Kerf quality tolerance change method, program and processing device

Abstract

To provide a kerf quality tolerance change method for appropriately executing a kerf check in a processing device, a program for causing a computer to execute the kerf quality tolerance change method, and a processing device executing the kerf quality tolerance change method.SOLUTION: When a determined value of an item related to the processing quality of a kerf calculated using the image of the kerf formed by imaging the kerf formed on a workpiece is an error value, a tolerance range for the item is changed so as to be included in the determined value. This allows the kerf check to be properly executed.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to a kerf-quality tolerance changing method for changing the tolerance of an item related to kerf processing quality that is set in order to perform a kerf check to check the processing quality of a kerf formed in a workpiece, a program for causing a computer to execute the kerf-quality tolerance changing method, and a processing device for executing the kerf-quality tolerance changing method. [Background technology]

[0002] Device chips such as IC (Integrated Circuit) and LSI (Large Scale Integration) are essential components in various electronic devices such as mobile phones, personal computers, etc. Such chips are manufactured, for example, by forming a large number of devices on the surface of a wafer made of a semiconductor material, and then dividing the wafer using a processing device into regions containing individual devices.

[0003] Examples of processing devices for dividing a workpiece such as a wafer include a cutting device and a laser processing device. The cutting device has a holding table for holding the workpiece and a cutting unit having an annular cutting blade, and cuts the workpiece by rotating the cutting blade and bringing it into contact with the workpiece. The laser processing device has a holding table for holding the workpiece and a laser processing unit that can irradiate a laser beam, and irradiates the workpiece with the laser beam to cause laser ablation.

[0004] Such a processing device generally has an imaging unit for imaging the workpiece and aligning the workpiece with the processing unit (cutting unit or laser processing unit), etc. This imaging unit may also be used to check the processing marks formed on the workpiece by the processing unit.

[0005] For example, a kerf processing quality is sometimes checked (kerf check) using an image of the kerf formed on the workpiece by imaging the kerf (see, for example, Patent Document 1). If an abnormality is found in the kerf processing quality by the kerf check, for example, the operation of the processing device is stopped and this is notified to an operator. This makes it possible to find processing defects in the workpiece in the processing device early and minimize the adverse effects caused by such defects. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] JP 2013-74198 A Summary of the Invention [Problem to be solved by the invention]

[0007] The kerf check is performed, for example, by calculating the values ​​(determined values) of a plurality of items related to the kerf processing quality using a kerf image, and determining whether each determined value is within a preset allowable range. If any of the determined values ​​is a value (error value) that is not within the allowable range, it is determined that there is an abnormality in the kerf processing quality in the processing device.

[0008] However, the requirements for the kerf processing quality may vary depending on the type of workpiece being processed, etc. Therefore, even if the kerf check determines that there is an abnormality in the kerf processing quality and the operation of the processing device is stopped, the kerf processing quality that is actually required may be satisfied.

[0009] In such a case, it is necessary to change the tolerance of at least one of the multiple items related to the kerf processing quality. However, for an operator who is not familiar with operating the processing device, it may not be easy to identify the item whose tolerance should be changed and the tolerance that should be set by the change.

[0010] In view of this, an object of the present invention is to provide a method for changing a kerf quality tolerance range for allowing a processing device to appropriately perform a kerf check, a program for causing a computer to execute the method for changing the kerf quality tolerance range, and a processing device for executing the method for changing the kerf quality tolerance range. [Means for solving the problem]

[0011] According to one aspect of the present invention, there is provided a kerf quality tolerance changing method for changing an allowable range of an item related to the processing quality of a kerf formed in a workpiece, which is set for performing a kerf check to check the processing quality of the kerf formed in the workpiece, the method including: a calculation step of calculating a judged value of the item using an image of the kerf formed by imaging the kerf formed in the workpiece; a determination step of determining whether the judged value is an error value not included in the allowable range; and a change step of changing the allowable range so as to include the judged value judged to be the error value in the determination step. The changed allowable range includes a value that is more out of the allowable range before the change than the determined value by one minimum unit when the allowable range is changed, and does not include a value that is more out of the allowable range before the change than the determined value by two minimum units. A method for varying kerf quality tolerances is provided.

[0013] In the method for changing the kerf quality tolerance range of the present invention, the item is preferably a kerf width, a chipping size, a kerf deviation amount, or a kerf recognition value.

[0014] According to another aspect of the present invention, there is provided a program for causing a computer to execute a kerf quality tolerance changing method for changing an allowable range of an item related to the machining quality of a kerf that is set for performing a kerf check to check the machining quality of the kerf formed in a workpiece, the kerf quality allowable range changing method including a calculation step of calculating a judged value of the item using an image of the kerf formed by imaging the kerf formed in the workpiece, a determination step of determining whether or not the judged value is an error value that is not included in the allowable range, and a change step of changing the allowable range so as to include the judged value that is determined to be the error value in the determination step. The changed allowable range includes a value that is more out of the allowable range before the change than the determined value by one minimum unit when the allowable range is changed, and does not include a value that is more out of the allowable range before the change than the determined value by two minimum units. The program is provided.

[0015] According to yet another aspect of the present invention, there is provided a processing apparatus including a holding table for holding a workpiece, a processing unit for forming a kerf in the workpiece held on the holding table, an imaging unit for imaging the kerf to form an image of the kerf, and a control unit for changing an allowable range of an item related to the processing quality of the kerf that is set for performing a kerf check to confirm the processing quality of the kerf formed in the workpiece, the control unit including a calculation unit for calculating a reference value of the item using the image of the kerf, a determination unit for determining whether the reference value is an error value not included in the allowable range, and a change unit for changing the allowable range so as to include the reference value determined by the determination unit to be the error value. The changed allowable range includes a value that is more out of the allowable range before the change than the determined value by one minimum unit when the allowable range is changed, and does not include a value that is more out of the allowable range before the change than the determined value by two minimum units. A processing apparatus is provided.

[0016] Furthermore, in the processing apparatus of the present invention, it is preferable that the processing unit is a cutting unit equipped with an annular cutting blade, and the kerf is formed by the cutting blade.

[0017] Alternatively, in the processing apparatus of the present invention, it is preferable that the processing unit is a laser processing unit capable of irradiating a laser beam onto the workpiece, and the kerf is formed by irradiating the laser beam from the laser processing unit onto the workpiece. Effect of the Invention

[0018] In the present invention, when a judged value of an item related to the kerf processing quality calculated using an image of the kerf formed on the workpiece by imaging the kerf is an error value, the allowable range of the item is changed to include the judged value, thereby making it possible to appropriately perform the kerf check. [Brief description of the drawings]

[0019] [Figure 1] FIG. 1 is a diagram illustrating an example of a system. [Diagram 2]FIG. 2 is a block diagram illustrating a computer. [Diagram 3] FIG. 3 is a block diagram illustrating functional units included in the computer. [Figure 4] FIG. 4 is a perspective view illustrating an example of a cutting device. [Diagram 5] FIG. 5 is a sequence diagram showing a schematic diagram of a method for changing the kerf quality allowable range executed in the system. [Figure 6] FIG. 6 is a flow chart that illustrates a part of the operation flow of the processing device in the method for changing the kerf quality allowable range. [Figure 7] FIG. 7 is a diagram showing an example of a screen showing the result of the kerf check. [Figure 8] FIG. 8 is a flow chart that illustrates a part of the operation flow of a computer in the method for changing the kerf quality acceptable range. [Figure 9] FIG. 9 is a sequence diagram showing a schematic diagram of a kerf quality acceptable range changing method executed in the processing device. [Figure 10] FIG. 10 is a flow chart that illustrates a part of the operation flow of the processing device in the method for changing the kerf quality allowable range. [Figure 11] FIG. 11 is a flow chart that illustrates a part of the operation flow of the processing device in the method for changing the kerf quality allowable range. [Figure 12] FIG. 12 is a perspective view illustrating an example of a laser processing apparatus. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0020] An embodiment of the present invention will be described with reference to the accompanying drawings. Fig. 1 is a diagram showing a schematic diagram of an example of a system according to the present embodiment. The system shown in Fig. 1 includes a computer 2 and a processing device 4. The computer 2 and the processing device 4 are provided separately from each other and can communicate with each other via a network 6.

[0021] The network 6 is configured, for example, by wireless communication or wired communication. Alternatively, the network 6 may be configured by a combination of wireless communication and wired communication. In addition, in FIG. 1, for convenience, only one computer 2 and one processing device 4 are illustrated, but the computer 2 may be capable of communicating with multiple processing devices 4, and the processing device 4 may be capable of communicating with multiple computers 2.

[0022] For example, the computer 2 may be configured to be able to communicate with multiple processing devices 4 of the same type or different types. Also, the processing device 4 may be configured to be able to communicate with multiple computers 2 each performing different processes, and to communicate with any one of the multiple computers 2 depending on the process performed by the processing device 4.

[0023] Then, the processing device 4 transmits, for example, an electrical signal corresponding to the image of the kerf and an electrical signal corresponding to the allowable ranges (kerf check conditions) of each of a plurality of items related to the kerf processing quality to the computer 2. Furthermore, the computer 2 transmits, for example, an electrical signal corresponding to the kerf check conditions under which the kerf processing quality is determined to be normal when a kerf check is performed using the image of the kerf to the processing device 4.

[0024] Fig. 2 is a block diagram showing a computer 2 included in the system shown in Fig. 1. The computer 2 shown in Fig. 2 includes a central processing unit (CPU) 8, a storage device 10, an output device 12, an input device 14, and a communication interface 16. The storage device 10 also includes a main storage device 10a with excellent rewriting speed and an auxiliary storage device 10b with large storage capacity. These components are connected via a bus 18 so as to be able to send and receive electrical signals to and from each other.

[0025] The CPU 8 reads out and executes various programs stored in the auxiliary storage device 10b of the storage device 10. For example, when an electrical signal corresponding to a kerf image and an electrical signal corresponding to the kerf check conditions are transmitted from the processing device 4 to the computer 2, the CPU 8 reads out a program for changing the kerf quality tolerance range from the auxiliary storage device 10b, performs arithmetic processing, and changes the kerf check conditions.

[0026] Specifically, CPU 8 changes the kerf check conditions so that the kerf processing quality is determined to be normal when a kerf check is performed using the image of the kerf. Furthermore, CPU 8 controls output device 12 to notify the user of computer 2 of the changed kerf check conditions. Moreover, CPU 8 transmits an electric signal corresponding to the changed kerf check conditions to processing device 4 via communication interface 16 in response to the operation of input device 14 by the user of computer 2.

[0027] The main memory device 10a of the storage device 10 is composed of a volatile memory such as a dynamic random access memory (DRAM) or a static random access memory (SRAM). The auxiliary memory device 10b is composed of a non-volatile memory such as a solid state drive (SSD) (NAND flash memory) or a hard disk drive (HDD) (magnetic storage device).

[0028] The output device 12 is composed of at least one of a display, a printer, a speaker, etc. The input device 14 is composed of at least one of a keyboard, a mouse, a touch pad, a microphone, etc. The output device 12 and the input device 14 may be integrated.

[0029] That is, the output device 12 and the input device 14 may be replaced with an input / output device such as a touch panel. The communication interface 16 is composed of at least one of a communication circuit (such as an analog-to-digital conversion circuit (ADC) and a digital-to-analog conversion circuit (DAC)) and an input / output (I / O) port.

[0030] Fig. 3 is a block diagram showing functional units included in the computer 2. The computer 2 shown in Fig. 3 has a calculation unit 20, a determination unit 22, and a change unit 24. The calculation unit 20 has a function of calculating values ​​(determined values) of a plurality of items related to the processing quality of the kerf by using an image of the kerf formed on the workpiece.

[0031] The multiple items include the kerf width, the chipping size, the amount of kerf deviation, and the kerf recognition value (kerf-likeness). The kerf width is evaluated, for example, as the distance between a pair of straight lines that pass through the innermost of a pair of inner surfaces that define the kerf and are aligned along the direction in which the kerf extends. The chipping size is evaluated, for example, as the maximum width of the chipping that spreads outward from one or the other of the pair of straight lines (the spread of the kerf) or the chipping area (the number of pixels that make up the chipping area).

[0032] The amount of deviation of the kerf is evaluated, for example, as the distance between a straight line located at the center of a pair of inner surfaces that define the kerf in an ideal position and aligned along the direction in which the kerf extends, and a straight line located at the center of a pair of inner surfaces that define the actual kerf and aligned along the direction in which the kerf extends. The kerf recognition value is evaluated, for example, as the difference in luminance (contrast) between a pair of pixels that constitute the image of the kerf, that are adjacent in a direction perpendicular to the direction in which the kerf extends, and that have the greatest change in luminance in this direction. The kerf recognition value is a value that depends on the inclination of the pair of inner surfaces that define the actual kerf, etc.

[0033] The determining unit 22 determines whether each of the plurality of determined values ​​calculated by the calculating unit 20 is a value (error value) that is not included in the allowable range of each of the plurality of items related to the kerf processing quality. The changing unit 24 changes the allowable range of the item so as to include the determined value determined by the determining unit 22 to be an error value.

[0034] Fig. 4 is a perspective view showing a schematic diagram of the processing device 4 included in the system shown in Fig. 1. In Fig. 4, some of the components of the processing device 4 are shown in functional blocks. In addition, the X-axis direction (front-back direction) and the Y-axis direction (left-right direction) shown in Fig. 4 are directions perpendicular to each other on a horizontal plane, and the Z-axis direction (up-down direction) is a direction perpendicular to the X-axis direction and the Y-axis direction (vertical direction).

[0035] The processing device 4 shown in Fig. 4 includes a base 26 that supports each of the components. An opening 26a is formed in the front corner of the base 26, and a cassette support table 28 that is raised and lowered by a lifting mechanism (not shown) is provided within this opening 26a. A cassette 30 that contains a plurality of workpieces 11 is placed on the upper surface of the cassette support table 28. Note that, for convenience, only the outline of the cassette 30 is shown in Fig. 4.

[0036] The workpiece 11 is, for example, a disk-shaped wafer made of a semiconductor material such as silicon. There are no limitations on the material, shape, structure, size, etc. of the workpiece 11. The workpiece 11 may be made of a semiconductor material other than silicon (e.g., silicon carbide (SiC) or gallium nitride (GaN)). A plurality of mutually intersecting planned division lines (streets) are set on the front surface 11a side of the workpiece 11.

[0037] Devices such as ICs or LSIs are formed on the front surface 11a side of each region partitioned by a plurality of planned division lines. A dicing tape (adhesive tape) 13 having a diameter longer than that of the workpiece 11 is attached to the back surface 11b of the workpiece 11. A metal ring-shaped frame 15 is attached to the outer periphery of the dicing tape 13. The workpiece 11 is contained in the cassette 30 as a workpiece unit 17 integrated with the frame 15 via the dicing tape 13.

[0038] A rectangular opening 26b with its longitudinal direction along the X-axis direction is formed on the side of the cassette support base 28, and a ball screw type X-axis moving mechanism (not shown), a table cover 32 that covers the X-axis moving mechanism, and a dust-proof / water-proof cover 34 are arranged inside this opening 26b. This X-axis moving mechanism has an X-axis moving table (not shown) covered by the table cover 32, and moves this X-axis moving table in the X-axis direction.

[0039] A holding table 36 is fixed to the upper surface of this X-axis moving table so as to be exposed from the table cover 32. Therefore, when the X-axis moving mechanism moves the X-axis moving table, the table cover 32 moves along the X-axis direction together with the holding table 36, and the dust-proof and drip-proof cover 34 expands and contracts in accordance with the moving table cover 32.

[0040] The holding table 36 has a disk-shaped frame made of a metal material such as stainless steel. The frame has a disk-shaped bottom wall and an annular side wall extending upward from the outer periphery of the bottom wall. The bottom wall and the side wall define a recess on the upper surface of the frame, and a disk-shaped porous plate made of ceramics or the like is fixed in the recess.

[0041] Furthermore, this porous plate has an upper surface parallel to the X-axis direction and the Y-axis direction, and its lower surface side is connected to a suction source (not shown) such as an ejector via a suction path (not shown) and a valve formed inside the frame of the holding table 36. When the valve is opened while this suction source is operating, negative pressure is generated in the space near the upper surface of the porous plate.

[0042] Therefore, the upper surface of this porous plate functions as a holding surface of the holding table 36 that holds the workpiece 11. In other words, when the workpiece 11 is placed on the upper surface of this porous plate via the dicing tape 13, and negative pressure is generated in the space near the upper surface of the porous plate, the workpiece 11 is sucked and held by the holding table 36.

[0043] Furthermore, clamps 38 for fixing the frame 15 are provided around the periphery of the frame of the holding table 36, and when the workpiece 11 is held by suction on the holding table 36, the frame 15 is also fixed by these clamps 38. The holding table 36 is also connected to a rotation drive source (not shown) such as a motor that rotates the holding table 36 about a rotation axis that passes through the center of its holding surface and is parallel to the Z-axis direction.

[0044] A support structure 40 is provided on the base 26 and arranged to straddle the opening 26b. Specifically, the support structure 40 has a pair of flat-plate-shaped standing portions 40a, 40b provided on the base 26 to sandwich the opening 26b, and a flat-plate-shaped bridge portion 40c provided on the pair of standing portions 40a, 40b to bridge the space above the opening 26b.

[0045] A first Y-axis moving mechanism 42a and a second Y-axis moving mechanism 42b are provided on the front (surface) side of the spanning portion 40c. The first Y-axis moving mechanism 42a and the second Y-axis moving mechanism 42b are fixed to the front surface of the spanning portion 40c and share a pair of guide rails 44 extending along the Y-axis direction. A moving plate 46a and a moving plate 46b are provided on the front (surface) side of the pair of guide rails 44.

[0046] The moving plate 46a is closer to the erected portion 40a than the moving plate 46b, and the moving plate 46b is closer to the erected portion 40b than the moving plate 46a. The moving plates 46a and 46b are connected to the front (surface) side of the pair of guide rails 44 in a manner that allows them to slide along the guide rails 44, within a range where they do not contact each other.

[0047] Further, screw shafts 48a and 48b extending along the Y-axis direction are disposed between the pair of guide rails 44. A motor 50a for rotating the screw shaft 48a is coupled to the end of the screw shaft 48a on the side of the erected portion 40b. Similarly, a motor (not shown) for rotating the screw shaft 48b is coupled to the end of the screw shaft 48b on the side of the erected portion 40a.

[0048] A nut portion (not shown) that accommodates balls that roll on the surface of the rotating screw shaft 48a is provided on the surface of the screw shaft 48a on which the helical groove is formed, forming a ball screw. That is, when the screw shaft 48a rotates, the balls circulate through the nut member, and the nut portion moves along the Y-axis direction. The nut portion is fixed to the rear surface (back surface) side of the moving plate 46a. Therefore, when the screw shaft 48a is rotated by the motor 50a, the moving plate 46a moves along the Y-axis direction together with the nut portion.

[0049] Similarly, a nut portion (not shown) that accommodates balls that roll on the surface of the rotating screw shaft 48b is provided on the surface of the screw shaft 48b on which the helical groove is formed, forming a ball screw. That is, when the screw shaft 48b rotates, the balls circulate through the nut member, and the nut portion moves along the Y-axis direction. In addition, this nut portion is fixed to the rear surface (back surface) side of the moving plate 46b. Therefore, when the screw shaft 48b is rotated by a motor connected to the end of the screw shaft 48b on the side of the erected portion 40a, the moving plate 46b moves along the Y-axis direction together with the nut portion.

[0050] The first Y-axis moving mechanism 42a includes a ball screw (screw shaft 48a, etc.) and a motor 50a for moving the moving plate 46a along the Y-axis direction. The second Y-axis moving mechanism 42b includes a ball screw (screw shaft 48b, etc.) for moving the moving plate 46b along the Y-axis direction, and a motor connected to the end of the screw shaft 48b on the erect portion 40a side.

[0051] A Z-axis moving mechanism 52 is provided on the front surface (surface) of each of the moving plates 46a and 46b. The Z-axis moving mechanism 52 is fixed to the front surface (surface) of the moving plate 46a or the moving plate 46b, and has a pair of guide rails 54 extending along the Z-axis direction. A moving plate 56 is connected to the front surface (surface) of the pair of guide rails 54 in a manner that allows it to slide along the pair of guide rails 54.

[0052] A screw shaft 58 extending along the Z-axis direction is disposed between the pair of guide rails 54. A motor 60 for rotating the screw shaft 58 is connected to the upper end of the screw shaft 58. A nut portion (not shown) for accommodating balls that roll on the surface of the rotating screw shaft 58 is provided on the surface of the screw shaft 58 on which a spiral groove is formed, thereby forming a ball screw.

[0053] That is, when the screw shaft 58 rotates, the balls circulate inside the nut portion, causing the nut portion to move along the Z-axis direction. This nut portion is fixed to the rear surface (back surface) side of the moving plate 56. Therefore, when the screw shaft 58 is rotated by the motor 60, the moving plate 56 moves along the Z-axis direction together with the nut portion.

[0054] A cutting unit (processing unit) 62 that cuts the workpiece 11 is provided below the moving plate 56. The cutting unit 62 has a cylindrical spindle housing that extends along the Y-axis direction. A spindle that extends in the Y-axis direction is housed in this spindle housing. The spindle is supported by the spindle housing in a rotatable state.

[0055] The tip of the spindle is exposed outside the spindle housing, and a cutting blade 64 having an annular cutting edge is attached to the tip. The spindle housing also contains a rotation drive source (not shown) such as a motor that is connected to the base end of the spindle. Therefore, when the spindle is rotated by the rotation drive source, the cutting blade 64 rotates around a straight line along the Y-axis direction as the rotation axis.

[0056] The cutting blade 64 is, for example, a hub-type cutting blade. The hub-type cutting blade is composed of an annular base made of metal or the like and an annular cutting edge formed along the outer periphery of the base. The cutting edge of this cutting blade is composed of, for example, an electroformed grinding wheel in which abrasive grains made of diamond or cubic boron nitride (cBN) or the like are fixed by a binder such as nickel.

[0057] Alternatively, the cutting blade 64 may be a washer-type cutting blade. A washer-type cutting blade is configured with an annular cutting edge to which abrasive grains are fixed by a binder such as metal, ceramic, or resin.

[0058] An imaging unit 66 is provided in front of the cutting unit 62. The imaging unit 66 has, for example, a light source such as an LED (Light Emitting Diode), an objective lens, and an imaging element such as a CCD (Charge Coupled Device) image sensor or a CMOS (Complementary Metal Oxide Semiconductor) image sensor.

[0059] Furthermore, a cleaning unit 68 is provided on the side of opening 26b of base 26 opposite opening 26a. Cleaning unit 68 includes a spinner table 70 that holds workpiece 11 via dicing tape 13 within a cylindrical cleaning space. The top surface of spinner table 70 is a surface that is approximately parallel to the horizontal plane (XY plane).

[0060] The lower part of the spinner table 70 is connected to a suction source (not shown) such as an ejector via a flow path (not shown) and a valve (not shown) formed inside the spinner table 70. When the valve is opened while the suction source is operating, negative pressure is generated in the space near the upper surface of the spinner table 70. Therefore, the upper surface of the spinner table 70 functions as a holding surface that holds the workpiece 11.

[0061] Furthermore, clamps for fixing frame 15 are provided around spinner table 70, and frame 15 is also fixed by these clamps when workpiece 11 is suction-held by spinner table 70. Spinner table 70 is also connected to a rotation drive source (not shown) such as a motor that rotates spinner table 70 around a rotation axis that passes through the center of its holding surface and is parallel to the Z-axis direction.

[0062] A nozzle 72 is disposed above the spinner table 70, which supplies a cleaning fluid (for example, a mixed fluid of water and air) toward the workpiece 11 held by the spinner table 70. In the processing device 4, with the workpiece 11 held by the spinner table 70, the workpiece 11 can be cleaned by supplying a fluid from the nozzle 72 while rotating the spinner table 70.

[0063] A cover 74 is provided on the upper side of the base 26 to cover the components arranged on the base 26. In Fig. 4, only the outline of the cover 74 is shown by a two-dot chain line. In addition, a touch panel 76 that displays various information related to the processing device 4 is provided on the side of the cover 74.

[0064] The touch panel 76 is composed of, for example, a touch sensor that functions as an input device for inputting instructions from an operator to the processing device 4, and a display that functions as an output device for outputting various information. The touch sensor is, for example, a capacitive touch sensor or a resistive touch sensor. The display is, for example, a liquid crystal display or an organic EL (Electro Luminescence) display.

[0065] That is, the touch panel 76 functions as a user interface, and the operator can operate the processing device 4 by touching the surface of the touch panel 76. Note that the touch panel 76 may be replaced with an output device and an input device that are independent of each other. For example, the touch panel 76 may be replaced with a display, a keyboard, and a mouse.

[0066] A warning light (pilot lamp) 78 is provided on the upper surface of the cover 74. The warning light 78 lights up or flashes when an error (abnormality) occurs in the processing device 4 to notify the operator of the occurrence of the error. For example, the warning light 78 lights up when the kerf processing quality is determined to be abnormal when a kerf check is performed using an image of the kerf. The warning light 78 may be replaced with a speaker that emits a sound when an abnormality occurs in the processing device 4, or may be provided together with the speaker.

[0067] The operation of each component of the processing device 4 described above is controlled by a control unit 80. The control unit 80 includes, for example, a CPU, a storage device including a main storage device (volatile memory) and an auxiliary storage device (non-volatile memory), and a communication interface. The control unit 80 and the touch panel 76 configure a computer similar to the computer 2 shown in FIG.

[0068] The auxiliary storage device of the control unit 80 stores a program for performing a kerf check using an image of the kerf formed in the workpiece 11. Therefore, the CPU of the control unit 80 can read out this program and perform a kerf check in response to an operator's operation on the touch panel 76. As a result, if the CPU determines that the processing quality of the kerf is abnormal, the CPU can, for example, turn on a warning light 78 and stop processing of the workpiece 11 in the processing device 4.

[0069] Fig. 5 is a sequence diagram showing a method for changing the kerf quality tolerance range executed in the system shown in Fig. 1. In this method, first, the workpiece 11 is held by the holding table 36 in the processing device 4 (holding step: S1). Specifically, after the workpiece 11 is placed on the holding surface of the holding table 36 via the dicing tape 13, negative pressure is generated in the space near the holding surface of the holding table 36 to suck and hold the workpiece 11 on the holding table 36, and the frame is fixed by the clamp 38.

[0070] Once the holding step (S1) is completed, the cutting unit 62 forms a kerf in the workpiece 11 (kerf forming step: S2). This kerf forming step (S2) is performed, for example, in the following order: First, the X-axis direction moving mechanism adjusts the position of the holding table 36 in the X-axis direction so that the cutting blade 64 and the workpiece 11 are spaced apart in the X-axis direction.

[0071] Next, the rotary drive source rotates the holding table 36 so that the planned dividing line (street) of the workpiece 11 is parallel to the Y-axis direction. Next, the first Y-axis moving mechanism 42a or the second Y-axis moving mechanism 42b adjusts the position of the cutting unit 62 in the Y-axis direction so that the street is positioned in the X-axis direction when viewed from the cutting blade 64.

[0072] Next, the Z-axis movement mechanism 52 adjusts the position of the cutting unit 62 in the Z-axis direction so that the bottom end of the cutting blade 64 of the cutting unit 62 is lower than the back surface 11b of the workpiece 11 and higher than the holding surface of the holding table 36. Next, the rotation drive source of the cutting unit 62 is operated to rotate the cutting blade 64.

[0073] Next, while rotating the cutting blade 64, the X-axis direction movement mechanism moves the holding table 36 along the X-axis direction so that the cutting blade 64 passes over the street from one end to the other end. This forms a kerf that penetrates the workpiece 11 and exposes the dicing tape 13.

[0074] When the kerf forming step (S2) is completed, the kerf is imaged by the imaging unit 66 (imaging step: S3). This forms an image of the kerf. At this time, the CPU of the control unit 80 may, for example, control the touch panel 76 to display the image of the formed kerf.

[0075] Once the imaging step (S3) is completed, a kerf check is performed using the kerf image (kerf check step: S4). Fig. 6 is a flow chart that shows a schematic operation flow of the processing device 4 when performing the kerf check step (S4). In the kerf check step (S4), the CPU of the control unit 80 calculates values ​​(determined values) of a plurality of items related to the kerf processing quality using the kerf image.

[0076] Then, the CPU judges whether each of the judged values ​​is within a preset allowable range (whether the kerf check conditions are met). If, as a result, at least one of the judged values ​​does not meet the kerf check conditions (an error has occurred) (S5: YES), the CPU transmits an electrical signal corresponding to the kerf image used in the kerf check and an electrical signal corresponding to the kerf check conditions to the computer 2 (transmission step: S6).

[0077] In this case, the CPU may turn on a warning light 78 to notify the operator of the processing device 4 that the kerf processing quality is abnormal, and may also control the touch panel 76 to display the results of the kerf check. In this case, these electrical signals may be automatically transmitted from the processing device 4 to the computer 2, or may be transmitted from the processing device 4 to the computer 2 in response to the operation of the touch panel 76 by the operator of the processing device 4.

[0078] When the computer 2 receives the electric signal corresponding to the kerf image and the electric signal corresponding to the kerf check conditions, the CPU 8 of the computer 2 reads out a program for changing the kerf quality tolerance range from the auxiliary storage device 10b, performs calculation processing, and changes the kerf check conditions. Specifically, first, the calculation unit 20 of the computer 2 calculates the respective judged values ​​of a plurality of items related to the kerf processing quality using the kerf image (calculation step: S7).

[0079] At this time, in the computer 2, the result of the kerf check may be notified to a user of the computer 2 via the output device 12. For example, the CPU 8 of the computer 2 may control a display (output device 12) to display the result of the kerf check on the display.

[0080] Fig. 7 is a diagram showing an example of a screen showing the results of the kerf check displayed on the display. An image 82 shown in Fig. 7 includes an image 84 used in the kerf check. The image 84 includes a kerf 84c formed on a planned dividing line (street) 84b located between a pair of adjacent devices 84a formed on the front surface 11a side of the workpiece 11.

[0081] The image 84 also includes a number of items related to the kerf processing quality ("kerf number," "off-center," "kerf width," "maximum kerf width," "maximum kerf piece width," "maximum chipping size," and "chipping area") 86a and their values ​​(determined values) 86b. Each item 86a will be explained below.

[0082] First, the "kerf score" is an index that indicates the kerf recognition value (kerf-likeness). Specifically, the "kerf score" is a score that represents the difference in luminance (contrast) between a pair of pixels that constitute the image 84 of the kerf 84c, that are adjacent in a direction perpendicular to the direction in which the kerf 84c extends, and that have the greatest change in luminance in this direction.

[0083] This "kerf score" is a value that depends on the inclination of a pair of inner surfaces that define the kerf 84c, etc. For example, the "kerf score" is calculated by setting the difference in luminance between the highest and lowest luminance pixels among the pixels that make up the kerf 84c and the remaining streets 84b in a direction perpendicular to the direction in which the kerf 84c extends as 100 points. Furthermore, it is recognized here that the boundary between the kerf 84c and the remaining streets 84b exists between the pair of pixels, and the judged values ​​of the other items 86a are calculated.

[0084] Moreover, "off-center" is an index that indicates the amount of deviation of the kerf 84c. Specifically, "off-center" is the distance between a straight line that is located at the center of a pair of inner sides that define the kerf in an ideal position and that runs along the direction in which the kerf extends, and a straight line that is located at the center of a pair of inner sides that define the actual kerf 84c and that runs along the direction in which the kerf 84c extends.

[0085] Moreover, the "kerf width" represents the distance between a pair of straight lines that pass through the innermost of a pair of inner surfaces that define the kerf 84c and are aligned along the direction in which the kerf 84c extends. In short, the "kerf width" is the width of the kerf 84c along the direction in which the kerf 84c extends, ignoring chipping that occurs on both sides of the kerf 84c.

[0086] Moreover, the "maximum kerf width" is the maximum width of the kerf 84c along a direction perpendicular to the direction in which the kerf 84c extends. In short, the "maximum kerf width" is the maximum width of the kerf 84c including chipping. Moreover, the "maximum kerf piece width" is the maximum width between the line that is located in the middle of the pair of lines used in calculating the "kerf width" and that is along the direction in which the kerf 84c extends, and the boundary between the kerf 84c and the remaining street 84b.

[0087] Furthermore, the "maximum chipping size" is the maximum width between one or the other of a pair of straight lines used in calculating the "kerf width" and the boundary between the kerf 84c and the remaining street 84b located outside the one or the other of the pair of straight lines. Furthermore, the "chipping area" is the number of pixels (area) constituting the region surrounded by the one or the other of a pair of straight lines used in calculating the "kerf width" and the boundary between the kerf 84c and the remaining street 84b located outside the one or the other of the pair of straight lines.

[0088] When the calculation step (S7) is completed, the judgment unit 22 of the computer 2 judges whether or not the judged values ​​of the plurality of items 86a are error values ​​not included in the allowable ranges (judgment step: S8). Specifically, the judged values ​​calculated by the calculation unit 20 are compared with the allowable ranges (kerf check conditions) of the plurality of items related to the kerf processing quality transmitted from the processing device 4. Table 1 is a table that diagrammatically shows an example of the kerf check conditions transmitted from the processing device 4.

[0089] [Table 1]

[0090] As a result of this comparison, the judgment unit 22 of the computer 2 judges that the judged value of the maximum chipping size (0.012 mm) is an error value (more than 0.010 mm) and that the other items 86a are not error values. At this time, the computer 2 may notify the user of the computer 2 of the items 86a whose judged values ​​are error values ​​via the output device 12. For example, the CPU 8 of the computer 2 may control the display so that the items 86a whose judged values ​​are error values ​​are displayed in a color different from that of the other items 86a.

[0091] When the determination step (S8) is completed, the change unit 24 of the computer 2 changes the allowable range (kerf check condition) of the item 86a so as to include the determined value (0.012 mm), which is an error value (change step: S9). Fig. 8 is a flow chart that shows a schematic operation flow of the computer 2 when performing the change step (S9). In the change step (S9), for example, the kerf check condition shown in Table 1 is changed to the kerf check condition shown in Table 2.

[0092] [Table 2]

[0093] Specifically, in this change step (S9), the tolerance range (kerf check condition) is changed so that a value (0.013 mm) that is outside the tolerance range before the change (0.010 mm or less) is included by one smallest unit (0.001 mm for maximum chipping size) when changing the tolerance range, and a value (0.014 mm) that is outside the tolerance range before the change by two smallest units is not included.

[0094] Then, if the user of computer 2 considers that the changed kerf check conditions can ensure the desired kerf processing quality (can be applied as the kerf check conditions of processing device 4) (S10: YES), in response to the user's operation of input device 14, CPU 8 of computer 2 transmits an electrical signal corresponding to the changed kerf check conditions to processing device 4 (transmission step: S11).

[0095] When the processing device 4 receives an electric signal corresponding to the changed kerf check conditions, the CPU of the control unit 80 of the processing device 4 updates the kerf check conditions stored in the storage device (auxiliary storage device) of the control unit 80 (update step: S12). This enables the kerf check in the processing device 4 to be appropriately performed.

[0096] The above-mentioned method for changing the kerf quality tolerance range is one aspect of the present invention, and the present invention also includes inventions having features different from this method. For example, in the present invention, information may be exchanged between the computer 2 and the processing device 4 using a non-transitory recording medium such as a portable Universal Serial Bus (USB) flash drive, without using the network 6.

[0097] That is, after the kerf check step (S4) shown in Fig. 5, electrical signals may be exchanged in the following order. First, a non-temporary recording medium is connected to the processing device 4, and then electrical signals corresponding to the kerf image and electrical signals corresponding to the kerf check conditions are stored in this recording medium. Next, the recording medium is removed from the processing device 4, transported, and connected to the computer 2. Next, the electrical signals stored in this recording medium are stored in the storage device 10 of the computer 2.

[0098] Similarly, after the change step (S9) shown in Fig. 5, electrical signals may be exchanged in the following order: First, a non-transient recording medium is connected to the computer 2, and then electrical signals corresponding to the changed kerf check conditions are stored in the storage device. Next, the recording medium is removed from the computer 2, transported, and connected to the processing device 4. Next, the electrical signals stored in the recording medium are stored in a storage device included in the control unit 80 of the processing device 4.

[0099] In the present invention, all steps of the method for changing the kerf quality acceptable range may be executed in the processing device 4. Fig. 9 is a sequence diagram showing a method for changing the kerf quality acceptable range executed in the processing device 4. In this method, first, a program for executing the method for changing the kerf quality acceptable range is transmitted to the processing device 4 from (the storage device 10 of) the computer 2 or a non-transitory recording medium storing the program.

[0100] In the processing device 4, this program is stored in the storage device of the control unit 80. Note that this program does not need to be stored in the storage device of the control unit 80, and it is sufficient that the CPU of the control unit 80 is in a readable state. For example, if a non-transitory recording medium that stores this program is connected to the processing device 4, the storage device of the control unit 80 does not need to store this program.

[0101] As a result, the control unit 80 of the processing device 4 has the same functional units as the computer 2 shown in Fig. 3. That is, the control unit 80 capable of reading this program includes a calculation unit that calculates the values ​​(determined values) of multiple items related to the kerf processing quality using an image of the kerf formed on the workpiece, a determination unit that determines whether or not each of the multiple determined values ​​calculated by the calculation unit is a value (error value) that is not included in the allowable range of each of the multiple items related to the kerf processing quality, and a change unit that changes the allowable range of the item so as to include the determined value determined to be an error value by the determination unit.

[0102] In this method, the above-mentioned holding step (S1), forming step (S2), imaging step (S3), calculation step (S7), determination step (S8), change step (S9), and update step (S12) are performed in this order in the processing device 4. This makes it possible to appropriately perform the kerf check in the processing device 4.

[0103] In the present invention, an operator of the processing device 4 may determine whether or not to change the kerf check conditions. Fig. 10 is a flow chart that shows a schematic diagram of a part of the operation flow of the processing device 4 in such a case. In this operation flow, the CPU of the control unit 80 of the processing device 4 determines whether or not each of the multiple judged values ​​calculated in the kerf check step (S4) is within a preset allowable range (whether or not the kerf check conditions are met).

[0104] If at least one of the judged values ​​does not meet the kerf check condition (an error has occurred) (S5: YES), the operator of the processing device 4 judges whether the kerf included in the kerf image actually meets the required kerf processing quality. That is, the operator visually checks the kerf image to confirm whether the kerf processing quality is abnormal.

[0105] As a result, if the operator confirms that there is no abnormality in the kerf processing quality (S13: NO), in response to the operator's operation of the touch panel 76, the CPU of the control unit 80 transmits to the computer 2 an electrical signal corresponding to the image of the kerf used in the kerf check and an electrical signal corresponding to the kerf check conditions (transmission step: S6).

[0106] In this case, the user of the computer 2 does not need to determine whether or not to apply the kerf check conditions changed in the computer 2 to the processing device 4. That is, step (S10) shown in Fig. 8 is unnecessary.

[0107] In the present invention, the kerf check conditions may be set according to the image of the kerf selected by the operator of the processing device 4. Fig. 11 is a flow chart that shows a schematic diagram of a part of the operation flow of the processing device 4 in such a case. In this operation flow, the operator uses the image of the kerf formed in the imaging step (S3) to check whether the formed kerf satisfies the desired processing quality.

[0108] Then, when the operator confirms that the kerf meets the desired processing quality (S14: YES), in response to the operator's operation of the touch panel 76, the CPU of the control unit 80 transmits to the computer 2 an electrical signal corresponding to the image of the kerf used in the kerf check and an electrical signal corresponding to the kerf check conditions (transmission step: S6).

[0109] In this case, it is not necessary to perform a kerf check in the processing device 4, and it is not necessary for the user of the computer 2 to determine whether or not to apply the kerf check conditions changed in the computer 2 to the processing device 4. That is, the kerf check step (S4) shown in Fig. 5 and the step (S10) shown in Fig. 8 are not necessary.

[0110] In the present invention, the processing device that performs the kerf check may be a laser processing device. Fig. 12 is a perspective view that shows a schematic example of the laser processing device. Note that the X-axis direction, the Y-axis direction, and the Z-axis direction shown in Fig. 12 correspond to the X-axis direction, the Y-axis direction, and the Z-axis direction shown in Fig. 4, respectively.

[0111] The laser processing apparatus 88 shown in Fig. 12 has a base 90 that supports each of the components. A horizontal movement mechanism 92 is disposed on the upper surface of the base 90. The horizontal movement mechanism 92 is fixed to the upper surface of the base 90 and has a pair of guide rails 94 that extend along the Y-axis direction. A moving plate 96 is connected to the upper portion of the pair of guide rails 94 in a manner that allows it to slide along the pair of guide rails 94.

[0112] A screw shaft 98 extending along the Y-axis direction is disposed between the pair of guide rails 94. A motor 100 for rotating the screw shaft 98 is connected to one end of the screw shaft 98. A nut portion (not shown) for accommodating balls that roll on the surface of the rotating screw shaft 98 is provided on the surface of the screw shaft 98 on which a spiral groove is formed, thereby forming a ball screw.

[0113] That is, when the screw shaft 98 rotates, the balls circulate inside the nut portion, causing the nut portion to move along the Y-axis direction. This nut portion is fixed to the lower surface side of the moving plate 96. Therefore, when the screw shaft 98 is rotated by the motor 100, the moving plate 96 moves along the Y-axis direction together with the nut portion.

[0114] A pair of guide rails 102 extending along the X-axis direction are fixed to the upper surface of the movable plate 96. A movable plate 104 is connected to the upper portions of the pair of guide rails 102 in a manner that allows the movable plate 104 to slide along the pair of guide rails 102. In addition, a screw shaft 106 extending along the X-axis direction is disposed between the pair of guide rails 102.

[0115] A motor 108 for rotating the screw shaft 106 is connected to one end of the screw shaft 106. A nut portion (not shown) for accommodating balls that roll on the surface of the rotating screw shaft 106 is provided on the surface of the screw shaft 106 on which a spiral groove is formed, thereby forming a ball screw.

[0116] That is, when the screw shaft 106 rotates, the balls circulate inside the nut portion, causing the nut portion to move along the X-axis direction. This nut portion is fixed to the lower surface side of the moving plate 104. Therefore, when the screw shaft 106 is rotated by the motor 108, the moving plate 104 moves along the X-axis direction together with the nut portion.

[0117] A cylindrical table base 110 is disposed on the upper surface side of the moving plate 104. A holding table 112 for holding a workpiece is disposed on the upper part of the table base 110. A rotation drive source (not shown) such as a motor is connected to the lower part of the table base 110. The force generated by this rotation drive source causes the holding table 112 to rotate about a rotation axis that is approximately parallel to the Z-axis direction.

[0118] The table base 110 and the holding table 112 are moved in the X-axis and Y-axis directions by the horizontal movement mechanism 92. A part of the upper surface of the holding table 112 is made of, for example, a porous material, and functions as a holding surface 112a that holds the workpiece. This holding surface 112a is approximately parallel to the X-axis and Y-axis directions.

[0119] The holding surface 112a is connected to a suction source (not shown) such as a vacuum pump via a flow path (not shown) provided inside the holding table 112. When the suction source operates, a negative pressure is generated on the holding surface 112a. As a result, for example, a workpiece placed on the holding surface 112a is sucked and held.

[0120] A support structure 114 having a side surface generally parallel to the Y-axis direction is provided on an area on one side of the base 90 in the Y-axis direction. A vertical movement mechanism 116 is disposed on the side surface of this support structure 114. The vertical movement mechanism 116 is fixed to the side surface of the support structure 114 and has a pair of guide rails 118 extending along the Z-axis direction.

[0121] A moving plate 120 is connected to the side of the pair of guide rails 118 that is farther from the support structure 114 so as to be slidable along the pair of guide rails 118. A screw shaft (not shown) extending along the Z-axis direction is disposed between the pair of guide rails 118. A motor 122 for rotating the screw shaft is connected to one end of the screw shaft.

[0122] A nut portion (not shown) that accommodates balls that roll on the surface of the rotating screw shaft is provided on the surface of the screw shaft on which the helical groove is formed, forming a ball screw. That is, when the screw shaft rotates, the balls circulate inside the nut portion, causing the nut portion to move along the Z-axis direction. In addition, the nut portion is fixed to the side surface of the moving plate 120 that is closer to the support structure 114. Therefore, when the screw shaft is rotated by the motor 122, the moving plate 120 moves along the Z-axis direction together with the nut portion.

[0123] A support 124 is fixed to a side surface of the moving plate 120 away from the support structure 114. The support 124 supports a part of a laser processing unit (processing unit) 126. The laser processing unit 126 includes, for example, a laser oscillator (not shown) fixed to the base 90, a cylindrical housing 128 supported by the support 124 and elongated in the Y-axis direction, and an irradiation head 130 provided at an end of the housing 128 (the other end in the Y-axis direction).

[0124] The laser oscillator has a laser medium such as Nd:YAG suitable for laser oscillation, generates a laser beam with a wavelength (e.g., 365 nm) that is absorbed by the workpiece, and emits it to the housing 128. The mode of laser oscillation performed by the laser oscillator is, for example, pulse oscillation. The housing 128 contains a part of the optical system that constitutes the laser processing unit 126, such as a mirror, and guides the laser beam emitted from the laser oscillator to the irradiation head 130.

[0125] The irradiation head 130 contains another part of the optical system that constitutes the laser processing unit 126, for example, a mirror and a condenser lens. The laser beam guided from the housing 128 has its path changed downward by the mirror, and is condensed by the condenser lens at a predetermined height on the holding table 112 side.

[0126] Moreover, an imaging unit 132 is provided at a position adjacent to the irradiation head 130 in the X-axis direction. The imaging unit 132 has, for example, a light source such as an LED, an objective lens, and an imaging element such as a CCD image sensor or a CMOS image sensor.

[0127] Furthermore, the upper part of the base 90 is covered with a cover (not shown) that houses each component. A touch panel 134 is disposed on one surface of the cover. The touch panel 134 is configured with an input device such as a capacitive touch sensor or a resistive touch sensor, and an output device such as a liquid crystal display or an organic EL display.

[0128] The operation of each of the components of the laser processing apparatus 88 described above is controlled by a control unit 136 built into the laser processing apparatus 88. The control unit 136 includes, for example, a CPU, a storage device including a main storage device (volatile memory) and an auxiliary storage device (non-volatile memory), and a communication interface. The control unit 136 and the touch panel 134 configure a computer similar to the computer 2 shown in FIG.

[0129] In addition, the structures and methods of the above-described embodiments can be modified as appropriate without departing from the scope of the present invention. [Explanation of symbols]

[0130] 2: Computer 4: Processing equipment 6: Network 8: CPU (Central Processing Unit) 10: Storage device (10a: main storage device, 10b: auxiliary storage device) 12: Output device 14: Input device 16: Communication interface 18: Bus 20: Calculation section 22: Judgment section 24: Changes 11: Workpiece (11a: front side, 11b: back side) 13: Dicing tape (adhesive tape) 15: Frame 17: Workpiece unit 26: Base (26a, 26b: opening) 28: Cassette support stand 28 30: Cassette 32: Table cover 34: Dust-proof and water-resistant cover 36: Holding table 38: Clamp 40: Support structure (40a, 40b: standing section, 40c: crossing section) 42a: 1st Y-axis movement mechanism 42b: 2nd Y-axis movement mechanism 44: Guide rail 46a, 46b: moving plate 48a, 48b: Screw shaft 50a:Motor 52:Z-axis movement mechanism 54: Guide rail 56: Moving plate 58: Screw shaft 60: Motor 62: Cutting unit (processing unit) 64: Cutting blade 66: Imaging unit 68: Cleaning unit 70: Spinner table 72: Nozzle 74: Cover 76: Touch panel 78: Warning light (pilot lamp) 80: Control unit 82: Image 84: Image (84a: Device, 84b: Street, 84c: Calf) 86a:Item 86b: Value (value to be determined) 88: Laser processing equipment 90: Foundation 92: Horizontal movement mechanism 94: Guide rail 96: Moving plate 98: Screw shaft 100:Motor 102: Guide rail 104: Moving plate 106: Screw shaft 108: Motor 110: Table base 112: Holding table (112a: holding surface) 114: Support structure 116: Vertical movement mechanism 118: Guide rail 120: Moving plate 122: Motor 124: Support 126: Laser processing unit 128: Housing 130: Irradiation head 132: Imaging unit 134: Touch panel 136: Control unit

Claims

1. A method for changing a tolerance range of a kerf quality that is set for performing a kerf check to check the processing quality of a kerf formed in a workpiece, the method comprising: A calculation step of calculating a judged value of the item by using an image of the kerf formed on the workpiece by imaging the kerf; a determining step of determining whether the determined value is an error value that is not included in the allowable range; a change step of changing the allowable range so as to include the determined value determined to be the error value in the determination step, the changed acceptable range includes a value that is more deviated from the acceptable range before the change than the determined value by one minimum unit when changing the acceptable range, and does not include a value that is more deviated from the acceptable range before the change than the determined value by two minimum units.

2. 2. The method for changing kerf quality tolerance range according to claim 1, wherein the item is a kerf width, a chipping size, a kerf deviation amount, or a kerf recognition value.

3. A program for causing a computer to execute a kerf quality tolerance changing method for changing a tolerance range of an item related to a kerf processing quality set for performing a kerf check to check the processing quality of a kerf formed in a workpiece, comprising: The method for changing the kerf quality tolerance range comprises: A calculation step of calculating a judged value of the item by using an image of the kerf formed on the workpiece by imaging the kerf; a determining step of determining whether the determined value is an error value that is not included in the allowable range; a change step of changing the allowable range so as to include the determined value determined to be the error value in the determination step, The program is characterized in that the allowable range after the change includes values ​​that are further out of the allowable range before the change than the determined value by one minimum unit when changing the allowable range, and does not include values ​​that are further out of the allowable range before the change than the determined value by two minimum units.

4. A processing device comprising: a holding table for holding a workpiece; a processing unit for forming a kerf in the workpiece held on the holding table; an imaging unit for imaging the kerf to form an image of the kerf; and a control unit for changing an allowable range of an item related to the processing quality of the kerf, which is set for performing a kerf check to confirm the processing quality of the kerf formed in the workpiece, The control unit a calculation unit that calculates a judged value of the item by using the image of the kerf; a determination unit that determines whether the determined value is an error value that is not included in the allowable range; a change unit that changes the allowable range so as to include the determined value that the determination unit has determined to be the error value, A processing device characterized in that the allowable range after the change includes values ​​that are further out of the allowable range before the change than the determined value by one minimum unit when changing the allowable range, and does not include values ​​that are further out of the allowable range before the change than the determined value by two minimum units.

5. The processing unit is a cutting unit having an annular cutting blade, 5. The processing device of claim 4, wherein the kerf is formed by the cutting blade.

6. The processing unit is a laser processing unit capable of irradiating a laser beam onto the workpiece, 5. The processing apparatus according to claim 4, wherein the kerf is formed by irradiating the workpiece with the laser beam from the laser processing unit.

Images