Resin composition and resin sheet

Abstract

A resin composition according to the present invention contains (A) a heat curing component and (B) a silane coupling agent. The (A) heat curing component contains a (A1) maleimide resin, and the (B) silane coupling agent is a compound represented by general formula (B1) below. (R210)a (R22)3-aSi-L21-NH-L22-NH-R23 ... (B1) (In general formula (B1), R21 is an alkyl group, R22 and R2３ are each an independent monovalent organic group, L21 and L22 are each an independent bivalent organic group, and a is 1, 2, or 3.)

Description

[Technical field]

[0001] The present invention relates to a resin composition and a resin sheet. [Background technology]

[0002] 2. Description of the Related Art Resin compositions having high heat resistance are used as sealing materials for power semiconductor elements and the like. For example, Patent Document 1 discloses a resin composition containing a maleimide compound, a compound having at least one of an allyl group and an epoxy group, an amine compound, and a radical generator including at least one of an acetophenone derivative and a tetraphenylethane derivative. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2015-147849 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, the resin composition described in Patent Document 1 has a problem in that the peel strength after heat curing is low, particularly when the heat curing temperature is low.

[0005] An object of the present invention is to provide a resin composition and a resin sheet which have excellent heat resistance and can improve peel strength after heat curing. [Means for solving the problem]

[0006] A resin composition according to one embodiment of the present invention is a resin composition containing (A) a thermosetting component and (B) a silane coupling agent, wherein the (A) thermosetting component contains (A1) a maleimide resin, and the (B) silane coupling agent is a compound represented by the following general formula (B1): (R 21 O)a (R 22 ) 3-a Si-L 21 -NH-L 22 -NH-R 23 (B1) (In the general formula (B1), R 21 is an alkyl group, R 22 and R 23 are each independently a monovalent organic group; L 21 and L 22 are each independently a divalent organic group, and a is 1, 2, or 3.

[0007] In the resin composition according to one aspect of the present invention, the content of the silane coupling agent (B) is preferably 0.01% by mass or more and 5% by mass or less based on the total amount of solids in the resin composition.

[0008] In the resin composition according to one aspect of the present invention, it is preferable that the resin composition further contains an adhesion imparting agent (E), and the adhesion imparting agent (E) is a compound having a triazine skeleton.

[0009] A resin sheet according to one aspect of the present invention is characterized in that it is formed from the resin composition according to the above aspect of the present invention.

[0010] In the resin sheet according to one aspect of the present invention, when the resin sheet is adhered to a copper foil and cured at 180° C. for two hours, the peel strength after curing is preferably 2.0 N / 10 mm or more.

[0011] In the resin sheet according to one aspect of the present invention, when the resin sheet is adhered to a copper foil and cured at 180° C. for two hours, the peel strength after curing is preferably 6.0 N / 10 mm or more.

[0012] The resin sheet according to one aspect of the present invention is preferably used to encapsulate a power semiconductor element, or to be interposed between the power semiconductor element and another electronic component.

[0013] In the resin sheet according to one embodiment of the present invention, it is preferable that the resin sheet is used to encapsulate a semiconductor element using one or more of silicon carbide and gallium nitride, or to be interposed between the semiconductor element using one or more of silicon carbide and gallium nitride and another electronic component.

[0014] According to one aspect of the present invention, it is possible to provide a resin composition and a resin sheet that have excellent heat resistance and can improve peel strength after thermal curing. [Brief description of the drawings]

[0015] [Figure 1] FIG. 2 is a schematic cross-sectional view of a laminate according to one embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] [Resin composition] First, the resin composition according to the present embodiment will be described. The resin composition according to the present embodiment contains a thermosetting component (A) and a silane coupling agent (B). The thermosetting component (A) according to the present embodiment contains a maleimide resin (A1).

[0017] ((A) Thermosetting component) The thermosetting component (A) (hereinafter may be simply referred to as "component (A)") has the property of forming a three-dimensional network when heated and firmly adhering to an adherend. As described above, the thermosetting component (A) in this embodiment contains the maleimide resin (A1) (hereinafter may be simply referred to as "component (A1)").

[0018] (A1) Maleimide resin The maleimide resin (A1) in this embodiment is not particularly limited as long as it is a maleimide resin containing two or more maleimide groups in one molecule.

[0019] From the viewpoint of heat resistance, the maleimide resin (A1) in the present embodiment preferably contains, for example, a benzene ring, and more preferably contains a structure in which a maleimide group is linked to a benzene ring. Also, the maleimide compound preferably has two or more structures in which a maleimide group is linked to a benzene ring.

[0020] The (A1) maleimide resin in this embodiment is preferably a maleimide resin containing two or more maleimide groups and one or more biphenyl skeletons in one molecule (hereinafter, may be simply referred to as "biphenylmaleimide resin").

[0021] From the viewpoints of heat resistance and adhesiveness, the maleimide resin (A1) in this embodiment is preferably represented by the following general formula (1).

[0022] [ka]

[0023] In the general formula (1), k is an integer of 1 or more, and the average value of k is preferably 1 to 10, more preferably 1 to 5, and even more preferably 1 to 3. m1 and m2 are each independently an integer of 1 to 6, preferably 1 to 3, and more preferably 1. n1 and n2 are each independently an integer of 0 to 4, preferably 0 to 2, and more preferably 0. R 1 and R 2 are each independently an alkyl group having 1 to 6 carbon atoms, preferably an alkyl group having 1 to 3 carbon atoms, and more preferably a methyl group. 1 are the same or different. 2 are the same or different from each other.

[0024] Specific examples of the maleimide resin represented by the general formula (1) in this embodiment include compounds represented by the following general formula (2) or (3).

[0025] [ka]

[0026] [ka]

[0027] In the general formulas (2) and (3), k is the same as k in the general formula (1). In the general formula (2), n1, n2, R 1 and R 2 are n1, n2, and R in the general formula (1). 1 and R 2 is the same as: An example of the maleimide resin represented by the general formula (3) is "MIR-3000-70MT" manufactured by Nippon Kayaku Co., Ltd.

[0028] In addition, the maleimide resin (A1) in this embodiment is also preferably a maleimide resin containing two or more maleimide groups and two or more phenylene groups in one molecule. From the viewpoint of increasing solubility in a solvent and improving sheet formability, it is preferable that the phenylene group has a substituent. Examples of the substituent include alkyl groups such as methyl groups and ethyl groups, and alkylene groups. Moreover, from the viewpoint of sheet formability, the (A1) maleimide resin in this embodiment is preferably a maleimide resin having an ether bond between the maleimide group and the phenylene group.

[0029] The maleimide resin containing two or more maleimide groups and two or more phenylene groups in one molecule is represented, for example, by the following general formula (4).

[0030] [ka]

[0031] In the general formula (4), R 3From R 6 are each independently a hydrogen atom or an alkyl group having 1 to 6 carbon atoms; L 1 is an alkylene group having 1 to 3 carbon atoms; L 2 and L 3 are each independently an alkylene group having 1 to 2 carbon atoms or an arylene group having 6 to 10 carbon atoms, and p and q are each independently 0 or 1. 1 , L 2 and L 3 The total number of carbon atoms in is 3 or less.

[0032] The maleimide resin represented by the general formula (4) in this embodiment is specifically represented by, for example, the following general formula (5) or the following general formula (6).

[0033] [ka]

[0034] [ka]

[0035] In the general formulas (5) and (6), L 1 is an alkylene group having 1 to 3 carbon atoms. In the general formula (5), R 3 From R 6 are each independently a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.

[0036] Moreover, from the viewpoints of flexibility and heat resistance, the (A1) maleimide resin in this embodiment is preferably a maleimide resin having two or more maleimide groups in one molecule, and a bonding group connecting at least one pair of two maleimide groups having four or more methylene groups in the main chain. Here, from the viewpoint of flexibility, the linking group linking the two maleimide groups preferably has six or more methylene groups in the main chain, more preferably has eight or more methylene groups in the main chain, and particularly preferably has ten or more methylene groups in the main chain. Moreover, it is more preferable that these methylene groups are linked to form an alkylene group having four or more carbon atoms. In this alkylene group, at least one -CH 2 -, -CH 2 -O- or -O-CH 2 - may be replaced. In addition, from the viewpoint of flexibility, the linking group connecting the two maleimide groups preferably has one or more side chains. Examples of the side chains include alkyl groups and alkoxy groups. Furthermore, when there are two or more side chains, the side chains may be bonded to each other to form an alicyclic structure.

[0037] Moreover, such a maleimide resin (A1) is preferably a maleimide resin that is liquid at a temperature of 25°C.

[0038] From the viewpoints of flexibility and heat resistance, such a maleimide resin (A1) is preferably represented by the following general formula (7).

[0039] [ka]

[0040] In the general formula (7), n is an integer of 0 or more, preferably an integer of 1 to 10, and more preferably an integer of 1 to 5. The average value of n is preferably 0.5 to 5, and more preferably 1 to 2. L 4 and L 5 are each independently a substituted or unsubstituted alkylene group having 4 or more carbon atoms, and in this alkylene group, at least one -CH 2 -, -CH 2 -O- or -O-CH 2-. From the viewpoint of flexibility, the number of carbon atoms in this alkylene group is preferably 6 or more, more preferably 8 or more, and particularly preferably 10 to 30. When hydrogen of the alkylene group is substituted, the substituent is an alkyl group having 1 to 10 carbon atoms, or an alkoxy group having 1 to 10 carbon atoms. Furthermore, these substituents may be bonded to each other to form an alicyclic structure. Each X is independently a substituted or unsubstituted alkylene group having 4 or more carbon atoms (at least one -CH 2 -Ga-CH 2 -O- or -O-CH 2 It is preferable that X is a divalent group having no aryl group, and further has a phthalimide group. The phthalimide group also includes a group derived from phthalimide. Specific examples of X include groups represented by the following structural formula (7-1) or the following general formula (7-2).

[0041] [ka]

[0042] In the general formula (7-2), Y 1 and Y 2 are each independently a hydrogen atom, a methyl group, or an ethyl group, and are preferably a methyl group. Specific examples of the maleimide resin represented by the general formula (7) in this embodiment include compounds represented by the following general formula (7-1-1) or (7-2-1).

[0043] [ka]

[0044] In the general formulas (7-1-1) and (7-2-1), n ​​is an integer of 1 or more and 5 or less. The average value of n is 1 or more and 2 or less. Examples of the maleimide resin represented by the general formula (7-1-1) include "BMI-1500" manufactured by Designer Molecules Inc. and "SLK1500" manufactured by Shin-Etsu Chemical Co., Ltd. An example of the maleimide resin represented by the general formula (7-2-1) is "BMI-1700" manufactured by Designer Molecules Inc.

[0045] Specific examples of the maleimide resin (A1) in this embodiment are, for example, from the viewpoint of obtaining a cured product having high heat resistance as well as sheet formability, the maleimide resin represented by the general formula (3) above, bis(3-ethyl-5-methyl-4-maleimidophenyl)methane, N,N'-1,3-phenylene dimaleimide, 4-methyl-1,3-phenylene bismaleimide, polyphenylmethane maleimide, or 2,2-bis[4-(4-maleimidophenoxy)phenyl]propane is preferred, from the viewpoint of sheet formability, the maleimide resin represented by the general formula (3) above, or bis(3-ethyl-5-methyl-4-maleimidophenyl)methane is more preferred, and from the viewpoint of reducing the complex viscosity at high temperatures before curing of the resin sheet according to this embodiment, the maleimide resin represented by the general formula (3) is even more preferred. As the maleimide resin (A1) in this embodiment, specifically, for example, from the viewpoint of flexibility and heat resistance, the maleimide resin represented by the general formula (7) is more preferable. These maleimide resins may be used alone or in combination of two or more. The maleimide resin represented by the general formula (3) may be used in combination with the maleimide resin represented by the general formula (7).

[0046] In this embodiment, the content of the (A1) component in the (A) component is preferably 60% by mass or more, more preferably 65% ​​by mass or more, and particularly preferably 70% by mass or more, based on the total amount of solids in the (A) component (i.e., when the amount of non-volatile content of the (A) component excluding the solvent is taken as 100% by mass). When the content of the (A1) component in the (A) component is in this range, the heat resistance after curing of the resin composition according to this embodiment can be improved.

[0047] (A2) Allyl resin The (A) thermosetting component contained in the resin composition in this embodiment preferably further contains (A2) allyl resin. The (A2) allyl resin (hereinafter sometimes simply referred to as "(A2) component") is preferably liquid at room temperature. By including the (A) thermosetting component allyl resin, it becomes easier to lower the reaction temperature of the resin sheet according to this embodiment while improving the peel strength of the resin sheet after curing.

[0048] In this embodiment, the mass ratio (A1 / A2) of the maleimide resin which is the component (A1) to the allyl resin (A2) is preferably 1.5 or more, and more preferably 3 or more. When the mass ratio (A1 / A2) is within the above range, the storage modulus E' at 250° C. of the cured product of the resin sheet tends to increase. When the mass ratio (A1 / A2) is within the above range, the heat resistance of the resin sheet can be improved. Furthermore, if the mass ratio (A1 / A2) is within the above range, the complex viscosity η of the resin sheet can be appropriately adjusted to ensure the fluidity of the resin sheet when applied to an adherend, while further improving the heat resistance of the resin sheet after curing. Furthermore, if the mass ratio (A1 / A2) is within the above range, the bleed-out of the allyl resin from the resin sheet is also suppressed. The upper limit of the mass ratio (A1 / A2) is not particularly limited. For example, the mass ratio (A1 / A2) may be 50 or less, and is preferably 10 or less.

[0049] The allyl resin (A2) in this embodiment is not particularly limited as long as it is a resin having an allyl group. The allyl resin (A2) in this embodiment is preferably, for example, an allyl resin containing two or more allyl groups in one molecule. The allyl resin in the present embodiment is more preferably represented by the following general formula (8), the following general formula (9), or the following general formula (10).

[0050] [ka]

[0051] [ka]

[0052] [ka]

[0053] In the general formula (8), R 7 and R 8 are each independently an alkyl group, preferably an alkyl group having 1 to 10 carbon atoms, more preferably an alkyl group having 1 to 4 carbon atoms, and further preferably an alkyl group selected from the group consisting of a methyl group and an ethyl group. In the general formula (9), n3 is 1 or more and 4 or less, preferably 1 or more and 3 or less, and more preferably 1 or more and 2 or less. In the allyl resin represented by the general formula (9), the ratio of components in which n3 is 1 is preferably 90 mol % or more.

[0054] Specific examples of the allyl resin (A2) in this embodiment include diallyl bisphenol A (2,2-bis(3-allyl-4-hydroxyphenyl)propane), the allyl phenol resin represented by the general formula (9), and the allyl phenol resin represented by the general formula (10). These allyl resins may be used alone or in combination of two or more.

[0055] (A3) Curing catalyst In the resin sheet according to the present embodiment, when the resin composition contains a thermosetting resin, it is preferable that the resin composition further contains a curing catalyst. This makes it possible to effectively advance the curing reaction of the thermosetting resin, and to satisfactorily cure the resin sheet. Examples of the curing catalyst include an imidazole-based curing catalyst, an amine-based curing catalyst, and a phosphorus-based curing catalyst.

[0056] Specific examples of imidazole-based curing catalysts include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-ethyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, 1,2-dimethylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, and 2-phenyl-4,5-di(hydroxymethyl)imidazole. From the viewpoint of reactivity, it is preferable to use 2-ethyl-4-methylimidazole. When an imidazole compound having a triazine skeleton is used as the adhesion promoter (E) described later, it also acts as a curing catalyst.

[0057] Specific examples of the amine-based curing catalyst include tertiary amine compounds such as 1,8-diazabicyclo[5,4,0]undecene-7 (DBU), triethylenediamine, benzyldimethylamine, and triethanolamine.

[0058] Specific examples of phosphorus-based curing catalysts include triphenylphosphine, tributylphosphine, tri(p-methylphenyl)phosphine, and tri(nonylphenyl)phosphine.

[0059] The thermosetting component (A) of the present embodiment may contain a thermosetting resin other than the component (A1), a curable resin other than the component (A2), and a curing catalyst other than the component (A3), as long as the object of the present invention is not impaired. The thermosetting resin other than the component (A1) may be any thermosetting resin having high heat resistance, such as epoxy resin, benzoxazine resin, cyanate resin, and melamine resin. These thermosetting resins may be used alone or in combination of two or more. However, from the viewpoint of high heat resistance, it is preferable that the thermosetting component (A) does not substantially contain an epoxy resin. Examples of the curable resin other than the component (A2) include resins such as phenol resins and resins having a C=C double bond other than the component (A2), as well as resins containing acid anhydrides and formaldehyde, etc. These curable resins can be used alone or in combination of two or more. Examples of the curing catalyst other than the component (A3) include triazole-based compounds, thiazole-based compounds, etc. These curing catalysts may be used alone or in combination of two or more. When a thermosetting resin other than the component (A1), a curable resin other than the component (A2), and a curing catalyst other than the component (A3) are used, the content of these is preferably 10 mass % or less, and more preferably 5 mass % or less, based on the total amount of solids in the component (A) (i.e., when the amount of non-volatile content of the component (A) excluding the solvent is taken as 100 mass %).

[0060] In this embodiment, the content of the (A) thermosetting component in the resin composition is preferably 2% by mass or more and 75% by mass or less, more preferably 5% by mass or more and 60% by mass or less, and particularly preferably 10% by mass or more and 40% by mass or less, based on the total amount of solids in the resin composition (i.e., when the total amount of non-volatile content of the resin composition excluding the solvent is taken as 100% by mass). By having the (A) thermosetting component content within the above range, the handleability of the resin sheet, the sheet shape retention, and the heat resistance of the resin composition are improved.

[0061] ((B) Silane coupling agent) The (B) silane coupling agent (hereinafter, sometimes simply referred to as "component (B)") is a compound represented by the following general formula (B1). This component (B) can improve the peel strength of the resin composition after curing. In this component (B), -NH-L in the following general formula (B1) 22 -NH-R 23 It is presumed that the adhesion to the metal surface is improved by the non-bonding interaction between the (B) portion and the metal ions on the metal surface or the organic functional groups bonded to the metal surface. In addition, since this (B) component does not have reactive functional groups (vinyl groups, epoxy groups, mercapto groups, and isocyanate groups) like ordinary silane coupling agents, it is presumed that it will not have a detrimental effect on the resin composition due to reactions with other components. (R 21 O) a (R 22 ) 3-a Si-L 21 -NH-L 22 -NH-R 23 (B1)

[0062] In the general formula (B1), R 21 is an alkyl group, preferably an alkyl group having 1 to 6 carbon atoms, more preferably an alkyl group having 1 to 3 carbon atoms, and further preferably a methyl group. R 22 and R 23 are each independently a monovalent organic group. 22 is preferably an alkyl group having 1 to 6 carbon atoms, more preferably an alkyl group having 1 to 3 carbon atoms, and further preferably a methyl group. 23 is preferably an alkyl group, an aryl group, or a pyridyl group, and more preferably an alkyl group having 1 to 8 carbon atoms, a phenyl group, or a pyridyl group. L 21 and L 22 are each independently a divalent organic group. 21is preferably an alkylene group, more preferably an alkylene group having 1 to 6 carbon atoms, and further preferably an alkylene group having 2 to 4 carbon atoms. 22 is preferably a divalent organic group containing oxygen or sulfur, -C b H 2b -C(=O)-C b H 2b -or-C b H 2b -C(=S)-C b H 2b More preferably, it is -, and even more preferably it is -C(=O)- or -C(=S)-, where b is 0, 1, 2, or 3. a is 1, 2 or 3, preferably 2 or 3, and more preferably 3. Specific examples of the compound represented by the general formula (B1) in this embodiment include compounds represented by the following structural formula (B1-1) or (B1-2).

[0063] [ka]

[0064] In this embodiment, the content of the (B) silane coupling agent in the resin composition is preferably 0.01% by mass or more and 5% by mass or less, more preferably 0.05% by mass or more and 3% by mass or less, even more preferably 0.1% by mass or more and 2% by mass or less, and particularly preferably 0.2% by mass or more and 1% by mass or less, based on the total amount of solids in the resin composition (i.e., when the total amount of non-volatiles in the resin composition excluding the solvent is 100% by mass). By setting the content of the (B) silane coupling agent in the resin composition within the above range, the peel strength of the resin composition after curing can be further improved.

[0065] ((C) Binder Component) In this embodiment, the resin composition preferably contains a binder component (C) (hereinafter, may be simply referred to as "component (C)") in addition to the components (A) and (B). By further containing the binder component (C) in the resin composition of this embodiment, film-forming properties are imparted, and the resin composition can be easily formed into a sheet. The (C) binder component of this embodiment is a resin component other than the (A) component, and has the function of bonding the (A) component or other components. The (C) binder component is preferably a thermoplastic resin. The (C) component may have a functional group as long as it has the function of bonding the (A) component or other components. In this way, when the (C) binder component has a functional group, even if the (C) binder component can be involved in the curing of the resin sheet by heat, in the present invention, the (C) binder component is distinguished from the (A) thermosetting component. The (C) binder component can be selected from a wide range of compounds, regardless of whether it is an aliphatic compound or an aromatic compound. The (C) binder component is preferably at least one resin selected from the group consisting of phenoxy resin, acrylic resin, methacrylic resin, polyester resin, urethane resin, and polyamideimide resin, and more preferably at least one resin selected from the group consisting of phenoxy resin and polyamideimide resin from the viewpoint of heat resistance. The polyester resin is preferably a wholly aromatic polyester resin. In addition, as the polyamideimide resin, a rubber-modified polyamideimide resin is preferable from the viewpoint of improving the flexibility of the resin sheet. The (C) binder component can be used alone or in combination of two or more kinds.

[0066] The phenoxy resin is preferably a phenoxy resin having one or more skeletons selected from the group consisting of a bisphenol A skeleton (hereinafter, bisphenol A may be referred to as "BisA"), a bisphenol F skeleton (hereinafter, bisphenol F may be referred to as "BisF"), a biphenyl skeleton, and a naphthalene skeleton, and is more preferably a phenoxy resin having a bisphenol A skeleton and a bisphenol F skeleton.

[0067] The weight average molecular weight (Mw) of the (C) binder component is preferably from 10,000 to 1,000,000, more preferably from 30,000 to 800,000, and even more preferably from 50,000 to 100,000, from the viewpoint of facilitating adjustment of the complex viscosity of the resin sheet to a desired range. The weight average molecular weight in this specification is a standard polystyrene-equivalent value measured by gel permeation chromatography (GPC).

[0068] In this embodiment, the content of the binder component (C) in the resin composition is preferably 1.5% by mass or more and 50% by mass or less, more preferably 2% by mass or more and 30% by mass or less, and particularly preferably 2% by mass or more and 15% by mass or less, based on the total amount of solids in the resin composition (i.e., when the total amount of non-volatile content of the resin composition excluding the solvent is taken as 100% by mass). By setting the content of the binder component (C) in the resin composition within the above range, it becomes easier to adjust the complex viscosity of the resin sheet before curing to a desired range, and the handleability and sheet formability of the resin sheet are improved.

[0069] (D) Inorganic filler In this embodiment, the resin composition preferably contains an inorganic filler (D) (hereinafter, sometimes simply referred to as "component (D)") in addition to components (A) to (C). This component (D) can improve at least one of the thermal properties and mechanical properties of the resin composition. (D) Examples of the inorganic filler include silica filler, alumina filler, boron nitride filler, etc. Among these, silica filler is preferred. Examples of the silica filler include fused silica and spherical silica. The inorganic filler (D) may be used alone or in combination of two or more kinds. The inorganic filler (D) may be surface-treated.

[0070] The average particle size of the (D) inorganic filler is not particularly limited. The average particle size of the (D) inorganic filler is preferably 0.1 nm or more and 100 μm or less, more preferably 10 nm or more and 10 μm or less, as determined by a general particle size distribution meter. In this specification, the average particle size of the (D) inorganic filler is a value measured by a dynamic light scattering method using a particle size distribution measuring device (manufactured by Nikkiso Co., Ltd., product name "Nanotrack Wave-UT151").

[0071] The content of the (D) inorganic filler in the resin composition is preferably 10% by mass or more and 90% by mass or less, more preferably 20% by mass or more and 85% by mass or less, even more preferably 40% by mass or more and 80% by mass or less, and particularly preferably 60% by mass or more and 80% by mass or less, based on the total amount of solids in the resin composition (i.e., when the total amount of non-volatiles in the resin composition excluding the solvent is taken as 100% by mass). By setting the content of the (D) inorganic filler in the resin composition within the above range, the linear expansion coefficient of the resin composition can be reduced, and for example, the difference in the linear expansion coefficient between the encapsulated object such as silicon carbide and the resin composition or resin sheet can be reduced.

[0072] ((E) Adhesion imparting agent) In the present embodiment, the resin composition preferably further contains an adhesion imparting agent (E) in addition to the components (A) to (D). Examples of the adhesion imparting agent include compounds having a triazine skeleton, etc. The compound having a triazine skeleton is preferably an imidazole compound having a triazine skeleton. An example of the imidazole compound having a triazine skeleton is a compound represented by the following general formula (11).

[0073] [ka]

[0074] In the general formula (11), R 11 and R 12are each independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, a hydroxymethyl group, or a phenyl group, preferably a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and more preferably a hydrogen atom or an alkyl group having 1 to 3 carbon atoms. 13 L is a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, a phenyl group, or an allyl group, preferably an alkyl group having 1 to 10 carbon atoms, and more preferably an alkyl group having 1 to 3 carbon atoms. 6 is an alkylene group having 1 to 5 carbon atoms, preferably an alkylene group having 2 to 4 carbon atoms, and more preferably an ethylene group.

[0075] Specific examples of the imidazole compound having a triazine skeleton in this embodiment include 2,4-diamino-6-[2-(2-methyl-1-imidazolyl)ethyl]-1,3,5-triazine, 2,4-diamino-6-[2-(2-ethyl-4-methyl-1-imidazolyl)ethyl]-1,3,5-triazine, and 2,4-diamino-6-[2-(2-undecyl-1-imidazolyl)ethyl]-1,3,5-triazine. Among these compounds, 2,4-diamino-6-[2-(2-methyl-1-imidazolyl)ethyl]-1,3,5-triazine or 2,4-diamino-6-[2-(2-ethyl-4-methyl-1-imidazolyl)ethyl]-1,3,5-triazine is preferred from the viewpoint of the peel strength and reaction temperature of the resin composition and the resin sheet.

[0076] In this embodiment, the content of the adhesion promoter (E) in the resin composition is preferably 0.01% by mass or more and 5% by mass or less, and more preferably 0.03% by mass or more and 3% by mass or less, based on the total amount of solids in the resin composition (i.e., when the total amount of non-volatiles in the resin composition excluding the solvent is taken as 100% by mass). If the content of the adhesion promoter is within the above range, the peel strength of the resin composition after curing can be further improved.

[0077] Examples of the resin composition according to this embodiment include a resin composition containing only the (A) component, the (B) component, and the (C) component, a resin composition containing only the (A) component, the (B) component, the (C) component, and the (D) component, and a resin composition containing only the (A) component, the (B) component, the (C) component, the (D) component, and the (E) component. Another example of the resin composition according to the present embodiment is a resin composition containing the components (A), (B), (C), (D), and (E), as well as components other than the components (A) to (E), as described below.

[0078] (Other Ingredients) In the present embodiment, the resin composition may further contain other components, such as at least one component selected from the group consisting of a crosslinking agent, a pigment, a dye, a defoaming agent, a leveling agent, an ultraviolet absorber, a foaming agent, an antioxidant, a flame retardant, an ion trapping agent, and an ion capturing agent. For example, the resin composition may further contain a crosslinking agent in order to adjust the initial adhesiveness and cohesiveness of the resin sheet before curing. Examples of the crosslinking agent include organic polyisocyanate compounds, amino resins, etc. The crosslinking agents may be used alone or in combination of two or more.

[0079] Examples of the organic polyisocyanate compound include aromatic polyisocyanate compounds, aliphatic polyisocyanate compounds, alicyclic polyisocyanate compounds, and trimers of these polyisocyanate compounds, as well as isocyanate-terminated urethane prepolymers obtained by reacting these polyisocyanate compounds with polyol compounds. More specific examples of the organic polyisocyanate compound include 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylylene diisocyanate, diphenylmethane-4,4'-diisocyanate, diphenylmethane-2,4'-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane-4,4'-diisocyanate, dicyclohexylmethane-2,4'-diisocyanate, and lysine isocyanate. The organic polyisocyanate compound may be used alone or in combination of two or more.

[0080] As the amino resin, urea resin, melamine resin, guanamine resin, and co-condensation resins thereof can be used.

[0081] The crosslinking agent as described above is usually mixed in an amount of 0.01 to 12 parts by mass, preferably 0.1 to 10 parts by mass, per 100 parts by mass of the binder component (C).

[0082] In the present embodiment, when the resin sheet is formed by coating, the resin composition preferably contains a solvent. Examples of the solvent include common solvents such as toluene, ethyl acetate, and methyl ethyl ketone, as well as high-boiling solvents such as cyclohexanone (boiling point: 155.6°C), dimethylformamide (boiling point: 153°C), dimethylsulfoxide (boiling point: 189.0°C), ethylene glycol ethers (cellosolve) (boiling point: about 120 to 310°C), and ortho-xylene (boiling point: 144.4°C).

[0083] [Resin sheet] The resin sheet according to this embodiment is formed from the resin composition according to this embodiment. In the resin sheet according to this embodiment, the flexibility can be further improved while maintaining the heat resistance. When the resin sheet is used for sealing a semiconductor element or for being interposed between a semiconductor element and another electronic component, it is preferable that the resin sheet is made only of the resin composition according to the present embodiment from the viewpoint of conformity to the irregularities of the adherend to which it is attached, etc. In other words, it is preferable that the resin sheet is not a composite material such as a combination of a resin composition and a fiber sheet, such as a prepreg.

[0084] The peel strength of the resin sheet according to this embodiment after thermal curing is preferably 2.0 N / 10 mm or more, more preferably 3.0 N / 10 mm or more and 50 N / 10 mm or less, even more preferably 4.0 N / 10 mm or more and 50 N / 10 mm or less, and particularly preferably 6.0 N / 10 mm or more and 40 N / 10 mm or less. If the peel strength of the resin sheet according to this embodiment after thermal curing is 2.0 N / 10 mm or more, when the resin sheet is used as a sealing material, it is possible to maintain high adhesion to an adherend. The peel strength after thermal curing of the resin sheet according to this embodiment can be adjusted to the above range, for example, by selecting the components to be used in the resin composition, preferably by blending at least one selected from an allyl resin and an adhesion imparting agent into the resin composition, and adjusting the type and amount of the component. The peel strength of the resin sheet according to the present embodiment after thermal curing was measured by performing a peel test at a peel angle of 90 degrees between the resin sheet after thermal curing and the adherend using the measurement method described below. Specifically, a test piece was prepared as follows, and the peel test was performed. (i) Preparation of test specimens Substrate: Copper foil (size 50mm x 10mm, thickness 150μm, JIS H 3100 specifications) Laminating device: Nikko Materials' "V-130" Bonding conditions: Lamination temperature 130℃, ultimate pressure 200Pa, time 40 seconds Resin sheet heat curing conditions: Heat curing temperature 180℃, heat curing time 2 hours (ii) Peel test method Equipment used: Tensile testing machine (Shimadzu Corporation "Autograph AG-100NXplus") Peeling method: Peel off the cured resin sheet from the substrate. Peeling speed: 50mm / min Peel angle: 90 degrees Measurement environment: 23℃ 50% relative humidity In the resin sheet according to the present embodiment, the resin composition is formed into a sheet, This simplifies application to the adherend, and simplifies attachment, particularly when the adherend has a large area. If the resin composition is in a sheet form, it is preformed into a shape that matches the shape after the sealing process, so that it can be supplied as a sealing material that maintains a certain degree of uniformity simply by applying it. In addition, if the resin composition is in a sheet form, it has no fluidity and is therefore easy to handle.

[0085] The storage modulus E' of the resin sheet according to the present embodiment after thermal curing at 250°C is preferably 150 MPa or more, more preferably 300 MPa or more, and even more preferably 500 MPa or more, from the viewpoint of improving the heat resistance of the cured product of the resin sheet. The storage modulus E' of the resin sheet after thermal curing at 250°C is a value measured for a test piece obtained by curing the resin sheet under the condition of 200°C for 4 hours.

[0086] The method of forming the resin composition into a sheet can be a conventionally known method, and is not particularly limited. When forming a resin sheet from the resin composition by applying a resin composition containing a solvent, the solvent may be completely evaporated in a drying process after application, or a part of the solvent may be left in the resin sheet. The resin sheet according to the present embodiment may be a strip-shaped sheet, or may be provided in a rolled state. The resin sheet according to the present embodiment wound into a roll can be used by being unwound from the roll and cut to a desired size.

[0087] The thickness of the resin sheet according to the present embodiment is, for example, preferably 10 μm or more, more preferably 20 μm or more, and preferably 500 μm or less, more preferably 400 μm or less, and further preferably 300 μm or less.

[0088] The resin sheet according to the present embodiment is preferably used for a semiconductor element. Specifically, the resin sheet according to the present embodiment is preferably used to seal the semiconductor element. In addition, the resin sheet according to the present embodiment is preferably used to be interposed between the semiconductor element and other electronic components. The semiconductor element is preferably a power semiconductor element. Since the resin sheet according to this embodiment has excellent heat resistance, it can be used to seal power semiconductor elements that are expected to operate at high temperatures of 200°C or higher, or to be interposed between the power semiconductor elements and other electronic components.

[0089] In addition, the resin sheet according to the present embodiment is preferably applied to a plurality of semiconductor elements at once. For example, if the resin composition is in a sheet form, the resin sheet can be applied to a structure in which a frame has a plurality of gaps and a semiconductor element is disposed in each gap, and the frame and the semiconductor elements are collectively sealed in a so-called panel level package.

[0090] In addition, the resin sheet according to the present embodiment is preferably used to seal a semiconductor element using at least one of silicon carbide and gallium nitride. Alternatively, the resin sheet according to the present embodiment is preferably used to be interposed between a semiconductor element using at least one of silicon carbide and gallium nitride and another electronic component. Examples of other electronic components include a printed wiring board and a lead frame. Since the upper limit of the operating temperature of silicon semiconductor elements is about 175° C., it is preferable to use, as the power semiconductor element, a semiconductor element using at least one of silicon carbide and gallium nitride, which are capable of operating at high temperatures. Since the resin sheet according to this embodiment is excellent in heat resistance, it can be used to encapsulate a semiconductor element using one or more of silicon carbide and gallium nitride assumed to operate at a high temperature of 200 °C or higher, or to be interposed between a semiconductor element using one or more of silicon carbide and gallium nitride and other electronic components.

[0091] (Thermosetting conditions) In the thermosetting conditions of the resin sheet according to this embodiment, the heating temperature is preferably 50 °C or higher and 300 °C or lower, and more preferably 100 °C or higher and 250 °C or lower. In the thermosetting conditions of the resin sheet according to this embodiment, the heating time is preferably 10 minutes or longer and 10 hours or shorter, and more preferably 20 minutes or longer and 7 hours or shorter. By setting the thermosetting conditions of the resin sheet within the above range, thermosetting of the resin sheet can be realized.

[0092] [Laminate] FIG. 1 shows a schematic cross-sectional view of the laminate 1 according to this embodiment. The laminate 1 according to this embodiment includes a first release material 2, a second release material 4, and a resin sheet 3 provided between the first release material 2 and the second release material 4. The resin sheet 3 is the resin sheet according to this embodiment.

[0093] The first release material 2 and the second release material 4 have releasability, and it is preferable that there is a difference between the release force of the first release material 2 with respect to the resin sheet 3 and the release force of the second release material 4 with respect to the resin sheet 3. The materials of the first release material 2 and the second release material 4 are not particularly limited. The ratio (P2 / P1) of the release force P2 of the second release material 4 to the release force P1 of the first release material 2 is preferably 0.02 ≦ P2 / P1 < 1 or 1 < P2 / P1 ≦ 50.

[0094] The first release material 2 and the second release material 4 may be, for example, a material that has release properties in itself, a material that has been subjected to a release treatment, a material on which a release agent layer is laminated, etc. When the first release material 2 and the second release material 4 have not been subjected to a release treatment, examples of the material for the first release material 2 and the second release material 4 include olefin resins, fluororesins, etc. The first release material 2 and the second release material 4 can be a release material comprising a release substrate and a release agent layer formed on the release substrate. By forming the release material comprising a release substrate and a release agent layer, handling becomes easy. In addition, the first release material 2 and the second release material 4 may comprise a release agent layer on only one side of the release substrate, or may comprise a release agent layer on both sides of the release substrate. The release agent can be formed, for example, by coating the release agent.

[0095] Examples of the release substrate include a paper substrate, a laminated paper obtained by laminating a thermoplastic resin such as polyethylene on the paper substrate, and a plastic film. Examples of the paper substrate include glassine paper, coated paper, and cast-coated paper. Examples of the plastic film include a polyester film (e.g., polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate), and a polyolefin film (e.g., polypropylene and polyethylene). Among these, a polyester film is preferred.

[0096] Examples of the release agent include silicone-based release agents made of silicone resins; long-chain alkyl group-containing compound-based release agents made of compounds containing long-chain alkyl groups, such as polyvinyl carbamates and alkyl urea derivatives; alkyd resin-based release agents made of alkyd resins (e.g., non-convertible alkyd resins and convertible alkyd resins); olefin resins (e.g., polyethylene (e.g., high-density polyethylene, low-density polyethylene, and linear low-density polyethylene), propylene homopolymers having an isotactic structure or a syndiotactic structure, etc.) Examples of the release agents include olefin resin-based release agents composed of rubber such as natural rubber and synthetic rubber (e.g., butadiene rubber, isoprene rubber, styrene-butadiene rubber, methyl methacrylate-butadiene rubber, and acrylonitrile-butadiene rubber); and acrylic resin-based release agents composed of acrylic resin such as (meth)acrylic acid ester copolymers. These can be used alone or in combination of two or more. Among these, alkyd resin-based release agents are preferred. In particular, when a phenoxy resin or polyamideimide resin is used as the binder component (C) of the resin composition contained in the resin sheet 3, if a general silicone-based release agent is used, there is a concern that the release material may be peeled off unintentionally before the use of the resin sheet 3, so it is preferable to use an alkyd resin-based release agent.

[0097] There is no particular limitation on the thickness of the first release material 2 and the second release material 4. It is usually from 1 μm to 500 μm, and preferably from 3 μm to 100 μm. The thickness of the release agent layer is not particularly limited. When the release agent layer is formed by applying a solution containing a release agent, the thickness of the release agent layer is preferably 0.01 μm or more and 3 μm or less, and more preferably 0.03 μm or more and 1 μm or less.

[0098] The method for manufacturing the laminate 1 is not particularly limited. For example, the laminate 1 is manufactured through the following steps. First, a resin composition containing a solvent is applied onto the first release material 2 to form a coating film. Next, the coating film is dried to form a resin sheet 3. Next, the resin sheet 3 and the second release material 4 are bonded together at room temperature to obtain the laminate 1. In this case, when the types of the release materials of the first release material 2 and the second release material 4 are the same, the ratio (P2 / P1) of the release force P2 of the second release material 4 to the release force P1 of the first release material 2 is likely to be P2 / P1<1. Even if the release materials of the first release material 2 and the second release material 4 are different, the value of P2 / P1 tends to be small because the resin composition is applied to the first release material 2.

[0099] [Effects of the embodiment] According to the resin composition and resin sheet of the present embodiment, a resin composition and a resin sheet that have excellent heat resistance and can improve peel strength after thermal curing can be obtained.

[0100] As described above, the resin sheet according to the present embodiment can be suitably used for power semiconductor elements. In other words, in the semiconductor device according to the present embodiment, the semiconductor element is preferably a power semiconductor element. The power semiconductor element is also expected to operate at high temperatures of 200° C. or higher. Therefore, heat resistance is required for materials used in semiconductor devices having power semiconductor elements. Since the resin sheet according to the present embodiment has excellent heat resistance, it is suitably used for covering the power semiconductor element in the semiconductor device, or for being interposed between the power semiconductor element and other components.

[0101] As described above, the resin sheet according to the present embodiment can be suitably used for semiconductor elements using at least one of silicon carbide and gallium nitride. In other words, in the semiconductor device according to the present embodiment, the semiconductor element is preferably a semiconductor element using at least one of silicon carbide and gallium nitride. Since a semiconductor element using at least one of silicon carbide and gallium nitride has characteristics different from those of a silicon semiconductor element, it is preferably used for applications such as power semiconductor elements, high-output devices for base stations, sensors, detectors, and Schottky barrier diodes. In these applications, attention is also paid to the heat resistance of a semiconductor element using at least one of silicon carbide and gallium nitride, and since the resin sheet according to the present embodiment has excellent heat resistance, it is suitably used in combination with a semiconductor element using at least one of silicon carbide and gallium nitride.

[0102] [Modifications of the embodiment] The present invention is not limited to the above-described embodiment, and any modifications or improvements that can achieve the object of the present invention are included in the present invention.

[0103] In the above embodiment, a laminate having a first release material, a second release material, and a resin sheet disposed between the first release material and the second release material has been described, but the laminate may also have a release material on only one side of the resin sheet.

[0104] In addition, although the semiconductor device embodiment has been described as being used for semiconductor encapsulation, the resin sheet of the present invention can also be used as an insulating material for circuit boards (e.g., a material for a rigid printed wiring board, a material for a flexible wiring board, and an interlayer insulating material for a build-up board, etc.), an adhesive film for build-up, and an adhesive, etc. EXAMPLES

[0105] The present invention will be described in more detail below with reference to examples, but the present invention is not limited to these examples in any way.

[0106] [Preparation of resin composition] The resin compositions of Examples 1 to 5 and Comparative Examples 1 and 2 were prepared by dissolving or dispersing each component in a solvent at the blending ratio (mass % (ratio converted into solid content)) shown in Tables 1 and 2. The materials used in the preparation of the resin composition are as follows:

[0107] (thermosetting component) Maleimide resin-1: Maleimide resin having a biphenyl group (maleimide resin represented by the general formula (3) above, "MIR-3000-70MT" manufactured by Nippon Kayaku Co., Ltd.) Maleimide resin-2: long-chain alkyl maleimide resin (maleimide resin represented by the general formula (7-2-1) above, "BMI-1700" manufactured by Designer Molecules Inc.) Maleimide resin-3: Long-chain alkyl maleimide resin ("SLK1500" manufactured by Shin-Etsu Chemical Co., Ltd.) Allyl resin: Diallyl bisphenol A (Daiwa Chemical Industry Co., Ltd. "DABPA") Curing catalyst (adhesion promoter): 2,4-diamino-6-[2-(2-ethyl-4-methyl-1-imidazolyl)ethyl]-1,3,5-triazine ("2E4MZ-A" manufactured by Shikoku Chemical Industries, Ltd.)

[0108] (Silane coupling agent) Silane coupling agent-1: a silane coupling agent represented by the structural formula (B1-1) ("X-12-989MS" manufactured by Shin-Etsu Chemical Co., Ltd.) Silane coupling agent-2: a silane coupling agent represented by the above structural formula (B1-2) ("X-12-1116" manufactured by Shin-Etsu Chemical Co., Ltd.) ·Silane coupling agent-3: 3-glycidoxypropyltriethoxysilane

[0109] (Binder component) Binder resin: BisA type phenoxy resin (Mitsubishi Chemical Corporation "YX7200B35")

[0110] (Inorganic filler) Silica filler: Fused silica (epoxy silane modified, average particle size 0.5 μm, maximum particle size 2.0 μm)

[0111] <Evaluation of Resin Composition and Resin Sheet> [Preparation of laminate including resin sheet] A resin varnish (a coating solution in which each component of the resin composition is dissolved or dispersed in a mixed solvent of cyclohexanone and methyl ethyl ketone, with a solid content concentration of 60% by mass) was applied to a first release material (a polyethylene terephthalate film provided with a release layer formed from an alkyd resin-based release agent, manufactured by Lintec Corporation, PET38AL-5, thickness 38 μm) using a knife coater, and dried at 90 ° C. for 1 minute, and then dried at 115 ° C. for 1 minute. The thickness of the resin composition after drying was 25 μm. Immediately after removing from the drying oven, the dried resin composition and a second release material (a polyethylene terephthalate film provided with a release layer formed from a silicone-based release agent, manufactured by Lintec Corporation, SP-PET382150, thickness 38 μm) were bonded together at room temperature to produce a laminate in which the first release material, a resin sheet made of the resin composition, and a second release material were laminated in this order.

[0112] [Peel strength measurement] One side of the resin sheet in the obtained laminate was bonded to a wafer piece (thickness 800 μm) obtained by cutting a 6-inch Si wafer into four equal parts in advance by vacuum pressure bonding at a lamination temperature of 130°C (laminating device: "V-130" manufactured by Nikko Materials Co., Ltd.; conditions: ultimate pressure 100 Pa, time 60 seconds), and then copper foil (size 50 mm x 10 mm, thickness 350 μm, JIS H 3100 specifications) was bonded to the other side of the resin sheet by vacuum pressure bonding under the same conditions as above. The second release material and the first release material of the resin sheet in the laminate were peeled off before being attached to the Si wafer and the copper plate, respectively. Thereafter, the resin composition was cured under thermal curing conditions at a temperature of 180°C for 2 hours to obtain a sample. For this sample, the copper foil was peeled off from the cured resin sheet at a peel speed of 50 mm / min and a peel angle of 90 degrees using a tensile tester (Shimadzu Corporation, Autograph AG-IS), and the peel strength (unit: N / 10 mm) between the copper foil and the cured resin sheet was measured. The measurements were carried out in an environment of 23°C and a relative humidity of 50%. The results obtained for Examples 1 to 3 and Comparative Example 1 are shown in Table 1. The results obtained for Examples 4 and 5 and Comparative Example 2 are shown in Table 2.

[0113] [Measurement of elastic modulus at 250℃] The obtained resin composition was applied onto a release material, and dried at 90°C for 1 minute and at 110°C for 1 minute to prepare a resin sheet with a thickness of 25 μm. Eight of these resin sheets were laminated to a thickness of 200 μm, and then peeled off from the release material to prepare a sample. The sample was cured under heat curing conditions at a temperature of 200°C for 4 hours to prepare a measurement sample. The measurement sample was measured for storage modulus E' (unit: MPa) at 250°C using TA Instruments' "DMA Q800" under conditions of a temperature rise rate of 3°C / min, a temperature range of 0 to 300°C, and a frequency of 11 Hz. The larger the storage modulus at 250°C, the better the heat resistance. Table 1 shows the results obtained for Examples 1 to 3 and Comparative Example 1. Table 2 shows the results obtained for Examples 4 and 5 and Comparative Example 2.

[0114] [Table 1]

[0115] It was found that the resin compositions according to Examples 1 to 3 were good in all evaluations of peel strength and elastic modulus at 250°C. In addition, Comparative Example 1 differs from Example 1 etc. in that a silane coupling agent other than the compound represented by general formula (B1) was used, but the peel strength result was found to be inferior to Example 1 etc. Therefore, it was confirmed that the resin compositions according to Examples 1 to 3 have excellent heat resistance and can improve the peel strength after heat curing.

[0116] [Table 2]

[0117] It was found that the resin compositions according to Examples 4 and 5 were good in all evaluations of peel strength and modulus of elasticity at 250°C. In addition, Comparative Example 2 differs from Example 4 etc. in that a silane coupling agent other than the compound represented by general formula (B1) was used, but the peel strength results were found to be inferior compared to Example 4 etc. Therefore, it was confirmed that the resin compositions according to Examples 4 and 5 have excellent heat resistance and can improve the peel strength after heat curing. [Explanation of symbols]

[0118] 1... laminate, 2... first release material, 3... resin sheet, 4... second release material.

Claims

1. A resin composition comprising (A) a thermosetting component and (B) a silane coupling agent, The (A) thermosetting component contains (A1) a maleimide resin, The silane coupling agent (B) is a compound represented by the following general formula (B1): Resin composition. (R ２１ O) ａ (R ２２ ) ３－ａ Si-L ２１ -NH-L ２２ -NH-R ２３ ・・・(B1) (In the general formula (B1), R ２１ is an alkyl group, R 22 is a monovalent organic group, R 23 is an alkyl group, an aryl group, or a pyridyl group, L 21 is an alkylene group, L 22 is -C(=O)- or -C(=S)-, and a is 1, 2, or 3.

2. The resin composition according to claim 1, The content of the silane coupling agent (B) is 0.01% by mass or more and 5% by mass or less based on the total amount of solids in the resin composition. Resin composition.

3. The resin composition according to claim 1 or 2, Further, the composition contains an adhesion imparting agent (E), The adhesion imparting agent (E) is a compound having a triazine skeleton. Resin composition.

4. Formed from the resin composition according to any one of claims 1 to 3. Resin sheet.

5. The resin sheet according to claim 4, When the resin sheet was bonded to a copper foil and cured at 180° C. for 2 hours, The peel strength after curing is 2.0 N / 10 mm or more. Resin sheet.

6. The resin sheet according to claim 4, When the resin sheet was bonded to a copper foil and cured at 180° C. for 2 hours, The peel strength after curing is 6.0 N / 10 mm or more. Resin sheet.

7. The resin sheet according to any one of claims 4 to 6, Used to seal a power semiconductor element or to be interposed between the power semiconductor element and other electronic components. Resin sheet.

8. The resin sheet according to any one of claims 4 to 6, It is used to seal a semiconductor element using one or more of silicon carbide and gallium nitride, or to be interposed between a semiconductor element using one or more of silicon carbide and gallium nitride and other electronic components. Resin sheet.

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