Method and system for dealing with mounting misalignment

Abstract

To predict a mounting deviation of a component and appropriately deal with the mounting deviation before mounting the component in mounting processing.SOLUTION: A mounting deviation dealing method for dealing with a mounting deviation of a component to be mounted on a substrate in mounting processing includes the steps of: (a) as information on a component mounted in mounting processing in the past, storing mounting result information in which information including a mounted position and a size of the component is associated with a mounting deviation amount as an inspection result; (b) as information on a component to be mounted in new mounting processing, acquiring mounting schedule information including a mounted position and a size of the component; (c) by using the mounting result information and the mounting schedule information, performing statistical analysis taking at least the mounted position and the size of the component as an explanatory variable and taking a mounting deviation amount as an objective variable to predict a mounting deviation amount of the component before starting the new mounting processing; and (d) performing predetermined dealing processing so as to suppress an influence of the predicted mounting deviation amount.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] This specification discloses a method and a system for dealing with mounting misalignment. [Background technology]

[0002] Conventionally, as a mounting system of this type, one has been proposed that performs the necessary correction when performing a mounting process in which a component supplied to a supply position by a component supply device is picked up by a nozzle and mounted on a board (see, for example, Patent Document 1). In this system, measurement values ​​obtained by measuring the position and orientation of the component picked up by the nozzle are accumulated, and a statistical analysis such as regression analysis is performed on the set of measurement values, a correction amount (adjustment amount) based on the result is calculated, and the supply position of the component is corrected based on the calculated correction amount. This makes it possible to perform correction according to the error characteristics of the component supply device, and the component is properly picked up by the nozzle, improving the mounting accuracy of the component on the board. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 11-46100 Summary of the Invention [Problem to be solved by the invention]

[0004] In the mounting system described above, although the error characteristics of the component supply device are corrected, component mounting deviations may occur due to other factors. To deal with other factors, it is conceivable to accumulate the inspection results of inspecting the board after mounting, perform statistical analysis on the collection of the inspection results, and respond with a correction amount based on the results. However, since appropriate adjustments cannot be made until the inspection results are accumulated, there is a risk that mounting deviations will occur frequently, which is not preferable.

[0005] A primary object of the present disclosure is to predict and appropriately deal with component mounting misalignment before the components are mounted in a mounting process. [Means for solving the problem]

[0006] In order to achieve the above-mentioned main object, the present disclosure has adopted the following means.

[0007] The method for dealing with mounting deviations disclosed herein includes the steps of: A method for dealing with a mounting misalignment of a component mounted on a board in a mounting process, comprising the steps of: (a) accumulating mounting performance information in which information including mounting positions and sizes of components is associated with mounting misalignment amounts as inspection results, as information on components mounted in past mounting processes; (b) acquiring mounting plan information including mounting positions and sizes of components as information on components to be mounted in the new mounting process; (c) predicting a mounting deviation amount of a component before the start of the new mounting process by performing a statistical analysis using the mounting record information and the mounting plan information, with at least a mounting position and a size of the component as explanatory variables and a mounting deviation amount as a target variable; (d) performing a predetermined corresponding process to suppress the influence of the predicted mounting deviation amount; The gist of the invention is that it includes the following:

[0008] The mounting deviation handling method of the present disclosure uses mounting performance information of components mounted in past mounting processes and mounting schedule information of components to be mounted in a new mounting process, and performs statistical analysis with at least the mounting position and size of the components as explanatory variables and the mounting deviation amount as a target variable to predict the mounting deviation amount of the components before the start of a new mounting process. Then, a predetermined response process is performed to suppress the influence of the predicted mounting deviation amount. This makes it possible to predict the mounting deviation amount of the components and appropriately handle it before the mounting process, thereby suppressing frequent occurrence of mounting deviation. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a diagram showing an outline of the configuration of a mounting system 10. [Diagram 2] FIG. 2 is a diagram showing an outline of the configuration of a mounting apparatus 20. [Diagram 3] 2 is an explanatory diagram showing the electrical connection relationship between the mounting device 20, the mounting inspection device 30, and the management server 40. FIG. [Figure 4] FIG. 4 is an explanatory diagram showing an example of mounting record information 45. [Diagram 5] 11 is a flowchart showing an example of a management process during installation. [Figure 6] FIG. 2 is an explanatory diagram showing the order of each process performed by each control device of the mounting system 10. [Figure 7] 11 is a flowchart showing an example of a design-time management process. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Next, an embodiment of the present disclosure will be described with reference to the drawings. Fig. 1 is a configuration diagram showing an outline of the configuration of a mounting system 10, Fig. 2 is a configuration diagram showing an outline of the configuration of a mounting device 20, and Fig. 3 is an explanatory diagram showing the electrical connection relationship between the mounting device 20, the mounting inspection device 30, and the management server 40. Note that the left-right direction in Figs. 1 and 2 is the X direction, the front-rear direction is the Y direction, and the up-down direction is the Z direction.

[0011] As shown in FIG. 1, the mounting system 10 includes a printing device 12, a print inspection device 14, a plurality of mounting devices 20, a mounting inspection device 30, and a management server 40, which are connected to a LAN 18 as a network. The printing device 12 prints on a board S (see FIG. 2) by pushing solder into pattern holes formed in a screen mask. The print inspection device 14 inspects the state of the solder printed by the printing device 12. A plurality of mounting devices 20 are arranged along the transport direction (X direction) of the board S, and mount components on the board S. The mounting inspection device 30 inspects the mounting state of the components mounted on the board S by the mounting device 20. The management server 40 manages various information and the entire mounting system 10. The printing device 12, the print inspection device 14, the plurality of mounting devices 20, and the mounting inspection device 30 are arranged in this order in the transport direction of the board S to form a production line. In addition to these devices, the production line may also include a reflow device that performs a reflow process on the board S on which components are mounted, and the mounting inspection device 30 may be located downstream of the reflow device.

[0012] As shown in FIG. 2 and FIG. 3, the mounting device 20 includes a board conveying device 21 for conveying the board S, a component supplying device 22 for supplying components, a head 23 in which a nozzle 24 for suctioning components is arranged so as to be movable up and down, and a head moving device 25 for moving the head 23 in the XY direction. The board conveying device 21 includes two pairs of conveyor belts that are spaced apart from each other and span the left and right directions in FIG. 2, and each conveyor belt conveys the board S from left to right in the figure. The component supplying device 22 is, for example, a tape feeder that supplies components by feeding a tape on which components are stored at a predetermined pitch, and multiple components are set in the mounting device 20 so that multiple types of components can be supplied. The components supplied from the component supplying device 22 include components having leads extending from the component body. The mounting device 20 also includes a mark camera 26, a parts camera 27, a mounting control device 29 for controlling the entire mounting device 20, and the like. Mark camera 26 is attached to head 23, and captures images of reference marks, board IDs, etc., attached to board S from above. Part camera 27 is installed between part supply device 22 and board transport device 21, and captures images of the parts sucked by nozzle 24 from below.

[0013] The mounting control device 29 is composed of a known CPU, ROM, RAM, etc. The mounting control device 29 outputs drive signals to the board transport device 21, the head 23, the head moving device 25, etc. Images from the mark camera 26 and the parts camera 27 are input to the mounting control device 29. For example, the mounting control device 29 processes the image of the board S captured by the mark camera 26 to obtain a board ID, or recognizes the position of the board S by recognizing the position of a board mark affixed to the board S. In addition, the mounting control device 29 determines the suction posture of the component sucked by the nozzle 24 based on the image captured by the parts camera 27.

[0014] 3, the mounting inspection apparatus 30 includes a board transport device 32 that transports the board S on which components are mounted, an inspection camera 34 that captures inspection images for inspecting the mounting state of the components, a camera moving device 36 that moves the inspection camera 34 in the X and Y directions, and an inspection control device 39 that controls the entire mounting inspection apparatus 30. The board transport device 32 and the camera moving device 36 have the same configurations as the board transport device 21 and the head moving device 25 of the mounting apparatus 20, respectively.

[0015] The inspection control device 39 is composed of a known CPU, ROM, RAM, etc. The inspection control device 39 outputs drive signals to the board transport device 32 and the camera moving device 36, and an image pickup signal to the inspection camera 34. The inspection control device 39 also receives images from the inspection camera 34, processes the images, and inspects the mounting state of the components. The inspection control device 39 is also communicably connected to the mounting control device 29 and the management control device 42 of the management server 40 via the LAN 18, and transmits information related to the inspection results, etc.

[0016] As shown in Fig. 3, the management server 40 includes a management control device 42, a storage unit 44, an input device 46, and a display 48. The management control device 42 is composed of a known CPU, ROM, RAM, etc. The storage unit 44 is a device such as a HDD that stores various information such as various processing programs and data. The input device 46 includes a keyboard and a mouse through which an operator inputs various commands. The display 48 is a liquid crystal display device that displays various information.

[0017] The storage unit 44 of the management server 40 stores mounting record information 45, a production program, and the like. The mounting record information 45, which will be described in detail later, is information including the inspection results received from the inspection control device 39. The production program is a program that determines which components are to be mounted on which boards S, and how many boards S thus mounted are to be produced, and is stored in the storage unit 44 by an operation by an operator, etc. Based on the production program, the management control device 42 creates a job that determines information such as the mounting order, component type, mounting position, mounting angle, size, and presence or absence of leads of each component to be mounted by each mounting device 20, information on the component supply device 22 that supplies each component, information on the nozzle 24 that picks up each component, and information on the number of boards S to be produced.

[0018] The management control device 42 is also communicatively connected to the mounting control device 29 via the LAN 18, and receives information about the mounting status from the mounting control device 29 and transmits production instructions such as jobs to the mounting control device 29. The management control device 42 is also communicatively connected to the inspection control device 39 via the LAN 18, and receives information about the inspection status and inspection results from the inspection control device 39 and transmits information about the board S to be inspected to the inspection control device 39. The management control device 42 is also communicatively connected to each control device (not shown) of the printing device 12 and the print inspection device 14 via the LAN 18, and receives information about the work status from each control device and transmits work instructions to each control device.

[0019] The operation of the mounting system 10 thus configured will be described below. First, the mounting process in the mounting apparatus 20 and the inspection process in the mounting inspection apparatus 30 will be outlined.

[0020] In the mounting process, the mounting control device 29 sequentially picks up components onto the nozzle 24 according to the mounting order defined in the job, and mounts each component on the board S at a target mounting position and mounting angle. The target mounting position and mounting angle are positions and angles corrected by a correction amount for correcting the mounting deviation amount predicted by a regression analysis described later, with respect to the mounting position and mounting angle defined in the job. The mounting control device 29 may move the head 23 above the part camera 27, calculate the positional deviation and angular deviation of the component with respect to the nozzle 24 based on an image captured by the part camera 27 of the component picked up by the nozzle 24, and correct the deviation amount. In that case, the mounting control device 29 corrects the moving position of the head 23 (nozzle 24) and the rotation angle of the nozzle 24 so that the positional deviation and angular deviation of the component with respect to the nozzle 24 are eliminated, and mounts the component at the target mounting position and mounting angle.

[0021] In the inspection process, the inspection control device 39 uses the inspection camera 34 to capture the board S on which components are mounted, and processes the image to inspect the mounting misalignment of each component, such as positional misalignment, angular misalignment, and missing components. As the positional misalignment and angular misalignment of each component, the inspection control device 39 detects the amount of positional misalignment ΔX in the X direction and the amount of positional misalignment ΔY in the Y direction relative to the target mounting position, as well as the amount of angular misalignment (rotational misalignment) Δθ relative to the target reference angle. The inspection control device 39 transmits the inspection results, in which the detected mounting misalignment amounts ΔX, ΔY, and Δθ are associated with information such as the mounting positions (X, Y) of the components, to the management server 40.

[0022] When the management server 40 receives the inspection result, it stores it in the mounting record information 45. FIG. 4 is an explanatory diagram showing an example of the mounting record information 45. In the mounting record information 45, mounting position information of each component, component information, and inspection result information are registered in association with each other. The mounting position information includes the mounting position (X, Y) and the mounting angle θ of the component. The component information includes the component size (W, D) indicating the width W and depth W, the component height H, and the presence or absence of the lead L. The inspection result information includes the position deviation amount (ΔX, ΔY) and the angle deviation amount Δθ. The mounting record information 45 is used for prediction of the mounting deviation amount and management processing for suppressing the influence of the predicted mounting deviation amount. In this embodiment, even if the mounting system 10 and the management server 40 are newly installed and the mounting processing is not performed, the mounting record information 45 is stored in advance. For example, the mounting record information 45 including the inspection result information of the mounting test performed in the manufacturing company of the mounting system 10 may be stored in the storage unit 44 at the time of shipping. In this case, when the mounting process is performed in the mounting system 10, information will be sequentially accumulated in the mounting performance information 45 in the memory unit 44, and new information may be stored in addition to the information stored at the time of shipment, or the information stored at the time of shipment may be overwritten with the new information.

[0023] Fig. 5 is a flow chart showing an example of the mounting management process, and Fig. 6 is an explanatory diagram showing the order of each process performed by each control device of the mounting system 10. In the mounting management process, the management control device 42 of the management server 40 first creates a job from the production program and transmits it to the mounting control device 29 of each mounting device 20 (S100, Fig. 6(1)). Next, the management control device 42 acquires mounting position information and component information of each component from the current job as explanatory variables (S110). In S110, the mounting position (X, Y), mounting angle θ, component size (W, D), component height H, and the presence or absence of leads L of each component are acquired.

[0024] Next, the management control device 42 predicts the amount of mounting deviation for the current job by regression analysis using the mounting position information, such as the mounting position (X, Y) and the mounting angle θ, and the component information, such as the component size (W, D), the component height H, and the presence or absence of leads L, as explanatory variables, and the mounting deviation amounts ΔX, ΔY, Δθ, which are inspection result information, as objective variables (S120, FIG. 6(2)).

[0025] In S120, the positional deviation amounts ΔX and ΔY are calculated by the following formulas (1) and (2), respectively, and the angle deviation amount Δθ is calculated by the following formula (3). In the regression analysis, first, the coefficients a to g of the above-mentioned respective explanatory variables are determined. For example, in the case of the following formula (1), by analyzing the correlation between the positional deviation amount ΔX and each explanatory variable, the coefficient a1 of the mounting position X, the coefficient b1 of the mounting position Y, the coefficient c1 of the mounting angle θ, the coefficient d1 of the component size W, the coefficient e1 of the component size D, the coefficient f1 of the component height H, and the coefficient g1 of the presence or absence of the lead L are determined, respectively. Similarly, the coefficients of the respective explanatory variables are determined in the following formulas (2) and (3). After determining the respective coefficients of the following formulas (1) to (3), the management control device 42 substitutes the respective explanatory variables acquired from the current job into the following formulas (1) to (3) respectively and calculates the mounting deviation amounts ΔX, ΔY, and Δθ predicted for each mounting position of each component. Although the mounting position information and component information of the past mounting results are not exactly the same as those of the current job, they do indicate the tendency of the mounting deviation amount due to the mounting position and size of the components in the mounting system 10. Therefore, in S120, it is possible to predict the mounting deviation amounts ΔX, ΔY, and Δθ that reflect the tendency. As described above, since the mounting result information 45 is stored from the time of shipment, it is possible to appropriately predict the mounting deviation amounts ΔX, ΔY, and Δθ even in a state in which the mounting results of the mounting system 10 have not been sufficiently accumulated.

[0026] ΔX=a1·X+b1·Y+c1·θ+d1·W+e1·D+f1·H+g1·L ···(1) ΔY=a2·X+b2·Y+c2·θ+d2·W+e2·D+f2·H+g2·L ···(2) Δθ=a3·X+b3·Y+c3·θ+d3·W+e3·D+f3·H+g3·L ···(3)

[0027] When the mounting deviation amounts ΔX, ΔY, and Δθ are predicted in this way, the management control device 42 sets the correction amounts Xc, Yc, and θc so as to cancel the mounting deviation amounts ΔX, ΔY, and Δθ, respectively, and transmits the set correction amounts Xc, Yc, and θc to the mounting control device 29 of each mounting device 20 (S130, FIG. 6(3)), and starts the mounting process (FIG. 6(4)). In this way, the correction amounts Xc, Yc, and θc are set based on the predicted mounting deviation amounts ΔX, ΔY, and Δθ, and then the mounting process is started. Therefore, compared to not setting the correction amounts until the inspection results of the current mounting process are accumulated, it is possible to suppress the mounting deviation from the beginning of the mounting process. Note that the management control device 42 may set each correction amount Xc, Yc, and θc and then transmit them together with the job.

[0028] When the mounting process is started in each mounting device 20, each mounting device 20 mounts each component on the board S while sequentially transporting the board S. When the board S on which each component has been mounted is transported to the mounting inspection device 30, the inspection process is performed (FIG. 6(5)). The inspection control device 39 transmits the mounting deviation amounts ΔX, ΔY, Δθ as the inspection results of the inspection process to the management control device 42 in association with the mounting positions (FIG. 6(6)).

[0029] Then, the management control device 42 determines whether or not the inspection result has been received from the inspection control device 39 (S140), and proceeds to S195 if it determines that the inspection result has not been received. On the other hand, if the management control device 42 determines that the inspection result has been received, it registers the mounting deviation amounts ΔX, ΔY, Δθ included in the received inspection result in the mounting record information 45 in association with the mounting position information and component information (S150).

[0030] Next, the management control device 42 determines whether the correction amount can be updated (S160), and proceeds to S195 if it is determined that the correction amount cannot be updated. For example, the management control device 42 determines that the correction amount can be updated if a sufficient number of inspection results are registered to reflect the tendency of the current mounting process, such as the number of received inspection results of the board S mounted in the current mounting process being equal to or greater than a predetermined number.

[0031] On the other hand, when the management control device 42 determines in S160 that the correction amount can be updated, it determines whether or not to analyze the inspection result of the current mounting process independently (S170). In S170, it is determined whether to analyze only the inspection result of the current mounting process, or to analyze the inspection result of the current mounting process together with the inspection result of the previous mounting process. Note that the management control device 42 may receive a selection from the operator of either a first analysis mode for performing the former analysis or a second analysis mode for performing the latter analysis, and set the selected mode. Then, in S170, the management control device 42 may make a determination based on the analysis mode that has been set.

[0032] When the management control device 42 determines in S170 that the inspection results of the current mounting process are to be analyzed independently, the management control device 42 performs regression analysis again using the mounting result information 45 including the inspection results of the current mounting process, excluding the inspection results of the past mounting processes, to re-predict the mounting deviation amounts ΔX, ΔY, and Δθ (S180A, FIG. 6(7)). On the other hand, when the management control device 42 determines in S170 that the inspection results of the current mounting process are not to be analyzed independently, the management control device 42 performs regression analysis again using the mounting result information 45 including the inspection results of the past mounting processes and the inspection results of the current mounting process, to re-predict the mounting deviation amounts ΔX, ΔY, and Δθ (S180B, FIG. 6(7)). Note that S180A and B are performed in the same manner as S120, except that the information used in the analysis is different.

[0033] Next, the management control device 42 resets the correction amounts Xc, Yc, and θc based on the re-predicted mounting deviation amounts ΔX, ΔY, and Δθ, and transmits the reset correction amounts Xc, Yc, and θc to the mounting control device 29 of each mounting device 20 (S190, FIG. 6 (8)). The mounting control device 29 of each mounting device 20 performs mounting processing while correcting the mounting position and mounting angle using the reset correction amounts Xc, Yc, and θc. Then, the management control device 42 determines whether or not the production of the board S has been completed (S195), and returns to S140 if it determines that the production has not been completed. On the other hand, if the management control device 42 determines that the production of the board S has been completed, it ends the mounting management processing.

[0034] Next, the process at the time of designing the board will be described. FIG. 7 is a flowchart showing an example of the design-time management process. In the design-time management process, the management control device 42 first inputs design data of the board S whose design has been completed (S200), and acquires mounting position information and component information of each component from the design data as explanatory variables (S210). Next, the management control device 42 predicts mounting deviation amounts ΔX, ΔY, Δθ of each component in the current design data by performing a regression analysis using mounting deviation amounts ΔX, ΔY, Δθ, which are inspection result information of the mounting record information 45, as objective variables (S220). S210 and S220 are performed in the same way as S110 and S120 of the mounting-time management process, and therefore the description will be omitted.

[0035] Next, the management control device 42 checks whether or not there is interference between components due to mounting deviation based on the mounting position (X, Y), mounting angle θ, component size (W, D), and predicted mounting deviation amounts ΔX, ΔY, and Δθ of each component (S230), and determines whether or not there are interfering components (S240). If the management control device 42 determines that there are no interfering components, it notifies the completion of the data check (S250) and ends the design-time management process. In S250, the management control device 42 displays a message on the display 48, for example, to the effect that the data check has been completed normally.

[0036] On the other hand, if the management control device 42 determines in S240 that there is an interfering component, it issues a warning and instructs the worker to correct the mounting position of the interfering component (S260), and ends the design-time management process. In S260, the management control device 42 instructs the worker to correct the mounting position by displaying, for example, a warning message indicating that components are interfering, and information such as the mounting position (X, Y) and size (W, D) of the interfering component on the display 48. After correcting the mounting position of the component, the worker can check whether the interference was avoided by having the corrected design data rechecked in the design-time management process.

[0037] Here, the correspondence between the components of this embodiment and the components of this disclosure will be clarified. In the implementation management process of this embodiment, S150 corresponds to step (a), S110 corresponds to step (b), S120 corresponds to step (c), and S130 corresponds to step (d). Also, S150 corresponds to step (e), and S180A corresponds to step (f). S180B corresponds to step (g). In the design management process, S210 corresponds to step (b), S220 corresponds to step (c), and S230 and S260 correspond to step (d). In addition, the management control device 42 and the memory unit 44 that executes S150 correspond to the accumulation unit, the management control device 42 that executes S110 and S210 corresponds to the acquisition unit, the management control device 42 that executes S120 and S220 corresponds to the prediction unit, and the management control device 42 that executes S130, S230, and S260 corresponds to the response processing unit.

[0038] In the mounting deviation handling method in the mounting system 10 of the present embodiment described above, a regression analysis is performed using the mounting result information 45 of the past mounting process and the mounting position information and component information (planned mounting information) acquired from a new job. The regression analysis is performed using the mounting position (X, Y) and the component size (W, D) as explanatory variables and the mounting deviation amounts ΔX, ΔY, and Δθ as objective variables, and the mounting deviation amounts ΔX, ΔY, and Δθ of each component are predicted before the mounting process is started. Then, the correction amounts Xc, Yc, and θc based on the predicted mounting deviation amounts ΔX, ΔY, and Δθ are set to start the mounting process, so that frequent occurrence of mounting deviations can be suppressed. In addition, frequent occurrence of mounting deviations of components can be suppressed at the beginning of the mounting process, i.e., before the inspection results of the mounting process are accumulated.

[0039] Furthermore, after the mounting process is started, the mounting deviation amounts ΔX, ΔY, Δθ are re-predicted and the correction amounts Xc, Yc, θc are updated by performing regression analysis using the mounting result information 45 in which new inspection results have been registered, instead of the past mounting result information 45. Therefore, once the mounting process is started, the mounting position is corrected by the correction amounts Xc, Yc, θc based on the mounting deviation amounts ΔX, ΔY, Δθ of the mounting process, so that the mounting deviation can be more appropriately suppressed.

[0040] Furthermore, after the mounting process is started, a regression analysis is performed using the past mounting record information 45 and the mounting record information 45 in which the inspection results have been newly registered to re-predict the mounting deviation amounts ΔX, ΔY, and Δθ, and the correction amounts Xc, Yc, and θc are updated. Therefore, once the mounting process is started, the mounting position is corrected by the correction amounts Xc, Yc, and θc that also reflect the mounting deviation amounts ΔX, ΔY, and Δθ of the mounting process, so that the mounting deviation can be more appropriately suppressed.

[0041] In addition, since the mounting positions (X, Y) of components are corrected to avoid interference between components when designing the board, it is possible to prevent interference due to mounting misalignment by appropriately designing the mounting positions (X, Y) when designing the board. In addition, since it is not necessary to take special measures to avoid interference due to mounting misalignment, such as slowing down the descending speed of the nozzle 24 during the mounting process, it is possible to perform an appropriate board design that reduces the difficulty of the mounting process.

[0042] It goes without saying that the present disclosure is in no way limited to the above-described embodiment, and can be embodied in various forms as long as it falls within the technical scope of the present disclosure.

[0043] For example, in the above-described embodiment, in the board design management process, a correction instruction for the mounting position (X, Y) is output to the worker to avoid interference between components, but this is not limited to the above. For example, a correction instruction may be output to a design device that automatically performs board design, and the mounting position (X, Y) may be automatically corrected. Alternatively, the design device that automatically performs board design may acquire the mounting record information 45, determine whether or not there is interference between components, and automatically correct the mounting position (X, Y) to avoid interference if there is any.

[0044] In the embodiment, when the inspection result is acquired after the start of the mounting process, one of the processes S180A, which uses the current mounting result information 45 (inspection result) instead of the past mounting result information 45 (inspection result) for analysis, and S180B, which uses the past mounting result information 45 (inspection result) and the current mounting result information 45 (inspection result) for analysis, is performed, but the present invention is not limited to this. For example, the process S180B may be performed when sufficient inspection results are not obtained, such as when the number of current inspection results is less than a predetermined number, and the process S180A may be performed when sufficient inspection results are obtained. Alternatively, the present invention is not limited to a configuration capable of executing both S180A and S180B, and may be configured to execute only one of them.

[0045] In the embodiment, the mounting deviation amounts ΔX, ΔY, and Δθ are re-predicted after the start of the mounting process to update the correction amounts Xc, Yc, and θc, but this is not limited to the above. The correction amounts Xc, Yc, and θc set before the start of the mounting process may be used until the mounting process is completed without being updated.

[0046] In the embodiment, an example has been given of performing response processing both at the time of board design and at the time of mounting processing, but this is not limited to this, and it is also possible to perform only response processing at the time of board design, or only response processing at the time of mounting processing.

[0047] In the embodiment, the mounting position (X, Y) and the mounting angle θ are exemplified as the mounting position information, and the component size (W, D), the component height H, and the presence or absence of a lead L are exemplified as the component information, and these are included in the explanatory variables, but this is not limited to this. For example, in addition to these, the component information may also include the weight of the component. Also, it is not necessary to include any of these pieces of information, and it is sufficient to include at least the mounting position (X, Y) and the component size (W, D) in the explanatory variables.

[0048] In the embodiment, the inspection result information is stored in the mounting record information 45 without distinguishing between different types of mounting devices 20 included in the mounting system 10 or between individual mounting devices 20 of the same type (identification numbers), but this is not limited to the above. For example, information on the type of mounting device 20 that mounted the components may be stored in the mounting record information 45 in association with the inspection result information, or information on the individual mounting device 20 in addition to the type may be stored in the mounting record information 45 in association with the inspection result information. In such a case, a regression analysis may be performed for each type or each mounting device 20, and a corresponding process such as setting a correction value for each type or each mounting device 20 may be performed.

[0049] In the embodiment, the management control device 42 of the management server 40 manages the mounting performance information 45 and performs the regression analysis, but this is not limited to the above. The mounting control device 29 may manage the mounting performance information and perform the regression analysis, or the inspection control device 39 may manage the mounting performance information and perform the regression analysis. Furthermore, two or more control devices out of the mounting control device 29, the inspection control device 39, and the management control device 42 may jointly manage the mounting performance information and perform the regression analysis.

[0050] In the embodiment, the mounting history information 45 is managed by the management server 40 of the mounting system 10, but this is not limited thereto. For example, the management server for the mounting history information may be provided outside the mounting system 10, and the management server may be configured to be able to communicate with one or more mounting systems 10 via a communication network. In addition, the management server may collectively store the mounting history information received from the multiple mounting systems 10, perform a regression analysis based on the mounting history information and the mounting position information and component information in the mounting process of each mounting system 10, and transmit the mounting deviation amount and the correction amount therefor to each mounting system 10. By collectively managing the mounting history information of the multiple mounting systems 10, the amount of information can be increased and the reliability of the regression analysis can be improved. Note that the management servers 40 of the multiple mounting systems 10 may communicate with each other to perform regression analysis including the mounting history information of the other mounting systems 10.

[0051] In the embodiment, regression analysis is exemplified, but the present invention is not limited thereto, and any statistical analysis may be performed, and any analysis other than regression analysis may be performed. In addition, the mounting performance information 45 is stored at the time of shipment, but the present invention is not limited thereto, and the mounting performance information 45 may not be stored at the time of shipment. In addition, the present invention is not limited to processing using all of the accumulated past mounting performance information 45, and may be processing using mounting performance information 45 within a predetermined period. The predetermined period may be a period that can be set by an operator, etc.

[0052] Here, the mounting deviation handling method of the present disclosure may be as follows. For example, in the mounting deviation handling method of the present disclosure, in the step (d), a correction amount for correcting the predicted mounting deviation amount may be set as the handling process during the mounting process, and the mounting position may be corrected by the set correction amount to perform the mounting process. In this way, it is possible to suppress the occurrence of mounting deviation of components during the mounting process, compared to a case where the mounting process is started without considering the past mounting deviation amount.

[0053] The mounting deviation countermeasure method of the present disclosure may include (e) acquiring the mounting record information of the components mounted in the mounting process after the mounting process is started, and (f) performing the statistical analysis during the mounting process using the mounting record information of the step (e) instead of the mounting record information of the step (a), thereby re-predicting the mounting deviation amount, and in the step (d), the correction amount may be updated based on the re-predicted mounting deviation amount. In this way, once the mounting process is started, the mounting position is corrected by a correction amount based on the mounting deviation amount of the mounting process, so that the mounting deviation can be more appropriately suppressed.

[0054] The mounting deviation countermeasure method of the present disclosure may include (e) acquiring the mounting record information of the components mounted in the mounting process after the mounting process is started, and (g) adding the mounting record information of the step (e) to the mounting record information of the step (a) during the mounting process and performing the statistical analysis to re-predict the mounting deviation amount, and in the step (d), the correction amount may be updated based on the re-predicted mounting deviation amount. In this way, once the mounting process is started, the mounting position is corrected with a correction amount that also reflects the mounting deviation amount of the mounting process, so that the mounting deviation can be more appropriately suppressed.

[0055] In the mounting misalignment countermeasure method of the present disclosure, in the step (d), the countermeasure process at the time of designing the board may be to correct the mounting positions of the components so as to avoid interference between the components due to the predicted mounting misalignment amount. In this way, the mounting positions can be appropriately designed at the time of designing the board, and the influence of the mounting misalignment can be suppressed.

[0056] The mounting system of the present disclosure includes: A mounting system that performs a mounting process for mounting components on a substrate, a storage unit that stores mounting performance information in which information including a mounting position and a size of a component is associated with a mounting deviation amount as an inspection result, as information on components mounted in a past mounting process; an acquisition unit that acquires mounting schedule information including mounting positions and sizes of components as information on components to be mounted in a new mounting process; a prediction unit that predicts a mounting deviation amount of a component before the start of the new mounting process by performing a statistical analysis using the mounting record information and the mounting plan information, with at least a mounting position and a size of the component as explanatory variables and a mounting deviation amount as a target variable; a processing unit that performs a predetermined processing so as to suppress the influence of the predicted mounting deviation amount; The gist of the project is to provide the following:

[0057] In the mounting system of the present disclosure, as in the above-mentioned mounting misalignment handling method, the mounting misalignment amount of the component can be predicted and appropriately handled before the mounting process, so that the frequent occurrence of mounting misalignment can be suppressed. Note that in this mounting system, a function for realizing each step of the above-mentioned mounting misalignment handling method may be added. [Industrial Applicability]

[0058] The present disclosure can be used in technical fields such as component mounting processing. [Explanation of symbols]

[0059] 10 mounting system, 12 printing device, 14 printing inspection device, 18 LAN, 20 mounting device, 21, 32 board transport device, 22 component supply device, 23 head, 24 nozzle, 25 head moving device, 26 mark camera, 27 parts camera, 29 mounting control device, 30 mounting inspection device, 34 inspection camera, 36 camera moving device, 39 inspection control device, 40 management server, 42 management control device, 44 memory unit, 45 mounting performance information, 46 input device, 48 display, S board.

Claims

1. A method for dealing with a mounting misalignment of a component mounted on a board in a mounting process, comprising the steps of: (a) accumulating mounting performance information in which information including mounting positions and sizes of components is associated with mounting misalignment amounts as inspection results, as information on components mounted in past mounting processes; (b) acquiring mounting plan information including mounting positions and sizes of components as information on components to be mounted in the new mounting process; (c) predicting a mounting deviation amount of a component before the start of the new mounting process by performing a statistical analysis using the mounting record information and the mounting plan information, with at least a mounting position and a size of the component as explanatory variables and a mounting deviation amount as a target variable; (d) performing a predetermined countermeasure to suppress the influence of the predicted mounting deviation amount; Includes implementation misalignment countermeasures.

2. 2. The method for dealing with mounting misalignment according to claim 1, In the step (d), as the corresponding processing during the new mounting process, a correction amount for correcting the predicted mounting deviation amount is set, and the new mounting process is performed by correcting the mounting position by the set correction amount. How to deal with implementation deviations.

3. The method for dealing with mounting misalignment according to claim 2, (e) acquiring, after the start of the mounting process, the mounting record information of the components mounted in the mounting process; (f) during the mounting process, performing the statistical analysis using the mounting record information of the step (e) instead of the mounting record information of the step (a), thereby re-predicting an amount of mounting deviation; In the step (d), the correction amount is updated based on the re-predicted mounting deviation amount. How to deal with implementation deviations.

4. The method for dealing with mounting misalignment according to claim 2, (e) acquiring, after the start of the mounting process, the mounting record information of the components mounted in the mounting process; (g) during the mounting process, the mounting record information of the step (a) is added to the mounting record information of the step (e) to perform the statistical analysis, thereby re-predicting an amount of mounting deviation, In the step (d), the correction amount is updated based on the re-predicted mounting deviation amount. How to deal with implementation deviations.

5. 2. The method for dealing with mounting misalignment according to claim 1, In the step (d), as the corresponding process in the board design, the mounting positions of the components are corrected so as to avoid interference between the components due to the predicted mounting deviation amount. How to deal with implementation deviations.

6. A mounting system that performs a mounting process for mounting components on a substrate, a storage unit that stores mounting performance information in which information including a mounting position and a size of a component is associated with a mounting misalignment amount as an inspection result, as information on components mounted in a past mounting process; an acquisition unit that acquires mounting schedule information including mounting positions and sizes of components as information on components to be mounted in a new mounting process; Using the mounting result information and the mounting schedule information, a statistical analysis is performed with at least the mounting position and size of the component as explanatory variables and the amount of mounting deviation as a target variable, thereby generating the new actual result. a prediction unit that predicts a mounting deviation amount of a component before a mounting process is started; a processing unit that performs a predetermined processing so as to suppress the influence of the predicted mounting deviation amount; A mounting system comprising:

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