Auto-Teach Enclosure System

Abstract

To provide an enclosure system that enables an autoteach operation.SOLUTION: An autoteach enclosure system 200 includes: a plurality of surfaces that at least partially enclose an interior volume 202 and form a front interface, where the surfaces include sidewall surfaces 210A, 210B, a bottom surface 212, a top surface 214 and a rear surface 216; and an autoteach pin 230 at least partially disposed within the interior volume. The autoteach pin is a scannable feature having a fixed position within the autoteach enclosure system. A front interface is coupled to one or more of the surfaces to interface the autoteach enclosure system with a substantially vertical portion of a load port of a wafer processing system. The autoteach pin enables an autoteach operation, which is an operation of automatically teaching the fixed position within the autoteach enclosure system to a robot arm of the wafer processing system.SELECTED DRAWING: Figure 2B

Description

[Technical field]

[0001] SUMMARY OF THE DISCLOSURE Embodiments of the present disclosure relate to enclosure systems, such as those used in wafer processing systems, and more particularly to enclosure systems configured to enable auto-teach operations. [Background technology]

[0002] In semiconductor processing and other electronic component processing, platforms are often used that use robotic arms to transfer objects, such as wafers, between processing chambers, from a storage area (e.g., a front opening unified pod (FOUP)) to a processing chamber, from a processing chamber to a storage area, and so on. A processing system, such as a wafer processing system, has one or more processing chambers for processing wafers. Gases may be used to etch the wafer in the processing chamber (e.g., the wafer may be etched while electrostatically held in place in the etching chamber). The robotic arm picks up the object from a particular location and transfers the object to a particular location. Summary of the Invention

[0003] The following is a simplified summary of the disclosure to provide a basic understanding of some aspects of the disclosure. This summary is not a detailed overview of the disclosure. It is not intended to identify key or critical elements of the disclosure, nor to delineate the scope or claims of particular embodiments of the disclosure. Its sole purpose is to present some concepts of the disclosure in a simplified form as a prelude to the more detailed description that is presented below.

[0004] In one aspect of the disclosure, an auto-teach enclosure system includes a plurality of surfaces at least partially enclosing an interior space of the auto-teach enclosure system. The auto-teach enclosure system further includes an auto-teach pin disposed at least partially within the interior space. The auto-teach pin is a scannable feature having a fixed position within the auto-teach enclosure system. The auto-teach enclosure system includes a front interface coupled to one or more of the plurality of surfaces for connecting the auto-teach enclosure system with a substantially vertical portion of a load port of a wafer processing system. The auto-teach pin enables an auto-teach operation of a robot arm of the wafer processing system. The auto-teach operation is an operation of automatically teaching a fixed position within the auto-teach enclosure system to a robot arm of the wafer processing system.

[0005] In another aspect of the disclosure, the method includes connecting a front interface of the auto-teach enclosure system with a substantially vertical portion of a load port of the factory interface to establish a sealed environment including an interior space of the auto-teach enclosure system and an interior of a factory interface of a wafer processing system. The method further includes scanning an auto-teach pin disposed within the interior space of the auto-teach enclosure system by a robotic arm of the factory interface while maintaining the sealed environment. The method further includes determining a fixed location associated with the auto-teach enclosure system based on a result of the scanning. The article is transferred by the robotic arm based on the fixed location.

[0006] In another aspect of the present disclosure, an enclosure system includes a plurality of surfaces at least partially enclosing an interior space of the enclosure system. The enclosure system further includes a plurality of support structures disposed within the interior space. The enclosure system further includes a calibration substrate mounted on the plurality of support structures within the interior space. The calibration substrate includes calibration pins. The enclosure system further includes a front interface coupled to one or more of the plurality of surfaces. The front interface is configured to connect the enclosure system with a substantially vertical portion of a load port of a wafer processing system. The calibration substrate enables a robot arm calibration operation of automatically determining a robot arm error of a robot arm of the wafer processing system.

[0007] The present disclosure is illustrated by way of non-limiting example in the accompanying drawings, in which like reference numerals indicate similar elements, and in which: Note that various references to "an" or "one" embodiment in the present disclosure are not necessarily to the same embodiment, and such references mean at least one. [Brief description of the drawings]

[0008] [Figure 1] 1 illustrates a processing system according to certain embodiments. [Figure 2A] FIG. 1 illustrates a front view of an auto-teach enclosure system according to certain embodiments. [Figure 2B] FIG. 1 illustrates an exploded perspective view of an auto-teach enclosure system according to certain embodiments. [Figure 2C] 1 illustrates a perspective view of a calibration substrate disposed within an auto-teach enclosure system, according to certain embodiments. [Figure 3A] 1 illustrates a front view of an auto-teach pin of an auto-teach enclosure system, according to certain embodiments. [Figure 3B] 1 illustrates a top view of an auto-teach pin of an auto-teach enclosure system, according to certain embodiments. [Figure 4A]FIG. 1 illustrates a top view of a robotic arm according to certain embodiments. [Figure 4B] FIG. 1 illustrates a top view of a robotic arm according to certain embodiments. [Figure 4C] 1 illustrates a method for performing a calibration operation using an auto-teach enclosure system, according to certain embodiments. [Figure 5A] 1 illustrates a method for performing one or more of an auto-teach operation, a calibration operation, or a diagnostic operation using an auto-teach enclosure system, according to certain embodiments. [Figure 5B] 1 illustrates a method for performing a calibration operation using an auto-teach enclosure system, according to certain embodiments. [Figure 5C] 1 illustrates a method for performing an auto-teach operation using an auto-teach enclosure system, according to certain embodiments. [Figure 5D] 1 illustrates a method for performing diagnostic operations using an auto-teach enclosure system, according to certain embodiments. [Figure 6] FIG. 1 is a block diagram illustrating a computer system according to certain embodiments. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] The embodiments described herein relate to an automated teaching enclosure system. A robot arm (e.g., atmospheric robot, factory interface robot, etc.) is located in a factory interface of a wafer processing system and moves wafers within the wafer processing system. An enclosure system (e.g., a Front Opening Unified Pod (FOUP) or other substrate enclosure system) is used to transfer objects such as wafers. The enclosure system provides a sealed environment during transfer. The enclosure system interfaces with the wafer processing system (e.g., docks with the wafer processing system, fits tightly to the wafer processing system, etc.), resulting in a sealed environment that includes the interior space of the enclosure system and the interior space of the factory interface. The robot arm removes objects from and / or inserts objects into the enclosure system during operation, and the enclosure system is closed and removed from the wafer processing system (e.g., sealed and disconnected with a door) when processing of wafers in the enclosure system is completed. The robotic arm picks up the wafer from a specific location from the enclosure system and places the wafer at a specific location within the enclosure system.

[0010] A robot arm with errors causes damage to the wafer, the enclosure system, and / or the robot arm. Robot arm errors are related to teaching, calibration, and / or diagnostics of components. Teaching refers to teaching the robot arm a location (e.g., a reference point) of the enclosure system. For example, the reference point can be the center of the enclosure system. Calibration refers to determining errors in the robot arm's motion (e.g., joint kinematic errors, joint hysteresis, joint backlash) and adjusting the settings of the robot arm to compensate for the determined errors. Diagnostics refers to determining whether a component of the robot arm is malfunctioning. For example, an end effector of the robot arm has a planar top surface, a protrusion (e.g., a fang) extending upward from the planar top surface, and a plunger disposed on the planar top surface. The end effector is configured to grasp a substrate disposed on the planar top surface by actuating the plunger to secure the substrate between the actuated plunger and the distal protrusion. Diagnostics can be performed to determine if the plunger of the robot arm is malfunctioning (eg, the plunger does not extend far enough to clamp the substrate, the plunger does not actuate fast enough, etc.).

[0011] If the location of the enclosure system (e.g., the center location of the enclosure system) is not taught to the robot arm, the robot arm will attempt to lift the wafer from an incorrect location and / or place the wafer in an incorrect location. Lifting the wafer from an incorrect location and / or placing the wafer in an incorrect location will cause damage to the wafer, the enclosure system, and / or the robot arm. Furthermore, even if the robot arm is instructed to lift and place the wafer in the correct location, this is often not actually achieved if the robot arm is not calibrated. If the robot arm is not calibrated, errors in the robot arm movement due to the lack of calibration will cause the robot arm to lift the wafer from an incorrect location and / or place the wafer in an incorrect location, thereby causing damage to the wafer, the enclosure system, and / or the robot arm. Furthermore, even if the center or zero location of the enclosure system is taught to the robot arm and the robot arm is calibrated, the robot arm may malfunction, still causing damage to the wafer, the enclosure system, and / or the robot arm. Correspondingly, in some embodiments, diagnostics are performed to determine if and / or how the robot arm is malfunctioning. Errors resulting from the robot arm not being taught the correct location of the enclosure system, the robot arm movements not being calibrated, and / or malfunctioning parts of the robot arm not being properly diagnosed may further result in wafers being improperly processed.

[0012] Traditionally, teaching the robot arm a position, calibrating the robot arm's movement, and diagnosing malfunctioning parts of the robot arm (e.g., determining the robot arm's error, the robot arm's speed dropping below a threshold speed) are manual processes. For manual processes, a technician opens the wafer processing system (resulting in an enclosed environment in the wafer processing system's factory interface being exposed to the atmosphere), manually operates the robot arm (potentially introducing contaminants to the robot arm), and manually performs the teaching, calibration, and diagnosis. After being opened, the wafer processing system undergoes a lengthy requalification process during which it is not used to process wafers. The requalification process impacts line yield, scheduling, quality, user time, energy used, etc.

[0013] The apparatus, systems, and methods disclosed herein provide an auto-teach enclosure system (e.g., a FOUP) that enables one or more of an auto-teach operation, a calibration operation, or a diagnostic operation. In one embodiment, the auto-teach enclosure system includes a surface (e.g., a top surface, a side surface, a bottom surface, a back surface, etc.) that at least partially encloses an interior space of the auto-teach enclosure system. An auto-teach pin is at least partially disposed within the interior space. The auto-teach pin is a scannable feature (e.g., a cylindrical feature that can be scanned by a robot arm) that has a fixed position within the auto-teach enclosure system. A front interface (e.g., a door frame) coupled to one or more of the surfaces (e.g., the side surface, the top surface, the bottom surface, etc.) connects the auto-teach enclosure system with a substantially vertical portion of a load port of a wafer processing system (e.g., encloses the auto-teach enclosure system). The auto-teach enclosure system includes a base plate fixed to a bottom surface (e.g., a bottom wall) of the surfaces (e.g., walls) of the auto-teach enclosure system. The auto-teach pins are fixed to the base plate and extend through the bottom surface into the interior space. The base plate connects the auto-teach enclosure system to a substantially horizontal portion of the load port. The substantially horizontal portion includes a kinematic device (e.g., kinematic pin, kinematic flange, etc.) for placing the auto-teach enclosure system in a precise position (e.g., the same position each time the auto-teach enclosure system connects with the load port). The robot arm scans the auto-teach pins to perform an auto-teach operation. An auto-teach operation is an operation that automatically determines (e.g., based on the position of the auto-teach pins) a fixed position (e.g., center) of one or more of the auto-teach enclosure system, the substantially horizontal portion of the load port, or the kinematic device, etc. The robot arm uses the determined fixed position to retrieve and / or insert an object from another enclosure system that connects with the load port.

[0014] In some embodiments, a calibration substrate is mounted on a support structure within an interior space of the auto-teach enclosure system. The calibration substrate is substantially horizontal and includes calibration pins secured to a top surface of the calibration substrate. A robot arm performs a calibration operation using the calibration substrate. The robot arm is instructed to scan the calibration pins to determine a first position of the calibration substrate (e.g., of the calibration pins), remove the calibration substrate from the support structure (e.g., remove the calibration substrate from the auto-teach enclosure system), place the calibration substrate at a first position on the support structure, scan the calibration pins to determine a second position of the calibration substrate, and determine a robot arm error based on a difference between the first position and the second position.

[0015] In one embodiment, a robot arm is used to perform a diagnostic operation with a calibration substrate. The calibration substrate has a first width in a first orientation and a second width in a second orientation. In some examples, a perimeter of the calibration substrate includes a notch. The robot arm is moved to position under the calibration substrate in the first orientation, and a plunger of the robot arm is actuated to clamp the calibration substrate in the first orientation to determine whether a first error occurs in clamping the calibration substrate in the first orientation. The same process is repeated in the second orientation to determine whether a second error occurs in clamping the calibration substrate in the second orientation. In some embodiments, the first error or the second error includes one or more of a time that the plunger takes to clamp against the calibration substrate that exceeds a threshold amount, a distance that the plunger extends that is not equal to a distance between the robot arm and the calibration substrate, or the like.

[0016] The apparatus, systems, and methods disclosed herein have advantages over conventional solutions. The auto-teach enclosure system interfaces with a load port of a wafer processing system to enable one or more of auto-teach, auto-calibration, and / or auto-component diagnostic operations (e.g., to perform the above operations while maintaining a sealed environment) without opening the wafer processing system (e.g., without opening a factory interface of the wafer processing system) and without a subsequent requalification process of the wafer processing system. The load port is configured to accept various types of enclosure systems, such as a front opening unified pod (FOUP). The load port fits tightly against a front interface of the auto-teach enclosure system to prevent contamination within the wafer processing system (factory interface), prevent harmful gases from exiting the wafer processing system (factory interface), and / or maintain an inert environment within the factory interface. The auto-teach enclosure system includes an auto-teach pin for enabling the auto-teach operation. In some embodiments, the auto-teach enclosure system includes a calibration substrate to enable one or more of calibration or diagnostic operations. The auto-teach enclosure system is used to learn fixed positions relative to the load port, robot arm errors, and / or problems with the robot arm, allowing the robot arm to be controlled to remove and place wafers at precise locations. In doing so, the auto-teach enclosure system reduces wafer errors and reduces damage to the robot arm, enclosure system, and / or wafer processing system. The use of the auto-teach enclosure system has less impact on line yield, scheduling, quality, user time, energy used, etc. than traditional solutions.

[0017] The auto-teach enclosure system being used for auto-teach operations is intended to be illustrative rather than limiting. In some embodiments, the auto-teach enclosure system is used for one or more of calibration operations, diagnostic operations, or auto-teach operations. In some embodiments, the auto-teach enclosure system is not used for auto-teach operations (e.g., no auto-teach operations are provided and the system is used for calibration and / or diagnostic operations).

[0018] FIG. 1 illustrates a processing system 100 (e.g., a wafer processing system) according to certain embodiments. The processing system 100 includes a factory interface 101 and load ports 128 (e.g., load ports 128A-128D). In some embodiments, the load ports 128A-128D are directly attached to (e.g., sealed to) the factory interface 101. An enclosure system 130 (e.g., a cassette, FOUP, process kit enclosure system, auto-teach enclosure system, etc.) is configured to removably couple (e.g., dock) to the load ports 128A-128D. Referring to FIG. 1, an enclosure system 130A is coupled to the load port 128A, an enclosure system 130B is coupled to the load port 128B, an enclosure system 130C is coupled to the load port 128C, and an enclosure system 130D is coupled to the load port 128D. In some embodiments, one or more enclosure systems 130 are coupled to the load ports 128 for transferring wafers and / or other substrates to and from the processing system 100. Each of the enclosure systems 130 may seal to a corresponding load port 128. In some embodiments, a first enclosure system 130A is docked to the load port 128A (e.g., to teach, calibrate and / or diagnose a robot arm of the factory interface 101). Once such operations are performed, the first enclosure system 130A is then decoupled from the load port 128A and a second enclosure system 130 (e.g., a FOUP containing wafers) is then docked to the same load port 128A. In some embodiments, the enclosure system 130 (e.g., enclosure system 130A) is an auto-teach enclosure system for performing one or more of an auto-teach operation, a calibration operation, or a diagnostic operation.In some embodiments, the enclosure system 130 (eg, enclosure system 130B) is a process kit enclosure system for transporting an article 110, such as a process kit ring, into and out of the processing system 100.

[0019] In some embodiments, the load port 128 includes a front interface that forms a vertical opening (or a substantially vertical opening). The load port 128 further includes a horizontal surface for supporting an enclosure system 130 (e.g., a cassette, an auto-teach enclosure system). Each enclosure system 130 (e.g., a wafer FOUP, an auto-teach enclosure system, a process kit enclosure system) has a front interface that forms a vertical opening. The front interface of the enclosure system 130 is sized to connect to (e.g., fit closely to) the front interface of the load port 128 (e.g., the vertical opening of the enclosure system 130 is approximately the same size as the vertical opening of the load port 128). The enclosure system 130 rests on the horizontal surface of the load port 128, and the vertical opening of the enclosure system 130 is aligned with the vertical opening of the load port 128. The front interface of the enclosure system 130 interconnects with the front interface of the load port 128 (e.g., snapped to, fixed to, or sealed to the load port 128). The bottom plate (e.g., base plate) of the enclosure system 130 has features that engage with the horizontal surfaces of the load port 128 (e.g., load features such as recesses or receptacles that engage with kinematic pin features of the load port, load port features for pin clearance, and / or enclosure system docking tray latch clamp features). The same load port 128 can be used for various types of enclosure systems 130 (e.g., auto-teach enclosure systems, process kit enclosure systems, cassettes containing wafers, etc.).

[0020] In some embodiments, enclosure system 130 (e.g., an auto-teach enclosure system) includes auto-teach pins for performing auto-teach operations. In some embodiments, enclosure system 130 includes a calibration board (e.g., including calibration pins) for performing one or more of a calibration operation or a diagnostic operation. Correspondingly, enclosure system 130 may include both auto-teach pins and a calibration board.

[0021] In some embodiments, the enclosure system 130B (e.g., a process kit enclosure system) contains one or more items 110 (e.g., one or more of a process kit ring, an empty process kit ring carrier, a process kit ring mounted on a process kit ring carrier, a placement verification wafer, etc.). In some examples, the enclosure system 130B is coupled to the factory interface 101 (e.g., via a load port 128) to enable automated transfer of a process kit ring on a process kit ring carrier into the processing system 100 for replacement of a used process kit ring.

[0022] In some embodiments, the processing system 100 also includes first vacuum ports 103a, 103b that couple the factory interface 101 to corresponding degassing chambers 104a, 104b. Second vacuum ports 105a, 105b are coupled to corresponding degassing chambers 104a, 104b and disposed between the degassing chambers 104a, 104b and the transfer chamber 106 to facilitate transfer of wafers and articles 110 (e.g., process kit rings) to the transfer chamber 106. In some embodiments, the processing system 100 includes and / or uses one or more degassing chambers 104 and a corresponding number of vacuum ports 103, 105 (e.g., the processing system 100 includes a single degassing chamber 104, a single first vacuum port 103, and a single second vacuum port 105). The transfer chamber 106 is coupled to a plurality of processing chambers 107 (e.g., four processing chambers 107, six processing chambers 107, etc.) arranged around it. The processing chambers 107 are coupled to the transfer chamber 106 through respective ports 108, such as slit valves or the like. In some embodiments, the factory interface 101 is at a higher pressure (e.g., atmospheric pressure) and the transfer chamber 106 is at a lower pressure (e.g., vacuum). Each degassing chamber 104 (e.g., load lock, pressure chamber) has a first door (e.g., first vacuum port 103) to seal the degassing chamber 104 from the factory interface 101 and a second door (e.g., second vacuum port 105) to seal the degassing chamber 104 from the transfer chamber 106. An article is transferred from the factory interface 101 into the degassing chamber 104 while the first door is opened and the second door is closed, the first door is closed, the pressure in the degassing chamber 104 is reduced to match the transfer chamber 106, the second door is opened, and the article is transferred from the degassing chamber 104. A local center finding (LCF) device is used to align the article in the transfer chamber 106 (e.g., before entering the processing chamber 107, after exiting the processing chamber 107).

[0023] In some embodiments, the processing chamber 107 includes one or more of an etch chamber, a deposition chamber (including atomic layer deposition, chemical vapor deposition, physical vapor deposition, or plasma enhanced versions thereof), an annealing chamber, or the like.

[0024] The factory interface 101 includes a factory interface robot 111. The factory interface robot 111 includes a robot arm, such as a selective compliance assembly robot arm (SCARA) robot. Examples of SCARA robots include a two-link SCARA robot, a three-link SCARA robot, a four-link SCARA robot, and the like. The factory interface robot 111 includes an end effector at the end of the robot arm. The end effector is configured to lift and handle certain objects, such as wafers. Alternatively or additionally, the end effector is configured to handle objects, such as calibration substrates and process kit rings (edge ​​rings). The end effector is also configured to scan objects (e.g., auto-teach pins, calibration pins, and the like), which are described in more detail below (e.g., FIGS. 4A-4C). The robot arm has one or more links or members (e.g., wrist members, upper arm members, forearm members, and the like) configured to be moved to move the end effector to various positions in various orientations.

[0025] The factory interface robot 111 is configured to transfer objects between the enclosure system 130 (e.g., cassettes, FOUPs) and the degassing chambers 104a, 104b (or load ports). While conventional systems involve an operator opening (e.g., disassembling, unsealing, contaminating) the processing system 100 (e.g., factory interface 101) to teach, calibrate, and / or diagnose malfunctions of the robot arm (e.g., of the factory interface robot), the processing system 100 is configured to facilitate automatic teaching, calibration, and / or diagnosis without an operator opening (e.g., without disassembling, unsealing, contaminating) the processing system 100. Correspondingly, in embodiments, a sealed environment including the interior space of the enclosure system 130 and the interior space of the factory interface 101 may be maintained during the automatic teaching, calibration, and / or diagnosis operations.

[0026] In an embodiment, the factory-interfaced robot 111 is taught a fixed position relative to the load port 128 using the enclosure system 130 (e.g., an auto-teach pin of an auto-teach enclosure system). The fixed position in one embodiment corresponds to a center position of the enclosure system 130A (e.g., an auto-teach enclosure system) located on the particular load port 128, which also corresponds to a center position of the enclosure system 130B (e.g., a cassette of substrates) located on the particular load port 128 in an embodiment. Alternatively, the fixed position may correspond to another fixed position within the enclosure system 130, such as the front or rear of the enclosure system 130. The factory-interfaced robot 111 is calibrated in some embodiments using the enclosure system 130 (e.g., an auto-teach pin of an auto-teach enclosure system and / or a calibration board). The factory-interfaced robot 111 is diagnosed in some embodiments using the enclosure system 130 (e.g., a calibration board of an auto-teach enclosure system).

[0027] The transfer chamber 106 includes a transfer chamber robot 112. The transfer chamber robot 112 includes a robot arm with an end effector at the end of the robot arm. The end effector is configured to handle a particular object, such as a wafer. In some embodiments, the transfer chamber robot 112 is a SCARA robot, but in some embodiments, may have fewer links and / or fewer degrees of freedom than the factory interface robot 111.

[0028] A controller 109 controls various aspects of the processing system 100. The controller 109 may be and / or include a computing device such as a personal computer, a server computer, a programmable logic controller (PLC), a microcontroller, or the like. The controller 109 includes one or more processing devices, which in some embodiments are general-purpose processing devices such as a microprocessor or a central processing unit. More specifically, in some embodiments, the processor device is a complex instruction set computing (CISC) microprocessor, a reduced instruction set computing (RISC) microprocessor, a very long instruction word (VLIW) microprocessor, or a processor implementing other instruction sets or a combination of instruction sets. In some embodiments, the processor device is one or more special-purpose processing devices, such as an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), a digital signal processor (DSP), a network processor, or the like. In some embodiments, the controller 109 includes data storage (e.g., one or more disk drives and / or solid state drives), main memory, static memory, network interfaces, and / or other components. In some embodiments, the controller 109 executes instructions to perform any one or more of the methods or processes described herein. The instructions are stored on a computer-readable storage medium, which may include one or more of the main memory, static memory, secondary storage, and / or a processing unit (during execution of the instructions).The controller 109 , in some embodiments, receives signals from and sends signals to the factory interface robot 111 and the wafer transfer chamber robot 112 .

[0029] FIG. 1 illustrates a schematic diagram of an article 110 (e.g., a process kit ring coupled to a process kit ring carrier) being transferred into a processing chamber 107. According to one aspect of the disclosure, the article 110 is removed from a process kit enclosure system 130B via a factory interface robot 111 disposed in a factory interface 101. The factory interface robot 111 transfers the article 110 into a respective degassing chamber 104a, 104b via one of the first vacuum ports 103a, 103b. A transfer chamber robot 112 located in a transfer chamber 106 removes the article 110 from one of the degassing chambers 104a, 104b via a second vacuum port 105a or 105b. The transfer chamber robot 112 moves the article 110 into the transfer chamber 106, where the article 110 is transferred to a processing chamber 107 via a corresponding port 108. Although not shown in FIG. 1 for clarity, the transfer of items 110 may include the transfer of process kit rings mounted in process kit ring carriers, the transfer of empty process kit ring carriers, the transfer of placement verification wafers, and the like.

[0030] 1 illustrates one example of the transfer of the article 110, but other examples are contemplated. In some examples, it is contemplated that the process kit enclosure system 130B is coupled to the transfer chamber 106 (e.g., via a load port attached to the transfer chamber 106). From the transfer chamber 106, the article 110 is loaded into the processing chamber 107 by the transfer chamber robot 112. Additionally, in some embodiments, the article 110 is loaded onto a substrate support pedestal (SSP). In some embodiments, an additional SSP is positioned opposite the illustrated SSP and in communication with the factory interface 101. The processed article 110 (e.g., a used process kit ring) is removed from the processing system 100 in the opposite direction to any of the manners described herein. When utilizing multiple enclosure systems 130B or a combination of enclosure systems 130B and SSPs, in some embodiments, one SSP or enclosure system 130B is used for unprocessed articles 110 (e.g., new process kit rings) and another SSP or enclosure system 130B is used to receive processed articles 110 (e.g., used process kit rings). The enclosure system 130A is used to perform one or more of auto-teach, calibration, or diagnostic operations of the robot arm (e.g., factory interface robot 111, transfer chamber robot 112, etc.) prior to transfer of the article 110 via the robot arm. One or more of the automatic teaching, calibration, or diagnostic operations may enable the robotic arm to precisely pick up an object from a specific location within enclosure system 130B and precisely place an object at a specific location within enclosure system 130B (e.g., when enclosure system 130B is docked to the same load port 128 as enclosure system 130A is docked).

[0031] The processing system 100 includes a chamber, such as a factory interface 101 (e.g., an equipment front end module (EFEM)) and adjacent chambers adjacent the factory interface 101 (e.g., a load port 128, an enclosure system 130, an evacuation chamber 104, such as an SSP or a load lock). One or more of the chambers are sealed (e.g., each of the chambers is sealed). The adjacent chambers are in close contact with the factory interface 101. In some embodiments, an inert gas (e.g., one or more of nitrogen, argon, neon, helium, krypton, or xenon) is supplied to one or more chambers (e.g., the factory interface 101 and / or adjacent chambers) to provide one or more inert environments. In some examples, the factory interface 101 is an inactive EFEM that maintains an inactive environment (e.g., an inactive EFEM mini-environment) within the factory interface 101, such that a user does not need to enter the factory interface 101 (e.g., the processing system 100 is not configured for manual access within the factory interface 101).

[0032] In some embodiments, a gas flow (e.g., inert gas, nitrogen) is provided to one or more chambers (e.g., factory interface 101) of processing system 100. In some embodiments, the gas flow is greater than leakage through one or more chambers to maintain a positive pressure in the one or more chambers. In some embodiments, the inert gas in factory interface 101 is recirculated. In some embodiments, a portion of the inert gas is exhausted. In some embodiments, the gas flow of non-recirculated gas into factory interface 101 is greater than the exhausted gas flow and gas leakage to maintain a positive pressure of the inert gas in factory interface 101. In some embodiments, factory interface 101 is coupled to one or more valves and / or pumps to provide the gas flow into and out of factory interface 101. A processing unit (e.g., controller 109) controls the gas flow into and out of factory interface 101. In some embodiments, the processing device receives sensor data from one or more sensors (e.g., oxygen sensors, humidity sensors, motion sensors, door operation sensors, temperature sensors, pressure sensors, etc.) and determines a flow rate of the inert gas flowing into and / or out of the factory interface 101 based on the sensor data.

[0033] The enclosure system 130 allows a robot arm (e.g., of a robot in the factory interface) to be taught, calibrated and / or diagnosed without opening the sealed environment in the factory interface 101 and adjacent chambers. Teaching, calibrating and diagnosing the robot arm are described in more detail below. The enclosure system 130 seals against the load port 128 in response to being docked thereto. The enclosure system 130 provides purge port access, which allows the interior of the enclosure system 130 to be purged prior to opening the enclosure system 130, minimizing disturbance of the inert environment in the factory interface 101.

[0034] 2A illustrates a front view of an auto-teach enclosure system 200 (e.g., enclosure system 130 of FIG. 1), according to certain embodiments. The auto-teach enclosure system 200 is configured to enable one or more of an auto-teach operation, a calibration operation, or a diagnostic operation.

[0035] Automated teach enclosure system 200 includes surfaces (e.g., walls, sidewalls, substantially planar structures, etc.) that at least partially enclose (e.g., form a cavity or chamber) interior space 202. In some embodiments, interior space 202 is a mini-environment (e.g., an enclosed environment). In some embodiments, interior space 202 is kept substantially particle-free (e.g., substantially uncontaminated). In some embodiments, automated teach enclosure system 200 includes a fan (e.g., on a top surface) that displaces particles within interior space 202. In some embodiments, interior space is substantially free (or completely free) of one or more of moisture, oxygen, or particles (e.g., dust), etc.

[0036] The surfaces include sidewall surfaces 210A-210B (e.g., sidewalls), bottom surface 212 (e.g., bottom wall), top surface 214 (e.g., top wall), and back surface 216 (e.g., rear wall). In some embodiments, the surfaces form clampable tabs. One or more of the surfaces (e.g., sidewall surfaces 210A-210B, bottom surface 212, top surface 214, etc.) form a front interface. The front interface is configured to interface with (e.g., seal against) a transport door of the auto-teach enclosure system 200. The front interface is configured to interface with (e.g., seal against) a substantially vertical portion of a load port of a wafer processing system. In response to the front interface being sealed against the door or load port, the auto-teach enclosure system 200 forms a sealed environment (e.g., gases and / or particles do not exit the auto-teach enclosure system 200 or enter the auto-teach enclosure system 200 from the ambient environment outside the wafer processing system).

[0037] In some embodiments, the auto-teach enclosure system 200 includes a base plate 220 (e.g., an adapter plate) coupled to the bottom surface 212. The base plate 220 is configured to connect with a horizontal portion of a load port. The base plate 220 has features (e.g., recesses, receptacles, kinematic interfaces) for receiving kinematic devices (e.g., kinematic pins, precisely positioned pins) of the horizontal portion of the load port. In some embodiments, the base plate 220 is secured to the bottom surface 212 before the auto-teach enclosure system 200 connects with the load port. In some embodiments, the base plate 220 is secured to the load port, and then the bottom surface 212 is secured to the base plate 220. In some embodiments, the auto-teach enclosure system 200 includes a seal (e.g., a crushable seal, a gasket) for sealing an opening in the bottom surface 212 through which the auto-teach pin 230 passes.

[0038] In some embodiments, one or more of an overhead transport flange 222 or at least one handle 224 are coupled to one or more surfaces of the autoteach enclosure system 200 for transport (e.g., automated transport, manual transport, etc.) of the autoteach enclosure system 200. In some embodiments, the OHT flange 222 is coupled to the top surface 214. In some embodiments, a first handle 224A is disposed on the first sidewall surface 210A and a second handle 224B is disposed on the second sidewall surface 210B.

[0039] In some embodiments, the auto-teach pin 230 is at least partially disposed within the interior space 202. In some embodiments, the auto-teach pin 230 is coupled to the base plate 220, with at least a portion of the auto-teach pin extending through an opening in the bottom surface 212 into the interior space 202. The auto-teach pin 230 enables auto-teach operations (see, e.g., method 540 in FIG. 5C). In some embodiments, the auto-teach pin 230 is disposed at the center of the base plate 220.

[0040] In some embodiments, a calibration substrate 240 is disposed within the interior space 202. The calibration substrate 240 is a planar object (e.g., a wafer) that can be grasped and moved by the end effector. The calibration substrate 240 is not completely fixed (e.g., a movable calibration substrate 240 that is not completely fixed) to perform a sensor calibration (e.g., a calibration operation).

[0041] In some embodiments, the calibration pins 242 are mounted on (e.g., secured to) the top surface of the calibration substrate 240. In some embodiments, the calibration substrate 240 is mounted on one or more support structures 244 (e.g., on three or four support structures) within the interior space 202. In some embodiments, the calibration substrate 240 is mounted on a first support structure 244A and a second support structure 244B disposed near the rear surface 216. In some embodiments, the calibration substrate 240 is mounted on support structures 244C-244D (e.g., in addition to support structures 244A-244B) near the front interface. In some embodiments, a collar 246 is mounted on the auto-teach pins 230, and the calibration substrate 240 is mounted on the collar 246 (e.g., in addition to support structures 244A-244B). In some embodiments, support structures 244 are mounted on bottom surface 212 (e.g., extending from bottom surface 212 to calibration substrate 240). In some embodiments, support structures 244 are mounted on one or more of sidewall surface 210A, sidewall surface 210B, or back surface 216. Calibration substrate 240 enables one or more of a calibration operation (see, e.g., method 520 of FIG. 5B) or a diagnostic operation (see, e.g., method 560 of FIG. 5D).

[0042] In some embodiments, auto-teach enclosure system 200 includes a single auto-teach pin 230 (e.g., auto-teach enclosure system 200 may or may not include calibration pin 242). Alternatively, auto-teach system 200 includes multiple auto-teach pins 230. In some embodiments, auto-teach enclosure system 200 includes a single calibration pin 242 (e.g., auto-teach enclosure system 200 may or may not include auto-teach pin 230). In some embodiments, auto-teach enclosure system 200 includes auto-teach pin 230 and calibration pin 242. In some embodiments, auto-teach pin 230 and calibration pin 242 are a single pin (e.g., a single pin may be used for both auto-teach and calibration).

[0043] In some embodiments, the auto-teach enclosure system 200 includes pins (e.g., auto-teach pins 230 and / or calibration pins 242) where the shape of at least a portion of the pin (e.g., trapezoidal) is configured to provide calibration and angle detection. In some examples, the trapezoidal portion of the pin provides both calibration and angle detection and is easy to machine into a turned part. In some embodiments, to increase accuracy, the corners of the trapezoidal portion are positioned via press-fit pins (e.g., the four aforementioned corners can be press-fit pins instead of a single machined feature).

[0044] In some embodiments, at least a portion of the pin has a skewed or asymmetric shape (e.g., trapezoidal) around a central pin (e.g., a cylindrical portion of the pin) to provide calibration. For calibration, the symmetry of a first portion of the pin (e.g., a cylindrical portion of the pin) is compared to the asymmetry of a second portion of the pin (e.g., a trapezoidal portion of the pin). A robot arm performs a z-motion (e.g., moving up and down) to scan the first portion (e.g., cylindrical) and the second portion (e.g., trapezoidal) of the pin for comparison. The robot arm performs a rotational motion around a single joint to measure the second portion (e.g., trapezoidal) from a first angle and from a second angle for comparison. The robot arm motion allows comparison of joint angles for the same close area, without the robot having to completely change joint poses to scan other objects. In some embodiments, a set of offset features (e.g., sides or ends of the trapezoidal portion) that increase or decrease separately due to the angle of the scan are used for angle detection.

[0045] In some embodiments, the auto-teach enclosure system 200 has two or more auto-teach pins 230 and / or two or more calibration pins 242. In some embodiments, the auto-teach enclosure system 200 includes two or more pins, and each pin can be used for one or more of the auto-teach and / or calibration. In some embodiments, one or more pins extend from the bottom surface 212. In some embodiments, one or more pins extend from a surface of the auto-teach enclosure system 200 (e.g., sidewall surface 210A, sidewall surface 210B, top surface 214, or back surface 216, etc.) into the interior space of the auto-teach enclosure system 200. In some embodiments, one or more pins extend from a structure (e.g., calibration structure 240) within the interior space of the auto-teach enclosure system 200. In some embodiments, a first pin extends from a first structure within the auto-teach enclosure system 200 (e.g., first calibration structure 240A, a structure that can be moved by a robotic arm) and a second pin extends from a second structure within the auto-teach enclosure system 200 (e.g., second calibration structure 240B, a structure that can be moved by a robotic arm).

[0046] FIG. 2B illustrates an exploded perspective view of an auto-teach enclosure system 200, according to certain embodiments.

[0047] The surfaces (e.g., walls, sidewalls) of the auto-teach enclosure system 200 include sidewall surfaces 210A-210B, a bottom surface 212, a top surface 214, and a back surface 216. In some embodiments, the auto-teach enclosure system 200 includes a base plate 220, and the auto-teach pins 230 are mounted on the base plate 220. The bottom surface 212 defines one or more openings. The base plate 220 is secured to the bottom surface 212, and the auto-teach pins 230 extend through the openings in the bottom surface 212 into the interior space 202 of the auto-teach enclosure system 200. The auto-teach pins 230 provide a seal (e.g., to provide a sealed environment) at the openings in the bottom surface 212.

[0048] In some embodiments, one or more purge adapters 250 are configured to be inserted into openings formed in the bottom surface 212. The purge adapters 250 are used to one or more of fill the auto-teach enclosure system 200 with gas (e.g., nitrogen (N2)), remove gas from the auto-teach enclosure system, or flow gas through the auto-teach enclosure system 200. Each of the purge adapters 250 provides a seal (e.g., to provide a sealed environment) at a corresponding opening in the bottom surface 212. In some embodiments, the auto-teach enclosure system 200 fits tightly against a load port in response to docking to the load port. An interior space of the auto-teach enclosure system 200 is configured to be purged through the one or more purge adapters 250 before the auto-teach enclosure system 200 is opened.

[0049] One or more of the above surfaces of auto-teach enclosure system 200 provide a front interface. Auto-teach enclosure system 200 includes door 252. Door 252 fits snugly against the front interface of auto-teach enclosure system 200 to provide a sealed environment. Door 252 interfaces with the calibration substrate (e.g., see FIG. 2B ) to prevent the calibration substrate from moving during transport (e.g., fixing the calibration substrate in place, pressing against the calibration substrate).

[0050] In some embodiments, the auto-teach enclosure system 200 includes handles 224A-224B and / or an OHT flange 222 for transporting the auto-teach enclosure system 200.

[0051] FIG. 2C illustrates a perspective view of an auto-teach enclosure system 200, according to certain embodiments.

[0052] In some embodiments, a base plate 220 is fixed to the bottom surface 212, and an auto-teach pin 230 extends through the bottom surface 212 into the interior space 202 of the auto-teach enclosure system. A purge adapter 250 is disposed on the bottom surface 212 and extends through the base plate 220 to fluidly connect with one or more gas or vacuum lines (e.g., to purge the auto-teach enclosure system 200, to create a vacuum within the auto-teach enclosure system 200, to fill the auto-teach enclosure system 200 with gas, etc.). In some embodiments, a handle 224 and an OHT flange 222 are fixed to corresponding surfaces of the auto-teach enclosure system 200. In some embodiments, a calibration substrate 240 is mounted on one or more support structures 244 in the interior space 202 of the auto-teach enclosure system 200. The calibration substrate 240 includes a calibration pin 242 fixed to an upper surface of the calibration substrate 240. The calibration substrate 240 includes a first width in a first orientation and a second width in a second orientation. In some embodiments, the calibration substrate 240 has a notch or recess. The first width of the calibration substrate 240 is from a first location on the periphery of the calibration substrate 240 to a second location on the periphery (e.g., neither the first location nor the second location includes a notch or recess), and the second width of the calibration substrate 240 is from a third location on the periphery where the notch or recess is located to a fourth location on the periphery. In response to the third location being a recess or an inward notch, the second width is less than the first width. The first and second widths are used to perform diagnostic operations on the robot arm (e.g., to determine whether the end effector can grip the calibration substrate 240 within a threshold amount of time of the first and second widths, etc.). The calibration substrate 240 and support structure 244 are dimensioned to enable the calibration substrate 240 to be lifted from a first position by a robot arm (e.g., grasped by the fangs and plunger of the robot arm's end effector) and placed at a second position on the support structure 244 that is different from the first position (e.g., to determine robot arm errors).Calibration pin 242 is sized and positioned to allow a robot arm (e.g., an end effector) to scan calibration pin 242 and determine the position of calibration pin 242 (e.g., to determine robot arm error). Auto-teach pin 230 is sized and positioned to allow a robot arm (e.g., an end effector) to scan auto-teach pin 230 and determine the position of auto-teach pin 230 (e.g., to teach the center position of auto-teach enclosure system 200 and / or load port).

[0053] 3A-3B illustrate an auto-teach pin 300 (e.g., auto-teach pin 230 of FIGS. 2A-2AC) of an auto-teach enclosure system (e.g., auto-teach enclosure system 130 of FIG. 1 and / or 200 of FIGS. 2A-2C), according to certain embodiments. FIG. 3A illustrates a front view of auto-teach pin 300, and FIG. 3B illustrates a top view of auto-teach pin 300. In some embodiments, one or more portions of a calibration pin (e.g., calibration pin 242 of FIGS. 2A-2B) are similar to corresponding portions of auto-teach pin 300. In some examples, the calibration pin has a cylindrical portion and a trapezoidal portion.

[0054] The auto-teach pin 300 includes a cylindrical portion 302 (e.g., a first portion having a cylindrical sidewall) that the robot arm uses to perform auto-teach operations to identify a fixed position (e.g., an xy position) of the auto-teach enclosure system and / or load port.

[0055] The auto-teach pin 300 includes a trapezoidal portion 304 (e.g., a second portion including a planar sidewall). The robotic arm uses the trapezoidal portion 304 to enable calibration of the robotic arm errors. In some embodiments, the trapezoidal portion 304 has an elliptical or polygonal (e.g., trapezoidal, square, rectangular, triangular, etc.) perimeter, allowing the robotic arm to scan the trapezoidal portion from different angles to measure different lengths (e.g., depths) and calibrate the robotic arm.

[0056] In some embodiments, the auto-teach pin 300 includes a base 306 secured to a protruding portion 324 of a base plate 320 (e.g., base plate 220 of FIGS. 2A-2C). One or more base fasteners (e.g., bolts, screws, etc.) couple the base 306 to the protruding portion 324 of the base plate 320.

[0057] The bottom surface of the auto-teach enclosure system includes openings for the auto-teach pins (e.g., cylindrical portion 302, trapezoidal portion 304, and base 306) and an opening for the clamp fastener 330. The base plate 320 includes a base flange 322 and a protruding portion 324. A seal portion 326 rests on the base flange 322, and the base 306 is secured to the protruding portion 324. The base plate 320 is secured to the bottom surface of the auto-teach enclosure system such that at least a portion of the auto-teach pins 300 extend through the openings in the bottom surface into the interior space of the auto-teach enclosure system. In some examples, at least a portion of the cylindrical portion 302, trapezoidal portion 304, and base 306 extend into the interior space. In some embodiments, the base flange 322 is aligned with the slope (e.g., a non-horizontal slope) of the bottom surface of the auto-teach enclosure system. The bottom surface rests on a seal portion 326 that rests on a base flange 322. A clamp 308 surrounds the base 306 and rests on the bottom surface. A clamp fastener 330 passes through the clamp 308, the bottom surface, and the seal portion 326 and engages the base flange 322, thereby securing the clamp 308 to the base flange. The base flange 322, the seal portion 326, the bottom surface, and the clamp 308 are substantially parallel to one another, and the clamp fastener 330 is substantially perpendicular to the base flange 322, the seal portion 326, the bottom surface, and the clamp 308.

[0058] The top surface of cylindrical portion 302 represents a first wafer transfer plane. The top surface of trapezoidal portion 304 represents an alternative wafer transfer plane. A distal end of cylindrical portion 302, near the top surface of cylindrical portion 302, is configured to support a collar for supporting a calibration substrate.

[0059] The cylindrical portion 302 has a rounded periphery and provides a precisely controlled surface for the robot arm to scan. The diameter of the cylindrical portion 302 varies as a programmable parameter. The cylindrical portion 302 represents the xy center (e.g., center of the load port) for a kinematic device (e.g., kinematic pin) of the load port (e.g., a substantially horizontal portion of the load port). The cylindrical portion 302 is used for auto-teach operations.

[0060] The trapezoidal section 304 allows for calibration for backlash and two additional robot linearity positions (e.g., 10 degrees and -10 degrees), resulting in a total of six scannable positions. The trapezoidal section 304 is used for calibration of backlash of specific joints on the robot arm. When approached from different angles, the trapezoidal section 304 provides different scan depths. The trapezoidal section allows for isolation of backlash (e.g., general errors in the joint) at individual joints.

[0061] 4A illustrates a top view of a robotic arm 400 according to certain embodiments. The robotic arm 400 is configured to perform one or more of an auto-teach operation, a calibration operation, or a diagnostic operation using an auto-teach enclosure system. The robotic arm 400 includes an end effector 408, a wrist member 436, a beam sensor 450, a light source 452, and a light receiver 454. An optical transmission fiber 456A is routed through the wrist member 436 and the end effector 408 and terminates at a first end 458A of the end effector 408. An optical reception fiber 456B is routed through the wrist member 436 and the end effector 408 and terminates at a second end 458B of the end effector 408. The first end 458A and the second end 458B of the end effector 408 are spaced apart by a gap 460 that forms an open area for certain types of processing, including detecting the edge of a substrate, auto-teach pins, or calibration pins, etc.

[0062] The optical transmission fiber 456A terminates at a first optical path opening 462A near the first end 458A. Similarly, the receiving optical fiber 456B terminates at a second optical path opening 462B near the second end 458B. The first optical path opening 462A and the second optical path opening 462B face each other and form an optical transmission path 464 (e.g., a light beam) for detecting the presence or absence of an end face of an object (e.g., an auto-teach pin, a calibration pin, a board, etc.). The optical transmission path 464 extends between the first end 458A and the second end 458B (e.g., between two points), thereby enabling detection of an object in the gap 460.

[0063] The beam sensor 450 further includes an optical transmission / reception module 466 that detects the degree of optical transmission between the optical transmission fiber 456A and the optical reception fiber 456B. The optical transmission / reception module 466 senses an end face of an object located between the first optical path opening 462A and the second optical path opening 462B in response to the object interrupting the optical transmission path 464. An output signal generated by the optical transmission / reception module 466 is provided to a controller via a conductor passing through the robot arm 400.

[0064] During operation of the robot arm 400, a controller (e.g., controller 109 of FIG. 1 ) sends signals to the robot arm 400 to move the end effector 408 to a particular position. In some examples, the controller generates signals to move one or more portions of the robot arm (e.g., upper arm, forearm, wrist member 436) to a particular position, such as a location in a factory interface or in a transfer chamber of a wafer processing system. The controller generates signals to move the end effector 408 based on a fixed position relative to the robot arm 400. For example, the robot arm 400 performs an auto-teach operation (e.g., the robot arm 400 determines the coordinates of a fixed position), a calibration operation (e.g., the robot arm 400 determines a robot arm error of the robot arm 400), and / or a diagnostic operation (e.g., the robot arm 400 determines an error or malfunction in the robot arm 400). The controller then generates signals to move one or more portions of the robotic arm 400 (e.g., upper arm, forearm, wrist member 436) to move the end effector 408 to a particular position relative to the fixed position (e.g., taking into account robotic arm tolerances, etc.).

[0065] In some embodiments, one or more errors in the mechanical structure of the robot arm 400 cause errors in positioning the end effector 408. For example, one or more joints (e.g., between the upper arm, forearm, and wrist members 436) have errors or play that contribute to position errors. This position error reduces the accuracy of the auto-teach motions performed by the robot arm 400. The errors in one or more joints include joint kinematic errors, joint hysteresis, and joint backlash. Joint kinematic errors (joint errors) are the result of a joint not rotating as instructed. For example, a joint is instructed to rotate to a certain angle, but the joint rotates to a different angle. Joint backlash occurs when a joint is rotated clockwise or counterclockwise, resulting in a repeatable position difference. Joint hysteresis refers to the hysteresis observed in clockwise and counterclockwise rotation of a joint. Other errors that may be analyzed include the actual lengths of one or more parts of the robot arm (eg, upper arm, forearm, wrist member 436) versus their lengths stored in the controller.

[0066] The accuracy of auto-teach is improved by repeatedly orienting the end effector 408 relative to a fixed position using various robot poses. A robot pose refers to the position of one or more parts of the robot arm (e.g., upper arm, forearm, wrist member 436). The robot arm 400 determines various coordinates of the fixed position that vary due to robot arm errors (e.g., joint errors and other errors).

[0067] 4B illustrates a top view of a robotic arm 400 according to certain embodiments. The robotic arm 400 is configured to perform one or more of an auto-teach operation, a calibration operation, or a diagnostic operation using an auto-teach enclosure system. The robotic arm 400 includes an end effector 408, a wrist member 436, a first optical path opening 462A (e.g., a fiber emitter) coupled to a light source 452, and a second optical path opening 462B (e.g., a fiber receiver) coupled to a light receiver 454. An optical transmission path 464 (e.g., a light beam, a path for triggering a beam) is disposed between the first optical path opening 462A and the second optical path opening 462B.

[0068] The robot arm 400 has a robot wrist center 410, which corresponds to an actual wafer center 412. The characteristic error 414 (e.g., robot arm error) of the robot arm 400 is the distance or angle between a center line and an error line. The center line is between the robot wrist center 410 and the actual wafer center 412. The error line is orthogonal (e.g., by a 90 degree angle 416) to the optical transmission line 464. In some embodiments, the robot arm 400 determines the characteristic error 414 via a calibration operation.

[0069] 4C illustrates a method 470 for performing a calibration operation using an auto-teach enclosure system, according to certain embodiments. Although shown in a particular sequence or order, unless otherwise specified, the order of the processes can be changed. Thus, the illustrated embodiment should be understood as merely an example, and the illustrated processes can be performed in a different order, and some processes can be performed in parallel. Furthermore, in various embodiments, one or more processes can be omitted. Thus, not all processes are required in all embodiments.

[0070] 4C, in block 472, the robot arm 400 places a calibration substrate (e.g., a pinned wafer) including calibration pins at a first position (e.g., Tx0, Ty0) on a support structure within the auto-teach enclosure system (e.g., in response to the auto-teach enclosure system being docked and seated against a load port). In some embodiments, the calibration substrate is placed at the first position before the auto-teach enclosure system is docked.

[0071] At block 474, the robot arm 400 performs a first scan (e.g., an auto-teach scan) of the calibration pin in the auto-teach enclosure system. The robot arm 400 determines that the calibration pin is in a first position. To perform the scan, the robot arm 400 rotates left and right about the wrist center 410.

[0072] At block 476, the robot arm 400 is directed to pick up the calibration substrate and move the calibration substrate to a second location (e.g., Tx1, Ty1) on a support structure within the auto-teach enclosure system. In some embodiments, the second location is the same as the first location. In some embodiments, the second location is different from the first location.

[0073] At block 478, the robotic arm 400 performs a second scan (e.g., an autoteach scan) and determines that the calibration pin is at a third position (e.g., Tx2, Ty2) within the autoteach enclosure system at block 480. To perform the scan, the robotic arm 400 rotates left and right about the wrist center 410.

[0074] The robot arm 400 determines a robot arm error based on two or more of the first position, the second position, or the third position. In one example, the robot arm error is a difference between the third position (e.g., the actual position) and the second position (e.g., the commanded position). Correspondingly, the robot arm uses the robot arm error to determine the actual position of the object.

[0075] In some embodiments, the robot arm performs method 470 for each member of the robot arm (e.g., wrist member, upper arm, forearm) to determine the robot arm error for each member of the robot arm. In some examples, the robot arm performs method 470 by rotating the forearm center of the forearm while holding other members stationary to determine the robot arm error specific to the forearm.

[0076] 5A-5D illustrate a method of performing one or more of an auto-teach operation, a calibration operation, or a diagnostic operation (e.g., while maintaining a sealed environment) using an auto-teach enclosure system according to certain embodiments. One or more of the auto-teach operation, the calibration operation, or the diagnostic operation are automatically performed in response to a user input (e.g., by pressing a button in a factory interface). Although shown in a particular flow or order, the order of the processes can be changed unless otherwise specified. Thus, the illustrated embodiment should be understood as merely an example, and the illustrated processes can be performed in a different order, and some processes can be performed in parallel. Furthermore, in various embodiments, one or more processes can be omitted. Thus, not all processes are required in all embodiments.

[0077] 5A, in block 502, a front interface of the auto-teach enclosure system interfaces with a substantially vertical portion of a load port of a wafer processing system. The front interface seals against the substantially vertical portion of the load port. In some examples, the front interface is secured to the substantially vertical portion of the load port and a seal member (e.g., a gasket) is disposed between the front interface and the substantially vertical portion of the load port.

[0078] At block 504, a base plate of the autoteach enclosure interfaces with a substantially horizontal portion of the load port. The base plate includes features (e.g., recesses or receptacles) that interface with kinematic devices (e.g., kinematic pins) of the substantially horizontal portion of the load port. Features of the base plate (e.g., cones) interface with kinematic features of the load port (e.g., kinematic pins) to position the autoteach enclosure system in a specific location relative to the load port. Kinematic features of the load port interface with features of other enclosure systems (e.g., process kit ring enclosure systems) to position the other enclosure systems in the same specific location relative to the load port as the autoteach enclosure system.

[0079] In block 506, the robotic arm is used to perform one or more of an auto-teach operation (e.g., see method 540 of FIG. 5C), a calibration operation (e.g., see method 520 of FIG. 5B), or a diagnostic operation (e.g., see method 560 of FIG. 5D).

[0080] In some embodiments, an automated teaching operation is used to teach the robot arm a fixed location (e.g., the center of an enclosure system or load port in the x-y plane) so that the robot arm can be positioned under the center of each wafer during a lift operation and transfer each wafer to the correct location during a placement (e.g., handover) operation.

[0081] In some embodiments, the calibration operation is used to determine an error in the movement of the robot arm and compensate for the error. For example, in response to determining that the wrist of the robot arm has rotated a first angular amount that is less than a commanded angular amount, the controller commands the wrist to rotate the difference between the first angular amount and the commanded angular amount, i.e., a one degree wrist error in the rotation of the robot arm (e.g., to compensate for the rotation error).

[0082] In some embodiments, diagnostic operations are used to determine whether components of the robot arm are functioning properly (eg, proper speed, proper measurement, proper wafer clamping, etc.).

[0083] Each of the auto-teach, calibration, and diagnostic operations is performed using the auto-teach enclosure system without opening the factory interface.

[0084] 5B illustrates a method 520 of performing a calibration operation (e.g., while maintaining a sealed environment) using an auto-teach enclosure system, according to certain embodiments. In some embodiments, the calibration operation is performed at a factory, after replacement of one or more parts of the robot arm (e.g., controller, members, joints, etc.), after manipulation of one or more portions of the robot arm, after damage to the robot arm, or after previous robot arm error data (e.g., obtained from a factory) is lost, etc. The calibration operation can provide robot joint errors of the robot arm that are not specific to any particular station (e.g., can be applied to the robot arm at any load port of a wafer fabrication system).

[0085] Referring to method 520 of FIG. 5B, at block 522, a calibration substrate is placed over the auto-teach pins on a support structure within the interior space of the auto-teach enclosure system.

[0086] At block 524, the robot arm scans the calibration pins of the calibration substrate to determine a first position of the calibration substrate. The robot arm scans the calibration pins by moving back and forth about a center of a member of the robot arm (e.g., a wrist center). The robot arm scans the calibration pins by moving only one member of the robot arm (e.g., a wrist member) and keeping other members of the robot arm stationary. The robot arm stores the first position.

[0087] At block 526, the robot arm removes the calibration substrate from the support structure. The robot arm positions an end effector of the robot arm under the calibration substrate. The robot arm actuates a plunger (e.g., a pneumatic plunger) of the end effector to grip the calibration substrate between the plunger of the end effector and a pad (e.g., a fang) at the distal end. In some embodiments, the robot arm lifts and moves the calibration substrate using only one member of the robot arm while holding other members of the robot arm stationary. In some embodiments, the robot arm removes the calibration substrate from the auto-teach enclosure system.

[0088] At block 528, the robot arm is instructed to place the calibration substrate at a first location. The robot arm retrieves the first location from memory and attempts to place the calibration substrate at the first location using the same member (e.g., wrist member) of the robot arm used to remove the calibration substrate from the support structure (e.g., to limit the determined robot arm error to one member).

[0089] In block 530, the robot arm again scans the calibration pins of the calibration substrate to determine a second position of the calibration substrate.

[0090] At block 532, a robot arm error is determined based on the difference between the first position and the second position. The robot arm error is used for any operation of the enclosure system (e.g., auto-teach operations, calibration operations of other members of the robot arm, diagnostic operations, etc.) and / or operations of other enclosure systems that are subsequently docked to the same load port as the auto-teach enclosure system (e.g., transfer of wafers, carriers, process kit rings, placement verification wafers, etc.).

[0091] 5C illustrates a method 540 of performing an auto-teach operation using an auto-teach enclosure system (e.g., while maintaining a sealed environment) according to certain embodiments. In some embodiments, the auto-teach operation is performed at one or more of the following: upon start-up (e.g., of a tool in a wafer fabrication system), periodically (e.g., once a year), as the robot arm ages, in response to drift in values ​​received from the robot arm, and after replacing parts of the robot arm. The auto-teach operation provides a specific position of the auto-teach enclosure system and / or load port. The specific position is used by the robot arm to determine the position of an object in any enclosure system attached to the same load port.

[0092] 5C, in block 542, a robot arm scans an auto-teach pin located within an interior space of an auto-teach enclosure system. In some embodiments, the robot arm scans the auto-teach pin by moving only one member of the robot arm (e.g., a wrist member) and keeping other members of the robot arm stationary. In some embodiments, the robot arm uses the same member that was used in the calibration operation.

[0093] At block 544, a fixed position (e.g., a center position) associated with the auto-teach enclosure system and / or the load port is determined based on the results of the scan at block 542. In some embodiments, the fixed position is further determined based on the robot arm error.

[0094] At block 546, the robot arm is caused to transfer the article based on the fixed position. In some embodiments, the robot arm transfers the article based on the robot error. The robot arm uses the fixed position for any operation of the enclosure system (e.g., calibration operations of other members of the robot arm, diagnostic operations, etc.) and / or operation of other enclosure systems that are subsequently docked to the same load port as the auto-teach enclosure system (e.g., transfer of wafers, carriers, process kit rings, placement verification wafers, etc.).

[0095] 5D illustrates a method 560 of performing diagnostic operations using an auto-teach enclosure system (e.g., while maintaining a sealed environment) according to certain embodiments. In some embodiments, diagnostic operations are performed one or more of: periodically (e.g., daily, weekly, monthly), as the robot arm ages, when a problem is detected with the robot arm and / or the wafers it handles, such as to perform statistical process control (SPC) tracking on the robot arm to know in advance if the robot arm is deteriorating and plan for downtime. Diagnostic operations may be performed to determine if any component of the robot arm is malfunctioning.

[0096] Referring to method 560 of FIG. 5D, in block 562, a robot arm is positioned beneath the calibration substrate in a first orientation corresponding to a first width of the calibration substrate. In some embodiments, an end effector of the robot arm is positioned beneath the calibration substrate. The end effector has a planar upper surface and one or more distal ends opposite the wrist of the robot arm. Each of the one or more distal ends has a corresponding protrusion (e.g., fang) extending upwardly from the planar surface. The end effector has a plunger disposed above the planar upper surface. The planar upper surface is configured to support a substrate. When actuated, the plunger is configured to press against one side of the substrate while the protrusion (e.g., fang) presses against another side of the substrate such that the substrate is gripped (e.g., secured) between the plunger and the protrusion. The robot arm is capable of transporting the substrate while securing the substrate via the end effector.

[0097] At block 564, a plunger of the robot arm is directed to actuate and secure the calibration substrate in a first orientation. To secure the calibration substrate, the calibration substrate is secured between a pad (e.g., a fang) on ​​a distal end of the end effector and the plunger.

[0098] At block 566, a determination is made regarding the occurrence of a first error in securing the substrate in the first orientation. The robot arm may actuate the plunger until a threshold amount of time is reached or until the substrate is determined to be secured between the plunger and the pad in response to the determined distance between the distal end of the plunger and the pad (e.g., a sensor determines a threshold amount of resistance to actuation of the plunger), whichever occurs first. For example, a distance between the plunger and the pad may correspond to each actuation position of the plunger.

[0099] In some embodiments, determining the first error is in response to determining that the substrate is not secured between the plunger and the pad within a threshold amount of time of actuating the plunger (e.g., a threshold amount of resistance is not detected within a threshold amount of time), which may indicate that the plunger is malfunctioning by not being actuated or by being actuated below a threshold speed.

[0100] In some embodiments, determining the first error is in response to determining that the plunger has been actuated more than a threshold distance to secure the calibration substrate (such that the measured width is less than the actual width), which may indicate that the plunger has malfunctioned by actuating less than the distance it was instructed to actuate.

[0101] In some embodiments, determining the first error is in response to determining that the measured width of the calibration substrate in the first orientation is different from the actual width of the calibration substrate in the first orientation, which may indicate that the plunger is not actuating to the extent that it is instructed to actuate or is malfunctioning by not properly securing the calibration substrate.

[0102] In some embodiments, the first error is in response to the calibration substrate not being properly seated on the robot arm (e.g., one or more portions protruding above the fangs of the end effector), wear on the end effector, etc.

[0103] At block 568, the robot arm is positioned under the calibration substrate at a second orientation corresponding to a second width of the calibration substrate that is different from the first width, where one of the first orientation or the second orientation corresponds to a feature (e.g., a notch, a recess) on the periphery of the calibration substrate.

[0104] In block 570, a plunger of the robot arm is actuated to secure the calibration substrate in a second orientation. In some embodiments, block 570 is similar to block 564.

[0105] At block 572, a second occurrence of error in fixing the calibration substrate in the second orientation is determined. In some embodiments, block 572 is similar to block 566. In some embodiments, the occurrence of error is determined for one of the first orientation or the second orientation (e.g., there is no error in the other of the first orientation or the second orientation).

[0106] 6 is a block diagram illustrating a computer system 600 according to certain embodiments. In some embodiments, computer system 600 is controller 109 (see, e.g., FIG. 1). Computer system 600 (e.g., processing unit 602) is used to cause the robotic arm to perform auto-teach, calibration, and / or diagnostic operations.

[0107] In some embodiments, computer system 600 is connected to other computer systems (e.g., via a network such as a Local Area Network (LAN), an intranet, an extranet, or the Internet). Computer system 600 operates as a server or a client computer in a client-server environment, or as a peer computer in a peer-to-peer (or distributed) network environment. Computer system 600 may be provided by a personal computer (PC), a tablet PC, a set-top box (STB), a personal digital assistant (PDA), a mobile phone, a web appliance, a server, a network router, switch, or bridge, or any machine capable of executing (sequentially or otherwise) a set of instructions that define actions to be taken by that machine. Furthermore, the term "computer" is intended to include any collection of computers that individually or in concert execute a set (or sets) of instructions to perform any one or more of the methods described herein.

[0108] In a further aspect, computer system 600 includes a processing unit 602, a volatile memory 604 (e.g., random access memory (RAM)), a non-volatile memory 606 (e.g., read-only memory (ROM) or electrically-erasable programmable ROM (EEPROM)), and a data storage device 618, which communicate with each other via a bus 608.

[0109] Processing unit 602 may be provided by one or more processors, such as a general-purpose processor (e.g., a complex instruction set computing (CISC) microprocessor, a reduced instruction set computing (RISC) microprocessor, a very long instruction word (VLIW) microprocessor, a microprocessor implementing other types of instruction sets, or a combination of other types of instruction sets), or a specialized processor (e.g., an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), a digital signal processor (DSP), or a network processor).

[0110] Computer system 600 further includes a network interface device 622 (e.g., communicating over a network 674). Computer system 600 also includes a video display unit 610 (e.g., a liquid crystal display (LCD)), an alphanumeric input device 612 (e.g., a keyboard), a cursor control device 614 (e.g., a mouse), and a signal generating device 620.

[0111] In some implementations, the data storage device 618 includes a non-transitory computer-readable storage medium 624 having stored thereon instructions 626 encoding any one or more of the methods or functions described herein, the instructions 626 including instructions for implementing the methods described herein (e.g., for causing the robotic arm to perform an auto-teach operation, for causing the robotic arm to perform a calibration operation, for causing the robotic arm to perform a diagnostic operation, and / or for performing method 470 of FIG. 4C).

[0112] The instructions 626 also reside, completely or at least partially, within the non-volatile memory 604 and / or within the processing unit 602 during execution by the computer system 600, and thus the non-volatile memory 604 and the processing unit 602 also constitute machine-readable storage media in some embodiments.

[0113] While in the illustrated example, computer-readable storage medium 624 is shown as a single medium, the term "non-transitory computer-readable storage medium" is intended to include a single medium or multiple media (e.g., a centralized or distributed database, and / or associated caches and servers) that store one or more sets of executable instructions. The term "non-transitory computer-readable storage medium" is also intended to include any medium capable of storing or encoding a set of instructions for execution by a computer that causes a computer to perform any one or more of the methods described herein. The term "non-transitory computer-readable storage medium" includes, but is not limited to, solid-state memory, optical media, and magnetic media.

[0114] In some embodiments, the methods, components, and features described herein are implemented by discrete hardware components or are integrated into the functionality of other hardware components, such as ASICS, FPGAs, DSPs, or similar devices. In some embodiments, the methods, components, and features are implemented by firmware modules or functional circuits within a hardware device. Furthermore, in some embodiments, the methods, components, and features are implemented in any combination of hardware devices and computer program components, or in a computer program.

[0115] Unless otherwise specified, terms such as "scanning," "moving," "causing," "performing," "removing," "placing," "directing," "determining," "disposing," "actuating," or "locating," refer to actions and processes performed or implemented by a computer system that manipulates data represented as physical (electronic) quantities in the registers and memory of the computer system and converts it into other data similarly represented as physical quantities in the memory or registers of the computer system, or other such information storage, transmission, or display devices. Additionally, in this specification, terms such as "first," "second," "third," "fourth," etc. are presented as labels to distinguish among various elements and may not have a sequential meaning according to their numerical designation.

[0116] The examples described herein also relate to apparatus for carrying out the methods described herein. In some embodiments, the apparatus comprises a general-purpose computer system that is specially constructed to carry out the methods described herein, or that is selectively programmed by a computer program stored in the computer system. In some embodiments, such a computer program is stored in a computer-readable tangible storage medium.

[0117] The methods and examples described herein are not inherently related to any particular computer or other apparatus. Various general-purpose systems may be used in accordance with the teachings described herein, or more specialized apparatus may be constructed to perform the methods described herein and / or each of their individual functions, routines, subroutines, or operations. Examples of configurations for various such systems are set forth in the preceding specification description.

[0118] In the above specification, numerous specific details are described, such as examples of specific systems, components, methods, etc., to allow some embodiments of the present disclosure to be better understood. However, it will be apparent to one skilled in the art that at least some embodiments of the present disclosure can be practiced without the above specific details. In other instances, well-known components or methods are not described in detail or are presented in a simplified block diagram format to avoid unnecessarily obscuring the present disclosure. Therefore, the specific details described are merely exemplary. Particular embodiments can vary from the above example details and still be considered to be within the scope of the present disclosure.

[0119] Throughout this specification, "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with that embodiment is included in at least one embodiment. Thus, the phrases "in one embodiment" or "in an embodiment" appearing in various places in this specification are not necessarily all referring to the same embodiment. Furthermore, the term "or" is intended to mean an inclusive "or" rather than an exclusive "or". When the term "about" or "approximately" is used herein, it is intended to mean that the nominal value presented is accurate to within ±10%.

[0120] Although the method operations herein are illustrated and described in a particular order, the order of the method operations can be changed such that certain operations are performed in reverse order, certain operations are performed at least partially concurrently with other operations, and in other embodiments, instructions or substeps of separate operations are performed intermittently and / or alternatingly.

[0121] It should be understood that the foregoing specification is intended to be illustrative and not limiting. Many other embodiments will be apparent to those skilled in the art upon reading and understanding the foregoing specification. Accordingly, the scope of the present disclosure is determined by reference to the appended claims, along with the full scope of equivalents to which such rights are entitled.

Claims

1. 1. An automated teaching system for a wafer processing system, comprising: an auto-teach pin, which is a scannable feature having a fixed position within the auto-teach system, the auto-teach pin enabling an auto-teach operation of a robot arm of the wafer processing system, an end effector of the robot arm scanning the auto-teach pin and performing the auto-teach operation of the robot arm, the auto-teach operation being an operation of automatically teaching the fixed position within the auto-teach system to the robot arm of the wafer processing system; Equipped with The automatic teaching pin is a first portion including a cylindrical sidewall, the first portion being used by the robot arm to identify the fixed position within the automated teaching system; a second portion including a planar sidewall, the robot arm scanning the second portion and performing a first calibration of a robot arm error; An automatic teaching system comprising:

2. The automated teaching system of claim 1 , wherein the first portion is disposed above the second portion.

3. The automated teaching system of claim 1 , wherein the first portion has a perimeter that is circular and the second portion has a perimeter that is one or more of a trapezoid, an ellipse, a polygon, a square, a rectangle, and a triangle.

4. 2. The automated teaching system of claim 1, wherein a central axis of the first portion passes through a center of a circular periphery of the first portion, and the second portion has a periphery that is asymmetric with respect to the central axis of the first portion.

5. The automatic teaching system of claim 1, wherein the symmetry of the first portion is compared with the asymmetry of the second portion to perform the first calibration of the robot arm error.

6. 2. The automated teaching system of claim 1, wherein the robot arm moves in a z-direction to scan the first portion and the second portion, and the robot arm performs a rotational movement about a single joint to measure the second portion from multiple angles to perform the first calibration of the robot arm error.

7. The automated teaching system of claim 1 , wherein a distal end top surface of the first portion is configured to support a collar for supporting a calibration substrate, the calibration substrate being lifted by the robotic arm.

8. The auto-teach system of claim 1 , wherein the auto-teach pin comprises a base secured to a protruding portion of a base plate, and one or more base fasteners couple the base to the protruding portion of the base plate.

9. 2. The automated teaching system of claim 1, wherein the robotic arm scans the second portion from different angles to determine a plurality of measurements of the second portion to perform the first calibration of the robotic arm.

10. The automatic teaching system comprises: a calibration substrate configured to be mounted on a plurality of support structures of the wafer processing system, the calibration substrate comprising calibration pins, the calibration substrate enabling a second calibration of the robot arm error of the robot arm of the wafer processing system to automatically determine the robot arm error of the robot arm. The auto-teach system of claim 1 further comprising:

11. The automated teaching system of claim 10 , wherein the calibration substrate comprises a substantially horizontal formation configured to rest on the support structure, and the calibration pins are attached to an upper surface of the substantially horizontal formation.

12. the calibration pin is scanned by the robot arm; the calibration substrate is lifted from a first position by the robot arm after the calibration pins have been scanned; the calibration substrate is positioned at a second position by the robot arm in response to the robot arm lifting the calibration substrate; the calibration pins are rescanned by the robot arm in response to the calibration substrate being placed on the support structure; and the robot arm error is determined based on a difference between the first position and the second position. The automated teaching system according to claim 10.

13. The automatic teaching system of claim 10, wherein the automatic teaching pin is positioned below the calibration pin.

14. The auto-teach system of claim 13 further comprising a collar disposed on the auto-teach pin, the calibration substrate being disposed on the collar.

15. The automated teaching system of claim 10 , wherein the calibration substrate is configured to enable a diagnostic operation of the robot arm to determine if a first error occurs in fastening the calibration substrate.

16. 16. The automated teaching system of claim 15, wherein the first error is based on whether an end effector of the robot arm grasps the calibration substrate within a threshold amount of time.

17. 16. The automated teaching system of claim 15, wherein the calibration substrate has a first width in a first orientation and a second width in a second orientation, the first width being different from the second width, and the first error is based on whether an end effector of the robot arm grasps the calibration substrate in the first orientation and the second orientation within a threshold amount of time.

18. The automated teaching system of claim 17 , wherein the first width corresponds to a notch or recess formed by the calibration substrate.

19. 1. A method comprising: scanning a first portion of an auto-teach pin, the first portion being a scannable feature having a fixed position within the wafer processing system, with an end effector of a robot arm of the wafer processing system, the first portion having a cylindrical sidewall; performing an auto-teach operation of the robot arm based on a cylindrical sidewall of the first portion of the auto-teach pin, the auto-teach operation being an operation for automatically teaching the robot arm the fixed position within the wafer processing system; scanning a second portion of the auto-teach pin with the end effector, the second portion having a planar sidewall; and performing a first calibration operation of a robot arm error based on the planar sidewall of the second portion of the auto-teach pin; The method includes:

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