Probe Unit

Abstract

The probe unit according to the present invention comprises a contact probe with which electrodes to be contacted are contacted at both lengthwise direction ends, and a probe holder provided with an insulative body that holds the contact probe. Formed in the body are a holder hole in which the contact probe is inserted and held, and a counterbore that is bored in at least in a portion of the periphery of the holder hole in the surface of the contact probe on one or both of the end sides, an inner wall surface that forms a hollow space having insulating properties.

Description

[Technical field]

[0001] The present invention relates to a probe unit. [Background technology]

[0002] Conventionally, when testing the continuity or operating characteristics of a test object such as a semiconductor integrated circuit or a liquid crystal panel, a probe unit is used that includes a contact probe that establishes an electrical connection between the test object and a signal processing device that outputs a test signal, and a probe holder that houses a plurality of these contact probes.

[0003] In general, when inputting and outputting high-frequency electrical signals, signal loss called insertion loss occurs. In order to operate a probe unit at high speed with high accuracy, it is important to reduce this insertion loss in the frequency range used. For example, Patent Documents 1 to 3 disclose techniques for matching characteristic impedance. In Patent Document 1, an air layer is provided around the contact probe to adjust the characteristic impedance. In Patent Document 2, an insulating ring is provided in the contact probe to suppress fluctuations in the characteristic impedance of the entire probe. In Patent Document 3, a porous insulating member is provided around the contact probe to adjust the characteristic impedance.

[0004] Furthermore, as a technique for suppressing power supply loss at high frequencies, a technique has been disclosed in which a through hole is provided around the contact probe and the through hole is connected to earth (see, for example, Patent Document 4). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2020-020660 A [Patent Document 2] JP 2020-153723 A [Patent Document 3] JP 2018-179671 A [Patent Document 4] JP 2004-146103 A Summary of the Invention [Problem to be solved by the invention]

[0006] However, the techniques of Patent Documents 1 to 3 focus on matching characteristic impedance, and do not focus on the attenuation of high-frequency signals themselves. Therefore, even if the reflection loss can be reduced by matching characteristic impedance, the attenuation due to insertion loss may be large. Furthermore, even if a through hole is used as in Patent Document 4, the through hole has a large mismatch and the attenuation cannot be sufficiently suppressed.

[0007] The present invention has been made in view of the above, and has an object to provide a probe unit capable of suppressing attenuation of high-frequency signals. [Means for solving the problem]

[0008] In order to solve the above-mentioned problems and achieve the object, the probe unit of the present invention comprises a contact probe that contacts electrodes to be contacted at both longitudinal ends, and a probe holder having an insulating main body portion that holds the contact probe, wherein the main body portion is formed with a holder hole through which the contact probe is inserted and held, and a countersink portion that is bored around the holder hole and at least partially around the holder hole on at least one surface of one end side and the other end side of the contact probe, and has an insulating inner wall surface that forms a hollow space.

[0009] Moreover, in the above-mentioned probe unit according to the present invention, one or more of the countersunk portions are provided around the holder hole.

[0010] Moreover, in the probe unit according to the present invention, the main body portion is formed into a single layer.

[0011] In addition, in the probe unit according to the present invention, the main body is formed by laminating a plurality of members, and at least some of the members form a single layer made of a different insulating material.

[0012] In addition, the probe unit of the present invention is characterized in that, in the above invention, the main body is formed by stacking a first member made of an insulating material, a second member made of the same insulating material as the first member, and a third member provided between the first member and the second member and made of an insulating material different from that of the first member and the second member.

[0013] In addition, in the probe unit according to the present invention, in the above invention, the countersink portion has a first countersink portion provided on the first member side, penetrating the first member, and having a surface of the third member as a bottom surface, and a second countersink portion provided on the second member side, penetrating the second member, and having a surface of the third member as a bottom surface.

[0014] In addition, the probe unit of the present invention, in the above invention, is characterized in that the main body further has a fourth member provided on the side of the second member opposite the third member, and the holder hole comprises a first holder hole that penetrates the first to third members and forms a stepped space with an end on the first member side that tapers, and a second holder hole that penetrates the fourth member and is a through hole whose opening diameter is smaller than the diameter of the first holder hole.

[0015] In addition, in the probe unit according to the present invention, the countersunk portion has a bottomed hole shape.

[0016] In addition, in the probe unit according to the present invention, the countersunk portion is a through hole penetrating the main body portion.

[0017] In addition, the probe unit of the present invention is characterized in that, in the above invention, the contact probe has a first plunger that forms a bottomed hollow space and contacts one contact object, a second plunger that forms a bottomed hollow space and contacts the other contact object, and a coil spring that biases the first and second plungers, the first and second plungers are connected by linking their hollow spaces together, and the coil spring is located in the hollow space formed by the first and second plungers.

[0018] Furthermore, the probe unit according to the present invention is characterized in that, in the above invention, the probe holder holds a first contact probe connected to a signal electrode and a second contact probe connected to a ground electrode, and the contact probes of the probe holder are arranged such that at least one of the second contact probes is arranged around the first contact probe. Effect of the Invention

[0019] According to the present invention, it is possible to suppress attenuation of high-frequency signals. [Brief description of the drawings]

[0020] [Figure 1] FIG. 1 is a perspective view showing a configuration of a probe unit according to a first embodiment of the present invention. [Diagram 2] FIG. 2 is a cross-sectional view showing a configuration of a main part of the probe unit according to the first embodiment of the present invention. [Diagram 3] FIG. 3 is a plan view showing a configuration of a probe holder included in the probe unit according to the first embodiment of the present invention. [Figure 4] FIG. 4 is a plan view showing a configuration of a main part of the probe unit according to the first embodiment of the present invention. [Diagram 5] FIG. 5 is a diagram showing the insertion loss (S21) in the probe unit according to the first embodiment of the present invention. [Figure 6]FIG. 6 is a cross-sectional view showing a configuration of a main part of a probe unit according to a first modification of the first embodiment of the present invention. [Figure 7] FIG. 7 is a plan view showing a configuration of a main part of a probe unit according to the second modification of the first embodiment of the present invention. [Figure 8] FIG. 8 is a plan view showing a configuration of a main part of a probe unit according to the third modification of the first embodiment of the present invention. [Figure 9] FIG. 9 is a cross-sectional view showing a configuration of a main part of a probe unit according to the second embodiment of the present invention. [Figure 10] FIG. 10 is a diagram showing the insertion loss (S21) in the probe unit according to the second embodiment of the present invention. [Figure 11A] FIG. 11A is a diagram showing an example (sample No. 2) of a formation mode of a countersunk portion in a probe unit according to the second embodiment of the present invention. [Figure 11B] FIG. 11B is a diagram showing an example (sample No. 3) of a formation mode of the countersunk portion in the probe unit according to the second embodiment of the present invention. [Figure 11C] FIG. 11C is a diagram showing an example (sample No. 4) of a formation mode of the countersunk portion in the probe unit according to the second embodiment of the present invention. [Figure 11D] FIG. 11D is a diagram showing an example (sample No. 5) of a formation mode of the countersunk portion in the probe unit according to the second embodiment of the present invention. [Figure 11E] FIG. 11E is a diagram showing an example (sample No. 6) of a formation mode of the countersunk portion in the probe unit according to the second embodiment of the present invention. [Figure 11F] FIG. 11F is a diagram showing an example (sample No. 7) of a formation mode of the countersunk portion in the probe unit according to the second embodiment of the present invention. [Figure 12] FIG. 12 is a diagram showing the insertion loss (S21) of each sample. [Figure 13]FIG. 13 is a diagram showing one example (part 1) of a formation mode of a counterbore and a holder hole (contact probe) in a probe unit according to the second embodiment of the present invention. [Figure 14] FIG. 14 is a diagram showing one example (part 2) of a formation mode of a counterbore and a holder hole (contact probe) in a probe unit according to the second embodiment of the present invention. [Figure 15] FIG. 15 is a diagram showing one example (part 3) of a formation mode of a counterbore and a holder hole (contact probe) in a probe unit according to the second embodiment of the present invention. In FIG. [Figure 16] FIG. 16 is a cross-sectional view showing a configuration of a main part of a probe unit according to a first modification of the second embodiment of the present invention. [Figure 17] FIG. 17 is a cross-sectional view showing a configuration of a main part of a probe unit according to a second modification of the second embodiment of the present invention. [Figure 18] FIG. 18 is a cross-sectional view showing a configuration of a main part of a probe unit according to a third modification of the second embodiment of the present invention. [Figure 19] FIG. 19 is a diagram showing an example of a formation mode of a counterbore and a through hole in a probe unit according to the fourth modification of the second embodiment of the present invention. [Figure 20] FIG. 20 is a plan view illustrating a configuration of a probe holder included in a probe unit according to the third embodiment of the present invention. [Figure 21] FIG. 21 is a plan view showing a configuration of a probe holder included in a probe unit according to a fourth embodiment of the present invention. [Figure 22] FIG. 22 is a plan view showing a configuration of a probe holder included in a probe unit according to a fifth embodiment of the present invention. [Diagram 23] FIG. 23 is a plan view showing a configuration of a probe holder included in a probe unit according to a sixth embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0021] Hereinafter, the embodiments of the present invention will be described in detail with reference to the drawings. Note that the present invention is not limited to the following embodiments. Also, each drawing referred to in the following description merely shows the shape, size, and positional relationship in a schematic manner to the extent that the contents of the present invention can be understood, and therefore the present invention is not limited to only the shape, size, and positional relationship exemplified in each drawing.

[0022] (Embodiment 1) Fig. 1 is a perspective view showing a configuration of a probe unit according to a first embodiment of the present invention. The probe unit 1 shown in Fig. 1 is a device used when performing an electrical characteristic test on a semiconductor integrated circuit 100 that is an object to be tested, and is a device that electrically connects between the semiconductor integrated circuit 100 and a circuit board 200 that outputs a test signal to the semiconductor integrated circuit 100.

[0023] The probe unit 1 has conductive contact probes 2 (hereinafter simply referred to as "probes 2") that contact electrodes of two different contacted objects, a semiconductor integrated circuit 100 and a circuit board 200, at both ends of the longitudinal direction, a probe holder 3 that stores and holds the multiple probes 2 according to a predetermined pattern, and a holder member 4 that is provided around the probe holder 3 and prevents misalignment of the semiconductor integrated circuit 100 that comes into contact with the multiple probes 2 during testing.

[0024] FIG. 2 is a cross-sectional view showing a configuration of a main part of a probe unit according to the first embodiment of the present invention. The probe 2 shown in FIG. 2 is formed using a conductive material, and includes a first plunger 21 that contacts an electrode of the semiconductor integrated circuit 100 when the semiconductor integrated circuit 100 is inspected, a second plunger 22 that contacts an electrode of a circuit board 200 having an inspection circuit, and a coil spring 23 that is provided between the first plunger 21 and the second plunger 22 and connects the first plunger 21 and the second plunger 22 in an expandable and contractible manner. The first plunger 21, the second plunger 22, and the coil spring 23 that constitute the probe 2 have the same axis. When the semiconductor integrated circuit 100 is contacted, the coil spring 23 expands and contracts in the axial direction, thereby cushioning the impact on the electrode of the semiconductor integrated circuit 100 and applying a load to the semiconductor integrated circuit 100 and the circuit board 200. 2 shows the probe 2 in its most contracted state, but when no load is applied from the contacted object, the probe 2 expands due to the biasing force of the coil spring 23, and a part of the first plunger 21 and / or the second plunger 22 protrudes from the probe holder 3. In a natural state in which no load other than gravity is applied, the coil spring 23 may be configured as a loosely wound coil in which the wire is wound at predetermined intervals, or may be configured to have a tightly wound portion in which a part of the wire is wound in tight contact.

[0025] A bottomed hollow space 21a is formed in the first plunger 21. A portion of the second plunger 22 is inserted into and connected to the hollow space 21a. The coil spring 23 is located in the hollow space 21a. That is, the coil spring 23 is located in the internal space formed by the first plunger 21 and the second plunger 22.

[0026] The probe holder 3 includes a main body 31 formed of an insulating material such as resin, machinable ceramic, or silicon. The main body 31 is a single layer. The main body 31 is formed with a holder hole 32 for accommodating a plurality of probes 2, and a countersunk portion 33 having a groove shape provided around the holder hole 32. The position of the holder hole 32 is determined according to the wiring pattern of the semiconductor integrated circuit 100. The holder hole 32 and the probe 2 are prevented from coming off by engaging their respective steps with each other. For example, a step formed in the second plunger 22 and a step formed in the holder hole 32 are engaged with each other to prevent the probe 2 from coming off. The axis N shown in FIG. 2 indicates the central axis of the holder hole 32. FIG. 2 illustrates an example in which the central axis (axis N) of the holder hole 32 and the longitudinal axis of the probe 2 coincide with each other.

[0027] 3 is a plan view showing a configuration of the probe holder included in the probe unit according to the first embodiment of the present invention. The holder hole 32 is formed so as to go around the outer periphery of the probe holder 3. The counterbore portion 33 has a counterbore portion 33a which is formed by drilling a part of the surface on which one opening of the holder hole 32 is formed, and a counterbore portion 33b which is formed by drilling a part of the surface on which the other opening of the holder hole 32 is formed, and which forms a hollow space with a bottom. The counterbore portions 33a and 33b are provided around each of the holder holes 32.

[0028] The countersunk portion 33 has an insulating inner wall surface that forms a hollow space. Unlike a through hole or the like, the countersunk portion 33 does not have a conductive film formed thereon, and is a bottomed hole that is not electrically conductive.

[0029] When the semiconductor integrated circuit 100 is inspected, the coil spring 23 is compressed along the longitudinal direction due to a contact load from the semiconductor integrated circuit 100 (see FIG. 2, for example). When the coil spring 23 is compressed, the pitch of the wire becomes smaller. An inspection signal supplied from the circuit board 200 to the semiconductor integrated circuit 100 during inspection travels from the electrode of the circuit board 200 through the second plunger 22 and the first plunger 21 of the probe 2 to the electrode of the semiconductor integrated circuit 100. At this time, the inspection signal may pass through the coil spring 23.

[0030] Fig. 4 is a plan view showing the configuration of the main part of the probe unit according to the first embodiment of the present invention. Fig. 4 corresponds to a view seen from the top side of the probe holder shown in Fig. 2. Consider an example in which three adjacently arranged probes 2 have the central probe 2 in contact with an electrode for signal transmission and the remaining probes 2 connected to electrodes for ground. In this case, the probe 2 connected to the electrode for signal transmission is referred to as probe 2S, and the probe 2 connected to the electrode for ground is referred to as probe 2G. Countersunk portions 33 (only countersunk portion 33a is shown in Fig. 4) are formed around these probes 2S and 2G.

[0031] FIG. 5 is a diagram showing the insertion loss (S21) in the probe unit according to the first embodiment of the present invention. In the arrangement of the probe 2 and the counterbore portion 33a shown in FIG. 4, the depth of the counterbore portion 33a (depth D shown in FIG. 2) was changed, and the frequency at which S21 was −1 dB (insertion loss was +1 dB) was analyzed. In this analysis, the pitch between the probes 2 was set to 0.4 mm, and the thickness of the counterbore portion 33 of the main body portion 31 in the depth direction was set to 1.75 mm, and the analysis was performed using Ansys HFSS made by Ansys, Inc. Note that any known software can be used for the analysis. In addition, the analysis was performed assuming that the counterbore portion 33 is formed with the counterbore portions 33a and 33b as shown in FIG. 2. In this case, the depths of the counterbore portions 33a and 33b from the surface of the main body portion 31 are set to the same depth.

[0032] As shown in Fig. 5, it can be seen that the frequency at which -1 dB is reached is increased by forming the counterbore portions 33a and 33b. When the counterbore portion 33 is not provided (depth is zero), the frequency is 68.5 GHz, which is a lower value compared to the configuration in which the counterbore portion 33 is formed. Also, in Fig. 5, the counterbore depth of the counterbore portions 33a and 33b is 400 The frequency peaks at a depth of 1 μm, and decreases slightly at greater depths. When the countersunk portions 33a and 33b are connected to form a through hole, the frequency is 89.5 GHz.

[0033] In the above-described first embodiment, the insertion loss on the high frequency side can be reduced by providing the counterbore portion 33 around the probe 2 in the probe holder 3. According to the first embodiment, the formation of the counterbore portion 33 can suppress the attenuation of the high frequency signal.

[0034] Here, the above-mentioned counterbore 33 is a groove with an insulating inner wall, and is different from a through-hole with a conductive inner wall. The through-hole has a larger mismatch in characteristic impedance than the counterbore 33. For this reason, the through-hole causes a large reflection, and as a result, the transmitted signal has a narrow band.

[0035] In the above-described first embodiment, the countersunk portion 33 can be used as a mark for placement of the high frequency probe 2.

[0036] (First Modification of First Embodiment) Next, a first modification of the first embodiment will be described with reference to Fig. 6. Fig. 6 is a cross-sectional view showing a configuration of a main part of a probe unit according to a first modification of the first embodiment of the present invention. In the first embodiment described above, the countersunk portion 33a and the countersunk portion 33b are formed independently of each other, but in the first modification, the countersunk portion 33a and the countersunk portion 33b facing each other in the thickness direction of the main body portion 31 are connected to form the countersunk portion 33A serving as a through hole penetrating the main body portion 31.

[0037] In the first modification, similarly to the first embodiment described above, by providing a counterbore portion 33A around the periphery of the probe 2 in the probe holder 3, it is possible to reduce the insertion loss on the high frequency side.

[0038] In the above-mentioned first embodiment, the GSG structure in which the signal probe 2S is sandwiched between the ground probes 2G has been described as an example, but the arrangement of the probes 2 is not limited thereto, and it is sufficient that there is at least one probe 2G around the probe 2S in the arrangement of the probes 2. An example of a structure other than the GSG structure will be described below.

[0039] (Modification 2 of the First Embodiment) Next, a second modification of the first embodiment will be described with reference to Fig. 7. Fig. 7 is a plan view showing a configuration of a main part of a probe unit according to a second modification of the first embodiment of the present invention. Fig. 7 corresponds to a view seen from the top side of the probe holder shown in Fig. 2. Here, Variations In FIG. 7, of two adjacently disposed probes 2, one probe 2 is a probe 2S for signal transmission and the other probe 2 is a probe 2G for grounding. A counterbore 33 (only counterbore 33a is shown in FIG. 7) is formed around the probes 2S and 2G. Even in the case of this GS structure, by providing the counterbore 33 around the probe 2, the insertion loss on the high frequency side can be reduced.

[0040] (Third Modification of First Embodiment) Next, a third modification of the first embodiment of the present invention will be described with reference to Fig. 8. Fig. 8 shows a third modification of the first embodiment of the present invention. 38 is a plan view showing the configuration of the main parts of the probe unit. Fig. 8 corresponds to a view seen from the top side of the probe holder shown in Fig. 2. Here, in the third modification, of the four probes 2 arranged adjacent to each other, the two central probes 2 are probes 2S for signal transmission, and the two probes 2 on both sides are probes 2G for grounding. A counterbore 33 (only counterbore 33a is shown in Fig. 8) is formed around these probes 2S and 2G. Even in the case of this GSSG structure, by providing the counterbore 33 around the probe 2, the insertion loss on the high frequency side can be reduced.

[0041] (Embodiment 2) Next, a second embodiment of the present invention will be described. Fig. 9 is a cross-sectional view showing a configuration of a main part of a probe unit according to the second embodiment of the present invention. The probe unit according to the second embodiment includes a probe holder 3A instead of the probe holder 3 of the above-mentioned probe unit 1. The configuration other than the probe holder 3A is the same as that of the first embodiment, so the description will be omitted.

[0042] The probe holder 3A includes a main body 34 formed of an insulating material such as resin, machinable ceramic, or silicon. The main body 34 is a multi-layer structure formed by stacking a plurality of members formed of different insulating materials. The main body 34 is formed by stacking a first member 34a located on the upper surface side of FIG. 9, a second member 34b located on the lower surface side, and a third member 34c provided between the first member 34a and the second member 34b. The main body 34 is formed with a holder hole 341, which is a through hole penetrating the first member 34a, the second member 34b, and the third member 34c, for accommodating a plurality of probes 2. The position of the holder hole 341 is determined according to the arrangement pattern of the probes 2.

[0043] Here, the first member 34a to the third member 34c may be made of the same material, or at least one of them may be made of a different material. In the following, in the second embodiment, an example in which the first member 34a and the second member 34b are made of polyether ether ketone (PEEK), and the third member 34c is made of polytetrafluoroethylene (PTFE) will be described. From the viewpoint of improving the retention of the probe 2, it is preferable that the first member 34a to the second member 34b are made of a material having hardness. In terms of improving the high frequency characteristics, it is preferable that the first member 34a to the third member 34c are made of the same material having a low dielectric constant.

[0044] A plurality of countersunk portions 35 are formed in the first member 34a. A plurality of countersunk portions 36 are formed in the second member 34b. In the probe holder 3A shown in Fig. 9, the countersunk portions 35, 36 are through holes penetrating the members, are formed in the same number, and are formed at the same positions relative to the holder hole 341. The countersunk portions 35, 36 are in the shape of bottomed holes whose bottom faces the surface of the third member 34c.

[0045] FIG. 10 is a diagram showing the insertion loss (S21) in the probe unit according to the second embodiment of the present invention. In the probe 2 and the countersunk portions 35 and 36 shown in FIG. 9, the depth of the countersunk portion was changed, and the frequency at which S21 was −1 dB (insertion loss was +1 dB) was analyzed. The signal transmitted by the probe 2 and its arrangement were the same as those shown in FIG. 4. In this analysis, the pitch between the probes 2 was set to 0.4 mm, the thicknesses of the first member 34a and the second member 34b were set to 0.30 mm, and the thickness of the third member 34c was set to 1.15 mm, and the analysis was performed using Ansys HFSS made by Ansys, Inc. In this case, the depths of the countersunk portions 35 and 36 from the outer surface of the main body portion 34 were set to the same depth.

[0046] As shown in FIG. 10, it can be seen that the deeper the counterbore depth of the counterbore portions 35, 36, the higher the frequency at which -1 dB is reached. In particular, when the counterbore portions 35, 36 are not provided (zero depth), the frequency is 73.7 GHz, which is a lower value compared to the configuration in which the counterbore portions 35, 36 are formed. In this case, the frequency is highest at a depth of 300 μm where the counterbore portions 35, 36 penetrate the first member 34a and the second member 34b, and the bottom surface is the surface of the third member 34c. In addition, when the counterbore portions 35, 36 are connected to form a through hole penetrating the main body portion 34, the frequency is 100.0 GHz.

[0047] Furthermore, the frequency at which S21 is -1 dB (insertion loss is +1 dB) was analyzed by changing the number and positions of the counterbore portions formed in the holder hole 341. Seven samples with different counterbore portions were prepared. Each sample was numbered (No. 1 to No. 7), and No. 1 had no counterbore portions.

[0048] Hereinafter, the configurations of Samples No. 2 to No. 7 will be described with reference to Fig. 11A to Fig. 11F, which are diagrams showing examples (Samples No. 2 to No. 7) of the formation of recesses in the probe unit according to the second embodiment of the present invention.

[0049] Sample No. 2 has a counterbore on the main body 34. 35 In sample No. 2, in a cross section (hereinafter simply referred to as a cross section of the main body 34) taken along a plane parallel to the penetrating direction of the holder hole 341 and including the central axis of the holder hole 341, 35 However, one end side of the holder hole 341 (the first 1 Plunger 21 The structure is such that one is formed on each side.

[0050] In sample No. 3, countersunk portions 35, 36 are formed in main body portion 34 (see FIG. 11B). In sample No. 3, countersunk portions 35, 36 are formed one each for holder hole 341 in the cross section of main body portion 34.

[0051] Sample No. 4 has a counterbore in the main body 34. 35 In sample No. 4, in the cross section of the main body 34, there are two countersunk portions on both sides of the holder hole 341. 35 The above configuration is achieved by forming two of the above structures.

[0052] Sample No. 5 has a counterbore in the main body 34. 36 In the cross section of the main body 34 of sample No. 5, 2 Plunger 22 The holder hole 341 is sandwiched between two countersunk portions. 36 The above configuration is achieved by forming two of the above structures.

[0053] In sample No. 6, countersunk portions 35 and 36 are formed in the main body portion 34 (see FIG. 11E). 2 Plunger 22 Counterbore on side 36 is formed, and the 1 Plunger 21 The holder hole 341 is sandwiched between two countersunk portions. 35 The above configuration is achieved by forming two of the above structures.

[0054] In sample No. 7, countersunk portions 35 and 36 are formed in the main body portion 34 (see FIG. 11F). 7 In the cross section of the main body 34, two countersunk portions 35 are formed on the first plunger 21 side with the holder hole 341 in between, and two countersunk portions 36 are formed on the second plunger 22 side with the holder hole 341 in between. This configuration is the same as the configuration shown in FIG.

[0055] Fig. 12 is a diagram showing the insertion loss (S21) of each sample. The graph shown in Fig. 12 is the result of analyzing the frequency at which S21 is -1 dB (insertion loss is +1 dB) for each sample when the depth of the countersunk portion is 300 μm. In addition, in this analysis, similar to Fig. 10, the pitch between the probes 2 is 0.4 mm, and the thickness in the depth direction of the countersunk portions 35 and 36 of the main body portion 34 is 1.75 mm, and the analysis was performed using Ansys HFSS made by Ansys, Inc. In this case, the depths of the countersunk portions 35 and 36 from the outer surface of the main body portion 34 are set to the same depth.

[0056] As shown in FIG. 12, it can be seen that the frequency at which -1 dB is reached varies depending on the formation mode of the counterbore portions 35 and 36. In particular, the frequency is higher when even one counterbore portion is formed than sample No. 1, which does not have the counterbore portions 35 and 36. Furthermore, the configurations (samples No. 3 to No. 5) in which two counterbore portions are formed for the holder hole 341 have a higher frequency than sample No. 2, in which one counterbore portion is formed. Similarly, the configuration (sample No. 6) in which three counterbore portions are formed for the holder hole 341 has a higher frequency than samples Nos. 1 to 5, and the configuration (sample No. 7) in which four counterbore portions are formed has a higher frequency than sample No. 6. This shows that the frequency at which -1 dB is reached can be increased by forming the counterbore portions, and that the frequency can be further increased by increasing the number of counterbore portions formed. In particular, in the configurations (No. 6 and No. 7) in which three or more countersunk portions are provided, the frequency can be increased by 10 GHz or more compared to the configuration (No. 1) in which no countersunk portions are provided.

[0057] In addition, the holder hole 341 and the countersunk portion 35 、35AThe analysis described above was performed by changing the distance to. FIGS. 13 to 15 are diagrams showing an example of the formation mode of the countersink portion and the holder hole (contact probe) in the probe unit according to the second embodiment of the present invention. In the first member 34a shown in FIGS. 13 to 15, the formation position or size of the countersink portion 35 is different. Specifically, in the first member 34a shown in FIG. 13, the distance d1 between the axis N of the holder hole 341 and the edge on the holder hole 341 side of the countersink portion 35, and in the first member 34a shown in FIGS. 14 and 15, the distance d2 (<d1) between the axis N of the holder hole 341 and the edge on the holder hole 341 side of the countersink portion 35. Also, in the first member 34a shown in FIGS. 13 and 14, Counterbore 35 the width H1, and in the first member 34a shown in FIG. 15, Counterbore 35A the width H2 ( < H1). As a result of the analysis, the configuration shown in FIG. 13 is 84.4 GHz, the configuration shown in FIG. 14 is 106.7 GHz, and the configuration shown in FIG. 15 is 81.9 GHz. It can be said that the closer to the holder hole 341 and the larger the width, the higher the frequency at which -1 dB is reached.

[0058] In the second embodiment described above, in the probe holder 3A, by providing the countersink portions 35 and 36 around the probe 2, the insertion loss on the high-frequency side can be reduced. According to the second embodiment, by forming the countersink portions 35 and 36, the attenuation of the high-frequency signal can be suppressed.

[0059] Furthermore, in the second embodiment described above, by increasing the number of formed countersink portions, increasing the width, and approaching the holder hole, the frequency at which -1 dB is reached can be increased, and the attenuation of the high-frequency signal can be further suppressed.

[0060] Note that in the second embodiment described above, an example in which the probe holder 3A is configured with a three-layer structure of the first member 34a to the third member 34c has been described, but it may be configured with two layers or a plurality of layers of four or more layers, or a configuration in which a space is formed in part.

[0061] (Modification Example 1 of Embodiment 2) Next, a first modified example of the second embodiment of the present invention will be described. Fig. 16 is a cross-sectional view showing a configuration of a main part of a probe unit according to the first modified example of the second embodiment of the present invention. The probe unit according to the first modified example includes a probe 2A instead of the probe 2 of the above-mentioned probe unit 1, and a probe holder 3B instead of the probe holder 3. The configuration other than the probe 2A and the probe holder 3B is the same as that of the first embodiment, so a description thereof will be omitted.

[0062] The probe 2A includes a first plunger 21, a second plunger 22A, and a coil spring 23. The probe 2A has the same configuration as the probe 2, except that a flange portion 22a is formed on the side surface of the second plunger 22A.

[0063] The probe holder 3B includes a main body 34A formed of an insulating material such as resin, machinable ceramic, or silicon. The main body 34A is a multi-layer structure formed by stacking a plurality of members formed of different insulating materials. The main body 34A has a plate-shaped first member 34a, a second member 34d, a third member 34c, and a fourth member 34e. The first member 34a is located on the upper surface side in FIG. 16. The fourth member 34e is located on the lower surface side in FIG. 16. The second member 34d The third member 34c is provided between the first member 34a and the fourth member 34e. The main body 34A corresponds to a configuration in which the fourth member 34e is laminated on the second member 34b of the main body 34 according to the second embodiment. 34d and the third member 34c, and is formed with a holder hole 341 for accommodating a plurality of probes 2. The holder hole 341 corresponds to a first holder hole that forms a stepped space with a tapered end on the first member side.

[0064] The first member 34a to the fourth member 34e may be made of the same material, or at least one of them may be made of a different material, as in embodiment 2. Also, an example will be described in which the sum of the thicknesses of the second member 34d and the fourth member 34e is the same as the thickness of the second member 34b in embodiment 2, but the thickness relationship is not limited to this.

[0065] A plurality of countersunk portions 36a are formed in the second member 34d. The countersunk portions 36a are through holes that penetrate the member, and are formed in the same number as the countersunk portions 35, and are formed in the same relative positions with respect to the holder hole 341. The countersunk portions 36a are in the shape of a bottomed hole, with the surfaces of the third member 34c and the fourth member 34e as the bottom surface. This hole shape becomes a closed space that is blocked by the third member 34c and the fourth member 34e.

[0066] A through hole 342 is formed in the fourth member 34e, penetrating in the plate thickness direction. The through hole 342 is provided corresponding to the holder hole 341, and the size of the opening is smaller than that of the holder hole. The diameter of the through hole 342 in a direction perpendicular to the penetrating direction is smaller than the diameter of the holder hole 341. Note that when the cross section of the through hole perpendicular to the penetrating direction is other than a circle, the above-mentioned "diameter" corresponds to the diameter of one side, a diagonal, or a circumscribing circle of the cross-sectional shape. The flange portion 22a of the probe 2A is engaged with a step formed by the holder hole 341 and the through hole 342, thereby preventing the flange portion 22a from falling off from the fourth member 34e.

[0067] In the above-mentioned first modification, the probe holder 3B is provided with the countersunk portions 35, 36a around the probe 2A, thereby reducing the insertion loss on the high frequency side. According to the first modification, the formation of the countersunk portions 35, 36a can suppress the attenuation of the high frequency signal.

[0068] Furthermore, in the above-mentioned variant example 1, a fourth member 34e is provided in which a through hole 342 is formed that partially blocks the holder hole 341 of the second member 34d, and the flange portion 22a provided on the probe 2A is engaged with the fourth member 34e, thereby more reliably preventing the probe 2A from falling off.

[0069] (Modification 2 of the second embodiment) Next, a second modification of the second embodiment of the present invention will be described. Fig. 17 is a cross-sectional view showing a configuration of a main part of a probe unit according to the second modification of the second embodiment of the present invention. The probe unit according to the second modification includes a probe 2A instead of the probe 2 of the above-mentioned probe unit 1, and a probe holder 3C instead of the probe holder 3. The configuration other than the probe holder 3C is the same as in the first embodiment and the first modification, so a description thereof will be omitted.

[0070] The probe holder 3C includes a main body 34B formed of an insulating material such as resin, machinable ceramic, or silicon. The main body 34B is a multi-layer structure formed by stacking a plurality of members formed of different insulating materials. The main body 34B has a plate-shaped first member 34a, a second member 34d, a third member 34c, and a fourth member 34f. The first member 34a is located on the upper surface side in FIG. 17. The fourth member 34f is located on the lower surface side in FIG. 17. The second member 34d The third member 34c is provided between the first member 34a and the fourth member 34f. The main body 34B corresponds to a configuration in which the fourth member 34f is laminated on the second member 34b of the main body 34 according to the second embodiment.

[0071] The first member 34a to the fourth member 34f may be made of the same material, or at least one of them may be made of a different material, as in Modification 1 of Embodiment 2. Also, an example will be described in which the sum of the thicknesses of the second member 34d and the fourth member 34f is the same as the thickness of the second member 34b in Embodiment 2, but the thickness relationship is not limited to this.

[0072] The second member 34d has a plurality of countersunk portions 36a formed therein. The countersunk portions 36a are shaped like holes with a bottom, the bottom of which is the surface of the third member 34c.

[0073] The fourth member 34f is formed with through holes 342 and 343 penetrating in the plate thickness direction. The through hole 342 is provided corresponding to the holder hole 341, and the size of the opening is smaller than that of the holder hole. The through hole 343 is provided corresponding to the countersunk portion 36a, and the size of the opening is the same as that of the countersunk portion 36a. That is, the countersunk portion 36a and the through hole 343 form a space that extends while maintaining the same shape. In other words, when the countersunk portion 36a forms a hole shape that extends in a circular shape, the through hole 343 also forms an elongated hole shape in a similar circular shape, and when the countersunk portion 36a forms a hole shape that extends in an elongated hole shape, the through hole 343 also forms a hole shape that extends in a similar elongated hole shape.

[0074] In the above-mentioned modified example 2, the probe holder 3C is provided with the counterbore portions 35, 36a around the probe 2A, and the fourth member 34f is provided with the through hole 343, thereby making it possible to reduce the insertion loss on the high frequency side. According to this modified example 2, the formation of the counterbore portions 35, 36a and the through hole 343 makes it possible to suppress the attenuation of the high frequency signal.

[0075] Furthermore, in the above-mentioned modified example 2, a fourth member 34f is provided in which a through hole 342 is formed that partially blocks the holder hole 341 of the second member 34d, and the flange portion 22a provided on the probe 2A is engaged with the fourth member 34f, thereby more reliably preventing the probe 2A from falling off.

[0076] (Third Modification of the Second Embodiment) Next, a third modification of the second embodiment of the present invention will be described. Fig. 18 is a cross-sectional view showing a configuration of a main part of a probe unit according to the third modification of the second embodiment of the present invention. The probe unit according to the third modification includes a probe 2A instead of the probe 2 of the above-mentioned probe unit 1, and a probe holder 3D instead of the probe holder 3. The configuration other than the probe holder 3D is the same as in the first embodiment and the first modification, so a description thereof will be omitted.

[0077] The probe holder 3D includes a main body 34C formed of an insulating material such as resin, machinable ceramic, or silicon. The main body 34C is a multi-layer structure formed by stacking a plurality of members formed of different insulating materials. The main body 34C has a plate-shaped first member 34a, a second member 34d, a third member 34c, and a fourth member 34g. The first member 34a is located on the upper surface side in FIG. 18. The fourth member 34g is located on the lower surface side in FIG. 18. The second member 34d and the third member 34c is the first member 34a and the fourth member 34g The main body 34C corresponds to a configuration in which the fourth member 34g is laminated on the second member 34b of the main body 34 according to the second embodiment.

[0078] The first member 34a to the fourth member 34g may be made of the same material, or at least one of them may be made of a different material, as in Modification 1 of Embodiment 2. Also, an example will be described in which the sum of the thicknesses of the second member 34d and the fourth member 34g is the same as the thickness of the second member 34b in Embodiment 2, but the thickness relationship is not limited to this.

[0079] The second member 34d has a plurality of countersunk portions 36a formed therein. The countersunk portions 36a are shaped like holes with a bottom, the bottom of which is the surface of the third member 34c.

[0080] The fourth member 34g is formed with through holes 342, 344 penetrating in the plate thickness direction. The through hole 342 is provided corresponding to the holder hole 341, and the opening size is smaller than that of the holder hole. The through hole 344 is provided corresponding to the countersunk portion 36a, and the opening size is smaller than that of the countersunk portion 36a. In other words, a stepped space is formed by the countersunk portion 36a and the through hole 344. Note that the countersunk portion 36a and the through hole 344 have a similar relationship in the shapes of the openings, and when the countersunk portion 36a forms a hole shape that extends in a circular shape, the through hole 344 also forms an elongated hole shape that similarly forms a circular shape, and the countersunk portion 36a forms a stepped hole shape that extends in a circular shape. 36a When the through hole 344 is formed to have a hole shape that extends in an elongated hole shape, the through hole 344 is also formed to have a hole shape that extends in a similar elongated hole shape.

[0081] In the above-mentioned modified example 3, the probe holder 3D is provided with the counterbore portions 35, 36a around the probe 2A, and the fourth member 34g is provided with the through hole 344, thereby making it possible to reduce the insertion loss on the high frequency side. According to this modified example 3, the formation of the counterbore portions 35, 36a and the through hole 344 makes it possible to suppress the attenuation of high frequency signals.

[0082] Furthermore, in the above-mentioned third modified example, a fourth member 34g is provided in which a through hole 342 is formed that partially blocks the holder hole 341 of the second member 34d, and the flange portion 22a provided on the probe 2A is engaged with the fourth member 34g, thereby more reliably preventing the probe 2A from falling off.

[0083] (Fourth Modification of the Second Embodiment) Next, a fourth modification of the second embodiment of the present invention will be described. Fig. 19 is a diagram showing an example of a formation mode of a countersink portion and a through hole in a probe unit according to the fourth modification of the second embodiment of the present invention. The probe unit according to the fourth modification includes a main body portion 34D instead of the main body portion 34A according to the first modification of the second embodiment. The configuration other than the main body portion 34D is the same as that of the first embodiment and the first modification, so a description thereof will be omitted.

[0084] The main body 34D is made of an insulating material such as resin, machinable ceramic, or silicon. The main body 34D is a multi-layer structure made by stacking a plurality of members made of different insulating materials. The main body 34D has a plate-shaped first member 34a, a second member 34d, a third member 34c (see FIG. 16, etc.), and a fourth member 34h.

[0085] The fourth member 34h has through holes 342 and 345 formed therethrough in the plate thickness direction. A plurality of through holes 345 are provided corresponding to the countersunk portions 36a. The through holes 345 are provided, for example, within the formation area of ​​the countersunk portions 36a and at positions where the probe 2A is sandwiched.

[0086] In the above-mentioned fourth modification, the probe holder is provided with the counterbore portions 35, 36a around the probe 2A, and the fourth member 34h is provided with the through hole 345, thereby reducing the insertion loss on the high frequency side. According to the fourth modification, the formation of the counterbore portions 35, 36a and the through hole 345 makes it possible to suppress the attenuation of the high frequency signal.

[0087] In addition, the fourth members 34e to 34h that function as lids for the holder hole 341 in comparison with the third member 34c can be applied to the first embodiment. For example, in the configuration shown in Fig. 2, by replacing the probe 2 with the probe 2A and providing a fourth member on the countersunk portion 33b side, the probe 2A can be prevented from coming off.

[0088] (Embodiment 3) Next, a third embodiment of the present invention will be described. Fig. 20 is a plan view showing a configuration of a probe holder included in a probe unit according to the third embodiment of the present invention. The probe unit according to the third embodiment includes a probe holder 3E instead of the probe holder 3 of the above-mentioned probe unit 1. The configuration other than the probe holder 3E is the same as that of the first embodiment, so a description thereof will be omitted.

[0089] The probe holder 3E includes a main body 31 formed of an insulating material such as resin, machinable ceramic, or silicon. The probe holder 3E is formed with a holder hole 32 for accommodating a plurality of probes 2, and a groove-shaped counterbore portion provided around the holder hole 32. In FIG. 20, only one of the counterbore portions 37 formed in the main body 31 is shown. In FIG. 20, the counterbore portion 37 is shown by a dashed line to distinguish the holder hole 32 from the counterbore portion 37. The counterbore portion 37 has a circular opening of the same size as the opening of the holder hole 32. The counterbore portion 37 is formed around the holder hole 32.

[0090] In the above-mentioned third embodiment as well, by providing the counterbore 37 around the periphery of the probe 2, the insertion loss on the high frequency side can be reduced.

[0091] (Embodiment 4) Next, a fourth embodiment of the present invention will be described. Fig. 21 is a plan view showing a configuration of a probe holder included in a probe unit according to the fourth embodiment of the present invention. The probe unit according to the fourth embodiment includes a probe holder 3F instead of the probe holder 3 of the above-mentioned probe unit 1. The configuration other than the probe holder 3F is the same as that of the first embodiment, so a description thereof will be omitted.

[0092] The probe holder 3F includes a main body 31 formed using an insulating material such as resin, machinable ceramic, or silicon. The probe holder 3F is formed with holder holes 32 for accommodating multiple probes 2, and a groove-shaped countersunk portion provided around the holder holes 32. In FIG. 21, only one of the countersunk portions 38 formed in the main body 31 is shown. The countersunk portion 38 is annularly grooved and extends along the multiple holder holes 32.

[0093] In the above-mentioned fourth embodiment as well, by providing the counterbore 38 around the periphery of the probe 2, the insertion loss on the high frequency side can be reduced.

[0094] (Embodiment 5) Next, a fifth embodiment of the present invention will be described. Fig. 22 is a plan view showing a configuration of a probe holder included in a probe unit according to the fifth embodiment of the present invention. The probe unit according to the fifth embodiment includes a probe holder 3G instead of the probe holder 3 of the above-mentioned probe unit 1. Probe holder 3G The rest of the configuration is the same as in the first embodiment, so the description will be omitted.

[0095] The probe holder 3G includes a main body 31 formed of an insulating material such as resin, machinable ceramic, or silicon. The probe holder 3G includes holder holes 32 for accommodating multiple probes 2, and groove-shaped countersunk portions provided around the holder holes 32. In FIG. 22, only one of the countersunk portions 39A and 39B formed in the main body 31 is shown. In FIG. 22, the countersunk portion 39B is shown by a dashed line to distinguish the holder holes 32 from the countersunk portion 39B. The countersunk portion 39A has an elongated hole shape extending along the multiple holder holes 32. The countersunk portion 39B has a circular opening of the same size as the opening of the holder holes 32.

[0096] In the above-mentioned fifth embodiment as well, by providing the counterbore portions 39A and 39B around the periphery of the probe 2, the insertion loss on the high frequency side can be reduced.

[0097] (Embodiment 6) Next, a sixth embodiment of the present invention will be described. Fig. 23 is a plan view showing a configuration of a probe holder included in a probe unit according to a sixth embodiment of the present invention. 6 The probe unit according to this embodiment includes a probe holder 3H instead of the probe holder 3 of the above-described probe unit 1. The configuration other than the probe holder 3H is the same as that of the first embodiment, and therefore description thereof will be omitted.

[0098] The probe holder 3H includes a main body 31 formed of an insulating material such as resin, machinable ceramic, or silicon. The probe holder 3H is formed with a holder hole 32 for accommodating a plurality of probes 2, and a groove-shaped counterbore portion provided around the holder hole 32. In FIG. 23, only one of the counterbore portions 40 formed in the main body 31 is shown. In FIG. 23, the counterbore portion 40 is shown by a dashed line to distinguish the holder hole 32 from the counterbore portion 40. The counterbore portion 40 has a circular opening of the same size as the opening of the holder hole 32. Some of the plurality of counterbore portions 40 are connected to each other.

[0099] In the sixth embodiment described above, by providing the counterbore 40 around the periphery of the probe 2, the insertion loss on the high frequency side can also be reduced.

[0100] In this manner, the present invention may include various embodiments not described here, and various design modifications may be made without departing from the technical idea defined by the claims.

[0101] In the above-mentioned first to sixth embodiments, examples have been described in which the opening of the countersunk portion has an oval or circular shape, but other shapes such as a letter shape, a polygon, a star, etc. By making the opening have a specific shape, the visibility of the countersunk portion is improved, and the placement of the probe 2 can be easily confirmed.

[0102] The contact probe configuration described here is merely an example, and various types of conventionally known probes can be applied. For example, the probe is not limited to the above-mentioned probe configured with a plunger and a coil spring, but may be a probe including a pipe member, a pogo pin, a solid conductive member, a conductive pipe, a wire, or a connection terminal (connector) that connects electrical contacts, or these probes may be combined as appropriate. [Industrial Applicability]

[0103] As described above, the probe unit according to the present invention is suitable for suppressing attenuation of high-frequency signals. [Explanation of symbols]

[0104] 1 Probe unit 2 Contact probe (probe) 3, 3A~3H Probe holder 21 First plunger 22 Second plunger 23 Coil spring 31, 34 Main body 32, 341 Holder hole 33, 33a, 33b, 35, 36, 36a, 37, 38, 39A, 39B counterbore 34a First member 34b, 34d Second member 34c Third member 34e~34h 4th component 100 Semiconductor integrated circuit 200 Circuit Board

Claims

1. a contact probe that contacts the electrodes to be contacted at both ends in a longitudinal direction; a probe holder having an insulating main body portion for holding the contact probe; Equipped with The main body portion includes: a holder hole through which the contact probe is inserted and held; a countersunk portion that is formed around the holder hole, at least in a part of the periphery of the holder hole on at least one of the surfaces on the one end side and the other end side of the contact probe, the countersunk portion having an insulating inner wall surface that forms a hollow space and a bottom surface that is not open; A probe unit comprising:

2. The countersunk portion is One or more of the holder holes are provided around the holder holes, The probe unit according to claim 1 .

3. The main body portion is a single layer.

3. The probe unit according to claim 1 or 2.

4. The main body is formed by laminating a plurality of members, and at least some of the members form a single layer made of a different insulating material.

3. The probe unit according to claim 1 or 2.

5. The main body portion is A first member made of an insulating material; A second member made of the same insulating material as the first member; a third member provided between the first member and the second member and made of an insulating material different from that of the first member and the second member; 5. The probe unit according to claim 4, wherein:

6. The countersunk portion is a first counterbore provided on the first member, penetrating the first member, and having a bottom surface on a surface of the third member; a second countersunk portion provided on the second member, penetrating the second member, and having a bottom surface on a surface of the third member; The probe unit according to claim 5, further comprising:

7. The main body portion is a fourth member provided on the second member opposite to the third member; and The holder hole is a first holder hole that penetrates the first to third members and forms a stepped space with an end portion on the first member side tapered; a second holder hole that is a through hole that penetrates the fourth member and has an opening diameter smaller than a diameter of the first holder hole; 6. The probe unit according to claim 5, comprising:

8. The contact probe includes: a first plunger that defines a bottomed hollow space and that comes into contact with one of the contact objects; a second plunger that forms a bottomed hollow space and comes into contact with another contact object; a coil spring that biases the first and second plungers; having The first and second plungers are connected such that their hollow spaces are connected to each other, The coil spring is located in a hollow space formed by the first and second plungers. The probe unit according to any one of claims 1 to 7.

9. the probe holder holds a first contact probe connected to a signal electrode and a second contact probe connected to a ground electrode; In the arrangement of the contact probes in the probe holder, at least one of the second contact probes is arranged around the first contact probe. The probe unit according to any one of claims 1 to 8.

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