Component mounting machine and component mounting system

Abstract

To appropriately limit the liftable height of a nozzle according to the type of a nozzle.SOLUTION: A component mounting machine includes a nozzle capable of sucking a component, a head to which a plurality of types of nozzles are detachable, and including a head body and a nozzle elevating mechanism that elevates the nozzle with respect to the head body, a storage unit that stores, for each type of nozzle, an elevation height which is the length in the height direction at which the nozzle can be elevated with respect to the head body, and a control unit that controls the nozzle elevating mechanism, and the control unit controls the nozzle elevating mechanism on the basis of the elevation height stored in the storage unit corresponding to the type of nozzle attached to the head.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present disclosure relates to a mounter that mounts components on a board using a nozzle attached to a head, and more particularly to a technique for determining a height to which a nozzle that picks up components can be raised and lowered. [Background technology]

[0002] In component mounters, components are picked up by nozzles attached to a head, and the picked up components are mounted on a board. If the nozzle that picks up the component interferes with other components, etc., the component cannot be mounted in the desired position on the board. For this reason, techniques have been developed to avoid interference between the nozzle that picks up the component and other components, etc. (for example, Patent Document 1). In the component mounter disclosed in Patent Document 1, multiple nozzles are attached to the head, and components are picked up by each of the multiple nozzles. If components picked up by adjacent nozzles interfere with each other, the nozzle posture is changed to avoid the interference between the components. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2014-127526 A Summary of the Invention [Problem to be solved by the invention]

[0004] In this type of component mounter, the nozzle can be raised and lowered relative to the head, and the nozzle rises and falls relative to the head when picking up and mounting components. If the radial dimension of the nozzle attached to the head is large, interference will occur between the nozzle and the head when the nozzle rises and falls. For this reason, in conventional technology, if the radial dimension of the nozzle is larger than a set value, the height to which the nozzle can be raised and lowered is limited to avoid interference between the nozzle and the head.

[0005] However, there are various types of nozzles, and the shapes of the nozzles differ depending on the type of nozzle. For example, there are nozzles in which only the dimensions of the lower end of the nozzle exceed the set value, and only the lower end of the nozzle interferes with the head, while there are nozzles in which the dimensions of not only the lower end of the nozzle but also the center and upper end of the nozzle exceed the set value, and the upper end of the nozzle interferes with the head. However, in conventional technology, if the dimensions of even one point from the upper end to the lower end of the nozzle are larger than the set value, the height to which the nozzle can be raised and lowered is uniformly limited. For this reason, depending on the type of nozzle, a problem occurs in that the height to which the nozzle can be raised and lowered is too limited.

[0006] This specification discloses a technique that can appropriately limit the height to which a nozzle can be raised or lowered depending on the type of nozzle. [Means for solving the problem]

[0007] The component mounter disclosed in this specification includes a nozzle capable of adsorbing components, and a head to which multiple types of nozzles are detachably attached. The head includes a head body and a nozzle lifting mechanism that raises and lowers the nozzle relative to the head body. The component mounter further includes a storage unit that stores, for each type of nozzle, a liftable height that is a length in the height direction at which the nozzle can be raised and lowered relative to the head body, and a control unit that controls the nozzle lifting mechanism. The control unit controls the nozzle lifting mechanism based on the liftable height stored in the storage unit that corresponds to the type of nozzle attached to the head.

[0008] In this mounter, the height to which the nozzle can be raised or lowered relative to the head is stored for each type of nozzle, and the nozzle lifting mechanism is controlled based on the stored height to which the nozzle can be raised or lowered, making it possible to appropriately limit the height to which the nozzle can be raised or lowered depending on the type of nozzle. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a diagram showing a schematic configuration of a component mounter according to an embodiment. [Diagram 2] FIG. 4 is a diagram for explaining a head lifting device that moves a head in a vertical direction. [Diagram 3] FIG. 2 is a side view of the nozzle, illustrating the dimensions of each part of the nozzle. [Figure 4] 1 is a schematic diagram showing a nozzle, a component sucked onto the nozzle, and a component pre-attached to a board. [Diagram 5] FIG. 1 is a block diagram showing a configuration of a component mounting system according to an embodiment. [Figure 6] 11 is a flowchart showing the procedure of a nozzle height determination process for determining the nozzle height during the mounting process. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] In the mounter disclosed in this specification, the storage unit may store, for each type of nozzle, dimensions in the X and Y directions perpendicular to the height direction of the nozzle. The liftable height may be a constant value when the dimensions of the nozzle in the X and Y directions are less than a predetermined value, while being set according to the dimensions of the nozzle in the X and Y directions when the dimensions of the nozzle in the X and Y directions are equal to or greater than the predetermined value.

[0011] In the component mounter disclosed in this specification, the head may be configured to mount a component adsorbed to the nozzle onto a board. The storage unit may further store a pre-attached component dimension, which is a height dimension of the component pre-attached to the board. The control unit may raise and lower the nozzle within a range of liftability of the nozzle that is calculated based on the liftable height and the pre-attached component dimension stored in the storage unit.

[0012] The mounter disclosed in this specification may further include an XY-direction movement mechanism that moves the head in the X and Y directions. The head may further include a head body lifting mechanism that raises and lowers the head body relative to the XY-direction movement mechanism. The range in which the nozzle can be raised and lowered may be calculated based on the liftable height, the dimensions of the pre-attached component, and the heightwise position of the head body relative to the XY-direction movement mechanism. EXAMPLES

[0013] A component mounting system 70 according to an embodiment will be described with reference to the drawings. As shown in Fig. 5, the component mounting system 70 includes a component mounter 10 and a management device 60 communicatively connected to the component mounter 10.

[0014] The component mounter 10 is a device that mounts components 18 on a board S. As shown in Fig. 1, the component mounter 10 includes a housing 12, a detachably attached component feeder 16, and a board transport device 14 and a head 20 housed in the housing 12. In this specification, the left-right direction of the component mounter 10 shown in Fig. 1 will be described as the X-axis direction, the front-rear direction as the Y-axis direction, and the up-down direction (i.e., height direction) as the Z-axis direction.

[0015] The board transport device 14 is a device that transports the board S to a component mounting position in the housing 12 and transports the board S from the component mounting position to the outside of the housing 12. In this embodiment, two board transport devices 14 are installed side by side in the Y-axis direction in the housing 12, and two boards S can be simultaneously transported into the housing 12.

[0016] The component feeder 16 is a tape-type component feeder that stores a plurality of components 18 (shown in FIG. 4). The component feeder 12 supplies the components 18 to the head 20 by feeding a tape that stores the components 18. A plurality of component feeders 12 can be attached to the component mounter 10. Therefore, by attaching component feeders 12 that store different types of components 18 to the component mounter 10, a plurality of types of components 18 can be supplied to the head 20.

[0017] The head 20 includes a head body 24 (shown in FIG. 3) that detachably holds a plurality of nozzles 40. Each of the plurality of nozzles 40 is capable of picking up a component 18. The head 20 includes a nozzle lifting device 28 (shown in FIG. 5; an example of a nozzle lifting mechanism) that raises and lowers each of the plurality of nozzles 40 in the Z-axis direction relative to the head body 24. By raising and lowering the nozzle 40 with the nozzle lifting device 28, the component 18 can be picked up by the nozzle 40, and the component 18 picked up by the nozzle 40 can be mounted on the board S.

[0018] The head 20 can be moved within the housing 12 by an XY robot 30 (an example of an XY direction movement mechanism). The XY robot 30 includes a Y-axis slider 32 and an X-axis slider 34. The Y-axis slider 32 is attached to the housing 12 so as to be movable in the Y-axis direction, and is driven by a drive device (not shown) to move in the Y-axis direction relative to the housing 12. The X-axis slider 34 is attached to the Y-axis slider 32 so as to be movable in the X-axis direction, and is driven by a drive device (not shown) to move in the X-axis direction relative to the Y-axis slider 32. The head 20 is attached to the X-axis slider 34. The X-axis slider 34 and the Y-axis slider 32 are driven to move the head 20 in the X-axis and Y-axis directions.

[0019] The head 20 further includes a head lifting device 26 (shown in FIG. 5; an example of a head body lifting mechanism). As shown in FIG. 2, the head lifting device 26 includes a Z-axis slider 36 attached to the X-axis slider 34 so as to be movable in the Z-axis direction. The Z-axis slider 36 moves in the Z-axis direction relative to the X-axis slider 34 by being driven by a driving device (not shown). When the Z-axis slider 34 moves in the Z direction, the head body 24 attached to the Z-axis slider 34 also moves in the Z-axis direction. This allows the head 20 to move between the position shown in FIG. 2(a) and the position shown in FIG. 2(b). The positions of the X-axis slider 34, the Y-axis slider 32, and the Z-axis slider 34 are each controllable, and this allows the position (x, y, z) of the head 20 in the housing 12 to be controlled.

[0020] The control unit 50 is configured using a computer including a CPU and a storage device. The control unit 50 executes a program stored in the storage device to control the operation of each unit (14, 16, 20, 30, etc.) of the component mounter 10. The control unit 50 controls the operation of each unit (14, 16, 20, 30, etc.) of the component mounter 10, so that a plurality of components 18 are mounted on the board S. That is, the board S is carried into a component mounting position in the housing 12 by the board transport device 14. When the board S is carried into the component mounting position, the head 20 moves above the component feeder 16, and the nozzle 40 picks up the component 18. When the nozzle 40 picks up the component 18, the head 20 moves above the board S, and mounts the component 18 picked up by the nozzle 40 on the board S. The board S on which the component 18 is mounted is transported outside the housing 12 by the board transport device 14. The control unit 50 is also connected to the management device 60 via the communication unit 52, and transmits and receives data to and from the management device 60. For example, the control unit 50 receives a mounting program transmitted from the management device 60. The control unit 50 also receives information about the components 18 and information about the nozzle 40 transmitted from the management device 60, and uses this information to control the elevation of the nozzle 40. The configuration of the management device 60 will be described in detail later.

[0021] As is clear from the above explanation, the position of the nozzle 40 in the Z-axis direction (height direction) is determined by the position of the Z-axis slider 36 driven by the head lifting device 26 (i.e., the Z-axis position of the Z-axis slider 36 (head main body 24) relative to the X-axis slider 34) and the position of the nozzle 40 driven by the nozzle lifting device 28 (i.e., the Z-axis position of the nozzle 40 relative to the head main body 24).

[0022] Here, the nozzle 40 that picks up the component 18 will be described. As shown in FIG. 3, the nozzle 40 includes a cylindrical main body 48, an upper end flange 42 provided at the upper end of the main body 48, and a lower end abutment portion 44 provided at the lower end of the main body 48. The upper end flange 42 is connected to a connection portion (not shown) of the head main body 24, and this connection portion is located within the nozzle mounting hole 22 of the head main body 24. The connection portion to which the upper end flange 42 is connected is moved in the Z-axis direction by the nozzle lifting device 28, so that the nozzle 40 moves up and down relative to the head main body 24. In addition, since the connection portion is located within the nozzle mounting hole 22, a diameter D1 (i.e., dimensions in the X and Y directions) of the upper end flange 42 is smaller than a diameter D2 of the nozzle mounting hole 22 (D1 <D2)。

[0023] The lower end abutment portion 44 is a portion that abuts against the component 18 when the component 18 is sucked onto the nozzle 40. The lower end abutment portion 44 is provided with a chuck 46 that grips the component 18. By gripping the component 18 with the chuck 46, the component 18 can be securely held by the nozzle 40. As is clear from FIG. 3, the diameter D3 (i.e., the dimensions in the X-axis direction and the Y-axis direction) of the lower end abutment portion 44 is larger than the diameter D2 of the nozzle mounting hole 22 (D3>D2). Therefore, when the nozzle 40 is raised and lowered relative to the head main body 24 by the nozzle lifting device 28, the lower end abutment portion 44 interferes with the lower surface of the head main body 24. Therefore, the nozzle 40 can rise to a position where the lower end abutment portion 44 interferes with (abuts against) the lower surface of the head main body 24, but cannot rise any higher.

[0024] In addition, the component mounter 10 is provided with a plurality of types of nozzles 40 according to the types of components 18 to be picked up. The plurality of types of nozzles 40 are detachable from the head body 24, and a nozzle 40 of a selected type is used according to the components to be picked up. The shape of the nozzle 40 varies depending on the type. For example, some nozzles 40 have a constant size (dimensions in the X-axis direction and the Y-axis direction) from the top end to the bottom end that is smaller than the diameter D2 of the nozzle mounting hole 22, while others have a size (dimensions in the X-axis direction and the Y-axis direction) of the middle part of the nozzle 40 that is larger than the diameter D2 of the nozzle mounting hole 22. When the size (dimensions in the X-axis direction and the Y-axis direction) from the top end to the bottom end of the nozzle 40 is smaller than D2, the nozzle 40 can be raised to the highest position to which it can be raised by the nozzle lifting device 28. On the other hand, when the size (dimensions in the X-axis direction and the Y-axis direction) of the middle part of the nozzle 40 is larger than D2, the nozzle 40 can only be raised to a position (height) where the middle part interferes with the lower surface of the head body 24.

[0025] In this embodiment, the height at which the nozzle 40 can be raised and lowered relative to the head body 24 (hereinafter referred to as the liftable height) is set according to the type of the nozzle 40. Here, the liftable height can be considered as the moving distance (length in the Z-axis direction) when the nozzle 40 moves from the lowest point to the highest point to which it can be raised relative to the head body 24. As is clear from the above explanation, when the diameter (dimensions in the X-axis and Y-axis directions) of the nozzle 40 becomes large, the height at which the head body 24 and the nozzle 40 interfere with each other becomes the highest point to which the nozzle 40 can be raised. Therefore, the liftable height of the nozzle 40 varies depending on the type (shape) of the nozzle. For example, when the maximum diameter of the nozzle 40 is smaller than D2 (more specifically, the value obtained by subtracting the clearance from D2), the liftable height of the nozzle 40 becomes the distance (constant value) between the highest point and the lowest point to which the nozzle 40 can be raised by the nozzle lifting device 28. On the other hand, when the maximum diameter of the nozzle 40 is larger than the diameter D2 (more specifically, the value obtained by subtracting the clearance from the diameter D2), for example, in the nozzle 40 shown in FIG. 3, the point where the lower end abutment portion 44 interferes with the lower surface of the head body 24 becomes the uppermost point, and the distance from this uppermost point to the lowermost point becomes the height to which the nozzle can be raised and lowered.

[0026] Next, with reference to FIG. 4, interference between component 18b picked up by nozzle 40 and component 18a mounted on board S (so-called pre-attached component) will be described. As shown in FIG. 4, when component 18a is pre-attached to board S, component 18b picked up by nozzle 40 needs to avoid interference with pre-attached component 18a. That is, in order to mount component 18b on board S, nozzle 40 needs to be raised to a position where the bottom surface of component 18b picked up by nozzle 40 is higher than the top surface of component 18a. (Distance h from the top end of nozzle 40 to board S) max However, it is necessary to achieve the state shown in Figure 4.)

[0027] As already described, the nozzle 40 has a maximum diameter at the lower end abutment portion 44, and the lower end abutment portion 44 interferes with the head body 24. That is, the height to which the nozzle 40 can be raised and lowered with respect to the head body 24 is not the length l1 from the upper end to the lower end of the nozzle 40, but the length l2 from the upper end flange 42 to the lower end abutment portion 44. For this reason, it is necessary to raise the head body 24 by the head lifting device 26 and set the distance from the board S to the upper end flange 42 to h1 (more specifically, a value taking into account the clearance a). Therefore, if the maximum lifting height to which the head body 24 is raised by the head lifting device 26 is less than h1, it is impossible to avoid interference between the parts 18a and 18b. On the other hand, if the maximum lifting height to which the head body 24 is raised by the head lifting device 26 is h1 or more, it is possible to avoid interference between the parts 18a and 18b.

[0028] As is clear from the above, the maximum height to which the nozzle 40 can be raised and lowered is the sum of the maximum height to which the head body 24 can be raised by the head lifting device 26 and the height to which the nozzle 40 can be raised and lowered relative to the head body 24. On the other hand, the minimum height to which the nozzle 40 can be lowered is the sum of the height dimension of the component 18b adsorbed to the nozzle 40 and the height dimension of the pre-attached component 18a mounted on the board S (actually, including the clearance c set between both components 18a and 18b). Therefore, the range in which the nozzle 40 can be raised and lowered can be calculated from the above maximum height (the maximum height by the head lifting device 26 + the height to which the nozzle 40 can be raised and lowered relative to the head body 24) and the height dimensions of the components 18a and 18b. In this embodiment, the height of the nozzle 40 (nozzle height) used in the mounting process is determined from the range in which the nozzle 40 can be raised and lowered calculated as above, taking into account the various clearances a, b, and c shown in FIG. 4. Here, clearance a is the clearance set between the lower end contact portion 44 of the nozzle 40 and the head body 24. Clearance b is the clearance set between the lower end contact portion 44 of the nozzle 40 and the component 18a (the gap between the lower end contact portion 44 and the component 18a that may be generated by the chuck 46). Clearance c is the clearance set between the adsorbed component 18a and the pre-attached component 18b as described above.

[0029] If the maximum height to which the nozzle 40 can be raised and lowered (the maximum height to which the head lifting device 26 can raise and lower the nozzle 40 relative to the head body 24) is lower than the minimum height to which the nozzle 40 can be lowered (the sum of the height dimensions of the components 18a, 18b), the picked-up component 18a and the pre-attached component 18b will interfere with each other. Therefore, such a component 18a cannot be mounted on the board S by the component mounter 10.

[0030] Next, a description will be given of a management device 60 (an example of a computer) that is communicatively connected to the component mounter 10. The management device 60 is configured using a computer equipped with a CPU and a storage device, and includes a calculation unit 62, an input unit 64, a storage unit 66, and a communication unit 68.

[0031] The input unit 64 receives input of the types and positions of the components 18 to be mounted on the circuit board S in the component mounter 10. That is, the type and mounting position of each of the multiple components 18 to be mounted on the circuit board S are input.

[0032] The memory unit 66 stores, for each type of component 18, the dimensions of that type of component 18 (dimension in the X-axis direction, dimension in the Y-axis direction, dimension in the Z-axis direction) and the type of nozzle 40 for suctioning that type of component 18. The memory unit 66 also stores, for each type of nozzle 40, the dimensions of that type of nozzle 40 (dimension in the X-axis direction, dimension in the Y-axis direction) and the height to which that type of nozzle 40 can be raised and lowered.

[0033] The calculation unit 62 generates a component mounting program to be executed by the component mounter 10, based on the types and positions of the components 18 input from the input unit 64. The component mounting program specifies the mounting order and mounting positions of the multiple components 18 to be mounted on the board S. Furthermore, the calculation unit 62 acquires information about the components 18 and information about the nozzle 40 from the storage unit 66, based on the types of the multiple components 18 input from the input unit 64. Specifically, the calculation unit 62 acquires the dimensions of the component 18 and the type of nozzle 40 that picks up the component 40 from the type of the component 18, and also acquires the height at which the nozzle 40 can be raised and lowered (the height at which the nozzle 40 can be raised and lowered relative to the head body 24) from the acquired type of nozzle 40.

[0034] The communication unit 68 transmits the component mounting program generated by the calculation unit 62, and the information related to the component 18 and the information related to the nozzle 40 acquired by the calculation unit 62 to the component mounter 10. The various data transmitted from the communication unit 68 to the component mounter 10 is stored in the memory 50a (an example of a storage unit) of the control unit 50 via the communication unit 52.

[0035] The control unit 50 of the component mounter 10 processes data transmitted from the management device 60. That is, the control unit 50 performs a nozzle height determination process to determine the height (nozzle height) of the nozzle 40 during the mounting process based on the component mounting program transmitted from the management device 60, information on the component 18, and information on the nozzle 40. Furthermore, the control unit 50 executes a component mounting process to mount a component on the board S based on the nozzle height determined in the nozzle height determination process and the received component mounting program. First, the nozzle height determination process will be described.

[0036] 6, the control unit 50 first obtains the type of component 18 and the dimensions of the component 18 (dimensions in the X-axis direction, Y-axis direction, and Z-axis direction) from the memory 50a in accordance with the mounting order defined in the component mounting program (S10). That is, the component mounting program, information on the components 18, and information on the nozzle 40 are transmitted from the management device 60 and stored in the memory 50a. In S10, the types and dimensions of the components 18, from the first component 18 to be mounted on the board S to the last component 18, are obtained from the memory 50a.

[0037] Next, the control unit 50 selects components in accordance with the mounting order (S12). As described below, the nozzle height determination process is executed for all of the components 18 to be mounted on the board S. Therefore, in S12, the component 18 to be mounted first is selected from among the components 18 for which the nozzle height has not been determined.

[0038] Next, the control unit 50 acquires information about the nozzle 40 that picks up the component 18 selected in S12 (S14). As already described, in this embodiment, the type of nozzle 40 that picks up the component 18 is determined according to the type of the component 18. Information about the nozzle 40 that specifies the type of nozzle 40 for each type of component 18 is transmitted from the management device 60 and stored in the memory 50a. In S14, the type of nozzle 40 that picks up the component 18 selected in S12 is identified based on the nozzle information stored in the memory 50a, and the height at which the nozzle 40 can be raised and lowered (the height at which the nozzle 40 can be raised and lowered relative to the head body 24) is acquired from the type of nozzle 40.

[0039] Next, the control unit 50 determines whether a pre-attached component 18 (for example, component 18a in FIG. 4) has been mounted on the board S (S16). A plurality of components 18 are mounted on the board S, and the order in which the components 18 are mounted on the board S is fixed. For this reason, when a component 18 has been mounted on the board S before the component 18 selected in S12, the determination in S16 is YES. On the other hand, when a component 18 has not been mounted on the board S before the component 18 selected in S12 (i.e., when the component 18 selected in S12 is the component 18 to be mounted first), the determination in S16 is NO.

[0040] If the pre-attached components 18 are not mounted on the board S (NO in S16), the control unit 50 skips S18 and proceeds to S20. On the other hand, if the pre-attached components 18 are mounted on the board S (YES in S16), the control unit 50 acquires the dimensions of the pre-attached components 18 (more specifically, the dimensions of the pre-attached components 18 in the Z-axis direction) (S18). Since the dimensions (dimensions in the X-axis direction, Y-axis direction, and Z-axis direction) of all the components 18 to be mounted on the board S are acquired in S10, in S18, the dimensions of all the pre-attached components 18 in the Z-axis direction are identified from the acquired information on the components 18, and the largest dimension of all the identified dimensions is identified. In other words, if there are multiple pre-attached components 18, the dimension of the component 18 in the Z-axis direction that has the largest dimension in the Z-axis direction among the multiple pre-attached components 18 is acquired.

[0041] Next, the control unit 50 calculates the maximum height (maximum component height) of the component 18 that can be mounted on the board S at that time from the dimension in the Z-axis direction of the pre-attached component 18 identified in S18 (S20). As already described, the maximum height to which the nozzle 40 can be raised and lowered is the sum of the maximum height to which the head body 24 can be raised by the head lifting device 26 and the height to which the nozzle 40 can be raised and lowered relative to the head body 24. Here, the maximum height to which the head body 24 can be raised by the head lifting device 26 is known and is stored in the memory 50a of the control unit 50. In addition, the height to which the nozzle 40 can be raised and lowered relative to the head body 24 is stored in the memory 50a for each type of nozzle 40. Therefore, the maximum height to which the nozzle 40 can be raised and lowered can be calculated based on the information stored in the memory 50a, and the value obtained by subtracting the maximum dimension (dimension in the Z-axis direction) of the pre-attached component 18 acquired in S18 from the calculated maximum height becomes the maximum component height of the component 18 that can be mounted on the board S at that time. Therefore, in S20, the maximum component height of the component 18 that can be mounted on the board S at that time is calculated from the information stored in the memory 50a and the maximum dimension (dimension in the Z-axis direction) of the pre-attached component 18 acquired in S18. Note that, if there is no pre-attached component 18, the maximum component height becomes the sum of the maximum lift height to which the head main body 24 can be lifted by the head lift device 26 and the liftable height at which the nozzle 40 can be raised and lowered relative to the head main body 24.

[0042] Next, the control unit 50 determines whether or not the maximum component height calculated in S20 is greater than the dimension in the Z-axis direction of the component 18 selected in S12 (S22). If the maximum component height calculated in S20 is less than the dimension in the Z-axis direction of the component 18 selected in S12 (NO in S22), the component 18 selected in S12 cannot be mounted on the board S, and so the operator is notified of this (S26), and the nozzle height determination process ends. Since the operator is notified in S26 that the component mounting program generated by the management device 60 cannot be executed by the component mounter 10, the operator can take appropriate measures (for example, execute the component mounting program on another component mounter 10, etc.).

[0043] On the other hand, if the maximum component height calculated in S20 is greater than the dimension in the Z-axis direction of the component 18 selected in S12 (YES in S22), the control unit 50 determines the height (nozzle height) of the nozzle 40 when mounting the component 18 selected in S12 on the board S (S24). As already described, the range in which the nozzle 40 can be raised and lowered can be calculated as the maximum height to which the nozzle 40 can be raised and lowered (the maximum height to which the head lifting device 26 can raise and lower the nozzle 40 relative to the head body 24), the sum of the dimension in the Z-axis direction of the component 18 picked up by the nozzle, and the dimension in the Z-axis direction of the pre-attached component 18. In S24, the nozzle height of the nozzle 40 when mounting the component is determined from the range in which the nozzle 40 can be raised and lowered calculated as described above, taking into account the various clearances a, b, and c.

[0044] Next, the control unit 50 judges whether or not the process from S12 has been executed for all components 18 to be mounted on the board S by the component mounter 10 (S28). If the process from S12 has been executed for all components 18 (YES in S28), the control unit 50 ends the nozzle height determination process. On the other hand, if the process from S12 has not been executed for all components 18 (NO in S28), the control unit 50 returns to S12 and executes the process from S12. As a result, for all components 18 to be mounted on the board S, the nozzle height of the nozzle 40 when mounting the components 18 is determined.

[0045] Incidentally, when executing the component mounting program, the control unit 50, after picking up a component onto the nozzle 40, raises and lowers the nozzle 40 to the nozzle height determined for the picked-up component 18. Then, the nozzle 40 is moved above the board S to a mounting position on the board S, and the component 18 is mounted at the mounting position. Because the nozzle height of the nozzle 40 is determined as described above, the component 18 picked up by the nozzle 40 can be mounted on the board S without interfering with the pre-attached component 18 that has been pre-attached to the board S.

[0046] In the above embodiment, the height to which the nozzle 40 can be raised and lowered relative to the head body 24 is stored for each type of nozzle 40, and the range in which the nozzle 40 can be raised and lowered is calculated using this height. Therefore, the nozzle 40 can be raised to the maximum relative to the head body 24 depending on the type (shape) of the nozzle. This makes it possible to increase the dimension in the height direction (Z-axis direction) of the component 18 that can be mounted on the board S. Furthermore, in this embodiment, the range in which the nozzle 40 can be raised and lowered is calculated taking into account the maximum height to which the head body 24 can be raised and lowered by the head lifting device 26. This also makes it possible to increase the dimension in the height direction (Z-axis direction) of the component 18 that can be mounted on the board S.

[0047] Furthermore, in this embodiment, the range in which nozzle 40 can be raised and lowered is calculated taking into consideration the dimension in the height direction (Z-axis direction) of component 18 picked up by nozzle 40 and the dimension in the height direction (Z-axis direction) of pre-attached component 18. This makes it possible to avoid interference between component 18 picked up by nozzle 40 and component 18 pre-attached to board S.

[0048] In the above embodiment, the nozzle height of the nozzle 40 when mounting the component 18 on the board S is determined for each component to be mounted on the board S, but the present invention is not limited to this example. For example, all the components 18 may be mounted using the highest nozzle height among the nozzle heights determined for each component in S24 of Fig. 6. This configuration also makes it possible to avoid interference between the component 18 picked up by the nozzle 40 and the pre-attached component 18.

[0049] Furthermore, in the above embodiment, there was no pre-attached component 18 on the board S before the mounting process was started by the component mounter 10, but the present invention is not limited to such an example, and a process of mounting a component 18 on a board S on which components have already been mounted by another component mounter may be performed. In this case, for example, information about the pre-attached component 18 (dimension in the Z-axis direction) may be further transmitted from the management device 60 to the component mounter 10.

[0050] In the above embodiment, the height at which the nozzle 40 can be raised and lowered (the height at which the nozzle 40 can be raised and lowered relative to the head body 24) is stored for each type of nozzle 40, but the present invention is not limited to this example. For example, the dimensions of the nozzle 40 in the X-axis and Y-axis directions (for example, the radial dimension D of the nozzle 40) may be stored for each type of nozzle 40. When the dimensions of the nozzle 40 in the X-axis and Y-axis directions are smaller than a predetermined value and do not interfere with the head body 24, the height at which the nozzle 40 can be raised and lowered is the maximum height at which the nozzle 40 can be raised and lowered by the nozzle lifting device 26 (maximum nozzle lifting height). Therefore, when the dimensions of the nozzle 40 in the X-axis and Y-axis directions are smaller than a predetermined value, it is not necessary to store the height at which the nozzle 40 can be raised and lowered, and the maximum nozzle lifting height by the nozzle lifting device 26 may be used. On the other hand, when the dimensions of the nozzle 40 in the X-axis and Y-axis directions are equal to or larger than a predetermined value, the nozzle 40 and the head body 20 interfere with each other, so the height at which the nozzle 40 can be raised and lowered according to the shape of the nozzle 40 is stored. According to this embodiment, the amount of data stored in the memory 50a of the control unit 50 of the component mounter 10 can be reduced.

[0051] In the above embodiment, the management device 60 transmits information about the component 18 and information about the nozzle 40 to the mounter 10, but this is not limited to the above example and various aspects can be adopted. For example, the information about the component 18 and information about the nozzle 40 may be directly input to the mounter 10. In addition, in the above embodiment, the nozzle height determination process is performed in the mounter 10, but the nozzle height determination process may be performed in the management device 60. In this case, the management device 60 transmits the component mounting program and the nozzle height at the time of mounting that is determined to the mounter 10. The mounter 10 only needs to perform the component mounting process based on the component mounting program and the nozzle height transmitted from the management device 60. In this way, the management device 60 and the mounter 10 can share the functions required to perform the nozzle height determination process in various aspects.

[0052] Although specific examples of the technology disclosed in this specification have been described in detail above, these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and variations of the specific examples exemplified above. Furthermore, the technical elements described in this specification or drawings exhibit technical utility alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. Furthermore, the technology exemplified in this specification or drawings achieves multiple objectives simultaneously, and achieving one of the objectives itself has technical utility. [Explanation of symbols]

[0053] 10: Component mounting machine 12: Housing 14: Substrate transport device 16: Parts feeder 18: Parts 20: Head 22: Nozzle mounting hole 24: Head body 26: Head lifting device 28: Nozzle lifting device 30: XY Robot 32: Y-axis slider 34: X-axis slider 36: Z-axis slider 40: Nozzle 42: Upper flange 44: Lower end contact part 46: Zipper 48: Main body 50: Control unit 52: Communications Department 60: Management device 62: Arithmetic section 64: Input section 66: Storage section 68: Communications Department

Claims

1. A nozzle capable of suctioning a part; a head to which a plurality of types of nozzles are detachably attached, the head including a head body and a nozzle elevating mechanism that raises and lowers the nozzles relative to the head body; a storage unit that stores, for each type of nozzle, a height at which the nozzle can be raised and lowered relative to the head body; a control unit that controls the nozzle lifting mechanism based on the liftable height stored in the storage unit that corresponds to the type of the nozzle attached to the head; and A component mounting machine comprising:

2. the storage unit stores, for each type of nozzle, dimensions of the nozzle in an X direction and a Y direction perpendicular to the height direction, 2. The component mounter according to claim 1, wherein the liftable height is a constant value when the dimensions of the nozzle in the X and Y directions are less than predetermined values, and is set according to the dimensions of the nozzle in the X and Y directions when the dimensions of the nozzle in the X and Y directions are equal to or greater than the predetermined values.

3. the head is configured to be capable of mounting the component adsorbed by the nozzle onto a substrate, the storage unit further stores a pre-attached component dimension, which is a dimension in a height direction of the component pre-attached to the board; 3. The component mounter according to claim 1, wherein the control unit raises and lowers the nozzle within a range of liftability of the nozzle that is calculated based on the liftable height stored in the memory unit and the dimensions of the pre-attached component.

4. the component mounter further includes an XY direction movement mechanism that moves the head in the X direction and the Y direction, the head further includes a head body lifting mechanism that lifts and lowers the head body relative to the XY direction movement mechanism, 4. The component mounter according to claim 3, wherein a range in which the nozzle can be raised and lowered is calculated based on the height at which the nozzle can be raised and lowered, the dimensions of the pre-attached component, and the position of the head body in the height direction relative to the XY direction movement mechanism.

5. A nozzle capable of suctioning a part; a head to which a plurality of types of nozzles are detachably attached, the head including a head body and a nozzle elevating mechanism that raises and lowers the nozzles relative to the head body; Equipped with A method for determining a range in which the nozzle can be raised and lowered in a component mounter that mounts the component picked up by the nozzle onto a board, comprising: Identifying the type of nozzle attached to the head; acquiring a liftable height, which is a length in a height direction at which the nozzle can be raised and lowered relative to the head main body, set according to the type of the identified nozzle; determining a range in which the nozzle can be raised and lowered based on the acquired height in which the nozzle can be raised and lowered; A method comprising:

6. A component mounting system including a component mounter and a computer communicably connected to the component mounter, The component mounter includes: A nozzle capable of suctioning a part; a head to which a plurality of types of nozzles are detachably attached, the head including a head body and a nozzle elevating mechanism that raises and lowers the nozzles relative to the head body; A receiving unit for receiving information transmitted from the computer; A control unit that controls the nozzle lifting mechanism; It is equipped with The computer includes: a lift height storage unit that stores, for each type of nozzle, a liftable height that is a length in a height direction at which the nozzle can be lifted and lowered relative to the head body; a transmission unit that transmits the liftable height stored in the liftable height storage unit to the receiving unit of the component mounter; It is equipped with the control unit of the component mounter controls the nozzle lifting mechanism based on the liftable height received by the receiving unit, the liftable height corresponding to the type of the nozzle attached to the head. Component mounting system.

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