Manufacturing method for fabric tags

Abstract

A method for manufacturing a fabric tag is described. The tag includes a radio module 1 having an ultra-high frequency (UHF) wave, a radio frequency identification integrated circuit (RFID IC) 2 connected to the UHF module 1, an antenna 3, and a substrate 4. The method includes mounting the UHF radio module 1 and the RFID integrated circuit 2 on the substrate 4, where the UHF radio module 1 and the RFID integrated circuit 2 are electrically connected in advance by a metal track, and mounting the antenna 3 on the substrate 4. The method is characterized by the step of applying a protective coating 5 to the UHF radio module 1 and the RFID integrated circuit 2, which includes covering the metal track for the electrical connection between the RFID integrated circuit 2 and the UHF radio module 1 and further covering a surface portion of the substrate 4 located around the UHF radio module 1 and the RFID integrated circuit 2.

Description

[Technical field]

[0001] The present invention relates to a method of manufacturing fabric tags, particularly but not exclusively, tags for identifying associated clothing items, for example, tags for identification of clothing items at dry cleaners.

[0002] The invention also relates to a tag, in particular a tag for fabric, obtained using the above method, which comprises a radio module having an ultra-high frequency wave, a radio frequency identification integrated circuit connected to the radio module, an antenna and a substrate supporting the radio module, the integrated circuit and the antenna. [Background technology]

[0003] Methods for producing tags for fabrics are known, for example of the type intended to be fastened to articles of clothing (or other fabrics).

[0004] Clothing items must be identifiable during the washing or treatment process, for example in a dry cleaner, where it is necessary, inter alia, to be able to identify the owner of the clothing item so that the clothing item can be returned to the owner after treatment.

[0005] Known tags are designed to allow the clothing item to be identified by a contactless reader.

[0006] The tag therefore generally comprises a package in which a radio module with a high transmission frequency, in particular ultra high frequency (UHF), is embedded in a radio-frequency identification integrated circuit (RFID IC) by a manufacturing method carried out by a microcircuit manufacturing company, which method involves applying a protective material to the radio module and to the integrated circuit pre-mounted on the radio module, thus forming a coating that forms the exterior part of the package.

[0007] This package is then integrated with the other components of the tag by the tag manufacturer, a company different from the microcircuit manufacturer.

[0008] In particular, the package together with the antenna is fixed to a substrate, such as a fabric substrate, the substrate providing support for the package and the antenna, and the antenna being inductively coupled to the package, so that no direct electrical contact is required between the package components and the antenna.

[0009] The package is secured to the fabric substrate using an adhesive or resin, and the antenna may be stitched to the substrate or looped around the package, for example forming a closed loop surrounding the package.

[0010] Although this method is widely used, it has several drawbacks.

[0011] First, applying an adhesive or resin to the package results in a build-up of material (ie, adhesive) on the protective material that is already part of the package, increasing the overall size of the tag, particularly the thickness of the tag.

[0012] The increased dimensions are undesirable in themselves as they increase the visibility of the tag on the article of clothing, and also increase the risk of the package or antenna components being accidentally separated from the substrate as the tag becomes more resistant to bending stresses acting on it once it is secured to the article of clothing. This limited flexibility also partially impacts the flexibility of the section of the article of clothing to which the tag is secured.

[0013] Additionally, and not in order of importance, the methods described above are relatively expensive since they require pre-assembled packaging components (which are already expensive in themselves), which makes sense in light of the packaging process described above.

[0014] The technical problem underlying the present invention is to devise a method for manufacturing a tag for textiles that is able to overcome all the above-mentioned drawbacks, and thus to provide a tag that is particularly resistant to stresses, has small dimensions, is extremely flexible and is more cost-effective than those currently available on the market, thus overcoming all the drawbacks associated with currently known tags. Examples of tag manufacturing methods are disclosed in Patent Documents 1, 2 and 3. [Prior art documents] [Patent documents]

[0015] [Patent Document 1] US Patent Application Publication No. 2019 / 228280 [Patent Document 2] Patent Publication No. 2013-206080 [Patent Document 3] European Patent No. 2772873 Summary of the Invention

[0016] The idea underlying the present invention is to attach a radio module and an integrated circuit associated with the radio module to a tag substrate, in particular a fabric substrate or a fabric tag, and to protect the electrical and structural connections between the module and the circuitry with the same material used to fasten the module and the integrated circuit to the fabric substrate.

[0017] In particular, prior to the method of fixing the module and the integrated circuit to the fabric substrate, the wireless module and the integrated circuit are not enclosed (encased or embedded) in a protective material that constitutes the package, and are, so to speak, "bare," i.e., the electrical tracks interconnecting the module and the circuit are exposed to the outside.

[0018] The method of fixing the module and circuit to the substrate also covers the electrical tracks, thereby protecting the electrical contacts (tracks) between the module and circuit and stably positioning the module and circuit on the substrate, using a single material and in the same procedural steps.

[0019] In one embodiment, which is also described in connection with the example below, this procedural step also includes partially covering the tag antenna in the area of ​​the substrate immediately surrounding the module and circuitry, thereby ensuring proper positioning of the antenna relative to the module and circuitry.

[0020] According to the proposed solution mentioned above, the technical problem underlying the present invention is solved by a method for manufacturing a fabric tag as claimed in claim 1.

[0021] Furthermore, according to the proposed solution mentioned above, the technical problem is also solved by a fabric tag according to claim 11.

[0022] According to one embodiment of the invention, the tag is formed directly on the fabric, and therefore the term "support substrate" can be understood to mean a fabric support, i.e. a fabric support without other materials, e.g. plastic materials.

[0023] Attaching the antenna to the fabric support may be performed separately from attaching the wireless module and integrated circuit to the fabric.

[0024] In particular, the radio module and the integrated circuit are pre-connected together by "flip chip" or "wire bonding" techniques before being attached to the fabric support. However, before being attached to the fabric support, the radio module and the integrated circuit are not connected to the long-range antenna. This connection with the antenna is made directly to the fabric support to which the antenna can be stitched to form a ring, inside which the radio module and the integrated circuit are then positioned and held in this position by glue or resin, which also provides a local protective covering. The fabric support with the antenna, the radio module and the integrated circuit is then intended to be attached to the fabric to be tracked, for example (but not limited to) an article of clothing.

[0025] Prior art manufacturing methods instead involve combining (or incorporating) all the electronic components required for tracking, including the long-range antenna and the microchip, into a so-called "inlay", associating the inlay with several layers, for example an adhesive layer located under the inlay, a silicone layer located under the adhesive layer, and a PET layer located on top of the inlay, and finally fixing the multi-layer structure thus formed to the fabric to be tracked, for example by heat welding. Prior art inlays incorporate chips and antennas made of aluminum, copper or silver, and these components may not be separately attached to the fabric support (or a support made of other materials) as envisaged by the present invention.

[0026] According to the invention, it is not envisaged to form a multi-layer structure for the tag by the innovative method steps. The radio module and the integrated circuit are not combined into an inlay and are not structurally associated with the long-range antenna, at least before being combined with the textile substrate. Instead, the radio module and the integrated circuit are directly attached to the textile substrate and are covered with a local protective coating in the form of a resin or adhesive only on the textile substrate, and only on the textile substrate is the structural connection made (using adhesive or resin) between the long-range antenna and the radio module or the integrated circuit, and only on the textile substrate is the structural connection made between the radio module or the integrated circuit and the textile substrate.

[0027] In a variant of the embodiment of the invention, the structural connection between the radio module or the integrated circuit and the substrate may involve a non-textile substrate, but also in this case, as already mentioned above, no inlay or multi-layer structure is provided, and instead the radio module and the integrated circuit, which are already structurally connected together, can be attached to the substrate separately from the antenna.

[0028] The protective coating, i.e., adhesive or resin, may not be considered a layer of the tag, since it only affects the radio module, the integrated circuit, and the surfaces immediately surrounding them, i.e., it does not cover or extend over other parts of the substrate.

[0029] The order of superposing the wireless module and the integrated circuit on the fabric layer is not limiting with respect to the present invention. It is preferred that the wireless module is in direct contact with the fabric substrate and the integrated circuit is located above the wireless module without direct contact with the fabric substrate. However, it is possible that there is direct contact between the integrated circuit and the fabric substrate and the wireless module is located above the integrated circuit without being in direct contact with the fabric substrate.

[0030] The following points should be noted:

[0031] The supporting substrate according to the present invention is preferably a fabric substrate. The above-mentioned materials are not intended to be limiting.

[0032] The tag is formed directly on the fabric substrate.

[0033] The tracked fabric can be secured to the tag by stitching the fabric (i.e., the fabric of the tag's fabric substrate and the fabric of the tracked apparel item). Such securing methods are not limiting.

[0034] The protective coating, eg, resin, directly contacts the radio module, the integrated circuit, and only the areas of the supporting substrate surrounding the radio module and the integrated circuit, without covering other portions of the substrate. [Brief description of the drawings]

[0035] [Figure 1] 1 is a schematic diagram showing a fabric tag according to the present invention; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0036] With reference to FIG. 1, a method of manufacturing a fabric tag 10 is described below, particularly, but not exclusively, for identification of an article of clothing (not shown) with which the tag 10 is intended to be associated, for example, for identification in a dry cleaning store.

[0037] Tag 10 is A radio module having an ultra-high frequency (UHF) signal, as shown in FIG. a radio frequency identification integrated circuit (RFID IC) connected to the UHF radio module 1, denoted by 2; Antenna 3 and A fabric substrate 4 supporting a UHF radio module 1, an RFID integrated circuit 2 and an antenna 3; Equipped with.

[0038] The method comprises: Mounting the UHF radio module 1 and the RFID integrated circuit 2 on a substrate 4, where the UHF radio module 1 and the RFID integrated circuit 2 are previously connected together by a metal track; mounting an antenna 3 on a substrate 4 around the UHF radio module 1 and the RFID integrated circuit 2; Includes.

[0039] The method comprises: The method includes the step of applying a protective coating 5 to the UHF radio module 1 and the RFID integrated circuit 2, the step of applying the protective coating 5 comprising: covering the metal tracks for the electrical connection between the RFID integrated circuit 2 and the UHF module 1 to protect the electrical interconnection between the RFID integrated circuit 2 and the UHF radio module 1; The method further includes covering a surface portion of the substrate 4 located around the UHF radio module 1 and the RFID integrated circuit 2 to protect the structural interconnection between the UHF radio module 1 and the substrate 4 and to maintain the UHF radio module 1 and the RFID integrated circuit 2 in a fixed position on the substrate 4.

[0040] In particular, the step of applying the protective coating 5 comprises: Covering a portion of the antenna 3 located on the surface portion of the substrate 4 to protect the structural connection between the antenna 3 and the substrate 4. More particularly, the step of applying the protective coating 5 further comprises: Completely incorporating the RFID integrated circuit 2 and the UHF radio module 1 within a protective coating 5 on a substrate 4 Further includes:

[0041] Specifically, the step of applying the protective coating 5 may include, for example: injecting a resin or adhesive; solidifying the resin or adhesive; Includes.

[0042] The protective coating 5 acquires rigidity at the end of the solidification step.

[0043] Advantageously, the antenna part intended to be covered by the protective covering 5 constitutes a shoulder for receiving the covering 5, e.g. an adhesive or a resin, thus preventing the covering 5 from dispersing relatively far away from the UHF radio module 1 and the RFID integrated circuit 2 in the region of the substrate, thus making it possible to use a defined amount of the protective covering 5 entirely in the region to be protected. Furthermore, the antenna part intended to be covered improves the adhesion of the protective covering material.

[0044] However, according to other embodiments of the present invention, the protective coating 5 may be formed from another coating material (i.e., without the use of adhesives or resins), such as, but not limited to, a covering material that does not require a hardening step to become rigid.

[0045] It should be pointed out that the term "protective covering 5" used in the present invention does not necessarily indicate a covering that completely adheres to the UHF radio module 1 and the RFID integrated circuit 2, as in the case of an adhesive or resin, but can also indicate a covering of the UHF radio module 1 and the RFID integrated circuit 2 that is at least partially not in contact with the UHF radio module 1 and the RFID integrated circuit 2 and also not in contact with the metal tracks for the electrical connection between the UHF radio module 1 and the RFID integrated circuit 2, or at least not along the entire length of the metal tracks, but nevertheless protects the electrical connection of the metal tracks between the UHF radio module 1 and the RFID integrated circuit 2 and is designed to cover at least the surface portion of the substrate 4 located around the UHF radio module 1 and the RFID integrated circuit 2, thereby also protecting the structural interconnection between the UHF radio module 1 and the substrate 4 and maintaining the UHF radio module 1 and the RFID integrated circuit 2 in a fixed position on the substrate 4.

[0046] The antenna 3 is preferably a wire, particularly a metal wire, and the step of attaching the antenna 3 onto the substrate 4 comprises stitching the antenna 3 onto the fabric substrate 4 .

[0047] The antenna is stitched a predetermined distance from the RFID integrated circuit 2 and the UHF radio module 1, forming a preferably closed loop for inductive coupling with the UHF radio module 1. The antenna preferably extends beyond the loop across the substrate, e.g. in the opposite direction to the module, forming a turn or sinusoidal loop.

[0048] The UHF radio module 1 includes a PCB (Printed Circuit Board) incorporating metal tracks intended to act as short-range inductors.

[0049] The RFID integrated circuit 2 is electrically connected to a metal track of the UHF radio module 1 before the step of mounting the UHF radio module 1 and the RFID integrated circuit 2 on the substrate 4, but the metal track is exposed or not covered with resin before the step of mounting the UHF radio module 1 and the RFID integrated circuit 2.

[0050] The tag thus formed is It is particularly flexible, Firmly fixing the module, the circuit and the antenna on a substrate; Especially thin, It is particularly advantageous that it is cost-effective. In order to maintain the disclosure matters at the time of filing of the present application, the contents of claims 1 to 11 at the time of filing of the present application are added as follows. (Claim 1) 1. A method for manufacturing a tag for RFID tracking of fabrics, in particular but not exclusively for identifying an article of clothing to which said tag pertains, for example for identification in a dry cleaning shop, comprising the steps of: The tag is A radio module (1) having an ultra-high frequency (UHF) signal; a radio frequency identification integrated circuit (RFID IC) (2) connected to the UHF radio module (1); Antenna (3); a substrate (4) supporting the UHF radio module (1), the RFID integrated circuit (2) and the antenna (3); Equipped with mounting the UHF radio module (1) and the RFID integrated circuit (2) on the substrate (4), where the UHF radio module (1) and the RFID integrated circuit (2) are previously electrically connected together by a metal track; mounting the antenna (3) on the substrate (4) around the UHF radio module (1) and the RFID integrated circuit (2); providing a protective coating (5) on the UHF radio module (1) and the RFID integrated circuit (2); A method comprising: Here, the step of applying the protective coating (5) comprises: covering the metal tracks for electrical connection between the RFID integrated circuit (2) and the UHF module (1) to protect the electrical interconnection between the RFID integrated circuit (2) and the UHF radio module (1); The method further includes covering a surface portion of the substrate (4) surrounding the UHF radio module (1) and the RFID integrated circuit (2) to protect a structural interconnection between the UHF radio module (1) and the substrate (4) and to maintain the UHF radio module (1) and the RFID integrated circuit (2) in a fixed position on the substrate (4). (Claim 2) The step of applying the protective coating (5) comprises: 2. The method of claim 1, further comprising covering a portion of the antenna (3) located on the surface portion of the substrate (4) to protect the structural interconnection between the antenna (3) and the substrate (4). (Claim 3) The step of applying the protective coating (5) comprises: The method of claim 1 further comprising fully incorporating said RFID integrated circuit (2) and said UHF radio module (1) within said protective covering (5). (Claim 4) The step of applying the protective coating (5) comprises: Injecting a resin or adhesive; solidifying the resin or the adhesive; Including, A method for manufacturing a tag according to claim 1, wherein the protective coating (5) is rigid at the end of the solidifying step. (Claim 5) The step of applying the protective coating (5) comprises: A method of manufacturing the tag of claim 1 comprising applying a coating, preferably made from a rigid material. (Claim 6) 2. The method of claim 1, wherein the antenna (3) is a wire, and the step of attaching the antenna (3) onto the substrate (4) includes stitching the antenna (3) onto the substrate (4). (Claim 7) 7. The method of claim 6, wherein the antenna is stitched at a predetermined distance from the RFID integrated circuit (2) and the UHF radio module (1) to form a preferably closed loop for inductive coupling with the UHF radio module (1). (Claim 8) 2. The method for manufacturing a tag according to claim 1, wherein the UHF radio module (1) includes a printed circuit board (PCB) incorporating metal tracks intended to function as short-range inductors, and the RFID integrated circuit (2) is pre-electrically connected to the metal tracks of the UHF radio module (1) prior to the step of mounting the UHF radio module (1) and the RFID integrated circuit (2) on the substrate (4), but the metal tracks are bare and not covered with resin prior to the step of mounting the UHF radio module (1) and the RFID integrated circuit (2). (Claim 9) The method for manufacturing a tag according to claim 1, wherein the supporting substrate (4) is a fabric substrate. (Claim 10) the radio module (1) and the RFID integrated circuit (2) are pre-connected together by flip-chip or wire bonding technology before the step of mounting the UHF radio module (1) and the integrated circuit (2) on the substrate (4); 10. The method for manufacturing a tag according to claim 9, wherein the radio module (1) and the integrated circuit (2) are not inserted into a layer or multi-layer structure, and the protective coating (5) is in direct contact with the radio module (1), the integrated circuit (2) and areas of the supporting substrate (4) surrounding the radio module (1) and the integrated circuit (2) without extending over other areas of the supporting substrate (4). (Claim 11) 11. A fabric tag, particularly but not exclusively a tag for identifying an article of clothing to which it pertains, for example an identification tag in a dry cleaning shop, made by the method according to any one of claims 1 to 10.

Claims

1. 1. A method for manufacturing a tag for RFID tracking of a fabric, comprising the steps of: The tag is A wireless module (1) having an ultra-high frequency (UHF) signal; a radio frequency identification integrated circuit (RFID IC) (2) connected to the wireless module (1); An antenna (3); A substrate (4) that supports the wireless module (1), the RFID integrated circuit (2), and the antenna (3); Equipped with mounting the radio module (1) and the RFID integrated circuit (2) on the substrate (4), where the radio module (1) and the RFID integrated circuit (2) are previously electrically connected together by metal tracks; mounting the antenna (3) on the substrate (4) around the wireless module (1) and the RFID integrated circuit (2); providing a protective coating (5) on said radio module (1) and said RFID integrated circuit (2); A method comprising: wherein the step of applying the protective coating (5) comprises: covering the metal tracks for electrical connection between the RFID integrated circuit (2) and the radio module (1) to protect the electrical interconnection between the RFID integrated circuit (2) and the radio module (1); and fixing the radio module (1) and the RFID integrated circuit (2) to the substrate (4) by covering a surface portion of the substrate (4) located around the radio module (1) and the RFID integrated circuit (2), thereby protecting the structural interconnection between the radio module (1) and the substrate (4) and maintaining the radio module (1) and the RFID integrated circuit (2) in a fixed position on the substrate (4), Before the radio module (1) and the RFID integrated circuit (2) are fixed to the substrate (4), the metal track connecting the radio module (1) and the RFID integrated circuit (2) is exposed to the outside, the radio module (1) and the RFID integrated circuit (2) are not combined by a protective material, and before the radio module (1) and the RFID integrated circuit (2) are fixed, the radio module (1) and the RFID integrated circuit (2) are not combined in an inlay and are not structurally associated with the antenna (3); wherein covering the metal tracks and fixing the wireless module (1) and the RFID integrated circuit (2) to the substrate (4) are performed during the same step by using a resin or adhesive as the protective coating (5).

2. The step of applying the protective coating (5) comprises:

2. The method of claim 1, further comprising covering a portion of the antenna (3) located on the surface portion of the substrate (4) to protect the structural interconnection between the antenna (3) and the substrate (4).

3. The step of applying the protective coating (5) comprises: The method of claim 1 further comprising fully incorporating said RFID integrated circuit (2) and said radio module (1) within said protective covering (5).

4. The step of applying the protective coating (5) comprises: injecting the resin or adhesive; solidifying the resin or the adhesive; Including, A method for manufacturing a tag according to claim 1, wherein said protective coating (5) is rigid at the end of said solidifying step.

5. 2. The method of claim 1, wherein the antenna (3) is a wire, and the step of attaching the antenna (3) onto the substrate (4) comprises stitching the antenna (3) onto the substrate (4).

6. 6. The method of claim 5, wherein the antenna is stitched at a predetermined distance from the RFID integrated circuit (2) and the radio module (1) to form a loop for inductive coupling with the radio module (1).

7. 2. The method for manufacturing a tag according to claim 1, wherein the radio module (1) comprises a printed circuit board (PCB) incorporating the metal tracks intended to function as short-range inductors, and the RFID integrated circuit (2) is pre-electrically connected to the metal tracks of the radio module (1) prior to the step of mounting the radio module (1) and the RFID integrated circuit (2) on the substrate (4), but the metal tracks are bare and not covered with resin prior to the step of mounting the radio module (1) and the RFID integrated circuit (2).

8. The method for manufacturing a tag according to claim 1, wherein the substrate (4) is a textile substrate.

9. the radio module (1) and the RFID integrated circuit (2) are pre-connected together by flip-chip or wire bonding technology before the step of mounting the radio module (1) and the integrated circuit (2) on the substrate (4); The wireless module (1) and the RFID integrated circuit (2) are not inserted in a layer or multi-layer structure, 9. The method of claim 8, wherein the protective covering (5) is in direct contact with the radio module (1), the RFID integrated circuit (2) and areas of the support substrate (4) surrounding the radio module (1) and the RFID integrated circuit (2) without extending over other areas of the support substrate (4).

10. A tag for fabric identification, produced by a method according to any one of claims 1 to 9.

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