Joining method for laminated light alloy parts

Abstract

A method for additive manufacturing of an object and a system for manufacturing an object, the method including: depositing a second foil sheet onto a first foil sheet, the first foil sheet and the second foil sheet each comprising a structural layer; forming a layer stack comprising the first foil sheet and the second foil sheet, the layer stack comprising an object section and at least one support section configured to surround the object section in the layer stack; and applying at least one of heat or pressure to opposite sides of the layer stack using a first plate and a second plate, wherein applying the at least one of heat or pressure increases a temperature of the layer stack to a temperature below a melting temperature of the structural layer, and the at least one of heat or pressure bonds the first foil sheet to the second foil sheet in the layer stack.

Description

[Technical field]

[0001] (CROSS REFERENCE TO RELATED APPLICATIONS) This application claims the benefit of and priority to U.S. Provisional Application No. 63 / 037,220, filed June 10, 2020, and International (PCT) Patent Application No. PCT / US2021 / 030879, filed May 5, 2021, the entire disclosures of each of which are hereby incorporated by reference as if set forth herein in their entirety. (Technical field)

[0002] The embodiments described herein relate to methods and systems for fabricating objects, and more particularly, but not exclusively, to methods and systems for additively manufacturing foil sheet stacks from foil sheets having structural layers and interlayer material layers with different melting points. [Background technology]

[0003] In traditional laminated object manufacturing ("LOM"), assembling a complex 3D structure involves sequentially adding layers of material to a structure and using adhesives to bond the layers together. Often, these layers are cut or shaped prior to being assembled into a part. The layers can comprise a wide variety of materials, including metals. This is sufficient for plastic and paper laminated object manufacturing, since plastic and paper parts are not typically exposed to high forces or loads.

[0004] This approach involves complex process control requiring precise alignment of the adhesive and manufacturing equipment to account for the adhesive bond, and the adhesive bond may not be as strong as a metal-to-metal bond to the metal part. The final manufactured adhesive metal part may not have the same mechanical properties as its constituent metal layers and may not be suitable for many applications.

[0005] Additionally, bonding processes for metal layers require that the process be carried out under an inert or non-oxidizing atmosphere to prevent oxidation of the surfaces on the constituent metal foil sheets or parts. Surface oxide groups can inhibit or otherwise slow down the bonding process, producing a lower strength bond.

[0006] Therefore, a need exists for methods and systems for improving additive manufacturing processes. Summary of the Invention [Means for solving the problem]

[0007] This Summary is provided to introduce some of the concepts in a simplified form that are further described below in the Detailed Description section. This Summary is not intended to identify or exclude key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.

[0008] According to one aspect, an embodiment relates to a method for additive manufacturing of an object. In some embodiments, the method includes: depositing a first foil sheet, depositing a second foil sheet on the first foil sheet, the first foil sheet and the second foil sheet each including a structural layer, forming a layer stack including the first foil sheet and the second foil sheet, the layer stack including an object section and at least one support section configured to surround the object section in the layer stack, and applying at least one of heat or pressure to both sides of the layer stack with a first plate and a second plate, the applying at least one of heat or pressure increases a temperature of the layer stack to a temperature below a melting temperature of the structural layer, the at least one of heat or pressure bonds the first foil sheet to the second foil sheet in the layer stack, the first plate and the second plate are in contact with the at least one support section, the at least one support section configured to conduct the at least one of heat or pressure through the layer stack to the object section.

[0009] In some embodiments, the first foil sheet is bonded to the second foil sheet using transient liquid phase diffusion bonding.

[0010] In some embodiments, the first foil sheet is joined to the second foil sheet using brazing.

[0011] In some embodiments, the first plate and the second plate do not contact the object segment.

[0012] In some embodiments, at least one of the first foil sheet and the second foil sheet includes an interlayer material layer, and the temperature of the layer stack is greater than the melting temperature of the interlayer material layer when the first foil sheet is joined to the second foil sheet.

[0013] In some embodiments, at least one of the first foil sheet and the second foil sheet includes an interlayer material layer, and the temperature of the layer stack is below the melting temperature of the interlayer material layer when the first foil sheet is joined to the second foil sheet.

[0014] In some embodiments, no powder is deposited on the first foil sheet or the second foil sheet to promote bonding.

[0015] In some embodiments, the structural layer comprises at least one of aluminum, magnesium, titanium, an aluminum alloy, a magnesium alloy, or a titanium alloy.

[0016] In some embodiments, the interlayer material layer comprises at least one of aluminum, copper, lithium, magnesium, silicon, zinc, an aluminum alloy, a magnesium alloy, or a titanium alloy.

[0017] In some embodiments, the first plate and the second plate are heated or pressure plates.

[0018] In some embodiments, at least one of the first foil sheet or the second foil sheet is a patterned foil sheet, where the pattern is configured to create microscopic voids between the foil sheets in the layer stack.

[0019] In some embodiments, the method further includes deforming the microscopic voids and bonding the first foil sheet to a second foil sheet without a surface oxide.

[0020] In some embodiments, the method further includes polishing at least one of the first foil sheet or the second foil sheet prior to bonding the first foil sheet to the second foil sheet.

[0021] In some embodiments, the first foil sheet comprises a first object area and a first support section connected to the first object area, and the second foil sheet comprises a second object area and a second support section connected to the second object area, and the method further includes attaching the second object area to the first object area and attaching the first support area to the second support area, wherein the first support area and the second support area comprise at least one support section.

[0022] In some embodiments, the layer stack comprises a top layer, at least one intermediate layer, and a bottom layer, the at least one intermediate layer comprising an object region and a first support region, the top layer being a second support region and the bottom layer being a third support region, and the first support region, second support region, and third support region are configured to surround the object region in the layer stack.

[0023] In another aspect, an embodiment relates to a system for manufacturing an object. In some embodiments, the system includes an additive manufacturing device configured to: deposit a first foil sheet; deposit a second foil sheet on the first foil sheet, where the first and second foil sheets each include a structural layer; and form a layer stack including the first and second foil sheets, where the layer stack includes an object section and at least one support section configured to surround the object in the layer stack; and at least one of a heated or pressurized plate configured to contact the at least one support section and apply at least one of heat or pressure to both sides of the layer stack, where the at least one support section is configured to conduct the at least one of the heat or pressure through the layer stack to the object section, where applying the at least one of the heat or pressure increases a temperature of the layer stack to a temperature below a melting temperature of the structural layer, where the at least one of the heat or pressure bonds the first foil sheet to the second foil sheet in the layer stack.

[0024] In some embodiments, at least one of heat or pressure bonds a first foil sheet to a second foil sheet in the layer stack using transient liquid phase diffusion bonding.

[0025] In some embodiments, at least one of heat or pressure bonds a first foil sheet to a second foil sheet in the layer stack using brazing.

[0026] In some embodiments, at least one of the heated or pressurized plates does not contact the object segment.

[0027] In some embodiments, at least one of the first foil sheet and the second foil sheet includes an interlayer material layer, and the temperature of the layer stack is greater than the melting temperature of the interlayer material layer when the first foil sheet is joined to the second foil sheet.

[0028] In some embodiments, at least one of the first foil sheet and the second foil sheet includes an interlayer material layer, and the temperature of the layer stack is below the melting temperature of the interlayer material layer when the first foil sheet is joined to the second foil sheet.

[0029] In some embodiments, no powder is deposited on the first foil sheet or the second foil sheet to promote bonding.

[0030] In some embodiments, the structural layer comprises at least one of aluminum, magnesium, titanium, an aluminum alloy, a magnesium alloy, or a titanium alloy.

[0031] In some embodiments, the interlayer material layer comprises at least one of aluminum, copper, lithium, magnesium, silicon, zinc, an aluminum alloy, a magnesium alloy, or a titanium alloy.

[0032] In some embodiments, at least one of the first foil sheet or the second foil sheet is a patterned foil sheet, where the pattern is configured to create microscopic voids between the foil sheets in the layer stack.

[0033] In some embodiments, the additive manufacturing device is configured to deform the microscopic voids and at least one of the heated or pressurized plates is configured to bond the first foil sheet to the second foil sheet without a surface oxide.

[0034] In some embodiments, the system further includes a sander configured to sand at least one of the first foil sheet or the second foil sheet.

[0035] In some embodiments, the first foil sheet includes a first object area and a first support area connected to the first object area, and the second foil sheet includes a second object area and a second support area connected to the second object area, and the additive manufacturing device is further configured to attach the second object area to the first object area and attach the first support area to the second support area, wherein the first support area and the second support area comprise at least one support section.

[0036] In some embodiments, the layer stack comprises a top layer, at least one intermediate layer, and a bottom layer, the at least one intermediate layer comprising an object region and a first support region, the top layer being a second support region and the bottom layer being a third support region, and the first support region, second support region, and third support region are configured to surround the object region in the layer stack. [Brief description of the drawings]

[0037] Non-limiting and non-exhaustive embodiments of the present disclosure are described with reference to the following figures, in which like reference numerals refer to like parts throughout the various views unless otherwise specified.

[0038] [Figure 1] FIG. 1 depicts a cross-sectional side view of a manufactured metal laminate body according to one embodiment.

[0039] [Diagram 2] FIG. 2 depicts an isometric view and an object view of the metal laminate object of FIG.

[0040] [Diagram 3] FIG. 3 depicts a top-down cross-sectional view of a manufactured metal laminate body according to one embodiment.

[0041] [Figure 4] FIG. 4 depicts an isometric view and an object view of the metal laminate object of FIG.

[0042] [Diagram 5] FIG. 5 depicts a cross-sectional view of a containment area between a support area and an object area in an individual foil sheet, according to one embodiment.

[0043] [Figure 6] FIG. 6 depicts a cross-sectional view of an individual foil sheet, according to one embodiment.

[0044] [Figure 7] FIG. 7 depicts two surfaces with microscopic surface defects that bond together, according to one embodiment.

[0045] [Figure 8] FIG. 8 depicts an additive manufacturing system with two plates configured to apply at least one of heat and pressure to a layer stack to bond layers in the layer stack.

[0046] [Figure 9] FIG. 9 diagrammatically illustrates a method for additive manufacturing of an object through diffusion bonding, according to one embodiment.

[0047] [Figure 10] FIG. 10 diagrammatically illustrates a method for additive manufacturing of an object through transient liquid phase (TLP) diffusion bonding, according to one embodiment.

[0048] [Figure 11] FIG. 11 diagrammatically illustrates a method for additive manufacturing of an object through brazing, according to one embodiment.

[0049] [Figure 12] FIG. 12 diagrammatically illustrates a method for additive manufacturing of an object, according to one embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0050] Various embodiments are described more fully below with reference to the accompanying drawings, which form a part of this specification, showing specific exemplary embodiments. However, the concepts of the present disclosure may be embodied in many different forms and should not be construed as being limited to the embodiments described herein, but rather, these embodiments are provided as part of a thorough and complete disclosure to fully convey the scope of the concepts, techniques, and implementations of the present disclosure to those skilled in the art. The embodiments may be practiced as a method, a system, or a device. Thus, the embodiments may take the form of a hardware implementation, an entirely software implementation, or an implementation combining software and hardware aspects. Therefore, the following detailed description should not be taken in a limiting sense.

[0051] References in the specification to "one embodiment" or "an embodiment" mean that a particular feature, structure, or characteristic described in connection with an embodiment is included in at least one example implementation or technique according to this disclosure. Appearances of the phrase "in one embodiment" in various places in the specification do not necessarily all refer to the same embodiment.

[0052] Moreover, the terminology used within the specification has been selected primarily for readability and instructional purposes, and may not have been selected to precisely describe or delineate the disclosed subject matter. Thus, the present disclosure is intended to be illustrative and non-limiting with respect to the scope of the concepts discussed herein.

[0053] The embodiments described herein relate to methods and systems that enable the fabrication of complex geometries using metal LOM. In some embodiments, LOM bonds patterned sheets of foil together to form metal objects with strength comparable to machined objects. In some embodiments, the use of appropriate selective constraining support strategies allows objects with more complex geometries to be fabricated via LOM techniques as a global manufacturing strategy, so that object processing time and / or costs can be reduced.

[0054] In some embodiments, "selective inhibition" describes a strategy in which material is deposited, removed, or modified to inhibit bonding in specific areas on any number of foil sheets that make up the manufactured object. In some embodiments, these patterned foils are configured to be stacked, simultaneously forming the object and its support structure. In some embodiments, the system may use a bonding method to form strong metallurgical bonds in uninhibited locations between adjacent foil sheets. In some embodiments, the system may quench and homogenize the object to finish it. In some embodiments, the system may employ a removal technique to separate the object from its support structure. In some embodiments, the removal technique may be used at any point after the bonding step.

[0055] The terms "foil" and "foil sheet" refer to metal sheets used to form each layer in a layer stack. A foil comprises one or more sublayers, in which at least one structural layer is present, and optionally some interlayers may comprise a different metal alloy than the structural layer. In some embodiments, the foil has a thickness in one dimension of 10 μm to 10 mm. In some embodiments, the foil may be patterned to correspond to the design of the object and its supporting structure. In some embodiments, the foil sheet may comprise at least one of Al, Sb, Ba, Be, Bi, B, Cd, Ca, C, Ch, Co, Cu, Gd, Ga, H, Fe, Pb, Li, Mg, Mn, Mo, Nd, Ni, Nb, N, O, Pd, P, K, S, Si, Ag, Na, Sr, S, Ta, Th, Sn, Ti, V, Y, Zn, Zr, or rare earth metals. In some embodiments, the foil sheet may include at least one of aluminum, magnesium, titanium, an aluminum alloy, a magnesium alloy, or a titanium alloy.

[0056] A single foil sheet may include at least one structural layer and at least one layer of intercalation material. "Structural layer" refers to the core or central portion of the foil. The structural layer typically comprises the majority of the foil. The composition of the alloys used for the structural layer material is described in terms of the primary alloying elements.

[0057] The terms "interlayer" and "interlayer material layer" are used interchangeably to refer to a portion of a foil sheet that allows successive foil sheets to bond. An interlayer can be on the outside of a foil sheet. In some embodiments, the thickness of the interlayer material is less than the thickness of the structural layer material. The composition of the alloys used for the interlayer material is described in terms of the primary alloying elements.

[0058] A "layer stack" refers to at least two foil sheets.

[0059] In some embodiments, a single foil sheet may include at least one support region and at least one object region. "Support" refers to the non-object components of the foil that, when joined together, form a holder or jig that conforms to the exterior of the object and may be used in subsequent post-processing. This holder or jig formed as a combination of multiple support regions may be referred to as a "support section." The combination of object regions may be referred to as an "object section." The process of joining may be referred to as "joining."

[0060] The term "aluminum" refers to any material comprised of aluminum. For example, a material comprised of aluminum may refer to a material that is pure molecular aluminum, aluminum that is pure to standard industrial grades, an alloy of aluminum and at least one other element, or any combination thereof. In cases where the alloy is comprised of a specific metal, such as aluminum, at least some of the alloy compositions are of the same specific metal. Secondary alloying elements present may be described subsequently.

[0061] Regarding selective inhabitation methods, there are two broad classifications, differentiated by the plane in which the bond is inhabited: The term "vertical inhabitation methods" refers to a group of methods that involve inhabitation bonds on the boundary between object and support regions within a single foil. A second classification of inhabitation methods, called "horizontal inhabitation methods", encompasses inhabitation strategies at the inhabitation boundary between object and support regions of two adjacent foil sheets.

[0062] The embodiments relate to methods of producing metal objects from constituent metal layers with comparable mechanical properties. In some embodiments, these methods avoid the use of adhesives between the constituent layers and instead use high-strength metallurgical bonds between the constituent layers to form the object. For aluminum parts, some embodiments may use joining methods such as diffusion bonding, transient liquid phase diffusion bonding, and / or brazing. Specific configurations of materials such as alloy compositions, alloy structures including composites of two or more sub-layers with distinct compositions, and processing conditions such as applied temperature and pressure may result in strong metallurgical bonds with shorter and more robust processing useful for producing aluminum parts.

[0063] FIG. 1 depicts a side cross-sectional view of a manufactured metal laminate object 100, according to one embodiment. In some embodiments, the object 100 may be manufactured on a print base 105. In some embodiments, a foil sheet 110 may be deposited onto the print base 105. The foil sheet 110 may comprise at least one of an exterior support area 115, an interior support area 120, or an object area 125. In some embodiments, multiple foil sheets may be either deposited directly onto the first foil sheet 110, or later added onto the first foil sheet 110. As discussed in more detail below, the foil sheet 110 may comprise at least one of a horizontal containment area 130 or a vertical containment area 135.

[0064] In some embodiments, the suppression areas 130, 135 may be formed at the intersection of the object area 125 and the support area 115 by cutting the foil sheet 110 and forming at least a portion of a vertical suppression area 135, or by interrupting the top surface of the foil material of the current foil sheet 110 and forming at least a portion of a horizontal suppression area 130.

[0065] Figure 2 depicts an isometric view 205 and an object view 210 of the metal laminate object of Figure 1. The object is attached to support sections 215, 220, which may be removed after object section 225 is formed to complete the metal laminate object, as described in more detail below. In some embodiments, object section 225 may be offset upwardly from base 245 to ensure that the bonding and restraining process is consistent throughout object section 225.

[0066] FIG. 3 depicts a top-down cross-sectional view of a foil sheet cut for the manufacture of a metal laminate object 300, according to one embodiment. In some embodiments, the foil sheet of the object 300 may comprise an exterior support region 305, an interior support region 310, an object region 315, a vertical containment region 320, and a horizontal containment region 330, respectively. In some embodiments, the support regions 305, 310 may be configured to split vertically and separate from the object region 315. In some embodiments, the large internal channel split distance may be reduced to prevent the support regions 305, 310 from being trapped. In some embodiments, the object region 315 may comprise at least one small feature 350 that does not require support. In some embodiments, the small feature 350 may be an internal cooling channel. As discussed in more detail below, some embodiments may comprise alignment features, such as a pair of holes 360′, 360″, configured to allow alignment pins to be inserted during assembly of an object section comprising multiple object regions 315.

[0067] FIG. 4 depicts an isometric view 405 and an object view 410 of the metal laminate object of FIG. 3. In some embodiments, the support sections 435 may be split 425 vertically using a foil cutting tool (not shown), such as a laser, plasma cutter, resistance knife, die cutter, milling, or other means. In some embodiments, this split enables easier separation between the support sections 435 and the object sections 445. In some embodiments, the support sections 435 may be split into a grid pattern to facilitate easy support removal. In some embodiments, the support sections 435 may be spaced 2 mm to 100 mm apart, depending on the size and shape of the object 410. In some embodiments, the support sections 435 may be spaced farther apart if the object sections 445 are parallel and flat in shape to the support sections 435. In some embodiments, the support sections 435 may be spaced closer together if the object sections 445 are twisted or have a complex shape relative to the support sections 435.

[0068] 5 depicts a cross-sectional view of a containment region between an object region 505 and a support region 510 in an individual foil sheet, according to one embodiment. In some embodiments, the object region 505 and the support region 510 can have a width 515 that is wide enough to prevent the overlying foil sheet from contacting the previously deposited layer 525. In some embodiments, when the width 515 is wide enough, a horizontal containment region is not needed.

[0069] In some embodiments, when the cut width is narrow, a containment region 535 may be formed on the previous layer such that the overlying foil sheet does not contact the previous layer, and the containment region 535 is configured to prevent permanent bonding of the object region 550 of the subsequent layer with the support region 555 of the previous layer.

[0070] Methods for creating the horizontal inhibition regions 535 include at least one of depositing an inhibition material and cutting away the foil surface. Horizontal inhibition is successful when the inhibition material is stable at the bonding temperature that prevents the formation of a bond between the foil sheets, or alternatively, in some embodiments, the foil sheets are not in surface contact to form a bond.

[0071] In some embodiments, the inhibitor material is selectively deposited on the foil sheet to create the horizontal inhibitor regions 535. In some embodiments, the inhibitor material may be an oxide, ceramic, nitride, non-reactive salt, non-reactive metal, carbide, graphite, hydrocarbon, or other form of carbon. In some embodiments, the inhibitor material may be an oxidizer that reacts with the foil to form an oxide layer. In some embodiments, the inhibitor material may be deposited via a variety of methods, including inkjet, marker, or glue extruder, or other deposition techniques that would be equivalents recognizable by those skilled in the art. In some embodiments, the metal oxide and ceramic may be suspended in a solution to aid in deposition. In some embodiments, the deposition aid may include at least one of titanium oxide, aluminum oxide, zirconium oxide, carbide, boron nitride, titanium nitride, or carbon. In some embodiments, heat or a laser may be used to promote the formation of an oxide layer on the surface of the foil.

[0072] In some embodiments, a horizontal restraint may be applied to the boundary between the object area 550 and the support area 555. In some embodiments, a horizontal restraint may be applied to the support area 555 after every layer. In some embodiments, the layers may be divided horizontally every 3 to 500 layers, depending on the thickness of the foil sheet 560. In some embodiments, the foil sheet 560 may have a thickness of 50 μm to 500 μm. In some embodiments, the support spacing and horizontal restraint gap may be adjusted to prevent the object area 505 from mechanically interlocking with the support area 510.

[0073] In some embodiments of the horizontal restraint method, the surface of the foil is ablated with a laser, leaving a void between subsequent foil sheets. The height of the void space can be greater than the distance the metal would extend between the bonding sheets to prevent contact between the two foil sheets. In some embodiments, the oxidation of the surface caused by the laser ablation will act to inhibit bonding, similar to when metal oxide or other ceramic powders are deposited on the surface.

[0074] In some embodiments, the horizontal containment zone 565 may not be present when the angle is steep enough that the overlying foil sheet will not contact the previous layer, even if the cut width is narrow.

[0075] 6 depicts a cross-sectional view of individual foil sheets 605, 615, 625, according to one embodiment. In some embodiments, at least one foil sheet (not shown) in a stack of foil sheets may consist exclusively of structural layer 610. In some embodiments, foil 615 may comprise structural layer 630 and a separate interlayer material layer 635 on one surface. In some embodiments, interlayer material layer 635 may be on top of structural layer 630. In some embodiments, interlayer material layer 635 may be on the bottom of structural layer 630. In some embodiments, foil sheet 625 may comprise structural layer 650 and two interlayer material layers on either side of the foil sheet.

[0076] In some embodiments, the structural layer 610 can be made of aluminum. In some embodiments, the structural layer 610 can be an aluminum alloy.

[0077] In some embodiments, the interlayer material layer may be made of a metal or alloy having a lower melting point than the structural layer. In some embodiments, the interlayer material layer 635 may be made of at least one of aluminum, copper, magnesium, silicon, and zinc. In some embodiments, the metal elements may be present in several different combinations, with each composition selected for a particular set of properties that are consistent with its bonding method, such as surface oxidation resistance, surface oxidation inhibition, optimal melting temperature, and liquid state properties such as wettability over the structural layer. In some embodiments, the two interlayer material layers 635 may comprise different materials. In some embodiments, the two interlayer material layers 635 may be the same.

[0078] In some embodiments, the thickness for the interlayer material layer 635 can be 0-40% of the thickness of the structural layer 630. In some embodiments, the thickness for the interlayer material layer 635 can be 0-5% of the thickness of the structural layer 630. In some embodiments, the thickness for the interlayer material layer 635 for a single coated foil can be 0-20% of the thickness of the structural layer 630. In some embodiments, the thickness for the interlayer material layer 635 for a double coated foil can be 0-40% of the thickness of the structural layer 630.

[0079] In some embodiments, the thickness of the interlayer material layer 635 is less than the thickness of the structural layer 630. In some embodiments, the total thickness of the foil 605 is greater than 50 μm. In other embodiments, the total thickness of the foil 605 is less than 500 μm. The thicknesses of the structural layer 630 and the interlayer material layer 635, and the ratio of the structural layer thickness to the interlayer thickness, are variable and, in some embodiments, optimized for a particular bonding method.

[0080] In some embodiments, the ratios and compositions of the interlayer and structural layer materials are selected such that the final mechanical properties of the object most closely resemble the properties of the structural layer materials.

[0081] In some embodiments, the specific composition of the intercalation layer 635 is selected to cause the intercalation material to melt at a lower temperature than the structural layer 630. In some embodiments, the intercalation material is selected to minimize the melting temperature. In some embodiments, the melting temperature of the intercalation material may be greater than 500° C. and less than 590° C. In some embodiments, the melting temperature of the intercalation material may be less than 500° C. In a different subset of these embodiments, the melting temperature of the intercalation material may be less than 490° C.

[0082] 7 depicts two surfaces 725, 730 with microscopic surface defects bonding together, according to one embodiment. In some embodiments, a layer in a layer stack may comprise two surfaces with microscopic surface defects 705. In some embodiments, when the surfaces are brought into contact 710 under at least one of an applied temperature and pressure, the two microscopic surface defects may begin to align 715. In some embodiments, this alignment may form a bond region 715 comprising surface defect elements from the two surfaces. In some embodiments, the void space between the two surfaces may be eliminated when the two surfaces are aligned 720.

[0083] The surfaces of the foil sheets can be patterned or textured. In some embodiments, microscopic voids are formed between stacked foil sheets, which when plastically deformed, allow bonds to form between the surfaces without surface oxides. The surfaces are roughened, scraped, etched, or otherwise treated to mechanically or chemically remove surface oxides immediately prior to stacking the foil sheets. The patterning and or texture allows the foil sheets to stack and stay in place without the use of additional adhesive components.

[0084] In some embodiments, the surface finish on the foil may comprise a roughened, textured, or patterned surface such that microscopic voids exist between adjacent sheets of the layer stack.

[0085] In some embodiments, the surface treatment of the foil sheet may promote gas flow between layers of a stack of foil sheets, allow gas to be removed during bonding, and / or improve the quality or consistency of the bond. If a flux or other protective material is employed to prevent oxidation of the surface of the structural layer, the channels formed by the surface treatment or patterning may allow the flux or protective material to flow out of the part during processing conditions so that it is not incorporated into the part.

[0086] In some embodiments, the surface finish on the foil sheet may comprise a polished smooth surface, hi some embodiments, the polished surface may be free of micro-defects, such that when two foil sheets are stacked, there is minimal or no void space between adjacent layers of the foil sheet stack.

[0087] 8 depicts an additive manufacturing system 800 including two plates 805′, 805″ (collectively 805) configured to apply at least one of heat and pressure to a layer stack 815 to bond foil sheets 810, according to one embodiment. Some embodiments may use at least one bonding method to bond at least two foil sheets 810 in the layer stack 815.

[0088] In some embodiments, plate 805 can be at least one of a pressurized or heated plate. In some embodiments, plate 805 can be configured to apply at least one of heat or pressure to opposing sides of layer stack 815. In some embodiments, applying at least one of heat or pressure increases the temperature of layer stack 815 to a temperature below the melting temperature of the structural layer of foil sheet 810, whereby the at least one of heat or pressure bonds the first foil sheet to a second foil sheet in layer stack 815.

[0089] In some embodiments, the plate 805 can apply uniform pressure to the layer stack 815 to bond the object region 820. In some embodiments, the layer stack 815 can comprise a complete encapsulation of the object region 820. The complete encapsulation can comprise at least two support regions 825, 830, such that the object region 820 is completely enclosed within the support regions 825, 830.

[0090] In some embodiments, the support regions 825, 830 are configured to conduct at least one of heat or pressure from the plate 805 through the layer stack 815. This conduction of heat or pressure facilitates bonding of the foil sheet 810 to form the bonded object region 820. In some embodiments, the plate 805 applies at least one of heat or pressure to the support regions 825, 830, which in turn conducts at least one of heat or pressure to the object region 820. In some embodiments, the support regions 825, 830 may have flat surfaces, whereby the plate 805 may apply at least one of pressure or heat uniformly across the entire surface. In some embodiments, the support regions are the only support regions surrounding the object region 820 and may be used to create a negative of the object. In some embodiments, the bonding process of the object region 820 may occur under an oxidizing atmosphere, such as air.

[0091] In some embodiments, the system may employ at least one of diffusion bonding, transient liquid state diffusion bonding, and / or brazing. In some embodiments, the alloy composition and processing conditions are optimized for efficient diffusion bonding.

[0092] In some embodiments, for diffusion bonding alloys, the structural material in each foil sheet 810 may be comprised of at least one of aluminum or an aluminum alloy. In some embodiments, each foil sheet 810 may not include an intercalation layer for a pure diffusion bonding alloy. In some embodiments, a flux or some other protective material may be deposited on the structural layer that vaporizes at the bonding temperature and thus prevents the formation of surface oxides.

[0093] FIG. 9 diagrammatically illustrates a method 900 for additive manufacturing of an object through diffusion bonding, according to one embodiment. In some embodiments, the diffusion bonding method 900 includes applying heat to a stack of foil sheets to bring the foil sheets to a bonding temperature (step 905). In some embodiments, the bonding temperature can be lower than the melting temperature of the structural layers of the foil sheets and high enough to promote diffusion and bonding between adjacent foil sheets. In some embodiments, the bonding temperature can be lower than the temperature between the layers of the foil sheets. In some embodiments, at least one plate can apply heat to the foil sheets.

[0094] In some embodiments, simultaneously or in parallel with the application of heat, the method may include applying pressure to the stack of foil sheets (step 910). In some embodiments, the application of pressure may plastically deform any microscopic surface defects and voids between the surfaces of the foil sheets, forming a solid-solid interface between the surfaces of the stacked foil sheets. In some embodiments, the applied pressure and deformation of the surfaces may also break down surface oxides, further enabling diffusion bonding.

[0095] In some embodiments, the stack of foil sheets may be brought to a bonding temperature and optional pressure (step 915) and held at the bonding temperature and optional pressure until elements from adjacent structural layers diffuse into one another (step 925), bonding the stack of foil sheets into the object area (step 930).

[0096] In some embodiments, the method may include a sequential diffusion bonding process. In a sequential diffusion bonding process, the method may include adding a foil to the object or part of the object at a bonding temperature (step 920). In some embodiments, the bonding temperature is below the melting temperature of the structural layer material. Alternatively, a foil may be added to a low temperature foil stack and the stack with the additional foil may be brought to the bonding temperature. In some embodiments, a foil is added to an already heated stack and pressure is applied to the stack. In some embodiments, after pressure is applied, the pressure is relaxed to add another foil (step 920).

[0097] In some embodiments, the temperature can promote diffusion and bonding between the elements of the structural layer of the added foil and the object, causing the bonding process to occur.

[0098] In some embodiments, at least one of the components of the object or machine may act as a heat sink, hi some embodiments, the heat sink may create a temperature gradient across the object for the purpose of selectively promoting diffusion bonding in one sub-region of the object.

[0099] In some embodiments, this diffusion process may be repeated until the object is completed.

[0100] In some embodiments, the diffusion process is not subject to sintering. Sintering results in shrinkage, in part, because a metallic bond is formed and non-metallic components are burned away. The adhesive used in sintering is burned away as the metallic bond is formed.

[0101] FIG. 10 diagrammatically illustrates a method 1000 for additive manufacturing of an object through transient liquid phase (TLP) diffusion bonding, according to one embodiment.

[0102] Some embodiments may optimize alloy compositions and processing conditions for efficient bonding through transient liquid phase (TLP) diffusion bonding in oxidizing or non-oxidizing atmospheres or under vacuum.

[0103] In some embodiments, the structural material is aluminum or an aluminum alloy. In some embodiments, the structural material may be comprised of at least one of aluminum, magnesium, titanium, copper, silicon, or zinc. The alloying element may be comprised of at least one of magnesium or zinc. In some embodiments, the coating interlayer may be comprised of at least one of an aluminum-magnesium alloy, a magnesium-zinc alloy, an alloy of at least two of aluminum, copper, magnesium, silicon, or zinc, or any combination thereof. In some embodiments, at least one of these interlayer alloying elements may act as an oxide getter and preferentially bind oxygen at a better rate than aluminum.

[0104] In some embodiments, the aluminum alloy foil sheet may be comprised of 20%-100% aluminum. In some embodiments, the aluminum alloy foil sheet may be comprised of at least one of Sb, Ba, Be, Bi, B, Cd, Ca, C, Ch, Co, Cu, Ga, Fe, Pb, Li, Mg, Mn, Ni, O, P, K, Sc, Si, Ag, Na, Sr, Sn, Ti, V, Zn, or Zr. In some embodiments, the aluminum alloy foil sheet may be comprised of more than 50% Cu. In some embodiments, the aluminum alloy foil sheet may be comprised of more than 40% Fe. In some embodiments, the aluminum alloy foil sheet may be comprised of more than 40% Mg. In some embodiments, the aluminum alloy foil sheet may be comprised of more than 40% Ni. In some embodiments, the aluminum alloy foil sheet may be comprised of more than 40% Zn. In some embodiments, the aluminum alloy foil sheet may be comprised of more than 60% Si.

[0105] In some embodiments, the magnesium alloy foil sheet may be comprised of 45%-100% magnesium. In some embodiments, the magnesium alloy foil sheet may be comprised of at least one of Al, Be, Ca, Cu, Gd, Fe, Li, Mn, Nd, Ni, Si, Ag, Th, Y, Zn, Zr, or rare earth metals. In some embodiments, the magnesium alloy foil sheet may be comprised of greater than 40% Al.

[0106] In some embodiments, the titanium alloy foil sheet may be comprised of 70% to 100% titanium, In some embodiments, the titanium alloy foil sheet may be comprised of at least one of Al, B, C, Ch, Cu, H, Fe, Mn, Mo, Ni, Nb, N, O, Pd, Si, S, Ta, Sn, V, Y, or Zr.

[0107] In some embodiments, the melting temperature of the intercalation layer may be at least 10° C. lower than the melting temperature of the structural layer. The melting temperature of the intercalation layer may be minimized to reduce the energy costs and mechanical complexity of the process. In some embodiments, the melting temperature of the intercalation layer may be below 500° C.

[0108] In some embodiments, the composition of the intercalation layer may be selected to form a eutectic or partial eutectic system, where the combination of the intercalation layer and structural layer elements melts at a lower temperature than its constituent elements in pure form. When melted, the intercalation layer decomposes the surface oxide. The elements of the intercalation or structural layer material are at least partially vaporized at a temperature below the melting temperature of the structural layer, enabling the decomposition of the surface oxide layer during the bonding process.

[0109] In some embodiments, the overall foil thickness is generally between 50 μm and 500 μm. The interlayer may be 1-5% of the thickness of the structural material and may be between 1 μm and 40 μm thick. The interlayer material may be deposited on either one or both sides of the structural material to form a single foil sheet.

[0110] In some embodiments, the method may use a diffusing element consisting of at least one of Cu, Mn, Zn, or Si. In some embodiments, the diffusing element may consist of at least 0.2% Cu. In some embodiments, the diffusing element may consist of at least 1% Cu. In some embodiments, the diffusing element may consist of at least 2% Cu. In some embodiments, the diffusing element may consist of up to 4% Cu. In some embodiments, the diffusing element may consist of up to 5% Cu. In some embodiments, the diffusing element may consist of up to 6% Cu. In some embodiments, the diffusing element may consist of up to 6.3% Cu.

[0111] In some embodiments, the method includes bringing the stack of foil sheets to a bonding temperature (step 1005), which is higher than the melting temperature of the intercalation layers but lower than the melting temperature of the structural layers of the constituent foil sheets.

[0112] In some embodiments, the method may include compressing the stack of foil sheets by applying pressure (step 1010). In some embodiments, the pressure may be between about 1 and 100 MPa.

[0113] In some embodiments, applying at least one of temperature or pressure melts the intercalation layer and increases the rate of diffusion of elements of the structural layer into and out of the intercalation layer (step 1015). In some embodiments, the applied pressure may promote intermixing of elements between the structural layer and the intercalation layer of an adjacent foil sheet.

[0114] In some embodiments, the molten intercalation layer completely wets the structural layer, eliminating void spaces and disrupting surface oxides that prevent bonding (step 1020).

[0115] In some embodiments, as the elements of the intercalation and structural layers disperse into one another, the average composition of the stacked foil sheets changes to approximate the final average composition of the body, and the melting temperature increases in response to the composition change, hi some embodiments, new bonds are formed between the metal components.

[0116] In some embodiments, the melting temperature of the joined parts is raised above the temperature applied to the parts so that the body solidifies at a certain temperature (step 1025).

[0117] The method 1000 may be repeated until the object is completed.

[0118] In some embodiments, the process can be performed sequentially. In a sequential process, foils can be added to a section at a bonding temperature above the melting temperature of the interlayer material, or new foils can be added to a cold stack, which is then brought to the bonding temperature. In some embodiments, the added interlayer of foil can be melted (step 1015) to continue the bonding process.

[0119] In some embodiments, previously deposited layers are not affected by this process because their constituent interlayers have already been melted, interdispersed, and bonded with the structural layers such that the portions will not melt at the applied bonding temperature.

[0120] For eutectic or partial eutectic systems, in part, the previously bonded foil sheet will not melt as the composition moves away from the lower melting eutectic composition. In some embodiments, either the object or another component of the machine can act as a heat sink and create a temperature gradient across the part for the purpose of selectively promoting diffusion bonding in one sub-region of the part.

[0121] This process can be repeated until the part is completed.

[0122] In some embodiments, the bond interface forms a non-linear bond interface between adjacent foil sheets that ultimately increases the article region strength as a result of the surface pretreatment, alloy composition, and processing conditions.

[0123] 11 diagrammatically illustrates a method 1100 for additive manufacturing of an object through brazing, according to one embodiment. In some embodiments, brazing is used to optimize alloy compositions and processing conditions for joining.

[0124] The structural material for brazing, as well as the TLP diffusion foil sheet, may be made of aluminum or an aluminum alloy. In some embodiments, the alloy may be made of magnesium, zinc, or any combination thereof. The coating interlayer may be made of an aluminum-magnesium alloy, a magnesium-zinc alloy, an alloy of at least two of aluminum, copper, magnesium, silicon, or zinc, or any combination thereof. At least one of these interlayer alloying elements may act as an oxide getter. In some embodiments, the oxide getter may preferentially bind oxygen at a better rate than aluminum. In some embodiments, the composition of the interlayer alloying elements may be selected to minimize the effect of surface oxides on the bonding process in an oxidizing atmosphere. The process may include a greater amount of elements that interfere with the surface oxide or preferentially bind oxygen.

[0125] In some embodiments, the method includes depositing a first foil sheet (step 1105). In some embodiments, the first foil sheet may be deposited onto a print base. In some embodiments, the first foil sheet may be deposited onto a foil sheet. The first foil sheet may comprise an object region and at least one support region connected to the object region. In some embodiments, the method further includes depositing a second foil sheet (step 1115). In some embodiments, the foil sheet may comprise at least one intercalation layer and at least one structural layer.

[0126] In some embodiments, the foil sheet may be deposited using additive manufacturing, hi some embodiments, additional liquid flux may be deposited (step 1110) prior to depositing the second foil sheet.

[0127] In some embodiments, an additional liquid flux may be applied into the void space between the layers of the part to increase the wettability of the interlayer material across the surface of the structural layer when melted. The flux may be decomposed at the joining temperature or otherwise forced out of the void space under pressure. In some embodiments, the additional liquid flux may deoxidize the light alloy part, which comprises at least one of an aluminum alloy, a magnesium alloy, or a titanium alloy. In some embodiments, the light alloy may consist of an aluminum, magnesium, or titanium alloy.

[0128] In some embodiments, the foil sheet may be brought to a bonding temperature, step 1120. In some embodiments, the bonding temperature is greater than the melting temperature of the intercalation layer, but less than the melting temperature of the structural layer of the foil sheet.

[0129] In some embodiments, the foil sheet may be held at this bonding temperature for a fixed period of time (step 1125). In some embodiments, holding the foil sheet at the bonding temperature allows the intercalation layer to melt, which may increase the diffusivity of the elements of the structural layer into the intercalation layer and, accordingly, the elements of the intercalation layer into the structural layer.

[0130] The process causes the formation of metallurgical bonds between adjacently stacked foil sheets to form an object (step 1130).

[0131] In some embodiments, the brazing process may be performed sequentially. In a sequential brazing process, foil may be added to a subassembly or object that includes several joined foil sheets. In some embodiments, additional liquid flux may be applied to the void space between the added foil sheet and the object.

[0132] In some embodiments, the added foil and the component may be brought to a joining temperature that is higher than the melting temperature of the interlayer of the added foil, but lower than the melting temperature of the structural layer of the added foil, and lower than the melting temperature of the alloy that makes up the component (step 1120).

[0133] In some embodiments, the added foil and component may be held at this bonding temperature for a fixed period of time (step 1125), which causes melting between the layers of added foil and the bonding process described above occurs.

[0134] In some embodiments, previously deposited layers may not be affected by this process because their constituent interlayers have already been melted, interdispersed, and bonded with the structural layers such that the object will not melt at the applied bonding temperature.

[0135] For eutectic or partial eutectic systems, in part, the previously bonded foil sheet will not melt as the composition moves away from the lower melting eutectic composition. In some embodiments, either the part or another component of the machine can act as a heat sink and create a temperature gradient across the part for the purpose of selectively promoting brazing in one sub-region of the part.

[0136] FIG. 12 diagrammatically illustrates a method 1200 for additive manufacturing of an object, according to an embodiment. In some embodiments, the method includes depositing a first foil sheet (step 1205). In some embodiments, the first foil sheet can be deposited onto a print base. In some embodiments, the first foil sheet can be deposited onto a foil sheet. The first foil sheet can include an object region and at least one support region connected to the object region. The first foil sheet can include an object region and a plurality of support regions connected to the object region. In some embodiments, the method further includes depositing a second foil sheet (step 1215). In some embodiments, the foil sheet can be deposited using additive manufacturing. In some embodiments, a constraint layer can be deposited prior to depositing the second foil sheet (step 1210). In some embodiments, the constraint layer can be deposited simultaneously with depositing the foil sheet. In some embodiments, the inhibiting material may include at least one of an oxide, a ceramic, a nitride, a non-reactive salt, a non-reactive metal, a carbide, graphite, a hydrocarbon, or carbon.

[0137] In some embodiments, the method includes aligning the foil sheet (step 1220). In some embodiments, the layer may have alignment features in the support area or object area. In some embodiments, the method may align the alignment features, and by aligning the alignment features, the foil sheet may be aligned. For example, in some embodiments, the alignment features may be at least one of holes, tabs, or slits, and the aligning may include provisionally threading a pin through the alignment feature to align the foil sheet.

[0138] In some embodiments, the method includes forming an object with the foil sheets (step 1225). In some embodiments, the object comprises object regions in the foil sheets. In some embodiments, forming the object includes spot welding the foil sheets together. In some embodiments, forming the object includes applying at least one of heat and pressure to the foil sheets. In some embodiments, after the foil sheets are aligned, the object regions in each foil sheet are attached to the object regions in the other foil sheets to form the object sections. Additionally, at least some of the support regions in each foil sheet are attached to at least some of the support regions in the other foil sheets to form the support sections. In some embodiments, the support sections are configured to distribute temperature and pressure uniformly to the object sections through the first and second foil sheets. In some embodiments, the support sections are configured to inhibit deformation of the object sections after initial deposition.

[0139] In some embodiments, the method further includes removing the support segments (step 1230). In some embodiments, the support segments may be subdivided to facilitate piecewise removal from the object. In some embodiments, the support segments may be removed by fracturing connecting bridges from the object.

[0140] The methods, systems, and devices discussed above are examples. Various configurations may omit, substitute, or add various procedures or components, as appropriate. For example, in alternative configurations, the method may be performed in a different order than described, and various things may be added, omitted, or combined. Also, features described for one configuration may be combined in various other configurations. Different aspects and elements of the configurations may be combined in a similar manner. Also, technology evolves, and thus many of the elements are examples and do not limit the scope of the disclosure or claims.

[0141] For example, the embodiments of the present disclosure are described above with reference to block diagrams and / or operational illustrations of methods, systems, and computer program products according to the embodiments of the present disclosure. The functions / acts mentioned in the blocks may occur out of the order shown in any flowchart. For example, two blocks shown in succession may in fact be performed substantially in parallel, and the blocks may sometimes be performed in reverse order, depending on the functionality / acts involved. Additionally or alternatively, not all of the blocks shown in any flowchart need to be performed and / or executed. For example, if a given flowchart has five blocks containing functions / acts, it may be the case that only three of the five blocks are performed and / or executed. In this example, any of the three of the five blocks may be performed and / or executed.

[0142] A statement that a value exceeds (or exceeds) a first threshold is equivalent to a statement that the value is slightly greater than the first threshold, meets or exceeds a second threshold, e.g., the second threshold is a value that is higher than the first threshold within the resolution of the relevant system. A statement that a value is less than (or within) a first threshold is equivalent to a statement that the value is slightly less than the first threshold, is less than or equal to the second threshold, e.g., the second threshold is a value that is lower than the first threshold within the resolution of the relevant system.

[0143] Specific details are given in the description to provide a thorough understanding of the example configurations (including implementations). However, the configurations may be practiced without these specific details. For example, well-known circuits, processes, algorithms, structures, and techniques have been shown without unnecessary detail to avoid obscuring the configurations. This description provides only example configurations and does not limit the scope, applicability, or configurations of the claims. Rather, the foregoing description of the configurations will provide one of ordinary skill in the art with an enabling description for implementing the described techniques. Various changes may be made in the function and arrangement of elements without departing from the spirit or scope of the present disclosure.

Claims

1. 1. A method for additive manufacturing of an object, the method comprising: depositing a first foil sheet; depositing a second foil sheet onto the first foil sheet, the first foil sheet and the second foil sheet each comprising a structural layer; forming a layer stack comprising the first foil sheet and the second foil sheet, the layer stack comprising an object section and at least one support section configured to surround the object section in the layer stack; applying at least one of heat or pressure to opposite sides of the layer stack with a first plate and a second plate; Including, applying at least one of heat or pressure increases a temperature of the layer stack to a temperature below a melting temperature of the structural layer; at least one of the heat or pressure bonds the first foil sheet to the second foil sheet in the layer stack; the first plate and the second plate are in contact with the at least one support section; The method, wherein the at least one support section is configured to conduct at least one of the heat or pressure through the layer stack to the object section.

2. The method of claim 1 , wherein the first foil sheet is bonded to the second foil sheet using transient liquid phase diffusion bonding.

3. The method of claim 1 , wherein the first foil sheet is joined to the second foil sheet using brazing.

4. The method of claim 1 , wherein the first plate and the second plate are not in contact with the object segment.

5. at least one of the first foil sheet and the second foil sheet comprises an interlayer material layer; The method of claim 1 , wherein the temperature of the layer stack is greater than the melting temperature of the intercalation material layer when the first foil sheet is joined to the second foil sheet.

6. at least one of the first foil sheet and the second foil sheet comprises an interlayer material layer; The method of claim 1 , wherein the temperature of the layer stack is below the melting temperature of the intercalation material layer when the first foil sheet is joined to the second foil sheet.

7. The method of claim 1 , wherein no powder is deposited on the first foil sheet or the second foil sheet to promote bonding.

8. The method of claim 1 , wherein the structural layer comprises at least one of aluminum, magnesium, titanium, an aluminum alloy, a magnesium alloy, or a titanium alloy.

9. The method of claim 5 , wherein the interlayer material layer comprises at least one of aluminum, copper, lithium, magnesium, silicon, zinc, an aluminum alloy, a magnesium alloy, or a titanium alloy.

10. The method of claim 1 , wherein the first plate and the second plate are heated or pressure plates.

11. 10. The method of claim 1, wherein at least one of the first foil sheet or the second foil sheet is a patterned foil sheet, the pattern being configured to create microscopic voids between the foil sheets in the layer stack.

12. 12. The method of claim 11, further comprising: deforming the microscopic voids; and bonding the first foil sheet to the second foil sheet without a surface oxide.

13. The method of claim 1 , further comprising polishing at least one of the first foil sheet or the second foil sheet prior to bonding the first foil sheet to the second foil sheet.

14. the first foil sheet comprises a first object area and a first support area connected to the first object area; the second foil sheet comprises a second object area and a second support area connected to the second object area; The method comprises: Attaching the second object region to the first object region; Attaching the first support area to the second support area; Further comprising: The method of claim 1 , wherein the first support region and the second support region comprise the at least one support section.

15. the layer stack comprises a top layer, at least one middle layer, and a bottom layer; the at least one intermediate layer comprises an object region and a first support region; the top layer being a second support region; the bottom layer being a third support region; The method of claim 1 , wherein the first region of support, the second region of support, and the third region of support are configured in the layer stack to surround the object region.

16. 1. A system for manufacturing an object, the system comprising:

1. An additive manufacturing device, comprising: depositing a first foil sheet; depositing a second foil sheet onto the first foil sheet, the first foil sheet and the second foil sheet each comprising a structural layer; forming a layer stack comprising the first foil sheet and the second foil sheet; configured to: an additive manufacturing device, the layer stack comprising an object section and at least one support section configured to surround the object section in the layer stack; At least one of the heated or pressurized plates; Equipped with at least one of the heated or pressurized plates is in contact with the at least one support section and configured to apply at least one of heat or pressure to both sides of the layer stack; the at least one support section is configured to conduct at least one of the heat or pressure through the layer stack to the object section; applying at least one of heat or pressure increases a temperature of the layer stack to a temperature below a melting temperature of the structural layer; The at least one of the heat or pressure bonds the first foil sheet to the second foil sheet in the layer stack.

17. 17. The system of claim 16, wherein at least one of the heat or pressure bonds the first foil sheet to the second foil sheet in the layer stack using transient liquid phase diffusion bonding.

18. 20. The system of claim 16, wherein at least one of the heat or pressure bonds the first foil sheet to the second foil sheet in the layer stack using brazing.

19. The system of claim 16 , wherein at least one of the heated or pressurized plates is not in contact with the object segment.

20. at least one of the first foil sheet and the second foil sheet comprises an interlayer material layer; 20. The system of claim 16, wherein the temperature of the layer stack is greater than the melting temperature of the intercalation material layer when the first foil sheet is joined to the second foil sheet.

21. at least one of the first foil sheet and the second foil sheet comprises an interlayer material layer; 20. The system of claim 16, wherein the temperature of the layer stack is below the melting temperature of the intercalation material layer when the first foil sheet is joined to the second foil sheet.

22. 17. The system of claim 16, wherein no powder is deposited on the first foil sheet or the second foil sheet to promote bonding.

23. 17. The system of claim 16, wherein the structural layer comprises at least one of aluminum, magnesium, titanium, an aluminum alloy, a magnesium alloy, or a titanium alloy.

24. 21. The system of claim 20, wherein the interlayer material layer comprises at least one of aluminum, copper, lithium, magnesium, silicon, zinc, an aluminum alloy, a magnesium alloy, or a titanium alloy.

25. 23. The system of claim 22, wherein at least one of the first foil sheet or the second foil sheet is a patterned foil sheet, the pattern being configured to create microscopic voids between the foil sheets in the layer stack.

26. 26. The system of claim 25, wherein the additive manufacturing device is configured to deform the microscopic voids and at least one of the heated or pressurized plates is configured to bond the first foil sheet to the second foil sheet without a surface oxide.

27. 17. The system of claim 16, further comprising a sander configured to sand at least one of the first foil sheet or the second foil sheet.

28. the first foil sheet comprises a first object area and a first support area connected to the first object area; the second foil sheet comprises a second object area and a second support area connected to the second object area; The additive manufacturing device comprises: Attaching the second object region to the first object region; Attaching the first support area to the second support area; [0023] 20. The method according to claim 1, further comprising: The system of claim 16 , wherein the first support area and the second support area comprise the at least one support section.

29. the layer stack comprises a top layer, at least one middle layer, and a bottom layer; the at least one intermediate layer comprises an object region and a first support region; the top layer being a second support region; the bottom layer being a third support region; The system of claim 16 , wherein the first region of support, the second region of support, and the third region of support are configured in the layer stack to surround the object region.

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