Infrared sensor, infrared sensor array, and method for manufacturing infrared sensor

Abstract

The present disclosure provides a technology for further improving the sensitivity of an infrared sensor. The infrared sensor of the present disclosure includes a base substrate; a bolometer infrared receiving unit; a first beam; and a second beam, wherein each of the first beam and the second beam has a connection portion connected to the base substrate and / or a member on the base substrate and a separation portion spaced from the base substrate, and is physically joined to the infrared receiving unit at the separation portion, the infrared receiving unit is supported by the first beam and the second beam while being spaced from the base substrate, the infrared receiving unit includes a resistance change portion made of a resistance change material whose electrical resistance changes with temperature, the resistance change portion is made of an amorphous semiconductor, and each of the first beam and the second beam is made of a crystalline semiconductor made of the same base material as the resistance change material, and is electrically connected to the resistance change portion at the separation portion.

Description

[Technical field]

[0001] The present disclosure relates to infrared sensors, infrared sensor arrays, and methods of manufacturing infrared sensors. [Background technology]

[0002] In the field of infrared sensors, a structure has been proposed in which a beam is used to separate an infrared receiving section from a base substrate. This structure aims to thermally insulate the infrared receiving section from the base substrate. In an infrared sensor having this structure, the higher the thermal insulation performance of the beam, the higher the infrared receiving sensitivity. Patent Document 1 discloses a technology for improving the thermal insulation performance of the beam by introducing a phononic crystal structure.

[0003] One type of infrared sensor is a bolometer sensor. A bolometer sensor is also called a thermistor sensor. The infrared receiving portion of a bolometer sensor includes a resistance change material whose electrical resistance changes depending on temperature. The infrared sensor disclosed in Patent Document 1 includes a bolometer sensor. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2017-223644 A Summary of the Invention [Problem to be solved by the invention]

[0005] The present disclosure provides a technique for improving the infrared light receiving sensitivity of a bolometer-type infrared sensor. [Means for solving the problem]

[0006] The present disclosure provides the following infrared sensor. 1. An infrared sensor comprising: Base substrate; Bolometer infrared receiver; First beam; and 2nd beam; Equipped with Where: Each of the first beam and the second beam has a connection portion connected to the base substrate and / or a member on the base substrate, and a separation portion separated from the base substrate, and is physically joined to the infrared receiving unit at the separation portion; the infrared receiving unit is supported by the first beam and the second beam in a state spaced apart from the base substrate, the infrared receiving unit includes a resistance change unit made of a resistance change material whose electrical resistance changes depending on temperature, the resistance change portion is made of an amorphous semiconductor, Each of the first beam and the second beam is made of a crystalline semiconductor made of the same base material as that of the resistance change material, and is electrically connected to the resistance change portion in the spaced portion. Effect of the Invention

[0007] The infrared sensor of the present disclosure is a bolometer type sensor that can have high sensitivity to receiving infrared light. [Brief description of the drawings]

[0008] [Figure 1A] FIG. 1A is a cross-sectional view illustrating an infrared sensor according to a first embodiment. [Figure 1B] FIG. 1B is a plan view diagrammatically illustrating the infrared sensor of the first embodiment. [Figure 2A] FIG. 2A is a plan view that illustrates a schematic example of a phononic crystal structure that a beam (first beam) of the infrared sensor of the present disclosure may have. [Figure 2B] FIG. 2B is a plan view that illustrates a schematic example of a phononic crystal structure that a beam (second beam) of the infrared sensor of the present disclosure may have. [Figure 3A] FIG. 3A is a schematic diagram showing a unit cell and its orientation in a first domain included in the phononic crystal structure of FIG. 2A. [Figure 3B]FIG. 3B is a schematic diagram showing a unit cell and its orientation in a second domain included in the phononic crystal structure of FIG. 2A. [Figure 4] FIG. 4 is an enlarged view of region R1 of the phononic crystal structure of FIG. 2A. [Diagram 5] FIG. 5 is a plan view diagrammatically illustrating another example of a phononic crystal structure that a beam of the infrared sensor of the present disclosure may have. [Figure 6] FIG. 6 is an enlarged view of region R2 of the phononic crystal structure of FIG. [Figure 7] FIG. 7 is a plan view illustrating a schematic diagram of still another example of a phononic crystal structure that a beam of an infrared sensor according to the present disclosure may have. [Figure 8] FIG. 8 is an enlarged view of region R3 of the phononic crystal structure of FIG. [Figure 9] FIG. 9 is a plan view diagrammatically illustrating still another example of a phononic crystal structure that a beam of an infrared sensor according to the present disclosure may have. [Figure 10] FIG. 10 is a plan view that illustrates a schematic example of a phononic crystal structure that the beam of the infrared sensor of the present disclosure may have. [Figure 11] FIG. 11 is a plan view that illustrates a schematic example of a phononic crystal structure that the beam of the infrared sensor of the present disclosure may have. [Figure 12A] FIG. 12A is a schematic diagram showing an example of a unit cell of a phononic crystal structure that a beam of an infrared sensor of the present disclosure may have. [Figure 12B] FIG. 12B is a schematic diagram showing another example of a unit cell of a phononic crystal structure that a beam of the infrared sensor of the present disclosure may have. [Figure 13] FIG. 13 is a plan view that illustrates a schematic example of a phononic crystal structure that the beam of the infrared sensor of the present disclosure may have. [Figure 14] FIG. 14 is a plan view that illustrates a schematic example of a phononic crystal structure that the beam of the infrared sensor of the present disclosure may have. [Figure 15A]FIG. 15A is a schematic diagram showing an example of a unit cell of a phononic crystal structure that a beam of an infrared sensor according to the present disclosure may have. [Figure 15B] FIG. 15B is a schematic diagram showing another example of a unit cell of a phononic crystal structure that a beam of an infrared sensor according to the present disclosure may have. [Figure 15C] FIG. 15C is a schematic diagram showing yet another example of a unit cell of a phononic crystal structure that a beam of an infrared sensor according to the present disclosure may have. [Figure 15D] FIG. 15D is a schematic diagram showing another example of a unit lattice of a phononic crystal structure that a beam of an infrared sensor according to the present disclosure may have. [Figure 16A] FIG. 16A is a cross-sectional view illustrating the infrared sensor of the second embodiment. [Figure 16B] FIG. 16B is a plan view diagrammatically illustrating the infrared sensor of the second embodiment. [Figure 17A] FIG. 17A is a cross-sectional view illustrating a modified example of the infrared sensor according to the second embodiment. [Figure 17B] FIG. 17B is a plan view diagrammatically illustrating a modified example of the infrared sensor according to the second embodiment. [Figure 18A] FIG. 18A is a cross-sectional view illustrating the infrared sensor of the third embodiment. [Figure 18B] FIG. 18B is a plan view diagrammatically illustrating the infrared sensor of the third embodiment. [Figure 19A] FIG. 19A is a cross-sectional view illustrating a modified example of the infrared sensor of the third embodiment. [Figure 19B] FIG. 19B is a plan view diagrammatically illustrating a modified example of the infrared sensor of the third embodiment. [Figure 20A] FIG. 20A is a cross-sectional view illustrating a modified example of the infrared sensor of the third embodiment. [Figure 20B] FIG. 20B is a plan view diagrammatically illustrating a modified example of the infrared sensor of the third embodiment. [Figure 21] FIG. 21 is a cross-sectional view illustrating an infrared sensor according to the fourth embodiment. [Figure 22A]FIG. 22A is a schematic cross-sectional view for explaining an example of a method for manufacturing the infrared sensor of the present disclosure. [Figure 22B] FIG. 22B is a schematic cross-sectional view for explaining an example of a method for manufacturing the infrared sensor of the present disclosure. [Figure 22C] FIG. 22C is a schematic cross-sectional view for explaining an example of a method for manufacturing the infrared sensor of the present disclosure. [Figure 22D] FIG. 22D is a schematic cross-sectional view for explaining an example of a method for manufacturing the infrared sensor of the present disclosure. [Figure 22E] FIG. 22E is a schematic cross-sectional view for explaining an example of a method for manufacturing the infrared sensor of the present disclosure. [Figure 22F] FIG. 22F is a schematic cross-sectional view for explaining an example of a method for manufacturing the infrared sensor of the present disclosure. [Figure 22G] FIG. 22G is a schematic cross-sectional view for explaining an example of a method for manufacturing the infrared sensor of the present disclosure. [Fig. 22H] FIG. 22H is a schematic cross-sectional view for explaining an example of a method for manufacturing the infrared sensor of the present disclosure. [Figure 22I] FIG. 22I is a schematic cross-sectional view for explaining an example of a method for manufacturing the infrared sensor of the present disclosure. [Figure 22J] FIG. 22J is a schematic cross-sectional view for explaining an example of a method for manufacturing the infrared sensor of the present disclosure. [Figure 22K] FIG. 22K is a schematic cross-sectional view for explaining an example of a method for manufacturing the infrared sensor of the present disclosure. [Figure 22L] FIG. 22L is a schematic cross-sectional view for explaining an example of a method for manufacturing the infrared sensor of the present disclosure. [Figure 22M] FIG. 22M is a schematic cross-sectional view for explaining an example of a method for manufacturing the infrared sensor of the present disclosure. [Figure 22N] FIG. 22N is a schematic cross-sectional view for explaining an example of a method for manufacturing the infrared sensor of the present disclosure. [Figure 22O]FIG. 22O is a schematic cross-sectional view for explaining an example of a method for manufacturing the infrared sensor of the present disclosure. [Figure 22P] FIG. 22P is a schematic cross-sectional view for explaining an example of a method for manufacturing the infrared sensor of the present disclosure. [Figure 22Q] FIG. 22Q is a schematic cross-sectional view for explaining an example of a method for manufacturing the infrared sensor of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] (Findings on which this disclosure is based) According to the study by the inventors, the infrared light receiving sensitivity of the bolometer type infrared sensor is improved not only by improving the thermal insulation performance of the beam but also by reducing the thermal noise N therm The improvement is also due to the reduction of thermal noise N therm is the total electrical resistance R of the infrared sensor all The total electrical resistance R of the infrared sensor is proportional to the 1 / 2 power of all is typically the total electrical resistance between the connection terminals of the infrared sensor and the readout integrated circuit (ROIC). all is typically the electrical resistance R of the connection terminal stud , the electrical resistance R of the wiring electrically connecting the connection terminal and the resistance change section wiring , the electrical resistance of the resistance change part R thermister , and the interfacial electrical resistance R at the interface between the resistance change part and the wiring interface In the infrared sensor of the present disclosure, each of the first beam and the second beam functions as a wiring. The base material of the resistance change section is the same as the base material of the first beam and the second beam. Therefore, the inclination of the energy band at the interface between the two can be mitigated, and therefore the interface electrical resistance R interface It is possible to reduce the interfacial electrical resistance R interface The reduction in thermal noise N therm Therefore, the infrared sensor of the present disclosure can have high light receiving sensitivity.

[0010] (Embodiments of the present disclosure) Hereinafter, the embodiments of the present disclosure will be described with reference to the drawings. Note that the embodiments described below are all comprehensive or specific examples. The numerical values, shapes, materials, components, component arrangement positions, connection forms, process conditions, steps, order of steps, etc. shown in the following embodiments are examples and are not intended to limit the present disclosure. In addition, among the components in the following embodiments, components that are not described in the independent claims showing the highest concept are described as optional components. Note that each figure is a schematic diagram and is not necessarily illustrated strictly.

[0011] [Infrared sensor] (Embodiment 1) An infrared sensor of the first embodiment is shown in FIG. 1A and FIG. 1B. FIG. 1A shows a cross section 1A-1A of the infrared sensor 1A of FIG. 1B. The infrared sensor 1A is a bolometer type infrared sensor, which is a type of thermal infrared sensor. The infrared sensor 1A includes a base substrate 11, a bolometer infrared receiving section 12, a first beam 13A, and a second beam 13B. Each of the first beam 13A and the second beam 13B has a connection section 16A, 16B connected to a member on the base substrate 11, and a separation section 17 separated from the base substrate 11. The first beam 13A and the second beam 13B each have a connection section 16A, 16B at one end. Each of the first beam 13A and the second beam 13B is physically joined to the infrared receiving section 12 at the separation section 17. The positions where the infrared receiving unit 12 is physically joined are the other ends of the first beam 13A and the second beam 13B. The infrared receiving unit 12 is supported by the first beam 13A and the second beam 13B in a state separated from the base substrate 11. This separation enhances thermal insulation between the base substrate 11 and the infrared receiving unit 12. The first beam 13A and the second beam 13B are conductive. The first beam 13A and the second beam 13B have a function of physically supporting the infrared receiving unit 12 and a function as a current path, i.e., wiring, for detecting the resistance of the resistance change portion in the infrared receiving unit 12.

[0012] The infrared sensor 1A is a member disposed on the base substrate 11, and further includes a first support 15A and a second support 15B extending in a direction away from the upper surface 14 of the base substrate 11. The first support 15A and the second support 15B are members on the base substrate 11. The first support 15A and the second support 15B are conductive. The first beam 13A is connected to the first support 15A at the connection portion 16A. The second beam 13B is connected to the second support 15B at the connection portion 16B. The first beam 13A and the first support 15A are physically and electrically connected at the connection portion 16A. The second beam 13B and the second support 15B are physically and electrically connected at the connection portion 16B. In a cross-sectional view, the infrared receiving unit 12, the first beam 13A, and the second beam 13B are suspended above the base substrate 11 by the first support 15A and the second support 15B. 1A and 1B, the above-mentioned suspension by the first support 15A and the second support 15B achieves a distance between the base substrate 11 and the infrared receiving section 12. The first support 15A and the second support 15B have a function of physically supporting the infrared receiving section 12, the first beam 13A, and the second beam 13B, and a function as a current path for detecting the resistance of the resistance change section in the infrared receiving section 12.

[0013] The infrared receiving section 12 includes a resistance change section 18 made of a resistance change material whose electrical resistance changes with temperature. The resistance change section 18 may be made of one type or two or more types of resistance change material, but typically is made of one type. The resistance change section 18 is made of an amorphous semiconductor. Each of the first beam 13A and the second beam 13B is made of a crystalline semiconductor made of the same base material as the base material of the resistance change material. Each of the first beam 13A and the second beam 13B is electrically connected to the resistance change section 18 of the infrared receiving section 12 at the separation section 17. The resistance change section 18, the first beam 13A, and the second beam 13B are the amorphous region 19 and the crystalline regions 20A and 20B of the semiconductor layer 21 made of the base material, respectively. The semiconductor layer 21 is a single layer. As will be clear from an example of a manufacturing method described later, the infrared sensor 1A of this form has a high affinity with semiconductor manufacturing technology. The semiconductor layer 21 has a thickness of, for example, 50 to 500 nm.

[0014] The resistance change section 18 is made of an amorphous semiconductor. On the other hand, the first beam 13A and the second beam 13B are made of a crystalline semiconductor. However, the base material of the semiconductor constituting the resistance change section 18 is the same as the base material of the semiconductor constituting the first beam 13A and the second beam 13B. The base material is, for example, silicon (Si) or silicon germanium (SiGe). The base material may be Si or SiGe. In this specification, the term "crystalline semiconductor" refers to a semiconductor having a content of crystallized base material of, for example, 50 mass% or more, 70 mass% or more, 80 mass% or more, 90 mass% or more, or even 95 mass% or more. In the case of a "crystalline semiconductor", the content of the crystallized base material may be 100 mass%. The term "amorphous semiconductor" refers to a semiconductor having a content of crystallized base material of, for example, less than 50 mass%, less than 30 mass%, less than 20 mass%, less than 10 mass%, or even less than 5 mass%. In the case of an "amorphous semiconductor," the content of the crystallized base material may be 0 mass %. The content of the crystallized base material can be evaluated, for example, by X-ray diffraction.

[0015] The first beam 13A and the second beam 13B are conductive. For this reason, the semiconductor constituting the first beam 13A and the second beam 13B is typically doped with a high concentration of impurities. The doping concentration of the impurities in the semiconductor is, for example, 10 17 ~10 23 cm -3 and 10 19 ~10 21 cm -3 The impurities may be elements different from the elements constituting the base material. When the base material is Si or SiGe, the impurities are, for example, boron (B) or phosphorus (P).

[0016] It is preferable that the concentration of the impurity doped in the base material continuously changes along the normal direction of the boundary surface at the boundary, i.e., the boundary surface, between the first beam 13A and / or the second beam 13B and the resistance change portion 18. In this embodiment, the interface electrical resistance R interfaceAs an example, in the vicinity of the interface, the gradient of the concentration of the doped impurity along the normal direction of the interface can be reduced by 10 18 cm -3 / nm or less. Here, the vicinity of the boundary surface means a range from the boundary surface to a region separated by a predetermined distance (e.g., 100 nm) in the normal direction of the boundary surface. The change in concentration is achieved, for example, by the diffusion of a part of the impurity doped in the semiconductor base material constituting the first beam 13A and / or the second beam 13B.

[0017] In the infrared sensor 1A, the resistance of the resistance change section 18 included in the infrared receiving section 12 is read. For reading, the infrared sensor 1A shown in FIG. 1A and FIG. 1B further includes a readout integrated circuit (ROIC; not shown) inside the base substrate 11. The infrared sensor 1A further includes a first signal readout terminal 22A and a second signal readout terminal 22B on the upper surface 14 of the base substrate 11. The first support pillar 15A and the ROIC are electrically connected via the first signal readout terminal 22A. The second support pillar 15B and the ROIC are electrically connected via the second signal readout terminal 22B. The resistance of the resistance change section 18 can be read via the first beam 13A, the second beam 13B, the first support pillar 15A, the second support pillar 15B, the first signal readout terminal 22A, and the second signal readout terminal 22B. The electrical resistance between the first signal read terminal 22A and the second signal read terminal 22B, which sandwich the resistance change portion 18, is the above-mentioned total electrical resistance R all The infrared sensor 1A may further include a member for reading the resistance of the resistance change portion 18.

[0018] When infrared rays are incident on the infrared receiving unit 12, the temperature of the infrared receiving unit 12 rises. At this time, the temperature of the infrared receiving unit 12 rises more as it is thermally insulated from the base substrate 11, which is a heat bath, and from the members on the base substrate 11. In the infrared sensor 1A including the bolometer infrared receiving unit 12, the resistance of the resistance change unit 18 included in the infrared receiving unit 12 changes with the rise in temperature. An electric signal corresponding to the changed resistance is processed by the ROIC to detect infrared rays. Depending on the processing, the infrared sensor 1A can measure the intensity of infrared rays and / or the temperature of an object. However, in the infrared sensor of the present disclosure, the reading of the resistance of the resistance change unit 18 included in the infrared receiving unit 12 is not limited to the mode by the ROIC provided inside the base substrate 11.

[0019] 1A and 1B, the physical joints between the first beam 13A and the second beam 13B and the infrared receiving section 12 and the electrical connection between the first beam 13A and the second beam 13B and the resistance change section 18 are the same. Specifically, the boundary between the resistance change section 18 and the first beam 13A and the boundary between the resistance change section 18 and the second beam 13B are the physical joints and the electrical connection. However, in the infrared sensor of the present disclosure, the physical joints and the electrical connection may be different.

[0020] The infrared sensor 1A shown in FIG. 1A and FIG. 1B further includes an infrared reflecting film 23 at a position facing the infrared receiving section 12 on the surface of the base substrate 11. In this embodiment, infrared light reflected by the infrared reflecting film 23 can be used, and the light receiving sensitivity of the infrared sensor 1A can be further improved. In the infrared sensor 1A shown in FIG. 1A and FIG. 1B, the infrared reflecting film 23 is disposed on the upper surface 14 of the base substrate 11. In a plan view, the area of ​​the infrared reflecting film 23 is larger than the area of ​​the infrared receiving section 12. In addition, in a plan view, the infrared reflecting film 23 is disposed so as to surround the infrared receiving section 12. However, the specific form of the infrared reflecting film 23 is not limited to the example shown in FIG. 1A and FIG. 1B. The thickness of the infrared reflecting film 23 is, for example, 50 to 500 nm. The infrared sensor of the present disclosure may not include the infrared reflecting film 23. In this specification, the term "plan view" means that the object is viewed from a direction perpendicular to the main surface of the object. Moreover, the term "main surface" refers to the surface having the largest area.

[0021] The base substrate 11 is typically made of a semiconductor. The semiconductor is, for example, Si. An oxide film may be formed on the upper surface 14 of the base substrate 11 made of Si. The oxide film is, for example, a silicon oxide (SiO2) film. However, the configuration of the base substrate 11 is not limited to the above example.

[0022] The first pillar 15A, the second pillar 15B, the first signal readout terminal 22A, and the second signal readout terminal 22B are made of, for example, a semiconductor doped with impurities, or a metal. The metal is, for example, a species with low thermal conductivity, such as titanium (Ti) or titanium nitride (TiN). However, the materials constituting the first pillar 15A, the second pillar 15B, and the signal readout terminals 22A and 22B are not limited to the above examples.

[0023] The ROIC may have a known configuration. The ROIC may be provided at a location other than inside the base substrate 11. The ROIC may be provided on the upper surface 14 of the base substrate 11, for example.

[0024] The infrared reflective film 23 is typically made of a metal. Examples of the metal include chromium (Cr), aluminum (Al), and gold (Au). However, the material constituting the infrared reflective film 23 is not limited to the above examples.

[0025] The section of the first beam 13A located between the joint with the infrared receiving unit 12 and the connection part 16A, and / or the section of the second beam 13B located between the joint with the infrared receiving unit 12 and the connection part 16B may have a phononic crystal structure having a plurality of regularly arranged through holes. In one example of the infrared sensor 1A of the first embodiment, the section of the first beam 13A located between the joint with the infrared receiving unit 12 and the connection part 16A has a first phononic crystal structure having a plurality of regularly arranged through holes, and the section of the second beam 13B located between the joint with the infrared receiving unit 12 and the connection part 16B has a second phononic crystal structure having a plurality of regularly arranged through holes. The above sections are usually located in the separation part 17 of the first beam 13A and / or the second beam 13B.

[0026] In insulators and semiconductors, heat is mainly transported by lattice vibrations called phonons. The thermal conductivity of a material made of an insulator or semiconductor is determined by the dispersion relation of the phonons that the material possesses. The dispersion relation of phonons means the relationship between frequency and wave number, or band structure. In insulators and semiconductors, phonons that transport heat span a wide frequency band from 100 GHz to 10 THz. This frequency band is the thermal band. The thermal conductivity of a material is determined by the dispersion relation of phonons in the thermal band.

[0027] According to the phononic crystal structure, the dispersion relationship of the phonons of the material can be controlled by the periodic structure of the through holes. That is, according to the phononic crystal structure, the thermal conductivity of the material itself can be controlled. In particular, the formation of a phononic band gap (PBG) by the phononic crystal structure can greatly reduce the thermal conductivity of the material. Phonons cannot exist in the PBG. Therefore, the PBG located in the thermal band can become a gap in thermal conduction. Also, even in frequency bands other than the PBG, the slope of the phonon dispersion curve is reduced by the PBG. The reduction in the slope reduces the group velocity of the phonons and reduces the thermal conduction rate. These points greatly contribute to the reduction of the thermal conductivity of the material. The thermal conductivity of the material can be reduced, for example, by making it porous. This is because the voids introduced by making it porous reduce the thermal conductivity of the material. However, according to the phononic crystal structure, the thermal conductivity of the material itself can be reduced. Therefore, compared to simple porousification, a further reduction in thermal conductivity is expected.

[0028] As can be understood from the above description, the first beam 13A and the second beam 13B having a section with a phononic crystal structure can further reduce the thermal conductivity. Therefore, when the first beam 13A and / or the second beam 13B, particularly both the first beam 13A and the second beam 13B, have a phononic crystal structure in the above section, the thermal insulation between the base substrate 11 and the infrared receiving section 12 in the infrared sensor 1A can be further improved. Furthermore, the further improvement in thermal insulation can further improve the light receiving sensitivity of the infrared sensor 1A.

[0029] The following description relates to the phononic crystal structure that the first beam 13A and / or the second beam 13B may have. Hereinafter, the phononic crystal structure that the first beam 13A and / or the second beam 13B may have will be referred to as phononic crystal structure A.

[0030] An example of the phononic crystal structure A is shown in FIG. 2A and FIG. 2B. FIG. 2A shows a state in which a part of the beam 13 (13A) is viewed in a plane. FIG. 2B shows a state in which a part of the beam 13 (13B) is viewed in a plane. The beam 13 (13A, 13B) has a thickness of, for example, 10 nm or more and 500 nm or less. The beam 13 is rectangular in a planar view. The long side of the beam 13 coincides with the direction connecting the infrared receiving unit 12 and the connection units 16A, 16B, that is, the macroscopic heat transfer direction in the infrared sensor 1A. The beam 13 is provided with a plurality of through holes 50 extending in the thickness direction of the beam 13. The phononic crystal structure A of the beam 13 is a two-dimensional phononic crystal structure in which the plurality of through holes 50 are regularly arranged in the in-plane direction.

[0031] The phononic crystal structure A of the first beam 13A has a first domain 51A which is a phononic crystal region, and a second domain 51B which is a phononic crystal region. The first domain 51A has a phononic single crystal structure having a plurality of through holes 50 regularly arranged in a first direction in a plan view. The second domain 51B has a phononic single crystal structure having a plurality of through holes 50 regularly arranged in a second direction different from the first direction in a plan view. In each single crystal structure, the diameter and arrangement period of the plurality of through holes 50 are the same. In each single crystal structure, the orientation of the unit cell 91A or 91B having the plurality of regularly arranged through holes 50 is the same. The shapes of the first domain 51A and the second domain 51B are rectangular in a plan view. The shape of the first domain 51A and the shape of the second domain 51B are the same in a plan view.

[0032] The phononic crystal structure A of the second beam 13B has a third domain 51C which is a phononic crystal region, and a fourth domain 51D which is a phononic crystal region. The third domain 51C has a phononic single crystal structure having a plurality of through holes 50 regularly arranged in a third direction in a plan view. The fourth domain 51D has a phononic single crystal structure having a plurality of through holes 50 regularly arranged in a fourth direction different from the third direction in a plan view. In each single crystal structure, the diameter and arrangement period of the plurality of through holes 50 are the same. In each single crystal structure, the orientation of the unit cell 91A or 91B having the plurality of regularly arranged through holes 50 is the same. The shapes of the third domain 51C and the fourth domain 51D are rectangular in a plan view. The shape of the third domain 51C and the shape of the fourth domain 51D are the same in a plan view.

[0033] The phononic crystal structure A shown in Figures 2A and 2B is also a phononic polycrystalline structure 52, which is a composite of multiple phononic single crystal structures.

[0034] The phononic crystal structure A shown in Fig. 2A is the same as the phononic crystal structure A shown in Fig. 2B, but may be different from each other.

[0035] The phononic crystal structure A that the first beam 13A can have and the phononic crystal structure A that the second beam 13B can have may be the same as or different from each other.

[0036] Hereinafter, the details of the form that the phononic crystal structure A can take will be described using the phononic crystal structure A that the first beam 13A can have, in other words, the phononic crystal structure A having the first domain 51A and the second domain 51B, as an example. The phononic crystal structure A that the second beam 13B can have can also take a similar form. The phononic crystal structure A that the first beam 13A can have and the phononic crystal structure A that the second beam 13B can have may be different from each other within the range of the form to be described.

[0037] The domain, which is the phononic crystal region, has a period of the array of the through holes 50 of, for example, 25P in plan view. 2 To control the phonon dispersion relationship by the phononic crystal structure, the domain must have an area of ​​at least 25P 2 In a square domain in plan view, the period is set to 5×P or more, so that the area is 25P or more. 2 The above area can be secured.

[0038] As shown in FIG. 3A and FIG. 3B, in the phononic crystal structure A, the orientation 53A of the unit cell 91A in the first domain 51A and the orientation 53B of the unit cell 91B in the second domain 51B are different from each other in plan view. The angle between the orientation 53A and the orientation 53B is, for example, 10 degrees or more in plan view. However, when the unit cell 91A and the unit cell 91B are the same and have n-fold rotational symmetry, the upper limit of the angle between the orientation 53A and the orientation 53B is less than 360 / n degrees. When the unit cell has n-fold rotational symmetry for multiple n, the maximum n is used as n that determines the upper limit of the angle. For example, a hexagonal lattice has two-fold rotational symmetry, three-fold rotational symmetry, and six-fold rotational symmetry. In this case, "6" is used as n that determines the upper limit of the angle. That is, for unit cells 91A and 91B, which are hexagonal lattices, the angle between orientation 53A and orientation 53B is less than 60 degrees. Phononic crystal structure A has at least two or more phononic crystal regions whose unit cell orientations are different from each other. As long as this condition is satisfied, phononic crystal structure A may further include any phononic crystal region and / or a region not having a phononic crystal structure.

[0039] The orientation of the unit cell can be determined based on any rule. However, the same rule must be applied to determine the orientation of the unit cell between different domains. The orientation of the unit cell is, for example, the extension direction of a straight line that bisects the angle between two non-parallel sides that make up the unit cell. However, the two sides must be determined using the same rule between different domains.

[0040] FIG. 4 shows an enlarged view of the region R1 of the phononic crystal structure A in FIG. 2A. At the interface 55 between the first domain 51A and the second domain 51B adjacent to each other, the orientations 53A and 53B of the unit cells 91A and 91B change. The interface 55 where the orientation of the unit cells changes brings about a large interface resistance against the heat flowing macroscopically through the phononic crystal structure A. This interface resistance is based on the mismatch of the phonon group velocity occurring between the first domain 51A and the second domain 51B. This interface resistance contributes to a reduction in the thermal conductivity of the beam 13 (13A) having the phononic crystal structure A. In FIG. 4, the interface 55 extends linearly in a plan view. Also, the interface 55 extends in the width direction of the rectangular beam 13 in a plan view. The width direction can be a direction perpendicular to the extension direction of the center line of the beam 13 determined by the macro heat transfer direction. The interface 55 divides the phononic crystal structure A perpendicular to the macroscopic heat transfer direction in plan view.

[0041] In the phononic crystal structure A of FIG. 2A, the period P of the arrangement of the plurality of through holes 50 in the first domain 51A is equal to the period P of the arrangement of the plurality of through holes 50 in the second domain 51B.

[0042] In the phononic crystal structure A of FIG. 2A, the diameters of the plurality of through holes 50 regularly arranged in the first domain 51A are equal to the diameters of the plurality of through holes 50 regularly arranged in the second domain 51B.

[0043] In the phononic crystal structure A in Fig. 2A, the type of unit cell 91A in the first domain 51A is the same as the type of unit cell 91B in the second domain 51B. Both the unit cell 91A and the unit cell 91B in Fig. 2A are hexagonal lattices.

[0044] The shape of each domain in plan view is not limited. The shape of each domain in plan view is, for example, a polygon including a triangle, a square, and a rectangle, a circle, an ellipse, or a composite shape of these. The shape of each domain in plan view may be indefinite. Furthermore, the number of domains that phononic crystal structure A has is not limited. The greater the number of domains that phononic crystal structure A has, the greater the effect of interface resistance due to the interface between the domains. Furthermore, the size of each domain that phononic crystal structure A has is not limited.

[0045] The phononic crystal structure A shown in FIGS. 5 and 6 is a polycrystalline structure 52. In the polycrystalline structure 52, an interface 55 between adjacent first domain 51A and second domain 51B extends in the direction of the long side of the rectangular beam 13 (13A) in a plan view. The direction of the long side may be the direction of macroscopic heat transfer. Except for this, the phononic crystal structure A in FIGS. 5 and 6 has a configuration similar to that of the phononic crystal structure A in FIG. 2A. The interface 55 divides the phononic crystal structure A parallel to the direction of macroscopic heat transfer in a plan view. FIG. 6 is an enlarged view of region R2 in FIG. 5.

[0046] 2A and 5, the size of the first domain 51A and the size of the second domain 51B are the same in plan view. However, the sizes of the first domain 51A and the second domain 51B of the phononic structure A may be different from each other in plan view.

[0047] The phononic crystal structure A shown in FIG. 7 and FIG. 8 is a polycrystalline structure 52. In the polycrystalline structure 52, the second domain 51B is surrounded by the first domain 51A in a planar view. The shapes of the first domain 51A and the second domain 51B are rectangular in a planar view. However, the size of the first domain 51A and the size of the second domain 51B are different in a planar view. An interface 55 between the second domain 51B and the first domain 51A surrounding the second domain 51B constitutes the outer edge of the second domain 51B in a planar view. Other than these points, the phononic crystal structure A in FIG. 7 and FIG. 8 has the same configuration as the phononic crystal structure A in FIG. 2A. Note that FIG. 8 is an enlarged view of the region R3 in FIG. 7.

[0048] In the phononic crystal structure A in FIG. 7 and FIG. 8, the interface 55 has a bent portion.

[0049] Furthermore, the phononic crystal structure A in FIG. 7 and FIG. 8 has a second domain 51B that is not in contact with the side of the beam 13 (13A).

[0050] The phononic crystal structure A shown in Fig. 9 is a polycrystalline structure 52. In the polycrystalline structure 52, a first domain 51A and a second domain 51B are arranged apart from each other in a plan view. More specifically, in a plan view, a region 201 not having a through hole 50 is provided between the first domain 51A and the second domain 51B in the long side direction of the beam 13 (13A). Except for this, the phononic crystal structure A in Fig. 9 has a similar configuration to the phononic crystal structure A in Fig. 2A.

[0051] The phononic crystal structure A shown in FIG. 10 is a polycrystalline structure 52. In the polycrystalline structure 52, a first domain 51A and a second domain 51B are arranged at a distance from each other in a plan view. More specifically, in a plan view, a region 202 having randomly arranged through holes 50 is provided between the first domain 51A and the second domain 51B in the long side direction of the beam 13 (13A). In the region 202, the through holes 50 are not regularly arranged in a plan view. Alternatively, in the region 202, the area of ​​the region where the through holes 50 are regularly arranged in a plan view is, for example, 25P 2 Here, P is the period of the arrangement of the through holes 50. Other than this, the phononic crystal structure A in Fig. 10 has the same configuration as the phononic crystal structure A in Fig. 2A.

[0052] The phononic crystal structure A shown in FIG. 11 is a polycrystalline structure 52. The polycrystalline structure 52 includes a plurality of domains 51A, 51B, 51C, 51D, 51E, 51F, and 51G having different shapes in a plan view. In each domain, the period of the arrangement of the plurality of through holes 50 and the orientation of the unit cell are the same. However, the orientations of the unit cells are different from each other between the domains 51A to 51G. In addition, in a plan view, the sizes and shapes of the domains 51A to 51G are different from each other. In this embodiment, there are more orientations of the unit cells when viewed as a whole of the phononic crystal structure A compared to the embodiments exemplified so far. Therefore, the effect of reducing the thermal conductivity based on the difference in the orientation of the unit cell between the domains becomes more prominent. In addition, in this embodiment, the interface 55 between the domains extends in a plurality of random directions in a plan view. Therefore, the effect of reducing the thermal conductivity based on the interface resistance becomes more prominent.

[0053] 11, an interface 55 between the adjacent first domain 51A and second domain 51B extends in a direction tilted from the width direction of the beam 13 (13A) in a plan view. The interface 55 also has a bent portion in a plan view.

[0054] The polycrystalline structure 52, which is the phononic crystal structure A, may include a first domain 51A and a second domain 51B in which the period P of the arrangement of the through holes 50 and / or the diameter D of the through holes 50 are different from each other. The diameter D of the through holes 50 in the first domain 51A shown in Fig. 12A is different from the diameter D of the through holes 50 in the second domain 51B shown in Fig. 12B. The period P of the arrangement of the through holes 50 in the first domain 51A shown in Fig. 12A is the same as the period P of the arrangement of the through holes 50 in the second domain 51B shown in Fig. 12B.

[0055] The phononic crystal structure A shown in FIG. 13 has a first domain 51A in which a plurality of through holes 50 having a relatively small period P and a diameter D are regularly arranged, and a second domain 51B in which a plurality of through holes 50 having a relatively large period P and a diameter D are regularly arranged. The phononic crystal structure A in FIG. 13 also has a region 92 having a plurality of through holes 50 having a relatively small period P and a diameter D, and a region 93 having a plurality of through holes 50 having a relatively large period P and a diameter D. The region 92 and the region 93 are adjacent to each other. As in the example of FIG. 11, the region 92 and the region 93 each include a plurality of domains having different shapes from each other in a plan view and having unit lattice orientations different from each other. The region 92 and the region 93 also divide the phononic crystal structure A perpendicular to the macroscopic heat transfer direction. In this embodiment, the frequency band of the phononic band gap formed in the first domain 51A is different from the frequency band of the phononic band gap formed in the second domain 51B, and therefore the effect of reducing the thermal conductivity is particularly remarkable.

[0056] The phononic crystal structure A shown in Fig. 14 includes a first domain 51A in which a plurality of through holes 50 having a relatively small period P and diameter D are regularly arranged, and a second domain 51B in which a plurality of through holes 50 having a relatively large period P and diameter D are regularly arranged. The phononic crystal structure A in Fig. 14 includes a plurality of domains having different shapes from each other in a planar view and having unit cell orientations different from each other. In this embodiment, the frequency band of the phononic band gap formed in the first domain 51A is different from the frequency band of the phononic band gap formed in the second domain 51B, and therefore the effect of reducing the thermal conductivity is particularly remarkable.

[0057] The period P of the arrangement of the through holes 50 is, for example, 1 nm or more and 300 nm or less. This is because the wavelengths of heat-carrying phonons are mainly in the range of 1 nm to 300 nm. The period P is determined by the center-to-center distance between adjacent through holes 50 in a plan view (see FIGS. 12A and 12B).

[0058] The diameter D of the through hole 50 is expressed by the ratio D / P to the period P, and is, for example, D / P≧0.5. If the ratio D / P<0.5, the porosity in the beam 13 (13A, 13B) may be excessively reduced, and the thermal conductivity may not be sufficiently reduced. The upper limit of the ratio D / P is, for example, less than 0.9, since adjacent through holes 50 do not contact each other. The diameter D is the diameter of the opening of the through hole 50. If the shape of the opening of the through hole 50 is a circle in a plan view, the diameter D is the diameter of the circle. The shape of the opening of the through hole 50 does not have to be a circle in a plan view. In this case, the diameter D is determined by the diameter of a virtual circle having the same area as the area of ​​the opening (see FIGS. 12A and 12B).

[0059] The type of unit lattice 91 having a plurality of regularly arranged through holes 50 is, for example, a square lattice (FIG. 15A), a hexagonal lattice (FIG. 15B), a rectangular lattice (FIG. 15C), and a face-centered rectangular lattice (FIG. 15D). However, the type of unit lattice 91 is not limited to these examples.

[0060] The phononic crystal structure A that the first beam 13A and / or the second beam 13B may have is not limited to the above-mentioned structure. The phononic crystal structure A may be, for example, the structure disclosed in JP 2017-223644 A. However, in the phononic crystal structure A having two or more phononic crystal regions with different unit cell orientations as shown in each of the above-mentioned figures including FIG. 2A and FIG. 2B, the thermal conductivity of the beam 13 can be further reduced, that is, the thermal insulation can be further improved. This is for the following reason.

[0061] According to the study by the present inventors, the degree of reduction in thermal conductivity brought about by the phononic crystal structure depends on the angle between the direction of heat transfer and the orientation of the unit lattice of the phononic crystal structure. This is believed to be because factors related to heat transfer, such as the bandwidth of the PBG, the number of PBGs, and the average group velocity of phonons, depend on the angle. In addition, regarding the transfer of heat, phonons flow in a macroscopic direction from high temperature to low temperature. On the other hand, when focusing on a microscopic region on the order of nanometers, no directionality is observed in the direction in which phonons flow. That is, on a microscopic level, the direction in which phonons flow is not uniform. In the phononic crystal structure A having a plurality of phononic crystal regions in which the orientation of the unit lattice is uniform, the interaction is maximized for phonons flowing in a certain direction in the microscopic view, but the interaction is weakened for phonons flowing in other directions. On the other hand, in the phononic crystal structure A having two or more phononic crystal regions in which the orientations of the unit lattice are different from each other, the interaction for each phonon flowing in a plurality of directions in the microscopic view can be enhanced. This allows the thermal conductivity of the beam 13 to be further reduced.

[0062] (Embodiment 2) The infrared sensor of embodiment 2 is shown in Figures 16A and 16B. Figure 16A shows a cross section 16A-16A of the infrared sensor 1B of Figure 16B. The infrared sensor 1B is a bolometer type infrared sensor, which is a type of thermal type infrared sensor.

[0063] In the infrared sensor 1B, the infrared receiving section 12 further includes an infrared absorbing layer 24. The infrared absorbing layer 24 is disposed on the resistance change section 18. In this embodiment, the light receiving sensitivity of the infrared sensor 1B can be further improved. The infrared absorbing layer 24 of the infrared sensor 1B of the second embodiment is in direct contact with the resistance change section 18. In addition, the area of ​​the infrared absorbing layer 24 is smaller than the area of ​​the resistance change section 18 when viewed in a plan view. In addition, the infrared absorbing layer 24 is disposed so as to be surrounded by the resistance change section 18 when viewed in a plan view. However, the specific form of the infrared absorbing layer 24 is not limited to the examples shown in FIG. 16A and FIG. 16B.

[0064] The material constituting the infrared absorbing layer 24 is, for example, a metal such as Ti, Cr, Au, Al, or copper (Cu), an oxide such as SiO2, or a nitride such as TiN or silicon nitride (SiN). However, the material constituting the infrared absorbing layer 24 is not limited to the above example. When the infrared absorbing layer 24 has conductivity, it is desirable to arrange an insulating layer 25 between the resistance change section 18 and the infrared absorbing layer 24 as shown in FIG. 17A and FIG. 17B. The material constituting the insulating layer 25 is, for example, an oxide such as SiO2. However, the material constituting the insulating layer 25 is not limited to the above example. When the insulating layer 25 is arranged, the infrared receiving section 12 has the resistance change section 18, the insulating layer 25, and the infrared absorbing layer 24. The insulating layer 25 and the infrared absorbing layer 24 are laminated in this order on the resistance change section 18. Note that FIG. 17A shows a cross section 17A-17A of the infrared sensor 1B of FIG. 17B.

[0065] The thickness of the infrared absorbing layer 24 is, for example, 5 to 100 nm when the infrared absorbing layer 24 is conductive, and is, for example, 100 to 1000 nm when the infrared absorbing layer 24 is insulating. The thickness of the insulating layer 25 is, for example, 10 to 300 nm.

[0066] Other configurations, including preferred embodiments, of infrared sensor 1B of embodiment 2 are similar to the corresponding configurations of infrared sensor 1A of embodiment 1. Moreover, the operating principle of infrared sensor 1B of embodiment 2 is the same as the operating principle of infrared sensor 1A of embodiment 1.

[0067] (Embodiment 3) The infrared sensor of embodiment 3 is shown in Figures 18A and 18B. Figure 18A shows a cross section 18A-18A of infrared sensor 1C of Figure 18B. Infrared sensor 1C is a bolometer type infrared sensor, which is a type of thermal type infrared sensor.

[0068] The infrared sensor 1C further includes an insulating layer 26 on the base substrate 11. In a cross-sectional view, the insulating layer 26 is disposed between the upper surface 14 of the base substrate 11 and the first beam 13A and the second beam 13B (semiconductor layer 21). In a plan view, the insulating layer 26 is disposed so as to surround the infrared receiving section 12 and the infrared reflective film 23. In addition, the section between the signal readout terminal 22A and the first beam 13A in the first support 15A is surrounded by the insulating layer 26. The section between the signal readout terminal 22B and the second beam 13B in the second support 15B is surrounded by the insulating layer 26.

[0069] The material constituting the insulating layer 26 is, for example, an oxide such as SiO2, etc. However, the material constituting the insulating layer 26 is not limited to the above example.

[0070] In addition, in the infrared sensor 1C, both ends of the semiconductor layer 21 are amorphous regions 19.

[0071] Other configurations, including preferred embodiments, of infrared sensor 1C of embodiment 3 are similar to the corresponding configurations of infrared sensor 1A of embodiment 1 or infrared sensor 1B of embodiment 2. The operating principle of infrared sensor 1C of embodiment 3 is the same as the operating principle of infrared sensor 1A of embodiment 1.

[0072] Another specific example of the infrared sensor 1C of the third embodiment is shown in Figs. 19A and 19B. Fig. 19A shows a cross section 19A-19A of the infrared sensor 1C of Fig. 19B. In the infrared sensor 1C shown in Figs. 19A and 19B, the infrared receiving section 12 further has an infrared absorbing layer 24. The infrared absorbing layer 24 is disposed on the resistance change section 18. In this embodiment, the light receiving sensitivity of the infrared sensor 1C can be further improved. The infrared absorbing layer 24 may take any of the forms described above in the description of the second embodiment, including the preferred forms.

[0073] Another specific example of the infrared sensor 1C of the third embodiment is shown in Fig. 20A and Fig. 20B. Fig. 20A shows a cross section 20A-20A of the infrared sensor 1C of Fig. 20B. In the infrared sensor 1C shown in Fig. 20A and Fig. 20B, the infrared receiving section 12 further includes an insulating layer 25 and an infrared absorbing layer 24. The insulating layer 25 and the infrared absorbing layer 24 are laminated in this order on the resistance change section 18. The infrared absorbing layer 24 and the insulating layer 25 may take the forms described above in the description of the second embodiment, including the preferred forms.

[0074] (Embodiment 4) An infrared sensor of the fourth embodiment is shown in FIG. 21. The infrared sensor 1D shown in FIG. 21 is a bolometer type infrared sensor, which is a type of thermal infrared sensor. The infrared sensor 1D includes a base substrate 11, a bolometer infrared receiving unit 12, a first beam 13A, and a second beam 13B. Each of the first beam 13A and the second beam 13B has a connection portion 16A, 16B connected to the base substrate 11 and a separation portion 17 separated from the base substrate 11. The first beam 13A and the second beam 13B have a connection portion 16A, 16B at one end. Each of the first beam 13A and the second beam 13B is physically joined to the infrared receiving unit 12 at the separation portion 17. The position where the first beam 13A and the second beam 13B are physically joined to the infrared receiving unit 12 is the other end of each of the first beam 13A and the second beam 13B. The infrared receiving unit 12 is supported by a first beam 13A and a second beam 13B in a state spaced apart from the base substrate 11. This space improves thermal insulation between the base substrate 11 and the infrared receiving unit 12. The first beam 13A and the second beam 13B are conductive. The first beam 13A and the second beam 13B have a function of physically supporting the infrared receiving unit 12 and a function as a current path, i.e., wiring, for detecting the resistance of the resistance change unit 18 in the infrared receiving unit 12.

[0075] The base substrate 11 has a recess 27 on the upper surface 14 on which the infrared receiving unit 12 is provided. In a plan view, the area of ​​the recess 27 is larger than the area of ​​the infrared receiving unit 12. In addition, in a plan view, the infrared receiving unit 12 is surrounded by the outer edge of the recess 27. The recess 27 is located between the infrared receiving unit 12, the spaced portion 17 of the first beam 13A, and the spaced portion 17 of the second beam 13B, and the base substrate 11. The first beam 13A is physically connected to the base substrate 11 at the connection portion 16A. The second beam 13B is physically connected to the base substrate 11 at the connection portion 16B. In a cross-sectional view, the infrared receiving unit 12, the spaced portion 17 of the first beam 13A, and the spaced portion 17 of the second beam 13B are suspended above the recess 27 of the base substrate 11. This suspension enhances thermal insulation between the base substrate 11 and the infrared receiving unit 12.

[0076] In the infrared sensor 1D, the resistance of the resistance change section 18 included in the infrared receiving section 12 is read. For reading, the infrared sensor 1D shown in FIG. 21 further includes a ROIC (not shown) inside the base substrate 11. The connection section 16A of the first beam 13A and the ROIC are electrically connected. The connection section 16B of the second beam 13B and the ROIC are electrically connected. The resistance of the resistance change section 18 can be read via the first beam 13A and the second beam 13B. The infrared sensor 1D may include an additional member for reading the resistance of the resistance change section 18.

[0077] When infrared rays are incident on the infrared receiving section 12, the temperature of the infrared receiving section 12 rises. At this time, the temperature of the infrared receiving section 12 rises more greatly as it is thermally insulated from the base substrate 11, which is a heat bath. In the infrared sensor 1D including the bolometer infrared receiving section 12, the resistance of the resistance change section 18 changes with the rise in temperature. An electric signal corresponding to the changed resistance is processed by the ROIC to detect infrared rays. Depending on the processing, the infrared sensor 1D can measure the intensity of infrared rays and / or the temperature of an object. However, as described above, in the infrared sensor of the present disclosure, the reading of the resistance of the resistance change section 18 is not limited to the mode by the ROIC provided inside the base substrate 11.

[0078] The infrared sensor 1A of the first embodiment and the infrared sensor 1D of the fourth embodiment differ in the manner of suspending the infrared receiving unit 12, the first beam 13A, and the second beam 13B relative to the upper surface 14 of the base substrate 11. In addition, in the infrared sensor 1D of the fourth embodiment, an infrared reflective film 23 is disposed on the bottom surface of the recess 27. However, the configuration of the infrared sensor 1D is the same as that of the infrared sensor 1A in that the infrared reflective film 23 is disposed at a position facing the infrared receiving unit 12 on the surface of the base substrate 11. The other configurations of the infrared sensor 1D of the fourth embodiment are the same as the corresponding configurations of the infrared sensor 1A of the first embodiment, including the preferred embodiment. In addition, the infrared sensor 1D of the fourth embodiment may further include an infrared absorbing layer 24 that is included in the infrared sensors 1B and 1C of the second and third embodiments, or may further include an infrared absorbing layer 24 and an insulating layer 25.

[0079] The infrared sensor of the present disclosure may include any components other than those described above, as long as the effects of the present invention can be obtained.

[0080] [Infrared sensor array] In principle, the infrared sensors 1A to 1D of the first to fourth embodiments function as an infrared sensor by themselves. A plurality of infrared sensors may be arranged in an array on the base substrate 11, with each infrared sensor being one pixel. The arrangement is typically a two-dimensional array. The array structure in which a plurality of infrared sensors are arranged enables, for example, imaging of an object having a finite temperature and / or evaluation of the intensity distribution of infrared radiation or laser light. It is sufficient that at least a portion of the plurality of infrared sensors arranged in the array is the infrared sensor of the present disclosure. All of the plurality of infrared sensors arranged in the array may be the infrared sensor of the present disclosure. The present disclosure includes an infrared sensor array that includes a plurality of infrared sensors arranged in a two-dimensional array, and the plurality of infrared sensors includes the infrared sensor of the present disclosure.

[0081] [Infrared sensor manufacturing method] The infrared sensor of the present disclosure can be manufactured by a combination of various thin film formation methods such as chemical vapor deposition (CVD), sputtering, and deposition; various microfabrication and pattern formation methods such as electron beam lithography, photolithography, block copolymer lithography, and selective etching; and various modification methods such as amorphization, crystallization, and imparting conductivity by doping and ion implantation. Block copolymer lithography is suitable for forming the phononic crystal structure A. Doping with impurities can impart conductivity to a semiconductor. Amorphization can be achieved by implanting ions of elements constituting the base material of a crystalline semiconductor.

[0082] An example of a method for manufacturing the infrared sensor of the present disclosure will be described below with reference to Fig. 22A to Fig. 22Q. However, in the infrared sensor 1E manufactured by the following method, the first beam 13A and the second beam 13B have the phononic crystal structure A. The method for manufacturing the infrared sensor of the present disclosure is not limited to the following example.

[0083] FIG. 22A: A base substrate 11 is prepared. Next, a metal layer is formed on the upper surface 14 of the base substrate 11. The metal layer is, for example, a Cr layer. The metal layer is formed, for example, by sputtering. The thickness of the metal layer is, for example, 200 nm. A photoresist 101 is formed on the formed metal layer. The metal layer is microfabricated by photolithography and selective etching using the photoresist 101 to form an infrared reflective film 23, a first read terminal 22A, and a second read terminal 22B.

[0084] FIG. 22B: The photoresist 101 is removed. A sacrificial layer 102 is formed so as to cover the infrared reflective film 23, the first read terminal 22A, and the second read terminal 22B. The sacrificial layer 102 is, for example, a SiO2 layer. The sacrificial layer 102 is formed by, for example, CVD. The thickness of the sacrificial layer 102 is, for example, 1 to 4 μm. The thickness of the sacrificial layer 102 corresponds to the distance between the infrared receiving unit 2 and the base substrate 11 in the infrared sensor 1E manufactured by this method.

[0085] 22C: A crystalline semiconductor layer 103 is formed on the sacrificial layer 102. The semiconductor layer 103 is, for example, a Si layer or a SiGe layer. The semiconductor layer 103 is formed by, for example, CVD. The thickness of the semiconductor layer 103 is, for example, 100 nm.

[0086] FIG. 22D: A photoresist 104 is formed on the semiconductor layer 103. Regions 103A and 103B in the semiconductor layer 103 that are to become the first beam 13A and the second beam 13B are exposed by photolithography. Next, impurities are doped into the exposed regions 103A and 103B by ion implantation. The impurities are, for example, B or P. The ion implantation amount is, for example, 10 17 ~10 23 cm -3 and 10 19 ~10 21 cm -3 may be also possible.

[0087] FIG. 22E: The photoresist 104 is removed. The whole is activated by heating. The heating temperature is, for example, 1000° C. The activation process gives electrical conductivity to the ion-implanted regions 103A and 103B. The regions that have been given electrical conductivity will become the first beam 13A and the second beam 13B by subsequent fine processing and pattern formation.

[0088] FIG. 22F: Photoresist 105 is formed on the semiconductor layer 103. A region 103C of the semiconductor layer 103 to become the resistance change portion 18 is exposed by photolithography. Next, ions of the same element as the element constituting the base material of the semiconductor layer 103 are implanted into the exposed region 103C to amorphize the region 103C. The amorphized region 103C will become the resistance change portion 18 by subsequent microfabrication and pattern formation. Both ends of the semiconductor layer 103 are left as regions 107 that are crystalline but not conductive (see FIG. 22G).

[0089] FIG. 22G: A hard mask 106 is formed on the semiconductor layer 103. The hard mask 106 is, for example, a SiO2 layer. The hard mask 106 is formed by, for example, CVD. The hard mask 106 has a thickness of, for example, 25 nm. The hard mask 106 is used to form the phononic crystal structure A of the first beam 13A and the second beam 13B.

[0090] FIG. 22H: Photoresist 108 is formed on the hard mask 106. Photolithography is used to expose areas of the hard mask 106 that coincide in plan view with areas of the first beam 13A and the second beam 13B where the phononic crystal structure A is to be formed. Next, a self-assembled film 109 of a block copolymer is formed on the exposed areas of the hard mask 106. The self-assembled film 109 is used for block copolymer lithography to form the phononic crystal structure A.

[0091] Fig. 22I: By block copolymer lithography, a plurality of regularly arranged through-holes 110 are formed in the hard mask 106. The photoresist 108 and the self-assembled film 109 are removed.

[0092] Fig. 22J: A photoresist is formed on the hard mask 106. The semiconductor layer 103 is microfabricated and patterned by photolithography to form the first beam 13A, the second beam 13B, and the resistance change portion 18. The first beam 13A, the second beam 13B, and the resistance change portion 18 constitute a single semiconductor layer 21.

[0093] 22K: The photoresist on the hard mask 106 is removed. By selective etching using the hard mask 106 as a resist, a plurality of through holes 50 are formed in the first beam 13A and the second beam 13B, which are regularly arranged at positions corresponding to the plurality of through holes 110 in a plan view. The formed plurality of through holes 50 constitute the phononic crystal structure A.

[0094] FIG. 22L: The hard mask 106 is removed.

[0095] Fig. 22M: A photoresist 112 is formed on the semiconductor layer 21. Contact holes 113 are formed in the semiconductor layer 21 and the sacrificial layer 102 by photolithography to expose the first read terminal 22A and the second read terminal 22B.

[0096] 22N: A metal is deposited in the formed contact holes 113 to form the first pillar 15A and the second pillar 15B. The deposited metal is, for example, Al. The first pillar 15A and the second pillar 15B are formed by, for example, sputtering.

[0097] FIG. 22O: An insulating layer 25 is formed on the semiconductor layer 21. The formed insulating layer 25 is surrounded by the resistance change portion 18 in a plan view. The insulating layer 25 is, for example, a SiN layer. The insulating layer 25 is formed by, for example, CVD. The insulating layer 25 has a thickness of, for example, 20 nm. The insulating layer 25 can be formed by photolithography.

[0098] FIG. 22P: The infrared absorbing layer 24 is formed on the insulating layer 25. The formed infrared absorbing layer 24 is surrounded by the insulating layer 25 in a plan view. The infrared absorbing layer 24 is, for example, a TiN layer. The infrared absorbing layer 24 is formed by, for example, sputtering. The thickness of the infrared absorbing layer 24 is, for example, 8 nm.

[0099] FIG. 22Q: The sacrificial layer 102 is removed, for example, by gas-phase hydrogen fluoride (HF) etching. In this manner, the infrared sensor 1E, which is one embodiment of the infrared sensor of the present disclosure, is manufactured. Note that the insulating layer 26 can be formed by pattern-etching the sacrificial layer 102.

[0100] In the above manufacturing method, the resistance change material and the resistance change section 18 including the resistance change material are formed by injecting ions of elements constituting a crystalline semiconductor base material into the base material. In other words, the present disclosure is a manufacturing method for the infrared sensor of the present disclosure, and includes a method of forming the resistance change section 18 by injecting ions of elements constituting the crystalline base material into the base material.

[0101] In the infrared sensor 1E manufactured by the above manufacturing method, the infrared receiving section 12 includes a resistance change section 18 made of a resistance change material, and the resistance change section 18, the first beam 13A, and the second beam 13B are, respectively, an amorphous region and a crystalline region of a semiconductor layer 21 made of the same base material. In addition, in the above manufacturing method, a semiconductor layer 103, which is a crystalline layer made of a crystalline base material, is formed at a position separated from the base substrate 11 (FIG. 22C), and an amorphous region is formed in a part of the semiconductor layer 103 by injecting ions of an element constituting the base material into a part 103C of the formed semiconductor layer 103, thereby forming a semiconductor layer 21 having the resistance change section 18 corresponding to the formed amorphous region, and the first beam 13A and the second beam 13B corresponding to the crystalline region in which the crystalline quality of the base material is maintained. In other words, the present disclosure is a method for manufacturing an infrared sensor of the present disclosure, which includes the following method: the resistance change portion, and the first and second beams are the amorphous and crystalline regions of a semiconductor layer made of the above-mentioned base material, respectively. A crystalline layer made of a crystalline base material is formed at a position spaced apart from a base substrate, and an amorphous region is formed in a part of the crystalline layer by injecting ions of an element constituting the base material into a partial region of the formed crystalline layer, thereby forming a semiconductor layer having a resistance change portion corresponding to the formed amorphous region, and a first and second beams corresponding to the crystalline region in which the crystallinity of the base material is maintained. [Industrial Applicability]

[0102] The infrared sensors of the present disclosure can be used in a variety of applications, including applications for conventional infrared sensors. [Explanation of symbols]

[0103] 1A, 1B, 1C, 1D, 1E Infrared sensors 11 Base board 12 (Bolometer) Infrared receiver 13 Beam 13A 1st beam 13B 2nd beam 14 Top side 15A 1st pillar 15B 2nd pillar 16A (First Beam) Connection 16B (Second beam) connection 17 Separation part 18 Resistance change section 19 Amorphous Region 20A,20B Crystalline region 21 Semiconductor layer 22A 1st readout terminal 22B Second read terminal 23 Infrared reflective film 24 Infrared absorbing layer 25 Insulating layer 26 Insulating layer 27 Recess 50 Through hole 51A First Domain 51B Second Domain 52 Phononic polycrystalline structures 53A,53B Direction 55 Interface 31A First Pillar 31B Second Pillar 91, 91A, 91B Unit Cell 92 areas 93 areas 101 Photoresist 102 Sacrificial Layer 103 Semiconductor layer 103A, 103B, 103C area 104 Photoresist 105 Photoresist 106 Hard Mask 107 areas 108 Photoresist 109 Self-assembled membrane 110 Through hole 112 Photoresist 113 Contact Hole 201 areas 202 areas

Claims

1. 1. An infrared sensor comprising: A base substrate; Bolometer type infrared receiver; A first beam; and Second beam; Equipped with Where: Each of the first beam and the second beam has a connection portion connected to the base substrate and / or a member on the base substrate, and a separation portion separated from the base substrate, and is physically joined to the infrared receiving unit at the separation portion, the infrared receiving unit is supported by the first beam and the second beam in a state spaced apart from the base substrate, the infrared receiving unit includes a resistance change unit made of a resistance change material whose electrical resistance changes depending on temperature, the resistance change portion is made of an amorphous semiconductor, each of the first beam and the second beam is made of a crystalline semiconductor made of the same base material as a base material of the resistance change material, and is electrically connected to the resistance change portion at the separation portion; A section of the first beam located between a joint portion with the infrared receiving unit and the connection portion has a first phononic crystal structure having a plurality of regularly arranged through holes, A section of the second beam located between a joint with the infrared receiving unit and the connection unit has a second phononic crystal structure having a plurality of regularly arranged through holes, The first phononic crystal structure includes a first domain and a second domain that are phononic crystal regions; the first domain includes the plurality of through holes regularly arranged in a first direction in a plan view, the second domain includes the plurality of through holes regularly arranged in a second direction different from the first direction in a plan view, The second phononic crystal structure includes a third domain and a fourth domain which are phononic crystal regions; the third domain includes the plurality of through holes regularly arranged in a third direction in a plan view, the fourth domain has the plurality of through holes regularly arranged in a fourth direction different from the third direction in a plan view; Infrared sensor.

2. 2. The infrared sensor according to claim 1, The base material is silicon or silicon germanium; Infrared sensor.

3. 3. The infrared sensor according to claim 1, The infrared receiving unit further includes an insulating layer and an infrared absorbing layer, the insulating layer and the infrared absorbing layer are laminated in this order on the resistance change section; Infrared sensor.

4. The infrared sensor according to any one of claims 1 to 3, The resistance change portion, the first beam, and the second beam are an amorphous region and a crystalline region of a semiconductor layer made of the base material, respectively. Infrared sensor.

5. The infrared sensor according to any one of claims 1 to 4, The infrared sensor further includes a first support and a second support disposed on the base substrate and extending in a direction away from an upper surface of the base substrate; Where: the first support pillar and the second support pillar are electrically conductive; The first beam is connected to the first column at the connection portion, The second beam is connected to the second column at the connection portion, In a cross-sectional view, the infrared receiving unit, the first beam, and the second beam are suspended above the base substrate by the first support and the second support. Infrared sensor.

6. The infrared sensor according to any one of claims 1 to 4, The base substrate has a recess, the recess is located between the infrared receiving portion, the separated portion of the first beam, and the separated portion of the second beam and the base substrate, each of the first beam and the second beam is connected to the base substrate at the connection portion; In a cross-sectional view, the infrared receiving portion, the spaced portion of the first beam, and the spaced portion of the second beam are suspended above the recess of the base substrate. Infrared sensor.

7. The infrared sensor according to any one of claims 1 to 6, The infrared sensor further includes an infrared reflective film at a position facing the infrared receiving unit on the surface of the base substrate. Infrared sensor.

8. The infrared sensor according to any one of claims 1 to 7, The infrared sensor further comprises a readout integrated circuit (ROIC) within the base substrate. Infrared sensor.

9. 1. An infrared sensor array, comprising: A plurality of infrared sensors arranged in a two-dimensional array are provided, Where: The plurality of infrared sensors include an infrared sensor according to any one of claims 1 to 8. Infrared sensor array.

10. A method for manufacturing an infrared sensor according to any one of claims 1 to 8, comprising the steps of: Where: The resistance change portion is formed by implanting ions of an element constituting the crystalline base material into the base material. A method for manufacturing an infrared sensor.

11. A method for manufacturing an infrared sensor according to claim 10, comprising the steps of: the resistance change portion, the first beam, and the second beam are an amorphous region and a crystalline region of a semiconductor layer made of the base material, respectively; Where: forming a crystalline layer composed of the crystalline base material at a position spaced apart from the base substrate; forming an amorphous region in a portion of the crystalline layer by implanting ions of an element constituting the base material into a partial region of the formed crystalline layer, thereby forming the semiconductor layer having the resistance change portion corresponding to the formed amorphous region, and the first beam and the second beam corresponding to a crystalline region in which the crystallinity of the base material is maintained; A method for manufacturing an infrared sensor.

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