Manufacturing method and device for electronic components

Abstract

To provide a manufacturing method for an electronic component and a manufacturing device for the electronic component capable of preventing sagging and wrinkling of a retaining film in a heating environment.SOLUTION: A manufacturing method for an electronic component includes: a fixing step of fixing a location relationship of an exposed part 301 of an electronic component 30 held in a retaining film 10 and / or an exposed part 131 of a retaining surface 13 of the retaining film 10; and a sucking step of sucking the retaining film 10 whose positional relation is fixed, from a non-retaining surface 14 side to a heated sucking surface 521. An electronic component manufacturing device 50 includes: a first chuck table 51 having a sucking surface 511 open downward; a second chuck table 52 having a sucking surface 521 open upward and having a heating mechanism; and a delivery mechanism 54 enabling an object to be delivered by bringing the suction surfaces of the first chuck table 51 and the second chuck table 52 in close proximity to each other in a state in which they face each other.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a method and apparatus for manufacturing electronic components that uses a holding film for holding a plurality of electronic components and that allows the electronic components to be handled while still held by the holding film. [Background technology]

[0002] Electronic components (package components, semiconductor chips, etc.) are manufactured through multiple processes, and in each process, a carrier, socket, etc. is selected from among multiple types according to the process, and the electronic components are held in these carriers, sockets, etc. The use of such carriers, sockets, etc. requires the electronic components to be transferred between processes, which is cumbersome and increases costs. Therefore, a holding film that can be shared between different processes has been proposed as a material for holding electronic components instead of carriers, sockets, etc. (see Patent Document 1). The above-mentioned holding film includes a base layer made of synthetic resin and a holding layer made of adhesive, and can hold a semiconductor wafer that is to be an electronic component by adhering it to the holding layer. The holding film can be fixed by adsorption to a chuck table while holding the semiconductor wafer that is to be an electronic component. This holding film is used in common in a singulation process in which the semiconductor wafer is singulated to obtain semiconductor components, an evaluation process in which the semiconductor components are evaluated, and a pick-up process in which the semiconductor components are separated from the adhesive layer. In the above-mentioned evaluation process, evaluation may be performed in a heated environment, such as checking operation in a heated environment and accelerated evaluation using thermal stress load. If a material flexible enough to be used in the pick-up process is selected as the base layer material of the above-mentioned holding film, it may not be possible to fix it to the chuck table during evaluation in a heated environment. Therefore, a holding film has been proposed that has versatility that allows it to be shared between different processes and can be reliably attached to the chuck table in a heated environment (see Patent Document 2). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] WO2017 / 002610 [Patent Document 2] WO2018 / 139612 Summary of the Invention [Problem to be solved by the invention]

[0004] In the above-mentioned evaluation process, in order to improve manufacturing efficiency, it may be an issue to simultaneously test as many electronic components as possible in a batch. In addition, in the above-mentioned heated environment, it may be an issue to solve the problem of poor suction of the holding film to the chuck table. The present inventors have studied the use of the holding film in a heated environment and found that when the holding film approaches a heated suction surface, it generates slack wrinkles due to thermal convection generated on the suction surface, bending due to the weight of the held electronic components, thermal expansion of the base layer of the holding film, etc. The occurrence of slack wrinkles causes problems such as abnormal suction of the holding film to the chuck table, the holding film stretches due to the slack wrinkles, changing the positional relationship of the electronic components, and deteriorating the efficiency of simultaneous measurement of multiple components, so it is necessary to suppress the occurrence of such slack wrinkles. Therefore, the inventors of the present invention conducted repeated tests in order to satisfy as many required characteristics as possible, and investigated a method for adsorbing a support film to a heated adsorption surface without causing sagging or wrinkles.

[0005] The present invention has been made in consideration of the above problems, and aims to provide a method and apparatus for manufacturing electronic components that can suppress the occurrence of sagging wrinkles in a support film in a heated environment. [Means for solving the problem]

[0006] As a means for solving the above problems, the present invention is as follows. [1] The method for producing an electronic component of the present invention includes a fixing step of fixing a positional relationship between an exposed portion of an electronic component held by a support film and / or an exposed portion of a support surface of the support film; The method further comprises a suction step of suctioning the holding film, the positional relationship of which is fixed, from the non-holding surface side onto a heated suction surface. [2] In the method for producing an electronic component of the present invention, a release step of releasing the fixed positional relationship after the suction step is further included, The method may further include a current application step of applying current from outside to electrodes of the electronic component exposed on the holding surface side after the release step. [3] In the method for manufacturing electronic components of the present invention, the fixing process can be a process of adsorbing the holding film, which is arranged with the holding surface facing upward, to a chuck table, which has an adsorption surface facing downward. [4] In the method for producing an electronic component of the present invention, the fixing step may be a step of attaching a fixing film to the holding surface side of the holding film. [5] In the method for producing an electronic component of the present invention, the support film has a support layer for holding the electronic component and a base layer for supporting the support layer, The base layer has a ratio R between the modulus of elasticity E'(160) at 160°C and the modulus of elasticity E'(25) at 25°C. E (=E'(160) / E'(25)) can be 0.001 or more and 0.6 or less, and E'(25) can be 400 MPa or less. [6] In the method for producing an electronic component of the present invention, the base layer may have a linear expansion coefficient of 100 ppm / K or more. [7] An electronic device manufacturing apparatus according to the present invention includes: a first chuck table having a suction surface that is open downward so that an object can be suctioned from an upper surface side; a second chuck table having an upwardly open suction surface so that the object can be suctioned from the lower surface side, and having a heating mechanism for heating the object fixed thereto; The gist of the present invention is that it is equipped with a transfer mechanism that brings the suction surfaces of the first chuck table and the second chuck table close to each other while facing each other, and that can transfer the object fixed to the first chuck table to the second chuck table. [8] In the electronic component manufacturing apparatus of the present invention, the target object may be a holding film holding an electronic component on an upper surface thereof. Effect of the Invention

[0007] According to the electronic component manufacturing method and electronic component manufacturing apparatus of the present invention, it is possible to suppress the occurrence of sagging wrinkles in the support film in a heated environment. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1A is an explanatory diagram illustrating the immobilization step, and FIG. 1B is an explanatory diagram illustrating the adsorption step in the present invention. [Diagram 2] FIG. 2 is an explanatory diagram illustrating a fixing step according to an embodiment of the present invention. [Diagram 3] 13A to 13C are explanatory diagrams illustrating a fixing step in a modified example of the present invention. [Figure 4] 13A to 13C are explanatory diagrams illustrating a fixing step in a modified example of the present invention. [Diagram 5] 13A to 13C are explanatory diagrams illustrating a fixing step in a modified example of the present invention. [Figure 6] FIG. 2A is a plan view and FIG. 2B is a side view illustrating the fixing of the positional relationship between a protective film and an electronic component in the present invention. [Figure 7] FIG. 2 is an explanatory diagram illustrating an adsorption process according to an embodiment of the present invention. [Figure 8] FIG. 11 is an explanatory diagram for explaining a release process according to the embodiment of the present invention. [Figure 9] FIG. 4 is an explanatory diagram illustrating a current application process according to an embodiment of the present invention. [Figure 10] FIG. 2 is a cross-sectional view illustrating a protective film in the present invention. [Figure 11]FIG. 1 is an explanatory diagram illustrating an electronic component manufacturing apparatus according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] The present invention will be described below with reference to the drawings. The matters shown here are illustrative and are for illustrative purposes of the embodiments of the present invention, and are described for the purpose of providing what is believed to be the most effective and easy-to-understand explanation of the principles and conceptual features of the present invention. In this respect, it is not intended to show structural details of the present invention beyond a certain extent that are necessary for a fundamental understanding of the present invention, and the description in conjunction with the drawings will make it clear to those skilled in the art how some forms of the present invention are actually embodied.

[0010] [1] Manufacturing methods for electronic components The method for producing an electronic component of the present invention includes a fixing step of fixing a positional relationship between an exposed portion 301 of an electronic component 30 held by a holding film 10 and / or an exposed portion 131 of a holding surface 13 of the holding film 10 (see FIG. 1(a) ); The method further includes a suction step of suctioning the holding film 10, the positional relationship of which has been fixed, onto a heated suction surface 521 from the non-holding surface 14 side (see FIG. 1(b)).

[0011] (1) Fixing process The fixing step is a step of fixing the positional relationship between the exposed portion 301 of the electronic component 30 held by the holding film 10 and / or the exposed portion 131 of the holding surface 13 of the holding film 10 (see FIGS. 2 to 5). That is, in the fixing step, the positional relationship of the exposed portion 301 of the electronic component 30 and / or the exposed portion 131 of the holding surface 13 of the holding film 10 is fixed, thereby suppressing the occurrence of slack wrinkles in steps subsequent to the fixing step.

[0012] The fixing step is not particularly limited as long as it can fix the above-mentioned positional relationship. Specific examples of the fixing step include the following. That is, as a method for performing the fixing step, a method using a chuck table 51 (hereinafter also referred to as "first chuck table 51") with the suction surface 511 facing downward can be mentioned. As a method for performing the fixing step, a method in which a fixing film 11 separate from the holding film 10 that holds the electronic component 30 is used may be mentioned.

[0013] In the case of a method using a first chuck table 51, the fixing process can be performed by adsorbing the exposed portion 301 of the electronic component 30 held by the holding film 10 to the first chuck table 51, as shown in FIG. 2. That is, in this fixing step, the positional relationship of the exposed portion 301 of the electronic component 30 is fixed by the first chuck table 51. In this fixing step, a part of the holding film 10, such as its peripheral edge, is adsorbed to the first chuck table 51. Therefore, in this fixing step, the positional relationship is also fixed for the portion of the exposed portion 131 of the holding film 10 that is sucked onto the first chuck table 51, such as the peripheral portion.

[0014] In the case of a method using a fixing film 11, the fixing step can be performed by attaching the fixing film 11 to the exposed portion 131 of the holding surface 13 of the holding film 10 as shown in FIG. In this fixing step, the fixing film 11 can also be attached to the exposed portion 301 of the electronic component 30. That is, in this fixing process, the positional relationship of the exposed portion 131 of the holding surface 13 of the holding film 10, or the positional relationship between the exposed portion 301 of the electronic component 30 and the exposed portion 131 of the holding surface 13 of the holding film 10, is fixed by the fixing film 11.

[0015] In addition, the fixing process using the first chuck table 51 can also be performed by adsorbing the exposed portion 301 of the electronic component 30 and the exposed portion 131 of the holding surface 13 of the holding film 10 to the first chuck table 51, as shown in Figure 4. In this fixing step, a first chuck table 51 having a recess 513 on an adsorption surface 511 is used. This recess 513 is formed with a depth equal to the thickness of the electronic component 30 so that the electronic component 30 can be adsorbed therein. That is, in this fixing process, the first chuck table 51 fixes the positional relationship between the exposed portion 301 of the electronic component 30 accommodated in the recess 513 and the exposed portion 131 of the holding surface 13 of the holding film 10 in contact with the suction surface 511.

[0016] Alternatively, the fixing step using the first chuck table 51 can be performed by adsorbing the exposed portion 131 of the holding surface 13 of the holding film 10 to the first chuck table 51 as shown in FIG. In this fixing step, a first chuck table 51 having a recess 513 on its suction surface 511 is used. The depth of this recess 513 is formed to be greater than the thickness of the electronic component 30, and the electronic component 30 cannot be sucked inside. That is, in this fixing step, the positional relationship of the exposed portion 131 of the holding surface 13 of the holding film 10 in contact with the suction surface 511 is fixed by the first chuck table 51 .

[0017] (1-1) Fixing the position In the fixing step of the present invention, the fixation of the positional relationship of the exposed portion of the electronic component held by the support film and / or the exposed portion of the holding surface of the support film includes at least one of the following forms <1> to <3>. <1> A form in which the positional relationship between the electronic components 30 held on the holding surface 13 of the holding film 10 is fixed. <2> A form in which, of the exposed portions 131 of the holding surface 13 of the holding film 10, the gap exposed portions 131B formed between the electronic components 30 are fixed. <3> A form in which, of the exposed portion 131 of the holding surface 13 of the holding film 10, a peripheral exposed portion 131A of the peripheral portion of the holding film 10 is fixed.

[0018] As a specific example, as shown in FIGS. 6(a) and 6(b), in the fixing step, a plurality of electronic components 30 are arranged and held at equal intervals in the vertical and horizontal directions on the holding surface 13 of the holding film 10. 6(a) and 6(b), the number of electronic components 30 held on the holding surface 13 of the holding film 10 is set to four, but the number is not particularly limited. The number can be, for example, two or more (usually 100,000 or less), or even 10 or more, or even 100 or more.

[0019] The electronic components 30 are arranged on the holding surface 13 of the holding film 10 with the electrodes 31 exposed to the outside so that the electrodes 31 can be electrically connected to the outside. That is, the electronic components 30 are usually arranged such that the electrodes 31 are not supported by the support layer 102 . 6(a) and 6(b), a plurality of electrodes 31 are provided on the upper surface of the electronic component 30. The electronic components 30 are bonded at their lower surfaces to the holding surface 13 of the holding film 10 so that the electrodes 31 are not held by the holding layer 102. In other words, the upper surface and the peripheral surface of the electronic component 30 excluding the lower surface are exposed to the outside, and these constitute the exposed portion 301 .

[0020] Although the electronic components 30 may be arranged so that the electrodes 31 are exposed not only on the top surface but also on the peripheral surface, it is preferable to be able to use electrical conductivity evaluation using needles of a probe card or the like. For this reason, the electronic components 30 are preferably arranged so that the electrodes 31 face upward, that is, so that the electrodes 31 are exposed on the top surface. 6(a) and 6(b), the portion where the electrode 31 is exposed to the outside is only the top surface of the electronic component 30, and in the following description, even when the exposed portion 301 refers only to the top surface of the electronic component 30, it is conveniently referred to as the exposed portion 301.

[0021] The holding film 10 has a portion on the holding surface 13 where the electronic component 30 is not held, exposed to the outside, and this portion serves as an exposed portion 131 . The exposed portion 131 has a peripheral exposed portion 131A formed on the peripheral portion of the holding film 10 and a gap exposed portion 131B formed between the electronic components 30.

[0022] In the adsorption process, in the heating environment caused by the heated adsorption surface 521, the holding film 10 is in a state where it may develop sagging wrinkles due to the effects of thermal convection from the adsorption surface 521, bending due to the weight of the electronic component 30, thermal expansion, etc. In the holding film 10, the portion where the electronic component 30 is held on the holding surface 13 is bonded to the electronic component 30. In this portion, the bonded electronic component 30 functions as a so-called "splint."

[0023] On the other hand, the exposed portion 131 of the holding film 10 does not have the electronic component 30 bonded thereto, and therefore has nothing to function as a so-called "splint." For this reason, when comparing the portion of the holding film 10 that holds the electronic component 30 with the exposed portion 131, slack wrinkles are less likely to occur in the portion that holds the electronic component 30, whereas slack wrinkles tend to occur more easily in the exposed portion 131. In addition, when comparing the peripheral exposed portion 131 of the holding film 10 with the gap exposed portion 131B, the peripheral exposed portion 131A has a larger size (planar area) and is therefore more likely to develop sagging wrinkles.

[0024] In the above-described embodiment (1), the exposed portions 301 of the electronic components 30 are fixed, so that the positional relationship between the electronic components 30 is fixed. In other words, the above-mentioned form <1> is a form in which the positional relationship between electronic components 30 is fixed by adsorbing exposed portions 301 of electronic components 30 to adsorption surface 511, attaching fixing film 11 to exposed portions 301, etc. In other words, if the positional relationship between the electronic components 30 changes, the relative positions of the contact needles of the probe card or the like and the electrodes 31 may shift, which may result in a decrease in efficiency of simultaneous measurement of multiple components during the current application process, etc. Such deviations in relative positions become larger as the number of held electronic components 30 increases. In the form (1), by fixing the positional relationship between the electronic components 30, it is possible to prevent the relative positions of the electrodes 31 of the electronic components 30 and the contact needles of a probe card or the like from shifting.

[0025] In addition, in the above-described embodiment (1), the positional relationship of the holding film 10 is fixed at a plurality of points of the portion holding the electronic component 30 by means of the electronic component 30 . That is, the above-mentioned embodiment <1> is also an embodiment in which the positional relationship between the portions of the support film 10 that support the electronic components 30 is fixed over a plurality of points. In this form (1), the positional relationship is fixed at multiple locations on the retaining film 10, that is, multiple locations on the retaining film 10 with fixed positional relationships are provided, thereby regulating the stretching and sagging between each location, thereby making it possible to suppress the occurrence of sagging wrinkles.

[0026] As described above, the embodiment of <1> can prevent the relative positions of the electrodes 31 and the contact needles of a probe card or the like from being shifted, and can suppress the occurrence of creases due to sagging of the support film 10. For this reason, the configuration of (1) is particularly effective in preventing problems in processes subsequent to the adsorption process. The embodiment of <1> corresponds to the above-mentioned fixing step, specifically, the methods shown in Figs. 2 to 4.

[0027] In the above-mentioned embodiment <2>, the positional relationship of the gap exposed portion 131B among the exposed portion 131 of the support film 10 is fixed. In other words, the above-mentioned form <2> is a form in which the shape of the gap exposed portion 131B is fixed by adsorbing the gap exposed portion 131B to the adsorption surface 511 with the exposed portion 131 of the holding film 10, or by attaching the fixing film 11 to the gap exposed portion 131B, thereby making the adsorption surface 511 and the fixing film 11 function as so-called "splints." In other words, if sagging wrinkles occur in the gap exposed portion 131B, the distance between the electronic components 30 will change, and the positional relationship between the electronic components 30 will also change, which may result in a decrease in efficiency in measuring multiple electronic components simultaneously during the current application process described below. In the embodiment of the invention, the gap exposure portion 131B is fixed in shape, so that the distance between the electronic components 30, that is, the width W 131B Therefore, the embodiment of (2) is particularly effective in preventing defects in the process after the adsorption process. The embodiment of <2> corresponds to the above-mentioned fixing step, specifically, to the methods shown in Figures 3, 4, and 5.

[0028] In the above-mentioned embodiment <3>, the positional relationship of the peripheral exposed portion 131A among the exposed portion 131 of the support film 10 is fixed. In other words, the above-mentioned form <3> is a form in which the shape of the peripheral exposed portion 131A is fixed by adsorbing the peripheral exposed portion 131A to the adsorption surface 511 using the exposed portion 131 of the holding film 10, or by attaching the fixing film 11 to the peripheral exposed portion 131A, thereby making the adsorption surface 511 and the fixing film 11 function as a so-called "splint." In other words, if sagging wrinkles occur in the exposed peripheral portion 131A, problems such as poor suction of the holding film 10 to the second chuck table 52 during the suction process and reduced efficiency in simultaneous measurement of multiple electronic components 30 due to changes in the positional relationship between the electronic components 30 during the energization process may occur. The form of <3> can prevent the generation of slack wrinkles in the exposed peripheral portion 131 A by fixing the shape of the exposed peripheral portion 131 A. Therefore, the form of <3> is particularly effective in preventing defects in the suction process and in the process after the suction process. Incidentally, the embodiment of <3> corresponds to the above-mentioned fixing step, specifically, the methods shown in Figs. 2 to 5.

[0029] As described above, in this method, the positional relationship of the exposed portion 301 of the electronic component 30 held by the holding film 10 and / or the exposed portion 131 of the holding surface 13 of the holding film 10 is fixed in the fixing process of the holding film 10 holding the electronic component 30. Moreover, the support film 10 is used in common in the fixing step, the adsorption step, and further in steps subsequent to the adsorption step, such as the energization step. The above-mentioned positional relationship fixed in the fixing step is maintained even in the heating environment in the adsorption step, and the occurrence of sagging wrinkles in the support film 10 can be suppressed. Therefore, in each process in which the holding film 10 is shared, the occurrence of sagging wrinkles can be suppressed, and problems such as poor adhesion of the holding film 10 to the chuck table and reduced efficiency in measuring multiple electronic components 30 simultaneously can be prevented.

[0030] (2) Adsorption process The adsorption process is a process in which the holding film 10, in which the positional relationship of the exposed portion 301 of the electronic component 30 and / or the exposed portion 131 of the holding surface 13 has been fixed in the fixing process, is adsorbed onto the heated adsorption surface 521 from the non-holding surface 14 side (see Figure 7). That is, in the adsorption step, the support film 10 can be adsorbed onto the heated adsorption surface 521 while maintaining the above-mentioned fixed positional relationship. Furthermore, after the holding film 10 is adsorbed to the adsorption surface 521 in this adsorption process, the positional relationship is fixed simply by being adsorbed to the adsorption surface 521, without relying on the positional relationship being fixed in the fixing process using the first chuck table 51 or the like.

[0031] In the adsorption step, it is only necessary that the support film 10 can be adsorbed onto the heated adsorption surface 521, and there are no particular limitations on the specific device and the like. In a device that performs the suction process, a chuck table 52 (hereinafter, also referred to as a "second chuck table 52") is usually used. The second chuck table 52 has an upwardly open suction surface 521. Furthermore, the second chuck table 52 has a heating mechanism (not shown). The suction surface 521 of the second chuck table 52 is heated by this heating mechanism.

[0032] The suction step may be performed by any method as long as the holding film 10 can be suctioned onto the suction surface 521 of the second chuck table 52, and there are no particular limitations on the specific method. As a specific example, the adsorption step can be achieved by carrying out the following steps. First step: the first chuck table 51 holding the holding film 10 by suction is moved to a position above the second chuck table 52. Second step: After the first step, the first chuck table 51 and the second chuck table 52 are brought close to each other. Third step: After the second step, the non-held surface 14 of the holding film 10 is brought into contact with the second chuck table 52 .

[0033] The suction process is performed in a heated environment by the heated suction surface 521 of the second chuck table 52. The temperature range in the heating environment is not particularly limited, but can usually be set to a temperature range according to the energization step which is a step subsequent to the suction step. That is, from the viewpoint of manufacturing efficiency and cost reduction, after the holding film 10 and the electronic component 30 are adsorbed to the second chuck table 52 in the suction step, the energization step can be executed as a step subsequent to the suction step. Specifically, the lower limit of the temperature range can be, for example, preferably 50° C. or more, further 100° C. or more, and further 150° C. or more. The upper limit of the temperature range is usually 250° C. or less.

[0034] In addition, in order to reduce the thermal effects on the holding film 10 in the heated environment before being adsorbed to the adsorption surface 521, it is preferable that the adsorption process maintains the holding film 10 adsorbed to the first chuck table 51 in a room temperature range, for example, 15 to 30°C, further 15 to 25°C, and further 20 to 25°C. The holding film 10 can be kept in the room temperature range, for example, by providing the first chuck table 51 with a cooling mechanism, or by providing an air blowing mechanism for air-cooling the holding film 10, or the like.

[0035] (3) Other processes This method may include steps other than the above-mentioned immobilization step and adsorption step. This method can include, for example, a release step and a current application step as steps subsequent to the adsorption step. In addition to the release process and the current-passing process, this method can also include an arrangement process, as a pre-process before the fixing process, in which multiple electronic components 30 are arranged on the holding surface 13 of the holding film 10 with the electrodes 31 exposed, and a pick-up process, as a post-process after the current-passing process, in which the electronic components 30 are separated from the holding surface 13 of the holding film 10. The release step and the current application step will be described below.

[0036] (3-1) Release process The releasing step is a step of releasing the above-mentioned positional relationship fixed in the fixing step (see FIG. 8). The release step can be performed as a step before the adsorption step, but is preferably performed as a step after the adsorption step. That is, the holding film 10 is fixed in the above-mentioned positional relationship after being adsorbed to the adsorption surface 521 of the second chuck table 52 in the adsorption step. Therefore, even if the fixation of the above-mentioned positional relationship by the first chuck table 51 is released in a step subsequent to the adsorption step, the positional relationship can be maintained in a fixed state.

[0037] In addition, in order to perform the release process as a preliminary process to the adsorption process, this can be achieved, for example, by performing the release process without bringing the non-holding surface 14 of the holding film 10 into contact with the second chuck table 52 while the first chuck table 51 is positioned above the second chuck table 52, dropping the holding film 10 onto the second chuck table 52, and performing the adsorption process.

[0038] The releasing step is not particularly limited as long as it can release the above-mentioned positional relationship fixed by the fixing step. As a specific example, when the first chuck table 51 is used to fix the above-mentioned positional relationship in the fixing step, the releasing step can be achieved by releasing the suction of the holding film 10 by the first chuck table 51. Furthermore, in the case where the fixing film 11 is used to fix the above-mentioned positional relationship in the fixing step, the releasing step can be achieved by peeling off the fixing film 11 from the holding film 10 and the electronic component 30.

[0039] (3-2)Electrification process The current application step is a step of applying current from the outside to the electrodes 31 of the electronic components 30 exposed on the holding surface 13 side (that is, the upper side) of the holding film 10. That is, the current passing step is a step of conducting a current passing evaluation of the electrical characteristics of the electronic component 30 by externally passing a current through the electrodes 31 of the electronic component 30 (see FIG. 9). The electrical conductivity evaluation is performed for each electronic component 30 held on the holding film 10, using the electrodes 31 exposed to the outside. The number of electrodes 31 exposed to the outside for one electronic component 30 may be one, but is usually multiple. The electrical conductivity evaluation can be performed using only some of the multiple exposed electrodes 31, or can be performed using all of them.

[0040] The contents and purposes of the energization evaluation are not limited, and examples of the contents and purposes include operation checks and accelerated durability tests. More specifically, these tests include DC tests that can evaluate the presence or absence of breaks or short circuits, and evaluate the input voltage, output voltage, and output current, etc., AC tests that can evaluate the output waveform, and functional tests that evaluate the possibility and speed of write and read operations, retention time, and mutual interference, etc. That is, examples of such tests include a final test, a structured test, a scan test, an adaptive test, etc. for packaged components, and a wafer test, a burn-in test, etc. for semiconductor components. These tests may be used alone or in combination of two or more.

[0041] Furthermore, in electrical conductivity evaluation, a probe (probe needle) or a probe card (substrate with probe needles) equipped with a plurality of probes is usually used. Specifically, electrical conductivity evaluation using a probe or a probe card is performed by arranging multiple electronic components 30 on the holding surface 13 of the holding film 10, contacting the probe with the electrode 31, and passing electrical current from the probe to the electrode 31. In this electrical conduction evaluation, the electronic components 30 to be evaluated may be some of the electronic components 30 arranged on the holding surface 13, or may be all of the electronic components 30. Whether to perform the electrical evaluation of some or all of the electronic components 30 can be selected according to need, but from the standpoint of manufacturing efficiency and cost reduction, it is preferable to perform the electrical evaluation of as many electronic components 30 as possible at the same time. That is, for example, with this method, the number of electronic components that can be simultaneously subjected to electrical evaluation can be made to be 2 or more (usually 100,000 or less), furthermore, 10 or more, and furthermore, 100 or more.

[0042] As shown in FIG. 9, in the electrical conductivity evaluation, a probe card 53 having a plurality of probes 531 formed thereon is brought into contact with corresponding locations of the electronic component 30 to establish an electrical connection, and, for example, a determination can be made as to whether a signal is correct or not between the probes 531 and a circuit formed on the electronic component 30 (probe test). The probe card 53 is not particularly limited, and can be designed according to the number of electronic components 30 to be simultaneously evaluated and the arrangement of the electronic components 30 on the holding surface 13 of the holding film 10. In particular, the present invention makes it possible to use a large-sized probe card equipped with a large number of probes capable of simultaneously connecting to a plurality of electrodes of a plurality of electronic components.

[0043] In the energization step, the electronic component 30 can be evaluated for energization in a heated environment by the heated suction surface 521 of the second chuck table 52. The temperature range in the heating environment in the current application step varies depending on the application of the electronic component 30, and is not particularly limited. Specifically, the lower limit of the temperature range can be, for example, preferably 50° C. or more, further 100° C. or more, and further 150° C. or more. The upper limit of the temperature range is usually 250° C. or less.

[0044] (4) Holding film The holding film 10 of the present invention is used to hold as many electronic components as possible together and to be shared among different processes. As shown in FIG. 10, the support film 10 has a support layer 102 for supporting the electronic component 30 and a base layer 101 for supporting the support layer 102 . The upper surface of this holding film 10 facing the holding layer 102 is used as a holding surface 13 for holding the electronic component 30, and the lower surface facing the base layer 101 is used as a non-holding surface 14 that is adsorbed to the second chuck table 52. The total thickness of the support film 10 is not particularly limited, but can be, for example, 50 μm or more and 300 μm or less, preferably 55 μm or more and 250 μm or less, and more preferably 100 μm or more and 200 μm or less.

[0045] The support film 10 is usually used in a state in which it is attached and stretched on a flat frame 12 (see Figs. 1 to 5 and Figs. 7 to 9). Specific examples of this frame 12 include a ring frame, a grip ring, and the like. The frame 12 is used for the purpose of making the support film 10 easier to handle during transportation and the like. That is, the frame 12 does not have the function of fixing the positional relationship between the exposed portion 301 of the electronic component 30 held by the holding film 10 and / or the exposed portion 131 of the holding surface 13 of the holding film 10 .

[0046] The layers and physical properties of the support film 10 will now be described. (4-1) Retention layer The support layer 102 is a layer for supporting a plurality of electronic components 30 in an aligned state, and is made of an adhesive. The thickness of the support layer 102 is not particularly limited, but may be, for example, 5 μm to 50 μm, and is preferably 5 μm to 40 μm, and more preferably 5 μm to 30 μm. When the thickness of the retaining layer 102 is within the above range, the retaining film 10 can ensure good retaining performance for the electronic component 30 .

[0047] From the viewpoint of suitably picking up the electronic component 30, the retaining layer 102 preferably has a property that the retaining force is reduced by the addition of heat or irradiation with energy rays. The adhesive used in the retaining layer 102 is not particularly limited, but examples of adhesives having the above-mentioned characteristics include foaming adhesives whose adhesive strength is reduced or lost by the addition of heat, and energy-curing adhesives whose adhesive strength is reduced or lost by irradiation with energy rays.

[0048] Both the foaming type adhesive and the energy curing type adhesive contain at least a main adhesive agent. Examples of the main adhesive agent include acrylic adhesives, silicone adhesives, rubber adhesives, etc. These may be used alone or in combination of two or more. Among these, acrylic adhesives are preferred.

[0049] Examples of the acrylic adhesive include a homopolymer of an acrylic ester compound, a copolymer of an acrylic ester compound and a comonomer, etc. These may be used alone or in combination of two or more kinds. Examples of the acrylic acid ester compound include methyl acrylate, ethyl acrylate, butyl acrylate, and 2-ethylhexyl acrylate. These may be used alone or in combination of two or more. Further, examples of the comonomer include vinyl acetate, acrylonitrile, acrylamide, styrene, methyl (meth)acrylate, (meth)acrylic acid, hydroxyethyl methacrylate, dimethylaminoethyl methacrylate, glycidyl methacrylate, and maleic anhydride.

[0050] The adhesive may contain a crosslinking agent in addition to the above-mentioned adhesive base agent. Examples of the crosslinking agent include epoxy crosslinking agents (pentaerythritol polyglycidyl ether, etc.) and isocyanate crosslinking agents (diphenylmethane diisocyanate, tolylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, polyisocyanate, etc.). These crosslinking agents may be used alone or in combination of two or more. When the adhesive contains a crosslinking agent, the content of the crosslinking agent is preferably 10 parts by mass or less, with the total amount of the adhesive being 100 parts by mass. The adhesive strength of the adhesive can be adjusted by the content of the crosslinking agent. Specifically, the method described in JP 2004-115591 A can be used.

[0051] The foaming adhesive foams by the addition of heat, thereby reducing the adhesive area between the holding surface 13 and the electronic component 30, and thereby reducing the adhesive strength. The foaming type adhesive contains a foaming agent in addition to the above-mentioned adhesive base. The foaming agent may be added to the adhesive base in a state encapsulated in a microcapsule, may be added to the adhesive base in its original state, or may be added in a state combined with the adhesive base. As for the microcapsules, examples of the material include vinylidene chloride-acrylonitrile copolymer, polyvinyl alcohol, polyvinyl butyral, polymethyl methacrylate, polyacrylonitrile, polyvinylidene chloride, polysulfone, and the like.

[0052] The foaming agent may be an inorganic foaming agent or an organic foaming agent. Examples of inorganic foaming agents include ammonium carbonate, ammonium hydrogen carbonate, sodium hydrogen carbonate, ammonium nitrite, sodium borohydride, and various azides. Examples of organic blowing agents include fluorinated alkane compounds such as trichloromonofluoromethane and dichloromonofluoromethane, azo compounds such as azobisisobutyronitrile, azodicarbonamide and barium azodicarboxylate, hydrazine compounds such as paratoluenesulfonylhydrazide, diphenylsulfone-3,3'-disulfonylhydrazide, 4,4'-oxybis(benzenesulfonylhydrazide) and allylbis(sulfonylhydrazide), semicarbazide compounds such as p-toluylenesulfonylsemicarbazide and 4,4'-oxybis(benzenesulfonylsemicarbazide), triazole compounds such as 5-morpholyl-1,2,3,4-thiatriazole, and N-nitroso compounds such as N,N'-dinitrosopentamethylenetetramine and N,N'-dimethyl-N,N'-dinitrosoterephthalamide.

[0053] The energy curable pressure-sensitive adhesive can be cured and its adhesive strength reduced by irradiating the pressure-sensitive adhesive with energy rays. Examples of the energy beam include ultraviolet rays, electron beams, infrared rays, etc. These energy beams may be used alone or in combination of two or more. Specifically, examples of the energy beam include ultraviolet-curable adhesives that are cured by ultraviolet rays.

[0054] In addition to the above-mentioned adhesive base, this energy curable adhesive can contain a compound having a carbon-carbon double bond in the molecule (hereinafter simply referred to as a "curable compound") and a photopolymerization initiator capable of initiating polymerization of the curable compound by reacting with energy rays. The curable compound is preferably a monomer, oligomer and / or polymer having a carbon-carbon double bond in the molecule and capable of being cured by radical polymerization. Specifically, examples of the curable compound include trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, tetraethylene glycol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, etc. These may be used alone or in combination of two or more. When the pressure-sensitive adhesive contains a curable compound, the content of the curable compound is preferably 0.1 to 20 parts by weight per 100 parts by weight of the pressure-sensitive adhesive.

[0055] The carbon-carbon double bond in the molecule may be included by the above-mentioned adhesive base agent having it in the molecule. That is, for example, the adhesive base agent can be an energy curable polymer having a carbon-carbon double bond in a side chain. In this way, when the adhesive base agent has a curable structure in the molecule, the above-mentioned curable compound may or may not be blended.

[0056] As the photopolymerization initiator, a compound capable of generating radicals upon irradiation with energy rays is preferable. Specific examples include acetophenone-based photopolymerization initiators {methoxyacetophenone, etc.}, α-ketol compounds {4-(2-hydroxyethoxy)phenyl(2-hydroxy-2-propyl)ketone, α-hydroxycyclohexylphenyl ketone, etc.}, ketal compounds {benzyl dimethyl ketal, etc.}, benzoin-based photopolymerization initiators {benzoin, benzoin alkyl ethers (benzoin methyl ether, benzoin isopropyl ether, benzoin isobutyl ether), etc.}, benzophenone-based photopolymerization initiators {benzophenone, benzoylbenzoic acid, etc.}, aromatic ketals {benzyl dimethyl ketal, etc.}, etc. These may be used alone or in combination of two or more. When the pressure-sensitive adhesive contains a photopolymerization initiator, the content of the photopolymerization initiator is preferably 5 to 15 parts by mass relative to 100 parts by mass of the pressure-sensitive adhesive.

[0057] (4-2) Base layer The base layer 101 is a layer provided for the purpose of improving the handling properties and mechanical properties of the support film 10 . The thickness of the base layer 101 is not particularly limited, but may be, for example, 50 μm or more and 200 μm or less, preferably 65 μm or more and 175 μm or less, and more preferably 80 μm or more and 150 μm or less.

[0058] The material used for the base layer 101 is not particularly limited, but it is preferable that the material has a mechanical strength sufficient to withstand the heating environment in the adsorption process, and in particular, that the thermal expansion and elongation in the heated state can be suppressed. Usually, the material for the base layer 101 is a resin having elastomeric properties.

[0059] Examples of the resin having elastomeric properties include thermoplastic elastomers, silicones, etc. These may be used alone or in combination of two or more kinds. Among these, those having thermoplasticity are preferred, and therefore thermoplastic elastomers are preferred. The thermoplastic elastomer may be made of a block copolymer having a hard segment and a soft segment, may be made of a polymer alloy of a hard polymer and a soft polymer, or may have properties of both of these.

[0060] Specifically, examples of the thermoplastic elastomer include polyester-based thermoplastic elastomers, polyamide-based thermoplastic elastomers, styrene-based thermoplastic elastomers, olefin-based thermoplastic elastomers, vinyl chloride-based thermoplastic elastomers, polyimide-based thermoplastic elastomers (polyimide ester-based, polyimide urethane-based, etc.), etc. These may be used alone or in combination of two or more kinds. Of these, polyester-based thermoplastic elastomers, polyamide-based thermoplastic elastomers, and polyimide-based thermoplastic elastomers are preferred, and polyester-based thermoplastic elastomers and / or polyamide-based thermoplastic elastomers are particularly preferred.

[0061] The polyester-based thermoplastic elastomer may have any structure except that the polyester component is used as the hard segment. As the soft segment, polyester, polyether, polyether ester, etc. can be used. These may be used alone or in combination of two or more. That is, for example, the polyester component constituting the hard segment can include a constituent unit derived from a monomer such as dimethyl terephthalate, while the component constituting the soft segment can include a constituent unit derived from a monomer such as 1,4-butanediol and poly(oxytetramethylene) glycol. More specifically, PBT-PE-PBT type polyester thermoplastic elastomers and the like can be mentioned.

[0062] The polyamide-based thermoplastic elastomer may have any structure except that the hard segment is a polyamide component. As the soft segment, polyester, polyether, polyether ester, etc. can be used. These may be used alone or in combination of two or more. That is, for example, examples of polyamide components constituting the hard segment include polyamide 6, polyamide 11, and polyamide 12. These may be used alone or in combination of two or more. For these polyamide components, various lactams and the like can be used as monomers.

[0063] On the other hand, the components constituting the soft segment may contain constituent units derived from monomers such as dicarboxylic acids and polyether polyols. Among these, polyether diols are preferred as polyether polyols, and examples thereof include poly(tetramethylene) glycol and poly(oxypropylene) glycol. These may be used alone or in combination of two or more. More specifically, examples of the thermoplastic elastomer include polyetheramide type polyamide-based thermoplastic elastomers, polyesteramide type polyamide-based thermoplastic elastomers, and polyetheresteramide type polyamide-based thermoplastic elastomers.

[0064] The base layer 101 may also contain a resin other than the elastomeric resin. Examples of such a resin include polyester, polyamide, polycarbonate, and acrylic resin. These may be used alone or in combination of two or more. Of these, polyester and / or polyamide are preferred. Specific examples include polyesters such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, and polybutylene naphthalate; and polyamides such as nylon 6 and nylon 12.

[0065] Furthermore, the resin used for the base layer 101 may contain additives such as plasticizers and softeners (mineral oil, etc.), fillers (carbonates, sulfates, titanates, silicates, oxides (titanium oxide, magnesium oxide), silica, talc, mica, clay, fibrous fillers, etc.), antioxidants, light stabilizers, antistatic agents, lubricants, colorants, etc. These additives may be used alone or in combination of two or more.

[0066] The film used as the material for the base layer 101 may be either unstretched or stretched, such as a uniaxially stretched film or a biaxially stretched film, regardless of whether it is stretched or not. The above-mentioned film may be either a single-layer film or a multi-layer film having a plurality of layers. It is preferable to use a surface-treated film for the base layer 101 from the viewpoint of improving adhesion to the support layer 102. Specific examples of the surface treatment include corona treatment, plasma treatment, undercoat treatment, and primer coat treatment.

[0067] (4-3) Other layers The support film 10 may consist of only the base layer 101 and the support layer 102, but may also have other layers. Examples of the other layers include an interface strength improving layer that improves the interface strength with the adhesive, and a migration prevention layer that suppresses migration of low molecular weight components from the base layer 101 to the support layer 102. These may be used alone or in combination of two or more.

[0068] (4-4) Physical properties The adhesive strength of the retaining film 10 having the retaining layer 102 is not particularly limited. The adhesive strength is preferably 0.1 N / 25 mm or more and 10 N / 25 mm or less, as measured by a 180-degree peel strength test after the retaining film 10 is attached to the surface of a silicon mirror wafer and left for 60 minutes. When the adhesive strength is within the above range, the retaining film 10 can ensure good adhesion to the electronic component 30. The adhesive strength is more preferably 0.2 N / 25 mm or more and 9 N / 25 mm or less, and even more preferably 0.3 N / 25 mm or more and 8 N / 25 mm or less. The measurement method for the 180-degree peel strength test complies with JIS Z0237:2009, except that the object to which the support film 10 is attached is a silicon mirror wafer and the peel speed is 300 mm / min.

[0069] The support film 10 having the base layer 101 has an elastic modulus of E' at 160°C. 101 (160), and the elastic modulus at 25°C is E' 101 (25), the ratio R E101 (=E' 101 (160) / E' 101 (25)) is preferably a relatively large value. Specifically, the ratio R E101 (=E' 101 (160) / E' 101 (25)) is preferably 0.001 or more and 0.6 or less, and 0.02≦R E101 ≦0.45 is more preferable, and 0.05≦R E101 It is more preferable that the ratio is ≦0.3.

[0070] The elastic modulus mentioned above indicates the tensile elastic modulus (unit: MPa). In addition, the ratio R E101 is the elastic modulus E' of the support film 10 101 That is, the value obtained from the support film 10 having not only the base layer 101 but also other layers (e.g., the support layer 102, etc.). However, it should be noted that the layers other than the base layer 101 have a ratio R E101 The effect on is generally very small, so this ratio R E101 is the elastic modulus E' of the base layer 101 alone 101 It is believed that the value obtained will be substantially equivalent to the value obtained from Among the materials used for the base layer 101 described above, the above ratio R E101 Examples of the thermoplastic elastomers that satisfy the above range include PBT-PE-PBT type polyester thermoplastic elastomers, which are polyester thermoplastic elastomers, polyetheramide type polyamide thermoplastic elastomers, polyesteramide type polyamide thermoplastic elastomers, and polyetheresteramide type polyamide thermoplastic elastomers, which are polyamide thermoplastic elastomers. Among these, PBT-PE-PBT type polyester thermoplastic elastomers (ratio R E101 ≒0.17) is particularly preferred.

[0071] 0.001≦R E101 E' in the range of ≦0.6 101 (25) is 3500MPa or less (E' 101 (25)≦3500 MPa). E' 101 The lower limit of (25) is not limited, but usually, 35MPa≦E' 101 (25). E' 101 (25) is further defined as 40MPa≦E' 101 (25) ≦1000 MPa is preferable, and 45 MPa ≦ E' 101 (25) ≦ 500MPa is more preferable, and 45MPa ≦ E' 101 (25) ≦300 MPa is more preferable. E' 101 The value of (25) may be different in the MD and TD directions of the base layer 101, but it is preferable that it is within the above range in both directions.

[0072] E' 101 (160) is not particularly limited, but 0.1MPa≦E' 101 (160)≦600MPa is preferable, and 0.15MPa≦E' 101 (160)≦300MPa is more preferable, and 0.2MPa≦E' 101 (160)≦100 MPa is more preferable, and 1 MPa≦E′ 101 It is particularly preferable that (160)≦50 MPa. E' 101 The value of (160) may be different in the MD and TD directions of the base layer 101, but is preferably within the above range in both directions.

[0073] The above-mentioned elastic modulus E' is measured by a dynamic mechanical analysis (DMA). Specifically, the sample size is 10 mm in width, the length between chucks is 20 mm, and the tensile modulus is measured at a frequency of 1 Hz and a heating rate of 5°C / min from -50°C to 200°C, and the data for each temperature is read from the data obtained. That is, from the measurement data of the tensile modulus, the value read at 25°C is taken as the modulus of elasticity E'(25), and the value read at 160°C is taken as the modulus of elasticity E'(160).

[0074] The linear thermal expansion coefficient (α 10 ) is not limited, but is preferably 300 ppm / K or less (α 10 The linear thermal expansion coefficient is preferably 280 ppm / K or less (α 10 ≦280ppm / K) is preferable, and 250ppm / K or less (α 10 The linear thermal expansion coefficient of the support film 10 is usually 100 ppm / K or more (100 ppm / K≦α 10 ) Examples of materials for the base layer 101 used in the support film 10 having such a linear thermal expansion coefficient include the above-mentioned thermoplastic elastomers. The linear thermal expansion coefficient is measured in accordance with JIS K7197 and is the thermal expansion coefficient at temperatures between 25°C and 150°C.

[0075] (5) Fixing film The fixing film 11 used in the present invention is used to fix the positional relationship of the exposed portion 301 of the electronic component 30 held by the holding film 10 and / or the exposed portion 131 of the holding surface 13 of the holding film 10 (see Figure 3). The fixing film 11 may have a base layer. The total thickness of the fixing film 11 is not particularly limited, but can be, for example, 10 μm or more and 110 μm or less, preferably 15 μm or more and 100 μm or less, and more preferably 20 μm or more and 90 μm or less.

[0076] Each layer and the physical properties of the fixing film 11 will be described below. (5-1) Base layer The base layer is a layer provided for the purpose of improving the handling properties and mechanical properties of the fixing film 11 . The thickness of the base layer is not particularly limited, but can be, for example, from 10 μm to 100 μm, preferably from 15 μm to 90 μm, and more preferably from 20 μm to 80 μm.

[0077] The material of the base layer used for the fixing film 11 is not particularly limited, but it is preferable that the material has mechanical strength sufficient to withstand a heated environment, and in particular, that the material is capable of suppressing thermal expansion and elongation when heated.

[0078] Generally, a resin film can be used as the material for the base layer. The resin may be one or more selected from thermoplastic resins, specifically polyester resins such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polybutylene terephthalate (PBT); polyimide resins such as semi-aromatic polyimide and aromatic polyimide; and polyamide resins such as nylon-6, nylon-66, and polymetaxylene adipamide.

[0079] The film used as the material for the base layer may be either unstretched or stretched, such as a uniaxially stretched film or a biaxially stretched film, regardless of whether it is stretched or not. The film used as the material for the fixed film 11 may be either a single-layer film having only a base layer, or a multi-layer film having a plurality of layers including a base layer.

[0080] (5-2) Other layers The fixing film 11 may consist of only a base layer, but may also have other layers. The fixing film 11 may have, as another layer, for example, a release layer on the contact surface that comes into contact with the holding film 10 . The release layer is not particularly limited, but is usually formed from a release agent, such as silicone, polytetrafluoroethylene, or ethylene-α-olefin random copolymer. In other words, by having a release layer, the fixing film 11 can improve adhesion to the retaining layer 102 when it is bonded to the retaining film 10 in the fixing process, and can improve the ease of peeling from the retaining layer 102 when it is peeled off from the retaining film 10 in the release process.

[0081] The fixing film 11 may or may not have a layer formed of an adhesive (hereinafter also referred to as an "adhesive layer"), such as the holding layer 102 of the holding film 10. That is, the fixing film 11 may have either an adhesive layer or no adhesive layer. When the fixing film 11 has the above-mentioned release layer, it is preferable that the fixing film 11 does not have an adhesive layer from the viewpoint of easy peeling from the holding layer 102 of the holding film 10 in the releasing step.

[0082] In addition, when the fixed film 11 has a base layer and a release layer, it may have other layers, such as an interfacial strength improving layer that improves the interfacial strength with the release layer, and a migration prevention layer that suppresses the migration of low molecular weight components from the base layer to the release layer. The fixing film 11 may have only one type of the other layers described above, or may have two or more types.

[0083] (5-3) Physical Properties The linear thermal expansion coefficient (α 11 ) is not particularly limited, but is smaller than the linear thermal expansion coefficient of the support film 10 (α 11 <α 10 ) is preferred. Specifically, the linear thermal expansion coefficient of the fixing film 11 is 100 ppm / K or less (α 11 The linear thermal expansion coefficient is preferably 90 ppm / K or less (α 11 ≦90ppm / K) is preferable, and 80ppm / K or less (α 11 The linear thermal expansion coefficient of the fixing film 11 is usually 20 ppm / K or more (20 ppm / K≦α 11 ) As a material for the base layer used for the fixing film 11 having such a linear thermal expansion coefficient, the above-mentioned thermoplastic resin can be mentioned.

[0084] When the linear thermal expansion coefficient of the fixing film 11 is smaller than the linear thermal expansion coefficient of the supporting film 10 (α 11 <α 10 ) can suppress deformation of the fixing film 11, such as thermal expansion or expansion, even more than the supporting film 10, particularly in a heated environment. Therefore, in the above-mentioned fixing step and adsorption step, the fixing film 11 can suitably suppress changes in shape of the support film 10 due to thermal expansion, elongation, and the like. The linear thermal expansion coefficient is measured in accordance with JIS K7197 and is the thermal expansion coefficient at temperatures between 25°C and 150°C.

[0085] (6) Electronic Components The electronic component 30 used in the present invention includes the following items (A) and (B). : Semiconductor chip (silicon die). Note that semiconductor chips (silicon die) are obtained by dicing a semiconductor wafer. : Packaged parts. Note that packaged parts are formed by dividing a package array in which multiple semiconductor chips are sealed in an array, or by forming the packaged parts individually without going through the package array.

[0086] Regarding the above item (B), the sealing material used to seal the package components is not limited, and organic materials (resins) and inorganic materials (ceramics, crystallized glass, glass, etc.) can be used. Furthermore, with regard to the above-mentioned (B), package arrays include package arrays that do not perform rewiring after sealing, package arrays using the fan-out method (eWLB method) in which rewiring is performed after sealing, and package arrays using the wafer-level chip size package (WLCSP) method.

[0087] Moreover, the electronic component 30 usually has an electrode 31 that can be electrically connected to the outside. The electronic component 30 may have only one electrode 31, or may have a plurality of electrodes 31. The form of the electrode capable of being electrically connected to the outside is not limited, and in the case of semiconductor components, for example, it includes a pad electrode, a bonding electrode, an exposed surface of a through electrode, and the like. Furthermore, package components include pad-type electrodes, pin-type electrodes, ball-type electrodes, lead frame-type electrodes, and the like.

[0088] That is, package components include PGA (Pin Grid Array) type, CPGA (Ceramic Pin Grid Array) type, PPGA (Plastic Pin Grid Array) type, SPGA (Staggered Pin Grid Array) type, BGA (Ball Grid Array) type, LGA (Land Grid Array) type, QFP (Quad Flat Package) type, PQFP (Plastic Quad Flat Package) type, QFN (Quad Flat Non-leaded) type, QFJ (Quad Flat J-leaded) type, PQFJ (Plastic Quad Flat J-leaded), TCP (Tape Carrier Package) type, CSP (Chip Size Package) type, etc.

[0089] Incidentally, the electronic component usually remains structurally unchanged after the fixing step and the adsorption step from before the steps. In other words, the electronic component that is the subject of the present invention remains an electronic component even after undergoing the fixing step and the suction step. However, in the present invention, when the electronic component undergoes another process after the suction process in which another configuration is added to the electronic component, the component that has undergone this other process is also conveniently referred to as an electronic component.

[0090] [2] Electronic component manufacturing equipment An electronic component manufacturing apparatus 50 according to an embodiment of the present invention includes a first chuck table 51, a second chuck table 52, and a delivery mechanism 54 (see FIG. 11). The first chuck table 51 has a suction surface 511 that is open downward so that an object can be sucked from the upper surface side. The second chuck table 52 has an adsorption surface 521 that is open upward so that an object can be adsorbed from the lower surface side, and also has a heating mechanism that heats the object fixed to the second chuck table 52. The transfer mechanism brings the suction surfaces of the first chuck table 51 and the second chuck table 52 close to each other with them facing each other, and can transfer the object fixed to the first chuck table 51 to the second chuck table 52.

[0091] The electronic component manufacturing apparatus 50 is used to carry out each step in the method for manufacturing the electronic component 30 described above. Therefore, the object is usually a holding film 10 holding an electronic component 30 on its upper surface (shown by a two-dot chain line in FIG. 11).

[0092] (1) First chuck table As described above, the first chuck table 51 has an adsorption surface 511 that is open downward so that the holding film 10 can be adsorbed from the upper surface (holding surface 13) side. That is, the first chuck table 51 sucks the holding film 10 holding the electronic components 30 and fixes it to the suction surface 511 . The first chuck table 51 is not particularly limited in terms of its configuration, etc., as long as it can suck the holding film 10 onto the suction surface 511 .

[0093] Specifically, the first chuck table 51 is a molded body having suction routes such as suction holes and suction grooves, and is usually used in a plate shape. Note that these suction holes and / or suction grooves can exert a suction effect by being connected to a suction source such as a vacuum pump via a necessary path. The above-mentioned adsorption surface 511 is usually the bottom surface of the molded article.

[0094] The adsorption surface 511 can usually be flat as shown in FIG. 2, but can also be recessed upward to provide a recess 513 as shown in FIGS. A plurality of recesses 513 are formed according to the size (planar size) of the electronic component 30 and the holding position of the electronic component 30 on the holding film . That is, the recess 513 has a function of accommodating the electronic component 30 therein when the upper surface (holding surface 13) of the holding film 10 is sucked onto the adsorption surface 511. In other words, by accommodating the electronic component 30 in the recess 513 of the adsorption surface 511, the holding film 10 can be adsorbed flatly onto the adsorption surface 511 without being bent.

[0095] The length of the recess 513 by which the adsorption surface 511 is recessed upward, that is, the depth of the recess 513, is not particularly limited. When the depth of the recess 513 is approximately equal to the thickness of the electronic component 30 to be housed therein, the electronic component 30 can be adsorbed inside the recess 513, and the positional relationship between the electronic components 30 can be fixed (see FIG. 4). Furthermore, when the depth of the recess 513 is made larger than the thickness of the electronic component 30 housed therein, it is possible to prevent the electronic component 30 from being sucked inside the recess 513 (see FIG. 5).

[0096] When the first chuck table 51 adsorbs the holding film 10, the adsorption surface 511 is brought into contact with the holding surface 13 of the holding film 10. When the adsorption surface 511 comes into contact with the holding surface 13 of the holding film 10, it is preferable that the adsorption surface 511 has a configuration having releasability with respect to the holding surface 13 so that the holding surface 13 is not adhered to the holding surface 13. Specific examples of this configuration include providing a release layer on the adsorption surface 511 by applying a release agent containing silicone resin or the like to the adsorption surface 511, and using a resin having release properties such as silicone resin as the material used for the molded body of the first chuck table 51.

[0097] Moreover, the first chuck table 51 may be provided with a cooling mechanism to keep the adsorbed holding film 10 in the room temperature range. The mechanism and configuration of this cooling mechanism are not limited as long as it can keep the holding film 10 in the room temperature range. For example, the cooling mechanism can be composed of a coolant supplying machine that supplies a coolant to the first chuck table 51, a blower that blows air onto the holding film 10 to cool it, and the like. The normal temperature range can be 15 to 30°C, preferably 15 to 25°C, and more preferably 20 to 25°C.

[0098] (2) Second chuck table As described above, the second chuck table 52 has an adsorption surface 521 that is open upward so that the holding film 10 can be adsorbed from the lower surface (non-holding surface 14) side. Furthermore, the second chuck table 52 has a heating mechanism for heating the holding film 10 fixed thereto. That is, the second chuck table 52 fixes the holding film 10 handed over from the first chuck table 51 by sucking the holding film 10 fixed to the first chuck table 51 onto the suction surface 521 .

[0099] In addition, the second chuck table 52 has an adsorption surface 521 heated by a heating mechanism. The holding film 10 fixed to the adsorption surface 521 and the electronic component 30 held by the holding film 10 are heated by the heated adsorption surface 521 and placed in a heated environment. Although the specific temperature of the heated adsorption surface 521 is not limited, for example, the lower limit of the temperature can be 50° C. or more, further 100° C. or more, and further 150° C. or more. Moreover, the upper limit of the temperature is usually 250° C. or less.

[0100] The second chuck table 52 is not limited in its configuration other than having the above-mentioned suction surface 521. Specifically, the second chuck table 52 is a molded body having suction routes such as suction holes and suction grooves, and is usually used in a plate shape. Note that these suction holes and / or suction grooves can exert a suction effect by being connected to a suction source such as a vacuum pump via a necessary path. Usually, the top surface of the molded body is used as the adsorption surface 521. Usually, the adsorption surface 521 is flat as a whole.

[0101] In addition, the second chuck table 52 is equipped with a heater as a heating mechanism. The second chuck table 52 can be provided with a heater to heat the suction surface 521. Naturally, the second chuck table 52 can be provided with a sensor and a control mechanism for controlling the heater.

[0102] (3) Delivery mechanism The transfer mechanism 54 is a mechanism that brings the suction surface 511 of the first chuck table 51 and the suction surface 521 of the second chuck table 52 close to each other in a face-to-face manner in order to transfer the holding film 10 fixed to the first chuck table 51 to the second chuck table 52 (see Figure 11). Specifically, the delivery mechanism 54 is equipped with a means for lowering the first chuck table 51 toward the second chuck table 52, a means for lifting the second chuck table 52 toward the first chuck table 51, or a means for performing both.

[0103] The delivery mechanism 54 is only required to bring the suction surface 511 of the first chuck table 51 and the suction surface 521 of the second chuck table 52 close to each other, and the configuration thereof is not limited. As a specific example of the delivery mechanism 54, FIG. 11 shows a means for lowering the first chuck table 51 toward the second chuck table 52.

[0104] That is, the delivery mechanism 54 includes a support body 541 that suspends and supports the first chuck table 51, and a support column 542 that supports the support body 541 from below. The support pillars 542 are configured to be expandable or contractible in the vertical direction. When the pillars 542 contract, the support body 541 supported by the pillars 542 moves downward, and the first chuck table 51 moves downward together with the support body 541 toward the second chuck table 52.

[0105] The delivery mechanism 54 may include, in addition to the support 541 and the pillars 542 described above, a drive source for driving the pillars 542 and the like. In addition, after the transfer mechanism 54 transfers the holding film 10 from the first chuck table 51 to the second chuck table 52, it has the function of extending the support pillars 542, raising the support body 541 and the first chuck table 51, and moving the first chuck table 51 away from the second chuck table 52.

[0106] (4) Other Organizations The electronic component manufacturing apparatus 50 may include an evaluation means for evaluating the electronic components 30 in addition to the first chuck table 51, the second chuck table 52, and the delivery mechanism 54. Specific examples of evaluation means include a probe card 53 (see FIG. 9) on which probes 531 are arranged to evaluate the electrical characteristics of the electronic component 30, and an appearance characteristic evaluation means (such as a non-contact optical evaluation means) that measures the appearance characteristics of the electronic component 30. [Industrial Applicability]

[0107] The electronic component manufacturing method and electronic component manufacturing apparatus of the present invention are widely used in the manufacture of electronic components, and are particularly suitable for use in the manufacture of components with excellent productivity, since they have the property of suppressing the occurrence of sagging wrinkles in a holding film that holds electronic components in a heated environment. [Explanation of symbols]

[0108] 10; support film; 101; base layer; 102; support layer; 11;Fixed film, 12; frame body; 13; retention surface; 131; exposed portion; 131A; peripheral exposed portion; 131B; gap exposed portion; 14; non-retentive surface, 30; electronic components; 301; exposed parts; 31;electrode, 50;Electronic component manufacturing equipment, 51; first chuck table; 511; suction surface; 513; recess; 52; second chuck table, 521; suction surface, 53; probe card, 531; probe, 54;delivery mechanism, 541;support, 542;support.

Claims

1. The upper surface and the peripheral surface of an electronic component held by a holding film are exposed portions of the electronic component, a portion of the holding surface of the holding film in a state in which the electronic component is held, where the electronic component is not held, is defined as an exposed portion of the holding surface of the holding film, a fixing step of fixing a positional relationship between an exposed portion of the electronic component held by the holding film and / or an exposed portion of a holding surface of the holding film; and a suction step of suctioning the holding film, the positional relationship of which has been fixed, from a non-holding surface side onto a heated suction surface.

2. a release step of releasing the fixed positional relationship after the adsorption step, The method for producing an electronic component according to claim 1 , further comprising, after the releasing step, a current application step of externally applying current to electrodes of the electronic component exposed on the holding surface side.

3. 3. The method for manufacturing an electronic component according to claim 1, wherein the fixing step is a step of adsorbing the holding film, which is arranged so that the holding surface faces upward, onto a chuck table, which has an adsorption surface facing downward.

4. The method for manufacturing an electronic component according to claim 1 or 2, wherein the fixing step is a step of attaching a fixing film to the holding surface side of the holding film.

5. The holding film has a holding layer for holding the electronic component and a base layer for supporting the holding layer, The base layer has a ratio R of the elastic modulus E' (160) at 160°C to the elastic modulus E' (25) at 25°C. Ｅ 5. The method for producing an electronic component according to claim 1, wherein (=E'(160) / E'(25)) is 0.001 or more and 0.6 or less, and E'(25) is 3500 MPa or less.

6. The method for producing an electronic component according to claim 5, wherein the base layer has a linear expansion coefficient of 100 ppm / K or more.

7. a first chuck table having a suction surface that is open downward so that the object can be suctioned from an upper surface side; a second chuck table having an upwardly open suction surface so that the object can be suctioned from the lower surface side, and having a heating mechanism for heating the object fixed thereto; a transfer mechanism that brings the suction surfaces of the first chuck table and the second chuck table close to each other while facing each other, and transfers the object fixed to the first chuck table to the second chuck table.

8. 8. The electronic component manufacturing apparatus according to claim 7, wherein the object is a holding film holding an electronic component on its upper surface.

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