Electroplating anode and electroplating method using the same

Abstract

An embodiment of the present application provides an electroplating anode and an electroplating method using the electroplating anode. The electroplating anode forms an electric field with a cathode (a target of electroplating) having a concave-convex shape to form an electroplating layer on the surface of the cathode. The electroplating anode includes a conductive plate, the shape of which matches the shape of the cathode, with the convex portions of the conductive plate corresponding to the concave portions of the cathode, and the concave portions of the conductive plate corresponding to the convex portions of the cathode. Alternatively, the electroplating anode includes an insulating back plate and a plurality of conductive units, each of which includes a body and a head disposed at one end of the body, the end of the body where the head is disposed being an electroplating terminal for the conductive unit, the conductive units being fixed to the insulating back plate by the body, the plurality of conductive units being arranged in an array, and any two conductive units being electrically insulated. The electric field formed between the electroplating anode and the cathode (a target of electroplating) is uniformly distributed, or the electric field is strengthened or weakened in local regions.

Description

[Technical field]

[0001] This application claims priority to a Chinese patent application, application number 201910935348.2, filed with the State Intellectual Property Office of the People's Republic of China on September 29, 2019, the entire contents of which are incorporated herein by reference.

[0002] FIELD OF THE DISCLOSURE This application relates to the art of electroplating printed circuit boards, including electroplating anodes and electroplating methods using the electroplating anodes. [Background technology]

[0003] At present, the most challenging printed circuit board for the manufacturing technology and process of related technology has the following characteristics: 1. The board thickness is 10cm or more. 2. The board surface size is 120cm x 120cm or more. 3. The aspect ratio of the holes is 15:1 or 20:1 or more. 4. The arrangement of densely arranged holes and sparsely distributed sporadic holes coexist, and the aspect ratio of the holes changes variably. For the above printed circuit board, high-end printed circuit board manufacturers and their clients have the following quality requirements or demands: 1. In the holes, the copper deposition thickness reaches the desired thickness, and on the surface, the copper deposition thickness is not excessively thick; 2. In the through holes, the copper is deposited in an "X" shape or the through holes are filled with copper; and 3. On the surface, the copper is deposited uniformly.

[0004] [Table 1]

[0005] In summary, the difficulty in manufacturing the above-mentioned thick printed circuit boards is that the related art cannot simultaneously meet the following performance requirements: 1. In the hole, the copper deposition thickness reaches the desired thickness; 2. At the same time, on the surface, the copper deposition thickness is not excessively large; 3. Within the through-holes, copper is deposited in an "X" shape or the through-holes are filled with copper; on the surface, copper is deposited uniformly. Summary of the Invention [Problem to be solved by the invention]

[0006] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present application provides an electroplating anode and an electroplating method using the electroplating anode to uniformize electroplating on a surface of a cathode or to enhance localized electroplating on a surface of a cathode. [Means for solving the problem]

[0007] In a first aspect, an electroplating anode according to an embodiment of the present application forms an electric field with a cathode, which is an object to be electroplated and has a bumpy shape, to form an electroplating layer on a surface of the cathode, and includes a conductive plate, the shape of the conductive plate matches the shape of the cathode, the convex portions of the conductive plate correspond to the concave portions of the cathode, and the concave portions of the conductive plate correspond to the convex portions of the cathode.

[0008] In a second aspect, the electroplating anode according to the embodiment of the present application forms an electric field with a cathode having a concave-convex shape as an electroplating target to form an electroplating layer on a surface of the cathode; an insulating back plate; and a plurality of conductive units, each of which includes a body and a head installed at one end of the body, the end of the body where the head is installed is an electroplating terminal of the conductive unit, and the conductive unit is fixed to the insulating backplate by one end of the body away from the head, the plurality of conductive units are arranged in an array, and any two of the conductive units are electrically insulated.

[0009] In a third aspect, an embodiment of the present application provides an electroplating method using the electroplating anode according to the first aspect, the electroplating anode forms an electric field with a cathode, which is an object to be electroplated, having a concave-convex shape to form an electroplating layer on a surface of the cathode, and includes a conductive plate, the shape of the conductive plate matches the shape of the cathode, the convex portions of the conductive plate correspond to the concave portions of the cathode, and the concave portions of the conductive plate correspond to the convex portions of the cathode; The electroplating method includes: obtaining a morphology of an anode based on a target morphology of the cathode; manufacturing a mold substrate, the shape of one side of which matches the shape of the cathode, the convex portions of which correspond to the concave portions of the cathode, and the concave portions of which correspond to the convex portions of the cathode, based on the shape of the anode; manufacturing the electroplating anode based on the mold substrate; applying an electroplating signal to the electroplating anode.

[0010] In a fourth aspect, an embodiment of the present application provides an electroplating method using the electroplating anode according to the second aspect, the electroplating anode forms an electric field with a cathode, which is an object to be electroplated and has an uneven shape, to form an electroplating layer on a surface of the cathode, and the method includes: an insulating back plate; and a plurality of conductive units, each of which includes a body and a head disposed at one end of the body, the end of the body where the head is disposed is an electroplating terminal of the conductive unit, the conductive units are fixed to the insulating back plate by the body, the plurality of conductive units are arranged in an array, and any two of the conductive units are electrically insulated from each other; The electroplating method includes: obtaining an anode morphology and an anode surface current distribution based on the cathode morphology; Controlling the distance between each head and the insulating backplate based on a configuration of the anode, and controlling to apply an individual electroplating signal to each conductive unit based on the anode surface current distribution, or controlling the distance between all of the heads and the insulating backplate to be the same and controlling to apply an individual electroplating signal to each conductive unit based on the anode surface current distribution, or controlling the distance between each head and the insulating backplate based on a configuration of the anode and applying the same electroplating signal to all of the conductive units.

[0011] In a fifth aspect, the present application provides an electroplating apparatus, comprising a first electroplating anode, a second electroplating anode, and a cathode; The first electroplating anode and the second electroplating anode both use electroplating anodes according to the second embodiment, the cathode includes a first surface and a second surface, the shape of the first electroplating anode matches the shape of the first surface of the cathode, the shape of the second electroplating anode matches the shape of the second surface of the cathode, the first electroplating anode faces the first surface of the cathode and forms an electric field with the cathode to form an electroplating layer on the first surface of the cathode, and the second electroplating anode faces the second surface of the cathode and forms an electric field with the cathode to form an electroplating layer on the second surface of the cathode. [Brief description of the drawings]

[0012] [Figure 1A] FIG. 1 is a schematic diagram of an electroplating anode according to an embodiment of the present application. [Figure 1B] FIG. 2 is a schematic diagram of another electroplating anode according to an embodiment of the present application. [Figure 1C] FIG. 2 is a schematic diagram of yet another electroplating anode according to an embodiment of the present application. [Diagram 2] FIG. 2 is a schematic diagram of yet another electroplating anode according to an embodiment of the present application. [Diagram 3] FIG. 3 is a schematic top view of the electroplating anode shown in FIG. 2. [Figure 4]FIG. 2 is a schematic diagram of yet another electroplating anode according to an embodiment of the present application. [Diagram 5] FIG. 2 is a schematic diagram of yet another electroplating anode according to an embodiment of the present application. [Figure 6] FIG. 6 is a top view of a partial structure of the electroplating anode shown in FIG. 5. [Figure 7] FIG. 2 is a schematic diagram of yet another electroplating anode according to an embodiment of the present application. [Figure 8] FIG. 2 is a schematic diagram of yet another electroplating anode according to an embodiment of the present application. [Figure 9] FIG. 2 is a schematic diagram of yet another electroplating anode according to an embodiment of the present application. [Figure 10] FIG. 2 is a schematic diagram of yet another electroplating anode according to an embodiment of the present application. [Figure 11] FIG. 2 is a schematic diagram of yet another electroplating anode according to an embodiment of the present application. [Figure 12] FIG. 2 is a schematic diagram of yet another electroplating anode according to an embodiment of the present application. [Figure 13] FIG. 2 is a schematic diagram of yet another electroplating anode according to an embodiment of the present application. [Figure 14] FIG. 2 is a schematic diagram of yet another electroplating anode according to an embodiment of the present application. [Figure 15] FIG. 2 is a schematic diagram of yet another electroplating anode according to an embodiment of the present application. [Figure 16] 1 is a flow chart of an electroplating method using an electroplating anode according to one embodiment of the present application. [Figure 17] 1 is a schematic diagram of the manufacture of an electroplating anode according to an embodiment of the present application. [Figure 18] 17 is a flowchart showing detailed steps included in step S130 in FIG. 16. [Figure 19] 1 is a schematic diagram of the manufacture of another electroplating anode according to an embodiment of the present application. [Figure 20] 4 is a flow chart of another electroplating method using an electroplating anode according to an embodiment of the present application. [Figure 21] 1 is a flow chart of yet another electroplating method using an electroplating anode in accordance with an embodiment of the present application. [Figure 22] 1 is a flow chart of yet another electroplating method using an electroplating anode in accordance with an embodiment of the present application. [Figure 23] 1 is a flow chart for manufacturing an electroplating anode according to an embodiment of the present application. [Figure 24] 1 is a schematic diagram of the manufacture of yet another electroplating anode according to an embodiment of the present application. [Diagram 25] 1 is a schematic configuration diagram of an electroplating apparatus according to an embodiment of the present application. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] According to the knowledge of researchers, in the related art, a flat plate-like or mesh-like electroplating anode is usually used to form an electric field with the cathode, which is the object of electroplating, to form the metal to be electroplated on the surface of the cathode. Since the cathode has an uneven morphology, the electric field formed by the convex parts of the cathode and the electroplating anode is different from the electric field formed by the concave parts of the cathode and the electroplating anode, so that the electroplating on the surface of the cathode is non-uniform. The cathode to be electroplated can be, for example, a printed circuit board, and the morphology of the cathode can be, for example, the morphology of one side surface or the morphology of both sides of the printed circuit board.

[0014] In order to avoid the above situation, the present application proposes various embodiments according to the general application concept, which is to modify the anode shape or electroplating signals of multiple parts of the electroplating anode based on the cathode shape to uniformize electroplating on the surface of the cathode or to enhance local electroplating on the surface of the cathode.

[0015] In this embodiment, the form of the anode (the form of the electroplating anode) is the form of a conductive plate or a form in which the heads of multiple conductive units are configured together, and similarly, the anode surface current distribution (the surface current distribution of the electroplating anode) is the effective surface current distribution from the surface current distribution of the conductive plate or the surface current distribution of the heads of multiple conductive units.

[0016] 1A is a schematic diagram of an electroplating anode according to an embodiment of the present application, and as shown in FIG. 1A, an electroplating anode 1 forms an electric field with a cathode 2, which is an object to be electroplated and has an uneven shape, to form an electroplating layer on the surface of the cathode 2 (FIG. 1A shows an example in which the surface of one side of the cathode 2 has unevenness), and includes a conductive plate, the shape of which matches or substantially matches the shape of the cathode 2, the convex parts of the conductive plate correspond to the concave parts of the cathode 2, and the concave parts of the conductive plate correspond to the convex parts of the cathode 2. FIG. 1A only illustrates a situation in which the shape of the conductive plate is composed of continuous straight lines, and the present application is not limited thereto, and in actual applications, the shape of the conductive plate can be reasonably set according to actual manufacturing needs.

[0017] In one embodiment, as shown in FIG. 1B, the electroplating anode 1 further includes a cathode surface morphology detector 17, an electric field distribution simulation optimizer 16, an electric field distribution controller 15 and an electroplating signal controller 13, wherein an input terminal of the electric field distribution simulation optimizer 16 is electrically connected to the cathode surface morphology detector 17, an output terminal of the electric field distribution simulation optimizer 16 is electrically connected to the electric field distribution controller 15, the electric field distribution controller 15 is electrically connected to the electroplating signal controller 13, the electroplating signal controller 13 is electrically connected to the conductive plate, and the electroplating signal controller 13 is configured to apply an electroplating signal to the conductive plate.

[0018] The electric field distribution simulation optimizer 16 is configured to obtain initial cathode morphology information from the cathode surface morphology detector 17 before starting electroplating, and to simulate the electric field between the electroplating anode 1 and the cathode 2 and the deposition of the electroplating material on the cathode 2 using the initial cathode morphology information, the initial anode morphology, and the initial anode surface current distribution as a model, and obtain the morphology of the electroplating anode 1 (i.e., the morphology of the conductive plate in FIG. 1A, which cannot be changed once the morphology of the conductive plate is formed) and the optimized anode surface current distribution through an optimization algorithm based on the set optimization target, i.e., the specific distribution and thickness of the electroplating material on the surface of the cathode, and transmit the information of the optimized anode surface current distribution to the electric field distribution controller 15. The electric field distribution controller 15 is configured to transmit the information of the optimized anode surface current distribution to the electric field distribution controller 15 based on the electroplating signal output by the electroplating signal controller 13 to the conductive plate. During electroplating, the electric field distribution simulation optimizer 16 obtains real-time cathode morphology information from the cathode surface morphology detector 17, and uses the real-time cathode morphology information, the morphology of the conductive plate and the current anode surface current distribution as a model to simulate the electric field between the electroplating anode 1 and the cathode 2 and the deposition of the electroplating material on the cathode 2, and obtains a more optimized anode surface current distribution through an optimization algorithm based on the set optimization target, and transmits the information of the more optimized anode surface current distribution to the electric field distribution controller 15, which controls the electroplating signal controller 13 to output to the conductive plate, and during electroplating, the electric field distribution simulation optimizer 16 repeats the optimization until the morphology of the cathode 2 reaches the optimization target or the difference from the optimization target reaches a preset value.

[0019] In this embodiment, the cathode surface morphology detector 17 can scan the morphology information of the cathode 2 using a non-contact method such as X-rays, gamma rays, ultrasound, light, or electromagnetic waves, and obtain a three-dimensional image of the cathode 2.

[0020] In one embodiment, as shown in FIG. 1C, the electroplating anode 1 further includes an electric field distribution simulation optimizer 16, an electric field distribution controller 15 and an electroplating signal controller 13.

[0021] The electric field distribution controller 15 is electrically connected to the electroplating signal controller 13 and the electric field distribution simulation optimizer 16, respectively, and the electroplating signal controller 13 is electrically connected to the conductive plate.

[0022] The electroplating signal controller 13 is set to apply an electroplating signal to the conductive plate, and the electric field distribution simulation optimizer 16 is set to simulate the electric field between the electroplating anode 1 and the cathode 2 and the deposition of the electroplating material on the cathode 2 using the input initial cathode morphology information, initial anode morphology, and initial anode surface current distribution as a model before starting electroplating, and obtain the morphology of the electroplating anode 1 (i.e., the morphology of the conductive plate in FIG. 1A, which cannot be changed once the morphology of the conductive plate is formed) and an optimized anode surface current distribution by an optimization algorithm based on the set optimization target, i.e., the specific distribution and thickness of the electroplating material on the surface of the cathode 2, and transmit the information of the optimized anode surface current distribution to the electric field distribution controller 15, and the electric field distribution controller 15 controls the electroplating signal output by the electroplating signal controller 13 to the conductive plate.

[0023] In one embodiment, as shown in FIG. 1C, the electroplating anode 1 further includes an electric field distribution simulation optimizer 16, an electric field distribution controller 15 and an electroplating signal controller 13.

[0024] The electric field distribution controller 15 is electrically connected to the electroplating signal controller 13 and the electric field distribution simulation optimizer 16, respectively, and the electroplating signal controller 13 is electrically connected to the conductive plate.

[0025] The electroplating signal controller 13 is set to apply an electroplating signal to the conductive plate. The electric field distribution simulation optimizer 16 simulates an electric field between the electroplating anode 1 and the cathode 2 and deposition of an electroplating material on the cathode 2 using input initial cathode morphology information, initial anode morphology, and initial anode surface current distribution as models before starting electroplating, and obtains a shape of the electroplating anode 1 (i.e., the shape of the conductive plate in FIG. 1A, which cannot be changed once the shape of the conductive plate is formed) and an optimized anode surface current distribution by an optimization algorithm based on a set optimization target, i.e., a specific distribution and thickness of an electroplating material on the surface of the cathode 2, and obtains a cathode morphology after this optimization that is closer to the optimization target, and transmits information of the optimized anode surface current distribution to the electric field distribution controller 15. The electric field distribution controller 15 is set to transmit information of the optimized anode surface current distribution to the electric field distribution controller 15. The electric field distribution controller 15 is set to transmit information of the optimized anode surface current distribution to the electric field distribution controller 15. The electric field distribution controller 15 transmits information of the optimized anode surface current distribution to the electric field distribution controller 15. The electric field distribution controller 16 ... During electroplating, the electric field distribution simulation optimizer 16 simulates the electric field between the electroplating anode 1 and the cathode 2 and the deposition of electroplating material on the cathode 2 using the shape of the conductive plate and the current anode surface current distribution as a model based on the shape of the cathode closest to the optimization target after the previous optimization, and obtains a more optimized anode surface current distribution through the optimization algorithm based on the set optimization target, and obtains the shape of the cathode closest to the optimization target after the current optimization, and is set to transmit information of the more optimized anode surface current distribution to the electric field distribution controller 15, and the electric field distribution controller 15 controls the electroplating signal controller 13 to output to the conductive plate, and during electroplating, the electric field distribution simulation optimizer 16 repeats optimization until the shape of the cathode 2 reaches the optimization target or the difference from the optimization target reaches a preset value.

[0026] In this embodiment, the morphology of the anode is modified based on the morphology of the cathode to make the morphology of the electroplating anode match or substantially match the morphology of the cathode, i.e., convex portions of the electroplating anode correspond to concave portions of the cathode and concave portions of the electroplating anode correspond to convex portions of the cathode. In this way, the electric fields formed by each portion of the cathode and the electroplating anode match or tend to match, thereby uniforming electroplating on the surface of the cathode or enhancing localized electroplating on the surface of the cathode.

[0027] FIG. 2 is a schematic diagram of yet another electroplating anode according to an embodiment of the present application, and FIG. 3 is a schematic diagram of the top surface of the electroplating anode shown in FIG. 2. As shown in FIGS. 2 and 3, the electroplating anode 1 forms an electric field with the cathode 2, which is an object of electroplating having an uneven shape, to form an electroplating layer on the surface of the cathode 2. The electroplating anode 1 includes an insulating back plate 12 and a plurality of conductive units 11. Each conductive unit 11 includes a body 111 and a head 112 installed at one end of the body 111. The end of the body 111 where the head 112 is installed is the electroplating terminal of the conductive unit 11. An electric field is formed between the head 112 of the conductive unit 11 and the cathode 2, and metal ions in the electroplating solution are deposited on the surface of the cathode to electroplate the cathode 2. For example, a copper layer can be formed by electroplating a printed circuit board. The conductive unit 11 is fixed to the insulating back plate 12 by the body 111. A plurality of conductive units 11 are arranged in an array, and any two conductive units 11 are electrically insulated from each other.

[0028] In this embodiment, the electroplating anode is discretized into multiple conductive units that do not contact each other, i.e., the continuous large surface is discretized into discontinuous small surfaces, and the anode morphology can be changed by changing the distance from the top of the conductive units to the cathode, and the electroplating signal of each "discontinuous small surface" of the electroplating anode is changed by changing the magnitude or mode of the electroplating signal applied to the conductive units, so that at least one of the anode morphology and the electroplating signal of each "discontinuous small surface" of the electroplating anode is changed based on the cathode morphology to uniformize electroplating on the surface of the cathode or enhance localized electroplating on the surface of the cathode. The electroplating signal may be, for example, a current, a voltage, or a power, and may be a direct current or a pulsed current.

[0029] The embodiments of the present application can achieve at least the following: 1. In holes with aspect ratios of 15:1 or 20:1 or more, the electric field distribution in the hole or the surface current distribution on the inner wall of the hole can be accurately controlled, and the thickness of the electroplating on the surface of the inner wall of the hole can be controlled or the hole can be filled with the electroplating (e.g., copper). 2. The plate surface size of the electroplating anode is 120cm x 120cm or more, the surface electric field distribution or surface current distribution of the plate can be accurately controlled, the electroplating material on the surface is distributed uniformly, and the thickness of the electroplating material on the surface can be controlled. 3. Rapid electroplating.

[0030] In one embodiment, as shown in Fig. 3, the shape of the vertical projection of the heads 112 on the insulating backplate 12 is a regular hexagon. The multiple heads 112 are arranged in an array. The multiple heads 112 are arranged in a row in sequence, and the heads 112 of two adjacent rows are arranged in a staggered pattern. In other embodiments, the shape of the vertical projection of the heads 112 on the insulating backplate 12 may be a square, a rectangle, a circle, an ellipse, or other shape, which is not limited to the embodiments of the present application.

[0031] 4 is a schematic diagram of yet another electroplating anode according to an embodiment of the present application. As shown in FIG. 4, the electroplating anode 1 includes two insulating back plates 12, and a body 111 is fixed to the two insulating back plates 12. The two insulating back plates 12 improve the robustness between the insulating back plates 12 and the body 111, making the body 111 less likely to shake, and more accurately controlling the position of the head 112 and the electric field between the head 112 and the cathode 2, thereby improving the electroplating effect of the cathode 2.

[0032] 5 is a schematic diagram of yet another electroplating anode according to an embodiment of the present application. As shown in FIG. 5, the surface of the head 112 away from the insulating backplate 12 is a convex curved surface. The convex curved surface protrudes in a direction away from the insulating backplate 12. In this embodiment, the head 112 having a convex curved surface increases the surface area of ​​the electroplating anode. In other embodiments, the surface of the head 112 away from the insulating backplate 12 may have other shapes.

[0033] Fig. 6 is a top view of a partial structure of the electroplating anode shown in Fig. 5. As shown in Figs. 5 and 6, the electroplating anode 1 further includes an insulating screw 114 and an insulating nut 113. The insulating nut 113 is fixed to the insulating back plate 12, the insulating screw 114 surrounds the body 111, and the insulating screw 114 and the insulating nut 113 are screwed together. In this embodiment, by rotating the insulating screw 114 in the insulating nut 113, the distance between each head 112 and the insulating back plate 12 can be controlled, and the distance between each head 112 and the cathode 2 can be controlled.

[0034] In one embodiment, as shown in FIG. 5 , the electroplating anode 1 may further include a terminal 115, which is located at one end of the body 111 away from the head 112, and the body 111 and the head 112 of the conductive unit 11 may be electrically connected to a power supply line via the terminal 115 electrically connected to the body 111.

[0035] 7 is a schematic diagram of yet another electroplating anode according to an embodiment of the present application. As shown in FIG. 7, the surface of the head 112 away from the insulating back plate 12 is flat. Since the head 112 has a flat shape and the head 112 and the cathode 2 form a locally uniform electric field, the difficulty of installing the conductive unit 11 is reduced and the cost is reduced.

[0036] 8 is a schematic diagram of another electroplating anode according to an embodiment of the present application. As shown in FIG. 8, the electroplating anode 1 further includes an electroplating signal controller 13 and a plurality of power supply lines 132, one conductive unit 11 is electrically connected to the electroplating signal controller 13 via one power supply line 132, and the electroplating signal controller 13 is configured to apply an electroplating signal to the conductive unit 11.

[0037] In one embodiment, as shown in Figures 8 and 9, the electroplating anode 1 further includes a driver controller 14 and a plurality of drivers 141. The electric field distribution controller 15 is electrically connected to the driver controller 14, which is electrically connected to a plurality of drivers 141, and each driver 141 is connected to one end of the corresponding body 111 away from the head 112. The electric field distribution controller 15 controls the driving signal output by the driver controller 14 to the driver 141, and each driver 141 is set to adjust the shape of the electroplating anode by controlling the distance between the head 112 and the insulating back plate 12, and can control the distance between the head 112 and the cathode 2.

[0038] In one embodiment, as shown in FIG. 8, the electroplating anode 1 includes two insulating back plates 12, and the body 111 is fixed to the two insulating back plates 12, and the body 111 can move along a direction perpendicular to the insulating back plate 12, but cannot move along other directions. The part where the power supply line 132 and the conductive unit 11 are electrically connected is located between the two insulating back plates 12. In this embodiment, since the part where the power supply line 132 and the conductive unit 11 are electrically connected is located between the two insulating back plates 12, the power supply line 132 can be protected by the two insulating back plates 12. Meanwhile, since the part where the power supply line 132 and the conductive unit 11 are electrically connected is located between the two insulating back plates 12, the part where the power supply line 132 and the conductive unit 11 are electrically connected uses the space between the two insulating back plates 12 without using any space other than the two insulating back plates 12, thereby improving the space utilization rate and increasing the integration degree of components in the electroplating anode 1.

[0039] In one embodiment, the electroplating anode 1 may include only one insulating backplate 12, with the body 111 fixed to the insulating backplate 12, such that the body 111 can move along a direction perpendicular to the insulating backplate 12, but cannot move along other directions.

[0040] 8 , the electroplating anode 1 further includes a cathode surface morphology detector 17, an electric field distribution simulation optimizer 16 and an electric field distribution controller 15. An input terminal of the electric field distribution simulation optimizer 16 is electrically connected to the cathode surface morphology detector 17, an output terminal of the electric field distribution simulation optimizer 16 is electrically connected to the electric field distribution controller 15, which is further electrically connected to the electroplating signal controller 13, and the electric field distribution controller 15 is further electrically connected to the driver controller 14. In the initial stage of electroplating, the electric field distribution simulation optimizer 16 obtains the initial cathode morphology information from the cathode surface morphology detector 17, and uses the initial cathode morphology information, the initial anode morphology and the initial anode surface current distribution as a model to simulate the electric field between the electroplating anode and the cathode and the deposition of the electroplating material at the cathode, and obtains the optimized anode morphology and the optimized anode surface current distribution by the optimization algorithm based on the set optimization target (target morphology of the cathode), i.e., the specific distribution and thickness of the electroplating material on the surface of the cathode, and is set to transmit the information of the optimized anode morphology and the optimized anode surface current distribution to the electric field distribution controller 15, which controls the electroplating signal controller 13 to output to the conductive unit 11, and the electric field distribution controller 15 controls the driver controller 14 to transmit different control signals to each driver 141, and the control signals include different extension or contraction distances of each body 111 to adjust the morphology of the anode.During electroplating, the electric field distribution simulation optimizer 16 obtains real-time cathode morphology information from the cathode surface morphology detector 17, and uses the real-time cathode morphology information, the current anode morphology, and the current anode surface current distribution as a model to simulate the electric field between the electroplating anode and the cathode and the deposition of electroplating material on the cathode, and obtains a more optimized anode morphology and a more optimized anode surface current distribution through an optimization algorithm based on the set optimization target, and is set to transmit the information of the more optimized anode morphology and the more optimized anode surface current distribution to the electric field distribution controller 15, which controls the electroplating signal controller 13 to output to the conductive unit 11, and the electric field distribution controller 15 controls the driver controller 14 to transmit different control signals to each driver 141, the control signals including different extension or contraction distances of each body 111 to adjust the anode morphology, and during electroplating, the electric field distribution simulation optimizer 16 repeats the optimization until the cathode morphology reaches the optimization target or the difference from the optimization target reaches a preset value. In this embodiment, based on the real-time thickness and distribution of the electroplating material on the surface of the cathode collected in real time, the electroplating simulation software adjusts the anode shape, power supply, mode and distribution in real time according to the preferred anode shape, power supply, mode and distribution results obtained from the set targets, and the system operating in this manner is called an "intelligent self-adaptive adjustable anode."

[0041] 9 is a schematic configuration diagram of yet another electroplating anode according to an embodiment of the present application. As shown in FIG. 9, the electroplating anode 1 further includes an electric field distribution simulation optimizer 16, an electric field distribution controller 15, and an electroplating signal controller 13. The electric field distribution simulation optimizer 16 is electrically connected to the electric field distribution controller 15, which is further electrically connected to the electroplating signal controller 13, which is further electrically connected to the driver controller 14. In the initial stage of electroplating, the electric field distribution simulation optimizer 16 uses the input initial cathode 2 morphology information, initial anode morphology and initial anode surface current distribution as a model to simulate the electric field between the electroplating anode and the cathode and the deposition of the electroplating material on the cathode, and obtains the optimized anode morphology and the optimized anode surface current distribution through an optimization algorithm based on the set optimization target (target cathode morphology), i.e., the specific distribution and thickness of the electroplating material on the surface of the cathode, and obtains the cathode morphology after this optimization that is closer to the optimization target, and transmits the information of the optimized anode morphology and the optimized anode surface current distribution to the electric field distribution controller 15, which controls the electroplating signal controller 13 to output to the conductive unit 11, and the electric field distribution controller 15 controls the driver controller 14 to transmit different control signals to each driver 141, and the control signal includes different extension or contraction distances of each body 111 to adjust the anode morphology.During electroplating, the electric field distribution simulation optimizer 16 uses the cathode morphology, which is closer to the optimization target after the previous optimization, the current anode morphology, and the current anode surface current distribution as a model to simulate the electric field between the electroplating anode and the cathode and the deposition of the electroplating material at the cathode; and obtains a more optimized anode morphology and a more optimized anode surface current distribution through an optimization algorithm based on the set optimization target; and obtains the cathode morphology, which is closer to the optimization target after the current optimization, and transmits the information of the more optimized anode morphology and the more optimized anode surface current distribution to the electric field distribution controller 15; the electric field distribution controller 15 controls the electroplating signal output by the electroplating signal controller 13 to the conductive unit 11; the electric field distribution controller 15 controls the driver controller 14 to transmit different control signals to each driver 141; the control signals include different extension or contraction distances of each body 111 to adjust the anode morphology; and during electroplating, the electric field distribution simulation optimizer 16 repeats the optimization until the cathode morphology reaches the optimization target or the difference from the optimization target reaches a preset value. In this embodiment, based on the initial configuration of the cathode, the electroplating simulation software adjusts the anode configuration, power supply, mode and distribution according to the results of the preferred anode configuration, power supply, mode and distribution obtained from the set targets, and the system operating in this manner is called an "intelligent adjustable anode".

[0042] Exemplarily, as shown in Fig. 8 and Fig. 9, the body 111 and the head 112 of the conductive unit 11 are made of titanium alloy or are made by coating the surface of the conductive layer with titanium alloy. The body 111 is inserted vertically into the hole of the insulating backplate 12 to form an array. All the heads 112 are on the same side of the insulating backplate 12. On the other side of the insulating backplate 12, each body 111 is connected to one driver 141, and the driver 141 drives the body 111 to move linearly, thereby determining the relative distance between the head 112 and the insulating backplate 12. All the drivers 141 are controlled by one driver controller 14, which transmits different control signals to each driver 141, and the control signals include different extension or contraction distances of each body 111. Each head 112 is supplied with an electroplating signal via the body 111 and a power supply line 132, and all the power supply lines 132 are connected to an electroplating signal controller 13, which determines the electroplating signal to be supplied to each head 112. The driver controller 14 and the electroplating signal controller 13 are controlled by an electric field distribution controller 15.

[0043] 10 is a schematic diagram of yet another electroplating anode according to an embodiment of the present application. As shown in FIG. 10, all the heads 112 are at the same distance from the insulating backplate 12. The electroplating anode 1 further includes an electroplating signal controller 13 and a plurality of power feed lines 132, and one conductive unit 11 is electrically connected to the electroplating signal controller 13 through one power feed line 132, and the electroplating signal controller 13 is set to apply an electroplating signal to the conductive unit 11. In this embodiment, the distance between the heads 112 and the insulating backplate 12 is the same, that is, the end surface of each head 112 forms a large plane, and the electroplating signals (e.g., surface current density) of the end surfaces of the heads 112 are different from each other.

[0044] 10 , the electroplating anode 1 further includes a cathode surface morphology detector 17, an electric field distribution simulation optimizer 16 and an electric field distribution controller 15. An input terminal of the electric field distribution simulation optimizer 16 is electrically connected to the cathode surface morphology detector 17, and an output terminal of the electric field distribution simulation optimizer 16 is electrically connected to the electric field distribution controller 15, which is further electrically connected to the electroplating signal controller 13. In the initial stage of electroplating, the electric field distribution simulation optimizer 16 is set to obtain the initial cathode morphology information from the cathode surface morphology detector 17, and simulate the electric field between the electroplating anode and the cathode and the deposition of the electroplating material at the cathode using the initial cathode morphology information, the anode morphology and the initial anode surface current distribution as a model, and obtain an optimized anode surface current distribution through an optimization algorithm based on the set optimization target, i.e., the specific distribution and thickness of the electroplating material on the surface of the cathode, and transmit the information of the optimized anode surface current distribution to the electric field distribution controller 15, and the electric field distribution controller 15 controls the electroplating signal output by the electroplating signal controller 13 to the conductive unit 11. During electroplating, the electric field distribution simulation optimizer 16 obtains real-time cathode morphology information from the cathode surface morphology detector 17, and uses the real-time cathode morphology information, the anode morphology and the current anode surface current distribution as a model to simulate the electric field between the electroplating anode and the cathode and the deposition of electroplating material on the cathode, and is set to obtain a more optimized anode surface current distribution through an optimization algorithm based on the set optimization target, and transmit the more optimized anode surface current distribution information to the electric field distribution controller 15, which controls the electroplating signal output by the electroplating signal controller 13 to the conductive unit 11, and during electroplating, the electric field distribution simulation optimizer 16 repeats the optimization until the cathode morphology reaches the optimization target or the difference from the optimization target reaches a preset value.

[0045] 11 is a schematic diagram of yet another electroplating anode according to an embodiment of the present application. All the heads 112 are at the same distance from the insulating back plate 12. As shown in FIG. 11, the electroplating anode 1 further includes an electric field distribution simulation optimizer 16, an electric field distribution controller 15 and an electroplating signal controller 13. The electric field distribution controller 15 is electrically connected to the electroplating signal controller 13 and the electric field distribution simulation optimizer 16. In the initial stage of electroplating, the electric field distribution simulation optimizer 16 uses the input initial cathode 2 morphology information, anode morphology and initial anode surface current distribution as a model to simulate the electric field between the electroplating anode and cathode and the deposition of electroplating material on the cathode, and obtains an optimized anode surface current distribution through an optimization algorithm based on the set optimization target, i.e., the specific distribution and thickness of the electroplating material on the cathode surface, and obtains the cathode morphology after this optimization that is closer to the optimization target, and transmits the optimized anode surface current distribution information to the electric field distribution controller 15, and the electric field distribution controller 15 controls the electroplating signal output by the electroplating signal controller 13 to the conductive unit 11. During electroplating, the electric field distribution simulation optimizer 16 uses the cathode morphology, anode morphology, and current anode surface current distribution that are closer to the optimization target after the previous optimization as a model to simulate the electric field between the electroplating anode and the cathode and the deposition of electroplating material on the cathode, and obtains a more optimized anode surface current distribution through an optimization algorithm based on the set optimization target, and is set to obtain the cathode morphology that is closer to the optimization target after the current optimization, and transmit the information of the more optimized anode surface current distribution to the electric field distribution controller 15, which controls the electroplating signal controller 13 to output to the conductive unit 11, and during electroplating, the electric field distribution simulation optimizer 16 repeats the optimization until the cathode morphology reaches the optimization target or the difference from the optimization target reaches a preset value.

[0046] 12 is a schematic diagram of yet another electroplating anode according to an embodiment of the present application. As shown in FIG. 12, a conductive unit 11 is fitted and fixed in an insulating back plate 12.

[0047] 12, a groove is provided on one surface of the insulating backplate 12, the heads 112 of all the conductive units 11 are fixed in the groove, and the heads 112 of all the conductive units 11 are at the same distance from the insulating backplate 12. One end of the body 111 of the conductive unit 11 is electrically connected to the head 112, and the other end of the body 111 of the conductive unit 11 is exposed from the opposite surface of the insulating backplate 12. Note that the electroplating anode in the embodiment of the present application may further include an electroplating signal controller 13, an electric field distribution controller 15, an electric field distribution simulation optimizer 16, or a cathode surface morphology detector 17, which is not limited in the embodiment of the present application.

[0048] 13 is a schematic diagram of yet another electroplating anode according to an embodiment of the present application. As shown in FIG. 13, the electroplating anode 1 further includes a plurality of drivers 141. Each driver 141 is connected to one end of the corresponding body 111 away from the head 112, and each driver 141 is set to control the distance between the head 112 and the insulating backplate 12, so that the distance between the head 112 and the cathode 2 can be controlled. In this embodiment, the distance between each head 112 and the insulating backplate 12 is different, and the electroplating signal (e.g., surface current density) of the end surface of the head 112 is the same.

[0049] 13, the electroplating anode 1 further includes a current feed plate 191. All the conductive units 11 are electrically connected to the current feed plate 191. The current feed plate 191 supplies the same electroplating signal to all the heads 112, thereby making the electroplating signals (e.g., surface current densities) on the end faces of all the heads 112 the same.

[0050] 13 , the electroplating anode 1 further includes a cathode surface morphology detector 17, an electric field distribution simulation optimizer 16 and an electric field distribution controller 15. An input terminal of the electric field distribution simulation optimizer 16 is electrically connected to the cathode surface morphology detector 17, and an output terminal of the electric field distribution simulation optimizer 16 is electrically connected to the electric field distribution controller 15, which is further electrically connected to the driver controller 14. In the initial stage of electroplating, the electric field distribution simulation optimizer 16 is set to obtain initial cathode morphology information from the cathode surface morphology detector 17, and use the initial cathode morphology information, initial anode morphology and anode surface current distribution as models to obtain an optimized anode morphology through an optimization algorithm based on the set optimization goal, i.e., the specific distribution and thickness of the electroplating material on the surface of the cathode, and transmit the information of the optimized anode morphology to the electric field distribution controller 15, and the electric field distribution controller 15 controls the driver controller 14 to transmit different control signals to each driver 141, and the control signals include different extension or contraction distances of each body portion 111. During electroplating, the electric field distribution simulation optimizer 16 obtains real-time cathode morphology information from the cathode surface morphology detector 17, and uses the real-time cathode morphology information, the anode surface current distribution and the current anode morphology as a model to obtain a more optimized anode morphology through an optimization algorithm based on the set optimization target, and is set to transmit the more optimized anode morphology information to the electric field distribution controller 15, and the electric field distribution controller 15 controls the driver controller 14 to transmit different control signals to each driver 141, the control signals including different extension or contraction distances of each body portion 111, and during electroplating, the electric field distribution simulation optimizer 16 repeats optimization to adjust the anode morphology in real time until the cathode morphology reaches the optimization target or the difference from the optimization target reaches a preset value.

[0051] FIG. 14 is a schematic diagram of another electroplating anode according to an embodiment of the present application. The same parts as those in FIG. 13 will not be described in this specification. As shown in FIG. 14, the electroplating anode 1 further includes an electric field distribution simulation optimizer 16 and an electric field distribution controller 15. The electric field distribution simulation optimizer 16 is electrically connected to the electric field distribution controller 15, and the electric field distribution controller 15 is further electrically connected to the driver controller 14. The electric field distribution simulation optimizer 16 uses the initial cathode 2 shape information, the anode surface current distribution, and the initial anode shape as a model, and obtains an optimized anode shape by an optimization algorithm based on a set optimization target, i.e., a specific distribution and thickness of the electroplating material on the surface of the cathode, and is set to obtain a cathode shape closer to the optimization target after this optimization, and transmit information of the optimized anode shape to the electric field distribution controller 15, and the electric field distribution controller 15 controls the driver controller 14, so that the driver controller 14 transmits different control signals to each driver 141, and the control signals include different extension or contraction distances of each body 111. During electroplating, the electric field distribution simulation optimizer 16 uses the cathode shape, anode surface current distribution, and current anode shape after the previous optimization, which are closer to the optimization target, as a model, to obtain a more optimized anode shape through an optimization algorithm based on the set optimization target, and is set to obtain the cathode shape after the current optimization, which is closer to the optimization target, and transmit the information of the more optimized anode shape to the electric field distribution controller 15, and the electric field distribution controller 15 controls the driver controller 14, which transmits different control signals to each driver 141, and the control signals include different extension distances or contraction distances of each body 111, and during electroplating, the electric field distribution simulation optimizer 16 repeats the optimization to adjust the anode shape in real time until the cathode shape reaches the optimization target or the difference from the optimization target reaches a preset value. In this embodiment, the distance between each head 112 and the insulating back plate 12 is different, and the electroplating signal (e.g., surface current density) of the end face of the head 112 is the same.

[0052] FIG. 15 is a schematic diagram of yet another electroplating anode according to an embodiment of the present application. As shown in FIG. 15, the electroplating anode 1 further includes a mold substrate 192, an adhesive layer 193, and a current supply plate 191. The adhesive layer 193 is located between the mold substrate 192 and the insulating backplate 12, and the shape of the mold substrate 192 facing the insulating backplate 12 matches or substantially matches the shape of the cathode 2, and the convex portion of the mold substrate 192 corresponds to the concave portion of the cathode 2, and the concave portion of the mold substrate 192 corresponds to the convex portion of the cathode 2. The mold substrate 192 may be, for example, a polymer mold. The current supply plate 191 contacts and electrically connects with a plurality of conductive units 11. In this embodiment, the distance between each head 112 and the insulating backplate 12 is different, and the electroplating signal (e.g., surface current density) of the end surface of the head 112 is the same. The adhesive layer 193 is a polymer adhesive or hardener for fixing the conductive unit 11, which is insoluble in the electrolyte but soluble in some solvents that are not components of the electrolyte. These solvents do not dissolve the mold substrate 192 and the insulating backplate 12, but when these solvents are used, the mold substrate 192 can be separated from the insulating backplate 12 and the conductive unit 11, and the insulating backplate 12 and the conductive unit 11 can be used repeatedly.

[0053] In one embodiment, as shown in Fig. 15, the electroplating anode 1 includes two insulating backplates 12, and the body 111 is fixed to the two insulating backplates 12 by one end remote from the head. The current feed plate 191 is located between the two insulating backplates 12. In this embodiment, since the current feed plate 191 is located between the two insulating backplates 12, the current feed plate 191 can be protected by using the two insulating backplates 12. Meanwhile, since the current feed plate 191 is located between the two insulating backplates 12, the current feed plate 191 utilizes the space between the two insulating backplates 12 without utilizing any space other than the two insulating backplates 12, thereby improving the space utilization rate and increasing the integration degree of components in the electroplating anode 1.

[0054] The electroplating anode 1 shown in FIG. 15 uses a mold substrate 192, an adhesive layer 193 and a power supply plate 191, so that the shape of the electroplating anode 1 cannot be changed after it is formed, and the power supply plate 191 supplies the same electroplating signal to all heads 112, thereby making the electroplating signals (e.g., surface current densities) of the end surfaces of all heads 112 the same at the same time.

[0055] In one embodiment, the electroplating anode shown in FIG. 15 further includes an electric field distribution simulation optimizer, an electric field distribution controller, and an electroplating signal controller.

[0056] The electric field distribution controller is electrically connected to the electroplating signal controller and the electric field distribution simulation optimizer respectively, and the electroplating signal controller is electrically connected to the conductive unit.

[0057] The electroplating signal controller is configured to apply an electroplating signal to the conductive unit, and the electric field distribution simulation optimizer is configured to simulate the electric field between the electroplating anode and the cathode and the deposition of the electroplating material at the cathode using the input initial cathode shape information, initial anode shape, and initial anode surface current distribution as a model before starting electroplating, and to obtain the shape of the mold substrate (the shape of the electroplating anode) and the optimized anode surface current distribution through an optimization algorithm based on the set optimization goal, i.e., the specific distribution and thickness of the electroplating material on the surface of the cathode, and transmit information of the optimized anode surface current distribution to the electric field distribution controller, and the electric field distribution controller controls the electroplating signal output by the electroplating signal controller to the conductive unit.

[0058] In one embodiment, the electroplating anode shown in FIG. 15 further includes an electric field distribution simulation optimizer, an electric field distribution controller, and an electroplating signal controller.

[0059] The electric field distribution controller is electrically connected to the electroplating signal controller and the electric field distribution simulation optimizer respectively, and the electroplating signal controller is electrically connected to the conductive unit.

[0060] The electroplating signal controller is configured to apply an electroplating signal to the conductive unit, and the electric field distribution simulation optimizer is configured to simulate an electric field between the electroplating anode and the cathode and deposition of an electroplating material on the cathode using input initial cathode shape information, initial anode shape, and initial anode surface current distribution as models before starting electroplating, and obtain a shape of the mold substrate (shape of the electroplating anode) and an optimized anode surface current distribution by an optimization algorithm based on a set optimization target, i.e., a specific distribution and thickness of an electroplating material on the surface of the cathode, and obtain a cathode shape after this optimization that is closer to the optimization target, and transmit information of the optimized anode surface current distribution to the electric field distribution controller, and the electric field distribution controller controls an electroplating signal output by the electroplating signal controller to the conductive unit. During electroplating, the electric field distribution simulation optimizer uses a cathode morphology that is closer to the optimization target after the previous optimization, a morphology of the electroplating anode, and a current anode surface current distribution as models to simulate an electric field between the electroplating anode and the cathode and deposition of an electroplating material on the cathode, and obtains a more optimized anode surface current distribution through the optimization algorithm based on the set optimization target, and is set to obtain a cathode morphology that is closer to the optimization target after the current optimization, and transmit information of the more optimized anode surface current distribution to the electric field distribution controller, and the electric field distribution controller controls the electroplating signal controller to output to the conductive unit, and during electroplating, the electric field distribution simulation optimizer repeats optimization until the cathode morphology reaches the optimization target or the difference from the optimization target reaches a preset value.

[0061] Fig. 16 is a flow chart of an electroplating method using an electroplating anode according to one embodiment of the present application. Based on the electroplating anode shown in Fig. 1A, as shown in Fig. 16 and Fig. 1A, an electroplating anode 1 forms an electric field with a cathode 2, which is an object to be electroplated and has an uneven shape, to form an electroplating layer on a surface of the cathode 2, and includes a conductive plate or a conductive mesh, the shape of the conductive plate matches or substantially matches the shape of the cathode 2, the convex parts of the conductive plate correspond to the concave parts of the cathode 2, and the concave parts of the conductive plate correspond to the convex parts of the cathode 2. The electroplating method includes steps S110 to S140.

[0062] In step S110, the morphology of the electroplating anode 1 is obtained based on the target morphology of the cathode 2.

[0063] Illustratively, the electric field distribution simulation optimizer uses the initial cathode morphology information, the initial anode morphology and the initial anode current distribution as models to obtain an optimized electroplating anode morphology through an optimization algorithm based on a set optimization goal (target morphology), i.e., a specific distribution and thickness of the electroplating material on the surface of the cathode.

[0064] In step S120, a mold substrate 192 is manufactured based on the configuration of the electroplating anode 1.

[0065] The shape of one side of the mold substrate 192 matches or substantially matches the shape of the cathode 2, and the convex portion on that side of the mold substrate 192 corresponds to the concave portion in the cathode 2, and the concave portion on that side of the mold substrate 192 corresponds to the convex portion in the cathode 2.

[0066] In step S130, the electroplating anode 1 is manufactured based on the mold substrate 192.

[0067] In step S140, an electroplating signal is applied to the electroplating anode 1.

[0068] An embodiment of the present application provides an electroplating method using an electroplating anode, which is used to form an electroplating anode as shown in FIG. 1A and to electroplate a cathode using the formed electroplating anode.

[0069] It should be noted that in step S140, the electroplating signal applied to the electroplating anode 1 may be either static or dynamic. The present application will be described below with reference to the electroplating anodes shown in Figures 1B and 1C.

[0070] In one embodiment, as shown in FIG. 1B, the electroplating anode 1 further includes a cathode surface morphology detector 17, an electric field distribution simulation optimizer 16, an electric field distribution controller 15 and an electroplating signal controller 13, wherein an input terminal of the electric field distribution simulation optimizer 16 is electrically connected to the cathode surface morphology detector 17, an output terminal of the electric field distribution simulation optimizer 16 is electrically connected to the electric field distribution controller 15, the electric field distribution controller 15 is electrically connected to the electroplating signal controller 13, the electroplating signal controller 13 is electrically connected to the conductive plate, and the electroplating signal controller 13 is configured to apply an electroplating signal to the conductive plate.

[0071] The steps of obtaining a morphology of the anode based on a target morphology of the cathode (corresponding to step S110) and obtaining the electroplating signal (corresponding to step S140) include: Before starting electroplating, the electric field distribution simulation optimizer 16 obtains initial cathode morphology information from the cathode surface morphology detector 17, and simulates the electric field between the electroplating anode 1 and the cathode 2 and the deposition of the electroplating material on the cathode 2 using the initial cathode morphology information, the initial anode morphology, and the initial anode surface current distribution as a model. Based on the set optimization target, i.e., the specific distribution and thickness of the electroplating material on the surface of the cathode 2, the optimization algorithm is used to obtain the morphology of the electroplating anode 1 (i.e., the morphology of the conductive plate in FIG. 1A, which cannot be changed once the morphology of the conductive plate is formed) and the optimized anode surface current distribution. The optimized anode surface current distribution information is transmitted to the electric field distribution controller 15, and the electric field distribution controller 15 controls the electroplating signal output by the electroplating signal controller 13 to the conductive plate. During electroplating, the electric field distribution simulation optimizer 16 obtains real-time cathode morphology information from the cathode surface morphology detector 17, and uses the real-time cathode morphology information, the morphology of the conductive plate, and the current anode surface current distribution as a model to simulate the electric field between the electroplating anode 1 and the cathode 2 and the deposition of the electroplating material on the cathode 2, and obtains a more optimized anode surface current distribution through an optimization algorithm based on the set optimization target, and transmits the more optimized anode surface current distribution information to the electric field distribution controller 15, which controls the electroplating signal controller 13 to output to the conductive plate, and during electroplating, the electric field distribution simulation optimizer 16 repeats the optimization until the morphology of the cathode 2 reaches the optimization target or the difference from the optimization target reaches a preset value. In this embodiment, the electroplating signal is optimized in real time during electroplating.

[0072] In one embodiment, as shown in FIG. 1C, the electroplating anode 1 includes an electric field distribution simulation optimizer 16, an electric field distribution controller 15 and an electroplating signal controller 13.

[0073] The electric field distribution controller 15 is electrically connected to the electroplating signal controller 13 and the electric field distribution simulation optimizer 16, respectively, the electroplating signal controller 13 is electrically connected to the conductive plate, and the electroplating signal controller 13 is configured to apply an electroplating signal to the conductive plate.

[0074] The steps of obtaining a morphology of the anode based on a target morphology of the cathode (corresponding to step S110) and obtaining the electroplating signal (corresponding to step S140) include: Before starting electroplating, the electric field distribution simulation optimizer 16 simulates the electric field between the electroplating anode 1 and the cathode 2 and the deposition of electroplating material on the cathode 2 using the input cathode target shape information, initial anode shape, and initial anode surface current distribution as a model, and obtains the shape of the electroplating anode 1 (i.e., the shape of the conductive plate in FIG. 1A, which cannot be changed once the shape of the conductive plate is formed in this embodiment) and the optimized anode surface current distribution by an optimization algorithm based on the set optimization target, i.e., the specific distribution and thickness of the electroplating material on the surface of the cathode 2, and transmits the information of the optimized anode surface current distribution to the electric field distribution controller 15, which controls the electroplating signal output by the electroplating signal controller 13 to the conductive plate. In this embodiment, optimization is performed only once before starting electroplating to obtain the optimized electroplating signal, and then the optimized electroplating signal is maintained as the electroplating signal during electroplating.

[0075] In one embodiment, as shown in FIG. 1C, the electroplating anode 1 includes an electric field distribution simulation optimizer 16, an electric field distribution controller 15 and an electroplating signal controller 13.

[0076] The electric field distribution controller 15 is electrically connected to the electroplating signal controller 13 and the electric field distribution simulation optimizer 16, respectively, the electroplating signal controller 13 is electrically connected to the conductive plate, and the electroplating signal controller 13 is configured to apply an electroplating signal to the conductive plate.

[0077] The steps of obtaining a morphology of the anode based on a target morphology of the cathode (corresponding to step S110) and obtaining the electroplating signal (corresponding to step S140) include: Before starting electroplating, the electric field distribution simulation optimizer 16 simulates the electric field between the electroplating anode 1 and the cathode 2 and the deposition of the electroplating material on the cathode 2 using the input initial cathode morphology information, initial anode morphology, and initial anode surface current distribution as a model, and obtains the morphology of the electroplating anode 1 (i.e., the morphology of the conductive plate in FIG. 1A, which cannot be changed once the morphology of the conductive plate is formed in this embodiment) and the optimized anode surface current distribution through an optimization algorithm based on the set optimization target, i.e., the specific distribution and thickness of the electroplating material on the surface of the cathode 2, and obtains the cathode morphology after this optimization that is closer to the optimization target, and transmits the information of the optimized anode surface current distribution to the electric field distribution controller 15, and the electric field distribution controller 15 controls the electroplating signal output by the electroplating signal controller 13 to the conductive plate, and transmits the information of the optimized anode surface current distribution to the electric field distribution controller 15. During electroplating, the electric field distribution simulation optimizer 16 simulates the electric field between the electroplating anode 1 and the cathode 2 and the deposition of electroplating material on the cathode 2 using the cathode morphology closest to the optimization target after the previous optimization, the electroplating anode 1 morphology (i.e., the conductive plate morphology) and the current anode surface current distribution as models, and obtains a more optimized anode surface current distribution by the optimization algorithm based on the set optimization target, and obtains the cathode morphology closer to the optimization target after the current optimization, and transmits the more optimized anode surface current distribution information to the electric field distribution controller 15, which controls the electroplating signal output by the electroplating signal controller 13 to the conductive plate, and during electroplating, the electric field distribution simulation optimizer 16 repeats the optimization until the morphology of the cathode 2 reaches the optimization target or the difference from the optimization target reaches a preset value. In this embodiment, the electroplating signal is optimized in real time during electroplating.

[0078] 17 is a schematic diagram of the manufacture of an electroplating anode according to one embodiment of the present application. As shown in FIG. 17, the manufacture of an electroplating anode 1 based on a mold substrate 192 (i.e., step S130) includes the following steps: This involves applying or depositing a conductive layer onto a mold substrate 192 to form an electroplating anode 1 .

[0079] Exemplarily, an optimized anode shape is obtained by the electric field distribution simulation optimizer 16, and a mold substrate 192 is manufactured based on the optimized anode shape. The mold substrate 192 may be, for example, a polymer mold. The electroplating anode 1 is formed by directly coating or depositing an insoluble or soluble conductive layer on the surface of the polymer mold.

[0080] Fig. 18 is a flow chart of detailed steps included in step S130 in Fig. 16, and Fig. 19 is a schematic diagram of another electroplating anode manufacturing method according to an embodiment of the present application. As shown in Fig. 18 and Fig. 19, manufacturing an electroplating anode 1 based on a mold substrate 192 (i.e., step S130) includes steps S1321 and S1322.

[0081] In step S1321, a planar conductive plate 102 is provided.

[0082] The planar conductive plate 102 may be in the form of a plate or a mesh.

[0083] In step S1322, the planar conductive plate 102 is pressed using one side of the mold substrate 192 that matches or substantially matches the cathode 2, thereby deforming the planar conductive plate 102 to match or substantially match the cathode 2, and removing the mold substrate 192 to form the electroplating anode 1.

[0084] Illustratively, the mold substrate 192 may be a rigid mold.

[0085] FIG. 20 is a flow chart of another electroplating method using an electroplating anode according to an embodiment of the present application. Based on the electroplating anode shown in FIG. 2 to FIG. 15, as shown in FIG. 20 and FIG. 2 to FIG. 15, the electroplating anode 1 forms an electric field with the cathode 2, which is an electroplating target having an uneven shape, to form an electroplating layer on the surface of the cathode 2, and includes an insulating back plate 12 and a plurality of conductive units 11. Each conductive unit 11 includes a body 111 and a head 112 installed at one end of the body 111, and the end of the body 111 where the head 112 is installed is an electroplating terminal of the conductive unit 11, and the conductive unit 11 is fixed to the insulating back plate 12 by the body 111. A plurality of conductive units 11 are arranged in an array, and any two conductive units 11 are electrically insulated. The electroplating method includes steps S210 and S220.

[0086] In step S210, the morphology of the anode and the anode surface current distribution are obtained based on the target morphology of the cathode 2.

[0087] In step S220, the distance between each head 112 and the insulating backplate 12 is controlled based on the shape of the anode, and an individual electroplating signal is applied to each conductive unit 11 based on the anode surface current distribution, or the distance between all heads 112 and the insulating backplate 12 is controlled to be the same, and an individual electroplating signal is applied to each conductive unit 11 based on the anode surface current distribution, or the distance between each head 112 and the insulating backplate 12 is controlled based on the shape of the anode, and the same electroplating signal is applied to all conductive units 11.

[0088] The anode morphology and anode surface current distribution can be obtained by an electric field distribution simulation optimizer 16 .

[0089] Exemplarily, as shown in Figures 8 and 9, the distance between each head 112 and the insulating backplate 12 can be controlled based on the shape of the anode, and individual electroplating signals can be controlled to be applied to each conductive unit 11 based on the anode surface current distribution.

[0090] Exemplarily, as shown in Figures 10 and 11, the distance between all the heads 112 and the insulating backplate 12 can be controlled to be the same, and individual electroplating signals can be applied to each conductive unit 11 based on the anode surface current distribution.

[0091] Illustratively, as shown in Figures 13, 14 and 15, the distance between each head 112 and the insulating backplate 12 is controlled based on the shape of the anode, and the same electroplating signal is applied to all conductive units 11.

[0092] An embodiment of the present application provides an electroplating method using an electroplating anode, which is used to form an electroplating anode as shown in Figures 2 to 15 and electroplate a cathode using the formed electroplating anode.

[0093] Figure 21 is a flow chart of yet another electroplating method using an electroplating anode according to an embodiment of the present application. As shown in Figures 8, 10, 13, 20 and 21, the electroplating anode 1 includes a cathode surface morphology detector 17 and an electric field distribution simulation optimizer 16. Based on the target morphology of the cathode 2, i.e., the optimization target, i.e., the specific distribution and thickness of the electroplating on the cathode surface, obtaining the anode morphology and anode surface current distribution (i.e., step S210) includes steps S2111 and S2112.

[0094] In step S2111, the cathode surface morphology detector 17 detects morphology information of the cathode 2 in real time.

[0095] In step S2112, the electric field distribution simulation optimizer 16 obtains an optimized anode morphology and an optimized anode surface current distribution in real time based on the target morphology information of the cathode 2, using the cathode morphology detected in real time, the current anode morphology, and the current anode surface current distribution as models.

[0096] Figure 22 is a flow chart of yet another electroplating method using an electroplating anode according to an embodiment of the present application. As shown in Figures 9, 11, 14, 20 and 22, the electroplating anode 1 further includes an electric field distribution simulation optimizer 16. Based on the target morphology of the cathode 2, i.e., the optimization target, i.e., the specific distribution and thickness of the electroplating on the cathode surface, obtaining the anode morphology and anode surface current distribution (i.e., step S210) includes step S2121.

[0097] In step S2121, the electric field distribution simulation optimizer 16 obtains an optimized anode morphology and an optimized anode surface current distribution based on the target morphology of the cathode 2, using the anode morphology close to the optimization target after the previous optimization or the initial cathode morphology, the current anode morphology, and the current anode surface current distribution as models.

[0098] In one embodiment, as shown in Figures 8, 9, 13, 14 and 20, the electroplating anode 1 includes a plurality of drivers 141, each driver 141 is connected to one end of the corresponding body 111 away from the head 112, and each driver 141 is configured to control the distance between the head 112 and the insulating backplate 12. In step S220, controlling the distance between each head 112 and the insulating backplate 12 based on the configuration of the anode includes: Based on the configuration of the anode, each driver 141 drives the movement of the conductive unit 11 connected to the driver 141 to control the distance between each head 112 and the insulating back plate 12 .

[0099] In one embodiment, as shown in Figures 5, 7 and 20, the electroplating anode 1 further includes an insulating screw 114 and an insulating nut 113, the insulating nut 113 is fixed to the insulating backplate 12, the insulating screw 114 surrounds the body 111, and the insulating screw 114 and the insulating nut 113 are screwed together. In step S220, controlling the distance between each head 112 and the insulating backplate 12 based on the configuration of the anode includes: This involves rotating insulating screws 114 in insulating nuts 113 to control the distance between each head 112 and the insulating backplate 12 based on the configuration of the anode.

[0100] Fig. 23 is a manufacturing flow chart of an electroplating anode according to an embodiment of the present application, and Fig. 24 is a schematic diagram of manufacturing yet another electroplating anode (see Fig. 15) according to an embodiment of the present application. As shown in Fig. 23, in step S220, controlling the distance between each head 112 and the insulating backplate 12 based on the configuration of the anode includes steps S2261 to S2263.

[0101] In step S2261, a mold substrate 192 is manufactured based on the shape of the anode.

[0102] In step S2262, the die substrate 192 is used to press the ends of the multiple body portions 111 opposite the head portions 112 so that the head portions 112 of the multiple conductive units 11 all take the form of anodes.

[0103] In step S2263, an adhesive or a hardener is filled between the mold substrate 192 and the insulating backplate 12, and the adhesive or the hardener is hardened to form an adhesive layer 193.

[0104] Regarding the electroplating anode manufactured in steps S2261 to S2263, as shown in FIG. 15, the electroplating process using the electroplating anode has already been described in the above embodiment of the present application, so the description will be omitted here.

[0105] FIG. 25 is a schematic diagram of an electroplating apparatus according to an embodiment of the present application. As shown in FIG. 25, the electroplating apparatus includes two electroplating anodes 1 and a cathode 2. The cathode 2 includes a first surface 21 and a second surface 22. The two electroplating anodes 1 are a first electroplating anode D1 and a second electroplating anode D2, respectively. The first electroplating anode D1 faces the first surface 21 of the cathode 2, and matches or substantially matches the shape of the first surface 21 of the cathode 2, forming an electric field with the cathode 2 to form an electroplating layer on the first surface 21 of the cathode 2. The second electroplating anode D2 faces the second surface 22 of the cathode 2, and matches or substantially matches the shape of the second surface 22 of the cathode 2, forming an electric field with the cathode 2 to form an electroplating layer on the second surface 22 of the cathode 2. The first electroplating anode D1 and the second electroplating anode D2 may be used to simultaneously electroplate the first surface 21 and the second surface 22 of the cathode 2, which are the targets of electroplating. Alternatively, the first surface 21 of the cathode 2 may be electroplated using the first electroplating anode D1, and then the second surface 22 of the cathode 2 may be electroplated using the second electroplating anode D2. Alternatively, the second surface 22 of the cathode 2 may be electroplated using the second electroplating anode D2, and then the first surface 21 of the cathode 2 may be electroplated using the first electroplating anode D1. The electroplating anode 1 (including the first electroplating anode D1 and the second electroplating anode D2) may be any of the electroplating anodes described in the above embodiments. The electroplating method for the electroplating anode 1 may be any of the electroplating methods described in the above embodiments. [Explanation of symbols]

[0106] 1 Anode 2 cathode 11 Conductive unit 12 Insulating backplate 13 Signal Controller 14 Driver Controller 15 Electric field distribution controller 16 Electric field distribution simulation optimizer 17 Cathode Surface Morphology Detector 21 First surface 22 Second surface 102 Conductive plate 111 Torso 112 Head 113 Insulating nut 114 Insulating screw Terminal 115 132 Power line 141 Drivers 191 Power supply board 192 Mold Substrate 193 Adhesive layer

Claims

1. 1. A system for electroplating, comprising: an electroplating anode; A cathode to be electroplated; an electric field distribution simulation optimizer; An electric field distribution controller; an electroplating signal controller; The electroplating anode forms an electric field with a cathode, which is an object to be electroplated having an uneven shape, to deposit an electroplating material on a surface of the cathode; the electroplating anode comprises a conductive plate, the shape of the conductive plate matches the shape of the cathode, the convex portions of the conductive plate correspond to the concave portions of the cathode, and the concave portions of the conductive plate correspond to the convex portions of the cathode; the electric field distribution controller is electrically connected to the electroplating signal controller and the electric field distribution simulation optimizer; The system, wherein the electroplating signal controller is electrically connected to the conductive plate, the electroplating signal controller configured to apply an electroplating signal to the conductive plate.

2. a cathode surface morphology detector; an input terminal of the electric field distribution simulation optimizer is electrically connected to the cathode surface morphology detector, and an output terminal of the electric field distribution simulation optimizer is electrically connected to the electric field distribution controller; The electric field distribution simulation optimizer is configured to obtain initial cathode morphology information from the cathode surface morphology detector before starting electroplating, and simulate an electric field between the electroplating anode and the cathode and deposition of electroplating material on the cathode using the initial cathode morphology information, the morphology of the conductive plate and the initial anode surface current distribution as a model, obtain an optimized anode surface current distribution through an optimization algorithm based on a predetermined optimization goal including a distribution and thickness of the electroplating material on the surface of the cathode, and transmit information of the optimized anode surface current distribution to the electric field distribution controller; the electric field distribution controller controls the electroplating signal output from the electroplating signal controller to the conductive plate; 2) simulating an electric field between the electroplating anode and the cathode and deposition of an electroplating material on the cathode using the real-time cathode morphology information, the morphology of the conductive plate, and a current anode surface current distribution as a model; (3) obtaining a more optimized anode surface current distribution through an optimization algorithm based on the optimization target; and (4) transmitting information of the more optimized anode surface current distribution to the electric field distribution controller, and the electric field distribution controller performs a step of (5) controlling an electroplating signal output by the electroplating signal controller to the conductive plate; and during electroplating, the electric field distribution simulation optimizer and the electric field distribution controller repeat steps (1) to (5) until the morphology of the cathode reaches the optimization target or a difference from the optimization target reaches a predetermined value.

3. 2. The system of claim 1, wherein the electric field distribution simulation optimizer is configured to simulate an electric field between the electroplating anode and the cathode and deposition of an electroplating material on the cathode using input initial cathode morphology information, a morphology of the conductive plate, and an initial anode surface current distribution as models before starting electroplating, obtain an optimized anode surface current distribution through an optimization algorithm based on a predetermined optimization goal including a distribution and thickness of an electroplating material on the surface of the cathode, and transmit information of the optimized anode surface current distribution to the electric field distribution controller, and the electric field distribution controller controls the electroplating signal output by the electroplating signal controller to the conductive plate.

4. The electric field distribution simulation optimizer is configured to simulate an electric field between the electroplating anode and the cathode and deposition of an electroplating material on the cathode using input initial cathode shape information, initial anode shape, and initial anode surface current distribution as a model before starting electroplating, obtain an optimized anode surface current distribution by an optimization algorithm based on a predetermined optimization goal including a distribution and thickness of an electroplating material on the surface of the cathode, obtain a cathode shape after this optimization that is closer to the optimization goal, and transmit information of the optimized anode surface current distribution to the electric field distribution controller, and the electric field distribution controller controls an electroplating signal output by the electroplating signal controller to the conductive plate; 2. The system of claim 1, wherein during electroplating, the electric field distribution simulation optimizer is configured to perform the steps of: (1) simulating an electric field between the electroplating anode and the cathode and deposition of an electroplating material on the cathode by using a morphology of the conductive plate and a current anode surface current distribution as a model based on a morphology of the cathode after a previous optimization that is closer to the optimization target; (2) obtaining a more optimized anode surface current distribution by the optimization algorithm based on the optimization target; (3) acquiring a morphology of the cathode after a current optimization that is closer to the optimization target; and (4) transmitting information of the more optimized anode surface current distribution to the electric field distribution controller, and the electric field distribution controller performs the step of (5) controlling an electroplating signal output by the electroplating signal controller to the conductive plate; and during electroplating, the electric field distribution simulation optimizer and the electric field distribution controller repeat the steps (1) to (5) until the morphology of the cathode reaches the optimization target or a difference from the optimization target reaches a predetermined value.

5. 1. A system for electroplating, comprising: an electroplating anode; A cathode to be electroplated; an electric field distribution simulation optimizer; An electric field distribution controller; an electroplating signal controller; The electroplating anode forms an electric field with a cathode, which is an object to be electroplated having an uneven shape, to deposit an electroplating material on a surface of the cathode; The electroplating anode includes a first insulating back plate and a plurality of conductive units, each of which includes a body and a head disposed at one end of the body, the end of the body where the head is disposed is an electroplating terminal of the conductive unit, the conductive units are fixed to the first insulating back plate by the body, the plurality of conductive units are arranged in an array, and any two of the conductive units are electrically insulated, the electric field distribution controller is electrically connected to the electroplating signal controller and the electric field distribution simulation optimizer; The electroplating signal controller is electrically connected to a plurality of the conductive units, the electroplating signal controller being configured to apply an electroplating signal to the plurality of the conductive units.

6. In the initial stage of electroplating, the electric field distribution simulation optimizer uses input initial cathode morphology information, anode morphology and initial anode surface current distribution as a model to simulate the electric field between the electroplating anode and the cathode and the deposition of electroplating material on the cathode, and obtains an optimized anode surface current distribution by an optimization algorithm based on a predetermined optimization target including the distribution and thickness of the electroplating material on the surface of the cathode, and obtains a cathode morphology after this optimization that is closer to the optimization target, and transmits information of the optimized anode surface current distribution to the electric field distribution controller, and the electric field distribution controller controls the electroplating signals output by the electroplating signal controller to each conductive unit, and during electroplating, the electric field distribution simulation optimizer uses the optimized anode surface current distribution after the previous optimization.

6. The system of claim 5, further comprising: a cathode morphology, an anode morphology, and a current anode surface current distribution that are closer to a target morphology are used as models to simulate an electric field between the electroplating anode and the cathode and deposition of an electroplating material on the cathode; a more optimized anode surface current distribution is obtained by the optimization algorithm based on the optimization target; and a cathode morphology after the current optimization that is closer to the optimization target is obtained; and information of the more optimized anode surface current distribution is transmitted to the electric field distribution controller; the electric field distribution controller controls the electroplating signal controller to output to each conductive unit; and during electroplating, the electric field distribution simulation optimizer repeats the optimization until the cathode morphology reaches the optimization target or the difference between the cathode morphology and the optimization target reaches a preset value.

7. Further comprising a driver controller and a plurality of drivers, the electric field distribution simulation optimizer is electrically connected to the electric field distribution controller, the electric field distribution controller is further electrically connected to the driver controller; The electric field distribution simulation optimizer is configured to obtain an optimized anode shape by an optimization algorithm based on a predetermined optimization goal including a distribution and thickness of an electroplating material on the surface of the cathode using initial cathode shape information, anode surface current distribution, and initial anode shape as a model, and to obtain a cathode shape that is closer to the optimization goal after the current optimization, and to transmit information of the optimized anode shape to the electric field distribution controller. The electric field distribution controller controls the driver controller to transmit different control signals to each driver, and the control signals include different extension distances or contraction distances of each body. During electroplating, the electric field distribution simulation optimizer obtains the cathode shape that is closer to the optimization goal after the previous optimization, the anode surface current distribution, and the initial anode shape as a model.

6. The system according to claim 5, further comprising: a surface current distribution and a current anode shape are used as a model, and an optimization algorithm is used to obtain a more optimized anode shape based on the optimization target; and a cathode shape after the current optimization that is closer to the optimization target is obtained; and the information of the more optimized anode shape is transmitted to the electric field distribution controller; the electric field distribution controller controls the driver controller to transmit different control signals to each driver, the control signals including different extension or contraction distances of each body; and during electroplating, the electric field distribution simulation optimizer repeats optimization to adjust the anode shape in real time until the cathode shape reaches the optimization target or the difference between the cathode shape and the optimization target reaches a preset value.

8. 6. The system of claim 5, further comprising a driver controller and a plurality of drivers, the driver controller electrically connected to the plurality of drivers, each driver connected to an end of a corresponding torso away from the head, and each driver configured to control a distance between the head and the first insulating backplate.

9. further comprising a cathode surface morphology detector, an input terminal of the electric field distribution simulation optimizer is electrically connected to the cathode surface morphology detector, an output terminal of the electric field distribution simulation optimizer is electrically connected to the electric field distribution controller, the electric field distribution controller is electrically connected to the electroplating signal controller, and the electric field distribution controller is further electrically connected to the driver controller; The electric field distribution simulation optimizer is configured to obtain initial cathode morphology information from the cathode surface morphology detector in an initial stage of electroplating, and to simulate an electric field between the electroplating anode and the cathode and deposition of an electroplating material on the cathode using the initial cathode morphology information, initial anode morphology, and initial anode surface current distribution as a model, and obtain an optimized anode morphology and an optimized anode surface current distribution through an optimization algorithm based on a predetermined optimization goal including a distribution and thickness of an electroplating material on the surface of the cathode, and transmit information of the optimized anode morphology and the optimized anode surface current distribution to the electric field distribution controller, the electric field distribution controller controls the electroplating signal controller to output to each conductive unit, and the electric field distribution controller controls the driver controller to transmit different control signals to each driver, the control signals including different extension distances or contraction distances of each body part to adjust the anode morphology, During electroplating, the electric field distribution simulation optimizer includes the steps of: (1) acquiring real-time cathode morphology information from the cathode surface morphology detector; (2) simulating an electric field between the electroplating anode and the cathode and deposition of electroplating material on the cathode using the real-time cathode morphology information, a current anode morphology, and a current anode surface current distribution as a model; (3) obtaining a more optimized anode morphology and a more optimized anode surface current distribution through an optimization algorithm based on the optimization goal; and (4) transmitting information of the more optimized anode morphology and the more optimized anode surface current distribution to the electric field distribution controller.

9. The system of claim 8, wherein the electric field distribution controller is configured to perform the steps of (5) controlling the electroplating signals output by the electroplating signal controller to each conductive unit, and (6) controlling the driver controller to transmit different control signals to each driver, the control signals including different expansion or contraction distances of each body to adjust a morphology of the anode, and during electroplating, the electric field distribution simulation optimizer and the electric field distribution controller repeat the steps (1) to (6) until the morphology of the cathode reaches the optimization target or a difference from the optimization target reaches a preset value.

10. The electric field distribution simulation optimizer is electrically connected to the electric field distribution controller, the electric field distribution controller is electrically connected to the electroplating signal controller, and the electric field distribution controller is further electrically connected to the driver controller; In the initial stage of electroplating, the electric field distribution simulation optimizer uses the input initial cathode shape information, initial anode shape, and initial anode surface current distribution as a model to simulate the electric field between the electroplating anode and the cathode and the deposition of electroplating material on the cathode, and obtains an optimized anode shape and an optimized anode surface current distribution through an optimization algorithm based on a predetermined optimization goal including the distribution and thickness of the electroplating material on the surface of the cathode, and obtains a cathode shape after this optimization that is closer to the optimization goal, and transmits the optimized anode shape and the optimized anode surface current distribution information to the electric field distribution controller, and the electric field distribution controller controls the electroplating signal controller to output to each conductive unit, and the electric field distribution controller controls the driver controller to transmit different control signals to each driver, and the control signals include different extension distances or contraction distances of each body part to adjust the anode shape; During electroplating, the electric field distribution simulation optimizer (1) uses a cathode morphology, which is closer to the optimization target after the previous optimization, a current anode morphology, and a current anode surface current distribution as models to simulate an electric field between the electroplating anode and the cathode and deposition of electroplating material at the cathode; (2) obtains a more optimized anode morphology and a more optimized anode surface current distribution through an optimization algorithm based on the optimization target; (3) obtains a cathode morphology, which is closer to the optimization target after the current optimization; and (4) obtains information on the more optimized anode morphology and the more optimized anode surface current distribution.

9. The system of claim 8, wherein the electric field distribution controller is configured to perform the steps of: (5) controlling the electroplating signal controller to output an electroplating signal to the conductive unit; and (6) controlling the driver controller to transmit different control signals to each driver, the control signals including different expansion or contraction distances of each body to adjust a morphology of the anode; and during electroplating, the electric field distribution simulation optimizer and the electric field distribution controller repeat the steps (1) to (6) until the morphology of the cathode reaches the optimization target or a difference from the optimization target reaches a preset value.

11. further comprising a cathode surface morphology detector, an input terminal of the electric field distribution simulation optimizer is electrically connected to the cathode surface morphology detector, an output terminal of the electric field distribution simulation optimizer is electrically connected to the electric field distribution controller, and the electric field distribution controller is electrically connected to the electroplating signal controller; The electric field distribution simulation optimizer is configured to obtain initial cathode morphology information from the cathode surface morphology detector in the initial stage of electroplating, and simulate the electric field between the electroplating anode and the cathode and the deposition of electroplating material on the cathode using the initial cathode morphology information, the initial anode morphology and the initial anode surface current distribution as a model, obtain an optimized anode surface current distribution through an optimization algorithm based on a predetermined optimization goal including the distribution and thickness of the electroplating material on the surface of the cathode, and transmit the information of the optimized anode surface current distribution to the electric field distribution controller, and the electric field distribution controller controls the electroplating signal output by the electroplating signal controller to each conductive unit; 6. The system of claim 5, wherein during electroplating, the electric field distribution simulation optimizer is configured to perform the steps of: (1) acquiring real-time cathode morphology information from the cathode surface morphology detector; (2) simulating an electric field between the electroplating anode and the cathode and deposition of electroplating material on the cathode using the real-time cathode morphology information, the anode morphology, and a current anode surface current distribution as a model; (3) obtaining a more optimized anode surface current distribution through the optimization algorithm based on the optimization target; and (4) transmitting information of the more optimized anode surface current distribution to the electric field distribution controller, and the electric field distribution controller performs the step of: (5) controlling an electroplating signal output by the electroplating signal controller to the conductive unit; and during electroplating, the electric field distribution simulation optimizer and the electric field distribution controller repeat the steps (1) to (5) until the cathode morphology reaches the optimization target or a difference from the optimization target reaches a predetermined value.

12. Further comprising a cathode surface morphology detector, an input terminal of the electric field distribution simulation optimizer is electrically connected to the cathode surface morphology detector, an output terminal of the electric field distribution simulation optimizer is electrically connected to the electric field distribution controller, and the electric field distribution controller is further electrically connected to the driver controller; The electric field distribution simulation optimizer is configured to obtain initial cathode morphology information from the cathode surface morphology detector in the initial stage of electroplating, and simulate the electric field between the electroplating anode and the cathode and the deposition of electroplating material on the cathode using the initial cathode morphology information, the initial anode morphology and the anode surface current distribution as a model, obtain an optimized anode morphology through an optimization algorithm based on a predetermined optimization goal including the distribution and thickness of the electroplating material on the surface of the cathode, and transmit the information of the optimized anode morphology to the electric field distribution controller, and the electric field distribution controller controls the driver controller to transmit different control signals to each driver, the control signals including different extension or contraction distances of each body part; 9. The system of claim 8, wherein during electroplating, the electric field distribution simulation optimizer is configured to: (1) obtain real-time cathode morphology information from the cathode surface morphology detector; (2) simulate an electric field between the electroplating anode and the cathode and deposition of electroplating material on the cathode using the real-time cathode morphology information, the anode surface current distribution, and a current anode morphology as a model; (3) obtain a more optimized anode morphology through an optimization algorithm based on the optimization target; and (4) transmit the information of the more optimized anode morphology to the electric field distribution controller; and the electric field distribution controller performs: (5) control the driver controller to transmit different control signals to each driver, the control signals including different expansion or contraction distances of each body portion; and during electroplating, the electric field distribution simulation optimizer and the electric field distribution controller repeat the steps (1) to (5) to adjust the anode morphology in real time until the cathode morphology reaches the optimization target or a difference between the optimization target and a preset value.

13. 6. The system of claim 5, further comprising an insulating screw and an insulating nut, said insulating nut secured to said first insulating backplate, said insulating screw surrounding said barrel, and said insulating screw and said insulating nut threadably engaged.

14. 6. The system of claim 5, further comprising a mold substrate, an adhesive layer, and a power supply plate, the adhesive layer being located between the mold substrate and the first insulating backplate, a shape of the mold substrate facing the first insulating backplate being matched to a shape of the cathode, a convex portion of the mold substrate corresponding to a concave portion of the cathode, a concave portion of the mold substrate corresponding to a convex portion of the cathode, and the power supply plate being in contact with and electrically connected to a plurality of the conductive units.

15. a second insulating backplate, the body being secured to the first insulating backplate and the second insulating backplate; 15. The system of claim 14, wherein the feed plate is located between the first insulating backplate and the second insulating backplate.

16. 1. A method of electroplating using an electroplating system, comprising: The electroplating system includes an electroplating anode, a cathode having a concave-convex shape as an electroplating target, an electric field distribution simulation optimizer, an electric field distribution controller, and an electroplating signal controller; The electroplating anode includes a first insulating back plate and a plurality of conductive units; Each conductive unit includes a body and a head disposed at one end of the body, the end of the body where the head is disposed is an electroplating terminal of the conductive unit, the conductive unit is fixed to the first insulating back plate by the body, the plurality of conductive units are arranged in an array, and any two of the conductive units are electrically insulated, obtaining a morphology and anode surface current distribution of an anode based on a target morphology of the cathode; controlling a distance between each head and the first insulating backplate based on a configuration of the anode and controlling an individual electroplating signal applied to each conductive unit based on the anode surface current distribution, or controlling the distance between all of the heads and the first insulating backplate to be the same and controlling an individual electroplating signal applied to each conductive unit based on the anode surface current distribution, or controlling the distance between each head and the first insulating backplate based on a configuration of the anode and controlling an identical electroplating signal applied to all of the conductive units; the electric field distribution controller is electrically connected to the electroplating signal controller and the electric field distribution simulation optimizer; the electroplating signal controller is electrically connected to the plurality of conductive units, and the electroplating signal controller is configured to apply an electroplating signal to the plurality of conductive units; Electroplating methods.

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