Electronic component manufacturing method and electronic component manufacturing device

Abstract

To provide a method for manufacturing electronic components which increases a transfer property and an alignment property of electronic components.SOLUTION: A method for manufacturing an electronic component includes an aligning step of aligning electronic components 1 at one time by using an alignment device 100. The alignment device 100 includes: a second flat plate 120 with a second through-hole 122; and a third flat plate 130 with a third through-hole 132 smaller than the second through-hole, an elastic member 134 being arranged in an inner wall of the third flat plate. In the aligning step, the electronic components 1 which are aligned by a magnet 150 and are dropped in the second through-hole 122 are pressed by a pressing member 160, and the electronic components 1 in the second through-hole 122 are moved to the third through-hole 132 and the electronic components 1 are retained by the elastic member 134.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a method and an apparatus for manufacturing electronic components. [Background technology]

[0002] When manufacturing electronic components, a holding jig is used to hold the electronic components in a predetermined state. Patent Document 1 discloses such a holding jig and an alignment plate. The holding jig disclosed in Patent Document 1 has a holding hole whose inner surface is elastic, and the alignment plate is disposed on the upper surface side of the holding jig and has a plurality of through holes. Patent Document 1 also describes: -Placing multiple electronic components on the alignment plate, The alignment plate is vibrated to cause the electronic components to be inserted into the through holes of the alignment plate, thereby aligning the electronic components; Using a pressing member, the electronic components transferred onto the alignment plate are pressed into the holding holes of the holding jig, thereby holding the electronic components. It is disclosed that the electronic components are thereby aligned and held. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2010-182876 A Summary of the Invention [Problem to be solved by the invention]

[0004] From the viewpoint of the alignment of the electronic components, it is preferable that the through holes in the alignment plate are small. However, if the through holes in the alignment plate are small, it becomes difficult to insert the electronic components into the through holes in the alignment plate when the alignment plate is vibrated to insert the electronic components into the through holes in the alignment plate.

[0005] Therefore, from the viewpoint of the ease of transferring electronic components, it is necessary to enlarge the through holes in the alignment plate. However, if the through holes in the alignment plate are enlarged, the posture of the electronic components in the through holes in the alignment plate becomes unstable. Therefore, when the electronic components are pressed into the holding holes of the holding jig, the electronic components are aligned and held in an unstable posture.

[0006] The present invention relates to an electronic component. Alignment The present invention aims to provide a method and apparatus for manufacturing electronic components that improves the manufacturing efficiency of electronic components. [Means for solving the problem]

[0007] The method for manufacturing electronic components according to the present invention includes an alignment step of aligning a plurality of electronic components together using an alignment device. The alignment device includes a second flat plate having a plurality of second through holes aligned in a predetermined direction, and a third flat plate having a plurality of third through holes aligned in the predetermined direction and arranged so as to overlap the second flat plate, the third through holes being smaller than the second through holes, and a plurality of elastic members being arranged on inner walls of the third through holes, respectively. The alignment step includes a first holding step of pressing the plurality of electronic components aligned by a magnet and dropped into the plurality of second through holes, respectively, using a plurality of pressing members, thereby moving the plurality of electronic components in the plurality of second through holes to the plurality of third through holes, respectively, and holding the plurality of electronic components by the plurality of elastic members on the inner walls of the plurality of third through holes, respectively.

[0008] The electronic component manufacturing apparatus according to the present invention includes an alignment device for aligning a plurality of electronic components together. The alignment device includes a second flat plate having a plurality of second through holes aligned in a predetermined direction, a third flat plate having a plurality of third through holes aligned in the predetermined direction and arranged to overlap the second flat plate, the third through holes being smaller than the second through holes, and a plurality of elastic members being arranged on inner walls of the third through holes, respectively, and a control unit for controlling the alignment device as a whole. The control unit uses a plurality of pressing members to press the plurality of electronic components, respectively, to move the plurality of electronic components that have been dropped into the plurality of second through holes and aligned by a magnet to the plurality of third through holes, respectively, and hold the plurality of electronic components by the plurality of elastic members on the inner walls of the plurality of third through holes, respectively. Effect of the Invention

[0009] According to the present invention, Alignment can be improved. [Brief description of the drawings]

[0010] [Figure 1] 2 is a schematic plan view showing an alignment device included in the electronic component manufacturing apparatus according to the present embodiment. FIG. [Diagram 2] 2 is a schematic cross-sectional view taken along line II-II of an alignment device included in the electronic component manufacturing apparatus shown in FIG. 1. [Diagram 3] 10 is a schematic diagram showing a transfer step in an alignment step in the method for manufacturing an electronic component according to the present embodiment. FIG. [Figure 4] 4 is a schematic diagram showing a first alignment step (first plate alignment step) in the alignment process in the method for manufacturing an electronic component according to the present embodiment. FIG. [Diagram 5] 4 is a schematic diagram showing a second alignment step (second plate alignment step) in the alignment step in the manufacturing method for an electronic component according to the present embodiment. FIG. [Figure 6] 5 is a schematic diagram showing a first holding step in an alignment step in the method for manufacturing an electronic component according to the present embodiment. FIG. [Figure 7] 5 is a schematic diagram showing a second holding step in an alignment step in the method for manufacturing an electronic component according to the present embodiment. FIG. [Figure 8] 5 is a schematic diagram showing a conductive member arrangement step in the manufacturing method for the electronic component according to the embodiment. FIG. [Figure 9] 1 is a perspective view showing an example (multilayer ceramic capacitor) of an electronic component according to an embodiment of the present invention. [Figure 10] 10 is a cross-sectional view (LT cross-section) taken along line XX of an example (multilayer ceramic capacitor) of the electronic component shown in FIG. 9. [Figure 11] 10 is a cross-sectional view (WT cross-section) taken along line XI-XI of a multilayer ceramic capacitor, which is an example of the electronic component shown in FIG. 9. [Figure 12] 10A and 10B are schematic cross-sectional views showing an alignment device and an alignment step for electronic components according to a comparative example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings, in which the same or corresponding parts are designated by the same reference numerals.

[0012] (Electronic components: multilayer ceramic capacitors) First, a multilayer ceramic capacitor will be described as an example of an electronic component manufactured by the manufacturing method and manufacturing apparatus according to the present embodiment with reference to Figs. 9 to 11. Fig. 9 is a perspective view showing an example (multilayer ceramic capacitor) of the electronic component according to the present embodiment, Fig. 10 is a cross-sectional view of the example (multilayer ceramic capacitor) of the electronic component shown in Fig. 9 taken along line XX, and Fig. 11 is a cross-sectional view of the example (multilayer ceramic capacitor) of the electronic component shown in Fig. 9 taken along line XI-XI. The electronic component (multilayer ceramic capacitor) 1 shown in Figs. 9 to 11 includes a laminate 10, an external electrode 40, and a conductive member 50. The external electrode 40 includes a first external electrode 41 and a second external electrode 42.

[0013] 9 to 11 show an XYZ orthogonal coordinate system. The X direction is the length direction L of the electronic component 1 and the laminate 10, the Y direction is the width direction W of the electronic component 1 and the laminate 10, and the Z direction is the stacking direction T of the electronic component 1 and the laminate 10. Thus, the cross section shown in Fig. 10 is also referred to as an LT cross section, and the cross section shown in Fig. 11 is also referred to as a WT cross section.

[0014] The length direction L, the width direction W, and the stacking direction T do not necessarily have to be perpendicular to each other, and may intersect each other.

[0015] The laminate 10 has a generally rectangular parallelepiped shape and has a first main surface TS1 and a second main surface TS2 facing each other in the stacking direction T, a first side surface WS1 and a second side surface WS2 facing each other in the width direction W, and a first end surface LS1 and a second end surface LS2 facing each other in the longitudinal direction L.

[0016] It is preferable that the corners and ridges of the laminate 10 are rounded. A corner is a portion where three faces of the laminate 10 intersect, and a ridge is a portion where two faces of the laminate 10 intersect.

[0017] 10 and 11, the laminate 10 has a plurality of dielectric layers 20 and a plurality of internal electrode layers 30 stacked in a stacking direction T. The laminate 10 also has, in the stacking direction T, an inner layer portion 10A, and a first outer layer portion 10B and a second outer layer portion 10C arranged so as to sandwich the inner layer portion 10A therebetween.

[0018] The inner layer portion 10A includes some of the multiple dielectric layers 20 and multiple internal electrode layers 30. In the inner layer portion 10A, the multiple internal electrode layers 30 are arranged facing each other via the dielectric layers 20. The inner layer portion 10A is a portion that generates electrostatic capacitance and substantially functions as a capacitor.

[0019] The first outer layer portion 10B is disposed on the first main surface TS1 side of the laminate 10, and the second outer layer portion 10C is disposed on the second main surface TS2 side of the laminate 10. More specifically, the first outer layer portion 10B is disposed between the internal electrode layer 30 closest to the first main surface TS1 among the multiple internal electrode layers 30 and the first main surface TS1, and the second outer layer portion 10C is disposed between the internal electrode layer 30 closest to the second main surface TS2 among the multiple internal electrode layers 30 and the second main surface TS2. The first outer layer portion 10B and the second outer layer portion 10C do not include the internal electrode layer 30, and each includes a portion of the multiple dielectric layers 20 other than the portion for the internal layer portion 10A. The first outer layer portion 10B and the second outer layer portion 10C are portions that function as protective layers for the internal layer portion 10A.

[0020] The material of the dielectric layer 20 may be, for example, a dielectric ceramic containing BaTiO3, CaTiO3, SrTiO3, CaZrO3, or the like as a main component. The material of the dielectric layer 20 may also contain a Mn compound, an Fe compound, a Cr compound, a Co compound, a Ni compound, or the like as a secondary component.

[0021] The multiple internal electrode layers 30 include multiple first internal electrode layers 31 and multiple second internal electrode layers 32. The multiple first internal electrode layers 31 and the multiple second internal electrode layers 32 are alternately arranged in the stacking direction T of the laminate 10.

[0022] The first internal electrode layer 31 includes a counter electrode portion 31A and a lead electrode portion 31B, and the second internal electrode layer 32 includes a counter electrode portion 32A and a lead electrode portion 32B.

[0023] The counter electrode portion 31A and the counter electrode portion 32A face each other via the dielectric layer 20 in the stacking direction T of the laminate 10. The shapes of the counter electrode portion 31A and the counter electrode portion 32A are not particularly limited and may be, for example, substantially rectangular. The counter electrode portion 31A and the counter electrode portion 32A are portions that generate electrostatic capacitance and substantially function as a capacitor.

[0024] The extracted electrode portion 31B extends from the counter electrode portion 31A toward a first end face LS1 of the laminate 10 and is exposed at the first end face LS1. The extracted electrode portion 32B extends from the counter electrode portion 32A toward a second end face LS2 of the laminate 10 and is exposed at the second end face LS2. The shapes of the extracted electrode portion 31B and the extracted electrode portion 32B are not particularly limited and may be, for example, a substantially rectangular shape.

[0025] As a result, the first internal electrode layer 31 is connected to the first external electrode 41, and a gap exists between the first internal electrode layer 31 and the second end face LS2 of the laminate 10, i.e., the second external electrode 42. In addition, the second internal electrode layer 32 is connected to the second external electrode 42, and a gap exists between the second internal electrode layer 32 and the first end face LS1 of the laminate 10, i.e., the first external electrode 41.

[0026] The first internal electrode layer 31 and the second internal electrode layer 32 contain metal Ni as a main component. The first internal electrode layer 31 and the second internal electrode layer 32 may contain at least one selected from metals such as Cu, Ag, Pd, or Au, or alloys containing at least one of these metals, such as an Ag-Pd alloy, as a main component or as a component other than the main component. Furthermore, the first internal electrode layer 31 and the second internal electrode layer 32 may contain particles of a dielectric material having the same composition as the ceramic contained in the dielectric layer 20 as a component other than the main component. In this specification, the metal of the main component is defined as the metal component with the highest weight percentage.

[0027] As shown in FIG. 11, the laminate 10 has an electrode facing portion W30 where the internal electrode layers 30 face each other in the width direction W, and a first side gap portion WG1 and a second side gap portion WG2 arranged to sandwich the electrode facing portion W30. The first side gap portion WG1 is located between the electrode facing portion W30 and the first side surface WS1, and the second side gap portion WG2 is located between the electrode facing portion W30 and the second side surface WS2. More specifically, the first side gap portion WG1 is located between the end of the internal electrode layer 30 on the first side surface WS1 side and the first side surface WS1, and the second side gap portion WG2 is located between the end of the internal electrode layer 30 on the second side surface WS2 side and the second side surface WS2. The first side gap portion WG1 and the second side gap portion WG2 do not include the internal electrode layer 30, and only include the dielectric layer 20. The first side gap WG1 and the second side gap WG2 are portions that function as protective layers for the internal electrode layer 30. The first side gap WG1 and the second side gap WG2 are also called W gaps.

[0028] As shown in Fig. 10, the laminate 10 has an electrode facing portion L30 where the first internal electrode layer 31 and the second internal electrode layer 32 of the internal electrode layer 30 face each other, a first end gap portion LG1, and a second end gap portion LG2 in the length direction L. The first end gap portion LG1 is located between the electrode facing portion L30 and the first end face LS1, and the second end gap portion LG2 is located between the electrode facing portion L30 and the second end face LS2. More specifically, the first end gap portion LG1 is located between the end of the second internal electrode layer 32 on the first end face LS1 side and the first end face LS1, and the second end gap portion LG2 is located between the end of the first internal electrode layer 31 on the second end face LS2 side and the second end face LS2. The first end gap LG1 does not include the second internal electrode layer 32 but includes the first internal electrode layer 31 and the dielectric layer 20, and the second end gap LG2 does not include the first internal electrode layer 31 but includes the second internal electrode layer 32 and the dielectric layer 20. The first end gap LG1 is a portion that functions as a lead-out electrode portion to the first end face LS1 of the first internal electrode layer 31, and the second end gap LG2 is a portion that functions as a lead-out electrode portion to the second end face LS2 of the second internal electrode layer 32. The first end gap LG1 and the second end gap LG2 are also referred to as L gaps.

[0029] The electrode opposing portion L30 is provided with the opposing electrode portion 31A of the first internal electrode layer 31 and the opposing electrode portion 32A of the second internal electrode layer 32. The first end gap portion LG1 is provided with the lead-out electrode portion 31B of the first internal electrode layer 31, and the second end gap portion LG2 is provided with the lead-out electrode portion 32B of the second internal electrode layer 32.

[0030] The external electrodes 40 include a first external electrode 41 and a second external electrode 42 .

[0031] The first external electrode 41 is disposed on a first end face LS1 of the laminate 10, and is connected to the first internal electrode layer 31. The first external electrode 41 may extend from the first end face LS1 to a part of the first main face TS1 and a part of the second main face TS2. The first external electrode 41 may also extend from the first end face LS1 to a part of the first side face WS1 and a part of the second side face WS2.

[0032] The second external electrode 42 is disposed on the second end face LS2 of the laminate 10, and is connected to the second internal electrode layer 32. The second external electrode 42 may extend from the second end face LS2 to a part of the first main face TS1 and a part of the second main face TS2. The second external electrode 42 may also extend from the second end face LS2 to a part of the first side face WS1 and a part of the second side face WS2.

[0033] The first external electrode 41 has a first base electrode layer 41A and a first plating layer 41B, and the second external electrode 42 has a second base electrode layer 42A and a second plating layer 42B. The first external electrode 41 may be composed of only the first plating layer 41B, and the second external electrode 42 may be composed of only the second plating layer 42B.

[0034] The first base electrode layer 41A and the second base electrode layer 42A may be fired layers containing a metal and glass. The glass may be a glass component containing at least one selected from B, Si, Ba, Mg, Al, Li, etc. As a specific example, borosilicate glass may be used. The metal may contain Cu as a main component. The metal may contain at least one selected from metals such as Ni, Ag, Pd, or Au, or alloys such as Ag-Pd alloy, as a main component or as a component other than the main component.

[0035] The fired layer is a layer formed by applying a conductive paste containing metal and glass to the laminate by a dipping method and firing the layer. The fired layer may be fired after firing the internal electrode layer, or may be fired simultaneously with the internal electrode layer. The fired layer may be a multi-layer structure.

[0036] Alternatively, the first base electrode layer 41A and the second base electrode layer 42A may be a resin layer containing conductive particles and a thermosetting resin. The resin layer may be formed on the above-mentioned fired layer, or may be formed directly on the laminate without forming a fired layer.

[0037] The resin layer is a layer formed by applying a conductive paste containing conductive particles and a thermosetting resin to the laminate by a coating method and then firing the conductive paste. The resin layer may be fired after firing the internal electrode layer, or may be fired simultaneously with the internal electrode layer. The resin layer may be a multi-layer structure.

[0038] The thickness of each of the first base electrode layer 41A and the second base electrode layer 42A as the fired layer or resin layer is not particularly limited, and may be 1 μm or more and 10 μm or less.

[0039] Alternatively, the first underlying electrode layer 41A and the second underlying electrode layer 42A may be a thin film layer of 1 μm or less formed by a thin film formation method such as sputtering or vapor deposition, on which metal particles are deposited.

[0040] The first plating layer 41B covers at least a portion of the first base electrode layer 41A, and the second plating layer 42B covers at least a portion of the second base electrode layer 42A. The first plating layer 41B and the second plating layer 42B each contain at least one selected from metals such as Cu, Ni, Ag, Pd, or Au, or alloys such as an Ag-Pd alloy.

[0041] Each of the first plating layer 41B and the second plating layer 42B may be formed of multiple layers. Preferably, it has a two-layer structure of Ni plating and Sn plating. The Ni plating layer can prevent the base electrode layer from being eroded by solder when mounting the ceramic electronic component, and the Sn plating layer can improve the wettability of the solder when mounting the ceramic electronic component, making it easier to mount.

[0042] The thickness of each of first plating layer 41B and second plating layer 42B is not particularly limited, and may be 1 μm or more and 10 μm or less.

[0043] The conductive member 50 is disposed on the mounting surface side of the external electrodes 40, i.e., the first external electrode 41 and the second external electrode 42. The conductive member 50 may be a bump or an interposer. This can suppress the generation of so-called squealing noise. This will be described in detail below.

[0044] In such an electronic component 1, when a voltage is applied between the external electrodes 40, the dielectric layer 20 generates an electric field-induced distortion in response to the applied voltage. When the electronic component 1 is surface-mounted on a substrate, this electric field-induced distortion causes the electronic component 1 to deform the substrate, generating a sound called "ringing" depending on the frequency of this deformation. When this "ringing" becomes louder, it causes a noise problem.

[0045] Regarding this problem, it is known that the wetting up of solder can be suppressed to suppress squeal. For example, by arranging a conductive member 50 such as a bump or an interposer on the mounting surface side of the electronic component 1, the wetting up of solder can be suppressed, and the occurrence of squeal can be suppressed.

[0046] (Electronic component manufacturing method) Next, a method for manufacturing the above-mentioned electronic component (multilayer ceramic capacitor) 1 will be described. First, a dielectric sheet for the dielectric layer 20 and a conductive paste for the internal electrode layer 30 are prepared. The dielectric sheet and the conductive paste contain a binder and a solvent. Known materials can be used as the binder and the solvent.

[0047] Next, a conductive paste is printed on the dielectric sheet in a predetermined pattern, for example, to form an internal electrode pattern on the dielectric sheet. The internal electrode pattern can be formed by screen printing, gravure printing, or the like.

[0048] Next, a predetermined number of dielectric sheets for the second outer layer portion 10C, on which no internal electrode pattern is printed, are laminated. Dielectric sheets for the inner layer portion 10A, on which the internal electrode pattern is printed, are laminated in sequence. A predetermined number of dielectric sheets for the first outer layer portion 10B, on which no internal electrode pattern is printed, are laminated. This produces a laminate sheet.

[0049] Next, the laminated sheet is pressed in the lamination direction by means of a hydrostatic press or the like to produce a laminated block. Next, the laminated block is cut to a predetermined size to cut out laminated chips. At this time, the corners and ridges of the laminated chips are rounded by barrel polishing or the like. Next, the laminated chips are fired to produce the laminate 10. The firing temperature depends on the materials of the dielectric and the internal electrodes, but is preferably 900°C or higher and 1400°C or lower.

[0050] The laminated chip may be fabricated by a method of later adding a dielectric to the side gaps on the side surfaces WS1 and WS2 of the laminate in the width direction W. In this case, the ends of both sides of the internal electrode layer in the width direction W are aligned (within an error of, for example, 5 μm).

[0051] Next, the first end face LS1 of the laminate 10 is immersed in a conductive paste that is an electrode material for the base electrode layer by using a dipping method, thereby applying a conductive paste for the first base electrode layer 415 to the first end face LS1. Similarly, the second end face LS2 of the laminate 10 is immersed in a conductive paste that is an electrode material for the base electrode layer by using a dipping method, thereby applying a conductive paste for the second base electrode layer 425 to the second end face LS2. Then, these conductive pastes are fired to form the first base electrode layer 415 and the second base electrode layer 425, which are fired layers. The firing temperature is preferably 600°C or higher and 900°C or lower.

[0052] As described above, the first base electrode layer 415 and the second base electrode layer 425, which are resin layers, may be formed by applying a conductive paste containing conductive particles and a thermosetting resin by a coating method and baking it, or the first base electrode layer 415 and the second base electrode layer 425, which are thin films, may be formed by a thin film formation method such as a sputtering method or a vapor deposition method.

[0053] In the above description, the base electrode layer is formed and fired after the laminated chip is fired, i.e., the laminate and the external electrodes are fired separately. However, the base electrode layer may be formed and fired before the laminated chip is fired, i.e., the laminate and the external electrodes may be fired simultaneously.

[0054] Thereafter, a first plating layer 416 is formed on the surface of the first base electrode layer 415 to form a first external electrode 41, and a second plating layer 426 is formed on the surface of the second base electrode layer 425 to form a second external electrode 42. Through the above steps, the above-mentioned electronic component (multilayer ceramic capacitor) 1 is obtained.

[0055] Thereafter, the electronic components 1 are aligned and held together (alignment step). The alignment step and an alignment device used in the alignment step will be described later.

[0056] Thereafter, a conductive member 50 such as a bump or an interposer is disposed on the mounting surface side of the external electrode 40, i.e., the first external electrode 41 and the second external electrode 42 (conductive member disposing step). For example, when forming a bump, a conductive paste is applied or printed on the mounting surface side of the first external electrode 41 and the second external electrode 42, and then fired. The conductive paste may be a metal material containing at least one high melting point metal selected from Cu and Ni, and Sn as a low melting point metal.

[0057] (Electronic parts manufacturing equipment: Alignment equipment) Next, an alignment device in an electronic component manufacturing apparatus according to this embodiment will be described with reference to Fig. 1 and Fig. 2. Fig. 1 is a schematic plan view showing the alignment device in an electronic component manufacturing apparatus according to this embodiment, and Fig. 2 is a schematic cross-sectional view taken along line II-II of the alignment device in the electronic component manufacturing apparatus shown in Fig. 1.

[0058] 1 and 2 is an apparatus for aligning and holding electronic components 1 together in the alignment step in the above-mentioned electronic component manufacturing method. Alignment apparatus 100 includes a first alignment plate (first flat plate) 110, a second alignment plate (second flat plate) 120, a holding jig (third flat plate) 130, a holding plate (fourth flat plate) 140, a magnet 150, a stand 152, a plurality of pressing members 160, and a control unit 170.

[0059] In addition, in Fig. 1, components other than the first alignment plate 110, the second alignment plate 120, and the holding jig 130 in the alignment device 100 in Fig. 2 are omitted. In addition, an XYZ orthogonal coordinate system is shown in Fig. 1 and Fig. 2. In addition, the XYZ orthogonal coordinate system in Fig. 1 and Fig. 2 does not necessarily match the XYZ orthogonal coordinate system in Fig. 9 to Fig. 11. In Fig. 1 and Fig. 2, the XY plane is a plane along the upper and lower surfaces of the first alignment plate 110, the second alignment plate 120, the holding jig 130, and the holding plate 140, and the Z direction is the overlapping direction of the first alignment plate 110, the second alignment plate 120, the holding jig 130, and the holding plate 140.

[0060] The first alignment plate 110 has a plurality of first through holes 112 aligned in the Y direction (a predetermined direction) and the X direction. The first through holes 112 are rectangular or approximately rectangular in shape corresponding to the shape of the electronic component 1. For example, if the length of the electronic component 1 in the longitudinal direction L is L1, the width in the width direction W is W1, and the thickness in the thickness direction T is T1 (for example, for a 1206 size, generally, L1=2×W1=2×T1), the size of the first through holes 112 in the X direction may be larger than L1, and is preferably about 1.2×L1. The size of the first through holes 112 in the Y direction is given by √(W1 2 +T1 2The size of the first through hole 112 in the Z direction is preferably greater than √(W1 2 +T1 2 )×W1. This makes it easier to insert electronic component 1 into first through hole 112 in a inserting step described below. Also, it makes it easier to rotate electronic component 1 in first through hole 112 in a first alignment step described below.

[0061] The upper surface side of the periphery of the first through-hole 112 in the first alignment plate 110 is tapered. This makes it easier to insert the electronic component 1 into the first through-hole 112 in the inserting step described below.

[0062] The first alignment plate 110 includes a metal, a resin, or an elastic material, which can reduce damage to the electronic components 1.

[0063] The second alignment plate 120 has a plurality of second through holes 122 aligned in the Y direction (predetermined direction) and the X direction. The second alignment plate 120 is disposed on the lower surface side of the first alignment plate 110 so that at least a portion of the second through holes 122 does not overlap with the first through holes 112. The second through holes 122 are rectangular or substantially rectangular in shape in accordance with the shape of the electronic component 1. The size of the second through holes 122 in the Y direction is smaller than the size of the first through holes 112 in the Y direction. The sizes of the second through holes 122 in the X direction and the Z direction may be the same as the sizes of the first through holes 112 in the X direction and the Z direction. This makes it possible to stabilize the posture of the electronic component 1 in a second alignment step and a first holding step described later.

[0064] The upper surface side of the periphery of the second through-hole 122 in the second alignment plate 120 is tapered. This makes it easier to rotate the electronic component 1 by 90 degrees when dropping it into the second through-hole 122 in the second alignment step described below.

[0065] The second alignment plate 120 includes a metal, a resin, or an elastic material, which can reduce damage to the electronic components 1.

[0066] The holding jig 130 is disposed on the lower surface side of the second alignment plate 120. The holding jig 130 has a plurality of third through holes 132 aligned in the Y direction (predetermined direction) and the X direction. An elastic member 134 is disposed on the inner wall of the third through hole 132. The holding jig 130 holds the electronic component 1 in the third through hole 132 by the elastic member 134 on the inner wall of the third through hole 132.

[0067] The third through hole 132 has a rectangular or approximately rectangular shape corresponding to the shape of the electronic component 1. The size in the Y direction of the third through hole 132 is smaller than the size in the Y direction of the first through hole 112. The sizes in the X direction and the Z direction of the third through hole 132 may be the same as the sizes in the X direction and the Z direction of the second through hole 122.

[0068] The holding jig 130 includes metal or resin, and the elastic member 134 includes rubber or silicone resin, thereby making it possible to reduce damage to the electronic component 1.

[0069] The holding plate 140 has adhesiveness and holds the electronic component 1 .

[0070] The base 152 is a base for moving the magnet 150, and is disposed between the first alignment plate 110 and the magnet 150. The magnet 150 is a rectangular parallelepiped extending in the X direction, and moves in the Y direction (predetermined direction) along the base 152.

[0071] The pressing member 160 is a member for pressing the electronic component 1. The pressing member 160 has a rectangular cross-section and a rectangular parallelepiped shape extending in the Z direction, corresponding to the first through hole 112, the second through hole 122, and the third through hole 132. The pressing member 160 includes a metal, a resin, or an elastic member. This can reduce damage to the electronic component 1.

[0072] The control unit 170 controls the entire alignment device (manufacturing device) 100. The control unit 170 functions to realize a transfer step, a first alignment step, a second alignment step, a first holding step, and a second holding step in the alignment step described below.

[0073] The control unit 170 is configured with an arithmetic processor such as a central processing unit (CPU), a digital signal processor (DSP), and a field-programmable gate array (FPGA). The various functions of the control unit 170 are realized by executing a program (application) stored in the storage unit, for example. The program (application) may be provided via a network, or may be provided by being recorded on a computer readable storage medium 40 such as a compact disc read only memory (CD-ROM) or a digital versatile disc (DVD). Examples of the storage medium include non-transitory tangible media.

[0074] (Electronic component manufacturing method: Alignment process) Next, the above-mentioned alignment step in the method for producing an electronic component according to the present embodiment will be described with reference to Figs. 3 to 8. Fig. 3 is a schematic diagram showing a transfer step in the alignment step in the method for producing an electronic component according to the present embodiment. Fig. 4 is a schematic diagram showing a first alignment step (first plate alignment step) in the alignment step in the method for producing an electronic component according to the present embodiment, and Fig. 5 is a schematic diagram showing a second alignment step (second plate alignment step) in the alignment step in the method for producing an electronic component according to the present embodiment. Fig. 6 is a schematic diagram showing a first holding step in the alignment step in the method for producing an electronic component according to the present embodiment, and Fig. 7 is a schematic diagram showing a second holding step in the alignment step in the method for producing an electronic component according to the present embodiment. Also, Fig. 8 is a schematic diagram showing a conductive member arrangement step in the method for producing an electronic component according to the present embodiment.

[0075] First, a plurality of electronic components 1 having external electrodes 40 formed on the end faces of the laminate 10 are placed on the upper surface of the first alignment plate 110. Next, as shown in Fig. 3, the first alignment plate 110 is vibrated under the control of the control unit 170, so that the electronic components 1 placed on the upper surface of the first alignment plate 110 are transferred into the first through holes 112 of the first alignment plate 110, respectively (transfer process).

[0076] At this time, as described above, since the size of the first through hole 112 in the Y direction is relatively large, it is easy to insert the electronic component 1 into the first through hole 112. In addition, since the upper surface side of the periphery of the first through hole 112 in the first alignment plate 110 is tapered, it is easy to insert the electronic component 1 into the first through hole 112.

[0077] Next, as shown in Fig. 4, the stacking directions T of the electronic components 1 are aligned together. Specifically, the magnet 150 is moved in the Y direction (predetermined direction) on the stand 152 under the control of the control unit 170. This causes magnetic field lines to act on the internal electrode layers, and the electronic components 1 whose stacking directions T are not in the Y direction are rotated in the first through-holes 112, and the electronic components 1 are aligned together so that the stacking directions T of all the electronic components 1 are aligned in the Y direction, in other words, the horizontal direction (first alignment step). The moving speed of the magnet 150 is preferably 100 mm / s or less. The magnet 150 may be moved multiple times.

[0078] It should be noted that, instead of moving the magnet 150 in the X direction, the first alignment plate 110 may be moved in the X direction. That is, the magnet 150 may be moved in the X direction relative to the first alignment plate 110. Moreover, the magnet 150 may be moved on the upper surface side of the first alignment plate 110, or the magnet 150 may be moved on the lower surface side of the first alignment plate 110.

[0079] At this time, as described above, since the size of the first through hole 112 in the Y direction is relatively large, the electronic component 1 can be easily rotated in the first through hole 112. Note that, as described above, if the second alignment plate 120 is disposed on the lower surface side of the first alignment plate 110 so that at least a portion of the second through hole 122 does not overlap with the first through hole 112, the electronic component 1 can be fastened in the first through hole 112.

[0080] Next, as shown in FIG. 5, the electronic components 1 are aligned collectively so that the stacking direction T of the electronic components 1 is rotated by 90 degrees. Specifically, under the control of the control unit 170, the first alignment plate 110 is moved in the Y direction (predetermined direction) so that the first through holes 112 and the second through holes 122 are communicated with each other. As a result, the electronic components 1 in the first through holes 112 are dropped into the second through holes 122 of the second alignment plate 120. At this time, the electronic components 1 are aligned collectively so that the stacking direction T of the electronic components 1 is rotated by 90 degrees from the Y direction (predetermined direction) (second alignment step). As a result, the electronic components 1 are aligned collectively so that the stacking direction T of all the electronic components 1 in the second through holes 122 is aligned in the Z direction, in other words, vertically.

[0081] At this time, as described above, since the size of second through hole 122 in the Y direction is relatively small, the posture of electronic component 1 in second through hole 122 is stable. In addition, since the upper surface side of the periphery of second through hole 122 in second alignment plate 120 is tapered, when electronic component 1 is dropped from first through hole 112 into second through hole 122, electronic component 1 can be easily rotated by 90 degrees.

[0082] Instead of moving the first alignment plate 110 in the X direction, the second alignment plate 120 and the holding jig 130 may be moved in the X direction. That is, the first alignment plate 110 may be moved in the X direction relative to the second alignment plate 120 and the holding jig 130.

[0083] 6, electronic component 1 is held in third through hole 132 of holding jig 130. Specifically, electronic component 1 is pressed using pressing member 160 under the control of control unit 170. As a result, electronic component 1 in second through hole 122 is moved to third through hole 132 of holding jig 130, and electronic component 1 is held by elastic member 134 on the inner wall of third through hole 132 (first holding step).

[0084] At this time, since the size of second through hole 122 in the Y direction is relatively small as described above, electronic component 1 can be moved to and held in third through hole 132 while maintaining a stable posture in second through hole 122.

[0085] 7, electronic component 1 is held by holding plate 140. Specifically, under the control of control unit 170, second alignment plate 120 and first alignment plate 110 are removed from holding jig 130 to prepare holding plate 140, and electronic component 1 is pressed using pressing member 160. As a result, electronic component 1 in third through hole 132 is moved to holding plate 140, and electronic component 1 is held by holding plate 140 (second holding step).

[0086] 8, conductive members 50 such as bumps or interposers are placed on the mounting surface sides of external electrodes 40 of electronic component 1 held by holding plate 140 (conductive member placement process). For example, when forming bumps, a conductive paste is applied or printed on the mounting surface sides of first external electrode 41 and second external electrode 42, and then fired.

[0087] At this time, since the posture of electronic component 1 is stable as described above, the position of the application surface of conductive paste for conductive member 50, for example, is stable.

[0088] Here, a comparative example devised by the inventors of the present application in the process of arriving at the present embodiment described above will be described. Fig. 12 is a schematic cross-sectional view showing an alignment device and alignment process for electronic components according to the comparative example. The alignment device of the comparative example shown in Fig. 12 differs from the alignment device 100 of the present embodiment described above mainly in that it includes a first alignment plate 110, a holding jig 130, and a pressing member 160, but does not include a second alignment plate 120.

[0089] In the alignment device of the comparative example, from the viewpoint of alignment of electronic components, it is preferable that through holes 112 of first alignment plate 110 are small. However, if through holes 112 of first alignment plate 110 are made small, it becomes difficult to insert electronic components 1 into through holes 112 when first alignment plate 110 is vibrated to insert electronic components 1 into through holes 112.

[0090] Therefore, from the viewpoint of the transferability of the electronic components, it was necessary to enlarge the through holes 112 of the first alignment plate 110. However, if the through holes 112 of the first alignment plate 110 were enlarged, the posture of the electronic components 1 in the through holes 112 would become unstable. For example, the electronic components 1 would become tilted in the through holes 112. Therefore, when the electronic components 1 are pressed into the through holes 132 of the holding jig 130, the electronic components 1 are aligned and held in an unstable posture.

[0091] If electronic component 1 is aligned and held in an unstable position in holding jig 130, for example, in the conductive member arrangement process described above, the position of the application surface of the conductive paste for conductive member 50 will become unstable.

[0092] In this regard, according to the electronic component manufacturing apparatus of this embodiment, the alignment device 100 is provided with a second alignment plate 120 between the first alignment plate 110 and the holding jig 130, and the first through hole 112 of the first alignment plate 110 is relatively large, and the second through hole 122 of the second alignment plate 120 is smaller than the first through hole 112 of the first alignment plate 110. Furthermore, according to the method for manufacturing electronic components of this embodiment, in the alignment process, the electronic component 1 is transferred into the relatively large first through hole 112 of the first alignment plate 110 (transfer process), the electronic component 1 is dropped from the first through hole 112 of the first alignment plate 110 into the relatively small second through hole 122 of the second alignment plate 120 (second alignment process), and the electronic component 1 is pushed from the second through hole 122 of the second alignment plate 120 into the third through hole 132 of the holding jig 130 (first holding process).

[0093] This improves the ease of transferring electronic component 1 into relatively large first through hole 112 of first alignment plate 110. Also, the posture of electronic component 1 can be stabilized in relatively small second through hole 122 of second alignment plate 120. Therefore, when electronic component 1 is pressed into third through hole 132 of holding jig 130, electronic component 1 can be aligned and held in a stable posture. Therefore, the alignment of the position and posture of electronic component 1 can be improved.

[0094] Moreover, according to the electronic component manufacturing apparatus of the present embodiment, alignment device 100 includes magnet 150 and base 152 . Furthermore, according to the electronic component manufacturing method of this embodiment, in the alignment step, the stacking directions of the electronic components 1 are aligned horizontally in a batch (first alignment step). When the electronic components 1 are dropped from the first through holes 112 of the first alignment plate 110 into the second through holes 122 of the second alignment plate 120, the electronic components 1 are rotated by 90 degrees, and the stacking directions of the electronic components 1 are aligned vertically in a batch (second alignment step). This can improve the alignment of electronic components 1 in the stacking direction.

[0095] Although the embodiment of the present invention has been described above, the present invention is not limited to the above-mentioned embodiment, and various changes and modifications are possible. For example, in the above-mentioned embodiment, a method for manufacturing electronic components including an alignment step for collectively aligning the positions and postures of electronic components and the stacking direction of electronic components is exemplified. However, the present invention is not limited to this, and can also be applied to a method for manufacturing electronic components including an alignment step for collectively aligning the positions and postures of electronic components. In this case, the first alignment step for collectively aligning the stacking direction of electronic components in the alignment step can be omitted. In this case, the alignment device in the electronic component manufacturing apparatus does not need to include the magnet 150 and the stand 152.

[0096] In the above-described embodiment, a multilayer ceramic capacitor is exemplified as an electronic component. However, the present invention is not limited to this, and can be applied to various multilayer electronic components in which a plurality of dielectric layers and one or a plurality of conductor layers are laminated, such as a multilayer inductor and a multilayer resistor. Furthermore, the present invention is not limited to multilayer electronic components, and can be applied to various electronic components.

[0097] In the above-described embodiment, the process after the alignment process is exemplified by the process of collectively arranging the conductive members on the electronic components. However, the present invention is not limited to this, and can be applied as a pre-process of various processes performed collectively on the electronic components. [Explanation of symbols]

[0098] 1. Electronic components (multilayer ceramic capacitors) 100 Alignment device (manufacturing device) 110 First alignment plate (first flat plate) 112 First through hole 120 Second alignment plate (second flat plate) 122 Second through hole 130 Holding jig (third plate) 132 3rd Through Hole 134 Elastic Members 140 Holding plate (4th plate) 150 Magnet 152 units 160 Pressing member 170 Control section

Claims

1. A method for manufacturing electronic components, comprising an alignment step of collectively aligning a plurality of electronic components using an alignment device, The alignment device includes: a second plate having a plurality of second through holes aligned in a predetermined direction; a third flat plate having a plurality of third through holes aligned in the predetermined direction and arranged to overlap the second flat plate, the plurality of third through holes being smaller than the plurality of second through holes, and a plurality of elastic members being respectively arranged on inner walls of the plurality of third through holes; a fourth flat plate having adhesive properties; Equipped with The alignment step includes: a first holding step of pressing a plurality of electronic components aligned by a magnet and dropped into the second through holes, respectively, with a plurality of pressing members, thereby moving the electronic components in the second through holes to the third through holes, respectively, and holding the electronic components by the elastic members on the inner walls of the third through holes, respectively; a second holding step of pressing the plurality of electronic components using the plurality of pressing members, respectively, after the first holding step, to move the plurality of electronic components in the plurality of third through holes relative to the fourth flat plate, and holding the plurality of electronic components by the fourth flat plate; A method for manufacturing an electronic component, comprising:

2. A method for manufacturing an electronic component as described in claim 1, further comprising, after the alignment process, a conductive member arrangement process of arranging a conductive member on the mounting surface side of the external electrodes of the plurality of electronic components held by the fourth flat plate.

3. An apparatus for manufacturing electronic components, comprising an alignment device for collectively aligning a plurality of electronic components, The alignment device includes: a second plate having a plurality of second through holes aligned in a predetermined direction; a third flat plate having a plurality of third through holes aligned in the predetermined direction and disposed on the second flat plate, the third through holes being smaller than the second through holes, and a plurality of elastic members being disposed on inner walls of the third through holes, respectively; a fourth flat plate having adhesive properties; A control unit that controls the alignment device as a whole; Equipped with The control unit is by pressing the plurality of electronic components using a plurality of pressing members, the plurality of electronic components that have been dropped into the plurality of second through holes and aligned by magnets are moved to the plurality of third through holes, respectively, and the plurality of electronic components are held by the plurality of elastic members on the inner walls of the plurality of third through holes, respectively; by pressing the electronic components using the pressing members, respectively, the electronic components in the third through holes are moved relative to the fourth plate, and the electronic components are held by the fourth plate. Electronic component manufacturing equipment.

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