Heat medium supply device

Abstract

A heat medium supplying device capable of quickly responding to changes in target processing temperature in semiconductor manufacturing equipment without changing the rated capacity of a cooling device or a heating device. [Solution] The heat medium supplying device 3 includes a cooling device 7 for cooling a first heat medium, a heating device 8 for heating a second heat medium, a cooling medium transfer pipe 11 for sending the cooled first heat medium to a temperature control device 2, a heating medium transfer pipe 12 for sending the heated second heat medium to the temperature control device 2, and an operation control unit 35 for controlling the operation of the cooling device 7. The operation control unit 35 is configured to issue a command to the cooling device 7 when the heat load on the cooling device 7 exceeds a cooling load threshold value, to switch the operation of the cooling device 7 from rated cooling operation to overload cooling operation.

Description

[Technical field]

[0001] The present invention relates to a heat medium supplying device that supplies a heat medium to a temperature control device that adjusts the temperature of semiconductor manufacturing equipment such as an etching equipment, a CVD equipment, or a PVD equipment. [Background technology]

[0002] Semiconductor manufacturing equipment (e.g., etching equipment, CVD equipment, PVD equipment) for manufacturing semiconductor devices is configured to execute manufacturing processes while controlling the processing temperature. For example, in an etching equipment, the processing temperature of the wafer is adjusted by flowing a temperature-adjusted liquid as a heat medium through a flow passage formed in a susceptor that supports the wafer.

[0003] The temperature of the heat medium supplied to the semiconductor manufacturing equipment is adjusted directly or indirectly by a cooling device and a heating device. For example, a heat medium cooled by a cooling device and a heat medium heated by a heating device are mixed to generate a temperature-adjusted heat medium, and the heat medium is supplied to the semiconductor manufacturing equipment to adjust the processing temperature in the semiconductor manufacturing equipment by the heat medium. In another example, as shown in Patent Document 1, a first heat medium and a second heat medium are cooled and heated by a cooling device and a heating device, respectively, and the cooled first heat medium and the heated second heat medium are heat-exchanged with a third heat medium to adjust the temperature of the third heat medium, and the third heat medium is supplied to the semiconductor manufacturing equipment to adjust the processing temperature in the semiconductor manufacturing equipment by the third heat medium. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent Publication No. 2021-77086 [Patent Document 2] JP 2023-98068 A [Patent Document 3] Patent No. 7014988 Summary of the Invention [Problem to be solved by the invention]

[0005] During wafer processing in a semiconductor manufacturing equipment, the target processing temperature for the wafer changes depending on the processing step. For example, when the target processing temperature in the semiconductor manufacturing equipment drops during wafer processing, the temperature of the heat medium supplied to the semiconductor manufacturing equipment needs to be quickly lowered, resulting in a temporary increase in the heat load of the cooling equipment. Similarly, when the target processing temperature in the semiconductor manufacturing equipment rises during wafer processing, the temperature of the heat medium supplied to the semiconductor manufacturing equipment needs to be quickly raised, resulting in a temporary increase in the heat load of the heating equipment.

[0006] However, increasing the cooling capacity of the cooling device and the heating capacity of the heating device in preparation for temporary load fluctuations brings about disadvantages such as larger sizes and higher costs for the cooling device and heating device.

[0007] Therefore, the present invention provides a heat medium supplying device that can quickly respond to changes in the target processing temperature in semiconductor manufacturing equipment without changing the rated capacity of the cooling device or heating device. [Means for solving the problem]

[0008] In one aspect, there is provided a heat medium supplying device that supplies a heat medium to a temperature control device that adjusts a temperature of a semiconductor manufacturing device, the heat medium supplying device comprising: a cooling device that cools a first heat medium; a heating device that heats a second heat medium; a cooling medium transfer pipe that sends the cooled first heat medium to the temperature control device; a heating medium transfer pipe that sends the heated second heat medium to the temperature control device; a cooling side return pipe that returns the first heat medium that has passed through the temperature control device to the cooling device; a heating side return pipe that returns the second heat medium that has passed through the temperature control device to the heating device; and an operation control unit that controls operation of the cooling device, wherein the operation control unit is configured to give a command to the cooling device to switch operation of the cooling device from rated cooling operation to overload cooling operation when a thermal load on the cooling device exceeds a cooling load threshold value.

[0009] Rated cooling operation is an operation in which the cooling device is operated within a range equal to or less than the upper limit of the rated cooling capacity of the cooling device, and overload cooling operation is an operation in which the cooling device is operated within a range exceeding the upper limit of the rated cooling capacity of the cooling device. An excessive increase in the thermal load on the cooling device occurs when the temperature of the heat medium returning to the cooling device from the temperature control device rises excessively. Such an excessive temperature rise in the heat medium usually occurs temporarily during the operation of the semiconductor manufacturing device, and its duration is relatively short, about several tens of seconds to several hundred seconds. Therefore, by temporarily performing overload cooling operation on the cooling device, the cooling capacity of the cooling device is increased, and the cooling device can quickly cool the first heat medium to the target cooling temperature.

[0010] In one aspect, the operation control unit is configured to give a command to the cooling device to switch the operation of the cooling device from overload cooling operation to rated cooling operation when a predetermined overload cooling operation allowable time has elapsed since the operation of the cooling device was switched from rated cooling operation to overload cooling operation. Since the increase in the heat load on the cooling device is temporary, it is not necessary to continue the overload cooling operation for a long period of time. Therefore, by switching the operation of the cooling device from overload cooling operation to rated cooling operation when a predetermined overload cooling operation allowable time has elapsed, it is possible to prevent the cooling device from breaking down due to the overload cooling operation.

[0011] In one aspect, the operation control unit is configured to, when an abnormality in the cooling device is detected during overload cooling operation of the cooling device, give a command to the cooling device to switch the operation of the cooling device from overload cooling operation to rated cooling operation. According to the present invention, it is possible to prevent a breakdown in the cooling device. An abnormality in the cooling device is detected, for example, by an abnormality detection device provided in the cooling device itself.

[0012] In one embodiment, the first heat medium cooled by the cooling device and the second heat medium heated by the heating device are the same heat medium. If the same heat medium is used for the first and second heat mediums, they can be mixed together. Therefore, it is possible to supply the first and second heat mediums directly to the temperature control device. However, it is also possible to use the first, second, and third heat mediums as independent systems by using a heat exchanger in between.

[0013] In one embodiment, the first heat medium cooled by the cooling device and the second heat medium heated by the heating device are different heat media. Since different heat media are used for the first and second heat media, they cannot be mixed, so a heat exchanger must be provided between the first heat medium and the third heat medium on the temperature control device side, and between the second heat medium and the third heat medium on the temperature control device side.However, there are advantages such as eliminating the need to adjust the liquid levels of the first and second heat media, and controlling the flow rates of the first and second heat media without affecting the flow rate on the temperature control device side.

[0014] In one aspect, there is provided a heat medium supplying device that supplies a heat medium to a temperature control device that adjusts the temperature of a semiconductor manufacturing device, the heat medium supplying device comprising: a cooling device that cools a first heat medium; a heating device that heats a second heat medium; a cooling medium transfer pipe that sends the cooled first heat medium to the temperature control device; a heating medium transfer pipe that sends the heated second heat medium to the temperature control device; a cooling side return pipe that returns the first heat medium that has passed through the temperature control device to the cooling device; a heating side return pipe that returns the second heat medium that has passed through the temperature control device to the heating device; and an operation control unit that controls operation of the heating device, wherein the operation control unit is configured to give a command to the heating device to switch operation of the heating device from rated heating operation to overload heating operation when the heat load on the heating device exceeds a heat load threshold value.

[0015] Rated heating operation is an operation in which the heating device is operated within a range equal to or less than the upper limit of the rated heating capacity of the heating device, and overload heating operation is an operation in which the heating device is operated within a range exceeding the upper limit of the rated heating capacity of the heating device. An excessive increase in the thermal load on the heating device occurs when the temperature of the heat medium returning to the heating device from the temperature control device drops excessively. Such an excessive drop in temperature of the heat medium usually occurs temporarily during the operation of the semiconductor manufacturing device, and its duration is relatively short, about several tens of seconds to several hundred seconds. Therefore, by temporarily operating the heating device in overload heating operation, the heating capacity of the heating device is increased, and the heating device can quickly heat the second heat medium to the target heating temperature.

[0016] In one aspect, the operation control unit is configured to give a command to the heating device to switch the operation of the heating device from overload heating operation to rated heating operation when a predetermined overload heating operation allowable time has elapsed since the operation of the heating device was switched from rated heating operation to overload heating operation. Since the increase in the thermal load on the heating device is temporary, it is not necessary to continue the overload heating operation for a long time. Therefore, by switching the operation of the heating device from the overload heating operation to the rated heating operation when a predetermined overload heating operation allowable time has elapsed, it is possible to prevent the heating device from breaking down due to the overload heating operation.

[0017] In one aspect, the operation control unit is configured to, when an abnormality in the heating device is detected during overload heating operation of the heating device, give a command to the heating device to switch the operation of the heating device from overload heating operation to rated heating operation. According to the present invention, it is possible to prevent a breakdown in the heating device. An abnormality in the heating device is detected, for example, by an abnormality detection device provided in the heating device itself.

[0018] In one embodiment, the first heat medium cooled by the cooling device and the second heat medium heated by the heating device are the same heat medium. If the same heat medium is used for the first and second heat mediums, they can be mixed together. Therefore, it is possible to supply the first and second heat mediums directly to the temperature control device. However, it is also possible to use the first, second, and third heat mediums as independent systems by using a heat exchanger in between.

[0019] In one embodiment, the first heat medium cooled by the cooling device and the second heat medium heated by the heating device are different heat media. Since different heat media are used for the first and second heat media, they cannot be mixed, so a heat exchanger must be provided between the first heat medium and the third heat medium on the temperature control device side, and between the second heat medium and the third heat medium on the temperature control device side.However, there are advantages such as eliminating the need to adjust the liquid levels of the first and second heat media, and controlling the flow rates of the first and second heat media without affecting the flow rate on the temperature control device side.

[0020] In one aspect, there is provided a heat medium supplying device that supplies a heat medium to a temperature control device that adjusts a temperature of a semiconductor manufacturing device, the heat medium supplying device comprising: a cooling device that cools a first heat medium; a heating device that heats a second heat medium; a cooling medium transfer pipe that sends the cooled first heat medium to the temperature control device; a heating medium transfer pipe that sends the heated second heat medium to the temperature control device; a cooling side return pipe that returns the first heat medium that has passed through the temperature control device to the cooling device; a heating side return pipe that returns the second heat medium that has passed through the temperature control device to the heating device; and an operation control unit that controls operation of the cooling device and the heating device, wherein the operation control unit is configured to, when a heat load on the cooling device exceeds a cooling load threshold value, give a command to the cooling device to switch the operation of the cooling device from rated cooling operation to overload cooling operation, and when a heat load on the heating device exceeds a heating load threshold value, give a command to the heating device to switch the operation of the heating device from rated heating operation to overload heating operation.

[0021] In one aspect, the operation control unit is configured to give a command to the cooling device to switch operation of the cooling device from overload cooling operation to rated cooling operation when a predetermined overload cooling operation allowable time has elapsed since the operation of the cooling device was switched from rated cooling operation to overload cooling operation, and to give a command to the heating device to switch operation of the heating device from overload heating operation to rated heating operation when a predetermined overload heating operation allowable time has elapsed since the operation of the heating device was switched from rated heating operation to overload heating operation.

[0022] In one aspect, the operation control unit is configured to, when an abnormality is detected in the cooling device during overload cooling operation of the cooling device, give a command to the cooling device to switch the operation of the cooling device from overload cooling operation to rated cooling operation, and when an abnormality is detected in the heating device during overload heating operation of the heating device, give a command to the heating device to switch the operation of the heating device from overload heating operation to rated heating operation.

[0023] In one embodiment, the first heat medium cooled by the cooling device and the second heat medium heated by the heating device are the same heat medium. If the same heat medium is used for the first and second heat mediums, they can be mixed together. Therefore, it is possible to supply the first and second heat mediums directly to the temperature control device. However, it is also possible to use the first, second, and third heat mediums as independent systems by using a heat exchanger in between.

[0024] In one embodiment, the first heat medium cooled by the cooling device and the second heat medium heated by the heating device are different heat media. Since different heat media are used for the first and second heat media, they cannot be mixed, so a heat exchanger must be provided between the first heat medium and the third heat medium on the temperature control device side, and between the second heat medium and the third heat medium on the temperature control device side.However, there are advantages such as eliminating the need to adjust the liquid levels of the first and second heat media, and controlling the flow rates of the first and second heat media without affecting the flow rate on the temperature control device side. Effect of the Invention

[0025] According to the present invention, when a temporary increase in heat load occurs, the cooling device or heating device is temporarily operated under overload, thereby quickly cooling or heating the heat medium to a target temperature. [Brief description of the drawings]

[0026] [Figure 1] 1 is a schematic diagram showing an embodiment of a semiconductor manufacturing system including a semiconductor manufacturing apparatus, a temperature control device, and a heat medium supply device. [Diagram 2] 4 is a graph showing an example of a change over time in temperature of a first heat medium cooled by a cooling device. [Diagram 3] FIG. 11 is a schematic diagram showing another embodiment of the heat medium supplying device. [Figure 4] FIG. 11 is a schematic diagram showing still another embodiment of the heat medium supplying device. [Diagram 5] 4 is a graph showing an example of a change over time in temperature of a second heat medium heated by a heating device. [Figure 6] FIG. 11 is a schematic diagram showing still another embodiment of the heat medium supplying device. [Figure 7] FIG. 5 is a diagram showing an embodiment in which the embodiment described with reference to FIG. 1 and the embodiment described with reference to FIG. 4 are combined. [Figure 8] FIG. 7 is a diagram showing an embodiment in which the embodiment described with reference to FIG. 3 and the embodiment described with reference to FIG. 6 are combined. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0027] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a schematic diagram showing an embodiment of a semiconductor manufacturing system including a semiconductor manufacturing apparatus, a temperature control device, and a heat medium supply device. The semiconductor manufacturing system includes a semiconductor manufacturing apparatus 1 (e.g., an etching apparatus, a CVD apparatus, a PVD apparatus, etc.), a temperature control device 2 that adjusts the temperature of a heat medium supplied to the semiconductor manufacturing apparatus 1, and a heat medium supply device 3 that supplies a cooled first heat medium and a heated second heat medium to the temperature control device 2. The temperature control device 2 is connected to the semiconductor manufacturing apparatus 1, and the heat medium supply device 3 is connected to the temperature control device 2. In the embodiment shown in FIG. 1, an etching apparatus that performs a dry etching process on a wafer is used as the semiconductor manufacturing apparatus 1, but the semiconductor manufacturing apparatus 1 is not limited to this embodiment.

[0028] The heat medium supplying device 3 includes a cooling device 7 that cools the first heat medium, a heating device 8 that heats the second heat medium, a cooling medium transfer pipe 11 that sends the cooled first heat medium to the temperature control device 2, a heating medium transfer pipe 12 that sends the heated second heat medium to the temperature control device 2, a cooling side return pipe 18 that returns the first heat medium that has passed through the temperature control device 2 to the cooling device 7, a heating side return pipe 19 that returns the second heat medium that has passed through the temperature control device 2 to the heating device 8, and an operation control unit 35 that controls the operation of the cooling device 7 and the heating device 8.

[0029] The operation control unit 35 includes at least one computer. The operation control unit 35 includes a storage device 35a in which programs and the like are stored, and a calculation device 35b that executes calculations according to instructions included in the programs. The storage device 35a includes a main storage device such as a random access memory (RAM), and an auxiliary storage device such as a hard disk drive (HDD) and a solid state drive (SSD). Examples of the calculation device 35b include a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit). However, the specific configuration of the operation control unit 35 is not limited to these examples.

[0030] The cooling medium transfer pipe 11 and the heating medium transfer pipe 12 are connected to the temperature control device 2. The temperature control device 2 has a first heat medium bypass pipe 42 that returns the cooled first heat medium to the cooling device 7 without sending it to the temperature control device 2, and a second heat medium bypass pipe 43 that returns the heated second heat medium to the heating device 8 without sending it to the temperature control device 2. The temperature control device 2 further includes a first bypass flow rate control valve 44 provided in the first heat medium bypass pipe 42, a cooling side transfer flow rate control valve 45 communicating with the cooling medium transfer pipe 11, a cooling side return flow rate control valve 46 communicating with the cooling side return pipe 18, a second bypass flow rate control valve 47 provided in the second heat medium bypass pipe 43, a heating side transfer flow rate control valve 48 communicating with the heating medium transfer pipe 12, and a heating side return flow rate control valve 49 communicating with the heating side return pipe 19.

[0031] The temperature control device 2 can adjust the flow rate of the first heat medium sent to the semiconductor manufacturing equipment 1 by controlling the operation of the first bypass flow rate adjustment valve 44, the cooling side transfer flow rate adjustment valve 45, and the cooling side return flow rate adjustment valve 46. Similarly, the temperature control device 2 can adjust the flow rate of the second heat medium sent to the semiconductor manufacturing equipment 1 by controlling the operation of the second bypass flow rate adjustment valve 47, the heating side transfer flow rate adjustment valve 48, and the heating side return flow rate adjustment valve 49. In this way, the temperature control device 2 is configured to adjust the temperature required for the semiconductor manufacturing equipment 1 by mixing the cooled first heat medium and the heated second heat medium while adjusting the flow rates of the cooled first heat medium and the heated second heat medium.

[0032] The flow rate control valves 44, 45, 46, 47, 48, and 49 are two-way valves, but are not limited to two-way valves as long as they can provide similar effects. For example, the flow rate control valves 44, 45, 46, 47, 48, and 49 may be three-way valves or a combination of two-way and three-way valves.

[0033] In this embodiment, the same heat medium is used for the first heat medium and the second heat medium. When the same heat medium is used for the first heat medium and the second heat medium, the two can be mixed. Therefore, it is possible to directly supply the first heat medium and the second heat medium to the temperature control device 2. In one embodiment, a fluorine-based inert liquid is used as the first heat medium and the second heat medium. An example of the cooling device 7 is a vapor compression refrigerator. Vapor compression refrigerators include turbo refrigerators, screw refrigerators, rotary refrigerators, scroll refrigerators, and the like, and these can be used. Examples of the heating device 8 are a heat pump, a boiler, an electric heater, and the like. The configuration of the cooling device 7 and the heating device 8 is not particularly limited as long as they can cool and heat the first heat medium and the second heat medium.

[0034] The heat medium supplying device 3 includes a first buffer tank 25 that holds a first heat medium, a second buffer tank 26 that holds a second heat medium, a tank communication pipe 30 that communicates between the first buffer tank 25 and the second buffer tank 26, and a communication valve 31 provided on the tank communication pipe 30. The first buffer tank 25 is connected to a cooling side return pipe 18. The cooling side return pipe 18 extends from the temperature control device 2 to the cooling device 7 via the first buffer tank 25.

[0035] The cooling medium transfer pipe 11, which transfers the first heat medium cooled by the cooling device 7, extends from the cooling device 7 to the temperature control device 2. The heating medium transfer pipe 12, which transfers the second heat medium heated by the heating device 8, extends from the heating device 8 to the temperature control device 2 via a second buffer tank 26. The second buffer tank 26 is connected to the heating medium transfer pipe 12. The heating side return pipe 19 extends from the temperature control device 2 to the heating device 8.

[0036] The heat medium supplying device 3 includes a first pump 33 connected to the cooling-side return pipe 18. When the first pump 33 is operated, the first heat medium is sent from the first buffer tank 25 to the cooling device 7 through the cooling-side return pipe 18. The cooling device 7 is connected to the cooling medium transfer pipe 11 and the cooling-side return pipe 18. The cooling device 7 is configured to cool the first heat medium sent through the cooling-side return pipe 18. The cooled first heat medium is transferred to the temperature control device 2 through the cooling medium transfer pipe 11.

[0037] The heat medium supplying device 3 includes a second pump 34 connected to the heating medium transfer pipe 12. When the second pump 34 is operated, the second heat medium (heated second heat medium) in the second buffer tank 26 is sent to the temperature control device 2 through the heating medium transfer pipe 12. The heating device 8 is connected to the heating medium transfer pipe 12 and the heating side return pipe 19. The heating device 8 is configured to heat the second heat medium sent through the heating side return pipe 19. The heat medium heated by the heating device 8 is transferred to the temperature control device 2 through the heating medium transfer pipe 12 and the second buffer tank 26.

[0038] The cooled first heat medium and the heated second heat medium are mixed by the temperature control device 2 to generate a third heat medium having a preset temperature. The third heat medium having a preset temperature is transferred from the temperature control device 2 to the semiconductor manufacturing equipment 1, and while passing through the semiconductor manufacturing equipment 1, cools or heats a wafer (not shown) in the semiconductor manufacturing equipment 1. The third heat medium that has passed through the semiconductor manufacturing equipment 1 is returned to the temperature control device 2 and is divided into two flows in the temperature control device 2. One of the two flows flows into the cooling side return pipe 18 as the first heat medium, and the other flows into the heating side return pipe 19 as the second heat medium. The first heat medium that flows into the cooling side return pipe 18 is sent to the cooling device 7 through the cooling side return pipe 18 and the first buffer tank 25. The second heat medium that flows into the heating side return pipe 19 is sent to the heating device 8 through the heating side return pipe 19.

[0039] In this way, the first heat medium circulates through the cooling device 7, the cooling medium transfer pipe 11, the first heat medium bypass pipe 42, the cooling side return pipe 18, and the first buffer tank 25, and at the same time, the second heat medium circulates through the heating device 8, the heating medium transfer pipe 12, the second heat medium bypass pipe 43, the second buffer tank 26, and the heating side return pipe 19. As the first heat medium and the second heat medium circulate, a difference occurs between the liquid level of the first heat medium in the first buffer tank 25 and the liquid level of the second heat medium in the second buffer tank 26. The operation control unit 35 operates the communication valve 31 to reduce the difference between the liquid level of the first heat medium in the first buffer tank 25 and the liquid level of the second heat medium in the second buffer tank 26.

[0040] Next, the operation control of the cooling device 7 by the operation control unit 35 will be described. In this embodiment, the operation control unit 35 is configured to issue a command to the cooling device 7 when the heat load on the cooling device 7 exceeds a cooling load threshold value, to switch the operation of the cooling device 7 from rated cooling operation to overload cooling operation. When the cooling device 7 is a vapor compression refrigerator such as a turbo refrigerator, the operation control unit 35 switches the operation of the cooling device 7 from rated cooling operation to overload cooling operation by increasing the rotation speed of the compressor of the vapor compression refrigerator.

[0041] The rated cooling operation is an operation in which the cooling device 7 is operated within a range equal to or less than the upper limit of the rated cooling capacity of the cooling device 7, and the overload cooling operation is an operation in which the cooling device 7 is operated within a range exceeding the upper limit of the rated cooling capacity of the cooling device 7. An excessive increase in the thermal load on the cooling device 7 occurs when the temperature of the heat medium returning from the temperature control device 2 to the cooling device 7 rises excessively. Such an excessive increase in temperature of the heat medium usually occurs temporarily during the operation of the semiconductor manufacturing equipment 1, and its duration is relatively short, about several tens of seconds to several hundred seconds. Therefore, by temporarily performing the overload cooling operation of the cooling device 7, the cooling capacity of the cooling device 7 is increased, and the cooling device 7 can quickly cool the first heat medium to the target cooling temperature.

[0042] The operation control unit 35 monitors the temperature of the first heat medium to determine whether the heat load on the cooling device 7 has exceeded the cooling load threshold value. More specifically, the heat medium supplying device 3 includes a first heat medium temperature measuring device 41 for measuring the temperature of the first heat medium flowing through the cooling side return pipe 18. The first heat medium temperature measuring device 41 is connected to the cooling side return pipe 18. The first heat medium temperature measuring device 41 is electrically connected to the operation control unit 35, and the measured value of the temperature of the first heat medium is sent to the operation control unit 35. During the operation of the heat medium supplying device 3, the operation control unit 35 monitors the measured value of the temperature of the first heat medium sent from the first heat medium temperature measuring device 41, and determines whether the heat load on the cooling device 7 has exceeded the cooling load threshold value.

[0043] In this embodiment, the operation control unit 35 is configured to give a command to the cooling device 7 when the temperature of the first heat medium flowing through the cooling-side return pipe 18 exceeds the cooling temperature threshold value, thereby switching the operation of the cooling device 7 from rated cooling operation to overload cooling operation. The temperature of the first heat medium measured by the first heat medium temperature measuring device 41 reflects the heat load on the cooling device 7. The cooling temperature threshold value related to the temperature of the first heat medium corresponds to the cooling load threshold value related to the heat load on the cooling device 7. The operation control unit 35 determines whether the heat load on the cooling device 7 has exceeded the cooling load threshold value based on a comparison between the temperature of the first heat medium and the cooling temperature threshold value. Therefore, the operation control unit 35 can give a command to the cooling device 7 based on the measured value of the temperature of the first heat medium, thereby switching the operation of the cooling device 7 from rated cooling operation to overload cooling operation.

[0044] The increase in the heat load on the cooling device 7 may be determined based on a signal from the semiconductor manufacturing equipment 1 or a signal from the temperature control device 2, in addition to the temperature of the first heat medium. For example, the operation control unit 35 receives a signal indicating a target processing temperature in the semiconductor manufacturing equipment 1 from the semiconductor manufacturing equipment 1, and when the target processing temperature in the semiconductor manufacturing equipment 1 exceeds a predetermined processing cooling temperature threshold, issues a command to the cooling device 7 to switch the operation of the cooling device 7 from rated cooling operation to overload cooling operation.

[0045] Fig. 2 is a graph showing an example of the change over time in temperature of the first heat medium cooled by the cooling device 7. In Fig. 2, the thin solid line represents the temperature of the first heat medium sent from the cooling device 7 to the temperature control device 2 during rated cooling operation, the thick dashed line represents the temperature of the first heat medium sent from the cooling device 7 to the temperature control device 2 during overload cooling operation, and the dashed dotted line represents the temperature of the first heat medium returning from the temperature control device 2 to the cooling device 7.

[0046] When the heat load on the cooling device 7 increases excessively, as shown in FIG. 2, the temperature of the first heat medium exiting the cooling device 7 and the temperature of the first heat medium returning from the temperature control device 2 temporarily rise. When the heat load on the cooling device 7 exceeds the cooling load threshold (for example, the temperature of the first heat medium flowing through the cooling side return pipe 18 exceeds the cooling temperature threshold), the cooling device 7 performs overload cooling operation. As a result, the temperature of the first heat medium exiting the cooling device 7 decreases more quickly than in rated cooling operation, and reaches the target cooling temperature. In one example, the temperature of the first heat medium when the cooling device 7 is performing overload cooling operation can reach the target cooling temperature about 30% faster than when the cooling device 7 is performing rated cooling operation.

[0047] The operation control unit 35 is configured to issue a command to the cooling device 7 to switch the operation of the cooling device 7 from overload cooling operation to rated cooling operation when a predetermined overload cooling operation allowable time has elapsed since the operation of the cooling device 7 was switched from the rated cooling operation to the overload cooling operation. Since the increase in the thermal load on the cooling device 7 is temporary, it is not necessary to continue the overload cooling operation for a long period of time. Therefore, by switching the operation of the cooling device 7 from overload cooling operation to the rated cooling operation when the predetermined overload cooling operation allowable time has elapsed, it is possible to prevent a breakdown of the cooling device 7 caused by the overload cooling operation.

[0048] The operation control unit 35 is configured to issue a command to the cooling device 7 to switch the operation of the cooling device 7 from the overload cooling operation to the rated cooling operation when an abnormality of the cooling device 7 is detected during the overload cooling operation of the cooling device 7. This operation can prevent the cooling device 7 from breaking down. The abnormality of the cooling device 7 is detected, for example, by an abnormality detection device provided in the cooling device 7 itself. Examples of the abnormality of the cooling device 7 include an excessive rise in the temperature of the refrigerant gas discharged from the compressor, a drop in the oil level of the compressor, a high temperature of the compressor, etc.

[0049] The above-mentioned operation control of the cooling device 7 can also be applied to the heat medium supplying device 3 described below. Fig. 3 is a schematic diagram showing another embodiment of the heat medium supplying device 3. The configuration and operation not specifically described are the same as those of the above embodiment described with reference to Figs. 1 and 2, and therefore the duplicated description will be omitted.

[0050] The cooling medium transfer pipe 11, which transfers the first heat medium cooled by the cooling device 7 to the temperature control device 2, and the cooling side return pipe 18, which returns the first heat medium that has passed through the temperature control device 2 to the cooling device 7, constitute a first circulation circuit 51 in which the first heat medium circulates. The heating medium transfer pipe 12, which transfers the second heat medium heated by the heating device 8 to the temperature control device 2, and the heating side return pipe 19, which returns the second heat medium that has passed through the temperature control device 2 to the heating device 8, constitute a second circulation circuit 52 in which the second heat medium circulates. The first pump 33 circulates the first heat medium in the first circulation circuit 51, and the second pump 34 circulates the second heat medium in the second circulation circuit 52.

[0051] The temperature control device 2 includes a third circulation circuit 53 through which a third heat medium circulates. The third circulation circuit 53 is connected to the semiconductor manufacturing equipment 1, and the third heat medium circulates through the third circulation circuit 53 and the semiconductor manufacturing equipment 1. The processing temperature in the semiconductor manufacturing equipment 1 is adjusted by the third heat medium. The temperature of the third heat medium is adjusted by the first heat medium and the second heat medium, as described below.

[0052] The second circulation circuit 52 is independent from the first circulation circuit 51, and the third circulation circuit 53 is independent from the first circulation circuit 51 and the second circulation circuit 52. That is, the first circulation circuit 51, the second circulation circuit 52, and the third circulation circuit 53 form closed circuits independent from each other, and the first heat medium, the second heat medium, and the third heat medium are not mixed.

[0053] Different heat media are used for the first heat medium, the second heat medium, and the third heat medium. For example, common brine is used as the first heat medium for cooling. Examples of brine include ethylene glycol, propylene glycol, calcium chloride, etc. Examples of the second heat medium for heating include silicone oil, etc. Examples of the third heat medium include a fluorine-based inert liquid. The third heat medium is an insulator that is chemically stable from low to high temperatures in order to directly adjust the processing temperature in the semiconductor manufacturing equipment 1.

[0054] The lower limit usable temperature of the third heat medium is lower than the lower limit usable temperature of the first heat medium and the second heat medium. The upper limit usable temperature of the third heat medium is higher than the upper limit usable temperature of the first heat medium and the second heat medium. In other words, the usable temperature range of the third heat medium is wider than the usable temperature range of the first heat medium and the second heat medium. The usable temperature is the temperature at which the viscosity (fluidity) of the heat medium can be maintained and the heat medium does not change phase (does not boil and does not solidify).

[0055] The temperature control device 2 includes a first heat exchanger 56 that performs heat exchange between the first heat medium cooled by the cooling device 7 and the third heat medium, and a second heat exchanger 57 that performs heat exchange between the second heat medium heated by the heating device 8 and the third heat medium. The first heat exchanger 56 is connected to the first circulation circuit 51 and the third circulation circuit 53. The first heat medium flowing through the first circulation circuit 51 and the third heat medium flowing through the third circulation circuit 53 perform heat exchange in the first heat exchanger 56. The second heat exchanger 57 is connected to the second circulation circuit 52 and the third circulation circuit 53. The second heat medium flowing through the second circulation circuit 52 and the third heat medium flowing through the third circulation circuit 53 perform heat exchange in the second heat exchanger 57.

[0056] The first heat exchanger 56 and the second heat exchanger 57 are connected in parallel by the third circulation circuit 53. The third circulation circuit 53 includes a first outlet flow path 61 connected to the heat medium outlet of the first heat exchanger 56, a first inlet flow path 62 connected to the heat medium inlet of the first heat exchanger 56, a second outlet flow path 63 connected to the heat medium outlet of the second heat exchanger 57, a second inlet flow path 64 connected to the heat medium inlet of the second heat exchanger 57, a junction flow path 67 connected to both the first outlet flow path 61 and the second outlet flow path 63, and a distribution flow path 68 connected to both the first inlet flow path 62 and the second inlet flow path 64. The junction flow path 67 and the distribution flow path 68 are connected to the semiconductor manufacturing apparatus 1.

[0057] The temperature control device 2 includes a three-way valve 70, a first check valve 71, and a second check valve 72. The three-way valve 70 is connected to the first inlet flow path 62, the second inlet flow path 64, and the distribution flow path 68. The third heat medium flowing through the distribution flow path 68 is distributed to the first inlet flow path 62 and the second inlet flow path 64 via the three-way valve 70. The flow rate of the third heat medium distributed to the first inlet flow path 62 and the second inlet flow path 64 is adjusted by the three-way valve 70. The first check valve 71 is provided in the first inlet flow path 62, and the second check valve 72 is provided in the second inlet flow path 64.

[0058] The third heat medium cooled by the first heat medium in the first heat exchanger 56 flows through the first outlet flow path 61. The third heat medium heated by the second heat medium in the second heat exchanger 57 flows through the second outlet flow path 63. The third heat medium flowing through the first outlet flow path 61 and the third heat medium flowing through the second outlet flow path 63 join at the joining flow path 67 and are sent to the semiconductor manufacturing equipment 1 to cool or heat the wafers in the semiconductor manufacturing equipment 1. The third heat medium passing through the semiconductor manufacturing equipment 1 flows through the distribution flow path 68 and is distributed to the first inlet flow path 62 and the second inlet flow path 64 by the three-way valve 70. In this way, the third heat medium circulates through the first heat exchanger 56, the second heat exchanger 57, and the semiconductor manufacturing equipment 1.

[0059] The first heat exchanger 56 is configured to exchange heat between the first heat medium cooled by the cooling device 7 and the third heat medium before being sent to the semiconductor manufacturing equipment 1. The second heat exchanger 57 is configured to exchange heat between the second heat medium heated by the heating device 8 and the third heat medium before being sent to the semiconductor manufacturing equipment 1. The third heat medium is cooled by the first heat medium and heated by the second heat medium.

[0060] The first heat medium temperature measuring instrument 41 measures the temperature of the first heat medium flowing through the cooling-side return pipe 18 that constitutes the first circulation circuit 51. The measured value of the temperature of the first heat medium is sent to the operation control unit 35. During operation of the heat medium supplying device 3, the operation control unit 35 monitors the measured value of the temperature of the first heat medium sent from the first heat medium temperature measuring instrument 41, and determines whether or not the heat load on the cooling device 7 has exceeded the cooling load threshold value.

[0061] In this embodiment, the operation control unit 35 is configured to issue a command to the cooling device 7 to switch the operation of the cooling device 7 from rated cooling operation to overload cooling operation when the temperature of the first heat medium flowing through the cooling-side return pipe 18 exceeds the cooling temperature threshold value. The temperature of the first heat medium measured by the first heat medium temperature measuring device 41 reflects the heat load on the cooling device 7. The cooling temperature threshold value related to the temperature of the first heat medium corresponds to the cooling load threshold value related to the heat load on the cooling device 7.

[0062] The operation control unit 35 determines whether the heat load on the cooling device 7 exceeds the cooling load threshold value based on a comparison between the temperature of the first heat medium and the cooling temperature threshold value. Therefore, the operation control unit 35 can issue a command to the cooling device 7 based on the measured value of the temperature of the first heat medium to switch the operation of the cooling device 7 from rated cooling operation to overload cooling operation. By performing the overload cooling operation, the cooling device 7 can reduce the temperature of the first heat medium more quickly than in the rated cooling operation and reach the target cooling temperature.

[0063] The increase in the heat load on the cooling device 7 may be determined based on a signal from the semiconductor manufacturing equipment 1 or a signal from the temperature control device 2, in addition to the temperature of the first heat medium. For example, the operation control unit 35 receives a signal indicating a target processing temperature in the semiconductor manufacturing equipment 1 from the semiconductor manufacturing equipment 1, and when the target processing temperature in the semiconductor manufacturing equipment 1 exceeds a predetermined processing cooling temperature threshold, issues a command to the cooling device 7 to switch the operation of the cooling device 7 from rated cooling operation to overload cooling operation.

[0064] Fig. 4 is a schematic diagram showing still another embodiment of the heat medium supplying device 3. Configurations and operations that are not particularly described are the same as those of the embodiment described with reference to Fig. 1, and therefore duplicated descriptions will be omitted.

[0065] In this embodiment, as described below, the operation control unit 35 controls the operation of the heating device 8. When the heat load on the heating device 8 exceeds a heat load threshold, the operation control unit 35 is configured to issue a command to the heating device 8 to switch the operation of the heating device 8 from rated heating operation to overload heating operation. When the heating device 8 is a heat pump, the operation control unit 35 switches the operation of the heating device 8 from rated heating operation to overload heating operation by increasing the rotation speed of the compressor of the heat pump.

[0066] The rated heating operation is an operation in which the heating device 8 is operated within a range equal to or less than the upper limit of the rated heating capacity of the heating device 8, and the overload heating operation is an operation in which the heating device 8 is operated within a range exceeding the upper limit of the rated heating capacity of the heating device 8. An excessive increase in the thermal load on the heating device 8 occurs when the temperature of the heat medium returning from the temperature control device 2 to the heating device 8 drops excessively. Such an excessive drop in temperature of the heat medium usually occurs temporarily during the operation of the semiconductor manufacturing apparatus 1, and its duration is relatively short, about several tens of seconds to several hundred seconds. Therefore, by temporarily performing an overload heating operation on the heating device 8, the heating capacity of the heating device 8 is increased, and the heating device 8 can quickly heat the second heat medium to the target heating temperature.

[0067] The operation control unit 35 monitors the temperature of the second heat medium to determine whether the heat load on the heating device 8 has exceeded the heat load threshold value. More specifically, the heat medium supplying device 3 is provided with a second heat medium temperature measuring device 80 for measuring the temperature of the second heat medium flowing through the heating side return pipe 19. The second heat medium temperature measuring device 80 is connected to the heating side return pipe 19. The second heat medium temperature measuring device 80 is electrically connected to the operation control unit 35, and the measured value of the temperature of the second heat medium is sent to the operation control unit 35. During the operation of the heat medium supplying device 3, the operation control unit 35 monitors the measured value of the temperature of the second heat medium sent from the second heat medium temperature measuring device 80, and determines whether the heat load on the heating device 8 has exceeded the heat load threshold value.

[0068] In this embodiment, the operation control unit 35 is configured to give a command to the heating device 8 to switch the operation of the heating device 8 from rated heating operation to overload heating operation when the temperature of the second heat medium flowing through the heating side return pipe 19 falls below the heating temperature threshold. The temperature of the second heat medium measured by the second heat medium temperature measuring device 80 reflects the heat load on the heating device 8. The heating temperature threshold related to the temperature of the second heat medium corresponds to the heat load threshold related to the heat load on the heating device 8. The operation control unit 35 determines whether the heat load on the heating device 8 has exceeded the heat load threshold based on a comparison between the temperature of the second heat medium and the heating temperature threshold. Therefore, the operation control unit 35 can give a command to the heating device 8 to switch the operation of the heating device 8 from rated heating operation to overload heating operation based on the measured value of the temperature of the second heat medium.

[0069] The determination of an increase in the heat load on heating device 8 may be based on a signal from semiconductor manufacturing equipment 1 or a signal from temperature control device 2, in addition to the temperature of the second heat medium. For example, operation control unit 35 receives a signal indicating a target processing temperature in semiconductor manufacturing equipment 1 from semiconductor manufacturing equipment 1, and when the target processing temperature in semiconductor manufacturing equipment 1 falls below a predetermined processing heating temperature threshold, issues a command to heating device 8 to switch the operation of heating device 8 from rated heating operation to overload heating operation.

[0070] Fig. 5 is a graph showing an example of the change over time in temperature of the second heat medium heated by the heating device 8. In Fig. 5, the thin solid line represents the temperature of the second heat medium sent from the heating device 8 to the temperature control device 2 during rated heating operation, the thick dashed line represents the temperature of the second heat medium sent from the heating device 8 to the temperature control device 2 during overload heating operation, and the dashed dotted line represents the temperature of the second heat medium returning from the temperature control device 2 to the heating device 8.

[0071] When the heat load on the heating device 8 increases excessively, as shown in FIG. 5, the temperature of the second heat medium leaving the heating device 8 and the temperature of the second heat medium returning from the temperature control device 2 temporarily drop. When the heat load on the heating device 8 exceeds the heat load threshold (for example, the temperature of the second heat medium flowing through the heating side return pipe 19 falls below the heating temperature threshold), the heating device 8 performs overload heating operation. As a result, the temperature of the second heat medium leaving the heating device 8 rises more quickly than in rated heating operation and reaches the target heating temperature. In one example, the temperature of the second heat medium when the heating device 8 is performing overload heating operation can reach the target heating temperature about 15% faster than when the heating device 8 is performing rated heating operation.

[0072] The operation control unit 35 is configured to issue a command to the heating device 8 to switch the operation of the heating device 8 from overload heating operation to rated heating operation when a predetermined overload heating operation allowable time has elapsed since the operation of the heating device 8 was switched from the rated heating operation to the overload heating operation. Since the increase in the thermal load on the heating device 8 is temporary, it is not necessary to continue the overload heating operation for a long period of time. Therefore, by switching the operation of the heating device 8 from overload heating operation to the rated heating operation when the predetermined overload heating operation allowable time has elapsed, it is possible to prevent failure of the heating device 8 due to the overload heating operation.

[0073] The operation control unit 35 is configured to, when an abnormality of the heating device 8 is detected during the overload heating operation of the heating device 8, issue a command to the heating device 8 to switch the operation of the heating device 8 from the overload heating operation to the rated heating operation. This operation can prevent the heating device 8 from breaking down. The abnormality of the heating device 8 is detected, for example, by an abnormality detection device provided in the heating device 8 itself. Examples of abnormalities of the heating device 8 include an excessive rise in the temperature of the refrigerant gas discharged from the compressor, a drop in the oil level of the compressor, a high temperature of the compressor, etc.

[0074] The above-mentioned operation control of the heating device 8 can also be applied to the embodiment of the heat medium supplying device 3 described with reference to Fig. 3. Fig. 6 is a schematic diagram showing still another embodiment of the heat medium supplying device 3. Configurations and operations that are not particularly described are the same as those of the above embodiment described with reference to Figs. 3 to 5, and therefore overlapping descriptions thereof will be omitted.

[0075] The second heat medium temperature measuring instrument 80 measures the temperature of the second heat medium flowing through the heating side return pipe 19 that constitutes the second circulation circuit 52. The measured value of the temperature of the second heat medium is sent to the operation control unit 35. During operation of the heat medium supplying device 3, the operation control unit 35 monitors the measured value of the temperature of the second heat medium sent from the second heat medium temperature measuring instrument 80, and determines whether or not the heat load on the heating device 8 has exceeded the heat load threshold value.

[0076] In this embodiment, the operation control unit 35 is configured to issue a command to the heating device 8 to switch the operation of the heating device 8 from rated heating operation to overload heating operation when the temperature of the second heat medium flowing through the heating side return pipe 19 falls below the heating temperature threshold value. The temperature of the second heat medium measured by the second heat medium temperature measuring device 80 reflects the heat load on the heating device 8. The heating temperature threshold value related to the temperature of the second heat medium corresponds to the heating load threshold value related to the heat load on the heating device 8.

[0077] The operation control unit 35 determines whether the heat load on the heating device 8 exceeds the heat load threshold value based on a comparison between the temperature of the second heat medium and the heating temperature threshold value. Therefore, the operation control unit 35 can issue a command to the heating device 8 based on the measured value of the temperature of the second heat medium to switch the operation of the heating device 8 from rated heating operation to overload heating operation. By performing the overload heating operation, the heating device 8 can increase the temperature of the second heat medium more quickly than in rated heating operation and reach the target heating temperature.

[0078] The determination of an increase in the heat load on heating device 8 may be based on a signal from semiconductor manufacturing equipment 1 or a signal from temperature control device 2, in addition to the temperature of the second heat medium. For example, operation control unit 35 receives a signal indicating a target processing temperature in semiconductor manufacturing equipment 1 from semiconductor manufacturing equipment 1, and when the target processing temperature in semiconductor manufacturing equipment 1 falls below a predetermined processing heating temperature threshold, issues a command to heating device 8 to switch the operation of heating device 8 from rated heating operation to overload heating operation.

[0079] Fig. 7 is a diagram showing an embodiment in which the embodiment described with reference to Fig. 1 and the embodiment described with reference to Fig. 4 are combined. Fig. 8 is a diagram showing an embodiment in which the embodiment described with reference to Fig. 3 and the embodiment described with reference to Fig. 6 are combined. The detailed configuration and operation shown in Fig. 7 are the same as those in the embodiment described with reference to Figs. 1 and 4, so duplicated explanations will be omitted. The detailed configuration and operation shown in Fig. 8 are the same as those in the embodiment described with reference to Figs. 3 and 6, so duplicated explanations will be omitted.

[0080] In the embodiment shown in Figures 7 and 8, the operation control unit 35 is configured to, when the thermal load on the cooling device 7 exceeds a cooling load threshold value, give a command to the cooling device 7 to switch the operation of the cooling device 7 from rated cooling operation to overload cooling operation, and when the thermal load on the heating device 8 exceeds a heating load threshold value, give a command to the heating device 8 to switch the operation of the heating device 8 from rated heating operation to overload heating operation.

[0081] According to the embodiment shown in Figures 7 and 8, when a temporary increase in heat load occurs, the cooling device 7 or the heating device 8 performs overload cooling operation or overload heating operation, thereby enabling the first heat medium or the second heat medium to quickly reach the target cooling temperature or the target heating temperature.

[0082] The above-described embodiments have been described for the purpose of enabling a person having ordinary skill in the art to practice the present invention. Various modifications of the above-described embodiments are naturally possible for a person skilled in the art, and the technical idea of ​​the present invention can be applied to other embodiments. Therefore, the present invention is not limited to the described embodiments, but is to be interpreted in the broadest scope according to the technical idea defined by the claims. [Explanation of symbols]

[0083] 1. Semiconductor manufacturing equipment 2 Temperature control device 3 Heat medium supply device 7 Cooling device 8 Heating device 11 Coolant transfer pipe 12 Heating medium transfer pipe 18 Cooling return pipe 19 Heating side return pipe 25 First Buffer Tank 26 Second Buffer Tank 30 Tank connecting pipe 31 Connecting valve 33 First Pump 34 Second Pump 35 Operation control unit 41 1st heat medium temperature measuring device 42 First heat medium bypass pipe 43 Second heat medium bypass pipe 44 First bypass flow control valve 45 Cooling side transfer flow control valve 46 Cooling side return flow control valve 47 Second bypass flow control valve 48 Heating side transfer flow control valve 49 Heating side return flow control valve 51 1st circulation circuit 52 Second circulation circuit 53 Third circulation circuit 56 1st heat exchanger 57 Second heat exchanger 61 First outlet channel 62 1st inlet channel 63 Second outlet channel 64 2nd inlet channel 67 Confluence 68 Distribution Channel 70 Three-way valve 71 First check valve 72 Second check valve 80 Second heat medium temperature measuring device

Claims

1. A heat medium supplying device for supplying a heat medium to a temperature control device that adjusts the temperature of a semiconductor manufacturing device, a cooling device that cools the first heat medium; A heating device that heats the second heat medium; a cooling medium transfer pipe that transfers the cooled first heat medium to the temperature control device; a heating medium transfer pipe that transfers the heated second heat medium to the temperature control device; a cooling-side return pipe for returning the first heat medium that has passed through the temperature control device to the cooling device; a heating side return pipe for returning the second heat medium that has passed through the temperature control device to the heating device; An operation control unit that controls the operation of the cooling device, The heat medium supply device is configured such that, when the thermal load on the cooling device exceeds a cooling load threshold, the operation control unit gives a command to the cooling device to switch the operation of the cooling device from rated cooling operation to overload cooling operation.

2. 2. The heat medium supply device according to claim 1, wherein the operation control unit is configured to give a command to the cooling device to switch the operation of the cooling device from the overload cooling operation to the rated cooling operation when a predetermined overload cooling operation permissible time has elapsed since the operation of the cooling device was switched from the overload cooling operation to the overload cooling operation.

3. 2. The heat medium supply device according to claim 1, wherein the operation control unit is configured to, when an abnormality is detected in the cooling device during overload cooling operation of the cooling device, give a command to the cooling device to switch the operation of the cooling device from overload cooling operation to rated cooling operation.

4. The heat medium supplying device according to claim 1 , wherein the first heat medium cooled by the cooling device and the second heat medium heated by the heating device are the same heat medium.

5. The heat medium supplying device according to claim 1 , wherein the first heat medium cooled by the cooling device and the second heat medium heated by the heating device are different heat media.

6. A heat medium supplying device for supplying a heat medium to a temperature control device that adjusts the temperature of a semiconductor manufacturing device, a cooling device that cools the first heat medium; A heating device that heats the second heat medium; a cooling medium transfer pipe that transfers the cooled first heat medium to the temperature control device; a heating medium transfer pipe that transfers the heated second heat medium to the temperature control device; a cooling-side return pipe for returning the first heat medium that has passed through the temperature control device to the cooling device; a heating side return pipe for returning the second heat medium that has passed through the temperature control device to the heating device; An operation control unit that controls the operation of the heating device, The operation control unit is configured to, when the thermal load on the heating device exceeds a heating load threshold, give a command to the heating device to switch the operation of the heating device from rated heating operation to overload heating operation.

7. The heat medium supply device according to claim 6, wherein the operation control unit is configured to give a command to the heating device to switch the operation of the heating device from overload heating operation to rated heating operation when a predetermined overload heating operation allowable time has elapsed since the operation of the heating device was switched from rated heating operation to overload heating operation.

8. The heat medium supply device according to claim 6, wherein the operation control unit is configured to, when an abnormality in the heating device is detected during an overload heating operation of the heating device, give a command to the heating device to switch the operation of the heating device from an overload heating operation to a rated heating operation.

9. The heat medium supplying device according to claim 6 , wherein the first heat medium cooled by the cooling device and the second heat medium heated by the heating device are the same heat medium.

10. The heat medium supplying device according to claim 6 , wherein the first heat medium cooled by the cooling device and the second heat medium heated by the heating device are different heat media.

11. A heat medium supplying device for supplying a heat medium to a temperature control device that adjusts the temperature of a semiconductor manufacturing device, a cooling device that cools the first heat medium; A heating device that heats the second heat medium; a cooling medium transfer pipe that transfers the cooled first heat medium to the temperature control device; a heating medium transfer pipe that transfers the heated second heat medium to the temperature control device; a cooling-side return pipe for returning the first heat medium that has passed through the temperature control device to the cooling device; a heating side return pipe for returning the second heat medium that has passed through the temperature control device to the heating device; An operation control unit that controls the operation of the cooling device and the heating device, The operation control unit is when the heat load on the cooling device exceeds a cooling load threshold, a command is given to the cooling device to switch the operation of the cooling device from rated cooling operation to overload cooling operation; A heat medium supplying device configured to, when a heat load on the heating device exceeds a heat load threshold, issue a command to the heating device to switch operation of the heating device from rated heating operation to overload heating operation.

12. The operation control unit is when a predetermined overload cooling operation allowable time has elapsed since the operation of the cooling device was switched from the rated cooling operation to the overload cooling operation, a command is given to the cooling device to switch the operation of the cooling device from the overload cooling operation to the rated cooling operation; The heat medium supply device according to claim 11, configured to give a command to the heating device to switch the operation of the heating device from overload heating operation to rated heating operation when a predetermined overload heating operation allowable time has elapsed since the operation of the heating device was switched from rated heating operation to overload heating operation.

13. The operation control unit is if an abnormality in the cooling device is detected during an overload cooling operation of the cooling device, a command is given to the cooling device to switch the operation of the cooling device from the overload cooling operation to a rated cooling operation; The heat medium supply device according to claim 11, configured to, when an abnormality in the heating device is detected during an overload heating operation of the heating device, give a command to the heating device to switch the operation of the heating device from an overload heating operation to a rated heating operation.

14. The heat medium supplying device according to claim 11 , wherein the first heat medium cooled by the cooling device and the second heat medium heated by the heating device are the same heat medium.

15. The heat medium supplying device according to claim 11 , wherein the first heat medium cooled by the cooling device and the second heat medium heated by the heating device are different heat media.

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