applied to the protective material 140a via the mold 130 to cause the protective material 104 to flow. That is, the protective material 140a can be caused to flow by vibrating the mold 130, and the flowability of the protective material 140a can be improved. At this time, the direction in which the mold 130 vibrates may be either the vertical direction or the horizontal direction, and the distance over which the mold 130 vibrates may be smaller than the thickness of the protective material 140a. Therefore, the flowability of the protective material 140a can be improved by vibrating the protective material 140a while preventing the components 120 on the circuit board 110 from being damaged by vibration.

[0061] S150: Referring to FIG. 1 and FIG. 6, after pressing the mold 130 for a predetermined time, the mold 130 is moved upward and removed. As a result, the protective material 140a remains on the upper part of the circuit board 110 and the side and upper surface of the component 120. The protective material 140a is hardened to form the protective layer 140. In order to form the protective layer 140, a predetermined hardening process may be performed according to the protective material. In the case of hot melt resin, it may be applied at a high temperature and hardened while cooling. In addition, in the case of photo-curable adhesive resin, it may be hardened by ultraviolet (UV), in the case of thermosetting resin, it may be hardened by heating the applied adhesive resin, and in the case of wet resin, it may be hardened by reacting with moisture contained in the air.

[0062] The protective layer 140 may be formed on the circuit board 110 and the components 120 mounted on the circuit board 110 by the process described above. That is, the protective layer 140 may be formed on the side and top surface of the components 120, and on the circuit board 110 exposed because the components 120 are not mounted. In this case, the protective layer 140 may be formed to a thickness corresponding to the separation distance between the circuit board 110 and the components 120 and the mold 130. That is, the protective layer 140 may be formed to a thickness of 5 μm to 1 mm. In this case, the protective layer 140 may have the same thickness on the side and top surface of the components 120 and the top surface of the circuit board 110, or one of them may be different. That is, the protective layer 150 may be formed to the same thickness on the top surface of the circuit board 110, the side and top surface of the components 120. That is, the protective layer 140 may be formed to the same thickness along the step, thereby providing uniform step coverage. Needless to say, protective layer 140 may be formed to the same thickness on the upper surface of component 120 and the upper surface of circuit board 110, and may be formed to a different thickness on the side surface of component 120. For example, the thicknesses of the upper surface of component 120 and the upper surface of circuit board 120 may be greater than the thicknesses of the side surfaces of the components. Of course, conversely, the thicknesses of the upper surface of component 120 and the upper surface of circuit board 110 may be less than the thicknesses of the side surfaces of the components. Note that protective layer 140 may be formed to a thickness different in at least one region from the other regions.

[0063] As described above, the circuit board assembly manufactured according to an embodiment of the present invention may include a circuit board 110 on which a plurality of components 120 are mounted, and a protective layer 140 may be formed on the upper portion of the circuit board 110 and on the side and upper surfaces of the plurality of components 120. The protective layer 140 may be formed by a pressing process using a mold 130 having a concave-convex structure corresponding to the shape of the circuit board 110 and the plurality of components 120 mounted thereon. The protective layer 140 may be formed to a uniform thickness on the side and upper surfaces of the circuit board 110 and the components 120, or at least one region may be formed to a different thickness from the other regions. By forming the protective layer 140 on the circuit board 110 on which the components 120 are mounted according to the present invention, the circuit board 110 and the components 120 can be protected from heat, moisture, or external impact. Therefore, the circuit board assembly can function normally without malfunctioning due to heat, moisture, or external impact.

[0064] The method for manufacturing a circuit board assembly according to one embodiment of the present invention has been described in detail above with reference to Figures 1 to 6. However, the method for manufacturing a circuit board assembly according to one embodiment of the present invention can be modified in various ways, including the following another embodiment (second embodiment).

[0065] 3. Manufacturing method of a circuit board assembly according to another embodiment (second embodiment) of the present invention Fig. 7 is a process flow diagram for explaining a method for manufacturing a circuit board assembly according to another embodiment (second embodiment) of the present invention. Fig. 8 and Fig. 9 are schematic cross-sectional views of each process of the method for manufacturing a circuit board assembly according to another embodiment of the present invention.

[0066] 7, the method for manufacturing a circuit board according to another embodiment of the present invention may include the steps of providing a mold and a circuit board (S210), mounting a predetermined component on the circuit board (S220), providing a mold above the circuit board on which the components are mounted and connecting a container storing a molten protective material to the mold (S230), injecting the molten protective material through the mold to bring the circuit board and the components into contact with the molten protective material (S240), and hardening the protective material to form a protective layer (S250). The method for manufacturing a circuit board according to another embodiment of the present invention will be described in more detail for each process with reference to FIGS. 8 and 9 as follows.

[0067] Here, the second embodiment of the present invention will be described with emphasis on the differences between the method for manufacturing a circuit board assembly according to one embodiment of the present invention and the method for manufacturing a circuit board assembly according to another embodiment of the present invention.

[0068] S210: The process of providing a mold and a circuit board is as follows.

[0069] Providing a mold and a circuit board comprises providing a mold and providing a printed circuit board.

[0070] A mold 130 having recesses corresponding to the shapes of the multiple components 120 and a protrusion corresponding to the surface of the circuit board 110 is prepared.

[0071] The mold 130 may be provided with a predetermined thickness, with recesses formed in portions corresponding to the multiple components 120 following the shapes of the components, and protrusions formed corresponding to the remaining surface of the upper portion of the circuit board 110. That is, the mold 130 may have an uneven structure that matches the components 120 mounted on the circuit board 110 and the upper surface of the circuit board 110. In this case, the recesses of the mold 130 corresponding to the components 120 may be formed larger than the components 130. The distance between the side surface of the component 120 and the inner surface of the recess may be equal to or different from the distance between the top surface of the component 120 and the bottom surface of the recess.

[0072] The mold 130 may be provided with a plurality of pipes 131, 132. The plurality of pipes 131, 132 may be provided extending in the vertical direction so as to penetrate the recessed and protruding portions of the mold 130. In this case, of the plurality of pipes 131, 132, a filter 133 may be provided at the lower opening of the pipe 131 connected to the recessed portion. The filter 133 may exhaust air, and may be formed of a predetermined material and in a predetermined shape that can suppress or block the passage of the molten protective material 140b.

[0073] The step of preparing the mold 130 may further include a step of providing a lower mold 134. The lower mold 134 serves to close the gap between the mold 130 and the periphery of the circuit board 110 during insert injection molding. The lower mold 134 may also be referred to as a lower mold for insert injection molding.

[0074] A printed circuit board (PCB) having a circuit pattern formed thereon is provided on the insulating layer.

[0075] On the other hand, multiple circuit boards 110 may be used in an electric vehicle. That is, a first circuit board on which multiple components having a controller for driving a motor and controlling the electric vehicle are mounted, and a second circuit board on which multiple components having a BMS for managing a battery are mounted may be used in an electric vehicle. In this case, the first circuit board and the second circuit board may be different in size, shape of the circuit pattern, spacing between the circuit patterns, etc.

[0076] S220: At least one component 120 for driving and controlling the electric vehicle is mounted on the circuit board 110. At this time, the component 120 mounted on the circuit board 110 may be in various forms such as a chip or a discrete element.

[0077] S230: The circuit board 110 on which the multiple components 120 are mounted is placed and fixed on a predetermined lower mold 134. A mold 130 having an uneven structure formed following the shape of the components 120 mounted on the circuit board 110 may be provided on the upper side of the lower mold 134. At this time, a container 150 in which the molten protective material 140b is stored may be connected to the mold 130. That is, an injection pipe 161 may be connected to multiple pipes 132 connected to the convex parts of the mold 130, and the container 150 in which the molten protective material 140b is stored may be connected to the injection pipe 161. At this time, an exhaust pipe 162 may be connected to the multiple pipes 131 connected to the concave parts of the mold 130.

[0078] The molten protective material 140b may be provided inside the container 150. The protective material 140a may be a hot melt resin. However, the protective material 140a may be a light curable resin, a thermosetting resin, a wet resin, or a combination of these, in addition to the hot melt resin. The molten protective material 140b may be controlled to a temperature of 200°C to 300°C.

[0079] S240: The molten protective material 140b is injected through the mold 130 to bring the circuit board 110 and the component 120 into contact with the molten protective material 140b. That is, the molten protective material 140b is injected from the container 150 through the injection tube 161 into a plurality of tubes 132 connected to the convex portion of the mold 130, to bring the circuit board 110 and the component 120 into contact with the molten protective material 140b. Air may also be exhausted through the tube 131 formed to penetrate the concave portion. At this time, the molten protective material 140b can be prevented from flowing out to the exhaust tube 162 by the filter 133 provided at the opening of the tube 131 formed to penetrate the concave portion.

[0080] The injection pressure of the molten protective material 140b may be 20 bar, and the injection flow rate may be 1.1 to 2.7 cc / sec, which prevents the component 120 from being damaged by the injection pressure of the molten protective material 140b.

[0081] The mold 130 and the lower mold 134 may be controlled to a predetermined temperature range that is higher than room temperature and lower than the melting temperature of the molten protective material 140b. Specifically, the mold 130 and the lower mold 134 may be controlled to a temperature of 30°C to 50°C. This allows the molten protective material 140b between the mold 130 and the circuit board 110 to have fluidity and to be controlled to a predetermined temperature that does not cause thermal damage to the circuit board 110. For example, the molten protective material 140b between the mold 130 and the circuit board 110 may be cooled and controlled to a predetermined temperature close to 140°C.

[0082] S250: After insert injection molding for a predetermined time, the mold 130 is moved upward and removed. As a result, the protective material 140a remains on the upper part of the circuit board 110 and the side and upper surface of the component 120. The protective material 140a is hardened to form the protective layer 140. A predetermined hardening process may be performed according to the protective material to form the protective layer 140. In the case of hot melt resin, it may be applied at a high temperature and hardened while cooling. In addition, in the case of photo-curable adhesive resin, it may be hardened by ultraviolet (UV), in the case of thermosetting resin, it may be hardened by heating the applied adhesive resin, and in the case of wet resin, it may be hardened by reacting with moisture contained in the air.

[0083] The protective layer 140 may be formed on the circuit board 110 and the components 120 mounted on the circuit board 110 by the process described above. That is, the protective layer 140 may be formed on the side and top surface of the components 120, and on the circuit board 110 exposed because the components 120 are not mounted. In this case, the protective layer 140 may be formed to a thickness corresponding to the separation distance between the circuit board 110 and the components 120 and the mold 130. That is, the protective layer 140 may be formed to a thickness of 5 μm to 1 mm. In this case, the protective layer 140 may have the same thickness on the side and top surface of the components 120 and the top surface of the circuit board 110, or one of them may be different. That is, the protective layer 150 may be formed to the same thickness on the top surface of the circuit board 110, the side and top surface of the components 120. That is, the protective layer 140 may be formed to the same thickness along the step, thereby providing uniform step coverage. Of course, protective layer 140 may be formed to the same thickness on the upper surface of component 120 and the upper surface of circuit board 110, and may be formed to a different thickness on the side surface of component 120. For example, the thicknesses of the upper surface of component 120 and the upper surface of circuit board 120 may be greater than the thicknesses of the side surfaces of the components. Of course, conversely, the thicknesses of the upper surface of component 120 and the upper surface of circuit board 110 may be less than the thicknesses of the side surfaces of the components. Note that protective layer 140 may be formed to a thickness different in at least one region from the other regions.

[0084] As described above, a circuit board assembly manufactured according to another embodiment of the present invention may include a circuit board 110 having a plurality of components 120 mounted thereon, and a protective layer 140 may be formed on the top of the circuit board 110 and the side and top surfaces of the plurality of components 120. The protective layer 140 may be formed by an insert injection molding process using a mold 130 having a concave-convex structure corresponding to the shapes of the circuit board 110 and the plurality of components 120 mounted thereon. The protective layer 140 may be formed to a uniform thickness on the side and top surfaces of the circuit board 110 and the components 120, or at least one region may be formed to a different thickness from the other regions.

[0085] 4. Circuit board assembly manufactured by the method for manufacturing a circuit board assembly according to an embodiment of the present invention and an electric vehicle having the same The circuit board assembly manufactured as described above may be used as a main board on which a controller for driving and controlling an electric vehicle is mounted and a sub-board on which a BMS for managing a battery is mounted, and such a main board and sub-board may be mounted in an electric vehicle including a light electric vehicle. An example of an electric vehicle equipped with such a main board and sub-board manufactured according to the present invention is shown in FIG.

[0086] FIG. 10 is a schematic block diagram of an electric vehicle in which a main board 310 and a sub board 320 are mounted on the circuit board assembly manufactured by the method for manufacturing a circuit board assembly according to an embodiment of the present invention.

[0087] 10, an electric vehicle according to the present invention may include a battery 210 that provides electric energy, a BMS 220 that manages the battery 210, a controller 230 that controls a status of the electric vehicle, an inverter 240 that converts the power of the battery 210, and a motor 250 that drives the electric vehicle. Here, the BMS 220 is a second circuit board assembly of the present invention and constitutes a sub-board 320, and the controller 230 is a first circuit board assembly of the present invention and constitutes a main board 310.

[0088] The battery 210 is an electric energy source that provides driving force to the motor 250 to drive the electric vehicle. The battery 210 may be managed by the BMS 220 and charged by an external power source. Here, the battery 210 may include at least one battery pack, and each of the at least one battery pack may include a plurality of battery modules, and the battery module may include a plurality of battery cells that can be charged and discharged. The plurality of battery modules may be connected in series and / or in parallel in various ways to meet the specifications of the vehicle and the battery pack, and the plurality of battery cells may also be connected in series and / or in parallel. Here, the type of the battery cell is not particularly limited, and may be, for example, a lithium ion battery, a lithium polymer battery, a nickel cadmium battery, a nickel metal hydride battery, a nickel zinc battery, or the like.

[0089] The BMS 220 estimates the status of the battery 210 and manages the battery 210 using the estimated status information. For example, the BMS 220 estimates and manages the status information of the battery 210, such as the state of charge (SOC), state of health (SOH), maximum input / output power allowance, and output voltage of the battery 210. Then, the BMS 220 controls charging or discharging of the battery 210 using such status information. The BMS 220 according to the present invention includes a SOC estimation device for estimating the SOC of the battery. The BMS 220 also controls cell balancing for balancing the state of charge of each battery cell. That is, the battery cell with a relatively high state of charge may be discharged, and the battery cell with a relatively low state of charge may be charged. Meanwhile, the BMS 220 may further include a sensing unit for sensing the status of the battery 210 in order to manage the battery 210 using the BMS 220. The sensing unit may include a current sensor for sensing the current of the battery 210, a voltage sensor for sensing the voltage, and a temperature sensor for sensing the temperature. At this time, at least one current sensor, at least one voltage sensor, and at least one temperature sensor may be provided. Such a BMS220 is mounted on a circuit board, and a protective layer is formed to configure a sub-board. That is, a plurality of components for estimating SOC, a plurality of components for cell balancing, a plurality of components constituting a sensing unit, and passive elements may be mounted on the circuit board, and a protective layer may be formed to configure the sub-board 320. Meanwhile, although not shown, a charge / discharge protection circuit for protecting the battery 210 by controlling the charge / discharge of the battery 210 may be further provided. That is, the charge / discharge protection circuit may be mounted on the sub-board as a component separate from the BMS220.

[0090] The controller 230 is an electronic control device that controls the status of the electric vehicle. For example, the controller 230 determines the degree of torque based on information such as accelerator, brake, and speed, and controls the output of the motor 250 to match the torque information. In addition, the electronic control unit (ECU) 230 enables the battery 210 to be charged or discharged based on status information such as SOC and SOH of the battery 210 received from the BMS 220. For example, if the SOC received from the BMS 220 is 55% or less, the controller 230 controls the charge / discharge switch to output power toward the battery 210 to charge the battery 210, and if the SOC is 55% or more, the controller 230 controls the charge / discharge switch to output power toward the motor 250 to discharge the battery 210. The controller 230 is mounted on a circuit board, and a protective layer is formed to form the main board 310. In addition to the controller 230, communication components for transmitting and receiving signals with the components that make up the electric vehicle, and for transmitting and receiving signals with the battery 210 and the BMS 220, etc. may be mounted on the circuit board, and a protective layer may be formed to form the main board 310.

[0091] The inverter 240 drives the motor 250 based on a control signal from the controller 230 so that the electric vehicle can run.

[0092] The motor 250 uses the electric energy of the battery 210 to drive the electric vehicle based on control information (e.g., torque information) received from the controller 230 .

[0093] The above-mentioned embodiments of the present invention are merely illustrative of the present invention and are not intended to limit the present invention. It should be noted that the configurations and methods disclosed in the above-mentioned embodiments of the present invention may be combined or crossed to be modified in various forms, and these modifications are also considered to be within the scope of the present invention. That is, the present invention may be embodied in various different forms within the scope of the claims and the technical ideas equivalent thereto, and those skilled in the art to which the present invention pertains can understand that various embodiments are possible within the scope of the technical ideas of the present invention. [Explanation of symbols]

[0094] 110: Circuit board 120: Parts 130: Mold 134: Lower mold 140a: Protective substance 140b: Molten protective material 140:Protective layer 150: Container

Claims

1. A step of preparing a mold having recesses corresponding to the shapes of a plurality of components and a protrusion corresponding to a surface of a circuit board; Mounting a plurality of components on a circuit board; providing the mold on the upper side of the circuit board and providing a protective material to be placed on the circuit board; using the mold to position the protective material over the circuit board and the components; curing the protective material to form a protective layer; Including, The step of providing a protective material to be placed on the circuit board includes a step of communicating a container storing molten protective material with the mold; positioning the protective material over the circuit board and the components using the mold includes injecting molten protective material through the mold to contact the circuit board and the components with the molten protective material; The mold is controlled to a predetermined temperature range that is higher than room temperature and lower than the melting temperature of the molten protective material; Among a plurality of tubes formed to penetrate the recessed and protruding portions of the mold, a molten protective material is injected through a tube formed to penetrate the protruding portion, and air is exhausted through a tube formed to penetrate the recessed portion; The method for manufacturing a circuit board assembly, wherein the protective layer is formed to the same thickness on the top of the circuit board and on the side and top surfaces of the component.

2. The method for manufacturing a circuit board assembly according to claim 1 , further comprising the step of exhausting air through a filter provided at an opening of a tube formed to penetrate the recess, thereby suppressing or preventing outflow of the molten protective material.

3. The method for manufacturing a circuit board assembly according to claim 1 or 2, wherein the recess is formed to be deeper than the height of the component and wider than the width of the component.

4. The method for manufacturing a circuit board assembly according to claim 3 , wherein a distance between the recess and the component corresponds to a thickness of the protective layer.

5. The method for manufacturing a circuit board assembly according to claim 1 , wherein the protective material comprises a hot melt resin, a light curable resin, a heat curable resin, a wet resin, or a combination thereof.

6. The method for manufacturing a circuit board assembly according to any one of claims 1 to 5, wherein the protective layer is formed to a thickness of 5 μm to 1 mm.

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