Double-track die bonding equipment and die bonding method

Abstract

The invention relates to the technical field of semiconductor mounting equipment, in particular to double-track die bonding equipment and a die bonding method. The double-track die bonding equipment comprises a bearing table, the bearing table is provided with a mounting area, a glue dipping area and a feeding area, and the glue dipping area and the feeding area are arranged adjacently and are adjacent to the same side of the mounting area; the mobile die bonding table assembly and the mobile transfer table assembly are arranged on the bearing table, the mobile die bonding table assembly comprises a first track, a second track, a first die bonding table and a second die bonding table, the first die bonding table is in sliding connection with the first track, and the second die bonding table is in sliding connection with the second track; the first track and the second track respectively extend from the glue dipping area to the mounting area. By introducing the design of the double die bonding tables which work alternately, glue dipping is only carried out on a partial area of the substrate each time, and chip mounting is immediately carried out on the partial area, so that the mounting quality and efficiency are ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor mounting equipment, and particularly relates to a dual-track die bonding equipment and a die bonding method. Background Art

[0002] In the field of semiconductor mounting equipment, the die bonding process is a process of bonding chips to specific positions on a substrate. Traditional methods usually involve dipping the entire substrate in glue at one time and then performing chip mounting. However, for substrates that require mounting a large number of chips, this traditional approach has significant defect problems: Since the time interval between dipping the glue and completing the mounting of all chips may be very long, this may cause some glue to start to solidify during the waiting period, thus affecting the mounting quality and efficiency. Summary of the Invention

[0003] In order to solve the problem that the existing die bonding equipment cannot meet the requirement of mounting a large number of chips on the same substrate, the present invention provides a dual-track die bonding equipment and a die bonding method.

[0004] To solve the above technical problems, the present invention provides the following technical solution: A dual-track die bonding equipment, including a carrying platform, on which there are a mounting area, a glue dipping area and a loading area. The glue dipping area and the loading area are adjacent and adjacent to the same side of the mounting area; it also includes a moving die bonding platform assembly and a moving transfer platform assembly provided on the carrying platform. The moving die bonding platform assembly includes a first track, a second track, a first die bonding platform and a second die bonding platform. The first die bonding platform is slidably connected to the first track, and the second die bonding platform is slidably connected to the second track. The first track and the second track respectively extend from the glue dipping area to the mounting area; in the working state, the first die bonding platform and the second die bonding platform work alternately in the mounting area and the glue dipping area; the moving transfer platform assembly includes a third track and a first transfer platform that are slidably connected. The third track extends from the loading area to the mounting area, and the first transfer platform moves back and forth between the loading area and the mounting area through the third track.

[0005] Preferably, a first robotic arm assembly, a first material platform assembly and a glue dipping platform assembly are further provided in the glue dipping area, and the first robotic arm assembly can move within the glue dipping area; the first robotic arm assembly transports materials between the first material platform assembly and the moving die bonding platform assembly, or performs glue dipping operations between the glue dipping platform assembly and the moving die bonding platform assembly; a second robotic arm assembly and a second material platform assembly are provided in the loading area. When the first transfer platform is in the loading area, the second robotic arm assembly transports materials between the second material platform assembly and the first transfer platform.

[0006] Preferably, the first track, the second track, and the third track are spaced apart and arranged in parallel, and the first track and the second track are located on one side of the glue dipping area close to the feeding area, and the third track is located on one side of the feeding area close to the glue dipping area.

[0007] Preferably, a first upward vision module is provided in the feeding area, and a second upward vision module is provided in the mounting area. The first upward vision module is located between the second material table assembly and the third track, and the second upward vision module is located between the third track and the moving die bonding table assembly. The shooting accuracy of the second upward vision module is higher than that of the first upward vision module.

[0008] Preferably, a first nozzle holder assembly is further provided in the mounting area. The first nozzle holder assembly is located at the end of the third track and straddles the upper part of the third track.

[0009] Preferably, a third material table assembly and a second transfer table are further provided in the mounting area. The third material table assembly and the second transfer table are respectively arranged on both sides of the third track. The second transfer table is located between the third track and the moving die bonding table assembly, and the second transfer table is arranged close to the second upward vision module.

[0010] Preferably, a standard positioning member is further provided in the mounting area. A positioning point is provided on the top surface of the standard positioning member. The standard positioning member is arranged between the third track and the moving die bonding table assembly.

[0011] Preferably, a gantry assembly is provided in the mounting area. The gantry assembly includes support columns located on two opposite sides of the mounting area and a cross beam guide slidably arranged between the two support columns. A main binding head assembly is arranged on the cross beam guide, and a first nozzle and a first downward vision module are arranged on the main binding head assembly.

[0012] Preferably, an expansion component is further provided on the main binding head, and at least one expansion module is arranged on the expansion component; the expansion module includes a sub-binding head or a dispensing component.

[0013] To solve the above technical problems, the present invention provides another technical solution as follows: A die bonding method, applied to the double-track die bonding equipment as described above, the method comprising: in the glue dipping area, dipping glue on the substrate placed on the first die bonding table / second die bonding table, dipping glue only on a partial area of the substrate each time, and transporting the substrate with glue dipping completed to the mounting area; in the loading area, transporting the chips to the first transfer table, and moving the first transfer table to the mounting area through the third track; in the mounting area, mounting the chips on the first transfer table onto the substrate at the first die bonding table / second die bonding table to complete the chip mounting; when one of the first die bonding table and the second die bonding table is located in the mounting area / glue dipping area, the other is correspondingly located in the glue dipping area / mounting area, and the glue dipping operation and the chip mounting operation are synchronously performed on the first die bonding table and the second die bonding table respectively; each substrate reciprocates between the mounting area and the glue dipping area through the moving die bonding table assembly, and at least two rounds of glue dipping and chip mounting are completed.

[0014] Compared with the prior art, the double-track die bonding equipment and the die bonding method provided by the present invention have the following beneficial effects: 1. The double-track die bonding equipment provided in the embodiment of the present invention aims to solve the problem of glue solidification in the traditional die bonding process. By introducing the design of double die bonding tables working alternately, only a partial area of the substrate is dipped with glue each time, and the chip mounting is immediately performed on this partial area, thus ensuring the quality and efficiency of the mounting; specifically, the carrier table is the main body for the modules or components of the carrier table; three major areas of mounting, glue dipping, and loading are set on the carrier table. The close arrangement of the functional areas simplifies the material transmission path, and the three areas are adjacent to each other, that is, the three do not overlap. While independently completing the corresponding mounting, glue dipping, and loading operations respectively, the material transportation is completed through the moving die bonding table assembly and the moving transfer table assembly. Each area focuses on a single task, avoiding mutual interference between different processes; by allowing the two die bonding tables to slide alternately on the two tracks, they can work alternately between the glue dipping area and the mounting area, that is, when one die bonding table is working in the glue dipping area, the other die bonding table is working in the mounting area, and after the work is completed, the working areas are exchanged through the corresponding tracks. This design enables the chip mounting to be immediately performed after only partial glue dipping, shortening the time interval from glue dipping to mounting, and the alternate operation design also ensures that the glue dipping area and the mounting area can operate simultaneously, without wasting productivity due to waiting in vain.

[0015] 2. In the embodiments of the present invention, a first robotic arm assembly and a second robotic arm assembly that can operate independently are respectively arranged in the glue dipping area and the loading area. Both are separated in terms of area and execution module, enabling the glue dipping and loading operations to be carried out synchronously without interference; this avoids potential problems caused by the crossover between different processes, such as material confusion or operation conflicts; the first robotic arm assembly and the second robotic arm assembly are respectively responsible for the glue dipping and loading operations, and they can move freely within their respective areas without being affected by each other. This design of independent control enables each robotic arm to focus on its own task, improving the operation accuracy and response speed; since the glue dipping and loading operations can be carried out simultaneously, the entire die bonding process realizes parallel processing, and the loading operation will not be delayed due to the glue dipping operation, and vice versa; this means that the chip can be ready to enter the mounting link at any time, and the substrate can also be timely subjected to glue dipping treatment, thereby reducing unnecessary waiting time; this not only speeds up the production speed but also enables the equipment to complete more tasks in a shorter time.

[0016] 3. In the embodiments of the present invention, a certain distance is maintained between each track, avoiding mutual interference between the moving components on different tracks and ensuring the independence and high efficiency of each process; the parallel tracks make the path planning of the robotic arm and other transportation tools simpler, reducing the complexity and improving the operation efficiency; at the same time, the three guide rails are parallel and are respectively arranged close to the corresponding areas, enabling the distance for moving the chip onto the chip to be shorter during the mounting process. A shorter moving distance means that the robotic arm or transportation tool can respond to the operation instructions faster, reducing the waiting time and periodic delay; at the same time, the shorter moving distance reduces the position deviation that may be caused by long-distance handling, thereby improving the mounting accuracy. Especially in the semiconductor manufacturing process with high-precision requirements, this is particularly important.

[0017] 4. In the embodiments of the present invention, by setting a first top view module and a second top view module to calibrate the chip twice during the loading and mounting processes of the chip, it is ensured that each chip can be accurately bonded to the substrate with high precision; specifically, the first top view module is mainly used for taking pictures when the chip is transferred from the second material table assembly to the first transfer table on the third track to ensure the correct basic orientation of the chip, which is suitable for initially adjusting the position of the chip. The second top view module is used for taking high-precision pictures before the chip is about to be mounted on the substrate to ensure the final position of the chip is accurate; due to its higher shooting accuracy, it can capture more subtle position deviations, thereby realizing more delicate adjustments; by first using the low-precision first top view module for rough calibration and then using the high-precision second top view module for fine calibration, the process of gradually optimizing the chip position is realized. This step-by-step calibration method not only improves the calibration accuracy but also saves time and avoids the complexity and cost increase brought by one-time high-precision calibration.

[0018] 5. In the embodiment of the present invention, the first nozzle holder assembly can be equipped with different types of nozzles, which facilitates the head to replace the nozzles to adapt to chips of various sizes and shapes, enhancing the versatility and flexibility of the device. The first nozzle holder assembly is placed at the end of the third track and spans above it, making full use of the vertical space and avoiding occupying additional horizontal area, thus making the layout of the entire device more compact. When the nozzle model needs to be replaced, since the first nozzle holder assembly is already located at the end of the third track, it can be immediately moved to the position of the first transfer station after replacement without additional long-distance movement, significantly shortening the preparation time. Even in the case of frequent nozzle model replacement, due to the short distance between the first nozzle holder assembly and the first transfer station, it is still possible to ensure that the first pick-up operation after each replacement can be completed quickly and accurately, ensuring the accuracy of chip mounting.

[0019] 6. In the embodiment of the present invention, the third material stage assembly serves as a storage and supply point for various types of chips, providing a stable and sufficient supply of raw materials for the entire mounting process. It can support chips of different specifications and quantities, adapting to diverse production requirements. It is separated from the second transfer station on both sides of the third track, avoiding the intersection of the material transfer path and minimizing the distance between the first transfer station and the second transfer station to the moving die bonding table assembly as much as possible. Since it is close to the second upper vision module, the second transfer station can be precisely calibrated under high-precision imaging, ensuring that the chips are in the best position before entering the mounting step, improving the success rate and quality of mounting.

[0020] 7. In the embodiment of the present invention, the positioning point serves as the calibration positioning point for the main bonding head, providing an accurate reference position. Through the positioning point on the standard positioning part, high-precision calibration of the main bonding head and other related components can be achieved, ensuring that each chip can be accurately bonded to the designated position on the substrate, greatly improving the quality and reliability of mounting. The standard positioning part is located between two key components, making full use of the space in the mounting area and avoiding occupying other positions additionally, making the layout of the entire device more compact and reasonable.

[0021] 8. In the embodiments of the present invention, the support columns provide a stable foundation for the entire gantry assembly, ensuring its stability during operation and reducing vibrations caused by mechanical movement or external factors; the crossbeam guide rails can slide along the support columns, enabling the main bonding head assembly to move freely within the mounting area, covering a larger working area and adapting to the mounting requirements of substrates and chips of different specifications and positions; the main bonding head assembly can slide on the crossbeam guide rails, achieving flexible movement within the mounting area and being able to quickly reach any required position for mounting operations. The first suction nozzle is used to accurately grasp and place the chips, ensuring that each chip can be precisely bonded to the designated position on the substrate. The first downward vision module can capture the positions of the chips and the substrate in real time during the mounting process, ensuring that the chips are in the optimal position before each mounting and preventing misalignment or offset; through the stable support provided by the gantry assembly and the high-precision vision detection of the first downward vision module, the accuracy and consistency of each mounting operation are ensured, greatly improving the quality and reliability of the mounting.

[0022] 9. In the embodiments of the present invention, the expansion components provide physical space and interfaces for adding additional components, enabling the device to be flexibly configured according to actual production requirements and enhancing the versatility and adaptability of the system; the expansion module is mainly used to achieve multi-chip mounting, capable of grasping multiple chips at one time and accurately placing them at the designated positions on the substrate, significantly improving the mounting efficiency; since multiple suction nozzle modules can be used simultaneously, the need for frequent suction nozzle replacement is reduced, saving time and costs and improving the overall working efficiency.

[0023] 10. The embodiments of the present invention also provide a die bonding method, which is applied to the above die bonding equipment, and thus also has the same beneficial effects as the above die bonding equipment, which will not be elaborated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is a layout schematic diagram of the double-track die bonding equipment provided by the first embodiment of the present invention.

[0025] Figure 2 is a schematic diagram of the moving transfer table assembly in the double-track die bonding equipment provided by the first embodiment of the present invention Figure 1 .

[0026] Figure 3 is a schematic diagram of the moving transfer table assembly in the double-track die bonding equipment provided by the first embodiment of the present invention Figure 2 .

[0027] Figure 4 is a structural schematic diagram of a partial structure of the moving die bonding table assembly in the double-track die bonding equipment provided by the first embodiment of the present invention.

[0028] Figure 5 is a layout schematic diagram of the glue dipping area in the double-track die bonding equipment provided by the first embodiment of the present invention.

[0029] Figure 6 It is a layout schematic diagram of the loading area in the double-track die bonding equipment provided by the first embodiment of the present invention.

[0030] Figure 7 It is a layout schematic diagram of the mounting area in the double-track die bonding equipment provided by the first embodiment of the present invention.

[0031] Figure 8 It is a schematic diagram of the gantry component in the double-track die bonding equipment provided by the first embodiment of the present invention.

[0032] Explanation of the attached drawing reference numerals: 100, double-track die bonding equipment; 1, carrier table; 11, mounting area; 111, gantry component; 1111, support column; 1112, crossbeam guide rail; 1113, main bonding head component; 1114, first suction nozzle; 1115, first lower vision module; 1116, expansion component; 1117, expansion module; 112, second upper vision module; 113, first suction nozzle holder component; 114, third material table component; 115, second transfer table; 116, standard positioning part; 12, dipping area; 121, first robotic arm component; 122, first material table component; 123, dipping table component; 13, loading area; 131, second robotic arm component; 132, second material table component; 133, first upper vision module; 2, moving die bonding table component; 21, first track; 211, linear motor; 212, drag chain; 22, second track; 23, first die bonding table; 24, second die bonding table; 3, moving transfer table component; 31, third track; 32, first transfer table. Detailed implementation manners

[0033] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the attached drawings and implementation examples. It should be understood that the specific implementation examples described herein are only used to explain the present invention and are not used to limit the present invention.

[0034] In the embodiments provided by the present invention, it should be understood that "B corresponding to A" means that B is associated with A, and B can be determined according to A. However, it should also be understood that determining B according to A does not mean determining B only according to A, and B can also be determined according to A and / or other information.

[0035] It should be understood that the "one embodiment" or "an embodiment" mentioned throughout the specification means that the specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present invention. Therefore, the "in one embodiment" or "in an embodiment" that appears throughout the specification does not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. Those skilled in the art should also be aware that the embodiments described in the specification are all optional embodiments, and the actions and modules involved are not necessarily essential to the present invention.

[0036] In various embodiments of the present invention, it should be understood that the magnitudes of the serial numbers of the above processes do not necessarily mean the inevitable sequence of execution. The execution sequence of each process should be determined by its function and internal logic, and should not constitute any limitation to the implementation process of the embodiments of the present invention.

[0037] In the flowcharts and block diagrams in the drawings of the present invention, the possible architectures, functions and operations of systems, methods and computer program products according to various embodiments of the present application are illustrated. In this regard, each block in the flowchart or block diagram may represent a module, a program segment, or a part of code, and this module, program segment, or part of code contains one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may also occur in a different order from that marked in the drawings. For example, two consecutively represented blocks may actually be executed substantially in parallel, and they may sometimes be executed in the reverse order, which is determined based on the functions involved. It should be particularly noted that each block in the block diagram and / or flowchart, and the combination of blocks in the block diagram and / or flowchart, can be implemented by a dedicated hardware-based system for performing the specified functions or operations, or can be implemented by a combination of dedicated hardware and computer instructions.

[0038] In semiconductor packaging and assembly processes, die bonding is a widely used chip mounting method, which generally refers to the process of using an adhesive to fix a bare chip to a carrier.

[0039] Please refer to Figures 1 to 3 , the first embodiment of the present invention provides a dual-track die bonder 100, including a carrier 1, on which there are a mounting area 11, a glue dipping area 12 and a loading area 13. The glue dipping area 12 and the loading area 13 are adjacent and adjacent to the same side of the mounting area 11; The dual-rail die bonding equipment 100 further includes a moving die bonding stage assembly 2 and a moving transfer stage assembly 3 disposed on the carrying stage 1. The moving die bonding stage assembly 2 includes a first track 21, a second track 22, a first die bonding stage 23 and a second die bonding stage 24. The first die bonding stage 23 is slidably connected to the first track 21, and the second die bonding stage 24 is slidably connected to the second track 22. The first track 21 and the second track 22 extend from the glue dipping area 12 to the mounting area 11. In the working state, the first die bonding stage 23 and the second die bonding stage 24 work alternately within the mounting area 11 and the glue dipping area 12. The moving transfer stage assembly 3 includes a third track 31 and a first transfer stage 32 that are slidably connected. The third track 31 extends from the loading area 13 to the mounting area 11, and the first transfer stage 32 moves back and forth between the loading area 13 and the mounting area 11 through the third track 31.

[0040] It can be understood that a dual-rail die bonding equipment 100 provided by an embodiment of the present invention aims to solve the problem of glue solidification in the traditional die bonding process. By introducing the design of dual die bonding stages working alternately, only a partial area of the substrate is dipped with glue each time, and the chip mounting is immediately performed on this partial area, thereby ensuring the quality and efficiency of the mounting. Specifically, the carrying stage 1 serves as the main body for carrying other modules or components. Three major areas, namely mounting, glue dipping, and loading, are provided on the carrying stage 1. The close arrangement of the functional areas simplifies the material transfer path, and the three areas are adjacent to each other, that is, they do not overlap. While each independently completes the corresponding mounting, glue dipping, and loading operations, the material transportation is completed through the moving die bonding stage assembly 2 and the moving transfer stage assembly 3. Each area focuses on a single task, avoiding mutual interference between different processes. By allowing the two die bonding stages to slide alternately on the two tracks, they can work alternately between the glue dipping area 12 and the mounting area 11. That is, when one die bonding stage is working in the glue dipping area 12, the other die bonding stage is working in the mounting area 11. After the work is completed, the working areas are exchanged through the corresponding tracks. This design enables the mounting to be immediately performed after only partial glue dipping each time, shortening the time interval from glue dipping to mounting. Moreover, the alternate operation design also ensures that the glue dipping area 12 and the mounting area 11 can operate simultaneously, without wasting productivity due to idle waiting.

[0041] Please continue to refer to Figure 1, as an implementation, the overall arrangement of the mounting area 11, the glue dipping area 12, and the loading area 13 is generally rectangular. From a top-down perspective, the mounting area 11 is located in the middle and upper regions of the carrier 1, the glue dipping area 12 is located in the lower left region of the carrier 1, and the loading area 13 is located in the lower right region of the carrier 1. Moreover, the three areas are each roughly rectangular; that is, the positions of the three areas are arranged in a triangular pattern, and the outer border of the overall arrangement is rectangular. It can be understood that the rectangular arrangement makes full use of the available area of the carrier 1, ensuring that each functional area can be arranged compactly and orderly, making the overall layout more concise and orderly.

[0042] Please refer to Figure 2 and Figure 3 , the first die bonding table 23 can slide on the first track 21, the second die bonding table 24 can slide on the second track 22, and the sliding of the first die bonding table 23 and the second die bonding table 24 is controlled separately. When in the working state, if the first die bonding table 23 is located at one end of the first track 21 close to the glue dipping area 12, then the second die bonding table 24 is located at one end of the second track 22 close to the mounting area 11, and vice versa.

[0043] Please refer to Figure 4 , the movable die bonding table assembly 2 further includes a linear motor 211 provided on the first track 21 for driving the first die bonding table 23 to move on the first track 21; the movable die bonding table assembly 2 further includes a cable carrier 212 disposed close to the first track 21 for accommodating the working cables of the first die bonding table 23, and the cable carrier 212 is parallel to the first track 21.

[0044] It can be understood that the linear motor 211 provides high-precision position control capabilities, capable of accurately moving the first die bonding table 23 to the specified position, ensuring the consistency and accuracy of each operation; the cable carrier 212 provides physical protection for the working cables of the first die bonding table 23, preventing the cables from being damaged due to frequent movement and extending the service life of the cables; the cable carrier 212 is arranged parallel to the first track 21, ensuring that the cables move synchronously with the die bonding table, reducing potential conflicts between the cables and other components, and avoiding interference during the operation; through the smooth movement driven by the linear motor 211 and the protection of the cables by the cable carrier 212, the influence of mechanical vibration and other external factors is reduced, further ensuring the stability of the system and the mounting quality.

[0045] Please refer to Figure 5 and Figure 6, as an implementation, a first robotic arm assembly 121, a first material table assembly 122, and a dipping table assembly 123 are further provided within the dipping area 12. The first robotic arm assembly 121 can move within the dipping area 12; the first robotic arm assembly 121 transports materials between the first material table assembly 122 and the moving die bonding table assembly 2, or performs dipping operations between the dipping table assembly 123 and the moving die bonding table assembly 2; a second robotic arm assembly 131 and a second material table assembly 132 are provided within the loading area 13. When the first transfer table 32 is located within the loading area 13, the second robotic arm assembly 131 transports materials between the second material table assembly 132 and the first transfer table 32.

[0046] It can be understood that in the embodiments of the present invention, the first robotic arm assembly 121 and the second robotic arm assembly 131 that can operate independently are respectively provided within the dipping area 12 and the loading area 13. They are separated both in terms of area and execution module, enabling the dipping and loading operations to be carried out synchronously without interference; avoiding potential problems caused by the intersection between different processes, such as material confusion or operation conflicts; the first robotic arm assembly 121 and the second robotic arm assembly 131 are respectively responsible for the dipping and loading operations, and they can move freely within their respective areas without being affected by each other. This design of independent control enables each robotic arm to focus on its own task, improving the operation accuracy and response speed; since the dipping and loading operations can be carried out simultaneously, the entire die bonding process realizes parallel processing, and the loading operation will not be delayed due to the dipping operation, and vice versa; this means that the chip can be ready to enter the mounting link at any time, and the substrate can also be dipped in time, thereby reducing unnecessary waiting time; this not only speeds up the production speed but also enables the equipment to complete more tasks in a shorter time.

[0047] Please continue to refer to Figure 5 , as an implementation, the first material table assembly 122 and the dipping table assembly 123 are respectively arranged on opposite sides of the moving die bonding table assembly 2, that is, the portions of the first track 21 and the second track 22 within the dipping area 12 are located between the first material table assembly 122 and the dipping table assembly 123. It can be understood that this design enables both the first material table assembly 122 and the dipping table assembly 123 to be as close as possible to the moving die bonding table assembly 2, reducing the response time for material preparation and dipping operations and improving the overall working efficiency.

[0048] Please combine with Figure 1 、 Figure 5 and Figure 6, as an implementation manner, the first track 21, the second track 22 and the third track 31 are spaced apart and arranged in parallel, and the first track 21 and the second track 22 are located on one side of the glue dipping area 12 close to the feeding area 13, and the third track 31 is located on one side of the feeding area 13 close to the glue dipping area 12.

[0049] It can be understood that in the embodiments of the present invention, a certain distance is maintained between the tracks, which avoids the mutual interference between the moving components on different tracks, ensuring the independence and high efficiency of each process; the parallel tracks make the path planning of the robotic arm and other transportation tools simpler, reducing the complexity and improving the operation efficiency; at the same time, the parallel arrangement of the three guide rails and their proximity to the corresponding areas respectively enable the distance for moving the chip onto the chip to be shorter during the chip mounting process. A shorter moving distance means that the robotic arm or transportation tool can respond to operation instructions faster, reducing the waiting time and periodic delay; at the same time, the shorter moving distance reduces the positional deviation that may be caused by long-distance handling, thereby improving the accuracy of chip mounting. This is particularly important in the semiconductor manufacturing process with high-precision requirements.

[0050] Please combine Figure 6 and Figure 7 , as an implementation manner, a first top view module 133 is provided in the feeding area 13, and a second top view module 112 is provided in the chip mounting area 11. The first top view module 133 is located between the second material table assembly 132 and the third track 31, and the second top view module 112 is located between the third track 31 and the moving die bonding table assembly 2. The shooting accuracy of the second top view module 112 is higher than that of the first top view module 133.

[0051] It can be understood that in the embodiments of the present invention, the first top view module 133 and the second top view module 112 are provided to calibrate the chip twice during the feeding and mounting processes of the chip, ensuring that each chip can be accurately bonded to the substrate with high precision; specifically, the first top view module 133 is mainly used to take pictures when the chip is transferred from the second material table assembly 132 to the first transfer table 32 on the third track 31, ensuring the correct basic orientation of the chip and being suitable for initially adjusting the position of the chip. The second top view module 112 is used to take high-precision pictures before the chip is about to be mounted on the substrate, ensuring the accuracy of the final position of the chip; due to its higher shooting accuracy, it can capture more subtle position deviations, thereby achieving more precise adjustment; by first using the low-precision first top view module 133 for rough calibration and then using the high-precision second top view module 112 for fine calibration, the process of gradually optimizing the chip position is realized. This step-by-step calibration method not only improves the accuracy of calibration, but also saves time and avoids the complexity and cost increase brought by one-time high-precision calibration.

[0052] As an implementation manner, both the first upward vision module 133 and the second upward vision module 112 are upward vision CCD (Charge Coupled Device) modules; a CCD is a semiconductor device that can convert an optical image into a digital signal to implement operations such as image acquisition, storage, and transmission processing.

[0053] Please continue to refer to Figure 7 , as an implementation manner, a first nozzle holder assembly 113 is further provided in the mounting area 11. The first nozzle holder assembly 113 is located at the end of the third track 31 and straddles above the third track 31.

[0054] It can be understood that in the embodiment of the present invention, the first nozzle holder assembly 113 can be equipped with different types of nozzles, which is convenient for the bonding head to replace the nozzles to adapt to chips of various sizes and shapes, enhancing the versatility and flexibility of the device; placing the first nozzle holder assembly 113 at the end of the third track 31 and straddling above it makes full use of the vertical space, avoiding occupying additional horizontal area and making the layout of the entire device more compact; when it is necessary to replace the nozzle model, since the first nozzle holder assembly 113 is already located at the end of the third track 31, it can be immediately moved to the position of the first transfer station 32 after replacement, without the need for additional long-distance movement, significantly shortening the preparation time; even in the case of frequent replacement of the nozzle model, due to the short distance between the first nozzle holder assembly 113 and the first transfer station 32, it can still ensure that the first suction operation after each replacement can be completed quickly and accurately, ensuring the accuracy of chip mounting.

[0055] As an implementation manner, the horizontal height of the first nozzle holder assembly 113 is higher than the horizontal height of the first transfer station 32. It can be understood that the higher nozzle holder assembly ensures that it will not physically contact or collide with the first transfer station 32 during operation. Especially when the nozzle holder assembly moves, grabs, and places chips, it provides sufficient vertical space to avoid potential operation interference.

[0056] As an implementation manner, a third material platform assembly 114 and a second transfer station 115 are further provided in the mounting area 11. The third material platform assembly 114 and the second transfer station 115 are respectively arranged on both sides of the third track 31. The second transfer station 115 is located between the third track 31 and the moving die bonding platform assembly 2, and the second transfer station 115 is arranged close to the second upward vision module 112.

[0057] It can be understood that in the embodiments of the present invention, the third material stage assembly 114 serves as a storage and supply point for various types of chips, providing a stable and sufficient supply of raw materials for the entire chip mounting process. It can support chips of different specifications and quantities, adapting to diverse production requirements. The third material stage assembly 114 and the second transfer stage 115 are respectively arranged on both sides of the third track 31, avoiding the intersection of the material transfer paths and minimizing the distances between the first transfer stage 32 and the second transfer stage 115 and the mobile die bonding stage assembly 2; due to being close to the second top view module 112, the second transfer stage 115 can be precisely calibrated under high-precision imaging, ensuring that the chips are in the optimal position before entering the chip mounting step, thereby improving the success rate and quality of chip mounting.

[0058] As an implementation manner, a standard positioning member 116 is further provided in the chip mounting area 11. The top surface of the standard positioning member 116 is provided with positioning points, and the standard positioning member 116 is arranged between the third track 31 and the mobile die bonding stage assembly 2.

[0059] It can be understood that in the embodiments of the present invention, the positioning points serve as the calibration positioning points for the main bonding head, providing accurate reference positions. Through the positioning points on the standard positioning member 116, high-precision calibration of the main bonding head and other related components can be achieved, ensuring that each chip can be accurately bonded to the designated position on the substrate, greatly improving the quality and reliability of chip mounting; the standard positioning member 116 is located between two key components, making full use of the space in the chip mounting area 11 and avoiding occupying other positions additionally, making the overall equipment layout more compact and reasonable.

[0060] Please refer to Figure 7 and Figure 8 As an implementation manner, a gantry component 111 is provided in the chip mounting area 11. The gantry component 111 includes support columns 1111 located on two opposite sides of the chip mounting area 11 and a crossbeam guide rail 1112 slidably arranged between the two support columns 1111. A main bonding head component 1113 is arranged on the crossbeam guide rail 1112, and a first suction nozzle 1114 and a first bottom view module 1115 are arranged on the main bonding head component 1113.

[0061] It can be understood that in the embodiments of the present invention, the support column 1111 provides a stable foundation for the entire gantry assembly 111, ensuring its stability during operation and reducing vibrations caused by mechanical movements or external factors; the crossbeam guide rail 1112 can slide along the support column 1111, enabling the main bonding head assembly 1113 to freely move within the mounting area 11, covering a larger working area and adapting to the mounting requirements of substrates and chips of different specifications and positions; the main bonding head assembly 1113 can slide on the crossbeam guide rail 1112, achieving flexible movement within the mounting area 11 and being able to quickly reach any required position for mounting operations. The first suction nozzle 1114 is used to accurately grasp and place the chips, ensuring that each chip can be precisely bonded to the designated position on the substrate. The first lower vision module 1115 can capture the positions of the chips and the substrate in real time during the mounting process, ensuring that the chips are in the optimal position before each mounting and preventing misalignment or deviation; through the stable support provided by the gantry assembly 111 and the high-precision vision detection of the first lower vision module 1115, the accuracy and consistency of each mounting operation are ensured, greatly improving the quality and reliability of the mounting.

[0062] As an implementation manner, an expansion component 1116 is further provided on the main bonding head, and at least one expansion module 1117 is provided on the expansion component 1116.

[0063] It can be understood that in the embodiments of the present invention, the expansion component 1116 provides physical space and interfaces for adding additional components, enabling the device to be flexibly configured according to actual production requirements and enhancing the versatility and adaptability of the system; the expansion module 1117 is mainly used to implement multi-chip mounting, capable of grasping multiple chips at one time and accurately placing them at the designated positions on the substrate, significantly improving the mounting efficiency; since multiple suction nozzle modules can be used simultaneously, the need for frequent suction nozzle replacement is reduced, saving time and costs and improving the overall working efficiency.

[0064] As an implementation manner, the expansion module 1117 includes a secondary bonding head or a dispensing component. It can be understood that the secondary bonding head is mainly used to achieve multi-chip synchronous mounting, capable of grasping multiple chips at one time and accurately placing them at the designated positions on the substrate, significantly improving the mounting efficiency; according to the requirements of chips of different specifications and shapes, different types of secondary bonding heads can be equipped, enhancing the device's support ability for various chip processing tasks; since multiple bonding heads can be used simultaneously, the need for frequent suction nozzle replacement is reduced, saving time and costs and improving the overall working efficiency. The dispensing component can precisely control the amount of glue dipped each time, ensuring the appropriate amount of glue required for each mounting and avoiding problems caused by too much or too little glue; the presence of the dispensing component makes the glue dipping operation more concentrated and efficient, reducing the time interval from glue dipping to mounting and further improving the production efficiency.

[0065] As an implementation manner, by arranging a plurality of secondary bonding heads, the expansion module 1117 can transfer a plurality of chips from the first transfer station 32 to the second transfer station 115 at one time, and then let the main bonding head assembly 1113 perform the bonding work between the second transfer station 115 and the eutectic stage. At this time, the empty first transfer station 32 can return to the loading area 13 in advance for the next round of loading.

[0066] The second embodiment of the present invention provides a die bonding method, which is applied to the double-track die bonding device 100 as described above. The method includes: In the glue dipping area 12, dip glue on the substrate placed on the first die bonding stage 23 / second die bonding stage 24. Each time, only dip glue on a partial area of the substrate, and transport the substrate with glue dipping completed to the bonding area 11. In the loading area 13, transport the chips to the first transfer station 32, and move the first transfer station 32 to the bonding area 11 through the third track 31. In the bonding area 11, bond the chips on the first transfer station 32 to the substrate at the first die bonding stage 23 / second die bonding stage 24 to complete the chip bonding. When one of the first die bonding stage 23 and the second die bonding stage 24 is located in the bonding area 11 / glue dipping area 12, the other is correspondingly located in the glue dipping area 12 / bonding area 11, and the glue dipping operation and the chip bonding operation are synchronously performed on the first die bonding stage 23 and the second die bonding stage 24 respectively. Each substrate reciprocates in the bonding area 11 and the glue dipping area 12 through the moving die bonding stage assembly 2, and at least completes two rounds of glue dipping and chip bonding.

[0067] It can be understood that the die bonding method provided by the method embodiment is applied to the above die bonding device, so it also has the same beneficial effects as the above die bonding device, which will not be elaborated here.

[0068] As an implementation manner, in the bonding area 11, the chips on the first transfer station 32 can be transferred to the second transfer station 115, and then the chips on the second transfer station 115 are in the bonding area 11.

[0069] Please combine Figures 1 to 8 , the working process / principle of the double-track die bonding device 100 provided in the embodiment of the present invention is briefly described as follows: The double-track die bonding device 100 mainly consists of the following key parts: The carrier stage 1: As the basic platform of the entire device, the carrier stage 1 is provided with a bonding area 11, a glue dipping area 12, and a loading area 13. The moving die bonding stage assembly 2: Includes a first track 21, a second track 22, a first die bonding stage 23, and a second die bonding stage 24, and is used for alternately working between the glue dipping area 12 and the bonding area 11. Moving transfer station assembly 3: It includes a third track 31 and a first transfer station 32, and is used to transport chips between the loading area 13 and the mounting area 11; Robotic arm assembly: A first robotic arm assembly 121 is provided in the glue dipping area 12, which is responsible for material transportation and glue dipping operations; A second robotic arm assembly 131 is provided in the loading area 13, which is responsible for transporting the chips from the second material table assembly 132 to the first transfer station 32; Vision module: A first top vision module 133 is provided in the loading area 13, and a high-precision second top vision module 112 is provided in the mounting area 11, which is used to calibrate the chip position; Nozzle holder assembly: It is located above the end of the third track 31 and is equipped with different types of nozzles for grasping and placing chips; Gantry assembly 111: It includes a support column 1111, a crossbeam guide rail 1112 and a main binding head assembly 1113, and is used to achieve high-precision chip mounting operations.

[0070] Mounting process: In the loading area 13, the second robotic arm assembly 131 grabs the chips to be mounted from the second material table assembly 132 and places them on the first transfer station 32. During this process, the first top vision module 133 performs preliminary calibration on the chips; The first transfer station 32 slides to the mounting area 11 through the third track 31; In the glue dipping area 12, the first robotic arm assembly 121 obtains glue from the glue dipping table assembly 123 and dips it onto the substrate on the first die bonding table 23 or the second die bonding table 24. Only a partial area of the substrate is dipped with glue each time, and then the substrate is transported to the mounting area 11 to prevent the glue from solidifying during the long waiting process.

[0071] In the mounting area 11, the first nozzle 1114 on the main binding head assembly 1113 sucks the chips from the first transfer station 32 and / or the third material table assembly 114, and accurately places them at the corresponding positions of the substrate on the first die bonding table 23 or the second die bonding table 24. During this process, the second top vision module 112 takes high-precision pictures of the chips to ensure that their final positions are accurate.

[0072] The first die bonding table 23 and the second die bonding table 24 work alternately between the glue dipping area 12 and the mounting area 11. Mounting is immediately performed after partial glue dipping each time, shortening the time interval from glue dipping to mounting; Each substrate reciprocates between the mounting area 11 and the glue dipping area 12 through the moving die bonding table assembly 2, and at least two rounds of glue dipping and chip mounting are completed to ensure that all chips are accurately bonded to the substrate.

[0073] The above has introduced in detail a dual-track die bonding device and a die bonding method disclosed in the embodiments of the present invention. Specific examples are used in this article to elaborate on the principle and implementation manner of the present invention. The description of the above embodiments is only used to help understand the method and its core idea of the present invention; at the same time, for those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation to the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the principle of the present invention should be included within the protection scope of the present invention.

Claims

1. A dual-track die bonding device, characterized in that: It comprises a carrying platform, on which a mounting area, a glue dipping area and a material loading area are provided, wherein the glue dipping area and the material loading area are arranged adjacent to each other and are adjacent to the same side of the mounting area; It also includes a mobile crystal bonding stage assembly and a mobile transfer stage assembly disposed on the carrier platform, wherein the mobile crystal bonding stage assembly includes a first track, a second track, a first crystal bonding stage and a second crystal bonding stage, wherein the first crystal bonding stage is slidably connected to the first track, and the second crystal bonding stage is slidably connected to the second track, and the first track and the second track extend from the glue dipping area to the mounting area respectively; in a working state, the first crystal bonding stage and the second crystal bonding stage work alternately in the mounting area and the glue dipping area; The mobile transfer table assembly includes a slidingly connected third track and a first transfer table, the third track extends from the loading area to the mounting area, and the first transfer table moves back and forth between the loading area and the mounting area via the third track.

2. The dual-track die bonding equipment according to claim 1, characterized in that: The glue dipping area is also provided with a first mechanical arm assembly, a first material table assembly and a glue dipping table assembly, and the first mechanical arm assembly can move in the glue dipping area; the first mechanical arm assembly transports materials between the first material table assembly and the mobile crystal bonding table assembly, or performs glue dipping operations between the glue dipping table assembly and the mobile crystal bonding table assembly; A second robotic arm assembly and a second material table assembly are provided in the material loading area. When the first transfer table is located in the material loading area, the second robotic arm assembly transports materials between the second material table assembly and the first transfer table.

3. The dual-track die bonding equipment according to claim 2, characterized in that: The first track, the second track and the third track are arranged in parallel and at intervals, and the first track and the second track are located on a side of the glue dipping area close to the feeding area, and the third track is located on a side of the glue dipping area close to the feeding area.

4. The dual-track die bonding equipment according to claim 3, characterized in that: A first upward viewing module is provided in the material loading area, and a second upward viewing module is provided in the mounting area. The first upward viewing module is located between the second material table assembly and the third track, and the second upward viewing module is located between the third track and the movable crystal bonding table assembly. The shooting accuracy of the second upward viewing module is higher than that of the first upward viewing module.

5. The dual-track die bonding equipment according to claim 1, characterized in that: A first nozzle rack assembly is also provided in the mounting area. The first nozzle rack assembly is located at the end of the third track and straddles the top of the third track.

6. The dual-track die bonding equipment according to claim 4, characterized in that: A third material table assembly and a second transfer table are also provided in the mounting area. The third material table assembly and the second transfer table are respectively arranged on both sides of the third track. The second transfer table is located between the third track and the mobile solid crystal table assembly, and the second transfer table is arranged close to the second upward viewing module.

7. The dual-track die bonding equipment according to claim 1, characterized in that: A standard positioning piece is also provided in the mounting area, a positioning point is provided on the top surface of the standard positioning piece, and the standard positioning piece is provided between the third track and the movable crystal fixing table assembly.

8. The dual-track die bonding equipment according to claim 1, characterized in that: A gantry assembly is provided in the mounting area, and the gantry assembly includes support columns located at two opposite sides of the mounting area and a beam guide slidably provided between the two support columns, a main binding head assembly is provided on the beam guide, and a first suction nozzle and a first downward viewing module are provided on the main binding head assembly.

9. The dual-track die bonding equipment according to claim 8, characterized in that: The main binding head is also provided with an expansion component, and the expansion component is provided with at least one expansion module; the expansion module includes an auxiliary binding head or a glue dispensing component.

10. A die bonding method, characterized in that: Applied to the dual-track die bonding equipment according to any one of claims 1 to 9, the method comprising: In the glue dipping area, the substrate placed on the first crystal bonding table / the second crystal bonding table is dipped in glue, and only a part of the substrate is dipped in glue each time, and the substrate after the dip in glue is transported to the mounting area; In the loading area, the chip is transported to the first transfer table, and the first transfer table is moved to the mounting area via the third track; In the mounting area, the chip on the first transfer table is mounted on the substrate at the first die bonding table / the second die bonding table to complete the chip mounting; When one of the first die bonding station and the second die bonding station is located in the mounting area / glue dipping area, the other is correspondingly located in the glue dipping area / mounting area, and the glue dipping operation and the chip mounting operation are respectively performed synchronously on the first die bonding station and the second die bonding station; Each substrate moves back and forth in the mounting area and the glue dipping area by moving the crystal bonding table assembly, completing at least two rounds of glue dipping and chip mounting.

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