Method and set for manufacturing a lighting device

Abstract

A method for manufacturing a lighting device comprising (1) a white-colored layer formation step for causing a white-colored sheet to adhere to a first surface side of an insulating substrate having a first surface provided with wiring including a connecting portion capable of being electrically connected to a light-emitting element, to thereby obtain a first laminated body provided with the white-colored layer on the first surface of the insulating substrate, (2) a fluorescent layer formation step for causing a phosphor sheet including phosphor particles to adhere to the white-colored layer side of the first laminated body, to thereby obtain a second laminated body provided with a fluorescent layer on the white-colored layer side of the first laminated body, and (3) a connection step for electrically connecting the light-emitting element to the connecting portion from the fluorescent layer side of the second laminated body.

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing a lighting device and a set for manufacturing a lighting device.

[0002] Various developments are underway for lighting devices using LEDs (Light Emitting Devices). Not only the development of LEDs themselves, but also the development of mounting boards that include LEDs is also known.

[0003] For example, Example 2 of Patent Document 1 describes the following: (i) a glass binder paint containing 30 vol% phosphor was applied to the surface of a glass substrate to form a fluorescent layer with a thickness of 200 μm; (ii) a plurality of CSPs were bonded onto the glass substrate to obtain a mounting substrate for LED lighting; and (iii) when electricity was applied to the mounting substrate, the problems of glare and multiple shadows were reduced despite light being emitted from the plurality of CSPs. (CSP is an abbreviation for Chip Scale Package or Chip Size Package, and is a package-less design in which the LED chip is wrapped in phosphor resin, consisting of only the LED chip and phosphor resin.) [Prior art documents] [Patent documents]

[0004] [Patent Document 1] International Publication No. 2019 / 093339 Summary of the Invention [Problem to be solved by the invention]

[0005] In Example 2 of Patent Document 1, a fluorescent layer 200 μm thick is formed on a glass substrate using a "glass binder paint" containing a phosphor. However, a sintering process at high temperatures is usually required to fully harden the glass binder paint. Therefore, Example 2 of Patent Document 1 leaves room for improvement in terms of the ease with which the fluorescent layer can be applied. In addition, the housing / substrate to which the glass binder paint is applied is subject to constraints such as heat resistance and optimization of the expansion coefficient. Furthermore, forming a fluorescent layer using a "paint" poses challenges, such as a complicated process and the need to solve the problem of paint dripping.

[0006] The present invention has been made in view of the above circumstances, and one of the objects of the present invention is to provide a method that allows for manufacturing a lighting device without using paint. [Means for solving the problem]

[0007] As a result of extensive research, the present inventors have completed the invention provided below.

[0008] 1. a white layer forming step of adhering a white sheet to a first surface side of an insulating substrate provided with wiring including a connection portion capable of electrically connecting a light emitting element on the first surface, thereby obtaining a first laminate in which a white layer is provided on the first surface side of the insulating substrate; a fluorescent layer forming step of adhering a phosphor sheet containing phosphor particles to the white layer side of the first laminate to obtain a second laminate in which a fluorescent layer is provided on the white layer side of the first laminate; a connecting step of electrically connecting a light-emitting element to the connecting portion from the fluorescent layer side of the second laminate; A method for manufacturing a lighting device, comprising: 2. 1. A method for manufacturing the lighting device according to claim 1, the white sheet is made of a thermosetting resin material in a B-stage state, the thermosetting resin material including a white pigment and a curable resin component; The method for manufacturing a lighting device, wherein the white layer forming step includes a step of adhering the white sheet by heat pressing. 3. 1. A method for manufacturing the lighting device according to claim 1, The method for manufacturing a lighting device, wherein the white layer forming step includes a step of adhering the white sheet using an adhesive. 4. A method for manufacturing the lighting device according to any one of 1. to 3., the phosphor sheet is made of a thermosetting resin material in a B-stage state, the thermosetting resin material including phosphor particles and a curable resin component; The method for manufacturing a lighting device, wherein the phosphor layer forming step includes a step of adhering the phosphor sheet by heat pressing. 5. A method for manufacturing the lighting device according to any one of 1. to 3., The method for manufacturing a lighting device, wherein the phosphor layer forming step includes a step of adhering the phosphor sheet using an adhesive. 6. A method for manufacturing the lighting device according to any one of 1. to 5., a first through hole is provided in the white sheet, A method for manufacturing a lighting device, wherein in the white layer forming process, the white sheet is adhered so that the first through hole is positioned at the connection portion when the insulating substrate is viewed from above from the first surface side. 7. A method for manufacturing the lighting device according to any one of 1. to 6., a second through hole is provided in the phosphor sheet; A method for manufacturing a lighting device, wherein in the phosphor layer forming process, the phosphor sheet is adhered so that the second through hole is positioned at the connection portion when the insulating substrate is viewed from above from the first surface side. 8. A method for manufacturing the lighting device according to any one of 1. to 7., A method for manufacturing a lighting device, wherein the white layer has a thickness of 20 to 150 μm. 9. A method for manufacturing the lighting device according to any one of 1. to 8., A method for manufacturing a lighting device, wherein the fluorescent layer has a thickness of 20 to 150 μm. 10. A method for manufacturing the lighting device according to any one of 1. to 9., The method for manufacturing a lighting device, wherein the phosphor particles include phosphor particles capable of converting blue light into light with a wavelength longer than the wavelength of the blue light. 11. A method for manufacturing the lighting device according to any one of 1. to 10., The phosphor particles are CASN-based phosphors, SCASN-based phosphors, La3Si6N 11 a method for manufacturing a lighting device, the lighting device including one or more phosphors selected from the group consisting of a ZnO-based phosphor, an Sr2Si5N8-based phosphor, a Ba2Si5N8-based phosphor, an α-sialon-based phosphor, a β-sialon-based phosphor, a LuAG-based phosphor, and a YAG-based phosphor. 12. A method for manufacturing the lighting device according to any one of 1. to 11., The method for manufacturing a lighting device, wherein the light-emitting element in the connecting step is a light-emitting element capable of emitting blue light. 13. A set for manufacturing a lighting device, comprising: a phosphor sheet containing phosphor particles; and a white sheet. [Effects of the Invention]

[0009] According to the present invention, a lighting device can be manufactured without using paint. [Brief explanation of the drawings]

[0010] [Figure 1] 10A to 10C are diagrams (cross-sectional views) for explaining a manufacturing procedure for the lighting device. [Figure 2] 10A to 10C are diagrams (cross-sectional views) for explaining a manufacturing procedure for the lighting device. [Figure 3] 10A to 10C are diagrams (cross-sectional views) for explaining a manufacturing procedure for the lighting device. [Figure 4] 10A to 10C are diagrams (cross-sectional views) for explaining a manufacturing procedure for the lighting device. [Figure 5]1A to 1C are diagrams (cross-sectional views) for explaining a manufacturing procedure for the lighting device and the lighting device itself. [Figure 6] 1A and 1B are diagrams illustrating an LED chip with a reflector and an LED chip without a reflector. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In all the drawings, similar components are denoted by similar reference numerals and descriptions thereof will be omitted where appropriate. To avoid complexity, (i) when there are multiple identical components in the same drawing, only one of them is given a symbol, and not all of them, or (ii) particularly in Figure 2 and subsequent figures, components similar to those in Figure 1 are not given a symbol again. All drawings are for illustrative purposes only, and the shapes and dimensional ratios of the components in the drawings do not necessarily correspond to the actual products.

[0012] In this specification, unless otherwise specified, the expression "X to Y" in the description of a numerical range means at least X and at most Y. For example, "1 to 5% by mass" means "at least 1% by mass and at most 5% by mass."

[0013] In this specification, the term "(meth)acrylic" represents a concept that encompasses both acrylic and methacrylic. The same applies to similar terms such as "(meth)acrylate." Unless otherwise specified, the term "organic group" as used herein refers to an atomic group formed by removing one or more hydrogen atoms from an organic compound. For example, a "monovalent organic group" refers to an atomic group formed by removing one hydrogen atom from any organic compound.

[0014] <Manufacturing method of lighting device> The method for manufacturing the lighting device of this embodiment includes the steps of: a white layer forming step of adhering a white sheet to the first surface side of an insulating substrate provided with wiring including a connection portion capable of electrically connecting a light emitting element on the first surface, thereby obtaining a first laminate in which a white layer is provided on the first surface side of the insulating substrate; a fluorescent layer forming step of adhering a phosphor sheet containing phosphor particles to the white layer side of the first laminate to obtain a second laminate having a fluorescent layer provided on the white layer side of the first laminate; a connecting step of electrically connecting the light-emitting element to the connecting portion from the phosphor layer side of the second laminate; Includes:

[0015] In this embodiment, the fluorescent layer is formed by "adhering" a "phosphor sheet containing phosphor particles" rather than "applying" a "paint" as described in Patent Document 1. These innovations make it easier to apply the fluorescent layer than when paint is used. Also, compared to when paint is used, there are fewer restrictions on the heat resistance and expansion coefficient optimization of the housing / substrate on which the fluorescent layer is formed. Furthermore, compared to when paint is used to form the fluorescent layer, there are also the advantages of a simpler process and the fact that paint does not "sag" in principle.

[0016] The method for manufacturing the lighting device of this embodiment will be described in more detail below with reference to the drawings.

[0017] Figure 1 First, a substrate including at least an insulating substrate 20 as shown in FIG. 1 (cross-sectional view) is prepared. Preferably, wiring including connection portions 21 capable of electrically connecting the light-emitting elements is provided on the first surface of the insulating substrate 20. In Fig. 1, a first copper foil 22A is provided as the wiring. A part of the first copper foil 22A is removed by etching, and functions as a copper circuit (wiring). On the other surface (second surface) of the insulating substrate 20, a second copper foil 22B may be provided.

[0018] The material of the insulating substrate 20 is not particularly limited as long as it is known to be used for PWBs (printed wiring boards). For example, polyimide resin, silicone resin, (meth)acrylic resin, urea resin, epoxy resin, fluororesin, glass, metal (aluminum, copper, iron, stainless steel, etc.) can be used. From the viewpoint of heat resistance, polyimide resin, silicone resin, glass, or metal (such as a so-called "metal substrate" using aluminum or copper as the base metal and provided with an insulating layer) can be preferably used. It is also preferable to use a commercially available material known as a "bonding sheet" or the like. The thickness of insulating substrate 20 is not particularly limited as long as it is within a range that allows it to be used in lighting fixtures, for example, 50 μm or more and 1000 μm or less, specifically 50 μm or more and 500 μm or less.

[0019] As will be described later, the first copper foil 22A is electrically connected to the surface-mounted LED element 28 by solder 30. Electricity is supplied to the surface-mounted LED element 28 by the first copper foil 22A and the solder 30, causing the surface-mounted LED element 28 to emit light. By providing the first copper foil 22A on one side of the insulating substrate 20 and the second copper foil 22B on the other side, a balance of forces is achieved on both sides of the insulating substrate 20, and for example, the occurrence of warping can be suppressed.

[0020] Figure 2 A white sheet is adhered to the side of the first copper foil 22A, i.e., the first surface side, of the substrate shown in Fig. 1. This results in a first laminate in which a white layer 24 is provided on the first surface side of the insulating substrate 20 (white layer forming step).

[0021] Preferably, the white sheet is made of a thermosetting resin material in a B-stage state, including a white pigment and a curable resin component. In the white layer forming step, the white sheet in the B-stage state is preferably adhered to the first surface by, for example, heat pressing or vacuum lamination. The adhesion conditions are not particularly limited, and can be the same as those for adhering the phosphor sheet described below. As another example, the white layer 24 may be provided by adhering a white sheet (which does not have to be in a B-stage state) using an adhesive. More specific aspects of the white sheet will be described later.

[0022] The white sheet preferably has a first through-hole formed therein. In the white layer forming step, the white sheet is preferably adhered so that the first through-hole is located at the position of the connection portion 21 when the insulating substrate 20 is viewed from above from the first surface side. In this manner, an opening 23 is formed in the white layer 24. The presence of this opening 23 makes it easy to electrically connect the light-emitting element to the connection portion 21 in the connection step described below. In other words, it is not necessary to remove a part of the white layer 24 to expose the connection portion 21 when making the electrical connection.

[0023] Incidentally, in consideration of industrial mass production, it is preferable to take some measure when attaching the white sheet to the first surface side of insulating substrate 20 so that the positions of the first through holes in the white sheet and the positions of connecting portions 21 can easily coincide without misalignment. Examples of such "measures" include the following.

[0024] Positioning pins are provided on the first surface of the insulating substrate 20. The outline of the board when viewed from above and the outline of the white sheet when viewed from above must be the same. By doing this, if you align the edges of the board and the white sheet, no misalignment will occur. In the heat press, instead of pressing the substrate and white sheet together with a flat metal plate, the heat press is performed using a device with a "recess" that matches the shape of the substrate and / or white sheet, preventing the substrate and / or white sheet from shifting.

[0025] Alternatively, in the heat press, instead of pressing the substrate and white sheet together with a flat metal plate, it is possible to provide a protrusion of an appropriate height on the metal plate on the white sheet side of the press device at a position corresponding to the position of the connection portion 21 of the substrate, and to use a white sheet that does not have any through holes. The white sheet melts and flows during the heat pressing. Therefore, even if the white sheet does not have the first through holes, the presence of the protrusions on the metal plate is thought to cause the protrusions to "push away" the molten white sheet, resulting in the first laminate shown in Figure 2. However, depending on the pressing conditions, it may not be possible to completely push away the molten white sheet with the protrusions, and part of the white sheet may remain as a thin film. In this case, the thin film may be removed.

[0026] The thickness of the white layer 24 is usually 20 to 150 μm, preferably 30 to 120 μm, and more preferably 35 to 100 μm. In particular, when the white sheet has through holes, the thickness of the white layer 24 is preferably 20 to 100 μm, and the total thickness of the white layer 24 and the fluorescent layer 26 described below is more preferably 100 μm or less.

[0027] Figure 3 A phosphor sheet containing phosphor particles is adhered to the side of the first laminate on which the white layer 24 is provided, on which the white layer 24 is provided, thereby obtaining a second laminate in which the phosphor layer 26 is provided on the side of the white layer 24 of the first laminate (phosphor layer forming step).

[0028] The phosphor sheet is preferably made of a thermosetting resin material in a B-stage state, including phosphor particles and a curable resin component. In the phosphor layer forming step, the phosphor sheet in the B-stage state is preferably bonded by a method such as heat pressing or vacuum lamination. Alternatively, the phosphor layer 26 may be provided by adhering a phosphor sheet (which may not be in a B-stage) with an adhesive. More specific aspects of the phosphor sheet will be described later.

[0029] The phosphor sheet preferably has a second through-hole. In the phosphor layer forming step, the phosphor sheet is preferably bonded so that the second through-hole is located at the position of the connection portion 21 when the insulating substrate 20 is viewed from above from the first surface side. In this way, an opening 23 is provided in the phosphor layer 26. The presence of this opening 23 makes it easy to electrically connect the light-emitting element to the connection portion 21 in the connection step described below. In other words, it is not necessary to remove a part of the phosphor layer 26 to expose the connection portion 21 when making the electrical connection.

[0030] Incidentally, in consideration of industrial mass production, it is preferable to devise some means when attaching the phosphor sheet so that the positions of the second through-holes in the phosphor sheet can easily align without misalignment with the positions of the connection parts 21. Specific examples of "devise" here include the various means described in the description of FIG. 2 for easily aligning the positions of the first through-holes with the positions of the connection parts 21 without misalignment.

[0031] When using a phosphor sheet made of a thermosetting resin material in a B-stage state, the phosphor layer can be provided on the exposed surface of the white layer 24 by any method, such as vacuum lamination. The conditions for the vacuum lamination are not particularly limited, but the thermocompression temperature is preferably 60 to 160°C, more preferably 80 to 140°C. The thermocompression pressure is preferably 0.098 to 1.77 MPa, more preferably 0.29 to 1.47 MPa. The thermocompression time is preferably 20 to 400 seconds, more preferably 30 to 300 seconds. The lamination is preferably performed under reduced pressure conditions of 26.7 hPa or less.

[0032] After vacuum lamination, the phosphor sheet may be subjected to a smoothing treatment by applying a pressure to the phosphor sheet.

[0033] The phosphor sheet laminated on the exposed surface of the white layer 24, and optionally smoothed, is then heated. This cures the uncured components in the phosphor sheet, providing the phosphor layer 26. The heating conditions are not particularly limited, but the curing temperature can be, for example, 120 to 240°C, preferably 150 to 220°C, and more preferably 170 to 200°C, and the curing time can be, for example, 5 to 120 minutes, preferably 10 to 100 minutes, and more preferably 15 to 90 minutes.

[0034] The above-described method for forming the fluorescent layer 26 is merely an example. The fluorescent layer 26 may be formed by a method other than the above, for example, by referring to a known method for laminating and curing prepreg.

[0035] Figures 4 and 5 Solder 30 is placed in the openings (through holes) of the phosphor layer 26. Then, the surface-mount LED elements 28 are placed on the solder 30. The solder is then melted, for example, by a reflow method, to solder and electrically connect the surface-mount LED elements 28 and the first copper foil 22A. In this way, for example, the light-emitting elements can be electrically connected to the connection portions 21 from the phosphor layer 26 side of the second laminate (connection step). Here, the specific method and conditions for soldering are not particularly limited. Incidentally, the solder 30 may be applied to the first copper foil 22A in advance.

[0036] In this manner, the lighting device can be manufactured. Incidentally, as shown in FIG. 5, a lighting device may be provided with a plurality of light emitting elements (surface-mounted LED elements 28).

[0037] Surface-mounted LED element 28 In this embodiment, it is preferable that the light-emitting element (surface-mounted LED element 28) does not have a reflector. Specifically, some known surface-mounted LED elements (light-emitting elements) are equipped with a reflector, as shown in FIG. 6A, so that light does not leak sideways or downward. However, in this embodiment, it is preferable that the light-emitting element (surface-mounted LED element 28) does not have a reflector, as shown in FIG. 6B. By using a light-emitting element without a reflector, light from the LED chip leaks sideways and downwards. This leaked light then strikes the portion of the fluorescent layer 26 indicated by α, causing that portion to emit light. This further reduces the problems of glare and multiple shadows.

[0038] 6A, a semiconductor light emitting element 100 is disposed in a package 108 formed by a substrate 102 and a reflector (housing) 104, and a sealing member 110 (light-transmitting resin) is filled in the package 108. The substrate 102 may be provided with wiring 112. In Figure 6B, the same elements as in Figure 2A are assigned the same reference numerals. The light-emitting device in Figure 2B does not use a housing (reflector). After mounting the semiconductor light-emitting device 100 as shown in the figure, the sealing member 110 can be formed by molding using a desired mold. Alternatively, the sealing member 110 may be prepared in advance in a desired shape, and then adhered to the substrate 102 so as to cover the semiconductor light-emitting device 100.

[0039] ·supplement In the white layer forming process and the fluorescent layer forming process, spacers (shims) may be used to adjust the film thickness. That is, the white layer 24 and the fluorescent layer 26 may be formed by using spacers and then applying heat, pressure, or the like.

[0040] 3 and 4, depending on the material of the resin sheet and the process conditions, when the sheet in the B-stage state is heated, the softened resin component may "flow out" to the portion of the first copper foil 22A that is to be soldered to the surface-mount LED element 28. If this occurs, there is a possibility that the first copper foil 22A and the surface-mount LED element 28 will not be electrically connected. One way to prevent this is to change the material of the resin sheet or the process conditions. As another method, it is conceivable to temporarily "protect" the portion of the first copper foil 22A to which the surface mount type LED element 28 is to be soldered by using an appropriate member, such as a spring pin. As another method, if the solder 30 is applied to the first copper foil 22A in advance as described above, the softened resin component can, in principle, be prevented from "flowing out" to the portion of the first copper foil 22A that is to be soldered to the surface-mounted LED element 28.

[0041] The white layer forming step and the phosphor layer forming step may be performed separately or simultaneously. An example of a "simultaneous" step is to stack a white sheet and a phosphor sheet in this order on a substrate and heat press them together. One advantage of performing the processes simultaneously is ease of positioning, since the positioning of the two layers can be completed in a single step.

[0042] <Lighting equipment> By the above-described procedure, it is possible to manufacture a lighting device as shown in FIG. 5, which includes (i) an insulating substrate 20, (ii) a fluorescent layer 26 provided on one side of the insulating substrate 20, (iii) a white layer 24 provided between the insulating substrate 20 and the fluorescent layer 26, and (iv) a light-emitting element installed on the surface of the fluorescent layer 26 opposite the insulating substrate 20.

[0043] <Phosphor sheet> As described above, the phosphor sheet that can be used in the phosphor layer forming step preferably contains phosphor particles and a curable resin component, and is made of a thermosetting resin material in a B-stage state. The thickness of the phosphor sheet is usually 20 to 150 μm, preferably 30 to 120 μm, and more preferably 35 to 100 μm.

[0044] Since the phosphor sheet is in a B-stage state (in other words, semi-cured state), it has substantially no fluidity at temperatures around room temperature, and can maintain its shape as a "sheet." Since the phosphor sheet is in the B-stage state, it can be placed on a substrate as a sheet and then heated (preferably while applying pressure) to adhere sufficiently strongly to the substrate, forming a phosphor layer 26. Since no liquid coating is required, the phosphor layer can be formed by a simpler process than conventional methods. In this specification, the B-stage state includes the state before the C-stage state, i.e., before complete curing. When the thickness of the phosphor sheet is 20 μm or more, the phosphor sheet contains a sufficient amount of phosphor particles, and the light conversion efficiency of the phosphor sheet can be sufficiently increased. Furthermore, when the thickness of the phosphor sheet is 150 μm or less, the time required for thermal curing can be shortened. A phosphor sheet that is not too thick is also preferable in that it facilitates electrical connection (such as soldering) between the light-emitting element and copper wiring in the manufacturing of the lighting device described below.

[0045] The phosphor sheet will be described in more detail below.

[0046] (phosphor particles) The phosphor particles contained in the phosphor sheet may be any particles that emit fluorescence in response to light emitted from the light-emitting element. Specifically, the phosphor particles may be any particles that can convert blue light into light with a wavelength longer than that of the blue light. Depending on the desired color tone and color temperature, only one type of specific phosphor particle may be used, or two or more types of phosphor particles may be used in combination.

[0047] The phosphor particles include CASN phosphor, SCASN phosphor, La3Si6N 11 The phosphors may be one or more selected from the group consisting of Sr2Si5N8-based phosphors, Ba2Si5N8-based phosphors, α-sialon-based phosphors, β-sialon-based phosphors, LuAG-based phosphors, and YAG-based phosphors. These phosphors usually contain activating elements such as Eu and Ce.

[0048] The CASN phosphor (a type of nitride phosphor) preferably contains Eu. The CASN phosphor is, for example, represented by the formula CaAlSiN3:Eu 2+ It is expressed as Eu 2+ This refers to a red phosphor that uses as an activator an alkaline earth silicon nitride crystal as a matrix. In the definition of Eu-containing CASN-based phosphors in this specification, Eu-containing SCASN-based phosphors are excluded.

[0049] The SCASN phosphor (a type of nitride phosphor) preferably contains Eu. The SCASN phosphor is, for example, represented by the formula (Sr,Ca)AlSiN3:Eu 2+ It is expressed as Eu 2+ This refers to a red phosphor that uses as an activator a crystal of alkaline earth silicon nitride as a base material.

[0050] La3Si6N 11 The phosphor is specifically La3Si6N 11 :Ce phosphors, etc., which usually convert the blue light from a blue LED into yellow light.

[0051] Specifically, the Sr2Si5N8 phosphor is Sr2Si5N8:Eu 2+ Phosphors and Sr2Si5N8:Ce 3+ These usually convert the wavelength of blue light from a blue LED into yellow to red light.

[0052] A Ba2Si5N8-based phosphor is specifically Ba2Si5N8:Eu, which normally converts the wavelength of blue light from a blue LED into orange to red light.

[0053] The α-sialon-based phosphor preferably contains Eu. The α-sialon containing Eu is, for example, represented by the general formula: M x Eu y Si 12-(m+n) Al (m+n) O n N 16-n In the general formula, M is at least one element containing at least Ca selected from the group consisting of Li, Mg, Ca, Y and lanthanide elements (excluding La and Ce). When the valence of M is a, ax + 2y = m, where 0 < x ≤ 1.5, 0.3 ≤ m < 4.5, and 0 < n < 2.25.

[0054] The β-sialon-based phosphor preferably contains Eu. The β-sialon containing Eu is, for example, represented by the general formula Si 6-z Al z O z N 8-z :Eu 2+ (0 < Z ≤ 4.2), and is a phosphor composed of β-sialon in which Eu 2+ is dissolved. In the general formula, the Z value and the europium content are not particularly limited. The Z value is, for example, more than 0 and 4.2 or less, and from the viewpoint of further improving the emission intensity of the β-sialon, it is preferably 0.005 or more and 1.0 or less. Also, the europium content is preferably 0.1 mass% or more and 2.0 mass% or less.

[0055] The LuAG-based phosphor usually means a lutetium aluminum garnet crystal. Considering its application to lighting devices, LuAG is preferably a LuAG:Ce phosphor. More specifically, LuAG can be represented by the composition formula of Lu3Al5O 12 :Ce, but the composition of LuAG does not necessarily have to follow stoichiometry.

[0056] The YAG-based phosphor usually means a yttrium aluminum garnet crystal. Considering its application to lighting devices, the YAG-based phosphor is preferably activated with Ce. More specifically, the YAG-based phosphor is Y3Al5O 12However, the composition of the YAG phosphor does not necessarily have to be stoichiometric.

[0057] Commercially available phosphor particles may be used. Examples of commercially available phosphor particles include Alonbright (registered trademark) from Denka Co., Ltd. Other commercially available products include those from Mitsubishi Chemical Corporation.

[0058] Median diameter of phosphor particles D 50 is preferably 1 μm or more and 20 μm or less, more preferably 5 μm or more and 15 μm or less. 50 By appropriately adjusting the thickness, it becomes easier to form a thin and uniform phosphor sheet.

[0059] It is preferable that the particle size distribution curve of the phosphor particles has two or more maxima. Specifically, it is preferable that maxima are observed in both the particle size range of 1 μm to 6 μm and the particle size range of 10 μm to 25 μm. The presence of two or more maxima means that the phosphor particles contain both large and small particles. Because the small particles penetrate into the "gaps" between the large particles, it is easier to increase the phosphor particle content compared to using only large particles. Furthermore, even if the phosphor particle content is increased, various physical properties are easily maintained. Furthermore, when formed into a coating film, it becomes more difficult for light emitted from the light-emitting element to penetrate.

[0060] Median diameter of phosphor particles D 50 The particle size distribution curve can be adjusted by devising a method for preparing phosphor particles, by appropriately grinding the phosphor particles, or by appropriately mixing two or more phosphor particles with different particle sizes.

[0061] The particle size distribution curve of the phosphor particles can be measured by dispersing the raw material phosphor particles in a dispersion medium using an ultrasonic homogenizer and then measuring it with a laser diffraction / scattering particle size distribution analyzer. From the particle size distribution curve obtained, the median diameter D 50 For details of the dispersion process and the measurement device, see the examples described below. Just to be clear, in this specification, the median diameter D 50 and particle size distribution curves are measured on a volume basis.

[0062] The phosphor sheet may contain only one type of phosphor particles, or may contain two or more types of phosphor particles. The content of phosphor particles in the phosphor sheet is 25 vol% or more and 60 vol% or less, preferably 30 vol% or more and 60 vol% or less, more preferably 35 vol% or more and 60 vol% or less, and even more preferably 40 vol% or more and 50 vol% or less.

[0063] By setting the content of phosphor particles to 25 vol % or more, it becomes easier to sufficiently convert the light emitted from the light emitting element into fluorescence. Another advantage of having a phosphor particle content of 25 vol% or more is that cracks are less likely to occur in the phosphor layer 26. Based on general knowledge, one of the causes of cracks is thought to be the difference in thermal expansion coefficient between the phosphor layer 26 and the substrate on which the phosphor layer 26 is provided. By having a phosphor particle content of 25 vol% or more, the curable resin component is relatively reduced. This also reduces the difference in thermal expansion coefficient between the phosphor layer 26 and the substrate on which the phosphor layer 26 is provided. As a result, it is thought that cracks are less likely to occur in the phosphor layer 26.

[0064] The content of phosphor particles in the phosphor sheet is preferably 30 vol% or more, more preferably 35 vol% or more. By doing so, even if the phosphor layer 26 is thin, the light emitted from the light-emitting elements can be sufficiently converted into fluorescence, and the color temperature of the light emitted from the light-emitting elements can be significantly changed.

[0065] On the other hand, the content of phosphor particles in the phosphor sheet is preferably 60 vol % or less. If the content of phosphor particles is not too high, the phosphor particles are less likely to fall off from the formed phosphor layer.

[0066] (curable resin component) The phosphor sheet may contain a curable resin component. In this specification, the term "curable resin component" refers not only to (1) a resin (polymer) component that has the property of being cured by the action of heat, light, etc., but also to (2) a component that is a monomer or oligomer before the formation of a coating film, but that can be polymerized by the action of heat, light, etc. to form a resin (polymer) after the formation of a coating film. In relation to the above, in this specification, in addition to polymers, monomers or oligomers, polymerization initiators and curing agents are also considered to be part of the "curable resin component".

[0067] When the curable resin component comprises a resin, a monomer, or an oligomer, it is typically organic, i.e., the curable resin component typically comprises an organic resin, an organic monomer, or an organic oligomer.

[0068] The curable resin component preferably contains a thermosetting resin component, which allows for the production of a highly durable lighting device. Of course, depending on the purpose and application, the curable resin component may also contain a thermoplastic resin.

[0069] The curable resin component preferably contains one or more of silicone resin, epoxy resin, and the like.

[0070] The silicone resin preferably contains a silicone resin having phenyl and / or methyl groups. Such silicone resins are preferred in terms of compatibility with other components, solvent solubility, coatability, heat resistance, durability, etc. The ratio of phenyl groups to methyl groups in this resin is, for example, about 0.3:1 to 1.5:1.

[0071] The hardenable resin component may contain reactive groups, which allow the hardenable resin component to harden by itself. For example, the curable resin component preferably contains a silicone resin containing silanol groups (-Si-OH). This allows a condensation reaction of the silanol groups to occur during coating film formation, resulting in a cured coating film. The silanol content (OH mass%) of the silicone resin containing silanol groups (-Si-OH) is, for example, 0.1 mass% to 5 mass%. As another example, the curable resin component may be one that cures through a hydrosilylation reaction between a vinyl group-containing polymer and a Si—H group-containing silicone polymer (addition reaction type).

[0072] The epoxy resin may be any resin having an epoxy group in the molecule, and examples thereof include bisphenol A epoxy resins, bisphenol F epoxy resins, bisphenol S epoxy resins, alicyclic epoxy resins, linear aliphatic epoxy resins, phenol novolac epoxy resins, cresol novolac epoxy resins, bisphenol A novolac epoxy resins, diglycidyl ethers of biphenols, diglycidyl ethers of naphthalenediol, diglycidyl ethers of phenols, diglycidyl ethers of alcohols, and alkyl-substituted, halide, and hydrogenated versions of these.

[0073] When an epoxy resin is used, it is preferable to use a curing agent capable of curing the epoxy resin, such as polyfunctional phenols, amines, imidazole compounds, acid anhydrides, organic phosphorus compounds, and halides thereof. Examples of polyfunctional phenols include monocyclic bifunctional phenols such as hydroquinone, resorcinol, and catechol, polycyclic bifunctional phenols such as bisphenol A, bisphenol F, naphthalenediols, and biphenols, as well as their halides and alkyl group-substituted derivatives. Furthermore, there are novolaks and resols, which are polycondensates of these phenols with aldehydes. Examples of amines include aliphatic or aromatic primary amines, secondary amines, tertiary amines, quaternary ammonium salts, aliphatic cyclic amines, guanidines, urea derivatives, etc. Examples of these compounds include N,N-benzyldimethylamine, 2-(dimethylaminomethyl)phenol, 2,4,6-tris(dimethylaminomethyl)phenol, tetramethylguanidine, triethanolamine, N,N'-dimethylpiperazine, 1,4-diazabicyclo[2,2,2]octane, 1,8-diazabicyclo[5,4,0]-7-undecene, 1,5-diazabicyclo[4,4,0]-5-nonene, hexamethylenetetramine, pyridine, picoline, piperidine, pyrrolidine, dimethylcyclohexylamine, Examples include dimethylhexylamine, cyclohexylamine, diisobutylamine, di-n-butylamine, diphenylamine, N-methylaniline, tri-n-propylamine, tri-n-octylamine, tri-n-butylamine, triphenylamine, tetramethylammonium chloride, tetramethylammonium bromide, tetramethylammonium iodide, triethylenetetramine, diaminodiphenylmethane, diaminodiphenyl ether, dicyandiamide, tolylbiguanide, guanylurea, and dimethylurea. Examples of imidazole compounds include imidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, 2-methylimidazole, 2-phenylimidazole, 2-undecylimidazole, 1-benzyl-2-methylimidazole, 2-heptadecylimidazole, 4,5-diphenylimidazole, 2-methylimidazoline, 2-phenylimidazoline, 2-undecylimidazol- ine, 2-heptadecylimidazol- ine, 2-isopropylimidazole, 2,4-dimethylimidazole, 2-phenyl-4-methylimidazole, 2-ethylimidazoline, 2-phenyl-4-methylimidazoline, benzimidazole, and 1-cyanoethylimidazole. Examples of acid anhydrides include phthalic anhydride, hexahydrophthalic anhydride, pyromellitic dianhydride, and benzophenonetetracarboxylic dianhydride. The organic phosphorus compound can be any phosphorus compound having an organic group, without any particular limitation, such as hexamethylphosphoric triamide, tri(dichloropropyl)phosphate, tri(chloropropyl)phosphate, triphenylphosphite, trimethylphosphate, phenylphosphonic acid, triphenylphosphine, tri-n-butylphosphine, and diphenylphosphine.

[0074] The epoxy resin curing agent can be used alone or in combination. The amount of the epoxy resin curing agent used is not particularly limited as long as it can appropriately proceed with the curing reaction of the epoxy group. It is preferably used in the range of 0.01 to 5.0 equivalents, particularly preferably 0.8 to 1.2 equivalents, per mole of epoxy group.

[0075] The phosphor sheet may contain a curing accelerator as needed. Typical curing accelerators include, but are not limited to, tertiary amines, imidazoles, and quaternary ammonium salts.

[0076] (Other ingredients) The phosphor sheet may contain fibers from the viewpoint of ease of handling, shape retention, etc. In other words, the phosphor sheet may be in a B-stage state in which the above-mentioned curable resin component or the like is impregnated into a fiber base material. The fiber substrate is not particularly limited, and may be, for example, a commonly used substrate for prepregs, such as glass cloth, aramid nonwoven fabric, or liquid crystal polymer nonwoven fabric.

[0077] A specific example of glass cloth is Asahi Schwebel's "Style 1027MS" (warp density 75 / 25 mm, weft density 75 / 25 mm, cloth weight 20 g / m 2 , thickness 19μm), Asahi Schwebel "Style 1037MS" (warp density 70 / 25mm, weft density 73 / 25mm, fabric weight 24g / m 2 , thickness 28μm), "1078" manufactured by Arisawa Seisakusho (warp density 54 / 25mm, weft density 54 / 25mm, fabric weight 48g / m2 , thickness 43 μm), "1037NS" manufactured by Arisawa Seisakusho Co., Ltd. (warp density 72 / 25 mm, weft density 69 / 25 mm, fabric weight 23 g / m 2 , thickness 21 μm), "1027NS" manufactured by Arisawa Seisakusho Co., Ltd. (warp density 75 / 25 mm, weft density 75 / 25 mm, fabric weight 19.5 g / m 2 , thickness 16μm), "1015NS" manufactured by Arisawa Seisakusho Co., Ltd. (warp density 95 / 25mm, weft density 95 / 25mm, fabric weight 17.5g / m 2 , thickness 15μm), "1000NS" manufactured by Arisawa Seisakusho Co., Ltd. (warp density 85 / 25mm, weft density 85 / 25mm, fabric weight 11g / m 2 , thickness 10 μm). A specific example of a liquid crystal polymer nonwoven fabric is "VECLUS" (basis weight 6 to 15 g / m), which is an aromatic polyester nonwoven fabric made by the melt-blown method, manufactured by Kuraray Co., Ltd. 2 ) and "Vectran".

[0078] The phosphor sheet may also contain a flowability adjuster from the viewpoint of manufacturability. Examples of flow control agents include silica particles such as hydrophobic silica and hydrophilic silica, and aluminum oxide. Fumed silica is particularly preferred. Examples of commercially available flow control agents include AEROSIL 130, AEROSIL 200, AEROSIL 300, AEROSIL R-972, AEROSIL R-812, AEROSIL R-812S, Aluminum Oxide C (manufactured by Nippon Aerosil Co., Ltd., AEROSIL is a registered trademark), and Carplex FPS-1 (manufactured by DSL, product name).

[0079] (Through hole) As mentioned above, the phosphor sheet preferably has through holes, the position, size, shape, number, etc. of which may be determined appropriately depending on the design of the lighting device to be ultimately obtained. The through holes can be formed by punching, for example, although the through holes may of course be formed by other methods.

[0080] (Method of manufacturing phosphor sheet) The phosphor sheet can be produced based on known knowledge regarding curable resin compositions. As an example, phosphor sheets can be manufactured by following the manufacturing method of "prepreg" used in the manufacture of electrical and electronic components. Specifically, phosphor sheets can be manufactured by the following process: (1) first, dissolve or disperse the components other than the fiber substrate in an organic solvent to produce a varnish, (2) impregnate the fiber substrate with the varnish, and (3) heat the varnish at a temperature and for a time period that does not completely cure it (putting it into a B-stage state). Of course, other methods (such as a hot-melt method that does not use a solvent) may also be used. The method for manufacturing prepreg is described in various known documents, which can be used as reference when manufacturing phosphor sheets. The method for manufacturing prepreg is described in, for example, JP 2020-139164 A and JP 2004-188652 A.

[0081] (Other Phosphor Sheet Forms) As described above, in this embodiment, a phosphor sheet is preferably used that contains phosphor particles and a curable resin component and is made of a thermosetting resin material in a B-stage state.

[0082] On the other hand, a phosphor sheet other than "a phosphor sheet made of a thermosetting resin material in a B-stage state that contains phosphor particles and a curable resin component" can also be used as long as it can provide the phosphor layer 26. Hereinafter, such a phosphor sheet may be referred to as "other phosphor sheets."

[0083] Another example of the phosphor sheet is a phosphor sheet in a state in which the above-mentioned B-stage phosphor sheet is completely cured (C-stage state). Another example of a phosphor sheet is a sheet made by dispersing phosphor particles in any resin, such as a thermoplastic resin. The thermoplastic resin can be selected appropriately depending on the desired performance. Specific examples of thermoplastic resins include polyolefins such as PE (polyethylene) and PP (polypropylene), polyester resins such as PVC (polyvinyl chloride), PS (polystyrene), ABS (acrylonitrile-butadiene-styrene copolymer), AS (acrylonitrile-styrene copolymer), PMMA (polymethyl methacrylate), PBT (polybutylene terephthalate), and PET (polyethylene terephthalate). These and other phosphor sheets can be adhered to the exposed surface of the white layer 24 using an adhesive to form the phosphor layer 26. The adhesive that can be used can be appropriately selected taking into consideration adhesive strength, durability, and the like.

[0084] The types and amounts of phosphor particles that can be contained in other phosphor sheets can be the same as those of the B-stage phosphor sheet described above. The other thicknesses of the phosphor sheet can be the same as those of the phosphor sheet in the B-stage state described above. The other phosphor sheets preferably have through holes, similar to the phosphor sheet in the B-stage state described above.

[0085] <White sheet> 2 and the like can be provided by using a "white sheet" that contains white particles (typically white pigments such as titanium oxide or alumina) instead of the phosphor particles in the above-mentioned <phosphor sheet>. The amount of the white particles is not particularly limited, but can be, for example, the same as the amount of phosphor particles in the phosphor sheet.

[0086] The thickness of the white sheet is usually 20 to 150 μm, preferably 30 to 120 μm, and more preferably 35 to 100 μm. In particular, when the white sheet has through holes, the thickness of the white sheet is preferably 20 to 100 μm. Furthermore, it is preferable to adjust the thickness of the white sheet and the thickness of the phosphor sheet so that the total thickness of the final white layer 24 and the phosphor layer 26 (described later) is 100 μm or less.

[0087] Like the phosphor sheet, the white sheet preferably contains a curable resin component and is made of a thermosetting resin material in a B-stage state.

[0088] On the other hand, similarly to the phosphor sheet, examples of the white sheet include a white sheet in a B-stage state that has been completely cured (to a C-stage state), and a white sheet formed by dispersing white particles in any resin (e.g., a thermoplastic resin). The thermoplastic resin used may be selected appropriately depending on the desired performance. Specific examples of thermoplastic resins include those listed in the <Phosphor Sheet> section. These white sheets can be bonded to a substrate using an adhesive to form the white layer 24. The adhesive that can be used can be selected appropriately taking into account factors such as adhesive strength and durability.

[0089] <Lighting device manufacturing set> The above-mentioned phosphor sheet and white sheet are both preferably used in the manufacture of lighting devices. Therefore, a "set" of the above-mentioned phosphor sheet (containing phosphor particles) and white sheet (typically containing white particles) is industrially useful as a set for manufacturing lighting devices. Specifically, a person who intends to manufacture a lighting device can obtain such a set for manufacturing a lighting device and manufacture the lighting device by using this set to perform each of the above-mentioned steps.

[0090] Although the embodiments of the present invention have been described above, these are merely examples of the present invention, and various other configurations may be adopted. Furthermore, the present invention is not limited to the above-described embodiments, and modifications and improvements within the scope of achieving the object of the present invention are included in the present invention. [Example]

[0091] The embodiments of the present invention will be described in detail based on Examples and Comparative Examples. However, it should be noted that the present invention is not limited to the Examples.

[0092] <Preparation of phosphor particles> CASN-1: CASN phosphor manufactured by Denka, product number RE-650YMDB, D 50 =15.7μm CASN-2: CASN phosphor manufactured by Denka, product number RE-Sample 650SD4, D 50 =3.2μm

[0093] <Production of phosphor sheets using silicone resin> In addition to the above phosphor particles, the following materials were prepared. Curable resin component: Toray Dow Corning silicone resin "RSN-0805" (silanol group-containing, silanol content (OH mass) 1%, silicon dioxide content 48% by mass, phenyl:methyl ratio = 1.1:1, weight average molecular weight 200-300 x 10 3 , xylene included, resin solids 50% by weight Flow modifier: AEROSIL 200 fumed silica from Nippon Aerosil Co., Ltd. Solvent: Butyl carbitol

[0094] Among the components listed in Table 1, first, the curable resin component (silicone resin) and a solvent were mixed to obtain a uniform solution. Thereafter, phosphor particles and a flowability modifier (only in Example 3) were added to the solution, and mixed and dispersed uniformly to obtain silicone resin varnishes 1-1 to 1-4.

[0095] [Table 1]

[0096] The silicone resin varnish was impregnated into a commercially available fiber substrate (glass cloth) and dried in a vertical drying oven. After cooling, through-holes for connecting the light-emitting element to the copper wiring were formed by punching. In this way, silicone resin-based phosphor sheets 1-1 to 1-4 were produced. The drying conditions (temperature and time) were adjusted so that the silicone resin-based phosphor sheet would reach a B-stage state. Also, taking into account the thickness (50 μm) of the phosphor layer described below, a fiber substrate (glass cloth) with an appropriate thickness was selected.

[0097] <Manufacturing phosphor sheets using epoxy resin> First, epoxy resin varnishes 2-1 to 2-4 having the following compositions were prepared. Bisphenol A epoxy resin 640 parts by mass Bisphenol A novolac resin 25 parts by mass Ethylmethylimidazole 0.2 parts by weight Phosphor particles: Amount shown in the table below Methyl ethyl ketone solvent: Resin varnish viscosity is approximately 0.1 Ns / m 2 The quantity that becomes

[0098] [Table 2]

[0099] The epoxy resin varnish was impregnated into a commercially available fiber substrate (glass cloth) and dried in a vertical drying oven at 135°C for 5 minutes. After cooling, through-holes for connecting the light-emitting element to the copper wiring were punched out. In this way, B-stage epoxy resin phosphor sheets 2-1 to 2-4 were produced. Incidentally, taking into consideration the thickness (50 μm) of the fluorescent layer described below, a fiber substrate (glass cloth) with an appropriate thickness was selected.

[0100] <Production of white sheets> A silicone resin-based white sheet was manufactured in the same manner as described above in <Manufacturing of phosphor sheet using silicone resin>, except that titanium oxide / alumina mixed particles were used instead of phosphor particles so that the amount in the non-volatile components was 50 vol% and the thickness of the glass cloth was changed appropriately. In addition, an epoxy resin-based white sheet was manufactured in the same manner as described above in <Manufacturing of phosphor sheet using epoxy resin>, except that titanium oxide / alumina mixed particles were used instead of phosphor particles so that the amount in the non-volatile components was 50 vol% and the thickness of the glass cloth was changed appropriately.

[0101] <Production of lighting device (silicone-based)> Using the above phosphor sheet, we fabricated a lighting device in which multiple CSPs were aligned at regular intervals on the phosphor layer. The manufacturing procedure is briefly described below. (1) As the insulating substrate material, we prepared a bonding sheet CS-3305A manufactured by Risho Kogyo Co., Ltd., with copper foil attached on both sides. We etched the copper foil to form a copper circuit on the first copper foil. (2) Place the above silicone resin white sheet on the first copper foil and apply pressure of 20 kgf / cm 2 The mixture was pressed at a pressure of 1000 kJ / cm at a temperature of 190° C. for 90 minutes, thereby forming a white layer having a thickness of 35 μm. (3) Place the above silicone resin phosphor sheet (any of 1-1 to 1-4) on the white layer and apply pressure of 20 kgf / cm 2 The laminate was pressed at a pressure of 1000 kJ / cm at a temperature of 190° C. for 90 minutes, thereby forming a fluorescent layer with a thickness of 50 μm. (4) A commercially available CSP (WICOP SZ8-Y15-WW-C8, manufactured by Seoul Semiconductor, reflector-less, color temperature 2200-2300K), which is a surface-mount LED element, was electrically connected to the first copper foil (copper circuit) by soldering.

[0102] Supplementally, in the above (2) and (3), the positions of the through holes in each sheet were set to be the positions where the CSP and the first copper foil were connected in (4).

[0103] <Production of lighting device (epoxy type)> Using the above phosphor sheet, we fabricated a lighting device in which multiple CSPs were aligned at regular intervals on the phosphor layer. The manufacturing procedure is briefly described below. (1) As the insulating substrate material, we prepared a bonding sheet CS-3305A manufactured by Risho Kogyo Co., Ltd., with copper foil attached on both sides. We etched the copper foil to form a copper circuit on the first copper foil. (2) Place the above white epoxy resin sheet on the first copper foil and apply pressure of 20 kgf / cm 2 The mixture was pressed at a pressure of 1000 kJ / cm at a temperature of 190° C. for 90 minutes, thereby forming a white layer having a thickness of 35 μm. (3) Place the above-mentioned epoxy resin phosphor sheet (any of 2-1 to 2-4) on the white layer and apply 20 kgf / cm 2 The laminate was pressed at a pressure of 1000 kJ / cm at a temperature of 190° C. for 90 minutes, thereby forming a fluorescent layer with a thickness of 50 μm. (4) A commercially available CSP (WICOP SZ8-Y15-WW-C8, manufactured by Seoul Semiconductor, reflector-less, color temperature 2200-2300K), which is a surface-mount LED element, was electrically connected to the first copper foil (copper circuit) by soldering.

[0104] Supplementally, in the above (2) and (3), the positions of the through holes in each sheet were set to be the positions where the CSP and the first copper foil were connected in (4).

[0105] <Evaluation: Color temperature conversion> An electric current was passed through each of the lighting devices fabricated above, causing the lighting device to emit light. The color temperature of the light emitted from the lighting device was measured using a total luminous flux measurement system (equipped with an integrating sphere) manufactured by Otsuka Electronics Co., Ltd. The color temperature conversion ability was evaluated as "good" when the measured color temperature was 2000 to 2100 K, and the color temperature was converted by at least 100 K from the color temperature of the CSP itself (2200 to 2300 K).

[0106] As a result, the color temperature conversion performance of all the lighting devices created was "good."

[0107] As described above, by using a white sheet and a phosphor sheet, it was possible to manufacture a lighting device without using paint.

[0108] This application claims priority based on Japanese Patent Application No. 2022-049915, filed on March 25, 2022, the disclosure of which is incorporated herein in its entirety. [Explanation of symbols]

[0109] 20 Insulating substrate 21 Connection 22A Copper foil 22B Cupric foil 23 Aperture 24 White layer 26 Fluorescent Layer 28 Surface-mounted LED elements 30 solder 100 Semiconductor light emitting element 102 Circuit Board 104 Reflector (housing) 108 Package 110 Sealing member 112 Wiring

Claims

1. a white layer forming step of obtaining a first laminate in which a white layer is provided on the first surface side of an insulating substrate, the first surface side of the insulating substrate being provided with wiring including a connection portion capable of electrically connecting a light emitting element, by adhering a white sheet to the first surface side of the insulating substrate; a fluorescent layer forming step of adhering a phosphor sheet containing phosphor particles to a side of the white layer in the first laminate to obtain a second laminate in which a fluorescent layer is provided on the side of the white layer of the first laminate; a connecting step of electrically connecting a light emitting element to the connecting portion from the phosphor layer side of the second laminate; A method for manufacturing a lighting device, comprising:

2. A method for manufacturing the lighting device according to claim 1, comprising the steps of: the white sheet is made of a thermosetting resin material in a B-stage state, the thermosetting resin material including a white pigment and a curable resin component; The method for manufacturing an illumination device, wherein the white layer forming step includes a step of adhering the white sheet by heat pressing.

3. A method for manufacturing the lighting device according to claim 1, comprising the steps of: The method for manufacturing an illumination device, wherein the white layer forming step includes a step of adhering the white sheet using an adhesive.

4. A method for manufacturing the lighting device according to any one of claims 1 to 3, comprising the steps of: the phosphor sheet is made of a thermosetting resin material in a B-stage state, the thermosetting resin material including phosphor particles and a curable resin component; The method for manufacturing an illumination device, wherein the phosphor layer forming step includes a step of adhering the phosphor sheet by heat pressing.

5. A method for manufacturing the lighting device according to any one of claims 1 to 3, comprising the steps of: The method for manufacturing an illumination device, wherein the phosphor layer forming step includes a step of adhering the phosphor sheet with an adhesive.

6. A method for manufacturing the lighting device according to any one of claims 1 to 3, comprising the steps of: The white sheet is provided with a first through hole, A method for manufacturing a lighting device, wherein in the white layer forming step, the white sheet is adhered such that the first through hole is located at the position of the connection portion when the insulating substrate is viewed from above from the first surface side.

7. A method for manufacturing the lighting device according to any one of claims 1 to 3, comprising the steps of: The phosphor sheet is provided with a second through hole, A method for manufacturing a lighting device, wherein in the phosphor layer forming process, the phosphor sheet is adhered so that the second through hole is located at the position of the connection portion when the insulating substrate is viewed from above from the first surface side.

8. A method for manufacturing the lighting device according to any one of claims 1 to 3, comprising the steps of: The method for manufacturing an illumination device, wherein the white layer has a thickness of 20 to 150 μm.

9. A method for manufacturing the lighting device according to any one of claims 1 to 3, comprising the steps of: The method for manufacturing an illumination device, wherein the fluorescent layer has a thickness of 20 to 150 μm.

10. A method for manufacturing the lighting device according to any one of claims 1 to 3, comprising the steps of: The method for manufacturing an illumination device, wherein the phosphor particles include phosphor particles capable of converting blue light into light with a longer wavelength than the wavelength of the blue light.

11. A method for manufacturing the lighting device according to any one of claims 1 to 3, comprising the steps of: The phosphor particles are a CASN phosphor, a SCASN phosphor, or a La ３ S ６ N １１ Sr based phosphor ２ S ５ N ８ Ba-based phosphor ２ S ５ N ８ The present invention relates to a method for manufacturing an illumination device, the method including: one or more phosphors selected from the group consisting of a ZnO-based phosphor, an α-SiAlON-based phosphor, a β-SiAlON-based phosphor, a LuAG-based phosphor, and a YAG-based phosphor.

12. A method for manufacturing the lighting device according to any one of claims 1 to 3, comprising the steps of: The method for manufacturing an illumination device, wherein the light-emitting element in the connecting step is a light-emitting element capable of emitting blue light.

13. A phosphor sheet including phosphor particles and a curable resin component, the phosphor sheet being made of a thermosetting resin material in a B-stage state; A white sheet and A set for manufacturing a lighting device comprising:

14. A set for manufacturing the lighting device according to claim 13, comprising: The set for manufacturing a lighting device, wherein the curable resin component includes at least one selected from the group consisting of a silicone resin and an epoxy resin.

15. A set for manufacturing a lighting device according to claim 13 or 14, comprising: The set for producing a lighting device, wherein the phosphor particles include one or more selected from the group consisting of a CASN-based phosphor, a SCASN-based phosphor, a La3Si6N11-based phosphor, a Sr2Si5N8-based phosphor, a Ba2Si5N8-based phosphor, an α-type Sialon-based phosphor, a β-type Sialon-based phosphor, a LuAG-based phosphor, and a YAG-based phosphor.

16. A set for manufacturing a lighting device according to claim 13 or 14, comprising: The white sheet includes a white pigment and a curable resin component, and is made of a thermosetting resin material in a B-stage state.

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