Power Conversion Equipment

Abstract

To provide a power conversion device capable of obtaining a noise suppression effect by fixing a housing to a vehicle-side member.SOLUTION: A power conversion device 1 has a plurality of semiconductor modules 2, a smoothing capacitor 3, and a housing 5 that houses the semiconductor modules 2 and the smoothing capacitor 3. The power conversion device 1 is equipped with conductive shield layers 41, 42. The shield layers 41, 42 are built in the housing 5. The shield layers 41, 42 are provided between a housing inner surface 5a and a housing outer surface 5b of a housing body 50. The power conversion device 1 is equipped with a collar member 8 integrally provided on the housing 5 to fix the housing 5 to a vehicle-side installation stand 13 using a fixture 12. The collar member 8 is electrically conductive and allows the fixture 12 to be inserted therethrough. The collar member 8 and the shield layers 41, 42 are connected in a conductive manner.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The disclosure herein relates to power conversion devices. [Background technology]

[0002] Patent Document 1 describes a microphone equipped with a case in which a plating layer is formed on a case body made of resin. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2008-67383 A Summary of the Invention [Problem to be solved by the invention]

[0004] The device of Patent Document 1 requires components such as an adhesive, a PCB substrate, a connection pattern, a connection terminal, etc., to ground the case. According to this device, there is ample room for improvement in the configuration for achieving blocking of noise such as electromagnetic waves and grounding, and improvements are required.

[0005] An object of the present disclosure is to provide a power conversion device in which a noise suppression effect can be obtained by fixing a housing to a vehicle-side member. [Means for solving the problem]

[0006] The various aspects disclosed in this specification employ different technical means to achieve their respective objectives. The reference symbols in parentheses in the claims and in this section are merely examples showing the corresponding relationship with the specific means described in the embodiments described below as one aspect, and do not limit the technical scope.

[0007] In order to achieve the above object, the disclosed embodiment comprises: A power conversion device (1) for converting electric power, A plurality of semiconductor modules (2); A capacitor (3, 4) electrically connected to the semiconductor module; A housing (5) that houses a semiconductor module and a capacitor; a built-in shield layer (41, 42) which is a conductive layer and is built between an inner surface (5a) and an outer surface (5b) of the housing and extends so as to cover an internal space (5c) of the housing; a collar member (8, 108) that is provided integrally with the housing in order to fix the housing to a vehicle-side member (13) using a fastener (12), the collar member having electrical conductivity and through which the fastener can be inserted; a conductive connection portion (43, 45, 81) that electrically connects the built-in shield layer and the collar member in a conductive manner; As a collar member, a through-hole collar member (8) is provided in a state where it passes through a fixed portion (513) of a housing that is fixed to a vehicle side member; Equipped with The collar member and the built-in shielding layer are electrically connected to each other. And, The conductive connection portion is embedded in the fixed portion and is in contact with both the embedded shield layer and the collar member. It is a power conversion device. The disclosed aspect comprises: A power conversion device (1) for converting electric power, A plurality of semiconductor modules (2); A capacitor (3, 4) electrically connected to the semiconductor module; A housing (5) that houses a semiconductor module and a capacitor; a built-in shield layer (41, 42) which is a conductive layer and is built between an inner surface (5a) and an outer surface (5b) of the housing and extends so as to cover an internal space (5c) of the housing; a collar member (8, 108) that is provided integrally with the housing in order to fix the housing to a vehicle-side member (13) using a fastener (12), the collar member having electrical conductivity and through which the fastener can be inserted; a conductive collar member (108) that electrically connects the vehicle side member and the built-in shield layer; Equipped with The collar member and the built-in shielding layer are electrically connected to each other, The conductive collar member is a vehicle side contact portion (8b) in contact with a vehicle side member; a shield-side contact portion (8c) embedded in the housing so as to contact the built-in shield layer; The power conversion device has the following features.

[0008] According to the above aspect, the built-in shielding layer can be grounded to the vehicle-side member through the collar member by fixing the housing to the vehicle-side member using the fastener inserted into the collar member. This provides a configuration in which electromagnetic noise transmitted to the built-in shielding layer is transferred to the vehicle-side member through the collar member. Therefore, a power conversion device that can obtain a noise suppression effect by fixing the housing to the vehicle-side member can be provided.

[0009] Moreover, the built-in shielding layer is built into the housing between the inner and outer surfaces, which makes it difficult for the built-in shielding layer to peel off from the inner or outer surface of the housing, thereby reducing the noise suppression effect of the built-in shielding layer. This makes it possible to maintain the noise suppression effect of the built-in shielding layer in the housing. [Brief description of the drawings]

[0010] [Figure 1] 1 is a circuit diagram of a power conversion device according to a first embodiment. [Diagram 2] 1 is a cross-sectional view showing a schematic configuration of a power conversion device according to a first embodiment. [Diagram 3] FIG. 4 is a cross-sectional view showing a schematic configuration of a power conversion device according to a second embodiment. [Figure 4] FIG. 11 is a cross-sectional view showing a schematic configuration of a power conversion device according to a third embodiment. [Diagram 5] FIG. 11 is a partial cross-sectional view showing a power conversion device according to a fourth embodiment. [Figure 6] FIG. 13 is a partial cross-sectional view showing a power conversion device according to a fifth embodiment. [Figure 7] FIG. 13 is a partial cross-sectional view showing a power conversion device according to a sixth embodiment. [Figure 8] FIG. 13 is a cross-sectional view showing a schematic configuration of a power conversion device according to a seventh embodiment. [Figure 9] FIG. 13 is a cross-sectional view showing a schematic configuration of a power conversion device according to an eighth embodiment. [Figure 10] FIG. 13 is a cross-sectional view showing a schematic configuration of a power conversion device according to a ninth embodiment. [Figure 11]FIG. 23 is a partial cross-sectional view showing a power conversion device according to a tenth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, a number of embodiments for carrying out the present disclosure will be described with reference to the drawings. In each embodiment, the same reference numerals may be used to designate parts corresponding to matters described in the preceding embodiment, and duplicated descriptions may be omitted. In each embodiment, when only a part of the configuration is described, other embodiments described previously may be applied to other parts of the configuration. In addition to combinations of parts that are specifically indicated as being possible in each embodiment, it is also possible to partially combine embodiments even if not indicated, as long as there is no particular problem with the combination.

[0012] First Embodiment A first embodiment disclosing an example of a power conversion device will be described with reference to Figs. 1 and 2. The power conversion device can be applied to an on-board power conversion device mounted on a vehicle such as an electric vehicle or a hybrid vehicle. A power conversion device capable of achieving the object specified in the specification can be applied to, for example, an inverter device, a converter device, etc. In this embodiment, a power conversion device applied to an inverter device will be described below.

[0013] The power conversion device 1 includes an inverter circuit 200. As shown in FIG. 1, the inverter circuit 200 includes a plurality of semiconductor modules 2. The semiconductor modules 2 each include a semiconductor element 20, which is turned on and off to convert DC power supplied from a DC power source 100 into AC power. The semiconductor element 20 is, for example, an IGBT element. The vehicle runs by driving a three-phase AC motor 110 using the obtained AC power. The smoothing capacitor 3 is connected in parallel to the semiconductor module 2. One of the Y capacitors 4 is connected to the positive wiring and is connected to the ground. One of the Y capacitors 4 is connected to the negative wiring and is connected to the ground. In the vehicle, the Y capacitor 4 is electrically connected to a body ground such as a chassis via a case ground of the power conversion device 1.

[0014] As shown in Fig. 2, the power conversion device 1 includes a housing 5 that houses electric components. The housing 5 houses a plurality of semiconductor modules 2, a smoothing capacitor 3, a Y capacitor 4, a control circuit board, etc. The smoothing capacitor 3 is connected to the semiconductor module 2 so that electricity can be passed therethrough. The smoothing capacitor 3 and the Y capacitor 4 are fixed to the housing 5. The smoothing capacitor 3 and the Y capacitor 4 are fixed to a support base 62 by fasteners 61 such as bolts, screws, rivets, or other connecting means such as welding or brazing. Hereinafter, the smoothing capacitor 3 and the Y capacitor 4 may be collectively referred to as capacitors.

[0015] The support base 62 is provided integrally with the housing 5 or is attached to the housing 5. The support base 62 is formed of the same material as the housing 5 or a different material. The support base 62 is connected to the capacitor via a connecting member 6 such as a terminal or a bus bar. With this configuration, the capacitor and the support base 62 are connected in a conductive state. The support base 62 has a supporting conductive part (not shown). The supporting conductive part is formed to include a conductive material such as a metal material and has conductivity. The supporting conductive part is connected to the connecting member 6 in a conductive manner.

[0016] The housing 5 forms a container. The housing 5 has an internal space 5c. The housing 5 has a housing inner surface 5a and a housing outer surface 5b. The housing inner surface 5a is the inner surface of the housing 5 and forms the internal space 5c. The housing outer surface 5b is the outer surface of the housing 5 and extends along the housing inner surface 5a.

[0017] The housing 5 has a housing body 50, shield layers 41, 42, and connection layers 43, 44. The shield layers 41, 42 and connection layers 43, 44 are built into the housing body 50, and thus built into the housing 5. The housing body 50 forms a housing inner surface 5a and a housing outer surface 5b. The housing body 50 forms an internal space 5c and extends along the internal space 5c. The housing body 50 is a resin molded product formed containing a resin material. The housing body 50 is a resin part of the housing 5. The housing body 50 has electrical insulation properties. The housing body 50 has the shield layers 41, 42 and connection layers 43, 44 built into it, and corresponds to a shield built-in part. The housing body 50 is in a state where the shield layers 41, 42 and connection layers 43, 44 are covered. The shield layers 41, 42 and connection layers 43, 44 are molded integrally with the resin part of the housing 5 by insert molding when the housing 5 is molded.

[0018] The housing 5 is formed by combining a plurality of case members. The housing 5 includes at least a first case member and a second case member. For example, the first case member is a lower case 51 that surrounds the periphery of the control circuit board, the semiconductor module 2, the capacitor, etc. The control circuit board, the semiconductor module 2, the capacitor, etc. are housed in an internal space 5c of the housing 5. For example, they are housed in the internal space of the lower case 51. For example, the second case member is a cover member 52 that is attached to the lower case 51 so as to cover the internal space of the lower case 51. The cover member 52 is fixed integrally to the lower case 51 so as to cover the upper part of the lower case 51.

[0019] The lower case 51 integrally includes a bottom wall 510, a side wall 511 erected from the periphery of the bottom wall 510, a joint portion 512, and a fixed portion 513. The bottom wall 510 corresponds to the bottom of the housing 5, and has the semiconductor module 2, the support base 62, the capacitor, etc. disposed thereon. The side wall 511 is a peripheral wall that surrounds the periphery of the semiconductor module 2 and the capacitor and extends upward perpendicularly to the bottom wall 510. The side wall 511 and the bottom wall 510 define an internal space of the lower case 51.

[0020] The cover member 52 integrally includes a top wall portion 520, a side wall portion 521 erected from the periphery of the top wall portion 520, and a joint portion 522. The top wall portion 520 corresponds to the ceiling portion of the housing 5, and covers the semiconductor module 2, the support base 62, the capacitor, etc. from above. The side wall portion 521 is a peripheral wall extending downward perpendicular to the top wall portion 520. The side wall portion 521 and the top wall portion 520 form an upper portion of the internal space of the lower case 51.

[0021] The shield layers 41, 42 are conductive and provided in the housing 5 to cover the internal space 5c. The shield layers 41, 42 are built into the housing 5 by being built into the housing main body 50, and correspond to built-in shielded layers. The shield layers 41, 42 are embedded in the housing main body 50. The shield layers 41, 42 are provided between the housing inner surface 5a and the housing outer surface 5b, and extend in layers along the internal space 5c. The shield layers 41, 42 are located at positions spaced apart from both the housing inner surface 5a and the housing outer surface 5b in the thickness direction of the surface forming portion.

[0022] The housing body 50 has a housing inside part 50a and a housing outside part 50b. The housing inside part 50a forms the housing inner surface 5a, and is an inside part of the shield layers 41, 42 in the housing body 50. The housing inside part 50a includes a case inside part 51a and a cover inside part 52a. The housing outside part 50b forms the housing outer surface 5b, and is an outside part of the shield layers 41, 42 in the housing body 50. The housing outside part 50b includes a case outside part 51b and a cover outside part 52b. The shield layers 41, 42 are provided between the housing inside part 50a and the housing outside part 50b. The shield layers 41, 42 extend along the boundary between the housing inside part 50a and the housing outside part 50b. The housing inside part 50a corresponds to the built-in inside part, and the housing outside part 50b corresponds to the built-in outside part.

[0023] The lower case 51 has a case shield layer 41, a case connection layer 43, and a case built-in portion 51c. The case shield layer 41 is built into the case built-in portion 51c, and is thereby built into the lower case 51. The case built-in portion 51c is included in the housing main body 50. The case built-in portion 51c forms the inner and outer surfaces of the lower case 51. In the lower case 51, the inner surface is included in the housing inner surface 5a, and the outer surface is included in the housing outer surface 5b.

[0024] The case built-in part 51c has a case inside part 51a and a case outside part 51b. The case inside part 51a is a part that forms the inner surface of the lower case 51. The case outside part 51b is a part that forms the outer surface of the lower case 51. The case inside part 51a is included in the housing inside part 50a, and the case outside part 51b is included in the housing outside part 50b. The case shield layer 41 is provided between the case inside part 51a and the case outside part 51b. The case shield layer 41 extends along the boundary between the case inside part 51a and the case outside part 51b. The case shield layer 41 extends in a direction perpendicular to the thickness direction of the case built-in part 51c. The case inside part 51a and the case outside part 51b are stacked in the thickness direction of the case built-in part 51c via the case shield layer 41.

[0025] In the case built-in portion 51c, the case shield layer 41 is built into the bottom wall portion 510 and the side wall portion 511 so as to span between them. In the bottom wall portion 510 and the side wall portion 511, the portions forming the inner surfaces 510a, 511a are included in the case inside portion 51a. Moreover, the portions forming the outer surfaces 510b, 511b are included in the case outside portion 51b. In the lower case 51, the joint portion 512 and the fixed portion 513 are included in the case outside portion 51b.

[0026] The case shield layer 41 has a bottom wall shield part 410 and a side wall shield part 411. The bottom wall shield part 410 is built into the bottom wall part 510. The bottom wall shield part 410 is provided between the inner surface 510a and the outer surface 510b in the bottom wall part 510. The bottom wall shield part 410 is located at a position separated from both the inner surface 510a and the outer surface 510b. The bottom wall shield part 410 extends along the inner surface 510a and the outer surface 510b. In the bottom wall part 510, a portion forming the inner surface 510a is included in the housing inner part 50a, and a portion forming the outer surface 510b is included in the housing outer part 50b.

[0027] The sidewall shield part 411 is built into the sidewall part 511. The sidewall shield part 411 is provided between the inner surface 511a and the outer surface 511b in the sidewall part 511. The sidewall shield part 411 is located away from both the inner surface 511a and the outer surface 511b. The sidewall shield part 411 extends along the inner surface 511a and the outer surface 511b. In the sidewall part 511, a portion forming the inner surface 511a is included in the housing inside part 50a, and a portion forming the outer surface 511b is included in the housing outside part 50b.

[0028] The cover member 52 has a cover shield layer 42, a cover connection layer 44, and a cover built-in portion 52c. The cover shield layer 42 is built into the cover member 52 by being built into the cover built-in portion 52c. The cover built-in portion 52c is included in the housing main body 50. The cover built-in portion 52c forms the inner and outer surfaces of the cover member 52. In the cover member 52, the inner surface is included in the housing inner surface 5a, and the outer surface is included in the housing outer surface 5b.

[0029] The built-in cover portion 52c has an inner cover portion 52a and an outer cover portion 52b. The inner cover portion 52a is a portion forming the inner surface of the cover member 52. The outer cover portion 52b is a portion forming the outer surface of the cover member 52. The inner cover portion 52a is included in the inner housing portion 50a, and the outer cover portion 52b is included in the outer housing portion 50b. The cover shield layer 42 is provided between the inner cover portion 52a and the outer cover portion 52b. The cover shield layer 42 extends along the boundary between the inner cover portion 52a and the outer cover portion 52b. The cover shield layer 42 extends in a direction perpendicular to the thickness direction of the built-in cover portion 52c. The inner cover portion 52a and the outer cover portion 52b are stacked in the thickness direction of the built-in cover portion 52c via the cover shield layer 42.

[0030] In the cover built-in portion 52c, the cover shield layer 42 is built into each of the top wall portion 520 and the side wall portion 521 so as to span between the top wall portion 520 and the side wall portion 521. In the top wall portion 520 and the side wall portion 521, the portions forming the inner surfaces 520a, 521a are included in the cover inner portion 52a. Moreover, the portions forming the outer surfaces 520b, 521b are included in the cover outer portion 52b. In the cover member 52, the joint portion 522 is included in the cover outer portion 52b.

[0031] The cover shield layer 42 has a top wall shield part 420 and a side wall shield part 421. The top wall shield part 420 is built into the top wall part 520. The top wall shield part 420 is provided between the inner surface 520a and the outer surface 520b in the top wall part 520. The top wall shield part 420 is located at a position separated from both the inner surface 520a and the outer surface 520b. The top wall shield part 420 extends along the inner surface 520a and the outer surface 520b. In the top wall part 520, a portion forming the inner surface 520a is included in the housing inner part 50a, and a portion forming the outer surface 520b is included in the housing outer part 50b.

[0032] The sidewall shield part 421 is built into the sidewall part 521. The sidewall shield part 421 is provided between the inner surface 521a and the outer surface 521b in the sidewall part 521. The sidewall shield part 421 is located at a position separated from both the inner surface 521a and the outer surface 521b. The sidewall shield part 421 extends along the inner surface 521a and the outer surface 521b. In the sidewall part 521, a portion forming the inner surface 521a is included in the housing inside part 50a, and a portion forming the outer surface 521b is included in the housing outside part 50b.

[0033] The shield layers 41 and 42 are built into the housing 5 so as to cover the internal space 5c. The case shield layer 41 is built into the lower case 51 so as to cover the internal space 5c from below. The cover shield layer 42 is built into the cover member 52 so as to cover the internal space 5c from above. The shield layers 41 and 42 can shield magnetism and are sometimes referred to as magnetic shield parts. The shield layers 41 and 42 can prevent electromagnetic noise generated inside the housing 5 from leaking to the outside of the housing 5. In addition, the shield layers 41 and 42 can prevent electromagnetic noise generated outside the housing 5 from entering the inside of the housing 5. For example, the case shield layer 41 can prevent electromagnetic noise from passing through the lower case 51. The cover shield layer 42 can prevent electromagnetic noise from passing through the cover member 52.

[0034] The shield layers 41, 42 are formed containing a conductive material such as a metal material and are conductive. The conductivity of the shield layers 41, 42 is higher than the conductivity of the housing main body 50. For example, the conductivity of the case shield layer 41 is higher than the conductivity of the case built-in portion 51c. The conductivity of the cover shield layer 42 is higher than the conductivity of the cover built-in portion 52c. In this embodiment, the conductivity per unit volume is simply referred to as conductivity.

[0035] The shield layers 41, 42 are formed containing a magnetic material such as iron, and have magnetism. The magnetic material contained in the shield layers 41, 42 is a magnetic material, a ferromagnetic material, or the like. The shield layers 41, 42 have a higher magnetic property than the housing main body 50. For example, the case shield layer 41 has a higher magnetic property than the case built-in portion 51c. The cover shield layer 42 has a higher magnetic property than the cover built-in portion 52c.

[0036] The shield layers 41, 42 are formed of a thin-walled member and extend in a direction perpendicular to the thickness direction of the housing body 50. Examples of the thin-walled member include a sheet-shaped sheet member and a thin plate-shaped plate member. At least a part of the shield layers 41, 42 is formed of a porous member having a large number of holes. The large number of holes penetrate the shield layers 41, 42 in the thickness direction and are arranged along the layer surfaces of the shield layers 41, 42. Examples of the porous member forming the shield layers 41, 42 include a mesh member having a net shape. In the shield layers 41, 42, a large number of holes are formed by the large number of meshes of the mesh member.

[0037] In the housing main body 50, the housing inside part 50a and the housing outside part 50b are connected to each other through the mesh of the mesh member. The housing inside part 50a and the housing outside part 50b are integrally connected to each other at many parts through holes such as meshes of the shield layers 41 and 42. In the lower case 51, the case inside part 51a and the case outside part 51b are connected to each other at many parts through the many meshes of the case shield layer 41. In each of the bottom wall part 510 and the side wall part 511, the parts on the inner surface 510a, 511a side and the parts on the outer surface 510b, 511b side are connected to each other at many parts through the mesh of the case shield layer 41. In the cover member 52, the cover inside part 52a and the cover outside part 52b are connected to each other through the many meshes of the cover shield layer 42. In the top wall 520 and the side wall 521, the portions on the inner surfaces 520a, 521a side and the portions on the outer surfaces 520b, 521b side are connected at many points via the mesh of the cover shield layer .

[0038] The joint portion 522 forms a flange portion that protrudes outward from the side wall portion 521. The joint portion 512 is a portion that is joined to the joint portion 522 of the cover member 52. The joint portions 512 and 522 have joint surfaces 512a and 522a that form planes perpendicular to the joining direction in which the lower case 51 and the cover member 52 are assembled. The joint portions 512 and 522 are joined by a fastener 11 such as a bolt or a screw and a collar member 7 with the joint surfaces 512a and 522a facing each other. The joint portions 512 and 522 have opposite surfaces 512b and 522b opposite the joint surfaces 512a and 522a.

[0039] The collar member 7 includes a first collar 71 and a second collar 72, and is provided integrally with the housing 5. The collar member 7 is a reinforcing member that supports the fixing device 11 and reinforces the joints 512, 522. The second collar 72 is a cylindrical body having a through hole 72a penetrating in the axial direction. The through hole 72a of the second collar 72 is formed with an inner diameter dimension that allows the shaft portion of the fixing device 11 to be inserted. The first collar 71 is a cylindrical body having a through hole 71a penetrating in the axial direction. A female thread is formed on the inner peripheral surface of the first collar 71 that forms the through hole 71a. This female thread is formed so that the male thread formed on the shaft portion of the fixing device 11 can be screwed into it. The first collar 71 and the second collar 72 are formed including a conductive material such as a metal material, and are conductive. The conductivity of the first collar 71 and the second collar 72 is higher than the conductivity of the housing main body 50. Moreover, the electrical conductivity of the first collar 71 and the second collar 72 is higher than the electrical conductivity of the shield layers 41, 42 and the electrical conductivity of the connection layers 43, 44.

[0040] The first collar 71 is provided integrally with the joint portion 512 with one axial end portion protruding slightly from the joint surface 512a. The other axial end portion of the first collar 71 is embedded in the joint portion 512. The first collar 71 is inserted into the mold that forms the lower case 51, and is molded integrally with the resin as the surrounding resin portion solidifies.

[0041] The second collar 72 is provided integrally with the joint 522 so as to penetrate the joint 522 in the axial direction. The second collar 72 is provided integrally with the joint 512 with one axial end slightly protruding from the joint surface 522a. The other axial end of the second collar 72 is exposed to the outside of the housing 5 and is in contact with the head of the fixing device 11. The head of the fixing device 11 is a part having an outer diameter larger than that of the shaft portion provided integrally with the other axial end of the shaft portion. The second collar 72 is provided by being inserted into a mold for forming the cover member 52 and being molded integrally with the resin by solidification of the surrounding resin portion.

[0042] The joint portion 512 and the joint portion 522 are joined by screwing the male thread of the fastener 11 inserted into the second collar 72 into the female thread of the first collar 71. When the joint portion 512 and the joint portion 522 are joined by the fastener 11 and the collar member 7, one axial end of the first collar 71 and one axial end of the second collar 72 are in contact with each other. Due to this contact state, the first collar 71 and the second collar 72 are electrically connected. The electrically connected state means a conductive state. For example, in a configuration in which the first collar 71 and the second collar 72 are electrically connected to each other, the first collar 71 and the second collar 72 are in a conductive state in which they are electrically connected to each other.

[0043] A seal portion 16 is provided between the joint portion 512 and the joint portion 522. The seal portion 16 is a conductive and elastic seal packing that is interposed between the cover member 52 and the lower case 51 to seal the gap between them. The seal portion 16 can be made of a conductive sheet-like material, grease, or gel-like material. The seal portion 16 is located away from the shield layers 41 and 42 and the connection layers 43 and 44. The case shield layer 41 and the case connection layer 43 are located away from the joint surface 512a, and therefore are located away from the seal portion 16. The cover shield layer 42 and the cover connection layer 44 are located away from the joint surface 522a, and therefore are located away from the seal portion 16. The seal portion 16 does not have to be conductive.

[0044] The connection layers 43, 44 are formed containing a conductive material such as a metal material, and are conductive. The conductivity of the connection layers 43, 44 is higher than that of the housing body 50, and is, for example, approximately the same as that of the shield layers 41, 42. For example, the conductivity of the case connection layer 43 is higher than that of the case built-in portion 51c. The conductivity of the cover connection layer 44 is higher than that of the cover built-in portion 52c.

[0045] The connection layers 43, 44 are formed of a thin-walled member. Examples of the thin-walled member include a sheet-shaped sheet member and a thin plate-shaped plate member. The connection layers 43, 44 are formed of a porous member having a large number of holes. The large number of holes penetrate the connection layers 43, 44 in the thickness direction and are arranged along the layer surface of the connection layers 43, 44. An example of a porous member forming the connection layers 43, 44 is a mesh member having a net shape. In the connection layers 43, 44, a large number of holes are formed by the large number of meshes of the mesh member.

[0046] The case connection layer 43 and the case shield layer 41 may be integrally formed, for example, from a single mesh member, etc. The cover connection layer 44 and the cover shield layer 42 may be integrally formed, for example, from a single mesh member, etc.

[0047] The connection layers 43, 44, when built into the housing 5, electrically connect the case shield layer 41 and the cover shield layer 42 via the collar member 7. The connection layers 43, 44 connect the case shield layer 41 and the cover shield layer 42 to each other via the collar member 7. The case connection layer 43 is electrically connected to the case shield layer 41 and the first collar 71. For example, the case connection layer 43 is in contact with both the case shield layer 41 and the first collar 71. The case shield layer 41 and the first collar 71 are electrically connected to each other via the case connection layer 43. The cover connection layer 44 is electrically connected to the cover shield layer 42 and the second collar 72. For example, the cover connection layer 44 is in contact with both the cover shield layer 42 and the second collar 72. The cover shield layer 42 and the second collar 72 are electrically connected to each other via the cover connection layer 44.

[0048] The case connection layer 43 is built into the lower case 51. For example, the case connection layer 43 is built into the case outer part 51b. The case connection layer 43 is built into the side wall part 511, the joint part 512 and the fixed part 513 so as to span between the side wall part 511 and the fixed part 513 via the joint part 512. The connection part between the case shield layer 41 and the case connection layer 43 is built into the side wall part 511. The end part of the case connection layer 43 opposite to the case shield layer 41 may or may not be exposed to the outside from the fixed part 513.

[0049] The case connection layer 43 extends in a layered manner in a direction perpendicular to the thickness direction of the joining portion 512 and the fixed portion 513. The case connection layer 43 extends along the joining surface 512a and the surface 513a. The case connection layer 43 is provided between the joining surface 512a and the opposite surface 512b at the joining portion 512. The case connection layer 43 is provided between the surface 513a and the installation surface 513b at the fixed portion 513. The case connection layer 43 is located at a position separated from all of the joining surface 512a, the opposite surface 512b, the surface 513a, and the installation surface 513b. The first collar 71 is in a state of penetrating the case connection layer 43. The case connection layer 43 is in contact with the outer peripheral surface of the first collar 71. The case connection layer 43 and the first collar 71 may be fixed by soldering, welding, or the like.

[0050] The cover connection layer 44 is embedded in the cover member 52. For example, the cover connection layer 44 is embedded in the cover outer portion 52b. The cover connection layer 44 is embedded in the side wall portion 521 and the joint portion 522 so as to span between the side wall portion 521 and the joint portion 522. The boundary portion between the cover shield layer 42 and the cover connection layer 44 is embedded in the side wall portion 521. The end portion of the cover connection layer 44 opposite to the cover shield layer 42 may or may not be exposed to the outside from the joint portion 522.

[0051] The cover connection layer 44 extends in a layered manner in a direction perpendicular to the thickness direction of the joint 522. The cover connection layer 44 extends along the joint surface 522a. The cover connection layer 44 is provided between the joint surface 522a and the opposite surface 522b in the joint 522. The cover connection layer 44 is located at a position spaced apart from both the joint surface 522a and the opposite surface 522b. The second collar 72 penetrates the cover connection layer 44. The cover connection layer 44 is in contact with the outer peripheral surface of the second collar 72. The cover connection layer 44 and the second collar 72 may be fixed by soldering, welding, or the like.

[0052] The fixed portion 513 is a plate-like portion extending outward from the joint portion 512, and is a portion fixed to the installation base 13. The installation base 13 is one of the vehicle side members, which are members mounted on the chassis, body, and vehicle of the vehicle. The installation base 13 is one of the vehicle side members, which are functional parts such as a motor device mounted on the vehicle. The installation base 13 is formed including a conductive material such as a metal material, and has conductivity. The fixed portion 513 may be configured to be provided at the same position as the joint portion 512 in the circumferential direction of the housing 5, or may be configured to be provided at a position shifted in the circumferential direction from the joint portion 512. The fixed portion 513 has a surface 513a located on the same side as the joint surface 512a, and an installation surface 513b forming a plane facing the installation base 13. The fixed portion 513 and the installation base 13 are joined by fasteners 12 such as bolts or screws and a collar member 8 with the installation surface 513b facing the outer surface of the installation base 13.

[0053] The collar member 8 is provided integrally with the fixed portion 513. The collar member 8 is in a state of penetrating the fixed portion 513, and corresponds to a penetrating collar member. The collar member 8 is a reinforcing member that supports the fixing device 12 and reinforces the fixed portion 513. The collar member 8 is a cylindrical body having a through hole 8a penetrating in the axial direction. The through hole 8a of the collar member 8 is formed with an inner diameter dimension that allows the shaft portion of the fixing device 12 to be inserted. The installation base 13 is provided with, for example, a female thread formed so that the male thread formed on the shaft portion of the fixing device 12 can be screwed into it. The installation base 13 may also be configured to have a through hole through which the shaft portion of the fixing device 12 can be inserted. In this case, the fixed portion 513 and the installation base 13 are fixed integrally by the fixing device 12 and the collar member 8, which are constituted by a bolt and a nut. The collar member 8 is formed by including a conductive material such as a metal material, and has conductivity. The conductivity of the collar member 8 is higher than that of the housing main body 50. Moreover, the electrical conductivity of the collar member 8 is higher than the electrical conductivity of the shield layers 41, 42 and the electrical conductivity of the connection layers 43, 44.

[0054] The collar member 8 is provided integrally with the fixed portion 513 so as to penetrate the fixed portion 513 in the axial direction. The collar member 8 is electrically conductively connected to each of the case connection layer 43 and the installation base 13. The collar member 8 is provided integrally with the fixed portion 513 with one axial end slightly protruding from the surface 513a of the fixed portion 513 and the other axial end in contact with the installation base 13. The collar member 8 is in a state of penetrating the case connection layer 43. The case connection layer 43 is in contact with the outer peripheral surface of the collar member 8. The case connection layer 43 and the installation base 13 are electrically conductively connected via the collar member 8. The collar member 8 is inserted into a mold for forming the lower case 51, and is molded integrally with the resin by solidifying the surrounding resin portion. The case connection layer 43 and the collar member 8 may be fixed by soldering, welding, or the like.

[0055] The collar member 8 and the shield layers 41, 42 are conductively connected via the connection layers 43, 44 and the collar member 7. That is, the collar member 8 and the shield layers 41, 42 are in a conductive state. The case connection layer 43 is in contact with both the collar member 8 and the case shield layer 41, thereby conductively connecting the collar member 8 and the case shield layer 41. The case connection layer 43 corresponds to a conductive connection portion and a conductive connection layer.

[0056] The internal space of the housing 5 is partitioned by, for example, a partition wall into a capacitor accommodating space and a semiconductor module accommodating space. In the semiconductor module accommodating space, in addition to the semiconductor module 2, a control circuit board and the like are installed.

[0057] The smoothing capacitor 3 and the Y capacitor 4 are electrically connected to the semiconductor module 2. The smoothing capacitor 3 smoothes the DC voltage applied to the semiconductor module 2. The smoothing capacitor 3 includes a capacitor element, a sealing member, terminals, etc. The smoothing capacitor 3 includes a capacitor element accommodated in a capacitor housing portion, and a sealing member that is filled in the capacitor housing space and seals the capacitor element. The sealing member seals the capacitor element of the smoothing capacitor 3 and the capacitor element of the Y capacitor 4 in the capacitor housing space. The sealing member corresponds to the exterior portion of the smoothing capacitor 3 and the Y capacitor 4. The capacitor element is connected to an electrode plate, etc. For example, a film capacitor can be used for the capacitor element.

[0058] The sealing member is made of a thermosetting resin such as an epoxy resin. The sealing member fills the gaps between the capacitor element and the terminals and the capacitor housing. With this configuration, the sealing member seals the capacitor element and the terminals. Parts of the terminals protrude from the sealing member as, for example, connecting members 6.

[0059] When manufacturing a capacitor, a capacitor element is placed in a capacitor housing space, and an uncured sealing material is then injected. Heat is then applied to cure the sealing material to manufacture the capacitor. The capacitor may also be configured to include an exterior case that houses the capacitor element. The capacitor may also be configured to have a film that covers the element as the exterior part.

[0060] The smoothing capacitor 3 and the Y capacitor 4 are conductively connected to the case shield layer 41 via the connecting member 6 and the support base 62. The support base 62 is conductively connected to the case shield layer 41. In the support base 62, the support conductive portion is conductively connected to the case shield layer 41. The support base 62 has a support protrusion 63 and a support embedded portion 64. The support protrusion 63 protrudes from the lower case 51 into the internal space 5c. The support protrusion 63 extends from the support embedded portion 64 toward the top wall portion 520. The fixing device 61 is included in the support protrusion 63.

[0061] A part of the support base 62 is embedded in the lower case 51, and this embedded portion is the support embedded portion 64. The support embedded portion 64 is embedded in the bottom wall portion 510. The support embedded portion 64 penetrates the case shield layer 41 in the thickness direction of the bottom wall portion 510. The case shield layer 41 is in contact with the outer circumferential surface of the support embedded portion 64. The support base 62 corresponds to the embedded support base. In the support base 62, the support conductive portion is provided so as to span between the support protruding portion 63 and the support embedded portion 64. The support conductive portion is in contact with the case shield layer 41 at the support embedded portion 64, and is conductively connected to the case shield layer 41.

[0062] Note that the support embedded portion 64 does not have to penetrate the case shield layer 41 as long as it is in contact with the case shield layer 41. For example, the support embedded portion 64 and the case shield layer 41 may be in contact with each other with an end face of the support embedded portion 64 overlapping the case shield layer 41. Furthermore, the support embedded portion 64 does not have to be in contact with the case shield layer 41 as long as it is conductively connected to the case shield layer 41. For example, the support embedded portion 64 may be indirectly connected to the case shield layer 41 via a conductive member.

[0063] The semiconductor module 2 includes a main body portion incorporating the semiconductor element 20, and a power terminal and a control terminal protruding from the main body portion. The semiconductor module 2 is also called a power module. The power terminal includes an input terminal to which a DC voltage is applied, and an output terminal connected to an output side bus bar on the side of the three-phase AC motor 110. The input terminal is connected to a terminal of a capacitor, and is electrically connected to an output portion of the DC power supply 100 via the input side bus bar. The control terminal is connected to a control circuit board. The control circuit board constitutes a circuit board on which electronic components such as a computing element that controls the operation of the semiconductor element 20 are mounted. The on / off operation of the semiconductor element 20 is controlled by the control circuit board. Through this control, the DC power supplied from the DC power supply 100 is converted into AC power.

[0064] The control circuit board is fixed in a state supported by, for example, a boss provided on the lower case 51. The control circuit board is electrically connected via wiring to a connector protruding to the outside of the housing 5. This connector can be connected to a peripheral device installed outside the power conversion device 1.

[0065] The power converter 1 has a configuration in which electromagnetic noise that causes damage to electrical components and the like is generated, propagated, and radiated. Hereinafter, electromagnetic noise may also be referred to as noise. In the power converter 1, noise is propagated by high-frequency current flowing through the power path. For example, a switching power supply is a source of noise. A switching power supply includes an electric circuit that converts voltage and frequency by interrupting current using semiconductors. In such a portion where the current is interrupted, high-frequency energy is generated, and if this energy leaks to the outside by propagation or radiation, it becomes a cause of noise interference. High-frequency energy is absorbed by a capacitor or the like, but it may leak to the outside. In addition, electromagnetic noise may also be generated due to a type of switching surge phenomenon in which current is interrupted by a commutator or the like. In addition, a capacitor in the power converter 1 may be a source of noise.

[0066] Electromagnetic noise is transmitted to the housing 5 by radiation or propagation, and may be released from the housing 5 to the outside. It is desirable to quickly release the electromagnetic noise transmitted to the housing 5 to the ground or the like in order to suppress noise interference. The power conversion device 1 has the shield layers 41, 42 and the collar member 8, and is thus configured to be able to quickly release the electromagnetic noise to the ground or the like.

[0067] The power conversion device 1 includes bus bars including an input side bus bar and an output side bus bar. The power conversion device 1 includes bus bars for inputting and outputting power. The bus bars are conductive members that form a power path connecting the input side terminal portion and the output side terminal portion in the power conversion device 1. The bus bars are conductive members that are connected to the input side or the output side of at least one of the semiconductor module 2 and the capacitor. Such a bus bar forms one of the power paths and can propagate electromagnetic noise. The shield layers 41, 42 can suppress noise radiated from the bus bars from penetrating the housing 5 and being released to the outside.

[0068] Next, a description will be given of a manufacturing method of the power conversion device 1. The process of manufacturing the power conversion device 1 includes a process of manufacturing the housing 5. The process of manufacturing the housing 5 also includes a process of manufacturing the lower case 51 and a process of manufacturing the cover member 52.

[0069] As a preparation step for manufacturing the lower case 51, the worker prepares the case shield layer 41, the case connection layer 43, the first collar 71, the collar member 8, and the support base 62. The worker mounts the case shield layer 41, the case connection layer 43, the first collar 71, the collar member 8, and the support base 62 in a mold while they are electrically connected to each other. The worker molds the resin part of the lower case 51 by injection molding using a mold. In the lower case 51, the case shield layer 41, the case connection layer 43, the first collar 71, the collar member 8, and the support base 62 are integrated into the resin part by insert molding. The resin part of the lower case 51 includes a part of the housing main body 50, such as a case built-in part 51c that constitutes the lower case 51.

[0070] As a preparation step for manufacturing the cover member 52, the worker prepares the cover shield layer 42, the cover connection layer 44, and the second collar 72. The worker mounts the cover shield layer 42, the cover connection layer 44, and the second collar 72 in a state in which they are electrically connected to each other, in a mold for molding. The worker molds the resin portion of the cover member 52 by injection molding using a mold. In the cover member 52, the cover shield layer 42, the cover connection layer 44, and the second collar 72 are integrated into the resin portion by insert molding. The resin portion of the cover member 52 includes the cover built-in portion 52c and other portions that constitute the cover member 52 of the housing main body 50.

[0071] The effects of the power converter 1 of the first embodiment will be described. The power converter 1 includes a housing 5 that houses at least a plurality of semiconductor modules 2 and a capacitor electrically connected to the semiconductor modules 2. The power converter 1 includes shield layers 41, 42 that are built between a housing inner surface 5a and a housing outer surface 5b and extend to cover an internal space 5c. The power converter 1 includes a collar member 8 that is electrically conductive and through which the fastener 12 can be inserted, and is provided integrally with the housing 5 to fasten the housing 5 to a vehicle-side member using the fastener 12. In the power converter 1, the collar member 8 and the shield layers 41, 42 are electrically connected to each other.

[0072] In the power converter 1, radio noise is generated from various noise sources. For example, radio noise is electromagnetic waves. Radio noise radiated into the housing 5 can cause malfunctions, so it is required to be quickly discharged. According to the power converter 1, the shield layers 41 and 42 contribute to preventing radiation and diffusion of electromagnetic noise. According to the power converter 1, the housing 5 is fixed to the vehicle-side member using the fastener 12 inserted into the collar member 8, so that the shield layers 41 and 42 are grounded to the vehicle-side member through the collar member 8. This makes it possible to provide a power converter 1 that can quickly move electromagnetic noise transmitted to the shield layers 41 and 42 to the vehicle-side member through the collar member 8. The power converter 1 can suppress spatial conduction of electromagnetic noise, etc., through the housing 5 to the inside or outside of the housing. In this way, the power converter 1 has a simple configuration and achieves a noise suppression effect by fixing the housing 5 to the vehicle-side member. The power converter 1 can suppress noise interference to electrical components in the housing and peripheral devices present around the housing 5.

[0073] For example, unlike the present embodiment, a configuration is assumed in which the shielding layer is not built into the housing 5 but is layered on at least one of the housing inner surface 5a and the housing outer surface 5b. In this configuration, the shielding layer is exposed to at least one of the inside and outside of the housing 5, and there is a concern that the shielding layer may peel off from the housing inner surface 5a or the housing outer surface 5b. In this case, peeling of the shielding layer from the housing inner surface 5a or the housing outer surface 5b is likely to reduce the noise suppression effect of the shielding layer.

[0074] In contrast, according to the present embodiment, the shield layers 41, 42 are embedded between the housing inner surface 5a and the housing outer surface 5b in the housing 5. With this configuration, peeling of the shield layers 41, 42 from the housing inner surface 5a or the housing outer surface 5b is prevented. This makes it difficult for peeling of the shield layers 41, 42 to cause a decrease in the noise suppression effect of the shield layers 41, 42. In this way, the noise suppression effect of the shield layers 41, 42 can be properly exhibited in the housing 5.

[0075] Electromagnetic waves such as radio noise are waves that propagate through space as changes in electric field and magnetic field, and are sometimes called electromagnetic radiation. Electromagnetic waves are generated according to the product of the electric field strength E and the magnetic field strength H. For this reason, the electric field strength E becomes zero when the shield layers 41, 42 are grounded to the vehicle side member via the collar member 8, and electromagnetic waves are not generated. On the other hand, even if the shield layers 41, 42 are grounded, the magnetic field strength H does not become zero, and a magnetic field is applied to the entire power conversion device 1. For example, the magnetic field is applied to the inside and outside of the housing 5. The magnetic field applied to the power conversion device 1 includes an AC magnetic field and a DC magnetic field. An AC magnetic field is sometimes called an AC magnetic field, and a DC magnetic field is sometimes called a DC magnetic field.

[0076] The AC magnetic field is likely to be consumed by eddy current loss Pe in the shield layers 41, 42. For the eddy current loss Pe, for example, the formula F1 shown in FIG. 2 is established. In the formula F1, B is the magnetic flux, f is the frequency, d is the thickness of the surface through which the eddy current flows, and ρ is the electrical conductivity. The eddy current loss Pe is likely to occur in both non-magnetic materials that do not have magnetism and magnetic materials. Therefore, regardless of whether the shield layers 41, 42 have magnetism or not, the AC magnetic field is likely to be consumed by eddy current loss Pe in the shield layers 41, 42. That is, the AC magnetic field is likely to be shielded by the shield layers 41, 42. Note that the thicker the shield layers 41, 42 are, the larger the eddy current loss Pe is likely to be, and the easier it is for the AC magnetic field to be shielded.

[0077] On the other hand, the DC magnetic field is not easily consumed by the eddy current loss Pe because no eddy current loss Pe occurs. Therefore, for example, unlike the present embodiment, in a configuration in which the shield layers 41 and 42 are not magnetic, the DC magnetic field is not easily shielded by the shield layers 41 and 42. Therefore, for example, the DC magnetic field is not easily passed through the housing 5. In the power conversion device 1, when a DC magnetic field is applied to an electric circuit included in a switching power supply or the like, noise is likely to occur inside the electric circuit. This noise is generated by the current flowing through the electric circuit and the DC magnetic field applied to the electric circuit from the outside. When this noise occurs, it is considered that control abnormalities of the board on which the electric circuit is mounted, heat generation of the board, etc. may occur.

[0078] In contrast, according to this embodiment, since the shield layers 41, 42 are magnetic, the DC magnetic field easily passes through the shield layers 41, 42, which contain a magnetic material. Therefore, in addition to the AC magnetic field, the DC magnetic field is easily shielded by the shield layers 41, 42. Therefore, the electromagnetic waves generated in the power conversion device 1 are less likely to affect other devices, and the power conversion device 1 is less likely to be affected by electromagnetic waves from other devices. In other words, the EMC performance can be improved. The EMC performance is sometimes referred to as the EMC effect.

[0079] According to this embodiment, in the housing body 50, the shield layers 41, 42 are provided between the housing inside part 50a and the housing outside part 50b. In this configuration, the housing inside part 50a and the housing outside part 50b can suppress peeling or separation of the shield layers 41, 42 from the housing body 50. For example, the housing outside part 50b suppresses peeling of the shield layers 41, 42 from the housing inside part 50a. Also, the housing inside part 50a suppresses peeling of the shield layers 41, 42 from the housing outside part 50b. Furthermore, in the lower case 51, the case inside part 51a and the case outside part 51b suppress peeling or separation of the case shield layer 41. In the cover member 52, the cover inside part 52a and the cover outside part 52b suppress peeling or separation of the cover shield layer 42.

[0080] According to this embodiment, the housing inside part 50a and the housing outside part 50b are connected through holes in the porous member in the shield layers 41 and 42. In this configuration, even if the shield layers 41 and 42 are present between the housing inside part 50a and the housing outside part 50b, the housing inside part 50a and the housing outside part 50b are unlikely to be separated from each other. Therefore, the direct connection between the housing inside part 50a and the housing outside part 50b can prevent the shield layers 41 and 42 from peeling off from the housing outside part 50b together with the housing inside part 50a. In addition, the shield layers 41 and 42 can be prevented from peeling off from the housing inside part 50a together with the housing outside part 50b.

[0081] According to this embodiment, the housing inside part 50a and the housing outside part 50b are connected through the mesh of the mesh member in the shield layers 41 and 42. In this configuration, the mesh member can maximize the ratio of the hole area to the layer surface area of ​​the shield layers 41 and 42. Therefore, the connection area between the housing inside part 50a and the housing outside part 50b, which are connected through the mesh of the shield layers 41 and 42, can be maximized. Therefore, it is possible to more reliably prevent the shield layers 41 and 42 from peeling off together with the housing inside part 50a from the housing outside part 50b, and the shield layers 41 and 42 from peeling off together with the housing outside part 50b from the housing inside part 50a.

[0082] The collar member 8 is provided in a state in which it penetrates the fixed portion 513 of the housing 5 that is fixed to the vehicle-side member. The case connection layer 43 is in contact with both the case shield layer 41 and the collar member 8, thereby electrically connecting the case shield layer 41 and the collar member 8. According to this configuration, by fixing the fixed portion 513 to the vehicle-side member using the fastener 12, the collar member 8 connects the fixed portion 513 and the vehicle-side member so as to electrically bridge them.

[0083] Furthermore, it is preferable that the collar member 8 has a higher electrical conductivity per unit volume than the shield layers 41, 42. With this configuration, it is possible to provide a power conversion device 1 that quickly moves the electromagnetic noise blocked by the shield layers 41, 42 to the collar member 8 and further propagates it to vehicle-side members.

[0084] According to this embodiment, since the case connection layer 43 extends in a layered manner, it is easy to increase the connection area between the case connection layer 43 and the case shield layer 41 and the collar member 8. Therefore, in a configuration in which the case shield layer 41 and the collar member 8 are conductively connected via the case connection layer 43, it is possible to prevent the connection area between the case connection layer 43 and the case shield layer 41 and the collar member 8 from becoming insufficient. Therefore, the noise suppression effect provided by the shield layers 41 and 42 can be enhanced by the case connection layer 43.

[0085] According to this embodiment, the support base 62 and the case shield layer 41 are electrically conductively connected in the lower case 51. In this configuration, the support base 62 can be included in the noise discharge path. Therefore, even if noise is generated in the smoothing capacitor 3, the Y capacitor 4, etc., a configuration can be realized in which the noise can be easily discharged from the support base 62 to the vehicle side member.

[0086] The housing 5 includes a lower case 51 provided with a case shield layer 41, and a cover member 52 attached to the lower case 51 so as to cover the internal space of the lower case 51. The lower case 51 is provided with a support base 62 that supports the Y capacitor 4 included in the capacitor so as to be conductive, and a collar member 8. With this configuration, a path extending from the Y capacitor 4, the support base 62, the first case member, the shield layers 41 and 42, the collar member 8, and the vehicle side member can be provided as a noise exhaust path. This promotes the exhaust of noise related to the Y capacitor 4, improving EMC performance.

[0087] According to this embodiment, at least a portion of the support base 62 is embedded in the lower case 51 and is in contact with the case shield layer 41. In this configuration, the conductive connection portion between the support base 62 and the case shield layer 41 is embedded in the lower case 51, so this connection portion is difficult to release. Therefore, it is possible to suppress a decrease in the noise exhaust effect of the noise exhaust path including the support base 62.

[0088] The housing 5 includes a lower case 51 provided with a case shield layer 41, and a cover member 52 provided with a cover shield layer 42 and attached to the lower case 51. The lower case 51 includes a joint 512 joined to the cover member 52. The cover member 52 includes a joint 522 joined to the joint 512. The power conversion device 1 includes a first collar 71 integrally provided on the joint 512 to fix the joint 512 and the joint 522 using the fixing device 11. The power conversion device 1 includes a second collar 72 integrally provided on the joint 522 to fix the joint 512 and the joint 522 using the fixing device 11. The first collar 71 and the second collar 72 are each a cylindrical body having electrical conductivity and through which the fixing device 11 can be inserted. The first collar 71 and the second collar 72 are in contact with each other when the joint 512 and the joint 522 are joined by the fixing device 11. The first collar 71 and the case shield layer 41 are joined in a conductive manner. The second collar 72 and the cover shield layer 42 are connected in a conductive manner.

[0089] According to this configuration, noise propagated to the case shield layer 41 and the cover shield layer 42 can be discharged to the vehicle side member via the collar member 8. This promotes the discharge of noise propagated throughout the entire housing 5, improving EMC performance.

[0090] The housing 5 is provided with a seal portion 16 that is interposed between the first case member and the second case member to provide a seal. Therefore, the seal between the lower case 51 and the cover member 52 can be ensured by the seal portion 16. Moreover, the seal portion 16 is in conductive contact with the collar member 7. Therefore, electromagnetic noise and the like that remains in the housing 5 can be shielded by the seal portion 16 in addition to the shield layers 41, 42.

[0091] <Second embodiment> In the first embodiment, the shield layers 41, 42 and the collar members 7, 8 are electrically conductively connected by the connection layers 43, 44. In contrast, in the second embodiment, the shield layers 41, 42 and the collar members 7, 8 are electrically conductively connected by the connection rods 45, 46. The configurations, actions, and effects of the second embodiment that are not particularly described are the same as those of the first embodiment. The second embodiment will be described mainly with respect to the differences from the first embodiment.

[0092] The housing 5 shown in FIG. 3 has connection rods 45 and 46. The connection rods 45 and 46 are built into the housing 5 by being built into the housing main body 50, similar to the connection layers 43 and 44 of the first embodiment. The connection rods 45 and 46 are covered by the housing main body 50. The connection rods 45 and 46 are molded integrally with the resin part of the housing 5 by insert molding when the housing 5 is molded. The lower case 51 has a case connection rod 45, and the cover member 52 has a cover connection rod 46. The case connection rod 45 is built into the lower case 51, similar to the case connection layer 43. The cover connection rod 46 is built into the cover member 52, similar to the cover connection layer 44.

[0093] The connecting rods 45, 46 are formed containing a conductive material such as a metal material, and are conductive. The conductivity of the connecting rods 45, 46 is higher than that of the housing body 50. For example, the conductivity of the case connecting rod 45 is higher than that of the case built-in part 51c. The conductivity of the cover connecting rod 46 is higher than that of the cover built-in part 52c. The conductivity of the connecting rods 45, 46 is higher than that of the shield layers 41, 42, and is, for example, approximately the same as that of the first collar 71, the second collar 72, and the collar member 8. The connecting rods 45, 46 are formed of a rod-shaped rod member. Examples of the rod member include a columnar member and a cylindrical member.

[0094] The connecting rods 45, 46, when built into the housing 5, electrically connect the case shield layer 41 and the cover shield layer 42 via the collar member 7. The connecting rods 45, 46 establish electrical continuity between the case shield layer 41 and the cover shield layer 42 via the collar member 7. The connecting rods 45, 46 correspond to conductive connecting portions.

[0095] The case connecting rod 45 is electrically conductively connected to each of the case shield layer 41 and the first collar 71. For example, the case connecting rod 45 is in contact with each of the case shield layer 41 and the first collar 71. One end of the case connecting rod 45 is in contact with an end of the case shield layer 41, and the other end is in contact with the outer circumferential surface of the first collar 71. The contact portions of the case connecting rod 45 with the case shield layer 41 and the first collar 71 may be fixed by soldering, welding, or the like.

[0096] The cover connecting rod 46 is conductively connected to each of the cover shield layer 42 and the second collar 72. For example, the cover connecting rod 46 is in contact with both the cover shield layer 42 and the second collar 72. One end of the cover connecting rod 46 is in contact with an end of the cover shield layer 42, and the other end is in contact with the outer circumferential surface of the second collar 72. The contact portions of the cover connecting rod 46 with the cover shield layer 42 and the second collar 72 may be fixed by soldering, welding, or the like.

[0097] The collar member 8 is conductively connected to the shield layers 41, 42 via the case connecting rod 45 and the collar member 7. The lower case 51 includes the case connecting rod 45 that conductively connects the collar member 8 and the first collar 71 in addition to the case connecting rod 45 that conductively connects the first collar 71 and the case shield layer 41. The case connecting rod 45 that conductively connects the collar member 8 and the first collar 71 is in contact with both the collar member 8 and the first collar 71. One end of the case connecting rod 45 is in contact with the outer circumferential surface of the collar member 8, and the other end is in contact with the outer circumferential surface of the first collar 71. These contact portions may be fixed by soldering, welding, or the like.

[0098] The housing 5 may include both the connection layers 43, 44 and the connection rods 45, 46 as conductive connection parts. For example, in the lower case 51, the case shield layer 41 and the first collar 71 may be conductively connected by the case connection layer 43, while the collar member 8 and the first collar 71 may be conductively connected by the case connection rod 45.

[0099] <Third embodiment> In the first embodiment, the shield layers 41, 42 are provided at positions spaced apart from the seal portion 16. In contrast, in the third embodiment, the shield layers 41, 42 and the collar members 7, 8 of the seal portion 16 are electrically connected by connecting rods 45, 46. The configurations, actions, and effects of the third embodiment that are not specifically described are the same as those of the second embodiment. The third embodiment will be described mainly with respect to the differences from the second embodiment.

[0100] In the housing 5 shown in FIG. 4, the case shield layer 41 and the cover shield layer 42 are electrically connected via the conductive seal portion 16. In the lower case 51, the case shield layer 41 is in contact with the seal portion 16. In the case shield layer 41, the side wall shield portion 411 extends to the joint surface 512a. The side wall shield portion 411 is exposed from the joint surface 512a and in contact with the seal portion 16. The side wall shield portion 411 is bridged between the bottom wall shield portion 410 and the seal portion 16. The side wall shield portion 411 extends beyond the case connecting rod 45 to reach the seal portion 16.

[0101] In the cover member 52, the cover shield layer 42 is in contact with the seal portion 16. In the cover shield layer 42, the side wall shield portion 421 extends to the joint surface 522a. The side wall shield portion 421 is exposed from the joint surface 522a and is in contact with the seal portion 16. The side wall shield portion 421 is in a state of spanning between the top wall shield portion 420 and the seal portion 16. The side wall shield portion 421 extends beyond the cover connecting rod 46 to reach the seal portion 16.

[0102] According to the present embodiment, the case shield layer 41 and the cover shield layer 42 are in contact with the seal portion 16. In this configuration, the entire internal space 5c can be covered by the shield layers 41, 42 and the seal portion 16. Therefore, at the boundary between the lower case 51 and the cover member 52, electromagnetic noise and the like can be shielded by the seal portion 16 and the shield layers 41, 42, improving the effect of suppressing noise leakage.

[0103] In addition, in the housing 5, when the seal portion 16 is in contact with the collar member 7, the shield layers 41, 42 and the collar member 7 are electrically connected via the seal portion 16. In this case, the shield layers 41, 42 and the collar member 7 do not need to be connected by the connection layers 43, 44 or the connection rods 45, 46.

[0104] <Fourth embodiment> In the first embodiment, the collar member 8 is provided in the housing 5 so as to penetrate the fixed portion 513. In contrast, in the fourth embodiment, a collar unit 80 including the collar member 8 is provided in the housing 5 so as to be embedded in the fixed portion 513. Configurations, actions, and effects not specifically described in the fourth embodiment are similar to those in the first embodiment. The fourth embodiment will be described mainly with respect to the differences from the first embodiment.

[0105] The housing 5 shown in FIG. 5 is provided with a color unit 80. The color unit 80 is embedded in the lower case 51. The color unit 80 has a collar member 8 and a conductor 81. Like the collar member 8, the conductor 81 is formed containing a conductive material such as a metal material and has conductivity. The conductivity of the conductor 81 is approximately the same as that of the collar member 8. In the color unit 80, the collar member 8 and the conductor 81 are integrated by being fixed by soldering, welding, or the like. The conductor 81 is, for example, a rod-shaped body or a cylindrical body. The conductor 81 has a shape extending in a direction perpendicular to the axial direction of the collar member 8.

[0106] The conductor 81 electrically connects the collar member 8 and the case shield layer 41. The conductor 81 is built into the lower case 51 so as to span between the fixed portion 513 and the side wall portion 511. The conductor 81 is provided between the surface 513a and the installation surface 513b at the fixed portion 513, and extends along the surface 513a and the installation surface 513b. One end of the conductor 81 is in contact with the collar member 8, and the other end is in contact with the case shield layer 41. The conductor 81 penetrates the case shield layer 41. The outer peripheral surface of the conductor 81 is in contact with the case shield layer 41, and this contact portion is fixed by soldering, welding, or the like. The end of the conductor 81 opposite to the collar member 8 may or may not be exposed from the housing inner surface 5a. The conductor 81 corresponds to a conductive connection portion.

[0107] The color unit 80 is molded integrally with the resin portion of the housing 5 by insert molding when the housing 5 is molded. The conductor 81 is built into the fixed portion 513 to reinforce the fixed portion 513, and is sometimes referred to as a reinforcing member. For the housing 5, the case shield layer 41 and the collar member 8 are electrically connected via the conductor 81 to promote the discharge of noise, thereby improving the EMC performance.

[0108] In the lower case 51, the joint portion 512 and the fixed portion 513 may be provided at positions spaced apart from each other. For example, in the present embodiment, the fixed portion 513 is located at a position spaced apart from the joint portion 512 on the side opposite to the cover member 52. In the lower case 51, the collar member 8 is conductively connected to the case shield layer 41 without the collar member 7 therebetween.

[0109] <Fifth embodiment> In the first embodiment, the power conversion device 1 has a support base 62 in contact with the case shield layer 41. In contrast, in the fifth embodiment, the power conversion device 1 has a support base 162 in contact with the cooling member 14. Configurations, actions, and effects not specifically described in the fifth embodiment are similar to those in the first embodiment. The fifth embodiment will be described mainly with respect to the differences from the first embodiment.

[0110] The power converter 1 shown in FIG. 6 includes a cooling member 14 and a support stand 162. The cooling member 14 is a member capable of cooling the semiconductor module 2. The cooling member 14 is provided in contact with the semiconductor module 2 or in contact with the semiconductor module 2 via a thermally conductive member so as to be capable of heat transfer. The cooling member 14 may also be configured to be in contact with the housing 5 or in contact with the housing 5 via a thermally conductive member so as to be capable of heat transfer. The conductive member may be a sheet-like member, grease, or gel-like material that is conductive or non-conductive. The cooling member 14 is plate-shaped and includes a flow path 14a through which a cooling fluid flows. The cooling member 14 is fixed integrally to the housing 5 by a fastener such as a bolt or a screw. The cooling member 14 is provided in the housing 5 as a part of the lower case 51. The cooling member 14 is in contact with the case shield layer 41 and is capable of electrical conduction with the case shield layer 41.

[0111] The support base 162 supports the connecting member 6, similarly to the support base 62 of the first embodiment, and is electrically conductively connected to the connecting member 6. The support base 162 is fixed to the cooling member 14 in a state of contact with the cooling member 14. The support base 162 is not embedded in the lower case 51. The support base 162 and the cooling member 14 are electrically conductively connected. In the support base 162, the support conductive portion is in contact with the cooling member 14. The support base 162 is electrically conductively connected to the case shield layer 41 via the cooling member 14. The support base 162 may be referred to as a cooling support base. The support base 162 may be in contact with the cooling member 14 in a heat-transferable manner.

[0112] The power conversion device 1 of the fifth embodiment includes a cooling member 14 having conductivity capable of cooling the semiconductor module 2, and a support base 162 that conductively supports the Y capacitor 4. The support base 162 is provided in contact with the cooling member 14, or is provided conductively to the cooling member 14 via the case shield layer 41. This makes it possible to provide a cooling member 14 that has both the function of cooling the semiconductor module 2 and the function of promoting the discharge of noise related to the Y capacitor 4, thereby improving the EMC performance.

[0113] Sixth embodiment In the first embodiment, the collar member 8 was conductively connected to the case shield layer 41 via the case connection layer 43. In contrast, in the sixth embodiment, the collar member 8 is directly conductively connected to the case shield layer 41. That is, the collar member 8 is in contact with the case shield layer 41. The configurations, actions, and effects of the sixth embodiment that are not specifically described are the same as those of the first embodiment. The sixth embodiment will be described mainly with respect to the differences from the first embodiment.

[0114] The housing 5 shown in Fig. 7 is provided with a collar member 108. The collar member 108 is embedded in the lower case 51. The collar member 108 electrically connects the installation base 13 and the case shield layer 41. The collar member 108 is in contact with both the installation base 13 and the case shield layer 41. The collar member 108 corresponds to a conductive collar member.

[0115] The collar member 108 is formed containing a conductive material such as a metal material, and has conductivity, similar to the collar member 8 of the first embodiment. The conductivity of the collar member 108 is higher than that of the housing body 50, and is higher than, for example, the conductivity of the shield layers 41 and 42 and the conductivity of the connection layers 43 and 44. The collar member 108 is, for example, a rod-shaped body, a cylindrical body, or a plate-shaped body. The collar member 108 has a shape extending in a direction perpendicular to the through hole 8a.

[0116] The collar member 108 has a vehicle side contact portion 8b and a shield side contact portion 8c. In the collar member 108, a portion on one end side is the vehicle side contact portion 8b, and a portion on the other end side is the shield side contact portion 8c.

[0117] The vehicle side contact portion 8b is in contact with the installation base 13 and is fixed to the installation base 13 by the fixing device 12. The vehicle side contact portion 8b is provided with a through hole 8a through which the fixing device 61 is inserted. The vehicle side contact portion 8b is a hole forming portion that forms the through hole 8a. The vehicle side contact portion 8b is fixed to the installation base 13 by being sandwiched between the head of the fixing device 12 and the installation base 13.

[0118] The shield side contact portion 8c is embedded in the side wall portion 511. The shield side contact portion 8c is embedded in the side wall portion 511 from the outer surface 511b. The shield side contact portion 8c is in contact with the case shield layer 41 inside the side wall portion 511. The shield side contact portion 8c penetrates the case shield layer 41. The outer peripheral surface of the shield side contact portion 8c is in contact with the case shield layer 41, and this contact portion is fixed by soldering, welding, or the like. The shield side contact portion 8c may or may not be exposed from the housing inner surface 5a.

[0119] With the above-mentioned configuration, the installation base 13 and the case shield layer 41 are in a conductive relationship via the collar member 108. The collar member 108 is molded integrally with the resin by inserting the shield-side contact portion 8c into a mold for forming the lower case 51 and solidifying the surrounding resin portion. The collar member 108 is a member that supports the fixing device 12 and also functions as a fixed portion.

[0120] According to the present embodiment, the collar member 108 includes the vehicle-side contact portion 8b and the shield-side contact portion 8c. With this configuration, the conductive collar member 108 is integrally provided with the side wall portion 511, thereby making it possible to establish electrical continuity between the case shield layer 41 and the vehicle-side member.

[0121] Seventh embodiment In the seventh embodiment, the housing 5 has inner shield layers 55a, 56a in addition to the shield layers 41, 42 as built-in shield layers. The configurations, actions, and effects of the seventh embodiment that are not specifically described are the same as those of the first embodiment. The seventh embodiment will be described mainly with respect to the differences from the first embodiment.

[0122] The housing 5 shown in FIG. 8 has shield layers 41, 42 and inner shield layers 55a, 56a. The inner shield layers 55a, 56a are superimposed on the housing inner surface 5a. The inner shield layers 55a, 56a extend along the housing inner surface 5a and are attached to the housing main body 50. The inner shield layers 55a, 56a are conductive and are provided in the housing 5 so as to cover the internal space 5c. The inner shield layers 55a, 56a are provided on the inside of the shield layers 41, 42 in the housing 5. The shield layers 41, 42 and the inner shield layers 55a, 56a are electrically connected to each other via the collar member 7 and the connection layers 43, 44, etc. The internal space 5c is doubly shielded by the shield layers 41, 42 and the inner shield layers 55a, 56a.

[0123] The inner shield layers 55a, 56a can be formed, for example, by a metal layer or an alloy layer plated on the housing inner surface 5a. The inner shield layers 55a, 56a may be, for example, copper plating plated on the housing inner surface 5a. With this configuration, the electrical conductivity is high, and the thickness dimension of the inner shield layers 55a, 56a can be reduced, resulting in a reduction in weight and thickness. The inner shield layers 55a, 56a can also be formed as layers built into the housing 5 so as to cover the housing inner surface 5a. In this case, the inner shield layers 55a, 56a are provided integrally with the resin portion of the housing 5 by insert molding during molding of the housing 5.

[0124] The inner shield layer 55a is provided at a position covering the inner surface of the lower case 51. The inner surfaces of the lower case 51 on which the inner shield layer 55a is provided include the inner surface 510a of the bottom wall portion 510 and the inner surface 511a of the side wall portion 511. Furthermore, the inner shield layer 55a is provided on a joint surface 512a of the joint portion 512 and a surface 513a of the fixed portion 513. The inner shield layer 55a has the effect of suppressing electromagnetic noise from leaking to the outside of the housing 5 on the inner surface side of the lower case 51.

[0125] The inner shield layer 56a is provided at a position covering the inner surface of the cover member 52. The inner surfaces of the cover member 52 on which the inner shield layer 56a is provided are the inner surface 520a of the top wall portion 520, the inner surface 521a of the side wall portion 521, etc. Furthermore, the inner shield layer 56a is provided on a joint surface 522a of the joint portion 522. The inner shield layer 56a has the effect of suppressing electromagnetic noise from leaking to the outside of the housing 5 on the inner surface side of the cover member 52.

[0126] The inner shield layer 55a and the inner shield layer 56a are preferably provided so as to overlap the entire inner surface that forms the internal space of the housing 5. This makes it possible to shield electromagnetic noise radiated from the internal space to the inner surface of the housing 5 over a wide range with high accuracy.

[0127] The collar member 7 is conductively connected to the shield layers 41 and 42 as well as the inner shield layers 55a and 56a. The collar member 7 is in contact with each of the inner shield layers 55a and 56a. In the collar member 7, one axial end of the first collar 71 is in contact with the inner shield layer 56a. With this configuration, the first collar 71 and the inner shield layer 56a are in a conductive relationship. In the collar member 7, one axial end of the second collar 72 is in contact with the inner shield layer 55a. With this configuration, the second collar 72 and the inner shield layer 55a are in a conductive relationship. The inner shield layer 55a of the lower case 51 and the inner shield layer 56a of the cover member 52 are in a conductive relationship via the collar member 7.

[0128] At the boundary between the lower case 51 and the cover member 52, the seal portion 16 contacts the inner shield layer 56a and the inner shield layer 55a. This allows electromagnetic noise and the like to be blocked by the seal portion 16, the inner shield layer 55a, and the inner shield layer 56a at the joint portion of the housing 5, improving the effect of suppressing noise leakage.

[0129] The collar member 8 is conductively connected to the case shield layer 41 as well as the inner shield layer 55a in the lower case 51. The collar member 8 is in contact with both the case shield layer 41 and the inner shield layer 55a. One axial end of the collar member 8 is in contact with the inner shield layer 55a. With this configuration, the collar member 8 and the inner shield layer 55a are in a conductive relationship. Furthermore, the inner shield layer 55a and the installation base 13 are conductive via the collar member 8.

[0130] The power conversion device 1 of this embodiment has a support base 262. The support base 262 supports the connecting member 6, similar to the support base 62 of the first embodiment, and is conductively connected to the connecting member 6. The support base 262 is fixed to the lower case 51 in a state of contact with the inner shield layer 55a. The support base 262 is not embedded in the lower case 51. The support base 262 and the inner shield layer 55a are conductively connected. In the support base 262, the support conductive portion is in contact with the inner shield layer 55a. The support base 262 is sometimes referred to as an inner support base.

[0131] According to the present embodiment, the power conversion device 1 includes an inner shield layer 55a provided on the lower case 51 so as to cover the inner surface of the lower case 51. The power conversion device 1 includes an inner shield layer 56a provided on the cover member 52 so as to cover the inner surface of the cover member 52. According to this configuration, the inner shield layers 55a, 56a can suppress radiation of electromagnetic noise and the like from inside the housing to the outside through the housing 5.

[0132] According to the present embodiment, the seal portion 16 is sandwiched between the inner shield layers 55a and 56a and comes into contact with each of the inner shield layers 55a, 56a. With this configuration, electromagnetic noise and the like remaining in the housing 5 can be shielded by the seal portion 16 and the inner shield layers 55a and 56a.

[0133] Eighth embodiment In the eighth embodiment, the housing 5 has outer shield layers 55b, 56b in addition to the shield layers 41, 42. The configurations, actions, and effects of the eighth embodiment that are not specifically described are the same as those of the seventh embodiment. The eighth embodiment will be described mainly with respect to the differences from the seventh embodiment.

[0134] The housing 5 shown in FIG. 9 has inner shield layers 55a, 56a and outer shield layers 55b, 56b in addition to the shield layers 41, 42. The outer shield layers 55b, 56b are overlaid on the housing outer surface 5b. The outer shield layers 55b, 56b extend along the housing outer surface 5b and are attached to the housing main body 50. The outer shield layers 55b, 56b are conductive and are provided on the housing 5 so as to cover the internal space 5c. The outer shield layers 55b, 56b are provided outside the shield layers 41, 42 in the housing 5. The shield layers 41, 42, the inner shield layers 55a, 56a, and the outer shield layers 55b, 56b are electrically connected to each other via the collar member 7 and the connection layers 43, 44, etc. The internal space 5c is triple-shielded by the shield layers 41, 42, the inner shield layers 55a, 56a, and the outer shield layers 55b, 56b.

[0135] The outer shield layers 55b, 56b can be formed, for example, by a metal layer or an alloy layer plated on the outer surface 5b of the housing. The outer shield layers 55b, 56b may be, for example, copper plating plated on the outer surface 5b of the housing. With this configuration, the electrical conductivity is high, and the thickness dimension of the outer shield layers 55b, 56b can be reduced, resulting in a reduction in weight and thickness. The outer shield layers 55b, 56b can also be formed as layers provided outside the housing 5 so as to cover the outer surface 5b of the housing. In this case, the outer shield layers 55b, 56b are provided integrally with the resin portion of the housing 5 by insert molding during molding of the housing 5.

[0136] The outer shield layer 55b is provided at a position covering the outer surface of the lower case 51. The outer surfaces of the lower case 51 on which the outer shield layer 55b is provided are the outer surface 510b of the bottom wall portion 510, the outer surface 511b of the side wall portion 511, and the installation surface 513b of the fixed portion 513. The outer shield layer 55b has the effect of blocking electromagnetic noise on the outer surface side of the lower case 51 and suppressing the noise from leaking out of the housing 5.

[0137] The outer shield layer 56b is provided at a position covering the outer surface of the cover member 52. The outer surfaces of the cover member 52 on which the outer shield layer 56b is provided are the outer surface 520b of the top wall portion 520, the outer surface 521b of the side wall portion 521, and the opposite surface 522b of the joint portion 522. The outer shield layer 56b has the effect of blocking electromagnetic noise on the outer surface side of the cover member 52 and suppressing the noise from leaking out of the housing 5.

[0138] The power conversion device 1 includes shield layers 41, 42, inner shield layers 55a, 56a, and outer shield layers 55b, 56b. With this configuration, electromagnetic noise can be shielded from the inside, inner surface side, and outer surface side of the housing 5, and the electromagnetic noise can be quickly discharged to the vehicle side member via the collar member 8. Therefore, the power conversion device 1 can effectively suppress noise interference with electrical components in the housing and peripheral devices around the housing.

[0139] <Ninth embodiment> In the eighth embodiment, the housing 5 has the inner shield layers 55a, 56a and the outer shield layers 55b, 56b in addition to the shield layers 41, 42. In contrast, in the ninth embodiment, the housing 5 does not have the inner shield layers 55a, 56a, but has the outer shield layers 55b, 56b. The configurations, actions, and effects of the ninth embodiment that are not particularly described are the same as those of the eighth embodiment. The ninth embodiment will be described mainly with respect to the differences from the eighth embodiment.

[0140] The housing 5 shown in Fig. 10 has shield layers 41, 42 and outer shield layers 55b, 56b. The shield layers 41, 42 and the outer shield layers 55b, 56b are electrically connected to each other via the collar member 7 and the connection layers 43, 44, etc. The internal space 5c is doubly shielded by the shield layers 41, 42 and the outer shield layers 55b, 56b. With this configuration, the housing 5 can block electromagnetic noise and can quickly discharge the electromagnetic noise to a vehicle-side member via the collar member 8, by the shield layers 41, 42 and the outer shield layers 55b, 56b.

[0141] Tenth embodiment In the tenth embodiment, the power conversion device 1 in the above ninth embodiment has a support base 262 in contact with the outer shield layer 55b. The configurations, actions, and effects of the tenth embodiment that are not particularly described are similar to those of the above ninth embodiment. The tenth embodiment will be described mainly with respect to the points that are different from the above ninth embodiment.

[0142] 11 has outer shield layers 55b, 56b and a support base 362. The support base 362 has a support protrusion 63 and a support embedded portion 64, similar to the support base 62 of the first embodiment.

[0143] The support base 362 is electrically conductively connected to the outer shield layer 55b. The support base 362 has the support embedded portion 64 embedded in the lower case 51 so as to be in contact with the outer shield layer 55b. In the support base 362, the support embedded portion 64 is in contact with the outer shield layer 55b. For example, the support embedded portion 64 penetrates the outer shield layer 55b. The outer peripheral surface of the support embedded portion 64 is in contact with the outer shield layer 55b, and this contact portion is fixed by soldering, welding, or the like. In the support base 362, the support conductive portion is in contact with the outer shield layer 55b. The support base 362 is sometimes referred to as an outer support base. The support embedded portion 64 may or may not protrude outward from the outer shield layer 55b.

[0144] The support base 362 is conductively connected to the case shield layer 41 in addition to the outer shield layer 55b. In the support base 362, similar to the first embodiment, the embedded support portion 64 is in contact with the case shield layer 41. In the lower case 51, the outer shield layer 55b and the case shield layer 41 are conductively connected via the support base 362. The support base 362 corresponds to an embedded support base.

[0145] <Other embodiments> The disclosure of this specification is not limited to the exemplified embodiments. The disclosure includes the exemplified embodiments and modifications made by those skilled in the art based thereon. For example, the disclosure is not limited to the combination of parts and elements shown in the embodiments, and can be implemented in various modifications. The disclosure can be implemented by various combinations. The disclosure can have additional parts that can be added to the embodiments. The disclosure includes those in which parts and elements of the embodiments are omitted. The disclosure includes the replacement or combination of parts and elements between one embodiment and another embodiment. The disclosed technical scope is not limited to the description of the embodiments. The disclosed technical scope is indicated by the description of the claims, and should be interpreted as including all modifications within the meaning and scope equivalent to the description of the claims.

[0146] The collar member and the shield layer disclosed in this specification are formed to include a metal or a material having electrical conductivity other than metal. The power conversion device includes a collar member and a shield layer having a higher electrical conductivity per unit volume than the housing.

[0147] The power converter capable of achieving the object disclosed in the specification is not limited to the configuration of the shield layer shown in the drawings. The collar member may be plated in the same manner as the shield layer. For example, when forming the shield layer, the collar member may also be plated to form a conductive layer.

[0148] In the above-described embodiment, the shield layers 41 and 42 are not limited to a configuration that completely covers the entire internal space 5c as long as they are provided in a range that can effectively suppress external radiation of electromagnetic noise. For example, at least one of the shield layers 41 and 42 may be provided, or the shield layers 41 and 42 may extend along a part of the internal space 5c.

[0149] In each of the above embodiments, the collar member 8 may be in contact with the case shield layer 41. An example of this configuration is the configuration of the sixth embodiment. In the first embodiment, the case shield layer 41 may be embedded in the fixed portion 513 so as to extend from the side wall portion 511 toward the fixed portion 513, and the collar member 8 may be in contact with a portion of the case shield layer 41 embedded in the fixed portion 513.

[0150] In each of the above embodiments, a fixed portion such as fixed portion 513 may be included in at least one of lower case 51 and cover member 52. For example, in a configuration in which lower case 51 and cover member 52 each include a fixed portion, collar member 8 may be provided so as to penetrate between the fixed portion of lower case 51 and the fixed portion of cover member 52. In this case, collar member 8 can realize both the fixation of lower case 51 and cover member 52, and the fixation of housing 5 to installation stand 13.

[0151] In each of the above embodiments, the built-in shielding layer such as the shielding layers 41 and 42 may be formed of multiple types of materials. For example, the built-in shielding layer may have a portion formed of a mesh material and a portion formed of a sheet material. The built-in shielding layer may also be formed of a conductive linear member. For example, the linear member may be provided so as to extend along the internal space 5c.

[0152] In each of the above embodiments, the connection layers 43, 44, the first collar 71, the second collar 72, the collar members 8, 108, the connection rods 45, 46, and the conductor 81 may have magnetism similar to the shield layers 41, 42. For example, the collar members 8, 108 may be formed containing a magnetic material such as iron. In each of the above embodiments, the vehicle on which the power conversion device 1 is mounted includes a passenger car, a bus, a construction vehicle, an agricultural machine vehicle, and the like. In addition, a vehicle is one of the moving bodies, and the moving bodies on which the power conversion device 1 is mounted include trains, airplanes, ships, and the like in addition to vehicles. The power conversion device 1 includes an inverter device and a converter device. Examples of the converter device include an AC input / DC output power supply device, a DC input / DC output power supply device, and an AC input / AC output power supply device. The power conversion device 1 may not be a mobile type mounted on a moving body, but may be a stationary type not mounted on a moving body. [Explanation of symbols]

[0153] 1...power conversion device, 2...semiconductor module, 3...smoothing capacitor as capacitor, 4...Y capacitor as capacitor, 5...housing, 5a...inner surface of housing as inner surface, 5b...outer surface of housing as outer surface, 5c...internal space, 50...housing main body as shield built-in part, 50a...inner surface of housing as built-in inner part, 50b...outer surface of housing as built-in outer part, 51...lower case as first case member, 513...fixed part, 52...cover member as second case member, 8...collar member as penetrating collar member, 108... Collar member as conductive collar member, 8b...vehicle side contact portion, 8c...shield side contact portion, 12...fixing device, 13...installation base as vehicle side member, 14...cooling member, 41...case shield layer as built-in shielded layer, 42...cover shield layer as built-in shielded layer, 43...case connection layer as conductive connection portion and conductive connection layer, 45...case connection rod as conductive connection portion, 62...support base as embedded support base, 162...support base, 262...support base, 362...support base as embedded support base, 81...conductor as conductive connection portion.

Claims

1. A power conversion device (1) for converting electric power, A plurality of semiconductor modules (2); A capacitor (3, 4) electrically connected to the semiconductor module; a housing (5) housing the semiconductor module and the capacitor; a built-in shielding layer (41, 42) which is a conductive layer and is built between an inner surface (5a) and an outer surface (5b) of the housing and extends so as to cover an internal space (5c) of the housing; a collar member (8, 108) that is provided integrally with the housing in order to fix the housing to a vehicle-side member (13) using a fastener (12), the collar member having electrical conductivity and through which the fastener can be inserted; a conductive connection portion (43, 45, 81) that electrically connects the built-in shield layer and the collar member in a conductive manner; As the collar member, a through-hole collar member (8) is provided in a state where it penetrates a fixed portion (513) of the housing that is fixed to the vehicle side member; Equipped with the collar member and the built-in shielding layer are electrically connected to each other; The conductive connection portion is built into the fixed portion and is in contact with both the built-in shield layer and the collar member.

2. The conductive connection portion is 2. The power conversion device according to claim 1, further comprising a conductive connection layer (43) that contacts each of the built-in shielding layer and the collar member and extends in a direction perpendicular to the direction in which the collar member penetrates the fixed portion.

3. The collar member includes a conductive collar member (108) that electrically connects the vehicle-side member and the built-in shielding layer, The conductive collar member is A vehicle side contact portion (8b) in contact with the vehicle side member; a shield-side contact portion (8c) embedded in the housing so as to contact the built-in shield layer; The power conversion device according to claim 1 or 2, further comprising:

4. A power conversion device (1) for converting electric power, A plurality of semiconductor modules (2); A capacitor (3, 4) electrically connected to the semiconductor module; a housing (5) housing the semiconductor module and the capacitor; a built-in shielding layer (41, 42) which is a conductive layer and is built between an inner surface (5a) and an outer surface (5b) of the housing and extends so as to cover an internal space (5c) of the housing; a collar member (8, 108) that is provided integrally with the housing in order to fix the housing to a vehicle-side member (13) using a fastener (12), the collar member having electrical conductivity and through which the fastener can be inserted; As the collar member, a conductive collar member (108) that electrically connects the vehicle side member and the built-in shielding layer in a conductive manner; Equipped with the collar member and the built-in shielding layer are electrically connected to each other; The conductive collar member is A vehicle side contact portion (8b) in contact with the vehicle side member; a shield-side contact portion (8c) embedded in the housing so as to contact the built-in shield layer; A power conversion device having the following features.

5. The housing includes: a shield-embedded portion (50) that forms the inner surface and the outer surface and that incorporates the embedded shield layer; A power conversion device as described in any one of claims 1 to 4, wherein in the shield built-in portion, the built-in shield layer is provided between a built-in inner portion (50a) forming the inner surface and a built-in outer portion (50b) forming the outer surface.

6. the built-in shielding layer has a porous member having a large number of holes formed therein, The power conversion device according to claim 5 , wherein the built-in inner portion and the built-in outer portion are connected to each other via the holes of the porous member.

7. the built-in shielding layer has a mesh member, The power conversion device according to claim 5 or 6, wherein the built-in inner portion and the built-in outer portion are connected via meshes of the mesh member.

8. a support base (62, 162, 262, 362) that supports a Y capacitor included in the capacitor in an electrically conductive manner inside the housing, 8. The power conversion device according to claim 1, wherein the built-in shield layer is electrically conductively connected to the support base.

9. The housing includes a first case member (51) in which the built-in shielding layer is provided, and a second case member (52) attached to the first case member so as to cover an internal space of the first case member, The power conversion device according to claim 8 , wherein the first case member is provided with the support base and the collar member.

10. 10. The power conversion device according to claim 8, further comprising, as the support base, an embedded support base (62, 362) at least a portion of which is embedded in the housing and in contact with the built-in shielding layer.

11. a cooling member (14) capable of cooling the semiconductor module by being in thermally conductive contact with the semiconductor module, the cooling member having electrical conductivity, and electrically conductively connected to the built-in shielding layer; A power conversion device as described in any one of claims 8 to 10, wherein the support base is provided in contact with the cooling member, and is conductively connected to the built-in shielding layer via the cooling member.

Images