Film for processing electronic components and method for processing electronic components

Abstract

To provide an electronic component-processing film which is superior in the property of arraying electronic components in the state of being extended, and an electronic component-processing method by use of the electronic component-processing film.SOLUTION: An electronic component-processing film comprises a sticky layer and a base material layer, in which the sticky layer satisfies the requirements (1) or (2) below. (1)The tensile strength is equal to or smaller than 1.4 MPa, and the tensile elongation is equal to or larger than 900%. (2)The tensile strength is equal to or larger than 1.5 MPa, and the tensile elongation is equal to or smaller than 850%.SELECTED DRAWING: None

Description

[Technical field]

[0001] The present disclosure relates to a film for processing electronic components and a method for processing electronic components. [Background technology]

[0002] In manufacturing methods for electronic components such as semiconductor chips and ceramic capacitors, a conventional process involves dicing a wafer placed on a stretchable film into individual pieces of the desired size, stretching the film to increase the distance between the chips, and then picking up the chips.

[0003] In recent years, the diversification of electronic component processing techniques has progressed, and a technique for processing individual chips as electronic components on a stretched film has been considered. For this reason, the development of a film that can widen the gap between chips compared to when the purpose is to pick up the chips has been considered. For example, Patent Document 1 proposes a method for manufacturing a semiconductor device that includes a step of widening the gap between individual chips on a film from 100 μm or less to 300 μm or more, and a film used in this method. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] International Publication No. 2018 / 216621 Summary of the Invention [Problem to be solved by the invention]

[0005] In order to precisely process the individual electronic components on the stretched film, it is desirable that there be little variation in the spacing between the electronic components on the film, i.e., excellent alignment of the electronic components is desirable.

[0006] In view of the above circumstances, an object of one aspect of the present disclosure is to provide an electronic component processing film that has excellent alignment properties for electronic components in a stretched state, and an electronic component processing method using the electronic component processing film. [Means for solving the problem]

[0007] Specific means for achieving the above object include the following embodiments. <1> A film for processing electronic components, comprising an adhesive layer and a base layer, the adhesive layer satisfying the following requirement (1) or (2). (1) The tensile strength is 1.4 MPa or less, and the tensile elongation is 900% or more. (2) The tensile strength is 1.5 MPa or more, and the tensile elongation is 850% or less. <2> The adhesive layer comprises an acrylic adhesive. <1> 2. The electronic component processing film according to claim 1 . <3> The adhesive layer contains a trimer of an aliphatic diisocyanate compound. <1> or <2> 2. The electronic component processing film according to claim 1 . <4> The product of the tensile strength and tensile elongation of the adhesive layer is 1300 MPa·% or more. <1> ~ <3> 13. The electronic component processing film according to claim 12 . <5> The ratio of the tensile elongation of the base layer to the tensile elongation of the adhesive layer (tensile elongation of the base layer / tensile elongation of the adhesive layer) is 0.2 to 1.0. <1> ~ <4> 13. The electronic component processing film according to claim 12 . <6> <1> ~ <5> 13. An electronic component processing method comprising the step of stretching the electronic component processing film with individualized electronic components placed on the electronic component processing film according to claim 12. <7> After the step of stretching the electronic component processing film, processing of electronic components is performed on the electronic component processing film. <6> The electronic component processing method according to claim 1 . Effect of the Invention

[0008] According to one aspect of the present disclosure, there is provided an electronic component processing film that exhibits excellent alignment of electronic components in a stretched state, and an electronic component processing method using the electronic component processing film. [Brief description of the drawings]

[0009] [Figure 1] FIG. 2 is a diagram showing the shape of a test piece used in a tensile test of an adhesive layer. [Diagram 2] FIG. 2 is a diagram showing the shape of a test piece used in a tensile test of a base material layer. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, an embodiment of the present invention will be described in detail. However, the present invention is not limited to the following embodiment. In the following embodiments, the components (including element steps, etc.) are not essential unless otherwise specified. The same applies to the numerical values ​​and their ranges, and they do not limit the present invention. In the present disclosure, the term "step" includes not only a step that is independent of other steps, but also a step that cannot be clearly distinguished from other steps as long as the purpose of the step is achieved. In the present disclosure, a numerical range indicated using "~" includes the numerical values ​​before and after "~" as the minimum and maximum values, respectively. In the numerical ranges described in the present disclosure in stages, the upper or lower limit value described in one numerical range may be replaced with the upper or lower limit value of another numerical range described in stages. In addition, in the numerical ranges described in the present disclosure, the upper or lower limit value of the numerical range may be replaced with a value shown in the examples. In the present disclosure, each component may contain multiple types of the corresponding substance. When multiple substances corresponding to each component are present in the composition, the content or amount of each component means the total content or amount of the multiple substances present in the composition, unless otherwise specified.

[0011] <Electronic component processing film> The film for processing electronic parts of the present disclosure is a film for processing electronic parts that includes an adhesive layer and a base layer, and the adhesive layer satisfies the following requirement (1) or (2). (1) The tensile strength is 1.4 MPa or less, and the tensile elongation is 900% or more. (2) The tensile strength is 1.5 MPa or more, and the tensile elongation is 850% or less.

[0012] As a result of the inventors' investigation, it was found that the mechanical properties of the adhesive layer are greatly involved in the alignment of electronic components when the electronic component processing film is stretched. Specifically, it was found that the alignment of chips is particularly good when the adhesive layer satisfies the above requirement (1) or (2). Although the reason for this is not necessarily clear, it is thought that an electronic component processing film in which the adhesive layer satisfies the above requirement (1) or (2) suppresses the variation in elongation rate depending on the part of the film when stretched.

[0013] (Adhesive layer) When the adhesive layer of the film for processing electronic parts satisfies (1), the tensile strength of the adhesive layer is preferably 0.5 MPa or more, more preferably 0.6 MPa or more, and even more preferably 0.7 MPa or more. When the adhesive layer of the film for processing electronic parts satisfies (1), the tensile strength of the adhesive layer is preferably 1.3 MPa or less, more preferably 1.25 MPa or less, and even more preferably 1.2 MPa or less.

[0014] When the adhesive layer of the film for processing electronic components satisfies (1), the tensile elongation of the adhesive layer is preferably 920% or more, more preferably 940% or more, and even more preferably 950% or more. When the adhesive layer of the film for processing electronic components satisfies (1), the tensile elongation of the adhesive layer is preferably 1400% or less, more preferably 1300% or less, and even more preferably 1200% or less.

[0015] When the adhesive layer of the film for processing electronic parts satisfies (2), the tensile strength of the adhesive layer is preferably 1.6 MPa or more, more preferably 1.7 MPa or more, and even more preferably 1.8 MPa or more. When the adhesive layer of the film for processing electronic parts satisfies (2), the tensile strength of the adhesive layer is preferably 2.6 MPa or less, more preferably 2.5 MPa or less, and even more preferably 2.4 MPa or less.

[0016] When the adhesive layer of the film for processing electronic components satisfies (2), the tensile elongation of the adhesive layer is preferably 600% or more, more preferably 650% or more, and even more preferably 700% or more. When the adhesive layer of the film for processing electronic components satisfies (2), the tensile elongation of the adhesive layer is preferably 830% or less, more preferably 820% or less, and even more preferably 800% or less.

[0017] In the present disclosure, the tensile strength and tensile elongation of the adhesive layer are measured using a Tensilon tensile tester "RTA-100 type" manufactured by Orientec Co., Ltd. or a similar tester having a jig for holding the test piece.

[0018] The measurement is performed by cutting the adhesive layer into a rectangle of 30 mm length (MD) × 10 mm width (TD) as shown in Figure 1, and rolling the resulting test piece into a 30 mm long round bar. Specifically, a mark line is drawn 10 mm from each end of the round bar-shaped test piece, and the part on the end side beyond each mark line is held with a jig of the testing machine to perform the tensile test. The test is performed in an environment of 23±5°C, with a tensile speed of 500 mm / min.

[0019] The tensile strength of the adhesive layer is calculated from the thickness (mm) and width (10 mm in this test) of the test piece before the tensile test and the maximum load (N) until the test piece breaks, using the following formula.

[0020]

number

[0021] The tensile elongation of the adhesive layer is calculated from the gauge length A of the test piece before the tensile test (10 mm in this test) and the gauge length B when the test piece is broken, according to the following formula.

[0022]

number

[0023] From the viewpoint of alignment of electronic components, the product of the tensile strength and the tensile elongation of the adhesive layer (tensile strength × tensile elongation) may be 1300 MPa·% or more. The product of the tensile strength and the tensile elongation of the adhesive layer may be 1400 MPa·% or more, 1500 MPa·% or more, or 1600 MPa·% or more. From the viewpoint of the balance between the alignment of electronic components and other properties, the product of the tensile strength and the tensile elongation of the adhesive layer may be 2000 MPa·% or less.

[0024] Methods for adjusting the tensile strength and tensile elongation of the adhesive layer include adjusting the thickness of the adhesive layer and selecting the types and amounts of components (adhesive, plasticizer, crosslinking agent, etc.) contained in the adhesive layer.

[0025] The adhesive layer may contain an adhesive. The type of adhesive is not particularly limited, and may be selected from known adhesives such as acrylic adhesives, rubber adhesives, silicone adhesives, and urethane adhesives. Among these, from the viewpoint of stability of characteristics, it is preferable to contain an acrylic adhesive.

[0026] In order to ensure a certain level of adhesive properties, the acrylic adhesive is preferably a copolymer (acrylic copolymer) containing a monomer with a low glass transition temperature (for example, -20°C or lower) as a copolymerization component. Examples of acrylic monomers with a glass transition temperature of -20°C or lower include butyl acrylate, ethyl acrylate, and 2-ethylhexyl acrylate. The above glass transition temperature is that of a homopolymer obtained using the monomer.

[0027] From the viewpoint of suppressing adhesion of the adhesive layer (glue residue) to the picked-up electronic components, it is preferable that the molecular weight of the acrylic copolymer is large. For example, it is preferable that the weight average molecular weight is 1 million or more. There is no particular upper limit on the molecular weight of the acrylic copolymer, but from the viewpoint of ensuring adhesiveness, it is preferable that the weight average molecular weight is 5 million or less.

[0028] If necessary, the adhesive layer may contain a plasticizer. The type of plasticizer is not particularly limited and can be selected according to the type of adhesive, etc. Specific examples include polyester plasticizers such as polyester adipate, phthalates such as bis(2-ethylhexyl) phthalate, terephthalates such as bis(2-ethylhexyl) terephthalate, adipic acids such as bis(2-ethylhexyl) adipate, trimellitic acid esters, phosphoric acid esters, citrate esters, and epoxidized vegetable oils.

[0029] Among the above plasticizers, polyester plasticizers, terephthalic acid esters, and phthalic acid esters are preferred, and from the viewpoint of affinity with living bodies and the environment, polyester plasticizers and terephthalic acid esters are more preferred. The adhesive layer may contain only one type of plasticizer, or two or more types of plasticizers.

[0030] The polyester plasticizer may be a reaction product of an aliphatic dicarboxylic acid and a glycol. In the reaction product of an aliphatic dicarboxylic acid and a glycol, examples of the aliphatic dicarboxylic acid to be reacted with the glycol include adipic acid, sebacic acid, azelaic acid, etc., and examples of the glycol to be reacted with the aliphatic dicarboxylic acid include 1,2-propanediol, butanediol, etc. Among these, the reaction product of adipic acid and a glycol (adipic acid polyester) is preferred.

[0031] The molecular weight of the polyester plasticizer is not particularly limited and may be within the range of 500 to 4,000, for example. From the viewpoint of suppressing adhesion (glue residue) of the adhesive layer to the picked-up electronic component, the molecular weight of the polyester plasticizer is preferably 1,500 to 4,000.

[0032] The content of the plasticizer in the adhesive layer may be, for example, 5 parts by mass to 30 parts by mass, 10 parts by mass to 25 parts by mass, or 15 parts by mass to 22 parts by mass per 100 parts by mass of the solid content of the adhesive in the adhesive layer.

[0033] The adhesive layer may contain a crosslinking agent. The type of crosslinking agent is not particularly limited and can be selected according to the type of adhesive, etc. Specific examples of the crosslinking agent include isocyanate crosslinking agents, melamine crosslinking agents, peroxide crosslinking agents, metal alkoxide crosslinking agents, metal chelate crosslinking agents, metal salt crosslinking agents, carbodiimide crosslinking agents, oxazoline crosslinking agents, aziridine crosslinking agents, and amine crosslinking agents. Among the above crosslinking agents, isocyanate crosslinking agents are preferred from the viewpoint of stable adhesive properties. The crosslinking agent contained in the adhesive layer may be of one type or of two or more types.

[0034] The isocyanate crosslinking agent is not particularly limited and can be selected from known compounds having an isocyanate group (isocyanate compounds). From the viewpoint of reactivity, bifunctional isocyanate compounds (compounds having two isocyanate groups) and polyfunctional isocyanates (compounds having three or more isocyanate groups) are preferred, and polyfunctional isocyanate compounds are more preferred.

[0035] Examples of the bifunctional isocyanate compound include aliphatic diisocyanate compounds, alicyclic diisocyanate compounds, aromatic diisocyanate compounds, carbodiimide-modified products of these diisocyanate compounds, and polymer compounds having these diisocyanate compounds in the molecule.

[0036] Examples of the aliphatic diisocyanate compound include 1,5-pentamethylene diisocyanate, 1,6-hexamethylene diisocyanate (HDI), trimethylhexamethylene diisocyanate (TMHDI), lysine diisocyanate, and norbornane diisocyanate methyl (NBDI).

[0037] Examples of the alicyclic diisocyanate compound include transcyclohexane-1,4-diisocyanate, isophorone diisocyanate (IPDI), H6-XDI (hydrogenated XDI), and H12-MDI (hydrogenated MDI).

[0038] Examples of aromatic diisocyanate compounds include dimer acid diisocyanate, 2,4-tolylene diisocyanate (2,4-TDI), 2,6-tolylene diisocyanate (2,6-TDI), 4,4'-diphenylmethane diisocyanate (4,4'-MDI), 2,4'-diphenylmethane diisocyanate (2,4'-MDI), 1,4-phenylene diisocyanate, xylylene diisocyanate (XDI), tetramethylxylidene diisocyanate (TMXDI), tolidine diisocyanate (TODI), and 1,5-naphthalene diisocyanate (NDI).

[0039] Examples of the polyfunctional isocyanate compound include a trimer of a bifunctional isocyanate compound and a polymer compound having a trimer of a bifunctional isocyanate compound in the molecule. Examples of the trimer of a difunctional isocyanate compound include an isocyanurate of a difunctional isocyanate compound, an adduct of a difunctional isocyanate compound, and a biuret of a difunctional isocyanate compound.

[0040] Among isocyanate crosslinking agents, a trimer of an aliphatic diisocyanate compound is preferred, an adduct of an aliphatic diisocyanate compound is more preferred, an adduct of 1,6-hexamethylene diisocyanate is even more preferred, and an adduct of 1,6-hexamethylene diisocyanate with trimethylolpropane (TMP) is particularly preferred.

[0041] In the present disclosure, a state in which a part or all of the crosslinking agent contained in the adhesive layer forms a crosslinked structure is also referred to as "a state in which the adhesive layer contains a crosslinking agent."

[0042] The content of the crosslinking agent in the adhesive layer may be, for example, 0.1 to 10 parts by mass, 0.5 to 5 parts by mass, or 1 to 3 parts by mass per 100 parts by mass of the solid content of the adhesive in the adhesive layer.

[0043] If necessary, the adhesive layer may contain a tackifier, a surfactant, a filler, and the like.

[0044] From the viewpoint of facilitating pick-up of electronic components, the adhesive layer may have a property that the adhesive strength is reduced by high-energy rays such as ultraviolet rays and radiation, or heat. For example, the adhesive strength of the adhesive layer may be reduced by using an adhesive that is cured by irradiation with high-energy rays such as ultraviolet rays and radiation, heating, or the like.

[0045] From the viewpoint of ensuring sufficient adhesive strength to electronic components, the thickness of the adhesive layer is preferably 1 μm or more, more preferably 5 μm or more, and even more preferably 10 μm or more. From the viewpoint of economy, the thickness of the adhesive layer is preferably 100 μm or less, more preferably 50 μm or less, and even more preferably 30 μm or less.

[0046] If necessary, a separator or the like may be disposed on the outer surface of the adhesive layer (the surface opposite to the side facing the base layer).

[0047] (base material layer) The material of the base layer of the electronic component processing film is not particularly limited. From the viewpoint of obtaining good stretchability, the base layer preferably contains a resin, more preferably a thermoplastic resin. Examples of the thermoplastic resin include polyvinyl chloride, polyester, polyolefin, polyamide, polyimide, polyurethane, and thermoplastic elastomer. From the viewpoint of stretchability, polyvinyl chloride is preferred.

[0048] In order to impart flexibility to the base layer, the base layer may contain a plasticizer. The type of plasticizer is not particularly limited and may be selected from the plasticizers that may be contained in the adhesive layer described above. From the viewpoint of the stretchability of the substrate and the prevention of migration to the adhesive layer, the plasticizer contained in the substrate layer is preferably a polyester plasticizer.

[0049] The content of the plasticizer in the adhesive layer may be, for example, 10 parts by mass to 55 parts by mass, 20 parts by mass to 50 parts by mass, or 25 parts by mass to 45 parts by mass per 100 parts by mass of the resin in the adhesive layer.

[0050] From the viewpoint of improving visibility during processing, the base layer may contain a colorant. The colorant may be a dye or a pigment, with the pigment being preferred from the viewpoint of durability. The colorant is preferably a color other than black, and more preferably blue. Specific examples of colorants include alkali blue, disazo yellow, phthalocyanine blue, Prussian blue, ultramarine blue, and cobalt blue.

[0051] When the colorant is particulate, the maximum particle diameter is preferably smaller than the thickness of the base layer when stretched. If the maximum diameter of the colorant contained in the base layer is smaller than the thickness of the base layer when stretched, the colorant is prevented from falling off the base layer when the base layer is stretched, which is advantageous in terms of maintenance of the electronic component processing device. For example, the maximum particle diameter of the colorant is preferably 25 μm or less, more preferably 20 μm or less, and even more preferably 10 μm or less. In the present disclosure, the "maximum particle diameter" of a colorant refers to the maximum value of the maximum diameter of each particle (the length when the diameter of the projected image is the longest) obtained from the projected image of colorant particles (preferably 100 or more particles).

[0052] The content of the colorant in the base layer is, for example, preferably 0.1 mass % to 2.0 mass % of the total solid content of the base layer, more preferably 0.2 mass % to 1.5 mass %, and even more preferably 0.3 mass % to 1.0 mass %.

[0053] From the viewpoint of ensuring sufficient strength, the thickness of the base layer is preferably 10 μm or more, more preferably 20 μm or more, and even more preferably 50 μm or more. From the viewpoint of ensuring sufficient stretchability, the thickness of the base layer is preferably 500 μm or less, more preferably 200 μm or less, and even more preferably 150 μm or less.

[0054] If necessary, the surface of the base layer opposite to the side facing the adhesive layer may be subjected to a matte finish, an antistatic finish, or the like.

[0055] From the viewpoint of obtaining sufficient stretchability, the tensile strength of the base layer is preferably 10 MPa or more, more preferably 15 MPa or more, and even more preferably 20 MPa or more. From the viewpoint of ensuring a necessary strength, the tensile strength of the base layer is preferably 100 MPa or less, more preferably 70 MPa or less, and even more preferably 50 MPa or less.

[0056] From the viewpoint of obtaining sufficient stretchability, the tensile elongation of the base layer is preferably 100% or more, more preferably 150% or more, and even more preferably 200% or more. From the viewpoint of ensuring necessary strength, the tensile elongation of the base layer is preferably 1000% or less, more preferably 800% or less, and even more preferably 600% or less.

[0057] From the viewpoint of alignment of electronic components, the ratio of the tensile strength of the base layer to the tensile strength of the adhesive layer (tensile strength of base layer / tensile strength of adhesive layer) is preferably 5 to 40, more preferably 7 to 30, and even more preferably 10 to 20.

[0058] From the viewpoint of alignment of electronic components, the ratio of the tensile elongation of the base layer to the tensile elongation of the adhesive layer (tensile elongation of base layer / tensile elongation of adhesive layer) is preferably 0.2 to 1.0, more preferably 0.3 to 0.8, and even more preferably 0.4 to 0.7.

[0059] In the present disclosure, the tensile strength and tensile elongation of the base material layer are measured using a Tensilon tensile tester "RTA-100 type" manufactured by Orientec Co., Ltd. or a similar tester having a jig for holding the test piece.

[0060] For the measurement, a test piece having the shape shown in Figure 2 is prepared using the base layer, and a tensile test is performed by gripping both ends of the test piece with the jig of the testing machine. The test is performed in an environment of 23±5°C and at a tensile speed of 500 mm / min.

[0061] The tensile strength of the base material layer is calculated from the thickness (mm) and width (10 mm in this test) of the test piece before the test and the maximum load (N) until the test piece breaks, using the following formula.

[0062]

number

[0063] The tensile elongation of the base material layer is calculated from the gauge length A of the test piece before the test (the length of the 10 mm wide portion of the test piece shown in FIG. 2: 40 mm) and the gauge length B when the test piece is cut, using the following formula.

[0064]

number

[0065] Methods for adjusting the tensile strength and tensile elongation of the base layer include adjusting the thickness of the base layer and selecting the types and amounts of components (thermoplastic resin, plasticizer, etc.) contained in the base layer.

[0066] From the viewpoint of obtaining sufficient stretchability, the tensile strength of the electronic component processing film (i.e., the state in which the base layer and the adhesive layer are laminated) is preferably 10 MPa or more, more preferably 15 MPa or more, and even more preferably 20 MPa or more. From the standpoint of ensuring the necessary strength, the tensile strength of the film for processing electronic parts is preferably 100 MPa or less, more preferably 70 MPa or less, and even more preferably 50 MPa or less.

[0067] From the viewpoint of obtaining sufficient stretchability, the tensile elongation of the film for processing electronic parts is preferably 100% or more, more preferably 150% or more, and even more preferably 200% or more. From the viewpoint of ensuring the necessary strength, the tensile elongation of the film for processing electronic parts is preferably 1000% or less, more preferably 800% or less, and even more preferably 600% or less.

[0068] The tensile strength and tensile elongation of the electronic component processing film are measured in the same manner as the tensile strength and tensile elongation of the base layer.

[0069] From the viewpoint of adequately holding electronic components during processing, the SUS adhesive strength of the adhesive layer side of the electronic component processing film (if treatment is performed to reduce the adhesive strength of the adhesive layer, the adhesive strength after treatment) is preferably 0.1 N / 25 mm or more, more preferably 0.2 N / 25 mm or more, and even more preferably 0.4 N / 25 mm or less.

[0070] From the viewpoint of facilitating pick-up of electronic components, the SUS adhesive strength of the adhesive layer side of the electronic component processing film (if treatment is performed to reduce the adhesive strength of the adhesive layer, the adhesive strength after treatment) is preferably 3.0 N / 25 mm or less, more preferably 2.5 N / 25 mm or less, and even more preferably 2.0 N / 25 mm or less.

[0071] The SUS adhesive strength is measured using a Tensilon tensile tester "RTA-100 type" manufactured by Orientec Co., Ltd. or a similar tester having a gripper and a 90-degree peeling device. Cold-rolled stainless steel 430BA is used as the SUS plate. Prior to the test, the SUS plate is heated to keep its surface tension constant, and ultrasonic cleaning with toluene is performed to remove dirt from the surface of the test plate. The conditions for the heat treatment and ultrasonic cleaning with toluene can be changed as appropriate depending on the condition of the SUS plate.

[0072] The electronic component processed film is cut to a size of 50 mm wide and 100 mm long, the separator is peeled off if present, and the adhesive layer is attached to a SUS plate to prepare a test specimen. This test specimen is passed between rubber rolls at a speed of 2 m / min under a pressure of 5880 N / m in an environment of 23°C to press the adhesive layer. After leaving the pressed test specimen for 30 minutes, the test specimen is cut to a width of 25 mm and a length of 100 mm, and the electronic component processed film is peeled off at a right angle to the SUS plate (90 degree peeling) at a speed of 200 mm / min. The peeling force at this time is the SUS adhesive force.

[0073] <Electronic component processing method> The electronic component processing method of the present disclosure includes a step of stretching the electronic component processing film described above in a state in which individual electronic components are arranged on the electronic component processing film (stretching step).

[0074] In the above method, the electronic components placed on the electronic component processing film may be individualized on the electronic component processing film, or may be individualized before being placed on the electronic component processing film.

[0075] Electronic components that have been singulated before being placed on the electronic component processing film can be placed on the electronic component processing film, for example, by singulating the electronic components on another film, attaching the adhesive layer of the electronic component processing film to the singulated electronic components, and transferring the electronic components onto the electronic component processing film.

[0076] The stretching ratio of the film for electronic parts processing in the stretching step is not particularly limited and can be selected according to the type of processing to be performed after stretching, etc. For example, the stretching ratio may be 1.2 or more, or 1.5 or more.

[0077] The stretching ratio is a value calculated by the following formula. Stretching ratio = Dimension in the stretching direction of the film for electronic parts processing after stretching / Dimension in the stretching direction of the film for electronic parts processing before stretching

[0078] The distance between adjacent electronic components after the stretching step (if the distance is not constant, the minimum distance) is not particularly limited and can be selected depending on the type of processing to be performed after stretching, etc. For example, the distance between the electronic components may be 100 μm or more, 200 μm or more, or 300 μm or more.

[0079] From the viewpoint of the alignment of electronic components, it is preferable that the variation in the distance between electronic components after the stretching step is small. For example, the value obtained by multiplying the ratio of the maximum distance between electronic components after the stretching step to the minimum distance (maximum value / minimum value) by 100 is preferably 300 or less, more preferably 200 or less, and even more preferably 150 or less.

[0080] If necessary, after the stretching step, processing of electronic parts (sealing treatment, heat treatment, etc.) may be performed on the film for processing electronic parts.

[0081] After the stretching step and the processing of the electronic parts, which is performed as necessary, are performed, the electronic parts are picked up from the film for processing electronic parts. The method of picking up the electronic parts is not particularly limited, and can be a known method. Before picking up, the adhesive layer may be subjected to a treatment (such as ultraviolet irradiation or heat treatment) to reduce the adhesive strength.

[0082] The type of electronic component used in the above method is not particularly limited, and examples thereof include various semiconductor chips and ceramic capacitors. EXAMPLES

[0083] The above embodiment will be specifically described below with reference to examples, but the above embodiment is not limited to these examples.

[0084] (Preparation of Adhesive Layer Composition) The materials shown in Table 1 below were dissolved in methyl ethyl ketone together with an adhesive to prepare a composition for an adhesive layer. The amounts of the materials shown in Table 1 are the amounts relative to 100 parts by mass of the adhesive (parts by mass, solid content equivalent).

[0085] The adhesive used was an acrylic adhesive (Tohpe Corporation, XE-2644, a copolymer of 80 to 90% by mass of butyl acrylate and 10 to 20% by mass of acrylonitrile).

[0086] Details of the materials shown in Table 1 are as follows. Plasticizer 1: Bis(2-ethylhexyl) terephthalate, ADEKA Corporation, D-810 Plasticizer 2: Polyester adipic acid (molecular weight approximately 1,000), ADEKA Corporation, P-150 Plasticizer 3: Polyester adipic acid (molecular weight approximately 2,000, ADEKA Corporation, P-200, Plasticizer 4: Polyester adipic acid (molecular weight approximately 3,000), ADEKA Corporation, P-5090

[0087] Crosslinker 1: TMP adduct of hexamethylene diisocyanate (Asahi Kasei Corporation, Duranate E405-80T) Crosslinker 2: TMP adduct of tolylene diisocyanate (Tosoh Corporation, Coronate L)

[0088] (Measurement of tensile strength and tensile elongation of adhesive layer) The adhesive layer composition was applied to the release-treated surface of a polyethylene terephthalate (PET) film having a thickness of 38 μm, and dried to form an adhesive layer. The polyethylene terephthalate film was then peeled off from the adhesive layer to prepare a round bar-shaped test piece having a length of 30 mm and a diameter of about 1 mm. The tensile strength and tensile elongation of the adhesive layer were measured by the method described above. The results are shown in Table 1.

[0089] (Production of electronic component processing film) The adhesive layer composition was applied to the release-treated surface of a PET film having a thickness of 38 μm, one side of which was release-treated, so that the thickness after drying was 20 μm, and then dried to form an adhesive layer. Next, the adhesive layer side of the PET film was attached to one side of a substrate at room temperature (25° C.), and the adhesive layer was transferred onto the substrate by pressing with a rubber roll, and the PET film was peeled off to produce an electronic component processing film having a substrate layer and an adhesive layer.

[0090] The base layer was a polyvinyl chloride film (thickness 120 μm) containing 44% by mass of plasticizer 2 (P-200) and 0.5% by mass of pigment (phthalocyanine blue, maximum particle size 10 μm). The tensile strength of the base layer measured by the above-mentioned method was 37 MPa, and the tensile elongation was 445%.

[0091] (Adhesive strength evaluation) Two days after the production of the electronic component processing film, the adhesive strength of the adhesive layer on the SUS was measured using the method described above. The results are shown in Table 1.

[0092] (Assessment of the alignment of electronic components) The electronic component processed film was cut into a circle with a diameter of 400 mm, and electronic components, which had been cut into individual pieces with a size of 5 mm x 5 mm, were transferred to an area with a radius of 100 mm from the center. In this state, the electronic component processed film was stretched in the radial direction. The stretching was performed so that the radius of the area where the electronic components were transferred became 1.5 times that before stretching. After stretching, the distance between adjacent electronic components was measured at the center and the periphery of the area where the electronic components were transferred, and the alignment was evaluated according to the value obtained from the following formula. Formula: (Distance between electronic components in the center / distance between electronic components in the outer periphery) x 100

[0093] A: The value obtained from the above formula is between 100 and 150 B: The value obtained from the above formula is more than 150 and 300 or less. C: The value obtained from the above formula is more than 300.

[0094] (Evaluation of glue residue) After evaluating the alignment of the electronic components, the electronic components were peeled off from the electronic component processing film, and the surface of the electronic components that had been in contact with the adhesive layer of the electronic component processing film was observed to check for the presence or absence of adhesive residue (transfer of the adhesive layer). The results were evaluated according to the following criteria. Formula: (Number of electronic components with glue residue / Total number of peeled electronic components) x 100

[0095] A: The value obtained from the above formula is 0 or more and 0.05 or less. B: The value obtained from the above formula is greater than 0.05 and less than or equal to 0.10. C: The value obtained from the above formula is greater than 0.10.

[0096] [Table 1]

[0097] As shown in Table 1, the electronic component processing films of Examples 1 and 2, in which the adhesive layer had a tensile strength of 1.4 MPa or less and a tensile elongation of 900% or more, and Examples 3, 4, and 5, in which the adhesive layer had a tensile strength of 1.5 MPa or more and a tensile elongation of 850% or less, had excellent alignment of electronic components in a stretched state.

Claims

1. An electronic component processing film comprising an adhesive layer and a base layer, the adhesive layer satisfying the following requirement (1) or (2), the electronic component processing film being for use in an electronic component processing method including a step of stretching the electronic component processing film with individualized electronic components placed on the electronic component processing film. (1) The tensile strength is 1.4 MPa or less, and the tensile elongation is 900% or more. (2) The tensile strength is 1.5 MPa or more, and the tensile elongation is 850% or less.

2. The film for processing electronic components according to claim 1 , wherein the adhesive layer comprises an acrylic adhesive.

3. The film for processing electronic parts according to claim 1 or 2, wherein the adhesive layer contains a trimer of an aliphatic diisocyanate compound.

4. The electronic component processing film according to any one of claims 1 to 3, wherein the product of the tensile strength and the tensile elongation of the adhesive layer is 1300 MPa·% or more.

5. The ratio of the tensile elongation of the base layer to the tensile elongation of the adhesive layer (tensile elongation of the base layer / tensile elongation of the adhesive layer) is 0.2 to 1.

0. The electronic component processing film according to any one of claims 1 to 4.

6. An electronic component processing method comprising a step of stretching the electronic component processing film with an individualized electronic component placed on the electronic component processing film according to any one of claims 1 to 5.

7. 7. The method for processing electronic parts according to claim 6, further comprising the step of: processing electronic parts on said electronic part processing film after said step of stretching said electronic part processing film.

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