Component mounter and component mounting position deviation determination method

Abstract

According to the present invention, a component E is imaged from an image capturing direction A inclined to a substrate B on which a component E is mounted, to acquire a component inspection image Ii including an upper surface Su and a side surface Ss of the component E, thereby identifying a boundary Sb1 (first boundary) which is between the upper surface Su and the side surface Ss of the component E and which is included in the component inspection image Ii. This configuration makes it possible to determine the presence or absence of positional deviation of the component E mounted on the substrate B through an easy operation of confirming whether the boundary Sb1, which is between the upper surface Su and the side surface Ss of the component E imaged by imaging the component E from an oblique direction, is within an allowable edge range Rb1. Thus, even with a simple component inspection camera 7 (image capturing unit) provided to the component mounting device 1, it is possible to determine the presence or absence of positional deviation of the component E mounted on the substrate B.

Description

[Technical field]

[0001] The present invention relates to a technique for determining misalignment of a component mounted on a board. [Background technology]

[0002] To produce boards on which components are mounted, component mounters such as those shown in Patent Documents 1 and 2 can be used. These component mounters have a mounting head that picks up components, and the mounting head picks up components from a pocket of a component supply tape and transfers them to lands on the board, thereby mounting the components on the board. With such component mounters, as shown in Patent Document 1, there are cases in which the components are mounted on the board in a state where they are misaligned with respect to the lands. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 4617998 [Patent Document 2] JP 2019-36015 A Summary of the Invention [Problem to be solved by the invention]

[0004] Therefore, it is conceivable to configure the component mounter so that an imaging unit that captures an image of a component mounted on a board is provided in the component mounter, and the presence or absence of misalignment of the component with respect to the board can be determined based on the image captured by the imaging unit. However, it is not necessarily easy to provide a component mounter with a high-precision imaging function provided in a dedicated inspection device such as the component mount inspection device of Patent Document 1, because it would result in an increase in cost, installation space, or weight.

[0005] The present invention has been made in consideration of the above-mentioned problems, and aims to provide a technology that can determine whether or not a component mounted on a board is misaligned, even using an imaging unit with a simple mechanism provided in a component mounting machine. [Means for solving the problem]

[0006] The component mounting machine of the present invention includes a board holding unit that holds a board on which a component having a top surface and a side surface is mounted, an imaging unit that obtains an image including the top surface and side surface of the component by imaging the component from an inclined direction relative to the board held by the board holding unit, a boundary identification unit that identifies a first boundary that is the boundary between the top surface and side surface of the component included in the image captured by the imaging unit, and a misalignment determination unit that determines whether or not the component is misaligned with the board based on the result of confirming whether or not the first boundary is within a first position range that indicates the acceptable range for the position of the first boundary with respect to the board.

[0007] The component mounting position misalignment determination method of the present invention includes the steps of: acquiring an image including the top and side surfaces of the component by having an imaging unit image the component from an inclined direction relative to the board on which the component is mounted; identifying a first boundary that is the boundary between the top and side surfaces of the component included in the image; and determining whether or not the component is misaligned relative to the board based on the results of checking whether or not the first boundary is within a first position range that indicates an acceptable range for the position of the first boundary relative to the board.

[0008] In the present invention (component mounter and component mounting misalignment determination method) configured as described above, an image including the top and side of the component is acquired by capturing an image of the component from an inclined direction with respect to the board on which the component is mounted, and a first boundary, which is a boundary between the top and side of the component included in the image, is identified. In this way, an image including the top and side of the component mounted on the board, in other words an image including the first boundary between the top and side of the component, can be acquired by capturing an image of the component from an oblique angle, and the first boundary, which is a boundary between the top and side of the component included in the image, can be identified. Then, based on the result of confirming whether the first boundary is within a first position range indicating an allowable range of the position of the first boundary with respect to the board, the presence or absence of misalignment of the component with respect to the board is determined. In this configuration, the presence or absence of misalignment of the component mounted on the board can be determined by a simple operation of capturing an image of the component from an oblique angle and confirming whether the first boundary between the top and side of the captured component is within the allowable range (first position range). In this way, even an imaging unit with a simple mechanism provided in the component mounter can determine the presence or absence of misalignment of the component mounted on the board.

[0009] The mounter may be configured such that the first position range is a first angle range indicating an allowable range of the angle of the first boundary with respect to the board, and the misalignment determination unit determines the presence or absence of misalignment of the component with respect to the board based on the result of checking whether the angle of the first boundary with respect to the board is within the first angle range. In this configuration, the presence or absence of misalignment of the component mounted on the board can be determined by a simple operation of checking whether the angle of the first boundary is within the allowable range (first angle range).

[0010] The component mounter may further include a component supply unit that supplies components, a mounting head that grips the components supplied by the component supply unit and mounts them on the board held by the board holding unit, and a gripping position acquisition unit that acquires the positional relationship between the mounting head and the components gripped by the mounting head, and the misalignment determination unit determines the first position range based on the positional relationship. With this configuration, it is possible to accurately determine whether or not there is misalignment of the components mounted on the board depending on the position at which the mounting head grips the components.

[0011] The component mounter may be further configured to include a board warpage acquisition unit that acquires the warpage of the board held by the board holder, and the misalignment determination unit determines the first position range based on the warpage of the board. With this configuration, it is possible to accurately determine whether or not there is misalignment of the components mounted on the board depending on the warpage of the board.

[0012] The component mounter may be configured so that the component has an electrode and a main body adjacent to the electrode, the imaging unit acquires an image including the electrode and the main body, the boundary specifying unit specifies a second boundary between the electrode and the main body included in the image captured by the imaging unit, and the misalignment determination unit determines whether or not the component is misaligned with respect to the board based on the result of checking whether or not the second boundary is within a second position range indicating an allowable range for the position of the second boundary with respect to the board. In this configuration, the presence or absence of misalignment of the component mounted on the board can be determined by a simple operation of checking whether the second boundary between the electrode and the main body of the component captured by the imaging unit is within the allowable range (second position range).

[0013] The component mounter may be configured such that the second position range is a second angle range indicating an allowable range of the angle of the second boundary with respect to the board, and the misalignment determination unit determines whether or not there is misalignment of the component with respect to the board based on whether or not the angle of the second boundary with respect to the board is within the second angle range. In this configuration, the presence or absence of misalignment of the component mounted on the board can be determined by a simple operation of checking whether or not the angle of the second boundary is within the allowable range (second angle range). Effect of the Invention

[0014] According to the present invention, even with an imaging unit having a simple mechanism provided in a component mounter, it is possible to determine whether or not a component mounted on a board is misaligned. [Brief description of the drawings]

[0015] [Figure 1] FIG. 1 is a plan view showing a schematic configuration of an example of a component mounter according to the present invention. [Diagram 2]2 is a perspective view showing a schematic diagram of a component mounted on a board by the component mounter of FIG. 1; [Diagram 3] FIG. 2 is a block diagram showing an electrical configuration of the component mounter of FIG. 1. [Figure 4] FIG. 2 is a diagram illustrating a part inspection camera attached to a head unit. [Diagram 5] 4 is a flowchart showing an example of mounting processing executed by the component mounter of FIG. [Figure 6] 6 is a flowchart showing an example of a positional deviation determination executed in the mounting process of FIG. 5 . [Figure 7] 7 is a diagram showing an example of image processing executed in the positional deviation determination of FIG. 6; [Figure 8] 7 is a diagram showing an example of image processing executed in the positional deviation determination of FIG. 6; [Figure 9] 1. FIG. 4 is a block diagram showing a modified example of the electrical configuration of the component mounter of FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] Fig. 1 is a plan view showing a schematic configuration of an example of a component mounter according to the present invention. Fig. 2 is a perspective view showing a schematic configuration of a component mounted on a board by the component mounter of Fig. 1. Fig. 3 is a block diagram showing an electrical configuration of the component mounter of Fig. 1. In Figs. 1 and 2 and the following figures, the X direction which is a horizontal direction, the Y direction which is a horizontal direction perpendicular to the X direction, and the Z direction which is a vertical direction are shown as appropriate.

[0017] The component mounter 1 mounts small piece-like components E, such as integrated circuits, transistors, and capacitors, on a board B. In the example shown in Fig. 2, the component E has a rectangular parallelepiped outer shape, and has a main body Eb and two electrodes Ee that sandwich the main body Eb. Thus, two lands Bl are provided on the board B in correspondence with the two electrodes Ee adjacent to both ends of the component E, and the two electrodes Ee are each placed on the two lands Bl, thereby mounting the component E on the board B.

[0018] Component E has a bottom surface Sl and a top surface Su that are parallel to each other, and is mounted on substrate B with the bottom surface Sl facing downward and the top surface Su facing upward. Component E has a side surface Ss extending between an edge of the bottom surface Sl and an edge of the top surface Su, and the side surface Ss of component E mounted on substrate B faces horizontally. On the top surface Su of component E, electrodes Ee appear at both ends, and the body Eb appears between these electrodes Ee. Similarly, on the side surface Ss of component E, electrodes Ee appear at both ends, and the body Eb appears between these electrodes Ee.

[0019] As shown in FIG. 3, the component mounter 1 includes a controller 100 that controls the entire device. The controller 100 includes an arithmetic processing unit 110, which is a processor including a CPU (Central Processing Unit) and a RAM (Random Access Memory), and a storage unit 120 including a HDD (Hard Disk Drive) or an SSD (Solid State Drive). The storage unit 120 stores component outer shape data De that indicates the outer shape of the component E. The component outer shape data De indicates the length of each side of the rectangular parallelepiped that constitutes the outer shape of the component E, the width of the electrodes Ee, and the like. The controller 100 also includes a drive control unit 130 that controls the drive system of the component mounter 1, and an image capture control unit 140 that controls the capture of the component E by cameras 6 and 7, which will be described later. The component mounter 1 also includes a UI (User Interface) 150. The UI 150 is configured by, for example, a touch panel display, and the arithmetic processing unit 110 displays the operating status of the component mounter 1 on the UI 150 and receives instructions inputted to the UI 150 by an operator.

[0020] As shown in Fig. 1, the component mounter 1 includes a transport unit 12 that transports a board B in the X direction (board transport direction). The transport unit 12 has a pair of conveyors 121 arranged in parallel in the X direction on a base 11, and transports the board B in the X direction by the conveyors 121. The interval between the conveyors 121 can be changed in the Y direction (width direction) perpendicular to the X direction, and the transport unit 12 adjusts the interval between the conveyors 121 according to the width of the board B to be transported. The transport unit 12 transports the board B from the upstream side in the X direction, which is the board transport direction, to a predetermined work position 123, and transports the board B on which the components E have been mounted at the work position 123 from the work position 123 to the downstream side in the X direction.

[0021] Two component supply units 21 are lined up in the X direction on each side of the transport unit 12 in the Y direction, and in each component supply unit 21, multiple tape feeders 22 are lined up in the X direction. In the component supply unit 21, multiple component supply locations 23 lined up in the X direction are provided, and tape feeders 22 that supply components E to be supplied to each component supply location 23 are detachably attached in correspondence with each component supply location 23. In other words, a component supply reel around which a carrier tape that contains components E at predetermined intervals is wound is disposed for each tape feeder 22, and each tape feeder 22 supplies components E to the component supply location 23 at its tip by intermittently feeding out the carrier tape pulled out from the component supply reel.

[0022] Further, in the component mounter 1, a pair of Y-axis rails 31 extending in the Y direction, a Y-axis ball screw 32 extending in the Y direction, and a Y-axis motor My for rotating the Y-axis ball screw 32 are provided, and an X-axis rail 34 is fixed to a nut of the Y-axis ball screw 32 while being supported by the pair of Y-axis rails 31 so as to be movable in the Y direction. An X-axis ball screw 35 extending in the X direction and an X-axis motor Mx for rotating the X-axis ball screw 35 are attached to the X-axis rail 34, and a head unit 40 is fixed to a nut of the X-axis ball screw 35 while being supported by the X-axis rail 34 so as to be movable in the X direction. Therefore, the drive control unit 130 can rotate the Y-axis ball screw 32 by the Y-axis motor My to move the head unit 40 in the Y direction, or rotate the X-axis ball screw 35 by the X-axis motor Mx to move the head unit 40 in the X direction.

[0023] The head unit 40 rotatably supports the rotary head 4. This rotary head 4 has a plurality of (eight) nozzles N arranged at equal pitch on a circumference, and each nozzle N picks up a component E. Meanwhile, the component mounter 1 has a Z-axis motor Mz that raises and lowers the nozzle N in the Z direction, and an R-axis motor Mr that rotates the nozzle N. Then, the drive control unit 130 adjusts the height of the nozzle N by the Z-axis motor Mz, and adjusts the rotation angle of the nozzle N by the R-axis motor Mr.

[0024] In the component mounter 1, the drive control unit 130 executes control upon receiving a command from the arithmetic processing unit 110, so that the component E is mounted on the board B. That is, the drive control unit 130 moves the nozzle N by the X-axis motor Mx and the Y-axis motor My, so that the nozzle N of the rotary head 4 faces the component E supplied to the component supply location 23 from above. Next, the drive control unit 130 lowers the nozzle N by the Z-axis motor Mz, so that the nozzle N abuts against the upper surface of the component E supplied to the component supply location 23, and then the nozzle N adsorbs the component E. Furthermore, the drive control unit 130 raises the nozzle N by the Z-axis motor Mz. In this way, the rotary head 4 picks up the component E from the component supply location 23 by the nozzle N. Next, the drive control unit 130 moves the nozzle N by the X-axis motor Mx and the Y-axis motor My, so that the component E adsorbed by the nozzle N faces the land Bl of the board B from above. Furthermore, the drive control unit 130 adjusts the angle of the component E picked up by the nozzle N with respect to the land Bl using the R-axis motor Mr, and then lowers the nozzle N using the Z-axis motor Mz to place the component E on the land Bl.

[0025] The component mounter 1 also includes a component recognition camera 6 disposed between the two component supply units 21 in the X direction, and the component recognition camera 6 is attached to the base 11 facing upward. The component recognition cameras 6 are disposed on both sides of the transport unit 12 in the Y direction. In contrast, the nozzle N that picks up the component E from the component supply location 23 faces the component recognition camera 6 from above before placing the component E on the land Bl. The component recognition camera 6 then captures an image of the component E adsorbed by the nozzle N from below, thereby acquiring a component recognition image Ir. The component recognition image Ir is transmitted from the component recognition camera 6 to the arithmetic processing unit 110 via the image capture control unit 140, and the arithmetic processing unit 110 recognizes the position of the component E relative to the nozzle N based on the position of the nozzle N at the time of acquiring the component recognition image Ir and the position of the component E in the component recognition image Ir. The calculation processing unit 110 can confirm the position of the nozzle N at the time of acquiring the component recognition image Ir by receiving the encoder outputs of the motors Mx, My, Mz, and Mr from the drive control unit 130. In this manner, component recognition for recognizing the position of the component E is performed.

[0026] The component mounter 1 also includes a component inspection camera 7 for inspecting components E mounted on lands Bl of the board B. This will be described with reference to FIG. 4. FIG. 4 is a schematic diagram of the component inspection camera attached to the head unit. As shown in FIGS. 1 and 4, the component inspection camera 7 is attached to the head unit 40, and the drive control unit 130 can move the component inspection camera 7 integrally with the head unit 40 by means of an X-axis motor Mx and a Y-axis motor My.

[0027] This component inspection camera 7 faces the surface Bs of the substrate B from an imaging direction A. Here, lands Bl are provided on the surface Bs of the substrate B, and components E are placed on the lands Bl on the surface Bs. As shown in Fig. 4, the imaging direction A is inclined at an angle θ (acute angle) with respect to a normal line Bn perpendicular to the surface Bs of the substrate B. In other words, the component inspection camera 7 faces the surface Bs of the substrate B from diagonally above.

[0028] This component inspection camera 7 has an optical system 71 facing the surface Bs of the board B from an imaging direction A, and a solid-state imaging element 72 that captures light focused by the optical system 71, and obtains a component inspection image Ii by using the solid-state imaging element 72 to capture light reflected from a component E mounted on the surface Bs of the board B. Furthermore, the component inspection camera 7 has an illumination 73 that irradiates light from the imaging direction A onto the component E mounted on the surface Bs of the board B. This illumination 73 is composed of, for example, a plurality of LEDs (Light Emitting Diodes) arranged two-dimensionally.

[0029] Fig. 5 is a flowchart showing an example of mounting processing executed by the component mounter of Fig. 1, and Fig. 6 is a flowchart showing an example of misalignment determination executed in the mounting processing of Fig. 5. Figs. 7 and 8 are diagrams typically showing an example of image processing executed in the misalignment determination of Fig. 6. Each step of Fig. 5 and Fig. 6 is executed under the control of the calculation processing unit 110.

[0030] In step S101, the transport unit 12 carries the substrate B into the working position 123 and fixes it at the working position 123. In step S102, the calculation processing unit 110 executes a process of recognizing the position of the substrate B based on an image captured by a camera of a fiducial mark attached to the substrate B to indicate the position of the substrate B (step S102). The image of the fiducial mark can be captured by, for example, the component inspection camera 7 or a camera provided separately therefrom.

[0031] In step S103, the rotary head 4 picks up the component E from the component supply point 23 with the nozzle N. In step 104, the rotary head 4 moves the component E to a position facing the component recognition camera 6 from above, the component recognition camera 6 captures an image of the component E to obtain a component recognition image Ir, and the calculation processing unit 110 recognizes the position of the component E relative to the nozzle N based on the component recognition image Ir. Then, in step S105, the drive control unit 130 mounts the component E on the land Bl provided on the front surface Bs of the board B while adjusting the position of the component E based on the position of the component E recognized in step S104.

[0032] In step S106, it is determined whether or not there is any misalignment of the component E mounted on the land Bl in step S105 (misalignment determination). In the misalignment determination shown in Fig. 6, the component inspection camera 7 captures an image of the component E mounted in step S104 from the imaging direction A to obtain a component inspection image Ii (step S201). As a result, the component inspection image Ii, which is diagrammatically shown in Fig. 7, is transmitted from the component inspection camera 7 to the calculation processing unit 110 via the imaging control unit 140.

[0033] This component inspection image Ii is two-dimensional image data that expresses luminance in multiple tones (for example, 256 tones), and in FIG. 7, the luminance is indicated by monochrome shading. Since the component E is imaged from an imaging direction A that is inclined with respect to the normal line Bn of the board B, the component inspection image Ii includes both the top surface Su and the side surface Ss of the component E. The main body Eb on the top surface Su has low luminance (in other words, it is dark), and is a low-luminance region. On the other hand, the electrode Ee on the top surface Su, and the electrode Ee and the main body Eb on the side surface Ss have higher luminance (in other words, it is brighter) than the main body Eb on the top surface Su, and are high-luminance regions having higher luminance than the low-luminance region. In other words, since the electrode Ee has a metallic luster, it has a higher luminance than the main body Eb of the top surface Su in the component inspection image Ii. Also, the amount of light reflected by the side surface Ss of the component E and reaching the component inspection camera 7 is greater than the amount of light reflected by the top surface Su of the component E and reaching the component inspection camera 7. Therefore, in the component inspection image Ii, the side surface Ss of the component E has a higher brightness than the main body Eb of the top surface Su. In the component inspection image Ii having such contrast, a linear boundary Sb1 parallel to a direction Ed1 (corresponding to the Y direction in this example) appears between the main body Eb of the side surface Ss and the main body Eb of the top surface Su, and a linear boundary Sb2 parallel to a direction Ed2 (corresponding to the X direction in this example) perpendicular to the direction Ed1 appears between the electrode Ee on the top surface Su and the main body Eb. Here, the directions Ed1 and Ed2 correspond to the extension directions of the sides of the rectangular parallelepiped that the external shape of the component E has in a planar view, in other words, the sides that define the rectangular parallelepiped that the external shape of the component E has in a planar view are parallel to either the direction Ed1 or the direction Ed2.

[0034] In step S202, the calculation processing unit 110 executes image processing to extract edges from the component inspection image Ii. Specifically, the boundaries between low-luminance areas and high-luminance areas are extracted as edges to obtain the edge image Ie shown in Fig. 7. This makes it possible to extract the boundary Sb1 between the side surface Ss and the top surface Su of the component E, and the boundary Sb2 between the electrode Ee and the main body Eb of the component E.

[0035] In step S203, the arithmetic processor 110 calculates the allowable edge range Rb1 and the allowable edge range Rb2, which indicate the range in which the boundary Sb1 and the boundary Sb2 of the component E should exist. Specifically, as shown in "Image processing for boundary Sb1" in FIG. 8, the boundary Sb1 located at the ideal location when there is no positional deviation of the component E with respect to the mounting position on the board B is calculated as the ideal boundary Pb1. This ideal boundary Pb1 is calculated based on the position (mounting position) where the component E is mounted and the outer shape of the component E indicated by the component outer shape data De. In addition, the mounting position (X position, Y position, angle r) of the component E is calculated based on the position (X position, Y position, angle r) of the nozzle N when the component E is mounted on the land Bl in step S105 and the position (X position, Y position, angle r) of the component E relative to the nozzle N recognized in step S104. Then, the allowable edge range Rb1 having a predetermined shape centered on the ideal boundary Pb1 is calculated. That is, the allowable edge range Rb1 corresponds to a range in which an allowable clearance is provided with respect to the ideal boundary Pb1. Similarly, as shown in "Image processing for boundary Sb2" in FIG. 8, an ideal boundary Pb2, which is the position of the ideal boundary Sb2, and an allowable edge range Rb2 having a predetermined shape centered on the ideal boundary Pb2 are calculated. Note that the timing for calculating the allowable edge ranges Rb1 and Rb2 is not limited to after the edge extraction in step S202. That is, the edge ranges may be calculated in advance before the edge extraction, or more specifically, before the execution of the position shift determination in FIG. 6, and stored in the storage unit 120.

[0036] That is, if the outer shape of the component E is a rectangular parallelepiped, a component parallel or perpendicular to the mounting angle of the component E (the sum of the angle r of the nozzle N during mounting and the angle r of the component E relative to the nozzle N) should be included in the component inspection image Ii. In addition, the range in which the component should exist can be limited based on the component outer shape data De. Therefore, the allowable edge ranges Rb1 and Rb2 are set as the range in which the component should exist. Here, the mounting angle of the component E and the component outer shape data De are both data (mounting control data) required to mount the component E on the board B, and the allowable edge ranges Rb1 and Rb2 can be set based on this mounting control data. That is, the allowable edge ranges Rb1 and Rb2 can be set without using additional data apart from the mounting control data required to mount the component E.

[0037] In step S204, the arithmetic processing unit 110 checks whether the boundary Sb1 between the side surface Ss and the upper surface Su extracted in step S202 falls within the allowable edge range Rb1. Furthermore, the arithmetic processing unit 110 checks whether each boundary Sb2 between the electrode Ee and the body Eb extracted in step S202 falls within the corresponding allowable edge range Rb2. If all of the boundaries Sb1 and Sb2 fall within the corresponding allowable edge ranges Rb1 and Rb2, it is determined that no misalignment of the component E has occurred ("NO" in step S204), and the misalignment determination in FIG. 6 is completed, and the process returns to the flowchart in FIG. 5.

[0038] On the other hand, if either of the boundaries Sb1 and Sb2 does not fall within the corresponding allowable edge ranges Rb1 and Rb2, it is determined that the component E has been displaced ("YES" in step S204), and the process proceeds to step S205. This allows accurate detection of, for example, the case where the component E has been displaced due to the wind pressure sprayed from the nozzle N when placing the component E on the board B, or the case where the component E has been displaced due to one side of the component E being lifted. In step S205, the calculation processing unit 110 records the mounting position and time of the component E that was determined to have been displaced in step S204 in a log showing the occurrence history of the displacement of the component E. This log is stored in the storage unit 120, and is appropriately displayed on the display of the UI 150, for example, in response to a request from the operator. Then, the position displacement determination in FIG. 6 ends, and the process returns to the flowchart in FIG. 5.

[0039] 5, it is confirmed whether or not all components E to be mounted on board B have been mounted on board B. If there is an unmounted board B (if "NO" in step S107), the process returns to step S103, whereas if mounting of all components E has been completed (if "YES" in step S107), the transport unit 12 removes board B from work position 123 (step S108), and the mounting process in FIG.

[0040] In the embodiment described above, a component inspection image Ii including the top surface Su and side surface Ss of the component E is acquired by capturing an image of the component E from an imaging direction A inclined with respect to the board B on which the component E is mounted (step S201), and a boundary Sb1 (first boundary) between the top surface Su and side surface Ss of the component E included in the component inspection image Ii is identified (step S202). In this way, by capturing an image of the component E from an oblique angle, a component inspection image Ii including the top surface Su and side surface Ss of the component E mounted on the board B, in other words, a component inspection image Ii including the boundary Sb1 between the top surface Su and side surface Ss of the component E, can be acquired, and the boundary Sb1 between the top surface Su and side surface Ss of the component E included in the component inspection image Ii can be identified. Then, based on a result of checking whether the boundary Sb1 is within an allowable edge range Rb1 (first position range) indicating an allowable range of the position of the boundary Sb1 with respect to the board B, the presence or absence of positional deviation of the component E with respect to the board B is determined (steps S203, S204). In this configuration, the presence or absence of misalignment of the component E mounted on the board B can be determined by a simple operation of imaging the component E from an oblique angle and checking whether the boundary Sb1 between the top surface Su and side surface Ss of the imaged component E is within the allowable edge range Rb1. In this way, even with the component inspection camera 7 (imaging unit) with a simple mechanism provided in the component mounter 1, it is possible to determine the presence or absence of misalignment of the component E mounted on the board B.

[0041] The system also includes a component supply unit 21 that supplies components E, and a rotary head 4 (mounting head) that picks up the components E supplied by the component supply unit 21 and mounts them on a board B held by the transport unit 12 (board holder). The component recognition camera 6 acquires the positional relationship between the nozzle N of the rotary head 4 and the component E (in other words, the pick-up position of the component E by the nozzle N). The calculation processing unit 110 (positional deviation determination unit) then calculates an allowable edge range Rb1 based on the positional relationship between the nozzle N of the rotary head 4 and the component E (step S203). With this configuration, the presence or absence of positional deviation of the component E mounted on the board B can be accurately determined according to the pick-up position of the component E by the nozzle N of the rotary head 4.

[0042] Moreover, the component E has an electrode Ee and a body Eb adjacent to the electrode Ee, and the component inspection camera 7 acquires a component inspection image Ii including the electrode Ee and the body Eb. In response to this, the calculation processing unit 110 (boundary identification unit) identifies a boundary Sb2 (second boundary) between the electrode Ee and the body Eb included in the component inspection image Ii captured by the component inspection camera 7 (step S202). Then, the calculation processing unit 110 (positional deviation determination unit) determines the presence or absence of positional deviation of the component E with respect to the board B based on the result of checking whether or not the boundary Sb2 is within an allowable edge range Rb2 (second positional range) indicating an allowable range of the position of the boundary Sb2 with respect to the board B (steps S203, S204). In this configuration, the presence or absence of positional deviation of the component E mounted on the board B can be determined by a simple operation of checking whether or not the boundary Sb2 between the electrode Ee and the body Eb of the component E captured by the component inspection camera 7 is within the allowable edge range Rb2.

[0043] As described above, in the above embodiment, the component mounter 1 corresponds to an example of a "component mounter" of the present invention, the arithmetic processing unit 110 corresponds to an example of a "boundary identification unit" of the present invention, the arithmetic processing unit 110 corresponds to an example of a "position deviation determination unit" of the present invention, the transport unit 12 corresponds to an example of a "board transport unit" of the present invention, the component supply unit 21 corresponds to an example of a "component supply unit" of the present invention, the rotary head 4 corresponds to an example of a "mounting head" of the present invention, the component recognition camera 6 and the arithmetic processing unit 110 correspond to an example of a "grip position acquisition unit" of the present invention, the component inspection camera 7 corresponds to an example of an "imaging unit" of the present invention, and the board B corresponds to an example of a "mounting unit" of the present invention. In the present invention, the component E corresponds to an example of a "substrate", the component E corresponds to an example of a "component", the electrode Ee corresponds to an example of an "electrode" in the present invention, the main body Eb corresponds to an example of a "main body" in the present invention, the component inspection image Ii corresponds to an example of an "image" in the present invention, the boundary Sb1 corresponds to an example of a "first boundary" in the present invention, the boundary Sb2 corresponds to an example of a "second boundary" in the present invention, the top surface Su corresponds to an example of an "top surface" in the present invention, the side surface Ss corresponds to an example of a "side surface" in the present invention, the allowable edge range Rb1 corresponds to an example of a "first positional range" in the present invention, and the allowable edge range Rb2 corresponds to an example of a "second positional range" in the present invention.

[0044] The present invention is not limited to the above embodiment, and various modifications can be made to the above without departing from the spirit of the present invention. For example, in step S203, an allowable edge range Rb1 of a predetermined shape including an ideal boundary Pb1 of the boundary Sb1 at its center is calculated, and in step S204, the presence or absence of misalignment of the component E is determined based on a comparison between the boundary Sb1 and the allowable edge range Rb1. However, the specific criteria for determining the misalignment of the component E are not limited to this, and the determination may be made based on the criteria shown in the following modified example.

[0045] In this modification, the arithmetic processing unit 110 sets a predetermined angle range from the ideal boundary Pb1 as the allowable angle range α (step S203). This allowable angle range α is provided on both sides of the ideal boundary Pb1. The angle of the ideal boundary Pb1 can be obtained, for example, from the angle indicated by the encoder of the R-axis motor Mr when mounting the component E and the angle of the component E relative to the nozzle N. If the angle between the boundary Sb1 indicated by the edge image Ie and the ideal boundary Pb1 is equal to or smaller than the allowable angle range α, the arithmetic processing unit 110 determines that there is no positional deviation of the component E ("NO" in step S204), and if the angle between the boundary Sb1 indicated by the edge image Ie and the ideal boundary Pb1 is greater than the allowable angle range α, the arithmetic processing unit 110 determines that there is a positional deviation of the component E ("YES" in step S204).

[0046] Similarly, the calculation processing unit 110 sets a predetermined angle range from the ideal boundary Pb2 as an allowable angle range β (step S203). If the angle between the boundary Sb2 indicated by the edge image Ie and the ideal boundary Pb2 is equal to or smaller than the allowable angle range β, the calculation processing unit 110 determines that there is no positional deviation of the part E ("NO" in step S204), and if the angle between the boundary Sb2 indicated by the edge image Ie and the ideal boundary Pb2 is larger than the allowable angle range β, the calculation processing unit 110 determines that there is a positional deviation of the part E ("YES" in step S204).

[0047] In this modified example, an allowable angle range α (first angle range) is set, which indicates the allowable range of the angle of the boundary Sb1 relative to the board B. Then, the calculation processing unit 110 determines whether or not there is misalignment of the component E relative to the board B, based on the result of checking whether or not the angle of the boundary Sb1 relative to the board B is within the allowable angle range α. In this configuration, the presence or absence of misalignment of the component E mounted on the board B can be determined by the simple operation of checking whether or not the angle of the boundary Sb1 is within the allowable angle range α.

[0048] Also, an allowable angle range β (second position range) is set, which indicates the allowable range of the angle of the boundary Sb2 with respect to the board B. Then, the calculation processing unit 110 determines whether or not there is misalignment of the component E with respect to the board B, based on whether or not the angle of the boundary Sb2 with respect to the board B is within the allowable angle range β. In this configuration, the presence or absence of misalignment of the component E mounted on the board B can be determined by a simple operation of checking whether or not the angle of the boundary Sb2 is within the allowable angle range β.

[0049] Alternatively, the component mounter 1 may be configured as shown in FIG. 9. Here, FIG. 9 is a block diagram showing a modified example of the electrical configuration of the component mounter of FIG. 1. The modified example of FIG. 9 differs from the example of FIG. 3 in that a distance sensor 8 is provided. This distance sensor 8 is attached to the head unit 40 facing the surface Bs of the substrate B from above, and measures the distance to the surface Bs of the substrate B. As the distance sensor 8, a stereo camera or a TOF (Time of Flight) type sensor can be used. In addition, the controller 100 has a distance acquisition unit 160 that acquires the distance measured by the distance sensor 8. This distance acquisition unit 160 calculates the warpage of the substrate B fixed to the work position 123 based on the distance measured by the distance sensor 8. The calculation of the warpage of the substrate B can be performed, for example, during the period from when the substrate B is carried in at step S101 to when the component E starts to be adsorbed at step S103.

[0050] Then, the calculation processing unit 110 calculates the mounting position of the component E based on the position of the nozzle N when the component E is mounted on the land Bl in step S105, the position of the component E relative to the nozzle N recognized in step S104, and the warpage of the board B calculated by the distance acquisition unit 160. Then, an ideal boundary Pb1 is calculated based on this mounting position and the outline of the component E indicated by the component outline data De. Furthermore, an allowable edge range Rb1 or an allowable angle range α is set for this ideal boundary Pb1. Similarly, the ideal boundary Pb2 is also calculated based on the mounting position of the component E obtained based on the warpage of the board B and the outline of the component E indicated by the component outline data De, and an allowable edge range Rb2 or an allowable angle range β is set for this ideal boundary Pb2.

[0051] In this modified example, a distance acquisition unit 160 (substrate warpage acquisition unit) is provided that acquires the warpage of the substrate B held by the transport unit 12 (substrate holding unit). Then, the calculation processing unit 110 (misalignment determination unit) determines the permissible edge range Rb1 or the permissible angle range α (first positional range) based on the warpage of the substrate B. With this configuration, it is possible to accurately determine the presence or absence of misalignment of the component E mounted on the substrate B depending on the warpage of the substrate B.

[0052] In the above embodiment, the ideal boundary Pb1 of the boundary Sb1 of the component E is calculated based on the position of the nozzle N when the component E is mounted on the board B and the position of the component E relative to the nozzle N. However, the ideal boundary Pb1 may be calculated as the position of the boundary Sb1 that is ideal when the component E is mounted without misalignment relative to the land Bl based on the position of the land Bl and the outline of the component E indicated by the component outline data De. The same applies to the ideal boundary Pb2 of the boundary Sb2 of the component E. The position of the land Bl can be confirmed, for example, by referring to board data indicating the procedure for mounting the component E on the board B.

[0053] Furthermore, the presence or absence of misalignment of the component E may be determined based only on the boundary Sb1 between the side surface Ss and the top surface Su of the component E, without referring to the boundary Sb2 between the electrodes Ee and the body Eb of the component E.

[0054] Furthermore, in the component inspection image Ii, the relationship in luminance between the side surface Ss and the top surface Su of the component E is not limited to the above example. For example, the component inspection image Ii may be captured under conditions in which the luminance of the top surface Su is higher than the luminance of the side surface Ss.

[0055] Furthermore, the mounting head that mounts the component E is not limited to the rotary type mounting head described above. Therefore, the presence or absence of misalignment of the component E mounted by an in-line head unit in which multiple mounting heads are arranged in a row can be determined in the same manner as described above. [Explanation of symbols]

[0056] 1...Component mounting machine 110...Calculation processing unit (boundary identification unit, position shift determination unit, grip position acquisition unit) 12...Transport section (substrate transport section) 21…Parts Supply Department 4...Rotary head (mounting head) 6...Part recognition camera (grasping position acquisition section) 7...Part inspection camera (imaging unit) B: Substrate E…Parts Ee…electrode Eb…Main body Ii…Part inspection image (image) Sb1…Boundary (1st boundary) Sb2…Boundary (second boundary) Su…Top surface Ss...side Rb1: Permissible edge range (first position range) Rb2: Permissible edge range (second position range)

Claims

1. a board holder for holding a board on which a component having a top surface and a side surface is mounted; an imaging unit that captures an image of the component from a direction inclined with respect to the board held by the board holding unit to obtain an image including the top surface and the side surface of the component; a boundary specifying unit that specifies a first boundary between the top surface and the side surface of the component included in the image captured by the imaging unit; a positional deviation determination unit that determines whether or not the component is misaligned with respect to the board based on a result of checking whether or not the first boundary is within a first positional range that indicates an allowable range for the position of the first boundary with respect to the board; Equipped with the component has an electrode and a body adjacent to the electrode; The imaging unit acquires the image including the electrode and the main body, The boundary identification unit identifies a second boundary that is a boundary between the electrode and the main body included in the image captured by the imaging unit, The positional misalignment determination unit is a component mounter that determines whether or not the component is misaligned relative to the board based on the results of checking whether or not the second boundary is within a second positional range that indicates an acceptable range for the position of the second boundary relative to the board.

2. the first position range is a first angle range indicating an allowable range of an angle of the first boundary with respect to the substrate, The component mounter according to claim 1 , wherein the misalignment determination unit determines whether or not there is misalignment of the component with respect to the board based on a result of checking whether an angle of the first boundary with respect to the board is within the first angle range.

3. a parts supply unit that supplies the parts; a mounting head that grasps the components supplied by the component supply unit and mounts the components on the board held by the board holding unit; a gripping position acquisition unit that acquires a positional relationship between the component gripped by the mounting head and the mounting head; Further equipped with The component mounter according to claim 1 , wherein the positional deviation determination unit determines the first positional range based on the positional relationship.

4. a substrate warpage acquisition unit that acquires a warpage of the substrate held by the substrate holding unit, The component mounter according to claim 1 , wherein the positional deviation determination unit determines the first positional range based on the warp of the board.

5. the second position range is a second angle range indicating an allowable range of an angle of the second boundary with respect to the substrate, The component mounter according to claim 1 , wherein the misalignment determination unit determines the presence or absence of misalignment of the component with respect to the board based on whether an angle of the second boundary with respect to the board is within the second angle range.

6. a step of acquiring an image including the top surface and the side surface of the component by using an imaging unit to capture an image of the component from an inclined direction with respect to a substrate on which the component is mounted, the component having a top surface and a side surface, an electrode, and a body adjacent to the electrode; identifying a first boundary between the top surface and the side surface of the component included in the image; determining whether or not the component is misaligned with respect to the board based on a result of checking whether or not the first boundary is within a first position range that indicates an allowable range for the position of the first boundary with respect to the board; acquiring the image including the electrode and the main body by the imaging unit; Identifying a second boundary between the electrode and the main body included in the image captured by the imaging unit; determining whether or not the component is misaligned with respect to the board based on a result of checking whether or not the second boundary is within a second position range that indicates an allowable range for the position of the second boundary with respect to the board; A component mounting position deviation determination method comprising:

7. a component supply unit that supplies a component having a top surface and a side surface; A substrate holder for holding a substrate; a mounting head that holds the component supplied by the component supply unit with a nozzle; a gripping position acquisition unit that acquires a positional relationship between the component gripped by the mounting head and the nozzle of the mounting head; a drive control unit that controls the mounting head to mount the component on the board while adjusting the position of the component based on the positional relationship; and an imaging unit that captures an image of the component mounted on the board from a direction inclined with respect to the board held by the board holding unit, thereby obtaining an image including the top surface and the side surface of the component; a boundary specifying unit that specifies a first boundary between the top surface and the side surface of the component included in the image captured by the imaging unit; a positional deviation determination unit that determines whether or not the component is misaligned with respect to the board based on a result of checking whether or not the first boundary is within a first positional range that indicates an allowable range for the position of the first boundary with respect to the board; a storage unit for storing part outer shape data indicating the outer shape of the part; Equipped with The positional deviation determination unit calculates a mounting position at which the component is mounted based on the position of the nozzle when the mounting head mounts the component on the board and the positional relationship, and determines the first position range based on the mounting position and the component outline data.

8. supplying a component having a top surface and a side surface by a component supply unit; a step of holding the component supplied by the component supply unit with a nozzle of a mounting head; acquiring a positional relationship between the component held by the mounting head and the nozzle of the mounting head; controlling the mounting head to mount the component on the board while adjusting the position of the component based on the positional relationship; acquiring an image including the top surface and the side surface of the component by an imaging unit capturing an image of the component from a direction inclined with respect to the board on which the component is mounted; identifying a first boundary between the top surface and the side surface of the component included in the image; determining whether or not the component is misaligned with respect to the board based on a result of checking whether or not the first boundary is within a first position range that indicates an allowable range for the position of the first boundary with respect to the board; Equipped with component outer shape data indicating an outer shape of the component is stored in a storage unit; A component mounting position deviation determination method, which calculates a mounting position at which the component is mounted based on the nozzle position when the mounting head mounts the component on the board and the positional relationship, and determines the first position range based on the mounting position and the component outline data.

Images