speaker

Abstract

An embodiment of the present specification discloses a speaker including a vibration assembly including a vibration element that converts an electrical signal into a mechanical vibration and a vibration housing that contacts the skin of a user's face, and a first elastic element that is elastically connected to the vibration housing.

Description

[Technical Field]

[0001] (Priority information) This invention claims priority to a PCT application with application number PCT / CN2021 / 071875, filed on January 14, 2021, the entire contents of which are incorporated herein by reference.

[0002] TECHNICAL FIELD The embodiments herein relate to the technical field of audio output, and in particular to speakers. [Background technology]

[0003] A speaker with the function of bone sound conduction can convert an audio signal into a mechanical vibration signal so that the wearer can hear the sound, and the mechanical vibration signal can be transmitted to the human auditory nerve through human tissues and bones.

[0004] The present specification provides a speaker that can reduce amplitude at a specific frequency, reduce the vibration sensation at low frequencies of the speaker, reduce sound leakage during operation of the speaker, and improve the sound quality of the speaker. Summary of the Invention [Problem to be solved by the invention]

[0005] The present invention aims to provide a speaker that reduces the amplitude of the vibration housing that comes into contact with the user's face while the speaker is in use, reduces the sense of vibration at low frequencies, reduces sound leakage from the speaker, and improves sound quality. [Means for solving the problem]

[0006] In order to achieve the above-mentioned object of the invention, the technical means according to the present invention are as follows.

[0007] The speaker includes a vibration assembly including a vibration element that converts an electrical signal into a mechanical vibration and a vibration housing that contacts the skin of the user's face, and a first elastic element that is elastically connected to the vibration housing.

[0008] In some embodiments, the loudspeaker further comprises a mass element connected to the vibration housing by the first elastic element and connected to the first elastic element to form a resonating assembly.

[0009] In some embodiments, the vibration housing includes a vibration panel that contacts the skin of a user's face, and the first elastic element is elastically connected to the vibration panel.

[0010] In some embodiments, the mass element is a channel member, the vibration element is at least partially housed within the channel member, and the first elastic element connects the vibration panel and an inner wall of the channel member.

[0011] In some embodiments, the first elastic element is a vibration transmitting sheet.

[0012] In some embodiments, the ratio of the mass of the mass element to the mass of the diaphragm panel is in the range of 0.04 to 1.25.

[0013] In some embodiments, the ratio of the mass of the mass element to the mass of the diaphragm panel is in the range of 0.1 to 0.6.

[0014] In some embodiments, the vibrating assembly generates a first resonant peak at a first frequency, the vibrating assembly generates a second resonant peak at a second frequency, and a ratio of the second frequency to the first frequency is in the range of 0.5 to 2.

[0015] In some embodiments, the vibrating assembly generates a first resonant peak at a first frequency, the vibrating assembly generates a second resonant peak at a second frequency, and a ratio of the second frequency to the first frequency is in the range of 0.9 to 1.1.

[0016] In some embodiments, the first frequency and the second frequency are both less than 500 Hz.

[0017] In some embodiments, within a frequency range below the first frequency, the amplitude of the resonating assembly is greater than the amplitude of the vibrating housing.

[0018] In some embodiments, the vibration housing includes a vibration panel and a housing back plate disposed opposite to the vibration panel, the vibration panel contacts the skin of a user's face, the mass element is connected to the housing back plate by the first elastic element, the first elastic element is disposed on a surface of the housing back plate, and a contact area between the first elastic element and the housing back plate is at least 10 mm 2 Greater than.

[0019] In some embodiments, the first elastic element includes at least one of silica gel, plastic, adhesive, urethane foam, and spring.

[0020] In some embodiments, the first elastic element is the adhesive.

[0021] In some embodiments, the adhesive has a Shore hardness in the range of 30-50.

[0022] In some embodiments, the adhesive has a tensile strength of 1 MPa or greater.

[0023] In some embodiments, the adhesive has an elongation at break in the range of 100% to 500%.

[0024] In some embodiments, the adhesive strength between the adhesive and the housing backplate is in the range of 8 MPa to 14 MPa.

[0025] In some embodiments, the thickness of the adhesive layer formed by applying the adhesive to the surface of the housing back plate is in the range of 50 μm to 150 μm.

[0026] In some embodiments, the contact area between the adhesive and the housing back plate occupies 1% to 98% of the area of ​​the inner wall of the housing back plate.

[0027] In some embodiments, the contact area between the adhesive and the housing back plate is 100 mm 2 ~200mm 2 is within the range.

[0028] In some embodiments, the contact area between the adhesive and the housing back plate is 150 mm 2 is.

[0029] In some embodiments, the first elastic element has voids in at least one of its interior and surface.

[0030] In some embodiments, the void is filled with a damping filler.

[0031] In some embodiments, the first resilient element is the polyurethane foam.

[0032] In some embodiments, the thickness of the urethane foam is in the range of 0.6 mm to 1.8 mm.

[0033] In some embodiments, the ratio of the mass of the mass element to the sum of the mass of the diaphragm panel and the housing backplate is in the range of 0.04 to 1.25.

[0034] In some embodiments, the ratio of the mass of the mass element to the sum of the mass of the diaphragm panel and the housing backplate is in the range of 0.1 to 0.6.

[0035] In some embodiments, the material from which the mass element is fabricated comprises at least one of a plastic, a metal, and a composite material.

[0036] In some embodiments, there are at least two sets of resonator assemblies, the first elastic elements of the resonator assemblies of each set are all connected to the housing back plate, and two adjacent sets of resonator assemblies are spaced a predetermined distance apart.

[0037] In some embodiments, there are at least two sets of resonator assemblies, and the at least two sets of resonator assemblies are arranged overlapping each other along the thickness direction of the first elastic element, and the first elastic elements of the two adjacent sets of resonator assemblies are connected to the mass element.

[0038] In some embodiments, the first elastic element is mounted on an inner wall of the housing back plate.

[0039] In some embodiments, the first elastic element comprises a vibrating membrane and the mass element comprises a composite structure intimately attached to a surface of the vibrating membrane.

[0040] In some embodiments, the composite structure includes at least one of a cone, an aluminum sheet, or a copper sheet.

[0041] In some embodiments, a sound emission hole is formed in the vibration housing, and sound generated by vibration of the resonator assembly is emitted to the outside through the sound emission hole.

[0042] In some embodiments, the sound emission holes are formed in the back plate of the housing.

[0043] In some embodiments, the first resilient element is mounted on an outer wall of the housing back plate.

[0044] In some embodiments, the mass element is a groove member, the vibration housing is at least partially housed within the groove member, and the first elastic element connects the outer wall of the vibration housing and the inner wall of the groove member, and a sound emitting passage is formed between the inner wall of the groove member and the outer wall of the vibration housing.

[0045] In some embodiments, the speaker further comprises a functional element, and the mass element is connected to the functional element.

[0046] In some embodiments, the functional element includes a battery, a printed circuit board.

[0047] In some embodiments, the vibration assembly further comprises a second elastic element, the vibration element transmitting the mechanical vibration to the vibration housing by means of the second elastic element.

[0048] In some embodiments, the second elastic element is a vibration transmitting sheet fixedly connected to the vibration housing.

[0049] The present specification is further illustrated by exemplary embodiments, which are not limiting and in which like numbers refer to similar structures, and will be described in detail with reference to the drawings, in which: [Brief explanation of the drawings]

[0050] [Figure 1] FIG. 1 is a block diagram of a speaker according to some embodiments of the present disclosure. [Figure 2] 1 is a schematic diagram of a longitudinal cross section of a loudspeaker without an added vibration damping assembly, according to some embodiments of the present disclosure. [Figure 3] 10 is a partial frequency response graph of a loudspeaker without an added vibration damping assembly, in accordance with some embodiments herein. [Figure 4] 1 is a schematic diagram of a vertical cross section of a loudspeaker with an added vibration damping assembly, according to some embodiments of the present disclosure. [Figure 5] 10 is a frequency response curve of a speaker with an added vibration damping assembly, according to some embodiments of the present disclosure. [Figure 6] FIG. 1 is a schematic diagram of a simplified mechanical model of a loudspeaker without an added vibration damping assembly, in accordance with some embodiments of the present disclosure. [Figure 7]FIG. 1 is a schematic diagram of a simplified mechanical model of a loudspeaker with an added vibration damping assembly, in accordance with some embodiments of the present disclosure. [Figure 8] 1 is a schematic longitudinal cross-sectional view of a loudspeaker in which the first elastic element is a diaphragm, according to some embodiments of the present disclosure. [Figure 9] 1 is a schematic diagram of a longitudinal cross section of a loudspeaker in which the mass element is a channel member, according to some embodiments of the present disclosure. [Figure 10] 1 is a schematic diagram of a cross-sectional view of another loudspeaker with an additional vibration damping assembly, according to some embodiments of the present disclosure. [Figure 11] 11 is a schematic vertical cross-sectional view of the speaker shown in FIG. 10 from another angle. [Figure 12] 1 is a cross-sectional schematic diagram of a loudspeaker with a vibration damping assembly installed inside a vibration housing, according to some embodiments of the present disclosure. [Figure 13] 1 is a sound leakage intensity graph of a speaker according to some embodiments of the present disclosure. [Figure 14] 10 is a sound pressure level graph of another speaker in accordance with some embodiments of the present disclosure. [Figure 15] 1 is a cross-sectional schematic diagram of a loudspeaker having an air gap in the first elastic element according to some embodiments of the present disclosure. [Figure 16] 1 is a schematic cross-sectional view of a loudspeaker including two resonant assemblies according to some embodiments of the present disclosure. [Figure 17] 1 is a schematic vertical cross-sectional view of another loudspeaker including two sets of resonant assemblies, according to some embodiments of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0051] In order to more clearly describe the technical means of the embodiments of the present specification, the drawings necessary for describing the embodiments will be briefly described below. Obviously, the drawings described below are only examples or parts of the embodiments of the present specification, and those skilled in the art can apply the present specification to other similar scenarios based on these drawings without any creative effort. It should be understood that these exemplary embodiments are only intended to enable those skilled in the art to better understand and implement the present invention, and do not limit the scope of the present invention in any way. Unless otherwise clear from the linguistic environment or otherwise described, the same symbols in the figures indicate the same structures or operations.

[0052] As used in this specification and claims, unless the context clearly dictates otherwise, terms such as "a," "one," "one kind," and / or "the" do not specifically refer to the singular but may include the plural. Generally, the terms "comprise" and "contain" merely indicate the inclusion of explicitly identified steps and elements, and these steps and elements are not an exclusive list; a method or device may also include other steps or elements. The term "based on" means "based at least in part on." The term "one embodiment" refers to "at least one embodiment." The term "another embodiment" refers to "at least one other embodiment." Relevant definitions of other terms are provided in the following description. Hereinafter, without loss of generality, when describing technologies related to bone conduction of the present invention, "bone conduction speaker" or "bone conduction earphone" will be used. This description is merely one form of bone conduction application, and those skilled in the art will recognize that "speaker" or "earphone" may be replaced with other similar words, such as "player" or "hearing aid."

[0053] Some embodiments of the present specification provide a speaker with bone sound conduction functionality. The speaker is equipped with a vibration damping assembly that can reduce the intensity of mechanical vibrations generated in the speaker during operation. The mechanical vibrations may be vibrations generated in the vibration housing of the speaker (e.g., the vibration panel that contacts the user's facial skin, and the housing side panels and back panel connected to the vibration panel, etc.). In some cases, using the vibration damping assembly to reduce the mechanical vibrations of the vibration housing in the low-frequency range can reduce the sense of vibration of the vibration housing in the low-frequency range and provide a more comfortable fit for the user when wearing the speaker. In other cases, reducing the intensity of the vibration of the vibration housing can also reduce sound leakage due to the vibration of the vibration housing, effectively improving the sound quality of the speaker and improving the user experience. The speaker described herein may be a speaker that transmits sound using bone conduction (i.e., conduction through bone) as one of its main methods. For example, when the speaker is operating, mechanical vibrations are generated in the vibration housing of the speaker, and the vibration housing transmits the mechanical vibrations to the user's auditory nerve via bone conduction through the user's facial skin, allowing the user to hear the sound. For ease of explanation, one or more embodiments herein will be described using a speaker as an example. Note that bone sound conduction is not the only path by which sound is transmitted to a user of a speaker herein. In some embodiments, a speaker may transmit sound in other ways. For example, a speaker may further include an air conduction (i.e., air conduction) speaker assembly, i.e., a speaker may include both a bone conduction speaker assembly and an air conduction speaker assembly, and transmit sound to a user through a combination of bone conduction and air conduction. The air conduction speaker assembly transmits vibration waves through the air to the user's auditory nerve, allowing the user to hear sound.

[0054] 1 is a block diagram of a loudspeaker according to some embodiments of the present disclosure. As shown in FIG. 1, a loudspeaker 100 may include a vibration assembly 110, a damping assembly 120, and a fixing assembly .

[0055] The vibrating assembly 110 can generate mechanical vibrations. The generation of mechanical vibrations involves the conversion of energy, and the speaker 100 can convert signals containing audio information into mechanical vibrations using the vibrating assembly 110. The conversion process can involve the coexistence and conversion of multiple different types of energy. For example, an electrical signal can be directly converted into mechanical vibrations by the energy conversion device of the vibrating assembly 110. For example, audio information can be contained in an optical signal, and a specific energy conversion device can convert the optical signal into a vibration signal. Other types of energy that can coexist and be converted during operation of the energy conversion device include thermal energy, magnetic energy, etc. The energy conversion method of the energy conversion device can include moving coil, electrostatic, piezoelectric, balanced armature, pneumatic, electromagnetic, etc. The vibrating assembly transmits the generated mechanical vibrations to the user's eardrum via bone conduction through the user's facial skin, allowing the user to hear the sound.

[0056] In some embodiments, the vibration assembly 110 may include a vibration element (e.g., vibration element 211) and a vibration housing (e.g., vibration housing 213) connected to the vibration element. The vibration element may generate mechanical vibrations, which may be transmitted to the vibration housing. The vibration housing may contact the skin of a user's face to transmit the mechanical vibrations to the user's auditory nerve.

[0057] In some embodiments, the vibration element (also referred to as an energy conversion device) may include a magnetic circuit assembly. The magnetic circuit assembly may provide a magnetic field. The magnetic field may convert a signal containing audio information into a mechanical vibration signal. In some embodiments, the audio information may include a video file, an audio file, or data or a file having a specific data format, or data or a file that can be converted into audio in a specific manner. The signal containing audio information may come from a storage assembly of the speaker 100 itself, or from an information generation, storage, or transmission system other than the speaker 100. The signal containing audio information may include one or more combinations of electrical signals, optical signals, magnetic signals, mechanical signals, etc. The signal containing audio information may come from one signal source or multiple signal sources. The multiple signal sources may be related or unrelated. In some embodiments, the speaker 100 may acquire the signal containing audio information in multiple different ways, and the acquisition of the signal may be wired, wireless, real-time, or delayed. For example, speaker 100 may receive an electrical signal containing audio information via a wired or wireless manner, or may generate an audio signal by directly acquiring data from a storage medium. For example, speaker 100 may also include an assembly with an audio collection function, capturing audio from the environment, converting the mechanical vibrations of the audio into an electrical signal, and processing the signal through an amplifier to obtain an electrical signal that meets specific requirements. In some embodiments, the wired connection may include a metal cable, an optical cable, or a combination thereof, such as one or more of a coaxial cable, a communication cable, a flexible cable, a spiral cable, a non-metallic sheathed cable, a metal sheathed cable, a multi-core cable, a twisted pair cable, a ribbon cable, a shielded cable, an electric communication cable, a paired cable, a twin-core parallel wiring, a twisted pair, etc. The above examples are merely for ease of explanation, and the medium of the wired connection may be other types of media, such as a transmission carrier for other electrical signals or optical signals.

[0058] The wireless connection may include radio communication, free-space optical communication, voice communication, electromagnetic induction, etc. The wireless communication may include the IEEE 802.11 standard, the IEEE 802.15 standard (e.g., Bluetooth technology and cellular technology), first generation mobile communication technology, second generation mobile communication technology (e.g., FDMA, TDMA, SDMA, CDMA, and SSMA), general packet radio service technology, third generation mobile communication technology (e.g., CDMA2000, WCDMA, TD-SCDMA, and WiMAX), fourth generation mobile communication technology (e.g., TD-LTE and FDD-LTE), satellite communication (e.g., GPS technology), near field communication (NFC), and other operating in other ISM frequency bands (e.g., 2.4 GHz), and the free-space optical communication may include visible light signals, infrared signals, etc., the voice communication may include sound wave signals, ultrasonic signals, etc., and the electromagnetic induction may include near field communication technology, etc. The above example is merely for ease of explanation, and the wireless connection medium may be of other types, such as Z-wave technology, other paid civilian radio frequency bands, or military radio frequency bands. For example, in some application scenarios of the present technology, the speaker 100 may receive a signal containing audio information from another device via Bluetooth (registered trademark) technology.

[0059] In some embodiments, the vibration housing may define a sealed or non-sealed housing space, and the vibration element may be installed inside the vibration housing. In some embodiments, the vibration housing may include a vibration panel and a housing side plate and a housing back plate connected to the vibration panel. For example, as shown in FIG. 2 , the vibration panel 2131, the housing side plate 2132, and the housing back plate 2133 may define a housing space, and the vibration element 211 may be installed in the housing space. In some embodiments, the housing side plate 2132 and the housing back plate 2133 may be independent members. The housing side plate 2132 and the housing back plate 2133 may be connected by a physical method or by other connecting structures. For example, the housing side plate 2132 and the housing back plate 2133 may be independently molded plate-like members and connected by adhesive. In some embodiments, the housing side plate 2132 and the housing back plate 2133 may be different parts of the same structure, i.e., there is no interrupted connecting surface between them. Illustratively, the vibration housing 213 may include a hemispherical housing or a semi-elliptical housing, and a vibration panel 2131 connected to the vibration housing 213. The hemispherical housing or the semi-elliptical housing may include a housing side plate 2132 and a housing back plate 2133, and there is no clear boundary between the housing side plate 2132 and the housing back plate 2133. For example, the portion connected to the vibration panel 2131 may be referred to as the housing side plate 2132, and the remaining portion may be referred to as the housing back plate 2133.

[0060] The diaphragm panel 2131 may be configured to contact the skin of the user's face. The diaphragm panel 2131 may be connected to the vibration element 211, and mechanical vibrations generated in the vibration element 211 may be transmitted to the user via the diaphragm panel 2131. The speaker of this specification transmits sound primarily through bone conduction, which transmits mechanical vibrations to the user through a member (e.g., the diaphragm panel 2131) that contacts the user's body (e.g., the skin of the user's face), and the vibrations are transmitted to the user's auditory nerves via the user's skin and bones, allowing the user to hear the sound. In some embodiments, the contact area between the diaphragm panel 2131 and the skin of the user's face is at least greater than a predetermined contact area. In some embodiments, the predetermined contact area is 50 mm 2 ~1000mm 2 In some embodiments, the predetermined contact area may be in the range of 75 mm 2 ~850mm 2 In some embodiments, the predetermined contact area may be in the range of 100 mm 2 ~700mm 2 may be in the range of

[0061] In some embodiments, the vibration housing may not define an accommodation space. In some embodiments, the vibration housing may not include a housing side panel or a housing back panel, and may include only a vibration panel that contacts the user's face. For example, in the embodiments shown in FIGS. 10 and 11 , the vibration housing 1013 has a plate-like structure. The plate-like vibration housing 1013 is directly connected to the vibration element 1011 and contacts the skin of the user's face. Therefore, in these embodiments, the vibration housing 1013 itself corresponds to the vibration panel.

[0062] In some embodiments, the diaphragm panel (e.g., diaphragm panel 2131 shown in FIG. 2) may be in direct contact with the skin of the user's face. In some embodiments, a vibration transmission layer may be wrapped around the outside of the diaphragm panel of speaker 100, and the vibration transmission layer may be in contact with the skin of the user's face. A vibration system formed by the diaphragm panel and the vibration transmission layer transmits the generated sound vibration to the skin of the user's face via the vibration transmission layer. In some embodiments, one vibration transmission layer may be wrapped around the outside of the diaphragm panel. In some embodiments, multiple vibration transmission layers may be wrapped around the outside of the diaphragm panel. In some embodiments, the vibration transmission layer may be made of one or more materials, and the material compositions of the different vibration transmission layers may be the same or different. In some embodiments, the multiple vibration transmission layers may be arranged overlapping each other in the thickness direction of the diaphragm panel, or may be arranged spreading out in the horizontal direction of the diaphragm panel, or a combination of the above two arrangement methods. The areas of the vibration transmission layers may be set to different sizes. In some embodiments, the area of ​​the vibration transmission layer is 1 cm or more. 2 In some embodiments, the area of ​​the vibration transmitting layer is 2 cm 2 In some embodiments, the area of ​​the vibration transmitting layer is 6 cm 2 It may be more than that.

[0063] In some embodiments, the vibration transmission layer may be made of a material with certain absorbency, flexibility, and chemical properties. For example, it may be plastic (including, but not limited to, high molecular weight polyethylene, blown nylon, engineering plastics, etc.), rubber, or other single or composite materials that can achieve similar performance. Rubber includes, but is not limited to, general-purpose rubber and specialty rubber. General-purpose rubber may include, but is not limited to, natural rubber, isoprene rubber, styrene butadiene rubber, butadiene rubber, chloroprene rubber, etc. Specialty rubber may include, but is not limited to, nitrile rubber, silicone rubber, fluororubber, polysulfide rubber, polyurethane rubber, hydrin rubber, acrylic rubber, propylene oxide rubber, etc. Styrene butadiene rubber may include, but is not limited to, emulsion-polymerized styrene butadiene rubber and solution-polymerized styrene butadiene rubber. Composite materials may include, but are not limited to, reinforcing materials such as glass fiber, carbon fiber, boron fiber, graphite fiber, graphene fiber, silicon carbide fiber, or aramid fiber. The vibration transmission layer may be a composite of other organic and / or inorganic materials, such as various glass fiber reinforced plastics composed of glass fiber reinforced unsaturated polyester, epoxy resin, or phenolic resin matrix. Other materials used in the manufacture of the vibration transmission layer further include a combination of one or more of silica gel, polyurethane, and polycarbonate.

[0064] In some embodiments, the vibration element may be connected to any location on the vibration housing. For example, in the embodiment shown in FIG. 12, the vibration element 1211 may be directly connected to the vibration panel 12131. For example, in the embodiment shown in FIG. 4, the vibration element 411 may be connected to the housing side plate 4132. Mechanical vibrations generated in the vibration element 411 are first transmitted to the housing side plate 4132, then to the vibration panel 4131, and finally transmitted to the user by the vibration panel 4131.

[0065] The vibration damping assembly 120 may be connected to a vibration housing (e.g., vibration housing 413 shown in FIG. 4 ) to reduce the intensity of mechanical vibrations of the vibration housing. In some embodiments, the vibration damping assembly 120 may be connected directly to a vibration panel of the vibration housing. For example, in the embodiment shown in FIG. 10 , the vibration damping assembly 1020 (first elastic element 1021 of the vibration damping assembly 1020) is connected to the vibration panel 12131. In some embodiments, the vibration damping assembly 120 may be connected to other members of the vibration housing. For example, in the embodiment shown in FIG. 4 , the vibration damping assembly 420 is connected to the housing back plate 4133 of the vibration housing 413.

[0066] In some embodiments, vibration damping assembly 120 may include a first elastic element (e.g., first elastic element 421 shown in FIG. 4). In some embodiments, the first elastic element may have a certain damping. In some cases, when vibration occurs in the vibration housing, the first elastic element connected thereto can absorb the mechanical energy of the vibration housing and reduce the amplitude of the vibration housing. In some embodiments, the damping of the first elastic element may be in a range of 0.005 Ns / m to 0.5 Ns / m. In some embodiments, the damping of the first elastic element may be in a range of 0.0075 Ns / m to 0.4 Ns / m. In some embodiments, the damping of the first elastic element may be in a range of 0.01 Ns / m to 0.3 Ns / m.

[0067] In some embodiments, the vibration damping assembly 120 may include a first elastic element (e.g., first elastic element 421 shown in FIG. 4 ) and a mass element (e.g., mass element 423 shown in FIG. 4 ) connected to the first elastic element. The mass element and the first elastic element may form a resonating assembly. Mechanical energy of the vibration housing may be transmitted to the mass element by the first elastic element, causing the mass element to vibrate, thereby absorbing the mechanical energy of the vibration housing and reducing the intensity of the vibration of the vibration housing. For more details of the vibration damping assembly, please refer to the descriptions of other embodiments (e.g., the embodiment shown in FIG. 4 ) in this specification, and description thereof will be omitted here.

[0068] As described in the previous embodiments, the mass element and the first elastic element formed integrally together are referred to as a resonator assembly. In some embodiments, the vibration damping assembly 120 may include one or more resonator assemblies. In some embodiments, the number of resonator assemblies may be one. For example, in the embodiment shown in FIG. 4, the vibration damping assembly 420 includes only one resonator assembly, and the first elastic element 421 is connected to the outer wall of the housing back plate 4133 of the vibration housing 413. In other embodiments, the number of resonator assemblies may be at least two. For example, in the embodiment shown in FIG. 16, the vibration damping assembly 1620 may include two resonator assemblies, both of which are mounted on the inner wall of the housing back plate 16133.

[0069] In some embodiments, when multiple sets of resonant assemblies are installed in the speaker 100, factors such as the installation location of the resonant assemblies, the connection method of each set of resonant assemblies, and the resonant frequency of the resonant assemblies may all affect the vibration damping effect of the vibration damping assembly 120.

[0070] In some embodiments, the at least two sets of resonant assemblies may be located inside the vibration housing and / or outside the vibration housing. Illustratively, both of the at least two sets of resonant assemblies may be located inside the vibration housing. For example, in the embodiment shown in FIG. 16 , both of the two sets of resonant assemblies are connected to the inner wall of the housing back plate 16133. In another example, both of the at least two sets of resonant assemblies may be located outside the vibration housing. In a further example, the at least two sets of resonant assemblies may be located inside and outside the vibration housing, respectively. For example, some of the resonant assemblies may be located outside the vibration housing, and their first elastic elements may be connected to the outer wall of the housing back plate, while other parts of the resonant assemblies may be located inside the vibration housing, and their first elastic elements may be connected to the inner wall of the housing back plate.

[0071] In some embodiments, each of the at least two resonator assemblies may be directly connected to the inner wall or the outer wall of the vibration housing. Illustratively, each of the at least two resonator assemblies may be directly connected to the inner wall of the vibration housing by adhesive bonding, welding, integral molding, riveting, screw connection, or the like. For example, in the embodiment shown in FIG. 16 , the first elastic elements (e.g., first elastic element 1621-1 and first elastic element 1621-2) of the two resonator assemblies are directly connected to the inner wall of the housing back plate 16133. In another example, at least one of the at least two resonator assemblies may not be directly connected to the inner wall of the vibration housing, but may be connected to another resonator assembly. 17, there are two resonator assemblies in total (including a first resonator assembly 1720-1 and a second resonator assembly 1720-2), and the first resonator assembly 1720-1 is directly connected to the inner wall of the housing back plate 17133 (its first elastic element 1721-1 is connected to the inner wall of the housing back plate 17133). The first elastic element 1721-2 of the second resonator assembly 1720-2 is placed on top of the first resonator assembly 1720-1 along the thickness direction of the first elastic element 1721-1 of the first resonator assembly 1720-1, and its first elastic element 1721-2 is connected to the mass element 1723-1 of the first resonator assembly 1720-1.

[0072] In some embodiments, when at least two sets of resonant assemblies are both installed on the inner wall or the outer wall of the vibration housing, adjacent two sets of resonant assemblies may be spaced apart by a predetermined distance. For example, in the embodiment shown in FIG. 16 , the vibration damping assembly 1620 includes two sets of resonant assemblies (e.g., a first resonant assembly 1620-1 and a second resonant assembly 1620-2), and the first elastic elements (e.g., a first elastic element 1621-1 and a first elastic element 1621-2) of the two sets of resonant assemblies are both directly connected to the inner wall of the housing back plate 16133, and the edges of the two first elastic elements are spaced apart by a predetermined distance. In some embodiments, the predetermined distance may be in the range of 0.1 mm to 70 mm. In some embodiments, the predetermined distance may be in the range of 0.2 mm to 60 mm. In some embodiments, the predetermined distance may be in the range of 0.3 mm to 50 mm. In some embodiments, the resonator assembly may include a positioning member that is fixedly mounted to the vibration housing and can position the first elastic element so as to precisely attach the first elastic element to the vibration housing. Illustratively, the positioning member may be a plastic injection-molded periphery mounted to the vibration housing, and the plastic injection-molded periphery can position an edge of the first elastic element.

[0073] In some embodiments, the at least two sets of resonator assemblies may be the same or similar. Here, the resonator assemblies may be the same or similar in terms of the mass elements, first elastic elements, and the resonant frequencies of the resonator assemblies. In other embodiments, the at least two sets of resonator assemblies may be different. For example, in the embodiment shown in FIG. 16, the two sets of resonator assemblies have clearly different sizes of the first elastic elements and the mass elements.

[0074] In some embodiments, the resonant frequencies of at least two sets of resonant assemblies may be different. In some cases, when the resonant frequencies of each set of resonant assemblies are different, each set of resonant assemblies can achieve vibration damping effects in a frequency band near its respective resonant frequency. For example, based on the embodiment shown in FIG. 4 , the vibration damping assembly 420 further includes another set of resonant assemblies (also including a mass element and a first elastic element) with a resonant frequency of approximately 300 Hz, which can effectively absorb mechanical energy of the vibration housing 413 in a frequency range of 250 Hz to 350 Hz. The original resonant assembly (i.e., the resonant assembly composed of the mass element 423 and the first elastic element 421) has a resonant frequency of a second frequency f0 and can effectively absorb mechanical energy of the vibration housing 413 in a low-frequency range (e.g., 100 Hz to 200 Hz). Therefore, the two sets of resonant assemblies of the vibration damping assembly 420 can absorb the mechanical energy of the vibration housing 413 within two frequency bands, effectively widening the frequency band in which the vibration damping assembly 420 absorbs vibrations.

[0075] In some other embodiments, the resonant frequencies of each set of resonant assemblies may be the same or similar. When the resonant frequencies of the resonant assemblies are the same or similar, the vibration damping effect in the frequency band around the corresponding resonant frequency can be enhanced. For example, based on the embodiment shown in FIG. 4 , the vibration damping assembly 420 may further include another set of resonant assemblies (including a mass element and a first elastic element), and the resonant frequencies of the set of resonant assemblies may be the same or similar to the resonant frequency of the original resonant assembly (i.e., the resonant assembly composed of the mass element 423 and the first elastic element 421). For example, if the resonant frequencies of the two sets of resonant assemblies are both the second frequency f0, this corresponds to enhancing the vibration damping effect of the vibration damping assembly 420 in the frequency band around the second frequency f0.

[0076] In some embodiments, the vibration assembly 110 may further include a second elastic element (e.g., the second elastic element 215 shown in FIG. 2 ), which may connect the vibration element and the vibration housing, and the mechanical vibration generated in the vibration element may be transmitted to the vibration housing via the second elastic element, thereby causing the vibration of the vibration panel. For more details about the second elastic element, please refer to the descriptions of other embodiments (e.g., the embodiment shown in FIG. 2 ) in this specification, and the description will be omitted here.

[0077] The fixing assembly 130 provides a fixed support for the vibration assembly 110 and the vibration damping assembly 120, thereby maintaining stable contact between the speaker 100 and the user's facial skin. The fixing assembly 130 may include one or more fixed connection members. The one or more fixed connection members may be fixedly connected to the vibration assembly 110 and / or the vibration damping assembly 120. In some embodiments, the fixing assembly 130 can achieve binaural wearing. For example, both ends of the fixing assembly 130 may be fixedly connected to two pairs of vibration assemblies 110 (or vibration damping assemblies 120). When the user wears the speaker 100, the fixing assembly 130 can fix the two pairs of vibration assemblies 110 (or vibration damping assemblies 120) near the user's left ear and right ear, respectively. In some embodiments, the fixing assembly 130 can achieve monoaural wearing. For example, the fixing assembly 130 may be fixedly connected to only one pair of vibration assemblies 110 (or vibration damping assemblies 120). When a user wears speaker 100, fixing assembly 130 can fix vibration assembly 110 (or vibration damping assembly 120) near one of the user's ears. In some embodiments, fixing assembly 130 may be glasses, such as, but not limited to, any combination of one or more of sunglasses, virtual reality (VR), augmented reality (AR), a helmet, and a headband.

[0078] The above description of the structure of the speaker 100 is merely a specific example and should not be considered the only possible embodiment. Obviously, after understanding the basic principles of speakers, those skilled in the art can make various modifications and changes to the form and details of the specific methods and steps for implementing the speaker 100 without departing from these principles, and these modifications and changes will still fall within the scope of the above description. For example, the speaker 100 may include one or more processors, which may execute one or more audio signal processing algorithms. The audio signal processing algorithms may correct or enhance the audio signal. For example, the audio signal may undergo noise cancellation, acoustic feedback suppression, wide dynamic range compression, automatic gain control, active environmental recognition, active noise cancellation, directional processing, tinnitus prevention processing, multi-channel wide dynamic range compression, active feedback suppression, volume control, or other similar processing, or any combination thereof, and these modifications and changes will still fall within the scope of the present invention. Also, for example, the speaker 100 may include one or more sensors, such as a temperature sensor, a humidity sensor, a speed sensor, a displacement sensor, etc., which may collect user information or environmental information.

[0079] 2 is a schematic cross-sectional view of a loudspeaker 200 without a vibration damping assembly according to some embodiments of the present disclosure. As shown in FIG. 2, the loudspeaker 200 may include a vibration assembly 210 and a stationary assembly 230.

[0080] In some embodiments, the vibration assembly 210 may include a vibration element 211, a vibration housing 213, and a second elastic element 215 elastically connecting the vibration element 211 and the vibration housing 213. The vibration element 211 can generate mechanical vibrations by converting an audio signal into a mechanical vibration signal. The mechanical vibrations generated in the vibration element 211 can be transmitted to the vibration housing 213 connected thereto by the second elastic element 215, causing vibrations in the vibration housing 213. Note that when the vibration element 211 transmits the mechanical vibrations to the vibration housing 213 via the second elastic element 215, the vibration frequency of the vibration housing 213 is the same as the vibration frequency of the vibration element 211.

[0081] The vibration element 211 described herein may be an element, such as a transducer, that converts an audio signal into a mechanical vibration signal. In some embodiments, the vibration element 211 may include a magnetic circuit assembly and a coil, where the magnetic circuit assembly can generate a magnetic field and the coil can generate mechanical vibration in the magnetic field. Specifically, a signal current may be passed through the coil, and the coil is located in the magnetic field generated by the magnetic circuit assembly and receives an ampere force, which drives the coil to generate mechanical vibration. At the same time, the magnetic circuit assembly receives a counterforce opposite to the coil. Under the action of the ampere force, the vibration element 211 can generate mechanical vibration. The mechanical vibration of the vibration element 211 can be transmitted to the vibration housing 213 so that the vibration housing 213 vibrates together with the vibration.

[0082] In some embodiments, the vibration housing 213 may include a vibration panel 2131, housing side panels 2132, and a housing back panel 2133. The vibration panel 2131 may also be referred to as a housing panel, and may refer to all components of the vibration housing 213 that come into contact with the user's facial skin. The housing back panel 2133 is located on the surface facing the vibration panel 2131, i.e., the surface away from the user's facial skin. In some embodiments, the vibration panel 2131 and the housing back panel 2133 are respectively installed on both end surfaces of the housing side panels 2132. The vibration panel 2131, the housing side panels 2132, and the housing back panel 2133 may form a shell-like structure having a certain storage space. The vibration element 211 may be installed inside the shell-like structure.

[0083] In some embodiments, the diaphragm panel 2131 may be directly connected to the housing side plate 2132. For example, the diaphragm panel 2131 and the housing side plate 2132 may be connected by adhesive bonding, riveting, welding, screw connection, integral molding, etc. In some embodiments, the diaphragm panel 2131 and the housing side plate 2132 may be connected by a connecting member.

[0084] In some embodiments, the diaphragm panel 2131 and the housing side plate 2132 may be rigidly connected. For example, when the diaphragm panel 2131 and the housing side plate 2132 are connected by welding, riveting, or the like, the diaphragm panel 2131 and the housing side plate 2132 are rigidly connected after the connection. In some embodiments, the diaphragm panel 2131 and the housing side plate 2132 may be elastically connected. For example, when the diaphragm panel 2131 and the housing side plate 2132 are connected by an elastic member (e.g., a spring, urethane foam, adhesive, etc.), the diaphragm panel 2131 and the housing side plate 2132 are elastically connected after the connection. In some embodiments, the connecting member may have a certain elasticity to reduce the intensity of mechanical vibrations transmitted to the housing side plate and the housing back plate by the connecting member and to reduce sound leakage due to vibration of the vibrating housing. The elasticity of the connecting member is determined by various aspects, such as the material, thickness, and structure of the connecting member. In some embodiments, whether the diaphragm panel 2131 and the housing side plate 2132 are rigidly or elastically connected may be determined according to actual circumstances. Exemplarily, it may be determined according to the connection status of the vibration element 211 and the vibration housing 213. For example, in the embodiment shown in FIG. 4, when the vibration element 411 is connected to the housing side plate 4132, the diaphragm panel 4131 and the housing side plate 4132 may be rigidly connected. Also, for example, in the embodiment shown in FIG. 12, when the vibration element 1211 is connected to the diaphragm panel 12131, the diaphragm panel 12131 and the housing side plate 12132 may be elastically connected.

[0085] The materials of the connecting members include, but are not limited to, steel (e.g., stainless steel, carbon steel, etc.), lightweight alloys (e.g., aluminum alloys, beryllium copper, magnesium alloys, titanium alloys, etc.), plastics (e.g., high molecular weight polyethylene, blown nylon, engineering plastics, etc.), and other single or composite materials that can achieve similar performance. Composite materials include, but are not limited to, reinforcing materials such as glass fiber, carbon fiber, boron fiber, graphite fiber, graphene fiber, silicon carbide fiber, or aramid fiber. The materials that make up the connecting members may also be composites of other organic and / or inorganic materials, such as glass fiber-reinforced unsaturated polyester, various glass fiber-reinforced plastics composed of an epoxy resin or phenolic resin matrix.

[0086] In some embodiments, the thickness of the connecting member may be 0.005 mm or more. In some embodiments, the thickness of the connecting member may be 0.005 mm to 3 mm. In some embodiments, the thickness of the connecting member may be 0.01 mm to 2 mm. In some embodiments, the thickness of the connecting member may be 0.01 mm to 1 mm. In some embodiments, the thickness of the connecting member may be 0.02 mm to 0.5 mm.

[0087] In some embodiments, the connecting member may be configured as a ring, and the ring-shaped connecting member may have a different shape. Exemplarily, the connecting member may include at least one circular ring. In another example, the connecting member may include at least two circular rings, which may be concentric or non-concentric, and the rings are connected by at least two support rods, which extend from the center of the outer ring to the center of the inner ring. In some embodiments, the connecting member may include at least one elliptical ring. Exemplarily, the connecting member may include at least two elliptical rings, each with a different radius of curvature, and the rings are connected by a support rod. In some embodiments, the connecting member may include at least one square ring. In some embodiments, the connecting member may be configured as a sheet. Exemplarily, an openwork pattern may be formed on the sheet-shaped connecting member. In some embodiments, the area of ​​the openwork pattern is equal to or greater than the area of ​​the non-openwork portion of the connecting member. It should be noted that the materials, thicknesses, and structures of the connecting members described above can be combined in any manner to form different connecting members. In some embodiments, the annular connecting member may have different thickness distributions. For example, the thickness of the support rod may be equal to the thickness of the annulus. Alternatively, the thickness of the support rod may be greater than the thickness of the annulus. For example, the connecting member may include at least two annulus rings connected by at least two support rods, the support rods extending from the outer annulus to the center of the inner annulus, and the thickness of the inner annulus is greater than the thickness of the outer annulus. In this embodiment, since the diaphragm panel 2131 is connected to the housing side plate 2132, the source of the mechanical vibration generated in the diaphragm panel 2131 is mechanical energy transmitted from the housing side plate 2132. To ensure that the diaphragm panel 2131 has a sufficiently large mechanical vibration intensity to ensure a greater volume of sound received by the user's auditory nerve, the diaphragm panel 2131 and the housing side plate 2132 may be rigidly connected.

[0088] In some embodiments, the diaphragm panel 2131, the housing side panels 2132, and the housing back panel 2133 may be made of the same material or different materials. For example, the diaphragm panel 2131 and the housing side panels 2132 may be made of the same material, and the material used to make the housing back panel 2133 may be different from the material used to make the other panels. In some embodiments, the diaphragm panel 2131, the housing side panels 2132, and the housing back panel 2133 may each be made of a different material.

[0089] In some embodiments, the material from which diaphragm panel 2131 is fabricated may be selected from the group consisting of acrylonitrile butadiene styrene (ABS), polystyrene (PS), high impact polystyrene (HIPS), polypropylene (PP), polyethylene terephthalate (PET), polyester (PES), polycarbonate (PC), polyamides (PA), polyvinyl chloride (PVC), polyurethanes (PU), polyvinylidene chloride, polyethylene (PE), polymethyl methacrylate (PMMA), and the like. Examples of suitable materials include, but are not limited to, poly(methacrylate, PMMA), polyetheretherketone (PEEK), phenolic (PF), urea-formaldehyde (UF), melamine formaldehyde (MF), and some metals, alloys (e.g., aluminum alloys, chromium-molybdenum steel, scandium alloys, magnesium alloys, titanium alloys, magnesium-lithium alloys, nickel alloys, etc.), glass fiber, or carbon fiber, or a combination of any of the above materials. In some embodiments, the material for manufacturing the diaphragm panel 2131 is any combination of glass fiber, carbon fiber, and materials such as polycarbonate (PC), polyamides (PA), etc. In some embodiments, the material for manufacturing the diaphragm panel 2131 may be a mixture of carbon fiber and polycarbonate (PC) in a certain ratio.In some embodiments, the material for manufacturing the diaphragm panel 2131 may be a mixture of carbon fiber, glass fiber, and polycarbonate (PC) in a certain ratio. In some embodiments, the material for manufacturing the diaphragm panel 2131 may be a mixture of glass fiber and polycarbonate (PC) in a certain ratio, or a mixture of glass fiber and polyamides (PA) in a certain ratio.

[0090] In some embodiments, diaphragm panel 2131 needs to have a certain thickness to ensure its rigidity. In some embodiments, diaphragm panel 2131 may have a thickness of 0.3 mm or more. In some embodiments, diaphragm panel 2131 may have a thickness of 0.5 mm or more. In some embodiments, diaphragm panel 2131 may have a thickness of 0.8 mm or more. In some embodiments, diaphragm panel 2131 may have a thickness of 1 mm or more. As the thickness increases, the weight of vibration housing 213 also increases, which increases the weight of speaker 200 and affects the sensitivity of speaker 200. Therefore, it is preferable that the thickness of diaphragm panel 2131 not be too large. In some embodiments, diaphragm panel 2131 may have a thickness of 2.0 mm or less. In some embodiments, diaphragm panel 2131 may have a thickness of 1.5 mm or less.

[0091] In some embodiments, the relevant parameters of the diaphragm panel 2131 may further include the relative density, tensile strength, modulus of elasticity, Rockwell hardness, etc., of the material from which the diaphragm panel 2131 is manufactured. In some embodiments, the relative density of the material of the diaphragm panel may be 1.02 to 1.50. In some embodiments, the relative density of the material of the diaphragm panel may be 1.14 to 1.45. In some embodiments, the relative density of the material of the diaphragm panel may be 1.15 to 1.20. In some embodiments, the tensile strength of the material of the diaphragm panel may be 30 MPa or more. In some embodiments, the tensile strength of the material of the diaphragm panel may be 33 MPa to 52 MPa. In some embodiments, the tensile strength of the material of the diaphragm panel may be 60 MPa or more. In some embodiments, the modulus of elasticity of the material of the diaphragm panel may be 1.0 GPa to 5.0 GPa. In some embodiments, the modulus of elasticity of the material of the diaphragm panel may be 1.4 GPa to 3.0 GPa. In some embodiments, the modulus of elasticity of the material of the diaphragm panel may be 1.8 GPa to 2.5 GPa. In some embodiments, the hardness (Rockwell hardness) of the material of the diaphragm panel may be 60 to 150. In some embodiments, the hardness of the material of the diaphragm panel may be 80 to 120. In some embodiments, the hardness of the material of the diaphragm panel may be 90 to 100. In some embodiments, considering both the relative density and tensile strength of the material of the diaphragm panel, the relative density may be 1.02 to 1.1, and the tensile strength may be 33 MPa to 52 MPa. In some embodiments, the relative density may be 1.20 to 1.45, and the tensile strength may be 56 MPa to 66 MPa.

[0092] In some embodiments, the diaphragm panel 2131 may be configured in different shapes, for example, the diaphragm panel 2131 may be configured in a square, a rectangle, a substantially rectangular shape (e.g., a rectangle with four corners replaced by arcs), an oval, a circle, or any other shape.

[0093] In some embodiments, diaphragm panel 2131 may be made of the same type of material. In some embodiments, diaphragm panel 2131 may be made by laminating two or more types of materials. In some embodiments, diaphragm panel 2131 may be made by combining one layer of a material with a high Young's modulus and one layer of a material with a low Young's modulus. In this way, there are advantages in that the rigidity requirements of diaphragm panel 2131 can be guaranteed, and comfort when in contact with the human face can be improved, and the fit of diaphragm panel 2131 when in contact with the human face can be improved. In some embodiments, the high Young's modulus material is selected from the group consisting of acrylonitrile butadiene styrene (ABS), polystyrene (PS), high impact polystyrene (HIPS), polypropylene (PP), polyethylene terephthalate (PET), polyester (PES), polycarbonate (PC), polyamides (PA), polyvinyl chloride (PVC), polyurethanes (PU), polyvinylidene chloride, polyethylene (PE), polymethyl methacrylate (PMMA), and polyisocyanate (POLYMETHYL ... The material may be any of the following materials: polymethacrylate (PMMA), polyetheretherketone (PEEK), phenolic formaldehyde resin (Phenolics (PF), urea formaldehyde (UF), melamine formaldehyde (MF), and some metals, alloys (e.g., aluminum alloy, chromium-molybdenum steel, scandium alloy, magnesium alloy, titanium alloy, magnesium-lithium alloy, nickel alloy, etc.), glass fiber, or carbon fiber, or a combination of any of the above materials.

[0094] In some embodiments, the diaphragm 2131 may directly contact the skin of the user's face. In some embodiments, the portion of the diaphragm 2131 that contacts the skin of the user's face may be the entire area or a portion of the area of ​​the diaphragm 2131. For example, if the diaphragm 2131 has an arc-shaped structure, only a portion of the area of ​​the arc-shaped structure contacts the skin of the user's face. In some embodiments, the diaphragm 2131 may be in surface contact with the skin of the user's face. In some embodiments, the surface of the diaphragm 2131 that contacts the skin of the user's face may be flat. In some embodiments, the outer surface of the diaphragm 2131 may have some protrusions or recesses. In some embodiments, the outer surface of the diaphragm 2131 may be a curved surface with an arbitrary contour.

[0095] In some embodiments, the vibration panel 2131 may be in indirect contact with the user's facial skin, for example, the vibration transmission layer in the above-mentioned embodiments may be installed on the vibration panel 2131, and the vibration transmission layer may be interposed between the vibration panel 2131 and the user's facial skin and may contact the user's facial skin instead of the vibration panel 2131.

[0096] The vibration element 211 includes a magnetic circuit assembly, and the vibration element 211 is accommodated in the vibration housing 213. Therefore, the larger the volume of the vibration housing 213 (i.e., the volume of the accommodation space), the larger the magnetic circuit assembly that can be accommodated inside the vibration housing 213, and therefore the higher the sensitivity of the speaker 200. The sensitivity of the speaker 200 can be reflected by the volume of the sound generated by the speaker 200 after a certain audio signal is input. When the same audio signal is input, the higher the volume generated by the speaker 200, the higher the sensitivity of the speaker 200. In some embodiments, the volume of the speaker 200 increases as the volume of the accommodation space of the vibration housing 213 increases. Therefore, in this specification, there are also certain requirements for the volume of the vibration housing 213. In some embodiments, the volume of the vibration housing 213 is set to 2000 m or more so that the speaker 200 has high sensitivity (volume). 3 ~6000mm 3 In some embodiments, the volume of the vibration housing 213 may be 2000 m 3 ~5000mm 3 In some embodiments, the volume of the vibration housing 213 may be 2800 m 3 ~5000mm 3 In some embodiments, the volume of the vibration housing 213 may be 3500 m 3 ~5000mm 3 In some embodiments, the volume of the vibration housing 213 may be 1500 m 3 ~3500mm 3 In some embodiments, the volume of the vibration housing 213 may be 1500 m 3 ~2500mm 3 may be.

[0097] In some embodiments, the fixing assembly 230 is fixedly connected to the vibration housing 213 of the vibration assembly 210. The fixing assembly 230 maintains stable contact between the speaker 200 and the user's facial skin, preventing the speaker 200 from shaking and ensuring that the vibration panel 2131 can stably transmit sound. In some embodiments, the fixing assembly 230 may be an arc-shaped elastic member that can generate a resilient force at the center of the arc to ensure stable contact with the human skull. Taking an example in which an earhook is used as the fixing assembly 230, referring to FIG. 2 , the tip point p of the earhook can be considered a fixed point because it closely contacts the human head. The earhook is fixedly connected to the housing side plate 2132 and fixed to the housing side plate 2132 or the housing back plate 2133 by a fixed connection method, such as adhesive bonding, locking, welding, or screwing. The portion of the ear hook connected to the vibration housing 213 may be made of the same material as, a different material from, or partially made of the same material as, the housing side plate 2132 or the housing back plate 2133. In some embodiments, the ear hook may further include a plastic, silica gel, and / or metal material so that the ear hook has low stiffness (i.e., a low spring constant). For example, the ear hook may include an arc-shaped titanium wire. In some embodiments, the ear hook may be integrally molded with the housing side plate 2132 or the housing back plate 2133. For more examples of vibration assembly 210 and vibration housing 213, reference may be made to PCT applications with application numbers PCT / CN2019 / 070545 and PCT / CN2019 / 070548, filed on January 5, 2019, the contents of which are incorporated herein by reference in their entireties.

[0098] As described above, the vibration assembly 210 further includes the second elastic element 215. The second elastic element 215 can elastically connect the vibration element 211 and the vibration housing 213 (e.g., the housing side plate 2132 of the vibration housing 213) so that mechanical vibration of the vibration element 211 is transmitted to the housing side plate 2132 of the vibration housing 213 by the second elastic element 215, and ultimately generates vibration in the diaphragm panel 2131. When mechanical vibration is generated in the diaphragm panel 2131, the diaphragm panel 2131 comes into contact with the skin on the face of the wearer (or user), and transmits the mechanical vibration to the auditory nerve via bones in a bone conduction manner, thereby making the user hear sound.

[0099] In some embodiments, the vibration element 211 and the second elastic element 215 may be housed inside the vibration housing 213, and the second elastic element 215 may connect the vibration element 211 to an inner wall of the vibration housing 213. In some embodiments, the second elastic element 215 may include a first portion and a second portion. The first portion of the second elastic element 215 may be connected to the vibration element 211 (e.g., a magnetic circuit assembly of the vibration element 211), and the second portion of the second elastic element 215 may be connected to the inner wall of the vibration housing 213.

[0100] In some embodiments, the second elastic element 215 may be a vibration transmission sheet. A first portion of the vibration transmission sheet may be connected to the vibration element 211, and a second portion of the vibration transmission sheet may be connected to the vibration housing 213. Specifically, the first portion of the vibration transmission sheet may be connected to the magnetic circuit assembly of the vibration element 211, and the second portion of the vibration transmission sheet may be connected to the inner wall of the vibration housing 213. Preferably, the vibration transmission sheet has an annular structure, and the first portion of the vibration transmission sheet is closer to the central region of the vibration transmission sheet than the second portion. For example, the first portion of the vibration transmission sheet may be located in the central region of the vibration transmission sheet, and the second portion is located on the periphery of the vibration transmission sheet.

[0101] In some embodiments, the vibration transmission sheet may be an elastic member. The elasticity of the vibration transmission sheet may be determined by various aspects such as the material, thickness, and structure of the vibration transmission sheet.

[0102] In some examples, the material from which the vibration transmission sheet is fabricated may be other single or composite materials capable of achieving similar performance, including, but not limited to, plastic (e.g., including but not limited to, high molecular weight polyethylene, blown nylon, engineering plastics, etc.), steel (e.g., including but not limited to, stainless steel, carbon steel, etc.), lightweight alloys (e.g., including but not limited to, aluminum alloys, beryllium copper, magnesium alloys, titanium alloys, etc.). Composite materials may include, but are not limited to, reinforcing materials such as glass fiber, carbon fiber, boron fiber, graphite fiber, graphene fiber, silicon carbide fiber, or aramid fiber, or composites of other organic and / or inorganic materials, such as various glass fiber reinforced plastics composed of glass fiber reinforced unsaturated polyester, epoxy resin, or phenolic resin matrices.

[0103] In some embodiments, the vibration transmission sheet may have a constant thickness. In some embodiments, the thickness of the vibration transmission sheet may be 0.005 mm or more. In some embodiments, the thickness of the vibration transmission sheet may be 0.005 to 3 mm. In some embodiments, the thickness of the vibration transmission sheet may be 0.01 mm to 2 mm. In some embodiments, the thickness of the vibration transmission sheet may be 0.01 mm to 1 mm. In some embodiments, the thickness of the vibration transmission sheet may be 0.02 mm to 0.5 mm.

[0104] In some embodiments, the elasticity of the vibration transmission sheet may be provided by its structure. For example, the vibration transmission sheet may have an elastic structure, and even if the material used to manufacture the vibration transmission sheet is highly rigid, the elasticity can be provided by the structure of the vibration transmission sheet. In some embodiments, the structure of the vibration transmission sheet may include, but is not limited to, a spring-like structure, a ring-like structure, or a substantially ring-like structure. In some embodiments, the structure of the vibration transmission sheet may be configured in a sheet-like shape. In some embodiments, the structure of the vibration transmission sheet may be configured in a striped shape. Specific structures of the vibration transmission sheet can be combined based on the materials, thicknesses, and structures described above to form different vibration transmission sheets. For example, a sheet-like vibration transmission sheet may have a different thickness distribution, such that the thickness of a first portion of the vibration transmission sheet is greater than the thickness of a second portion of the vibration transmission sheet. In some embodiments, the number of vibration transmission sheets may be one or more. For example, the number of vibration transmission sheets may be two, with the second portions of the two vibration transmission sheets being connected to the inner walls of the two housing side plates 2132 that are positioned opposite each other, and the first portions of the two vibration transmission sheets being both connected to the vibration element 211.

[0105] In some embodiments, the vibration transmission sheet may be directly connected to the vibration housing 213 and the vibration element 211. Illustratively, the vibration transmission sheet may be connected to the vibration element 211 and the vibration housing 213 by adhesive. In another example, the vibration transmission sheet may be further fixed to the vibration element 211 and the vibration housing 213 by welding, fastening, riveting, threading (e.g., connection by members such as screws, nails, screws, bolts, etc.), clamp connection, pin connection, key connection, or integral molding. For more examples of vibration transmission sheets, reference may be made to PCT applications with application numbers PCT / CN2019 / 070545 and PCT / CN2019 / 070548 filed on January 5, 2019, the contents of which are incorporated herein by reference in their entireties.

[0106] In some embodiments, the vibration assembly 210 may include a first vibration transmission connecting member. The vibration transmission sheet may be connected to the vibration element 211 by the first vibration transmission connecting member. In some embodiments, the first vibration transmission connecting member may be fixedly connected to the vibration element 211 as shown in FIG. 2 . For example, the first vibration transmission connecting member may be fixed to the surface of the vibration element 211. In some embodiments, a first portion of the vibration element 211 may be fixedly connected to the first vibration transmission connecting member. In some embodiments, the vibration transmission sheet may be further fixed to the first vibration transmission connecting member by welding, locking, riveting, threading (e.g., connected by members such as screws, nails, bolts, etc.), clamping, pinning, keying, or integral molding.

[0107] In some embodiments, the vibration assembly 210 may further include a second vibration transmission connecting member, which may be fixed to an inner wall of the vibration housing 213. For example, the second vibration transmission connecting member may be fixed to an inner wall of the housing side plate 2132. The vibration transmission sheet may be connected to the vibration housing 213 by the second vibration transmission connecting member. In some embodiments, the second portion of the vibration element 211 may be fixedly connected to the second vibration transmission connecting member. The manner of connection between the second vibration transmission connecting member and the vibration transmission sheet may be the same as or similar to the manner of connection between the first vibration transmission connecting member and the vibration transmission sheet in the above-described embodiments, and therefore, description thereof will be omitted here.

[0108] FIG. 3 is a frequency response graph of a portion of a speaker without an additional vibration damping assembly, according to some embodiments of the present disclosure. The horizontal axis represents frequency, and the vertical axis represents the strength (also referred to as amplitude) of vibration of the speaker 200. The vibration strength here may be understood to be the vibration acceleration of the speaker 200. A larger value on the vertical axis indicates a larger amplitude of the speaker 200, and thus a stronger sense of vibration of the speaker 200. For ease of explanation, in some embodiments, an audio frequency range below 500 Hz may be referred to as a low-frequency region, an audio frequency range from 500 Hz to 4000 Hz may be referred to as a mid-frequency region, and an audio frequency range above 4000 Hz may be referred to as a high-frequency region. In some embodiments, audio in the low-frequency region may give a user a clear sense of vibration. If a sharp peak appears in the low-frequency region (i.e., the vibration acceleration of a certain frequency is much higher than the vibration acceleration of other nearby frequencies), on the one hand, the audio heard by the user may be harsh and shrill, and on the other hand, the strong sense of vibration may also be unpleasant. Therefore, it is desirable that no sharp peaks or dips appear within the low frequency range, and the flatter the frequency response curve, the better the acoustic effect of the speaker 200.

[0109] 3, speaker 200 generates a low-frequency resonance peak in the low-frequency region (around 100 Hz). For ease of explanation, speaker 200 can be considered to generate a first resonance peak at a first frequency. This low-frequency resonance peak can be understood to be generated by the cooperative action of vibrating assembly 210 and fixing assembly 230. Because the vibration acceleration of this low-frequency resonance peak is large, the vibration sensation of diaphragm 2131 is strong, and the user may experience facial pain when wearing speaker 200, affecting the user's comfort and experience during use.

[0110] 4 is a schematic cross-sectional view of a loudspeaker 400 with a vibration damping assembly added thereto, according to some embodiments of the present disclosure. As shown in FIG. 4, the loudspeaker 400 includes a vibration assembly 410 and a vibration damping assembly 420.

[0111] In some embodiments, the vibration assembly 410 may include a vibration element 411, a vibration housing 413, and a second elastic element 415. The vibration housing 413 may include a vibration panel 4131, a housing side plate 4132, and a housing back plate 4133. The housing side plate 4132 of the vibration housing 413 is elastically connected to the vibration element 411 by the second elastic element 415. When mechanical vibration occurs in the vibration element 411, the mechanical vibration is transmitted to the housing side plate 4132 via the second elastic element 415, and further transmitted to the diaphragm 4131 and the housing back plate 4133 via the housing side plate 4132, causing the diaphragm panel 4131 and the housing back plate 4133 to vibrate. In some embodiments, the vibration element 411, the vibration housing 413, and the second elastic element 415 are the same as or similar to the vibration element 211, the vibration housing 213, and the second elastic element 215 of the speaker 200, respectively, and detailed descriptions of their structures are omitted here.

[0112] In some embodiments, the vibration damping assembly 420 may include a mass element 423 and a first elastic element 421, where the first elastic element 421 and the mass element 423 are fixedly connected to form a resonating assembly. The mass element 423 may be connected to the vibration housing 413 by the first elastic element 421. The vibration housing 413 can transmit mechanical vibrations to the mass element 423 via the first elastic element 421, driving the mass element 423 to generate mechanical vibrations in the mass element 423. When mechanical vibrations occur in the mass element 423, the vibration acceleration of the vibration housing 413, i.e., the intensity of the vibrations, can be reduced, thereby reducing the vibration sensation of the vibration housing 413 and improving the user experience.

[0113] In some embodiments, the first elastic element 421 may be connected to any position other than the diaphragm panel 4131 of the vibration housing 413. Illustratively, the first elastic element 421 may be connected to the housing side plate 4132 or the housing back plate 4133. For example, in the example shown in FIG. 4 , the first elastic element 421 may be connected to the outer wall of the housing back plate 4133.

[0114] 5 is a frequency response graph of a portion of a speaker with an additional vibration damping assembly according to some embodiments of the present disclosure. Also, FIG. 5 shows the frequency response curve of the resonator assembly (composed of the first elastic element and the mass element). As can be seen from FIG. 5, due to the influence of the resonator assembly, the frequency response curve of the speaker 400 in the low frequency range is flatter, which avoids the strong vibration sensation caused by the sharp low-frequency resonant peak, improving the user experience.

[0115] FIG. 6 is a schematic diagram of a simplified dynamic model of a speaker without an additional resonant assembly, according to some embodiments of the present disclosure. For ease of understanding, if a speaker does not include a resonant assembly (i.e., a mass element and a first elastic element integrated together), the dynamic model of the speaker can be equivalent to the model shown in FIG. 6. For ease of analysis and explanation, the vibration housing and the vibration element can be simplified to mass block m1 and mass block m2, the fixed assembly (e.g., ear hook) can be simplified to elastic connecting member k1, the second elastic element can be simplified to elastic connecting member k2, and the damping of elastic connecting member k1 and elastic connecting member k2 is R1 and R2, respectively. The vibration housing and the vibration element vibrate under the application of an ampere force F and an ampere force reaction force -F, respectively. The composite vibration system composed of the vibration housing, the vibration element, the second elastic element, and the fixed assembly is fixed to point p, the tip of the ear hook.

[0116] FIG. 7 is a schematic diagram of a simplified dynamic model of a speaker with an additional resonant assembly according to some embodiments of the present disclosure. Similar to FIG. 6, for ease of understanding, if a speaker includes a resonant assembly (composed of a mass element and a first elastic element), the dynamic model of the speaker can be equivalent to the model shown in FIG. 7. As shown in FIG. 7, m1 and m2 represent the masses of the vibration housing and the vibration element, respectively, m3 represents the mass of the mass element of the vibration assembly, k1 and R1 represent the elasticity and damping of the fixed assembly (e.g., ear hook), k2 and R2 represent the elasticity and damping of the second elastic element, respectively, and k3 and R3 represent the elasticity and damping of the first elastic element. The entire complex vibration system is fixed at point p, the tip of the ear hook, and the vibration housing and the vibration element vibrate under the forces F and -F, respectively. Adding the resonant assembly is equivalent to increasing the stiffness and damping of the vibration housing. At the same time, the ampere force F remains unchanged, and the reaction force -F of the ampere force remains unchanged. Therefore, the addition of the resonant assembly can reduce the amplitude of the vibration housing.

[0117] In some embodiments, the vibration assembly 410 and the resonant assembly can each generate a low-frequency resonant peak at a specific frequency in the low-frequency range. By utilizing the resonant assembly to absorb the mechanical vibration of the vibration housing 413, the purpose of reducing the amplitude of the mechanical vibration of the vibration housing 413 at that low-frequency resonant peak can be achieved. As shown in FIG. 5 , the curve "without resonant assembly" indicates the frequency response of the speaker 400 without the resonant assembly. It can be seen that the vibration assembly 410 (combined with the fixed assembly 430) can generate a first resonant peak 450 at a first frequency f. The curve "with resonant assembly - resonant assembly" indicates the frequency response of the resonant assembly itself. It can be seen that the resonant assembly can generate a second resonant peak 460 at a second frequency f. The curve "with resonant assembly - speaker" indicates the frequency response of the speaker 400 due to the interaction between the vibration assembly 410 and the resonant assembly. It can be seen that the frequency response in the low frequency range (e.g., 100 Hz to 200 Hz) of the speaker 400 to which the resonant assembly is added is flatter compared to the frequency response in the low frequency range of a speaker to which no resonant assembly is added (e.g., the speaker 200 shown in FIG. 2), and that the amplitude near the first frequency f (i.e., the frequency corresponding to the first resonant peak 450) is clearly lower than the amplitude when no resonant assembly is added.

[0118] In some exemplary application scenarios, mechanical vibrations generated in the vibration element 411 can be transmitted to the vibration housing 413 by the second elastic element 415, forcing the vibration housing 413 to vibrate. Therefore, the vibration frequency of the vibration housing 413 is the same as the vibration frequency of the vibration element 411. Similarly, the vibration housing 413 transmits mechanical vibrations to the mass element 423 of the resonator assembly by the first elastic element 421, forcing the mass element 423 to vibrate. Therefore, the vibration frequency of the mass element 423 is the same as the vibration frequency of the vibration housing 413. As can be seen from the regularity of the change in the frequency response curve of the resonator assembly itself in FIG. 5 , within the range from 100 Hz to the second frequency f0 (i.e., the frequency corresponding to the second resonant peak 460), the vibration acceleration of the resonator assembly increases with increasing frequency. When the frequency is at the second frequency f0, the second resonant peak 460 appears. When the frequency continues to increase beyond the second frequency f0, the vibration acceleration of the resonator assembly decreases with increasing frequency. The frequency response graph of the resonant assembly can reflect the response of the resonant assembly to external vibrations of different frequencies (i.e., vibrations of the vibrating housing 413). For example, within the range of frequencies at and around the second frequency f0, the resonant assembly absorbs a lot of vibration energy from the vibrating housing 413. In this way, the resonant assembly mainly reduces vibrations around the low-frequency band of the vibrating housing 413 (e.g., the frequency corresponding to the first resonant peak 450), and has little or no effect on the vibration of the vibrating housing 413 in and around bands other than the low-frequency resonant peak, which ultimately has the advantage of making the frequency response curve of the speaker 400 flatter and providing better sound quality.

[0119] In some embodiments, the first frequency f is a natural frequency of the vibrating assembly 410 (combined with the fixed assembly 430), and the second frequency f is a natural frequency of the resonating assembly. In some embodiments, the natural frequency is related to factors such as the material, mass, elastic modulus, and shape of the structure itself.

[0120] In some embodiments, the second frequency f0 corresponding to the second resonant peak 460 of the resonant assembly can be set to be close to the first frequency f corresponding to the first resonant peak 450 of the vibrating housing 413, so that the resonant assembly can effectively reduce the intensity of vibration of the first resonant peak 450 of the vibrating housing 413. As shown in FIG. 5 , in some embodiments, the ratio of the second frequency f0 to the first frequency f is in a range of 0.5 to 2. In some embodiments, the ratio of the second frequency f0 to the first frequency f is in a range of 0.65 to 1.5. In some embodiments, the ratio of the second frequency f0 to the first frequency f is in a range of 0.75 to 1.25. In some embodiments, the ratio of the second frequency f0 to the first frequency f is in a range of 0.85 to 1.15. In some embodiments, the ratio of the second frequency f0 to the first frequency f is in a range of 0.9 to 1.1.

[0121] To increase the frequency response range of speaker 400, the low-frequency resonant peaks (e.g., first resonant peak 450 and second resonant peak 460) of vibrating assembly 410 and resonating assembly 410 can be controlled to be lower in frequency by modifying their structures and materials. In some embodiments, first resonant peak 450 and second resonant peak 460 may both be controlled within the low-frequency range. In some embodiments, first frequency f and second frequency f may both be lower than 800 Hz. In some embodiments, first frequency f and second frequency f may both be lower than 700 Hz. In some embodiments, first frequency f and second frequency f may both be lower than 600 Hz. In some embodiments, first frequency f and second frequency f may both be lower than 500 Hz.

[0122] In some embodiments, by controlling the structure and materials of the resonator assembly (e.g., controlling the mass of the mass element 423, the elastic coefficient of the first elastic element 421, etc.), the resonator assembly can generate vibrations with a larger amplitude than the vibration housing 413 after the vibration housing 413 transmits vibrations to the resonator assembly. For example, the amplitude of the resonator assembly can be larger than the amplitude of the vibration housing 413 within at least a portion of a frequency range lower (or higher) than the first frequency f. In some embodiments, the fixing assembly 430 and the vibration housing 413 can be connected, and the resonator assembly does not directly contact the user. Therefore, the large amplitude vibrations of the resonator assembly do not cause an unpleasant vibration sensation to the user. In some embodiments, because the amplitude of the resonator assembly is large, the mass element 423 of the resonator assembly can be designed to have a large area. As the resonator assembly vibrates, the vibration of the large-area mass element 423 drives the air to vibrate, generating low-frequency air-conducted sound, thereby improving the low-frequency response of the speaker 400. For example, the mass element 423 can be set to a plate-like member (e.g., a circular plate, a square plate, etc.), which, when vibrated, can drive the air to vibrate, thereby generating air-conducted sound.

[0123] Referring to FIG. 5 , in some embodiments, the interaction between the vibration housing 413 and the resonator assembly can cause the speaker 400 to generate a dip 472 in the low-frequency range (approximately 150 Hz to 200 Hz), with the vibration acceleration of the dip 472 being lower than the vibration acceleration of the first resonant peak 450. Because of the formation of the dip 472, the peak value of the vibration acceleration of the speaker 400 also decreases. As can be seen from FIG. 5 , the speaker 400 has two peak values ​​of vibration acceleration, both of which are lower than the vibration acceleration of the first resonant peak 450. The above indicates that, compared to a speaker without a resonator assembly (e.g., the speaker 200 shown in FIG. 2 ), the speaker 400 with the resonator assembly not only generates a lower dip in the vibration acceleration, but also has a smaller peak value of the vibration acceleration, meaning that the vibration sensation in the low-frequency range of the vibration housing 413 is weaker. This enhances the user's experience when wearing the speaker 400.

[0124] In some embodiments, speaker 400 may generate a dip in a frequency range less than 450 Hz. In some embodiments, speaker 400 may generate a dip in a frequency range less than 400 Hz. In some embodiments, speaker 400 may generate a dip in a frequency range less than 350 Hz. In some embodiments, speaker 400 may generate a dip in a frequency range less than 300 Hz. In some embodiments, speaker 400 may generate a dip in a frequency range less than 200 Hz.

[0125] In some exemplary application scenarios, the mass of the resonator assembly is mainly provided by the mass element 423. Therefore, if the mass m3 of the mass element 423 is very small and the ratio between the mass m3 of the mass element 423 and the mass m1 of the vibration housing 413 is too small, the resonator assembly has little effect on the amplitude of the mechanical vibration of the vibration housing 413, and cannot effectively reduce the mechanical vibration around the first resonance peak 450 of the vibration housing 413. For example, if ... negligible effect on the amplitude of the vibration housing 413, and therefore the vibration acceleration of the first resonance peak 450 of the vibration housing 413 is still large, and the vibration sensation of the speaker 400 cannot be effectively reduced.

[0126] In another exemplary application scenario, if the mass m3 of the mass element 423 is very large and the ratio between the mass m3 of the mass element 423 and the mass m1 of the vibration housing 413 is too large, the impact of the resonant assembly on the amplitude of the mechanical vibration of the speaker 400 will be too large, which will obviously change the frequency response of the speaker 400. Therefore, it is necessary to control the mass m3 of the mass element 423 of the resonant assembly within a certain range.

[0127] In some embodiments, the ratio of the mass m3 of the mass element 423 of the resonator assembly to the mass m1 of the vibration housing 413 may be in the range of 0.04 to 1.25. In some embodiments, the ratio of the mass m3 of the mass element 423 of the resonator assembly to the mass m1 of the vibration housing 413 may be in the range of 0.05 to 1.2. In some embodiments, the ratio of the mass m3 of the mass element 423 of the resonator assembly to the mass m1 of the vibration housing 413 may be in the range of 0.06 to 1.1. In some embodiments, the ratio of the mass m3 of the mass element 423 of the resonator assembly to the mass m1 of the vibration housing 413 may be in the range of 0.07 to 1.05. In some embodiments, the ratio of the mass m3 of the mass element 423 of the resonator assembly to the mass m1 of the vibration housing 413 may be in the range of 0.08 to 0.9. In some embodiments, the ratio of the mass m3 of the mass element 423 of the resonator assembly to the mass m1 of the vibration housing 413 may be in the range of 0.09 to 0.75. In some embodiments, the ratio of the mass m3 of the mass element 423 of the resonator assembly to the mass m1 of the vibration housing 413 may be in the range of 0.1 to 0.6.

[0128] In some embodiments, the material for fabricating mass element 423 may include, but is not limited to, plastic, metal, composite material, etc. In some embodiments, mass element 423 may be a freestanding structure. In some embodiments, mass element 423 may be combined with other components of speaker 400 as a composite structure. For example, in the embodiment shown in FIG. 8 , first elastic element 821 is a vibrating membrane, and mass element 823 may be attached to the surface of the vibrating membrane as a composite structure to form a composite vibrating membrane structure with the vibrating membrane. In the composite vibrating membrane structure, mass element 823 may include at least one of a cone, an aluminum sheet, a copper sheet, etc. In some embodiments, speaker 400 may further include a functional element, and mass element 423 may be connected to and combined with the functional element as a composite structure. In other embodiments, mass element 423 itself may be a functional element. The functional element here may be a component that realizes one or more specific functions of speaker 400. Exemplary functional elements may include at least one of a battery, a printed circuit board, a communication assembly, etc.

[0129] In some embodiments, the mass element 423 may have one or a combination of a plate-like structure, a block-like structure, a spherical structure, a columnar structure, a conical structure, a striped structure, or any other possible structure. Illustratively, the mass element 923 may have a circular plate-like structure. In another example, as shown in FIG. 9 , the mass element 923 may be a grooved member, which may have a rectangular groove (the cross-sectional shape of the groove is rectangular) or a circular groove (the cross-sectional shape of the groove is circular). Based on the above, the specific shape and structure of the mass element of this specification may be designed according to actual needs.

[0130] 8 is a schematic longitudinal cross-sectional view of a speaker in which the first elastic element is a vibrating membrane according to some embodiments of the present disclosure. As shown in FIG. 8, the speaker 800 may include a vibration assembly 810 and a vibration damping assembly 820. The vibration assembly 810 generates mechanical vibrations and contacts the skin of a user's face to transmit the mechanical vibrations to the user's auditory nerve via the skin of the user's face via bone conduction. The vibration damping assembly 820 can reduce the vibration sensation experienced by the user when the vibration assembly vibrates.

[0131] In some embodiments, the vibration assembly 810 may include a vibration element 811, a vibration housing 813, and a second elastic element 815. The vibration element can generate mechanical vibrations based on an electrical signal. The vibration element 811 may be elastically connected to the vibration housing 813 by the second elastic element 815. When the vibration element 811 generates mechanical vibrations, the mechanical vibrations are transmitted to the vibration housing 813 via the second elastic element 815, driving the vibration housing 813 to generate mechanical vibrations, which are then transmitted to the user's facial skin, allowing the user to hear sound through the user's facial skin via bone conduction.

[0132] In some embodiments, the vibration housing 813 may include a vibration panel 8131, a housing side panel 8132, and a housing back panel 8133. In some embodiments, the vibration element 811, the vibration panel 8131, and the second elastic element 815 are the same as or similar to the vibration element 211, the vibration panel 2131, and the second elastic element 215 of the speaker 200, respectively, and detailed descriptions of their structures will not be given here.

[0133] In some embodiments, the vibration damping assembly 820 may include a resonating assembly composed of a first elastic element 821 and a mass element 823. The mass element 823 may be elastically connected to the vibration housing 813 (a housing side plate 8132 of the vibration housing 813) by the first elastic element 821. The vibration housing 813 reduces the amplitude of the vibration housing 813 because the mechanical vibration of the vibration housing 813 is partially absorbed by the mass element 823 by transmitting vibrations to the mass element 823 by the first elastic element 821.

[0134] As shown in FIG. 8 , the vibration damping assembly 820 may be housed in the vibration housing 813, and the vibration damping assembly 820 may be connected to an inner wall of a housing side plate 8132 by a first elastic element 821. In some embodiments, the first elastic element 821 may include a vibrating membrane. The peripheral side of the vibrating membrane may be connected to the interior of the housing side plate 8132 of the vibration housing 813 via a support structure or may be directly connected. The housing side plate 8132 is a side wall installed to surround the diaphragm 8131. When vibration occurs in the vibration housing 813, the housing side plate 8132 can cause the vibration of the vibrating membrane. The vibrating membrane here may be referred to as a passive vibrating membrane because it is connected to the vibration housing 813 and is driven to vibrate by the vibration housing 813. In some embodiments, the type of vibrating membrane may include, but is not limited to, a plastic vibrating membrane, a metal vibrating membrane, a paper vibrating membrane, a biological vibrating membrane, etc.

[0135] In some embodiments, the mass element 823 can be attached to the surface of the diaphragm to form a composite structure with the diaphragm. Attaching the mass element 823 to the surface of the diaphragm to form a composite structure mainly serves the following purposes: (1) the composite structure can act as a counterweight element to adjust the mass of the diaphragm system and ensure that the entire diaphragm system is within a certain mass range, so that the diaphragm itself has a large amplitude effect and can effectively reduce the amplitude in the low-frequency range of the loudspeaker 800; and (2) the composite diaphragm structure formed by combining the mass element 823 and the diaphragm can have a higher rigidity, which makes it less likely for higher-order modes to occur on the surface of the composite diaphragm, thereby avoiding the generation of multiple peaks in the frequency response of the passive diaphragm.

[0136] In some embodiments, the type of mass element 823 may include, but is not limited to, one or a combination of a cone, an aluminum sheet, or a copper sheet. In some embodiments, mass element 823 may be made of the same material. For example, a composite structure may be a cone or an aluminum sheet. In some embodiments, mass element 823 may be made of different materials. For example, mass element 823 may be a structure formed by combining a cone and a copper sheet. For example, mass element 823 may be a structure formed by mixing aluminum and copper in a certain ratio.

[0137] In some embodiments, the connection between the mass element 823 and the diaphragm may include, but is not limited to, adhesive bonding, welding, fastening, riveting, threaded connections (such as screws, nails, screws, bolts, etc.), interference fit connections, clamp connections, pin connections, key connections, and integrally molded connections.

[0138] In some exemplary application scenarios, when the diaphragm vibrates, it may cause air vibrations within the vibration housing 813. In some embodiments, a sound emitting hole 840 may be formed in the vibration housing 813 to guide the air vibrations within the vibration housing to the outside of the vibration housing 813. The guided air vibrations are transmitted to the user's auditory nerve via air conduction, allowing the user to hear sound. In some cases, the presence of the vibration damping assembly 820 may reduce the intensity of the mechanical vibration of the diaphragm 8131 and reduce the volume of the speaker 800 in the low-frequency range. However, the sound emitted from the sound emitting hole 840 may increase the response of the speaker 800 in the low-frequency range so that the speaker 800 can still maintain a constant volume even when the vibration sensation at low frequencies is reduced.

[0139] In some embodiments, the sound emission holes 840 may be formed at any position on the vibration housing 813. In some embodiments, the sound emission holes 840 may be formed on the side of the vibration housing 813 facing away from the user's face, i.e., on the housing back panel 8133. In some embodiments, the sound emission holes 840 may be formed on the housing side panel 8132, for example, at a position on the housing side panel 8132 that faces the user's ear canal. In other embodiments, the sound emission holes 840 may also be formed on corners of the vibration housing 813, for example, at the connection points of the housing side panel 8132 and the housing back panel 8133. In some embodiments, the number of sound emission holes 840 may be multiple. The multiple sound emission holes 840 may be formed at different positions. For example, some of the multiple sound emission holes 840 may be formed on the housing back panel 8133, and other parts may be formed on the housing side panel 8132. In some embodiments, at least a portion of the sound emitted by the sound emission holes 840 may be guided to the user's ear, thereby improving the low-frequency response of the speaker 800. In some embodiments, the above-described objective can be achieved by positioning the sound emitting hole 840 at a position facing the user's ear. For example, when the user wears the speaker 800, the housing side panel 8132 faces the user's ear, and the sound emitting hole 840 can be positioned on the housing side panel 8132 so that sound can be emitted through the sound emitting hole 840 and at least a portion of the sound can be guided toward the user's ear. In some embodiments, the above-described objective can be achieved by providing an additional sound-conducting structure. For example, a sound guide tube can be provided at the exit of the sound emitting hole 840, and the sound can be guided toward the user's ear through the sound guide tube. In some embodiments, the cross-sectional shape of the sound emitting hole 840 may include, but is not limited to, a circle, a square, a triangle, a polygon, etc.

[0140] In some embodiments, speaker 800 may include a fixing assembly 830, which may be fixedly connected to vibration housing 813 (e.g., housing side plate 8132 of vibration housing 813). Fixing assembly 830 can maintain stable contact between speaker 800 and the face of a user (e.g., a wearer), prevent speaker 800 from shaking, and ensure stable sound transmission from speaker 800.

[0141] In some embodiments, the less stiff the fixing assembly 830 (i.e., the smaller the spring constant), the more pronounced the low frequency response at the first resonance peak 450 of the speaker 800 (i.e., the greater the vibration acceleration and the higher the sensitivity of the speaker 800), and the higher the sound quality of the speaker 800. On the other hand, if the fixing assembly 830 has a lower stiffness (i.e., a smaller spring constant), it is more conducive to reducing the vibration of the vibration housing 813.

[0142] In some embodiments, the fixing assembly 830 may be an ear hook. One vibration housing 813 may be connected to each end of the fixing assembly 830, and the two vibration housings 813 may be fixed to either side of the user's skull in an ear hook manner. In this case, the speaker is a binaural speaker. In some embodiments, the fixing assembly 830 may be a single ear clip. The fixing assembly 830 may be connected to only one vibration housing 813, and the vibration housing 813 may be fixed to one side of the user's skull. The structure of the fixing assembly 830 may be the same as or similar to the fixing assemblies in other embodiments herein (e.g., fixing assembly 230), and therefore will not be described here.

[0143] FIG. 9 is a schematic longitudinal cross-sectional view of a speaker in which the mass element is a groove member, according to some embodiments of the present disclosure. As shown in FIG. 9 , the speaker 900 may include a vibration assembly 910, a vibration damping assembly 920, and a fixed assembly 930. The vibration assembly 910 may include a vibration element 911, a vibration housing 913, and a second elastic element 915. The second elastic element 915 elastically connects the vibration element 911 and the vibration housing 913 to transmit mechanical vibrations of the vibration element 911 to the vibration housing 913. The vibration housing 913 contacts the skin of the user's face and transmits the mechanical vibrations to the user's auditory nerve. The vibration damping assembly 920 can reduce the vibration sensation experienced by the user when the vibration housing 913 generates mechanical vibrations. The fixed assembly may be fixedly connected to the vibration damping assembly 920.

[0144] In some embodiments, the vibration element 911, the vibration housing 913, and the second elastic element 915 are the same as or similar to the vibration element 411, the vibration housing 413, and the second elastic element 415 of the speaker 400, respectively, and detailed descriptions of their structures are omitted here.

[0145] The vibration damping assembly 920 may include a mass element 923 and a first elastic element 921. The mass element 923 may be elastically connected to the vibration housing 913 by the first elastic element 921. As shown in FIG. 9 , the vibration damping assembly 920 may be connected to an outer wall of the housing back plate 9133 by the first elastic element 921. When mechanical vibration occurs in the vibration housing 913, the resonating assembly composed of the mass element 923 and the first elastic element 921 can absorb a portion of the mechanical energy of the vibration housing 913, thereby reducing the amplitude of the vibration housing 913.

[0146] Compared to speaker 400, the vibration damping assembly 920 differs in that the mass element 923 is a groove member. The vibration housing 913 may be at least partially housed in the groove member. In some embodiments, the groove cross-sectional shape of the groove member may be circular, rectangular, polygonal, or the like. In some embodiments, the groove cross-sectional shape of the groove member may match the outer contour of the vibration housing 913 so as to house the vibration housing 913. For example, if the outer contour of the vibration housing 913 is a rectangular parallelepiped, the groove cross-sectional shape of the groove member may be a corresponding rectangular shape. In some embodiments, the vibration housing 913 may be completely housed in the groove of the groove member. In some embodiments, the vibration housing 913 may be partially housed in the groove of the groove member. For example, the diaphragm panel 9131 and at least a portion of the housing side panel 9132 of the vibration housing 913 may be located outside the groove so that the diaphragm panel 9131 can easily contact the skin of the user's face and transmit vibrations.

[0147] In some embodiments, the first elastic element 921 may include a first portion and a second portion. The first portion of the first elastic element is connected to the vibration housing. The second portion of the first elastic element 921 is connected to the inner wall of the channel member. For example, in the embodiment shown in FIG. 9 , the first portion of the first elastic element 921 is connected to the outer wall of the housing back panel 9133, and the second portion of the first elastic element 921 is connected to the inner wall of the channel member. Also, for example, the first portion of the first elastic element may be connected to the outer wall of the housing side panel, and the second portion of the first elastic element may be connected to the inner bottom wall of the channel member. In some alternative embodiments, the vibration housing 913 may not include the housing back panel 9133, but may include only the diaphragm panel 9131 and the housing side panel 9132 connected thereto. In this case, the mass element 923 may be connected to the inner wall and / or the outer wall of the housing side panel 9132 by the first elastic element 921.

[0148] In some specific embodiments, the first elastic element 921 may be an annular structure, with a first portion of the first elastic element 921 located in a central region of the annular structure and a second portion located on a periphery of the annular structure. In some alternative embodiments, the first elastic element may be a spring. Both ends of the spring are connected to the vibration housing and the groove member as a first portion and a second portion, respectively.

[0149] In some embodiments, the first elastic element 921 may be directly connected to the housing back plate 9133 and the channel member, or may be connected to the housing back plate 9133 and the channel member by, for example, welding, adhesive bonding, integral molding, or the like. In some embodiments, the first elastic element 921 may be connected to the housing back plate 9133 and the channel member by a connecting member. For example, a third connecting member may be fixedly installed on the housing back plate 9133, and a first portion of the first elastic element 921 may be fixedly connected to the third connecting member. A fourth connecting member may be fixedly installed on the channel member, and a second portion of the first elastic element 921 may be fixedly connected to the fourth connecting member.

[0150] In some embodiments, the internal size of the grooved member may be larger than the external size of the vibration housing 913. In this case, a cavity may be formed between the vibration housing 913 and the grooved member. When the vibration housing 913 and the grooved member vibrate, the air in the cavity is driven to vibrate, generating sound. A sound-emitting passage 940 may also be formed between the grooved member and the outer wall of the vibration housing 913. For example, in the embodiment shown in FIG. 9 , a gap exists between the side wall of the grooved member and the housing side plate 9132, and this gap may serve as the sound-emitting passage 940. The sound generated by the air vibration between the vibration housing 913 and the grooved member can be transmitted to the outside through the sound-emitting passage 940, and the human ear can partially receive the sound, achieving the effect of increasing low frequencies to a certain extent and increasing the volume.

[0151] In some embodiments, anchoring assembly 930 can maintain speaker 900 in contact with the user's facial skull. In some embodiments, anchoring assembly 930 may be fixedly connected to damping assembly 920. For example, anchoring assembly 930 may be fixedly connected to or integrally molded with mass element 921 (e.g., a channel member). In some embodiments, anchoring assembly 930 may be fixedly connected directly to the channel member. In some embodiments, anchoring assembly 930 may be connected to the channel member by a fixed connecting member.

[0152] In some embodiments, the fixing assembly 930 may be in the form of an ear hook. A grooved member and a vibration housing 913 housed in the grooved member are connected to both ends of the fixing assembly 930, respectively, and the two grooved members are fixed to both sides of the skull in an ear-hook manner. In some embodiments, the fixing assembly 930 may be a single ear clip. The fixing assembly 930 is connected independently to one grooved member and the vibration housing 913 housed in the grooved member, and the grooved member can be fixed to one side of the human skull. The structure of the fixing assembly 930 may be the same as or similar to the fixing assemblies in other embodiments of the present application (e.g., fixing assembly 830), and therefore will not be described here.

[0153] In some embodiments, for more details about the mass element 923 and the resonant frequency of the resonant assembly formed by the mass element 923 and the first elastic element 921, reference can be made to the descriptions of other embodiments in this specification, and the description will not be repeated here.

[0154] Note that the one or more embodiments described above are for illustrative purposes only and are not intended to limit the shape or number of the speaker 900. After fully understanding the principles of the speaker 900, modifications can be made to the speaker 900 to obtain a speaker 900 different from the embodiments described herein. For example, the shape of the mass element can be changed. Also, for example, the material used to manufacture the first elastic element 921 can be adjusted so that the first elastic element 921 has a higher vibration absorption effect. In some embodiments, the first elastic element 921 can be urethane foam or adhesive. For example, the first elastic element 921 can be adhesive applied to the outer wall of the housing back plate 9133, and the groove member can be bonded to the vibration housing 913 by the adhesive. In some embodiments, the adhesive can have a certain damping property to further absorb the vibration energy of the vibration housing 913 and reduce the amplitude.

[0155] FIG. 10 is a schematic longitudinal cross-sectional view of another speaker to which a vibration damping assembly is added according to some embodiments of the present disclosure, and FIG. 11 is a schematic longitudinal cross-sectional view of the speaker shown in FIG. 10 from another angle. As shown in FIGS. 10 and 11 , the speaker 1000 may include a vibration assembly 1010, a vibration damping assembly 1020, and a fixing assembly 1030. The vibration assembly 1010 may include a vibration element 1011, a vibration housing 1013, and a second elastic element 1015 (shown in FIG. 11 ). The second elastic element 1015 elastically connects the vibration element 1011 and the vibration housing 1013. In some embodiments, the vibration element 1011, the second elastic element 1015, and the fixing assembly 1030 are the same as or similar to the vibration element 411, the second elastic element 415, and the fixing assembly 430 of the speaker 400, respectively, and detailed descriptions of their structures will not be given here.

[0156] In comparison with the speaker in the aforementioned embodiment (e.g., speaker 400), the vibration housing 1013 may be a separate plate-like or substantially plate-like structure that directly contacts the user's facial skin to transmit vibrations, and therefore the vibration housing 1013 itself corresponds to the vibration panel in the aforementioned embodiment. The vibration housing 1013 does not define an accommodation space, and the vibration element 1011 and the second elastic element 1015 are directly connected to the vibration housing 1013. The mass element 1023 may be a groove member, and the mass element 1023 may have a groove that may be the accommodation space, and at least a portion of the vibration assembly 1010 may be accommodated in the space formed by the mass element 1023. The first elastic element 1021 may connect the mass element 1023 and the vibration housing 1013.

[0157] 11, the vibration element 1011 may include a magnetic circuit assembly. A coil is installed in a vibration housing 1013, and a magnetic circuit assembly is installed around the coil. A second elastic element 1015 connects the magnetic circuit assembly and the vibration housing 1013.

[0158] In some embodiments, the second elastic element 1015 may be a vibration transmission sheet. In some embodiments, the vibration transmission sheet may have an annular structure. As shown in FIG. 11 , the annular vibration transmission sheet is disposed around the vibration housing 1013, with the peripheral side of the annular vibration transmission sheet connected to the magnetic circuit assembly and the center of the annular vibration transmission sheet connected to the vibration housing 1013. When mechanical vibration occurs due to an ampere force, the vibration housing 1013 transmits the vibration to the mass element 1023 through the first elastic element 1021, thereby causing the mass element 1023 to vibrate, ultimately achieving the effect of reducing the amplitude of the vibration assembly 1010. For more details about the vibration transmission sheet, please refer to the description of FIG. 2 . A detailed description will be omitted here.

[0159] In some cases, after the speaker undergoes the improvements described in the above embodiments, the frequency response range of the speaker is widened, especially the low frequency response range of the speaker, so that the amplitude of the low frequency resonance peak generated by the speaker in the low frequency range is significantly reduced, and the vibration sensation felt by the user on the skin when wearing the speaker is reduced, effectively improving the user's usage experience.

[0160] In addition, a speaker may experience sound leakage during operation. Sound leakage here refers to the possibility that vibrations of the speaker generate sound that is transmitted to the surrounding environment during operation, and that the sound emitted from the speaker may be heard by people in the environment other than the person wearing the speaker. Sound leakage can occur for various reasons, including when vibrations of a vibration element (e.g., an energy conversion device) are transmitted to the vibration housing by the second elastic element, causing the vibration of the vibration housing, or when vibrations of a vibration panel are transmitted to the vibration housing by the connecting member, causing the vibration of the vibration housing, or when vibrations of the vibration element cause air vibrations within the vibration housing, and the sound generated by the air vibrations is emitted from the housing through a sound emission hole formed in the housing, resulting in sound leakage.

[0161] It should be noted that sound leakage from a speaker is related to mechanical vibrations of the vibrating housing. In some cases, the greater the intensity of the mechanical vibrations of the vibrating housing, the more serious the sound leakage from the speaker. The smaller the intensity of the mechanical vibrations of the vibrating housing, the less sound leakage from the speaker. Therefore, in one or more embodiments described above, reducing the intensity of the mechanical vibrations of the vibrating housing using a vibration-damping assembly also improves sound leakage from the speaker. In some embodiments, reducing the intensity of the vibrations of the vibrating housing using a vibration-damping assembly can reduce sound leakage from the speaker. The vibration-damping assembly may be the same as or similar to that described in one or more embodiments described above. In some embodiments, the vibration-damping assembly may include a first elastic element having a certain damping, which can absorb mechanical energy from the vibrating housing (e.g., the housing side panel and the housing back panel), reduce the intensity of the vibrations of the vibrating housing, and reduce sound leakage from the speaker. In some embodiments, the vibration damping assembly may include both a first elastic element and a mass element, and the first elastic element transmits mechanical vibrations to the mass element, causing the mass element to vibrate and achieving the purpose of absorbing mechanical energy of the vibration housing.

[0162] 12 is a cross-sectional schematic diagram of a speaker having a vibration damping assembly installed inside a vibration housing according to some embodiments of the present disclosure. As shown in FIG. 12, the speaker may include a vibration assembly 1210 and a vibration damping assembly 1220. The vibration assembly 1210 may include a vibration element 1211 and a vibration housing 1213 connected to the vibration element 1211. The vibration element 1211 generates mechanical vibrations and transmits the mechanical vibrations to the vibration housing 1213, causing the vibration housing 1213 to vibrate. The vibration housing 1213 is in contact with the skin of a user's face and transmits the vibrations to the user's auditory nerve via bone conduction.

[0163] 12, the vibration housing 1213 may include a vibration panel 12131, a housing side plate 12132, and a housing back plate 12133. The housing back plate 12133 is disposed opposite the vibration panel 12131, and the housing side plate 12132 is connected between the housing back plate 12133 and the vibration panel 12131. The vibration panel 12131 may come into contact with the skin of the user's face.

[0164] In some embodiments, the diaphragm panel 12131 and the housing side panel 12132 may be directly connected, for example, by adhesive bonding, welding, riveting, nailing, or integral molding. In other embodiments, the diaphragm panel 12131 and the housing side panel 12132 may be connected by a connecting member. In some embodiments, the diaphragm panel 12131 and the housing side panel 12132 may be elastically connected to reduce the intensity of mechanical vibrations transmitted to the housing side panel 12132 and the housing back panel 12133, thereby reducing sound leakage due to vibrations of the housing side panel 12132 and the housing back panel 12133. In other embodiments, the diaphragm panel 12131 and the housing side panel 12132 may be rigidly connected. In this embodiment, because the vibration element 1211 and the diaphragm panel 12131 are directly connected, mechanical vibrations generated in the vibration element 1211 can be directly transmitted to the user via the diaphragm panel 12131. Therefore, the diaphragm panel 12131 and the housing side panel 12132 may be elastically connected to reduce the mechanical energy received by the housing side panel 12132 and the housing back panel 12133, thereby reducing sound leakage due to vibration of the housing side panel 12132 and the housing back panel 12133.

[0165] In this embodiment, the vibration element 1211 is connected to a diaphragm panel 12131 and transmits mechanical vibrations to the diaphragm panel 12131. The diaphragm panel 12131 transmits the mechanical vibrations to the housing side plates 12132 and the housing back plate 12133, causing them to vibrate. Therefore, during operation of the speaker 1200, the vibration housing 1213 continues to vibrate, and the vibration of the vibration housing 1213 causes air vibrations, resulting in sound leakage.

[0166] The vibration damping assembly 1220 includes a first elastic element 1221 and a mass element 1223. The mass element 1223 is connected to a housing side plate 12132 and a housing back plate 12133 by the first elastic element 1221. Similar to the previous embodiment, when the vibration housing 1213 vibrates, the mechanical vibration of the vibration housing 1213 is transmitted to the mass element 1223 via the first elastic element 1221, causing the mass element 1223 to vibrate. The vibration damping assembly 1220 absorbs the mechanical energy of the vibration housing 1213 (mainly the housing back plate 12133 and the housing side plate 12132) in a specific frequency band, thereby reducing the amplitude of the vibration housing 1213 and reducing sound leakage due to vibration. The specific range of the specific frequency band depends on factors such as the elastic coefficient and mass of the resonator assembly composed of the first elastic element 1221 and the mass element 1223. By varying the elastic modulus of the resonator assembly and the mass of the resonator assembly, the frequency band range over which the resonator assembly absorbs vibrations can be adjusted.

[0167] In some embodiments, by adjusting the type, hardness, thickness, and contact area of ​​the first elastic element 1221 with the vibration housing 1213, the frequency band range in which the resonator assembly absorbs vibrations can be adjusted.

[0168] Illustratively, when the first elastic element is an adhesive, in some embodiments the Shore hardness of the adhesive may be in the range of 10 to 80. In some embodiments, the Shore hardness of the adhesive may be in the range of 20 to 60. In some embodiments, the Shore hardness of the adhesive may be in the range of 25 to 55. In some embodiments, the Shore hardness of the adhesive may be in the range of 30 to 50.

[0169] An adhesive layer can be formed after the adhesive is applied to the inner wall of the housing back plate 12133, and in some embodiments, the thickness of the adhesive layer can be 10 μm to 200 μm. In some embodiments, the thickness of the adhesive layer can be 20 μm to 190 μm. In some embodiments, the thickness of the adhesive layer can be 30 μm to 180 μm. In some embodiments, the thickness of the adhesive layer can be 40 μm to 160 μm. In some embodiments, the thickness of the adhesive layer can be 50 μm to 150 μm.

[0170] In some embodiments, the contact area between the adhesive layer and the inner wall of the housing back plate 12133 may occupy 1% to 98% of the surface area of ​​the inner wall of the housing back plate 12133. In some embodiments, the contact area between the adhesive layer and the inner wall of the housing back plate 12133 may occupy 5% to 90% of the surface area of ​​the inner wall of the housing back plate 12133. In some embodiments, the contact area between the adhesive layer and the inner wall of the housing back plate 12133 may occupy 10% to 60% of the surface area of ​​the inner wall of the housing back plate 12133. In some embodiments, the contact area between the adhesive layer and the inner wall of the housing back plate 12133 may occupy 20% to 40% of the surface area of ​​the inner wall of the housing back plate 12133. In some embodiments, the contact area between the adhesive layer and the inner wall of the housing back plate 12133 may occupy 1 ... 2 ~200mm 2 In some embodiments, the contact area between the adhesive layer and the inner wall of the housing back plate 12133 is 20 mm 2 ~190mm 2In some embodiments, the contact area between the adhesive layer and the inner wall of the housing back plate 12133 is 30 mm 2 ~180mm 2 In some embodiments, the contact area between the adhesive layer and the inner wall of the housing back plate 12133 is 40 mm 2 ~170mm 2 In some embodiments, the contact area between the adhesive layer and the inner wall of the housing back plate 12133 is 50 mm 2 ~150mm 2 In some specific examples, the contact area between the adhesive layer and the inner wall of the housing back plate 12133 is 10 mm 2 may be.

[0171] FIG. 13 is a graph showing the sound leakage intensity of a speaker according to some embodiments of the present disclosure. FIG. 13 shows the sound leakage intensity curve of speaker 200 without a vibration damping assembly (i.e., the dashed line in the figure) and the sound leakage intensity curve of speaker 1200 with a vibration damping assembly 1220 (i.e., the solid line in the figure). In some embodiments, the vibration damping assembly may include only a mass element. The mass element may be an inner housing installed inside the vibration housing (i.e., the housing in FIG. 12). As can be seen from FIG. 13, the sound leakage intensity of speaker 1200 around 10,000 Hz (e.g., in the range of 10,000 Hz to 10,300 Hz) is significantly reduced due to the influence of vibration damping assembly 1220. In this embodiment, first elastic element 1221 of vibration damping assembly 1220 is an adhesive having a Shore hardness of 30 to 50. The adhesive layer formed by applying the adhesive to the inner wall of housing back plate 12133 has a thickness of 50 μm to 150 μm. The contact area between the adhesive layer and the inner wall of the housing back plate 12133 is 150mm 2 is.

[0172] The vibration damping assembly 1220 of the present specification can reduce sound leakage in the high frequency range of the speaker 1200 (e.g., 10,000 Hz to 10,300 Hz) and also reduce sound leakage in other frequency ranges of the conduction speaker 1200. In some embodiments, urethane foam is selected as the first elastic element 1221, and by adjusting the thickness of the urethane foam, its elasticity and damping can be changed to control the frequency range of sound leakage reduction to the mid-low frequency range. In some embodiments, the thickness of the urethane foam may be 0.3 mm to 2 mm. In some embodiments, the thickness of the urethane foam may be 0.4 mm to 1.9 mm. In some embodiments, the thickness of the urethane foam may be 0.5 mm to 1.8 mm. In some embodiments, the thickness of the urethane foam may be 0.6 mm to 1.8 mm.

[0173] 14 is a sound pressure level graph of another speaker according to some embodiments of the present disclosure. Fig. 14 shows a sound pressure level curve of a speaker 1200 to which a vibration damping assembly 1220 having a 0.6 mm thick urethane foam as a first elastic element 1221 is added, a sound pressure level curve of a speaker 1200 to which a vibration damping assembly 1220 having a 1.2 mm thick urethane foam as a first elastic element 1221 is added, a sound pressure level curve of a speaker 1200 to which a vibration damping assembly 1220 having a 1.8 mm thick urethane foam as a first elastic element 1221 is added, and a sound pressure level curve of a speaker 200 to which no vibration damping assembly 1220 is added. The ordinate SPL (Sound Pressure Level) indicates the sound pressure level, which may correspond to the intensity of mechanical vibration of the speaker 1200. That is, a larger value of the ordinate in the figure indicates a larger intensity of mechanical vibration of the speaker 1200. Additionally, since the mechanical vibration of the speaker 1200 mainly comes from the vibration of the vibration housing 1213 , the value of the ordinate may indicate the intensity of the mechanical vibration of the vibration housing 1213 .

[0174] 14, compared to speaker 200 without a resonator assembly (in the embodiment shown in FIG. 12, vibration damping assembly 1220 may correspond to the resonator assembly), speaker 1200 with resonator assemblies having urethane foams of 0.6 mm, 1.2 mm, and 1.8 mm thick as first elastic elements 1221 exhibits reduced vibration intensity in specific frequency band regions. For example, when the urethane foam thickness of vibration damping assembly 1220 of speaker 1200 is 0.6 mm, speaker 1200 exhibits reduced vibration intensity in the frequency range of approximately 180 Hz to 1010 Hz, and a dip appears at a frequency of approximately 1000 Hz (where the vibration intensity in the frequency range of 180 Hz to 1010 Hz is lowest). In another example, when the thickness of the urethane foam of the vibration control assembly 1220 of the speaker 1200 is 1.2 mm, the speaker 1200 exhibits reduced vibration intensity in the frequency range of approximately 170 Hz to 750 Hz, and a dip at a frequency of approximately 650 Hz (where the vibration intensity is lowest within the frequency range of 170 Hz to 750 Hz). In another example, when the thickness of the urethane foam of the vibration control assembly 1220 of the speaker 1200 is 1.8 mm, the speaker 1200 exhibits reduced vibration intensity in the frequency range of approximately 160 Hz to 350 Hz, and a dip at a frequency of approximately 300 Hz (where the vibration intensity is lowest within the frequency range of 160 Hz to 350 Hz). Because the vibration intensity is reduced, sound leakage that occurs during operation of the speaker 1200 is also reduced accordingly.

[0175] Note that the one or more embodiments described above are for illustrative purposes only and are not intended to limit the shape or number of the speaker 1200. After fully understanding the principles of sound leakage reduction of the speaker 1200, modifications can be made to the speaker 1200 to obtain a speaker 1200 different from the embodiments described herein. For example, the vibration damping assembly 1220 may be modified with reference to the above-described embodiments. In some embodiments, the vibration damping assembly 1220 may not include a mass element 1223 and may include only a first elastic element 1221. Illustratively, the first elastic element 1221 itself may have a certain damping so as to absorb and consume energy caused by vibration of the vibration housing 1213 connected thereto (e.g., the housing back plate 12133 and the housing side plate 12132 of the vibration housing 1213) and achieve the purpose of reducing sound leakage.

[0176] 15 is a cross-sectional schematic diagram of a speaker having an air gap in the first elastic element, according to some embodiments of the present disclosure. As shown in FIG. 15, the speaker 1500 may include a vibration assembly 1510 and a vibration damping assembly 1520. The vibration assembly 1510 may include a vibration element 1511 (e.g., an energy conversion device) that generates mechanical vibrations and a vibration housing 1513 that contacts the skin of a user's face. The vibration damping assembly 1520 is connected to the vibration housing 1513 to absorb the mechanical energy of the vibration housing 1513, thereby reducing the amplitude of the vibration housing 1513 and ultimately reducing sound leakage caused by the vibration of the vibration housing 1513. In some embodiments, the vibration housing 1513 (including the housing side panels 15132, the housing back panel 15133, and the housing panel 15131), the vibration element 1511, and the mass element 1523 of the speaker 1500 are the same as or similar to the vibration housing 1213 (including the housing side panels 12132, the housing back panel 12133, and the housing panel 12131), the vibration element 1211, and the mass element 1223 of the speaker 1200, and will not be described here.

[0177] In comparison with the speaker 1200, the speaker 1500 differs in that the first elastic element 1521 is not completely connected to the mass element 1523. The term "not completely connected" here may mean that an empty space remains at the contact surface between the mass element 1523 and the first elastic element 1521. Alternatively, the first elastic element 1521 may have a filler disposed therein. This will be described by way of example. In some embodiments, a gap 15211 is present on the surface of the first elastic element 1521 that faces away from the housing back plate 15133. Due to the presence of the gap 15211, when the mass element 1523 is connected to the first elastic element 1521, an empty space remains at the contact surface between the mass element 1523 and the first elastic element 1521. In some cases, the void 15211 in the first elastic element 1521 can further reduce the elasticity of the first elastic element 1521 so that the first elastic element 1521 can still provide a sufficiently low elasticity even when the first elastic element 1521 has a small thickness, making it easier to adjust the resonant frequency of the resonant assembly formed by the first elastic element 1521 and the mass element 1523 to a required frequency band. In some alternative embodiments, the void 15211 may be located inside the first elastic element 1521. In other embodiments, the void 15211 may be located both on the surface and inside the first elastic element 1521. In some embodiments, the void 15211 may be formed by forming a hole in the first elastic element 1521. For example, if the first elastic element 1521 is made of plastic, the void 15211 can be formed by forming a hole on the surface and / or inside of the plastic. In other embodiments, the void 15211 may be a structure that the first elastic element 1521 itself has. For example, the first elastic element 1521 may be a urethane foam, and the urethane foam itself may have a hole structure, which may directly become the void 15211. In some embodiments, a filler may be placed in the void 15211. An exemplary filler may be a damping filler such as damping rubber, damping grease, or the like.In some cases, installing a damping filler in the gap 15211 can increase the damping of the first elastic element 1521, and when the speaker 1500 is operating, the first elastic element 1521 can further consume the vibration energy of the vibration housing 1513, reduce the amplitude of the vibration housing 1513, and reduce sound leakage.

[0178] 16 is a cross-sectional schematic diagram of a speaker including two sets of resonating assemblies according to some embodiments of the present disclosure. As shown in FIG. 16, the speaker 1600 may include a vibration assembly 1610 and a vibration damping assembly 1620. The vibration assembly 1610 may include a vibration element 1611 (e.g., an energy conversion device) that generates mechanical vibrations and a vibration housing 1613 that contacts the skin of a user's face. The vibration damping assembly 1620 is connected to the vibration housing 1613 to absorb the mechanical energy of the vibration housing 1613, thereby reducing the amplitude of the vibration housing 1613 and ultimately reducing sound leakage caused by the vibration of the vibration housing 1613. In some embodiments, the vibration housing 1613 (including the housing side panels 16132, the housing back panel 16133, and the housing panels 16131), the vibration element 1611, the first elastic element 1621, and the mass element 1623 of the speaker 1600 are the same as or similar to the vibration housing 1213 (including the housing side panels 12132, the housing back panel 12133, and the housing panels 12131), the vibration element 1211, the first elastic element 1221, and the mass element 1223 of the speaker 1200, and will not be described here.

[0179] Compared to the speaker 1200 shown in FIG. 12 , the vibration control assembly 1620 of the speaker 1600 differs in that it includes two sets of resonator assemblies. For ease of explanation, the resonator assembly installed on the upper side of the inner wall of the housing back plate 16133 can be referred to as the first resonator assembly 1620-1, and the resonator assembly installed on the lower side of the inner wall of the housing back plate 16133 can be referred to as the second resonator assembly 1620-2. The mass elements of each set of resonator assemblies are connected to the inner wall of the housing back plate by first elastic elements. The first elastic element 1621-1 of the first resonator assembly 1620-1 is connected to both the inner walls of the housing back plate 16133 and the upper housing side plate 16132. The first elastic element 1621-2 of the second resonator assembly 1620-2 is connected to both the inner walls of the housing back plate 16133 and the lower housing side plate 16132. As shown in FIG. 16 , the first elastic elements of the two resonator assemblies are both made of the same material and have the same thickness. Exemplarily, the first elastic elements of the two resonator assemblies are both made of adhesive, and the thickness of the adhesive layer formed by applying the adhesive to the inner wall of the housing back plate is the same or similar. In some alternative embodiments, the first elastic elements of the two resonator assemblies may be made of different materials and may have different thicknesses. Exemplarily, the first elastic element 1621-1 of the first resonator assembly 1620-1 may be urethane foam, and the first elastic element 1621-2 of the second resonator assembly 1620-2 may be adhesive.

[0180] Continuing to refer to FIG. 16, the first resonator assembly 1620-1 and the second resonator assembly 1620-2 are spaced apart by a predetermined distance, for example, the edges of the first elastic elements 1621 of the two sets of resonator assemblies are spaced apart by a predetermined distance, which may be set according to actual needs.

[0181] The first resonator assembly 1620-1 and the second resonator assembly 1620-2 may not be limited to the installation manner and installation positions shown in FIG. 16 . In some embodiments, the first resonator assembly 1620-1 and the second resonator assembly 1620-2 may be installed in any region of the inner wall of the housing back plate 16133. The inner wall of the housing back plate 16133 may include an edge region and a central region. The edge region may be a region adjacent to the housing side plate 16132. In some embodiments, the first resonator assembly 1620-1 and the second resonator assembly 1620-2 may both be installed in the edge region. For example, in FIG. 16 , the first elastic elements of the two resonator assemblies are both connected to the housing side plate 16132. In other embodiments, the first resonator assembly 1620-1 and the second resonator assembly 1620-2 may both be installed in the central region. For example, the first elastic elements of the two resonator assemblies are not connected to the housing side plate 16132, but are separated from the housing side plate 16132 by a predetermined threshold distance, which may be set according to actual needs. In some alternative embodiments, the first resonator assembly 1620-1 and the second resonator assembly 1620-2 may be located in the edge region and the central region, respectively. Illustratively, the first resonator assembly 1620-1 may be located in the edge region, with its first elastic element 1621-1 connected to the upper housing side plate 16132. The second resonator assembly 1620-2 may be located in the central region, with its first elastic element 1621-2 connected only to the inner wall of the housing back plate 16133. In another example, the first resonator assembly 1620-1 is located in the edge region and is arranged around the entire housing back plate 16133 to form a ring-shaped structure surrounding the second resonator assembly 1620-2. For example, a first elastic element 1621-1 is formed by placing a urethane foam around the edge region of the housing back plate 16133, and then an annular mass element 1623-1 corresponding to the shape of the urethane foam is connected to the urethane foam. The first elastic element 1621-2 and the mass element 1623-2 of the second resonator assembly 1620-2 are placed in the central region.

[0182] As described in the above embodiments, the resonant frequency of the first resonant assembly 1620-1 may be the same as or different from the resonant frequency of the second resonant assembly 1620-2. When the resonant frequency of the first resonant assembly 1620-1 is different from the resonant frequency of the second resonant assembly 1620-2, a vibration damping effect can be achieved in a frequency band near each resonant frequency, thereby widening the frequency band for absorbing vibrations. When the resonant frequency of the first resonant assembly 1620-1 is the same as the resonant frequency of the second resonant assembly 1620-2, the vibration damping effect in the frequency band near the resonant frequency can be further enhanced.

[0183] 17 is a cross-sectional schematic diagram of another speaker including two sets of resonator assemblies according to some embodiments of the present disclosure. As shown in FIG. 17 , speaker 1700 may include a vibration assembly 1710 and a vibration damping assembly 1720. Vibration assembly 1710 may include a vibration element 1711 (e.g., an energy conversion device) that generates mechanical vibrations and a vibration housing 1713 that contacts the skin of a user's face. Vibration damping assembly 1720 is connected to vibration housing 1713 to absorb mechanical energy of vibration housing 1713, thereby reducing the amplitude of vibration of vibration housing 1713 and ultimately reducing sound leakage caused by vibration of vibration housing 1713. In some embodiments, the vibrating housing 1713 (including housing panel 17131, housing side panel 17132, and housing back panel 17133), vibrating element 1711, first elastic element (e.g., first elastic element 1721-1, first elastic element 1721-2), and mass element (e.g., mass element 1723-1, mass element 1723-2) of the speaker 1700 are the same as or similar to the vibrating housing 1613 (including housing panel 16131, housing side panel 16132, and housing back panel 16133), vibrating element 1611, first elastic element (e.g., first elastic element 1621-1, first elastic element 1621-2), and mass element (e.g., mass element 1623-1, mass element 1623-2) of the speaker 1600, and will not be described here.

[0184] 16 , neither of the two sets of resonator assemblies (e.g., the first resonator assembly 1720-1 and the second resonator assembly 1720-2) of the speaker 1700 is directly connected to the vibration housing 1713, but is connected in a stacked manner. Illustratively, one side of the first elastic element 1721-1 of the first resonator assembly 1720-1 is connected to the inner wall of the vibration housing 1713, and an edge of the first elastic element 1721-1 is connected to the housing side plate 17132. The mass element 1723-1 of the first resonator assembly 1720-1 is connected to the other side of the first elastic element 1721-1. The first elastic element 1721-2 of the second resonator assembly 1720-2 has one side connected to the side of the mass element 1723-1 of the first resonator assembly 1720-1 facing away from the housing back plate 17133, an edge of the first elastic element 1721-2 is not connected to the housing side plate 17132, and the other side connected to the mass element 1723-2. In some embodiments, during actual manufacturing, adhesive can be applied to the inner wall of the housing back plate 17133 (as the first elastic element 1721-1 of the first resonator assembly 1720-1), the adhesive covers the inner wall of the housing back plate 17133, and the mass element 1723-1 is adhered to the surface of the adhesive. Next, adhesive is applied to the side of the mass element 1723-1 facing away from the housing back plate 17133 (as the first elastic element 1721-2 of the second resonator assembly 1720-2), and finally another mass element 1723-2 is adhered to the surface of the adhesive.

[0185] In some cases, when at least two sets of resonant assemblies are connected together in series in a stacked manner, a more complex resonant system can be configured, which has multiple resonant modes, i.e., multiple resonant frequencies, and at the corresponding resonant frequencies, the resonant system can absorb the vibration energy of the vibration housing 1713 to reduce sound leakage caused by the vibration of the vibration housing 1713.

[0186] Although the basic concepts have been described above, it will be apparent to those skilled in the art that the above disclosure of the invention has been presented by way of example only and is not intended to limit the present specification. Although not expressly described herein, those skilled in the art may make various changes, improvements, and modifications to the present specification. These changes, improvements, and modifications are intended to be suggested by the present specification and are therefore within the spirit and scope of the exemplary embodiments of the present specification.

[0187] Furthermore, certain terms are used herein to describe embodiments herein. For example, "one embodiment," "one embodiment," and / or "some embodiments" refer to particular features, structures, or characteristics associated with at least one embodiment herein. Therefore, it is emphasized and understood that references to "one embodiment" or "one embodiment" or "one alternative embodiment" more than once in various parts of this specification do not necessarily all refer to the same embodiment. Furthermore, particular features, structures, or characteristics in one or more embodiments herein may be combined as appropriate.

[0188] Similarly, in the foregoing description of embodiments herein, it should be understood that various features may be grouped together in a single embodiment, drawing, or description for the purpose of simplifying the description and facilitating an understanding of one or more embodiments of the invention. However, this method of disclosure should not be interpreted as reflecting an intention that the claimed subject matter requires more features than are recited in each claim. In fact, an embodiment may include fewer than all features of a single embodiment disclosed above.

[0189] In some examples, numbers describing the number of components and attributes are used, and it should be understood that the numbers describing such examples are in some instances modified by the modifiers "about," "approximately," or "generally." Unless otherwise specified, "about," "approximately," or "generally" indicates that the number can vary by ±20%. Thus, in some examples, all numerical parameters used in the specification and claims are approximations that may vary depending on the specific requirements of a particular example. In some examples, numerical data should be calculated using the specified number of significant digits and ordinary rounding techniques. While in some examples herein the numerical ranges and data used to determine ranges are approximations, in specific examples, such numerical values ​​are set as precisely as possible.

[0190] Finally, it should be understood that the embodiments described herein are merely illustrative of the principles of the embodiments herein. Other variations may be within the scope of the present disclosure. Thus, by way of example, and not of limitation, alternative configurations of the embodiments herein may be considered consistent with the teachings herein. Thus, the embodiments herein are not limited to the embodiments expressly introduced and described herein. [Explanation of symbols]

[0191] 100 speakers 110 Vibration Assembly 120 Vibration Control Assembly 130 Fixing Assembly 211 Vibration element 213 Vibration Housing 2131 Vibration Panel 2132 Housing side plate

Claims

1. A speaker, a vibration assembly including a vibration element for converting an electrical signal into a mechanical vibration and a vibration housing for contacting the skin of the user's face; a first elastic element connected to the vibration housing; a mass element connected to the vibration housing by the first elastic element, the first elastic element and the mass element forming a resonating assembly; Including, The vibration housing includes a vibration panel and a housing back plate disposed opposite the vibration panel, the vibration panel being in contact with the skin of the user's face; the mass element is connected to an inner wall of the housing back plate by the first elastic element; The first elastic element is disposed on the surface of the housing back plate, and the contact area between the first elastic element and the housing back plate is at least 10 mm ２ Bigger, speaker.

2. The loudspeaker according to claim 1 , wherein the first elastic element is a vibration transmission sheet.

3. The loudspeaker of claim 1 , wherein a ratio of the mass of the mass element to the mass of the diaphragm panel is in the range of 0.04 to 1.

25.

4. 4. A loudspeaker as claimed in any one of claims 1 to 3, wherein the vibration assembly generates a first resonant peak at a first frequency and the resonant assembly generates a second resonant peak at a second frequency, the ratio of the second frequency to the first frequency being in the range of 0.5 to 2.

5. The speaker of claim 4 , wherein the first frequency and the second frequency are both less than 500 Hz.

6. The loudspeaker of claim 5 , wherein within a frequency range less than the first frequency, the amplitude of the resonating assembly is greater than the amplitude of the vibrating housing.

7. The speaker according to claim 1 , wherein the first elastic element includes at least one of silica gel, plastic, adhesive, urethane foam, and spring.

8. The adhesive has a Shore hardness in the range of 30 to 50; The tensile strength of the adhesive is 1 MPa or more, The adhesive has a breaking elongation in the range of 100% to 500%; The adhesive strength between the adhesive and the housing back plate is in the range of 8 MPa to 14 MPa; The thickness of the adhesive layer formed by applying the adhesive to the surface of the housing back plate is within a range of 50 μm to 150 μm; the contact area between the adhesive and the housing back plate occupies 1% to 98% of the area of ​​the inner wall of the housing back plate; The contact area between the adhesive and the housing back plate is 100 mm ２ ~200mm ２ 8. The loudspeaker of claim 7, wherein the frequency of the loudspeaker is in the range of

9. The speaker of claim 1 , wherein there are at least two sets of the resonator assemblies, the first elastic elements of the resonator assemblies of each set are all connected to the housing back plate, and two adjacent sets of the resonator assemblies are spaced a predetermined distance apart.

10. The speaker of claim 1, wherein there are at least two sets of the resonator assemblies, the at least two sets of the resonator assemblies are arranged in a stacked manner along a thickness direction of the first elastic element, and the first elastic elements of the two adjacent sets of the resonator assemblies are connected to the mass element.

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