Endoscopy

Abstract

To provide an endoscope capable of appropriately radiating heat of a heat-generating part in a simple configuration.SOLUTION: An endoscope includes an image pick-up device 44 generating heat during operation, a shield pipe 41 integrated with the image pick-up device 44 and when the image pick-up device 44 generates heat, radiating the heat transmitted from the image pick-up device 44, and a mold resin part 48, where the mold resin part 48 has a linear expansion coefficient larger than those of the image pick-up device 44 and the shield pipe 41.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to an endoscope. [Background technology]

[0002] In recent years, with the soaring need for higher image quality in endoscopes, image sensors have become increasingly more pixelated. However, as the pixel count of image sensors increases, power consumption increases and the amount of heat generated by the image sensors also increases, so it is necessary to devise a method for dissipating the heat from the image sensors.

[0003] Patent Document 1 discloses an endoscope in which a cooling device is provided between an imaging element and a wiring board, and which can effectively dissipate heat generated from the imaging element.

[0004] Patent Document 2 discloses an endoscope in which an imaging element and a circuit board are solidified by filling them with two different types of resin, thereby efficiently dissipating heat from the circuit board.

[0005] Patent Document 3 discloses an endoscope that is attached to a tip portion and includes a heat dissipation member having a plurality of fins for dissipating heat from the tip portion. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] JP 2015-217162 A [Patent Document 2] JP 2011-200398 A [Patent Document 3] JP 2007-156079 A Summary of the Invention [Problem to be solved by the invention]

[0007] However, the endoscope of Patent Document 1 is equipped with a cooling device, the endoscope of Patent Document 2 uses two different types of resin, and the endoscope of Patent Document 3 is equipped with a heat dissipation member at the tip. All of the endoscopes of Patent Documents 1 to 3 require a separate member for heat dissipation and have a complex configuration.

[0008] The present invention has been made in consideration of the above circumstances, and its object is to provide an endoscope that does not require a separate component for heat dissipation and can properly dissipate heat from a heat-generating portion with a simple configuration. [Means for solving the problem]

[0009] The endoscope of the present invention is characterized in that, in an endoscope equipped with a heat generating section that generates heat when operated and a heat dissipation member that dissipates heat transmitted from the heat generating section, the heat dissipation member includes a first heat dissipation member that covers the heat generating section and a cylindrical second heat dissipation member into which the first heat dissipation member is fitted, and the first heat dissipation member has a linear expansion coefficient greater than those of the heat generating section and the second heat dissipation member.

[0010] In the present invention, the linear expansion coefficient of the first heat dissipation member covering the heat generation portion is greater than that of the heat generation portion, and the linear expansion coefficient of the first heat dissipation member is greater than that of the cylindrical second heat dissipation member into which the first heat dissipation member is fitted, so that the thermal expansion amount of the first heat dissipation member is greater than that of the heat generation portion and the second heat dissipation member. Therefore, when the heat generation portion generates heat, the first heat dissipation member can be in close contact with the heat generation portion and the second heat dissipation member, and the heat of the heat generation portion is quickly conducted to the second heat dissipation member on the outside via the first heat dissipation member.

[0011] The endoscope of the present invention is characterized in that a sheet-shaped intervening member is arranged between the first heat dissipation member and the second heat dissipation member, and the linear expansion coefficient of the intervening member is greater than the linear expansion coefficients of the heat generating portion and the heat dissipation member.

[0012] In the present invention, the coefficient of linear expansion of the interposed member is larger than the coefficients of linear expansion of the heat generating portion and the heat dissipation member, and therefore the amount of thermal expansion of the interposed member is larger than that of the heat dissipation member. Therefore, when the heat generating portion generates heat, the first heat dissipation member and the second heat dissipation member can be in close contact with each other via the interposed member, and the heat of the heat generating portion is quickly conducted to the second heat dissipation member which is located outside the first heat dissipation member.

[0013] The endoscope according to the present invention includes an outer member into which the second heat dissipation member is fitted, the outer member having a linear expansion coefficient greater than that of the second heat dissipation member.

[0014] In the present invention, the outer member has a larger linear expansion coefficient than the second heat dissipation member, and therefore the amount of thermal expansion of the outer member is larger than that of the second heat dissipation member. Therefore, when the heat generating portion generates heat, the outer member and the second heat dissipation member are not in close contact with each other, and the heat of the heat generating portion is not easily transferred to the outer member via the second heat dissipation member. Therefore, it is possible to prevent the patient's skin from coming into contact with the outer member and being burned.

[0015] The endoscope of the present invention is characterized in that the outer member includes a first outer member that is exposed to the outside and a second outer member that is not exposed, and the first outer member has a lower thermal conductivity than the second outer member.

[0016] In the present invention, the first outer member, which is exposed to the outside and may come into contact with the patient's skin, has a lower thermal conductivity than the second outer member, so that even if heat from the heat generating portion is transferred to the first outer member via the second heat dissipation member, it is possible to prevent the patient's skin from coming into contact with the first outer member and suffering burns.

[0017] The endoscope according to the present invention is characterized in that the second outer member is cylindrical in shape and includes a tubular exterior member into which the second outer member is fitted, and the thermal conductivity of the exterior member is 0.1 W / (m K) or less.

[0018] In the present invention, the thermal conductivity of the exterior member that can come into contact with the patient's skin is low, being 0.1 W / (m K) or less, so even if heat from the heat generating portion is conducted to the second outer member via the second heat dissipation member, the patient's skin can be prevented from coming into contact with the exterior member and being burned.

[0019] The endoscope according to the present invention is characterized in that the exterior member has a thermal conductivity of 0.05 W / (m·K) or less.

[0020] In the present invention, the thermal conductivity of the exterior member that can come into contact with the patient's skin is low, at 0.05 W / (m K) or less, so it is possible to more reliably prevent the patient's skin from being burned by contact with the exterior member.

[0021] The endoscope according to the present invention is characterized in that the first heat dissipation member is made of epoxy, and the second heat dissipation member is made of nickel.

[0022] In the present invention, the first heat dissipation member is made of epoxy, and the second heat dissipation member is made of nickel.

[0023] The endoscope according to the present invention is characterized in that the second heat dissipation member has a compressibility of 20% or more.

[0024] In the present invention, the compression rate of the second heat dissipation member when heat is generated is 20% or more compared to when heat is not generated by the heat generating portion.

[0025] The endoscope according to the present invention is characterized in that the compressibility of the interposed member is 20% or more.

[0026] In the present invention, the compression rate of the interposed member when heat is generated is 20% or more compared to when heat is not generated in the heat generating portion. Effect of the Invention

[0027] According to the present invention, the heat of the heat generating portion can be appropriately dissipated with a simpler configuration. [Brief description of the drawings]

[0028] [Figure 1] 1 is an external view of an endoscope according to an embodiment of the present invention; [Diagram 2] 2 is a cross-sectional view of an insertion portion of an endoscope according to the present embodiment. FIG. [Diagram 3] 3 is an enlarged cross-sectional view showing the imaging assembly shown in FIG. 2. [Figure 4] 6 is a graph showing the relationship between the temperature of the imaging element and the compressibility of the interposed member in the endoscope according to the present embodiment. [Diagram 5] 4 is a graph showing the relationship between the thermal conductivity of the cover tube and the temperature difference between the inside and outside of the cover tube. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0029] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An endoscope according to an embodiment of the present invention will be described in detail below with reference to the drawings. FIG. 1 is an external view of an endoscope according to an embodiment of the present invention. The endoscope 1 is a flexible scope intended for the upper or lower digestive tract. The endoscope 1 includes an operation section 11, a connector section 12, and an insertion section 2. A folding prevention section 13 is provided between the insertion section 2 and the operation section 11.

[0030] The operation section 11 is cylindrical, with an operation knob 111 provided at one end and a channel inlet 113 provided at the other end. In addition, a forceps plug 112 is provided at the channel inlet 113.

[0031] The connector unit 12 is connected to the operation unit 11 via a universal cord 121. The connector unit 12 is connected to a power supply device, a display device, etc. (not shown). Power lines and signal lines (not shown) are wired from the connector unit 12 to the insertion unit 2 through the universal cord 121, the operation unit 11, the fold prevention portion 13, and the inside of the insertion unit 2.

[0032] The breakage prevention portion 13 communicates with the other end of the operation portion 11, and has a cylindrical shape whose diameter decreases toward the insertion portion 2 side. The insertion section 2 has a long, thin tube shape, and includes, in order from the tip side, a tip section 201, a bending section 202, and a soft section 203. The tip section 201 is the shortest and is hard. The bending section 202 is flexible. The soft section 203 is the longest and is soft.

[0033] Fig. 2 is a cross-sectional view of the insertion portion 2 of the endoscope 1 according to the present embodiment. Fig. 2 shows a tip portion 201 of the insertion portion 2. An imaging assembly 4 is provided in the tip portion 201 along the axial direction of the tip portion, and the imaging assembly 4 is surrounded by an outer member 3.

[0034] FIG. 3 is an enlarged cross-sectional view showing the imaging assembly 4 shown in FIG. The imaging assembly 4 includes an imaging element 44 (heat generating portion), a cylindrical shield pipe 41 (second heat dissipation member) having a rectangular cross section that houses the imaging element 44, and a molded resin part 48 (first heat dissipation member) that is formed inside the shield pipe 41 and integrates the imaging element 44 and the shield pipe 41. Heat generated by the imaging element 44 is absorbed and dissipated by the shield pipe 41 or the molded resin part 48. That is, the shield pipe 41 and the molded resin part 48 are heat dissipation members.

[0035] The shield pipe 41 is made of, for example, nickel. An objective lens unit 42 is provided at one end of the shield pipe 41, and a cable 47 is inserted into the shield pipe 41 from the other end of the shield pipe 41.

[0036] The imaging element 44 is, for example, a complementary metal oxide semiconductor (CMOS) image sensor or a charge coupled device (CCD) image sensor. The imaging element 44 is plate-shaped. The imaging element 44 is fitted inside the shield pipe 41, and its side surface abuts against the inner surface of the shield pipe 41.

[0037] A cover lens 46 is provided on the light receiving surface side of the imaging element 44 inside the shield pipe 41. The cover lens 46 has a cover glass, a color filter, a microlens, etc. That is, the cover lens 46 covers the light receiving surface of the imaging element 44.

[0038] The imaging element 44 converts an optical image formed on the light receiving surface into an electric signal and outputs the electric signal to the display device. Within the shield pipe 41, a plurality of electrodes 441 for inputting and outputting electric signals are protruded from the surface of the imaging element 44 opposite to the light receiving surface. In addition, a mounting board 43 is provided adjacent to the electrodes 441. That is, the imaging element 44 is connected to the mounting board 43 via the electrodes 441.

[0039] Furthermore, inside the shield pipe 41, a driver IC (not shown) and the like are mounted on a mounting board 43, and the mounting board 43 and a cable 47 are connected via electric wires. The driver IC drives the imaging element .

[0040] The driver IC is electrically connected to one end of a cable 47. The cable 47 is configured such that the power lines and signal lines are covered with a sheath, and is flexible. The cable 47 is used for supplying power from the power supply device to the imaging element 44, and outputting signals from the imaging element 44 to the display device. The cable 47 is connected to the flexible printed circuit board.

[0041] Furthermore, inside the shield pipe 41, a molded resin is filled from the imaging element 44 to one end of the cable 47 to form a molded resin section 48. More specifically, the molded resin section 48 is formed so as to cover the electrode 441 side of the imaging element 44 and the mounting board 43. In Figures 2 and 3, the molded resin section 48 is indicated by hatching.

[0042] The molded resin part 48 is, for example, a highly heat-conductive resin containing a heat-conductive filler, and has high insulating properties. The heat conductivity of the molded resin part 48 is, for example, 2.4 W / (m·K). The molded resin part 48 molds the driver IC, the flexible printed circuit board, and the connection part of the cable 47 with the flexible printed circuit board, preventing electrical disconnection. The molded resin part 48 absorbs heat generated from the imaging element 44, the driver IC, and the flexible printed circuit board, and transmits it to the shield pipe 41.

[0043] That is, the molded resin portion 48 has a substantially rectangular parallelepiped shape and is fitted inside the shield pipe 41. The molded resin portion 48 is made of, for example, epoxy and has a linear expansion coefficient larger than that of the shield pipe 41. The linear expansion coefficient of the molded resin portion 48 is 55.5×10 -6 / °C, and the shield pipe 41 (15.5×10 -6 / ℃).

[0044] Furthermore, the molded resin portion 48 has a linear expansion coefficient larger than those of the imaging element 44 and the shield pipe 41. The linear expansion coefficient of the imaging element 44 is 3.43×10 -6 / °C. In contrast, the molded resin portion 48 is made of resin as described above, and has a linear expansion coefficient of 55.5×10 -6 / °C. As described above, the shield pipe 41 is made of nickel and has a linear expansion coefficient of 15.5×10 -6 / ℃.

[0045] Between the imaging element 44 and the molded resin portion 48, and the shield pipe 41, a sheet-shaped intervening member 45 is disposed for the purposes of airtightness, insulation, and the like. That is, the intervening member 45 is sheet-shaped and surrounds the imaging element 44 and the molded resin portion 48. The intervening member 45 is made of, for example, silicone rubber, and an adhesive may be applied to a main surface of the intervening member 45.

[0046] The linear expansion coefficient of the intervening member 45 is 2.5 to 4.0 × 10-4 / °C, and the image sensor 44 (3.43 × 10 -6 / ℃), molded resin part 48 (55.5×10 -6 / ℃) and shield pipe 41 (15.5×10 -6 / ℃) is greater than the linear expansion coefficient. In this way, since the linear expansion coefficient of the interposing member 45 is greater than the linear expansion coefficients of the molded resin portion 48 and the shield pipe 41, when thermal expansion occurs due to heat generation from the imaging element 44, the molded resin portion 48 and the shield pipe 41 can be closely contacted via the interposing member 45.

[0047] Furthermore, the compression rate of the interposed member 45 due to the shield pipe 41 and the molded resin portion 48 is 20% or more in a high-temperature environment of 70 to 80° C. Here, the compression rate is calculated by the following formula 1. {(T1-T2) / T1}×100 (Formula 1) T1 is the thickness before the intervening member 45 is interposed between the shield pipe 41 and the molded resin part 48, and T2 is the thickness in the high temperature environment when the intervening member 45 is interposed between the shield pipe 41 and the molded resin part 48.

[0048] Fig. 4 is a graph showing the relationship between the temperature of the imaging element 44 and the compression ratio of the interposed member 45 in the endoscope 1 according to the present embodiment. In Fig. 4, the horizontal axis represents the compression ratio (%) of the interposed member 45, and the vertical axis represents the temperature of the imaging element 44.

[0049] 4, it is understood that the higher the compression rate of the interposed member 45, the lower the temperature of the imaging element 44. In other words, the higher the compression rate of the interposed member 45, the more heat is dissipated from the imaging element 44. Furthermore, when the compression rate of the interposed member 45 exceeds 20% (see the arrow in FIG. 4), the amount of decrease in the temperature of the imaging element 44 remains almost the same.

[0050] As described above, the linear expansion coefficient of the intervening member 45 is larger than those of the molded resin portion 48 and the shield pipe 41, and the compression ratio of the intervening member 45 is 20% or more, so that the heat generated by the imaging element 44 is quickly conducted to the shield pipe 41 via the intervening member 45, and is effectively dissipated.

[0051] The material of the interposed member 45 is not limited to silicon rubber, but may be polyimide, polyester, a silicon sheet, urethane, acrylic, hot melt, or the like.

[0052] The objective lens unit 42 has a plurality of imaging lenses 421, 421, . . . and a lens holding cylinder 422. The lens holding tube 422 has a rectangular cylindrical shape and has a circular inner peripheral surface in cross section. In the axial direction of the lens holding tube 422, the wall thickness of the half closer to the shield pipe 41 is thicker than the remaining half. In addition, the lens holding tube 422 has a stepped portion formed along the circumferential direction on the outer peripheral surface of one end portion on the shield pipe 41 side, and a tapered portion with a reduced outer diameter is provided. The outer diameter of the tapered portion is slightly smaller than the inner diameter of the one end portion of the shield pipe 41, and the one end portion of the shield pipe 41 is fitted onto the one end portion of the lens holding tube 422.

[0053] The multiple imaging lenses 421, 421, . . . are fitted into a lens holding cylinder 422. The multiple imaging lenses 421, 421, .

[0054] As shown in FIG. 2, the imaging assembly 4 is fitted within the outer member 3 . The outer member 3 includes a tip cylindrical portion 31 (first outer member) and a cylindrical main body 32 (second outer member). The tip cylindrical portion 31 has a bottomed cylindrical shape, and the cylindrical main body 32 has a cylindrical shape. The tip of the lens holding tube 422 is exposed to the outside through a through hole formed in the bottom of the tip cylindrical portion 31.

[0055] One end of the tip cylindrical portion 31 is fitted coaxially with one end of the cylindrical body 32. More specifically, the cylindrical body 32 has a step formed along the circumferential direction on the inner peripheral surface of the one end, providing an expanded diameter portion with an expanded inner diameter. The inner diameter of the expanded diameter portion is slightly larger than the outer diameter of the one end of the tip cylindrical portion 31. Large The one end of the tip cylindrical portion 31 is fitted into the one end of the cylindrical main body 32 .

[0056] The tip cylindrical portion 31 is made of resin, such as m-PPE (Noryl, Iupiace), PPSU (Radel), POM, PPE, PC, PP, ABS, PMMA, etc. The tip cylindrical portion 31 has one end fitted inside a cover tube 26 (exterior member) described below, and the other end on the tip side is exposed to the outside.

[0057] In addition, a plurality of through holes are formed in the bottom of the tip cylindrical portion 31, penetrating the bottom from inside to outside, and one end of the imaging assembly 4 is exposed to the outside through one of the through holes, as described above. In addition, one end of a channel tube (not shown) opens through another through hole. The channel tube extends over the entire length of the insertion portion 2, and the other end is connected to a channel inlet 113 of the operation portion 11.

[0058] The cylindrical body 32 is made of a metal such as SUS, Cu, brass, Al, Ti, Fe, etc. The cylindrical body 32 is fitted inside the cover tube 26 and is not exposed to the outside.

[0059] The tip cylindrical portion 31 has a lower thermal conductivity than the cylindrical main body 32. For example, the tip cylindrical portion 31 has a thermal conductivity of 0.5 W / (m·K) or less, and the cylindrical main body 32 has a thermal conductivity of 20 W / (m·K) or more.

[0060] Furthermore, in the endoscope 1 according to this embodiment, the distal end cylindrical portion 31 and the cylindrical main body 32 are configured to have a linear expansion coefficient larger than that of the shield pipe 41 . That is, the tip cylindrical portion 31 is made of resin and has a linear expansion coefficient larger than that of the shield pipe 41 made of a metallic material. Moreover, for the cylindrical main body 32, a material having a linear expansion coefficient larger than that of the shield pipe 41 is selected from the materials listed above.

[0061] Therefore, when heat is generated from the imaging element 44 and the shield pipe 41 and the outer member 3 (the tip cylindrical portion 31 and the cylindrical main body 32) thermally expand, the thermal expansion of the outer member 3 becomes larger than that of the shield pipe 41, and it is possible to prevent the shield pipe 41 and the outer member 3 from coming into close contact with each other. Therefore, it is possible to suppress the heat from the imaging element 44 from being transmitted to the outer member 3 via the shield pipe 41.

[0062] Furthermore, as described above, in the endoscope 1 according to this embodiment, the thermal conductivity of the tip cylindrical portion 31 exposed to the outside is lower than the thermal conductivity of the unexposed cylindrical main body 32. Therefore, even if heat from the imaging element 44 is transmitted to the outer member 3 via the shield pipe 41, it is possible to prevent high heat from being transmitted to the patient's skin via the tip cylindrical portion 31.

[0063] 2, the outer peripheral surface of the outer member 3 is covered by the cover tube 26. That is, the cover tube 26 is fitted onto the outer member 3. As described above, the outer peripheral surface of the one end of the tip cylindrical portion 31 is surrounded by the cover tube 26, and the entire outer peripheral surface of the cylindrical main body 32 is surrounded by the cover tube 26.

[0064] The cover tube 26 is made of a material with excellent heat insulation properties. More specifically, the cover tube 26 is made of a material with a lower thermal conductivity than the tip cylindrical portion 31. For example, the cover tube 26 is made of fluorine-based rubber.

[0065] As described above, the cover tube 26 covers the entire outer circumferential surface of the cylindrical main body 32. Therefore, although the thermal conductivity of the cylindrical main body 32 is higher than that of the tip cylindrical portion 31, even if heat from the imaging element 44 is transmitted to the outer member 3 via the shield pipe 41, the transmission of high heat to the patient's skin can be suppressed.

[0066] In the above, an example has been described in which the thermal conductivity of the cover tube 26 is 0.2 to 0.25 W / (m·K), but the present invention is not limited to this. Fig. 5 is a graph showing the relationship between the thermal conductivity of the cover tube 26 and the temperature difference between the inside and outside of the cover tube 26. In Fig. 5, the horizontal axis shows the thermal conductivity of the cover tube 26, and the vertical axis shows the temperature difference between the inside and outside of the cover tube 26. That is, Fig. 5 shows how much of a temperature difference occurs between the inside and outside of the cover tube 26 depending on the thermal conductivity of the material of the cover tube 26. However, Fig. 5 shows the calculation results assuming that the thickness of the cover tube 26 is 0.5 mm, the outer diameter of the endoscope 1 is 10.75 mm, and the power consumption of the image sensor 44 is 0.23 mW.

[0067] As can be seen from Fig. 5, the lower the thermal conductivity of the cover tube 26, the larger the temperature difference between the inside and outside of the cover tube 26, and the lower the risk of burns. In particular, when the thermal conductivity of the cover tube 26 is 0.1 W / (m·K) or less (see the arrow in Fig. 5), the temperature difference between the inside and outside of the cover tube 26 is Rapid increase Therefore, by using a material for the cover tube 26 with a thermal conductivity of 0.1 W / (m·K) or less, the risk of burns can be effectively reduced.

[0068] Considering that the human body generally suffers burns at temperatures above 70°C and that the guaranteed upper limit temperature of the image sensor 44 is 75°C, it is desirable that the temperature difference between the inside and outside of the cover tube 26 be 6°C or more. Therefore, by using a material for the cover tube 26 with a thermal conductivity of 0.05 W / (m K) or less, the risk of burns can be reduced more reliably.

[0069] In the present embodiment, the shield pipe 41 is made of nickel, but the present invention is not limited to this. The shield pipe 41 may be made of, for example, Al, SUS, Cu, brass, Ti, Fe, or the like.

[0070] In the present embodiment, the molded resin portion 48 is made of epoxy, but the present invention is not limited to this. The molded resin portion 48 may be made of, for example, a silicone-based, acrylic-based, urethane-based, melamine-based, hot melt-based, or other material.

[0071] <Modification> In the above, an example has been described in which the interposing member 45 is interposed between the shield pipe 41 and the molded resin portion 48, but this is not limited thereto, and the interposing member 45 may be omitted.

[0072] In such a modified example, the shield pipe 41 may be configured so that its compression ratio is 20% or more in a high-temperature environment of 70 to 80° C. The compression ratio of the shield pipe 41 is calculated by the above-mentioned formula 1. In this case, T1 is the thickness of the shield pipe 41 at room temperature, and T2 is the thickness of the shield pipe 41 in the high temperature environment.

[0073] Furthermore, as described above, the linear expansion coefficient of the molded resin portion 48 is greater than that of the shield pipe 41, so that when thermal expansion occurs due to heat generation from the imaging element 44, the molded resin portion 48 and the shield pipe 41 can be brought into close contact with each other.

[0074] As described above, the linear expansion coefficient of molded resin portion 48 is greater than that of shielded pipe 41, and the compression ratio of shielded pipe 41 is 20% or more, so that heat generated by imaging element 44 is quickly conducted to shielded pipe 41 and is effectively dissipated. [Explanation of symbols]

[0075] 1 Endoscope 3 Outer member 4 Imaging Assembly 26 Cover tube (exterior part) 31 Tip cylindrical portion (first outer member) 32 Cylinder body (second outer member) 41 Shield pipe (second heat dissipation member) 44 Image sensor (heat generating part) 45 Intervening member 48 molded resin portion (first heat dissipation member)

Claims

1. An endoscope including a heat generating section that generates heat during operation and a heat dissipating member that dissipates heat transmitted from the heat generating section, the heat dissipation member includes a first heat dissipation member that covers the heat generating portion, and a cylindrical second heat dissipation member into which the first heat dissipation member is fitted, the first heat dissipation member has a linear expansion coefficient larger than those of the heat generating portion and the second heat dissipation member, a sheet-shaped interposition member is disposed between the first heat dissipation member and the second heat dissipation member; An endoscope, comprising: an intervening member having a linear expansion coefficient greater than linear expansion coefficients of the heat generating portion, the first heat dissipating member, and the second heat dissipating member.

2. an outer member into which the second heat dissipation member is fitted, The endoscope according to claim 1 , wherein the outer member has a linear expansion coefficient larger than that of the second heat dissipation member.

3. The outer member includes a first outer member that is exposed to the outside and a second outer member that is not exposed to the outside, 3. The endoscope according to claim 2, wherein the first outer member has a lower thermal conductivity than the second outer member.

4. the second outer member is cylindrical; a cylindrical exterior member into which the second outer member is fitted, 4. The endoscope according to claim 3, wherein the exterior member has a thermal conductivity of 0.1 W / (m·K) or less.

5. 5. The endoscope according to claim 4, wherein the exterior member has a thermal conductivity of 0.05 W / (m·K) or less.

6. the first heat dissipation member is made of epoxy; 6. The endoscope according to claim 1, wherein the second heat dissipation member is made of nickel.

7. 7. The endoscope according to claim 1, wherein the second heat dissipation member has a compressibility of 20% or more.

8. 2. The endoscope according to claim 1, wherein the intervening member has a compressibility of 20% or more.

Images