Mounting method and mounting device

Abstract

A mounting method for mounting parts on a substrate using a suction member that can suction parts and that is raised and lowered as a result of driving by a driving source, said method comprising: a detection step in which the suction member that has suctioned a part descends to the mounting position for the part on the substrate, and contact of the suction member on the substrate with the part therebetween is detected; and a setting step in which a detection interval for the detection performed at the detection step can be set for each part mounting position on the substrate.

Description

[Technical field]

[0001] The present disclosure relates to a mounting method and a mounting device for adsorbing a component and mounting it on a board. [Background technology]

[0002] Patent Document 1 describes a mounting device that mounts components on a board by lowering a suction nozzle holding the components using a motor. In this mounting device, the area of ​​the board is divided into a first area, which is an area near the clamp and an area near the backup, and a second area, which is the remaining area other than the first area, and the load during mounting is obtained, and the speed at which the suction nozzle is lowered is determined based on the obtained load. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. WO2018 / 061146 A1 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the mounting device described in Patent Document 1, the speed at which the suction nozzle descends is determined for the purpose of preventing damage to the components during mounting, and no consideration is given to shortening the mounting time.

[0005] The present disclosure describes a mounting method and a mounting device that can further shorten the mounting time. [Means for solving the problem]

[0006] In order to achieve the above object, the mounting method disclosed herein is a mounting method for mounting components on a board using an attraction member that can be raised and lowered by being driven by a drive source to attract components, the method including a detection step for detecting that the attraction member that has attracted the component has descended to a mounting position of the component on the board and contacted the board via the component, and a setting step for setting a detection section in which detection is performed by the detection step for each mounting position of the component on the board; The method includes a storage step of storing in a memory as history information the height of the suction member when it is detected in the detection step that the suction member has come into contact with the board via the component, and a determination step of determining a detection section based on the history information stored in the storage step, in which the determination step determines the range of the detection section according to the degree of variation in the height of the suction member contained in the history information, and when the degree of variation in the height is within a predetermined range, the detection section is determined by shifting the center value of the detection section to the average value of the height. . Effect of the Invention

[0007] According to the present disclosure, a detection section for detecting when the suction member to which a component is adsorbed comes into contact with the board via the component can be set for each mounting position of the component on the board; in other words, the length of the detection section can be changed depending on the condition of the board at the position where the component is to be mounted, thereby making it possible to further shorten the mounting time. [Brief description of the drawings]

[0008] [Figure 1] 1 is a perspective view illustrating an appearance of a mounting device according to an embodiment of the present disclosure. [Diagram 2] 2 is a cross-sectional view of a mounting head included in the mounting device of FIG. 1. [Diagram 3] FIG. 2 is a block diagram showing a simplified control system of the mounting apparatus of FIG. [Figure 4] 4 is a flowchart showing the procedure of implementation processing executed by a CPU in FIG. 3; [Diagram 5] 5 is a flowchart showing a subsequent procedure of the mounting process of FIG. 4. [Figure 6] FIG. 13 is a diagram illustrating an example of setting of a touchdown detection section for each mounting position. [Figure 7] FIG. 13 is a diagram showing a schematic configuration of another example of a mounting head. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings.

[0010] Fig. 1 shows an outline of the configuration of a mounting apparatus 10. In Fig. 1, the left-right direction is the X-axis direction, the front-rear direction is the Y-axis direction, and the up-down direction is the Z-axis direction.

[0011] The mounting apparatus 10 is an apparatus that performs a mounting process to mount a component P on a substrate S, and is equipped with a base 11, a housing 12 supported by the base 11, a substrate transport unit 20, a backup unit 30, a component supply unit 40, a mounting head 50, an XY robot 60, and a control device 90 (see Figure 3).

[0012] 1, the substrate transport unit 20 includes a pair of side frames 22 arranged at a predetermined interval in the Y-axis direction, and a conveyor belt 24 provided on each of the pair of side frames 22, and transports the substrate S by driving the conveyor belt 24 in a circular motion. The substrate transport unit 20 also includes a clamper (not shown) that can be raised and lowered, and when the substrate S is placed on the conveyor belt 24, the clamper is raised to push up the substrate S, thereby pressing the substrate S against a pressing portion 26 at the upper end of the side frame 22. As a result, the substrate S is sandwiched and clamped between the clamper and the pressing portion 26.

[0013] The backup unit 30 includes a backup plate 32 that is installed so as to be able to be raised and lowered by a lifting device (not shown), and a plurality of backup pins 34 that are erected on the backup plate 32. With the substrate S transported by the substrate transport unit 20 in a clamped state, the backup unit 30 raises the backup plate 32 to back up the substrate S from the back surface side with the backup pins 34.

[0014] The component supply unit 40 includes a feeder unit 42 and a tray unit 44. The feeder unit 42 uses a feeder to feed a carrier tape, on which a plurality of components are stored, from a reel around which the carrier tape is wound, and supplies the components to the supply position. The carrier tape is composed of a bottom tape, such as a paper tape, on which component storage sections are formed at predetermined intervals, and a top film that covers the surface of the bottom tape and is peeled off just before the supply position. The tray unit 44 supplies the components to the supply position by arranging and placing a plurality of components on a tray made of resin or the like.

[0015] The XY robot 60 includes a pair of left and right Y-axis guide rails 63 provided on the upper stage of the housing 12 along the front-rear direction (Y-axis direction), a Y-axis slider 64 that is spanned between the pair of left and right Y-axis guide rails 63 and can move along the Y-axis guide rails 63, a pair of upper and lower X-axis guide rails 61 provided on the side of the Y-axis slider 64 along the left-right direction (X-axis direction), and an X-axis slider 62 that can move along the X-axis guide rails 61. The X-axis slider 62 can be moved by driving an X-axis motor 66 (see FIG. 3), and the Y-axis slider 64 can be moved by driving a Y-axis motor 68 (see FIG. 3). The mounting head 50 is attached to the X-axis slider 62, and the mounting head 50 can be moved to any position on the XY plane by the control device 90 driving and controlling the XY robot 60 (X-axis motor 66 and Y-axis motor 68).

[0016] One or more suction nozzles 59 (eight in this embodiment) are detachably attached to the underside of the mounting head 50, and types are attached according to the component type. The suction nozzle 59 is a suction member that uses pressure to suction a component. The mounting head 50 also raises and lowers the suction nozzle 59 in the Z direction by an elevator device 70 (see FIG. 2) driven by a Z-axis motor 55. The mounting head 50 also rotates (spins) the suction nozzle 59 by an R-axis (rotation axis) motor 51, making it possible to adjust the angle of the component picked up by the suction nozzle 59.

[0017] As shown in FIG. 2, the mounting head 50 includes a cover 500, a pair of front and rear lifting devices 70, a revolving part 54, and a rotating part 55.

[0018] The cover 500 constitutes the outer shell of the mounting head 50. A pair of front and rear lifting devices 70 are arranged at 180° opposite each other around the revolution axis (the revolution axis of the eight suction nozzles 59) Q. The lifting device 70 includes a Z-axis (vertical axis) motor 71 and a ball screw unit 72. The lifting device 70 also includes a Z-axis position sensor 74 (see FIG. 3). The ball screw unit 72 includes a shaft unit (fixed unit) 72a and a nut unit (movable unit) 72b. The Z-axis motor 71 is attached to the cover 500. The shaft unit 72a is connected to the rotating shaft of the Z-axis motor 71. The shaft unit 72a extends in the vertical direction. The nut unit 72b is annularly mounted on the shaft unit 72a via a number of balls (not shown). A recess (power transmission unit) 72b1 is arranged in the nut unit 72b.

[0019] The revolution section 54 includes a Q-axis (revolution axis) motor 52, a first gear for revolution 541, a second gear for revolution 542, a shaft for revolution 543, a rotating plate 544, and eight collars 545. The Q-axis motor 52 is attached to the cover 500 via a bracket (not shown). The first gear for revolution 541 is connected to the rotating shaft of the Q-axis motor 52. The second gear for revolution 542 meshes with the first gear for revolution 541. The rotating plate 544 is disposed below the second gear for revolution 542, spaced apart by a predetermined distance. The shaft for revolution 543 connects the second gear for revolution 542 and the rotating plate 544. The eight collars 545 are disposed at 45° intervals around the revolution axis Q. The collar 545 has a short-axis cylindrical shape extending in the vertical direction. The collar 545 is embedded in the rotating plate 544 .

[0020] The rotation unit 55 includes an R-axis motor 51, a first rotation gear 551, a second rotation gear 552, and a third rotation gear 553. The R-axis motor 51 is attached to the cover 500 via a bracket (not shown). The first rotation gear 551 is connected to a rotating shaft of the R-axis motor 350. The second rotation gear 552 meshes with the first rotation gear 551. The second rotation gear 552 has an annular shape. The third rotation gear 553 is connected to the lower side of the second rotation gear 552. The third rotation gear 553 has a cylindrical shape. The revolution shaft 543 passes through the second rotation gear 552 and the third rotation gear 553 in the up-down direction.

[0021] Each of the eight holders 58 is inserted through the collar 545. The holder 58 includes a clad portion 580 and a core portion 581. The clad portion 580 is movable in the up-down direction relative to the collar 545. The clad portion 580 includes an outer tube member 580a, a protruding portion (power transmission portion) 580c, and a holder gear 580d. The protruding portion 580c is disposed on the outer peripheral surface of the outer tube member 580a. The protruding portion 580c is engageable with the recessed portion 72b1 in the up-down direction. The holder gear 580d is disposed on the outer peripheral surface of the outer tube member 580a. The holder gear 580d is engaged with the third gear 553 for rotation.

[0022] The clad portion 580 is vertically movable relative to the core portion 581 by a predetermined pushing stroke.

[0023] Core portion 581 includes a detection target portion 581a. Detection target portion 581a protrudes upward from outer cylinder member 580a.

[0024] A suction part 591 is disposed at the lower end of the suction nozzle 59. The suction part 591 is capable of suctioning and releasing the component P by air pressure supplied through a gas passage (not shown).

[0025] A photoelectric sensor 73 is disposed on the nut portion 72b. The photoelectric sensor 73 is movable up and down together with the nut portion 72b. The photoelectric sensor 73 includes a light-emitter and a light-receiver, not shown. The light-emitter is capable of emitting light to the detected portion 581a. The light-receiver is capable of receiving light reflected from the detected portion 581a. A detection area A is set horizontally adjacent to the photoelectric sensor 73 (on the side of the detected portion 581a).

[0026] The touchdown detection method includes a reference value setting step and a touchdown determination step. The touchdown detection step is performed in a non-grounded state (specifically, a state in which the horizontal transfer of component P by XY robot 31 is completed and before holder 58 and suction nozzle 59 are lowered, as shown by holder 58 and suction nozzle 59 on the rear side in FIG. 2). In the reference value setting step, control device 90 detects the light receiving rate from the light receiver of photoelectric sensor 73.

[0027] When the detectable portion 581a does not enter the detection area A, none of the light from the light emitter enters the light receiver. This initial state is set to 0%. On the other hand, when the detectable portion 581a enters the entire detection area A, all of the reflected light from the detectable portion 581a enters the light receiver. This final state is set to 100%.

[0028] In contrast, in reality, in the non-grounded state, the upper end of the detected portion 581a enters the detection area A. In the initial value setting step, the control device 90 detects the light-receiving rate of the light receiver in the non-grounded state and sets the reference level a1. For example, if the light-receiving rate of the light receiver in the non-grounded state is 10%, with the initial state being 0% and the final state being 100%, the control device 90 sets the reference level a1 to 10%. The control device 90 also sets the threshold value a2 to, for example, 110%, with the reference level a1 being 100%.

[0029] The grounding determination process is executed when switching from a non-grounded state to a grounded state. That is, it is executed when the holder 58 and the suction nozzle 59 are lowered. In the grounding determination process, the control device 90 drives the Z-axis motor 71 to lower the holder 58 and the suction nozzle 59 relative to the mounting head 50 shown in FIG. 2. In addition, the control device 90 continuously detects the light receiving rate from the light receiver of the photoelectric sensor 73.

[0030] When the holder 58 descends and the component P is grounded on the board S, the suction nozzle 59 and the core portion 581 immediately stop descending. However, the clad portion 580 continues to descend together with the nut portion 72b and the photoelectric sensor 73. Therefore, the suction nozzle 59 and the core portion 581 rise relatively to the clad portion 580. When the core portion 581 rises relatively to the clad portion 580, the detected portion 581a rises relatively in the detection area A. Therefore, the light receiving rate of the light receiver of the photoelectric sensor 73 increases. When the light receiving rate reaches the threshold value a2, the control device 90 determines that the component P is grounded on the board S. The control device 90 stops the Z-axis motor 71 and stops the descent of the holder 58 and the suction nozzle 59. The control device 90 releases the grounded component P from the suction nozzle 59, drives the Z-axis motor 71, and raises the holder 58 and the suction nozzle 59.

[0031] Then, the control device 90 sets the next holder 58 and suction nozzle 59 (with component P already picked up) directly above the next mounting coordinate. Thereafter, the control device 90 executes the reference value setting process and the grounding determination process. In this manner, the control device 90 repeatedly executes the grounding detection method as many times as the number of components P held by the mounting head 50.

[0032] 3, the control device 90 is configured as a microprocessor centered on a CPU 91, and in addition to the CPU 91, includes a ROM 92, an HDD 93, a RAM 94, an input / output interface 95, etc. These are connected via a bus 96. To the control device 90, an image signal from the part camera 80, an image signal from the mark camera, a detection signal from an X-axis position sensor 67 that detects the position of the X-axis slider 62 in the X-axis direction, a detection signal from a Y-axis position sensor 69 that detects the position of the Y-axis slider 64 in the Y-axis direction, a detection signal from a Z-axis position sensor 74 that detects the position of each nut portion 72b in the Z-axis direction, a detection signal from a photoelectric sensor 73 that detects the position of each holder 58 in the Z-axis direction, etc. are input via the input / output interface 95. On the other hand, the control device 90 outputs, via the input / output interface 95, a control signal to the substrate transport unit 20, a control signal to the component supply unit 40, a drive signal to the XY robot 60 (X-axis motor 66 and Y-axis motor 68), a drive signal to the mounting head 50 (R-axis motor 51, Q-axis motor 52, and Z-axis motor 71), and the like.

[0033] The operation of the mounting device 10 thus configured will be described below. Figures 4 and 5 are flowcharts showing an example of a mounting process. This process is executed by the control device 90 in a state in which the substrate S carried in by the substrate transport unit 20 is clamped and backed up by the backup unit 30. Hereinafter, in the description of the procedure of each process, steps will be represented as "S".

[0034] In FIG. 4, the CPU 91 of the control device 90 first sets the touchdown detection section for each mounting position to an initial value (S10). Here, the touchdown detection section is a section in which the speed at which the holder 58 and the suction nozzle 59 are lowered is slowed down when it is detected that the component P has touched down on the board S, that is, when it is determined that the component P has touched down in the above-mentioned grounding determination process. If the component P picked up by the suction nozzle 59 is at a position higher than the touchdown detection section, the mounting time of the component P can be shortened by speeding up the speed at which the holder 58 and the suction nozzle 59 are lowered. However, if touchdown is detected at this high speed, there is a risk that touchdown cannot be detected properly. Therefore, the speed at which the holder 58 and the suction nozzle 59 are lowered is slowed down immediately before touchdown is detected, so that touchdown can be detected properly.

[0035] FIG. 6(a) shows an example of a touchdown detection section for each mounting position of a board S0, the surface of which is an ideal flat surface. In FIG. 6(a) (similarly for FIGS. 6(b) and 6(c)), the horizontal direction indicates the mounting position, and the vertical direction indicates the height. The horizontal mounting positions P1 to P5 each indicate a different mounting position. The vertical height H0 indicates a target value for grounding the component P on the board S. The height H1 indicates the start point of the touchdown detection section for each mounting position. That is, in the board S0, the same section H1-H0 is set as the initial value for the touchdown detection section for each mounting position for all mounting positions P1 to P5. This is because the target height H0 at each mounting position P1 to P5 is the same as the height of the ground on the board S0.

[0036] FIG. 6(b) shows an example of the touchdown detection section for each mounting position of the board S1 having a warp on the surface of the board S. In the example of FIG. 6(b), the height H0 also indicates a target value for grounding the component P on the board S. However, the board S1 has a warp at the mounting position P2 with a height H2 higher than the target height H0, and a warp at the mounting position P4 with a height H3 lower than the target height H0. Therefore, in order to provide a touchdown detection section of the same length or longer as the board S0 in FIG. 5(a) for each of the mounting positions P1 to P5, it is necessary to set the height H4 obtained by adding the section H1-H0 to the height H2 as the start point of the touchdown detection section for each mounting position. Therefore, for the board S1, the same section H4-H0 is set as the initial value for the touchdown detection section for each mounting position for each of the mounting positions P1 to P5.

[0037] In addition, in the above S10 in Fig. 4, the question is whether to use the touchdown detection section in Fig. 6(a) or the touchdown detection section in Fig. 6(b) as the initial value of the touchdown detection section for each mounting position, but if the state of warping of the board S is not known before starting the mounting process, the touchdown detection section in Fig. 6(a) should be used, and if it is known, the touchdown detection section in Fig. 6(b) should be used. In this embodiment, the touchdown detection section in Fig. 6(b) is used.

[0038] Returning to FIG. 4, the CPU 91 controls the mounting head 50 to lower the suction nozzle 59 and pick up the component P supplied to the supply position by the component supply unit 40 (S12).

[0039] Next, when the CPU 91 has completed suction of the component to the suction nozzle 59, the CPU 91 controls the mounting head 50 to move the mounting head 50 onto the board S using the XY robot 60, lower the suction nozzle 59, and mount the component P at the mounting position on the board S (S14).

[0040] Next, the CPU 91 detects the touchdown height and stores the detected touchdown height in, for example, the RAM 94 in association with the current mounting position (S16). Specifically, the touchdown height is detected by detecting a detection signal from the Z-axis position sensor 74 when the light-receiving rate of the light receiver of the photoelectric sensor 73 reaches the threshold value a2, that is, when the control device 90 (the CPU 91 of the control device 90) determines that the component P is grounded to the board S.

[0041] Then, the CPU 91 judges whether or not mounting of all components has been completed (S18). If it is judged that there are still components to be mounted (S18: NO), the CPU 91 selects the next component to be mounted, and returns the process to S12. On the other hand, if it is judged that mounting of all components has been completed (S18: YES), the CPU 91 advances the process to S20.

[0042] In S20, the CPU 91 judges whether mounting on a predetermined number of boards has been completed. If it is judged that mounting on the predetermined number of boards has not been completed (S20: NO), the CPU 91 advances the process to S40 in FIG. 5. On the other hand, if it is judged that mounting on the predetermined number of boards has been completed (S20: YES), the CPU 91 advances the process to S22. Here, the "predetermined number" refers to a portion of the number of boards out of all boards on which mounting is planned. In this embodiment, the predetermined number is, for example, three boards (boards S1 to S3 in FIG. 6(c)), but is not limited to this.

[0043] In S40 of Fig. 5, the CPU 91 judges whether mounting on all boards has been completed. If it is judged that mounting on all boards has not been completed (S40: NO), the CPU 91 waits until the next board to be mounted is backed up by the backup unit 30, and then returns the process to S12 of Fig. 4. On the other hand, if it is judged that mounting on all boards has been completed (S40: YES), the CPU 91 ends the mounting process.

[0044] 4, the CPU 91 calculates the average value of the touchdown height for each mounting position by averaging the touchdown heights stored in association with each mounting position over a predetermined number of boards.

[0045] Next, the CPU 91 calculates the variation from the average touchdown height for each mounting position (S24). When one mounting position is fixed, the touchdown heights are stored for a predetermined number of boards. Then, in the above S22, one average touchdown height is calculated for one fixed mounting position. Therefore, in S24, for each of the touchdown heights for the predetermined number of boards, the difference from the average touchdown height is calculated, and this is taken as the variation for one fixed mounting position. Then, this calculation of the variation is performed for all mounting positions. Note that the average touchdown height for each mounting position calculated in S22 and the variation from the average touchdown height for each mounting position calculated in S24 are temporarily stored, for example, in the RAM 94.

[0046] Next, the CPU 91 initializes the mounting position counter (S26). Note that the mounting position counter is a software counter that counts to indicate the mounting position, that is, in this embodiment, any one of the mounting positions P1 to P5. Therefore, in this embodiment, the mounting position counter counts any one of 1 to 5, and therefore the initialization means setting the mounting position counter to "1."

[0047] Then, the CPU 91 judges whether or not the variation in the mounting position indicated by the mounting position counter exceeds a predetermined range (S28 in FIG. 5). Since the variation is calculated as the difference from the average touchdown height as described above in this embodiment, the CPU 91 judges whether or not the variation exceeds the predetermined range based on whether or not the maximum value of the calculated differences exceeds the predetermined range.

[0048] If it is determined in S28 that the variation in the mounting position indicated by the mounting position counter exceeds a predetermined range (S28: YES), the CPU 91 adds the maximum value of the variation, i.e., the maximum value of the difference, to the average touchdown height, and further adds a predetermined margin, associates it with the mounting position, and stores it, for example, in the RAM 94 (S30), and then proceeds to S34.

[0049] On the other hand, if it is determined in S28 that the variation in the mounting position indicated by the mounting position counter does not exceed the predetermined range (S28: NO), the CPU 91 adds a predetermined margin to the average touchdown height, associates it with the mounting position, and stores it, for example, in the RAM 94 (S32), and then proceeds to S34.

[0050] In S34, the CPU 91 determines whether the mounting position counter has counted the last mounting position. If it is determined that the mounting position counter has not counted the last mounting position (S34: NO), the CPU 91 increments the mounting position counter by "1" (S36) and returns the process to S28. On the other hand, if it is determined that the mounting position counter has counted the last mounting position (S34: YES), the CPU 91 advances the process to S38.

[0051] In S38, the CPU 91 updates the touchdown detection section for each mounting position with the stored value. After that, the CPU 91 advances the process to S40. The process of S40 has been described above, and therefore will not be described here. After the touchdown detection section for each mounting position is updated by the process of S38, the CPU 91 determines the speed at which the holder 58 and the suction nozzle 59 are lowered based on the updated touchdown detection section for each mounting position until mounting on all boards is completed. In other words, the CPU 91 increases the speed at which the holder 58 and the suction nozzle 59 are lowered at a position higher than the touchdown detection section for each mounting position, and decreases the speed within the touchdown detection section for each mounting position.

[0052] Fig. 6(c) shows an example of the touchdown detection section for each mounting position updated by the process of S38 above. In Fig. 6(c), board S1 indicates the board mounted first by the mounting process, board S2 indicates the board mounted second by the mounting process, and board S3 indicates the board mounted third by the mounting process.

[0053] In the example of FIG. 6(c), for mounting positions P1, P3, and P5, there is no warping on any of the boards S1 to S3, so the average touchdown height is H0 and the variation is 0. Therefore, if the "predetermined margin" in S30 above is set to, for example, a value H1-H0 (see FIG. 6(a)), the touchdown detection section for each mounting position at mounting positions P1, P3, and P5 is updated from the initial value H4-H0 to a value H1-H0. Note that H1 <H4である。

[0054] On the other hand, although there is warping on all of the boards S1 to S3, there is little variation at mounting position P2. For example, if the average touchdown height is the height of mounting position P2 on board S2 and the maximum variation is within a predetermined range, the touchdown detection section for each mounting position at mounting position P2 is updated from the initial value H4-H0 to a value H5-H0. Note that height H5 is the height of mounting position P2 on board S2 plus a "predetermined margin," i.e., value H1-H0, where H5>H4.

[0055] Furthermore, for mounting position P4, there is warping on all of the boards S1 to S3, and there is a lot of variation. For example, if the average touchdown height is the height of mounting position P4 on board S3 = H0, and the maximum value of variation exceeds a predetermined range, the touchdown detection section for each mounting position at mounting position P4 is updated from the initial value H4-H0 to a value H6-H0. Note that height H6 is the value obtained by adding the maximum value of variation, that is, the difference between the height of mounting position P2 on board S2 and the height H0 of mounting position P2 on board S3, to the height H0 of mounting position P2 on board S3, and further adding a "predetermined margin", that is, the value H1-H0, and H6>H5>H4.

[0056] In this way, the touchdown detection interval for each mounting position after the update is longer than the initial value at mounting positions P2 and P4, but shorter than the initial value at mounting positions P1, P3, and P5, so that the touchdown detection interval for each mounting position as a whole is shorter than the initial value. This makes it possible to shorten the mounting time.

[0057] Furthermore, at mounting positions where there is little variation in touchdown height, such as mounting position P2, the touchdown detection section for each mounting position is updated to a value obtained by adding a predetermined margin to the average touchdown height, that is, a section obtained by shifting the center value of the touchdown detection section for each mounting position to the average touchdown height. Furthermore, at mounting positions where there is a lot of variation in touchdown height, such as mounting position P4, the touchdown detection section for each mounting position is updated to a value obtained by adding the average touchdown height to the maximum value of the variation, and further adding a predetermined margin. In this way, the touchdown detection section for each mounting position is set to an optimal section depending on the touchdown height situation on each board S, so it is possible to accurately detect touchdown on any board S.

[0058] 7 shows a mounting head 140 having a different configuration from the mounting head 50 of FIG. 2. The mounting head 140 includes a head body 142 in which a plurality of nozzle holders 165 (only two are shown in FIG. 7) are arranged at predetermined angular intervals (for example, 30 degree intervals) in a circumferential direction coaxial with a rotation axis, and a suction nozzle 160 detachably attached to a lower end of each nozzle holder 165. The mounting head 140 also includes an R-axis motor (not shown) that rotates the head body 142 to rotate (revolve) the plurality of nozzle holders 165, a Q-axis motor 146 that rotates (spins) the plurality of nozzle holders 165, and a lifting device (not shown) that lifts and lowers the nozzle holder 165. The mounting head 140 also includes a negative pressure supply device 170 that supplies a negative pressure to the suction portion 161, and a positive pressure supply device 180 that supplies a positive pressure to the nozzle holder 165.

[0059] The head body 142 includes a frame 141 attached to the X-axis slider 62 (see FIG. 1), a shaft portion 142a rotatably supported by the frame 141, and a holder holding portion 142b formed in a cylindrical shape with a diameter larger than that of the shaft portion 142a and holding a plurality of nozzle holders 165 movably in the Z-axis direction. When the R-axis motor is driven, the shaft portion 142a and the holder holding portion 142b rotate, and the plurality of nozzle holders 165 rotate (revolve). The head body 142 also includes a gear 143 that is coaxial with the shaft portion 142a and supported rotatably relative to the shaft portion 142a, and a gear 147 that rotates with the rotation of the gear 143. The gear 143 meshes with a gear 145 attached to the rotating shaft of the Q-axis motor 146, and the gear 147 meshes with a gear 165b attached to each nozzle holder 165. When the Q-axis motor 146 is driven, each nozzle holder 165 and the suction nozzles 160 attached to each nozzle holder 165 rotate (spin) by the same amount of rotation (rotation angle) in the same direction. In addition, a spring 165a is disposed between the lower surface of the gear 165b and the upper surface of the holder holding portion 142b. The spring 165a biases the nozzle holder 165 upward in the Z-axis direction.

[0060] The nozzle holder 165 is configured as a cylindrical member extending in the Z-axis direction, and has a first gas passage 166a and a second gas passage 167a formed therein. The nozzle holder 165 also has a horizontal portion 165c formed at its upper end portion and extending in the radial direction.

[0061] The negative pressure supply device 170 is a device that independently supplies negative pressure from the same negative pressure source 171 to the plurality of suction nozzles 160 attached to the plurality of nozzle holders 165. The negative pressure supply device 170 includes a negative pressure source 171 such as a vacuum pump, a frame passage 172, a head passage 173, a negative pressure introduction passage 174, an air introduction passage 175, a spool hole 177, a spool 178, and a spool drive mechanism (not shown). The frame passage 172 is formed in the frame 141 of the mounting head 140 and is connected to the negative pressure source 171. The head passage 173 is formed so as to communicate with the frame passage 172 and extend along the central axis of the mounting head 140. The negative pressure introduction passages 174 are formed in a plurality of ways that communicate with the head passage 173 and extend radially from the central axis of the holder holding portion 142b. A plurality of atmosphere introduction passages 175 are formed corresponding to the negative pressure introduction passages 174 so as to communicate with a positive pressure source (here, the atmosphere).

[0062] The spool 178 is a switching valve for selectively connecting the first gas passage 166a provided in each of the plurality of nozzle holders 165 to either the corresponding negative pressure introduction passage 174 or the atmosphere introduction passage 175. The first gas passage 166a is connected to a suction port at the tip of the suction part 161 of the suction nozzle 160. The spool 178 is a cylindrical member that is inserted into each of the spool holes 177 formed in the holder holding part 142b corresponding to each of the plurality of nozzle holders 165. The spool 178 has a reduced diameter at approximately the center, and the periphery of the reduced diameter part in the space in the spool hole 177 becomes a path for negative pressure from the negative pressure source 171. When the spool 178 itself is moving upward (the state of FIG. 7), it connects the first gas passage 166a to the negative pressure introduction passage 174 and blocks communication between the first gas passage 166a and the atmosphere introduction passage 175. On the other hand, when the spool 178 is moving downward, it blocks communication between the first gas passage 166a and the negative pressure introduction passage 174 and connects the first gas passage 166a to the atmosphere introduction passage 175. The spool drive mechanism outputs a drive force to move the spool 178 up and down, thereby switching whether the spool 178 connects the first gas passage 166a to the negative pressure introduction passage 174 or the atmosphere introduction passage 175.

[0063] The positive pressure supply device 180 is a device that supplies positive pressure to the second gas passage 167a provided in each of the multiple nozzle holders 165. The positive pressure supply device 180 includes a positive pressure source 181 such as a compressor, a flow sensor 181a, a frame passage 182, a head passage 183, and a positive pressure introduction passage 184. The flow sensor 181a is connected to the positive pressure source 181 and detects the flow rate of gas (here, air) supplied from the positive pressure source 181 and flowing through the second gas passage 167a. The frame passage 182 is formed at a position different from the frame passage 172 in the frame 141 of the mounting head 140, and is connected to the flow sensor 181a and the positive pressure source 181. The head passage 183 is formed to communicate with the frame passage 182 and extend along the central axis direction of the mounting head 140. The head passage 183 has a ring shape with the head passage 173 at the center in a top view, and extends in the vertical direction in a shape surrounding the head passage 173 while being spaced apart from it. The positive pressure introduction passages 184 are formed in plurality so as to communicate with the head passage 183 and extend from the central axis side of the holder holding part 142b toward the outside of the holder holding part 142b. Each of the plurality of positive pressure introduction passages 184 is formed corresponding to each of the plurality of nozzle holders 165, and communicates with the second gas passage 167a of the corresponding nozzle holder 165. Note that each of the plurality of positive pressure introduction passages 184 is formed so as to avoid the negative pressure introduction passage 174 and the spool hole 177. The frame passage 182, the head passage 183, the positive pressure introduction passage 184, and the second gas passage 167a are not connected to the frame passage 172, the head passage 173, the negative pressure introduction passage 174, the atmosphere introduction passage 175, the spool hole 177, or the first gas passage 166a. That is, the negative pressure path and the positive pressure (atmosphere) path of the negative pressure supply device 170 and the positive pressure path of the positive pressure supply device 180 are independent of each other.

[0064] When mounting a component P on a board S by the mounting head 140, the CPU 91 starts lowering the target nozzle by the lifting device. Then, the CPU 91 waits until the flow rate detected by the flow rate sensor 181a exceeds a predetermined threshold, that is, until the pushing amount reaches a predetermined amount. When it is determined that the pushing amount reaches the predetermined amount, the CPU 91 switches the spool 178 corresponding to the target nozzle by the spool drive mechanism to apply positive pressure (atmosphere) to the suction part 161, thereby releasing the negative pressure, and raises the suction part 161 by the lifting device. In this way, when the CPU 91 determines that the pushing amount reaches the predetermined amount based on the flow rate detected by the flow rate sensor 181a, it releases the negative pressure of the suction part 161 and raises it.

[0065] That is, whereas in the mounting head 50 of Fig. 2 above, touchdown is detected based on the light receiving rate of light detected by the receiver of the photoelectric sensor 73, in the mounting head 140 of Fig. 7, touchdown is detected based on the flow rate detected by the flow sensor 181a, which is a difference. However, the process of setting the touchdown detection section for each mounting position, that is, the processes other than S12 and S14 during the mounting process of Figs. 4 and 5 above, do not differ even if the mounting head is changed from the mounting head 50 to the mounting head 140, so a description thereof will be omitted.

[0066] As described above, the mounting method of this embodiment is a mounting method for mounting a component P on a board S using a mounting head 50 that can be raised and lowered by driving a Z-axis motor 71 to pick up the component P, and includes a detection step (S16) for detecting that the mounting head 50, 140 that has picked up the component P has lowered to the mounting position of the component P on the board S and contacted the board S via the component P, and a setting step (S10, S38) for setting a detection section for detection by the detection step for each mounting position of the component P on the board S. Incidentally, in this embodiment, the Z-axis motor 71 is an example of a "driving source." The mounting head 50, 140 is an example of a "suction member."

[0067] In this way, in the mounting method of this embodiment, the detection section for detecting when the mounting head 50, 140 which has adsorbed the component P comes into contact with the board S via the component P can be set for each mounting position of the component P on the board S. In other words, the length of the detection section can be changed depending on the condition of the board S at the position where the component P is to be mounted, thereby making it possible to further shorten the mounting time.

[0068] The method further includes a storage step (S16) for storing in the RAM 94 as history information the height of the mounting head 50 when the detection step detects that the mounting head 50, 140 has come into contact with the board S via the component P, and a determination step (S30, S32) for determining the detection section based on the history information stored in the storage step. The RAM 94 is an example of a "memory".

[0069] In this way, the detection section is determined based on the history of the height of the mounting head 50 actually used in the past for mounting, so that an appropriate detection section can be set.

[0070] Moreover, the determining steps (S30, S32) determine the range of the detection section according to the degree of variation in the height of the mounting head 50 contained in the history information.

[0071] This makes it possible to set a more appropriate detection section.

[0072] Moreover, in the determining step (S32), when the degree of variation in height is within a predetermined range, the detection section is determined by shifting the center value of the detection section to the average value of the height.

[0073] In this way, the detection section is shifted while the length of the detection section remains the same, so that the detection section can be prevented from becoming longer.

[0074] The mounting head 50 also includes a suction portion 591 that suctions the component P, and a photoelectric sensor 73 that projects light onto a detection area A where a detected portion 581a moves relatively in response to contact of the component P with the board S, and receives light from the detection area A, and the detection step (S16) detects that the component P has come into contact with the mounting position on the board S based on an output signal from the photoelectric sensor 73. Incidentally, the suction portion 591 is an example of a "nozzle portion."

[0075] The mounting head 140 also includes a suction unit 161 that suctions the component P, and a frame passage 182 in which the flow rate or pressure of the gas flowing varies according to the amount of pressure of the suction unit 161, and the detection step (S16) detects that the component P has come into contact with the mounting position on the board S by detecting at least one of the flow rate and pressure of the gas flowing through the frame passage 182. Incidentally, the suction unit 161 is an example of a "nozzle portion." The frame passage 182 is an example of a "gas passage."

[0076] The present invention is not limited to the above-described embodiment, and various modifications are possible without departing from the spirit of the present invention.

[0077] (1) In the above embodiment, the number of suction nozzles 59 in the mounting head 50 in FIG. 2 was eight, and the number of suction nozzles 160 in the mounting head 140 in FIG. 7 was twelve, but the number of suction nozzles is not limited to these.

[0078] (2) In the above embodiment, the same "predetermined margin" is added in both the processes of S30 and S32 in Fig. 5, but this is not limiting, and the margin value added in the processes of S30 and S32 may be different. Also, the margin value may be set to "0" or a value close to "0". In this case, the mounting time can be further shortened. [Explanation of symbols]

[0079] 10... mounting device, 50, 140... mounting head, 58... holder, 580... cladding portion, 581... core portion, 59, 160... suction nozzle, 591, 161... suction portion, 60... XY robot, 70... lifting device, 71... Z-axis motor, 72a... shaft portion, 72b... nut portion, 73... photoelectric sensor, 90... control device, 91... CPU, 92... ROM, 93... HDD, 94... RAM, 95... input / output interface, 161a... nozzle portion passage, 1 61b...nozzle portion branch passage, 165...nozzle holder, 166...first gas passage, 167a...second gas passage, 170...negative pressure supply device, 171...negative pressure source, 172...frame passage, 173...head passage, 174...negative pressure introduction passage, 175...atmosphere introduction passage, 177...spool hole, 178...spool, 180...positive pressure supply device, 181...positive pressure source, 181a...flow rate sensor, 182...frame passage, 183...head passage, 184...positive pressure introduction passage.

Claims

1. A mounting method for mounting a component on a board using a suction member that can be raised and lowered by being driven by a drive source to suction the component, comprising: a detection step of detecting that the suction member on which the component has been suctioned has descended to a mounting position of the component on the board and contacted the board via the component; a setting step capable of setting a detection section in which the detection is performed by the detecting step for each mounting position of the component on the board; a storage step of storing in a memory, as history information, a height of the suction member when it is detected in the detection step that the suction member has come into contact with the board via the component; a determination step of determining the detection section based on the history information stored by the storage step; having the determining step determines a range of the detection section in accordance with a degree of variation in height of the attraction member included in the history information, and, if the degree of variation in height is within a predetermined range, determines the detection section by shifting a center value of the detection section to an average value of the height. How to implement it.

2. the suction member includes a nozzle portion that suctions the component, and a photoelectric sensor that projects light onto a detection area where a detected portion moves relatively in response to contact of the component with the board and receives the light from the detection area; The detection step detects that the component has come into contact with the mounting position on the board based on an output signal from the photoelectric sensor. The mounting method according to claim 1 .

3. the suction member includes a nozzle portion that suctions the component, and a gas passage through which a flow rate or a pressure of the gas flowing varies according to an amount of pressure of the nozzle portion, the detection step detects that the component has come into contact with the mounting position on the board by detecting at least one of a flow rate and a pressure of the gas flowing through the gas passage; The mounting method according to claim 1 .

4. A mounting device comprising a suction member capable of lifting and lowering by being driven by a drive source to suction a component, and the component suctioned by the suction member is mounted on a board, a detection unit that detects when the suction member on which the component has been suctioned descends to a mounting position for the component on the board and comes into contact with the board via the component; a setting unit capable of setting a detection section in which the detection unit performs detection for each mounting position of the component on the board; a storage unit that stores in a memory a height of the suction member when the detection unit detects that the suction member has come into contact with the board via the component; a determination unit that determines the detection section based on the height of the attraction member stored in the memory unit, and determines a range of the detection section in accordance with a degree of variation in the height of the attraction member; having the determination unit determines the detection section by shifting a center value of the detection section to an average value of the height when the degree of variation in the height is within a predetermined range. Mounting equipment.

Images