Dual-liquid pump liquid cooling heat dissipation device
The two-liquid pump system addresses inefficiencies in conventional cooling systems by extending radiator tubes and using air-blocking spaces to maintain cooling fluid temperature, improving heat dissipation for server processors.
Patent Information
- Application Number
- JP2023116891
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2023-05-17
- Filing Date
- 2023-07-18
- Publication Date
- 2025-01-31
- Estimated Expiration
- 2043-07-18
AI Technical Summary
Conventional liquid cooling systems for server processors face inefficiencies due to short radiator tubes, insufficient cooling liquid flow, and heat accumulation, leading to reduced cooling efficiency and overheating.
A two-liquid pump system with separate first and second liquid boxes and radiator tube groups, incorporating air-blocking spaces and multiple fans, to enhance cooling fluid flow and prevent heat transfer between thermal and cooling chambers.
Improves cooling efficiency by extending radiator tube length, preventing heat accumulation, and maintaining cooling fluid temperature, thereby enhancing overall heat dissipation performance.
Smart Images

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Abstract
Description
[Technical field]
[0001] The present invention relates to a liquid cooling and heat dissipation device, and more particularly to a dual liquid pump liquid cooling and heat dissipation device for use in servers to cool processors. [Background technology]
[0002] Conventional server processors emit heat during operation, so a liquid cooling system with better cooling effect must be used. A known liquid cooling system (for example, according to Patent Document 1) is a closed liquid circulation system that combines a liquid cooling head, a radiator, a liquid port, and liquid tubes connecting the liquid cooling head, the radiator, and a liquid pump, and has a diversion box on the radiator, a return box, a heat dissipation radiator connected between the diversion box and the return box, and heat dissipation fins, and generally, the inside of the diversion box is divided into a heat liquid chamber and a cooling liquid chamber by a metal partition plate.
[0003] [Patent Document 1] US Patent Publication No. US20090044929 Summary of the Invention [Problem to be solved by the invention]
[0004] The radiator tube of the above-mentioned known liquid cooling radiator is short, and only one liquid pump can flow the liquid therein. However, because the heat dissipating radiator tube is short, the liquid cannot be lowered to a desired low temperature after it flows into the radiator tube. If it is returned to the liquid cooling head, problems remain such as a decrease in cooling efficiency and heat accumulation in the liquid. To solve this problem, in addition to lengthening the radiator tube and heat dissipating fins, the number of fans is increased, so that the liquid flows longer inside the radiator tube to lower the temperature. However, this approach may result in an insufficient amount of liquid cooling inside the radiator tube, which may result in overloading of any one of the liquid ports in the liquid cooling radiator.
[0005] In addition, the hot liquid is transferred to the cooling liquid in the cooling chamber through the metal partition plate in the hot liquid chamber, resulting in the cooling liquid being heated after cooling. Meanwhile, since the space between the hot liquid chamber and the cooling liquid chamber in the prior art is the same, the hot liquid cannot pass through the hot liquid chamber quickly and flow to the heat dissipation radiator, so the thermal energy of the hot liquid is accumulated in the shunt box and transferred to the front of the cooling radiator (including the front of the heat dissipation radiator), causing the cooling liquid to be heated again after heat dissipation. [Means for solving the problem]
[0006] The present invention has been made in view of the above, and has an object to provide a dual liquid pump radiator and a liquid cooling heat dissipation device. The dual liquid pump radiator includes a first liquid box, a second liquid box, and a first radiator tube set and a second radiator tube set connected between the first liquid box and the second liquid box, and the first liquid box and the second liquid box each have a liquid port portion provided inside, so that the liquid port portions of the first liquid box and the second liquid box flow the working liquid and dissipate heat.
[0007] The objective of the present invention is to provide a dual fluid pump liquid cooling heat dissipation device radiator and a liquid cooling heat dissipation device, in which the air-blocking space inside the first liquid box of the dual fluid pump radiator is designed so that the heat liquid flowing into the first liquid box cannot be transferred to the cooling liquid that has already dissipated heat.
[0008] Another object of the present invention is to provide a dual fluid pump liquid cooling heat dissipation device radiator and a liquid cooling heat dissipation device, in which the spatial design of the first liquid box of the dual fluid pump radiator allows the hot liquid flowing into the first liquid box to flow quickly to the first radiator tube group. Effect of the Invention
[0009] (1) The dual liquid pump liquid cooling and heat dissipation device of the present invention improves the overall heat dissipation effect by increasing the total length of the first radiator tube set and the second radiator tube set and the number of fans, and avoids the flow rate reduction and excessive load on a single liquid pump caused by the first radiator tube set and the second radiator tube set being too long.
[0010] The air-blocking space of the present invention prevents the hot liquid in the hot liquid chamber from being transferred to the cooling liquid in the cooling liquid chamber, prevents the cooled cooling liquid from being reheated, and improves the cooling effect of the liquid cooling head.
[0011] (2) The dual fluid pump liquid cooling and heat dissipation device of the present invention can prevent the thermal energy of the heating fluid from being transferred to the cooling fluid, preventing the cooling fluid from being heated again, and improving the cooling effect of the entire liquid cooling and heat dissipation device on the processor.
[0012] (3) The dual fluid pump liquid cooling heat dissipation device of the present invention allows the hot liquid flowing into the first liquid box to quickly flow into the first radiator tube group to dissipate heat, thereby avoiding the heat accumulation phenomenon caused by the hot liquid stagnation in the first liquid box. [Brief description of the drawings]
[0013] [Figure 1]1 is a conceptual diagram illustrating a liquid heat dissipation device according to an embodiment of the present invention being applied to a server device; [Diagram 2] FIG. 2 is a schematic diagram of an assembled liquid cooling device according to an embodiment of the present invention. [Diagram 3] 1 is a first exploded view of a dual liquid pump liquid cooling heat dissipation device according to one embodiment of the present invention; FIG. [Figure 4] FIG. 2 is a second exploded view of a dual liquid pump liquid cooling heat dissipation device according to one embodiment of the present invention. [Diagram 5] FIG. 2 is an exploded image diagram of a first liquid box of a liquid cooling device according to an embodiment of the present invention. [Figure 6] 4 is an image diagram of the operation of the first liquid box of the liquid cooling device according to the embodiment of the present invention. FIG. [Figure 7] FIG. 2 is an exploded image diagram of a second liquid box of a liquid cooling device according to an embodiment of the present invention. [Figure 8] 5 is an image diagram of the operation of the second liquid box of the liquid cooling device according to the embodiment of the present invention. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS EXAMPLES
[0014] 1 and 2, the dual liquid pump liquid cooling heat dissipation radiator 100 of the present invention is assembled into a liquid cooling heat dissipation device 100 by a liquid cooling head 200 and two liquid tubes 300. The liquid cooling head 200 is attached to a processor 500 to provide cooling and heat dissipation.
[0015] Please refer to Figures 3 and 4. A preferred embodiment of the dual liquid pump liquid cooling heat dissipation radiator 100 according to the present invention includes a first liquid box 10, a second liquid box 20, and a first radiator tube set 30 and a second radiator tube set 40 arranged in parallel between the first liquid box 10 and the second liquid box 20. The first radiator tube set 30 and the second radiator tube set 40 each have a plurality of flat tubes 31, 41 arranged vertically and spaced apart, and heat dissipation fins 32, 42 welded to both the upper and lower surfaces of each of the flat tubes 31, 32. When the first radiator tube set 30 and the second radiator tube set 40 are assembled, the first ends of the flat tubes 31, 41 are connected to the first liquid box 10, and the second ends are connected to the second liquid box 20.
[0016] Continuing to refer to Figures 5 and 6, the first liquid box 10 forms a hollow sealed metal box inside, and an air-blocking space 11 is provided inside the first liquid box 10, which separates the inside of the first liquid box 10 into a first heat liquid chamber 12 and a first cooling liquid chamber 13, and the first heat liquid chamber 12 and the first cooling liquid chamber 13 are made smaller in space than each other, so that the heat liquid flows into the first heat liquid chamber 12 and then quickly flows into the first radiator tube set 30, thereby preventing heat energy from accumulating in the first liquid box 10. A liquid inlet hole 14 communicating with the first heat liquid chamber 12 and a liquid outlet hole 15 communicating with the first cooling liquid chamber 13 are provided on the box wall of the first liquid box 10. A first liquid pump 50 is provided inside the first hot liquid chamber 12 or the first cooling liquid chamber 13 of the first liquid box 10, and when the first liquid pump 50 is operated, it flows the cooling liquid (hot liquid) that has been heated inside the liquid cooling head 200 through one of the liquid tubes 300 and the liquid inlet hole 14 into the first hot liquid chamber 12, and then again into the flat tubes 31 of the first radiator tube set 30, and from each flat tube 31 to the second liquid box 20. In this process, the first radiator tube group 30 is used to dissipate heat for the first time to lower the temperature, and when the first liquid pump 50 is operated, the cooling liquid inside the second liquid box 20 flows through the flat tube 41 of the second radiator tube group 40 to the first cooling liquid chamber 13, and then the second radiator tube group 40 is used to dissipate heat for the second time to lower the temperature, and the cooling liquid (cooling liquid) that has dissipated heat and lowered the temperature is transported again through the liquid outlet hole 15 and another liquid tube 300 to the liquid cooling head 200, to cool the processor 500 again.
[0017] 7 and 8. The second liquid box 20 is a hollow sealed metal box, and a second partition plate 21 is provided inside the second liquid box 20, which divides the inside of the second liquid box 20 into a second hot liquid chamber 22 and a second hot liquid chamber 23. A second liquid pump 60 is provided inside the second liquid chamber 22 or the second cooling liquid chamber 23, and the second liquid pump 60 operates to flow the cooling liquid (the hot liquid whose temperature has been lowered the first time) inside the flat tubes 31 of the first radiator tube set 30 into the second hot liquid chamber 22, and the cooling liquid in the second cooling liquid chamber 23 into the flat tubes 41 of the second radiator tube set 40, and then the second radiator tube set 40 is used to dissipate heat a second time, lower the temperature, and turn the liquid into cooling liquid, which then flows into the first cooling chamber 13 of the first liquid box 10. In an embodiment of the present invention, by using the first liquid pump 50 and the second liquid pump 60 to operate simultaneously, the flow rate reduction and excessive liquid pump load that occur after the radiator tube set is lengthened can be overcome, and the lengths of the first radiator tube set 30 and the second radiator tube set 40 can be increased, and more fans 80 can be installed in parallel.
[0018] The air-blocking space 11 of the first liquid box 10 forms an L-shaped bent space, with one end of the air-blocking space 11 adjacent to the inner surface of the front wall of the first liquid box 10, the other end of the air-blocking space 11 adjacent to the inner wall of one side of the first liquid box 10, and the lower end of the air-blocking space 11 adjacent to the inner surface of the lower wall of the first liquid box 10. In a preferred embodiment, the air-shielding space 11 includes a heat liquid refracting partition plate 111 and a cooling liquid refracting partition plate 112 arranged at intervals, one end of the heat liquid refracting partition plate 111 and the cooling liquid refracting partition plate 112 are welded to the inside of the front wall between the liquid inlet hole 14 and the liquid outlet hole 15, the other ends are welded to the inner surface of the side wall of the first liquid box 10 between the first radiator tube 39 and the second radiator tube 40, and the lower ends are welded to the inner surface of the bottom wall of the first liquid box 10, so that the air-shielding space 11 is located between the heat liquid refracting partition plate 111 and the cooling liquid refracting partition plate 112. Since the thermal conductivity of air is 0.025 W / mK while the thermal conductivity of aluminum is 237 W / mK, the air blocking space 11 of the present invention can effectively prevent the hot liquid in the first cooling liquid chamber 12 from being transferred to the cooling liquid in the first cooling liquid chamber 13 of the partition wall, prevent the cooling liquid from being heated again after its temperature is reduced, and ensure the efficiency of the cooling liquid when it flows into the liquid cooling head 200.
[0019] 5 and 7. The first liquid box 10 and the second liquid box 20 are each composed of a box body 16, 24 and a box lid 17, 25. The box bodies 16, 24 are combined to form a rectangular box body with an upper opening, and the box lids 17, 25 are preferably rectangular box bodies with an upper opening. The front wall of the first liquid box 10 is provided with a liquid inlet hole 14 and a liquid outlet hole 15, and the liquid inlet hole 14 and the liquid outlet hole 15 are respectively connected to quick release tubes. 1 The side walls of the box body 16 of the first fluid box 10 and the box body 24 of the second fluid box 20 are respectively provided with a row of first radiator tube insertion holes 18, 26 and a row of second radiator tube insertion holes 19, 27. B group30 and the flat tubes 31 and 41 of the second radiator tube set 40 are respectively 1 The radiator tubes are inserted into the radiator tube insertion holes 18, 26 and the second radiator tube insertion holes 19, 27 and welded in place.
[0020] 5 and 7, the first liquid pump 50 and the second liquid pump 60 are installed. In a preferred embodiment of the present invention, the inner surface of each box cover 17, 25 is provided with a protruding liquid pump base 171, 251, and the corresponding outer surface is provided with a recessed liquid pump chamber 172, 252 extending from the liquid pump base 171, 251, so that the first liquid pump 50 is provided with a liquid pump chamber 172, and the second liquid pump 60 is provided with another liquid pump chamber 252. 2 Inside the first entrance 173 and a first outlet 174 are provided. entrance 173 communicates with the first cooling liquid chamber 13 and connects the first outlet 174 to the quick release tube 151 of the liquid outlet hole 15. A second liquid pump chamber 252 is disposed inside the other liquid pump chamber 252. entrance 253 and a second outlet 254 are provided. entrance 253 communicates with the second hot liquid chamber 22 and the second outlet 254 communicates with the second cold liquid chamber 23 .
[0021] 2 and 3, in one preferred embodiment of the dual fluid pump liquid cooling heat dissipation radiator 100 of the present invention, two fan racks 70 and a number of fans 80 are implemented. The two fan racks 70 are covered with metal plates at the upper and lower ends of the first radiator tube group 30 and the second radiator tube group 40 to form a dual liquid pump liquid cooling heat dissipation radiator 100 with an air input end 101 and an air output end 102. The air input end 101 is located between the first liquid box 10 and the front wall of the second liquid box 20, and the air output end 102 is located between the first liquid box 10 and the rear wall of the second liquid box 20. A number of fans 80 are arranged in parallel and fixed between the two fan racks 70 at the air input end 101 and / or the air output end 102. The cold air flows from the air input end 101 to each heat dissipation fin 32, 42 and then flows out again from the air output end 102, thereby lowering the temperature of the cooling liquid flowing inside the first radiator tube group 30 and the second radiator tube group 40. [Explanation of symbols]
[0022] 100 Dual Fluid Pump Liquid Cooling Heat Dissipation Radiator 101 Air input end 102 Air output end 200 Liquid Cooling Head 300 Liquid Tube 400 Server 500 processor 10 First Liquid Box 11 Air-tight space 111 Liquid refractive partition plate 112 Cooling refractive partition plate 12 First hot liquid chamber 13 First cooling liquid chamber 14 Liquid inlet hole 141 Quick Release Tube 15 Liquid outlet hole 151 Quick Release Tube 16 Box body 17 Box Lid 171 Liquid Pump Base 172 Liquid Pump Chamber 173 Entrance 1 174 Exit 1 18 First radiator tube insertion hole 19 Second radiator tube insertion hole 20 Second Liquid Box 21 Second liquid partition plate 22 Second hot liquid chamber 23 Second cooling liquid chamber 24 Box body 25 Box Lid 251 Liquid Pump Base 252 Liquid Pump Chamber 253 Second Entrance 254 Exit 2 26 First radiator tube insertion hole 27 Second radiator tube insertion hole 30 1st radiator tube assembly 31 Flat Tube 32 Heat dissipation fin 40 2nd radiator tube assembly 41 Flat Tube 42 Heat dissipation fin 50 First Liquid Pump 60 Second Liquid Pump 70 Fan Rack 80 Fans
Claims
1. The vehicle comprises a first fluid box (10), a second fluid box (20), a first radiator tube set (30), and a second radiator tube set (40); The first radiator tube set and the second radiator tube set are arranged in parallel in the front and rear between the first liquid box and the second liquid box, the first radiator tube set and the second radiator tube set each have a plurality of flat tubes (41) arranged vertically at intervals, heat dissipation fins (32, 42) are welded to both the upper and lower surfaces of the flat tube, first ends of the flat tubes are connected to the first liquid box, and second ends of the flat tubes are connected to the second liquid box, An air-blocking space (11) is provided inside the first liquid box, and the air-blocking space divides the inside of the first liquid box into a first heat liquid chamber (12) and a first cooling liquid chamber (13), the space of the first heat liquid chamber being smaller than the space of the first cooling liquid chamber, and the wall of the first liquid box has a liquid inlet hole (14) communicating with the first heat liquid chamber and a liquid outlet hole (15) of the first cooling liquid chamber communicating with the first cooling liquid chamber, and a first liquid pump (50) is provided inside the first liquid box, and the first liquid pump causes cooling liquid to flow from the liquid inlet hole through the first heat liquid chamber to the flat tube of the first radiator tube set and into the second liquid box, the cooling liquid flowing into the second liquid box flows into the first liquid box through each of the flat tubes of the second radiator tube set, and the cooling liquid flowing into the first liquid box flows into the liquid outlet hole of the first cooling liquid chamber, a second liquid partition plate (21) is provided inside the second liquid box, the second liquid box being divided into a second heat liquid chamber (22) and a second cooling liquid chamber (23) by the second liquid partition plate, a second liquid pump (60) is provided inside the second liquid box, and the second liquid pump causes the cooling liquid inside the flat tubes of the first radiator tube set to flow into the second heat liquid chamber and then into the second cooling liquid chamber, and causes the cooling liquid in the second cooling liquid chamber to flow into the flat tubes of each of the second radiator tube set and then back into the first cooling liquid chamber of the first liquid box.
2. 2. The dual fluid pump liquid cooling heat dissipation device of claim 1, wherein said first liquid pump is located in said first cooling liquid chamber and said second liquid pump is located in said second cooling liquid chamber.
3. 3. A dual liquid pump liquid cooling and heat dissipation device as described in claim 2, characterized in that the air blocking space forms a curved space, one end of the air blocking space is adjacent to the inner surface of the front wall of the first liquid box, the other end of the air blocking space is adjacent to the inner wall of one side of the first liquid box, and the lower end of the air blocking space is adjacent to the inner surface of the lower wall of the first liquid box.
4. 2. The dual liquid pump liquid cooling heat dissipation device according to claim 1, wherein the first liquid box and the second liquid box are respectively assembled by a box body (24) and a box lid (25), the box body being a rectangular box body with an open upper end, and the box lid being a rectangular box lid covering the opening at the upper end, the front wall of the box body of the first liquid box is provided with the liquid inlet hole and the liquid outlet hole, the liquid inlet hole and the liquid outlet hole are respectively connected to a quick release tube (151), the side walls corresponding to the box bodies of the first liquid box body and the second liquid box are respectively provided with a first radiator tube insertion hole (18) and a second radiator tube insertion hole (19), and the flat tubes of the first radiator tube set and the second radiator tube set are respectively inserted into the first radiator tube insertion hole and the second radiator tube insertion hole.
5. 5. The dual liquid pump liquid cooling and heat dissipation device according to claim 4, characterized in that the air blocking space includes a thermal liquid refraction partition plate (111) and a cooling liquid refraction partition plate (112) arranged at intervals, one end of the thermal liquid refraction partition plate and the cooling liquid refraction partition plate are welded to the inside of the front wall between the liquid inlet hole and the liquid outlet hole, the other end is welded to the inner surface of the first liquid box side wall between the first radiator tube insertion hole and the second radiator tube insertion hole, and the lower end is welded to the inner surface of the bottom wall of the first liquid box, thereby positioning the air blocking space between the thermal liquid refraction partition plate and the cooling liquid refraction partition plate.
6. 5. The dual fluid pump liquid cooling and heat dissipation device according to claim 4, characterized in that the inner surface of the box lid is provided with a protruding liquid pump base (171), and the outer surface of the box lid is provided with a recessed liquid chamber extending to the liquid pump base; the first liquid pump is provided in the liquid pump chamber (172) of the box lid of the first liquid box, the second liquid pump is provided in the liquid pump chamber of the box lid of the second liquid box, a first inlet (173) and a first outlet (174) are provided inside the liquid chamber of the first liquid box, the first inlet is connected to the first cooling liquid chamber, the first outlet is connected to the quick release tube of the liquid outlet hole, and a second inlet (253) and a second outlet (254) are provided inside the liquid chamber of the second liquid box, the second inlet is connected to the second hot liquid chamber, and the second outlet is connected to the second cooling liquid chamber.
7. 2. The dual liquid pump liquid cooling heat dissipation device of claim 1, further comprising two fan racks (70) and a plurality of fans, the two fan racks being arranged at both upper and lower ends of the first radiator tube set and the second radiator tube set to form an air input end and an air output end, the fans being fixed in parallel to the two fan racks provided at the air input end to blow air to the air input end of the heat dissipation fins.
8. A dual liquid pump liquid cooling heat dissipation device as described in claim 1, characterized in that it is combined with a liquid cooling head (200) and two cooling liquid tubes (300), the liquid cooling head is used for attaching to a surface of a processor (500), one ends of the two cooling liquid tubes are each connected to the liquid cooling head, and the other ends of the two cooling liquid tubes are each connected to a quick release tube coupled to the liquid inlet hole and the liquid outlet hole.
Citation Information
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