Processing equipment

Abstract

To provide a processing device that can appropriately process an object.SOLUTION: A processing device, which processes an object by irradiating the object with processing light from a processing light source, comprises: a synthetic optical system that synthesizes the processing light from the processing light source with measurement light including pulse light; an irradiation optical system that irradiates the object with the processing light and the measurement light synthesized through the synthetic optical system; and an irradiation position changing optical system, to which the processing light and the measurement light synthesized through the synthetic optical system are made to incident, which changes an irradiation position of the processing light on the object and an irradiation position of the measurement light on the object.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to the technical field of a processing device capable of processing an object with processing light. [Background technology]

[0002] As an example of a processing device capable of processing an object, Patent Document 1 describes a processing device that forms a structure by irradiating a processing light onto the surface of an object. This type of processing device is required to process the object appropriately. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] U.S. Patent No. 4,994,639 Summary of the Invention

[0004] According to a first aspect, there is provided a processing apparatus that processes an object by irradiating the object with processing light from a processing light source, the processing apparatus comprising: a synthesis optical system that combines the processing light from the processing light source and measurement light including pulsed light; an irradiation optical system that irradiates the processing light and the measurement light via the synthesis optical system onto the object; and an irradiation position changing optical system into which the processing light and the measurement light via the synthesis optical system are incident and which changes the irradiation position of the processing light on the object and the irradiation position of the measurement light on the object. [Brief description of the drawings]

[0005] [Figure 1] FIG. 1 is a cross-sectional view that illustrates a schematic overall structure of a processing system according to a first embodiment. [Diagram 2] FIG. 2 is a system configuration diagram showing the system configuration of the machining system according to the first embodiment. [Diagram 3] FIG. 3 is a cross-sectional view showing the structure of the machining head of the first embodiment. [Figure 4]FIG. 4 is a cross-sectional view partially showing the optical path of the processing light and the optical path of the measurement light between the combining optical system and the workpiece. [Diagram 5] FIG. 5 is a plan view showing an irradiated region irradiated with processing light and an irradiated region irradiated with measurement light. [Figure 6] Each of FIGS. 6(a) to 6(c) is a timing chart showing the irradiation timing of the processing light and the irradiation timing of the measurement light. [Figure 7] FIG. 7 is a cross-sectional view partially showing the optical path of the processing light and the optical path of the measurement light between the combining optical system and the workpiece. [Figure 8] FIG. 8 is a plan view showing an irradiated region irradiated with processing light and an irradiated region irradiated with measurement light. [Figure 9] FIG. 9 is a cross-sectional view partially showing the optical path of the processing light and the optical path of the measurement light between the combining optical system and the workpiece. [Figure 10] FIG. 10 is a timing chart showing the measurement light incident on the detector and the interference light detected by the detector. [Figure 11] FIG. 11 is a cross-sectional view showing the structure of a head driving system. [Figure 12] FIG. 12 is a cross-sectional view showing the structure of a second driving system included in the head driving system. [Figure 13] FIG. 13 is a cross-sectional view showing the structure of the machining head according to the second embodiment. [Figure 14] FIG. 14 is a cross-sectional view showing the structure of the machining head according to the third embodiment. [Figure 15] FIG. 15 is a cross-sectional view showing another example of the structure of the processing head according to the third embodiment. [Figure 16] FIG. 16 is a cross-sectional view showing another example of the structure of the processing head according to the third embodiment. [Figure 17] FIG. 17 is a cross-sectional view showing another example of the structure of the processing head according to the third embodiment. [Figure 18] FIG. 18 is a cross-sectional view showing another example of the structure of the processing head according to the third embodiment. [Figure 19]FIG. 19 is a cross-sectional view showing the structure of a machining head according to the fourth embodiment. [Figure 20] FIG. 20 is a cross-sectional view showing the structure of the machining head according to the fifth embodiment. [Figure 21] FIG. 21 is a cross-sectional view showing a processing head to which the first optical system candidate is attached as a common optical system. [Figure 22] FIG. 22 is a cross-sectional view showing a processing head to which the second optical system candidate is attached as a common optical system. [Figure 23] FIG. 23 is a cross-sectional view showing a processing head to which the third optical system candidate is attached as a common optical system. [Figure 24] FIG. 24 is a cross-sectional view that illustrates a schematic overall structure of a processing system according to the seventh embodiment. [Diagram 25] FIG. 25 is a cross-sectional view showing the structure of the machining head of the eighth embodiment. [Figure 26] FIG. 26 is a cross-sectional view illustrating a schematic overall structure of a processing system according to the ninth embodiment. [Figure 27] FIG. 27 is a system configuration diagram showing the system configuration of the machining system according to the ninth embodiment. [Figure 28] FIG. 28 is a cross-sectional view showing the structure of the machining head of the ninth embodiment. [Figure 29] FIG. 29 is a cross-sectional view showing the structure of a measurement head according to the ninth embodiment. [Diagram 30] FIG. 30 is a cross-sectional view that illustrates a schematic overall structure of a processing system according to the tenth embodiment. [Diagram 31] FIG. 31 is a cross-sectional view that typically shows the overall structure of a processing system according to the eleventh embodiment. [Diagram 32] FIG. 32 is a cross-sectional view illustrating a schematic overall structure of a processing system according to the twelfth embodiment. [Diagram 33] FIG. 33 is a cross-sectional view showing an example of the structure of a processing device equipped with an end effector. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0006] Hereinafter, embodiments of a processing device, a processing member, a robot system, and a measuring device will be described with reference to the drawings. Hereinafter, embodiments of a processing device, a processing member, a robot system, and a measuring device will be described using a processing system SYS that processes a workpiece W using processing light EL. However, the present invention is not limited to the embodiments described below.

[0007] In the following description, the positional relationship of various components constituting the machining system SYS will be described using an XYZ orthogonal coordinate system defined by mutually orthogonal X-axis, Y-axis, and Z-axis. For convenience of explanation, the X-axis direction and the Y-axis direction are each assumed to be horizontal (i.e., a predetermined direction in a horizontal plane), and the Z-axis direction is assumed to be vertical (i.e., a direction perpendicular to the horizontal plane, essentially an up-down direction). The rotation directions (in other words, tilt directions) around the X-axis, Y-axis, and Z-axis are referred to as the θX direction, the θY direction, and the θZ direction, respectively. Here, the Z-axis direction may be the direction of gravity. The XY plane may be the horizontal direction.

[0008] (1) Machining system SYSa according to the first embodiment First, a machining system SYS of a first embodiment (hereinafter, the machining system SYS of the first embodiment will be referred to as a "machining system SYSa") will be described.

[0009] (1-1) Structure of the processing system SYSa First, the structure of the machining system SYSa of the first embodiment will be described with reference to Fig. 1 and Fig. 2. Fig. 1 is a cross-sectional view showing the structure of the machining system SYSa of the first embodiment. Fig. 2 is a system configuration diagram showing the system configuration of the machining system SYSa of the first embodiment.

[0010] 1 and 2, the processing system SYSa includes a processing apparatus 1, a stage apparatus 3, and a control device 5. The processing apparatus 1 and the stage apparatus 3 are housed in a housing 4. However, the processing apparatus 1 and the stage apparatus 3 do not have to be housed in the housing 4. In other words, the processing system SYSa does not have to include a housing 4 that houses the processing apparatus 1 and the stage apparatus 3.

[0011] The processing device 1 is capable of processing the workpiece W under the control of the control device 5. The workpiece W may be, for example, a metal, an alloy (for example, duralumin, etc.), a semiconductor (for example, silicon), a resin (for example, CFRP (Carbon Fiber Reinforced Plastic) or paint (for example, a paint layer applied to a base material), etc.), glass, or an object made of any other material.

[0012] The processing device 1 irradiates the workpiece W with processing light EL in order to process the workpiece W. The processing light EL may be any type of light as long as it can process the workpiece W by irradiating it on the workpiece W. In the first embodiment, the processing light EL is described using an example in which the processing light EL is laser light, but the processing light EL may be a type of light other than laser light. Furthermore, the wavelength of the processing light EL may be any wavelength as long as it can process the workpiece W by irradiating it on the workpiece W. For example, the processing light EL may be visible light or invisible light (e.g., at least one of infrared light and ultraviolet light). The processing light EL includes pulsed light, but may not include pulsed light. In other words, the processing light EL may be continuous light.

[0013] The processing device 1 may irradiate the workpiece W with processing light EL to perform a removal process (typically, a cutting process or a grinding process) for removing a part of the workpiece W. When performing a removal process, the processing device 1 may form a riblet structure on the workpiece W. The riblet structure is a structure that can reduce the resistance of the surface of the workpiece W to a fluid (particularly, frictional resistance, turbulent frictional resistance). The riblet structure may include, for example, a structure in which a plurality of grooves extending in a first direction (e.g., the Y-axis direction) along the surface of the workpiece W are arranged along a second direction (e.g., the X-axis direction) along the surface of the workpiece W and intersecting the first direction.

[0014] In addition to or instead of the removal processing, the processing device 1 may perform additional processing to add a new structure to the workpiece W by irradiating the workpiece W with processing light EL. In this case, the processing device 1 may perform the additional processing to form the above-mentioned riblet structure on the surface of the workpiece W. In addition to or instead of at least one of the removal processing and the additional processing, the processing device 1 may perform marking processing to form a desired mark on the surface of the workpiece W by irradiating the workpiece W with processing light EL.

[0015] The processing device 1 can further measure the workpiece W under the control of the control device 5. The processing device 1 irradiates the workpiece W with measurement light ML in order to measure the workpiece W. The measurement light ML may be any type of light as long as it can measure the workpiece W by irradiating it on the workpiece W. In the first embodiment, an example will be described in which the measurement light ML is laser light, but the measurement light ML may be a type of light other than laser light. Furthermore, the wavelength of the measurement light ML may be any wavelength as long as it can measure the workpiece W by irradiating it on the workpiece W. For example, the measurement light ML may be visible light or invisible light (e.g., at least one of infrared light and ultraviolet light). The measurement light ML includes pulsed light.

[0016] The wavelength of the measurement light ML may be different from the wavelength of the processing light EL. For example, the wavelength of the measurement light ML may be shorter than the wavelength of the processing light EL. As an example, light in the wavelength band of 266 nm or 355 nm may be used as the measurement light ML, and light in the wavelength band of 532 nm, 1 μm, or 10 μm may be used as the processing light EL. In this case, the spot diameter of the measurement light ML on the workpiece W is smaller than the spot diameter of the processing light EL on the workpiece W. As a result, the measurement resolution by the measurement light ML is higher than the processing resolution by the processing light EL. However, the wavelength of the measurement light ML does not have to be shorter than the wavelength of the processing light EL. The wavelength of the measurement light ML may be the same as the wavelength of the processing light EL.

[0017] The processing device 1 may be capable of measuring the state of the workpiece W. The state of the workpiece W may include the position of the workpiece W. The position of the workpiece W may include the position of the surface of the workpiece W. The position of the surface of the workpiece W may include the position of each surface portion obtained by dividing the surface of the workpiece W in at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction. The state of the workpiece W may include the shape of the workpiece W (e.g., a three-dimensional shape). The shape of the workpiece W may include the shape of the surface of the workpiece W. The shape of the surface of the workpiece W may include the orientation of each surface portion obtained by dividing the surface of the workpiece W (e.g., the orientation of the normal of each surface portion, which is substantially equivalent to the amount of inclination of each surface portion with respect to at least one of the X-axis, the Y-axis, and the Z-axis) in addition to or instead of the position of the surface of the workpiece W described above. The state of the workpiece W may include the size of the workpiece W (e.g., the size in at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction).

[0018] In order to process and measure the workpiece W, the processing device 1 includes a processing head 11 that emits the processing light EL and the measurement light ML to the workpiece W, and a head drive system 12 that moves the processing head 11. The processing head 11 means any member capable of emitting the processing light EL and the measurement light ML to the workpiece W. Therefore, although the processing head 11 includes the term "head", it does not necessarily mean a member attached to the tip of some member. Therefore, the processing head 11 may be referred to as a processing member. Furthermore, the processing head 11 includes a processing light source 111, a processing optical system 112, a measurement light source 113, a measurement optical system 114, a composite optical system 115, and a common optical system 116. The structures of the processing head 11 and the head drive system 12 will be described in detail later.

[0019] The head drive system 12 moves the processing head 11 along at least one of the X-axis direction, the Y-axis direction, the Z-axis direction, the θX direction, the θY direction, and the θZ direction. When the processing head 11 moves, the positional relationship between the stage 32 (and the workpiece W placed on the stage 32) and the processing head 11 changes. In other words, when the stage 32 moves, the relative positions of the stage 32, the workpiece W, and the processing head 11 change. Therefore, moving the stage 32 is equivalent to changing the positional relationship between the stage 32, the workpiece W, and the processing head 11. Furthermore, when the positional relationship between the stage 32, the workpiece W, and the processing head 11 changes, the positional relationship between the stage 32, the workpiece W, and each optical system (that is, at least one of the processing optical system 112, the measurement optical system 114, the synthesis optical system 115, and the common optical system 116) of the processing head 11 changes. Therefore, moving the processing head 11 is equivalent to changing the positional relationship between the stage 32, the workpiece W, and each optical system of the processing head 11. Furthermore, when the positional relationship between the stage 32, the workpiece W, and the machining head 11 changes, the positional relationship between the stage 32, the workpiece W, and the housing 117 of the machining head 11 changes. Therefore, moving the machining head 11 is equivalent to changing the positional relationship between the stage 32, the workpiece W, and the housing 117 of the machining head 11. Furthermore, when the positional relationship between the stage 32, the workpiece W, and the machining head 11 changes, the irradiation positions of the processing light EL and the measurement light ML on the workpiece W change. Therefore, moving the machining head 11 is equivalent to changing the irradiation positions of the processing light EL and the measurement light ML on the workpiece W.

[0020] The stage device 3 includes a base plate 31 and a stage 32. The base plate 31 is disposed on the bottom surface of the housing 4 (or on a support surface such as a floor surface on which the housing 4 is placed). The stage 32 is disposed on the base plate 31. A vibration isolation device (not shown) for reducing transmission of vibration of the base plate 31 to the stage 32 may be provided between the base plate 31 and the bottom surface of the housing 4 or a support surface such as a floor surface on which the housing 4 is placed. Furthermore, a support frame (not shown) for supporting the processing device 1 may be disposed on the base plate 31.

[0021] A workpiece W is placed on the stage 32. The stage 32 may hold the placed workpiece W. For example, the stage 32 may hold the workpiece W by vacuum adsorption and / or electrostatic adsorption of the workpiece W. Alternatively, the stage 32 may not hold the placed workpiece W.

[0022] The stage 32 can move on the base plate 31 with the workpiece W placed thereon under the control of the control device 5. The stage 32 can move relative to at least one of the base plate 31 and the processing device 1. The stage 32 can move along each of the X-axis direction and the Y-axis direction. In this case, the stage 32 can move along a stage running surface (moving surface) parallel to the XY plane. The stage 32 may further be movable along at least one of the Z-axis direction, the θX direction, the θY direction, and the θZ direction. In order to move the stage 32, the stage device 3 includes a stage drive system 33. The stage drive system 33 moves the stage 32 using, for example, any motor (for example, a linear motor, etc.). Furthermore, the stage device 3 may include a stage position measuring device for measuring the position of the stage 32. The stage position measuring device may include, for example, at least one of an encoder and a laser interferometer.

[0023] When the stage 32 moves, the positional relationship between the stage 32 (and the workpiece W placed on the stage 32) and the machining head 11 changes. In other words, when the stage 32 moves, the relative positions of the machining head 11, the stage 32, and the workpiece W change. Therefore, moving the stage 32 is equivalent to changing the positional relationship between the stage 32, the workpiece W, and the machining head 11. Furthermore, when the positional relationship between the stage 32, the workpiece W, and the machining head 11 changes, the positional relationship between the stage 32, the workpiece W, and the housing 117 of the machining head 11 changes. Therefore, moving the stage 32 is equivalent to changing the positional relationship between the stage 32, the workpiece W, and the housing 117 of the machining head 11. Furthermore, when the positional relationship between the stage 32, the workpiece W, and the machining head 11 changes, the positional relationship between the stage 32, the workpiece W, and each optical system provided in the machining head 11 changes. Therefore, moving the stage 32 is equivalent to changing the positional relationship between the stage 32, the workpiece W, and each optical system provided in the machining head 11. Furthermore, when the positional relationship between the stage 32, the workpiece W, and the processing head 11 changes, the irradiation positions of the processing light EL and the measurement light ML on the workpiece W change. Therefore, moving the stage 32 is equivalent to changing the irradiation positions of the processing light EL and the measurement light ML on the workpiece W.

[0024] The control device 5 controls the operation of the machining system SYSa. For example, the control device 5 sets machining conditions for the workpiece W, and controls the machining device 1 and the stage device 3 so that the workpiece W is machined according to the set machining conditions. For example, the control device 5 sets measurement conditions for the workpiece W, and controls the machining device 1 and the stage device 3 so that the workpiece W is measured according to the set measurement conditions.

[0025] The control device 5 may include, for example, a central processing unit (CPU) (or a graphics processing unit (GPU) in addition to or instead of the CPU) and a memory. The control device 5 functions as a device that controls the operation of the machining system SYSa by the CPU executing a computer program. This computer program is a computer program for making the control device 5 (for example, the CPU) perform (i.e., execute) the operation to be performed by the control device 5, which will be described later. In other words, this computer program is a computer program for making the control device 5 function so as to make the machining system SYSa perform the operation to be described later. The computer program executed by the CPU may be recorded in a memory (i.e., a recording medium) provided in the control device 5, or may be recorded in any storage medium (for example, a hard disk or a semiconductor memory) built into the control device 5 or externally attachable to the control device 5. Alternatively, the CPU may download the computer program to be executed from a device external to the control device 5 via a network interface.

[0026] The control device 5 may not be provided inside the processing system SYSa, and may be provided as a server or the like outside the processing system SYSa. In this case, the control device 5 and the processing system SYSa may be connected by a wired and / or wireless network (or a data bus and / or a communication line). As the wired network, a network using a serial bus type interface, for example, typified by at least one of IEEE1394, RS-232x, RS-422, RS-423, RS-485, and USB, may be used. As the wired network, a network using a parallel bus type interface may be used. As the wired network, a network using an interface conforming to Ethernet (registered trademark), for example, typified by at least one of 10BASE-T, 100BASE-TX, and 1000BASE-T, may be used. As the wireless network, a network using radio waves may be used. As an example of a network using radio waves, a network conforming to IEEE802.1x (for example, at least one of wireless LAN and Bluetooth (registered trademark)) may be mentioned. As the wireless network, a network using infrared rays may be used. A network using optical communication may be used as the wireless network. In this case, the control device 5 and the processing system SYSa may be configured to be able to transmit and receive various information via the network. The control device 5 may be able to transmit information such as commands and control parameters to the processing system SYSa via the network. The processing system SYSa may include a receiving device that receives information such as commands and control parameters from the control device 5 via the network. Alternatively, a first control device that performs a part of the processing performed by the control device 5 may be provided inside the processing system SYSa, while a second control device that performs another part of the processing performed by the control device 5 may be provided outside the processing system SYSa.

[0027] As a recording medium for recording the computer program executed by the CPU, at least one of CD-ROM, CD-R, CD-RW, flexible disk, MO, DVD-ROM, DVD-RAM, DVD-R, DVD+R, DVD-RW, DVD+RW, Blu-ray (registered trademark), and other optical disks, magnetic media such as magnetic tape, magneto-optical disk, semiconductor memory such as USB memory, and any other medium capable of storing a program may be used. The recording medium may include a device capable of recording a computer program (for example, a general-purpose device or a dedicated device in which a computer program is implemented in a state in which it can be executed in at least one of the forms of software and firmware). Furthermore, each process or function included in the computer program may be realized by a logical processing block realized in the control device 5 by the control device 5 (i.e., a computer) executing the computer program, or may be realized by hardware such as a predetermined gate array (FPGA, ASIC) provided in the control device 5, or may be realized in a form in which a logical processing block and a partial hardware module that realizes some elements of the hardware are mixed.

[0028] (1-2) Structure of the processing head 11 Next, an example of the structure of the processing head 11 will be described with reference to Fig. 3. Fig. 3 is a cross-sectional view showing an example of the structure of the processing head 11.

[0029] 3, the processing head 11 includes a processing light source 111, a processing optical system 112, a measurement light source 113, a measurement optical system 114, a composite optical system 115, and a common optical system 116. The processing light source 111, the processing optical system 112, the measurement light source 113, the measurement optical system 114, the composite optical system 115, and the common optical system 116 are housed in a housing 117. However, at least one of the processing light source 111, the processing optical system 112, the measurement light source 113, the measurement optical system 114, the composite optical system 115, and the common optical system 116 does not have to be housed in the housing 117.

[0030] The processing light source 111 is capable of generating the processing light EL. When the processing light EL is laser light, the processing light source 111 may include, for example, a laser diode. Furthermore, the processing light source 111 may be a light source capable of pulse oscillation. In this case, the processing light source 111 is capable of generating pulsed light (for example, pulsed light having an emission time of picoseconds or less) as the processing light EL. The processing light source 111 emits the generated processing light EL toward the processing optical system 112.

[0031] The processing optical system 112 is an optical system into which the processing light EL emitted from the processing light source 111 is incident. The processing optical system 112 is an optical system that emits the processing light EL incident on the processing optical system 112 toward the combining optical system 115. In other words, the processing optical system 112 is an optical system that guides the processing light EL emitted from the processing light source 111 to the combining optical system 115. The processing light EL emitted by the processing optical system 112 is irradiated onto the workpiece W via the combining optical system 115 and the common optical system 116. For this reason, it can also be said that the processing optical system 112 is an optical system that emits the processing light EL toward the workpiece W via the combining optical system 115 and the common optical system 116.

[0032] The processing optical system 112 includes a position adjustment optical system 1121 and an angle adjustment optical system 1122. The position adjustment optical system 1121 can adjust the emission position of the processing light EL from the processing optical system 112. The position adjustment optical system 1121 includes, for example, a parallel plane plate that can be tilted with respect to the traveling direction of the processing light EL, and changes the position of the processing light by changing the tilt angle of the parallel plane plate. In the example of FIG. 3, the emission position of the processing light EL can be set to any position in the YZ plane by using multiple parallel plane plates with different tilt directions. When the emission position of the processing light EL from the processing optical system 112 changes, the incident angle of the processing light EL (for example, the incident angle with respect to the workpiece W) changes. The angle adjustment optical system 1122 can adjust the emission angle of the processing light EL from the processing optical system 112. The angle adjustment optical system 1122 includes, for example, a mirror that can be tilted with respect to the traveling direction of the processing light EL, and changes the emission angle of the processing light by changing the tilt angle of this mirror. 3, the emission angle of the processing light EL can be set to any direction around the θX axis and the θY axis by using multiple mirrors with different tilt directions. When the emission angle of the processing light EL from the processing optical system 112 changes, the irradiation position of the processing light EL (for example, the irradiation position on the workpiece W) changes. However, the processing optical system 112 does not have to include at least one of the position adjustment optical system 1121 and the angle adjustment optical system 1122. The processing optical system 112 may include other optical elements or optical members (which may be referred to as optical systems, the same applies below) in addition to or instead of at least one of the position adjustment optical system 1121 and the angle adjustment optical system 1122.

[0033] The processing light EL emitted from the processing optical system 112 enters the combining optical system 115. The combining optical system 115 includes a beam splitter (e.g., a polarizing beam splitter) 1151. The beam splitter 1151 emits the processing light EL incident on the beam splitter 1151 toward the common optical system 116. In the example shown in FIG. 3, the processing light EL incident on the beam splitter 1151 is emitted toward the common optical system 116 by transmitting through a polarization separation surface. For this reason, in the example shown in FIG. 3, the processing light EL enters the polarization separation surface of the polarizing beam splitter 1151 in a state having a polarization direction that can be transmitted through the polarization separation surface (a polarization direction that becomes p-polarized light with respect to the polarization separation surface).

[0034] The processing light EL emitted from the combining optical system 115 is incident on the common optical system 116. The common optical system 116 emits the processing light EL incident on the common optical system 116 toward the workpiece W. The common optical system 116 includes a galvanometer mirror 1161 and an fθ lens 1162.

[0035] The processing light EL emitted from the synthesis optical system 115 is incident on the galvanometer mirror 1161. The galvanometer mirror 1161 changes the irradiation position of the processing light EL on the workpiece W by deflecting the processing light EL (i.e., changing the emission angle of the processing light EL). In other words, the galvanometer mirror 1161 changes the position of the irradiated area EA that is set on the workpiece W or on the optical path of the processing light EL as an area irradiated with the processing light EL by deflecting the processing light EL. Since the galvanometer mirror 1161 is disposed at or near the entrance pupil position of the fθ lens 1162, the change in the emission angle of the processing light EL by the galvanometer mirror 1161 is converted by the fθ lens 1162 into a change in the irradiation position of the processing light EL (i.e., the position of the irradiated area EA). For example, the galvanometer mirror 1161 includes an X-scanning mirror 1161X and a Y-scanning mirror 1162Y. Each of the X-scan mirror 1161X and the Y-scan mirror 1162Y is a tilt-angle variable mirror whose angle with respect to the optical path of the processing light EL incident on the galvanometer mirror 1161 is changed. The X-scan mirror 1161X deflects the processing light EL by swinging or rotating so as to change the irradiation position of the processing light EL on the workpiece W along the X-axis direction (i.e., changing the angle of the X-scan mirror 1161X with respect to the optical path of the processing light EL). The Y-scan mirror 1161Y deflects the processing light EL by swinging or rotating so as to change the irradiation position of the processing light EL on the workpiece W along the Y-axis direction (i.e., changing the angle of the Y-scan mirror 1161Y with respect to the optical path of the processing light EL).

[0036] The processing light EL from the galvanometer mirror 1161 is incident on the fθ lens 1162. Therefore, the galvanometer mirror 1161 is disposed on the optical path of the processing light EL between the synthesis optical system 115 and the fθ lens 1162. The fθ lens 1162 is disposed on the optical path of the processing light EL between the galvanometer mirror 1161 and the workpiece W. The fθ lens 1162 is disposed on the optical path of the processing light EL between the galvanometer mirror 1161 and the irradiated area EA. The fθ lens 1162 is an optical system for irradiating the processing light EL from the galvanometer mirror 1161 to the irradiated area EA. In particular, the fθ lens 1162 is an optical system for converging the processing light EL from the galvanometer mirror 1161 on the workpiece W. Therefore, the fθ lens 1162 irradiates the processing light EL in a convergent state to the workpiece W. As a result, the workpiece W is processed by the processing light EL. The fθ lens 1162 may be referred to as an irradiation optical system because it irradiates the processing light EL onto the workpiece W. The range of movement of the irradiated area EA moved on the workpiece W by the galvanometer mirror 1161 may be referred to as the processed area. In other words, the irradiated area EA may move within the processed area.

[0037] Next, the measurement light source 113 can generate the measurement light ML. When the measurement light ML is laser light, the measurement light source 113 may include, for example, a laser diode. In particular, since the measurement light ML includes pulsed light as described above, the measurement light source 113 is a light source capable of pulse oscillation. In this case, the measurement light source 113 can generate pulsed light (for example, pulsed light having an emission time of picoseconds or less) as the measurement light ML. The measurement light source 113 emits the generated measurement light ML toward the measurement optical system 114.

[0038] In the first embodiment, the measurement light source 113 includes an optical frequency comb light source. The optical frequency comb light source is a light source capable of generating light including frequency components equally spaced on a frequency axis (hereinafter referred to as an "optical frequency comb") as pulsed light. In this case, the measurement light source 113 emits pulsed light including frequency components equally spaced on a frequency axis as measurement light ML.

[0039] In the example shown in FIG. 1, the processing head 11 includes a plurality of measurement light sources 113. For example, the processing head 11 includes a measurement light source 113#1 and a measurement light source 113#2. The plurality of measurement light sources 113 each emit a plurality of measurement light beams ML that are phase-synchronized with each other and have coherence. For example, the plurality of measurement light sources 113 may have different oscillation frequencies. Therefore, the plurality of measurement light beams ML emitted by the plurality of measurement light sources 113 each become a plurality of measurement light beams ML with different pulse frequencies (for example, the number of pulse light beams per unit time, which is the reciprocal of the emission period of the pulse light). As an example, the measurement light source 113#1 may emit a measurement light ML#1 with a pulse frequency of 25 GHz, and the measurement light source 113#2 may emit a measurement light ML#2 with a pulse frequency of 25 GHz+α (for example, +100 kHz).

[0040] The measurement optical system 114 is an optical system into which the measurement light ML emitted from the measurement light source 113 is incident. The measurement optical system 114 is an optical system that emits the measurement light ML incident on the measurement optical system 114 toward the synthesis optical system 115. In other words, the measurement optical system 114 is an optical system that guides the measurement light ML emitted from the measurement light source 113 to the synthesis optical system 115. The measurement light ML emitted by the measurement optical system 114 is irradiated onto the workpiece W via the synthesis optical system 115 and the common optical system 116. For this reason, the measurement optical system 114 can also be said to be an optical system that emits the measurement light ML toward the workpiece W via the synthesis optical system 115 and the common optical system 116.

[0041] The measurement optical system 114 is optically separated from the processing optical system 112. Therefore, the optical path of the processing light EL between the processing light source 111 and the combining optical system 115 and the optical path of the measurement light ML between the measurement light source 113 and the combining optical system 115 are optically separated. Note that, "one optical system is optically separated from another optical system" may mean that the optical path of one optical system and the optical path of another optical system do not overlap each other.

[0042] The measurement optical system 114 includes, for example, a beam splitter 1141 , a beam splitter 1142 , a detector 1143 , a beam splitter 1144 , a mirror 1145 , a detector 1146 , and a mirror 1147 .

[0043] The measurement light ML emitted from the measurement light source 113 is incident on the beam splitter 1141. Specifically, the measurement light ML emitted from the measurement light source 113#1 (hereinafter referred to as “measurement light ML#1”) and the measurement light ML emitted from the measurement light source 113#2 (hereinafter referred to as “measurement light ML#2”) are incident on the beam splitter 1141. The beam splitter 1141 emits the measurement light ML#1 and ML#2 incident on the beam splitter 1141 toward the beam splitter 1142.

[0044] The beam splitter 1142 reflects measurement light ML#1-1, which is a part of measurement light ML#1 incident on the beam splitter 1142, toward the detector 1143. The beam splitter 1142 emits measurement light ML#1-2, which is the other part of measurement light ML#1 incident on the beam splitter 1142, toward the beam splitter 1144. The beam splitter 1142 reflects measurement light ML#2-1, which is a part of measurement light ML#2 incident on the beam splitter 1142, toward the detector 1143. The beam splitter 1142 emits measurement light ML#2-2, which is the other part of measurement light ML#2 incident on the beam splitter 1142, toward the beam splitter 1144.

[0045] The measurement beams ML#1-1 and ML#2-1 emitted from the beam splitter 1142 are incident on the detector 1143. The detector 1143 detects interference light generated by interference between the measurement beams ML#1-1 and ML#2-1. Specifically, the detector 1143 detects the interference light by receiving the interference light. For this reason, the detector 1143 may include a light receiving element (light receiving unit, typically a photoelectric conversion element) capable of receiving light. The detection result of the detector 1143 is output to the control device 5.

[0046] The measurement beams ML#1-2 and ML#2-2 emitted from the beam splitter 1142 are incident on the beam splitter 1144. The beam splitter 1144 emits at least a portion of the measurement beam ML#1-2 incident on the beam splitter 1144 toward a mirror 1145. The beam splitter 1144 emits at least a portion of the measurement beam ML#2-2 incident on the beam splitter 1144 toward a mirror 1147.

[0047] The measurement light ML#1-2 emitted from the beam splitter 1144 is incident on the mirror 1145. The measurement light ML#1-2 incident on the mirror 1145 is reflected by a reflecting surface of the mirror 1145 (the reflecting surface may be referred to as a reference surface). Specifically, the mirror 1145 reflects the measurement light ML#1-2 incident on the mirror 1145 toward the beam splitter 1144. That is, the mirror 1145 emits the measurement light ML#1-2 incident on the mirror 1145 as the measurement light ML#1-3, which is the reflected light, toward the beam splitter 1144. The measurement light ML#1-3 emitted from the mirror 1145 is incident on the beam splitter 1144. The beam splitter 1144 emits the measurement light ML#1-3 incident on the beam splitter 1144 toward the beam splitter 1142. The measuring beams ML#1-3 emitted from the beam splitter 1144 are incident on the beam splitter 1142. The beam splitter 1142 emits the measuring beams ML#1-3 incident on the beam splitter 1142 towards the detector 1146.

[0048] On the other hand, the measurement light ML#2-2 emitted from the beam splitter 1144 is incident on the mirror 1147. The mirror 1147 reflects the measurement light ML#2-2 incident on the mirror 1147 toward the combining optical system 115. In other words, the mirror 1147 emits the measurement light ML#2-2 incident on the mirror 1147 toward the combining optical system 115.

[0049] The measurement light ML#2-2 emitted from the mirror 1147 enters the combining optical system 115. The beam splitter 1151 of the combining optical system 115 emits the measurement light ML#2-2 incident on the beam splitter 1151 toward the common optical system 116. In the example shown in Fig. 3, the measurement light ML#2-2 incident on the beam splitter 1151 is reflected at the polarization separation surface and thereby emitted toward the common optical system 116. For this reason, in the example shown in Fig. 3, the measurement light ML#2-2 enters the polarization separation surface of the polarizing beam splitter 1151 while having a polarization direction that can be reflected at the polarization separation surface (a polarization direction that becomes s-polarized light with respect to the polarization separation surface).

[0050] Here, as described above, the processing light EL is incident on the beam splitter 1151 in addition to the measurement light ML#2-2. That is, both the measurement light ML#2-2 and the processing light EL pass through the beam splitter 1151. The beam splitter 1151 outputs the processing light EL and the measurement light ML#2-2, which are incident on the beam splitter 1151 from different directions, in the same direction (that is, toward the same common optical system 116). Therefore, the beam splitter 1151 essentially functions as an optical system that combines the processing light EL and the measurement light ML#2-2. Note that the above-mentioned same direction may be the direction of the processing light EL and the measurement light ML#2-2 such that the processing light EL and the measurement light ML#2-2 are incident on the common optical system 116, which is an optical system located on the exit side of the combining optical system 115, and the directions of the processing light EL and the measurement light ML#2-2 may be slightly different as long as the processing light EL and the measurement light ML#2-2 are incident on the common optical system 116.

[0051] The combining optical system 115 may have any structure as long as it can combine the processing light EL and the measurement light ML#2-2. For example, in addition to or instead of using the beam splitter 1151, the combining optical system 115 may combine the processing light EL and the measurement light ML#2-2 using a dichroic mirror that reflects light in a certain wavelength band and transmits light in another wavelength band.

[0052] The measurement light ML#2-2 emitted from the combining optical system 115 is incident on the common optical system 116. The common optical system 116 emits the measurement light ML#2-2 incident on the common optical system 116 toward the workpiece W.

[0053] Specifically, the measurement light ML#2-2 emitted from the synthesis optical system 115 is incident on the galvanometer mirror 1161. The galvanometer mirror 1161 changes the irradiation position of the measurement light ML#2-2 on the workpiece W by deflecting the measurement light ML#2-2. That is, the galvanometer mirror 1161 changes the position of the irradiated area MA that is set on the workpiece W or on the optical path of the measurement light ML#2-2 as the area irradiated with the measurement light ML#2-2 by deflecting the measurement light ML#2-2. Note that since the galvanometer mirror 1161 is disposed at or near the entrance pupil position of the fθ lens 1162, the change in the emission angle of the measurement light ML#2-2 by the galvanometer mirror 1161 is converted by the fθ lens 1162 into a change in the irradiation position of the measurement light ML#2-2 (that is, the position of the irradiated area MA). For example, the X-scanning mirror 1161X deflects the measurement light ML#2-2 by swinging or rotating so as to change the irradiation position of the measurement light ML#2-2 on the workpiece W along the X-axis direction (i.e., changing the angle of the X-scanning mirror 1161X with respect to the optical path of the measurement light ML#2-2). The Y-scanning mirror 1161Y deflects the measurement light ML#2-2 by swinging or rotating so as to change the irradiation position of the measurement light ML#2-2 on the workpiece W along the Y-axis direction (i.e., changing the angle of the Y-scanning mirror 1161Y with respect to the optical path of the measurement light ML#2-2). The galvanometer mirror 1161 may be referred to as an irradiation position changing optical system.

[0054] The measurement light ML#2-2 from the galvanometer mirror 1161 is incident on the fθ lens 1162. The fθ lens 1162 is an optical system for concentrating the measurement light ML#2-2 from the galvanometer mirror 1161 on the workpiece W. The fθ lens 1162 is an optical system for irradiating the measurement light ML#2-2 from the galvanometer mirror 1161 onto the workpiece W. The fθ lens 1162 is an optical system for irradiating the measurement light ML#2-2 from the galvanometer mirror 1161 onto the irradiated area MA. For this reason, the fθ lens 1162 is disposed on the optical path of the measurement light ML#2-2 between the galvanometer mirror 1161 and the irradiated area MA. In particular, the fθ lens 1162 irradiates the measurement light ML#2-2 in a convergent state onto the workpiece W. As a result, the workpiece W is machined by the measurement light ML (specifically, the measurement light ML#2-2). Incidentally, the fθ lens 1162 may be referred to as an irradiation optical system because it irradiates the workpiece W with the measurement light ML#2-2.

[0055] The range of movement of the irradiation area MA moved on the workpiece W by the galvanometer mirror 1161 may be referred to as the measurement area. In other words, the irradiation area MA may move within the measurement area.

[0056] Here, as described above, the processing light EL is incident on the common optical system 116 in addition to the measurement light ML#2-2. That is, the processing light EL and the measurement light ML#2-2 combined by the combining optical system 115 are incident on the common optical system 116. Therefore, both the measurement light ML#2-2 and the processing light EL pass through the same common optical system 116 (specifically, the same galvanometer mirror 1161 and the same fθ lens 1162). For this reason, the galvanometer mirror 1161 can synchronously change the irradiation position of the processing light EL on the workpiece W and the irradiation position of the measurement light ML#2-2 on the workpiece W. The galvanometer mirror 1161 can change the irradiation position of the processing light EL on the workpiece W and the irradiation position of the measurement light ML#2-2 on the workpiece W in conjunction with each other. That is, the galvanometer mirror 1161 can synchronously and / or synchronously change the relative position of the irradiated area EA with respect to the workpiece W and the relative position of the irradiated area MA with respect to the workpiece W.

[0057] The divergence angle of the measurement light ML#2-2 directed from the common optical system 116 to the workpiece W may be larger than the divergence angle of the processing light EL directed from the common optical system 116 to the workpiece W. In this case, the spot diameter of the measurement light ML on the workpiece W is smaller than the spot diameter of the processing light EL on the workpiece W. As a result, the measurement resolution by the measurement light ML is higher than the processing resolution by the processing light EL.

[0058] The aperture angle of the measurement light ML#2-2 directed from the common optical system 116 to the workpiece W depends on the size of the beam of the measurement light ML#2-2 incident on the common optical system 116. Specifically, the larger the size of the beam of the measurement light ML#2-2 incident on the common optical system 116, the larger the aperture angle of the measurement light ML#2-2 directed from the common optical system 116 to the workpiece W. Similarly, the aperture angle of the processing light EL directed from the common optical system 116 to the workpiece W depends on the size of the beam of the processing light EL incident on the common optical system 116. Specifically, the larger the size of the beam of the processing light EL incident on the common optical system 116, the larger the aperture angle of the processing light EL directed from the common optical system 116 to the workpiece W. For this reason, the size of the beam of the measurement light ML#2-2 incident on the common optical system 116 may be larger than the size of the beam of the processing light EL incident on the common optical system 116. In this case, the spot diameter of the measurement light ML on the workpiece W becomes smaller than the spot diameter of the processing light EL on the workpiece W. As a result, the measurement resolution by the measurement light ML is higher than the processing resolution by the processing light EL. Note that the "size of the light beam" referred to here may mean the size of the cross section of the light beam that intersects with the light traveling direction. If the cross section of the light beam that intersects with the light traveling direction is not circular, the "size of the light beam" may mean the maximum size of the cross section of the light beam that intersects with the light traveling direction. For example, if the cross section of the light beam that intersects with the light traveling direction is elliptical, the major axis of the ellipse may be the maximum size.

[0059] The aperture angle of the measurement light ML#2-2 traveling from the common optical system 116 to the workpiece W depends on the size of the beam of the measurement light ML#2-2 at the pupil position of the fθ lens 1162 (typically the entrance pupil position, or the exit pupil position when the light traveling from the workpiece W to the fθ lens 1161 is considered as a reference). Specifically, the larger the size of the beam of the measurement light ML#2-2 at the pupil position of the fθ lens 1162, the larger the aperture angle of the measurement light ML#2-2 traveling from the common optical system 116 to the workpiece W. Similarly, the aperture angle of the processing light EL traveling from the common optical system 116 to the workpiece W depends on the size of the beam of the processing light EL at the pupil position of the fθ lens 1162. Specifically, the larger the size of the beam of the processing light EL at the pupil position of the fθ lens 1162, the larger the aperture angle of the processing light EL traveling from the common optical system 116 to the workpiece W. For this reason, the size of the beam of measurement light ML#2-2 at the pupil position of the fθ lens 1162 may be larger than the size of the beam of processing light EL at the pupil position of the fθ lens 1162. In this case, the spot diameter of measurement light ML on workpiece W is smaller than the spot diameter of processing light EL on workpiece W. As a result, the measurement resolution by measurement light ML is higher than the processing resolution by processing light EL.

[0060] The combining optical system 115 may combine the processing light EL and the measurement light ML#2-2 such that the optical path of the processing light EL and the optical path of the measurement light ML#2-2 at least partially overlap (in other words, superimpose) between the combining optical system 115 and the workpiece W. In other words, the combining optical system 115 may combine the processing light EL and the measurement light ML#2-2 such that the optical path of the processing light EL from the combining optical system 115 to the workpiece W and the optical path of the measurement light ML#2-2 from the combining optical system 115 to the workpiece W at least partially overlap. Note that the "optical path of light" when considering the overlap of optical paths may mean a collection of paths along which light propagates (or paths of light rays). For example, the optical path of the processing light EL between the combining optical system 115 and the workpiece W may include a spatial region that is a combination of a first path, which is a spatial region occupied by the processing light EL from the combining optical system 115 to a first position of the workpiece W, a second path, which is a spatial region occupied by the processing light EL from the combining optical system 115 to a second position of the workpiece W, and an Nth path, which is a spatial region occupied by the processing light EL from the combining optical system 115 to an Nth position of the workpiece W. For example, the optical path of the processing light EL between the combining optical system 115 and the workpiece W may include a spatial region through which the processing light EL can pass by the galvanometer mirror 1161 (see FIGS. 4 and 7, which will be described later). For example, the optical path of the measurement light ML between the combining optical system 115 and the workpiece W may include a spatial region through which the measurement light ML can pass by the galvanometer mirror 1161 (see FIGS. 4 and 7, which will be described later).

[0061] Since the common optical system 116 exists between the combining optical system 115 and the workpiece W, the combining optical system 115 may combine the processing light EL and the measurement light ML#2-2 such that the optical path of the processing light EL and the optical path of the measurement light ML#2-2 at least partially overlap in the common optical system 116. The combining optical system 115 may combine the processing light EL and the measurement light ML#2-2 such that the optical path of the processing light EL and the optical path of the measurement light ML#2-2 in the common optical system 116 at least partially overlap. The combining optical system 115 may combine the processing light EL and the measurement light ML#2-2 such that the optical path of the processing light EL and the optical path of the measurement light ML#2-2 at least partially overlap between the common optical system 116 and the workpiece W. The combining optical system 115 may combine the processing light EL and the measurement light ML#2-2 so that the optical path of the processing light EL from the common optical system 116 to the workpiece W and the optical path of the measurement light ML#2-2 from the common optical system 116 to the workpiece W at least partially overlap.

[0062] As an example, as shown in FIG. 4, which is a cross-sectional view partially showing the optical path of the processing light EL and the optical path of the measurement light ML#2-2 between the combining optical system 115 and the workpiece W, the combining optical system 115 may combine the processing light EL and the measurement light ML#2-2 so that the optical path of the processing light EL from the combining optical system 115 to the workpiece W and the optical path of the measurement light ML#2-2 from the combining optical system 115 to the workpiece W are coaxial. In this case, as shown in FIG. 5, which is a plan view showing the irradiated area EA irradiated with the processing light EL and the irradiated area MA irradiated with the measurement light ML, the combining optical system 115 may combine the processing light EL and the measurement light ML#2-2 so that the irradiated area EA and the irradiated area MA at least partially overlap. The combining optical system 115 may combine the processing light EL and the measurement light ML#2-2 so that the irradiation position of the processing light EL on the workpiece W and the irradiation position of the measurement light ML#2-2 on the workpiece W at least partially coincide with each other. When the irradiated area EA and the irradiated area MA at least partially overlap, the measurement light ML#2-2 is irradiated to at least a part of the irradiated area EA to which the processing light EL is irradiated, and the processing light EL is irradiated to at least a part of the irradiated area MA to which the measurement light ML#2-2 is irradiated. That is, the processing light EL and the measurement light ML#2-2 are irradiated to the same area. In addition, the optical path of the processing light EL from the synthesis optical system 115 to the workpiece W and the optical path of the measurement light ML#2-2 from the synthesis optical system 115 to the workpiece W being coaxial may include the fact that the principal ray of the processing light EL from the synthesis optical system 115 to the workpiece W and the principal ray of the measurement light ML#2-2 from the synthesis optical system 115 to the workpiece W coincide with each other. Here, the principal ray of the processing light EL and the measurement light ML#2-2 can be a ray that passes through the position of the light quantity center of gravity in the light beam cross section (cross section intersecting the traveling direction of the processing light EL and the measurement light ML#2-2) of the processing light EL and the measurement light ML#2-2.

[0063] When the irradiated area EA and the irradiated area MA at least partially overlap, the processing device 1 may simultaneously irradiate the irradiated area EA with the processing light EL and irradiate the irradiated area MA with the measurement light ML#2-2. Specifically, as shown in FIG. 6(a), which is a timing chart showing the irradiation timing of the processing light EL and the irradiation timing of the measurement light ML#2-2, when the processing light EL and the measurement light ML#2-2 each include a pulsed light as described above, the processing device 1 may irradiate the processing light EL and the measurement light ML#2-2 so that the timing (in other words, the time, the period) at which at least one of the multiple pulsed lights constituting the processing light EL is irradiated to the irradiated area EA coincides with the timing (in other words, the time, the period) at which at least one of the multiple pulsed lights constituting the measurement light ML#2-2 is irradiated to the irradiated area MA.

[0064] Alternatively, when the irradiated area EA and the irradiated area MA at least partially overlap, the processing device 1 may irradiate the irradiated area EA with the processing light EL and the irradiated area MA with the measurement light ML#2-2 at different timings. Specifically, as shown in Fig. 6(b) and Fig. 6(c), which are timing charts showing the irradiation timing of the processing light EL and the irradiation timing of the measurement light ML#2-2, the processing device 1 may irradiate the processing light EL and the measurement light ML#2-2 so that the timing (i.e., time, period) at which at least one of the multiple pulsed lights constituting the processing light EL is irradiated to the irradiated area EA is different from the timing (i.e., time, period) at which at least one of the multiple pulsed lights constituting the measurement light ML#2-2 is irradiated to the irradiated area MA. The processing device 1 may irradiate the processing light EL and the measurement light ML#2-2 so that the timing (i.e., time, period) at which at least one of the multiple pulsed lights constituting the processing light EL is irradiated to the irradiated area EA does not overlap with the timing (i.e., time, period) at which at least one of the multiple pulsed lights constituting the measurement light ML#2-2 is irradiated to the irradiated area MA. Typically, the processing device 1 may irradiate the processing light EL and the measurement light ML#2-2 so that the timing at which one pulsed light PL#13 constituting the processing light EL is irradiated to the irradiated area EA is set between the timing at which one pulsed light PL#12 constituting the measurement light ML#2-2 is irradiated to the irradiated area MA and the timing at which another pulsed light PL#14 constituting the measurement light ML#2-2 is irradiated to the irradiated area MA. The processing device 1 may irradiate the processing light EL and the measurement light ML#2-2 such that the timing at which one pulsed light PL#12 constituting the measurement light ML#2-2 is irradiated to the irradiated area MA is set between the timing at which one pulsed light PL#11 constituting the processing light EL is irradiated to the irradiated area EA and the timing at which another pulsed light PL#13 constituting the processing light EL is irradiated to the irradiated area EA. In this case, the irradiation of the measurement light ML#2-2 onto the workpiece W is less likely to be hindered by a substance (e.g., fumes, etc.) generated due to the irradiation of the processing light EL onto the workpiece W. As a result, more appropriate measurement using the measurement light ML#2-2 is possible.

[0065] Alternatively, the combining optical system 115 may combine the processing light EL and the measurement light ML#2-2 such that the optical path of the processing light EL and the optical path of the measurement light ML#2-2 are at least partially separated between the combining optical system 115 and the workpiece W. In other words, the combining optical system 115 may combine the processing light EL and the measurement light ML#2-2 such that the optical path of the processing light EL from the combining optical system 115 to the workpiece W and the optical path of the measurement light ML#2-2 from the combining optical system 115 to the workpiece W are at least partially separated. Since a common optical system 116 exists between the combining optical system 115 and the workpiece W, the combining optical system 115 may combine the processing light EL and the measurement light ML#2-2 such that the optical path of the processing light EL and the optical path of the measurement light ML#2-2 are at least partially separated within the common optical system 116. The combining optical system 115 may combine the processing light EL and the measurement light ML#2-2 such that the optical path of the processing light EL in the common optical system 116 and the optical path of the measurement light ML#2-2 in the common optical system 116 are at least partially separated. The combining optical system 115 may combine the processing light EL and the measurement light ML#2-2 such that the optical path of the processing light EL and the optical path of the measurement light ML#2-2 are at least partially separated between the common optical system 116 and the workpiece W. The combining optical system 115 may combine the processing light EL and the measurement light ML#2-2 such that the optical path of the processing light EL from the common optical system 116 to the workpiece W and the optical path of the measurement light ML#2-2 from the common optical system 116 to the workpiece W are at least partially separated.

[0066] 7, which is a cross-sectional view partially showing the optical path of the processing light EL and the optical path of the measurement light ML#2-2 between the combining optical system 115 and the workpiece W, the combining optical system 115 may combine the processing light EL and the measurement light ML#2-2 such that the optical path of the processing light EL from the combining optical system 115 to the workpiece W and the optical path of the measurement light ML#2-2 from the combining optical system 115 to the workpiece W are at least partially separated along a direction intersecting the optical axis AX of the combining optical system 115 and / or the common optical system 116. In other words, the combining optical system 115 may combine the processing light EL and the measurement light ML#2-2 such that the optical path of the processing light EL from the combining optical system 115 to the workpiece W and the optical path of the measurement light ML#2-2 from the combining optical system 115 to the workpiece W are in an off-axis relationship. 8, which is a plan view showing an irradiated area EA irradiated with the processing light EL and an irradiated area MA irradiated with the measurement light ML, the combining optical system 115 may combine the processing light EL and the measurement light ML#2-2 so that the irradiated area EA and the irradiated area MA are at least partially separated. The combining optical system 115 may combine the processing light EL and the measurement light ML#2-2 so that the irradiation position of the processing light EL on the workpiece W and the irradiation position of the measurement light ML#2-2 on the workpiece W are at least partially different.

[0067] 7 shows an example in which the processing light EL from the fθ lens 1162 to the workpiece W and the measurement light ML#2-2 from the fθ lens 1162 to the workpiece W are parallel. That is, FIG. 7 shows an example in which the chief ray of the processing light EL from the fθ lens 1162 to the workpiece W and the chief ray of the measurement light ML#2-2 from the fθ lens 1162 to the workpiece W are parallel. However, the processing light EL from the fθ lens 1162 to the workpiece W and the measurement light ML#2-2 from the fθ lens 1162 to the workpiece W may be non-parallel. That is, the chief ray of the processing light EL from the fθ lens 1162 to the workpiece W and the chief ray of the measurement light ML#2-2 from the fθ lens 1162 to the workpiece W may be non-parallel. In other words, the telecentricity of the fθ lens 1162 on the workpiece side with respect to the processing light EL may be non-telecentric, and the telecentricity of the fθ lens 1162 on the workpiece side with respect to the measurement light ML may be non-telecentric.

[0068] In order to at least partially separate the irradiated area EA and the irradiated area MA, the combining optical system 115 may combine the processing light EL and the measurement light ML#2-2 so that the processing light EL and the measurement light ML#2-2 have an angle difference on the pupil plane of the fθ lens 1162. That is, the combining optical system 115 may combine the processing light EL and the measurement light ML#2-2 so that the incident angle of the processing light EL to the pupil plane of the fθ lens 1162 and the incident angle of the measurement light ML#2-2 to the pupil plane of the fθ lens 1162 are different. As a result, the angular difference between the processing light EL and the measurement light ML#2-2 on the pupil plane is converted by the fθ lens 1162 into the difference in the irradiation position of the processing light EL and the measurement light ML#2-2 on the image plane (typically, the surface of the workpiece W). That is, the angular difference between the processing light EL and the measurement light ML#2-2 on the pupil plane is converted by the fθ lens 1162 into the difference in the position between the irradiated area EA and the irradiated area MA on the workpiece W.

[0069] 9, in order to at least partially separate the irradiated area EA and the irradiated area MA on the workpiece W, the common optical system 116 may include a relay lens 1163 between the galvanometer mirror 1161 and the fθ lens 1162. The relay lens 1163 is an optical member (optical system) for at least partially separating the optical path of the processing light EL and the optical path of the measurement light ML#2-2 on a plane optically conjugate with the surface of the workpiece W.

[0070] When the irradiated area EA and the irradiated area MA are at least partially separated, the processing device 1 may irradiate the irradiated area EA with the processing light EL and the irradiated area MA with the measurement light ML#2-2 at the same timing (see FIG. 6(a)). Alternatively, when the irradiated area EA and the irradiated area MA are at least partially separated, the processing device 1 may irradiate the irradiated area EA with the processing light EL and the irradiated area MA with the measurement light ML#2-2 at different timings (see FIG. 6(b) and FIG. 6(c)).

[0071] Furthermore, the combining optical system 115 may combine the processing light EL and the measurement light ML#2-2 so that the optical path of the processing light EL and the optical path of the measurement light ML#2-2 are separated (so as not to overlap even partially) between the combining optical system 115 and the workpiece W.

[0072] Alternatively, in each of the cases where the irradiated area EA and the irradiated area MA at least partially overlap, where the irradiated area EA and the irradiated area MA are at least partially separated, and where the irradiated area EA and the irradiated area MA are completely separated, the processing device 1 may irradiate the measurement light ML to the workpiece W before the processing device 1 starts processing the workpiece W (for example, at the timing when the workpiece W is placed on the stage 32 or the timing when the measurement light ML can be irradiated to the workpiece W). In other words, the processing device 1 may irradiate the measurement light ML#2-2 to the irradiated area MA before the processing device 1 starts processing the workpiece W (for example, at the timing when the workpiece W is placed on the stage 32 or the timing when the measurement light ML can be irradiated to the workpiece W). The processing device 1 may irradiate the measurement light ML to the workpiece W after the processing device 1 completes processing the workpiece W. The processing device 1 may irradiate the measurement light ML#2-2 to the irradiated area MA after the processing device 1 completes processing the workpiece W.

[0073] 3 again, when the workpiece W is irradiated with the measurement light ML#2-2, light resulting from the irradiation of the measurement light ML#2-2 is generated from the workpiece W. In other words, when the workpiece W is irradiated with the measurement light ML#2-2, light resulting from the irradiation of the measurement light ML#2-2 is emitted from the workpiece W. For example, when the workpiece W is irradiated with the measurement light ML#2-2, reflected light of the measurement light ML#2-2 is emitted from the workpiece W. For example, when the workpiece W is irradiated with the measurement light ML#2-2, scattered light of the measurement light ML#2-2 is emitted from the workpiece W. Here, the light resulting from the irradiation of the measurement light ML#2-2, or in other words the light emitted from the workpiece W due to the irradiation of the measurement light ML#2-2, may include at least one of the measurement light ML#2-2 reflected by the workpiece W (i.e., reflected light), scattered light generated by the irradiation of the measurement light ML#2-2 onto the workpiece W, the measurement light ML#2-2 diffracted by the workpiece W (i.e., diffracted light), and the measurement light ML#2-2 transmitted through the workpiece W (i.e., transmitted light).

[0074] At least a part of the light emitted from the workpiece W due to the irradiation of the measurement light ML#2-2 (hereinafter, this light is referred to as "measurement light ML#2-3") enters the common optical system 116. The measurement light ML#2-3 that entered the common optical system 116 enters the synthesis optical system 115 via the fθ lens 1162 and the galvanometer mirror 1161. The beam splitter 1151 of the synthesis optical system 115 emits the measurement light ML#2-3 that entered the beam splitter 1151 toward the measurement optical system 114. In the example shown in FIG. 3, the measurement light ML#2-3 that entered the beam splitter 1151 is reflected at the polarization separation surface and is emitted toward the measurement optical system 114. Therefore, in the example shown in FIG. 3, the measurement light ML#2-3 enters the polarization separation surface of the polarizing beam splitter 1151 in a state in which it has a polarization direction that can be reflected at the polarization separation surface.

[0075] The measurement light ML#2-3 emitted from the combining optical system 115 is incident on a mirror 1147 of the measurement optical system 114. The mirror 1147 reflects the measurement light ML#2-3 incident on the mirror 1147 toward the beam splitter 1144. The beam splitter 1144 emits at least a portion of the measurement light ML#2-3 incident on the beam splitter 1144 toward the beam splitter 1142. The beam splitter 1142 emits at least a portion of the measurement light ML#2-3 incident on the beam splitter 1142 toward the detector 1146.

[0076] Here, as described above, in addition to the measurement light ML#2-3, the measurement light ML#1-3 is incident on the detector 1146. That is, the measurement light ML#2-3 directed toward the detector 1146 via the workpiece W and the measurement light ML#1-3 directed toward the detector 1146 without passing through the workpiece W are incident on the detector 1146. The measurement light ML#1-3 may be referred to as a reference light. The detector 1146 detects interference light generated by interference between the measurement light ML#1-3 and the measurement light ML#2-3. Specifically, the detector 1146 detects the interference light by receiving the interference light. For this reason, the detector 1146 may be provided with a light receiving element (light receiving unit) capable of receiving light. The detection result of the detector 1146 is output to the control device 5.

[0077] The control device 5 calculates the state of the workpiece W based on the detection results of the detector 1143 and the detector 1146. Here, the principle of calculating the state of the workpiece W based on the detection results of the detector 1143 and the detector 1146 will be described with reference to Fig. 10.

[0078] 10 is a timing chart showing the measurement light ML#1-1 incident on the detector 1143, the measurement light ML#2-1 incident on the detector 1143, the interference light detected by the detector 1143, the measurement light ML#1-3 incident on the detector 1146, the measurement light ML#2-3 incident on the detector 1146, and the interference light detected by the detector 1146. Since the pulse frequency of the measurement light ML#1 is different from the pulse frequency of the measurement light ML#2, the pulse frequency of the measurement light ML#1-1 is different from the pulse frequency of the measurement light ML#2-1. Therefore, the interference light between the measurement light ML#1-1 and the measurement light ML#2-1 becomes interference light in which the pulse light appears in synchronization with the timing when the pulse light constituting the measurement light ML#1-1 and the pulse light constituting the measurement light ML#2-1 are simultaneously incident on the detector 1143. Similarly, the pulse frequency of the measurement light ML#1-3 is different from the pulse frequency of the measurement light ML#2-3. Therefore, the interference light between measurement light ML#1-3 and measurement light ML#2-3 becomes interference light in which pulsed light appears in synchronization with the timing when the pulsed light constituting measurement light ML#1-3 and the pulsed light constituting measurement light ML#2-3 are simultaneously incident on detector 1146.

[0079] Here, the position (position on the time axis) of the pulsed light that creates the interference light detected by the detector 1146 varies depending on the positional relationship between the processing head 11 and the workpiece W. This is because the interference light detected by the detector 1146 is interference light between the measurement light ML#2-3 that is directed to the detector 1146 via the workpiece W and the measurement light ML#1-3 that is directed to the detector 1146 without going through the workpiece W. On the other hand, the position (position on the time axis) of the pulsed light that creates the interference light detected by the detector 1143 does not vary depending on the positional relationship between the processing head 11 and the workpiece W. For this reason, it can be said that the time difference between the pulsed light that creates the interference light detected by the detector 1146 and the pulsed light that creates the interference light detected by the detector 1143 indirectly indicates the positional relationship between the processing head 11 and the workpiece W (typically, the distance between the processing head 11 and the workpiece W). For this reason, the control device 5 can calculate the state of the workpiece W based on the time difference between the pulsed light that creates the interference light detected by the detector 1146 and the pulsed light that creates the interference light detected by the detector 1143. Specifically, the control device 5 can calculate the position of the portion of the workpiece W irradiated with the measurement light ML#2-2 based on the time difference between the pulsed light that creates the interference light detected by the detector 1146 and the pulsed light that creates the interference light detected by the detector 1143. That is, the control device 5 can obtain information on the position of the portion of the workpiece W irradiated with the measurement light ML#2-2. Furthermore, if the measurement light ML#2-2 is irradiated to multiple points on the workpiece W and / or if the measurement light ML#2-2 is irradiated so as to scan the surface of the workpiece W, the control device 5 can also calculate the shape of the workpiece W.

[0080] The calculated state of the workpiece W may be used to control the machining system SYSa. Specifically, the calculated state of the workpiece W may be used to control the machining device 1. The calculated state of the workpiece W may be used to control the machining head 11. The calculated state of the workpiece W may be used to control the head drive system 12. The calculated state of the workpiece W may be used to control the stage device 3. The calculated state of the workpiece W may be used to control the stage drive system 33.

[0081] For example, the control device 5 may change the relative positional relationship between the workpiece W and the processing head 11 based on the calculated state of the workpiece W so that the relative positional relationship between the workpiece W and the processing head 11 becomes a desired positional relationship. In other words, the control device 5 may control a device capable of changing the relative positional relationship between the workpiece W and the processing head 11 so that the relative positional relationship between the workpiece W and the processing head 11 becomes a desired positional relationship based on the calculated state of the workpiece W. An example of a device capable of changing the relative positional relationship between the workpiece W and the processing head 11 is at least one of the head drive system 12 and the stage drive system 33. Note that an example of the "desired positional relationship" is a positional relationship in which the processing light EL and / or the measurement light ML is irradiated to a desired position on the workpiece W.

[0082] For example, the control device 5 may change the relative positional relationship between the workpiece W and each optical system (for example, at least one of the processing optical system 112, the measurement optical system 114, the composite optical system 115, and the common optical system 116) of the processing head 11 based on the calculated state of the workpiece W so that the relative positional relationship between the workpiece W and each optical system of the processing head 11 becomes a desired relationship. In other words, the control device 5 may control a device capable of changing the relative positional relationship between the workpiece W and each optical system of the processing head 11 based on the calculated state of the workpiece W so that the relative positional relationship between the workpiece W and each optical system of the processing head 11 becomes a desired relationship. At least one of the head drive system 12 and the stage drive system 33 is an example of a device capable of changing the relative positional relationship between the workpiece W and each optical system of the processing head 11.

[0083] For example, the control device 5 may change the relative position of the irradiated area EA with respect to the workpiece W based on the calculated state of the workpiece W, so that the irradiated area EA is set at a desired position on the workpiece W (i.e., the processing light EL is irradiated). In other words, the control device 5 may control a device capable of changing the relative position of the irradiated area EA with respect to the workpiece W, so that the irradiated area EA is set at a desired position on the workpiece W based on the calculated state of the workpiece W. Examples of devices capable of changing the relative position of the irradiated area EA with respect to the workpiece W include the angle adjustment optical element 1122 of the processing optical system 112, the galvanometer mirror 1161 of the common optical system 116, the head driving system 12, and the stage driving system 33.

[0084] For example, the control device 5 may change the relative position of the irradiated area MA with respect to the workpiece W based on the calculated state of the workpiece W, so that the irradiated area MA is set at a desired position on the workpiece W (i.e., the measurement light ML#2-2 is irradiated). In other words, the control device 5 may control a device capable of changing the relative position of the irradiated area MA with respect to the workpiece W, so that the irradiated area MA is set at a desired position on the workpiece W based on the calculated state of the workpiece W. Examples of devices capable of changing the relative position of the irradiated area MA with respect to the workpiece W include the angle adjustment optical element 1122 of the processing optical system 112, the galvanometer mirror 1161 of the common optical system 116, the head driving system 12, and the stage driving system 33.

[0085] However, as described above, in the first embodiment, the galvanometer mirror 1161 can change the relative position of the irradiated area MA with respect to the workpiece W and the irradiation position of the measurement light ML#2-2 on the workpiece W in conjunction with each other. Therefore, when the relative position of the irradiated area MA with respect to the workpiece W is changed using the galvanometer mirror 1161, the relative position of the irradiated area EA with respect to the workpiece W is also changed at the same time. In other words, when the relative position of the irradiated area EA with respect to the workpiece W is changed using the galvanometer mirror 1161, the relative position of the irradiated area MA with respect to the workpiece W is also changed at the same time.

[0086] The head drive system 12 also moves the processing head 11, and therefore can change the relative position of the irradiated area MA with respect to the workpiece W and the irradiation position of the measurement light ML#2-2 on the workpiece W in conjunction with each other. Therefore, when the relative position of the irradiated area MA with respect to the workpiece W is changed using the head drive system 12, the relative position of the irradiated area EA with respect to the workpiece W is also changed at the same time. In other words, when the relative position of the irradiated area EA with respect to the workpiece W is changed using the head drive system 12, the relative position of the irradiated area MA with respect to the workpiece W is also changed at the same time.

[0087] The stage drive system 33 also moves the stage 32 (i.e., moves the workpiece W placed on the stage 32), and therefore can change the relative position of the irradiated area MA with respect to the workpiece W and the irradiation position of the measurement light ML#2-2 on the workpiece W in a coordinated manner. When the relative position of the irradiated area MA with respect to the workpiece W is changed using the stage drive system 33, the relative position of the irradiated area EA with respect to the workpiece W is also changed at the same time. In other words, when the relative position of the irradiated area EA with respect to the workpiece W is changed using the stage drive system 33, the relative position of the irradiated area MA with respect to the workpiece W is also changed at the same time.

[0088] For example, the control device 5 may determine whether or not the workpiece W has been appropriately processed by the processing light EL based on the calculated state of the workpiece W. That is, the control device 5 may perform a post-inspection of the workpiece W after the workpiece W has been processed by the processing light EL based on the calculated state of the workpiece W. Specifically, the control device 5 may determine whether or not the workpiece W has been appropriately processed by the processing light EL by comparing the calculated state of the workpiece W with an ideal state of the workpiece W after processing. When it is determined that the workpiece W has not been appropriately processed by the processing light EL, the control device 5 may control the processing device 1 so that the workpiece W is appropriately processed by the processing light EL.

[0089] When post-inspection of the workpiece W is performed, the irradiated area MA on the workpiece W onto which the measurement light ML#2-2 is irradiated may be set behind the irradiated area EA onto which the processing light EL is irradiated. Here, "rear" means rear along the movement direction of the processing light EL on the workpiece W (i.e., the movement direction of the irradiated area EA). In this case, after the processing light EL is irradiated onto a certain area on the workpiece W, the measurement light ML#2-2 is irradiated onto that area. Therefore, the irradiation order of the processing light EL and the measurement light ML#2-2 is an order suitable for post-inspection of the workpiece W.

[0090] For example, the control device 5 may perform a pre-inspection of the workpiece W before the workpiece W is processed by the processing light EL, based on the calculated state of the workpiece W. For example, the control device 5 may perform a pre-inspection to determine whether or not the workpiece W has any defects that may prevent proper processing by the processing light EL. For example, the control device 5 may perform a pre-inspection to identify the state of the workpiece W in order to determine the processing content by the processing light EL.

[0091] When pre-inspection of the workpiece W is performed, the irradiated area MA on the workpiece W onto which the measurement light ML#2-2 is irradiated may be set in front of the irradiated area EA on the workpiece W onto which the processing light EL is irradiated. Here, "forward" means forward along the direction of movement of the processing light EL on the workpiece W. In this case, the measurement light ML#2-2 is irradiated onto a certain area on the workpiece W, and then the processing light EL is irradiated onto that area. Therefore, the irradiation order of the processing light EL and the measurement light ML#2-2 is an order suitable for pre-inspection of the workpiece W.

[0092] (1-3) Structure of head drive system 12 (1-3-1) Overall structure of head drive system 12 Next, an example of the structure of the head driving system 12 will be described with reference to Fig. 11. Fig. 11 is a cross-sectional view showing an example of the structure of the head driving system 12.

[0093] As shown in Fig. 11, the head drive system 12 includes a first drive system 121 and a second drive system 122. The first drive system 121 is attached to the second drive system 122. The first drive system 121 supports the second drive system 122. The machining head 11 is attached to the second drive system 122. The second drive system 122 supports the machining head 11. Therefore, the second drive system 122 may substantially function as a connection device that connects the first drive system 121 and the machining head 11.

[0094] The first drive system 121 moves the second drive system 122 relative to the workpiece W under the control of the control device 5. That is, the first drive system 121 functions as a moving device that moves the second drive system 122 relative to the workpiece W. Since the processing head 11 is attached to the second drive system 122, it can be said that the first drive system 121 moves the second drive system 122 to move the processing head 11 relative to the workpiece W. That is, the first drive system 121 moves the processing head 11 together with the second drive system 122. The first drive system 121 moves the processing head 11 via the second drive system 122. The first drive system 121 functions as a drive unit that moves (in other words, drives) each optical system provided in the processing head 11 via the second drive system 122.

[0095] The second drive system 122 moves the machining head 11 relative to the workpiece W under the control of the control device 5. That is, the second drive system 122 functions as a moving device that moves the machining head 11 relative to the workpiece W. The second drive system 122 functions as a moving device that moves the machining head 11 relative to the workpiece W. Since the second drive system 122 supports the machining head 11 as described above, it can be said that the second drive system 122 supports the machining head 11 in a state in which the machining head 11 is displaceable relative to the workpiece W. In this case, the second drive system 122 functions as a support unit that supports each optical system provided in the machining head 11 in a state in which each optical system provided in the machining head 11 is displaceable relative to the workpiece W.

[0096] The first drive system 121 and the second drive system 122 will be described below in order.

[0097] (1-3-1-1) Structure of the first drive system 121 As shown in FIG. 11, the first drive system 121 includes a base 1211 and an arm drive system 1212 .

[0098] The base 1211 is attached to the housing 4 (for example, a ceiling member of the housing 4) or a support frame (support structure) (not shown). The arm drive system 1212 is attached to the base 1211. The base 1211 supports the arm drive system 1211. The base 1211 is used as a base member for supporting the arm drive system 1211.

[0099] The arm drive system 1212 includes a plurality of arm members 12121. The plurality of arm members 12121 are connected to each other so as to be able to swing freely via at least one joint member 12122. Therefore, the arm drive system 1212 is a robot having a so-called vertical multi-joint structure. The arm drive system 1212 is not limited to a robot having a vertical multi-joint structure, and may be, for example, a robot having a horizontal multi-joint structure, such as a polar coordinate type robot, a cylindrical coordinate type robot, a Cartesian coordinate type robot, or a parallel link type robot. The arm drive system 1212 may include a single joint (i.e., a drive shaft defined by a joint member 12122). Alternatively, the arm drive system 1212 may include a plurality of joints. FIG. 11 shows an example in which the arm drive system 1212 includes three joints. The two arm members 12121 connected to each other via the joints are swung by actuators 12123 corresponding to each joint. 11 shows an example in which the arm drive system 1212 is equipped with three actuators 12123 corresponding to the three joints. As a result, at least one arm member 12121 moves. Therefore, the at least one arm member 12121 is movable with respect to the workpiece W. In other words, the at least one arm member 12121 is movable so that the relative positional relationship between the at least one arm member 12121 and the workpiece W is changed.

[0100] A second drive system 122 is attached to the arm drive system 1212. Specifically, the second drive system 122 is attached to one of the multiple arm members 12121 that is located at a position farthest from the base 1211. For ease of explanation, the one arm member 12121 to which the second drive system 122 is attached will be referred to as the distal arm member 12124 below. The second drive system 122 may be directly attached to the distal arm member 12124, or may be indirectly attached to the distal arm member 12124 via another member.

[0101] When the distal arm member 12124 is moved by the actuator 12123 described above, the second drive system 122 attached to the distal arm member 12124 also moves. Therefore, the arm drive system 1212 (i.e., the first drive system 121) can move the second drive system 122. Specifically, the arm drive system 1212 can move the second drive system 122 relative to the workpiece W. The arm drive system 1212 can move the second drive system 122 so that the relative positional relationship between the second drive system 122 and the workpiece W is changed. In addition, when the second drive system 122 moves, the machining head 11 attached to the second drive system 122 also moves. Therefore, the arm drive system 1212 (i.e., the first drive system 121) can move the machining head 11.

[0102] It should be noted that the first drive system 121 is not limited to an articulated robot, and may have any structure as long as it is capable of moving the second drive system 122 relative to the workpiece W.

[0103] (1-3-1-2) Structure of the second drive system 122 Next, the structure of the second drive system 122 will be described with reference to Fig. 12. Fig. 12 is a cross-sectional view showing the structure of the second drive system 122.

[0104] As shown in FIG. 12, the second driving system 122 includes a support member 1221 , a support member 1222 , an air spring 1223 , a damper member 1224 , and a driving member 1225 .

[0105] The support member 1221 is attached to the first driving system 121. Specifically, the support member 1221 is attached to a tip arm member 12124 of the first driving system 121. The support member 1222 is attached to the processing head 11.

[0106] The support member 1221 and the support member 1222 are coupled (in other words, connected) via the air spring 1223, the damper member 1224, and the drive member 1225. That is, the air spring 1223, the damper member 1224, and the drive member 1225 are attached to the support members 1221 and 1222, respectively, so as to couple the support member 1221 and the support member 1222. Since the first drive system 121 is attached to the support member 1221 and the machining head 11 is attached to the support member 1222, it can be said that the air spring 1223, the damper member 1224, and the drive member 1225 are substantially attached to the support members 1221 and 1222, respectively, so as to couple the first drive system 121 and the machining head 11.

[0107] The air spring 1223 applies an elastic force caused by the pressure of a gas (air, for example) to at least one of the support members 1221 and 1222 under the control of the control device 5. The air spring 1223 applies an elastic force caused by the pressure of the gas to at least one of the first drive system 121 and the processing head 11 via at least one of the support members 1221 and 1222 under the control of the control device 5. In particular, the air spring 1223 may apply an elastic force caused by the pressure of the gas to at least one of the support members 1221 and 1222 along the direction in which the support members 1221 and 1222 are aligned (the Z-axis direction, the direction of gravity, in the example shown in FIG. 12). That is, the air spring 1223 may apply an elastic force caused by gas pressure to at least one of the first drive system 121 and the processing head 11 via at least one of the support members 1221 and 1222 along the direction in which the first drive system 121 (particularly the distal arm member 12124) and the processing head 11 are aligned (the Z-axis direction, the direction of gravity, in the example shown in FIG. 12). The air spring 1223 may be referred to as an elastic member.

[0108] In order to impart an elastic force caused by the gas pressure, gas is supplied to the air spring 1223 from a gas supply device 12261 via a pipe 12262 and a valve 12263. The control device 5 controls at least one of the gas supply device 12261 and the valve 12263 based on the measurement result of a pressure gauge 1226 that measures the pressure of the aircraft body in the air spring 1223. It is noted that the gas supply device 12261, the pipe 12262, and the valve 12263 may not be required. In this case, the air spring 1223 may impart an elastic force caused by the internal gas pressure to at least one of the support members 1221 and 1222, regardless of the control of the control device 5.

[0109] The air spring 1223 may support the weight of the support member 1222 by using an elastic force under the control of the control device 5. Specifically, the air spring 1223 may support the weight of the support member 1222 by using an elastic force along the direction in which the support members 1221 and 1222 are aligned. Since the processing head 11 is attached to the support member 1222, the air spring 1223 may support the weight of the processing head 11 attached to the support member 1222 by using an elastic force. Specifically, the air spring 1223 may support the weight of the processing head 11 by using an elastic force along the direction in which the first drive system 121 (particularly, the distal arm member 12124) and the processing head 11 are aligned. In this case, the air spring 1223 may function as a weight canceller that cancels the weight of the processing head 11. The air spring 1223 may support the weight of the support member 1222 by using an elastic force, regardless of the control of the control device 5.

[0110] The air spring 1223 may use elastic force to reduce vibrations transmitted between the first drive system 121 and the processing head 11 via the second drive system 122 under the control of the control device 5. That is, the air spring 1223 may use elastic force to damp vibrations transmitted between the first drive system 121 and the processing head 11 via the second drive system 122. Specifically, the air spring 1223 may use elastic force to reduce (dampen) vibrations traveling (i.e., transmitted) from the first drive system 121 to the processing head 11 via the second drive system 122. That is, the air spring 1223 may use elastic force to reduce (dampen) vibrations traveling from a portion of the first drive system 121 to which the second drive system 122 is attached (i.e., the distal arm portion 12124) to a portion of the processing head 11 to which the second drive system 122 is attached. In this case, the control device 5 may control at least one of the gas supply device 12261 and the valve 12263 based on the measurement result of the pressure gauge 1226 so that the vibration transmitted between the first drive system 121 and the processing head 11 via the second drive system 122 is reduced (i.e., damped). The air spring 1223 (or the second drive system 122 including the air spring 1223) may be referred to as a vibration reduction device or a vibration damping device. The air spring 1223 may reduce the vibration transmitted between the first drive system 121 and the processing head 11 via the second drive system 122 by utilizing an elastic force, regardless of the control of the control device 5.

[0111] The damper member 1224 imparts an elastic force caused by a factor other than air pressure to at least one of the support members 1221 and 1222. The damper member 1224 imparts an elastic force caused by a factor other than air pressure to at least one of the first drive system 121 and the processing head 11 via at least one of the support members 1221 and 1222. In particular, the damper member 1224 may impart an elastic force to at least one of the support members 1221 and 1222 along a direction in which the support members 1221 and 1222 are aligned (the Z-axis direction, the direction of gravity, in the example shown in FIG. 12). That is, the damper member 1224 may apply an elastic force to at least one of the first drive system 121 and the machining head 11 via at least one of the support members 1221 and 1222 along the direction in which the first drive system 121 (particularly the distal arm member 12124) and the machining head 11 are aligned (the Z-axis direction, the direction of gravity, in the example shown in FIG. 12). The damper member 1224 may be referred to as an elastic member.

[0112] The damper member 1224 may be any member capable of applying elastic force. For example, the damper member 1224 may include a compression spring coil. For example, the damper member 1224 may include a leaf spring.

[0113] The damper member 1224 may support the weight of the support member 1222 by using an elastic force. Specifically, the damper member 1224 may support the weight of the support member 1222 by using an elastic force along the direction in which the support members 1221 and 1222 are aligned. Since the machining head 11 is attached to the support member 1222, the damper member 1224 may support the weight of the machining head 11 attached to the support member 1222 by using an elastic force. Specifically, the damper member 1224 may support the weight of the machining head 11 by using an elastic force along the direction in which the first drive system 121 (particularly, the distal arm member 12124) and the machining head 11 are aligned. In this case, the damper member 1224 may function as a weight canceller that cancels the weight of the machining head 11.

[0114] The damper member 1224 may use elastic force to reduce vibrations transmitted between the first drive system 121 and the machining head 11 via the second drive system 122. That is, the damper member 1224 may use elastic force to attenuate vibrations transmitted between the first drive system 121 and the machining head 11 via the second drive system 122. Specifically, the damper member 1224 may use elastic force to reduce (attenuate) vibrations traveling (i.e., transmitted) from the first drive system 121 to the machining head 11 via the second drive system 122. For this reason, the damper member 1224 (or the second drive system 122 including the damper member 1224) may be referred to as a vibration reduction device or a vibration damping device.

[0115] The damper member 1224 may convert the vibration of the air spring 1223 into a damped vibration by using an elastic force. In other words, the damper member 1224 may convert the vibration transmitted between the first drive system 121 and the machining head 11 via the second drive system 122 into a damped vibration by using an elastic force.

[0116] The driving member 1225 can generate a driving force under the control of the control device 5. The driving member 1225 can impart the generated driving force to at least one of the support members 1221 and 1222. The driving member 1225 can impart the generated driving force to at least one of the first driving system 121 and the processing head 11 via at least one of the support members 1221 and 1222. The driving member 1225 may have any structure as long as it can generate a driving force. For example, the driving member 1225 may have a structure capable of electrically generating a driving force. For example, the driving member 1225 may have a structure capable of magnetically generating a driving force. As an example, FIG. 12 shows an example in which the driving member 1225 is a voice coil motor (VCM) capable of electrically generating a driving force. Note that while a voice coil motor is a type of linear motor, the driving member 1225 may be a linear motor different from the voice coil motor. The drive member 1225 may generate a driving force along a linear axis.

[0117] The driving member 1225 may have a structure in which a member of the driving member 1225 attached to the support member 1221 does not come into physical contact with a member of the driving member 1225 attached to the support member 1222. For example, when the driving member 1225 is a voice coil motor, a member of the driving member 1225 attached to the support member 1221 (e.g., a member including either a coil or a magnetic pole) does not come into physical contact with a member of the driving member 1225 attached to the support member 1222 (e.g., a member including the other of a coil or a magnetic pole).

[0118] The driving member 1225 may move at least one of the support members 1221 and 1222 using a driving force under the control of the control device 5. The driving member 1225 may move at least one of the first driving system 121 and the processing head 11 by moving at least one of the support members 1221 and 1222 using a driving force under the control of the control device 5. In this case, the driving member 1225 may change the relative position between the first driving system 121 and the processing head 11 by moving at least one of the first driving system 121 and the processing head 11 using a driving force. In this case, it can be said that the second driving system 122 including the driving member 1225 couples the first driving system 121 and the processing head 11 so that the relative position between the first driving system 121 and the processing head 11 can be changed. In other words, it can be said that the above-mentioned air spring 1223 and damper member 1224 (and further, the driving member 1225) connect the first driving system 121 and the machining head 11 together so that the relative position between the first driving system 121 and the machining head 11 can be changed by the driving member 1225. The driving member 1225 may be referred to as a position changing device.

[0119] The driving member 1225 may change the relative position between the first driving system 121 and the machining head 11 under the control of the control device 5 based on the measurement result of the position measurement device 1227 provided in the second driving system 122. The position measurement device 1226 measures the relative position between the first driving system 121 and the machining head 11. For example, the position measurement device 1226 may be an encoder including a detection unit 12261 attached to the support member 1221 and a scale unit 12262 attached to the support member 1222. The measurement result of the position measurement device 1226 includes information regarding the relative position between the support member 1221 and the support member 1222. Since the first driving system 121 is attached to the support member 1221 and the machining head 11 is attached to the support member 1222, the information regarding the relative position between the support member 1221 and the support member 1222 includes information regarding the relative position between the first driving system 121 and the machining head 11. Therefore, the control device 5 can appropriately identify the relative position between the first drive system 121 and the machining head 11. As a result, the control device 5 can appropriately change the relative position between the first drive system 121 and the machining head 11 based on the measurement result of the position measurement device 1227.

[0120] The driving member 1225 may change the relative position between the first driving system 121 and the machining head 11 (typically, move the machining head 11 relative to the first driving system 121) under the control of the control device 5, thereby moving the machining head 11 relative to the workpiece W. The driving member 1225 may move the machining head 11 so that the relative positional relationship between the machining head 11 and the workpiece W is changed.

[0121] The driving member 1225 may reduce vibration transmitted between the first driving system 121 and the processing head 11 via the second driving system 122 by changing the relative position between the first driving system 121 and the processing head 11 using the driving force under the control of the control device 5. In other words, the driving member 1225 may damp vibration transmitted between the first driving system 121 and the processing head 11 via the second driving system 122 using the driving force. Specifically, the driving member 1225 may reduce (dampen) vibration traveling (i.e., transmitted) from the first driving system 121 to the processing head 11 via the second driving system 122 using the driving force. For this reason, the driving member 1225 (or the second driving system 122 including the driving member 1225) may be referred to as a vibration reduction device or a vibration damping device.

[0122] The driving member 1225 may convert the vibration of the air spring 1223 into damped vibration by changing the relative position between the first driving system 121 and the processing head 11 using the driving force. That is, the driving member 1225 may convert the vibration transmitted between the first driving system 121 and the processing head 11 via the second driving system 122 into damped vibration using the driving force. In this case, it can be said that the driving member 1225 reduces the relative displacement amount between the first driving system 121 and the processing head 11 caused by the vibration from the first driving system 121 toward the processing head 11 using the driving force. Specifically, it can be said that the driving member 1225 reduces the relative displacement amount between the part of the first driving system 121 to which the second driving system 122 is connected (i.e., the tip arm part 12124) and the part of the processing head 11 to which the second driving system 122 is connected, caused by the vibration from the first driving system 121 toward the processing head 11, using the driving force. If the driving member 1225 can convert the vibration of the air spring 1223 into damped vibration, the second driving system 122 does not need to include the damper member 1224. However, even if the driving member 1225 cannot convert the vibration of the air spring 1223 into damped vibration, the second driving system 122 does not need to include the damper member 1224. Furthermore, the number of air springs 1223, the number of damper members 1224, and the number of driving members 1225 do not need to be equal to one another.

[0123] The driving member 1225 may apply a driving force acting along a direction including a component in the direction in which the air spring 1223 and / or the damper member 1224 apply an elastic force. In the example shown in FIG. 12, since the air spring 1223 and / or the damper member 1224 apply an elastic force along the Z-axis direction, the driving member 1225 may apply a driving force acting along a direction including a component in the Z-axis direction. When the driving member 1225 generates a driving force acting along a direction including a component in the direction in which the air spring 1223 and / or the damper member 1224 apply an elastic force, the driving member 1225 can convert the vibration of the air spring 1223 into a damped vibration by using this driving force. When converting the vibration of the air spring 1223 into a damped vibration, the driving member 1225 may change the resonance frequency of the air spring 1223 by using the driving force. Typically, the driving member 1225 may increase the resonance frequency of the air spring 1223 by using the driving force.

[0124] A device that actively reduces vibrations using an elastic member such as the air spring 1223 and the driving member 1225 may be called an active vibration isolation device. Therefore, the second drive system 122 may be called an active vibration isolation device. The active vibration isolation device may be called an active vibration isolation system (AVIS).

[0125] (1-4) Technical effects of processing system SYSa The processing system SYSa described above can appropriately process the workpiece W by using the processing light EL. Furthermore, the processing system SYSa can appropriately measure the workpiece W by using the measurement light ML. In particular, in the first embodiment, since an optical comb is used as the measurement light ML, the measurement accuracy of the workpiece W is improved.

[0126] Furthermore, the processing system SYSa can irradiate the workpiece W with the processing light EL and the measurement light ML via the same optical system (specifically, the common optical system 116). In particular, the processing system SYSa can irradiate the workpiece W with the processing light EL and the measurement light ML via the same galvanometer mirror 1161. Therefore, the processing system SYSa can change the irradiation position of the processing light EL on the workpiece W and the irradiation position of the measurement light ML#2-2 on the workpiece W synchronously and / or in conjunction with each other. That is, the processing system SYSa can change the irradiation position of the processing light EL on the workpiece W and the irradiation position of the measurement light ML#2-2 on the workpiece W in a state where the relative positional relationship between the irradiation position of the processing light EL on the workpiece W and the irradiation position of the measurement light ML#2-2 on the workpiece W is fixed. Therefore, the accuracy of the alignment of the processing light EL and the measurement light ML by the processing system SYSa is improved. For example, the possibility that the irradiation position of the processing light EL on the workpiece W and the irradiation position of the measurement light ML#2-2 on the workpiece W are significantly shifted is reduced.

[0127] (2) Machining system SYSb according to the second embodiment Next, a processing system SYS of a second embodiment (hereinafter, the processing system SYS of the second embodiment is referred to as "processing system SYSb") will be described. The processing system SYSb of the second embodiment is different from the processing system SYSa of the first embodiment described above in that it includes a processing device 1b instead of the processing device 1. Other features of the processing system SYSb may be the same as other features of the processing system SYSa. The processing device 1b is different from the processing device 1 in that it includes a processing head 11b instead of the processing head 11. Other features of the processing device 1b may be the same as other features of the processing device 1. Therefore, hereinafter, the processing head 11b of the second embodiment will be described with reference to FIG. 13. FIG. 13 is a cross-sectional view showing an example of the structure of the processing head 11b of the second embodiment. Note that the same components as those already described will be given the same reference numerals and detailed descriptions thereof will be omitted.

[0128] 13, the processing head 11b differs from the above-described processing head 11 in which both the processing light source 111 and the measurement light source 113 are arranged inside the housing 117 in that at least one of the processing light source 111 and the measurement light source 113 is arranged outside the housing 117. FIG. 13 shows an example in which both the processing light source 111 and the measurement light source 113 are arranged outside the housing 117. Other features of the processing head 11b may be the same as other features of the processing head 11.

[0129] In this case, the machining head 11b emits, to the workpiece W, the processing light EL emitted from the processing light source 111 arranged outside the machining head 11b and / or the measurement light ML emitted from the measurement light source 113 arranged outside the machining head 11b. Specifically, the processing light EL emitted from the processing light source 111 is incident on the processing optical system 112 inside the housing 117 from outside the housing 117 via a light transmission member 1111b such as an optical fiber. Similarly, the measurement light ML emitted from the measurement light source 113 is incident on the measurement optical system 114 inside the housing 117 from outside the housing 117 via a light transmission member 1131b such as an optical fiber. In the example shown in Figure 13, measurement light ML#1 emitted from measurement light source 113#1 is incident on measurement optical system 114 inside housing 117 from outside housing 117 via optical transmission member 1131b#1, and measurement light ML#2 emitted from measurement light source 113#2 is incident on measurement optical system 114 inside housing 117 from outside housing 117 via optical transmission member 1131b#2.

[0130] One of the processing light source 111 and the measurement light source 113 may be disposed inside the housing 117, and the other may be disposed outside the housing 117. Also, one of the measurement light sources 113#1 and 113#2 may be disposed inside the housing 117, and the other may be disposed outside the housing 117.

[0131] The machining system SYSb of the second embodiment can achieve the same effects as those achieved by the machining system SYSa of the first embodiment. Furthermore, in the second embodiment, at least one of the machining light source 111 and the measurement light source 113 does not need to be disposed inside the housing 117 of the machining head 11b. In other words, the machining head 11b does not need to include at least one of the machining light source 111 and the measurement light source 113. This allows the machining head 11b to be made smaller and / or lighter.

[0132] (3) Machining system SYSc according to the third embodiment Next, a processing system SYS of a third embodiment (hereinafter, the processing system SYS of the third embodiment will be referred to as "processing system SYSc") will be described. The processing system SYSc of the third embodiment is different from the processing system SYSb of the second embodiment described above in that it includes a processing device 1c instead of the processing device 1b. Other features of the processing system SYSc may be the same as other features of the processing system SYSb. The processing device 1c is different from the processing device 1b in that it includes a processing head 11c instead of the processing head 11b. Other features of the processing device 1c may be the same as other features of the processing device 1b. Therefore, hereinafter, the processing head 11c of the third embodiment will be described with reference to FIG. 14. FIG. 14 is a cross-sectional view showing an example of the structure of the processing head 11c of the third embodiment.

[0133] As shown in FIG. 14, the machining head 11c differs from the above-mentioned machining head 11b in which both the machining optical system 112 and the measurement optical system 114 are arranged inside the housing 117 in that at least a part of the machining optical system 112 and / or the measurement optical system 114 is arranged outside the housing 117. FIG. 14 shows an example in which both the machining optical system 112 and the measurement optical system 114 are arranged outside the housing 117. Furthermore, the machining head 11c differs from the machining head 11b in that it includes a synthesis optical system 115c instead of the synthesis optical system 115. Other features of the machining head 11c may be the same as other features of the machining head 11b.

[0134] In this case, the machining head 11c emits the processing light EL emitted from the machining optical system 112 arranged outside the machining head 11c and / or the measurement light ML emitted from the measurement optical system 114 arranged outside the machining head 11c to the workpiece W. Specifically, the processing light EL emitted from the machining optical system 112 is incident on the composite optical system 115c inside the housing 117 from outside the housing 117 via an optical transmission member 1111c such as an optical fiber. Similarly, the measurement light ML (specifically, the measurement light ML#2-2) emitted from the measurement optical system 114 is incident on the composite optical system 115c inside the housing 117 from outside the housing 117 via an optical transmission member 1131c such as an optical fiber.

[0135] The synthesis optical system 115c is different from the synthesis optical system 115 in that it includes condenser lenses 1152c and 1153c. Other features of the synthesis optical system 115c may be the same as other features of the synthesis optical system 115. The processing light EL that is incident on the synthesis optical system 115c via the optical transmission member 1111c is incident on the beam splitter 1151 via the condenser lens 1152c. The condenser lens 1152c is arranged so that the front focal point of the condenser lens 1152c is located on the end face of the optical transmission member 1111c (specifically, the end face on the synthesis optical system 115 side). As a result, the condenser lens 1152c converts the processing light EL, which is divergent light, into parallel light. Therefore, the processing light EL converted into parallel light is incident on the beam splitter 1151. The measurement light ML#2-2 incident on the combining optical system 115c via the optical transmission member 1131c is incident on the beam splitter 1151 via the condenser lens 1153c. The condenser lens 1153c is arranged so that the front focal point of the condenser lens 1153c is located on the end face of the optical transmission member 1131c (specifically, the end face on the combining optical system 115 side). As a result, the condenser lens 1153c converts the measurement light ML#2-2, which is divergent light, into parallel light. Therefore, the measurement light ML#2-2 converted into parallel light is incident on the beam splitter 1151.

[0136] At least a part of the processing optical system 112 may be arranged outside the housing 117 and the measurement optical system 114 may be arranged inside the housing 117, or the processing optical system 112 may be arranged inside the housing 117 and at least a part of the measurement optical system 114 may be arranged outside the housing 117. Also, at least a part of the processing optical system 112 may be arranged outside the housing 117 and at least a part of the measurement optical system 114 may be arranged outside the housing 117.

[0137] The machining system SYSc of the third embodiment can achieve the same effects as those achieved by the machining system SYSb of the second embodiment. Furthermore, in the third embodiment, at least a part of the machining optical system 112 and / or the measurement optical system 114 does not need to be disposed inside the housing 117 of the machining head 11c. In other words, the machining head 11c does not need to include at least a part of the machining optical system 112 and / or the measurement optical system 114. This allows the machining head 11c to be further reduced in size and / or weight.

[0138] As shown in FIG. 15, which is a cross-sectional view showing another example of the structure of the processing head 11c of the third embodiment, the processing head 11c may include a spatial filter 1181c. The spatial filter 1181c may be, for example, a light-shielding plate having an opening 1182c formed therein. The spatial filter 1181c is disposed so that the measurement light ML#2-2 from the optical transmission member 1131c is incident on the condenser lens 1153c through the opening 1182c, and the measurement light ML#2-3 from the condenser lens 1153c is incident on the optical transmission member 1131c through the opening 1182c. The size (e.g., diameter) of the opening 1182c of the spatial filter 1181c may be smaller than the size (e.g., diameter) of the core of the optical fiber constituting the optical transmission member 1131c. The surface of the spatial filter 1181c on the side of the synthesis optical system 115 may have a knife-edge shape or any other shape. The surface of the spatial filter 1181c on the side of the optical transmission member 1131c may have a knife-edge shape. The spatial filter 1181c may be disposed on the end face of the optical transmission member 1131c (specifically, the end face on the side of the synthesis optical system 115). In this case, since the front focal point of the condenser lens 1153c is located on the end face of the optical transmission member 1131c, the spatial filter 1181c may be disposed at the front focal position of the condenser lens 1153c. In this case, the rear focal position of the condenser lens 1153c may coincide with the front focal position of the fθ lens 1162. The spatial filter 1181c may be disposed at a position optically conjugate with the surface of the workpiece W. When the spatial filter 1181c is disposed in this manner, stray light (noise light) that is generated on at least one optical surface of the fθ lens 1162, the beam splitter 1151, and the condenser lens 1153c and then travels toward the measurement optical system 114 can be reduced. In addition, when a position optically conjugate with the surface of the workpiece W (i.e., an intermediate image point) exists between the end face of the optical transmission member 1131c and the workpiece W, the spatial filter 1181c may be disposed at a position optically conjugate with the surface of the workpiece W between the end face of the optical transmission member 1131c and the workpiece W. The spatial filter 1181c may be disposed at a position that provides an optical Fourier transform for the workpiece W (typically, the entrance pupil position and / or the exit pupil position of the fθ lens 1162).However, the spatial filter 1181c may be disposed at a position different from the pupil position and a position optically conjugate with the surface of the workpiece W. Alternatively, the core of the optical fiber constituting the light transmission member 1131c may itself be used as the spatial filter 1181c. In other words, the core of the optical fiber constituting the light transmission member 1131c may itself function as the spatial filter 1181c.

[0139] As shown in FIG. 16, which is a cross-sectional view showing another example of the structure of the processing head 11c of the third embodiment, when the wavelength of the processing light EL and the wavelength of the measurement light ML are different, the processing head 11c may include a dichroic filter 1183c. The dichroic filter 1183c is a filter that reflects light of the wavelength of the processing light EL and transmits light of the wavelength of the measurement light ML. The dichroic filter 1183c may be a transmission type filter or a reflection type filter. The dichroic filter 1183c may be disposed on the optical path of the measurement light ML#2-2 between the end face of the light transmission member 1131c (specifically, the end face on the side of the synthesis optical system 115) and the beam splitter 1151. The dichroic filter 1183c may be disposed at a position where the measurement light ML#2-2 becomes a parallel light beam between the end face of the light transmission member 1131c and the beam splitter 1151 (specifically, on the optical path of the measurement light ML#2-2 between the condenser lens 1153c and the polarization separation surface of the beam splitter 1151). In this case as well, stray light (noise light) that is generated on at least one optical surface of the fθ lens 1162 and the beam splitter 1151 and then travels toward the measurement optical system 114 can be reduced.

[0140] Alternatively, as described above, the synthesis optical system 115 may include a dichroic mirror instead of the beam splitter 1151. In a situation where the synthesis optical system 115 includes a dichroic mirror, when the polarization direction of the processing light EL becomes p-polarized light with respect to the dichroic surface of the dichroic mirror and the polarization direction of the measurement light ML#2-2 becomes s-polarized light with respect to the dichroic surface of the dichroic mirror, the processing head 11c may include a polarizing filter instead of the dichroic filter 1183c. The polarizing filter is a filter that blocks or reflects light in the polarization direction of the processing light EL and transmits light in the polarization direction of the measurement light ML#2-2. The polarizing filter may be a transmission type filter or a reflection type filter. The polarizing filter may be arranged at the same position as the position where the dichroic filter 1183c is arranged. In this case as well, stray light (noise light) that is generated on at least one of the optical surfaces of the fθ lens 1162 and the beam splitter 1151 and then travels toward the measurement optical system 114 can be reduced.

[0141] Alternatively, the processing head 11c may include an optical isolator instead of the dichroic filter 1183c and the polarizing filter. The optical isolator may be a polarization-dependent optical isolator or a polarization-independent optical isolator. The optical isolator may be disposed at the same position as the dichroic filter 1183c or in a position nearby the position. In this case, it is also possible to reduce stray light (noise light) that is generated on at least one optical surface of the fθ lens 1162 and the beam splitter 1151 and then travels toward the measurement optical system 114.

[0142] As shown in FIG. 17, which is a cross-sectional view showing another example of the structure of the processing head 11c of the third embodiment, the processing head 11c may include a wave plate 1184c. The wave plate 1184c is rotatable around its optical axis or around an axis parallel to its optical axis. The wave plate 1184c may be disposed on the optical path of the measurement light ML#2-2 between the condenser lens 1153c and the polarization separation surface of the beam splitter 1151. The processing head 11c may include a single wave plate 1184c or may include multiple wave plates 1184c. When the processing head 11c includes multiple wave plates 1184c, the multiple wave plates 1184c may include at least one 1 / 2 wave plate 1184c and at least one 1 / 4 wave plate 1184c. In this case, the ellipticity, which is one of the polarization states of the measurement light ML#2-2, may be adjusted by rotating the 1 / 4 wave plate 1184c around the axis. The polarization direction, which is one of the polarization states of measurement light ML#2-2, may be adjusted by rotating half-wave plate 1184c about its axis.

[0143] As shown in FIG. 18, which is a cross-sectional view showing another example of the structure of the processing head 11c of the third embodiment, the light transmission member 1131c may have a plurality of cores through which at least a part of the measurement light ML#2-2 and / or the measurement light ML#2-3 can propagate. The plurality of cores are arranged on a plane crossing the traveling direction of the measurement light ML#2-2 and / or the measurement light ML#2-3. In order to have a plurality of cores, the light transmission member 1131c may include an optical fiber bundle in which a plurality of optical fibers are bundled. Here, the optical fiber bundle in which a plurality of optical fibers are bundled may be a bundle fiber (so-called image fiber) in which a plurality of optical fibers are bundled so as to maintain the same positional relationship at both ends. In order to have a plurality of cores, the light transmission member 1131c may have an image fiber in which a plurality of cores and a clad are integrated (that is, an image fiber having a plurality of cores and a clad between the plurality of cores). The image fiber may be an optical transmission member in which the arrangement of the cores at the incident end and the arrangement of the cores at the exit end are the same (the positional relationship between the cores at the incident end and the cores at the exit end is the same), and which can transmit the light amount distribution at the incident end to the exit end. When the optical transmission member 1131c has a plurality of cores, the detector 1146 may be a detector in which a plurality of photoelectric conversion elements 11461 are arranged along at least one direction. For example, as shown in FIG. 18, the detector 1146 may be a detector in which a plurality of photoelectric conversion elements 11461 are arranged in one direction (i.e., a plurality of photoelectric conversion elements 11461 are arranged one-dimensionally). The detector 1146 may be a detector in which a plurality of photoelectric conversion elements 11461 are arranged in two directions (i.e., a plurality of photoelectric conversion elements 11461 are arranged two-dimensionally). Furthermore, the processing head 11c may include an optical system 1184c for making an end face of the optical transmission member 1131c (specifically, the end face on the detector 1146 side) and a detection surface of the detector 1146 (that is, a surface on which a plurality of photoelectric conversion elements 11461 are arranged) optically conjugate. In the example shown in Fig. 18, the optical system 1184c is disposed between the optical transmission member 1131c and the beam splitter 1144, but the position of the optical system 1184c is not limited to this example.When the machining head 11c has the structure shown in FIG. 18, it becomes possible to measure the surface of the workpiece W, and as a result, the throughput regarding the measurement of the workpiece W is improved.

[0144] 18 includes a measurement device (in other words, a measuring device) that uses the measurement light ML to measure the workpiece W. Specifically, the processing head 11c includes a measurement device (in other words, a measuring device) that includes the measurement light source 112, the measurement optical system 114 (particularly, the mirror 1145 and the detector 1146), the light transmission member 1131c, the common optical system 116 (particularly, the fθ lens 1162), and the control device 5.

[0145] In the processing head 11c shown in Fig. 14 to Fig. 18, the refractive surface of the optical member located on the optical path of the measurement light ML#2-2 and / or ML#2-3 may be arranged so as to be inclined with respect to a plane perpendicular to the optical axis. For example, in the optical path of the measurement light ML#2-2 and / or ML#2-3, the refractive surface of the polarizing beam splitter 1151 may be arranged so as to be inclined with respect to a plane perpendicular to the optical axis of the optical system including the polarizing beam splitter 1151 (in this case, the synthesis optical system 115c). The refractive surface of the polarizing beam splitter 1151 may include, for example, at least one of the optical surface of the polarizing beam splitter 1151 on which the measurement light ML#2-2 is incident and the measurement light ML#2-3 is emitted (the optical surface on the +X side in Fig. 14) and the optical surface of the polarizing beam splitter 1151 on which the measurement light ML#2-2 is emitted and the measurement light ML#2-3 is incident (the optical surface on the -Z side in Fig. 14). 16, in the optical path of the measurement light ML#2-2 and / or ML#2-3, the refractive surface of the dichroic mirror 1183c (or a polarizing filter or an optical isolator, the same applies hereinafter in this paragraph) may be arranged so as to be inclined with respect to a plane perpendicular to the optical axis of the optical system (e.g., the synthesis optical system 115c) including the dichroic mirror 1183c. The refractive surface of the dichroic mirror 1183c includes, for example, at least one of the optical surface (the optical surface on the +X side in FIG. 16) on which the measurement light ML#2-2 is incident and the measurement light ML#2-3 is emitted among the optical surfaces of the dichroic mirror 1183c, and the optical surface (the optical surface on the -X side in FIG. 16) on which the measurement light ML#2-2 is emitted and the measurement light ML#2-3 is incident among the optical surfaces of the dichroic mirror 1183c. In this case as well, it is possible to reduce stray light (noise light) that is generated on at least one of the optical surfaces of the fθ lens 1162 and the beam splitter 1151 and then travels toward the measurement optical system 114. Although not shown in the drawings to avoid redundancy, in the processing head 11c shown in Figures 14 to 18, the refracting surface of the optical member located on the optical path of the processing light EL may be arranged so as to be inclined with respect to a plane perpendicular to the optical axis.

[0146] 14 to 18, at least one of the lenses constituting the fθ lens 1162 may be arranged so that the optical axis of the at least one lens is inclined with respect to the optical axis of the fθ lens 1162. At least one of the lenses constituting the fθ lens 1162 may be arranged so that the optical axis of the at least one lens is separated (i.e., decentered) from the optical axis of the fθ lens 1162. In this case as well, stray light (noise light) that is generated on the optical surface of the fθ lens 1162 and then travels toward the measurement optical system 114 can be reduced.

[0147] In the processing head 11c shown in Figures 14 to 18, the common optical system 116 may include an achromatic lens as an fθ lens 1162, in which chromatic aberration correction is performed for the wavelength of the measurement light ML and the wavelength of the processing light EL. In the processing head 11c shown in Figures 14 to 18, the focal length of the condenser lens 1152c and the focal length of the condenser lens 1153c may be different. As an example, when the wavelength of the measurement light ML is shorter than the wavelength of the processing light EL, the focal length of the condenser lens 1153c may be longer than the focal length of the condenser lens 1152c. However, the focal length of the condenser lens 1152c and the focal length of the condenser lens 1153c may be the same. In the machining head 11c shown in Figs. 14 to 18, the optical system including the fθ lens 1162 and the condenser lens 1153c may be configured so that the surface of the workpiece W and the end face of the optical transmission member 1131c (specifically, the end face on the synthetic optical system 115 side) are in an optically conjugate positional relationship with respect to the wavelength of the measurement light ML. In the machining head 11c shown in Figs. 14 to 18, the optical system including the fθ lens 1162 and the condenser lens 1152c may be configured so that the surface of the workpiece W and the end face of the optical transmission member 1111c (specifically, the end face on the synthetic optical system 115 side) are in an optically conjugate positional relationship with respect to the wavelength of the processing light EL. In the machining head 11c shown in Figs. 14 to 18, at least one of the condenser lenses 1152c and 1153c may be a zoom optical system. When the condenser lens 1152c is a zoom optical system, the condenser lens 1152c allows the focus position of the processing light EL to be adjusted independently of the focus position of the measurement light ML. When the condenser lens 1153c is a zoom optical system, the condenser lens 1153c allows the focus position of the measurement light ML to be adjusted independently of the focus position of the processing light EL.

[0148] (4) Machining system SYSd according to the fourth embodiment Next, a processing system SYS of a fourth embodiment (hereinafter, the processing system SYS of the fourth embodiment will be referred to as "processing system SYSd") will be described. The processing system SYSd of the fourth embodiment is different from the processing system SYSa of the first embodiment described above in that it includes a processing device 1d instead of the processing device 1. Other features of the processing system SYSd may be the same as other features of the processing system SYSa. The processing device 1d is different from the processing device 1 in that it includes a processing head 11d instead of the processing head 11. Other features of the processing device 1d may be the same as other features of the processing device 1. Therefore, hereinafter, the processing head 11d of the fourth embodiment will be described with reference to FIG. 19. FIG. 19 is a cross-sectional view showing an example of the structure of the processing head 11d of the fourth embodiment.

[0149] 19, the processing head 11d differs from the processing head 11 in that it includes a measurement optical system 114d instead of the measurement optical system 114. Other features of the processing head 11d may be the same as other features of the processing head 11.

[0150] The measurement optical system 114d differs from the measurement optical system 114 in that it emits a plurality of measurement light beams ML. In order to emit a plurality of measurement light beams ML, the measurement optical system 114d differs from the measurement optical system 114 in that it includes a beam splitter 1147d and an X-scanning mirror 1148dX instead of the mirror 1147. Other features of the measurement optical system 114d may be the same as other features of the measurement optical system 114.

[0151] In the fourth embodiment, the measurement light ML#2-2 emitted from the beam splitter 1144 is incident on the beam splitter 1147d. The beam splitter 1147d emits measurement light ML#2-21, which is a part of the measurement light ML#2-2 incident on the beam splitter 1147d, toward the synthesis optical system 115. The measurement light ML#2-21 is irradiated onto the workpiece W via the synthesis optical system 115 and the common optical system 116. Therefore, the measurement light ML#2-21 in the fourth embodiment is irradiated onto the workpiece W via an optical path similar to that of the measurement light #2-2 in the first embodiment.

[0152] At least a portion of the light emitted from the workpiece W due to irradiation with the measurement light ML#2-21 (for example, at least a portion of the reflected light, scattered light, diffracted light and / or transmitted light described above, hereinafter, this light will be referred to as "measurement light ML#2-31") enters the common optical system 116. The measurement light ML#2-31 that entered the common optical system 116 enters the synthesis optical system 115 via the fθ lens 1162 and the galvanometer mirror 1161. The beam splitter 1151 of the synthesis optical system 115 emits the measurement light ML#2-31 that entered the beam splitter 1151 toward the measurement optical system 114. The measurement light ML#2-31 that entered the measurement optical system 114 from the synthesis optical system 115 enters the detector 1146 via the beam splitter 1147d, the beam splitter 1144 and the beam splitter 1142. Therefore, measurement light ML#2-31 in the fourth embodiment is incident on detector 1146 via the same optical path as measurement light #2-3 in the first embodiment. Therefore, detector 1146 detects interference light between measurement light ML#1-3 and measurement light ML#2-31.

[0153] On the other hand, the beam splitter 1147d emits measurement light ML#2-22, which is another part of the measurement light ML#2-2 incident on the beam splitter 1147d, toward the X-scanning mirror 1148dX. The X-scanning mirror 1148dX deflects the measurement light ML#2-22 to change the irradiation position of the measurement light ML#2-22 on the workpiece W. Specifically, the X-scanning mirror 1148dX swings or rotates so as to change the irradiation position of the measurement light ML#2-22 on the workpiece W along the X-axis direction (that is, changes the angle of the X-scanning mirror 1148dX with respect to the optical path of the measurement light ML#2-22), thereby deflecting the measurement light ML#2-22.

[0154] The measurement light ML#2-22 emitted from the X-scanning mirror 1148dX is incident on the Y-scanning mirror 1161Y of the common optical system 116. The Y-scanning mirror 1161Y deflects the measurement light ML#2-22 by swinging or rotating so as to change the irradiation position of the measurement light ML#2-22 on the workpiece W along the Y-axis direction (i.e., changing the angle of the Y-scanning mirror 1161Y with respect to the optical path of the measurement light ML#2-22). The measurement light ML#2-22 emitted from the Y-scanning mirror 1161Y is irradiated onto the workpiece W via the fθ lens 1162. As a result, the common optical system 116 emits a plurality of measurement light ML (two measurement light ML#2-21 and ML#2-22 in the example shown in FIG. 19) toward the workpiece W.

[0155] The common optical system 116 may emit multiple measurement light beams ML toward different positions on the workpiece W. In other words, the common optical system 116 may emit multiple measurement light beams ML such that the irradiation position of the measurement light ML#2-21 on the workpiece W differs from the irradiation position of the measurement light ML#2-22 on the workpiece W. The common optical system 116 may emit multiple measurement light beams ML such that the position of the irradiated area MA#1 irradiated with the measurement light ML#2-21 differs from the position of the irradiated area MA#2 irradiated with the measurement light ML#2-22. Typically, the X-scanning mirror 1161X, which can change the irradiation position of the measurement light ML#2-21 independently of the irradiation position of the measurement light ML#2-22, and the X-scanning mirror 1148dX, which can change the irradiation position of the measurement light ML#2-22 independently of the irradiation position of the measurement light ML#2-21, may deflect the measurement light ML#2-21 and ML#2-22 so that the common optical system 116 emits the measurement light ML#2-21 and ML#2-22 toward different positions on the workpiece W.

[0156] At least a part of the light emitted from the workpiece W due to irradiation with the measurement light ML#2-22 (for example, at least a part of the reflected light, scattered light, diffracted light and / or transmitted light described above, hereinafter this light will be referred to as "measurement light ML#2-32") enters the common optical system 116. The measurement light ML#2-32 that entered the common optical system 116 enters the X-scanning mirror 1148dX via the fθ lens 1162 and the Y-scanning mirror 1161Y. The measurement light ML#2-32 that entered the X-scanning mirror 1148dX enters the detector 1146 via the X-scanning mirror 1148dX, beam splitter 1147d, beam splitter 1144 and beam splitter 1142. Therefore, the detector 1146 detects the interference light between the measurement light ML#1-3 and the measurement light ML#2-32.

[0157] Incidentally, the measurement light ML#2-22 does not have to be incident on the Y scanning mirror 1161Y of the common optical system 116. In this case, another Y scanning mirror (not shown) may be provided, which is arranged in the optical path of the measurement light ML#2-22 near the Y scanning mirror 1161Y and swings or rotates so as to change the irradiation position of the measurement light ML#2-22 on the workpiece W along the Y axis direction. This other Y scanning mirror may change the angle of the other Y scanning mirror with respect to the optical path of the measurement light ML#2-22. In this case, the measurement light ML#2-21 may not be required. That is, in the fourth embodiment, the common optical system 116 is not essential.

[0158] The control device 5 calculates the state of the workpiece W based on the detection results of the detector 1143 and the detector 1146. Here, as described above, in the fourth embodiment, the detector 1146 detects a plurality of interference lights. The control device 5 may use the detection results of the plurality of interference lights for different purposes. For example, the control device 5 may use the detection result of the first interference light (e.g., interference light between the measurement light ML#1-3 and the measurement light ML#2-31) for the first purpose. That is, the control device 5 may calculate the state of the workpiece W used for the first purpose based on the detection result of the first interference light. In this case, the measurement light ML#2-21 corresponds to the measurement light ML used for the first purpose. Furthermore, for example, the control device 5 may use the detection result of the second interference light (e.g., interference light between the measurement light ML#1-3 and the measurement light ML#2-32) for the second purpose. In other words, the control device 5 may calculate the state of the workpiece W used for a second purpose different from the first purpose based on the detection result of the second interference light.

[0159] An example of the first use is to specify the shape of the workpiece W. An example of the second use is to specify the position of the workpiece W (particularly, the relative position of the workpiece W with respect to the processing head 11). Information on the position of the workpiece W is mainly used to control the position of the processing head 11 with respect to the workpiece W, the irradiation position of the processing light EL on the workpiece W, and / or the irradiation position of the measurement light ML on the workpiece W. Therefore, an example of the second use is to control the position of the processing head 11 with respect to the workpiece W, the irradiation position of the processing light EL on the workpiece W, and / or the irradiation position of the measurement light ML on the workpiece W based on the position of the workpiece W (particularly, the relative position of the workpiece W with respect to the processing head 11). In this case, the control device 5 may specify the shape of the workpiece W based on the detection result of the first interference light (for example, the interference light between the measurement light ML#1-3 and the measurement light ML#2-31). Furthermore, based on the detection result of the second interference light (e.g., interference light between the measurement light ML#1-3 and the measurement light ML#2-32), the control device 5 may control the position of the processing head 11 relative to the workpiece W, the irradiation position of the processing light EL on the workpiece W, and / or the irradiation position of the measurement light ML on the workpiece W so that the processing light EL and / or the measurement light ML are irradiated to the desired position of the workpiece W whose shape has been identified.

[0160] The machining system SYSd of the fourth embodiment can achieve the same effects as those achieved by the machining system SYSa of the first embodiment described above. Furthermore, the machining system SYSd of the fourth embodiment can irradiate a plurality of measurement light beams ML having different applications onto the workpiece W. Therefore, the machining system SYSd can appropriately machine the workpiece W based on the detection results of the plurality of measurement light beams ML (i.e., the detection results of the plurality of interference light beams).

[0161] Instead of the beam splitter 1147d, the measurement optical system 114d may include a mirror that can be inserted into and removed from the optical path of the measurement light ML#2-2. When inserted (i.e., arranged) in the optical path of the measurement light ML#2-2, this mirror may reflect the measurement light ML#2-2 toward the combining optical system 115. On the other hand, when removed from the optical path of the measurement light ML#2-2, this mirror does not affect the optical path of the measurement light ML#2-2. In this case, the X-scan mirror 1148dX may be arranged so that the measurement light ML#2-2 from the beam splitter 1144 is incident on the X-scan mirror 1148dX.

[0162] In the above description, the measurement optical system 114d includes the X-scanning mirror 1148dX. This is because the Y-scanning mirror 1161Y is disposed closer to the workpiece W than the X-scanning mirror 1161X in the galvanometer mirror 1161, and the measurement light ML#2-22 emitted from the X-scanning mirror 1148dX is incident on the Y-scanning mirror 1161Y of the galvanometer mirror 1161. However, when the X-scanning mirror 1161X is disposed closer to the workpiece W than the Y-scanning mirror 1161Y in the galvanometer mirror 1161, the measurement optical system 114d may include a Y-scanning mirror in addition to or instead of the X-scanning mirror 1148dX. The Y-scanning mirror of the measurement optical system 114d deflects the measurement light ML#2-22 by swinging or rotating so as to change the irradiation position of the measurement light ML#2-22 on the workpiece W along the Y-axis direction (i.e., changing the angle of the Y-scanning mirror with respect to the optical path of the measurement light ML#2-22). Furthermore, measurement light ML#2-22 emerging from the Y-scanning mirror of measurement optical system 114d may be incident on X-scanning mirror 1161X of galvanometer mirror 1161.

[0163] Also in the fourth embodiment, the constituent elements described in at least one of the second to third embodiments may be adopted. The constituent elements described in the second embodiment include a constituent element related to the arrangement of at least one of the processing light source 111 and the measurement light source 113 outside the housing 117. The constituent elements described in the third embodiment include a constituent element related to the arrangement of at least one of the processing optical system 112 and the measurement optical system 114 outside the housing 117.

[0164] (5) Machining system SYSe according to the fifth embodiment Next, a processing system SYS of a fifth embodiment (hereinafter, the processing system SYS of the fifth embodiment will be referred to as the "processing system SYSe") will be described. The processing system SYSe of the fifth embodiment is different from the processing system SYSa of the first embodiment described above in that it includes a processing device 1e instead of the processing device 1. Other features of the processing system SYSe may be the same as other features of the processing system SYSa. The processing device 1e is different from the processing device 1 in that it includes a processing head 11e instead of the processing head 11. Other features of the processing device 1e may be the same as other features of the processing device 1. Therefore, hereinafter, the processing head 11e of the fifth embodiment will be described with reference to FIG. 20. FIG. 20 is a cross-sectional view showing an example of the structure of the processing head 11e of the fifth embodiment.

[0165] 20, the processing head 11e differs from the processing head 11 in that it includes a measurement optical system 114e instead of the measurement optical system 114. Other features of the processing head 11e may be the same as other features of the processing head 11.

[0166] The measurement optical system 114e differs from the measurement optical system 114 in that it includes a galvanometer mirror 1148e. Other features of the measurement optical system 114e may be the same as other features of the measurement optical system 114.

[0167] In the fourth embodiment, measurement light ML#2-2 emitted from beam splitter 1144 (that is, measurement light ML#2-2 emitted via mirror 1147) is incident on a galvanometer mirror 1148e. The galvanometer mirror 1148e deflects measurement light ML#2-2 (that is, changes the emission angle) to change the irradiation position of measurement light ML#2-2 on workpiece W. For example, the galvanometer mirror 1148e includes an X-scanning mirror 1148eX and a Y-scanning mirror 1148eY. Each of the X-scanning mirror 1148eX and the Y-scanning mirror 1148eY deflects measurement light ML#2-2 incident on the galvanometer mirror 1148e. The X-scanning mirror 1148eX is an inclination angle variable mirror that changes the angle with respect to the optical path of measurement light ML#2-2. The X-scanning mirror 1148eX deflects measurement light ML#2-2 by swinging or rotating so as to change the irradiation position of measurement light ML#2-2 on the workpiece W along the X-axis direction (i.e., changing the angle of the X-scanning mirror 1148eX with respect to the optical path of measurement light ML#2-2). The Y-scanning mirror 1148eY deflects measurement light ML#2-2 by swinging or rotating so as to change the irradiation position of measurement light ML#2-2 on the workpiece W along the Y-axis direction (i.e., changing the angle of the Y-scanning mirror 1148eY with respect to the optical path of measurement light ML#2-2).

[0168] The galvanometer mirror 1148e emits the deflected measurement light ML#2-2 toward the combining optical system 115. The measurement light ML#2-2 is irradiated onto the workpiece W via the combining optical system 115 and the common optical system 116. Furthermore, the measurement light ML#2-3, which is at least a part of the light emitted from the workpiece W due to the irradiation of the measurement light ML#2-2, is incident on the galvanometer mirror 1148e of the measurement optical system 114e via the common optical system 116 and the combining optical system 115. The measurement light ML#2-3 incident on the galvanometer mirror 1148e is incident on the detector 1146 via the galvanometer mirror 1148e, the mirror 1147, the beam splitter 1144, and the beam splitter 1142.

[0169] The measurement optical system 114e may include a position adjustment optical system (not shown) instead of / in addition to the galvanometer mirror 1148e. The position adjustment optical system may have a parallel plane plate that can be tilted with respect to the traveling direction of the measurement light ML2-2 so that the position of the measurement light ML2-2 from the measurement optical system 114e on a plane perpendicular to the optical path of the measurement light ML2-2 can be set to an arbitrary position.

[0170] The processing system SYSe of the fifth embodiment can enjoy the same effects as those of the processing system SYSa of the first embodiment described above. Furthermore, the processing system SYSe of the fifth embodiment includes a galvanometer mirror 1148e capable of deflecting the measurement light ML#2-2 without deflecting the processing light EL. Therefore, the processing system SYSe can move the irradiation position of the measurement light ML#2-2 on the workpiece W relative to the irradiation position of the processing light EL on the workpiece W. The processing system SYSe can move the irradiated area MA irradiated with the measurement light ML#2-2 relative to the irradiated area EA irradiated with the processing light EL. In this way, the processing system SYSe can independently change the irradiation position of the processing light EL on the workpiece W and the irradiation position of the measurement light ML#2-2 on the workpiece W. The processing system SYSe can independently change the position of the irradiated area EA and the position of the irradiated area MA.

[0171] In addition, the fifth embodiment may also employ the components described in at least one of the second to fourth embodiments. The components described in the fourth embodiment include components related to the emission of a plurality of measurement beams ML.

[0172] (6) Machining system SYSf according to the sixth embodiment Next, a processing system SYS of a sixth embodiment (hereinafter, the processing system SYS of the sixth embodiment will be referred to as "processing system SYSf") will be described. The processing system SYSf of the sixth embodiment is different from the processing system SYSa of the first embodiment described above in that it includes a processing device 1f instead of the processing device 1. Other features of the processing system SYSf may be the same as other features of the processing system SYSa. The processing device 1f is different from the processing device 1 in that it includes a processing head 11f instead of the processing head 11. Other features of the processing device 1f may be the same as other features of the processing device 1. The processing head 11f is different from the processing head 11 in that the common optical system 116 is detachable from the processing head 11f. The processing head 11f is different from the processing head 11 in that the common optical system 116 is replaceable. Other features of the processing head 11f may be the same as other features of the processing head 11.

[0173] The processing head 11f may be equipped with one optical system candidate 118f selected from a plurality of different optical system candidate 118f each of which can be used as the common optical system 116. For example, the processing head 11f may be equipped with one optical system 118f selected from a plurality of different optical system candidate 118f according to the processing content of the processing system SYSf.

[0174] For example, the multiple optical system candidates 118f may include at least two optical system candidates 118f having different emission directions of the processing light EL and / or measurement light ML relative to the optical axis of the optical system candidate 118f (particularly, the optical axis on the incident side of the processing light EL and / or measurement light ML). In this case, one optical system 118f capable of emitting the processing light EL and / or measurement light ML in an emission direction suitable for the processing content of the processing system SYSf may be attached to the processing head 11f from among the multiple optical system candidates 118f.

[0175] For example, the multiple optical system candidates 118f may include at least two optical system candidates 118f having different distances from the position where the combining optical system 115 emits the processing light EL and / or the measurement light ML to the position where the optical system candidate 118 emits the processing light EL and / or the measurement light ML. In this case, the processing head 11f may be equipped with one optical system 118f from the multiple optical system candidates 118f, such that the distance from the position where the combining optical system 115 emits the processing light EL and / or the measurement light ML to the position where the optical system candidate 118 emits the processing light EL and / or the measurement light ML is a distance suitable for the processing content of the processing system SYSf.

[0176] For example, the multiple optical system candidates 118f may include at least two optical system candidates 118f having different distances from the position where the processing optical system 112 emits the processing light EL to the position where the optical system candidate 118 emits the processing light EL (i.e., the distance from the processing optical system 112 to the position where the optical system candidate 118 emits the processing light EL). In this case, the processing head 11f may be equipped with one optical system 118f from the multiple optical system candidates 118f, the distance from the position where the processing optical system 112 emits the processing light EL to the position where the optical system candidate 118 emits the processing light EL being a distance suitable for the processing content of the processing system SYSf.

[0177] For example, the multiple optical system candidates 118f may include at least two optical system candidates 118f having different distances from the position where the measurement optical system 114 emits the measurement light ML to the position where the optical system candidate 118 emits the measurement light ML (i.e., the distance from the measurement optical system 114 to the position where the optical system candidate 118 emits the processing light EL). In this case, the processing head 11f may be equipped with one optical system 118f from the multiple optical system candidates 118f, the one having a distance from the position where the measurement optical system 114 emits the measurement light ML to the position where the optical system candidate 118 emits the measurement light ML that is suitable for the processing content of the processing system SYSf.

[0178] For example, the multiple optical system candidates 118f may include at least two optical system candidates 118f having different distances from a position where the processing light EL and / or measurement light ML enter the optical system candidate 118f to a position where the processing light EL and / or measurement light ML exit from the optical system candidate 118f (i.e., the distance from the entrance surface of the optical system candidate 118f to the exit surface of the optical system candidate 118f). In this case, the processing head 11f may be equipped with one optical system 118f in which the distance from the position where the processing light EL and / or measurement light ML enter the optical system candidate 118f to the position where the processing light EL and / or measurement light ML exit from the optical system candidate 118f is a distance suitable for the processing content of the processing system SYSf.

[0179] An example of the optical system candidate 118f will be described below with reference to FIGS.

[0180] FIG. 21 is a cross-sectional view showing the processing head 11f to which the first optical system candidate 118f#1 is attached as the common optical system 116. As shown in FIG. 21, the first optical system candidate 118f#1 is an optical system including a galvanometer mirror 1161 and an fθ lens 1162. That is, the first optical system candidate 118f#1 is the same as the common optical system 116 of the first embodiment described with reference to FIG. 3 and the like. The first optical system candidate 118f#1 can function as the common optical system 116 capable of emitting the processing light EL and / or the measurement light ML along the optical axis of the incident side of the first optical system candidate 118f#1. Since the optical axis of the incident side of the first optical system candidate 118f#1 is parallel to the Z axis, the first optical system candidate 118f#1 can function as the common optical system 116 capable of emitting the processing light EL and / or the measurement light ML along the Z axis direction. Such a first optical system candidate 118f#1 may be selected as the common optical system 116 to be attached to the machining head 11f when the machining system SYSf machines a surface of the workpiece W that intersects with the Z-axis, for example.

[0181] FIG. 22 is a cross-sectional view showing the processing head 11f to which the second optical system candidate 118f#2 is attached as the common optical system 116. As shown in FIG. 22, the second optical system candidate 118f#2 includes a housing 1161f#2, an actuator 1162f#2, a condenser lens 1163f#2, and a scanning mirror 1164f#2. The housing 1161f#2 is a cylindrical housing in which a space 1165f#2 extending along the Z-axis direction is formed. The actuator 1162f#2 operates to rotate the housing 1161f#2 around the Z-axis. The condenser lens 1163f#2 and the scanning mirror 1164f#2 are arranged in the space 1165f#2 of the housing 1161f#2. The processing light EL and / or measurement light ML emitted from the synthesis optical system 115 enters the space 1165f#2 through an opening 1166f#2 formed in the upper part of the housing 1161f#2. The processing light EL and / or measurement light ML that enters the space 1165f#2 enters the scanning mirror 1164f#2 via the condenser lens 1163f#2. The scanning mirror 1164f#2 reflects the processing light EL and / or measurement light ML propagated in the Z-axis direction toward a direction intersecting the Z-axis. Since the optical axis of the incident side of the second optical system candidate 118f#2 is parallel to the Z-axis, the second optical system candidate 118f#2 can function as a common optical system 116 that can emit the processing light EL and / or measurement light ML along a direction intersecting the optical axis of the incident side of the second optical system candidate 118f#2. At this time, the scanning mirror 1164f#2 swings or rotates so as to change the emission direction of the processing light EL and / or measurement light ML from the second optical system candidate 118f#2 around the X-axis or around the Y-axis. The processing light EL and / or measurement light ML emitted from the scanning mirror 1164f#2 is emitted to the outside of the second optical system candidate 118f#2 through the opening 1167f#2 formed on the side surface of the housing 1161f#2. Here, the emission direction of the processing light EL and / or measurement light ML from the second optical system candidate 118f#2 is changed around the Z-axis by the rotation of the housing 1161f#2 by the actuator 1162f#2 around the Z-axis.Such a second optical system candidate 118f#2 may be selected as the common optical system 116 to be attached to the machining head 11f when the machining system SYSf machines a surface along the Z-axis among the surfaces of the workpiece W. The second optical system candidate 118f#2 may be selected as the common optical system 116 to be attached to the machining head 11f when the machining system SYSf machines the workpiece W to form a cylindrical recess in the workpiece W. The second optical system candidate 118f#2 may be selected as the common optical system 116 to be attached to the machining head 11f when the workpiece W is machined to form a structure surrounding the common optical system 116.

[0182] FIG. 23 is a cross-sectional view showing the processing head 11f to which the third optical system candidate 118f#3 is attached as the common optical system 116. As shown in FIG. 23, the third optical system candidate 118f#3 includes a housing 1161f#3, a condenser lens 1162f#3, and a galvanometer mirror 1163f#3. The housing 1161f#3 is a cylindrical housing in which a space 1164f#3 extending along the Z-axis direction is formed. The condenser lens 1162f#3 and the galvanometer mirror 1163f#3 are arranged in the space 1164f#3 of the housing 1161f#3. The processing light EL and / or the measurement light ML emitted from the synthesis optical system 115 enter the space 1164f#3 from an opening 1165f#3 formed in the upper part of the housing 1161f#3. The processing light EL and / or measurement light ML incident on the space 1164f#3 enters the galvanometer mirror 1163f#3 via the condenser lens 1162f#3. The galvanometer mirror 1163f#3 reflects the processing light EL and / or measurement light ML propagated in the Z-axis direction toward a direction intersecting the Z-axis. Since the optical axis of the incident side of the third optical system candidate 118f#3 is parallel to the Z-axis, the third optical system candidate 118f#3 can function as a common optical system 116 that can emit the processing light EL and / or measurement light ML along a direction intersecting the optical axis of the incident side of the third optical system candidate 118f#3. At this time, the galvanometer mirror 1163f#3 swings or rotates so as to change the emission direction of the processing light EL and / or measurement light ML from the second optical system candidate 118f#2 along each of the X-axis and Y-axis. Specifically, the galvanometer mirror 1163f#3 includes an X-scanning mirror 1163fX#3 that swings or rotates to change the emission direction of the processing light EL and / or measurement light ML from the second optical system candidate 118f#2 around the X-axis, and a Y-scanning mirror 1163fY#3 that swings or rotates to change the emission direction of the processing light EL and / or measurement light ML from the second optical system candidate 118f#2 around the Y-axis. The processing light EL and / or measurement light ML emitted from the galvanometer mirror 1163f#3 are emitted to the outside of the third optical system candidate 118f#3 through an opening 1166f#3 formed on a side surface of the housing 1161f#3.Such a third optical system candidate 118f#3 may be selected as the common optical system 116 to be attached to the machining head 11f when the machining system SYSf machines a surface along the Z-axis among the surfaces of the workpiece W. The third optical system candidate 118f#2 may be selected as the common optical system 116 to be attached to the machining head 11f when the machining system SYSf machines the workpiece W so as to form a slit (i.e., a slit-shaped depression or groove) extending along the X-axis direction or the Y-axis direction in the workpiece W.

[0183] In the sixth embodiment, the common optical system 116 is replaceable, but only the fθ lens 1162 may be replaceable. For example, at least a part of the common optical system 116 may be disposed between the beam splitter 1151 and the condenser lens 1163f#2, or at least a part of the common optical system 116 may be disposed between the beam splitter 1151 and the condenser lens 1162f#3. In this case, the common optical system 116 may include a scanning mirror having a scanning direction different from the scanning direction of the galvanometer mirror 1164f#2 and the galvanometer mirror 1163f#3. Here, the scanning direction may be the direction in which the processing light and / or the measurement light moves on the workpiece W.

[0184] The machining system SYSf of the sixth embodiment can achieve the same effects as those achieved by the machining system SYSa of the first embodiment. Furthermore, the machining system SYSf of the sixth embodiment can machine the workpiece W by using a common optical system 116 suitable for the machining contents of the machining system SYSf. Therefore, the workpiece W can be machined in a wider variety of machining contents.

[0185] In the above description, the entire common optical system 116 is replaceable. However, instead of the entire common optical system 116 being replaceable, a part of the common optical system 116 may be replaceable. In other words, a part of the multiple optical members constituting the common optical system 116 may be replaceable.

[0186] Also in the sixth embodiment, the components described in at least one of the second to fifth embodiments may be adopted. The components described in the fifth embodiment include components related to independent control of the irradiation position of the measurement light ML on the workpiece W.

[0187] (7) Machining system SYSg according to the seventh embodiment Next, a machining system SYS of a seventh embodiment (hereinafter, the machining system SYS of the seventh embodiment will be referred to as a "machining system SYSg") will be described with reference to Fig. 24. Fig. 24 is a cross-sectional view that illustrates a schematic overall structure of the machining system SYSg of the seventh embodiment.

[0188] 24, the machining system SYSg of the seventh embodiment is different from the machining system SYSa of the first embodiment in that the machining system SYSg further includes a position measuring device 6g. Other features of the machining system SYSg may be the same as other features of the machining system SYSa.

[0189] The position measuring device 6g measures the relative positional relationship between the workpiece W and the processing head 11. In the seventh embodiment, the position measuring device 6g measures the position of the workpiece W relative to the processing head 11. In order to measure the position of the workpiece W relative to the processing head 11, the position measuring device 6g may measure the workpiece W. Since the processing head 11 is equipped with each optical system, the operation of measuring the relative positional relationship between the workpiece W and the processing head 11 is substantially equivalent to the operation of measuring the relative positional relationship between the workpiece W and each optical system equipped in the processing head 11. In other words, the operation of measuring the position of the workpiece W relative to the processing head 11 substantially measures the position of the workpiece W relative to each optical system equipped in the processing head 11.

[0190] The position measuring device 6g may be disposed at a fixed position with respect to the processing head 11 (particularly, each optical system provided in the processing head 11). The position measuring device 6g may be disposed at a position where the relative position with respect to the processing head 11 is fixed. The position measuring device 6g may be disposed at a position where the relative position between the processing head 11 and the position measuring device 6g does not change even if the head drive system 12 moves the processing head 11. For example, FIG. 24 shows an example in which the position measuring device 6g is attached to the outer surface of the processing head 11 (for example, the outer surface of the housing 117).

[0191] When the position measuring device 6g is arranged at a fixed position relative to the machining head 11, the output from the position measuring device 6g (i.e., the measurement result of the position measuring device 6g) includes information regarding the position of the workpiece W relative to the machining head 11. Specifically, the measurement result of the position measuring device 6g includes information regarding the position of the workpiece W relative to the position measuring device 6g. In other words, the measurement result of the position measuring device 6g includes information regarding the position of the workpiece W in the measurement coordinate system of the position measuring device 6g. Here, when the position measuring device 6g is arranged at a fixed position relative to the machining head 11, the information regarding the position of the workpiece W relative to the position measuring device 6g substantially includes information regarding the position of the workpiece W relative to the machining head 11 arranged at a fixed position relative to the position measuring device 6g. Therefore, the control device 5 can appropriately identify the position of the workpiece W relative to the machining head 11.

[0192] The position measuring device 6g may be any type of measuring device as long as it is capable of measuring the workpiece W. For example, the position measuring device 6g may include an imaging device (i.e., a camera) capable of imaging the surface of an object such as the workpiece W. The position measuring device 6g may include an irradiation device that irradiates the workpiece W with measurement light that draws a predetermined pattern on the workpiece W, and an imaging device that images the pattern drawn on the workpiece W by the measurement light. In this way, the position measuring device 6g may be a measuring device that measures the workpiece W by a non-contact method (for example, at least one of a light detection method, a sound wave detection method, and a radio wave detection method).

[0193] The measurement results of the position measuring device 6g (i.e., information regarding the position of the workpiece W relative to the machining head 11) may be used to control the machining system SYSa. Specifically, the measurement results of the position measuring device 6g may be used to control the machining device 1. The measurement results of the position measuring device 6g may be used to control the machining head 11. The measurement results of the position measuring device 6g may be used to control the head driving system 12. The measurement results of the position measuring device 6g may be used to control the stage device 3. The measurement results of the position measuring device 6g may be used to control the stage driving system 33.

[0194] For example, the control device 5 may change the relative positional relationship between the workpiece W and the processing head 11 based on the measurement result of the position measuring device 6g so that the relative positional relationship between the workpiece W and the processing head 11 becomes a desired positional relationship. In other words, the control device 5 may control a device capable of changing the relative positional relationship between the workpiece W and the processing head 11 based on the measurement result of the position measuring device 6g so that the relative positional relationship between the workpiece W and the processing head 11 becomes a desired positional relationship. An example of a device capable of changing the relative positional relationship between the workpiece W and the processing head 11 has already been described above. The "desired positional relationship" has also been described above.

[0195] For example, the control device 5 may change the relative positional relationship between the workpiece W and each optical system (for example, at least one of the processing optical system 112, the measurement optical system 114, the composite optical system 115, and the common optical system 116) of the processing head 11 based on the measurement result of the position measurement device 6g so that the relative positional relationship between the workpiece W and each optical system of the processing head 11 becomes a desired relationship. In other words, the control device 5 may control a device capable of changing the relative positional relationship between the workpiece W and each optical system of the processing head 11 based on the measurement result of the position measurement device 6g so that the relative positional relationship between the workpiece W and each optical system of the processing head 11 becomes a desired relationship. An example of a device capable of changing the relative positional relationship between the workpiece W and each optical system of the processing head 11 has already been described above.

[0196] For example, the control device 5 may change the relative position of the irradiated area EA with respect to the workpiece W based on the measurement result of the position measuring device 6g so that the irradiated area EA is set at a desired position on the workpiece W (i.e., the processing light EL is irradiated). In other words, the control device 5 may control a device capable of changing the relative position of the irradiated area EA with respect to the workpiece W based on the measurement result of the position measuring device 6g so that the irradiated area EA is set at a desired position on the workpiece W. An example of a device capable of changing the relative position of the irradiated area EA with respect to the workpiece W has already been described above.

[0197] For example, the control device 5 may change the relative position of the irradiated area MA with respect to the workpiece W based on the measurement result of the position measurement device 6g so that the irradiated area MA is set at a desired position on the workpiece W (i.e., the measurement light ML#2-2 is irradiated). In other words, the control device 5 may control a device capable of changing the relative position of the irradiated area MA with respect to the workpiece W so that the irradiated area MA is set at a desired position on the workpiece W based on the measurement result of the position measurement device 6g. An example of a device capable of changing the relative position of the irradiated area MA with respect to the workpiece W has already been described above.

[0198] For example, the control device 5 may perform a first operation based on the state of the workpiece W calculated from the detection results of the detectors 1143 and 1146, and may perform a second operation based on the measurement results of the position measurement device 6g. For example, the control device 5 may control the first drive system 121 of the head drive system 12 based on the state of the workpiece W calculated from the detection results of the detectors 1143 and 1146, and may control the second drive system 122 of the head drive system 12 based on the measurement results of the position measurement device 6g. More specifically, the control device 5 may roughly align the irradiated area EA and / or the irradiated area MA relatively to the workpiece W by controlling the first drive system 121 based on the state of the workpiece W calculated from the detection results of the detectors 1143 and 1146. Then, the control device 5 may more accurately align the irradiated area EA and / or the irradiated area MA with respect to the workpiece W by controlling the second drive system 122 based on the measurement results of the position measurement device 6g. The control device 5 may cancel out the vibrations of the first drive system 121 by controlling the second drive system 122 based on the measurement results of the position measurement device 6g so that the vibrations of the first drive system 121 are not transmitted to the machining head 11 via the second drive system 122.

[0199] In addition, in the seventh embodiment, the position measuring device 6g is attached to the outer surface of the processing head 11, but a part of the position measuring device 6g may be attached inside the processing head 11 (inside the housing 117), or the entire position measuring device 6g may be attached inside the processing head 11 (inside the housing 117).

[0200] The machining system SYSg of the seventh embodiment can achieve the same effects as those achieved by the machining system SYSa of the first embodiment described above. Furthermore, the machining system SYSg of the seventh embodiment can machine the workpiece W using the detection results of the position measuring device 6g in addition to the detection results of the detectors 1143 and 1146. Therefore, the machining system SYSg can machine the workpiece W more appropriately. For example, the machining system SYSg can machine the workpiece W with higher accuracy.

[0201] In addition, the seventh embodiment may also employ at least one of the components described in the second to sixth embodiments. The components described in the sixth embodiment include components related to replacement of the common optical system 116.

[0202] (8) Machining system SYSh of the eighth embodiment Next, a processing system SYS of an eighth embodiment (hereinafter, the processing system SYS of the eighth embodiment is referred to as "processing system SYSh") will be described. The processing system SYSh of the eighth embodiment is different from the processing system SYSa of the first embodiment described above in that it includes a processing device 1h instead of the processing device 1. Other features of the processing system SYSh may be the same as other features of the processing system SYSa. The processing device 1h is different from the processing device 1 in that it includes a processing head 11h instead of the processing head 11. Other features of the processing device 1h may be the same as other features of the processing device 1. Therefore, hereinafter, the processing head 11h of the eighth embodiment will be described with reference to FIG. 25. FIG. 25 is a cross-sectional view showing an example of the structure of the processing head 11h of the eighth embodiment.

[0203] 25, the processing head 11h differs from the processing head 11 in that it does not need to include a synthesis optical system 115. Furthermore, the processing head 11h differs from the processing head 11 in that it includes a processing irradiation optical system 118h and a measurement irradiation optical system 119h instead of the common optical system 116. Other features of the processing head 11h may be the same as other features of the processing head 11.

[0204] The processing irradiation optical system 118h is incident on the processing light EL emitted from the processing optical system 112. The processing irradiation optical system 118h irradiates the processing light EL incident on the processing irradiation optical system 118h onto the workpiece W. On the other hand, the measurement light ML#2-2 emitted from the measurement optical system 114 is not incident on the processing irradiation optical system 118h. The processing irradiation optical system 118h does not irradiate the measurement light ML#2-2 emitted from the measurement optical system 114 onto the workpiece W.

[0205] In order to irradiate the workpiece W with the processing light EL, the processing irradiation optical system 118h includes a galvanometer mirror 1181h and an fθ lens 1182h.

[0206] The processing light EL emitted from the processing optical system 112 is incident on the galvanometer mirror 1181h. The galvanometer mirror 1181h changes the irradiation position of the processing light EL on the workpiece W by deflecting the processing light EL. For example, the galvanometer mirror 1181h includes an X-scanning mirror 1181hX and a Y-scanning mirror 1181hY. Each of the X-scanning mirror 1181hX and the Y-scanning mirror 1181hY is a tilt angle variable mirror that changes the angle with respect to the optical path of the processing light EL incident on the galvanometer mirror 1181h. The X-scanning mirror 1181hX deflects the processing light EL by swinging or rotating so as to change the irradiation position of the processing light EL on the workpiece W along the X-axis direction (i.e., changing the angle of the X-scanning mirror 1181hX with respect to the optical path of the processing light EL). The Y-scanning mirror 1181hY deflects the processing light EL by swinging or rotating so as to change the irradiation position of the processing light EL on the workpiece W along the Y-axis direction (i.e., changing the angle of the Y-scanning mirror 1181hY with respect to the optical path of the processing light EL). Considering such characteristics of the galvanometer mirror 1181h, the galvanometer mirror 1181h differs from the galvanometer mirror 1161 of the common optical system 116 in that it changes the irradiation position of the processing light EL on the workpiece W, but does not change the irradiation position of the measurement light ML on the workpiece W. The galvanometer mirror 1181h differs from the galvanometer mirror 1161 in that the processing light EL passes through but the measurement light ML does not pass through. Other features of the galvanometer mirror 1181h may be the same as other features of the galvanometer mirror 1161.

[0207] The processing light EL from the galvanometer mirror 1181h is incident on the fθ lens 1182h. The fθ lens 1182h is an optical system for irradiating the processing light EL from the galvanometer mirror 1181h onto the workpiece W. In particular, the fθ lens 1182h is an optical system for focusing the processing light EL from the galvanometer mirror 1181h onto the workpiece W. Considering the characteristics of the fθ lens 1182h, the fθ lens 1182h is different from the fθ lens 1162 of the common optical system 116 in that the fθ lens 1182h irradiates the workpiece W with the processing light EL while not changing the irradiation position of the measurement light ML on the workpiece W. The fθ lens 1182h is different from the fθ lens 1162 in that the processing light EL passes through while the measurement light ML does not pass through. Other features of the fθ lens 1182h may be the same as other features of the fθ lens 1162.

[0208] The measurement light ML#2-2 emitted from the measurement optical system 114 is incident on the measurement irradiation optical system 119h. The measurement irradiation optical system 119h irradiates the measurement light ML#2-2 incident on the measurement irradiation optical system 119h onto the workpiece W. On the other hand, the processing light EL emitted from the processing optical system 112 is not incident on the measurement irradiation optical system 119h. The measurement irradiation optical system 119h does not irradiate the processing light EL emitted from the processing optical system 112 onto the workpiece W.

[0209] In order to irradiate the workpiece W with the measurement light ML#2-2, the measurement irradiation optical system 119h includes a galvanometer mirror 1191h and an fθ lens 1192h.

[0210] The measurement light ML#2-2 emitted from the measurement optical system 114 is incident on the galvanometer mirror 1191h. The galvanometer mirror 1191h deflects the measurement light ML#2-2 to change the irradiation position of the measurement light ML#2-2 on the workpiece W. For example, the galvanometer mirror 1191h includes an X-scanning mirror 1191hX and a Y-scanning mirror 1191hY. Each of the X-scanning mirror 1191hX and the Y-scanning mirror 1191hY is a tilt angle variable mirror that changes the angle with respect to the optical path of the measurement light ML#2-2 incident on the galvanometer mirror 1191h. The X-scanning mirror 1191hX swings or rotates so as to change the irradiation position of the measurement light ML#2-2 on the workpiece W along the X-axis direction (i.e., changes the angle of the X-scanning mirror 1191hX with respect to the optical path of the measurement light ML#2-2), thereby deflecting the measurement light ML#2-2. The Y-scanning mirror 1191hY deflects the measurement light ML#2-2 by swinging or rotating so as to change the irradiation position of the measurement light ML#2-2 on the workpiece W along the Y-axis direction (i.e., changing the angle of the Y-scanning mirror 1191hY with respect to the optical path of the measurement light ML#2-2). Considering such characteristics of the galvanometer mirror 1191h, the galvanometer mirror 1191h is different from the galvanometer mirror 1161 of the common optical system 116 in that it changes the irradiation position of the measurement light ML#2-2 on the workpiece W, but does not change the irradiation position of the processing light EL on the workpiece W. The galvanometer mirror 1191h is different from the galvanometer mirror 1161 in that the measurement light ML passes through but the processing light EL does not pass through. Other features of the galvanometer mirror 1191h may be the same as other features of the galvanometer mirror 1161.

[0211] The measurement light ML#2-2 from the galvanometer mirror 1191h is incident on the fθ lens 1192h. The fθ lens 1192h is an optical system for irradiating the measurement light ML#2-2 from the galvanometer mirror 1191h onto the workpiece W. In particular, the fθ lens 1192h is an optical system for focusing the measurement light ML#2-2 from the galvanometer mirror 1191h onto the workpiece W. Considering the characteristics of the fθ lens 1192h, the fθ lens 1192h is different from the fθ lens 1162 of the common optical system 116 in that the measurement light ML#2-2 is irradiated onto the workpiece W while the irradiation position of the measurement light ML on the workpiece W is not changed. The fθ lens 1192h is different from the fθ lens 1162 in that the measurement light ML passes through while the processing light EL does not pass through. Other features of the fθ lens 1192h may be the same as other features of the fθ lens 1162.

[0212] In the eighth embodiment, the optical axis of the fθ lens 1182h that irradiates the workpiece W with the processing light EL and the optical axis of the fθ lens 1192h that irradiates the workpiece W with the measurement light ML are almost parallel to each other. However, the optical axis of the fθ lens 1182h and the optical axis of the fθ lens 1192h do not have to be parallel to each other. For example, the optical axis of the fθ lens 1182h and the optical axis of the fθ lens 1192h may intersect with each other on a surface on which the surface of the workpiece W is located or in the vicinity thereof, and the optical axis of the fθ lens 1182 and the optical axis of the fθ lens 1192h may be set so that at least a part of the field of view of the fθ lens 1182 and the field of view of the fθ lens 1192h overlap each other. In these cases, it may be said that the optical axis of the fθ lens 1182h is tilted toward the fθ lens 1192h, or it may be said that the optical axis of the fθ lens 1192h is tilted toward the fθ lens 1182h. In addition, the optical axis of the fθ lens 1182h and the optical axis of the fθ lens 1192h may be set so that they form an acute angle when viewed from a direction intersecting the plane in which the fθ lenses 1182h and 1192h are arranged.

[0213] Thus, in the eighth embodiment, within the machining head 11, the optical system related to the processing light EL (specifically, the processing optical system 112 and the processing irradiation optical system 118h) and the optical system related to the measurement light ML (specifically, the measurement optical system 114 and the measurement irradiation optical system 119h) are optically separated. In other words, the machining head 11h does not need to be equipped with an optical element or optical member through which both the processing light EL and the measurement light ML pass. The machining system SYSh of the eighth embodiment, like the machining system SYSa of the first embodiment, can also properly process the workpiece W using the processing light EL and properly measure the workpiece W using the measurement light ML.

[0214] In the eighth embodiment, the processing light EL from the galvanometer mirror 1181h and the measurement light ML from the galvanometer mirror 1191h may be made incident on one fθ lens.

[0215] In the eighth embodiment, the components described in at least one of the second to seventh embodiments may be adopted. The components described in the seventh embodiment include the components related to the position measurement device 6g. In the eighth embodiment, the processing head 11h includes the processing irradiation optical system 118h and the measurement optical system 119h instead of the common optical system 116, so that the components that can be adopted in the common optical system 116 may be adopted in at least one of the processing irradiation optical system 118h and the measurement optical system 119h. For example, at least one of the processing irradiation optical system 118h and the measurement optical system 119h may be replaceable like the common optical system 116 in the sixth embodiment.

[0216] (9) Machining system SYSi according to the ninth embodiment Next, a machining system SYS of a ninth embodiment (hereinafter, the machining system SYS of the ninth embodiment will be referred to as a "machining system SYSi") will be described with reference to Fig. 26 and Fig. 27. Fig. 26 is a cross-sectional view showing a schematic overall structure of the machining system SYSi of the ninth embodiment. Fig. 27 is a system configuration diagram showing the system configuration of the machining system SYSi of the ninth embodiment.

[0217] 26 and 27, the processing system SYSi of the ninth embodiment differs from the processing system SYSa of the first embodiment described above in that it includes a processing device 1i instead of the processing device 1. Furthermore, the processing system SYSi of the ninth embodiment differs from the processing system SYSa of the first embodiment described above in that it further includes a measuring device 2i. Other features of the processing system SYSi may be the same as other features of the processing system SYSa.

[0218] The processing device 1i is different from the processing device 1 in that it includes a processing head 11i instead of the processing head 11. Other features of the processing device 1i may be the same as other features of the processing device 1. The processing head 11i is different from the above-mentioned processing head 11 that emits the processing light EL and the measurement light ML to the workpiece W in that the processing head 11i emits the processing light EL to the workpiece W but does not emit the measurement light ML. An example of the structure of such a processing head 11i is shown in FIG. 28. As shown in FIGS. 27 and 28, the processing head 11i includes a processing light source 111, a processing optical system 112, and a processing irradiation optical system 118h. The processing light source 111, the processing optical system 112, and the processing irradiation optical system 118h may be housed in a housing 117 of the processing head 11i. It can be said that the processing head 11i is an optical member that selectively includes an optical member that contributes to the emission of the processing light EL among the multiple optical members included in the processing head 11h of the eighth embodiment shown in FIG. 25. For this reason, a detailed description of the machining head 11i will be omitted.

[0219] The measurement device 2i includes a measurement head 21i that emits measurement light ML to the workpiece W, and a head drive system 22i that moves the measurement head 21i. The measurement head 21i means any member capable of emitting measurement light ML to the workpiece W. Therefore, although the measurement head 21i includes the term "head," it does not necessarily mean a member that is attached to the tip of some member. Therefore, the measurement head 21i may be referred to as a measurement member.

[0220] The measurement head 21i is different from the above-mentioned processing head 11 that emits both the processing light EL and the measurement light ML to the workpiece W in that the measurement head 21i emits the measurement light ML to the workpiece W but does not emit the processing light EL. An example of the structure of such a measurement head 21i is shown in FIG. 29. As shown in FIG. 27 and FIG. 29, the measurement head 21i includes a measurement light source 113, a measurement optical system 114, and a measurement irradiation optical system 119h. The measurement light source 113, the measurement optical system 114, and the measurement irradiation optical system 119h may be housed in a housing 217i of the measurement head 21i. It can be said that the measurement head 21i is an optical member that selectively includes an optical member that contributes to the emission of the measurement light ML among the multiple optical members included in the processing head 11h of the eighth embodiment shown in FIG. 25. For this reason, a detailed description of the measurement head 21i will be omitted.

[0221] The head drive system 22i may have the same structure as the head drive system 12 described above. That is, the head drive system 22i may include a first drive system 121 and a second drive system 122. The head drive system 22i and the measurement head 21i may be connected in a manner similar to the manner in which the head drive system 12 and the processing head 11 are connected. For this reason, a detailed description of the head drive system 22i will be omitted.

[0222] In the ninth embodiment, when the machining head 11i moves, the irradiation position of the processing light EL on the workpiece W changes, while the irradiation position of the measurement light ML on the workpiece W does not change. Therefore, moving the machining head 11i in the ninth embodiment is equivalent to changing the irradiation position of the processing light EL on the workpiece W (or the position of the irradiated area EA). On the other hand, when the measurement head 21i moves, the irradiation position of the measurement light ML on the workpiece W changes, while the irradiation position of the processing light EL on the workpiece W does not change. Therefore, moving the measurement head 21i in the ninth embodiment is equivalent to changing the irradiation position of the measurement light ML on the workpiece W (or the position of the irradiated area MA). In this way, in the ninth embodiment, the machining system SYSi can independently change the irradiation position of the processing light EL on the workpiece W and the irradiation position of the measurement light ML#2-2 on the workpiece W.

[0223] In the ninth embodiment, the stage 32 may move so that an irradiation area EA to be irradiated with the processing light EL is set on the workpiece W during at least a part of a processing period in which the processing device 1i should emit the processing light EL to the workpiece W. The stage 32 may move so that the workpiece W is located at a position where the processing device 1i can irradiate the processing light EL during at least a part of the processing period. On the other hand, the stage 32 may move so that an irradiation area MA to be irradiated with the measurement light ML is set on the workpiece W during at least a part of a measurement period in which the measuring device 2i should emit the measurement light ML to the workpiece W. The stage 32 may move so that the workpiece W is located at a position where the measuring device 2i can irradiate the measurement light ML during at least a part of the measurement period. In other words, the stage 32 may move between a position where the processing device 1i can irradiate the processing light EL and a position where the measuring device 2i can irradiate the measurement light ML.

[0224] Thus, in the ninth embodiment, similarly to the eighth embodiment, the optical system related to the processing light EL (specifically, the processing optical system 112 and the processing irradiation optical system 118h) and the optical system related to the measurement light ML (specifically, the measurement optical system 114 and the measurement irradiation optical system 119h) are optically separated. Furthermore, in the ninth embodiment, the device that emits the processing light EL to the workpiece W (i.e., the processing device 1i) and the device that emits the measurement light ML to the workpiece W (i.e., the measurement device 2i) are separate devices. The processing system SYSi of the ninth embodiment, like the processing system SYSa of the first embodiment, can also properly process the workpiece W using the processing light EL and properly measure the workpiece W using the measurement light ML.

[0225] In the ninth embodiment, the components described in at least one of the second to eighth embodiments may be adopted. The components described in the eighth embodiment include components related to optical separation between the optical system related to the processing light EL and the optical system related to the measurement light ML. In the ninth embodiment, the processing system SYSi includes the processing irradiation optical system 118h and the measurement optical system 119h instead of the common optical system 116, and therefore, components that can be adopted for the common optical system 116 may be adopted for at least one of the processing irradiation optical system 118h and the measurement optical system 119h. For example, at least one of the processing irradiation optical system 118h and the measurement optical system 119h may be replaceable in the same manner as the common optical system 116 in the sixth embodiment.

[0226] (10) Machining system SYSj of the tenth embodiment Next, a machining system SYS of a tenth embodiment (hereinafter, the machining system SYS of the tenth embodiment will be referred to as a "machining system SYSj") will be described with reference to Fig. 30. Fig. 30 is a cross-sectional view that illustrates a schematic overall structure of the machining system SYSj of the tenth embodiment.

[0227] As shown in FIG. 30, the processing system SYSj of the tenth embodiment is different from the processing system SYSi of the ninth embodiment in that the measuring device 2i emits the measuring light ML to the workpiece W so that the measuring light ML is obliquely incident on the workpiece W. Other features of the processing system SYSj may be the same as other features of the processing system SYSi. Such a processing system SYSj of the tenth embodiment can also enjoy the same effects as those that the processing system SYSi of the ninth embodiment can enjoy. Furthermore, the processing system SYSj of the tenth embodiment can emit the processing light EL and the measuring light ML toward the same position on the workpiece W. That is, even if the processing device 1i and the measuring device 2i are separate devices, the processing system SYSj can emit the processing light EL and the measuring light ML so that the optical path of the processing light EL and the optical path of the measuring light ML at least partially overlap. As a result, the stage 32 does not necessarily have to move between the position where the processing device 1i can irradiate the processing light EL and the position where the measuring device 2i can irradiate the measuring light ML.

[0228] In addition, the tenth embodiment may also employ the constituent elements described in at least one of the second to ninth embodiments described above. The constituent elements described in the ninth embodiment include a constituent element that a device that emits processing light EL to the workpiece W and a device that emits measurement light ML to the workpiece W are separate devices.

[0229] (11) Machining system SYSk according to the eleventh embodiment Next, a processing system SYS of an eleventh embodiment (hereinafter, the processing system SYS of the eleventh embodiment will be referred to as a "processing system SYSk") will be described with reference to Fig. 31. Fig. 31 is a cross-sectional view that illustrates a schematic overall structure of the processing system SYSk of the eleventh embodiment.

[0230] As shown in Fig. 31, the machining system SYSk of the eleventh embodiment differs from the machining system SYSj of the tenth embodiment in that it includes a plurality of measuring devices 2 instead of the measuring device 2i. In the example shown in Fig. 31, the machining system SYSk includes two measuring devices 2k (specifically, a measuring device 2k#1 and a measuring device 2k#2). Other features of the machining system SYSk may be the same as other features of the machining system SYSj.

[0231] The measuring device 2k#1 is a device that includes at least a part of the optical members included in the measuring device 2i. The measuring device 2k#2 is a device that includes at least a remaining part of the optical members included in the measuring device 2i (i.e., the optical members not included in the measuring device 2k#1). In other words, the processing system SYSk of the eleventh embodiment is different from the processing system SYSj of the tenth embodiment described above in that the measuring device 2i is further divided into a plurality of measuring devices 2k. Note that the measuring devices 2k#1 and 2k#2 may include the same optical members. In other words, the measuring devices 2k#1 and 2k#2 may include optical members that have the same function or perform the same function.

[0232] In the example shown in FIG. 31, the measurement device 2k#1 at least includes a measurement light source 113, a measurement optical system 114#1 corresponding to a part of the measurement optical system 114, and a measurement irradiation optical system 119h. On the other hand, the measurement device 2k#2 at least includes a measurement optical system 114#2 corresponding to the remaining part of the measurement optical system 114 (that is, including at least an optical member not included in the measurement optical system 114#1 among the multiple optical members included in the measurement optical system 114). In particular, the measurement optical system 114#2 includes at least a detector 1146. Therefore, in the example shown in FIG. 31, the measurement light ML (specifically, the measurement light ML#2-2) is emitted from the measurement optical system 114#1 to the workpiece W, and the measurement light ML (specifically, the measurement light #2-3) from the workpiece W is incident on the measurement optical system 114#2.

[0233] The machining system SYSk of the eleventh embodiment can achieve the same effects as those achieved by the machining system SYSj of the tenth embodiment.

[0234] In the eleventh embodiment, the components described in at least one of the second to tenth embodiments may be adopted. The components described in the tenth embodiment include the component that the measurement light ML is obliquely incident on the workpiece W.

[0235] (12) Machining system SYSl of the 12th embodiment Next, a processing system SYS of a twelfth embodiment (hereinafter, the processing system SYS of the twelfth embodiment will be referred to as a "processing system SYSl") will be described with reference to Fig. 32. Fig. 32 is a cross-sectional view that illustrates a schematic overall structure of the processing system SYSl of the twelfth embodiment.

[0236] 32, the processing system SYSl of the 12th embodiment differs from the processing system SYSj of the above-described 10th embodiment in that an index 13l that can be measured by the measuring device 2i is attached to the processing device 1i. For example, the index 13l may be attached to the housing 117 (for example, the outer surface of the housing 117) of the processing device 1i. Other features of the processing system SYSl may be the same as other features of the processing system SYSj.

[0237] The measurement device 2i emits the measurement light ML (specifically, measurement light ML #2-2) to the index 13l in addition to emitting the measurement light ML to the workpiece W. For example, the measurement device 2i may emit the measurement light ML to the index 13l by deflecting the measurement light ML with a galvanometer mirror 1191h. For example, the measurement device 2i may emit the measurement light ML to the index 13l by changing the position of the measurement device 2i in at least one of the X-axis direction, the Y-axis direction, the Z-axis direction, the θX direction, the θY direction, and the θZ direction by the head drive system 22i.

[0238] The measuring device 2i may emit the measurement light ML to the index 13l before the processing device 1i starts processing the workpiece W (for example, at the timing when the workpiece W is placed on the stage 32). The measuring device 2i may emit the measurement light ML to the index 13l before the processing device 1i irradiates the workpiece W with the processing light EL. The measuring device 2i may emit the measurement light ML to the index 13l during at least a part of the period during which the processing device 1i irradiates the workpiece W with the processing light EL. The measuring device 2i may emit the measurement light ML to the index 13l after the processing device 1i irradiates the workpiece W with the processing light EL. The measuring device 2i may emit the measurement light ML to the index 13l after the processing device 1i completes processing of the workpiece W.

[0239] When the measurement light ML (specifically, the measurement light ML#2-2) is irradiated onto the index 13l, light resulting from the irradiation of the measurement light ML#2-2 (for example, at least one of the above-mentioned reflected light, scattered light, diffracted light, and transmitted light) is generated from the index 13l. Therefore, in the twelfth embodiment, the measurement light ML#2-3 including at least a part of the light emitted from the index 13l due to the irradiation of the measurement light ML#2-2 is incident on the detector 1146. Therefore, the control device 5 determines the state ( Specifically, the position of the index 13l relative to the measuring head 21i can be calculated. Furthermore, since the index 13l is attached to the processing head 11i, the control device 5 can calculate the position of the processing head 11i relative to the measuring head 21i based on the calculated position of the index 13l. In other words, the control device 5 can calculate the relative positional relationship between the reference point of the measuring head 21i and the reference point of the processing head 11i (typically, the distance between the reference point of the measuring head 21i and the reference point of the processing head 11i).

[0240] The control device 5 may control the position of the processing head 11i and / or the measurement head 21i based on information on the calculated relative positional relationship between the reference point of the measurement head 21i and the reference point of the processing head 11i (hereinafter referred to as the "baseline amount"). The control device 5 may control the position of the stage 32 based on the baseline amount. The control device 5 may control the irradiation position of the processing light EL and / or the irradiation position of the measurement light ML based on the baseline amount. For example, the control device 5 may control the position of the processing head 11i, the position of the measurement head 21i, the position of the stage 32, the irradiation position of the processing light EL and / or the irradiation position of the measurement light ML based on the baseline amount so that the processing light EL is irradiated to a desired position of the workpiece W. For example, the control device 5 may control the position of the processing head 11i, the position of the measurement head 21i, the position of the stage 32, the irradiation position of the processing light EL and / or the irradiation position of the measurement light ML based on the baseline amount so that the measurement light ML is irradiated to a desired position of the workpiece W.

[0241] Such a machining system SYSl of the twelfth embodiment can achieve the same effects as those achieved by the machining system SYSj of the tenth embodiment. Furthermore, the machining system SYSl can machine the workpiece W based on the baseline amount. Therefore, even if the positional relationship between the machining device 1i and the measuring device 2i deviates from the ideal positional relationship (typically, the positional relationship as designed), the machining system SYSl can machine the workpiece W based on the baseline amount that reflects the deviation in the positional relationship. Therefore, the machining system SYSl can machine the workpiece W more appropriately.

[0242] In addition, the twelfth embodiment may also employ at least one of the components described in the second to eleventh embodiments. The components described in the eleventh embodiment include components related to the division of the measuring head 21i.

[0243] (13) Other modifications In the above description, the processing system SYS forms a riblet structure on the surface of the workpiece W. However, the processing system SYS may form an arbitrary structure having an arbitrary shape on the surface of the workpiece W. Even in this case, if the control device 5 controls the processing head 11, etc. so that the processing light EL scans the surface of the workpiece W along a scanning trajectory corresponding to the structure to be formed, an arbitrary structure having an arbitrary shape can be formed. An example of an arbitrary structure is a micro- or nanometer-order fine texture structure (typically an uneven structure) formed regularly or irregularly. Such a fine texture structure may include at least one of a shark skin structure and a dimple structure having a function of reducing resistance by a fluid (gas and / or liquid). The fine texture structure may include a lotus leaf surface structure having at least one of a liquid repellent function and a self-cleaning function (for example, having a lotus effect). The fine texture structure may include at least one of a fine protrusion structure having a liquid transport function (see U.S. Patent Publication No. 2017 / 0044002), a concave-convex structure having a lyophilic function, a concave-convex structure having an anti-fouling function, a moth-eye structure having at least one of a reflectance reducing function and a liquid repellent function, a concave-convex structure that exhibits a structural color by intensifying only light of a specific wavelength through interference, a pillar array structure having an adhesive function utilizing van der Waals forces, a concave-convex structure having an aerodynamic noise reducing function, and a honeycomb structure having a droplet collecting function.

[0244] In the above description, the processing system SYS forms a riblet structure on the workpiece W to reduce the resistance of the surface of the workpiece W to the fluid. However, the processing system SYS may form another structure on the workpiece W that is different from the riblet structure for reducing the resistance of the surface to the fluid. For example, the processing system SYS may form a riblet structure on the workpiece W to reduce noise generated when the fluid and the surface of the workpiece W move relatively to each other. For example, the processing system SYS may form a structure on the workpiece W that generates vortices in response to the flow of the fluid on the surface of the workpiece W. For example, the processing system SYS may form a structure on the workpiece W to impart hydrophobicity to the surface of the workpiece W.

[0245] In the above description, the processing system SYS that processes an object with the processing light EL is described. That is, in the above description, an example in which the second drive system 122 connects the processing head 11 and the first drive system 121 is described. However, in addition to or instead of the processing head 11 in the processing system SYS, an end effector that acts on an object may be used. For example, as shown in FIG. 33 showing an example of the structure of a processing device 1m equipped with an end effector, the second drive system 122 may connect the end effector 13m and the first drive system 121. In the example shown in FIG. 33, the end effector 13m is attached to the processing head 11, and the second drive system 122 connects the end effector 13m and the first drive system 121 via the processing head 11. However, the end effector 13m may be attached to the second drive system 122 without the processing head 11. The processing system SYS equipped with such an end effector may be called a robot system. Incidentally, while FIG. 33 shows an example in which the processing apparatus 1 of the first embodiment is equipped with an end effector 13m, at least one of the processing apparatus 1 of the second embodiment to the processing apparatus 1i of the twelfth embodiment may be equipped with an end effector 13m.

[0246] The end effector may be a part having a function of directly acting on a work target (e.g., an object). The end effector may also be a part that obtains the properties of the work target (e.g., an object). Here, the properties of the object (e.g., a work target) may include at least one of the object's shape, object's position, object's feature point positions, object's attitude, object's surface properties (e.g., at least one of reflectance, spectral reflectance, surface roughness, color, etc.), and object's hardness. The machining head 11, the measuring head 21i, and the position measuring device 6g in the above description can be considered as a type of end effector.

[0247] In the above description, the processing light source and the measurement light source are separate light sources, but they may be combined into a single light source.

[0248] In the above description, a galvanometer mirror is used as the irradiation position changing optical system, but a polygon mirror or a MEMS mirror may also be used.

[0249] In the above description, an fθ lens with a projection characteristic of fθ is used as the irradiation optical system that irradiates the processing light EL and / or the measurement light ML onto the workpiece W, but an optical system with other projection characteristics may also be used. Furthermore, as described above, the irradiation optical system is not limited to a total refractive optical system (dioptric optical system), but may be a reflective refractive optical system (catadioptric optical system) or a total reflective optical system (cataptric optical system).

[0250] In the above description, the processing head 11 is movable by the head drive system 12. Here, the head drive system 12 is not limited to a robot, and may be, for example, an aircraft capable of flying at a position away from the workpiece W. Examples of the aircraft include at least one of an airplane, a drone, a helicopter, a balloon, and an airship.

[0251] (9) Additional Notes The following supplementary notes are further disclosed regarding the above-described embodiment.

[0252] [Appendix 1] A processing member that processes an object by irradiating the object with processing light from a processing light source, a measurement optical system that emits measurement light including pulsed light; an illumination optical system that illuminates the object with the measurement light from the measurement optical system; Equipped with The optical path of the processing light and the optical path of the measurement light at least partially overlap each other. Processed parts.

[0253] [Appendix 2] The optical path of the processing light overlaps at least a part of the optical path of the measurement light between the irradiation optical system and the object. 2. The workpiece according to claim 1.

[0254] [Appendix 3] an irradiation position changing optical system for changing the irradiation position of the measurement light on the object; 3. The processed member according to claim 1 or 2.

[0255] [Appendix 4] The optical path of the measurement light is an area through which the measurement light can pass by the irradiation position changing optical system. 4. The processed member according to claim 3.

[0256] [Appendix 5] The irradiation optical system collects the measurement light from the irradiation position changing optical system. 5. The processed member according to claim 3 or 4.

[0257] [Appendix 6] The irradiation position changing optical system changes an emission angle of the measurement light. 6. The processed member according to any one of claims 3 to 5.

[0258] [Appendix 7] When the emission angle of the measurement light is changed by the irradiation position changing optical system, the irradiation position on the object is changed. 7. The processed member according to claim 6.

[0259] [Appendix 8] The irradiation optical system emits the measurement light and the processing light toward the object. 8. The processed member according to any one of claims 1 to 7.

[0260] [Appendix 9] an irradiation position changing optical system that changes the irradiation position of the processing light on the object and the irradiation position of the measurement light on the object; 9. The workpiece according to claim 8.

[0261] [Appendix 10] the optical path of the processing light is an area through which the processing light can pass by the irradiation position changing optical system; The optical path of the measurement light is an area through which the measurement light can pass by the irradiation position changing optical system. 10. The processed member according to claim 9.

[0262] [Appendix 11] The irradiation position changing optical system changes the irradiation position of the processing light on the object and the irradiation position of the measurement light on the object in conjunction with each other. 11. The processed member according to claim 9 or 10.

[0263] [Appendix 12] The irradiation optical system collects the processing light and the measurement light from the irradiation position changing optical system. 12. The processed member according to any one of claims 8 to 11.

[0264] [Appendix 13] The irradiation position changing optical system changes an exit angle of the processing light and an exit angle of the measurement light. 13. The processed member of any one of claims 8 to 12.

[0265] [Appendix 14] The irradiation position changing optical system includes a tilt angle variable mirror that changes an angle with respect to an optical path of the incident processing light and an optical path of the incident measurement light. 14. The processed member according to any one of claims 8 to 13.

[0266] [Appendix 15] In the irradiation optical system, a path of the processing light and a path of the measurement light at least partially overlap each other. 15. The processed member according to any one of claims 1 to 14.

[0267] [Appendix 16] In the irradiation optical system, a path of the processing light and a path of the measurement light are at least partially separated from each other along a direction intersecting an optical axis of the irradiation optical system. 16. The processed member according to any one of claims 1 to 15.

[0268] [Appendix 17] The processing optical system further includes a processing optical system that outputs the processing light incident from the processing light source to the irradiation optical system. 17. The workpiece of any one of claims 1 to 16.

[0269] [Appendix 18] a synthesis optical system that synthesizes the processing light from the processing optical system and the measurement light from the measurement optical system and outputs the synthesized light to the irradiation optical system; 18. The workpiece of claim 17.

[0270] [Appendix 19] The combining optical system outputs the measurement light and the processing light, which are respectively incident on the combining optical system from different directions, in the same direction. 19. The workpiece of claim 18.

[0271] [Appendix 20] The processing optical system is optically separated from the measurement optical system. 20. The processed member of any one of claims 17 to 19.

[0272] [Appendix 21] a measurement light source that supplies the measurement light, The measurement optical system emits the measurement light from the measurement light source toward the irradiation optical system. 21. The processed member of any one of claims 1 to 20.

[0273] [Appendix 22] The measurement light source is provided in a housing that houses the measurement optical system. 22. The processed member of claim 21.

[0274] [Appendix 23] The measurement optical system includes a detector that detects light generated by the measurement light irradiated onto the object. 23. The workpiece of any one of claims 1 to 22.

[0275] [Appendix 24] The detector detects interference light that is produced when the light generated by the measurement light irradiated onto the object interferes with a reference light that is generated from a portion of the measurement light. 24. The processed member of claim 23.

[0276] [Appendix 25] The reference beam does not pass through the object. 25. The processed member of claim 24.

[0277] [Appendix 26] The detector detects the light generated by the measurement light irradiated on the object via the irradiation optical system. 26. The workpiece of any one of claims 23 to 25.

[0278] [Appendix 27] The processed member is controlled based on the detection result of the detector. 27. The workpiece of any one of claims 23 to 26.

[0279] [Appendix 28] The irradiation position of the processing light on the object and the relative position of the object are controlled based on the detection result of the detector. 28. The workpiece of any one of claims 23 to 27.

[0280] [Appendix 29] The relative position between the irradiation optical system and the object is controlled based on the detection result of the detector. 29. The workpiece of any one of claims 23 to 28.

[0281] [Appendix 30] an irradiation position changing optical system for changing an irradiation position of the processing light on the surface of the object; The irradiation position changing optical system is controlled based on the detection result of the detector. 30. The workpiece of any one of claims 23 to 29.

[0282] [Appendix 31] The processing light source is further provided. 31. The workpiece of any one of claims 1 to 30.

[0283] [Appendix 32] The processing light source may further include a processing light irradiation optical system that emits the processing light from the processing light source toward the object. 32. The workpiece of any one of claims 1 to 31.

[0284] [Appendix 33] The processing light from the processing light source does not pass through the irradiation optical system. 33. The workpiece of claim 32.

[0285] [Appendix 34] The wavelength of the processing light is different from the wavelength of the measurement light. 34. The workpiece of any one of claims 1 to 33.

[0286] [Appendix 35] The processing light includes pulsed light. 35. The workpiece of any one of claims 1 to 34.

[0287] [Appendix 36] The measurement light includes light from an optical comb light source as the pulse light. 36. The workpiece of any one of claims 1 to 35.

[0288] [Appendix 37] The measurement light includes light including frequency components arranged at equal intervals on a frequency axis as the pulse light. 37. The workpiece of any one of claims 1 to 36.

[0289] [Appendix 38] At least some of the optical members constituting the irradiation optical system are replaceable. 38. The workpiece of any one of claims 1 to 37.

[0290] [Appendix 39] The replaceable part of the optical members is one of a plurality of candidate measurement optical systems having different emission directions of the measurement light with respect to the processed member. 39. The workpiece of claim 38.

[0291] [Appendix 40] The replaceable part of the optical members is one of a plurality of candidate measurement optical systems having different distances along the optical path of the measurement light between an incident position of the measurement light to the irradiation optical system and an exit position of the measurement light from the irradiation optical system. 40. The processed member according to claim 38 or 39.

[0292] [Appendix 41] a processing light irradiation optical system that emits the processing light incident from the processing light source toward the object, At least some of the optical members constituting the processing light irradiation optical system are replaceable. 41. The workpiece of any one of claims 1 to 40.

[0293] [Appendix 42] The replaceable part of the optical members is one of a plurality of candidate optical systems for processing, each of which has a different emission direction of the processing light with respect to the workpiece. 42. The workpiece of claim 41.

[0294] [Appendix 43] The replaceable part of the optical members is one of a plurality of candidate processing optical systems having different distances along the optical path of the processing light between an incident position of the processing light to the processing light irradiation optical system and an exit position of the processing light from the processing light irradiation optical system. 43. The processed member according to claim 41 or 42.

[0295] [Appendix 44] The irradiation optical system emits a plurality of the measurement beams toward the object. 44. The workpiece of any one of claims 1 to 43.

[0296] [Appendix 45] The irradiation optical system emits the plurality of measurement beams toward different positions on the object. 45. The workpiece of claim 44.

[0297] [Note 46] a first measurement light among the plurality of measurement light is used for a first purpose, A second measurement light different from the first measurement light among the plurality of measurement light is used for a second purpose different from the first purpose. 46. ​​The processed member according to claim 44 or 45.

[0298] [Appendix 47] the first use includes use for identifying a shape of the object; The second use includes use for identifying a relative position between the object and at least one of the measurement optical system and the processing optical system that emits the processing light toward the object. 47. The workpiece of claim 46.

[0299] [Appendix 48] The apparatus further includes a position changing device for changing a relative position between the object and a housing in which the processed member is housed. 48. The workpiece of any one of claims 1 to 47.

[0300] [Appendix 49] The position changing device is a movable member whose relative positional relationship with a part of the object is changeable; a connection device that connects the movable member and the housing so that a relative positional relationship between the movable member and the housing can be changed; Equipped with The connection device includes a drive member that moves at least one of the movable member and the housing, and an elastic member that connects the movable member and the housing. 49. The workpiece of claim 48.

[0301] [Appendix 50] The position changing device changes a relative position between the housing and the object based on a detection result of light generated by the measurement light irradiated on the object. 49. The workpiece of claim 49.

[0302] [Appendix 51] a position measuring device that measures a relative position between the object and at least one of the irradiation optical system and a processing light irradiation optical system that emits the processing light toward the object; 51. The workpiece of any one of claims 1 to 50.

[0303] [Appendix 52] The position measurement device includes an imaging device that images a surface of the object. 52. The workpiece of claim 51.

[0304] [Appendix 53] a first optical system that emits measurement light including pulsed light toward an object; a second optical system that processes the object by irradiating the object with processing light; a support section that supports at least a portion of the first optical system in a state in which at least a portion of the first optical system is displaceable relative to the object, and supports at least a portion of the second optical system in a state in which at least a portion of the second optical system is displaceable relative to the object; a drive unit that drives at least a part of the first optical system and at least a part of the second optical system via the support unit; A robot system comprising:

[0305] [Appendix 54] A light source that emits an optical frequency comb as a reference light and an optical frequency comb as a measurement light, which are phase-locked and coherent with each other; an illumination optical system that illuminates an object with the measurement light emitted from the light source; a reference surface on which the reference light emitted from the light source is incident; a detection unit that detects an interference signal based on interference light between light generated from the object by the measurement light irradiated onto the object and a reference light returned from the reference surface; an optical fiber that transmits at least one of the measurement light traveling from the light source to the irradiation optical system and the light generated from the object by the measurement light irradiated onto the object; a signal processing unit that obtains information regarding a position of the object using the interference signal detected by the detection unit; Equipped with The optical fiber includes an image fiber having a plurality of cores arranged in a plane transverse to the traveling direction of the at least one light. Measuring equipment.

[0306] [Appendix 55] The detection unit has a plurality of photoelectric conversion elements arranged along at least one direction. 55. The measuring device of claim 54.

[0307] [Appendix 56] an optical system that makes an end face of the optical fiber on the detector side conjugate with a plane on which the plurality of photoelectric conversion elements are arranged; 56. The measuring device according to claim 55.

[0308] [Appendix 57] The image fiber has a bundle of multiple fibers arranged in the transverse plane. 57. The measuring device of any one of claims 54 to 56.

[0309] [Appendix 58] The image fiber includes a multi-core optical fiber having a plurality of cores arranged on the transverse plane and a cladding between the plurality of cores. 58. The measuring device of any one of claims 54 to 57.

[0310] The requirements of each of the above-described embodiments may be combined as appropriate. Some of the requirements of each of the above-described embodiments may not be used. The requirements of each of the above-described embodiments may be replaced with the requirements of other embodiments as appropriate. In addition, to the extent permitted by law, the disclosures of all publications and U.S. patents relating to the devices, etc. cited in each of the above-described embodiments are incorporated by reference into the present description.

[0311] Furthermore, the present invention can be modified as appropriate within the scope that does not contradict the gist or concept of the invention that can be read from the claims and the entire specification, and processing devices, processing members, robot systems, and measuring devices that involve such modifications are also included in the technical concept of the present invention. [Explanation of symbols]

[0312] 1 Processing equipment 11 Processing head 111 Processing light source 112 Processing optical system 113 Measurement Light Source 114 Measurement Optical System 115 Synthetic optical system 116 Common optical system 12 Head drive system 5. Control device EL processing light ML measurement light SYS Machining System

Claims

1. A processing device for processing an object, comprising: a branching optical system that branches the first measurement light and the second measurement light; a deflection optical system that deflects the first measurement light in a first direction; a detector that detects light generated by the first measurement light irradiated onto the object via the deflection optical system and the second measurement light irradiated onto the object; a control device that enables the object to be processed based on a detection result of the detector; Equipped Processing equipment.

2. The optical system further includes a synthesis optical system that synthesizes a processing light for processing the object and the first measurement light, The deflection optical system deflects the processing light and the first measurement light, which have been incident via the combining optical system, in a first direction. The processing device according to claim 1 .

3. The deflection optical system further deflects the processing light, the first measurement light, and the second measurement light in a second direction. The processing device according to claim 2.

4. Further comprising an irradiation optical system that irradiates the processing light, the first measurement light, and the second measurement light onto the object. The processing device according to claim 2 or 3.

5. The detector detects light generated by the first measurement light and the second measurement light irradiated to the object via the irradiation optical system and the synthesis optical system. The processing device according to claim 4.

6. The control device controls the deflection optical system so as to change the irradiation position of the processing light on the object based on a detection result of the detector. The processing device according to any one of claims 2 to 5.

7. The deflection optical system changes the irradiation position of the processing light on the object and the irradiation position of the first measurement light on the object in a coordinated manner. The processing device according to claim 6.

8. The deflection optical system changes an exit angle of the processing light and an exit angle of the first measurement light. The processing device according to any one of claims 1 to 7.

9. The detector detects interference light between a reference light generated from a portion of the first measurement light and at least a portion of the second measurement light. The processing device according to any one of claims 1 to 8.

10. A method for processing an object, comprising the steps of: a branching step of branching the light into a first measurement light and a second measurement light; a deflection step of deflecting the first measurement light in a first direction; an irradiation step of irradiating the object with the first measurement light that has been deflected in the deflection step and the second measurement light; a detection step of detecting light generated by the first measurement light irradiated onto the object after the deflection step and the second measurement light irradiated onto the object; a control step of enabling the object to be processed based on a detection result of the detector; A processing method comprising the steps of:

11. The processing step is a step of irradiating the object with processing light and processing the object, a combining step of combining the processing light and the first measurement light, the deflection step includes deflecting the processing light and the first measurement light, which have been subjected to the combining step, in a first direction; The irradiation step irradiates the object with the second measurement light in addition to the first measurement light and the processing light that have been subjected to the deflection step. The processing method according to claim 10.

12. The deflection step further deflects the processing light, the first measurement light, and the second measurement light in a second direction. The processing method according to claim 11.

13. The control step controls so as to change the irradiation position of the processing light with respect to the object in the deflection step based on a detection result in the detection step. The processing method according to claim 11 or 12.

14. The deflection step changes the irradiation position of the processing light on the object and the irradiation position of the first measurement light on the object in a coordinated manner. The processing method according to claim 13.

15. The deflection step changes an emission angle of the processing light and an emission angle of the first measurement light. The processing method according to any one of claims 11 to 14.

16. The detection step includes detecting interference light between a reference light generated from a portion of the first measurement light and at least a portion of the second measurement light. The processing method according to any one of claims 11 to 15.

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