SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Abstract

To provide a substrate processing apparatus and a substrate processing method that can sufficiently ensure the stability of bonding between multiple elements and substrates.SOLUTION: The substrate processing apparatus has a stage 30 on which a substrate 2 on which a plurality of elements 4a, 4b, 4c are arranged is installed, an upper member 21 that covers the upper part of the stage 30 and forms a processing chamber 6, which is a pressurized space, between the stage 30 and the upper member, a sheet holding portion 40 that holds an elastic sheet 80 between the stage 30 and the upper member 21, and a pressurization control portion 12 that pressurizes the processing chamber 6. The sheet holding portion 40 conveys the elastic sheet 80 from one side of the stage 30 to the other with the steering roll 41 and take-up roll 42 located on both sides of the stage 30, and places the elastic sheet 80 on the stage 30 so that the substrate 2 is covered.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a substrate processing apparatus and a substrate processing method for processing a substrate on which a plurality of elements are arranged. [Background technology]

[0002] In a technology for forming an element array consisting of multiple elements on a substrate, a process is performed using a substrate processing apparatus to press multiple elements onto a substrate on which the multiple elements are arranged with a flat plate in order to improve the strength and stability of the mechanical joint between the multiple elements and the substrate. In recent years, the height of the elements arranged on the substrate has been miniaturized to about several μm, while the flatness of the surface of the flat plate may vary on the order of several tens of μm. In this case, it is difficult to press the multiple elements on the substrate with a uniform force using the flat plate.

[0003] For example, Patent Document 1 describes a technique for covering electronic components and a mounting board with a resin film. A resin film has the characteristic of deforming to conform to the shapes of multiple elements, and it is considered useful to press multiple elements on a board with an elastic sheet such as a resin film in order to solve the above-mentioned problem. Even when using such a technique, further ingenuity is required to press multiple elements with a uniform force. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2002-217221 A Summary of the Invention [Problem to be solved by the invention]

[0005] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of sufficiently ensuring stability of bonding between a plurality of elements and a substrate. [Means for solving the problem]

[0006] In order to achieve the above object, the present invention provides a substrate processing apparatus comprising: a stage on which a substrate having a plurality of elements arranged thereon is placed; an upper member that covers an upper portion of the stage and forms a pressurized space between the stage and an upper member; a sheet holding portion that holds an elastic sheet between the stage and the upper member; A pressurization control unit that pressurizes the pressurized space, The sheet holding unit transports the elastic sheet from one side of the stage to the other side using a feed roll and a take-up roll arranged on either side of the stage, and positions the elastic sheet on the stage so that the substrate is covered.

[0007] In the substrate processing apparatus according to the present invention, the pressure control unit pressurizes the pressure space, and the sheet holding unit transports the elastic sheet from one side of the stage to the other side using a feed roll and a take-up roll arranged on both sides of the stage, and places the elastic sheet on the stage so as to cover the substrate. With the elastic sheet arranged on the stage so as to cover the substrate, the pressure control unit pressurizes the pressure space, making it possible to press the elastic sheet against the substrate based on the pressure, and the elastic sheet can be brought into contact with the substrate or multiple elements arranged on the substrate, and the multiple elements arranged on the substrate can be pressed by the elastic sheet.

[0008] Furthermore, when pressurizing the pressurized space, the elastic sheet can be deformed to conform to the shape of the multiple elements arranged on the substrate, thereby allowing the elastic sheet to be brought into close contact with the multiple elements and to press the multiple elements with a uniform force. Furthermore, since the elastic sheet is transported from one side of the stage to the other by the feed roll and the take-up roll, the elastic sheet can be supplied between the stage and the upper member with a small and simple configuration. As described above, the substrate processing apparatus according to the present invention can sufficiently ensure the stability of the bonding between the multiple elements and the substrate.

[0009] Preferably, the feed roll and the take-up roll feed and take-up the elastic sheet, respectively, every time the substrate is placed on the stage. With this configuration, an unused portion of the elastic sheet is supplied between the stage and the upper member every time the substrate is placed on the stage, and the elastic sheet in an appropriate state can press the multiple elements arranged on the substrate in a stable manner.

[0010] Preferably, the stage further includes a plurality of lift pins extending through the interior of the stage so as to be capable of ascending and descending; The substrate is transferred to the stage via the plurality of lift pins. With this configuration, the substrate can be transferred in a stable state from the transfer position to the stage, and damage to the substrate can be prevented during the transfer.

[0011] Preferably, the sheet holder moves relatively close to the stage to place the elastic sheet on the stage. With this configuration, the process of placing the elastic sheet on the stage can be efficiently performed, and the work tact time can be increased.

[0012] Preferably, the apparatus further includes a pressure reduction control unit that reduces the pressure in the space within the sheet surrounded by the elastic sheet and the stage. With the elastic sheet placed on the stage so as to cover the substrate, reducing the pressure in the space within the sheet causes the elastic sheet to be drawn toward the substrate, making it possible to bring the elastic sheet into close contact with the substrate or multiple elements placed on the substrate. In this state, the pressurized space is pressurized, and the elastic sheet is pressed toward the substrate based on the pressure, so that the multiple elements placed on the substrate can be pressed with a uniform force by the elastic sheet.

[0013] Preferably, a sheet fixing portion for fixing the elastic sheet to the stage is provided at a position farther from the center of the stage than the installation area of ​​the substrate. By applying pressure to the pressurized space with the elastic sheet fixed to the stage at the position of the sheet fixing portion, it becomes possible to press the elastic sheet toward the substrate in a stable state, and the elastic sheet can press a plurality of elements arranged on the substrate with a more uniform force.

[0014] Preferably, the pressurization control unit pressurizes the pressurized space so that the air pressure inside the pressurized space is approximately twice the air pressure outside the pressurized space. With this configuration, when the pressurized space is pressurized, the elastic sheet is pressed toward the substrate with an appropriate pressing force, and the elastic sheet can press the multiple elements against the substrate with an appropriate force. Therefore, it is possible to prevent the multiple elements from falling off the substrate, and to sufficiently ensure the stability of the bonding between the multiple elements and the substrate.

[0015] In order to achieve the above object, a substrate processing method according to the present invention includes: placing a substrate on which a plurality of elements are arranged on a stage provided inside a pressurized space; placing the elastic sheet on the stage such that the substrate is covered; reducing the pressure in a space within the sheet surrounded by the elastic sheet and the stage; and pressurizing the pressurized space.

[0016] The substrate processing method according to the present invention includes the steps of placing an elastic sheet on a stage so as to cover the substrate, reducing the pressure in the space enclosed by the elastic sheet and the stage, and pressurizing the pressurized space. By reducing the pressure in the space within the sheet while the elastic sheet is placed on the stage so as to cover the substrate, the elastic sheet is drawn toward the substrate, and the elastic sheet can be brought into contact with the substrate or a plurality of elements arranged on the substrate. By pressurizing the pressurized space in this state, the elastic sheet is pressed toward the substrate based on the pressure, and the elastic sheet can be pressed against a plurality of elements arranged on the substrate.

[0017] Furthermore, when the space within the sheet is decompressed or when the pressurized space is pressurized, the elastic sheet can be deformed to conform to the shapes of the multiple elements arranged on the substrate. This allows the elastic sheet to be in close contact with the multiple elements and to press the multiple elements with a uniform force. Therefore, the substrate processing method according to the present invention can ensure sufficient stability in bonding between the multiple elements and the substrate.

[0018] Preferably, the pressurized space is pressurized with the elastic sheet in contact with the plurality of elements arranged on the substrate. With this configuration, as described above, when the elastic sheet is pressed against the substrate based on the air pressure in the pressurized space, the elastic sheet can be efficiently pressed against the plurality of elements arranged on the substrate.

[0019] Preferably, the pressurized space is heated while the pressurized space is being pressurized, thereby heating the substrate placed on the stage. With this configuration, the multiple elements arranged on the substrate can be satisfactorily bonded to the substrate. Also, the elastic sheet becomes more easily deformed to follow the shape of the multiple elements arranged on the substrate, and the degree of adhesion between the elastic sheet and the multiple elements can be increased when the space within the sheet is depressurized or when the pressurized space is pressurized.

[0020] Preferably, the stage is heated while the pressurized space is being pressurized, thereby heating the substrate placed on the stage. Even with this configuration, the multiple elements arranged on the substrate can be satisfactorily bonded to the substrate. In addition, the elastic sheet becomes more easily deformed to follow the shape of the multiple elements arranged on the substrate, and the degree of adhesion between the elastic sheet and the multiple elements can be increased when the space within the sheet is depressurized or when the pressurized space is pressurized. [Brief description of the drawings]

[0021] [Figure 1] FIG. 1 is a schematic cross-sectional view of a substrate processing apparatus according to one embodiment of the present invention. [Diagram 2] FIG. 2 is a schematic plan view showing a state in which a substrate is placed on a stage of the substrate processing apparatus shown in FIG. [Diagram 3] FIG. 3 is a schematic plan view showing a state in which the stage on which the substrate shown in FIG. 2 is placed is covered with an elastic sheet. [Figure 4] FIG. 4 is a schematic partial cross-sectional view showing the substrate shown in FIG. 3 together with an elastic sheet. [Diagram 5] FIG. 5 is a schematic cross-sectional view showing the substrate placed on the stage shown in FIG. 3 together with an elastic sheet. [Figure 6] FIG. 6 is a diagram showing a functional configuration of the substrate processing apparatus shown in FIG. [Figure 7] FIG. 7 is a schematic cross-sectional view showing a process of pressing a plurality of elements arranged on a substrate with an elastic sheet. [Figure 8] FIG. 8 is a schematic cross-sectional view showing a process subsequent to that shown in FIG. [Figure 9] FIG. 9 is a schematic cross-sectional view showing a process subsequent to that shown in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0022] Hereinafter, the present invention will be described based on the embodiments shown in the drawings.

[0023] As shown in FIG. 1, a substrate processing apparatus 10 according to an embodiment of the present invention is an apparatus for forming an element array 4 (FIG. 3) consisting of a plurality of elements 4a, 4b, 4c on a substrate 2, and is for improving the strength and stability of the mechanical joint between the plurality of elements 4a, 4b, 4c and the substrate 2 by performing a process of pressing the plurality of elements 4a, 4b, 4c against the substrate 2 on which the plurality of elements 4a, 4b, 4c are arranged, using a predetermined means. That is, the substrate processing apparatus 10 functions as a pressurizing unit (pressurizing device) when forming the element array 4 on the substrate 2. The substrate processing apparatus 10 has a chamber 20, a stage 30, and a sheet holding unit 40. In the drawing, the X-axis corresponds to the width direction of the chamber 20, the Y-axis corresponds to the depth direction of the chamber 20, and the Z-axis corresponds to the height direction of the chamber 20.

[0024] The chamber 20 is formed of a box made of metal or the like, and has an upper member 21 and a lower member 22. The upper member 21 and the lower member 22 are configured to be combineable vertically (in the Z-axis direction). At least one of the upper member 21 and the lower member 22 is movable in the Z-axis direction, and in this embodiment, the upper member 21 moves vertically relative to the lower member 22. The upper member 21 and the lower member 22 are combined to form a processing chamber 6. The processing chamber 6 is a space formed inside the upper member 21 and the lower member 22, and is used as a pressurized space. Air, nitrogen, an inert gas, etc. are present inside the processing chamber 6.

[0025] When the substrate 2 or the like is carried into the chamber 20, the upper member 21 moves upward relative to the lower member 22, opening the processing chamber 6. When the processing chamber 6 is in an open state, a transfer space 7 is formed between the upper member 21 and the lower member 22. An elastic sheet 80, which will be described later, is transferred to and held in the transfer space 7 by the sheet holding part 40.

[0026] When a process is performed in which the multiple elements 4a, 4b, and 4c are pressed against the substrate 2 on which the multiple elements 4a, 4b, and 4c are arranged by a predetermined means, as shown in Fig. 9, the upper member 21 moves downward from the position shown in Fig. 1 relative to the lower member 22 to close (seal) the processing chamber 6. This causes the processing chamber 6 to form a closed space and to function as a pressurized space in which the interior can be pressurized.

[0027] As shown in FIG. 1, the upper member 21 has a cross-sectional shape of an approximately C-shape, and includes a top plate portion 210 and an upper leg portion 211. The upper member 21 functions as a lid portion of the chamber 20. The top plate portion 210 constitutes the top of the upper member 21 and is made of a plate having a shape approximately parallel to the XY plane. The top plate portion 210 is formed so as to cover the upper side of the stage 30. The upper leg portion 211 extends in a direction approximately perpendicular (downward) to the top plate portion 210 and is formed on the peripheral portion of the top plate portion 210. Although detailed illustration is omitted, when the upper member 21 is viewed from the Z-axis negative direction side, the upper leg portion 211 is formed so as to surround the peripheral portion of the top plate portion 210 in an approximately ring shape (approximately rectangular shape). The upper leg portion 211 supports the top plate portion 210.

[0028] A first space 212 is formed inside the upper member 21 (i.e., the area surrounded by the top plate portion 210 and the upper leg portion 211). When the upper member 21 is combined with the lower member 22, the first space 212 forms a part of the upper side of the processing chamber 6.

[0029] An upper heating device 91 is provided on the top plate 210 inside the first space 212. The upper heating device 91 is for heating the internal atmosphere of the processing chamber 6, and is composed of, for example, a heater. As described later, heat generated from the upper heating device 91 is transferred to the substrate 2 placed on the stage 30, and contributes to improving the bonding strength between the substrate 2 and the multiple elements 4a, 4b, and 4c arranged thereon. As described later, an elastic sheet 80 is arranged on the stage 30 so as to cover the substrate 2 (see FIG. 8), and the heat generated from the upper heating device 91 is also transferred to this elastic sheet 80, and it is possible to deform the shape of the elastic sheet 80 so as to follow the shape of the multiple elements 4a, 4b, and 4c arranged on the substrate 2.

[0030] The lower member 22 has a shape that is approximately symmetrical to the upper member 21. The lower member 22 has a cross-sectional shape that is approximately C-shaped, and has a bottom 220 and a lower leg 221. The bottom 220 constitutes the bottom of the lower member 22 and is made of a plate having a shape that is approximately parallel to the XY plane. A plurality of through holes 220a are formed in the bottom 220, and a plurality of lift pins 50, which will be described later, are inserted into the plurality of through holes 220a so as to be able to rise and fall.

[0031] The lower leg 221 extends in a direction (upward) substantially perpendicular to the bottom 220, and is formed on the peripheral edge of the bottom 220. Although detailed illustration is omitted, when the lower member 22 is viewed from the Z-axis positive direction side, the lower leg 221 is formed so as to surround the peripheral edge of the bottom 220 in a substantially ring-like (substantially rectangular) shape. As will be described later, in a state in which the upper member 21 is combined with the lower member 22, the lower leg 221 abuts against the upper leg 211 directly or via an elastic sheet 80, and supports the upper member 21. Note that the upper leg 211 and the lower leg 221 are preferably connected via a sealing member such as an O-ring.

[0032] A second space 222 is formed inside the lower member 22 (i.e., the area surrounded by the bottom 220 and the lower leg 221). When the upper member 21 is combined with the lower member 22, the second space 222 forms a part of the lower side of the processing chamber 6. That is, the processing chamber 6 is formed by combining the first space 212 and the second space 222. Note that a piping (not shown) is formed in the upper member 21 or the lower member 22, and gas can be sent into the processing chamber 6 through this piping to pressurize the inside of the processing chamber 6 (to create a positive pressure).

[0033] The stage 30 is a platform for placing the substrate 2 on which the elements 4a, 4b, and 4c are arranged, and is fixed to the inside of the chamber 20 (upper leg 211 and lower leg 221) by a support member (not shown). The stage 30 is made of, for example, a flat metal plate, and has a surface approximately parallel to the XY plane.

[0034] The width in the X-axis direction of the stage 30 is shorter by a predetermined length than the width in the X-axis direction of the inner circumferential surface of each of the upper leg portion 211 and the lower leg portion 221 (i.e., the width in the X-axis direction of each of the first space 212 and the second space 222). The width in the Y-axis direction of the stage 30 is shorter by a predetermined length than the width in the Y-axis direction of the inner circumferential surface of each of the upper leg portion 211 and the lower leg portion 221 (i.e., the width in the Y-axis direction of each of the first space 212 and the second space 222).

[0035] The top of the stage 30 is covered by the top plate 210 of the upper member 21, and the bottom 220 of the lower member 22 is disposed below the stage 30. The stage 30 is disposed above the end (top) of the lower leg 221 of the lower member 22 on the positive Z-axis direction side. In a state where the member 21 is assembled to the lower member 22, the stage 30 is 212 The space formed between the stage 30 and the upper member 21 constitutes a part of the pressurized space (processing chamber 6).

[0036] The height position of the stage 30 is not particularly limited, and may be at the same height as the end portion on the positive Z-axis direction side of the lower leg portion 221. Alternatively, the stage 30 may be disposed lower than the end portion (top portion) of the lower leg portion 221 of the lower member 22 on the positive Z-axis direction side.

[0037] Furthermore, the width in the X-axis direction of the stage 30 may be equal to the width in the X-axis direction of the inner peripheral surfaces of the upper leg 211 and the lower leg 221, and the width in the Y-axis direction of the stage 30 may be equal to the width in the Y-axis direction of the inner peripheral surfaces of the upper leg 211 and the lower leg 221. In this case, the upper leg 211 comes into contact with the edge (end face) of the stage 30, and a closed space is formed by the stage 30, the top plate portion 210, and the upper leg 211. This closed space can be used as a pressurized space.

[0038] A lower heating device 92 is provided on the rear surface of the stage 30. The lower heating device 92 is for heating the stage 30 and is composed of, for example, a heater. The heat generated from the lower heating device 92 is transferred to the substrate 2 placed on the stage 30, and contributes to improving the bonding strength between the substrate 2 and the multiple elements 4a, 4b, and 4c arranged thereon. As will be described later, an elastic sheet 80 is arranged on the stage 30 so as to cover the substrate 2. The heat generated from the lower heating device 92 is also transferred to the elastic sheet 80, and it is possible to deform the shape of the elastic sheet 80 so as to follow the shape of the multiple elements 4a, 4b, and 4c arranged on the substrate 2.

[0039] The stage 30 has a plurality of first suction holes 31, a second suction hole 32, and a sheet fixing portion 33 (FIG. 3). As shown in FIG. 2, each of the plurality of first suction holes 31 is formed in an outer edge portion 34a of a substrate installation area 34 of the stage 30. The substrate installation area 34 is an area in which the substrate 2 is installed in the stage 30 having a substantially rectangular shape, and has a shape conforming to the shape of the substrate 2 (substantially rectangular in this embodiment). Although details will be described later, when the substrate 2 is installed on the stage 30, the stage 30 is covered with an elastic sheet 80 (see FIG. 3), and an intra-sheet space 8 (FIG. 5) is formed between the elastic sheet 80 and the stage 30. The first suction hole 31 functions as a suction hole for sucking gas (internal atmosphere) inside the intra-sheet space 8, and is disposed at a position where the gas inside the intra-sheet space 8 can be sucked.

[0040] Regarding the size of first suction hole 31, for example, when first suction hole 31 has a rectangular shape, the length of the short side of first suction hole 31 is preferably 0.3 to 10.0 mm, and more preferably 0.5 to 1.5 mm. Also, the length of the long side of first suction hole 31 is preferably 2.0 to 15.0 mm, and more preferably 3.0 to 5.0 mm.

[0041] When the length of the short side of the first suction hole 31 is set within the above range, the length of the short side of the first suction hole 31 does not become excessively short, and the gas inside the space within the sheet 8 (FIG. 5) can be efficiently sucked in. Furthermore, when the gas inside the space within the sheet 8 is sucked in through the first suction hole 31, the elastic sheet 80 is sucked toward the first suction hole 31, but at this time, it is possible to prevent the elastic sheet 80 from being excessively sucked through the first suction hole 31, and it is possible to prevent the occurrence of a problem in which it becomes difficult to peel off the elastic sheet 80 from the substrate 2 or the stage 30 after the pressure treatment of the substrate 2 using the elastic sheet 80.

[0042] Furthermore, when the length of the long side of the first suction hole 31 is set within the above range, the length of the long side of the first suction hole 31 does not become excessively short, and the gas inside the space within the sheet 8 can be efficiently sucked in. Furthermore, the length of the long side of the first suction hole 31 does not become excessively long, preventing unevenness in the temperature distribution within the surface of the substrate 2, maintaining uniformity in the temperature of each part of the substrate 2, and improving the bonding reliability between the substrate 2 and the multiple elements 4a, 4b, and 4c arranged thereon.

[0043] When the shape of the first suction hole 31 is elliptical, the length of the short side of the rectangle described above may be applied to the length of the short axis of the ellipse, and the length of the long side of the rectangle described above may be applied to the length of the long axis of the ellipse. The same is true when the shape of the first suction hole 31 is another shape, and the length of the short side of the rectangle described above may be applied to the length of the Y axis direction of the first suction hole 31 having another shape, and the length of the long side of the rectangle described above may be applied to the length of the X axis direction of the first suction hole 31 having another shape.

[0044] In the illustrated example, some of the multiple first suction holes 31 are linearly arranged at predetermined intervals in the Y-axis direction along the first side 34a1 or the third side 34a3 of the substantially rectangular substrate installation area 34. Some of the multiple first suction holes 31 are linearly arranged at predetermined intervals in the X-axis direction along the second side 34a2 or the fourth side 34a4 of the substantially rectangular substrate installation area 34.

[0045] The number of first suction holes 31 is not limited to the number shown in the figure and may be changed as appropriate. The pitch of each of the multiple first suction holes 31 may also be changed as appropriate, and for example, each of the multiple first suction holes 31 may be disposed adjacent to each other at a distance shorter than the diameter (diameter in the direction along the extension direction of the outer edge portion 34a of the substrate installation area 34).

[0046] When the first suction hole 31 is viewed from the Z-axis direction, the first suction hole 31 has a substantially circular shape. However, the shape of the first suction hole 31 is not limited to this, and may be a substantially elliptical shape, a substantially triangular shape, a substantially rectangular shape, or another polygonal shape. For example, the shape of the first suction hole 31 may be a substantially elliptical shape having a major axis in a direction perpendicular to the extension direction of the outer edge 34a of the substrate installation area 34 (a direction away from the outer edge 34a of the substrate installation area 34 along the X-axis direction or the Y-axis direction). Alternatively, the width of the first suction hole 31 in a direction perpendicular to the extension direction of the outer edge 34a of the substrate installation area 34 may be larger than the width of the first suction hole 31 in a direction along the extension direction of the outer edge 34a of the substrate installation area 34.

[0047] As shown in the enlarged view in the figure, each of the multiple first suction holes 31 is formed so as to straddle the inside and outside of the outer edge 34a of the substrate installation area 34 of the stage 30. That is, some of the first suction holes 31 are located outside the outer edge 34a of the substrate installation area 34 (on the side away from the center of the stage 30), and the remaining parts of the first suction holes 31 are located inside the outer edge 34a of the substrate installation area 34 (on the side closer to the center of the stage 30).

[0048] In the illustrated example, the area of ​​the portion of the first suction hole 31 located outside the outer edge 34a of the substrate mounting area 34 is smaller than the area of ​​the portion located inside the outer edge 34a of the substrate mounting area 34, but it may be larger, or the areas may be equal.

[0049] When the substrate 2 is placed in the substrate installation area 34, in each of the plurality of first suction holes 31, a portion of the first suction hole 31 located inside the outer edge 34a of the substrate installation area 34 is covered by the substrate 2. In other words, when the substrate 2 is placed in the substrate installation area 34, each of the plurality of first suction holes 31 spans the outer edge (periphery) of the substrate 2 placed in the substrate installation area 34.

[0050] The first suction holes 31 are formed so as not to cause any trouble even if the substrate 2 is slightly misaligned from the outer edge 34a of the substrate installation area 34 toward the X-axis direction or / and the Y-axis direction. That is, since each of the first suction holes 31 is arranged so as to straddle the outer edge 34a of the substrate installation area 34, even if the substrate 2 is misaligned from the outer edge 34a of the substrate installation area 34 toward the X-axis direction or / and the Y-axis direction, suction can be performed through each of the first suction holes 31 as long as the first suction holes 31 are not completely blocked. In this way, by arranging the first suction holes 31 so as to straddle the outer edge 34a of the substrate installation area 34, it is possible to allow the substrate 2 to be misaligned with respect to the substrate installation area 34.

[0051] When the substrate 2 is placed in the substrate installation area 34, the portions of the first suction holes 31 located inside the outer edge 34a of the substrate installation area 34 are blocked by the substrate 2, while the portions located outside the outer edge 34a of the substrate installation area 34 are open. Therefore, suction of the above-mentioned in-seat space 8 (FIG. 5) through the first suction holes 31 is mainly performed in the portions located outside the outer edge 34a of the substrate installation area 34.

[0052] In the illustrated example, a plurality of first suction holes 31 are formed in the stage 30, but the number of first suction holes 31 may be one. For example, a substantially ring-shaped first suction hole 31 extending along (or circumnavigating) the outer edge 34a of the substrate installation area 34 may be formed in the stage 30.

[0053] As shown in FIG. 1, a first suction pipe 60 is connected to each of the first suction holes 31. Each of the first suction pipes 60 extends downward, and a part of it is embedded in the bottom 220 of the lower member 22. The gas sucked through the first suction holes 31 passes through the first suction pipe 60 and is discharged to the outside of the chamber 20. A suction device (not shown) is connected to each of the first suction pipes 60. The first suction pipes 60 may be connected to each other to form a single suction pipe. In this case, it is only necessary to perform suction by the suction device for this single suction pipe, and the number of suction devices can be reduced.

[0054] The second suction hole 32 is formed in approximately the center of the stage 30, and is disposed inside the multiple first suction holes 31. With the substrate 2 placed on the stage 30, suction is performed via the second suction hole 32, thereby making it possible to draw the substrate 2 to the stage 30 and fix it to the stage 30 by suction. Note that the effect of fixing the substrate 2 to the stage 30 by suction can also be achieved by suction via the multiple first suction holes 31.

[0055] 3, the second suction hole 32 is formed inside the substrate placement area 34 of the stage 30, and is disposed more inward (closer to the center of the stage 30) than the multiple first suction holes 31. The second suction hole 32 is preferably disposed at a position where it can suck approximately the center of the substrate 2 placed on the stage 30. The number of second suction holes 32 may be one or more.

[0056] 1, a second suction pipe 70 is connected to the second suction hole 32. The second suction pipe 70 extends downward, and a portion of it is embedded in the bottom 220 of the lower member 22. The gas sucked through the second suction hole 32 passes through the second suction pipe 70 and is discharged to the outside of the chamber 20. An unillustrated suction device is connected to the second suction pipe 70.

[0057] 3, the sheet fixing portion 33 is formed in a substantially rectangular shape, and is provided at a position farther from the center of the stage than the multiple first suction holes 31 (outside the multiple first suction holes 31). The sheet fixing portion 33 is provided at a position farther from the center of the stage than the outer edge portion 34a of the substrate installation area 34 (outside the outer edge portion 34a), and is provided inside the edge of the stage 30. The sheet fixing portion 33 is provided so as to surround the outer edge portion 34a of the substrate installation area 34, and is disposed at a position close to the outer edge portion 34a. The shape of the sheet fixing portion 33 is not limited to the shape shown in the figure, and may be changed as appropriate.

[0058] As will be described later, in this embodiment, in a state where the substrate 2 is placed on the stage 30, the stage 30 is covered with an elastic sheet 80 (FIG. 8). The sheet fixing part 33 has a function of fixing the elastic sheet 80 placed on the stage 30 to the stage 30. As shown in FIG. 5, the sheet fixing part 33 is composed of, for example, a plurality of third suction holes 33a formed in the stage 30, and the elastic sheet 80 is brought into close contact with the stage 30 at the position of the sheet fixing part 33 by suction through the plurality of third suction holes 33a, and is fixed to the stage 30. A third suction pipe 100 is connected to the third suction hole 33a.

[0059] In the illustrated example, the sheet fixing part 33 is provided with a plurality of third suction holes 33a, but the sheet fixing part 33 may be provided with a single third suction hole 33a. In this case, the third suction hole 33a may be a substantially ring-shaped suction hole extending along (or circling) the sheet fixing part 33.

[0060] The sheet fixing portion 33 may be formed of a joining member such as an adhesive (adhesive portion) or a fastener, and the elastic sheet 80 may be fixed to the stage 30 via such a joining member. A groove may be formed around the sheet fixing portion 33 at the position of the sheet fixing portion 33, and a plurality of third suction holes 33a may be formed inside the groove. With this configuration, when the elastic sheet 80 is fixed to the stage 30 at the position of the sheet fixing portion 33, it is possible to increase the airtightness of the sheet intra-space 8 described later, and it is possible to prevent gas from entering the sheet intra-space 8 from the outside.

[0061] The distance L (see Figs. 3 and 5) between the sheet fixing portion 33 and the outer edge 34a of the substrate placement area 34 in which the plurality of first suction holes 31 are arranged is preferably 5 to 25 mm, more preferably 10 to 20 mm. Moreover, the ratio L / T1 (see Fig. 5) of the distance L to the thickness T1 of the substrate 2 is preferably 5 to 250, more preferably 15 to 70. When the distance L or the ratio L / T1 is set within the above range, the distance L does not become excessively long, and the gas inside the space 8 within the sheet (Fig. 5) can be efficiently sucked. Moreover, the distance L does not become excessively short, and the elastic sheet 80 is prevented from being bitten into the outer edge 34a of the substrate 2, and the occurrence of a problem in which the elastic sheet 80 becomes difficult to peel off from the substrate 2 or the stage 30 after the substrate 2 is subjected to a pressure treatment using the elastic sheet 80 can be prevented. The thickness T1 (see FIG. 4) of the substrate 2 is preferably 0.1 to 1.0 mm, and more preferably 0.3 to 0.7 mm.

[0062] 1, a plurality of through holes 35 are formed in the stage 30, and a plurality of lift pins 50 are inserted into the plurality of through holes 35 in an upright state. Each of the plurality of lift pins 50 penetrates the interior of the stage 30 so as to be able to rise and fall. The plurality of lift pins 50 are also inserted into a plurality of through holes 220a formed in the bottom 220 of the lower member 22, and penetrate the interior of the bottom 220 so as to be able to rise and fall. The lift pins 50 are made of a rod-shaped member and have a predetermined length in the Z-axis direction.

[0063] The multiple lift pins 50 support the substrate 2 and also serve to transport the substrate 2. With the substrate 2 placed on the tops of the multiple lift pins 50, the multiple lift pins 50 support the substrate 2 on the inside of the edge of the substrate 2. Note that the number of the multiple lift pins 50 is not particularly limited as long as the substrate 2 can be supported in a stable state.

[0064] With the transfer space 7 formed between the upper member 21 and the lower member 22, the substrate 2 is transferred from the outside of the chamber 20 to the inside of the processing chamber 6 through the transfer space 7 by, for example, a robot arm or the like.

[0065] The substrate 2 transported to the processing chamber 6 is placed on the tops of the multiple lift pins 50 and is supported by the multiple lift pins 50. At this time, the multiple lift pins 50 protrude above the stage 30, and the tops of the multiple lift pins 50 are located at positions spaced a predetermined distance above the surface of the stage 30. The substrate 2 is delivered to the tops of the multiple lift pins 50 above the stage 30.

[0066] In this state, the multiple lift pins 50 move downward, and when the tops of the multiple lift pins 50 reach the upper surface of the stage 30, the substrate 2 is placed on the stage 30, completing the transfer of the substrate 2. By transferring the substrate 2 vertically toward the stage 30 via the multiple lift pins 50 in this manner, it becomes possible to transfer the substrate 2 in a stable state from its delivery position to the stage 30, and damage to the substrate 2 during the transfer can be prevented.

[0067] The sheet holding unit 40 has a feed roll 41, a take-up roll 42, and a number of pulleys 43. The feed roll 41 is disposed on the negative side of the X-axis from the stage 30, and the take-up roll 42 is disposed on the positive side of the X-axis from the stage 30. The multiple pulleys 43 are disposed on the negative side of the X-axis from the stage 30 on which the feed roll 41 is disposed. The feed roll 41, the take-up roll 42, and the multiple pulleys 43 are all disposed outside the chamber 20, and the feed roll 41 and the take-up roll 42 hold the elastic sheet 80 between the stage 30 and the upper member 21 (part of the transport space 7) while applying tension so that the elastic sheet 80 is stretched in a state parallel to the XY plane.

[0068] The feed roll 41 and the take-up roll 42 are each configured to be rotatable and movable (up and down) in the Z-axis direction. The feed roll 41 feeds out the elastic sheet 80 toward the side where the take-up roll 42 is located at a predetermined timing. The take-up roll 42 takes up the elastic sheet 80 fed out by the feed roll 41 at this timing. This makes it possible for the feed roll 41 and the take-up roll 42 to transport the elastic sheet 80 from one side to the other side in the X-axis direction of the stage 30 via the transport space 7.

[0069] Each time a substrate 2 is placed on the stage 30, the feed roll 41 and the take-up roll 42 respectively feed and take-up the elastic sheet 80 while holding the elastic sheet 80 in the transport space 7. In addition, each time a substrate 2 is placed on the stage 30, the feed roll 41 and the take-up roll 42 place the elastic sheet 80 on the stage 30 so that the substrate 2 is covered.

[0070] More specifically, after the feed roll 41 and the take-up roll 42 have respectively fed and taken up the elastic sheet 80, they move downward as shown in Fig. 8, approaching the stage 30 and placing the elastic sheet 80 on the upper surface of the stage 30 while covering the upper surface of the substrate 2. The elastic sheet 80 is placed on the stage 30 in a state in which it is tensioned by the feed roll 41 and the take-up roll 42. Note that when the elastic sheet 80 is placed on the stage 30, the elastic sheet 80 may press the substrate 2 or the multiple elements 4a, 4b, and 4c placed on the substrate 2 with a predetermined pressing force, or may simply abut against the substrate 2 without pressing against the multiple elements 4a, 4b, and 4c.

[0071] 3, when the elastic sheet 80 is placed on the stage 30, the entire substrate 2 is covered with the elastic sheet 80, and the elastic sheet 80 is fixed to the upper surface of the stage 30 at the position of the sheet fixing portion 33. Therefore, an intra-sheet space 8 surrounded by the elastic sheet 80 and the stage 30 is formed inside the sheet fixing portion 33, as shown in FIG.

[0072] More specifically, the seat interior space 8 is 33 and the edge of the substrate 2 (part indicated by L in the figure), and above the substrate 2. The sheet space 8 is preferably airtightly sealed from the outer space and has high airtightness. Within the sheet space 8, the back surface of the elastic sheet 80 may be in contact with the multiple elements 4a, 4b, and 4c arranged on the substrate 2.

[0073] The height of the intra-seat space 8 gradually increases from the position of the sheet fixing part 33 toward the edge of the substrate 2, and at the position of the edge of the substrate 2, it is approximately equal to the sum of the thickness of the substrate 2 and the thickness of the multiple elements 4a, 4b, 4c. The length of the intra-seat space 8 in the X-axis direction is approximately equal to the width of the approximately rectangular sheet fixing part 33 in the X-axis direction, and the intra-seat space 8 extends from one end of the sheet fixing part 33 in the X-axis direction to the other end. The length of the intra-seat space 8 in the Y-axis direction is approximately equal to the width of the sheet fixing part 33 in the Y-axis direction, and the intra-seat space 8 extends from one end of the sheet fixing part 33 in the Y-axis direction to the other end.

[0074] Inside the space within the sheet 8, a part of the first suction hole 31 is covered by the edge of the substrate 2, while the remaining part of the first suction hole 31 is open, so that it is possible to suck gas inside the space within the sheet 8 through the first suction hole 31. As a result, the inside of the space within the sheet 8 is depressurized (negative pressure is generated), and the elastic sheet 80 is drawn (adsorbed) toward the substrate 2 so as to be in close contact with the edge of the substrate 2, and at the same time, it abuts against the elements 4a, 4b, 4c while deforming so as to follow the shapes of the elements 4a, 4b, 4c arranged on the substrate 2.

[0075] Therefore, after suction is performed through the first suction holes 31, the volume of the space 8 within the sheet becomes smaller than before suction is performed through the first suction holes 31. In this embodiment, suction is performed through the first suction holes 31 to reduce the volume of the space 8 within the sheet, and then the inside of the processing chamber 6 is pressurized as described below, making it possible to press the multiple elements 4a, 4b, and 4c arranged on the substrate 2 with a uniform force by the elastic sheet 80. The inside of the space 8 within the sheet is preferably suctioned to create a vacuum.

[0076] Elastic sheet 80 is formed of a long sheet (film) that is sufficiently thinner than the thickness of substrate 2. Elastic sheet 80 has a thickness T2 (see FIG. 4) of preferably 10 to 100 μm, and more preferably 30 to 70 μm.

[0077] The elastic sheet 80 is made of a flexible film-like material, and a resin film such as a PET film, a fluorine-based film, or a PEN film is used. From the viewpoint of flexibility and heat resistance, it is particularly preferable to use a fluorine-based film. By using a fluorine-based film, the elastic sheet 80 is in close contact with the multiple elements 4a, 4b, and 4c arranged on the substrate 2, and the multiple elements 4a, 4b, and 4c arranged on the substrate 2 can be pressurized relatively uniformly.

[0078] Furthermore, from the viewpoint of strength and heat resistance, it is preferable to use a PEN film as the elastic sheet 80. By using a PEN film as the elastic sheet 80, the multiple elements 4a, 4b, and 4c arranged on the substrate 2 can be pressed with a relatively large force.

[0079] It is preferable that the elastic sheet 80 has good releasability. In this embodiment, the sheet holding unit 40 moves downward to place the elastic sheet 80 on the stage 30 so as to be in contact with the surface of the substrate 2, and then releases the contact state between the stage 30 or the substrate 2 and the elastic sheet 80, and moves upward. In other words, the sheet holding unit 40 places the elastic sheet 80 so as to be detachable (peelable) from the stage 30 or the substrate 2.

[0080] Therefore, it is preferable to use a fluorine-based film with good releasability so that the elastic sheet 80 can be easily detached from the substrate 2 or the multiple elements 4a, 4b, and 4c arranged on the substrate 2, and it is also preferable to form a release layer on the elastic sheet 80 to further enhance the releasability.

[0081] In this embodiment, the material of the substrate 2 is a glass substrate coated with epoxy resin. However, the material of the substrate 2 is not limited to this, and may be, for example, a glass epoxy substrate or a glass substrate made of SiO2 or Al2O3, or a flexible substrate made of elastomers such as polyimide, polyamide, polypropylene, polyether ether ketone, urethane, silicone, polyethylene terephthalate, polyethylene naphthalate, or glass wool.

[0082] For example, a conductive bonding material (not shown) is formed in advance on the surface of the substrate 2. This conductive bonding material electrically and mechanically connects the substrate 2 and the elements 4a, 4b, and 4c by anisotropic conductive particle connection or bump pressure connection, and is hardened by heating. Examples of the conductive bonding material include ACF, ACP, NCF, and NCP. The thickness of the conductive bonding material is preferably 1.0 to 10,000 μm. It is also possible to perform heat and pressure bonding using a low melting point bonding material containing a metal such as Sn instead of the conductive bonding material. In this case, the thickness of the low melting point bonding material is 0.1 to 10,000 μm.

[0083] Wiring is formed in a predetermined pattern on the substrate 2, and the electrodes of the elements 4a, 4b, and 4c can be connected to the wiring via a conductive bonding material.

[0084] The elements 4a, 4b, and 4c are arranged in an array on the substrate 2. An array refers to a state in which the elements 4a, 4b, and 4c are arranged in a plurality of rows and a plurality of columns according to a determined pattern, and the intervals in the row direction and the column direction may be the same or different.

[0085] The elements 4a, 4b, and 4c are arranged as RGB pixels on a display substrate for a display, and are also arranged on an illumination substrate as light emitters for a backlight. Departure The elements 4a and 4b are green light emitting elements, and the element 4c is a blue light emitting element, however, the elements disposed on the substrate 2 are not limited to these elements.

[0086] The elements 4a, 4b, and 4c in this embodiment are micro light emitting elements (micro LED elements), and their size (width x depth) is, for example, 5 μm x 5 μm to 50 μm x 50 μm. 4a ~ 4c The thickness (height) is, for example, 50 μm or less.

[0087] As shown in Fig. 6, the substrate processing apparatus 10 includes a drive unit 11, a pressure control unit 12, a pressure reduction control unit 13, and a temperature control unit 14. The drive unit 11 executes a process for driving the upper member 21 of the chamber 20 shown in Fig. 1, the sheet holding unit 40, or the plurality of lift pins 50 so that they can be raised and lowered in the vertical direction. 12 When the upper member 21 and the lower member 22 are combined to form a closed space (pressurized space) inside the processing chamber 6 (see FIG. 9), the pressurization control unit 12 executes a process of pressurizing (creating positive pressure) the inside of the processing chamber 6. The pressurization control unit 12 pressurizes the processing chamber 6 so that the air pressure inside the processing chamber 6 is preferably 10 Pa to 0.5 MPa.

[0088] Pressure reduction control section 13 When the substrate 2 is placed on the stage 30 (see FIG. 7), the pressure reduction control section 31 executes a process of performing suction via the second suction hole 32 and the second suction pipe 70. 13 When the elastic sheet 80 is placed on the stage 30 (see FIG. 5 and FIG. 8), the pressure reducing control section 33a performs a process of suctioning through the third suction hole 33a and the third suction pipe 100. 13 When the substrate 2 is covered with the elastic sheet 80 to form the space 8 within the sheet (see FIGS. 8 and 9), a process for reducing the pressure inside the space 8 within the sheet (creating a negative pressure) is performed.

[0089] Temperature control unit 14 controls the heating temperature by upper heating device 91 and lower heating device 92. The set temperatures of upper heating device 91 and lower heating device 92 vary depending on the materials of elastic sheet 80 and bonding material, but are, for example, 100 to 200°C.

[0090] Next, a method for forming an element array 4 on a substrate 2 will be described with reference to Fig. 1 and Fig. 7 to Fig. 9. The following mainly describes the steps before and after pressing the multiple elements 4a, 4b, and 4c arranged on the substrate 2 with an elastic sheet 80.

[0091] 1, the upper leg 211 of the upper member 21 is disposed above the lower leg 221 of the lower member 22 by a predetermined distance, and a transport space 7 is formed between the upper member 21 and the lower member 22. The elastic sheet 80 is held by the sheet holding portion 40 so that the elastic sheet 80 is disposed inside the transport space 7. The elastic sheet 80 is previously fed and wound by the feed roll 41 and the winding roll 42, and an unused portion of the elastic sheet 80 is disposed in the transport space 7. The multiple lift pins 50 are previously kept on standby in a state where they are protruded above the stage 30.

[0092] Next, the substrate 2 (see FIG. 3) on which the multiple elements 4a, 4b, and 4c are arranged is transferred to the transfer space 7 using a robot arm (not shown) and placed on the tops of the multiple lift pins 50.

[0093] 7, the multiple lift pins 50 holding the substrate 2 are moved downward, and the substrate 2 is placed on the stage 30 provided inside the processing chamber 6. When the multiple lift pins 50 move downward and each of their tops reaches the upper surface of the stage 30, the substrate 2 is placed on the stage 30, and the transfer of the substrate 2 to the stage 30 is completed.

[0094] Next, suction is performed via the second suction holes 32 and the second suction pipe 70, and the substrate 2 placed on the stage 30 is adsorbed and fixed onto the stage 30. Note that suction via the second suction holes 32 and the second suction pipe 70 may be started before the substrate 2 is placed on the stage 30.

[0095] 8, the sheet holding unit 40 waiting above the stage 30 is lowered a predetermined distance, and the elastic sheet 80 is placed on the stage 30 so as to cover the substrate 2. The downward movement of the sheet holding unit 40 is achieved by the lowering of the feed roll 41, the winding roll 42, and the pulley 43.

[0096] 5, the elastic sheet 80 is fixed to the stage 30 at the position of the sheet fixing part 33. For example, the elastic sheet 80 arranged on the stage 30 is adsorbed and fixed to the stage 30 by suction via the third suction hole 33a and the third suction pipe 100, thereby forming an intra-sheet space 8 inside the sheet fixing part 33. Note that suction via the third suction hole 33a and the third suction pipe 100 may be started before the elastic sheet 80 is placed on the stage 30.

[0097] Next, suction is performed via the multiple first suction holes 31 and the multiple first suction pipes 60 to suck the gas inside the space within the sheet 8. This reduces the pressure inside the space within the sheet 8, and the elastic sheet 80 that forms the space within the sheet 8 is sucked toward the stage 30 or the substrate 2. As a result, the volume of the space within the sheet 8 is reduced, and the elastic sheet 80 is adhered to the edge of the substrate 2. The elastic sheet 80 also comes into contact with the multiple elements 4a, 4b, and 4c arranged on the substrate 2 so as to be in close contact with them.

[0098] Suction through the multiple first suction holes 31 and the multiple first suction pipes 70 may start before the intra-seat space 8 is formed. The timing of suction through the third suction holes 33a etc. may be the same as or different from the timing of suction through the first suction holes 31. In this embodiment, after suction through the second suction holes 32 etc. is performed, suction through the third suction holes 33a etc. starts, and then suction through the first suction holes 31 etc. starts.

[0099] 9, the upper member 21 is moved downward, and the upper leg portions 211 of the upper member 21 are brought into contact with the lower leg portions 221 of the lower member 22 with the elastic sheet 80 sandwiched therebetween. This makes the processing chamber 6 a closed space and functions as a pressurized space.

[0100] Next, with the substrate 2 covered with the elastic sheet 80 (with the elastic sheet 80 in contact with the multiple elements 4a, 4b, and 4c arranged on the substrate 2), gas is sent into the inside of the processing chamber 6 through piping (not shown) formed in the chamber 20 to pressurize the inside of the processing chamber 6. This creates a state in which the inside of the intra-sheet space 8 is depressurized while the outside of the intra-sheet space 8 (processing chamber 6) is pressurized, generating a pressure difference between the inside and outside of the intra-sheet space 8 (FIG. 5).

[0101] As a result, the elastic sheet 80 forming the space within the sheet 8 is pressed with a large force by the substrate 2 or the multiple elements 4a, 4b, and 4c arranged on the substrate 2, significantly reducing the volume of the space within the sheet 8. Also, the elastic sheet 80 deforms to follow the shape of the multiple elements 4a, 4b, and 4c arranged on the substrate 2, and is brought into close contact with the multiple elements 4a, 4b, and 4c with a high degree of adhesion, so that the elastic sheet 80 can press the multiple elements 4a, 4b, and 4c with a uniform force.

[0102] Furthermore, in this embodiment, the elastic sheet 80 is not pressed by a physical means (for example, an object such as a flat plate or an elastic body), but is pressed based on the pressure difference between the inside and the outside of the space within the sheet 8. Therefore, it is possible to press the elastic sheet 80 without being affected by unevenness or inclination formed on the surface of the flat plate, elastic body, etc., and the elastic sheet 80 can press the multiple elements 4a, 4b, and 4c with a uniform and appropriate force.

[0103] While the inside of the processing chamber 6 is being pressurized, the inside of the processing chamber 6 is heated by the upper heating device 91, and the stage 30 is heated by the lower heating device 92. This allows the substrate 2 placed on the stage 30 to be heated in a well-balanced manner from its upper and lower sides, and the multiple elements 4a, 4b, and 4c arranged on the substrate 2 can be satisfactorily bonded to the substrate 2 via the conductive bonding material. In addition, the heat received from the upper heating device 91 and the lower heating device 92 makes the elastic sheet 80 more likely to deform so as to follow the shapes of the multiple elements 4a, 4b, and 4c arranged on the substrate 2, and the degree of adhesion between the elastic sheet 80 and the multiple elements 4a, 4b, and 4c can be increased.

[0104] Even during heating by the upper heating device 91 and the lower heating device 92, suction is performed via the multiple first suction holes 32. This makes it possible to prevent gaps from being formed between the elastic sheet 80 and the substrate 2 due to deformation of the elastic sheet 80 caused by heating, and improves adhesion between the elastic sheet 80 and the multiple elements 4a, 4b, 4c arranged on the substrate 2. Furthermore, during heating by the upper heating device 91 and the lower heating device 92, the bonding material (conductive bonding material) bonding the multiple elements 4a, 4b, 4c to the substrate 2 may decompose and generate decomposition gas, but by maintaining the above-mentioned suction state, the multiple first suction holes 32 can be suctioned. 31 The decomposition gas can be sucked and removed by this.

[0105] The heating by the upper heating device 91 and the lower heating device 92 may be performed simultaneously with the start of pressurization inside the processing chamber 6 or before this.

[0106] As shown in Fig. 9, the elastic sheet 80 presses the substrate 2 for a predetermined time, and then the substrate 2 is removed from the processing chamber 6. That is, as shown in Fig. 8, the upper member 21 is moved upward by a predetermined distance to open the processing chamber 6. Next, as shown in Fig. 7, the sheet holding part 40 is raised by a predetermined distance and made to wait above the stage 30. As a result, the elastic sheet 80, which has been placed on the stage 30 so as to cover the substrate 2, is detached (peeled off) from the stage 30. At this point, the elastic sheet 80 may be unwound and wound by the feed roll 41 and the winding roll 42 to supply an unused portion of the elastic sheet 80 to the transport space 7.

[0107] Next, as shown in Fig. 1, the multiple lift pins 50 are moved upward. When the multiple lift pins 50 move upward and the top of each reaches the upper surface of the stage 30, the substrate 2 is placed on the tops of the multiple lift pins 50 and is supported by the multiple lift pins 50. In this state, the multiple lift pins 50 are raised to a position where they protrude a predetermined distance above the stage 30 and are kept on standby. Thereafter, the substrate 2 is removed from the transfer space 7 using a robot arm (not shown), thereby obtaining an element array 4 in which the multiple elements 4a, 4b, 4c are fixed to the substrate 2 with a uniform force.

[0108] As described above, in the substrate processing apparatus 10 according to this embodiment, the pressure control unit 12 shown in Fig. 6 pressurizes the processing chamber 6 shown in Fig. 9, and as shown in Fig. 9, the sheet holding unit 40 transports the elastic sheet 80 from one side of the stage 30 to the other side by the feed roll 41 and the take-up roll 42 arranged on both sides of the stage 30, and places the elastic sheet 80 on the stage 30 so as to cover the substrate 2. In a state in which the elastic sheet 80 is arranged on the stage 30 so as to cover the substrate 2, the pressure control unit 12 pressurizes the processing chamber 6, and the elastic sheet 80 can be pressed against the substrate 2 based on the pressure, and the elastic sheet 80 can be brought into contact with the substrate 2 or the multiple elements 4a, 4b, and 4c arranged on the substrate 2, and the multiple elements 4a, 4b, and 4c arranged on the substrate 2 can be pressed by the elastic sheet 80.

[0109] In addition, when the processing chamber 6 is pressurized, the elastic sheet 80 can be deformed so as to follow the shape of the multiple elements 4a, 4b, and 4c arranged on the substrate 2, and the elastic sheet 80 can be brought into close contact with the multiple elements 4a, 4b, and 4c, and the multiple elements 4a, 4b, and 4c can be pressed with a uniform force by the elastic sheet 80. In addition, since the elastic sheet 80 is transported from one side of the stage 30 to the other side by the feed roll 41 and the take-up roll 42, the elastic sheet 80 can be supplied between the stage 30 and the upper member 21 with a small and simple configuration. As described above, according to the substrate processing apparatus 10 of this embodiment, the stability of the bonding between the multiple elements 4a, 4b, and 4c and the substrate 2 can be sufficiently ensured.

[0110] Furthermore, in this embodiment, each time the substrate 2 is placed on the stage 30, the feed roll 41 and the take-up roll 42 respectively feed and take up the elastic sheet 80. Therefore, each time the substrate 2 is placed on the stage 30, an unused portion of the elastic sheet 80 is supplied between the stage 30 and the upper member 21, and this elastic sheet 80 in an appropriate state can press the multiple elements 4a, 4b, and 4c arranged on the substrate 2 in a stable state.

[0111] Furthermore, in this embodiment, the sheet holding unit 40 moves relatively close to the stage 30 to place the elastic sheet 80 on the stage 30. This makes it possible to efficiently perform the process of placing the elastic sheet 80 on the stage 30, thereby enabling the speed-up of the work tact time.

[0112] Moreover, this embodiment has a pressure reduction control unit 13 (FIG. 6) that reduces the pressure in the sheet space 8 surrounded by the elastic sheet 80 and the stage 30. With the elastic sheet 80 arranged on the stage 30 so as to cover the substrate 2, the sheet space 8 is reduced in pressure, whereby the elastic sheet 80 is drawn toward the substrate 2, and the elastic sheet 80 can be brought into close contact with the substrate 2 or the multiple elements 4a, 4b, and 4c arranged on the substrate 2. In this state, the processing chamber 6 is pressurized, and the elastic sheet 80 is pressed toward the substrate 2 based on the pressure, whereby the multiple elements 4a, 4b, and 4c arranged on the substrate 2 can be pressed with a uniform force by the elastic sheet 80.

[0113] 3, a sheet fixing portion 33 for fixing the elastic sheet 80 to the stage 30 is provided at a position farther from the center of the stage 30 than the substrate placement area 34 (outside the substrate placement area 34). By applying pressure to the processing chamber 6 with the elastic sheet 80 fixed to the stage 30 at the position of the sheet fixing portion 33, it becomes possible to press the elastic sheet 80 toward the substrate 2 in a stable state, and the elastic sheet 80 can press the multiple elements 4a, 4b, 4c arranged on the substrate 2 with a more uniform force.

[0114] 6 pressurizes the processing chamber 6 so that the air pressure inside the processing chamber 6 shown in FIG. 1 is approximately twice the air pressure outside the processing chamber 6. Therefore, when the processing chamber 6 is pressurized, the elastic sheet 80 is pressed toward the substrate 2 with an appropriate pressing force, and the elastic sheet 80 can press the multiple elements 4a, 4b, and 4c against the substrate 2 with an appropriate force. Therefore, it is possible to prevent the multiple elements 4a, 4b, and 4c from falling off the substrate 2, and the stability of the bonding between the multiple elements 4a, 4b, and 4c and the substrate 2 can be sufficiently ensured.

[0115] The substrate processing method according to the present embodiment includes the steps of arranging the elastic sheet 80 on the stage 30 so as to cover the substrate 2, depressurizing the space 8 within the sheet surrounded by the elastic sheet 80 and the stage 30, and pressurizing the processing chamber 6. By depressurizing the space 8 within the sheet in a state in which the elastic sheet 80 is arranged on the stage 30 so as to cover the substrate 2, the elastic sheet 80 is drawn toward the substrate 2, and it becomes possible to bring the elastic sheet 80 into contact with the substrate 2 or the multiple elements 4a, 4b, and 4c arranged on the substrate 2. In this state, by pressurizing the processing chamber 6, the elastic sheet 80 is pressed toward the substrate 2 based on the pressure, and the multiple elements 4a, 4b, and 4c arranged on the substrate 2 can be pressed by the elastic sheet 80.

[0116] Moreover, in this embodiment, the processing chamber 6 is pressurized in a state in which the elastic sheet 80 is in contact with the multiple elements 4a, 4b, and 4c arranged on the substrate 2. Therefore, as described above, when the elastic sheet 80 is pressed toward the substrate 2 based on the air pressure in the processing chamber 6, the multiple elements 4a, 4b, and 4c arranged on the substrate 2 can be efficiently pressed by the elastic sheet 80.

[0117] The present invention is not limited to the above-described embodiment, and various modifications can be made within the scope of the present invention.

[0118] In the above embodiment, the upper leg 211 or the lower leg 221 shown in FIG. 1 may contact the stage 30 at a position (e.g., an edge of the stage 30) farther from the center of the stage 30 than the multiple first suction holes 31, thereby forming a pressurized space. With this configuration, it is possible to use the space surrounded by the stage 30, the top plate 210, and the upper leg 211 or the lower leg 221 as the pressurized space. The volume of the pressurized space is 1st space 212 and 2nd space Since the volume of the pressurized space is smaller than the volume of the processing chamber 6 consisting of 222, it is possible to efficiently increase the air pressure in the pressurized space, and based on the pressure difference between the pressurized space and the space 8 within the sheet, the elastic sheet 80 can press the multiple elements 4a, 4b, 4c arranged on the substrate 2 with an appropriate force.

[0119] In the above embodiment, as shown in FIG. 3, the sheet fixing part 33 is provided on the stage 30, but it may be provided on the chamber 20. For example, the sheet fixing part 33 may be formed on the upper surface of the lower leg 221 of the lower member 22 shown in FIG. 1. In this case, in addition to the aspects described in the above embodiment, the following aspects are exemplified as aspects of the sheet fixing part 33. For example, a recess is formed on the upper surface of the lower leg 221, and a protrusion or a jig is provided on the lower surface of the upper leg 211 at a position corresponding to the recess. In this configuration, when the upper member 21 descends and abuts against the lower leg 221, the protrusion or the jig provided on the upper leg 211 fits into the recess. As a result, the elastic sheet 80 located between the upper leg 211 and the lower leg 221 is pressed down by the convex portion or jig formed on the upper leg 211 inside the concave portion formed in the lower leg 221, so that the elastic sheet 80 can be fixed between the upper leg 211 and the lower leg 221.

[0120] In the above embodiment, as shown in Fig. 8, the sheet holding unit 40 places the elastic sheet 80 on the stage 30 so that the substrate 2 is covered by the feed roll 41 and the take-up roll 42 moving relatively closer to the stage 30, but the means for covering the substrate 2 with the elastic sheet 80 is not limited to this. For example, the substrate processing apparatus 10 may be provided with a laminator, and the substrate 2 may be covered with the elastic sheet 80 by the laminator.

[0121] In the above embodiment, as shown in FIG. 3, the shape of the substrate 2 is substantially rectangular, but it may be circular or another polygonal shape.

[0122] In the above embodiment, the elastic sheet 80 is lowered to the position of the stage 30 as shown in FIG. 8, and then the upper member 21 is lowered to the position of the lower member 22 as shown in FIG. 9. However, the elastic sheet 80 may be lowered to the position of the stage 30 after the upper member 21 is lowered to the position of the lower member 22 and a closed space (processing chamber 6) is formed within the chamber 20.

[0123] In the above embodiment, the substrate processing apparatus 10 is provided with two heating devices, the upper heating device 91 and the lower heating device 92, but it may be provided with only one of them. In addition, the heating temperatures by the upper heating device 91 and the lower heating device 92 are preferably the same, but may be different.

[0124] In the above embodiment, as the sheet holding part 40 approaches the stage 30, the sheet holding part 40 places the elastic sheet 80 on the stage 30 so as to cover the substrate 2, but as the stage 30 on which the substrate 2 is placed approaches the sheet holding part 40 (or the elastic sheet 80), the sheet holding part 40 may place the elastic sheet 80 on the stage 30 so as to cover the substrate 2. Alternatively, as the sheet holding part 40 (or the elastic sheet 80) approaches the sheet holding part 40 (or the elastic sheet 80) while supporting the substrate 2, the sheet holding part 40 may cover the substrate 2 with the elastic sheet 80.

[0125] In the above embodiment, the multiple first suction holes 31 and the sheet fixing portion 33 (third suction hole 33a) are arranged at a predetermined distance apart, but they may also be arranged adjacent to each other. [Explanation of symbols]

[0126] 2...Substrate 4…Element array 4a, 4b, 4c...Elements 6. Processing room 7...Transportation space 8…Seat space 10...Substrate processing device 11...Drive unit 12...Pressure control section 13... Pressure reduction control section 14...Temperature control unit 20…Chamber 21…Upper member 210…Tabletop 211...Upper leg 212… 1st space 22…Lower member 220...Bottom 220a...Through hole 221...lower leg 222… 2nd space 30…Stage 31...1st suction hole 32…Second suction hole 33…Seat fixing part 33a...Third suction hole 34… Board installation area 34a…Outer edge 35...Through hole 40…Sheet holding part 41...Output roll 42…Winding roll 50…Lift pin 60…1st suction tube 70…Second suction tube 80...Elastic sheet 91...Upper heating device 92…Lower heating device 100...Third suction tube

Claims

1. a stage on which a substrate having a plurality of elements arranged thereon is placed; an upper member that covers an upper portion of the stage and forms a pressurized space between the stage and an upper member; a sheet holding portion that holds an elastic sheet between the stage and the upper member; A pressurization control unit that pressurizes the pressurized space, the pressurized space is a closed space formed by the upper member and the elastic sheet coming into contact with each other, The sheet holding unit transports the elastic sheet from one side of the stage to the other side using a feed roll and a take-up roll arranged on either side of the stage, and positions the elastic sheet on the stage so that the substrate is covered.

2. Each time the substrate is placed on the stage, the feed roll and the take-up roll are The substrate processing apparatus according to claim 1 , wherein the elastic sheet is fed and wound up.

3. The stage further includes a plurality of lift pins extending through the interior of the stage so as to be capable of ascending and descending; The substrate processing apparatus according to claim 1 , wherein the substrate is transferred to the stage via a plurality of the lift pins.

4. 4. The substrate processing apparatus according to claim 1, wherein the sheet holding section moves relatively close to the stage to place the elastic sheet on the stage.

5. 5. The substrate processing apparatus according to claim 1, further comprising a pressure reduction control section for reducing the pressure in an inner space surrounded by the elastic sheet and the stage.

6. 6. The substrate processing apparatus according to claim 1, further comprising a sheet fixing portion for fixing the elastic sheet to the stage at a position farther from the center of the stage than the placement area of ​​the substrate.

7. 7. The substrate processing apparatus according to claim 1, wherein the pressurization control section pressurizes the pressurized space so that the air pressure inside the pressurized space is approximately twice the air pressure outside the pressurized space.

8. placing a substrate on which a plurality of elements are arranged on a stage provided inside a pressurized space; placing an elastic sheet on the stage such that the elastic sheet covers the substrate; reducing the pressure in a space within the sheet surrounded by the elastic sheet and the stage; and pressurizing the pressurized space.

9. The substrate processing method according to claim 8 , wherein the pressurized space is pressurized with the elastic sheet in contact with the plurality of elements arranged on the substrate.

10. 10. The substrate processing method according to claim 8, further comprising the step of heating the pressurized space while pressurizing the pressurized space, thereby heating the substrate placed on the stage.

11. 11. The substrate processing method according to claim 8, further comprising heating the stage while the pressurized space is being pressurized, thereby heating the substrate placed on the stage.

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