Component Mounting Equipment

Abstract

To provide a component mounting device which can easily detect an abnormality of a backup pin with a simple structure.MEANS FOR SOLVING THE PROBLEM: A component mounting device 1 comprises: a backup pin 50 which backs up a substrate P from the lower side; a plate which is provided with a plurality of support parts that can support the backup pin 50; a camera which images the backup pin 50 supported by the support parts from the upper side; and a control unit 30. The backup pin 50 includes a contact part 53 which can be in contact with the support parts. The backup pin 50 includes a first mark 55A and a second mark 55B which are arranged at different positions in the vertical direction and can be recognized by the camera from the upper side. The control unit 30 acquires a first image by imaging the first mark 55A of the backup pin 50 supported by the support parts by the camera, acquires a second image by imaging the second mark 55B of the backup pin 50 supported by the support parts by the camera, and determines whether or not there is an abnormality in the backup pin 50 by measuring the inclination of the backup pin 50 on the basis of the first image and the second image.SELECTED DRAWING: Figure 9

Description

[Technical field]

[0001] The present disclosure relates to a component mounting apparatus. [Background technology]

[0002] A component mounting device that mounts components on a board includes a backup device that supports the board from below in order to prevent the board from bending when mounting components on the board. A backup device such as this is conventionally known as described in JP 2019-140228 A (Patent Document 1 below). The backup device described in Patent Document 1 includes a plurality of backup pins, an upper plate having a plurality of pin insertion holes into which the backup pins are inserted, a touch panel disposed below the upper plate, and a control unit. The touch panel is capable of detecting the backup pins inserted into the pin insertion holes. The control unit is capable of determining whether the backup pins are erected in the correct position based on the detection result of the touch panel. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2019-140228 A Summary of the Invention [Problem to be solved by the invention]

[0004] In the above configuration, it is necessary to provide a touch panel in the backup device in order to obtain position information of the backup pin, which may complicate the configuration of the backup device. [Means for solving the problem]

[0005] The component mounting device disclosed herein is a component mounting device that mounts components on a board, and includes: a backup pin that backs up the board from below; a plate having a plurality of support portions capable of supporting the backup pin; a camera that images the backup pin supported by the support portion from above; and a control unit, wherein the backup pin has an abutment portion that can abut against the support portion, and the backup pin has a first mark and a second mark that are arranged at different positions in the vertical direction and can each be recognized by the camera from above, and the control unit obtains a first image by capturing an image of the first mark of the backup pin supported by the support portion with the camera, obtains a second image by capturing an image of the second mark of the backup pin supported by the support portion with the camera, and measures an inclination of the backup pin based on the first image and the second image to determine whether or not there is an abnormality in the backup pin. Effect of the Invention

[0006] According to the present disclosure, it is possible to provide a component mounting device that has a simple configuration and is capable of easily detecting an abnormality in a backup pin. [Brief description of the drawings]

[0007] [Figure 1] FIG. 1 is a plan view of the component mounting apparatus according to the first embodiment. [Diagram 2] FIG. 2 is a side view of the component mounting apparatus. [Diagram 3] FIG. 3 is a perspective view of the backup device. [Figure 4] FIG. 4 is a schematic side view of the backup device, showing cross sections of the contact portion, the upper plate, and the lower plate. [Diagram 5] FIG. 5 is a diagram showing an electrical configuration of the component mounting apparatus. [Figure 6] FIG. 6 is a diagram illustrating a first image and a second image acquired by capturing an image of the backup pin shown in FIG. [Figure 7]FIG. 7 is a schematic side view showing the backup pin in an inclined state, and is a diagram showing cross sections of the upper plate and the lower plate. [Figure 8] FIG. 8 is a diagram illustrating a first image and a second image acquired by capturing an image of the backup pin shown in FIG. [Figure 9] FIG. 9 is a flowchart showing the abnormality determination process for the backup pin. [Figure 10] FIG. 13 is a perspective view showing a backup pin according to another embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] [Description of the embodiments of the present disclosure] First, embodiments of the present disclosure will be listed and described.

[0009] (1) A component mounting device disclosed herein is a component mounting device that mounts components on a board, the component mounting device comprising: a backup pin that backs up the board from below; a plate having a plurality of support portions capable of supporting the backup pin; a camera that images the backup pin supported by the support portions from above; and a control unit, wherein the backup pin has an abutment portion that can abut against the support portions, and the backup pin has a first mark and a second mark that are arranged at different positions in the vertical direction and can be recognized by the camera from above, the control unit obtains a first image by capturing an image of the first mark of the backup pin supported by the support portion with the camera, obtains a second image by capturing an image of the second mark of the backup pin supported by the support portion with the camera, and measures an inclination of the backup pin based on the first image and the second image to determine whether or not there is an abnormality in the backup pin.

[0010] According to this configuration, since the first mark and the second mark are provided at different positions in the up-down direction of the backup pin, it is possible to measure the inclination of the backup pin and determine whether or not there is an abnormality in the backup pin based on the first image in which the first mark is captured and the second image in which the second mark is captured. Therefore, with a simple configuration in which the backup pin is provided with the first mark and the second mark, it is possible to detect an abnormality in the backup pin. Here, cases where there is an abnormality in the backup pin include, for example, a case where a foreign object is caught between the contact portion and the plate, a case where the backup pin itself is bent, and the like.

[0011] (2) The support portion is preferably a hole edge portion of a through hole into which the backup pin can be inserted.

[0012] According to this configuration, the backup pin can be supported by the hole edge portion of the through hole provided in the plate.

[0013] (3) It is preferable that the control unit calculates a first reference position, which is a center position of the backup pin captured in the first image from the first image, calculates a second reference position, which is a center position of the backup pin captured in the second image from the second image, calculates an inclination of the backup pin from an amount of positional deviation between the first reference position and the second reference position, and determines that there is an abnormality in the backup pin when the amount of positional deviation is larger than a preset threshold value.

[0014] With this configuration, the first reference position is calculated from the first image, the second reference position is calculated from the second image, and the inclination of the backup pin can be calculated from the amount of positional deviation between the first and second reference positions. By comparing the amount of positional deviation with a threshold, an abnormality in the backup pin can be detected.

[0015] (4) It is preferable that the camera is a board imaging camera for recognizing the position of the board, and that the board imaging camera is movable in the vertical direction.

[0016] According to this configuration, by appropriately setting the height of the board imaging camera, the distance between the board imaging camera and the first mark can be adjusted, and the first image can be favorably captured. Also, by appropriately setting the height of the board imaging camera, the distance between the board imaging camera and the second mark can be adjusted, and the second image can be favorably captured.

[0017] (5) The plate may be disposed at a support position when backing up the substrate, and the plate may be movable above the support position.

[0018] With this configuration, since the plate can be moved above the support position, the distance between the camera and the first mark can be adjusted by appropriately setting the height of the plate, and the first image can be captured satisfactorily. Also, the distance between the camera and the second mark can be adjusted by appropriately setting the height of the plate, and the second image can be captured satisfactorily.

[0019] (6) The component mounting device of the present disclosure preferably further includes an alarm unit, and when it is determined that there is an abnormality in the backup pin, the control unit preferably notifies an operator via the alarm unit that it is not possible to position the backup pin on the support part.

[0020] With this configuration, an operator can immediately correct the abnormality in the backup pin, which makes it possible to prevent production from being started in a state where there is an abnormality in the backup pin.

[0021] (7) It is preferable that the component mounting device of the present disclosure further includes a display unit, and when it is determined that there is an abnormality in the backup pin, the control unit causes the display unit to display the position of the backup pin.

[0022] With this configuration, the operator can easily check for any abnormality in the backup pin.

[0023] (8) The component mounting device of the present disclosure preferably further includes a display unit, and when it is determined that there is an abnormality in the backup pin, the control unit preferably causes the display unit to display the position of the other support part when it is preset that the backup pin can be positioned on another support part of the plurality of support parts instead of the support part.

[0024] With this configuration, if an abnormality is detected due to a foreign object being caught between the contact portion and the plate, the backup pin can be placed on another support portion, thereby eliminating the need to remove the foreign object.

[0025] [Details of the embodiment of the present disclosure] The present disclosure will be described below with reference to the embodiments. The present disclosure is not limited to these examples, but is defined by the claims, and is intended to include all modifications within the meaning and scope of the claims.

[0026] <Embodiment 1> A first embodiment will be described with reference to Figures 1 to 9. In the following description, the left-right direction in Figure 1 is referred to as the X-axis direction, the up-down direction in Figure 2 is referred to as the Y-axis direction, and the up-down direction in Figure 2 is referred to as the Z-axis direction. In real space, the positive direction in the Z-axis direction is considered to be upward. In addition, in the following description, the right side in Figure 1 is referred to as the upstream side, and the left side in Figure 1 is referred to as the downstream side. In addition, in the following description, the reference numerals in the drawings may be omitted for the same components, with some exceptions.

[0027] [Overall configuration] 1, the first embodiment illustrates a component mounting apparatus 1 that mounts components E, such as electronic components, on a board P, such as a printed circuit board. The component mounting apparatus 1 includes a base 10, a transport conveyor 11, a head unit 12, a head transport section 13, a backup device 20 (see FIG. 2), two component imaging cameras 15, a board imaging camera 16 (an example of a camera), a tape component supply device 3, a control section 30 shown in FIG. 5, an operation section 31, and the like.

[0028] The base 10 has a rectangular shape in a plan view and has a flat upper surface. The rectangular frame indicated by the two-dot chain line in Fig. 1 indicates a working position A when mounting a component E on a substrate P. Although not shown in Fig. 1, a backup device 20 (see Fig. 2), which will be described later, is disposed below the working position A.

[0029] The transport conveyor 11 transports the board P from the upstream side in the X-axis direction to the working position A, and transports the board P on which the components E are mounted at the working position A to the downstream side. The transport conveyor 11 is equipped with a pair of conveyor belts 11A, 11B that are driven in a circular motion in the X-axis direction, a conveyor drive motor 42 (see FIG. 5) that drives the conveyor belts 11A, 11B, and the like. The upper conveyor belt 11A in the figure is movable in the Y-axis direction, and the distance between the two conveyor belts 11A, 11B can be adjusted according to the width of the board P.

[0030] The head unit 12 rotates a plurality of (here, five) mounting heads 17 around an axis and raises and lowers them in the axial direction. The configuration of the head unit 12 will be described later. The head transport unit 13 transports the head unit 12 in the X-axis and Y-axis directions within a predetermined movable range. The head transport unit 13 includes a beam 13A that supports the head unit 12 so that it can move back and forth in the X-axis direction, a pair of Y-axis guide rails 13B that support the beam 13A so that it can move back and forth in the Y-axis direction, an X-axis servo motor 38 that moves the head unit 12 back and forth in the X-axis direction, and a Y-axis servo motor 39 that moves the beam 13A back and forth in the Y-axis direction.

[0031] The two component imaging cameras 15 are provided between the two tape component supply devices 3 aligned in the X-axis direction. The component imaging cameras 15 are used to image the components E adsorbed to the mounting head 17 from below to recognize the position, orientation, etc. of the components E, and are disposed with their imaging surfaces facing upward.

[0032] The board imaging camera 16 is provided in the head unit 12. The board imaging camera 16 is for capturing images of fiducial marks (not shown) and the like attached to the board P to recognize their positions, and is disposed with the imaging surface facing downward. In this embodiment, the board imaging camera 16 is a camera that images a first mark 55A and a second mark 55B of a backup pin 50, which will be described later.

[0033] The tape component supplying devices 3 are arranged in a row in the X-axis direction, two on each side of the transport conveyor 11 in the Y-axis direction, for a total of four. A plurality of feeders 3A are attached to each of these tape component supplying devices 3 and aligned horizontally in the X-axis direction. Each feeder 3A is a so-called tape feeder and includes a reel (not shown) on which a component tape containing a plurality of components E is wound, and an electric tape feeding device that pulls out the component tape from the reel, and supplies components E one by one from a component supply position provided at the end on the transport conveyor 11 side.

[0034] In this example, a tape component supplying device 3 is used as an example of a component supplying device, but the component supplying device may be a so-called tray feeder that supplies trays on which components E are placed, or may be one that supplies semiconductor wafers.

[0035] [Head unit] 2, the head unit 12 according to this embodiment is a so-called in-line type, and multiple mounting heads 17 are arranged side by side in the X-axis direction. The head unit 12 is also provided with a Z-axis servo motor 40 (see FIG. 5) that raises and lowers these mounting heads 17 individually, an R-axis servo motor 41 (see FIG. 5) that rotates these mounting heads 17 all at once around their axis, and the like.

[0036] Each mounting head 17 is for suctioning and releasing a component E, and has a nozzle shaft 17A and a suction nozzle 17B that is detachably attached to the lower end of the nozzle shaft 17A. Negative pressure and positive pressure are supplied to the suction nozzle 17B from an air supply device (not shown) via the nozzle shaft 17A. The suction nozzle 17B picks up the component E when negative pressure is supplied to it, and releases the component E when positive pressure is supplied to it.

[0037] Although an in-line type head unit 12 will be described as an example here, the head unit 12 may be, for example, a so-called rotary head in which a plurality of mounting heads 17 are arranged on a circumference.

[0038] [Backup device] As shown in Fig. 2, the backup device 20 backs up the board P when components E are mounted on the board P. Specifically, before the board P is carried into work position A, the backup device 20 is lowered to a position where the upper end (more specifically, the upper ends of the backup pins 50) is below the conveyor belts 11A and 11B. When the board P is carried into work position A, the backup device 20 rises, and the board P is lifted by the multiple backup pins 50. As a result, the board P is supported from below by the backup device 20. In other words, the board P is backed up.

[0039] As shown in FIG. 3, the backup device 20 includes a plurality of backup pins 50, an upper plate 22 (an example of a plate), a lower plate 23 arranged below the upper plate 22, four support pillars 25, and a lifting mechanism 26 for raising and lowering the lower plate 23.

[0040] [Backup pin] Fig. 4 shows a schematic diagram of a part of the backup device 20. As shown in Fig. 4, the backup pin 50 has a cylindrical large diameter portion 51, a cylindrical small diameter portion 52 extending downward from the lower end of the large diameter portion 51, a contact portion 53 protruding like a flange from the lower end of the large diameter portion 51, and a reduced diameter portion 54 extending upward from the upper end of the large diameter portion 51. The reduced diameter portion 54 has a truncated cone shape whose radial dimension decreases toward the top. An annular magnet 53A is embedded in the lower surface of the contact portion 53 for attracting the contact portion 53 to the upper plate 22.

[0041] [1st mark, 2nd mark] A first mark 55A and a second mark 55B are provided on the outer peripheral surface of the reduced diameter portion 54 in the form of a strip having a predetermined width in the vertical direction (not shown in Figs. 2 and 3). The first mark 55A and the second mark 55B are disposed at different positions in the vertical direction, and in this embodiment, the second mark 55B is positioned higher than the first mark 55A. The first mark 55A and the second mark 55B are colored so as to be recognizable from above by the board imaging camera 16.

[0042] [Upper plate, through hole] Upper plate 22 is a metal member formed into a flat plate shape. As shown in Fig. 3, a plurality of through holes 24 penetrating in the plate thickness direction are formed in upper plate 22 in a matrix pattern. As shown in Fig. 4, the inner diameter of through hole 24 is larger than the outer diameter of small diameter portion 52 of backup pin 50, but smaller than the outer diameter of abutment portion 53. In upper plate 22, the periphery of through hole 24 (in other words, the hole edge portion of through hole 24) restricts the descent of backup pin 50. Here, the hole edge portion of through hole 24 is an example of a support portion.

[0043] The lower plate 23 is a plate-like member, and is connected to the upper plate 22 via supports 25 that stand up from the four corners.

[0044] 2, the lifting mechanism 26 includes a plurality of ball screws 26A extending downward from the lower plate 23, ball nuts 26B screwed into each ball screw 26A, a lifting motor 43, and a belt 26C wound around the ball nuts 26B and the lifting motor 43. When the lifting motor 43 is rotated, the ball nuts 26B rotate via the belt 26C, and the ball screws 26A move up and down. This causes the backup device 20 to move up and down.

[0045] 4, the small diameter portion 52 of the backup pin 50 is inserted into the through hole 24 from above, and the lower surface of the abutment portion 53 abuts against the edge of the through hole 24 in the upper plate 22, thereby restricting further descent. When the lower surface of the abutment portion 53 abuts against the edge of the through hole 24, the magnet 53A embedded in the lower surface of the abutment portion 53 is attracted to the upper surface of the metallic upper plate 22. As a result, the vertical position of the backup pin 50 is fixed by the magnet 53A.

[0046] The regular position at which the backup pins 50 are erected on the upper plate 22 differs for each type of substrate P. This is because the position at which the substrate P should be supported by the backup pins 50 differs depending on the size of the substrate P and the position of the portion on which the component E is mounted, etc. Here, the one of the multiple through holes 24 that is disposed at the regular position is referred to as the regular through hole 24A.

[0047] Depending on the substrate P to be produced, the backup pin 50 that should be erected in one regular through hole 24A may be arranged in another through hole 24 different from the regular through hole 24A. In this embodiment, an alternative through hole 24B that can be substituted for the regular through hole 24A is set in this manner. Here, the hole edge portion of the alternative through hole 24B is an example of another support portion.

[0048] 3, there may be a case where an alternative through hole 24B is provided adjacent to and in front of a regular through hole 24A disposed at the left end and rear end of the upper plate 22. In this case, even if it becomes impossible to install a backup pin 50 in the regular through hole 24A for some reason, the backup pin 50 can be installed in the alternative through hole 24B instead, thereby making it possible to quickly rearrange the backup pin 50.

[0049] [Electrical configuration of component mounting device] 5, the component mounting apparatus 1 includes a control unit 30 and an operation unit 31. The control unit 30 includes an arithmetic processing unit 32, a motor control unit 33, a storage unit 34, an image processing unit 35, an external input / output unit 36, a feeder communication unit 37, and the like.

[0050] The arithmetic processing unit 32 includes a CPU, a ROM, a RAM, etc., and executes a control program stored in the ROM to control each unit of the component mounting apparatus 1. Note that the arithmetic processing unit 32 may include an ASIC (Application Specific Integrated Circuit) or an FPGA (Field Programmable Gate Array) instead of or in addition to the CPU.

[0051] Under the control of the calculation processing unit 32, the motor control unit 33 rotates each motor, such as an X-axis servo motor 38, a Y-axis servo motor 39, a Z-axis servo motor 40, an R-axis servo motor 41, a conveyor drive motor 42, and a lift motor 43.

[0052] Various data are stored in the storage unit 34. The various data include information on the number and type of boards P scheduled to be produced, information on the mounting coordinates and mounting angles of components E, information on the mounting sequence of components E, and the like. Further, the memory unit 34 stores regular position data that indicates the position of the regular through hole 24A in which the backup pin 50 should be installed, for each type of substrate P. The regular position data is created in advance before the start of production of the substrate P, and is stored in the memory unit 34. Furthermore, the storage unit 34 also stores in advance, for each type of substrate P, alternative position data that indicates the position of the alternative through hole 24B in which the backup pin 50 can be placed instead of the regular position.

[0053] The image processing section 35 is configured to receive image signals output from the component imaging camera 15 and the board imaging camera 16, and generates a digital image based on the output image signals. The external input / output unit 36 ​​is a so-called interface, and is configured to receive detection signals output from various sensors 44 provided in the main body of the component mounting apparatus 1. The external input / output unit 36 ​​is also configured to control the operation of various actuators 45 based on control signals output from the arithmetic processing unit 32.

[0054] The feeder communication unit 37 is connected to the feeder 3A and controls the feeder 3A in an integrated manner. The operation unit 31 includes a display unit 31A such as a liquid crystal display, and an input unit 31B such as a touch panel, a keyboard, and a mouse. An operator can perform various settings by operating the operation unit 31. In this embodiment, the display unit 31A is an example of a notification unit.

[0055] [Determining whether the backup pin is abnormal] Determining whether or not there is an abnormality in the backup pin 50 will be described with reference to Fig. 7. As shown in Fig. 7, some foreign object 56 (such as an electronic component) may be placed on the upper surface of the upper plate 22. In that case, the foreign object 56 may be caught between the abutment portion 53 of the backup pin 50 and the edge of the through-hole 24 of the upper plate 22, causing the backup pin 50 arranged on the upper plate 22 to tilt.

[0056] If the backup pin 50 tilts, it may come into contact with the component E or printed wiring mounted on the underside of the substrate P, causing damage to them. Also, if the backup pin 50 tilts, it may cause a misalignment between the position where the component E should be mounted and the position where it is actually mounted when mounting the component E on the top side of the substrate P. Also, if the backup pin 50 tilts, the upper end of the backup pin 50 will no longer come into contact with the underside of the substrate P, and it is conceivable that the substrate P will bend at that portion.

[0057] In addition, in addition to the case where the backup pin 50 is tilted due to a foreign object 56 being caught between the abutment portion 53 and the upper plate 22, the same thing can occur when, for example, the backup pin 50 itself is bent.

[0058] In the component mounting apparatus 1 according to this embodiment, the control unit 30 controls the board imaging camera 16 to capture images of the first mark 55A and the second mark 55B from above, and measures the inclination of the backup pin 50 based on the obtained images. This makes it possible to detect abnormalities in the backup pin 50, including foreign matter 56 being caught between the contact portion 53 and the upper plate 22, deformation of the backup pin 50, and the like. The detection of an abnormality in the backup pin 50 by the control unit 30 will be described in detail below.

[0059] [1st image, 2nd image] The control unit 30 captures an image of the first mark 55A of the backup pin 50 inserted into the through hole 24 of the upper plate 22 from above using the board imaging camera 16 to obtain a first image, and captures an image of the second mark 55B from above to obtain a second image. Before capturing the image of the first mark 55A, the control unit 30 appropriately sets the height of the upper plate 22 using the lifting mechanism 26. During production of the board P, the upper plate 22 is disposed at the support position (see FIG. 2), and the upper surface of the board P can be captured satisfactorily by the board imaging camera 16. In this embodiment, the lifting mechanism 26 can move the upper plate 22 above the support position. Therefore, the first mark 55A can be raised to the height position of the upper surface of the board P during production, and the first mark 55A can be captured satisfactorily by the board imaging camera 16. Before capturing the image of the second mark 55B, the height of the upper plate 22 is adjusted by the lifting mechanism 26 in the same manner as above, so that the second mark 55B can be captured satisfactorily by the board imaging camera 16.

[0060] [First reference position, second reference position, position deviation amount] The control unit 30 calculates a first reference position, which is the center position in a horizontal plane (XY plane) of the backup pin 50 captured in the first image, based on the first image. Then, the control unit 30 calculates a second reference position, which is the center position in a horizontal plane of the backup pin 50 captured in the second image, based on the second image. The control unit 30 calculates the amount of positional deviation between the first reference position and the second reference position. The amount of positional deviation can be used as a measure of the inclination of the backup pin 50. The control unit 30 is configured to determine that there is an abnormality in the backup pin 50 when the amount of positional deviation is larger than a preset threshold value.

[0061] [Determination when the backup pin is not tilted] Fig. 6 shows a first image 61 (left part of Fig. 6) and a second image 62 (center part of Fig. 6) of the backup pin 50 shown in Fig. 4, and a composite image 63 (right part of Fig. 6) obtained by superimposing the first image 61 and the second image 62. The backup pin 50 shown in Fig. 4 is properly erected with respect to the upper plate 22 and is not tilted. Therefore, as shown in Fig. 6, the first mark 55A shown in the first image 61 and the second mark 55B shown in the second image 62 are circular, and the center positions of the respective circles are set to the first reference position 64 and the second reference position 65. In the composite image 63, the first reference position 64 and the second reference position 65 overlap each other and the amount of positional deviation is zero. Therefore, the control unit 30 determines that the backup pin 50 is not tilted and determines that there is nothing abnormal with the backup pin 50.

[0062] [Determining if the backup pin is tilted] FIG. 8 shows a first image 71 (left part of FIG. 8) and a second image 72 (center part of FIG. 8) of the backup pin 50 shown in FIG. 7, and a composite image 73 (right part of FIG. 8) obtained by superimposing the first image 71 and the second image 72. A foreign object 56 is sandwiched between the contact part 53 of the backup pin 50 shown in FIG. 7 and the upper plate 22, and the backup pin 50 is inclined with respect to the upper plate 22. Therefore, as shown in FIG. 8, the widths of the strip-shaped parts of the first mark 55A shown in the first image 71 and the second mark 55B shown in the second image 72 are not constant. Here, the center position in the XY coordinate system of the shape of the outer edge of the first mark 55A is set as a first reference position 74, and the center position in the XY coordinate system of the shape of the outer edge of the second mark 55B is set as a second reference position 75. In the composite image 73, the first reference position 74 and the second reference position 75 are shifted in the X-axis direction, so that a positional deviation amount dX having a finite magnitude is calculated by the control unit 30. If the positional deviation amount dX is larger than a threshold value, the control unit 30 determines that the backup pin 50 is tilted, and determines that there is an abnormality in the backup pin 50.

[0063] On the other hand, if the positional deviation amount dX is equal to or less than the threshold value, the control unit 30 determines that there is no abnormality in the backup pin 50. Here, the threshold value is set within a range that does not cause damage or bending of the substrate P as described above when backing up the substrate P. Therefore, even if the positional deviation amount dX has a finite magnitude and the inclination of the backup pin 50 is not zero, the control unit 30 is configured to determine that there is no abnormality as long as the positional deviation amount dX is equal to or less than the threshold value.

[0064] When the control unit 30 determines that there is an abnormality in the backup pin 50, it notifies the operator that there is an abnormality in the backup pin 50 by displaying an error message on the display unit 31A indicating that the backup pin 50 cannot be inserted into the through hole 24. Furthermore, the control unit 30 causes the display unit 31A to display the position of the backup pin 50 having an abnormality. This allows the operator to immediately recognize which backup pin 50 has an abnormality among the multiple backup pins 50 arranged on the upper plate 22. This makes it easier for the operator to check for abnormalities in the backup pins 50.

[0065] When it is determined that there is an abnormality in the backup pin 50, the operator usually needs to perform at least the work of pulling out the backup pin 50 from the regular through hole 24A and the work of relocating the backup pin 50 in the regular through hole 24A. For example, when a foreign object 56 is caught between the abutment portion 53 and the upper plate 22, after pulling out the backup pin 50 from the regular through hole 24A, the foreign object 56 is removed, and the backup pin 50 is relocated in the regular through hole 24A. Moreover, if the backup pin 50 is deformed, a new backup pin 50 is repositioned in the regular through hole 24A. If the regular through hole 24A is damaged, the upper plate 22 is replaced with a new one, and the backup pin 50 is repositioned.

[0066] Furthermore, in the case where an alternative through hole 24B is set to replace the regular through hole 24A, the control unit 30 causes the display unit 31A to display the position of the alternative through hole 24B when it determines that there is an abnormality in the backup pin 50. Thus, the operator can quickly recognize the position of the alternative through hole 24B in which the backup pin 50 can be installed.

[0067] When the alternative through hole 24B is set as described above and the position of the alternative through hole 24B is notified to the operator by the control unit 30, the operator may be able to easily rearrange the backup pin 50 thereafter. For example, if the abnormality in the backup pin 50 is due to a foreign object 56 being caught between the contact portion 53 and the upper plate 22, the operator can pull out the backup pin 50 from the regular through hole 24A, and then follow the display on the display unit 31A to erect the backup pin 50 in the alternative through hole 24B, thereby completing the rearrangement work. In other words, there is no need to perform the work of removing the foreign object 56 from the edge of the regular through hole 24A. Furthermore, if the regular through-hole 24A is damaged, the backup pin 50 can be quickly relocated by using the alternative through-hole 24B without replacing the upper plate 22.

[0068] [Back-up pin abnormality determination process flow] 9, a flow of the abnormality determination process of the backup pin 50 by the control unit 30 will be described. This process is performed on the backup pin 50 erected in the regular through hole 24A of the upper plate 22 by the operator before starting production of the substrate P.

[0069] The control unit 30 captures an image of the first mark 55A of the backup pin 50 arranged in the regular through hole 24A using the board imaging camera 16 to obtain a first image (S10). The control unit 30 calculates a first reference position based on the first image (S20).

[0070] The control unit 30 captures an image of the second mark 55B of the backup pin 50 arranged in the regular through hole 24A using the board imaging camera 16 to obtain a second image (S30). The control unit 30 calculates a second reference position based on the second image (S40).

[0071] The control unit 30 calculates the amount of positional deviation between the calculated first reference position and the second reference position (S50). If the amount of positional deviation is equal to or smaller than a preset threshold value (S60: NO), the control unit 30 determines that there is no abnormality in the backup pin 50 (S70). 4, the process proceeds from S60 to S70, and the abnormality determination process ends. In this case, since the backup pin 50 is normally erected, production of the board P is started.

[0072] On the other hand, if the amount of positional deviation is greater than the threshold value (S60: YES), the control unit 30 determines that the backup pin 50 is tilted, and determines that there is an abnormality in the backup pin 50 (S80). As described above, the abnormality determination process is performed for the backup pin 50 shown in Fig. 7, and if the positional deviation amount dX in Fig. 8 is greater than the threshold value, the process proceeds from S60 to S80. If the positional deviation amount dX is equal to or smaller than the threshold value, the process proceeds from S60 to S70 as described above, and the abnormality determination process ends.

[0073] If it is determined that there is an abnormality in the backup pin 50, the control unit 30 notifies the operator of the error by displaying an error message on the display unit 31A (S90). The control unit 30 also displays the position of the backup pin 50 having the abnormality on the display unit 31A (S100), making it easy for the operator to check for the abnormality in the backup pin 50.

[0074] If an alternative through hole 24B to replace the regular through hole 24A for the backup pin 50 determined to be abnormal has not been set (S110: NO), the abnormality determination process ends. In this case, the operator performs the task of rearranging the backup pin 50.

[0075] On the other hand, if the substitute through hole 24B to replace the regular through hole 24A has been set in advance (S110: YES), the control unit 30 displays the position of the substitute through hole 24B on the display unit 31A (S120), and the abnormality determination process ends. If the substitute through hole 24B has been set, the operator may be able to quickly complete the rearrangement work of the backup pin 50, as described above.

[0076] When it is determined that there is an abnormality in the backup pin 50, the abnormality determination process is ended, and the operator rearranges the backup pin 50, the abnormality determination process is executed again by the control unit 30 (S10~). When it is determined that there is no abnormality in the abnormality determination process (S70), the production of the substrate P is started.

[0077] [Effects of embodiment 1] As described above, the component mounting apparatus 1 of the first embodiment is a component mounting apparatus 1 that mounts a component E on a substrate P, and includes the backup pin 50 that backs up the substrate P from below, the upper plate 22 (plate) on which a plurality of support portions capable of supporting the backup pin 50 are provided, the substrate imaging camera 16 (camera) that images the backup pin 50 supported by the support portion from above, and the control unit 30, the backup pin 50 includes the abutment portion 53 that can abut against the support portion, and the backup pin 50 has a first mark 55A and a second mark 55B that are arranged at different positions in the vertical direction and can be recognized by the substrate imaging camera 16 from above, and the control unit 30 obtains a first image by imaging the first mark 55A of the backup pin 50 supported by the support portion with the substrate imaging camera 16, and obtains a second image by imaging the second mark 55B of the backup pin 50 supported by the support portion with the substrate imaging camera 16, and measures the inclination of the backup pin 50 based on the first and second images, thereby determining whether or not there is an abnormality in the backup pin 50.

[0078] According to such a configuration, the first mark 55A and the second mark 55B are provided at different positions in the up-down direction of the backup pin 50, so that it is possible to measure the inclination of the backup pin 50 and determine whether or not there is an abnormality in the backup pin 50 based on a first image in which the first mark 55A is captured and a second image in which the second mark 55B is captured. Therefore, with a simple configuration in which the backup pin 50 is provided with the first mark 55A and the second mark 55B, it is possible to detect an abnormality in the backup pin 50.

[0079] In the first embodiment, the support portion is the hole edge portion of the through hole 24 into which the backup pin 50 can be inserted.

[0080] With this configuration, the backup pin 50 can be supported by the edge of the through hole 24 provided in the upper plate 22 .

[0081] In the first embodiment, the control unit 30 calculates a first reference position, which is the center position of the backup pin 50 captured in the first image, from the first image, calculates a second reference position, which is the center position of the backup pin 50 captured in the second image, from the second image, calculates the inclination of the backup pin 50 from the amount of positional deviation between the first reference position and the second reference position, and determines that there is an abnormality in the backup pin 50 if the amount of positional deviation is greater than a preset threshold value.

[0082] According to this configuration, the first reference position is calculated from the first image, the second reference position is calculated from the second image, and the inclination of the backup pin 50 can be calculated from the amount of positional deviation between the first and second reference positions. An abnormality in the backup pin 50 can be detected by comparing the amount of positional deviation with a threshold value.

[0083] In the first embodiment, the upper plate 22 is disposed at the support position when backing up the substrate P, and the upper plate 22 is adapted to be movable above the support position.

[0084] With this configuration, since the upper plate 22 can be moved upward from the support position, the distance between the board imaging camera 16 and the first mark 55A can be adjusted by appropriately setting the height of the upper plate 22, and the first image can be captured satisfactorily. Also, the distance between the board imaging camera 16 and the second mark 55B can be adjusted by appropriately setting the height of the upper plate 22, and the second image can be captured satisfactorily.

[0085] The component mounting apparatus 1 of embodiment 1 further includes a display unit 31A (alarm unit), and if it is determined that there is an abnormality in the backup pin 50, the control unit 30 notifies the operator via the display unit 31A that it is not possible to place the backup pin 50 in the through hole 24.

[0086] According to this configuration, the operator can immediately correct the abnormality in the backup pin 50. This makes it possible to prevent production from being started in a state where the backup pin 50 has an abnormality.

[0087] In the first embodiment, when it is determined that the backup pin 50 is abnormal, the control unit 30 causes the display unit 31A to display the position of the backup pin 50.

[0088] With this configuration, the operator can easily check for abnormalities in the backup pin 50.

[0089] In embodiment 1, when it is determined that there is an abnormality in the backup pin 50, if it is pre-set that the backup pin 50 can be placed in another alternative through hole 24B among the multiple through holes 24 instead of the normal through hole 24A, the control unit 30 causes the display unit 31A to display the position of the alternative through hole 24B.

[0090] According to this configuration, when an abnormality is detected due to a foreign object 56 being caught between the abutment portion 53 and the upper plate 22, the backup pin 50 can be placed in the alternative through-hole 24B. Therefore, the task of removing the foreign object 56 can be omitted.

[0091] <Other embodiments> The technology disclosed in this specification is not limited to the embodiments described above and in the drawings, and for example, the following embodiments are also included in the technical scope disclosed in this specification.

[0092] (1) In the above embodiment, the height of the upper plate 22 is changed by the lifting mechanism 26, thereby allowing the first mark 55A and the second mark 55B, which are provided at different heights on the backup pin 50, to be captured satisfactorily, but the present invention is not limited to this. For example, the board imaging camera capturing images of the first and second marks may be movable in the vertical direction. With this configuration, by appropriately setting the height of the board imaging camera, the distance between the board imaging camera and the first mark can be adjusted, allowing the first image to be captured satisfactorily. Furthermore, by appropriately setting the height of the board imaging camera, the distance between the board imaging camera and the second mark can be adjusted, allowing the second image to be captured satisfactorily.

[0093] (2) In the above embodiment, the height of the upper plate 22 when the first mark 55A is imaged is different from the height of the upper plate 22 when the second mark 55B is imaged, and the first mark 55A and the second mark 55B are imaged separately, but this is not limited to the above. For example, the plate may be set to a height at which both the first mark and the second mark can be well imaged by the camera, and then the first mark and the second mark may be imaged at the same time. In such a configuration, the first image and the second image become a single image similar to the composite image in the above embodiment, and the same effect as the above embodiment is achieved.

[0094] (3) In the above embodiment, the first mark 55A and the second mark 55B are provided by coloring the reduced diameter portion 54. However, the first mark and the second mark may be configured to be recognizable by a camera by performing surface treatment, shape processing, or the like on the backup pin.

[0095] (4) In the above embodiment, the first mark 55A and the second mark 55B were provided around the entire outer circumferential surface of the reduced diameter portion 54, but the first mark and the second mark may be provided only on a portion of the outer circumferential surface of the reduced diameter portion. (5) In the above embodiment, the first mark 55A and the second mark 55B are provided at a distance from each other on the outer circumferential surface of the reduced diameter portion 54, but as shown in Fig. 10, in the backup pin 150, the first mark 155A and the second mark 155B may be provided in a band shape on the outer circumferential surface of the reduced diameter portion 54. In other words, the outer circumferential surface of the reduced diameter portion 54 may be colored in a band shape over the entire circumference, with the lower end portion of this colored portion being the first mark 155A and the upper end portion being the second mark 155B.

[0096] (6) In the above embodiment, the backup pin 50 has a reduced diameter portion 54, and the first mark 55A and the second mark 55B are provided on the reduced diameter portion 54. However, the portion of the backup pin 50 where the first mark 55A and the second mark 55B are provided is not limited to the reduced diameter portion 54. It is sufficient that the first mark and the second mark are provided at different positions in the vertical direction and can be recognized from above by a camera such as a board imaging camera. For example, the backup pin does not need to have a reduced diameter portion, and the first mark may be provided on the upper surface of the abutment portion and the second mark may be provided on the upper end surface of the backup pin.

[0097] (7) In the above embodiment, the first and second reference positions were the center positions of the backup pin 50 captured in the first and second images, respectively. However, the first and second reference positions may be any positions based on which the inclination of the backup pin can be calculated. (8) In the above embodiment, the display unit 31A is used as an example of a notification unit that notifies the operator of an error. However, a notification unit that notifies by sound, light, or the like may also be used.

[0098] (9) In the above embodiment, the board imaging camera 16 is used as the camera that captures the images of the first mark 55A and the second mark 55B. However, the camera that captures the images of the first mark and the second mark does not have to be a board imaging camera. (10) In the above embodiment, the tasks of positioning the backup pins 50, removing any abnormal backup pins 50, and removing the foreign objects 56 were performed by an operator. However, these tasks may be performed automatically by the component mounting device. (11) In the above embodiment, the vertical position of the backup pin 50 is fixed by the magnet 53A. However, the magnet may be omitted.

[0099] (12) In the above embodiment, the upper plate 22 has the hole edge portions of the multiple through holes 24 as an example of the multiple support portions. However, for example, the support portion may be a flat surface of a plate having a magnet embedded in the lower portion, and the backup pin may be supported on the plate only by the magnetic force of the magnet. [Explanation of symbols]

[0100] 1...component mounting device, 3...tape component supply device, 3A...feeder, 10...base, 11...transport conveyor, 11A...conveyor belt, 12...head unit, 13...head transport section, 13A...beam, 13B...Y-axis guide rail, 15...component imaging camera, 16...board imaging camera (one example of a camera), 17...mounting head, 17A...nozzle shaft, 17B...suction nozzle 20...backup device, 22...upper plate (one example of a plate), 23...lower plate, 24...through hole, 24A...regular through hole, 24B...alternative through hole, 25...support, 26...lifting mechanism, 26A...ball screw, 26B...ball nut, 26C...belt 30...control unit, 31...operation unit, 31A...display unit (one example of an alarm unit), 31B...input unit, 32...arithmetic processing unit, 33...motor control unit, 34...storage unit, 35...image processing unit, 36...external input / output unit, 37...feeder communication unit, 38...X-axis servo motor, 39...Y-axis servo motor, 40...Z-axis servo motor, 41...R-axis servo motor, 42...conveyor drive motor, 43...lifting motor, 44...sensors, 45...actuators 50, 150... backup pin, 51... large diameter portion, 52... small diameter portion, 53... abutment portion, 53A... magnet, 54... reduced diameter portion, 55A, 155A... first mark, 55B, 155B... second mark, 56... foreign matter 61, 71...first image, 62, 72...second image, 63, 73...composite image, 64, 74...first reference position, 65, 75...second reference position A: Work position, E: Part, P: Board, dX: Position deviation

Claims

1. A component mounting apparatus for mounting components on a substrate, comprising: A backup pin that backs up the substrate from below; a plate provided with a plurality of support portions capable of supporting the backup pin; a camera that captures an image of the backup pin supported by the support portion from above; A control unit, the backup pin includes a contact portion capable of contacting the support portion, the backup pin has a first mark and a second mark that are arranged at different positions in a vertical direction and can be recognized by the camera from above, the control unit acquires a first image by capturing an image of the first mark of the backup pin supported by the support unit with the camera; acquiring a second image by capturing an image of the second mark of the backup pin supported by the support portion with the camera; The component mounting device determines whether or not there is an abnormality in the backup pin by measuring an inclination of the backup pin based on the first image and the second image.

2. The component mounting device according to claim 1 , wherein the support portion is a hole edge portion of a through hole into which the backup pin can be inserted.

3. The control unit calculates a first reference position, which is a center position of the backup pin captured in the first image, from the first image; A second reference position, which is a center position of the backup pin shown in the second image, is calculated from the second image; calculating an inclination of the backup pin from an amount of positional deviation between the first reference position and the second reference position; 3. The component mounting device according to claim 1, wherein when the amount of misalignment is greater than a preset threshold value, it is determined that there is an abnormality in the backup pin.

4. the camera is a substrate imaging camera for recognizing a position of the substrate, The component mounting device according to claim 1 , wherein the board imaging camera is movable in a vertical direction.

5. The plate is disposed in a supporting position when backing up the substrate, The component mounting device according to claim 1 , wherein the plate is movable above the support position.

6. Further, a notification unit is provided, 6. The component mounting device according to claim 1, wherein when it is determined that there is an abnormality in the backup pin, the control unit notifies an operator via the notification unit that it is not possible to place the backup pin on the support portion.

7. Further, a display unit is provided, The component mounting device according to claim 1 , wherein when it is determined that the backup pin is abnormal, the control unit causes the display unit to display a position of the backup pin.

8. Further, a display unit is provided, 8. The component mounting device according to claim 1, wherein when it is determined that there is an abnormality in the backup pin, when it is preset that the backup pin can be arranged on another support part of the plurality of support parts instead of the support part, the control unit causes the display unit to display the position of the other support part.

Images