Processing equipment

Abstract

To provide a processing device which is capable of improving the quality of a processed product by suppressing a positional change of a groove due to thermal expansion of a resin layer of a main roller and, at the same time, is capable of improving the production efficiency of the processed product by performing groove reproduction efficiently.SOLUTION: A processing device 2 includes a main roller 6 formed of a number of grooves 26 to which a wire 1 is wound over, spirally along a circumferential direction and at a predetermined interval P in an axial line direction X. Therein, the main roller 6 has a shaft part 20, a resin layer 22 which covers an outer circumferential surface 20a of the shaft part 20 and, at the same time, is formed of a number of the grooves 26 and a holding part 24 which holds the resin layer 22 in the axial line direction X, on the resin layer 22, it is permitted that a number of reproduction grooves 26 are formed by stripping off a surface layer of the resin layer 22 along its outer periphery by the use of groove reproduction means 30, and a groove formation width L1 in the axial line direction X in which a number of the grooves 26 and reproduction grooves 26 are formed on the resin layer 22 is smaller than a resin formation width L in the axial line direction X of the resin layer 22.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a machining apparatus, and more particularly to a machining apparatus such as a wire saw or a wire electric discharge machining apparatus that slices a workpiece with a wire. [Background technology]

[0002] A wire saw or wire electric discharge machine is a processing machine that slices a workpiece with a wire. Spiral Numerous grooves are arranged around the circumference. hand, The roller is provided with main rollers formed at a predetermined interval in the axial direction. The main roller has a shaft portion (core material) and a resin layer covering the outer peripheral surface of the shaft portion and having the numerous grooves described above formed therein.

[0003] Patent Document 1 discloses a processing roller for a wire saw, in which a resin layer is coated around the outer periphery of a shaft, and a number of grooves for hanging wires are formed on the outer periphery of the resin layer. A metal detection ring for detecting thermal expansion displacement of the resin layer is fixed to the end face of the resin layer by integral molding. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 11-277399 Summary of the Invention [Problem to be solved by the invention]

[0005] Since the wire is wound around the groove formed in the resin layer of the main roller and slides in contact with it, the resin layer is prone to expansion due to processing heat and the like that accompanies the operation of the processing device. Therefore, thermal expansion of the resin layer changes the position of the groove in the resin layer, which may change the thickness and warpage of the sliced ​​product, the wafer, which may affect the quality of the wafer. However, although Patent Document 1 provides a detection ring for detecting the thermal expansion displacement of the resin layer, the detection ring does not suppress the thermal expansion displacement of the resin layer itself.

[0006] In addition, since the wire is wound around and slides around the groove formed in the resin layer of the main roller, the groove becomes worn and deformed with the operation of the processing device. Therefore, a groove regeneration means is used to periodically regenerate the groove by peeling off the surface layer of the resin layer along its outer periphery.

[0007] However, in Patent Document 1, the detectable ring may interfere with the groove restoring means, making it difficult to peel off the surface layer of the resin layer. Also, in order to perform the peeling process of the surface layer of the resin layer using the groove restoring means, the detectable ring must be removed and then reattached after the work is completed, which reduces the production efficiency of the wafer.

[0008] The present invention has been made in consideration of such problems, and aims to provide a processing device that can improve the quality of processed products by suppressing changes in the position of the groove caused by thermal expansion of the resin layer of the main roller, and can improve the production efficiency of processed products by efficiently performing groove regeneration. [Means for solving the problem]

[0009] In order to achieve the above object, the processing device described in claim 1 is a processing device for slicing a workpiece with a wire, and includes a main roller in which numerous grooves around which the wire is wound in a spiral shape are formed along the circumferential direction and at predetermined intervals in the axial direction, the main roller having a shaft portion, a resin layer covering the outer circumferential surface of the shaft portion and in which the numerous grooves are formed, and a holding portion for holding the resin layer in the axial direction, the resin layer is allowed to form numerous regenerated grooves by peeling the surface layer of the resin layer along its outer periphery by a groove regenerating means, and the groove formation width in the axial direction in which the numerous grooves and regenerated grooves are formed in the resin layer is smaller than the resin formation width in the axial direction of the resin layer. The difference between the groove forming width and the resin forming width is large enough that the groove restoring means does not interfere with the holding portion. It is characterized by the following.

[0010] Ma Claims 2 The invention described is as follows: 1 In the groove regeneration means, a rotating means for rotating the main roller, a horizontal moving means for moving the cutting bit along the axial direction, and a lifting and lowering means for raising and lowering the cutting bit toward the resin layer work together to form a large number of regenerated grooves, and the difference in width between the groove formation width and the resin formation width is large enough that the cutting bit does not come into contact with the holding portion when the regenerated grooves are formed by the groove regeneration means.

[0011] Also, claims 3 The invention described is as follows: 2 In the present invention, the difference in width between the groove formation width and the resin formation width is set in accordance with at least one of the cutting edge angle, cutting edge width, and descent angle of the cutting edge. Effect of the Invention

[0012] Therefore, according to the processing device described in claim 1, the quality of the processed product can be improved by suppressing changes in the groove position caused by thermal expansion of the resin layer of the main roller, and the production efficiency of the processed product can be improved by efficiently regenerating the groove. Furthermore, according to the invention as set forth in claim 2, the holding portion suppresses the thermal expansion displacement of the resin layer, and therefore the change in position of the groove, and it is possible to reliably form the desired playback groove without removing the holding portion.

[0013] In addition, according to the invention described in claim 3, the holding part suppresses the thermal expansion displacement of the resin layer and therefore the change in position of the groove, while the desired regenerated groove can be reliably formed by the cutting bit without removing the holding part. According to the invention as set forth in claim 4, the groove can be regenerated reliably with the holding portion attached to the main roller. [Brief description of the drawings]

[0014] [Figure 1] 1 is a schematic diagram of a wire saw according to an embodiment of the present invention; [Diagram 2] FIG. [Diagram 3] FIG. 4 is an enlarged cross-sectional view of a groove formed in a resin layer. [Figure 4] FIG. [Diagram 5] (a) to (d): Schematic diagrams illustrating the groove restoration process step by step. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015] Hereinafter, a processing apparatus according to an embodiment of the present invention will be described with reference to the drawings. 1 shows a schematic diagram of a wire saw 2 as an example of a processing device that slices a workpiece W with a wire 1. The wire saw 2 is equipped with a roller unit 4, which has a pair of main rollers 6. The pair of main rollers 6 are disposed spaced apart from each other in a wire path 8, and are each fastened to a rotating shaft (not shown) of the roller unit 4. These rotating shafts can be driven by a motor (not shown) to rotate each of the main rollers 6 forward and backward.

[0016] The wire saw 2 includes a pair of wire reels 10 and a pair of guide rollers 12. The wire reels 10 are disposed spaced apart from each other in the wire path 8 at positions separated by the roller unit 4 and each guide roller 12, and can be rotated forwards and backwards by a motor (not shown). Each wire reel 10 is used as a pay-out reel or a take-up reel depending on the direction of rotation.

[0017] The wire reel 10 used as a payout reel pays out the wire 1 as it rotates, and the paid-out wire 1 is guided along the wire path 8 toward the roller unit 4 via one of the guide rollers 12. Each guide roller 12 is a direction changing roller, and is disposed apart from one another on the wire path 8 at positions separated by the roller unit 4.

[0018] The wire unwound from the wire reel 10 is guided to the roller unit 4 via one guide roller 12. The wire 1 guided to the roller unit 4 is wound around the pair of main rollers 6 a predetermined number of times, and then is led out of the roller unit 4 and passes through the other guide roller 12 to be wound onto the wire reel 10 used as a take-up reel.

[0019] Each wire reel 10 is connected to a traverse control mechanism (not shown), and each traverse control mechanism reciprocates the connected wire reel 10 in its axial direction. This allows stable unwinding or winding of the wire 1 in the wire path 8. A lifting table 14 is disposed between the pair of main rollers 6 above the roller unit 4. An adhesive portion 16 is provided on the underside of the lifting table 14, and a workpiece W to be sliced ​​is attached to the adhesive portion 16.

[0020] While the wire 1 travels through the roller unit 4, the workpiece W is gradually lowered together with the lift table 14 and cut into a plurality of slices by the wire 1 positioned between the pair of main rollers 6. At this time, coolant is supplied to the wire positioned between the main rollers 6.

[0021] The coolant is used as a cooling liquid for cooling the wire 1 and each main roller 6, and when the coolant contains abrasive grains, it is also used as a grinding liquid for cutting the workpiece W. When the coolant does not contain abrasive grains, the abrasive grains are fixed to the wire 1 itself. After being supplied to the wire 1 located between the main rollers 6, the coolant is collected in a collection tank 18 and reused.

[0022] 2 shows a cross-sectional view of the main roller 6. The main roller 6 includes a hollow shaft portion 20 that is a core material, a resin layer 22 that covers an outer peripheral surface 20a of the shaft portion 20, and a pair of ring-shaped retaining portions 24 that retain the resin layer 22 on both sides in the axial direction X of the shaft portion 20. The rotating shaft of the roller unit 4 is inserted into and fastened to an inner peripheral surface 20b of the shaft portion 20.

[0023] The resin layer 22 has the wire 1 Spiral A number of grooves 26 are formed along the circumferential direction of the shaft portion 20, each of which is wound a predetermined number of times. hand, The grooves 26 are formed at a predetermined interval (groove pitch) in the axial direction X. A groove formation width L1 in the axial direction X where the numerous grooves 26 are formed in the resin layer 22 is smaller than a resin formation width L in the axial direction X of the resin layer 22. Furthermore, a width difference ΔL between the groove formation width L1 and the resin formation width L is ensured at both ends of the resin layer 22 in the axial direction X.

[0024] 3 shows an enlarged cross-sectional view of the groove 26 formed in the resin layer. Each groove is formed in a cross-sectional inverted trapezoid shape having a predetermined groove depth D, a predetermined groove angle θ, and a predetermined groove bottom width Wa, and is formed in large numbers on the outer peripheral surface 22a of the resin layer 22 with a predetermined groove pitch P and a predetermined tip width Wb. These predetermined values ​​are appropriately set according to the specifications of the main roller 6. As shown in FIG. 2, corners 28 are formed at the boundaries between the outermost ends (left and right ends) of the grooves 26 located on both sides in the axial direction X of the resin layer 22 and the outer peripheral surface 22a of the resin layer 22. That is, the groove formation width L1 is defined as the distance between the corners 28 that are the outermost ends of the grooves 26 in the axial direction X.

[0025] Since the wire 1 is wound around and in sliding contact with the numerous grooves 26 formed in the resin layer 22 of the main roller 6, the resin layer 22 is prone to expansion due to processing heat and the like associated with the operation of the wire saw 2. Thermal expansion of the resin layer 22 may change the positions of the grooves 26 in the resin layer 22, causing changes in the thickness and warping of the sliced ​​product, that is, the wafer, which may affect the quality of the wafer. However, in this embodiment, the pair of holding parts 24 suppresses thermal expansion of the resin layer 22, particularly in the axial direction X, and suppresses changes in the positions of the grooves 26 in the resin layer 22.

[0026] 4 shows a schematic diagram of a groove machining device 30 that forms the grooves 26 in the main roller 6. The groove machining device 30 includes a rotation unit (rotation means) 32, a cutting tool 34, a fixed base 36, a horizontal movement unit (horizontal movement means) 38, and an elevation movement unit (elevation movement means) 40. The rotation unit 32 centers the shaft portion 20 of the main roller 6 and rotatably supports it. The cutting tool 34 has a blade 34a at its tip for forming the grooves 26 in the resin layer 22 of the main roller 6.

[0027] The cutting bit 34 is fixed to the fixed base 36 with the tip of the blade 34a of the blade facing downward, with the vertical direction (axial radial direction) Y as the longitudinal direction. The horizontal movement unit 38 has rails 38a that support the fixed base 36 movably in the horizontal direction (axial direction X), and moves the fixed base 36 along the rails 38a to move the cutting bit 34 along the axial direction X. The lifting and lowering unit 40 supports the fixed base 36, and therefore the cutting bit 34, so that they can be raised and lowered relative to the main roller 6. The rotation unit 32, the horizontal movement unit 38, and the lifting and lowering unit 40 work together to form the numerous grooves 26 described above in the resin layer 22 of the main roller 6.

[0028] Here, since the wire 1 is wound around and in sliding contact with the groove 26 formed in the resin layer 22 of the main roller 6, the groove 26 formed in the resin layer 22 wears and deforms as the wire saw 2 operates. Therefore, the groove 26 is periodically regenerated by using a groove processing device 30. That is, in the wire saw 2 of this embodiment, the resin layer 22 of the main roller 6 is allowed to have a regenerated groove formed by groove regenerating means using the groove processing device 30 while thermal expansion is suppressed by the pair of holding parts 24.

[0029] 5(a) to (d) are schematic diagrams for explaining the groove renewal process in stages using a cross section of the upper part of the main roller 6. FIG. 5(a) shows the stage before the groove renewal. Each groove 26 in the groove formation region 42 formed in the groove formation width L1 of the resin layer 22 is worn and deformed. FIG. 5(b) shows the peeling process of the resin layer 22, which is a stage before the groove renewal process. First, by driving the horizontal movement unit 38, as shown by the dashed line, the cutting edge of the blade 34a of the cutting tool 34 is positioned above the corner 28 at one end side (the left end side in FIG. 5(b)) of the groove formation width L1, and slightly outside the corner 28 in the axial direction (slightly to the left in FIG. 5(b)).

[0030] Next, the lifting and lowering unit 40 is driven to lower the cutting bit 34 vertically downward, and as shown by the dashed line, the cutting bit 34 is positioned at a peeling start position 44 by causing the tip of the blade 34a of the cutting bit 34 to bite into the outer peripheral surface 22a of the resin layer 22 to a peeling depth D1 of the resin layer. The peeling start position 44 is located within a range of a width difference ΔL in the axial direction X, and is a position where the cutting bit 34 is not in contact with the holding part 24. The peeling depth D1 is equal to or greater than the groove depth D.

[0031] Next, the rotating unit 32 and the horizontal moving unit 38 are driven to move the cutting bit 34 horizontally while rotating the main roller 6, and the cutting edge of the cutting bit 34 is positioned at a peeling end position 46 on the other end side (right side in FIG. 5(b)) of the groove formation width L1, as shown by the solid line, and slightly outside (slightly to the right in FIG. 5(b)) in the axial direction X from the corner 28. Next, the lifting and lowering unit 40 is driven to lift the cutting bit 34 vertically upward and retract it, as shown by the two-dot chain line.

[0032] As a result, the surface layer of the resin layer 22 on which the numerous grooves 26 are formed is peeled off along its outer periphery, forming a peeled region 48 in the resin layer 22. The peeled region 48 is formed into an inverted trapezoidal cross section by a peeled peripheral surface 48a without grooves 26 and peeled side surfaces 48b formed on both sides of the peeled region 48 in the axial direction X.

[0033] The peeled peripheral surface 48a is recessed by a peeling depth D1 from the outer peripheral surface 22a of the resin layer 22 around the entire circumference of the resin layer 22. The peeled side surface 48b is an inclined surface formed from the peeled peripheral surface 48a to the outer peripheral surface 22a, and the inclination angle α with respect to the axial direction X corresponds to the blade angle β and blade width Wc of the blade 34a of the cutting bit 34.

[0034] Even after the peeled region 48 is formed, a width difference ΔL is ensured on both ends in the axial direction of the resin layer on the outer peripheral surface 22a of the resin layer 22. The width difference ΔL is set to a size that does not cause the groove machining device 30 to interfere with the holding part 24, in other words, a size that causes the cutting bit 34 to be out of contact with the holding part 24, depending on at least one of elements such as the blade angle β of the blade 34a of the cutting bit 34, the blade width Wc, and the descent angle of the cutting bit 34 based on the vertical direction Y (0° in the case of FIG. 5(b)).

[0035] Specifically, in order to regenerate the groove without contacting the cutting bit 34 with the holding portion 24, if the blade angle β or blade width Wc of the blade 34a of the cutting bit 34 is relatively large, it is necessary to ensure a large width difference ΔL in advance. Also, if the descent angle of the cutting bit 34 based on the vertical direction is greater than 0°, that is, if the cutting bit 34 is lowered obliquely downward along the peeled side surface 48b, it is necessary to ensure a large width difference ΔL in advance.

[0036] 5(c) shows a groove regeneration process performed after the peeling process. By driving the rotation unit 32, the horizontal movement unit 38, and the elevation movement unit 40, the cutting tool 34 is gradually moved in the axial direction X while rotating the main roller 6, and a large number of grooves 26 are formed in the peeled area 48. Shape Next, the lifting and lowering unit 40 is driven to raise and retract the cutting tool 34. As a result, the groove formation region 42 is formed on the peeled peripheral surface 48a of the resin layer 22.

[0037] The groove formation width L1 of the groove formation region 42 formed on the peeled peripheral surface 48a is the same as the groove formation width L1 in the initial stage before the groove is restored. In addition, at both ends in the axial direction X of the resin layer 22, a width difference ΔL of the same size as in the initial stage is secured between the groove formation width L1 and the resin formation width L. In addition, the restored grooves 26 have the same shape as before the wear, and are formed with the same groove pitch P.

[0038] 5(d) shows a state where the peeling process and the groove restoration process have been performed three times. In the peeled region 48, the peeled peripheral surface 48a is recessed to a peeling depth D3, which is three times the peeling depth D1 in the first groove restoration. In the second and third peeling processes, the peeling start position 44 and the peeling end position 46 are shifted to positions approaching each other in the axial direction X.

[0039] As a result, the peeled side surface 48b formed in the third peeling step is formed as a continuous inclined surface maintaining the inclination angle α from the peeled side surface 48b formed in the first peeling step. By repeating the peeling step shown in Fig. 5(b) and the groove reproduction step shown in Fig. 5(c), the groove reproduction can be periodically repeated until the thickness t of the remaining resin layer 22 becomes a predetermined thickness (for example, a resin layer thickness that can ensure the strength of the groove 26) or the groove formation width L cannot be ensured in the groove formation region 42.

[0040] As described above, the wire saw 2 of the present embodiment includes the holding portion 24 that holds the resin layer 22 of the main roller 6 in the axial direction X. Furthermore, the groove formation width L1 in the axial direction X in which the numerous grooves 26 and the regenerated grooves 26 are formed in the resin layer 22 is set to be smaller than the resin formation width L in the axial direction X of the resin layer 22.

[0041] As a result, the thermal expansion displacement of the resin layer 22 and thus the positional change of the groove 26 are suppressed by the holding part 24, and the groove can be regenerated by a groove regenerating means using the groove processing device 30 without removing the holding part 24. Therefore, in the wire saw 2, the quality of the processed product, that is, the wafer, can be improved, and by efficiently performing groove regeneration, the production efficiency of the processed product, that is, the wafer, can be improved.

[0042] Furthermore, the width difference ΔL between the groove formation width L1 and the resin formation width L is set to a size that does not interfere with the groove reproduction means using the groove processing device 30. This makes it possible to reliably form the desired reproduction groove without removing the holding part, while suppressing the thermal expansion displacement of the resin layer 22 and thus the position change of the groove 26 by the holding part 24.

[0043] More specifically, the groove regenerating means using the groove processing device 30 can form a large number of regenerated grooves 26 by cooperation of the rotation unit 32, the horizontal movement unit 38, and the elevation movement unit 40. The width difference ΔL between the groove formation width L1 and the resin formation width L is set to a size such that the cutting bit 34 is not in contact with the holding part 24 when the groove 26 is formed by the groove regenerating means using the groove processing device 30. This allows the holding part 24 to suppress thermal expansion displacement of the resin layer 22, and thus positional change of the groove 26, while the cutting bit 34 can reliably form the desired regenerated groove 26 without removing the holding part 24.

[0044] Moreover, the width difference ΔL between the groove formation width L1 and the resin formation width L is set according to at least one of the blade angle β of the blade 34a of the cutting bit 34, the blade width Wc, and the descent angle of the cutting bit 34. By ensuring in advance a large width difference ΔL according to these elements, groove reproduction can be reliably performed with the holding part 24 attached to the main roller 6.

[0045] Although the description of one embodiment of the present invention has been completed above, the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention. For example, if it is possible to suppress the thermal expansion displacement of the resin layer 22 and thus the position change of the groove 26, only one holding portion 24 may be provided according to the configuration of the main roller 6 and the roller unit 4, and the resin layer 22 may be held on only one side of the axial direction X.

[0046] Furthermore, the width difference ΔL between the groove formation width L1 and the resin formation width L may be different at both ends in the axial direction X of the resin layer 22, provided that this does not impede groove reproduction. Furthermore, as long as an appropriate width difference ΔL can be ensured that the cutting bit 34 does not come into contact with the holding portion 24, it is also possible to change the groove formation width L1 during groove reproduction in response to changes in the specifications of the wire saw 2 and the main roller 6.

[0047] In this embodiment, since the groove can be restored without removing the retaining portion 24, the retaining portion 24 may be formed integrally with the shaft portion 20. As shown in Fig. 2 and Figs. 5(a) to (d), the retaining portion 24 is formed to have a smaller shaft diameter than the resin layer 22. However, this is not limited thereto, and the shaft diameter of the retaining portion 24 may be made larger than the shaft diameter of the resin layer 22 as long as the retaining portion 24 can restore the groove while suppressing the thermal expansion displacement of the resin layer 22 and thus the positional change of the groove 26.

[0048] 5(d), so long as an appropriate width difference ΔL can be ensured so that the cutting bit 34 does not come into contact with the holding portion 24, it is not necessary to shift the peeling start position and the peeling end position to positions approaching each other in the axial direction X every time the peeling step is performed. Furthermore, the present invention is not limited to the wire saw 2 described in the above embodiment, and can be widely applied to machining devices that slice a workpiece with a wire, including wire electric discharge machining devices. [Explanation of symbols]

[0049] 1 Wire 2. Wire saw (processing equipment) 6 Main roller 20 Shaft 20a Outer surface 22 Resin layer 24 Holding part 26 groove (regeneration groove) 30 Grooving equipment (groove regeneration means) 32 Rotation unit (rotation means) 34 Cutting tool 34a Blade 38 Horizontal movement unit (horizontal movement means) 40 Lifting and moving unit (lifting and moving means) W work X-axis direction P Groove pitch (spacing) L1 groove forming width L Resin forming width ΔL width difference β Blade angle Wc blade width

Claims

1. A processing device for slicing a workpiece with a wire, a main roller having a number of grooves around which the wire is wound in a spiral shape, the grooves being formed in a circumferential direction and at predetermined intervals in an axial direction; The main roller is A shaft portion, a resin layer covering an outer circumferential surface of the shaft portion and having the numerous grooves formed therein; a holding portion that holds the resin layer in the axial direction; having the resin layer is allowed to form a number of regenerated grooves by peeling off the surface layer of the resin layer along its outer periphery by a groove regenerating means; a groove formation width in the axial direction in which the numerous grooves and the reproduction groove are formed in the resin layer is smaller than a resin formation width in the axial direction of the resin layer; A processing device, wherein a difference in width between the groove formation width and the resin formation width is such that the groove reproduction means does not interfere with the holding portion.

2. the groove regenerating means forms the numerous regenerated grooves by cooperation of a rotating means for rotating the main roller, a horizontal moving means for moving a cutting bit along the axial direction, and a lifting and lowering means for lifting and lowering the cutting bit toward the resin layer; 2. The processing device according to claim 1, wherein the difference in width between the groove formation width and the resin formation width is such that the cutting bit does not come into contact with the holding portion when the groove regenerating means forms the regenerated groove.

3. 3. The processing device according to claim 2, wherein the width difference between the groove formation width and the resin formation width is set in accordance with at least one of an edge angle, an edge width, and a descent angle of the cutting bit.

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