Cleaning device and cleaning method

Abstract

To wash a periphery of a tabular object even when a clamp or the like protrudes above the periphery of the tabular object.SOLUTION: A washing device includes; a holding unit that includes a disc-shaped base and regulation members provided at least three positions of the periphery of the base and is rotatable in a state of the regulation members regulating movement of a tabular object; and a washing unit for washing one surface of the tabular object held by the holding unit. The washing unit includes: a first washing nozzle capable of spraying first washing liquid to the center of the one surface of the tabular object; an arm; a fluctuation mechanism that is coupled to a base end of the arm and makes the arm fluctuate along a horizontal plane; a washing tool that is coupled to a tip of the arm and comes into contact with the one surface of the tabular object held by the holding unit to wash the tabular object; and a second nozzle that is provided between the base end and the tip of the arm and is capable of spraying second washing liquid to the periphery of the one surface.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a cleaning device for cleaning a plate-like object and a cleaning method for cleaning a plate-like object. [Background technology]

[0002] In the manufacturing process of semiconductor devices, grinding and polishing are performed on the processed surface (one side) of a wafer made of a semiconductor material such as silicon. Grinding debris, polishing debris, etc. that adhere to the one side of the wafer after grinding and polishing are removed from the one side of the wafer by, for example, a spinner cleaning mechanism provided in the grinding and polishing device.

[0003] For example, in a spinner cleaning mechanism, one side of the wafer is cleaned by rotating a spinner table which holds under suction the other side of the wafer, which is located opposite to the one side of the wafer, while spraying cleaning water such as pure water from a cleaning nozzle located above the spinner table onto the one side of the wafer.

[0004] Furthermore, when a higher level of cleanliness is required, a cleaning method has been proposed in which a cleaning brush is pressed against one side of a wafer rotating around a predetermined axis of rotation while supplying cleaning water, and the cleaning brush is oscillated to clean the one side of the wafer (see, for example, Patent Document 1).

[0005] Meanwhile, a spinner cleaning mechanism has been proposed that has four clamps that can grip the outer peripheral sides of the wafer when cleaning one side of the wafer, in order to avoid contamination of the other side of the wafer due to contact with components of the cleaning mechanism and to simultaneously clean both the one side and the other side of the wafer (see, for example, Patent Document 2).

[0006] However, when the spinner cleaning mechanism grips a wafer, a clamp protrudes from the outer periphery of one side of the wafer toward the center, and the oscillation range of the cleaning brush needs to be set inside the clamp protrusion position, which creates a problem that the outer periphery of one side of the wafer that is located outside the clamp protrusion position cannot be cleaned.

[0007] Therefore, in order to clean the outer periphery of one side of the wafer, it is possible to consider providing a separate spinner cleaning mechanism equipped with a spinner table that suction-holds the other side of the wafer; however, this would result in problems such as an increase in the installation area and an increase in the manufacturing costs of the semiconductor device. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] JP 2015-198167 A [Patent Document 2] Japanese Patent Application Publication No. 11-31643 Summary of the Invention [Problem to be solved by the invention]

[0009] The present invention has been made in consideration of the above problems, and has an object to clean the outer periphery of a plate-like object such as a wafer when the plate-like object is cleaned by swinging a cleaning tool such as a cleaning brush while a clamp or the like protrudes above the outer periphery of the plate-like object such as a wafer. [Means for solving the problem]

[0010] According to one aspect of the present invention, a cleaning device for cleaning a plate-like object includes a disk-shaped base, and restricting members provided at least in three places on the outer periphery of the base for restricting movement of the plate-like object in the radial direction and thickness direction of the base, the restricting members being provided on the outer periphery of the base, the holding unit being rotatable while restricting movement of the plate-like object with the restricting members, and a cleaning unit for cleaning one side of the plate-like object held by the holding unit, the side opposite the base, the regulating member has an edge regulating portion capable of contacting a side portion of the plate-like object, and an upper surface regulating portion provided at an upper end portion of the edge regulating portion in a manner of protruding a predetermined amount toward the center of the base and regulating movement of the plate-like object in a thickness direction of the base,the cleaning unit has a first cleaning nozzle capable of spraying a first cleaning liquid onto a center portion of the one surface of the plate-like object held by the holding unit, an arm disposed above the base of the holding unit, a swinging mechanism connected to a base end of the arm and swinging the arm along a horizontal plane, a cleaning tool connected to a tip end of the arm and contacting the one surface of the plate-like object held by the holding unit to clean the plate-like object, and a second cleaning nozzle provided between the base end and the tip end of the arm and capable of spraying a second cleaning liquid onto an outer periphery of the one surface of the plate-like object held by the holding unit, and the one surface of the plate-like object held by the holding unit and rotating in the circumferential direction of the base is sprayed with the first cleaning liquid sprayed from the first cleaning nozzle and In a range inside the upper surface restriction portion in the radial direction of the base and after cleaning the one surface of the plate-like object with the cleaning tool that is in contact with the one surface of the plate-like object while swinging, the position of the arm is adjusted to position the second cleaning nozzle on the outer periphery of the plate-like object, and the second cleaning liquid is sprayed from the second cleaning nozzle onto the outer periphery of the one surface of the base, and the plate-like object held by the holding unit is rotated in the circumferential direction of the base, thereby cleaning the outer periphery of the one surface. Preferably, the second cleaning nozzle sprays a gas-liquid mixed fluid in which a liquid and a gas are mixed. Preferably, the holding unit further includes a plurality of support pins arranged at predetermined intervals on the upper surface of the base along the outer periphery of the base.

[0011] According to another aspect of the present invention, there is provided a cleaning method for cleaning a plate-like object, the method comprising: a holding step of holding the plate-like object with a holding unit by restricting movement of the plate-like object in a radial direction and a thickness direction of a base by restricting members provided at at least three locations on an outer periphery of the base of the holding unit; a step of spraying a first cleaning liquid from a first cleaning nozzle onto a center portion of one side of the plate-like object located on the opposite side to the base, the plate-like object being held in the holding step and rotating in the circumferential direction of the base; a first cleaning step of swinging the arm along a horizontal plane while a cleaning tool connected to a tip end of the arm is in contact with the one side of the plate-like object, thereby cleaning the one side; and a second cleaning step of, after the first cleaning step, positioning a second cleaning nozzle provided between the base end and the tip end of the arm at the outer periphery of the plate-like object, spraying a second cleaning liquid from the second cleaning nozzle onto the outer periphery of the one side of the base, and rotating the plate-like object in the circumferential direction of the base, thereby cleaning the outer periphery of the one side. The regulating member has an edge regulating portion capable of contacting a side portion of the plate-like object, and an upper surface regulating portion that is provided at an upper end of the edge regulating portion in a manner of protruding a predetermined amount toward the center of the base and regulates the movement of the plate-like object in the thickness direction of the base, and in the first cleaning step, the cleaning tool is swung in a range inside the upper surface regulating portion in the radial direction of the base. Preferably, in the second cleaning step, the second cleaning nozzle sprays a gas-liquid mixed fluid, which is a mixture of a liquid and a gas, onto the one surface. Also, preferably, a plurality of support pins are provided on the upper surface of the base and arranged at predetermined intervals along the outer periphery of the base, and in the holding step, the plate-like object is supported by the plurality of support pins. Effect of the Invention

[0012] A cleaning device according to one aspect of the present invention includes a holding unit and a cleaning unit having a first cleaning nozzle capable of spraying a first cleaning liquid onto a center portion of one surface of a plate-like object held by the holding unit, and a second cleaning nozzle capable of spraying a second cleaning liquid onto an outer periphery of the one surface of the plate-like object held by the holding unit.

[0013] When using the cleaning device to clean a plate-like object, first, one side of the plate-like object, which is held by a holding unit and rotates circumferentially around the base, is cleaned with a first cleaning liquid sprayed from a first cleaning nozzle and a cleaning tool that oscillates in contact with one side of the plate-like object.

[0014] Then, the position of the arm part is adjusted to position the second cleaning nozzle on the outer periphery of the plate-shaped object, and the second cleaning liquid is sprayed from the second cleaning nozzle onto the outer periphery of one side of the base, while the plate-shaped object held by the holding unit is rotated circumferentially around the base to clean the outer periphery of one side.

[0015] Therefore, even if the regulating member of the holding unit protrudes above the outer periphery of one surface, the outer periphery of one surface can be cleaned without using a separate spinner cleaning mechanism for cleaning the outer periphery. [Brief description of the drawings]

[0016] [Figure 1] FIG. 1 is a schematic diagram of a grinding and polishing device. [Diagram 2] FIG. 2 is an enlarged perspective view of the bottom surface cleaning device. [Diagram 3] FIG. [Figure 4] FIG. 4(A) is a perspective view of the holding unit, and FIG. 4(B) is a side view of the holding unit. [Diagram 5] FIG. 1 is a flow diagram of a cleaning method. [Figure 6] FIG. [Figure 7] FIG. 13 is a diagram showing a suction pad cleaning step. [Figure 8] FIG. 8(A) is a perspective view of the holding unit, and FIG. 8(B) is a side view of the holding unit. [Figure 9] FIG. 9(A) is a top view of the upper surface cleaning device, and FIG. 9(B) is a side view of the upper surface cleaning device. [Figure 10] FIG. 10(A) is a top view of the upper surface cleaning device, and FIG. 10(B) is a side view of the upper surface cleaning device. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] An embodiment according to one aspect of the present invention will be described with reference to the accompanying drawings. Fig. 1 is a schematic diagram of a grinding and polishing apparatus 2 that grinds, polishes, and cleans a semiconductor wafer 11. The X-axis direction, Y-axis direction, and Z-axis direction shown in Fig. 1 are mutually orthogonal.

[0018] The grinding / polishing apparatus 2 has a rectangular parallelepiped base 4. Two cassettes 6a and 6b are placed in front of the base 4 (on one side in the Y-axis direction). The cassette 6a stores a plurality of unprocessed wafers 11.

[0019] A plurality of devices (not shown) are formed on the front surface 11a of the wafer 11. A disk-shaped support substrate 13 having a thickness of about 700 μm to 800 μm is attached to the front surface 11a with an adhesive, wax, or the like to form a plate-shaped object 15 (see FIG. 6).

[0020] In the plate-like object 15, the back surface of the wafer 11 is exposed upward, and this exposed upper surface 11b (one surface) is subjected to processing such as grinding and polishing. The plate-like object 15 after processing is stored in the cassette 6b.

[0021] A transport robot 8 capable of accessing the cassettes 6a, 6b is provided behind the cassettes 6a, 6b (on the other side in the Y-axis direction). The transport robot 8 has a hand unit 8a. The hand unit 8a can suck and hold a plate-like object 15 by a suction pad (not shown) provided on one surface of the hand unit 8a.

[0022] The transfer robot 8 can move in the X-axis direction by a ball screw type moving mechanism 8b. The transfer robot 8 deploys a horizontal articulated arm unit to place the plate-like object 15 carried out from the cassette 6a on a positioning table 10 arranged behind the transfer robot 8.

[0023] The positioning table 10 has a disk-shaped table and a number of movable pins arranged around the periphery of the table. The position of the plate-like object 15 on the XY plane is adjusted by moving the movable pins toward the center of the table.

[0024] A first transport mechanism 12 is disposed above the positioning table 10. The first transport mechanism 12 has a horizontally articulated arm unit 12a. A movement mechanism that moves the arm unit 12a along the Y-axis and Z-axis directions is provided at the base end of the arm unit 12a.

[0025] A disk-shaped suction and holding unit 12b that uses negative pressure to suction and hold a plate-shaped object 15 is provided at the tip of the arm unit 12a. The plate-shaped object 15, whose position has been adjusted by the positioning table 10, is transported by the first transport mechanism 12 to a disk-shaped turntable 14 arranged on the base 4.

[0026] The turntable 14 is rotatable about a rotation axis that is approximately parallel to the Z-axis direction. The upper surface of the turntable 14 is divided into four regions, and each region is provided with a chuck table 16 that can suction and hold the plate-like object 15 by negative pressure.

[0027] The area closest to the positioning table 10 is the load / unload area A. The first transport mechanism 12 transports the plate-like object 15 from the positioning table 10 to the chuck table 16 located in the load / unload area A.

[0028] The area 90 degrees clockwise from the loading / unloading area A in a top view is the rough grinding area B. A rough grinding unit 20 having a spindle, a rough grinding wheel, etc. is provided above the rough grinding area B. In FIG. 1, the rough grinding unit 20 is shown in a simplified form.

[0029] The area 90 degrees clockwise from the rough grinding area B in top view is the finish grinding area C. A finish grinding unit 22 having a spindle, a finish grinding wheel, etc. is provided above the finish grinding area C. In FIG. 1, the finish grinding unit 22 is shown in a simplified form.

[0030] The area 90 degrees clockwise from the finish grinding area C in top view is the polishing area D. A polishing unit 24 having a spindle, a polishing wheel, etc. is provided above the polishing area D. In Fig. 1, the polishing unit 24 is shown in a simplified form. The position of the polishing unit 24 can be moved in the X-axis direction by a moving mechanism (not shown).

[0031] After the plate-like object 15 is carried into the carry-in / carry-out area A, the turntable 14 is rotated 90 degrees clockwise, whereby the plate-like object 15 is transported to the rough grinding area B, where the upper surface 11b side is roughly ground.

[0032] After the rough grinding, the turntable 14 is rotated 90 degrees clockwise to transport the plate-shaped object 15 to the finish grinding area C. Then, the upper surface 11b side is finish ground. After the finish grinding, the turntable 14 is rotated 90 degrees clockwise to transport the plate-shaped object 15 to the polishing area D. Then, the upper surface 11b side is polished.

[0033] After polishing, the turntable 14 is rotated 270 degrees counterclockwise in a top view to return the plate-like object 15 to the carry-in / carry-out area A. Then, the second transport mechanism 26 carries the plate-like object 15 out of the chuck table 16.

[0034] The second transport mechanism 26 has an arm 26a. A rotation mechanism that rotates the arm 26a in the XY plane is provided at the base end of the arm 26a. A movement mechanism is connected to the rotation mechanism. The rotation mechanism is moved along the Y-axis direction and the Z-axis direction by the movement mechanism.

[0035] A disk-shaped suction and retention unit 26b is provided at the tip of the arm 26a. As shown in Figures 6 and 7, the suction and retention unit 26b has a disk-shaped frame 26b1. A disk-shaped recess is formed in the frame 26b1, and a disk-shaped porous plate 26b2 is fixed to the recess.

[0036] A negative pressure generating source (not shown) such as an ejector is connected to one end of the flow path formed in the frame 26b1. The negative pressure generated by the negative pressure generating source is transmitted to the porous plate 26b2. The lower surfaces of the frame 26b1 and the porous plate 26b2 function as a holding surface 26c that holds the upper surface 11b of the plate-like object 15 by suction.

[0037] The plate-like object 15 held by suction on the holding surface 26c is transported above the underside cleaning device 30 (see Figure 1), and the underside 13a of the support substrate 13 exposed downward (i.e., the other side of the plate-like object 15) is cleaned by the underside cleaning device 30.

[0038] Here, the configuration of the lower surface cleaning device 30 will be described with reference to Fig. 2. Fig. 2 is an enlarged perspective view of the lower surface cleaning device 30. The lower surface cleaning device 30 has a cylindrical support member 32 fixed on a base 4.

[0039] A pipe 32a through which cleaning water such as pure water is supplied is provided on a side surface of the support member 32. The support member 32 has a through hole 32b whose length direction is approximately parallel to the Z-axis direction, and a cylindrical rotor 34 is inserted into the through hole 32b.

[0040] A pair of support blocks 36 arranged approximately parallel to a first direction E1 parallel to the horizontal plane are fixed to the upper part of the rotating body 34. A grinding wheel 36a is fixed to the upper surface of each support block 36.

[0041] A cylindrical nozzle unit 38 is provided on the upper surface of the rotor 34 so as to be adjacent to one side surface of each support block 36. The longitudinal portion of the nozzle unit 38 is parallel to the horizontal plane and disposed approximately parallel to a second direction E2 that is perpendicular to the first direction E1.

[0042] A plurality of openings 38a are provided along the second direction E2 on a side surface of the nozzle unit 38. Each opening 38a is arranged to face upward, and cleaning water 38b (see FIGS. 6 and 7) supplied via the pipe 32a is sprayed upward from each opening 38a.

[0043] A driven pulley 40 is formed at the bottom of the rotor 34, which is disposed so as to protrude from the bottom of the through-hole 32b. An endless belt 46 is stretched between the driven pulley 40 and a drive pulley 44 connected to the output shaft of a motor 42.

[0044] When the motor 42 is operated, the rotor 34 rotates about a rotation axis that is approximately parallel to the Z-axis direction. A through hole is formed in the center of the cylinder of the rotor 34. A rod 48 is inserted into this through hole.

[0045] A support block 50 is fixed to the upper end of the rod 48 and disposed approximately parallel to the second direction E2 so as to pass between the pair of support blocks 36. A cleaning member 50a made of a soft member such as a sponge is fixed to the upper surface of the support block 50.

[0046] A pair of pins (not shown) protruding downward are provided on the underside of the support block 50. When the motor 42 is operated with these pins fitted into holes (not shown) provided in the rotor 34, the rod 48 rotates together with the rotor 34.

[0047] The upper end of the rod 52a of the air cylinder 52 contacts the lower end of the rod 48. Fig. 2 shows the state where the rod 52a is at the minimum protruding position. At this time, the upper surface of the cleaning member 50a is lower than the upper surface of the grinding wheel 36a (see Fig. 7).

[0048] In contrast, when the rod 52a is at its maximum protrusion position, the upper surface of the cleaning member 50a is higher than the upper surface of the grinding wheel 36a (see FIG. 6). Even when the rod 52a is at its maximum protrusion position, each pin of the support block 50 is engaged with the rotor 34.

[0049] After the lower surface 13a of the plate-like object 15 is cleaned by the lower surface cleaning device 30, the plate-like object 15 is transported to the upper surface cleaning device 60 (cleaning device) by the second transport mechanism 26. Next, the upper surface cleaning device 60 that cleans the upper surface 11b of the wafer 11 (i.e., one surface of the plate-like object 15) will be described with reference to Figures 3, 4(A) and 4(B).

[0050] Fig. 3 is an enlarged perspective view of the upper surface cleaning device 60. The upper surface cleaning device 60 has a holding unit 62 for holding a plate-like object 15. Fig. 4(A) is a perspective view of the holding unit 62, and Fig. 4(B) is a side view of the holding unit 62. The holding unit 62 has a disk-shaped base 64.

[0051] A rotary drive source (not shown) such as a motor is provided under the base 64. The rotary drive source rotates the base 64 around a rotation axis substantially parallel to the Z-axis direction at a low speed (e.g., a predetermined value of 50 rpm or more and 100 rpm or less) or at a high speed (e.g., a predetermined value of 1000 rpm or more and 2000 rpm or less).

[0052] The upper surface of the base 64 is coated with a fluororesin such as polytetrafluoroethylene (hereinafter, referred to as PTFE). On the outer periphery of the upper surface of the base 64, a plurality of support pins 66 (six in this embodiment) are arranged at predetermined intervals along the outer periphery of the base 64.

[0053] Each support pin 66 is made of a fluororesin such as PTFE. The height of the upper end of the support pin 66 with respect to the upper surface of the base 64 is set to a predetermined value (e.g., about 20 mm) that allows the hand part 8a to be inserted between the lower surface 13a of the plate-like object 15 supported by the multiple support pins 66 and the upper surface of the base 64.

[0054] A plurality of (three in this embodiment) regulating members 68 are disposed at predetermined intervals on the side surface of the outer periphery of the base 64 along the outer periphery of the base 64. Note that the number of regulating members 68 is not limited to three as long as it is three or more.

[0055] A drive mechanism 70 such as an air actuator is provided at the lower end of the regulating member 68. The drive mechanism 70 moves the regulating member 68 between a closed position (see FIGS. 3 and 4(A)) and an open position (see FIG. 4(B)).

[0056] The restricting member 68 has an edge restricting portion 68a (see FIG. 3) that can come into contact with a side portion of the wafer 11 supported by the support pins 66 when the restricting member 68 is in the closed position. The edge restricting portion 68a is a rectangular parallelepiped member made of a fluororesin such as PTFE, and restricts the movement of the plate-like object 15 in the radial direction of the base 64 when the restricting member 68 is in the closed position.

[0057] An upper end of the edge restricting portion 68a is provided with an upper surface restricting portion 68b (see FIG. 3) in a manner that protrudes a predetermined amount (for example, 0.5 mm) toward the center of the base 64. The upper surface restricting portion 68b is a rectangular parallelepiped member made of a fluororesin such as PTFE, and restricts the movement of the plate-like object 15 in the thickness direction of the base 64.

[0058] When the regulating member 68 is placed in the closed position with the base 64 stationary and the support pin 66 supporting the plate-like object 15, a gap 68c is formed between the lower surface of the upper surface regulating portion 68b and the upper surface 11b of the plate-like object 15 (see Figure 8 (B)).

[0059] In this embodiment, since the lower surface 13a of the plate-like object 15 is cleaned by the lower surface cleaning device 30, and then the upper surface 11b of the plate-like object 15 is cleaned by the upper surface cleaning device 60, it is desirable to reduce the contact area between the lower surface 13a and the base 64 as much as possible when cleaning the upper surface 11b. Therefore, support pins 66 and regulating members 68 are employed instead of a porous chuck table.

[0060] A first cleaning nozzle 72 is disposed above the center of the base 64. The center of the base 64 refers to an area approximately in the center of the circular upper surface of the base 64, and is, for example, a circular area having a radius of r / 2 that is concentric with the upper surface of the base 64 having a radius of r.

[0061] The first cleaning nozzle 72 is disposed so that the nozzle 72a faces downward, and a chemical liquid supply source 74 (not shown) is connected to the first cleaning nozzle 72. The chemical liquid supply source 74 has a tank (not shown) that stores a chemical liquid (first cleaning liquid) 72b (see FIG. 9(B)).

[0062] The chemical solution 72b is ozone water, a mixture of hydrofluoric acid and nitric acid (so-called fluoronitric acid), citric acid water, etc. The chemical solution supply source 74 further has a solenoid valve (not shown) that controls the supply of the chemical solution 72b from the tank to the first cleaning nozzle 72.

[0063] A swing mechanism 76 is provided on the side of the base 64. The swing mechanism 76 has a base 76a arranged substantially parallel to the Z-axis direction. A motor, an actuator, and a drive mechanism are mounted on the bottom of the base 76a. Hue A driving source (not shown) such as a motor is connected to the actuator.

[0064] The drive source rotates the base 76a within a predetermined angular range in a horizontal plane. In addition to rotating the base 76a, the drive source can also position the orientation of the base 76a such that the orientation of the base 76a is at a predetermined angle that is different from the rotation angle range.

[0065] An actuator (not shown) that moves the drive source and the base 76a in the up-down direction is provided on the underside of the drive source. The upper end of the base 76a is disposed above the base 64, and the base end of an arm 78 disposed so as to protrude toward the center of the base 64 is connected to the upper end of the base 76a. A cleaning tool 80 is connected to the tip of the arm 78.

[0066] The cleaning tool 80 is a sponge having a generally flat disk shape and relatively high flexibility and water absorption. For example, PVA (polyvinyl alcohol) is used as the material of the sponge. The cleaning tool 80 may be a sponge brush having a plurality of protrusions on the lower surface of the disk.

[0067] A second cleaning nozzle 82 is provided between the base end and the tip end of the arm 78. The position of the second cleaning nozzle 82 in the longitudinal direction of the arm 78 is appropriately determined so that the second cleaning nozzle 82 is located directly above the outer periphery of the base 64 when the orientation of the base 76a is at a predetermined angle.

[0068] An air supply source (not shown) for supplying compressed air (gas) and a cleaning water supply source (not shown) for supplying cleaning water (liquid) such as pure water are connected to the second cleaning nozzle 82. An ejection port 82a of the second cleaning nozzle 82 faces downward.

[0069] From the ejection port 82a, a gas-liquid mixed fluid (second cleaning liquid) 82b (see FIG. 10(B)) in which cleaning water is mixed with air and the cleaning water is atomized is ejected downward. Note that the second cleaning nozzle 82 may eject the chemical liquid 72b supplied from the chemical liquid supply source 74 instead of the gas-liquid mixed fluid 82b.

[0070] When the arm 78 is swung by the swinging mechanism 76, the second cleaning nozzle 82 also swings in the horizontal plane together with the cleaning tool 80. The first cleaning nozzle 72, the swinging mechanism 76, the arm 78, the cleaning tool 80, the second cleaning nozzle 82, etc. constitute a cleaning unit 84 that cleans the upper surface 11b of the plate-like object 15.

[0071] A control unit (not shown) controls the operation of each component of the grinding / polishing apparatus 2. The control unit is configured by a computer including a processing device such as a CPU (Central Processing Unit) and a storage device such as a flash memory.

[0072] By operating the processing device in accordance with software such as a program stored in the storage device, the control unit functions as a concrete means in which the software and the processing device (hardware resources) work together.

[0073] Next, a method for cleaning the plate-like object 15 will be described with reference to Fig. 5 to Fig. 10. Fig. 5 is a flow diagram of the cleaning method. The cleaning of the plate-like object 15 is performed after rough grinding, finish grinding, and polishing of the upper surface 11b side.

[0074] First, the second transport mechanism 26 suction-holds the polished plate-like object 15 arranged in the carry-in / carry-out area A, and places the plate-like object 15 above the bottom surface cleaning device 30. At this time, the suction-holding unit 26b suction-holds the top surface 11b of the wafer 11, so that the bottom surface 13a of the support substrate 13 is exposed downward.

[0075] Then, the rod 48 is raised to bring the cleaning member 50a into contact with the underside 13a, and while cleaning water 38b (see FIG. 6) is being sprayed from the nozzle unit 38, the cleaning member 50a is rotated around the rod 48 as an axis (underside cleaning step S10).

[0076] This cleans the underside 13a of the plate-like object 15. Fig. 6 is a diagram showing a underside cleaning step S10. After the underside cleaning step S10, the second transport mechanism 26 transports the plate-like object 15 to the holding unit 62 in which the regulating member 68 is in the open position, and the plate-like object 15 is placed on the upper part of the base 64 via the support pins 66 (transport step S20).

[0077] In this embodiment, after the transport step S20, the suction and hold unit 26b is returned to the lower surface cleaning device 30, and the holding surface 26c of the suction and hold unit 26b is cleaned (holding surface cleaning step S30). Fig. 7 is a diagram showing the holding surface cleaning step S30.

[0078] In the holding surface cleaning step S30, the rod 48 is lowered and the grinding wheel 36a is rotated around the rotor 34. In this state, the suction and holding unit 26b is lowered and cleaning water 38b is sprayed from the nozzle unit 38 while the holding surface 26c is ground and cleaned by the grinding wheel 36a.

[0079] By suction-holding the upper surface 11b of the wafer 11 with the holding surface 26c that has undergone the holding surface cleaning step S30, the cleanliness of the upper surface 11b can be increased compared to when the upper surface 11b is suction-held with the holding surface 26c that has not undergone the holding surface cleaning step S30.

[0080] The holding surface cleaning step S30 can be performed at any timing after the transporting step S20. For example, it can be performed in parallel with one or more of the holding step S40, the first cleaning step S50, and the second cleaning step S60, which will be described later.

[0081] The plate-like object 15 transported to the upper surface cleaning device 60 in the transport step S20 is restricted in movement by the restricting member 68, which is set to the closed position. In this manner, the plate-like object 15 is held by the holding unit 62 (holding step S40).

[0082] FIG. 8(A) is an oblique view of the holding unit 62 when the regulating member 68 is in the closed position and holds the plate-like object 15, and FIG. 8(B) is a side view of the holding unit 62 when the plate-like object 15 is held.

[0083] In the holding step S40, the lower surface 13a faces the base 64, and the upper surface 11b is exposed upward (i.e., the upper surface 11b is located on the opposite side to the base 64). After the holding step S40, the base 64 is rotated in its circumferential direction at a low speed (e.g., 60 rpm), and the upper surface 11b of the rotating plate-like object 15 is washed with the chemical solution 72b and the cleaning tool 80 (first cleaning step S50).

[0084] Fig. 9(A) is a top view of the upper surface cleaning device 60 in the first cleaning step S50. Fig. 9(B) is a side view of the upper surface cleaning device 60 in the first cleaning step S50 when the base 64 is viewed from the side in the direction F1 in Fig. 9(A). In Fig. 9(B), the base 76a, the arm 78, the second cleaning nozzle 82, etc. are omitted.

[0085] In the first cleaning step S50, a chemical solution 72b (see FIG. 9(B)) is sprayed from a first cleaning nozzle 72 positioned at the center of the upper surface 11b of the plate-like object 15, and an arm 78 is swung at a predetermined swing angle along a horizontal plane while the cleaning tool 80 is in contact with the upper surface 11b. This cleans the upper surface 11b.

[0086] After the first cleaning step S50, while rotating the base 64 at a low speed, the rocking mechanism 76 stops rocking and the arm 78 is moved upward so that the cleaning tool 80 does not come into contact with the upper surface 11b. Then, the rocking mechanism 76 adjusts the position of the arm 78 so that the second cleaning nozzle 82 is located above the outer periphery of the plate-like object 15.

[0087] Then, with the arm 78 stationary, the gas-liquid mixture fluid 82b is sprayed from the second cleaning nozzle 82 onto the outer periphery of the upper surface 11b, cleaning the outer periphery of the upper surface 11b (second cleaning step S60).

[0088] Fig. 10(A) is a top view of the upper surface cleaning device 60 in the second cleaning step S60, and Fig. 10(B) is a side view of the upper surface cleaning device 60 in the second cleaning step S60 when the base 64 is viewed from the side in the direction F2 in Fig. 10(A). In Fig. 10(B), the base 76a, the arm 78, the cleaning tool 80, etc. are omitted.

[0089] After the second cleaning step S60, the base 64 is rotated at high speed (for example, 2000 rpm) to scatter the cleaning water remaining on the upper surface 11b radially outward of the plate-like object 15 by centrifugal force, thereby drying the plate-like object 15. Then, the transfer robot 8 accesses the upper surface cleaning device 60 and transfers the plate-like object 15 to the cassette 6b.

[0090] In this embodiment, even if the regulating member 68 protrudes above the outer periphery of the upper surface 11b, the outer periphery of the upper surface 11b can be cleaned without using a separate spinner cleaning mechanism for cleaning the outer periphery of the upper surface 11b.

[0091] Furthermore, as long as a gap 68c is formed between the upper surface 11b and the upper surface regulating portion 68b, the gas-liquid mixed fluid 82b is also sprayed into this gap 68c, so that the outer periphery of the upper surface 11b located directly below the upper surface regulating portion 68b is also cleaned.

[0092] In addition, the structures, methods, etc. according to the above-mentioned embodiments can be modified as appropriate without departing from the scope of the present invention. For example, instead of the suction holding units 12b and 26b, an edge clamp mechanism (also called a mechanical pick) that holds the wafer 11 by physically contacting at least three points on the outer peripheral side of the wafer 11 can be used. However, when this edge clamp mechanism is used, the holding surface cleaning step S30 is omitted. [Explanation of symbols]

[0093] 2: grinding and polishing device, 4: base, 6a, 6b: cassette 8: Transport robot, 8a: Hand unit, 8b: Moving mechanism, 10: Positioning table 11: wafer, 11a: front surface, 11b: top surface 12: first transport mechanism, 12a: arm unit, 12b: suction and holding unit 13: Support substrate, 13a: Bottom surface, 15: Plate-shaped object 14: Turntable, 16: Chuck table 20: Rough grinding unit, 22: Finish grinding unit, 24: Polishing unit 26: second transport mechanism, 26a: arm, 26b: suction and holding unit 26b1: Frame body, 26b2: Porous plate, 26c: Holding surface 30: bottom surface cleaning device, 32: support member, 32a: pipe, 32b: through hole, 34: rotor 36: Support block, 36a: Grinding wheel 38: nozzle unit, 38a: opening, 38b: cleaning water 40: driven pulley, 42: motor, 44: driving pulley, 46: endless belt 48: rod, 50: support block, 50a: cleaning member 52: air cylinder, 52a: rod 60: upper surface cleaning device, 62: holding unit, 64: base, 66: support pin 68: regulating member, 68a: edge regulating portion, 68b: upper surface regulating portion, 68c: gap 70: Drive mechanism 72: first cleaning nozzle, 72a: jet nozzle, 72b: chemical solution, 74: chemical solution supply source 76: swing mechanism, 76a: base, 78: arm, 80: cleaning tool 82: second cleaning nozzle, 82a: jet nozzle, 82b: gas-liquid mixture fluid 84: Cleaning unit A: Loading / unloading area, B: Rough grinding area, C: Finish grinding area, D: Polishing area E1: 1st direction, E2: 2nd direction, F1,F2: Direction

Claims

1. A cleaning device for cleaning a plate-like object, comprising: a holding unit including a disk-shaped base and restricting members provided at least at three locations on an outer periphery of the base for restricting movement of the plate-shaped object in a radial direction and a thickness direction of the base, the holding unit being rotatable in a state in which the movement of the plate-shaped object is restricted by the restricting members; a cleaning unit for cleaning one surface of the plate-like object held by the holding unit, the surface being located on the opposite side to the base; the regulating member has an edge regulating portion capable of contacting a side portion of the plate-like object, and an upper surface regulating portion provided at an upper end portion of the edge regulating portion in a manner of protruding a predetermined amount toward the center of the base and regulating movement of the plate-like object in a thickness direction of the base, The cleaning unit comprises: a first cleaning nozzle capable of spraying a first cleaning liquid onto a central portion of the one surface of the plate-like object held by the holding unit; an arm disposed above the base of the holding unit; a swing mechanism connected to a base end of the arm and configured to swing the arm along a horizontal plane; a cleaning tool connected to a tip end of the arm and contacting the one surface of the plate-like object held by the holding unit to clean the plate-like object; a second cleaning nozzle provided between the base end and the tip end of the arm and capable of spraying a second cleaning liquid onto an outer periphery of the one surface of the plate-like object held by the holding unit; a cleaning device characterized in that the one surface of the plate-shaped object held by the holding unit and rotating in the circumferential direction of the base is cleaned with the first cleaning liquid sprayed from the first cleaning nozzle and the cleaning tool that oscillates and contacts the one surface of the plate-shaped object in a range radially inward of the top surface regulating portion of the base, and then the position of the arm is adjusted to position the second cleaning nozzle on the outer periphery of the plate-shaped object, and the second cleaning liquid is sprayed from the second cleaning nozzle onto the outer periphery of the one surface of the base, and the plate-shaped object held by the holding unit is rotated in the circumferential direction of the base, thereby cleaning the outer periphery of the one surface.

2. 2. The cleaning device according to claim 1, wherein the second cleaning nozzle sprays a gas-liquid mixed fluid in which a liquid and a gas are mixed.

3. A cleaning apparatus as described in claim 1 or 2, characterized in that the holding unit further has a plurality of support pins arranged at predetermined intervals on the upper surface of the base along the outer periphery of the base.

4. A cleaning method for cleaning a plate-like object, comprising the steps of: a holding step of holding the plate-like object with the holding unit by restricting movement of the plate-like object in a radial direction and a thickness direction of the base with restricting members provided at at least three locations on an outer periphery of the base of the holding unit; a first cleaning step in which a first cleaning liquid is sprayed from a first cleaning nozzle onto a center of one surface of the plate-like object located on the opposite side to the base, the plate-like object being held in the holding step and rotating in the circumferential direction of the base, and the arm is swung along a horizontal plane while a cleaning tool connected to a tip of an arm disposed above the plate-like object is brought into contact with the one surface of the plate-like object; and a second cleaning step of, after the first cleaning step, positioning a second cleaning nozzle provided between the base end and the tip end of the arm at an outer periphery of the plate-like object and spraying a second cleaning liquid from the second cleaning nozzle onto the outer periphery of the one surface of the base while rotating the plate-like object in a circumferential direction of the base, thereby cleaning the outer periphery of the one surface; Equipped with the regulating member has an edge regulating portion capable of contacting a side portion of the plate-like object, and an upper surface regulating portion provided at an upper end portion of the edge regulating portion in a manner of protruding a predetermined amount toward the center of the base and regulating movement of the plate-like object in a thickness direction of the base, The cleaning method, wherein in the first cleaning step, the cleaning tool is swung in a radial direction of the base within a range inside the upper surface regulating portion.

5. 5. The cleaning method according to claim 4, wherein in the second cleaning step, the second cleaning nozzle sprays a gas-liquid mixed fluid, which is a mixture of liquid and gas, onto the one surface.

6. A cleaning method as described in claim 4 or 5, characterized in that the upper surface of the base is provided with a plurality of support pins arranged at predetermined intervals along the outer periphery of the base, and in the holding process, the plate-like object is supported by the plurality of support pins.

Images