Semiconductor Device

Abstract

The present invention provides a semiconductor device that reduces inductance in a circuit in which a plurality of semiconductor packages are connected to each other in series. A first terminal is provided on a first surface of a first semiconductor package, and is electrically connected to a first pole side of a first semiconductor chip. A first output terminal is provided on a second surface of the first semiconductor package, and is electrically connected to a second pole side of the first semiconductor chip. A second output terminal is provided on a third surface of a second semiconductor package, and is electrically connected to the first pole side of a second semiconductor chip. A second terminal is provided on the third surface of the second semiconductor package, and is electrically connected to the second pole side of the second semiconductor chip. The first output terminal is connected to the second output terminal. A bus bar is connected to the second terminal, and extends from the second terminal toward the first surface provided with the first terminal.

Description

[Technical field]

[0001] The present disclosure relates to a semiconductor device. [Background technology]

[0002] A structure in which two semiconductor devices are connected in series to each other is applied to various control systems such as power control devices. In the semiconductor assembly described in Patent Document 1, two semiconductor devices having a common design are connected in series to each other. In each semiconductor device, a positive terminal is provided on one side and a negative terminal is provided on the other side. The negative terminal of one of the series-connected semiconductor assemblies is folded back on that side and extends toward the positive terminal, passing above the two semiconductor devices. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] U.S. Patent No. 10,304,770 Summary of the Invention [Problem to be solved by the invention]

[0004] In a structure in which a plurality of semiconductor packages, each including a switching element, are connected in series with one another, the path of the bus bar for guiding one terminal toward the other terminal becomes longer, resulting in increased inductance.

[0005] In order to solve the above-mentioned problems, the present disclosure provides a semiconductor device that reduces the inductance of a circuit in which a plurality of semiconductor packages are connected in series with each other. [Means for solving the problem]

[0006] The semiconductor device according to the present disclosure includes a first semiconductor package, a first terminal, a first output terminal, a second semiconductor package, a second output terminal, a second terminal, and a bus bar. The first semiconductor package includes a first semiconductor chip. The first terminal is provided on a first surface of the first semiconductor package. The first terminal is electrically connected to a first pole side of the first semiconductor chip. The first output terminal is provided on a second surface of the first semiconductor package. The first output terminal is electrically connected to a second pole side of the first semiconductor chip. The second semiconductor package includes a second semiconductor chip. The second output terminal is provided on a third surface of the second semiconductor package. The second output terminal is electrically connected to a first pole side of the second semiconductor chip. The second terminal is provided on the third surface of the second semiconductor package. The second terminal is electrically connected to a second pole side of the second semiconductor chip. The bus bar is connected to the second terminal. The first output terminal is connected to the second output terminal. The bus bar extends from the second terminal in a direction toward the first surface on which the first terminal is provided. Effect of the Invention

[0007] According to the semiconductor device of the present disclosure, the inductance of a circuit in which a plurality of semiconductor packages are connected in series to one another is reduced.

[0008] The objects, features, aspects, and advantages of the present disclosure will become more apparent from the following detailed description and the accompanying drawings. [Brief description of the drawings]

[0009] [Figure 1] FIG. 2 is a circuit diagram showing an example of a configuration of a three-phase inverter. [Diagram 2] 2 is a cross-sectional view showing a configuration of a semiconductor package for an upper arm of the semiconductor device in the first embodiment. [Diagram 3] 1A and 1B are diagrams illustrating an internal structure of a semiconductor package for an upper arm. [Figure 4] 1A and 1B are diagrams illustrating a configuration of a semiconductor package for an upper arm. [Diagram 5] 1A and 1B are diagrams illustrating an internal structure of a semiconductor package for a lower arm. [Figure 6] 1A and 1B are diagrams illustrating a configuration of a semiconductor package for a lower arm. [Figure 7] 11A and 11B are diagrams illustrating a connection configuration between an upper arm semiconductor package and a lower arm semiconductor package. [Figure 8] 1 is a diagram showing a configuration of a semiconductor device in a first embodiment. [Figure 9] FIG. 11 is a diagram showing a configuration of a semiconductor device in a second embodiment. [Figure 10] FIG. 11 is a diagram showing a configuration of a semiconductor device in a third embodiment. [Figure 11] 11A and 11B are diagrams illustrating a connection configuration between an upper arm semiconductor package and a lower arm semiconductor package. [Figure 12] 1A and 1B are diagrams illustrating a configuration of a semiconductor package for an upper arm. [Figure 13] 1A and 1B are diagrams illustrating a configuration of a semiconductor package for a lower arm. [Figure 14] 1A and 1B are diagrams illustrating an internal structure of a semiconductor package for an upper arm. [Figure 15] 1A and 1B are diagrams illustrating an internal structure of a semiconductor package for a lower arm. [Figure 16] 4 is a plan view showing an internal structure of a semiconductor package for an upper arm. FIG. [Figure 17] 4 is a plan view showing an internal structure of a semiconductor package for the lower arm. FIG. [Figure 18] FIG. 13 is a diagram showing a configuration of a semiconductor device in a fourth embodiment. [Figure 19] 13 is a side view showing an example of a holding structure for a semiconductor chip in embodiment 5. FIG. [Figure 20] 13 is a diagram showing an example of the configuration of a semiconductor package for an upper arm and a bus bar in the sixth embodiment. FIG. [Figure 21] 1A and 1B are diagrams illustrating an example of a configuration of an upper arm semiconductor package and a bus bar. [Figure 22] 13 is a plan view showing an internal structure of a semiconductor package for an upper arm in embodiment 7. FIG. [Figure 23]4 is a plan view showing an internal structure of a semiconductor package for the lower arm. FIG. [Figure 24] FIG. 13 is a diagram showing a configuration of a semiconductor device in an eighth embodiment. [Diagram 25] 13 is a plan view showing the internal structure of a semiconductor package for an upper arm in a ninth embodiment. FIG. [Figure 26] 4 is a plan view showing an internal structure of a semiconductor package for the lower arm. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] <Embodiment 1> 1 is a circuit diagram showing an example of the configuration of a three-phase inverter. The three-phase inverter includes three upper arm semiconductor packages 111 and three lower arm semiconductor packages 121. Each of the upper arm semiconductor package 111 and the lower arm semiconductor package 121 includes a switching element 10. One upper arm semiconductor package 111 and one lower arm semiconductor package 121 are connected in series to each other to form one leg.

[0011] Fig. 2 is a cross-sectional view showing the configuration of upper arm semiconductor package 111 of the semiconductor device in embodiment 1. Fig. 3 is a diagram showing the internal structure of upper arm semiconductor package 111. Fig. 4 is a diagram showing the configuration of upper arm semiconductor package 111. However, in Fig. 2, the positional relationship in the height direction and the positional relationship in the depth direction of P terminal 13, first AC terminal 14, and control terminal 15 are shown in a simplified manner and are different from the original positional relationship in embodiment 1 shown in Fig. 3.

[0012] Upper arm semiconductor package 111 includes insulating substrate 11 , first semiconductor chip 12 , P terminal 13 , first AC terminal 14 , control terminal 15 and sealing material 16 .

[0013] Insulating substrate 11 includes a metal pattern 17 on its surface. Insulating substrate 11 holds first semiconductor chip 12 on metal pattern 17 via bonding material 18A. Insulating substrate 11 is formed of, for example, ceramic.

[0014] The first semiconductor chip 12 includes a switching element 10. The first semiconductor chip 12 is formed of, for example, a semiconductor such as Si, or a so-called wide band gap semiconductor such as SiC, GaN, or gallium oxide. The first semiconductor chip 12 is a so-called power semiconductor chip. The first semiconductor chip 12 has an IGBT (Insulated Gate Bipolar Transistor) formed as the switching element 10. The switching element 10 may be an RC-IGBT (Reverse-Conducting IGBT) in which an IGBT and a free wheel diode are formed in one semiconductor substrate. Alternatively, the switching element 10 may be a MOSFET (Metal Oxide Semiconductor Field Effect Transistor) or the like.

[0015] The P terminal 13 is formed of, for example, a metal frame. The metal frame is formed of a metal flat plate or a metal plate formed by shaping the metal flat plate. One end of the P terminal 13 is connected to the metal pattern 17 by a bonding material 18B. That is, the P terminal 13 is electrically connected to the first electrode side of the first semiconductor chip 12 via the metal pattern 17. The first electrode side is the collector side of the IGBT. The other end of the P terminal 13 protrudes from the first side A of the upper arm semiconductor package 111. In other words, the P terminal 13 is provided on the first side A of the upper arm semiconductor package 111. The P terminal 13 is a positive terminal.

[0016] The first AC terminal 14 is formed of, for example, a metal frame. One end of the first AC terminal 14 is connected to a surface electrode (not shown) of the first semiconductor chip 12 by the bonding material 18C. That is, the first AC terminal 14 is electrically connected to the second pole side of the first semiconductor chip 12. The surface electrode is an emitter electrode, and the second pole side is the emitter side of the IGBT. The other end of the first AC terminal 14 protrudes from the second side B of the upper arm semiconductor package 111. In other words, the first AC terminal 14 is provided on the second side B different from the first side A on which the P terminal 13 is provided. In the first embodiment, the sealing material 16 forming the outer shape of the upper arm semiconductor package 111 has a rectangular shape in a plan view. The first side A and the second side B are surfaces that face each other in the rectangle. The first AC terminal 14 is a negative terminal.

[0017] The control terminal 15 is a terminal for transmitting a control signal related to the control of the switching element 10 included in the first semiconductor chip 12. The control terminal 15 is connected to the first semiconductor chip 12 via, for example, a control wire 19. Note that the control wire 19 is not shown in FIG. 3. A plurality of control terminals 15 may be provided. A portion of the control terminal 15 protrudes from the first side surface A of the upper arm semiconductor package 111.

[0018] Sealing material 16 seals metal pattern 17 of insulating substrate 11, first semiconductor chip 12, part of P terminal 13, part of first AC terminal 14, and part of control terminal 15. Sealing material 16 is, for example, a resin. Sealing material 16 is formed by, for example, molding. Sealing material 16 has a rectangular shape in a plan view.

[0019] Fig. 5 is a diagram showing the internal structure of the lower arm semiconductor package 121. Fig. 6 is a diagram showing the configuration of the lower arm semiconductor package 121.

[0020] The lower arm semiconductor package 121 includes an insulating substrate 21, a second semiconductor chip 22, a second AC terminal 23, an N terminal 24, a control terminal 25, and a sealing material 26. Although a diagram showing a cross-sectional configuration of the lower arm semiconductor package 121 is omitted, the configurations of the insulating substrate 21, the metal pattern 27, and the sealing material 26 are similar to the configurations of the insulating substrate 11, the metal pattern 17, and the sealing material 16 of the upper arm semiconductor package 111, respectively.

[0021] The second semiconductor chip 22 includes a switching element 10. The configuration of the second semiconductor chip 22 is, for example, the same as the configuration of the first semiconductor chip 12. The second semiconductor chip 22 is held on a metal pattern 27 of the insulating substrate 21 via a bonding material 28A.

[0022] The second AC terminal 23 is formed of, for example, a metal frame. One end of the second AC terminal 23 is connected to the metal pattern 27 by the bonding material 28B. That is, the second AC terminal 23 is electrically connected to the first electrode side of the second semiconductor chip 22 via the metal pattern 27. The first electrode side is the collector side of the IGBT. The other end of the second AC terminal 23 protrudes from the third side surface C of the lower arm semiconductor package 121. In other words, the second AC terminal 23 is provided on the third side surface C of the lower arm semiconductor package 121. The second AC terminal 23 is a positive terminal.

[0023] The N terminal 24 is formed of, for example, a metal frame. One end of the N terminal 24 is connected to a surface electrode (not shown) of the second semiconductor chip 22 by a bonding material 28C. That is, the N terminal 24 is electrically connected to the second pole side of the second semiconductor chip 22. The surface electrode is an emitter electrode, and the second pole side is the emitter side of the IGBT. The other end of the N terminal 24 protrudes from the third side face C of the lower arm semiconductor package 121. The N terminal 24 is provided on the same surface as the third side face C on which the second AC terminal 23 is provided. The N terminal 24 is a negative terminal.

[0024] The control terminal 25 is a terminal for transmitting a control signal related to the control of the switching element 10 included in the second semiconductor chip 22. The control terminal 25 is connected to the second semiconductor chip 22 via, for example, a control wire (not shown). A plurality of control terminals 25 may be provided. A part of the control terminal 25 protrudes from the fourth side surface D of the lower arm semiconductor package 121. In the first embodiment, the sealing material 26 forming the outer shape of the lower arm semiconductor package 121 has a rectangular shape in a plan view. The third side surface C and the fourth side surface D are surfaces that face each other in the rectangle.

[0025] The sealing material 26 seals the metal pattern 27 of the insulating substrate 21, the second semiconductor chip 22, a portion of the second AC terminal 23, a portion of the N terminal 24, and a portion of the control terminal 25. The sealing material 26 is, for example, a resin. The sealing material 26 is formed, for example, by molding. The sealing material 26 has a rectangular shape in a plan view.

[0026] Fig. 7 is a diagram showing a connection configuration between the upper arm semiconductor package 111 and the lower arm semiconductor package 121. Fig. 8 is a diagram showing a configuration of the semiconductor device 101 in the first embodiment.

[0027] The upper arm semiconductor package 111 is disposed so that its second side surface B faces the third side surface C of the lower arm semiconductor package 121. The first AC terminal 14 is connected to the second AC terminal 23. As a result, the switching element 10 of the upper arm semiconductor package 111 and the switching element 10 of the lower arm semiconductor package 121 are connected in series to each other. When the semiconductor device 101 is incorporated in an inverter circuit, AC wiring for supplying power to a load is connected to the first AC terminal 14 or the second AC terminal 23.

[0028] Bus bar 31 is connected to N terminal 24 of lower arm semiconductor package 121. Bus bar 31 extends from N terminal 24 in the direction of first side surface A on which P terminal 13 is provided. Bus bar 31 in the first embodiment is disposed on the upper surface of upper arm semiconductor package 111. In other words, bus bar 31 extends from N terminal 24 across the upper surface of upper arm semiconductor package 111 in the direction of first side surface A.

[0029] The busbar 31 includes a busbar terminal portion 31A on the first side surface A side of the upper arm semiconductor package 111. The busbar terminal portion 31A is arranged alongside the P terminal 13 of the upper arm semiconductor package 111. The busbar terminal portion 31A has the same potential as the N terminal 24 of the lower arm semiconductor package 121.

[0030] In summary, the semiconductor device 101 in the first embodiment includes an upper arm semiconductor package 111, a P terminal 13, a first AC terminal 14, a lower arm semiconductor package 121, a second AC terminal 23, an N terminal 24, and a bus bar 31. The upper arm semiconductor package 111 includes a first semiconductor chip 12. The P terminal 13 is provided on a first side surface A as an example of a first surface of the upper arm semiconductor package 111. The P terminal 13 is electrically connected to a first pole side of the first semiconductor chip 12. The first AC terminal 14 is provided on a second side surface B as an example of a second surface of the upper arm semiconductor package 111. The first AC terminal 14 is electrically connected to a second pole side of the first semiconductor chip 12. The lower arm semiconductor package 121 includes a second semiconductor chip 22. The second AC terminal 23 is provided on a third side surface C as an example of a third surface of the lower arm semiconductor package 121. The second AC terminal 23 is electrically connected to a first pole side of the second semiconductor chip 22. The N terminal 24 is provided on a third side surface C, which is an example of a third surface of the lower arm semiconductor package 121. The N terminal 24 is electrically connected to the second pole side of the second semiconductor chip 22. The bus bar 31 is connected to the N terminal 24. The first AC terminal 14 is connected to the second AC terminal 23. The bus bar 31 extends from the N terminal 24 in the direction of the first side surface A, which is an example of a first surface on which the P terminal 13 is provided.

[0031] When the switching element 10 included in the first semiconductor chip 12 and the second semiconductor chip 22 is an IGBT, the first pole side is the collector side of the IGBT, and the second pole side is the emitter side. When the switching element 10 is a MOSFET, the first pole side is the drain side of the MOSFET, and the second pole side is the source side.

[0032] Such a semiconductor device 101 reduces the inductance in a circuit in which the upper arm semiconductor package 111 and the lower arm semiconductor package 121 are connected in series to each other.

[0033] In the first embodiment, an example in which the semiconductor device 101 is applied to a three-phase inverter has been shown. However, the device in which the semiconductor device 101 is incorporated is not limited to a three-phase inverter. The semiconductor device 101 can be applied to systems in which a plurality of semiconductor packages are connected in series, such as other power control devices and signal processing devices, and such systems achieve the same effects as those described above. In addition, the first pole side may be the negative pole side, and the second pole side may be the positive pole side.

[0034] <Embodiment 2> The second embodiment is a subordinate concept to the first embodiment. In the second embodiment, the same components as those in the first embodiment are given the same reference numerals, and detailed description thereof will be omitted.

[0035] 9 is a diagram showing a configuration of a semiconductor device 102 in embodiment 2. The semiconductor device 102 includes a third AC terminal 29 in a lower arm semiconductor package 122. An upper arm semiconductor package 112 is the same as the upper arm semiconductor package 111 in embodiment 1.

[0036] The third AC terminal 29 is formed of, for example, a metal frame. Although the internal structure of the lower arm semiconductor package 122 is not shown, one end of the third AC terminal 29 is connected to the metal pattern 27 by a bonding material. That is, the third AC terminal 29 is electrically connected to the first pole side of the second semiconductor chip 22 via the metal pattern 27. The first pole side is the collector side of the IGBT. The other end of the third AC terminal 29 protrudes from the fourth side surface D of the lower arm semiconductor package 122. That is, the third AC terminal 29 is provided on the fourth side surface D, which is an example of a fourth surface different from the third side surface C on which the second AC terminal 23 is provided. The third AC terminal 29 has the same potential as the second AC terminal 23.

[0037] In such a semiconductor device 102, since an AC wiring for supplying power to a load can be connected between the first side face A and the third side face C, or on the fourth side face D side, the AC wiring can be easily taken out.

[0038] <Embodiment 3> The third embodiment is a subordinate concept to the first embodiment. In the third embodiment, the same components as those in the first or second embodiment are given the same reference numerals, and detailed description thereof will be omitted.

[0039] FIG. 10 is a diagram showing a configuration of semiconductor device 103 in embodiment 3. FIG. 11 is a diagram showing a connection configuration between upper arm semiconductor package 113 and lower arm semiconductor package 123. FIG. 12 is a diagram showing a configuration of upper arm semiconductor package 113. FIG. 13 is a diagram showing a configuration of lower arm semiconductor package 123. FIG. 14 is a diagram showing an internal structure of upper arm semiconductor package 113. FIG. 15 is a diagram showing an internal structure of lower arm semiconductor package 123. FIG. 16 is a plan view showing an internal structure of upper arm semiconductor package 113. FIG. 17 is a plan view showing an internal structure of lower arm semiconductor package 123.

[0040] P terminal 13 includes two P terminal elements 13A. Two P terminal elements 13A are separate members, each formed of a metal frame. P terminal element 13A is connected to metal pattern 17 via bonding material 18B. Two P terminal elements 13A protrude from two locations on first side surface A of upper arm semiconductor package 113. Two P terminal elements 13A are arranged on both sides of control terminal 15.

[0041] Similar to the first embodiment, the first AC terminal 14 is electrically connected to the second electrode side of the first semiconductor chip 12 by the bonding material 18C. The first AC terminal 14 in the third embodiment includes two first AC terminal portions 14A that branch out inside the upper arm semiconductor package 113 and protrude from two points on the second side surface B.

[0042] The second AC terminal 23 includes two second AC terminal elements 23A. The two second AC terminal elements 23A are separate members, each formed of a metal frame. The second AC terminal elements 23A are connected to the metal pattern 27 via a bonding material 28B. The two second AC terminal elements 23A protrude from two locations on the third side surface C of the lower arm semiconductor package 123. The two second AC terminal elements 23A are disposed on both sides of the N terminal 24. The second AC terminal elements 23A are connected to the first AC terminal portion 14A.

[0043] The third AC terminal 29 includes two third AC terminal elements 29A. The two third AC terminal elements 29A are separate members, each formed of a metal frame. The third AC terminal element 29A is connected to the metal pattern 27 via a bonding material 28D. The two third AC terminal elements 29A protrude from two locations on the fourth side surface D of the lower arm semiconductor package 123. The two third AC terminal elements 29A are arranged on both sides of the control terminal 25.

[0044] The bus bar 31 includes two bus bar terminal portions 31A on the first side surface A side of the semiconductor package 113 for the upper arm.

[0045] In such a semiconductor device 103, the number of terminals increases, and therefore the number of current paths also increases. Furthermore, since the current paths cross, the inductance decreases.

[0046] P terminal 13 may include three or more P terminal elements 13A. First AC terminal 14 may include three or more first AC terminal portions 14A. Second AC terminal 23 may include three or more second AC terminal elements 23A. Third AC terminal 29 may include three or more third AC terminal elements 29A. In any case, the same effect as above is achieved.

[0047] <Fourth embodiment> The fourth embodiment is a subordinate concept to the first embodiment. In the fourth embodiment, the same components as those in any of the first to third embodiments are given the same reference numerals, and detailed description thereof will be omitted.

[0048] 18 is a diagram showing a configuration of a semiconductor device 104 in embodiment 4. The semiconductor device 104 includes an upper arm semiconductor package 114 and a lower arm semiconductor package 124. The lower arm semiconductor package 124 is the same as the lower arm semiconductor package 122 in embodiment 2.

[0049] The upper arm semiconductor package 114 is not provided with the control terminal 15. If there is no need to control a diode (not shown) related to the driving of the switching element 10, the control terminal 15 is not necessarily required.

[0050] Such a semiconductor device 104 increases the degree of freedom in layout when constructing a power control device such as an inverter circuit.

[0051] Although the lower arm semiconductor package 124 is provided with a control terminal 25, if control of a diode or the like is not required, the control terminal 25 may not be provided. Similarly, both the upper arm semiconductor package 114 and the lower arm semiconductor package 124 may not be provided with the control terminals 15, 25. In either case, the same effect as above can be achieved.

[0052] <Embodiment 5> In the fifth embodiment, the same components as those in any of the first to fourth embodiments are given the same reference numerals, and detailed description thereof will be omitted.

[0053] 19 is a side view showing an example of a holding structure for semiconductor chip 52 in embodiment 5. Semiconductor chip 52 corresponds to first semiconductor chip 12 or second semiconductor chip 22.

[0054] The semiconductor device in the fifth embodiment includes a metal plate 53, an insulating material 54, and a heat spreader 55 instead of insulating substrates 11, 21 having metal patterns 17, 27.

[0055] The insulating material 54 is provided on the surface of the metal plate 53. The heat spreader 55 is provided on the insulating material 54. The heat spreader 55 holds the semiconductor chip 52 via a bonding material 56.

[0056] The heat spreader 55 has a larger heat capacity than the insulating substrates 11 and 21 having the metal patterns 17 and 27. Therefore, such a semiconductor device reduces the transient thermal resistance.

[0057] <Sixth embodiment> The sixth embodiment is a subordinate concept to the first embodiment. In the sixth embodiment, the same components as those in any of the first to fifth embodiments are given the same reference numerals, and detailed description thereof will be omitted.

[0058] 20 and 21 are diagrams showing an example of the configuration of upper arm semiconductor package 116 and bus bar 32 according to the sixth embodiment.

[0059] The upper arm semiconductor package 116 includes two protrusions 16B on its top surface. The protrusions 16B are formed as part of the sealing material 16. The bus bar 32 includes two holes 32B corresponding to the two protrusions 16B. The holes 32B of the bus bar 32 fit into the protrusions 16B of the upper arm semiconductor package 116.

[0060] In the assembly process of the semiconductor device, the fitting structure determines the attachment position of bus bar 32 relative to the position of upper arm semiconductor package 116. The number of projections 16B and holes 32B is not limited to two, and may be one, or three or more.

[0061] <Embodiment 7> The seventh embodiment is a subordinate concept of the first embodiment. In the seventh embodiment, the same components as those in any of the first to sixth embodiments are given the same reference numerals, and detailed description thereof will be omitted.

[0062] Fig. 22 is a plan view showing the internal structure of the upper arm semiconductor package 117 in the seventh embodiment. Fig. 23 is a plan view showing the internal structure of the lower arm semiconductor package 127.

[0063] The first semiconductor chip 12 and the second semiconductor chip 22 contain SiC as a semiconductor material. With this configuration, the output of the semiconductor device is increased.

[0064] <Embodiment 8> In the eighth embodiment, the same components as those in any of the first to seventh embodiments are given the same reference numerals, and detailed description thereof will be omitted.

[0065] FIG. 24 is a diagram showing a configuration of a semiconductor device 108 according to the eighth embodiment.

[0066] The semiconductor device 108 includes two upper arm semiconductor packages 118 and two lower arm semiconductor packages 128. The two upper arm semiconductor packages 118 are arranged in parallel to each other. The two lower arm semiconductor packages 128 are arranged in parallel to each other. The upper arm semiconductor package 118 has the same configuration as the upper arm semiconductor package 113 in the third embodiment. The lower arm semiconductor package 128 has the same configuration as the lower arm semiconductor package 123 in the third embodiment.

[0067] The upper arm semiconductor package 118 is disposed such that its second side surface B faces the third side surface C of the lower arm semiconductor package 128. The first AC terminal portion 14A is connected to the second AC terminal element 23A. As a result, the switching element 10 of the upper arm semiconductor package 118 and the switching element 10 of the lower arm semiconductor package 128 are connected in series to each other.

[0068] The bus bar 31 is a single component, and is connected to all of the N terminals 24 of the two lower arm semiconductor packages 128.

[0069] With this configuration, the area of ​​the current path in the bus bar 31 is increased, thereby reducing the inductance.

[0070] Each of the two upper arm semiconductor packages 118 may have the same configuration as the upper arm semiconductor package described in any of the first to seventh embodiments. Each of the two lower arm semiconductor packages 128 may have the same configuration as the lower arm semiconductor package described in any of the first to seventh embodiments.

[0071] The number of upper arm semiconductor packages 118 and the number of lower arm semiconductor packages 128 may be three. Even in this case, the bus bar 31 is a single component and is connected to all of the N terminals 24.

[0072] <Embodiment 9> In the ninth embodiment, the same components as those in any of the first to eighth embodiments are given the same reference numerals, and detailed description thereof will be omitted.

[0073] Fig. 25 is a plan view showing the internal structure of the upper arm semiconductor package 119 in the ninth embodiment. Fig. 26 is a plan view showing the internal structure of the lower arm semiconductor package 129.

[0074] The upper arm semiconductor package 119 includes two first semiconductor chips 12. The first AC terminal 14 is connected together to the second pole sides of the two first semiconductor chips 12. The second pole side is, for example, the emitter side of an IGBT.

[0075] The lower arm semiconductor package 129 includes two second semiconductor chips 22. The N terminal 24 is connected to the second pole sides of the two second semiconductor chips 22 together.

[0076] Since a plurality of first semiconductor chips 12 and a plurality of second semiconductors are mounted, the output of the semiconductor device is increased.

[0077] In the ninth embodiment, the upper arm semiconductor package 119 may have the same configuration as the upper arm semiconductor package described in any one of the first to seventh embodiments. The lower arm semiconductor package 129 may have the same configuration as the lower arm semiconductor package described in any one of the first to seventh embodiments.

[0078] The number of first semiconductor chips 12 and the number of second semiconductor chips 22 may each be three or more.

[0079] Although this disclosure has been described in detail, the above description is illustrative in all respects and is not restrictive. It is understood that countless variations not illustrated can be envisioned.

[0080] In the present disclosure, each embodiment can be freely combined, and each embodiment can be modified or omitted as appropriate. [Explanation of symbols]

[0081] 10 switching element, 11 insulating substrate, 12 first semiconductor chip, 13 P terminal, 13A P terminal element, 14 first AC terminal, 14A first AC terminal portion, 15 control terminal, 16 sealing material, 16B protrusion, 17 metal pattern, 18A to 18C bonding material, 19 control wire, 21 insulating substrate, 22 second semiconductor chip, 23 second AC terminal, 23A second AC terminal element, 24 N terminal, 25 control terminal, 26 sealing material, 27 metal pattern, 28A to 28D bonding material, 29 third AC terminal, 29A third AC terminal element, 31 bus bar, 31A bus bar terminal portion, 32 bus bar, 32B hole, 52 semiconductor chip, 53 metal plate, 54 insulating material, 55 heat spreader, 56 bonding material, 101 to 104 semiconductor device, 108 Semiconductor device, 111-114 upper arm semiconductor packages, 116-119 upper arm semiconductor packages, 121-124 lower arm semiconductor packages, 127-129 lower arm semiconductor packages, A first side, B second side, C third side, D fourth side.

Claims

1. a first semiconductor package including a first semiconductor chip; a first terminal provided on a first surface of the first semiconductor package and electrically connected to a first electrode side of the first semiconductor chip; a first output terminal provided on a second surface of the first semiconductor package and electrically connected to a second electrode side of the first semiconductor chip; a second semiconductor package including a second semiconductor chip; a second output terminal provided on a third surface of the second semiconductor package and electrically connected to the first electrode side of the second semiconductor chip; a second terminal provided on the third surface of the second semiconductor package and electrically connected to the second pole side of the second semiconductor chip; a bus bar connected to the second terminal, the first output terminal is connected to the second output terminal; The bus bar extends from the second terminal in a direction toward the first surface on which the first terminal is provided.

2. the first semiconductor package is disposed such that the second surface of the first semiconductor package faces the third surface of the second semiconductor package; the bus bar includes at least one bus bar terminal portion on the first surface side of the first semiconductor package, and is provided on an upper surface of the first semiconductor package; The semiconductor device according to claim 1 , wherein the at least one bus bar terminal portion is arranged alongside the first terminal on the first surface side of the first semiconductor package.

3. The semiconductor device according to claim 1 , further comprising a third output terminal provided on a fourth surface of said second semiconductor package and electrically connected to said first pole side of said second semiconductor chip.

4. the first terminal includes a plurality of terminal elements protruding from a plurality of positions on the first surface of the first semiconductor package, the first output terminal includes a plurality of output terminal portions branching out from inside the first semiconductor package and protruding from a plurality of positions on the second surface, the second output terminal includes a plurality of output terminal elements protruding from a plurality of positions on the third surface of the second semiconductor package, The semiconductor device according to claim 2 , wherein the at least one bus bar terminal portion comprises a plurality of bus bar terminal portions.

5. 2. The semiconductor device according to claim 1, further comprising a control terminal for transmitting a control signal related to control of a switching element included in said first semiconductor chip or said second semiconductor chip.

6. Further comprising an insulating substrate including a metal pattern on a surface thereof; The semiconductor device according to claim 1 , wherein the insulating substrate holds the first semiconductor chip or the second semiconductor chip via the metal pattern.

7. A metal plate; An insulating material provided on a surface of the metal plate; A heat spreader provided on the insulating material, The semiconductor device according to claim 1 , wherein the heat spreader holds the first semiconductor chip or the second semiconductor chip.

8. the first semiconductor package includes at least one protrusion on the top surface; the busbar includes at least one hole; The semiconductor device according to claim 2 , wherein the at least one hole of the bus bar is fitted onto the at least one protrusion of the first semiconductor package.

9. The semiconductor device according to claim 1 , wherein the first semiconductor chip or the second semiconductor chip includes SiC as a semiconductor material.

10. a plurality of first semiconductor packages arranged in parallel with each other and each including a first semiconductor chip; a first terminal provided on a first surface of each of the plurality of first semiconductor packages and electrically connected to a first electrode side of the first semiconductor chip; a first output terminal provided on a second surface of each of the plurality of first semiconductor packages and electrically connected to a second electrode side of the first semiconductor chip; a plurality of second semiconductor packages arranged in parallel with each other and each including a second semiconductor chip; a second output terminal provided on a third surface of each of the plurality of second semiconductor packages and electrically connected to the first pole side of the second semiconductor chip; a second terminal provided on the third surface of each of the plurality of second semiconductor packages and electrically connected to the second pole side of the second semiconductor chip; a bus bar connected to the second terminal, the first output terminal is connected to the second output terminal; The bus bar extends from the second terminal in a direction toward the first surface on which the first terminal is provided.

11. a first semiconductor package including a plurality of first semiconductor chips; a first terminal provided on a first surface of the first semiconductor package and electrically connected to a first electrode side of the first semiconductor chips; a first output terminal provided on a second surface of the first semiconductor package and electrically connected to second electrodes of the first semiconductor chips; a second semiconductor package including a plurality of second semiconductor chips; a second output terminal provided on a third surface of the second semiconductor package and electrically connected to the first pole sides of the second semiconductor chips; a second terminal provided on the third surface of the second semiconductor package and electrically connected to the second pole sides of the second semiconductor chips; a bus bar connected to the second terminal, the first output terminal is connected to the second output terminal; The bus bar extends from the second terminal in a direction toward the first surface on which the first terminal is provided.

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