Semiconductor module and method for manufacturing the same

Abstract

To improve the power cycle tolerance in a semiconductor module.SOLUTION: A semiconductor module includes a laminated substrate provided with a semiconductor chip, and a connection terminal having a connection portion to be connected to the laminated substrate. The connection portion includes at least one ultrasonic connection portion, and at least one laser weld portion at least a part of which is provided outside the location where the ultrasonic connection portion is provided. The at least one ultrasonic connection portion may be provided distally of the connection portion relative to the at least one laser weld portion.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to a semiconductor module and a method for manufacturing the semiconductor module. [Background technology]

[0002] Conventionally, there is known a bonding method that includes a first bonding step of temporarily attaching a first member to a second member at a bonding site by ultrasonic pressure welding, and a second bonding step of irradiating the bonding site with a laser beam after the first bonding step to laser weld the first member to the second member (see, for example, Patent Document 1). Also, there is known a hermetic sealing method that includes positioning and fixing a metal lid to a ceramic package by ultrasonic welding, and then welding the periphery of the main surface of the metal lid with an electron beam to achieve a hermetic seal (see, for example, Patent Document 2). [Prior art document] [Patent documents] [Patent Document 1] Japanese Unexamined Patent Publication No. 10-22328 [Patent Document 2] Japanese Patent Application Laid-Open No. 11-354660 Summary of the Invention [Problem to be solved by the invention]

[0003] It is preferable to improve the power cycle resistance of a semiconductor module. [Means for solving the problem]

[0004] In order to solve the above problems, a first aspect of the present invention provides a semiconductor module. The semiconductor module may include a laminated substrate. A semiconductor chip may be provided on the laminated substrate. The semiconductor module may include a connection terminal. The connection terminal may have a connection portion that connects to the laminated substrate. The connection portion may have at least one ultrasonic connection portion. The connection portion may have at least one laser weld portion. At least a portion of the laser weld portion may be provided in a location other than where the ultrasonic connection portion is provided.

[0005] The at least one ultrasonic connection may be provided closer to a tip of the connection portion than the at least one laser weld.The at least one laser weld may be provided closer to a tip of the connection portion than the at least one ultrasonic connection.

[0006] The connection portion may have a plurality of laser welds. The plurality of laser welds may sandwich the ultrasonic connection portion when viewed from above. The plurality of laser welds may be provided on the opposite side of the connection portion from the tip side of the ultrasonic connection portion. The holes of the laser welds may be deeper as they are provided on the opposite side of the connection portion from the tip side.

[0007] The connection terminal may have a foot. The foot may extend in the height direction. The longitudinal direction of the at least one laser weld may be inclined with respect to a direction connecting the tip of the connection portion and the foot. The longitudinal direction of the at least one laser weld may be approximately parallel to the direction connecting the tip of the connection portion and the foot.

[0008] The connection portion may have two laser welds. The two laser welds may intersect.

[0009] At least a portion of the laser welds may overlap the ultrasonic connection in a top view. Any of the laser welds may have a first portion that overlaps the ultrasonic connection in a top view. Any of the laser welds may have a second portion that does not overlap the ultrasonic connection in a top view. The hole in the second portion may be deeper than the hole in the first portion.

[0010] The ultrasonic connection may have irregularities on the surface of the connection portion.

[0011] The semiconductor module may include a plurality of connection terminals. The laser welds provided at the connection portions of the connection terminals may be aligned in a straight line.

[0012] In a second aspect of the present invention, there is provided a method for manufacturing a semiconductor module. The method for manufacturing a semiconductor module may include an ultrasonic bonding step. In the ultrasonic bonding step, an ultrasonic bond may be provided at the connection portion by ultrasonic waves. The method for manufacturing a semiconductor module may include a laser welding step after the ultrasonic bonding step. In the laser welding step, a laser weld may be provided at the connection portion by laser welding. At least a portion of at least one laser weld may be provided at a location other than where the ultrasonic bond is provided.

[0013] The above summary of the invention does not list all of the necessary features of the present invention. Also, subcombinations of these features may also be inventions. [Brief description of the drawings]

[0014] [Figure 1] 2 is an example of a top view of the semiconductor module 100. FIG. [Diagram 2] 1 is an example of a top view of a semiconductor assembly 110. FIG. [Diagram 3] FIG. 3 is a diagram showing a comparative example of the a-a cross section of FIG. 2. [Figure 4] 4 is a diagram showing an example of a connection terminal 52 of FIG. 3 as viewed from above. [Diagram 5] FIG. 3 is a diagram showing an embodiment of the cross section aa of FIG. 2. [Figure 6] 6 is a diagram showing an example of a connection terminal 52 of FIG. 5 as viewed from above. [Figure 7] FIG. 3 is a diagram showing another embodiment of the cross section taken along the aa section of FIG. 2. [Figure 8] 8 is a diagram showing an example of a connection terminal 52 of FIG. 7 when viewed from above. [Figure 9] FIG. 3 is a diagram showing another embodiment of the cross section taken along the aa section of FIG. 2. [Figure 10] 10 is a diagram showing an example of a connection terminal 52 of FIG. 9 as viewed from above. [Figure 11] FIG. 3 is a diagram showing another embodiment of the cross section taken along the aa section of FIG. 2. [Figure 12] 12 is a diagram showing an example of a connection terminal 52 of FIG. 11 as viewed from above. [Figure 13] 13 is a diagram showing another example of the connection terminal 52 when viewed from above. FIG. [Figure 14] 13 is a diagram showing an example of an arrangement of connection portions 62 of connection terminals 52 when viewed from above. FIG. [Figure 15] FIG. 3 is a diagram showing another embodiment of the cross section taken along the aa section of FIG. 2. [Figure 16] 2A to 2C are diagrams illustrating an example of a method for forming the semiconductor module 100. [Figure 17] 6 is a diagram showing the vicinity of a laser welded portion 74 in FIG. 5. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015] The present invention will be described below through embodiments of the invention, but the following embodiments do not limit the scope of the invention according to the claims. Furthermore, not all of the combinations of features described in the embodiments are necessarily essential to the solution of the invention.

[0016] In this specification, one side in a direction parallel to the depth direction of a semiconductor module is referred to as "upper" and the other side as "lower." Of the two main surfaces of a substrate, layer or other member, one surface is referred to as the upper surface and the other surface is referred to as the lower surface. The directions of "upper" and "lower" are not limited to the direction of gravity or the direction of attachment to a substrate or the like when mounting a semiconductor chip.

[0017] 1 is an example of a top view of a semiconductor module 100. The semiconductor module 100 includes a base 10, a laminated substrate 20, a semiconductor chip 30, a semiconductor assembly 110, a PCB 40 (Printed Circuit Board), and a housing 90. The laminated substrate 20 is provided above the base 10. The semiconductor chip 30 is provided above the laminated substrate 20. The semiconductor assembly 110 includes the semiconductor chip 30. The PCB 40 is provided above the semiconductor assembly 110. The housing 90 is provided to surround a side edge of the base 10.

[0018] 1, the long side direction of the rectangular housing 90 is defined as the X-axis, and the short side direction is defined as the Y-axis. The Z-axis direction is a right-handed direction relative to the X-axis and Y-axis directions, and is the direction of the semiconductor module 100 on which the semiconductor assembly 110 is installed. The top view is the direction seen from the positive direction of the Z-axis toward the semiconductor module 100.

[0019] The housing 90 is provided around the outer edge of the base 10 to surround the multiple semiconductor assemblies 110. The housing 90 is made of polyphenyl sulfide (PPS), polybutylene terephthalate (PBT), polybutyl acrylate (PBA), polyamide (PA), acrylonitrile butadiene styrene (ABS), liquid crystal polymer (LCP), polyether ether ketone (PEEK), polybutylene succinate (PBS), urethane, silicone, or the like. In this example, the housing 90 is made of PPS resin, which is a heat-resistant resin.

[0020] The base 10 is a base for cooling a semiconductor to dissipate heat generated in the semiconductor assembly 110. The base 10 is made of a metal having excellent thermal conductivity. As an example, the base 10 is made of a metal such as copper, aluminum, iron, or an alloy thereof.

[0021] A cooler is provided below the base 10. As an example, the cooler includes a heat sink having a plurality of fins. The cooler may be a cooling device that cools by flowing a cooling liquid between the plurality of fins. As an example, the cooler is made of a metal such as copper, aluminum, iron, or an alloy thereof.

[0022] As an example, a bonding layer containing a thermal compound is provided between the cooler and the base 10. The bonding layer may be an organic oil containing a filler with good thermal conductivity such as alumina. In another example, the cooler and the base 10 may be integrally molded from a metal. In this case, the base 10 becomes the upper surface of the cooler.

[0023] The laminated substrate 20 may be a DCB (Direct Copper Bonding) substrate, an AMB (Active Metal Blazed) substrate, etc. The laminated substrate 20 in this example is a DCB substrate.

[0024] The laminated substrate 20 has a structure in which the metal plate 22 is directly bonded to the insulating plate 21 so as to sandwich the insulating plate 21 from above and below. The laminated substrate 20 may be placed above the base 10 via a bonding material by soldering using lead-free solder.

[0025] The insulating plate 21 includes a material having high thermal conductivity and small dielectric loss. As an example, the insulating plate 21 includes a ceramic material such as alumina, aluminum nitride, or silicon nitride. The metal plate 22 is made of a metal such as copper or aluminum. In particular, when the laminate substrate 20 is a DCB substrate, the metal plate 22 is made of copper or a copper alloy.

[0026] As an example, the semiconductor chip 30 has switching elements such as power metal oxide semiconductor field effect transistors (MOSFETs), insulated gate bipolar transistors (IGBTs), and reverse conducting (RC)-IGBTs, and free wheeling diodes such as free wheeling diodes (FWDs). The semiconductor chip 30 may be manufactured using a semiconductor substrate such as silicon, silicon carbide, or gallium nitride. A semiconductor module 100 including a semiconductor assembly 110 including a plurality of semiconductor chips 30 can constitute a power device such as an inverter or an intelligent power module (IPM) including a control circuit as a whole. The semiconductor chip 30 is provided above the laminated substrate 20, particularly on the upper surface of the metal plate 22. Similar to between the base 10 and the laminated substrate 20, solder bonding using lead-free solder as a bonding material may be performed between the semiconductor chip 30 and the metal plate 22.

[0027] The PCB 40 has a wiring layer connected to the control electrodes 34 of the switching elements of the semiconductor chip 30. As an example, the PCB 40 is electrically connected to the semiconductor chip 30 by bonding wires 55. As an example, the PCB 40 is provided as a substrate in which a wiring layer is provided on a polyimide film substrate or an epoxy film substrate. The PCB 40 may be provided on a shelf-like portion of the wall surface of the housing 90 that protrudes toward the semiconductor assembly 110 above the semiconductor chip 30.

[0028] One or more external connection parts 50 are provided around each semiconductor assembly 110. As an example, when the semiconductor module 100 is a three-phase inverter, three external connection parts 50 may be provided for each semiconductor assembly 110 as power supply terminals and load terminals for driving the U phase, V phase, and W phase. The external connection parts 50 may be nickel plated. By connecting a copper bus bar to the external connection parts 50, a large current can be applied to each connection terminal 52 of the semiconductor assembly 110.

[0029] The connection terminal 52 is electrically connected to the external connection portion 50. In this example, a plurality of connection terminals 52 are provided for one external connection portion 50. In FIG. 1, two or three connection terminals 52 are provided for one external connection portion 50. Also, one connection terminal 52 may be provided for one external connection portion 50. The connection terminal 52 and the external connection portion 50 may be connected by welding or a bonding material, or may be formed from a single metal plate. The connection terminal 52 is provided as a terminal for external connection to each semiconductor assembly 110 in order to supply a voltage for driving each element of the semiconductor chip 30.

[0030] FIG. 2 is an example of a top view of the semiconductor assembly 110. The semiconductor assembly 110 of this example includes a laminated substrate 20 and four semiconductor chips 30, each in two pairs, mounted on the laminated substrate 20. The semiconductor chips 30 are electrically connected to connection terminals 52 for external connection. The semiconductor assembly 110 may have a metal wiring plate 70 that electrically connects the semiconductor chips 30 and the connection terminals 52. Instead of the metal wiring plate 70, the semiconductor chips 30 and the connection terminals 52 may be electrically connected by a conductive member such as a wire or a ribbon. In this example, the connection terminals 52 and the metal plate 22 are connected by a bonding material. The semiconductor assembly 110 may include a block (not shown) provided on the metal plate 22. The connection terminals 52 may be connected to the metal plate 22 via the block. The block may be provided from a metal material such as copper or a copper alloy. The metal plate 22 may include a main circuit section to which the semiconductor chips 30 and the metal wiring plate 70 are connected, and a control circuit section to which the control electrode 34 is connected.

[0031] An upper main electrode 32 for external connection and a control electrode 34 for controlling a main current are provided on the upper surface of the semiconductor chip 30. The upper main electrode 32 may contain aluminum, nickel, or an alloy containing at least one of them. When the semiconductor chip 30 has a vertical switching element, the semiconductor chip 30 may have the upper main electrode 32 on the upper surface side and a lower main electrode (not shown) on the opposite side to the upper main electrode 32. When the switching element is an IGBT element, the upper main electrode 32 may be an emitter electrode and the lower main electrode may be a collector electrode. The control electrode 34 may include various sense electrodes such as an emitter sense electrode, a temperature sense electrode, and a current sense electrode in addition to a gate electrode.

[0032] The upper main electrode 32 and the metal plate 22 may be electrically connected by a metal wiring plate 70. The upper main electrode 32 and the metal wiring plate 70 may be joined by soldering using lead-free solder.

[0033] As an example, the metal wiring board 70 is made of a material having excellent conductivity, such as aluminum, copper, or an alloy containing at least one of these. The metal wiring board 70 may be provided by a lead frame. The metal wiring board 70 may have an end connected to the metal plate 22, an end connected to the upper main electrode 32, and a connecting portion connecting both ends. The connecting portion may be rectangular when viewed from the Y-axis direction.

[0034] The PCB 40 has a wiring layer, to which a control terminal (not shown) and a bonding wire 55 are connected. The semiconductor chip 30 can be controlled by various signals generated by a control circuit via the PCB 40. The semiconductor chip 30 may include various sense electrodes in addition to a gate electrode, and the sense electrodes may also be connected to the control circuit via the bonding wire 55 and the PCB 40. The current of the control signal may be smaller than the current flowing through the connection terminal 52.

[0035] The PCB 40 may have a structure divided into a plurality of pieces as in this example by the connection terminals 52. In a portion between the plurality of PCBs 40, a portion of the base 10 may be exposed in a top view.

[0036] Fig. 3 is a diagram showing a comparative example of the aa cross section of Fig. 2. The aa cross section is an XZ plane passing through one connection terminal 52. Note that the dimensions of Fig. 3 do not necessarily match those of Fig. 2. The semiconductor module 100 of this example has a base 10, a laminated substrate 20, and a connection terminal 52 in this cross section.

[0037] The connection terminal 52 in this example has a connection portion 62, a foot portion 64, and an extension portion 66. The connection portion 62 is a portion that connects to the laminated substrate 20. The connection portion 62 may be a plate-like portion that is approximately parallel to the XY plane. Therefore, the connection portion 62 may be a plate-like portion that is approximately parallel to the top surface of the semiconductor chip 30. Note that approximately parallel refers to a state in which the angle is, for example, 10 degrees or less.

[0038] The foot 64 is a portion that extends in the Z-axis direction (height direction). The extension 66 extends in the Y-axis direction. Although omitted in FIG. 3, the extension 66 connects to the external connection portion 50. Thus, the extension 66 connects the external connection portion 50 and the connection portion 62 via the foot 64. The extension 66 is provided above the laminated substrate 20. Moreover, the tip 63 of the connection portion 62 is the end portion opposite the foot 64. In other words, the tip 63 side of the connection portion 62 is the opposite side to the foot 64 side of the connection portion 62.

[0039] In this example, the connection portion 62 has at least one ultrasonic connection portion 72. The ultrasonic connection portion 72 is a portion that is connected by ultrasonic bonding. Ultrasonic bonding is a method of bonding by applying ultrasonic vibrations to a bonding surface by a vibrator, causing the bonding surfaces to rub against each other and undergo plastic deformation. In this example, the connection portion 62 and the laminated substrate 20 are bonded by ultrasonic vibrations. As shown in FIG. 3, the ultrasonic connection portion 72 has irregularities on the surface of the connection portion 62.

[0040] Fig. 4 is a diagram showing an example of the connection terminal 52 of Fig. 3 when viewed from above. Fig. 4 shows the vicinity of the tip 63 of the connection portion 62. As shown in this example, the ultrasonic connection part 72 may have a circular shape.

[0041] The ultrasonic connection portion 72 ultrasonically bonded to the laminated substrate 20 may experience connection failure (peeling) due to stress, resulting in poor electrical characteristics, which may lead to a tendency for the power cycle resistance to decrease.

[0042] Fig. 5 is a diagram showing an example of a cross section taken along line aa in Fig. 2. Fig. 6 is a diagram showing an example of the connection terminal 52 in Fig. 5 as viewed from above. Figs. 5 and 6 differ from Figs. 3 and 4 in that the connection portion 62 has a laser weld 74. The configuration of Fig. 5 other than the laser weld 74 may be the same as that of Fig. 3. The configuration of Fig. 6 other than the laser weld 74 may be the same as that of Fig. 4.

[0043] In this example, the connection portion 62 has at least one laser weld 74. The laser weld 74 is a portion that is connected by laser welding. Laser welding is a method of joining by locally melting metal by irradiating a focused laser beam and solidifying the molten metal. In this example, the connection portion 62 and the laminated substrate 20 are joined by laser welding. In FIG. 5, the location where the laser melting occurred is indicated by hatching. In this specification, one laser weld 74 means that it is continuously connected in one direction. The laser weld 74 in FIG. 6 is continuously connected in the X-axis direction.

[0044] The connection surface of the ultrasonic connection part 72 is a connection surface 76, which is indicated by a thick line in FIG. 5. In the example of FIG. 5, the connection surface 76 is substantially parallel to the horizontal direction (X-axis direction or Y-axis direction). Substantially parallel may include an error of ±10 degrees from parallel. On the other hand, the connection surface 78 of the laser welded part 74 (see FIG. 17) is inclined with respect to the horizontal direction. Therefore, the connection surface 78 of the laser welded part 74 includes a direction different from the direction of the connection surface 76 of the ultrasonic connection part 72. Therefore, the connection part 62 becomes strong against stress in various directions. Therefore, in this example, since the laser welded part 74 is included in addition to the ultrasonic connection part 72, connection failure due to stress is unlikely to occur, interfacial rupture is suppressed, and power cycle resistance can be improved.

[0045] When the ultrasonic connection part 72 is irradiated with a laser beam, the laser beam is diffusely reflected. Therefore, the laser weld part 74 overlapping with the ultrasonic connection part 72 may be defectively formed. Therefore, it is preferable that at least a part of the laser weld part 74 is provided in a place other than where the ultrasonic connection part 72 is provided. In FIG. 6, the entire laser weld part 74 is provided in a place other than where the ultrasonic connection part 72 is provided. In other words, the laser weld part 74 is provided so as not to overlap with the ultrasonic connection part 72.

[0046] In this example, at least one ultrasonic connection 72 is provided closer to the tip 63 of the connection portion 62 than at least one laser weld 74. In FIG. 6, one ultrasonic connection 72 is provided closer to the tip 63 of the connection portion 62 than one laser weld 74. In other words, the laser weld 74 is provided closer to the foot 64 than the ultrasonic connection 72. Since the laser weld 74 is provided closer to the foot 64, the stress applied to the ultrasonic connection 72 provided on the tip 63 side is reduced. This makes it possible to suppress interfacial rupture and improve power cycle resistance.

[0047] In this example, the longitudinal direction of laser weld 74 is inclined with respect to the direction connecting tip 63 and foot 64 of connecting portion 62. In FIG. 6, the longitudinal direction of laser weld 74 is the X-axis direction. Moreover, the direction connecting tip 63 and foot 64 of connecting portion 62 is the Y-axis direction. The longitudinal direction of laser weld 74 may be approximately perpendicular to the direction connecting tip 63 and foot 64 of connecting portion 62. Approximately perpendicular may include an error of ±10 degrees from perpendicular. Laser weld 74 has a longitudinal direction as shown in FIG. 6, since it is formed by continuous irradiation with laser light.

[0048] Also, the reference surface 73 of the ultrasonic connection 72 is located below the reference surface 75 of the laser weld 74. The reference surface is the uppermost part of the ultrasonic connection 72 or the laser weld 74. As described above, in ultrasonic bonding, ultrasonic waves are applied by pressing a vibrator. Therefore, the reference surface 73 of the ultrasonic connection 72 is lower than before the ultrasonic connection 72 is formed. On the other hand, since the laser weld 74 is bonded by irradiating it with laser light, the reference surface 75 of the laser weld 74 does not change from before the laser weld 74 is formed. Therefore, the ultrasonic connection 72 and the laser weld 74 can be distinguished from each other by the height of the reference surface.

[0049] 5, the hole depth D1 of the laser weld 74 may be greater than the hole depth D2 of the ultrasonic connection 72. The hole depth D1 of the laser weld 74 may be the maximum depth of the portion where laser melting has occurred. In other words, it may be the maximum depth of the portion shown by hatching. The hole depth D2 of the ultrasonic connection 72 may be the maximum depth of the unevenness on the surface of the ultrasonic connection 72. The hole depth D2 of the ultrasonic connection 72 may be greater than the hole depth D1 of the laser weld 74.

[0050] Fig. 7 is a diagram showing another embodiment of the cross section aa in Fig. 2. Fig. 8 is a diagram showing an example of the connection terminal 52 in Fig. 7 as viewed from above. Figs. 7 and 8 differ from Figs. 5 and 6 in the configurations of the ultrasonic connection portion 72 and the laser weld portion 74. The configuration in Fig. 7 other than the ultrasonic connection portion 72 and the laser weld portion 74 may be the same as Fig. 5. The configuration in Fig. 8 other than the ultrasonic connection portion 72 and the laser weld portion 74 may be the same as Fig. 6.

[0051] In this example, the connection portion 62 has a plurality of laser welds 74. In Figures 7 and 8, the connection portion 62 has a laser weld 74-1 and a laser weld 74-2. The connection portion 62 may have three or more laser welds 74.

[0052] In this example, at least one laser weld 74 is provided closer to the tip 63 of the connection portion 62 than at least one ultrasonic connection portion 72. In Figures 7 and 8, laser weld 74-2 is provided closer to the tip 63 of the connection portion 62 than the ultrasonic connection portion 72. Even with this configuration, it is possible to suppress interfacial rupture and improve power cycle resistance. Also, in Figures 7 and 8, laser weld 74-1 is provided closer to the foot portion 64 than the ultrasonic connection portion 72.

[0053] In this example, the plurality of laser welds 74 sandwich the ultrasonic connection 72 in a top view. In Fig. 8, the laser welds 74-1 and 74-2 sandwich the ultrasonic connection 72 in a top view. With this configuration, it is possible to further suppress interfacial rupture and improve the power cycle resistance.

[0054] Fig. 9 is a diagram showing another embodiment of the cross section aa in Fig. 2. Fig. 10 is a diagram showing an example of the connection terminal 52 in Fig. 9 as viewed from above. Figs. 9 and 10 differ from Figs. 5 and 6 in the configurations of the ultrasonic connection portion 72 and the laser weld portion 74. The configurations of Fig. 9 other than the ultrasonic connection portion 72 and the laser weld portion 74 may be the same as Fig. 5. The configurations of Fig. 10 other than the ultrasonic connection portion 72 and the laser weld portion 74 may be the same as Fig. 6.

[0055] In this example, the connection portion 62 also has a plurality of laser welds 74. In Figures 9 and 10, the connection portion 62 has laser welds 74-3 and laser welds 74-4. The laser welds 74-3 and laser welds 74-4 are provided on the foot portion 64 side relative to the ultrasonic connection portion 72. In other words, the laser welds 74-3 and laser welds 74-4 are provided on the opposite side of the tip portion 63 relative to the ultrasonic connection portion 72.

[0056] In this example, the hole of the laser weld 74 becomes deeper as it is provided on the side opposite to the tip 63 of the connection part 62. In Fig. 9, the hole depth D3 of the laser weld 74-3 is greater than the hole depth D4 of the laser weld 74-4. With this configuration, the foot 64 side is stronger against stress in the height direction (Z-axis direction). Therefore, it is possible to further suppress interfacial rupture and improve the power cycle resistance.

[0057] Fig. 11 is a diagram showing another embodiment of the cross section aa in Fig. 2. Fig. 12 is a diagram showing an example of the connection terminal 52 in Fig. 11 as viewed from above. Fig. 11 shows a cross section passing through the laser welded portion 74 in Fig. 12. Figs. 11 and 12 differ from Figs. 5 and 6 in the configurations of the ultrasonic connection portion 72 and the laser welded portion 74. The configurations of Fig. 11 other than the ultrasonic connection portion 72 and the laser welded portion 74 may be the same as Fig. 5. The configurations of Fig. 12 other than the ultrasonic connection portion 72 and the laser welded portion 74 may be the same as Fig. 6.

[0058] In this example, the longitudinal direction of the laser weld 74 is approximately parallel to the direction connecting the tip 63 and the foot 64 of the connection part 62. In Fig. 12, the longitudinal direction of the laser weld 74 is the Y-axis direction. Also, the direction connecting the tip 63 and the foot 64 of the connection part 62 is the Y-axis direction. In this way, the laser weld 74 can be provided along the direction connecting the tip 63 and the foot 64 of the connection part 62.

[0059] In FIG. 12, at least a portion of the laser weld 74 overlaps with the ultrasonic connection 72 in a top view. In FIG. 12, the laser weld 74 has a first portion 82 that overlaps with the ultrasonic connection 72 in a top view. The laser weld 74 also has a second portion 84 that does not overlap with the ultrasonic connection 72 in a top view. Even if at least a portion of the laser weld 74 overlaps with the ultrasonic connection 72 in a top view, by providing the second portion 84 that does not overlap with the ultrasonic connection in a top view, it is possible to suppress interfacial rupture and improve the power cycle resistance. Note that it is preferable that the proportion of the second portion 84 in the laser weld 74 is large.

[0060] 11, the hole depth D6 of the second portion 84 is deeper than the hole depth D5 of the first portion 82. As described above, when the ultrasonic connection portion 72 is irradiated with laser light, diffuse reflection of the laser light occurs. Therefore, the hole depth D6 of the second portion 84 that does not overlap with the ultrasonic connection portion 72 in top view is deeper than the hole depth D5 of the first portion 82 that overlaps with the ultrasonic connection portion 72 in top view.

[0061] Fig. 13 is a diagram showing another example of the connection terminal 52 as viewed from above. Fig. 13 differs from Fig. 6 in the configurations of the ultrasonic connection portion 72 and the laser welded portion 74. The configurations of Fig. 13 other than the ultrasonic connection portion 72 and the laser welded portion 74 may be the same as those of Fig. 6.

[0062] In this example, the connection portion 62 has a plurality of laser welds 74. In Figs. 9 and 10, the connection portion 62 has two laser welds 74 (laser welds 74-5 and laser welds 74-6). The longitudinal direction of the laser welds 74-5 is approximately parallel to the Y-axis direction. The longitudinal direction of the laser welds 74-6 is approximately parallel to the X-axis direction. In addition, at least a portion of the laser welds 74-5 overlaps with the ultrasonic connection portion 72 in a top view.

[0063] 13, the laser welded portion 74-5 and the laser welded portion 74-6 intersect. That is, at least a portion of the laser welded portion 74-5 overlaps with the laser welded portion 74-6. Even with this configuration, it is possible to suppress interfacial fracture.

[0064] Fig. 14 is a diagram showing an example of an arrangement of connection portions 62 of connection terminals 52 in a top view. Fig. 14 is a diagram showing an arrangement of each connection portion 62 of a plurality of connection terminals 52 (connection terminals 52-1, 52-2, and 52-3). Connection terminal 52-1 has a connection portion 62-1. Connection terminal 52-2 has a connection portion 62-2. Connection terminal 52-3 has a connection portion 62-3. Each connection terminal 52 may be connected to one external connection portion 50, or each connection terminal 52 may be connected to a different external connection portion 50. The plurality of connection terminals 52 are arranged in parallel.

[0065] Each connection portion 62 has a laser weld 74. In this example, the laser welds 74 provided on each connection portion 62 are provided on a straight line. In Fig. 14, the laser welds 74 provided on each connection terminal 52 are provided on the X-axis direction. Because the laser welds 74 are provided on a straight line, a plurality of laser welds 74 can be provided in succession without changing the arrangement of the semiconductor module 100.

[0066] Fig. 15 is a diagram showing another embodiment of the cross section taken along line aa in Fig. 2. Fig. 15 differs from Fig. 5 in that the connection terminal 52 does not have a foot. Other configurations in Fig. 15 may be the same as those in Fig. 5.

[0067] In this example, since the connection terminal 52 does not have a foot portion, the extension portion 66 extends in the Z-axis direction in addition to the X-axis direction. Even if the connection terminal 52 has such a configuration, the connection terminal 52 can be electrically connected to the external connection portion 50.

[0068] 16 is a diagram showing an example of a method for forming the semiconductor module 100. The method for forming the semiconductor module 100 includes a placement step S101, an ultrasonic bonding step S102, and a laser welding step S103.

[0069] In the arrangement step S101, the connection terminals 52 are arranged. The semiconductor connection terminals 52 are arranged above the laminated substrate 20. In the arrangement step S101, the connection terminals 52 may be supported by an external support stand or the like.

[0070] In the ultrasonic bonding step S102, ultrasonic bonding portion 72 is provided on connection portion 62 of connection terminal 52 by ultrasonic waves. In ultrasonic bonding, ultrasonic vibration is applied to the bonding surfaces by a vibrator, and the bonding surfaces are rubbed against each other to plastically deform and bond the surfaces. For ultrasonic bonding, ultrasonic waves may be applied by other known methods.

[0071] In the laser welding step S103, a laser weld 74 is provided on the connection portion 62 of the connection terminal 52 by laser welding. In laser welding, a laser beam is focused and irradiated to locally melt metal, and the molten metal is solidified to bond the metal. Since ultrasonic bonding is performed by applying ultrasonic vibrations by a vibrator, the laser welding step S103 is preferably performed after the ultrasonic bonding step S102.

[0072] Fig. 17 is a diagram showing the vicinity of laser welded portion 74 in Fig. 5. Fig. 17 shows connection portion 62 of connection terminal 52 and metal plate 22. The connection surface at laser welded portion 74 is designated as connection surface 78, and is indicated by a thick line in Fig. 17. As described above, in the example of Fig. 17, connection surface 78 is inclined with respect to the horizontal direction.

[0073] Although the present invention has been described above using the embodiments, the technical scope of the present invention is not limited to the scope described in the above embodiments. It is clear to those skilled in the art that various modifications and improvements can be made to the above embodiments. It is clear from the description of the claims that such modifications and improvements can also be included in the technical scope of the present invention.

[0074] It should be noted that the order of execution of each process, such as operations, procedures, steps, and stages, in the devices, systems, programs, and methods shown in the claims, specifications, and drawings is not specifically stated as "before," "prior to," etc., and may be realized in any order unless the output of a previous process is used in a later process. Even if the operational flow in the claims, specifications, and drawings is explained using "first," "next," etc. for convenience, it does not mean that it is essential to perform the process in this order. [Explanation of symbols]

[0075] 10 base, 20 laminated substrate, 21 insulating plate, 22 metal plate, 30 semiconductor chip, 32 upper main electrode, 34 control electrode, 40 PCB, 50 external connection portion, 52 connection terminal, 55 bonding wire, 62 connection portion, 63 tip, 64 foot, 66 extension, 70 metal wiring board, 72 ultrasonic connection portion, 73 reference surface, 74 laser welded portion, 75 reference surface, 76 connection surface, 78 connection surface, 82 first portion, 84 second portion, 90 housing, 100 semiconductor module, 110 semiconductor assembly

Claims

1. a laminated substrate on which a semiconductor chip is provided; a connection terminal having a connection portion connected to the laminated substrate; Equipped with The connection portion is At least one ultrasonic connection; At least one laser weld, at least a portion of which is provided in a location other than the location of the ultrasonic connection; have Semiconductor module.

2. At least one of the ultrasonic connection parts is provided on the tip side of the connection part relative to at least one of the laser weld parts. The semiconductor module according to claim 1 .

3. At least one of the laser welds is provided closer to the tip of the connection portion than at least one of the ultrasonic connection portions. The semiconductor module according to claim 1 .

4. The connection portion has a plurality of the laser welds, The plurality of laser welds sandwich the ultrasonic connection portion when viewed from above. The semiconductor module according to claim 1 .

5. The connection portion has a plurality of the laser welds, The plurality of laser welds are provided on the opposite side of the tip of the connection portion from the ultrasonic connection portion. The semiconductor module according to claim 2 .

6. The hole of the laser weld becomes deeper as it is provided on the opposite side from the tip side of the connection part. The semiconductor module according to claim 5 .

7. The connection terminal further includes a foot portion extending in a height direction, At least one of the laser welds has a longitudinal direction inclined with respect to a direction connecting the tip of the connection portion and the foot portion. The semiconductor module according to claim 1 .

8. The connection terminal further includes a foot portion extending in a height direction, A longitudinal direction of at least one of the laser welds is approximately parallel to a direction connecting the tip of the connection portion and the foot portion. The semiconductor module according to claim 1 .

9. The connection portion has two of the laser welds, The two laser welds intersect The semiconductor module according to claim 8 .

10. At least a portion of the laser weld overlaps with the ultrasonic connection portion in a top view. The semiconductor module according to claim 1 .

11. Any of the laser welds may be a first portion overlapping the ultrasonic connection portion in a top view; a second portion that does not overlap the ultrasonic connection portion when viewed from above; having The hole in the second portion is deeper than the hole in the first portion. The semiconductor module according to claim 10.

12. The ultrasonic connection portion has an uneven surface at the connection portion. The semiconductor module according to claim 1 .

13. A plurality of the connection terminals are provided, The laser welds provided on the connection portions of the connection terminals are aligned in a straight line. The semiconductor module according to claim 1 .

14. a laminated substrate on which a semiconductor chip is provided; a connection terminal having a connection portion connected to the laminated substrate; A method for manufacturing a semiconductor module comprising: an ultrasonic bonding step of providing an ultrasonic bond to the bonded portion by ultrasonic waves; a laser welding step of providing a laser welded portion at the connection portion by laser welding after the ultrasonic connection step; Equipped with At least one of the laser welds is provided at a location other than where the ultrasonic connection is provided. A method for manufacturing a semiconductor module.

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