High-frequency induction heating head and high-frequency induction heating device using same

Abstract

To diversify the soldering work using a high-frequency induction heating head.SOLUTION: A high-frequency induction heating head according to the present invention includes a loop-shaped core body 4A partially formed with a magnetic gap portion 27A, and a coil 5 that supplies magnetic flux to the core body 4A, and the core body 4A has a magnetic gap end face 25a and a magnetic gap end face 26a arranged as a pair on both sides of the magnetic gap portion 27A. One of the magnetic gap end faces 25a and 26a is formed in a position extending in the outer peripheral direction of the loop shape more than the other.SELECTED DRAWING: Figure 16

Description

[Technical field]

[0001] The present invention relates to a high-frequency induction heating head and a high-frequency induction heating device using the same. [Background technology]

[0002] For example, as shown in Patent Document 1, a high-frequency induction heating head is used to solder electronic components to pads on a circuit board. The high frequency induction heating head includes a core body having a magnetic gap serving as a heating portion, and a coil for supplying magnetic flux to the core body. That is, when soldering a terminal portion of an electronic component to a pad portion of a circuit board, first the terminal portion of the electronic component is placed on the pad portion of the circuit board, and then wire solder is supplied to the soldering portion between the pad portion and the terminal portion. At this time, the pad portions of the circuit board, the terminal portions of the electronic components, and the solder thread are arranged within the magnetic gap portion of the core body, and the magnetic flux generated in the magnetic gap portion inductively heats the pad portions of the circuit board, the terminal portions of the electronic components, and the solder thread, thereby performing soldering. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2014-120649 A Summary of the Invention [Problem to be solved by the invention]

[0004] In the above-mentioned Patent Document 1, the high-frequency magnetic head is configured to include a core body having a magnetic gap formed in a part thereof, and a magnetic coil that supplies magnetic flux to the core body. However, in the core body disclosed in the publication, the first magnetic gap end face and the second magnetic gap end face are arranged symmetrically in the magnetic gap portion. In this way, if the first and second magnetic gap end faces in the magnetic gap portion are shaped symmetrically, the objects to be heated that can be soldered are limited, and it may not be possible to meet the versatility of soldering work. To explain this point further, for example, when soldering a linear lead terminal to a pad on a substrate as in the prior art, if the lead terminal, the pad on the substrate, and the solder thread can be positioned within the magnetic gap, the lead terminal, the pad on the substrate, and the solder thread can be efficiently heated by the magnetic flux concentrated in the magnetic gap. However, if the item to be soldered (such as a lead terminal) is larger than the magnetic gap, the item cannot be positioned in the magnetic gap, and ultimately the soldering operation cannot be performed. Of course, in that case, one might think that it would be enough to widen the magnetic gap, but widening the magnetic gap would reduce the magnetic flux density in the magnetic gap, resulting in insufficient heat generation in various parts and, as a result, making soldering impossible. In conclusion, soldering can only be performed with a device that allows the item to be soldered to be placed in the magnetic gap, and the versatility of soldering cannot be met. SUMMARY OF THE PRESENT EMBODIMENT An object of the present invention is to meet the diversification of soldering operations. [Means for solving the problem]

[0005] In order to achieve this object, the high-frequency induction heating head of the present invention comprises a loop-shaped core body having a magnetic gap portion formed in a portion thereof, and a coil that supplies magnetic flux to the core body, the core body having a first magnetic gap end face and a second magnetic gap end face arranged as a pair on either side of the magnetic gap portion, one of the first and second magnetic gap end faces being configured at a position extended in the outer circumferential direction of the loop shape further than the other.

[0006] Here, the first magnetic gap end face and the second magnetic gap end face may be arranged so as to face the outer periphery of the loop-shaped core body.

[0007] In the present invention, the cross-sectional areas of the first magnetic gap end face and the second magnetic gap end face may be configured to be smaller than the cross-sectional area of ​​the remaining portion of the core body.

[0008] Furthermore, the high frequency induction heating device of the present invention is characterized by comprising the above-mentioned high frequency induction heating head, and a holding means for holding a heated object placed in a magnetic gap portion of the high frequency induction heating head. Examples of objects to be heated include many objects such as circuit boards, various electronic components, and connectors. Effect of the Invention

[0009] As described above, the high-frequency induction heating head of the present invention is characterized in that one of the first magnetic gap end face and the second magnetic gap end face formed on the core body is located at a position extended in the outer circumferential direction of the loop shape more than the other. With the above configuration, in the magnetic gap portion, the magnetic flux flowing from the first magnetic gap end face to the second magnetic gap end face, or from the second magnetic gap end face to the first magnetic gap end face, reaches the other magnetic gap end face via a path extended in the loop-shaped outer periphery direction of the loop-shaped core body, compared to when the first and second magnetic gap end faces are opposed to each other. That is, in the magnetic gap portion, a magnetic flux path is formed that spreads in the outer circumferential direction of the loop of the loop-shaped core body (for example, this is expressed as the vertical direction). Furthermore, compared to a configuration in which the first and second magnetic gap end faces oppose each other symmetrically, a widened magnetic flux path can also be formed in a direction perpendicular to the magnetic gap direction (for example, this is expressed as the lateral direction). As a result, it is now possible to solder objects to be heated, which was previously difficult, and it is possible to meet the diverse needs of soldering. [Brief description of the drawings]

[0010] [Figure 1]FIG. 2 is a perspective view showing a high-frequency induction heating head portion of a high-frequency induction heating device used to explain each embodiment of the present invention. [Diagram 2] FIG. 2 is a front view of the high-frequency induction heating head portion of the first embodiment. [Diagram 3] FIG. 2 is a side view of the high-frequency induction heating head portion according to the first embodiment. [Figure 4] FIG. [Diagram 5] FIG. 2 is a perspective view of the high-frequency induction heating head portion of the first embodiment with a part thereof removed. [Figure 6] FIG. 2 is an exploded perspective view of the high-frequency induction heating head portion of the first embodiment. [Figure 7] FIG. 2 is an exploded perspective view of a high-frequency induction heating head portion according to the first embodiment. [Figure 8] FIG. 2 is a partially enlarged perspective view of a high-frequency induction heating head portion according to the first embodiment. [Figure 9] FIG. 2 is a partially enlarged exploded perspective view of a high-frequency induction heating head portion according to the first embodiment of the present invention. [Figure 10] FIG. 2 is a partially enlarged exploded perspective view of a high-frequency induction heating head portion according to the first embodiment of the present invention. [Figure 11] FIG. 2 is a perspective view showing one embodiment of a high-frequency induction heating head portion of the present invention. [Figure 12] FIG. 2 is a perspective view of a high-frequency induction heating head portion according to the first embodiment. [Figure 13] FIG. 2 is a front view of the high-frequency induction heating head portion according to the first embodiment. [Figure 14] FIG. 2 is a front view showing a core body of the high-frequency induction heating head according to the first embodiment. [Figure 15] FIG. 2 is a partially enlarged perspective view of a high-frequency induction heating head portion according to the first embodiment. [Figure 16] FIG. 2 is a partially enlarged front view of the high-frequency induction heating head portion of the first embodiment. [Figure 17] FIG. 4 is a partially enlarged perspective view showing the operation of the high-frequency induction heating head according to the first embodiment. [Figure 18] FIG. 11 is a perspective view showing another embodiment of the high-frequency induction heating head portion of the present invention. [Figure 19] FIG. 2 is a perspective view of a high-frequency induction heating head portion according to the first embodiment. [Figure 20] FIG. 2 is a front view showing an example of soldering work using the high-frequency induction heating head according to the first embodiment. [Figure 21] FIG. 2 is a perspective view showing an example of a heated object on which soldering work is performed according to the first embodiment. [Figure 22] FIG. 2 is a perspective view of a core body of the high-frequency induction heating head according to the first embodiment. [Diagram 23] FIG. 2 is a perspective view of a core body of the high-frequency induction heating head according to the first embodiment. [Figure 24] FIG. 2 is a front view of a core body of the high-frequency induction heating head according to the first embodiment. [Diagram 25] FIG. 2 is a side view of a core body of the high-frequency induction heating head according to the first embodiment. [Figure 26] FIG. 4 is a partially enlarged cross-sectional view showing the operation of the high-frequency induction heating head according to the first embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. (Basic configuration) The present invention relates to a high-frequency induction heating head and a high-frequency induction heating device using the same, and is characterized particularly by the shape of the core body. Therefore, first, using Figures 1 to 10, the basic configurations of a high-frequency induction heating head equipped with a core body and a high-frequency induction heating device using the same will be explained, and then, using Figures 11 to 26, the features of the core body according to the present invention will be described in detail. In this specification, a high-frequency induction heating head includes a core body and a coil that supplies magnetic flux to the core body. Moreover, the high-frequency induction heating device is provided with the high-frequency induction heating head and a holding means for holding an object to be heated and soldered by the high-frequency induction heating head. 1 to 4, a high-frequency induction heating head 1 includes a box-shaped main body case 2. As shown in FIG. The six surfaces of the main body case 2, namely the top surface 2a, bottom surface 2b, and four outer peripheral surfaces 2c, are all formed from resin, and an IH output connection connector 2A and two cooling water connection connectors 3 are provided on the top surface 2a of the main body case 2. Further, below the main body case 2, a core body 4 and a coil 5 for supplying magnetic flux to the core body 4 are arranged. As shown in Figs. 5 to 7, a capacitor 6 is disposed inside the main body case 2, and electric water channel connectors 7, 8 are provided on both sides of the capacitor 6 facing outward from the capacitor 6 side. These electrical waterway connectors 7, 8 are both made of copper material and are configured to provide electrical continuity with the objects they come into contact with.

[0012] First, the electrical-waterway connector 8 has an overall building-like shape, and inside it is formed a waterway (not shown) extending in the vertical direction, and a cooling water connection connector 3 is connected to the upper end of this waterway on the upper surface of the electrical-waterway connector 8. 7, the lower end of the water channel in the electrical water channel connector 8 forms a water channel joint 9 on the condenser 6 side at the lower part of the electrical water channel connector 8. As shown in FIG. Next, the electrical water channel connector 7 has an overall plate-like shape, but inside the lower base portion 10, a water channel (not shown) is formed which extends laterally toward the electrical water channel connector 8 and then downward. The end of the water channel of the electrical water channel connector 7 on the electrical water channel connector 8 side is a water channel joint portion 11 as shown in FIG. 7, the end portion of the water channel of the electrical water channel connector 7 on the lower end side is a water channel joint portion 12. As shown in FIG. With the above-mentioned configuration, when the left and right electrical-water channel connectors 7, 8 are screwed to the fixing parts of the capacitor 6 using the metal screws 13, 14 shown in Figures 6 and 7, the electrical-water channel connectors 7, 8 are integrated on both sides of the capacitor 6, as shown in Figure 5. In addition, by this integration process, continuous water channels are formed in both the left and right electrical conduit connectors 7, 8, respectively, from the cooling water connection connector 3, the water channel in the electrical conduit connector 8, its water channel joint 9, the water channel joint 11 of the electrical conduit connector 7, the water channel of the electrical conduit connector 7, and the water channel joint 12. The integrated assembly of the capacitor 6 and the electrical water channel connectors 7 and 8 is held on the bottom surface 2b within the main case 2 as shown in Figure 5, and the cooling water connection connector 3 is extended above the through hole A on the top surface 2a of the main case 2. In addition, the undersides of the base portions 10 of the two electrical waterway connectors 7 are located in the through hole B portion of the underside 2b of the main body case 2, so that the waterway connection portion 12 on the underside of the base portions 10 faces the outside of the main body case 2 through the through hole B. The core body 4 and the coil 5 are connected to the lower surfaces of the two base portions 10 by the screws 16 shown in FIGS.

[0013] More specifically, first, the coil 5 is formed into a U-shape using a copper pipe with a water passage formed inside, and one end and the other end are respectively connected to front and rear coil bases 17 and 18 made of copper material. The front and rear coil bases 17, 18 have horizontal flanges 17a, 18a formed on their upper edges, each with a through hole for inserting a screw 16. The front and rear coil bases 17, 18 are joined to the base part 10 of the electrical-waterway connector 7 by inserting the screw 16 from below into the through hole of the flanges 17a, 18a and screwing the screw 16 into the threaded hole on the underside of the base part 10 of the electrical-waterway connector 7. In addition, coil bases 17 and 18 each have a water passage (not shown) extending in the vertical direction, and the lower end of the water passage in coil base 17 is connected to a water passage joint (not shown) on one end side of coil 5, and the lower end of the water passage in coil base 18 is connected to a water passage joint (not shown) on the other end side of coil 5. 6, a water channel joint 19 is formed on flange 17a at the upper end of the water channel of coil base 17, and a water channel joint 20 is formed on flange 18a at the upper end of the water channel of coil base 18, as shown in FIG. Therefore, when the coil bases 17, 18 are fixed to the undersides of the two base parts 10 with the metal screws 16 shown in Figures 6 and 7, the water channel coupling parts 19, 20 of the coil bases 17, 18 are each separately connected to the water channel coupling parts 12 on the undersides of the two base parts 10 via rubber gaskets 15. In addition, a rubber packing 15 as shown in FIG. 7 is interposed between the water channel joints 9 and 11 to prevent water leakage. With the above configuration, when cooling water of, for example, 25°C is poured into one of the cooling water connection connectors 3, the cooling water flows through the water channel in one of the electrical conduit connectors 8, the water channel joint 9, the water channel joint 11 of one of the electrical conduit connectors 7, the water channel in one of the electrical conduit connectors 7, the water channel joint 12, the water channel joint 19 of the coil base 17, the water channel of the coil base 17, the water channel joint on one end side of the coil 5, the water channel of the coil 5, the water channel joint on the other end side of the coil 5, the water channel in the coil base 18, the water channel joint 20 of the coil base 18, the water channel joint 12 of the other electrical conduit connector 7, the water channel of the other electrical conduit connector 7, the water channel in the other electrical conduit connector 8, and the other cooling water connection connector 3, and then is cooled in the cooling section outside the main body case 2 and circulated again to the one of the cooling water connection connectors 3. The coil bases 17, 18 are overlapped with a resin insulating plate 21 between them, and the screws 22 that join them are made of resin and are insulating, so that no short-circuiting electrical continuity occurs between the coil bases 17, 18. Also, as shown in FIG. 5, one terminal of the IH output connection connector 2A and a terminal portion 23 of one of the electrical waterway connectors 8 are connected by wiring (not shown in order to avoid cluttering the drawing), and the other terminal of the IH output connection connector 2A and a terminal portion 24 of the other electrical waterway connector 8 are connected by wiring (not shown in order to avoid cluttering the drawing). The capacitor 6 and the electrical waterway connectors 7 and 8 are also integrated with the metal screws 13 and 14 and are electrically connected to each other. Furthermore, the capacitor 6, the electrical conduit connectors 7 and 8, the coil bases 17 and 18, and the coil 5 are also electrically connected to each other. In other words, when power is supplied from IH output connector 2A, resonance occurs between capacitor 6 and coil 5, and this resonant current is supplied to coil 5, generating a magnetic flux.

[0014] Next, the core body 4 that performs heating by this magnetic flux will be described. As shown in Figures 8 to 10, the core body 4 is configured by overlapping one end side (upper end side) of a C-shaped first sub-core body 25 and one end side (upper end side) of an inverted C-shaped second sub-core body 26, and forming a magnetic gap 27 by a gap between the other end sides (lower end sides) of the sub-core bodies 25, 26. In other words, the core body 4 is configured by overlapping one end (upper end) of the C-shaped sub-core body 25 and the inverted C-shaped sub-core body 26, so that when viewed from the front, it is ring-shaped, and a gap that forms the magnetic gap 27 is formed in part of the ring. The coil 5 passes linearly through the internal space of the ring-shaped core body 4, so that the magnetic flux generated in the coil 5 flows through the core body 4 and the magnetic gap 27. In addition, a through hole 28 is provided through the sub-core bodies 25, 26 at the overlapping portion at one end side of the sub-core bodies 25, 26, and a through shaft is inserted into the through hole 28. hand A screw 29 is inserted through the magnetic gap 27 and used as an opening / closing axis to vary the size of the magnetic gap 27 . The core body 4 is plate-shaped with a thickness dimension in the front-back direction smaller than its outer diameter dimension when viewed from the front, and protective plates 30, 31 are disposed on the front and back surfaces of this plate-shaped core body 4, respectively. The protective plate 30 is formed by overlapping one end (upper side) of a first C-shaped sub-protective plate 32 and one end (upper side) of a second inverted C-shaped sub-protective plate 33, and a through hole 34 is provided at the overlapping portion of the sub-protective plates 32 and 33, which penetrates the sub-protective plates 32 and 33. hand The screw 29 passes through. The protective plate 31 is formed by overlapping one end (upper side) of a first C-shaped sub-protective plate 35 and one end (upper side) of a second inverted C-shaped sub-protective plate 36, and a through hole 37 is provided at the overlapping portion of the sub-protective plates 35 and 36, which penetrates the sub-protective plates 35 and 36. The through hole 37 is provided with a through axis. hand The screw 29 passes through. In other words, the through axis hand The screw 29 passes through the through hole 34 of the sub-protective plates 32, 33, then through the through hole 28 of the sub-core bodies 25, 26, and then through the through hole 37 of the sub-protective plates 35, 36, and is screwed into the threaded hole 39 of the U-shaped heat conductive member 38. With this configuration, both the front and back surfaces of the core body 4 are covered with the protective plates 30 and 31 in a state in which heat can be conducted. Further, a rearwardly folded portion 40 is formed at the upper portion of the sub-protective plates 32, 33 so as to cover the upper surfaces of the sub-core bodies 25, 26, and a screw hole 41 is formed therein. Further, a forward bent portion 42 is formed in the upper portion of the sub-protective plates 35, 36 so as to cover the rearward bent portion of the upper portion of the sub-protective plates 32, 33, and a through hole 43 is formed therein. Further, the sub-protective plates 35, 36 are provided at their upper portions with outward mounting portions 44, in which through holes 45 are formed. The through hole 43 is a long hole extending in the front-rear direction, and the through hole 45 is a long hole extending in the outer circumferential direction. With this configuration, protective plate 31, core body 4, and protective plate 30 are stacked and held and fixed to heat conductive member 38. As an example of a method for this, first, protective plate 31, core body 4, and protective plate 30 are stacked, and a rod-shaped jig (not shown) is inserted into through holes 34, 28, and 37 to align the axes. Next, the screw 46 is screwed into the screw hole 41 of the protective plate 30 from above the protective plate 31 via the through hole 43, so that the core body 4 is sandwiched between the protective plates 30, 31 from the front and rear. Then, the rod-shaped jig is removed from the core body 4 and protective plates 30, 31 that have been provisionally unitized in this manner, and is then placed in the holding portion 38a of the heat conduction member 38 in Figure 9. Screws 29 are then inserted through the through holes 34, 28 and 37 of the protective plate 31, core body 4 and protective plate 30, and the screws 29 are then screwed into the threaded holes 39 of the heat conduction member 38. Furthermore, the screws 47 are inserted through the through holes 45 of the protective plate 31 and screwed into the screw holes 48 of the heat conductive member 38 . In this state, the size of the magnetic gap 27 is adjusted, and finally, the screws 29 and 47 are firmly tightened, thereby completing the holding and fixing of the protective plate 31, the core body 4, and the protective plate 30 to the heat conductive member . With the above configuration, the surface of the protective plate 31 opposite to the core body 4 is in contact with the thermally conductive member 38, making it easy for heat to be conducted between the thermally conductive member 38 and the protective plate 31. In other words, when the coil base 18 is cooled by the cooling water that cools the coil 5, the low temperature is also utilized to cool the core body 4 made of ferrite material via the copper heat conductive member 38 and the copper protective plate 31. In this embodiment, the temperature of the core body 4 can be suppressed to approximately 100°C even when operated continuously for 24 hours.

[0015] The high-frequency induction heating head 1 of this embodiment solders the terminals of electronic components to the pads of a circuit board in the magnetic gap 27 area, and the ability to perform such soldering work continuously for 24 hours a day makes it possible to dramatically increase productivity. As is well known, in such a high-frequency induction heating head 1, the heated objects are pads on a circuit board, terminals of electronic components, solder, etc., and a high-frequency induction heating device using the high-frequency induction heating head 1 needs to be provided with a holding means for holding the circuit board, etc. In this embodiment, the protective plates 30 and 31 are made of a metal material having a lower relative magnetic permeability than the core body 4 and a lower electric resistance than the core body 4 . Specifically, the core body 4 is made of a ferrite material, and the protective plates 30 and 31 are made of a copper material or an aluminum material. The relative permeability of the ferrite material constituting the core body 4 is 50 to 5000, whereas when the protective plates 30, 31 are made of copper or aluminum, the relative permeability is approximately 1. Therefore, the magnetic flux flowing through the core body 4 flows primarily within the core body 4 and rarely leaks to the protective plates 30, 31. However, in this embodiment, a large high-frequency current of about 100 A is passed through coil 5, so even if the leakage flux is sufficiently small compared to the amount of magnetic flux flowing through magnetic gap 27, it may still sufficiently heat up the components near core body 4 and cause them to reach high temperatures. In contrast, in the present embodiment, the magnetic flux leaking from the core body 4 passes through the protective plates 30, 31, which have a lower relative permeability than the core body 4. Furthermore, since the protective plates 30, 31 are made of a metal material having a lower electrical resistance than the core body 4, the passage of the magnetic flux causes eddy currents to flow, and these eddy currents generate magnetic flux in the opposite direction to the magnetic flux passing through the protective plates 30, 31. As a result, the amount of magnetic flux leaking from the core body 4 through the protective plates 30, 31 is reduced, thereby preventing inadvertent heating of other nearby components. According to an experiment, it was possible to reduce inadvertent heating at a position 4 mm away from the magnetic gap 27 by 20%, and to reduce inadvertent heating at a position 8 mm away by 40%. This prevents an article that is not intended to be heated from being inadvertently heated by the magnetic flux from the core body 4 and from being deteriorated. Furthermore, since objects that are not intended to be heated in the vicinity of the magnetic gap 27 are not inadvertently heated by the magnetic flux, the degree of freedom in the heating operation is improved, and the productivity is also increased. Furthermore, the reduction in leakage flux also means that the magnetic flux in the magnetic gap 27 increases, and the heating efficiency can be improved.

[0016] When the protective plates 30 and 31 are made of copper, the electrical resistance is 1.68×10 -8Ωm, and when the protective plates 30 and 31 are made of aluminum, the electrical resistance is 2.83×10 -8 The electrical resistance of ferrite is approximately Ωm, and compared to this, the electrical resistance of ferrite is extremely small.

[0017] Furthermore, since the outer shape of the core body 4 and the outer shapes of the protective plates 30, 31 are made substantially the same and the front and back sides of the core body 4 are covered with the protective plates 30, 31, the core body 4 can be protected by the protective plates 30, 31 from being directly collided with by other objects, and as a result, damage to the core body 4 can be suppressed. In other words, since the core body 4 is made of ferrite, it is susceptible to damage when it is hit by another object or when the core body 4 itself is dropped. However, if the outer shape of the core body 4 and the outer shapes of the protective plates 30, 31 are made approximately identical and the front and back sides of the core body 4 are covered with the protective plates 30, 31, the protective plates 30, 31 can protect the core body 4 from being directly hit by another object, and as a result, damage to the core body 4 can be suppressed. Furthermore, when protective plate 31 is made of copper, the thermal conductivity is 403 W / m K, and when made of aluminum, the thermal conductivity is 236 W / m K, both of which have good thermal conductivity. Therefore, when coil 5 is cooled with cooling water, core body 4 can be sufficiently cooled via protective plate 31, and the cooling effect can be further enhanced by placing thermally conductive grease, such as silicone grease, between core body 4 and protective plate 31.

[0018] In the above embodiment, the core body 4 is water-cooled, but the core body 4 may be air-cooled. For example, air may be blown to the heat conductive member 38 and the protective plates 30 and 31 for cooling. For this purpose, the heat conducting member 38 and the protective plates 30 and 31 may be provided with heat dissipating fins.

[0019] (Embodiment 1) 11 to 17 show one embodiment that is a feature of the present invention, and are particularly intended to explain the core body of the high-frequency induction heating head 1. FIG. This embodiment is characterized in that the shape of the core body 4 in FIGS. 1 to 10 is changed to a core body 4A in FIGS. In other words, by replacing the core body 4 in Figs. 1 to 10 with the core body 4A in Figs. 11 to 17, the high-frequency induction heating head 1 as shown in Figs. 1 to 10 and a high-frequency induction heating device using it can be constructed. First, in the above-mentioned Figures 1 to 10, the core body 4 is formed by combining the C-shaped sub-core body 25 and the inverted C-shaped sub-core body 26, but in this embodiment, the core body 4A is formed by combining the C-shaped sub-core body 25A and the inverted C-shaped sub-core body 26A. The C-shaped sub-core body 25A and the inverted C-shaped sub-core body 26A are made of ferrite material, and are combined to form a ring-shaped core body 4A as shown in FIG. Furthermore, a magnetic gap portion 27A is formed in a part of the ring-shaped core body 4A. In the magnetic gap portion 27A, a magnetic gap end face 25a of the sub-core body 25A and a magnetic gap end face 26a of the sub-core body 26A are disposed facing toward the outer periphery of the loop-shaped core body 4A. As shown in FIG. 14, magnetic gap end face 26a of sub-core body 26A is extended in the outer circumferential direction of loop-shaped core body 4A beyond magnetic gap end face 25a of sub-core body 25A. In this configuration, the coil 5 passes linearly through the loop of the core body 4A as shown in FIG. 11, so that the magnetic flux generated in the coil 5 flows through the core body 4A and the magnetic gap portion 27A. The core body 4A is held in the same manner as in FIGS. 11 to 17 show an example in which a power transistor 50, which is used as an example of an object to be heated, is soldered onto a circuit board 49 using the core body 4A, the coil 5, and the like. The circuit board 49 is held by a general holding means. That is, the connection terminals 51 of the power transistor 50 are soldered to through holes in the circuit board 49, as in the conventional case. However, what is distinctive about this embodiment is that the heat dissipation fins 52 of the power transistor 50 are soldered to a heat dissipation pattern 53 provided on the front side of the circuit board 49. The heat dissipation fins 52 and the heat dissipation pattern 53 are made of, for example, copper in order to improve solderability and thermal conductivity. That is, in the conventional method, the power transistor 50 is fixed to the heat dissipation pattern 53 by a screw through a through hole 54 provided in the heat dissipation fin 52, but in this embodiment, the heat dissipation fin 52 of the power transistor 50 is soldered to the heat dissipation pattern 53 provided on the front side of the circuit board 49. Specifically, cream solder is applied to the surface of the heat dissipation pattern 53 that is covered by the heat dissipation fins 52 of the power transistor 50, and the power transistor 50 is placed on top of it. In this state, the heat dissipation fins 52 of the power transistor 50 are soldered onto the heat dissipation pattern 53 of the circuit board 49 using the core body 4A, coil 5, etc. At this time, as shown in Figures 13, 15, and 16, the magnetic gap end face 25a of the sub-core body 25A is located above the heat dissipation fin 52, and the magnetic gap end face 26a of the sub-core body 26A is located to the side of the end face 52a of the heat dissipation fin 52 (i.e., outside the heat dissipation fin 52) and above the heat dissipation pattern 53 near the end face 52a of the heat dissipation fin 52. When current is applied to coil 5 in this state, as shown in Figure 16, magnetic flux flows in magnetic gap portion 27A between magnetic gap end face 25a of sub-core body 25A and magnetic gap end face 26a of sub-core body 26A (since high-frequency current is supplied to coil 5, the direction of the arrow shown in Figure 16 will be reversed at the next moment). A characteristic feature is that, as shown in FIG. 16, in magnetic gap portion 27A, the magnetic flux flowing between magnetic gap end face 25a of sub-core body 25A and magnetic gap end face 26a of sub-core body 26A flows not only through heat dissipation fin 52 but also through the cream solder and heat dissipation pattern 53 below it. In this embodiment, as described above, the magnetic gap end face 25a of the sub-core body 25A constituting the ring-shaped core body 4A and the magnetic gap end face 26a of the sub-core body 26A are arranged in the magnetic gap portion 27A toward the outer periphery of the loop-shaped core body 4A. As shown in FIG. 14, magnetic gap end face 26a of sub-core body 26A is extended in the outer circumferential direction of loop-shaped core body 4A beyond magnetic gap end face 25a of sub-core body 25A. As a result, the magnetic flux path between magnetic gap end face 25a of sub-core body 25A and magnetic gap end face 26a of sub-core body 26A extends in the thickness direction of heat dissipation fin 52 (this is expressed as the vertical direction). As a result, in magnetic gap portion 27A, the magnetic flux flowing between magnetic gap end face 25a of sub-core body 25A and magnetic gap end face 26a of sub-core body 26A flows not only through heat dissipation fin 52, but also through the cream solder and heat dissipation pattern 53 below it. FIG. 17 shows eddy currents formed by the flow of magnetic flux (because a high frequency current is supplied to coil 5, the direction of the arrows shown in FIG. 17 will be reversed at the next moment). As can be seen in Figure 17, large eddy currents flow on the end face 52a side of the upper surface of the heat dissipation fin 52, and large eddy currents also flow at the end face 52a of the heat dissipation fin 52. Furthermore, large eddy currents also flow in the heat dissipation pattern 53 in the vicinity of the end face 52a of the heat dissipation fin 52. As a result, the temperature of these parts rises rapidly, melting the cream solder. This makes it possible to solder the heat dissipation fin 52 of the power transistor 50 to the heat dissipation pattern 53 provided on the front side of the circuit board 49. Furthermore, during such soldering, when the temperature rises on the upper surface of the heat dissipation fin 52, on the end face 52a side, on the end face 52a of the heat dissipation fin 52, and on the heat dissipation pattern 53 near the end face 52a of the heat dissipation fin 52, since the heat dissipation fin 52 and the heat dissipation pattern 53 are made of copper, which has good thermal conductivity, the temperature rises rapidly, especially in the wide area where the heat dissipation fin 52 and the heat dissipation pattern 53 overlap, and the cream solder over this wide area can be melted. As a result, the heat dissipation fins 52 of the power transistor 50 can be soldered to the heat dissipation pattern 53 provided on the front surface of the circuit board 49 . In addition, the width (vertical direction in FIG. 15) of magnetic gap end face 25a of sub-core body 25A and magnetic gap end face 26a of sub-core body 26A in this embodiment is smaller than the width (vertical direction in FIG. 15) of heat dissipation fin 52 of power transistor 50. However, as a result of extending the magnetic flux path in the vertical direction, the magnetic flux path also spreads in the horizontal direction (vertical direction in FIG. 15) compared to the case where magnetic gap end faces 25a, 26a are opposed to each other. This leads to the generation of eddy currents that spread not only vertically but also horizontally as shown in FIG. 17. As a result, it is possible to solder wide heat dissipation fin 52 of power semiconductor 50 to heat dissipation pattern 53 provided on the front side of circuit board 49. As described above, in this embodiment, it is possible to carry out soldering work that was previously difficult, for example, soldering the heat dissipation fins 52 of the power transistor 50 to the heat dissipation pattern 53 provided on the front side of the circuit board 49, thereby making it possible to meet a variety of soldering needs. (Embodiment 2) 18 to 26 show another embodiment of the present invention. This embodiment is characterized in that the shape of the core body 4 in Figures 1 to 10 is changed to the core body 4B in Figures 18 to 26. In other words, by replacing the core body 4 in Figures 1 to 10 with the core body 4B in Figures 18 to 26, it is possible to configure the high-frequency induction heating head 1 as shown in Figures 1 to 10 and a high-frequency induction heating device using it. The configuration other than the core body 4B is the same as that in Figs. 1 to 10, so the explanation will be centered on the core body 4B to avoid complicating the explanation and to facilitate understanding. First, in the above-mentioned Figures 1 to 10, the core body 4 is formed by combining the C-shaped sub-core body 25 and the inverted C-shaped sub-core body 26, but in this embodiment, the core body 4B is formed by combining the C-shaped sub-core body 25B and the inverted C-shaped sub-core body 26B. The C-shaped sub-core body 25B and the inverted C-shaped sub-core body 26B are made of ferrite material, and are combined to form a ring-shaped core body 4B as shown in FIG. Furthermore, a magnetic gap portion 27B is formed in a part of the ring-shaped core body 4B. In the magnetic gap portion 27B, a magnetic gap end face 25b of the sub-core body 25B and a magnetic gap end face 26b of the sub-core body 26B are disposed facing toward the outer periphery of the loop-shaped core body 4B. As shown in FIG. 24, magnetic gap end face 26b of sub-core body 26B is extended in the outer circumferential direction of loop-shaped core body 4B beyond magnetic gap end face 25b of sub-core body 25B. In this configuration, the coil 5 passes linearly through the loop of the core body 4B as shown in FIG. 18, so that the magnetic flux generated in the coil 5 flows through the core body 4B and the magnetic gap portion 27B. As shown in Figs. 22 to 25, magnetic gap end surface 25b of sub-core body 25B has a smaller (thinner) cross-sectional area than the portion of sub-core body 25B other than magnetic gap portion 27B. Similarly, the magnetic gap end surface 26b of the sub-core body 26B has a smaller (thinner) cross-sectional area than the portions of the sub-core body 26B other than the magnetic gap portion 27B. The core body 4A is held in the same manner as in FIGS. 18 to 26, reference numeral 55 denotes a receptacle connector, and a case 56 of this receptacle connector 55 is disposed on one surface side of a circuit board 57 as shown in FIG. As shown in FIG. 26, connection terminals 58 of receptacle connector 55 protrude from the other surface of circuit board 57 through through holes 59 provided in circuit board 57 . As is well known, receptacle connector 55 is configured so that a pin header (not shown) is detachably coupled to case 56 on one surface side of circuit board 57. In the receptacle connector 55 used in this manner, the connection terminals 58 are soldered to the through holes 59 of the circuit board 57, and this soldering is performed by using the core body 4B of this embodiment. Furthermore, by soldering the connection terminals 58 to the through holes 59 of the circuit board 57, electrical connection is also established between the circuit pattern (not shown) of the circuit board 57 and the connection terminals 58. In such a receptacle connector 55, as shown in Figures 19 to 21, a plurality of connection terminals 58 are arranged, for example, in two rows, and since the spacing 58a between the rows is narrow, it is not possible to sandwich the connection terminals 58 between the ends of the opposing core bodies, as in the prior art. Therefore, in this embodiment, as shown in FIG. 26, first, soldering is performed for each connection terminal 58 in the first row, and then soldering is performed for each connection terminal 58 in the second row. Specifically, as shown in FIG. 26, magnetic gap end face 25b of sub-core body 25B is positioned above space 58a between the two rows, and magnetic gap end face 26b of sub-core body 26B is positioned on the side opposite space 58a of connection terminals 58 to be soldered, on the base side of connection terminals 58 protruding from circuit board 57 (solder surface side of circuit board 57), and in this state, as in the prior art, solder wire is supplied from a soldering device (not shown) so that it is brought into contact with connection terminals 58 to be soldered. Next, when current is applied to coil 5, as shown in FIG. 26, the magnetic flux flowing between magnetic gap end face 25b of sub-core body 25B and magnetic gap end face 26b of sub-core body 26B heats connection terminal 58 to be soldered, the solder thread supplied thereto, and through-hole 59 through which connection terminal 58 to be soldered passes, causing the solder thread to melt and flow into through-hole 59, thereby fixing connection terminal 58 to through-hole 59 by solder. A characteristic feature is that, as shown in Figure 26, magnetic gap end face 25b of sub-core body 25B is arranged on space 58a between the two rows, and magnetic gap end face 26b of sub-core body 26B is arranged on the side opposite space 58a of connecting terminals 58 to be soldered, on the base side of connecting terminals 58 protruding from circuit board 57 (the solder surface side of circuit board 57). In other words, in this embodiment, in the magnetic gap portion 27B of the loop-shaped core body 4B, the magnetic gap end face 26b of the sub-core body 26B is configured to extend further toward the outer periphery of the loop than the magnetic gap end face 25b of the sub-core body 25B, so that an arrangement as shown in Figure 26 can be achieved. For this reason, as shown in Figure 26, the magnetic flux flowing between magnetic gap end face 26b of sub-core body 26B and magnetic gap end face 25b of sub-core body 25B flows to connection terminal 58 to be soldered, the solder thread supplied thereto, and through hole 59 through which connection terminal 58 to be soldered passes, and these are heated, melting the solder thread and causing it to flow into through hole 59, thereby fixing connection terminal 58 to through hole 59 with solder (since high-frequency current is supplied to coil 5, at the next moment the direction of the arrow shown in Figure 26 is reversed). In other words, in this embodiment, even when two rows of connection terminals 58 are arranged with a narrow gap 58a between them, a magnetic flux path can be formed that extends in the direction of the connection terminals 58 to be soldered, the solder thread supplied thereto, and the through-holes 59 through which the connection terminals 58 to be soldered pass (for example, this can be expressed as the vertical direction), so that the connection terminals 58 can be easily electrically and mechanically connected to the through-holes 59 by solder. Also in this embodiment, compared to when the magnetic gap end faces 25b, 26b are opposed to each other, a wider magnetic flux path is formed in a direction perpendicular to the magnetic gap direction (for example, this is expressed as the lateral direction). However, in order to suppress the spread of the magnetic flux in the lateral direction, in this embodiment, the magnetic gap end face 25b of the subcore body 25B has a smaller (thinner) cross-sectional area than the portion other than the magnetic gap portion 27B of this subcore body 25B. Similarly, the magnetic gap end surface 26b of the sub-core body 26B has a smaller (thinner) cross-sectional area than the portion of the sub-core body 26B other than the magnetic gap portion 27B. In this manner, when soldering of one connection terminal 58 in the first row is completed, the base (an example of a holding means) holding the circuit board 57 is moved so that the next connection terminal 58 is positioned in the magnetic gap portion 27B, and the next soldering is then performed. Then, when the soldering of all the connection terminals 58 in the first row is completed, the base is then rotated and the soldering of the connection terminals 58 in the second row is carried out in sequence, until the soldering of all the connection terminals 58 is completed. That is, the receptacle connector 55 can be mounted on the circuit board 57 by soldering. In this manner, in this embodiment, it is possible to perform soldering work that was previously difficult; for example, it is possible to mount a receptacle connector 55 having multiple connection terminals arranged in two rows with a narrow spacing 58a between the rows on a circuit board 57 by soldering, thereby meeting the diverse needs of soldering. [Industrial Applicability]

[0020] The high-frequency induction heating head and the high-frequency induction heating device using the same according to the present invention can heat a specific portion without contact, and can therefore be used in soldering devices and the like. [Explanation of symbols]

[0021] 1 High frequency induction heating head 2 Main unit case 2a Top side 2b Bottom side 2c Outer surface 2A IH output connector 3 Cooling water connector 4 Core Body 4A Core Body 4B Core Body 5 Coil 6 Capacitors 7 Electrical waterway connector 8 Electrical waterway connections 9 Waterway joint 10 Base 11 Waterway joint 12 Waterway joint 13 Screw 14 Screws 15 Rubber packing 16 Screws 17 Coil base 18 Coil base 19 Waterway joint 20 Waterway joint 21 Insulating plate 22 Screw 23 Terminal section 24 Terminal section 25 Sub-core body 25A Sub-core body 25a Magnetic gap end face 25B Sub-core body 25b Magnetic gap end face 26 Sub-core body 26A Sub-core body 26a Magnetic gap end face 26B Sub-core body 26b Magnetic gap end face 27 Magnetic Gap 27A Magnetic gap section 27B Magnetic gap section 28 Through hole 29 Screw 30 Protection plate 31 Protective plate 32 Sub-protection plate 33 Sub-protection plate 34 Through hole 35 Sub-protection plate 36 Sub-protection plate 37 Through hole 38 Thermal Conductive Materials 39 Screw holes 40 Folding section 41 Screw hole 42 Folding section 43 Through hole 44 Mounting part 45 Through hole 46 Screw 47 Screw 48 screw holes 49 Circuit Board 50 Power transistor 51 Connection terminal 52 Heat dissipation fin 52a End face 53 Heat dissipation pattern 54 Through hole 55 receptacle connector 56 cases 57 Circuit Board 58 Connection terminal 58a spacing 59 Through Hole

Claims

1. The magnetic coil includes a loop-shaped core body having a magnetic gap formed in a portion thereof, and a coil that supplies magnetic flux to the core body. the core body has a first magnetic gap end surface and a second magnetic gap end surface arranged as a pair on both sides of the magnetic gap portion, one of the first and second magnetic gap end faces is located at a position extended in an outer circumferential direction of the loop shape relative to the other, A high frequency induction heating head, characterized in that the first magnetic gap end face and the second magnetic gap end face are arranged toward an outer periphery of the loop-shaped core body.

2. 2. The high frequency induction heating head according to claim 1, wherein the cross-sectional areas of the first magnetic gap end face and the second magnetic gap end face are smaller than the cross-sectional area of ​​the remaining portion of the core body.

3. 3. A high frequency induction heating device comprising: the high frequency induction heating head according to claim 1 or 2; and a holding means for holding a body to be heated that is placed in a magnetic gap portion of the high frequency induction heating head.

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