Electronic component with metal terminal, connection structure, and method for manufacturing the connection structure

Abstract

To provide an electronic component which can inhibit variations in a height dimension when mounted and achieve stabilization of a mounting position, and to provide a connection structure and a manufacturing method of the connection structure.SOLUTION: An electronic component 11 with a metal terminal includes: electronic components 2 each having an element assembly 21 and external electrodes 22, 22 provided on end surfaces 21a, 21a facing in an X direction at the element assembly 21; and plate-like metal terminals 12, 12 each having a joint part 31 joined to the external electrodes 22 and a leg part 32 which is provided protruding farther than the electronic component 2 in a Z direction. The leg part 32 of the metal terminal 12 has: an extension portion 41 which is continuous from the joint part 31 and extends in the Z direction; a first bending portion 42 which bends from a tip of the extension portion 41 to the electronic component 2 side at a first angle θ1 which is an acute angle relative to the extension portion 41; and a second bending portion 43 which bends from a tip of the first bending portion 42 at a second angle θ2 larger than the first angle θ1 relative to the extension portion 41.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present disclosure relates to an electronic component with a metal terminal, a connection structure, and a method for manufacturing the connection structure. [Background technology]

[0002] Conventionally, there is known an electronic component with metal terminals, in which metal terminals are provided on a pair of end faces of a chip-type electronic component such as a multilayer ceramic capacitor. In such an electronic component, the metal terminals are used for mounting to a connected member such as a circuit board. For example, the tip portion of the metal terminal protruding from the electronic component is abutted against the mounting surface of the connected member, and the tip portion of the metal terminal is soldered to the mounting surface, thereby achieving electrical connection of the electronic component to the connected member.

[0003] An example of a conventional electronic component with a metal terminal is a chip-type electronic component described in Patent Document 1. This conventional electronic component is provided with a plate-shaped metal terminal formed by bending along the outer surface of the electronic component. The tip of the metal terminal is bent at an acute angle toward the electronic component with respect to the portion along the outer surface of the electronic component. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 62-213226 Summary of the Invention [Problem to be solved by the invention]

[0005] When adopting a configuration in which the tip of the metal terminal is bent as in the electronic component described in the above-mentioned Patent Document 1, it is possible to offset the variation in the height dimension of the electronic component by the amount of bending of the tip of the metal terminal. Therefore, the variation in the height dimension of the connection structure after mounting the electronic component is suppressed. On the other hand, when the tip of the metal terminal is bent at an acute angle toward the electronic component side, there is a problem that the solder is likely to shrink at the base end side of the bent part, i.e., the contact part side between the metal terminal and the mounting surface, when the solder paste located between the bent part and the mounting surface melts and solidifies. If the solder shrinks significantly at the base end side of the bent part, the joint area between the metal terminal and the mounting surface by the solder becomes insufficient, and the mounting position may become unstable.

[0006] The present disclosure has been made to solve the above-mentioned problems, and aims to provide electronic components, connection structures, and methods for manufacturing connection structures that can suppress variation in height dimensions during mounting and stabilize the mounting position. [Means for solving the problem]

[0007] An electronic component with metal terminals according to one aspect of the present disclosure comprises one or more electronic components having a base body and a pair of external electrodes provided on each of a pair of end faces of the base body that face each other in a first direction, and a pair of plate-shaped metal terminals having a joint joined to the external electrodes and a leg provided to protrude further than the electronic component in a second direction intersecting the first direction, each leg of the pair of metal terminals having an extension portion extending in the second direction continuous with the joint portion, a first bent portion bent from the tip of the extension portion toward the electronic component at a first angle that is an acute angle relative to the extension portion, and a second bent portion bent from the tip of the first bent portion at a second angle relative to the extension portion that is greater than the first angle.

[0008] In this electronic component with metal terminals, each leg of the pair of metal terminals has a first bent portion that is bent from the tip of the extension portion toward the electronic component at a first angle that is an acute angle with respect to the extension portion. This makes it possible to offset the variation in height dimension of the electronic component by the amount of bending of the bent portion at the tip of the metal terminal when the tip of the extension portion is abutted against the mounting surface, thereby suppressing the variation in height dimension during mounting. Also, in this electronic component with metal terminals, each leg of the pair of metal terminals has a second bent portion that is bent from the tip of the first bent portion at a second angle that is larger than the first angle with respect to the extension portion. By providing such a second bent portion, the solder paste located between the leg and the mounting surface during mounting is more likely to come into contact with the second bent portion and remain there, and the amount of solder shrinking toward the abutment portion between the metal terminal and the mounting surface can be suppressed. This makes it possible to ensure a sufficient bonding area between the metal terminal and the mounting surface by the solder, thereby stabilizing the mounting position.

[0009] The second angle may be a right angle, in which case the solder paste located between the leg and the mounting surface during mounting can more easily come into contact with the second bent portion, and the amount of solder shrinkage toward the contact portion between the metal terminal and the mounting surface can be more sufficiently suppressed.

[0010] The length of the second bent portion may be greater than the length of the first bent portion. By ensuring a sufficient length of the second bent portion, the solder paste located between the leg portion and the mounting surface during mounting can be more easily brought into contact with the second bent portion, and the amount of solder shrinkage toward the contact portion between the metal terminal and the mounting surface can be more sufficiently suppressed.

[0011] The tip of the second bent portion may be located closer to the electronic component than the tip of the extended portion. In this case, the tip of the second bent portion can be prevented from contacting the mounting surface when the tip of the extended portion is brought into contact with the mounting surface. This makes it possible to avoid impairing the effect of suppressing the variation in height dimension during mounting.

[0012] When viewed from the first direction, the second bent portion may be curved so that the electronic component side is convex. In this case, the solder shrinks toward the center in the second direction when the solder paste melts and solidifies, so that the mounting position in the second direction is stabilized.

[0013] A connection structure according to one aspect of the present disclosure is a connection structure formed by connecting the above-mentioned electronic component with metal terminals to a connected member, in which a tip of an extended portion of the metal terminal in the electronic component with metal terminals, a first bent portion, and a second bent portion are joined to a mounting surface of the connected member by solder.

[0014] In this connection structure, each leg of the pair of metal terminals has a first bent portion that is bent from the tip of the extending portion toward the electronic component at a first angle that is an acute angle with respect to the extending portion that continues from the joint portion and extends in the second direction. This makes it possible to offset the variation in height dimension of the electronic component by the amount of bending of the bent portion at the tip of the metal terminal when the tip of the extending portion is abutted against the mounting surface, thereby suppressing the variation in height dimension during mounting. Also, in this connection structure, each leg of the pair of metal terminals has a second bent portion that is bent from the tip of the first bent portion at a second angle that is larger than the first angle with respect to the extending portion. By providing such a second bent portion, the solder paste located between the leg and the mounting surface during mounting is more likely to come into contact with the second bent portion and remain there, and the amount of solder shrinking toward the abutting portion between the metal terminal and the mounting surface can be suppressed. This makes it possible to ensure a sufficient bonding area between the metal terminal and the mounting surface by the solder, thereby stabilizing the mounting position.

[0015] The second bent portion may have a portion parallel to the mounting surface of the connected component, in which case the solder paste between the leg and the mounting surface during mounting can more easily come into contact with the second bent portion, and the amount of solder shrinkage toward the contact portion between the metal terminal and the mounting surface can be more sufficiently suppressed.

[0016] A method for manufacturing a connection structure according to one aspect of the present disclosure is a method for manufacturing a connection structure formed by connecting the above-mentioned electronic component with metal terminals to a connected member, and includes a first step of abutting a tip of an extended portion of a metal terminal of the electronic component with metal terminal against a mounting surface of the connected member on which solder paste is disposed, and a second step of melting and solidifying the solder paste while the solder paste is in contact with the tip of the extended portion of the metal terminal, the first bent portion, and the second bent portion, thereby joining the leg of the metal terminal to the mounting surface of the connected member.

[0017] In this method for manufacturing a connection structure, when the tip of the extension portion is brought into contact with the mounting surface, the variation in height dimension of the electronic component can be offset by the amount of bending of the bent portion of the tip of the metal terminal, thereby suppressing the variation in height dimension during mounting. Furthermore, by bringing the solder paste into contact with the tip of the extension portion of the metal terminal, the first bent portion, and the second bent portion, the solder paste located between the leg portion and the mounting surface during mounting tends to remain in place, and the amount of solder shrinking toward the contact portion between the metal terminal and the mounting surface can be suppressed. Therefore, it is possible to ensure a sufficient bonding area between the metal terminal and the mounting surface by the solder, and the mounting position is stabilized.

[0018] In the second step, the second bent portion may be formed with a portion parallel to the mounting surface of the connected component. In this case, the solder paste located between the leg and the mounting surface during mounting can more easily come into contact with the second bent portion, and the amount of solder shrinkage toward the contact portion between the metal terminal and the mounting surface can be more sufficiently suppressed. Effect of the Invention

[0019] According to the present disclosure, it is possible to suppress variations in height dimension during mounting, and to stabilize the mounting position. [Brief description of the drawings]

[0020] [Figure 1] 1 is a perspective view showing an example of a connection structure formed using an electronic component with a metal terminal according to one aspect of the present disclosure. [Diagram 2]FIG. 2 is a side view of FIG. [Diagram 3] FIG. 2 is a plan view of FIG. [Figure 4] FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. [Diagram 5] 4 is an enlarged side view showing the periphery of the leg of the metal terminal. FIG. [Figure 6] 5(a) to 5(c) are enlarged side views of a main part illustrating a manufacturing process of the connection structure according to the present embodiment. [Figure 7] 5(a) and 5(b) are enlarged side views of a main part showing a manufacturing process of a connection structure according to a comparative example. [Figure 8] 13(a) to 13(c) are enlarged side views showing the periphery of a leg of an electronic component with a metal terminal according to a modified example. [Figure 9] 8(b) is an enlarged side view of a main portion showing a configuration example of a connection structure when the modified example shown in FIG. 8(b) is used. [Figure 10] 13 is an enlarged side view of a main portion showing the periphery of a leg of an electronic component with a metal terminal according to another modified example. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0021] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of an electronic component with a metal terminal, a connection structure, and a method for manufacturing a connection structure according to one aspect of the present disclosure will be described in detail with reference to the drawings.

[0022] Fig. 1 is a perspective view showing an example of a connection structure formed using an electronic component with a metal terminal according to one aspect of the present disclosure. Fig. 2 is a side view of Fig. 1, and Fig. 3 is a plan view of Fig. 1. The connection structure 1 shown in Figs. 1 to 3 is formed by electrically connecting an electronic component 2 to a pad (mounting surface) 4 of a connected member 3. The electronic component 2 is, for example, a chip-type electronic component such as a multilayer ceramic capacitor. The connected member 3 is, for example, another electronic component, a circuit member, a printed circuit board, etc.

[0023] For electrical connection to the connected member 3, the electronic component 2 is configured as an electronic component 11 with metal terminals. The electronic component 11 with metal terminals has one or more electronic components 2 held by a pair of plate-shaped metal terminals 12, 12. In this embodiment, the electronic component 11 with metal terminals has an array 13 in which two electronic components 2 are arranged along the extending direction of the pads 4. The pair of metal terminals 12, 12 are arranged facing each other in a direction perpendicular to the arrangement direction of the electronic components 2 in the array 13. The array 13 has electronic components 2, 2 adjacent to each other in the Y direction and an insulating member 14 (see FIGS. 1 and 3) arranged between the electronic components 2, 2. In the following description, the opposing direction of the pair of metal terminals 12, 12 is the X direction, the arrangement direction of the electronic components 2 in the array 13 is the Y direction, and the direction connecting the electronic component 2 and the pad 4 is the Z direction. For convenience of description, the pad 4 side may be referred to as the bottom, and the opposite side of the pad 4 as the top.

[0024] As shown in Figs. 1 to 3, the electronic component 2 includes an element body 21 and a pair of external electrodes 22, 22 arranged on the outer surface of the element body 21. The element body 21 has a rectangular parallelepiped shape. The rectangular parallelepiped shape may include a shape in which the corners and ridges are chamfered and a shape in which the corners and ridges are rounded. The element body 21 has a pair of end faces 21a, 21a in the longitudinal direction (see Figs. 2 and 3), a pair of end faces 21b, 21b in the height direction, and a pair of end faces 21c, 21c in the width direction. The opposing direction of the end faces 21a, 21a is a first direction of the present disclosure, which coincides with the X direction. The opposing direction of the end faces 21b, 21b is a second direction of the present disclosure, which coincides with the Z direction. The opposing direction of the end faces 21c, 21c is perpendicular to the first direction and the second direction, and coincides with the Y direction.

[0025] The element body 21 is formed by stacking a plurality of dielectric layers in a predetermined direction. In the element body 21, the stacking direction of the plurality of dielectric layers coincides with the Y direction. Each dielectric layer is formed by a sintered body of a ceramic green sheet containing a dielectric material. Examples of the dielectric material include dielectric ceramics such as BaTiO3-based, Ba(Ti,Zr)O3-based, and (Ba,Ca)TiO3-based. In the actual element body 21, each dielectric layer is integrated to such an extent that the boundaries between the dielectric layers are not visible.

[0026] As shown in FIG. 4, a plurality of internal electrodes 23A, 23B are arranged inside the element body 21. The internal electrodes 23A, 23B are made of a conductive material that is typically used as an internal electrode for a multilayer electric element. The internal electrodes 23A, 23B are made of a sintered body of a conductive paste containing a conductive material. Examples of the conductive material include base metals such as Ni and Cu. In this embodiment, Ni is used as the conductive material.

[0027] The internal electrodes 23A, 23B have mutually different electrical polarities. They are alternately arranged at a fixed interval in the Y direction within the element body 21. The internal electrodes 23A, 23B have opposing portions that face each other in the Z direction. The internal electrode 23A is drawn to one end face 21a and exposed at the one end face 21a. The internal electrode 23B is drawn to the other end face a and exposed at the other end face 21a.

[0028] The pair of external electrodes 22, 22 have mutually different electrical polarities. One of the external electrodes 22, 22 is a positive electrode, and the other is a negative electrode. As shown in Figs. 1 to 3, the external electrode 22 is provided so as to cover the end face 21a of the element body 21. The external electrode 22 has electrode portions that protrude to the end faces 21b, 21b and the end faces 21c, 21c. In other words, the external electrode 5 is formed over five faces including the end faces 21b, 21b and the end faces 21c, 21c, with the end face 3a at the center. These electrode portions are joined at the ridges of the element body 21 and are electrically connected.

[0029] An electrode portion of the external electrode 22 covering one end face 21a is arranged so as to cover an exposed portion of the internal electrode 23 at the one end face 21a. Similarly, an electrode portion of the external electrode 22 covering the other end face 21a is arranged so as to cover an exposed portion of the internal electrode 23 at the other end face 21a. In this way, each of the internal electrodes 23A and 23B is electrically connected to the corresponding external electrode 5.

[0030] The external electrode 22 may be configured to include a first electrode layer on the element body 21 side and a second electrode layer on the opposite side (external surface side) to the element body 21. The first electrode layer may be formed, for example, by baking a conductive paste applied to the surface of the element body 21. The first electrode layer is a sintered metal layer formed by sintering a metal component (metal powder) contained in the conductive paste. The first electrode layer may be a sintered metal layer made of Cu or may be a sintered metal layer made of Ni. The conductive paste may be a mixture of powder made of Cu or Ni, a glass component, an organic binder, and an organic solvent. The second electrode layer may be formed on the first electrode layer by, for example, a plating method. The second electrode layer may include, for example, a Ni plating layer formed on the first electrode layer and a Sn plating layer formed on the Ni plating layer.

[0031] The electronic component 2 having the above configuration is arranged so that the end faces 21a, 21a and the end faces 21c, 21c are perpendicular to the pad 4 and the end faces 21b, 21b are parallel to the pad 4. One end face 21b is an opposing face facing the pad 4. In the array 13, the electronic components 2, 2 are arranged so that one end face 21c of one electronic component 2 and the other end face 21c of the other electronic component 2 face each other via the insulating member 14. The electronic components 2, 2 are also arranged so that both end positions in the X direction and both end positions in the Z direction coincide with each other.

[0032] The insulating member 14 is made of an insulating resin such as an epoxy resin. The insulating member 14 may be made of an insulating plastic, ceramic, or glass. The insulating member 14 is, for example, an insulating film or an insulating sheet having a rectangular shape similar to that of the end face 21c. The insulating member 14 is sandwiched between the electronic components 2, 2 adjacent to each other in the arrangement direction, and is in contact with each of the electronic components 2, 2. The insulating member 14 may be bonded to at least one of the electronic components 2, 2. The insulating member 14 does not necessarily have to be disposed.

[0033] The pair of metal terminals 12, 12 are each formed into a plate shape from a metal material having electrical conductivity. Examples of the metal material include iron, nickel, copper, silver, and alloys containing these. The metal terminal 12 has a joint 31 joined to the external electrode 22 and a leg 32 provided to protrude beyond the electronic component 2 in the Z direction.

[0034] The joint 31 has a rectangular shape with dimensions that overlap one of the external electrodes 22, 22 of each of the electronic components 2, 2 when viewed from the X direction. A joint member 33 (see Figs. 2 and 3) is used to join the joint 31 and the external electrodes 22, 22. The joint member 33 is conductive and electrically connects the joint 31 and the external electrodes 22, 22. For example, solder or a conductive adhesive can be used as the joint member 33. For example, a conductive adhesive made of a resin such as a thermosetting resin and a conductive filler such as Ag can be used as the conductive adhesive. For example, a phenol resin, an acrylic resin, a silicone resin, an epoxy resin, a polyimide resin, or the like can be used as the thermosetting resin.

[0035] The joint 31 is provided with a pair of upper and lower arms 34, 35 that sandwich the electronic component 2 in the Z direction. The arms 34, 35 protrude from the joint 31 toward the electronic component 2 along the X direction. The lower arm 34 is provided at the lower part of the joint 31 in correspondence with one end face 21b that faces the pad 4. The width of the lower arm 34 in the Y direction is, for example, smaller than the width of the electronic component 2 in the Y direction. The lower arm 34 is formed by cutting a part of the joint 31 into a rectangular shape except for the lower side, and bending the cut piece toward the electronic component 2.

[0036] The upper arm portion 35 is provided at the upper end of the joint portion 31 in correspondence with the other end surface 21b located opposite to the pad 4. The width of the upper arm portion 35 in the Y direction is approximately the same as the width of the lower arm portion 35 in the Y direction. The electronic component 2 is sandwiched between the arm portions 34, 35, so that the electronic component 2, 2 is held by the metal terminals 12, 12. The arm portions 34, 35 are provided at their tips with tip pieces 34a, 35a that open in the Z direction relative to the base end side. The tip pieces 34a, 35a function as guides when inserting the electronic component 2 between the arm portions 34, 35.

[0037] 1, at least one through hole 36 is provided in the joint 31 in a region facing the external electrode 22. The through hole 36 is used, for example, to inject a bonding member 33 between the joint 31 and the external electrode 22. The through hole 36 is also used to check the bonding state between the joint 31 and the external electrode by the bonding member 33.

[0038] 1, the joint 31 is provided with a plurality of protrusions 37 that protrude toward the external electrode 22. These protrusions 37 reduce the contact area between the joint 31 and the external electrode 22, and suppress the transmission of vibrations generated in the electronic component 2 to the pad 4 through the metal terminal 12. In addition, these protrusions 37 make it possible to provide a gap between the joint 31 and the external electrode 22 according to the amount of protrusion of the protrusions 37. This allows the joint material 33 to be sufficiently filled between the joint 31 and the external electrode 22.

[0039] The leg portion 32 is a portion that is joined to the pad 4 by solder H. The leg portion 32 has an extending portion 41 that is continuous with the joint portion 31, a first bent portion 42 that bends from the tip of the extending portion 41 toward the electronic component 2, and a second bent portion 43 that bends from the tip of the first bent portion 42. The extending portion 41 extends in the Z direction from the lower end of the joint portion 31 with the same width as the joint portion 31. There is no particular limit to the length of the extending portion 41 in the Z direction, but in this embodiment, it is longer than the length of the arm portions 34, 35 in the X direction.

[0040] As shown in FIG. 1, at least one slit 45 is provided near the boundary between the joint 31 and the extension 41. The slit 45 extends in the Y direction corresponding to each of the electronic components 2, 2. The width of the slit 45 in the Y direction is, for example, approximately the same as or slightly larger than the width of the arm portions 34, 35 in the Y direction. The position of the slit 45 in the Z direction is lower than the position of the lower arm portion 34. The slit 45 prevents the solder H that joins the metal terminal 12 and the pad 4 from creeping up from the leg portion 32 to the joint 31. The slit 45 prevents the solder H from creeping up, thereby preventing a solder bridge from occurring between the leg portion 32 and the lower arm portion 34.

[0041] FIG. 5 is an enlarged side view of a main part showing the periphery of the leg of the metal terminal. In the figure, the periphery of the leg 32 of one metal terminal 12 is shown, but the periphery of the leg of the other metal terminal 12 has a similar structure (a structure symmetrical with respect to the center of the X direction of the electronic component 2). As shown in FIG. 5, the first bent portion 42 is bent from the tip of the extended portion 41 toward the electronic component 2 at a first angle θ1 that is an acute angle with respect to the extended portion 41. Therefore, the extended portion 41 and the first bent portion 42 form a V shape when viewed from the Y direction. In this embodiment, the first angle θ1 is, for example, 30° or more and less than 90°. The first angle θ1 may be 30° or more and 80° or less. In the first bent portion 42, the distance from the pad 4 increases from the base end 42a side (the tip 41a side of the extended portion 41) toward the tip 42b side (the base end side of the second bent portion 43).

[0042] The second bent portion 43 is bent from the tip of the first bent portion 42 at a second angle θ2 larger than the first angle θ1 with respect to the extending portion 41. Here, the second angle θ2 is a right angle. Therefore, the second bent portion 43 is perpendicular to the extending portion 41 and parallel to the pad 4. The tip 43b of the second bent portion 43 is a free end. In the second bent portion 43, the distance from the pad 4 is constant from the base end 43a side (the tip 42b side of the first bent portion 42) to the tip 43b side (the free end of the second bent portion 43). The tip 43b of the second bent portion 43 is located closer to the electronic component 2 than the tip 41a of the extending portion 41. That is, the tip 41a of the extending portion 41 is the lowest point of the leg 32.

[0043] The length W2 of the second bent portion 43 is greater than the length W1 of the first bent portion 42. When the length W1 of the first bent portion 42 is 1, the length W2 of the second bent portion 43 is, for example, 1.5 to 5.0. In this embodiment, the projected length W2a of the second bent portion 43 in the X direction is also greater than the projected length W1a of the first bent portion 42 in the X direction. The first bent portion 42 and the second bent portion 43 extend longer in the X direction than the arm portions 34, 35, and the tip 43b of the second bent portion 43 is located closer to the center of the electronic component 2 in the X direction than the tips of the arm portions 34, 35 (see FIG. 2).

[0044] The leg 32 and the pad 4 are joined by, for example, reflow soldering. In this embodiment, the solder H can be formed using, for example, a Sn-Ag-Cu based solder paste Hp (see FIG. 6(a) and the like). In this case, the solder paste Hp contains Sn, Ag, Cu, and flux. The solder paste Hp may also contain a solvent. The flux can be, for example, rosin.

[0045] The solder H is formed between the tip 41a of the extension portion 41, the tip outer surface side (opposite side to the first bent portion 42 and the second bent portion 43), and the tip inner surface side (side where the first bent portion 42 and the second bent portion 43 are formed) and the pad 4. The solder H provides an electrical connection between the metal terminal 12 and the pad 4. The solder H on the tip outer surface side of the extension portion 41 is formed so as to fill the corner formed by the tip 41a of the extension portion 41 and the pad 4. The solder H on the tip inner surface side of the extension portion 41 is formed so as to fill the gap between the first bent portion 42 and the pad 4 and the gap between the second bent portion 43 and the pad 4, except for the tip 43b side of the second bent portion 43.

[0046] 6(a) to 6(c) are enlarged side views of a main part showing the manufacturing process of a connection structure according to an embodiment. In forming the connection structure 1, first, as shown in FIG. 6(a), an electronic component 11 with metal terminals and a connected member 3 having solder paste Hp arranged on its pad 4 are prepared. The solder paste Hp is applied to the surface of the pad 4 by, for example, a printing method in a predetermined thickness. The thickness of the solder paste Hp is approximately the same as the distance between the second bent portion 43 and the pad 4 when the tip 41a of the extension portion 41 of the metal terminal 12 is brought into contact with the pad 4 in, for example, the next first step.

[0047] 6(b), the tip 41a of the extension portion 41 of the metal terminal 12 of the electronic component 11 with metal terminals is brought into contact with the pad 4 of the connected member 3 on which the solder paste Hp is placed (first step). With the tip 41a of the extension portion 41 of the metal terminal 12 in contact with the pad 4, the solder paste Hp is brought into contact with each of the tip 41a, the first bent portion 42, and the second bent portion 43 of the extension portion 41 of the metal terminal 12.

[0048] Next, as shown in Fig. 6(c), the solder paste Hp is melted and solidified in a state where it is in contact with the tip 41a of the extension portion 41 of the metal terminal 12, the first bent portion 42, and the second bent portion 43, and the leg portion 32 of the metal terminal 12 is joined to the pad 4 of the connected member 3 (second process). Here, for example, the metal terminal 12 is heated to melt the Sn-Ag-Cu solder contained in the solder paste Hp. The molten solder paste Hp is cooled and solidified to form the solder H. The leg portion 32 of the metal terminal 12 is joined to the pad 4 by the solder H, and the connection structure 1 shown in Fig. 1 is formed.

[0049] As described above, in electronic component 11 with metal terminals, each leg 32 of a pair of metal terminals 12, 12 has a first bent portion 42 that bends from tip 41a of extension portion 41 toward electronic component 2 at a first angle θ1 that is an acute angle with respect to extension portion 41. This makes it possible to offset variations in the height dimension of electronic component 2 by the amount of bending of first bent portion 42 and second bent portion 43 at the tip of metal terminal 12 when tip 41a of extension portion 41 is brought into contact with pad 4, thereby suppressing variations in the height dimension of connection structure 1 during mounting.

[0050] Furthermore, in electronic component 11 with metal terminals, leg 32 of each of a pair of metal terminals 12, 12 has second bent portion 43 that is bent from tip 42b of first bent portion 42 at a second angle θ2 larger than the first angle θ1 with respect to extension portion 41. By providing such second bent portion 43, solder H located between leg 32 and pad 4 during mounting comes into contact with second bent portion 43 and tends to remain there, and the amount of shrinkage of solder H toward the contact portion between tip 41a of extension portion 41 and pad 4 can be suppressed.

[0051] 7(a) and 7(b) are enlarged side views of a main part showing the manufacturing process of a connection structure according to a comparative example. In the electronic component with a metal terminal according to the comparative example, as shown in FIG. 7(a), a leg 132 of the metal terminal has only an extending portion 141 and a first bent portion 142. In this case, when a tip 141a of the extending portion 141 is brought into contact with a pad 4 of a connected member 3 on which solder paste Hp is arranged, the solder paste Hp on the inner surface side of the tip of the extending portion 141 comes into contact only with the base end side of the first bent portion 142.

[0052] When the solder paste Hp is melted and solidified in this state, as shown in FIG. 7(b), the solder H tends to shrink toward the contact portion between the tip 141a of the extension portion 141 and the pad 4. If the solder H shrinks significantly toward the contact portion between the tip 141a of the extension portion 141 and the pad 4, the bonding area between the metal terminal and the pad 4 by the solder H is considered to be insufficient. In addition, since the volume of the solder H is biased toward the outer tip surface side rather than the inner tip surface side of the extension portion 141, the leg 132 is easily pulled toward the outside of the electronic component in the X direction. Therefore, the mounting position of the electronic component with metal terminals may become unstable.

[0053] In contrast, in the electronic component with metal terminals 11 according to this embodiment, the amount of shrinkage of the solder H on the side of the contact portion between the tip 41a of the extension portion 41 and the pad 4 can be suppressed, so that the bonding area between the metal terminal 12 and the pad 4 by the solder H can be sufficiently secured. In addition, because the volume of the solder H can be sufficiently secured on the inner side of the tip of the extension portion 41, it is also possible to suppress the leg portion 32 of the metal terminal 12 from being pulled outward from the electronic component 2 in the X direction. Therefore, the mounting position of the electronic component with metal terminals 11 in the X direction can be stabilized.

[0054] In this embodiment, the second angle θ2 of the second bent portion 43 with respect to the extending portion 41 is a right angle. This makes it easier for the solder paste Hp located between the leg portion 32 and the pad 4 to come into contact with the second bent portion 43 during mounting, and makes it possible to more sufficiently suppress the amount of shrinkage of the solder H toward the contact portion between the tip 41a of the extending portion 41 and the pad 4.

[0055] In this embodiment, the length W2 of the second bent portion 43 is greater than the length W1 of the first bent portion 42. By ensuring a sufficient length W2 of the second bent portion 43, the solder paste Hp located between the leg portion 32 and the pad 4 during mounting can be more easily brought into contact with the second bent portion 43, and the amount of shrinkage of the solder H toward the contact portion between the tip 41a of the extension portion 41 and the pad 4 can be more sufficiently suppressed.

[0056] In this embodiment, the tip 43b of the second bent portion 43 is located closer to the electronic component 2 than the tip of the extending portion 41. This makes the tip 41a of the extending portion 41 the lowest point of the leg 32 in the Z direction, so that it is possible to prevent the tip 43b of the second bent portion 43 from hitting the pad 4 when the tip 41a of the extending portion 41 is brought into contact with the pad 4. This makes it possible to avoid impairing the effect of suppressing the variation in height dimension during mounting.

[0057] The present disclosure is not limited to the above embodiment. For example, in the above embodiment, the second angle θ2 of the second bent portion 43 with respect to the extending portion 41 is a right angle, but the second angle θ2 does not necessarily have to be a right angle, and may be larger than the first angle θ1 of the first bent portion 42 with respect to the extending portion 41. As shown in FIG. 8(a), the second angle θ2 may be an acute angle, and as shown in FIG. 8(b), the second angle θ2 may be an obtuse angle. Even if the second angle θ2 is an obtuse angle, it is preferable that the tip 43b of the second bent portion 43 is located closer to the electronic component 2 than the tip of the extending portion 41. Also, as shown in FIG. 8(c), the first angle θ1 of the first bent portion 42 with respect to the extending portion 41 may be substantially 0° (parallel to the extending portion 41). In this case, the second angle θ2 may be any of a right angle, an acute angle, and an obtuse angle.

[0058] 8(a) and 8(b), when the second angle θ2 is not a right angle, the second bent portion 43 may have a portion that is parallel to the pad 4 of the connected member 3 when connecting the electronic component 11 with metal terminals to the connected member 3. FIG. 9 is an enlarged side view of a main part showing an example of the configuration of the connection structure 1 when the second bent portion 43 has the configuration shown in FIG. 8(b). In the example of the same figure, the extension portion 41 is inclined outward in the X direction with respect to the pad 4, so that the entire second bent portion 43 can be made parallel to the pad 4.

[0059] This makes it easier for the solder paste Hp located between the leg 32 and the pad 4 to come into contact with the second bent portion 43 during mounting, similar to when the second angle θ2 of the second bent portion 43 relative to the extending portion 41 is a right angle, and makes it possible to more sufficiently suppress the amount of shrinkage of the solder H toward the contact portion between the tip 41a of the extending portion 41 and the pad 4. Although not shown, when the second bent portion 43 has the configuration shown in Fig. 8(a), the extending portion 41 can be tilted inward in the X direction relative to the pad 4 to make the entire second bent portion 43 parallel to the pad 4.

[0060] In the above embodiment, the length W2 of the second bent portion 43 is longer than the length W1 of the first bent portion 42, but the relationship between the lengths W1 and W2 is not limited to this. The length W2 of the second bent portion 43 may be equal to the length W1 of the first bent portion 42, or may be shorter than the length W1 of the first bent portion 42.

[0061] 10, when viewed from the X direction, the second bent portion 43 may be curved so that the electronic component 2 side is convex. In this case, the solder H shrinks toward the center in the Y direction when the solder paste Hp melts and solidifies, so that the leg 32 of the metal terminal 12 can be prevented from being pulled outward from the electronic component 2 in the Y direction. This stabilizes the mounting position of the electronic component 11 with metal terminals in the Y direction. In the example of FIG. 10, the second bent portion 43 has a flat convex top surface, but is not limited to this shape, and may be, for example, a convex shape that is gently curved so as to draw an arc as a whole.

[0062] In the above embodiment, a multilayer capacitor is exemplified as the electronic component 2, but electronic components to which the present disclosure can be applied are not limited to multilayer capacitors. For example, the present disclosure can be applied to multilayer electronic components such as multilayer inductors, multilayer varistors, multilayer piezoelectric actuators, multilayer thermistors, and multilayer composite components, as well as electronic components other than multilayer electronic components. [Explanation of symbols]

[0063] 1...connection structure, 2...electronic component, 3...connected member, 4...pad (mounting surface), 11...electronic component with metal terminal, 12...metal terminal, 21...element body, 21a...end face, 22...external electrode, 31...joint, 32...leg, 41...extension portion, 41a...tip, 42...first bent portion, 42b...tip, 43...second bent portion, 43b...tip, θ1...first angle, θ2...second angle, H...solder, Hp...solder paste.

Claims

1. one or more electronic components each including an element body and a pair of external electrodes provided on a pair of end faces of the element body facing each other in a first direction; a pair of plate-shaped metal terminals each having a joint portion joined to the external electrode and a leg portion provided so as to protrude beyond the electronic component in a second direction intersecting the first direction, The legs of each of the pair of metal terminals are a flat extending portion extending continuously from the joint portion in the second direction; a flat first bent portion bent from a tip of the extension portion toward the electronic component at a first angle that is an acute angle with respect to the extension portion; a second bent portion bent from a tip of the first bent portion at a second angle relative to the extension portion that is greater than the first angle, the second bent portion being flat at least in the extension direction.

2. 2. The electronic component with metal terminals according to claim 1, wherein the second angle is a right angle.

3. 3. The electronic component with metal terminals according to claim 1, wherein the length of the second bent portion is greater than the length of the first bent portion.

4. 4. The electronic component with metal terminals according to claim 1, wherein a tip of the second bent portion is located closer to the electronic component than a tip of the extending portion.

5. 5. The electronic component with metal terminals according to claim 1, wherein the second bent portion is curved so that the electronic component side is convex when viewed from the first direction.

6. A connection structure obtained by connecting the electronic component with a metal terminal according to any one of claims 1 to 5 to a member to be connected, A connection structure in which the tip of the extended portion of the metal terminal in the electronic component with metal terminal, the first bent portion, and the second bent portion are joined to the mounting surface of the connected member by solder.

7. 7. The connection structure according to claim 6, wherein the second bent portion has a portion that is parallel to a mounting surface of the connected member.

8. A method for producing a connection structure comprising connecting the electronic component with a metal terminal according to any one of claims 1 to 5 to a member to be connected, comprising the steps of: a first step of contacting a tip of the extension portion of the metal terminal of the electronic component with metal terminals with a mounting surface of the connected member on which solder paste is arranged; a second step of joining the leg of the metal terminal to the mounting surface of the connected member by melting and solidifying the solder paste while the solder paste is in contact with the tip of the extended portion of the metal terminal, the first bent portion, and the second bent portion.

9. The method for manufacturing a connection structure according to claim 8 , wherein in the second step, a portion that is parallel to a mounting surface of the member to be connected is formed in the second bent portion.

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