Cleaning method and coating device

Abstract

To provide a cleaning method that uses a cleaning tool to clean a wider range in the height direction inside a container of a spin coating device.SOLUTION: A cleaning method for cleaning a spin coating device by holding a cleaning jig 50 on a rotary holding device includes forming a peripheral ceiling portion 54 and a peripheral bottom portion 55 in the circumferential direction on the peripheral portion of the cleaning jig, continuously forming discharge ports 56 in the circumferential direction between the peripheral ceiling portion and the peripheral bottom portion, forming a plurality of holes 61 in the peripheral bottom portion at intervals in the circumferential direction, obliquely inclining the lower surface of the peripheral ceiling portion toward the upper outer periphery, rotating the cleaning jig at a first rotation speed while holding the cleaning jig on the rotary holding device, supplying cleaning liquid to the bottom of the cleaning jig, allowing the cleaning liquid to accumulate in the discharge port through a guide path from the bottom, reaching the cleaning liquid to the inner cup, and rotating the cleaning jig at a second rotation speed higher than the first rotation speed while allowing the cleaning liquid accumulated in the discharge port to reach a portion of the outer cup located above the discharge port.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present disclosure relates to a cleaning method. and the coating device. [Background technology]

[0002] Patent Document 1 discloses a cleaning jig that can be used to clean a container in a spin coating device that drops a treatment liquid onto a substrate rotatably held in the container and applies a film of the treatment liquid onto the substrate by rotating the substrate, the cleaning jig having an outer peripheral surface that is formed so as to retain solvent that is supplied to the back side and guided by the rotation and to splash it into the container when rotated in the spin coating device. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2010-16315 A Summary of the Invention [Problem to be solved by the invention]

[0004] The technique according to the present disclosure cleans the inside of a container of a spin coating device over a wider range in the height direction than in the past. [Means for solving the problem]

[0005] One aspect of the present disclosure is a cleaning method for a spin coating apparatus that supplies a treatment liquid onto a substrate held by a spin holding device disposed in a container and forms a film of the treatment liquid on the substrate by rotating the substrate, by having the spin holding device hold a disk-shaped cleaning jig similar to the substrate, and cleaning the spin coating apparatus, wherein the container has an outer cup that is open at the top and that is provided so as to surround the substrate held by the spin holding device, and an inner cup that is located below the substrate held by the spin holding device and that discharges liquid toward a drain port, and a peripheral ceiling portion and a peripheral bottom portion are formed in the circumferential direction on the peripheral portion of the cleaning jig, and a discharge port is provided between the peripheral ceiling portion and the peripheral bottom portion so as to be continuous around the entire circumference and extend in the circumferential direction. a cleaning liquid supplying step of supplying the cleaning liquid to the bottom of the cleaning jig through the guide path from the bottom to the discharge port and allowing the cleaning liquid to reach the inner cup; and then, rotating the cleaning jig at a second rotation speed higher than the first rotation speed, the cleaning liquid that has accumulated in the discharge port reaching a portion of the outer cup that is located above the discharge port. Effect of the Invention

[0006] According to the present disclosure, when cleaning the inside of a container of a spin coating device, it is possible to clean a wider range in the height direction than in the past. [Brief description of the drawings]

[0007] [Figure 1] 1 is an explanatory diagram showing a schematic cross-sectional side view of a spin coating device to which a cleaning jig according to an embodiment of the present invention is applied; [Diagram 2] FIG. 2 is a plan view of the cleaning tool according to the embodiment. [Diagram 3] 3 is a cross-sectional view taken along line AA in FIG. 2. [Figure 4] FIG. 3 is a cross-sectional view taken along line BB in FIG. [Diagram 5] 3 is a cross-sectional view taken along line CC in FIG. 2. [Figure 6] 2 is an explanatory view showing the positional relationship between a peripheral portion of the cleaning jig and an outer cup when the cleaning jig according to the embodiment is set on a spin chuck of the spin coating apparatus of FIG. 1. [Figure 7] 7 is an explanatory diagram showing a state in FIG. 6 at the time of relatively low speed rotation. FIG. [Figure 8] FIG. 8 is an explanatory diagram showing a state when the rotor is rotated at a relatively high speed from the state shown in FIG. 7. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] In the manufacturing process of semiconductor devices, a coating liquid such as a resist liquid is applied to a substrate, for example, a semiconductor wafer (hereinafter sometimes referred to as a "wafer") by spin coating. Such spin coating is performed by supplying the coating liquid from above the wafer held by a spin chuck and rotating the wafer. In such cases, the coating liquid splashes from the top surface of the wafer to the surrounding area, so a container is placed to catch the splashed coating liquid, surrounding the wafer.

[0009] The coating liquid that has splashed into the container and adhered to the inner wall of the container is periodically washed away. In this regard, according to the technology described in Patent Document 1, the solvent that is supplied to the backside and guided by the rotation is held and splashed into the container, and the inner wall of the container can be washed using the cleaning liquid from the nozzle for cleaning the backside as is, in the same manner as spin coating for normal wafers.

[0010] Now, for example, in terms of resist liquid, in recent years, a thick film thickness of about 10 μm is sometimes adopted in a process from the viewpoint of etching resistance. In such a case, a resist liquid having a high viscosity of, for example, 50 to 600 cP is used. Since such a high-viscosity resist liquid has a higher solid content in the resist liquid than conventional low-viscosity resists, it may scatter and adhere to the upper part of the container more than conventionally during spin coating.

[0011] In this regard, in the conventional technology, the range of cleaning in the vertical direction is almost horizontal, and a technology that enables cleaning of a wider range in the vertical direction has been awaited. Therefore, the present disclosure makes it possible to clean a wider range in the vertical direction inside a container than in the conventional technology.

[0012] Hereinafter, a cleaning tool according to the present embodiment will be described with reference to the drawings. In this specification, elements having substantially the same functional configurations are denoted by the same reference numerals, and redundant description will be omitted.

[0013] <Spin coating device> First, the configuration of a spin coater in which a container is cleaned using a cleaning jig according to the embodiment will be described. As shown in Fig. 1, a spin coater 1 as a coating device has, for example, a rectangular parallelepiped housing 2, and a container 3 is housed in this housing 2. The container 3 has an outer cup 10 and an inner cup 20.

[0014] A spin chuck 4 is provided in the outer cup 10 to horizontally hold a wafer, which is a substrate, or a cleaning jig 50, which will be described later, during coating processing. The spin chuck 4 can be rotated by a drive device 6 having a motor or the like via a shaft portion 5, and can also be moved up and down (Z direction). The spin chuck 4 constitutes a rotation holding device. A coating nozzle 7 is provided in the housing 2 to supply a coating liquid to the wafer held on the spin chuck 4. As shown in FIG. 1, the coating nozzle 7 can move in the Y direction in the figure between a standby position (shown by a solid line) and a supply position (shown by a broken line). In addition, a clean air supply unit 8, such as a filter device, for supplying clean air to the container 3 is provided on the top plate portion of the housing 1. A downflow of clean air is formed by the clean air supply unit 8.

[0015] Meanwhile, one or more cleaning nozzles 31 are provided on the underside of the spin chuck 4, which supply a cleaning liquid from the center toward the rear surface of the substrate held by the spin chuck 4 or the cleaning jig 50 at an angle upward and outward. In the illustrated example, two cleaning nozzles 31 are provided. These cleaning nozzles 31 are supported by a base portion 32. A cleaning liquid, for example, a solvent for a coating liquid supplied by a coating nozzle 7, for example, a resist liquid, is supplied to the cleaning nozzle 31 from a solvent supply portion 33.

[0016] The exterior cup 10 has a circular opening at the top, and is configured to surround the substrate held by the spin chuck 4 and the cleaning jig 50. A cylindrical block body 11 is provided at the top of the exterior cup 10, and a sloped portion 12 and an outer peripheral cylindrical portion 13 are provided continuously downward from this block body 11. The block body 11 has the function of preventing the mist in the exterior cup 10 from being released to the outside, and of properly guiding the downflow into the exterior cup 10.

[0017] On the other hand, the inner cup 20 has an inner inclined surface portion 21 and an outer inclined surface portion 22, as shown in FIG. 1. The inner inclined surface portion 21 discharges the coating liquid, solvent, etc., scattered on the underside of the cleaning jig 50 or the substrate held by the spin chuck 4 toward the drain port 34 provided in the base portion 32. The outer inclined surface portion 22 discharges the coating liquid, solvent, etc., together with the coating liquid, solvent, etc., received by the outer cup 10, from the drain port 14 provided at the bottom of the outer cylindrical portion 13 through the space between the hanging wall 23 and the outer cylindrical portion 13. Also, the steam, mist, etc., are exhausted from the exhaust portion 24 through the space between the hanging wall 23 and the outer cylindrical portion 13, as shown by the arrow in FIG. 1.

[0018] The spin coater 1 is configured as described above, and various operations are controlled by the control unit 100 shown in FIG. 1. The control unit 100 is, for example, a computer equipped with a CPU, a memory, and the like, and has a program storage unit (not shown). The program storage unit stores programs for performing the coating process on the substrate in the spin coater 1, the cleaning process by the cleaning jig 50, and the associated control of various drive systems such as the spin chuck 4, and the discharge and stop of the processing liquid from various nozzles. The programs may be recorded in a computer-readable storage medium and installed from the storage medium to the control unit 100. A part or all of the programs may be realized by dedicated hardware (circuit board). The storage medium includes temporary and non-temporary ones.

[0019] <Cleaning tool> Next, the cleaning jig 50 according to the embodiment will be described in detail. Fig. 2 is a plan view of the cleaning jig 50, Fig. 3 is a cross-sectional view taken along line AA in Fig. 2, Fig. 4 is a cross-sectional view taken along line BB in Fig. 2, and Fig. 5 is a cross-sectional view taken along line CC in Fig. 2. The cleaning jig 50 has a disk-like shape as a whole, and its outer dimensions other than the thickness are the same as those of the wafer.

[0020] A ring-shaped recess 52 is formed on the upper peripheral portion of the cleaning jig 50. A ring-shaped flat bottom portion 53 facing the recess 52 is formed on the lower surface side of the recess 52. A ring-shaped peripheral ceiling portion 54 that protrudes outward over the entire circumference is provided on the outside of the ring-shaped recess 52 of the cleaning jig 50. On the other hand, a ring-shaped peripheral bottom portion 55 that continues from the bottom portion 53 and protrudes outward over the entire circumference is formed in the portion facing the peripheral ceiling portion 54. A ring-shaped discharge port 56 is formed over the entire circumference of the cleaning jig 50 between the peripheral ceiling portion 54 and the peripheral bottom portion 55. In this embodiment, the discharge port 56 is formed by the peripheral ceiling portion 54 and the peripheral bottom portion 55. Of course, this is not limited to this, and a separate discharge port 56 may be formed between the peripheral ceiling portion 54 and the peripheral bottom portion 55.

[0021] In addition, the peripheral bottom 55 is formed with holes 61 that are arc-shaped in plan view at equal intervals as shown in FIG. 2 and FIG. 5. In the cleaning jig 50 according to this embodiment, 12 holes 61 are formed as shown in FIG. 2. As shown in FIG. 5, the holes 61 are formed in the peripheral bottom 55 with a length that reaches the back of the discharge port 56 in the height direction. This forms a guide path 62 that leads from the inlet of the hole 61 to the discharge port 56. The inside of the discharge port 56 has an upper surface 56a and a lower surface 56b. In this embodiment, the guide path 62 has a shape in which the flow path cross-sectional area increases toward the discharge port 56. In addition, each hole 61 is formed independently of the others up to at least the lower surface 56b in each discharge port 56. Furthermore, each hole 61 communicates with the lower surface 56b in the discharge port 56 at a position closer to the center of the cleaning jig 50 in plan view.

[0022] FIG. 6 shows the positional relationship between the peripheral portion of the cleaning jig 50 and the block body 11 and the inner cup 20 of the outer cup 10 when the cleaning jig 50 having such a structure is held by the spin chuck 4. As shown in this figure, the lower surface side of the peripheral ceiling portion 54, i.e., the upper surface 56a inside the discharge port 56, is inclined and faces obliquely upward at an elevation angle θ from the horizontal plane. This elevation angle θ can be set arbitrarily within a range of, for example, 5 degrees to 20 degrees. In this embodiment, the lower end portion 11a of the block body 11 is set to be located within this range of the elevation angle θ. According to the knowledge of the inventors, during spin coating of the substrate, the scattered coating liquid adheres in large amounts to the lower end portion 11a of the block body 11 and its surroundings. Furthermore, as shown in FIG. 6, the position of the upper end 11b of the block body 11 is located above the elevation angle of the peripheral ceiling portion of the cleaning jig 50 held by the spin chuck 4, more specifically, above the extension line of the upper surface 56a inside the discharge port 56. In this example, the upper end 11b of the block body 11 is located above the range of the elevation angle θ.

[0023] <Cleaning method> The cleaning jig 50 according to the embodiment has the above-mentioned configuration. Next, a cleaning method using this cleaning jig 50 will be described.

[0024] First, a predetermined coating process is performed on a wafer, and then the wafer is removed from the housing 2 of the spin coater 1. Then, the cleaning jig 50 is carried into the housing 2 and held by the spin chuck 4. As described above, the cleaning jig 50 has the same shape and size as the wafer except for its thickness, so the transfer arm for transferring the wafer can be used as is. In addition, while the cleaning jig 50 is not in use, it can be kept on standby in a wafer storage location, such as a buffer unit or a storage cabinet, in the coating and developing processing apparatus in which this type of spin coater 1 is mounted.

[0025] Next, while rotating the cleaning jig 50 at a relatively low speed, cleaning liquid is supplied from the cleaning nozzle 31 toward the bottom 53 on the lower surface of the cleaning jig 50. Then, as shown in Fig. 7, the cleaning liquid flows along the surface of the bottom 53 toward the outer periphery, and some of it falls onto the inner slope 21 and outer slope 22 of the inner cup 20, and these surfaces are cleaned by the cleaning liquid. The supply to the inner slope 21 and outer slope 22 is controlled by, for example, the discharge flow rate of the cleaning liquid and the rotation speed of the cleaning jig 50.

[0026] In this case, another portion of the cleaning liquid flowing along the surface of bottom 53 toward the outer periphery enters holes 61 in peripheral bottom 55, flows around the entire upper circumference of peripheral bottom 55, and is retained from the inlet of hole 61 to the entire upper circumferential region of peripheral bottom 55 due to surface tension, forming a pool of cleaning liquid T. In this case, by connecting each hole 61 to lower surface 56b inside discharge port 56 at a position closer to the center of cleaning jig 50 in plan view, more cleaning liquid can be stored from the back of hole 61, and as a result, the amount of pool of liquid T to be stored can be increased.

[0027] After cleaning of the inner slope 21 and the outer slope 22 of the inner cup 20 is completed, the cleaning jig 50 is then rotated at a relatively high speed. Then, as shown in Fig. 8, the puddle T of the cleaning liquid that had formed from the entrance of the hole 61 of the cleaning jig 50 to the guide path 62 is pushed outward by centrifugal force and splashed from the discharge port 56 toward the lower end 11a of the block body 11 of the outer cup 10. This cleans the lower end 11a of the block body 11 and its surrounding area.

[0028] Therefore, compared to the conventional method of scattering the cleaning liquid in the horizontal direction, it is possible to clean a wider area in the vertical direction. Also, as described above, the cleaning liquid flows along the surface of the bottom 53 toward the outer periphery, and part of it falls onto the inner slope 21 and the outer slope 22 of the inner cup 20 to clean these surfaces. Therefore, according to this embodiment, the cleaning liquid can be supplied in the scattering direction toward each of the block body 11 and the inner cup 20, and efficient cleaning is possible without being affected by the state of contamination of each other. In addition, in the above embodiment, the multiple holes 61 are formed independently of each other and extend to the lower surface 56b inside the discharge port 56. Therefore, when the cleaning liquid rises from the bottom 53 of the cleaning jig 50 to the lower surface 56b inside the discharge port 56, it flows through a short flow path without interfering with each other, making it easier to guide the cleaning liquid to the space inside the discharge port 56. 6, it is possible to adjust the scattering area in the height direction of the cleaning liquid. In this case, the maximum angle of the elevation angle θ is preferably set so that the upper end of the exterior cup 10 (the upper end 11b of the block body 11 in this embodiment) is located at a position higher than the extension line of the lower surface side of the peripheral ceiling portion 54. This makes it possible to more reliably prevent the mist of the cleaning liquid scattered from the discharge port 56 from scattering outside the exterior cup 10.

[0029] In addition, in this embodiment, the guide path 62 has a shape in which the cross-sectional area of ​​the flow path increases toward the discharge port 56, so that the cleaning liquid in the puddle T is not prevented from scattering outward due to centrifugal force, and therefore the cleaning liquid in the puddle T can be scattered appropriately.

[0030] In this embodiment, the holes 61 are arc-shaped in plan view, but of course this is not the only option, and holes of other shapes can be used, and the number of holes 61 is not limited to that of this embodiment. The holes do not all need to be the same size, and a combination of large and small holes may be arranged. This makes it possible to change the amount of cleaning liquid to be splashed toward the exterior cup 10 during the cleaning process, and to achieve an appropriate cleaning effect depending on the state of the coating liquid attached to the exterior cup 10. From this perspective, the holes 61 do not necessarily need to be arranged at equal intervals.

[0031] Furthermore, in the embodiment described above, the peripheral ceiling portion 54 and the peripheral bottom portion 55 have the same outward protruding length, but this is not limited thereto, and the protruding length of the peripheral bottom portion 55 may be made longer than the protruding length of the peripheral ceiling portion 54. This allows the liquid puddle T to be scattered in an orderly manner in a more upward direction.

[0032] Furthermore, in such a method for cleaning the outer cup 10, if the amount of cleaning liquid in the puddle T is insufficient, the cleaning jig 50 is rotated again at a relatively low speed and the supply of cleaning liquid from the cleaning nozzle 31 is resumed to form a puddle T again, after which the supply of cleaning liquid from the cleaning nozzle 31 is stopped and the cleaning jig 50 is rotated again at a relatively high speed. In other words, a combination of relatively low rotation and supply of cleaning liquid from the cleaning nozzle 31 and a combination of relatively high rotation and stopping the supply of cleaning liquid from the cleaning nozzle 31 may be repeated. This makes it possible to eliminate the shortage of cleaning liquid in the outer cup 10.

[0033] The embodiments disclosed herein should be considered as illustrative and not restrictive in all respects. The above-described embodiments may be omitted, substituted, or modified in various forms without departing from the scope and spirit of the appended claims. [Explanation of symbols]

[0034] 1 Rotary coating device 3 containers 10 Outer Cup 20 Inner Cup 50 Cleaning fixture 54 Periphery ceiling 55 Bottom rim 56 Discharge port 61 holes 62 Taxiway 100 Control section T Liquid pool

Claims

1. A cleaning method for a spin coating apparatus that supplies a processing liquid onto a substrate held by a spin holding device disposed in a container and forms a film of the processing liquid on the substrate by rotating the substrate, the method comprising the steps of: cleaning the spin coating apparatus by holding a disk-shaped cleaning jig similar to the substrate on the spin holding device, the method comprising the steps of: the container has an outer cup that is open at the top and that is provided so as to surround the substrate held by the rotating and holding device, and an inner cup that is located below the substrate held by the rotating and holding device and that discharges a liquid toward a drainage port; The cleaning jig has a peripheral ceiling portion and a peripheral bottom portion formed in a circumferential direction on a peripheral portion thereof, A discharge port is formed between the peripheral ceiling portion and the peripheral bottom portion in a continuous circumferential direction around the entire circumference, A plurality of holes, which are inlets of induction paths leading to the discharge port, are formed at intervals in the circumferential direction on the peripheral bottom portion, The lower surface of the peripheral ceiling portion is inclined obliquely toward the outer periphery, supplying a cleaning liquid to a bottom portion of the cleaning jig while rotating the cleaning jig at a first rotation speed in a state where the cleaning jig is held by the rotation holding device, and allowing the cleaning liquid to accumulate in the discharge port from the bottom portion through the guide path and reach the inner cup; Next, while rotating the cleaning jig at a second rotation speed higher than the first rotation speed, the cleaning liquid accumulated at the discharge port is allowed to reach a portion of the outer cup located above the discharge port. A cleaning method comprising:

2. The cleaning method according to claim 1 , wherein the guide path has a shape in which a flow path cross-sectional area increases toward the discharge port.

3. The cleaning method according to claim 1 , wherein the holes are each arc-shaped in the circumferential direction and are provided at equal intervals.

4. A coating apparatus that supplies a coating liquid onto a substrate in a container and forms a film of the coating liquid on the substrate by rotating the substrate, comprising: a rotation holding device capable of holding and rotating the substrate; a container having an outer cup with an open top and arranged to surround the substrate held by the rotating and holding device, and an inner cup located below the substrate held by the rotating and holding device for discharging a liquid toward a drainage port; A control unit, the rotating and holding device is capable of holding a disk-shaped cleaning jig similar to the substrate, A peripheral ceiling portion and a peripheral bottom portion are formed in the peripheral portion of the cleaning jig in the circumferential direction, and a discharge port is formed continuously in the circumferential direction between the peripheral ceiling portion and the peripheral bottom portion around the entire circumference, and a plurality of holes which are inlets of guide paths leading to the discharge port are formed at intervals in the circumferential direction in the peripheral bottom portion, and the lower surface of the peripheral ceiling portion is inclined obliquely toward the outer periphery and upward, The control unit is supplying a cleaning liquid to a bottom portion of the cleaning jig while rotating the cleaning jig at a first rotation speed in a state in which the cleaning jig is held by the rotation holding device, and causing the cleaning liquid to flow from the bottom portion through the guide path to accumulate in the discharge port and reach the inner cup; Next, while rotating the cleaning jig at a second rotation speed higher than the first rotation speed, the cleaning liquid accumulated at the discharge port is allowed to reach a portion of the outer cup located above the discharge port. The coating device controls the cleaning process by the cleaning jig so as to perform the above.

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