Antenna Device

Abstract

To provide an antenna device capable of improving the heat radiation property.SOLUTION: An antenna device comprises a communication part, a control part, and a coupling part. The communication part has a first wiring board, an antenna element, and a beamforming IC. The first wiring board has a first surface and a second surface located at an opposite side to the first surface as the principal surfaces. The antenna element is located on the first surface. The beamforming IC is located on the second surface. The control part has a second wiring board. The first and second wiring boards are coupled with each other by the coupling part. The coupling part is located so as to couple between an edge part of the second surface and an edge part of a principal surface of the second wiring board.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The disclosed embodiments relate to an antenna apparatus. [Background technology]

[0002] Conventionally, an antenna device in which an antenna board and a control board are laminated has been disclosed. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Special Publication No. 2021-520140 Summary of the Invention [Problem to be solved by the invention]

[0004] However, conventional antenna devices still have room for improvement in terms of improving heat dissipation.

[0005] One aspect of an embodiment has been made in view of the above, and aims to provide an antenna device capable of improving heat dissipation properties. [Means for solving the problem]

[0006] An antenna device according to one aspect of the embodiment includes a communication unit, a control unit, and a coupling unit. The communication unit has a first wiring board, an antenna element, and a beam forming IC. The first wiring board has a first surface and a second surface located opposite to the first surface as main surfaces. The antenna element is located on the first surface. The beam forming IC is located on the second surface. The control unit has a second wiring board. The first wiring board and the second wiring board are coupled by the coupling unit. The coupling unit is located so as to couple between an edge of the second surface and an edge of the main surface of the second wiring board. Effect of the Invention

[0007] According to the antenna device of one aspect of the embodiment, it is possible to improve heat dissipation properties. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a cross-sectional view showing an outline of an antenna device according to a first embodiment. [Diagram 2] FIG. 2 is a cross-sectional view showing an outline of an antenna device according to a modified example of the first embodiment. [Diagram 3] FIG. 3 is a cross-sectional view showing an outline of an antenna device according to the second embodiment. [Figure 4] FIG. 4 is a cross-sectional view showing an outline of an antenna device according to a modified example of the second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, embodiments of the antenna device disclosed in the present application will be described in detail. Note that the present invention is not limited to the embodiments described below.

[0010] [First embodiment] The configuration of the antenna device according to the first embodiment will be described with reference to Fig. 1. Fig. 1 is a cross-sectional view showing an outline of the antenna device according to the first embodiment.

[0011] As shown in FIG. 1, the antenna device 1 includes a communication unit 10, a control unit 20, a coupling unit 30, and a heat dissipation unit 40.

[0012] The communication unit 10 has a first wiring board 11. The first wiring board 11 has a first surface 111 and a second surface 112 as main surfaces. The first surface 111 is a front surface on which the antenna element 12 is located. The second surface 112 is a back surface located opposite the first surface 111. Here, the main surface refers to a surface having an area larger than the four surfaces corresponding to the side surfaces or end surfaces when the first wiring board 11 is, for example, a hexahedron having four surfaces corresponding to the side surfaces or end surfaces connected to the main surface.

[0013] Control unit 20 has second wiring board 21. Second wiring board 21 has third surface 211 and fourth surface 212. Third surface 211 is the main surface of second wiring board 21, and is located on the connecting portion 30 side. Fourth surface 212 is located on the opposite side to third surface 211. Second wiring board 21 has end surfaces 213, 214 that connect third surface 211 and fourth surface 212.

[0014] Here, first wiring board 11 and second wiring board 21 are arranged to be connected at their ends via connecting portion 30. Beam forming IC 13 is located on second surface 112 of first wiring board 11.

[0015] According to this configuration, even if the first wiring board 11 and the second wiring board 21 are connected via the connecting portion 30, the beam forming IC 13 arranged on the second surface 112 of the first wiring board 11 is not surrounded (enclosed) by the second wiring board 21, thereby improving the heat dissipation of the beam forming IC 13.

[0016] The first wiring board 11 may have an organic resin as an insulating base material. Such an insulating base material may be, for example, an epoxy resin, an acrylic resin, a polycarbonate resin, a polyimide resin, an olefin resin, or a polyphenylene resin. The insulating base material may be, for example, polytetrafluoroethylene (PTFE) or other fluororesins or polyphenylene ether resins.

[0017] First wiring board 11 may have conductor 110. Conductor 110 may be, for example, an internal conductor layer located inside first wiring board 11. Conductor 110 may be a surface conductor layer located on first surface 111 and / or second surface 112 of first wiring board 11. Conductor 110 may also be a connection conductor whose both ends are located on first surface 111 and second surface 112 and which extends in the thickness direction of first wiring board 11.

[0018] Similarly to the first wiring board 11, the second wiring board 21 may also have an organic resin as an insulating base material. In addition, for example, the second wiring board 21 may have a ceramic base material as the insulating base material. Such a ceramic base material may be, for example, an alumina-based or glass ceramic-based ceramic, or may be a dielectric material such as cordierite, zirconia, barium titanate, strontium titanate, or calcium titanate, aluminum titanate, or lead zirconate titanate (PZT). In this case, the ceramic base material may have, for example, a plurality of ceramics.

[0019] Second wiring board 21 may have a conductor. Second wiring board 21 may have, for example, an internal conductor layer located inside. Second wiring board 21 may also have a surface conductor layer located on third surface 211 and / or fourth surface 212. Second wiring board 21 may also have a connection conductor whose both ends are located on third surface 211 and fourth surface 212 and which extends in the thickness direction of second wiring board 21.

[0020] The communication unit 10 further includes an antenna element 12 and a beam forming IC 13. The antenna element 12 is located on a first surface 111 of the first wiring board 11. The antenna element 12 includes, for example, an insulating substrate, a patch, and a circuit unit. The insulating substrate includes, for example, a dielectric material or other insulating material. The patch is, for example, a conductor film made of a conductive material such as copper. The circuit unit includes, for example, an integrated circuit such as an RFIC (Radio Frequency Integrated Circuit). The patch and the circuit unit are electrically connected to each other via, for example, a power feed line.

[0021] The beam forming IC 13 is located on the second surface 112 of the first wiring board 11. The beam forming IC 13 has an IC element 14 and a cover 15.

[0022] The IC element 14 is bonded to the second surface 112 via a bonding material 61. The IC element 14 may be, for example, a semiconductor element for beam forming. The bonding material 61 is, for example, conductive, and electrically connects the first wiring board 11 and the IC element 14.

[0023] The IC element 14 may be configured to be housed in a lid 15 as shown in FIG. 1. In other words, the lid 15 is, for example, a lid-shaped member that covers the IC element 14. The lid 15 may function as, for example, a heat spreader. In other words, the beam forming IC 13 may be, for example, an IC element 14 covered with a lid-shaped heat spreader. The material of the lid 15 may be, for example, an aluminum alloy or other metal, or may be, for example, a resin such as a thermosetting resin or a photosetting resin. The lid 15 is preferably made of a metal from the viewpoints of mechanical strength, heat resistance, and thermal conductivity.

[0024] A heat dissipation member 71 may be located between the IC element 14 and the lid 15. The heat dissipation member 71 is located, for example, so as to be in contact with the IC element 14 and the lid 15. This allows, for example, heat generated in the IC element 14 to be quickly dissipated via the lid 15. The heat dissipation member 71 may be, for example, a TIM (Thermal Interface Material). The heat dissipation member 71 may contain, for example, an organic resin such as an epoxy resin or a silicone resin. In addition, the surface of the heat dissipation member 71 may have adhesiveness.

[0025] The communication unit 10 may further include a filter 16. The filter 16 is located, for example, on the second surface 112 of the first wiring board 11. The filter 16 is bonded to the second surface 112 via, for example, a bonding material 62. The filter 16 has, for example, a band-stop filter that blocks the passage of radio waves in a specific frequency band. The bonding material 62 has, for example, electrical conductivity, and electrically connects the first wiring board 11 and the filter 16. The filter 16 may have, for example, a band-pass filter that allows the passage of radio waves in a specific frequency band.

[0026] The filter 16 may be located away from the beam forming IC 13. Specifically, a space 81 may be provided between the filter 16 and the cover 15 of the beam forming IC 13. By providing the space 81 between the filter 16 and the beam forming IC 13, heat from the beam forming IC 13 is less likely to be transmitted to the filter 16. This makes it possible to reduce, for example, changes in the filter characteristics associated with temperature changes in the filter 16. This makes it possible to stabilize the antenna characteristics of the antenna device 1.

[0027] The connecting portion 30 connects the first wiring board 11 and the second wiring board 21. The connecting portion 30 is located between the edge portion 112a of the second surface 112 and the edge portion 211a of the third surface 211 of the second wiring board 21, and is located so as to connect the edge portion 112a and the edge portion 211a. The first wiring board 11, the connecting portion 30, and the second wiring board 21 form a stepped structure. Here, the edge portion 112a of the second surface 112 means a range from the end of the second surface 112 intersecting with the end surface 113 to 25% of the entire width of the second surface 112. Similarly, the edge portion 211a of the third surface 211 means a range from the end of the third surface 211 intersecting with the end surface 213 to 25% of the entire width of the third surface 211.

[0028] The connecting portion 30 has a base material 31 and a conductor 32. The base material 31 may be, for example, an insulating base material having an organic resin. The base material 31 may be, for example, an epoxy resin, an acrylic resin, a polycarbonate resin, a polyimide resin, an olefin resin, or a polyphenylene resin. The base material 31 may also be, for example, polytetrafluoroethylene (PTFE) or other fluororesins or polyphenylene ether resins.

[0029] Conductor 32 electrically connects first wiring board 11 and second wiring board 21. Conductor 32 may be, for example, an internal conductor layer located inside coupling portion 30. Conductor 32 may also be a connecting conductor whose two ends are located at edge portion 112a and edge portion 211a.

[0030] The connecting portion 30 is bonded to the edge portion 211a via a bonding material 63. The bonding material 63 has, for example, electrical conductivity and electrically connects the conductor 32 and the second wiring board 21. Note that the bonding material 63 may have, for example, insulating properties. The bonding material 63 having insulating properties bonds, for example, the base material 31 and the second wiring board 21.

[0031] The connecting portion 30 may be located away from the beam forming IC 13. Specifically, a space 82 may be provided between the connecting portion 30 and the cover 15 of the beam forming IC 13. By providing such a space 82, heat from the beam forming IC 13 is less likely to be transmitted to the first wiring board 11 and / or the second wiring board 21 via the connecting portion 30. This can improve the heat dissipation of the antenna device 1, for example.

[0032] The heat dissipation section 40 has a flat section 41. The flat section 41 has a flat surface 411 that faces the communication section 10. The flat section 41 is an example of a first heat dissipation section.

[0033] The flat portion 41 is positioned so as to overlap the beam forming IC 13 when viewed from the first surface 111 side. The distance between the flat portion 41 and the second surface 112 is equal to or less than the length of the connecting portion 30. With this configuration, the flat portion 41 of the heat dissipation unit 40 and the beam forming IC 13 are close to each other, so that the heat dissipation from the beam forming IC 13 can be improved. In particular, if the flat portion 41 is positioned so as to overlap the entire surface of the beam forming IC 13 when viewed from the first surface 111 side, the heat dissipation can be further improved.

[0034] The area of ​​flat portion 41 when viewed from first surface 111 may be larger than the area of ​​first surface 111 of first wiring board 11. This can improve the heat dissipation properties of communication unit 10.

[0035] Also, a heat dissipation member 72 may be provided between the beam forming IC 13 and the flat portion 41. The heat dissipation member 72 is located in a direction along the second surface 112 of the first wiring board 11, on the surface of the lid 15 of the beam forming IC 13. The flat surface 411 of the flat portion 41 is in contact with the lid 15 of the beam forming IC 13 via the heat dissipation member 72. This allows, for example, heat generated in the beam forming IC 13 to be quickly released via the lid 15, thereby further improving the heat dissipation of the communication unit 10. The heat dissipation member 72 may be, for example, a TIM. The heat dissipation member 72 may include, for example, an organic resin such as an epoxy resin or a silicone resin. Also, the surface of the heat dissipation member 72 may have adhesiveness.

[0036] The heat dissipation section 40 may have a flat section 42 and a relay section 43. The flat section 42 may face the fourth surface 212 of the second wiring board 21 constituting the control section 20. The flat section 42 may have a flat surface 421 located so as to face the fourth surface 212. The flat section 42 is an example of a second heat dissipation section. A heat dissipation member such as a TIM may be located between the flat section 42 and the fourth surface 212 of the second wiring board 21. In this case, when the flat section 42 and the second wiring board 21 are in contact with the heat dissipation member, for example, the heat dissipation property of the second wiring board 21 is improved.

[0037] The flat portion 42 is positioned so as to overlap the beam forming IC 13 when viewed in plan from the first surface 111 side. The distance between the flat portion 41 and the second surface 112 is equal to or less than the length of the connecting portion 30. With this configuration, the flat portion 41 of the heat dissipation unit 40 and the beam forming IC 13 are close to each other, so that the heat dissipation from the beam forming IC 13 can be improved.

[0038] The area of ​​flat surface 421 may be larger than the area of ​​fourth surface 212 of second wiring board 21. This can improve the heat dissipation performance of control unit 20.

[0039] The relay portion 43 is located between the flat portion 41 and the flat portion 42. Since the heat dissipation portion 40 has the relay portion 43, the heat dissipation portion 40 is located continuously from the communication portion 10 side to the fourth surface 212 side of the second wiring board 21. As a result, the heat generated in the beam forming IC 13 is dissipated, for example, not only from the flat portion 41 of the heat dissipation portion 40 but also from the flat portion 42, and the heat dissipation performance of the antenna device 1 can be improved.

[0040] The material of the heat dissipation portion 40 may be, for example, a metal material such as copper or aluminum. The flat portion 41, the relay portion 43, and the flat portion 42 of the heat dissipation portion 40 may be made of the same material. Moreover, the materials of the flat portion 41, the relay portion 43, and the flat portion 42 may be different from one another.

[0041] Furthermore, the antenna device 1 may have a lid portion 90. The lid portion 90 may be combined with the heat dissipation portion 40 to form the housing 2.

[0042] (Modification) Fig. 2 is a cross-sectional view showing an outline of an antenna device according to a modified example of the first embodiment. The antenna device 1 shown in Fig. 2 differs from the antenna device 1 shown in Fig. 1 in that the first wiring board 11 has a first board portion 11a and a second board portion 11b.

[0043] First substrate portion 11a has a first surface 111 and is located on the antenna element 12 side. First substrate portion 11a has, for example, an organic resin as an insulating base material. Such an insulating base material may be, for example, an epoxy resin, an acrylic resin, a polycarbonate resin, a polyimide resin, an olefin resin, or a polyphenylene resin. Furthermore, the insulating base material may be, for example, polytetrafluoroethylene (PTFE) or other fluororesins or polyphenylene ether resin.

[0044] The second substrate unit 11b has a second surface 112 and is located on the side of the beam forming IC 13. The second substrate unit 11b has a ceramic base material made of, for example, ceramics. The ceramic base material may be, for example, an alumina-based or glass ceramic-based ceramic, or may be a dielectric material such as cordierite, zirconia, barium titanate, strontium titanate, or calcium titanate, or may be aluminum titanate, lead zirconate titanate (PZT), or the like.

[0045] Also, the second substrate portion 11b may have, for example, a built-in filter 16A. Since the second substrate portion 11b is made of ceramics, the filter 16A can be built in. In this case, the filter 16 shown in FIG. 1 is not necessary.

[0046] The second substrate section 11b may have a higher thermal conductivity than the first substrate section 11a. Heat generated in the beam forming IC 13 is preferentially transferred to the heat dissipation section 40. This reduces the change in filter characteristics caused by temperature changes in the filter 16A. This allows the antenna characteristics of the antenna device 1 to be stabilized.

[0047] [Second embodiment] Fig. 3 is a cross-sectional view showing an outline of an antenna device according to a second embodiment. In the antenna device 1A shown in Fig. 3, a first wiring board 11, a coupling portion 30 and a second wiring board 21 are positioned in a U-shape in a cross-sectional view.

[0048] The heat dissipation section 40 also has a flat section 44 as a first heat dissipation section. The flat section 44 is positioned so as to separate the beam forming IC 13 and the second wiring board 21.

[0049] The flat portion 44 is positioned so as to overlap the beam forming IC 13 when viewed from the first surface 111 side. The distance between the flat portion 44 and the second surface 112 is equal to or less than the length of the connecting portion 30. With this configuration, the flat portion 44 of the heat dissipation unit 40 and the beam forming IC 13 are close to each other, so that the heat dissipation from the beam forming IC 13 can be improved. In particular, if the flat portion 44 is positioned so as to overlap the entire surface of the beam forming IC 13 when viewed from the first surface 111 side, the heat dissipation can be further improved.

[0050] The area of ​​flat portion 44 when viewed from first surface 111 may be larger than the area of ​​first surface 111 of first wiring board 11. This can improve the heat dissipation properties of communication unit 10.

[0051] Furthermore, since flat portion 44 of heat dissipation unit 40 and second wiring board 21 are close to each other, flat portion 44 also contributes to dissipation of heat generated in control unit 20. In particular, when flat portion 44 is positioned so as to overlap the entire surface of second wiring board 21 when viewed in plan from first surface 111 side, heat dissipation can be further improved.

[0052] Furthermore, first wiring board 11 and connecting portion 30 may be bonded to each other via, for example, bonding material 64. The material of bonding material 64 may be the same as that of bonding material 63 that bonds connecting portion 30 to second wiring board 21.

[0053] The heat dissipation unit 40 may also have a bottom plate 45. The bottom plate 45 is located on the beam forming IC 13 side.

[0054] Antenna device 1A may also have walls 46 and 47. Such walls 46 and 47 may be combined with heat dissipation section 40 to form housing 2A. Housing 2A is positioned so as to surround first wiring board 11 and second wiring board 21.

[0055] The housing 2A is a concave box. The housing 2A has a bottom plate 45 and walls 46 and 47. The walls 46 and 47 stand along the edge of the bottom plate 45 in a direction intersecting with a flat surface 451 of the bottom plate 45. The walls 46 and 47 have a shape that circumferentially surrounds the edge of the bottom plate 45.

[0056] The housing 2A may have a lid portion 90 located on the opposite side of the bottom plate 45 with the walls 46 and 47 in between. The lid portion 90 may have, for example, the same shape as the bottom plate 45. As shown in FIG. 3, when the bottom plate 45 is located on the second wiring board 21 side, the bottom plate 45 becomes the second heat dissipation portion.

[0057] When the beam forming IC 13 side of the second wiring board 21 is defined as a third surface 211 and the opposite side of the third surface 211 is defined as a fourth surface 212, the second wiring board 21 may have a main IC 22 on the fourth surface 212.

[0058] Moreover, the control unit 20 may further include a main IC 22. The main IC 22 is located on the fourth surface 212 of the second wiring board 21. The main IC 22 has a main element 23 and a cover 24.

[0059] Main element 23 is bonded to second surface 112 via bonding material 65. Main element 23 may be, for example, a main semiconductor element that comprehensively controls antenna device 1. Bonding material 65 has, for example, electrical conductivity, and electrically connects second wiring board 21 and main element 23.

[0060] The main element 23 may be configured to be housed in a lid 24 as shown in FIG. 3. In other words, the lid 24 is, for example, a lid-shaped member that covers the main element 23. The lid 24 may function as, for example, a heat spreader. In other words, the main IC 22 may be, for example, the main element 23 covered with a lid-shaped heat spreader. The material of the lid 24 may be, for example, an aluminum alloy or other metal, or may be, for example, a resin such as a thermosetting resin or a photosetting resin. The lid 24 is preferably made of a metal from the viewpoints of mechanical strength, heat resistance, and thermal conductivity.

[0061] A heat dissipation member 73 may be located between the main element 23 and the lid 24. The heat dissipation member 73 is located, for example, so as to be in contact with the main element 23 and the lid 24. This allows, for example, heat generated in the main element 23 to be quickly dissipated via the lid 24. The heat dissipation member 73 may be, for example, a TIM. Furthermore, the surface of the heat dissipation member 73 may have adhesiveness.

[0062] The bottom plate 45 may have a flat surface 451 located opposite the fourth surface 212. A heat dissipation member 74 such as a TIM may be located between the bottom plate 45 and the cover 24 of the main IC 22. In this case, when the bottom plate 45 and the main IC 22 are in contact with the heat dissipation member 74, for example, the heat dissipation of the control unit 20 including the main IC 22 is further improved.

[0063] In the antenna device 1A shown in FIG. 3, the communication unit 10, the control unit 20, and other components can be housed inside the housing 2A by, for example, inserting them in a direction intersecting the plane of the drawing.

[0064] (Modification) Fig. 4 is a cross-sectional view showing an outline of an antenna device according to a modified example of the second embodiment. The antenna device 1A shown in Fig. 4 differs from the antenna device 1A shown in Fig. 3 in that the first wiring board 11 has a first board portion 11a and a second board portion 11b.

[0065] First substrate portion 11a has a first surface 111, and is located on the side of antenna element 12. First substrate portion 11a has, for example, an organic resin as an insulating base material.

[0066] The second substrate unit 11b has a second surface 112 and is located on the side of the beam forming IC 13. The second substrate unit 11b has, for example, a ceramic base material made of ceramics.

[0067] Also, the second substrate portion 11b may have, for example, a built-in filter 16A. Since the second substrate portion 11b is made of ceramics, the filter 16A can be built in. In this case, the filter 16 shown in FIG. 3 is not necessary.

[0068] As described above, the antenna device 1 according to the embodiment includes the communication unit 10, the control unit 20, and the connecting unit 30. The communication unit 10 includes the first wiring board 11, the antenna element 12, and the beam forming IC 13. The first wiring board 11 has a first surface 111, which is the front surface, and a second surface 112, which is the back surface located on the opposite side of the first surface 111, as main surfaces. The antenna element 12 is located on the first surface 111. The beam forming IC 13 is located on the second surface 112. The control unit 20 includes the second wiring board 21. The first wiring board 11 and the second wiring board 21 are connected by the connecting unit 30. The connecting unit 30 is located so as to connect between the edge portion 112a of the second surface 112 and the edge portion 211a of the main surface of the second wiring board 21.

[0069] Therefore, according to the antenna device 1 according to the embodiment, it is possible to improve heat dissipation properties.

[0070] Further advantages and modifications may readily occur to those skilled in the art. Thus, the invention in its broader aspects is not limited to the specific details and representative embodiments shown and described above. Accordingly, various modifications may be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and equivalents thereof. [Explanation of symbols]

[0071] 1,1A Antenna device 2,2A housing 10. Communications Department 11 First wiring board 12 Antenna elements 13 Beamforming IC 20 Control section 21 Second wiring board 30 Connecting part 40 Heat dissipation part 41,44 Flat area

Claims

1. A communication unit, a control unit, and a connection unit Equipped with the communication unit includes a first wiring board, an antenna element, and a beam forming IC; the first wiring board has a first surface and a second surface located on the opposite side to the first surface as a main surface; the antenna element is located on the first plane; the beamforming IC is located on the second surface; The control unit has a second wiring board, the second wiring board has a third surface that forms a main surface and a fourth surface located on the opposite side to the third surface; the first wiring board and the second wiring board are connected to each other at the connecting portion, the connecting portion connects between an edge portion of the second surface of the first wiring substrate and an edge portion of the third surface of the second wiring substrate, The first wiring board, the connecting portion, and the second wiring board are positioned to form a stepped structure. Antenna device.

2. A heat dissipation section is provided, The heat dissipation portion has a flat portion, the flat portion is positioned so as to overlap the beam forming IC when viewed in a plan view from the first surface side, The distance between the flat portion and the second surface is equal to or less than the length of the connecting portion.

2. The antenna device according to claim 1.

3. the communication unit includes a filter located on the second surface, the filter is located remotely from the beamforming IC; a heat dissipation member located between the beam forming IC and the flat portion; The heat dissipation member is located in a direction along the second surface and on a surface of the beam forming IC.

3. The antenna device according to claim 2.

4. The coupling portion is located away from the beamforming IC.

4. The antenna device according to claim 3.

5. The heat dissipation section is located continuously from the communication section side to the fourth surface side. The antenna device according to any one of claims 2 to 4.

6. the first wiring board has a first substrate portion made of organic resin and arranged to have the first surface, and a second substrate portion made of ceramic and arranged to have the second surface, The second substrate portion has a built-in filter.

3. The antenna device according to claim 2.

7. the first wiring substrate, the connecting portion, and the second wiring substrate are positioned in a U-shape in a cross-sectional view, The flat portion is positioned to separate the beam forming IC and the second wiring board.

3. The antenna device according to claim 2.

8. The flat portion is positioned so as to overlap the entire surface of the beam forming IC when viewed from the first surface side. The antenna device according to any one of claims 2 to 6.

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